Cooling tile assembly for multisport surfaces and method for assembling the same

Abstract

A cooling tile assembly for installation over a ground surface, the cooling tile assembly being suitable as a multisport surface with freezing functionality, the cooling tile assembly comprising a base layer comprising a plurality of base panels, each base panel of the base layer comprising an upper side and a ground-facing side opposite to the upper side, the ground-facing side being configured to face the ground surface when the cooling tile assembly is assembled, a cover layer comprising a plurality of cover panels configured to be arranged side-by-side, each of the plurality of cover panels comprising an exposed side and a bottom side opposite the exposed side, each of the plurality of cover panels being complementarily stackable onto at least a portion of a corresponding one of the base panels to form a pipe-receiving cavity therebetween, and a pipe circuit comprising a plurality of pipes positioned within the pipe-receiving cavity.

Description

COOLING TILE ASSEMBLY FOR MULTISPORT SURFACES AND METHOD FOR ASSEMBLING THE SAMECROSS-RFERENCE TO RELATED APPLICATION

[0001] The present application claims priority from U.S. provisional patent application No. 63 / 709,060, filed on October 18, 2024, and entitled “COOLING TILE ASSEMBLY FOR MULTISPORT SURFACES AND METHOD FOR ASSEMBLING THE SAME”, the disclosure of which is hereby incorporated by reference in its entirety.TECHNICAL FIELD

[0002] The technical field relates to multi sports surfaces with freezing capabilities and to methods for constructing multi sports surfaces with freezing capabilities.BACKGROUND

[0003] In countries with harsh winters, such as Canada, it is common to find ice rink structures in outdoor parks. In other regions, cities may opt to build permanent outdoor ice rinks equipped with integrated cooling systems. These permanent installations, whether located in parks or on concrete surfaces, require the construction of a specialized concrete slab in which refrigerant pipes are embedded. To ensure the structural integrity of the rink, the slab must be poured without any casting joints. However, this method is relatively expensive and technically complex to execute. Moreover, it is not suitable for surfaces that are already paved with asphalt, as it typically necessitates the preliminary removal of the existing asphalt layer.

[0004] Therefore, there is a need for a multisport surface configured to address these shortcomings.SUMMARY

[0005] According to a general aspect, there is provided a cooling tile assembly for permanently covering a ground surface, the cooling tile assembly being useable as a multisport surface with freezing capabilities. The cooling tile assembly comprises a base comprising a plurality of base panels arrangeable side-by-side and securable together; a cover comprising a plurality of cover panels arrangeable side-by-side; eachFile No. 021889-0008 - 1 -of the plurality of cover panels being complementary stackable in each of the plurality of base panels to form a cavity therebetween; a pipe circuit comprising a plurality of pipes nested in the cavity; and a manifold connected to the pipe circuit and allowing cooling of the pipe circuit.

[0006] In at least one embodiment, each of the base panels of the base layer comprises a plurality of base layer connectors extending upwardly from the upper side of the respective base panel.

[0007] In at least one embodiment, one or more of the base layer connectors is shaped as a cylindrical stud.

[0008] In at least one embodiment, the cylindrical studs comprises lateral ribs extending upwardly along a sidewall of the cylindrical stud.

[0009] In at least one embodiment, at least one of the base layer connectors of a given one of the base panels is shaped to receive a fastener for securing the given one of the base panels to the ground surface.

[0010] In at least one embodiment, at least one of the base panels of the base layer comprises one or more base openings at least partially extending between the upper and ground-facing sides of the respective base panel, the base openings being configured to retain water when the cooling tile assembly is submerged.

[0011] In at least one embodiment, the base panel further comprises one or more internal support structures extending across a given base opening, the internal support structures being configured to resist a thermal dilation of the base panel.

[0012] In at least one embodiment, each of the base panels comprises an interlocking mechanism for securing adjacent ones of the base panels together.

[0013] In at least one embodiment, the interlocking mechanism comprises a first interlocking connector disposed along a first later edge of the respective base panel.

[0014] In at least one embodiment, the interlocking mechanism comprises a second interlocking connector, the second interlocking connector being a given one of the base panel connectors positioned along a second lateral edge of the respective baseFile No. 021889-0008 - 2 -panel and vertically offset from the ground-facing side of the respective base panel to define a connector-receiving gap sized to receive the first interlocking connector of an adjacent one of the base panels.

[0015] In at least one embodiment, the first and second interlocking connectors comprise complimentary connectors configured to secure adjacent ones of the base panels together.

[0016] In at least one embodiment, the complimentary connectors are snap fit connectors.

[0017] In at least one embodiment, each of the cover panels of the cover layer comprises a plurality of cover layer connectors extending downwardly from the bottom side of the respective cover panel, each of the base layer connectors and a corresponding one of the cover layer connectors defining a pair of interlockable connectors for removably securing the respective base and cover panels together.

[0018] In at least one embodiment, at least one of the cover panels of the cover layer comprises an upper tile portion and an intermediate portion removably securable to one another, the intermediate portion being configured to be installed between the upper tile portion and the base layer when the cooling tile assembly is assembled.

[0019] In at least one embodiment, the upper tile portion and the intermediate portion comprise coupling members configured for removable attachment to secure the upper tile portion and the intermediate portion together.

[0020] In at least one embodiment, the coupling members are configured to allow relative sliding movement between the intermediate and upper tile portions when the cooling tile assembly is assembled.

[0021] In at least one embodiment, the coupling members are arranged on the intermediate and upper tile portions in a substantially radial pattern relative to a central region of the respective intermediate tile portion and the upper tile portion.

[0022] In at least one embodiment, the coupling members include snap connectors.File No. 021889-0008 - 3 -

[0023] In at least one embodiment, the base layer connectors of each of the base panels are arranged in a first grid pattern, and wherein the cover layer connectors of each of the cover layers are arranged in a second grid pattern corresponding substantially to the first grid pattern of the base layer connectors.

[0024] In at least one embodiment, each of the base layer connectors and the cover layer connectors comprises a connector alignment feature configured to facilitate positional alignment between the base layer connectors and the corresponding cover layer connectors during installation of the cooling tile assembly.

[0025] In at least one embodiment, one of the base layer connectors and the cover layer connectors comprises an alignment member extending upwardly from a top surface thereof, and the other of the base layer connectors and the cover layer connectors comprises an alignment recess shaped and sized to receive the alignment member.

[0026] In at least one embodiment, the cooling tile assembly further comprises a manifold configured to be fluidly connected to the pipe circuit and to circulate a cooling fluid through the pipes to enable the freezing functionality.

[0027] In at least one embodiment, the manifold is configured to be at least partially interposed between the base layer and the cover layer when the cooling tile assembly is assembled.

[0028] In at least one embodiment, the manifold comprises a manifold block defining a connector aperture sized to receive a corresponding base layer connector when the cooling tile assembly is assembled.

[0029] In at least one embodiment, each cover panel further defines a plurality of cover openings configured to allow water to circulate within the cavity when the cooling tile assembly is submerged.

[0030] According to another aspect, there is provided a method for installing a cooling tile assembly for permanently covering a ground surface, the cooling tile assembly being useable as a multisport surface with freezing capabilities, the method comprising the steps: covering the ground surface with a base layer by securing side-by-side aFile No. 021889-0008 - 4 -plurality of base panels, distributing a pipe circuit over the base layer, and installing a cover layer over the base layer by complementarily stacking a cover panel over each of the plurality of base panels, the pipe circuit being interposed therebetween.

[0031] In at least one embodiment, the method further comprises connecting at least one manifold to the pipe circuit.

[0032] In at least one embodiment, the method further comprises injecting a cooling fluid in an input port of a first manifold, and retrieving a hot fluid in an output port of a second manifold.

[0033] In at least one embodiment, the method further comprises comprising securing at least one of the base panels to the ground surface.

[0034] In at least one embodiment, the method further comprises comprising a step of covering the cooling tile assembly with water until a surface of ice is covering the cooling tile assembly.

