Packaging structure of micro-display chip, packaging structure group and ar glasses

Abstract

The present application provides a packaging structure of a micro-display chip, a packaging structure group and AR glasses. The packaging structure of a micro-display chip comprises: a display chip, a light-emitting surface of the display chip having a light-emitting region and a non-light-emitting region, and the non-light-emitting region being provided with a first electrical connection portion; and a circuit board, a connection end of the circuit board having a second electrical connection portion, at least part of the connection end of the circuit board and at least part of the non-light-emitting region of the display chip being stacked, and the first electrical connection portion being correspondingly electrically connected to the second electrical connection portion. At least part of the connection end of the circuit board of the packaging structure of a micro-display chip and the non-light-emitting region of the display chip are stacked and electrically connected, thus helping to reduce the transverse size of the packaging structure and facilitating the miniaturization of the packaging structure.

Description

Packaging structure of microdisplay chips, packaging structure assembly and AR glasses Technical Field

[0001] This application relates to the field of Micro LED, and further to the packaging structure of micro display chips, the packaging structure assembly, and AR glasses. Background Technology

[0002] Inorganic micro-pixel light-emitting diodes, also known as micro LEDs or μ-LEDs, offer advantages over traditional LEDs, including better strain relaxation, higher light extraction efficiency, more uniform current diffusion, and higher output performance, making them widely used in the field of micro-displays.

[0003] Figure 1 shows a cross-sectional schematic diagram of a conventional microdisplay chip packaging structure. The conventional microdisplay panel includes a reinforcing plate 1p, a display chip 2p, and a circuit board 3p. The display chip 2p and the circuit board 3p are arranged side by side on the same side of the reinforcing plate 1p. The display chip 2p and the circuit board 3p are electrically connected by wires, such as metal wires. A packaging frame 4p is provided at the connection between the display chip 2p and the circuit board 3p.

[0004] In the existing structure of microdisplay panels, the width (X1) of the microdisplay panel is difficult to further reduce because the display chip 2p and the circuit board 3p are arranged side by side on the same side of the reinforcing plate 1p and are electrically connected by metal wires. On the other hand, in the thickness direction, the encapsulation frame 4p must completely wrap the wires, making it equally difficult to further reduce the thickness (X2) of the microdisplay panel.

[0005] In conclusion, the existing packaging structure of microdisplay chips will greatly limit the further miniaturization of microdisplay panel structures, which is not conducive to meeting the future requirements of the microdisplay industry for the size of microdisplay panels.

[0006] Summary of the Invention

[0007] To address the aforementioned technical problems, this application provides a microdisplay chip packaging structure, a packaging structure assembly, and AR glasses. At least a portion of the connection terminals of the circuit board of the microdisplay chip packaging structure are stacked and electrically connected to the non-light-emitting area of ​​the display chip, which helps to reduce the lateral size of the packaging structure and facilitates the miniaturization of the packaging structure.

[0008] To achieve at least one of the above objectives, this application provides a packaging structure for a micro display chip, comprising: a display chip, wherein the light-emitting surface of the display chip has a light-emitting area and a non-light-emitting area, and the non-light-emitting area is provided with a first electrical connection portion; a circuit board, wherein the connection end of the circuit board has a second electrical connection portion; at least a portion of the connection end of the circuit board is stacked with at least a portion of the non-light-emitting area of ​​the display chip, and the first electrical connection portion and the second electrical connection portion are correspondingly electrically connected.

[0009] According to another aspect of this application, a microdisplay chip packaging structure group is further provided, comprising: two or more microdisplay chip packaging structures arranged side by side, wherein the circuit boards of adjacent microdisplay chip packaging structures are integrally connected to each other.

[0010] According to another aspect of this application, an AR glasses is further provided, comprising: a glasses frame including a frame and temples; an optical waveguide sheet mounted on the frame; and a package structure assembly of the microdisplay chip as described in any one of the preceding claims, wherein the package structure assembly is mounted at the connection between the frame and the temples, the light-emitting surface of the package structure assembly faces the optical waveguide sheet, and the external circuit board segment of the package structure is disposed inside the temples.