[0035] In at least one embodiment, the ice covering the cooling tile assembly is about 1 1 ” of thickness.BRIEF DESCRIPTION OF THE DRAWINGS

[0036] FIG. 1 is a top perspective view of a cooling tile assembly, in accordance with one embodiment.

[0037] FIG. 2 is a cross-sectional view of the cooling tile assembly of FIG. 1 .

[0038] FIG. 3 is a top perspective view of a base panel and a cover panel of the cooling tile assembly, in accordance with one embodiment.

[0039] FIG. 4 is a top perspective exploded view of the base panel and the cover panel of FIG. 3.

[0040] FIG. 5 is a top perspective view of a base panel of the cooling tile assembly, in accordance with one embodiment.

[0041] FIG. 6 is a bottom perspective view of the base panel of FIG. 5.File No. 021889-0008 - 5 -

[0042] FIG. 7 is a top plan view of the base panel of FIG. 5.

[0043] FIG. 8 is a bottom plan view of the base panel of FIG. 5.

[0044] FIG. 9 is a front elevation view of the base panel of FIG. 5.

[0045] FIG. 10 is a rear elevation view of the base panel of FIG. 5.

[0046] FIG. 11 is a top perspective exploded view of two adjacent base panels of the cooling tile assembly, in accordance with one embodiment.

[0047] FIG. 12 is a front elevation exploded view of the two adjacent base panels of FIG. 11.

[0048] FIG. 13 is a top perspective view of an intermediate layer of a cover panel of the cooling tile assembly, in accordance with one embodiment.

[0049] FIG. 14 is a bottom perspective view of the intermediate portion of FIG. 13.

[0050] FIG. 15 is a top plan view of the intermediate portion of FIG. 13.

[0051] FIG. 16 is a bottom plan view of the intermediate portion of FIG. 13.

[0052] FIG. 17 is a front elevation view of the intermediate portion of FIG. 13.

[0053] FIG. 18 is a top perspective view of an upper tile portion of a cover panel of the cooling tile assembly, in accordance with one embodiment.

[0054] FIG. 19 is a bottom perspective view of the upper tile portion of FIG. 18.

[0055] FIG. 20 is a top plan view of the upper tile portion of FIG. 18.

[0056] FIG. 21 is a bottom plan view of the upper tile portion of FIG. 18.

[0057] It will be noted that throughout the appended drawings, like features are identified by like reference numerals.File No. 021889-0008 - 6 -DETAILED DESCRIPTION

[0058] It will be appreciated that, for simplicity and clarity of illustration, where considered appropriate, reference numerals may be repeated among the figures to indicate corresponding or analogous elements or steps. In addition, numerous specific details are set forth in order to provide a thorough understanding of the exemplary embodiments described herein. However, it will be understood by those of ordinary skill in the art, that the embodiments described herein may be practiced without these specific details. In other instances, well-known methods, procedures and components have not been described in detail so as not to obscure the embodiments described herein. Furthermore, this description is not to be considered as limiting the scope of the embodiments described herein in any way but rather as merely describing the implementation of the various embodiments described herein.

[0059] For the sake of simplicity and clarity, namely so as to not unduly burden the figures with several references numbers, not all figures contain references to all the components and features, and references to some components and features may be found in only one figure, and components and features of the present disclosure which are illustrated in other figures can be easily inferred therefrom. The embodiments, geometrical configurations, materials mentioned and / or dimensions shown in the figures are optional, and are given for exemplification purposes only.

[0060] Moreover, it will be appreciated that positional descriptions such as “above”, “below”, “top”, “bottom”, “forward”, “rearward” “left”, “right” and the like should, unless otherwise indicated, be taken in the context of the figures and correspond to the position and orientation in the cooling tile assembly and corresponding parts when being used. Positional descriptions should not be considered limiting.

[0061] To provide a more concise description, some of the quantitative expressions given herein may be qualified with the term "about". It is understood that whether the term "about" is used explicitly or not, every quantity given herein is meant to refer to an actual given value, and it is also meant to refer to the approximation to such given value that would reasonably be inferred based on the ordinary skill in the art, including approximations due to the experimental and / or measurement conditions for such given value.File No. 021889-0008 - 7 -

[0062] In the above description, an embodiment is an example or implementation of the subject matter. The various appearances of “one embodiment,” “an embodiment” or “some embodiments” do not necessarily all refer to the same embodiments.

[0063] Reference in the specification to “some embodiments”, “an embodiment”, “one embodiment” or “other embodiments” means that a particular feature, structure, or characteristic described in connection with the embodiments is included in at least some embodiments, but not necessarily all embodiments, of the subject matter.

[0064] It is to be understood that the phraseology and terminology employed herein is not to be construed as limiting and are for descriptive purpose only.

[0065] The principles and uses of the teachings of the present description may be better understood with reference to the accompanying description, figures and examples.

[0066] It is to be understood that the terms “including”, “comprising”, “consisting” and grammatical variants thereof do not preclude the addition of one or more components, features, steps, or integers or groups thereof and that the terms are to be construed as specifying components, features, steps or integers.

[0067] It is to be understood that where the specification states that a component, feature, structure, or characteristic “may”, “might”, “can” or “could” be included, that particular component, feature, structure, or characteristic is not required to be included.

[0068] Methods of the present description may be implemented by performing or completing manually, automatically, or a combination thereof, selected steps or tasks.

[0069] Referring to FIGS. 1 to 4, a cooling tile assembly 100 for covering a ground surface is illustrated, in accordance with one embodiment. In certain embodiments, the cooling tile assembly 100 is configured for direct installation on a ground surface to at least partially cover it. Alternatively, in other embodiments, the cooling tile assembly 100 may be installed onto the ground surface with one or more intermediate layers (such as a tarp, or the like) positioned between the cooling tile assembly 100 and the ground surface.File No. 021889-0008 - 8 -

[0070] The ground surface may be of any type, whether indoor or outdoor, including but not limited to asphalt, concrete, gravel, grass, or soil. Once installed, the cooling tile assembly 100 may provide a durable multisport surface suitable for various activities such as football, handball, basketball, badminton, or similar sports. Advantageously, the cooling tile assembly 100 may be further equipped with refrigeration and freezing capabilities, as described in further detail below. In such embodiments, the cooling tile assembly 100 may be adapted to receive water, which may be cooled and frozen to form an ice surface. When configured in this manner, the cooling tile assembly 100 may serve as an ice rink suitable for ice skating and other ice-based activities, including but not limited to hockey, broomball, curling, and the like. In certain embodiments, the cooling tile assembly 100 may be further equipped with heating capabilities as, described in further detail below.

[0071] It will be understood that the embodiments of the cooling tile assembly 100 described herein are merely provided as examples and that various alternative configurations may be considered. In the illustrated embodiment, the cooling tile assembly 100 provides a large substantially rectangular sport surface area 20. Alternatively, the cooling tile assembly 100 could be configured in accordance with any other suitable configuration to provide other forms of iced surfaces including an icy path, a skateway, or the like.

[0072] In the illustrated embodiment, the cooling tile assembly 100 is a modular construction including a base layer 200, a cover layer 300, a pipe circuit 400 and a manifold 500. Broadly, the base layer 200 includes a plurality of base panels 210, and the cover layer 300 includes a plurality of cover panels 310, each of the cover panels 310 being complementarily stackable onto at least a portion of a corresponding one of the base panels 210 to form a cavity therebetween shaped and sized to receive at least a portion of the pipe circuit 400 therein, as will be described in further detail below.

[0073] It will be understood that the modular configuration of the cooling tile assembly 100 as described herein may be less expensive than a conventional permanent refrigerated rink and require a less exhaustive construction.File No. 021889-0008 - 9 -Base layer

[0074] Referring to FIGS. 5 to 12, in the illustrated embodiment, the base layer 200 extends substantially parallel to the ground surface. When the cooling tile assembly 100 is assembled, the base layer 200 generally lies flat against the ground surface. In alternative embodiments, the base layer 200 may be slightly angled to accommodate irregularities or deviations in the ground surface.

[0075] In certain embodiments, the base panels 210 of the base layer 200 are configured to be arranged side-by-side and secured to one another to form the complete base layer 200 of the cooling tile assembly 100. This modular configuration may facilitate transportation and on-site assembly and may further enhance adaptability to various project requirements and custom shapes for the cooling tile assembly 100.

[0076] As shown in the non-limitative embodiment illustrated FIGS. 5 to 10, each base panel 210 is substantially rectangular although it will be understood that each base panel 210 can alternatively include any other suitable shape including irregular shapes having complementary edges configured to mate together when assembled in a side- by-side arrangement. While the base panels 210 used in the illustrated cooling tile assembly 100 may share similar shapes and dimensions to facilitate uniform assembly, it will be further understood that alternative configurations with varying shapes and sizes may also be considered. In the illustrated embodiment, each base panel 210 has a substantially square shape with each side measuring about 12”. Each base panel 210 includes an upper side 220, a ground-facing side 230 opposite the upper side 220, and four lateral edges 240a, 240b, 240c, and 240d. When the cooling tile assembly 100 is installed on the ground surface, the ground-facing side 230 of each base panel 210 is oriented toward and rests against the ground surface, while the upper side 220 faces upwards opposite the ground surface.

[0077] In the illustrated embodiment, each base panel 210 further includes a plurality of base layers connectors 222 protruding upwardly from the upper side 220 of the base layer 210, the base layer connectors 222 being arranged in a first grid pattern 212. In the illustrated embodiment, the first grid pattern 212 corresponds to a square grid formed between each one of the base layer connectors 222, as best shown in FIG. 5.File No. 021889-0008 - 10 -The base layer connectors 222 are configured to enable a removable attachment of the base layer 200 to the cover layer 300, as described in further detail below.

[0078] In the illustrated embodiment, each of the base layer connectors 222 includes a substantially disc-shaped base portion 223 and a substantially cylindrical stud portion 224 extending upwardly from the base portion 223. In certain embodiments, one or more of the base layer connectors 222 may include lateral reinforcing ribs 226 that extend upwardly along the sidewall of the stud portion 224. In certain embodiments, the lateral reinforcing ribs 226 may be shaped and sized to improve a structural integrity of the respective base layer connectors 222. These lateral reinforcing ribs 226 may vary in width. For example, in the illustrated embodiment, the lateral reinforcing ribs 226 exhibit a width that gradually decreases along the vertical extent of the corresponding base layer connector 222.

[0079] When the stud portion is substantially cylindrically shaped, each of the base layer connectors 222 can include a substantially circular top surface including one or more first connectors 225. The first connectors 225 are configured to be secured to a corresponding second connector 325 (shown in FIG. 14) of a cover layer connector 322 of the cover panel 310 to define a pair of interlockable connectors, as described in further detail below.

[0080] In certain embodiments, the pairs of interlockable connectors can include bolts, screws, nuts, rivets, pins, dowels, clamps, clips, couplings, welds, adhesives, snap- fits, latches, and keyways, or the like. In the illustrated embodiment, the pair of interlockable connectors includes snap-fit connectors. In particular, each first connector 225 of the base layer connectors 222 includes a male portion of a snap-fit connector and, more specifically, includes a resilient projection shaped and sized to be inserted within the second connector 325 configured as the female portion of the snap-fit connector (i.e., as a slot) defined within the corresponding cover layer connector 322. In this manner, the first connector 225 is configured to mechanically interlock with the second connector 325 of the cover layer connector 322 when one of the cover panels 310 is complementarily stacked on top of the base panel 210.

[0081] In certain embodiments, each base layer connector 222 can include multiple first connectors 225. For instance, in the illustrated embodiment and as best shown inFile No. 021889-0008 - 11 -FIG. 7, each base layer connector can include four first connectors 225 evenly spaced around the top surface of the respective base layer connector 222. Each of the first connectors 225 may be elastically deformed into a deflected shape when partially inserted into the second connector 325 of a corresponding cover layer connector 322 and subsequently released to its original relaxed shape when the first connector 225 is fully inserted to at least partially lock the base layer 210 and the cover layer 310 together. It will be understood that, in other embodiments, one or more of the first connectors 225 may include the female portion of a snap-fit connector, while the corresponding second connectors 325 may include the male portion of a snap-fit connector.

[0082] In certain embodiments, the base layer connectors 222 and the cover layer connectors 322 may include connector alignment features configured to facilitate positional alignment between the base layer connector 222 and the corresponding cover layer connector 322 during installation of the cooling tile assembly 100. For instance, in the non-limitative embodiment illustrated in FIGS. 5 to 10, each base layer connector 222 further includes an alignment member 227 extending substantially upward from the top surface of the corresponding base layer connector 222. The alignment member 227 is configured to engage an alignment aperture 327 formed in the cover layer connector 322, thereby facilitating positional alignment between the base layer connector 222 and the corresponding cover layer connector 322 during installation of the cooling tile assembly 100. More specifically, cooperative engagement between the alignment member 227 and the alignment aperture 327 promotes accurate alignment of the first and second connectors 225, 325, respectively, to ensure proper assembly and fit of the cooling tile assembly 100. It will be understood that the alignment member 227 and the alignment aperture 327 described herein are an example of the alignment features and that, in other embodiments, the base layer connectors 222 and the cover layer connectors 322 may include any other suitable alignment feature.

[0083] In certain embodiments, at least one of the base layer connectors 222 or the cover layer connectors 322 may include a gasket (not shown) configured to absorb noise when a cover panel 310 is complementarily stacked onto a corresponding base panel 210 and the first and second connectors 225, 325 are engaged. The gasket mayFile No. 021889-0008 - 12 -be made of a rubber or any other suitable resilient material and further occupy any residual space between the cover panel 310 and the base panel 210, thereby contributing to a more secure fit and reducing potential vibration or impact-related disturbances.

[0084] In the exemplary, non-limitative embodiment shown in FIGS. 5 to 10, a base layer connector 222 extends upward from the upper surface 220 of the base panel 210 at each intersection point of the first grid pattern 212. According to this configuration, the base layer connectors 222 are substantially uniformly spaced from one another, thereby defining a consistent spacing between adjacent ones of the base layer connectors 222. In certain embodiments, the interstitial space defined between neighboring base layer connectors 222 is dimensioned to accommodate a pipe 410 of the pipe circuit 400, as described in further detail below.

[0085] In accordance with certain non-limitative embodiments, one or more of the base layer connectors 222 can include a fastener-receiving aperture (not shown) sized to receive a fastener (such as a loop fastener or the like) configured to secure a pipe 410 to an adjacent one of the base layer connectors.

[0086] Referring to FIG. 5, in certain embodiments, the base layer connectors 222 may include a central base connector 228 positioned substantially at the center of the base panel 210. The remaining base layer connectors 222 may be distributed around the central base connector 228 in accordance with the first grid pattern 212 described above. In some embodiments, the central base connector 228 is configured to receive a fastener or other suitable securing means (not shown) for anchoring the base panel 210 to the ground surface. In such cases, the central base connector 228 may include an open top sized to provide access to a hollow interior and may therefore be devoid of a first connector 225 to accommodate the fastener.

[0087] Alternatively, in other embodiments, a plurality of fasteners can be secured to the base layer 200 at regular or irregular intervals. For example, a fastener may be positioned approximately every 100 ft2of the base layer 200.