[0011] Technical effects:

[0012] 1) In the micro display chip packaging structure provided in this application, at least a portion of the connection end of the circuit board is stacked with and electrically connected to the non-light-emitting area of ​​the display chip, which is beneficial to reducing the lateral size of the packaging structure and helps to miniaturize the packaging structure.

[0013] 2) In the microdisplay chip packaging structure provided in this application, the shape of the circuit board corresponds to the shape of the non-light-emitting area and surrounds the outside of the light-emitting area. There are multiple electrical connection points between the circuit board and the non-light-emitting area, which can meet the needs of more data transmission.

[0014] 3) In the micro display chip packaging structure provided in this application, the end of the circuit board away from the light-emitting area is flush with the end of the display chip, which can further reduce the overall size of the packaging structure.

[0015] 4) In the micro display chip packaging structure provided in this application, the side of the circuit board with the second electrical connection portion extends away from the light-emitting area and extends outward from the display chip. The side of the circuit board without the second electrical connection portion extends away from the light-emitting area and is flush with the end of the display chip. This can reduce the volume of the packaging structure without increasing the thickness of the circuit board.

[0016] 5) In the micro display chip packaging structure provided in this application, a heat sink is provided on the back of the display chip. The heat sink can improve the heat dissipation capacity of the display chip and provide support for the display chip on the back.

[0017] 6) In the micro display chip packaging structure provided in this application, there is a first plastic encapsulation frame between the circuit board and the heat sink, and a second heat sink frame on the outside of the heat sink. The first heat sink frame and the second heat sink frame can protect the circuit board and the display chip, and can improve the stability of the electrical connection structure between the display chip and the circuit board. Attached Figure Description

[0018] The above and other objects, features and advantages of this disclosure will become more apparent from the more detailed description of exemplary embodiments thereof taken in conjunction with the accompanying drawings, wherein like reference numerals generally denote like parts.

[0019] Figure 1 is a cross-sectional schematic diagram of the packaging structure of a prior art microdisplay chip;

[0020] Figure 2 is a top view of the packaging structure of the microdisplay chip according to the first embodiment of this application;

[0021] Figure 3a is a top view of the display chip in the packaging structure of the micro display chip according to the first embodiment of this application.

[0022] Figure 3b is a schematic diagram of the first modified embodiment of the display chip in the packaging structure of the micro display chip according to the first embodiment of this application;

[0023] Figure 3c is a schematic diagram of a second modified embodiment of the display chip in the packaging structure of the micro display chip according to the first embodiment of this application;

[0024] Figure 3d is a schematic diagram of the third modified embodiment of the display chip in the packaging structure of the micro display chip of the first embodiment of this application;

[0025] Figure 4 is a bottom view of the circuit board in the packaging structure of the microdisplay chip according to the first embodiment of this application.

[0026] Figure 5 is a schematic diagram of the cross-sectional structure along line AA in Figure 2;

[0027] Figure 6 is a schematic diagram of the cross-sectional structure along line BB in Figure 2;

[0028] Figure 7 is a cross-sectional schematic diagram of the packaging structure of the microdisplay chip according to the second embodiment of this application;

[0029] Figure 8a is a top view of the packaging structure of the microdisplay chip according to the first embodiment of this application;

[0030] Figure 8b is a schematic diagram of the cross-sectional structure of line CC in Figure 8a;

[0031] Figure 9 is a top view of the packaging structure of the microdisplay chip according to the second embodiment of this application;

[0032] Figure 10 is a top view of the packaging structure of the microdisplay chip according to the third embodiment of this application.

[0033] Figure 11 is a three-dimensional structural diagram of the packaging structure group of the microdisplay chip according to the fourth embodiment of this application;

[0034] Figure 12 is an exploded view of the packaging structure of the microdisplay chip according to the fourth embodiment of this application.