[0088] In the illustrated embodiment, and as best shown in FIGS. 9 to 12, each of the base panels 210 may include an interlocking mechanism 242 disposed along at leastFile No. 021889-0008 - 13 -one edge 240 thereof and configured to facilitate a connection with an adjacent one of the base panels 210. In the illustrated embodiment, the interlocking mechanism 242 includes a first interlocking connector 244 positioned along a first later edge 240a of the base panel 210, and a second interlocking connector 246 positioned along a second lateral edge 240b of the base panel 210. The first and second interlocking connectors 244, 246 respectively form the male and female components of a snap-fit connection. In particular, in the illustrated embodiment, the first interlocking connector 244 is supported on a connector support 247 that extends from the ground-facing side 230 towards the upper side 220 by a predetermined height h. The second interlocking connector 246 (i.e., the female component of the interlocking mechanism 240) is integrated into a given base layer connector 222’ positioned along the second lateral edge 240b of the base panel 210. Notably, the base layer connector 222’ includes a base portion 223 that is vertically offset from the ground-facing side 230 of the base panel 210, thereby defining a support-receiving gap 248 substantially sized to accommodate the connector support 247 of an adjacent one of the base panels 210. During assembly of the cooling tile assembly 100, the base layer connector 222’ of a given one of the base panels 210 can be aligned with and positioned above the connector support 247 of an adjacent one of the base panels 210, enabling mechanical engagement of the first and second interlocking mechanisms 244, 246, and thereby securing the adjacent base panels 210 together.

[0089] In the embodiment, the base panel 210 includes multiple first interlocking connectors 244 disposed along the first and third lateral edges 240a, 240c of the base panel 210, the third lateral edge 240c being adjacent to the first lateral edge 240a. Similarly, the base panel 210 may include multiple second interlocking connectors 246 positioned along the second and fourth lateral edges 240b, 240d of the base panel 210, the fourth lateral edge 240d being adjacent to the second lateral edge.

[0090] It will be understood that, in other embodiments, the interlocking mechanism 242 can include any other suitable pair of connectors including, for instance, magnetic connectors, snap-fit connectors, adhesive connectors, or the like, with the first and second interlocking connectors 228, 229 being positioned along any suitable lateral edge 240 of the base panel 210.File No. 021889-0008 - 14 -

[0091] Referring now to FIGS. 5 to 8, in certain embodiments, the base panel 210 further includes one or more base openings 232 of varying geometries that extend at least partially between the upper side 220 and the ground-facing side 230. When the cooling tile assembly 100 is in use (i.e., when it is submerged in water), the base openings 232 may function as receptacles configured to retain water, as described in greater detail below. In the illustrated embodiment, each of the one or more base openings 232 is substantially circular however, it will be understood that, in other embodiments, the base openings 232 may adopt any suitable shape conductive to water retention. In certain embodiments, each base opening 232 may have a depth of approximately 1 / 8 inch.

[0092] In certain embodiments and as best shown in FIGS. 7 and 8, the base panel 210 further includes one or more internal support structures 234 extending across respective base openings 232. Each of the internal support structures 234 may include one or more support members extending substantially horizontally between opposing edges of the corresponding base opening 232, thereby enhancing the structural integrity of the base panel 210 and mitigating deformation due to thermal expansion or contraction during operation of the cooling tile assembly 100. The support members of the internal support structures 234 may adopt various geometries including straight, wavey, or combinations thereof. For example, a first internal support structure 234a may extend within a corresponding base opening 232 and include eight radially extending support members arranged in a substantially vortex-like configuration originating from a central region of the corresponding base opening 232. Additionally, a second internal support structure 234b may extend within a corresponding base opening 232 and include one or more arcuate or undulating support members spanning the corresponding base opening 232. In this manner, the internal support structures 234 may contribute to improved material resilience of the base panel 210, facilitate controlled thermal dilation, and help prevent structural failure due to expansion of freezing water retained within the base openings 232.

[0093] Referring again to FIG. 5, in certain embodiments, a connecting channel 236 can be provided between two adjacent ones of the base openings 232 to allow fluid communication therebetween and thus further facilitate controlled thermal dilation. In the illustrated embodiment, the connecting channels 236 are defined within the baseFile No. 021889-0008 - 15 -portion 223 of respective base layer connectors 222. When present, the connecting channels 236 may further contribute to improved material resilience of the base panel 210, facilitate controlled thermal dilation, and help prevent structural failure due to expansion of freezing water retained within the base openings 232

[0094] The various configurations of the base openings 232 described above are designed to maximize water retention when the cooling tile assembly 100 is submerged, thereby promoting faster freezing of the lower water layer (i.e. , the water located beneath the pipe circuit 400), as further described below. Specifically, as water freezes, it expands and may exert outward pressure on the surrounding structures including the base layer connectors 222, potentially leading to deformation or damage. Additionally, temperature fluctuations during winter can cause further movement of the ice, increasing the risk of structural stress or failure. These configurations thus contribute to the structural resilience of the base panel 210 by accommodating the expansion of freezing water and facilitating thermal dilation.

[0095] In certain embodiments, a rubber ring (not shown) may be affixed to the base of one or more of the base layer connectors 222 on the ground-facing side 230 of each base panel 210. The rubber ring may enhance adherence to the ground surface, helping to prevent lateral displacement of the base panel 210 and thus of the cooling tile assembly 100 during use thereof. Furthermore, the rubber ring may provide noise dampening and improve shock absorption of the cooling tile assembly 100.

[0096] In certain embodiments, each of the base layer connectors 222 may be substantially equal in height and volume, and may define a substantially hollow interior to reduce a weight of the base panel 210, to enable a better circulation of fluids, and / or to reduce the structural rigidity of the base panel 210, thereby allowing for greater flexibility and thermal responsiveness of the cooling tile assembly 100.

[0097] In certain embodiments, the base layer connectors 222 can further include drainage apertures (not shown) located on the base portion 223 of the respective base layer connectors 222. The drainage apertures can be configured to allow water to be evacuated from the hollow interior of the base layer connector 222 onto the ground surface beneath the base layer 200.File No. 021889-0008 - 16 -Cover layer

[0098] As stated above, the cover layer 300 includes a plurality of cover panels 310 configured to be arranged side-by-side with each of the plurality of cover panels 310 being complementary stackable on top of respective ones of the base panels 210 to form the pipe-receiving cavity 150 therebetween.

[0099] Referring again to FIG. 4, one or more of the cover panels 310 may include an intermediate portion 314 and an upper tile portion 316 removably securable to one another, the intermediate portion 314 being configured to be mounted between the upper tile portion 316 and the base layer 200 when the cooling tile assembly 100 is assembled, as will be described in further detail below. It will be understood that, in other embodiments, the cover panels 310 may be unitary (i.e., the cover panels 310 may not include distinct portions configured to be removably secured to one another).

[0100] As shown in the non-limitative embodiment illustrated FIGS. 3 and 4, each cover panel 310 is substantially square-shaped (similar to the base panel 210) although it will be understood that each cover panel 310 can alternatively include any other suitable shape. While the cover panels 310 used in the illustrated cooling tile assembly 100 may share similar shapes and dimensions to facilitate uniform assembly, it will be further understood that alternative configurations with varying shapes and sizes may also be considered. In the illustrated embodiment, each cover panel 310 has a substantially square shape with each side measuring about 12”. Each cover panel 310 includes an exposed side 320, a bottom side 330 opposite the exposed side 320, and four lateral edges 340.

[0101] When the cooling tile assembly 100 is assembled, the cover panels 310 can be stacked over respective base panels 210 such that the bottom side 330 is oriented toward and faces the upper side 220 of the respective base panel 210, while the exposed side 320 faces upwardly.

[0102] In the illustrated embodiment, the upper tile portion 316 of each cover panel 310 defines the exposed side 320 (upon which users may walk or a layer of ice may be formed during operation), and an underside 321 opposite the exposed sideFile No. 021889-0008 - 17 -320. The intermediate portion 314 defines the bottom side 330 of the cover panel 310 and a top surface 331 opposite the bottom side 330.

[0103] In certain embodiments, the base panels 210 of the base layer 200 and the cover panels 310 of the cover layer 300 (including, when present, the intermediate portion 314 and the upper tile portion 316) can be made of a material such as a thermoplastic resin or other forms of polymers. The thermoplastic resin may include at least one selected from resins, such as polypropylene (PP), high-density polyethylene (HDPE), fiber-reinforced plastic (FRP), polycarbonate (PC), polyethylene (PE), or the like. Said materials may facilitate the molding process during manufacturing thereof. It will be understood that, in other embodiments, the base panels 210 and the cover panels 310 of the cooling tiles assembly 100 can be made of any suitable material including metals, ceramics, or the like.

[0104] Each of the intermediate and upper tile portions 314, 316 may include one or more coupling members 318 configured for removable attachment to secure the intermediate and upper tile portions 314, 316 together. In the illustrated embodiment, the coupling members 318 comprise snap connectors configured to allow relative sliding movement between the intermediate and upper tile portions 314, 316 once engaged. Specifically, the coupling members 318 may be arranged on both the intermediate and upper tile portions 314, 316 in a substantially radial pattern relative to a central region of each tile portion. This configuration enables relative movement between the intermediate and upper tile portions during thermal expansion and contraction caused by temperature fluctuations during use of the cooling tile assembly 100. Such relative movement may facilitate controlled thermal dilation and may help prevent structural failure due to expansion of freezing water retained within the cooling tile assembly 100. It will be understood that, in other embodiments, the coupling members 318 of the intermediate and upper tile portions 314, 316 may include any other attachment feature configured to enable a relative movement between the tile portions.

[0105] Referring now to FIG. 14, each intermediate portion 314 of the cover panel 310 further includes a plurality of cover layer connectors 322 that protrude downwardly from the bottom side 330 of the corresponding intermediate portion 314File No. 021889-0008 - 18 -and arranged in a second grid pattern 312. In the illustrated embodiment, each of the cover layer connectors 322 includes a substantially cylindrical stud portion 324 extending downwardly from the bottom side 320 of the intermediate layer 314, and a set of lateral reinforcing ribs 326 extending upwardly along the sidewall of the cylindrical stud portion 324, similar to the lateral reinforcing ribs 226 described above. Although the cover layer connectors 322 depicted in FIGS. 13 to 17 do not include a base portion, it will be understood that, in other embodiments, a base portion may be provided, analogous to the base portion 223 of the base layer connectors 222 described above.

[0106] In the illustrated embodiment, one or more of the cover layer connectors 322 are positioned along the edges 340 and corners of the bottom side 320 of the intermediate layer 314. In such embodiments, the cover layer connectors 322 positioned along the edges 340 of the intermediate layer 314 may be segmented, i.e. , the cover layer connectors 322 may include only a portion or a fraction of a full connector geometry. For instance, when the cover layer connectors 322 include a substantially cylindrical stud portion 324, the cover layer connectors 322 may take the form of semi-cylindrical connectors 328 and / or quarter-cylindrical connectors 329. In the illustrated embodiment, the semi-cylindrical connectors 328 are positioned along each one of the side edges 340 of the intermediate layer 314, with a plane surface 328a of the semi-cylindrical connectors 328 intersecting the corresponding side edge 340. In the non-limitative embodiment illustrated in FIGS. 13 to 17, the intermediate layer 314 of each cover layer 310 includes two semi-cylindrical connectors 328 positioned along each one of the four side edges 340. Moreover, the intermediate layer 314 of each cover layer 310 may further include four quarter-cylindrical studs 329 provided at each corner of the respective intermediate layer 314, with each of the quarter-cylindrical studs 329 defining two plane surfaces 329a, 329b intersecting two adjacent ones of the side edge 340. As shown in FIG. 14, the semi-cylindrical connectors 328 and the quarter-cylindrical studs 329 are positioned at intersection points of the second grid pattern 312 such that the distance between adjacent ones of the quarter-cylindrical studs 329 and the consecutive semi-cylindrical connectors 328, as well as the distance between two consecutive semi-cylindrical connectors 328 areFile No. 021889-0008 - 19 -substantially equal, ensuring an evenly spaced distribution of studs along each one of the side edges 340 of the corresponding cover layer 310.

[0107] As stated above, each cover layer connector 322 includes an alignment aperture 327 configured to facilitate positional alignment between the base layer connector 222 and the corresponding cover layer connector 322 during installation of the cooling tile assembly 100. Each cover layer connector 322 further includes one or more second connectors 325 configured to engage the first connector 225 of a corresponding base layer connector 225.

[0108] In certain embodiments, during assembly of the cooling tile assembly 100, a cover panel 310 may be aligned with a corresponding base panel 210 such that each cover layer connector 322 engages a corresponding base layer connector 222. With respect to the semi-cylindrical connectors 328, two such connectors may be coupled to a single base layer connector 222. In these cases, the alignment member 227 of the base layer connector 222 and the corresponding alignment aperture 327 of each semi-cylindrical connector 328 may cooperate to ensure proper alignment between the respective first and second connectors 225, 325.

[0109] Similarly, four quarter-cylindrical connectors 329 may be coupled to a single base layer connector 222. In such embodiments, the quarter-cylindrical connectors 329 may be devoid of an alignment aperture 327. Nevertheless, the alignment member 227 of the base layer connector 222 may still facilitate alignment of each second connector 325 of the quarter-cylindrical connectors 329 with the corresponding first connector 225 of the base layer connector 222.

[0110] In certain embodiments, each of the cover layer connectors 322 may be substantially equal in height and volume, and may define a substantially hollow interior to reduce a weight of the cover panel 310, to enable a better circulation of fluids, and / or to reduce the structural rigidity of the base panel 310, thereby allowing for greater flexibility and thermal responsiveness of the cooling tile assembly 100.

[0111] In certain embodiments, each cover panel 310 can include an interlocking mechanism (not shown) positioned along one or more of the edges 340 for connecting two adjacent base panels. When the cover panel 310 includes anFile No. 021889-0008 - 20 -intermediate portion 314 and an upper tile portion 316 as described above, the interlocking mechanism can be provided on either or both of the portions. The interlocking mechanism may include male connectors protruding horizontally from the edges 340 (for instance two adjacent ones of the four edges 340 of the cover panel 310). The interlocking mechanism may further include female connectors positioned on one or more of the edges 340 (for instance the remaining two edges 340 of the cover panel 310). In certain embodiments, each male connector may be connected to the plane surface 327a of the semi-cylindrical connectors 327 by a male connector arm, such that the male connector is horizontally spaced apart from the plane surface 327a of the semi-cylindrical connectors 327 and each male connector protrudes externally from the corresponding edges 340. In certain embodiments, the male connector arm of the male connector protrudes from a central region of each semi- cylindrical connectors 327 positioned on the edges 340. In certain embodiments, each male connector can be substantially semi-cylindrical and configured to engage a female connector defined in one of the semi-cylindrical connectors 327 of and adjacent cover panel 310. It will be understood that, in other embodiments, the cover panel 310 may include any other suitable interlocking mechanism including snap-fit connectors, or the like.

[0112] Referring now to FIGS. 15 and 16, in certain embodiments, the cover panel 310 further includes one or more cover openings 332 of varying geometries that extend at least partially between the exposed side 320 and the bottom side 330. When the cooling tile assembly 100 is in use (i.e. , when it is submerged in water), the cover openings 332 may function as apertures configured to enable the flow of water across the cover tile 310, as described in greater detail below.

[0113] In certain embodiments, and as best shown in FIGS. 15 and 16, the cover panel 310 may include one or more internal support structures 334 extending across one or more of the cover openings 332. In the illustrated embodiment, the internal support structures 334 are positioned across the cover openings 332 of the intermediate portion 314. It will be understood, however, that in other embodiments, internal support structures 334 may be provided across the cover openings 332 of the upper tile portion 316.File No. 021889-0008 - 21 -

[0114] Each of the internal support structures 334 may include one or more support members extending substantially horizontally between opposing edges of the corresponding cover opening 332, thereby enhancing the structural integrity of the cover panel 310 and mitigating deformation due to thermal expansion or contraction. The support members of the internal support structures 334 may adopt various geometries including straight, wavey, or combinations thereof. For example, and as best shown in FIGS. 15 and 16, a first internal support structure 334a may extend within a corresponding cover opening 332 and include eight radially extending support members arranged in a substantially vortex-like configuration originating from a central region of the corresponding cover opening 332. Additionally, a second internal support structure 334b may extend within a corresponding cover opening 332 and include one or more arcuate or undulating support members spanning the corresponding cover opening 332. In this manner, the internal support structures 334 may contribute to improved material resilience of the cover panel 310, facilitate controlled thermal dilation, and help prevent structural failure due to expansion of freezing water retained within the cover openings 332.Pipe circuit

[0115] Referring again to FIGS. 1 and 2, the pipe circuit 400 can include a plurality of pipes 410 nested in the pipe-receiving cavity 150. In certain embodiments, one or more of the pipes 410 can be sufficiently flexible to be laid in an arcuate or serpentine pattern without being pinched. For example, as shown in FIG. 1 , the pipes 410 can be bent at a given angle between 0° and 180° without restricting of a flow of fluid within the pipes 410. In certain embodiments, each of the plurality of pipes 410 can be bent over a radius of between 1” to 2”, so that when bent into a loop without being pinched, the two portions of the pipe extending from the loop are spaced apart by approximately 2” to 4”. In particular, when the cooling tile assembly 100 is installed on the ground surface, the pipes 410 can be laid between each of the base layer connectors 222 and the cover layer connectors 322.

[0116] In certain embodiments, each of the plurality of pipes 410 can have a total length of at least about 100m, or at least about 150m, or more preferably about 250m and may be deprived of any gasket or seal.File No. 021889-0008 - 22 -

[0117] The plurality of pipes 410 are designed to support and facilitate fluid transport at very low temperatures and possess thermal conductivity properties suitable for promoting energy transfer into the water retained within the cooling tile assembly 100. It will be appreciated that higher thermal conductivity of the pipes 410 may enhance the efficiency of water freezing within the cooling tile assembly 100.

[0118] Each pipe 410 may have a diameter ranging from approximately ! inch to 2 inches, and more preferably about 1 inch. Once positioned within the pipereceiving cavity 150, adjacent pipes 410 extending through the cavity 140 may be spaced apart by a distance at least equal to the width of a base layer connector 222. For example, the spacing between adjacent pipes 410 may range from about 1 inch to 4 inches, and more preferably around 2 inches.

[0119] In certain embodiments, each of the pipes 410 may be formed from materials such as metallocene, polyethylene (including medium-density polyethylene (MDPE), linear low-density polyethylene (LLDPE), or high-density polyethylene (HDPE)), polymers such as polyvinyl chloride (PVC), monomers such as ethylene propylene diene monomer (EPDM), nylon, or any combination thereof. In other embodiments, the pipes 410 may be made of metal, such as stainless steel, although any other thermally conductive material may be considered depending on the application requirements.Manifold

[0120] As stated above, the cooling tile assembly may include one or more manifolds 500 fluidly connected to the pipe circuit 400 and configured to distribute cooling fluid from a refrigerating unit (not shown) to the pipes 410.

[0121] Referring now to FIG. 1 , a manifold 500 is shown in accordance with a non-limitative embodiment. The manifold 500 includes a manifold block 510 defining an inlet 520 configured to receive a refrigerated cooling fluid and a plurality of outlet ports 530 each configured to be fluidly connected to a corresponding pipe 410 of the pipe circuit 400. It will be understood that, in other embodiments, the manifold block 510 may define multiple inlets 520 and any other suitable number of outlet ports 530.File No. 021889-0008 - 23 -

[0122] In the illustrated embodiment, the manifold 500 is positioned along a side of the base and cover layers 200, 300 when the cooling tile assembly 100 is installed, with the pipe circuit 400 extending laterally thereof into the pipe-receiving cavity 150. It will be understood that, in other embodiments, the manifold 500 may be positioned in any other suitable location relative to the base and cover layers 200, 300.

[0123] In certain embodiments, the manifold body 510 may have an external length that is substantially equal to the length of the base layer 200. At least a portion of the manifold body 510 may be positioned between the base and cover layers 200 and 300, i.e., within the pipe-receiving cavity 150. In such configurations, the manifold body 510 may define one or more connector apertures 515, each shaped and sized to receive the base layer connectors 222 and the cover layer connectors 322 therethrough. In particular, the connector apertures 515are distributed following the same first grid pattern 212 of the base panel 210, to complementary fit in a base layer 200.

[0124] In certain embodiments, a refrigerating unit (not shown) may be fluidly connected to the inlet 520 of the manifold block 510. The refrigerating unit may operate as a servo system, configured to inject cooling fluid through an input hose (not shown) and to draw heated fluid through at least one output hose (not shown). In such configurations, a manifold 500 connected to the input hose may function as a cold manifold, while a header connected to the output hose may serve as a hot manifold. In this manner, cold fluid introduced into the cold manifold 500 is distributed into the pipe circuit 400 extending across the cooling tile assembly 100. The fluid circulates in a serpentine pattern through the pipes 410 and, upon absorbing heat, is drawn into the hot manifold at an elevated temperature before returning to the refrigerating unit for recooling and recirculation. It is understood that the geometry and configuration of the pipe circuit 400 and manifold 500 described herein represent exemplary embodiments, and that other suitable configurations may be considered without departing from the scope of the invention.

[0125] In certain embodiments, the fluid circulated through the cooling tile assembly 100 can be any refrigerant fluid or cooling fluid with freezing capabilities, such as cooling liquid or cooling gaz. In certain embodiments, the cooling fluid canFile No. 021889-0008 - 24 -have a temperature from about -20°C to about -10°C, and preferably about -13°C when injected into the colling tile assembly 100, while the hot fluid can have a temperature from about -10°C to about 0°C, and preferably about -9°C, or -8°C when drawn from the cooling tile assembly 100.

[0126] In certain embodiments, the manifold 500 can be made of any suitable material, including but not limited to fibre-plastic composite or fibreglass reinforced plastic (FRP), polyvinyl chloride (PVC), or high-density polyethylene (HDPE). In other embodiments, the manifold 500 can also be made of metal, such as aluminium (Al) or stainless steel.Method

[0127] A method for installing a cooling tile assembly 100 for permanently covering a ground surface is also disclosed herein. The resulting cooling tile assembly 100 can be used as a multisport surface with freezing capabilities.

[0128] To install the cooling tile assembly 100, the base layer 200, the cover layer 300, the pipe circuit 400 and the manifold 500 as described above are first provided. In one embodiment, the cooling tile assembly 100 could be provided as a kit for a cooling tile assembly, in which all the components of the cooling tile assembly 100 illustrated above are provided as separate components to be assembled together by the user. In certain embodiments, at least some of the components could be preassembled together to facilitate assembly by the user.

[0129] The first step comprises installing the base layer 200 on the ground surface by securing a plurality of base panels 210 in a side-by-side configuration so as to abut each other. In certain embodiments, the method can further include securing at least one of the base panels 210 to the ground surface, using a fastener or any other securing means.

[0130] The next step can include installing the manifold 500. In particular, a manifold body 510 of the manifold 500 may be installed adjacent to the base layer 200 or at least partially upon the base layer 200 with one or more base layer connectors 222 of the base panels 210 being inserted into corresponding connector apertures 515 of the manifold body.File No. 021889-0008 - 25 -

[0131] The method may further include the step of distributing the pipe circuit 400 by nesting the pipes 410 into the pipe-receiving cavities 150 defined between the base layer connectors 222 of the base panels 210 and the cover layer connectors 322 of the cover panels 322. For example, the plurality of pipes 410 can be installed in a serpentine pattern around the base layer connectors 222 of the base panels 210. Each extremity of the pipes 410 can be further connected to a corresponding outlet port 530 of the manifold body 510. In certain embodiments, the method may further include securing each pipe 410 to a base layer connector 222 adjacent to the pipe 410.

[0132] The method further includes the step of mounting the cover layer 300 over the base layer 200 by complementary stacking one or more cover panels 310 over each of the base panels 210, the pipe circuit 400 being sandwiched therebetween into the pipe-receiving cavity 150. In certain embodiments, cover panels 310 can also be disposed on top of the manifold 500. The stacking of the cover panels 310 over each of the plurality of base panels 210 is repeated until the entire cooling tile assembly 100 is covered by the cover 300. In certain embodiments, the method may further include connecting together an intermediate portion 314 and an upper tile portion 316 to form a given one of the cover panels 310. In certain embodiments, the step of mounting the cover layer 300 can include removably securing an upper tile portion 316 of the cover panel 310 to an intermediate portion 314 of the cover panel 310.

[0133] The method may further include connecting the manifold to a refrigerating unit via an input hose and injecting a cooling fluid into the input hose, and to draw in a heated fluid in at least one output hose, in order to circulate a fluid with freezing capabilities (or cooling fluid) along the pipe circuit 400. In certain embodiments, the method comprises starting to circulate the fluid along the pipe circuit 400 a couple of days before using the cooling tile assembly 100, to ensure proper and uniform spread of the cooling fluid along the pipe circuit 400.

[0134] After a predetermined period (e.g., several hours or days), the pipe circuit 400 may reach a sufficiently low temperature to initiate the filling of the cooling tile assembly 100 with water. In certain embodiments, water may be distributed over the cover layer 300, passing through various perforations or permeating the cover panelsFile No. 021889-0008 - 26 -310, thereby coming into contact with the chilled pipe circuit 400 until reaching the base panels 210. To optimize the freezing process, it may be advantageous to water the cooling tile assembly 100 in stages. For example, in a first stage, water may be added until the base openings 232 of the base panels 210 are fully submerged. The geometric configuration of the base openings 232 functions as retention bowls, allowing water to accumulate and remain in direct contact with the pipe circuit 400, which is nested above. This direct contact promotes efficient freezing of the retained water.

[0135] The second stage can further be processed once the water injected in the first stage is completely frozen. The second stage can comprise watering the cooling tile assembly 100 until the cooling tile assembly is submerged by water. The frozen base formed during the first stage and the contact with the freezing pipe circuit 400 may render the freezing of water during the second stage more efficient.

[0136] In a subsequent stage of the method, once the previously provided water has frozen, additional water may be provided above the exposed side 320 of the cover panels 310 to form an additional layer of ice thereupon. In certain embodiments, a thickness of water (or ice) overlaying the cooling tile assembly 100 of about 1” to about 3” can be provided, and more preferably about 1 14”. Overall, the total thickness of water (or ice) may be about 2” to about 5”, and more preferably about 3 14”, with a first portion being within the cooling tile assembly 100, and a second portion being an exposed layer of ice to practice ice sports on the cooling tile assembly during winter.

[0137] During certain periods (such as warmer months) the method may further include deactivating the refrigerating unit to stop circulation of the cooling fluid through the pipe circuit 400, thereby allowing any thawed water to evacuate from the cooling tile assembly 100. Once the ice has melted and the exposed surface 330 of the cover panels 310 is substantially dry, the cooling tile assembly may remain in its assembled state and be repurposed as a multisport surface.

[0138] While the above description provides examples of the embodiments, it will be appreciated that some features and / or functions of the described embodiments are susceptible to modification without departing from the spirit and principles of operation of the described embodiments. As an example, the cooling tile assemblyFile No. 021889-0008 - 27 -could also be used as a heating tiles assembly, by connecting the manifold to a heating unit. Accordingly, what has been described above has been intended to be illustrative and non-limiting and it will be understood by persons skilled in the art that other variants and modifications may be made without departing from the scope of the invention as defined in the claims appended hereto.File No. 021889-0008 - 28 -

Claims

CLAIMS:1 . A cooling tile assembly for installation over a ground surface, the cooling tile assembly being suitable as a multisport surface with one of freezing functionality and heating functionality, the cooling tile assembly comprising: a base layer comprising a plurality of base panels configured to be arranged side-by-side, each base panel of the base layer comprising an upper side and a ground-facing side opposite to the upper side, the ground-facing side being configured to face the ground surface when the cooling tile assembly is assembled; a cover layer comprising a plurality of cover panels configured to be arranged side-by-side, each of the plurality of cover panels comprising an exposed side and a bottom side opposite the exposed side, each of the plurality of cover panels being complementarily stackable onto at least a portion of a corresponding one of the base panels to form a pipe-receiving cavity therebetween; and a pipe circuit comprising a plurality of pipes positioned within the pipereceiving cavity.

2. The cooling tile assembly of claim 1 , wherein each of the base panels of the base layer comprises a plurality of base layer connectors extending upwardly from the upper side of the respective base panel.

3. The cooling tile assembly of any one of claims 2, wherein one or more of the base layer connectors is shaped as a cylindrical stud.

4. The cooling tile assembly of claim 3, wherein each cylindrical stud comprises lateral ribs extending upwardly along a sidewall of the cylindrical stud.

5. The cooling tile assembly of claim 3 or 4, wherein at least one of the base layer connectors of a given one of the base panels is shaped to receive aFile No. 021889-0008 - 29 -fastener for securing the given one of the base panels to the ground surface.

6. The cooling tile assembly of any one of claims 2 to 5, wherein at least one of the base panels of the base layer comprises one or more base openings at least partially extending between the upper and ground-facing sides of the respective base panel, the base openings being configured to retain water when the cooling tile assembly is submerged.

7. The cooling tile assembly of claim 6, wherein the base panel further comprises one or more internal support structures extending across a given base opening, the internal support structures being configured to at least partially resist a thermal dilation of the base panel.

8. The cooling tile assembly of any one of claims 2 to 7, wherein each of the base panels comprises an interlocking mechanism for securing adjacent ones of the base panels together.

9. The cooling tile assembly of claim 8, wherein the interlocking mechanism comprises a first interlocking connector disposed along a first later edge of the respective base panel.

10. The cooling tile assembly of claim 9, wherein the interlocking mechanism comprises a second interlocking connector, the second interlocking connector being a given one of the base panel connectors positioned along a second lateral edge of the respective base panel and vertically offset from the ground-facing side of the respective base panel to define a connector-receiving gap sized to receive the first interlocking connector of an adjacent one of the base panels.

11. The cooling tile assembly of claim 10, wherein the first and second interlocking connectors comprise complimentary connectors configured to secure adjacent ones of the base panels together.

12. The cooling tile assembly of claim 11 , wherein the complimentary connectors are snap-fit connectors.File No. 021889-0008 - 30 -13. The cooling tile assembly of anyone of claims 2 to 12, wherein each of the cover panels of the cover layer comprises a plurality of cover layer connectors extending downwardly from the bottom side of the respective cover panel, each of the base layer connectors and a corresponding one of the cover layer connectors defining a pair of interlockable connectors for removably securing the respective base and cover panels together.

14. The cooling tile assembly of claim 13, wherein at least one of the cover panels of the cover layer comprises an upper tile portion and an intermediate portion removably securable to one another, the intermediate portion being configured to be installed between the upper tile portion and the base layer when the cooling tile assembly is assembled.

15. The cooling tile assembly of claim 14, wherein the upper tile portion and the intermediate portion comprise coupling members configured for removable attachment to secure the upper tile portion and the intermediate portion together.

16. The cooling tile assembly of claim 15, wherein the coupling members are configured to allow relative sliding movement between the intermediate and upper tile portions when the cooling tile assembly is assembled.

17. The cooling tile assembly of claim 16, wherein the coupling members are arranged on the intermediate and upper tile portions in a substantially radial pattern relative to a central region of the respective intermediate tile portion and the upper tile portion.

18. The cooling tile assembly of any one of claims 14 to 17, wherein the coupling members include snap connectors.

19. The cooling tile assembly of any one of claims 13 to 18, wherein the base layer connectors of each of the base panels are arranged in a first grid pattern, and wherein the cover layer connectors of each of the cover layers are arranged in a second grid pattern corresponding substantially to the first grid pattern of the base layer connectors.File No. 021889-0008 - 31 -20. The cooling tile assembly of any one of claims 13 to 19, wherein each of the base layer connectors and the cover layer connectors comprises a connector alignment feature configured to facilitate positional alignment between the base layer connectors and the corresponding cover layer connectors during installation of the cooling tile assembly.

21. The cooling tile assembly of claim 20, wherein one of the base layer connectors and the cover layer connectors comprises an alignment member extending upwardly from a top surface thereof, and the other of the base layer connectors and the cover layer connectors comprises an alignment recess shaped and sized to receive the alignment member.

22. The cooling tile assembly of any one of claims 2 to 21 , further comprising a manifold configured to be fluidly connected to the pipe circuit and to circulate a cooling fluid through the pipes to enable the freezing functionality.

23. The cooling tile assembly of claim 22, wherein the manifold is configured to be at least partially interposed between the base layer and the cover layer when the cooling tile assembly is assembled.

24. The cooling tile assembly of claim 23, wherein the manifold comprises a manifold block defining a connector aperture sized to receive a corresponding base layer connector when the cooling tile assembly is assembled.

25. The cooling tile assembly of any one of claims 1 to 24, wherein each cover panel further defines a plurality of cover openings configured to allow water to circulate within the cavity when the cooling tile assembly is submerged.

26. A method for installing a cooling tile assembly for permanently covering a ground surface, the cooling tile assembly being useable as a multisport surface with at least one of freezing and heating capabilities, the method comprising the steps:File No. 021889-0008 - 32 -covering the ground surface with a base layer by securing side-by-side a plurality of base panels; distributing a pipe circuit over the base layer; and installing a cover layer over the base layer by complementarily stacking a cover panel over each of the plurality of base panels, the pipe circuit being interposed therebetween.

27. The method of claim 26, further comprising connecting at least one manifold to the pipe circuit.

28. The method of claim 27, further comprising injecting a cooling fluid in an input port of a first manifold, and retrieving a hot fluid in an output port of a second manifold.

29. The method of any one of claims 26 top 28, further comprising securing at least one of the base panels to the ground surface.

30. The method of any one of claims 26 to 29, further comprising a step of covering the cooling tile assembly with water until a surface of ice is covering the cooling tile assembly.31 . The method of claim 30, wherein the ice covering the cooling tile assembly is about 1 >2” of thickness.

32. The method of claim 31 , wherein the step of installing the cover layer comprises removably securing an upper tile portion of the cover layer to an intermediate portion of the cover layer connector.

33. A cooling tile assembly for installation over a ground surface, the cooling tile assembly being suitable as a multisport surface with one of freezing functionality and heating functionality, the cooling tile assembly comprising: a base layer comprising a plurality of base panels configured to be arranged side-by-side, the ground-facing side being configured to face the ground surface when the cooling tile assembly is assembled;File No. 021889-0008 - 33 -a cover layer comprising a plurality of cover panels configured to be arranged side-by-side, each of the plurality of cover panels comprising an upper tile portion and an intermediate portion removably securable to one another, the intermediate portion being configured to be installed between the upper tile portion and the base layer when the cooling tile assembly is assembled comprising to form a pipe-receiving cavity between the base and cover layers.

34. The cooling tile assembly of claim 33, wherein the upper tile portion and the intermediate portion comprise coupling members configured for removable attachment to secure the upper tile portion and the intermediate portion together.

35. The cooling tile assembly of claim 34, wherein the coupling members are configured to allow relative sliding movement between the intermediate and upper tile portions when the cooling tile assembly is assembled.

36. The cooling tile assembly of claim 35, wherein the coupling members are arranged on the intermediate and upper tile portions in a substantially radial pattern relative to a central region of the respective intermediate tile portion and the upper tile portion.

37. The cooling tile assembly of any one of claims 33 to 36, wherein each of the base panels of the base layer comprises a plurality of base layer connectors extending upwardly from an upper side of the respective base panel.

38. The cooling tile assembly of claim 37, wherein one or more of the base layer connectors is shaped as a cylindrical stud.

39. The cooling tile assembly of claim 38, wherein each cylindrical stud comprises lateral ribs extending upwardly along a sidewall of the cylindrical stud.

40. The cooling tile assembly of any one of claims 37 to 39, wherein at least one of the base layer connectors of a given one of the base panels isFile No. 021889-0008 - 34 -shaped to receive a fastener for securing the given one of the base panels to the ground surface.41 . The cooling tile assembly of any one of claims 37 to 40, wherein at least one of the base panels of the base layer comprises one or more base openings at least partially extending between the upper and ground-facing sides of the respective base panel, the base openings being configured to retain water when the cooling tile assembly is submerged.

42. The cooling tile assembly of claim 41 , wherein the base panel further comprises one or more internal support structures extending across a given base opening, the internal support structures being configured to at least partially resist a thermal dilation of the base panel.

43. The cooling tile assembly of any one of claims 37 to 42, wherein each of the base panels comprises an interlocking mechanism for securing adjacent ones of the base panels together.

44. The cooling tile assembly of claim 43, wherein the interlocking mechanism comprises a first interlocking connector disposed along a first later edge of the respective base panel.

45. The cooling tile assembly of claim 44, wherein the interlocking mechanism comprises a second interlocking connector, the second interlocking connector being a given one of the base panel connectors positioned along a second lateral edge of the respective base panel and vertically offset from the ground-facing side of the respective base panel to define a connector-receiving gap sized to receive the first interlocking connector of an adjacent one of the base panels.

46. The cooling tile assembly of claim 45, wherein the first and second interlocking connectors comprise complimentary connectors configured to secure adjacent ones of the base panels together.

47. The cooling tile assembly of claim 46, wherein the complimentary connectors are snap fit connectors.File No. 021889-0008 - 35 -48. The cooling tile assembly of anyone of claims 37 to 47, wherein each of the cover panels of the cover layer comprises a plurality of cover layer connectors extending downwardly from the bottom side of the respective cover panel, each of the base layer connectors and a corresponding one of the cover layer connectors defining a pair of interlockable connectors for removably securing the respective base and cover panels together.

49. The cooling tile assembly of claim 48, wherein the pair of interlockable connectors comprises a male connector and a female connector.

50. The cooling tile assembly of claim 49, wherein the male and female connectors include snap-fit connectors.51 . The cooling tile assembly of any one of claims 48 to 50, wherein the base layer connectors of each of the base panels are arranged in a first grid pattern, and wherein the cover layer connectors of each of the cover layers are arranged in a second grid pattern corresponding substantially to the first grid pattern of the base layer connectors.

52. The cooling tile assembly of any one of claims 48 to 51 , wherein each of the base layer connectors and the cover layer connectors comprises a connector alignment feature configured to facilitate positional alignment between the base layer connectors and the corresponding cover layer connectors during installation of the cooling tile assembly.

53. The cooling tile assembly of claim 52, wherein one of the base layer connectors and the cover layer connectors comprises an alignment member extending upwardly from a top surface thereof, and the other of the base layer connectors and the cover layer connectors comprises an alignment recess shaped and sized to receive the alignment member.

54. The cooling tile assembly of any one of claims 37 to 53, further comprising a pipe circuit comprising a plurality of pipes positioned within the pipereceiving cavity.File No. 021889-0008 - 36 -55. The cooling tile assembly of claim 54, further comprising a manifold configured to be fluidly connected to the pipe circuit and to circulate a cooling fluid through the pipes to enable the freezing functionality.

56. The cooling tile assembly of claim 55, wherein the manifold is configured to be at least partially interposed between the base layer and the cover layer when the cooling tile assembly is assembled.

57. The cooling tile assembly of claim 56, wherein the manifold comprises a manifold block defining a connector aperture sized to receive a corresponding base layer connector when the cooling tile assembly is assembled.

58. The cooling tile assembly of any one of claims 33 to 57, wherein each upper tile portion further defines a plurality of cover openings configured to allow water to circulate within the cavity when the cooling tile assembly is submerged.File No. 021889-0008 - 37 -

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