[0035] Figure 13 is a front view of the packaging structure of the microdisplay chip shown in Figure 11.

[0036] Figure 14 is a schematic diagram of the cross-sectional structure along line DD in Figure 13;

[0037] Figure 15 is a three-dimensional structural diagram of the AR glasses provided in one embodiment of this application;

[0038] Figure 16 is a schematic diagram of the front structure of the AR glasses shown in Figure 15;

[0039] Figure 17 is a schematic diagram of the cross-sectional structure along line EE in Figure 16. Detailed Implementation

[0040] Preferred embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0041] Referring to Figure 2, the packaging structure of the microdisplay chip provided in the first embodiment of this application includes a display chip 10 and a circuit board 20. The light-emitting surface 11 of the display chip 10 has a light-emitting area 12 and a non-light-emitting area 13. The light-emitting surface 11 is the side of the display chip 10 that emits light, that is, the side of the display chip 10 where the light-emitting area 12 is disposed. The non-light-emitting area 13 surrounds the light-emitting area 12. One side of the circuit board 20 includes an external circuit board segment 23, which is adapted to be electrically connected to an external circuit.

[0042] Referring to Figure 2, the packaging structure of the microdisplay chip further includes a heat sink 40 disposed on the back side of the display chip 10. The heat sink 40 contacts the back side of the display chip 10, which refers to the side of the display chip 10 opposite to the light-emitting surface. The heat sink 40 can increase the overall heat dissipation capacity of the packaging structure. Preferably, the material of the heat sink 40 is graphite sheet, but it can also be other high thermal conductivity materials. The thickness of the heat sink 40 is in the range of 10–100 μm.

[0043] Referring to Figure 3a, the display chip 10 further includes a first electrical connection portion 131 located in the non-light-emitting area 13. Specifically, the first electrical connection portion 131 further includes two parts (131a, 131b), which are respectively disposed on opposite sides of the light-emitting area 12. Both parts (131a, 131b) of the circuit board 131 can be electrically connected to the circuit board 20. Further, the first electrical connection portion 131 is electrically connected to the light-emitting area 12, and power can be supplied to the light-emitting area 12 through the first electrical connection portion 131 to illuminate the light-emitting area 12. Specifically, the display chip 10 further includes a driving backplate (not shown in the figure) and a light-emitting mesa array (not shown in the figure). The light-emitting mesa array is disposed on the top surface of the driving backplate, and the light-emitting mesa is located in the area corresponding to the light-emitting area 12. The first electrical connection portion 131 is disposed on the top surface of the driving backplate and is located on one side of the light-emitting mesa array. The first electrical connection part 131 is electrically connected to the driving back plate, and the light-emitting platform array is also electrically connected to the driving back plate. The first electrical connection part 131 and the light-emitting platform array are electrically connected through the driving back plate.

[0044] Referring to 3b, in some modified embodiments, the two parts (131a, 131b) of the first connecting portion 131 are respectively disposed on adjacent sides of the light-emitting area 12.

[0045] Referring to FIG3c, in some modified embodiments, the first connecting portion 131 surrounds the light-emitting area 12.

[0046] Referring to FIG3d, in some embodiments, the electrical connection portion 131 includes only a portion and is disposed on one side of the light-emitting region 12.

[0047] Referring to FIG4, the connection end 21 of the circuit board 20 has a second connection portion 211, which is adapted to be electrically connected to the first electrical connection portion 131 of the display chip 10. Specifically, the second electrical connection portion 211 also includes two parts (211a, 211b), and the positions of the two parts of the second electrical connection portion (211a, 211b) correspond to the positions of the two parts (131a, 131b) of the first electrical connection portion 131 shown in FIG3a. The two parts (211a, 211b) of the second electrical connection portion 211 are adapted to be electrically connected to the two parts (131a, 131b) of the first electrical connection portion 131. In some modified embodiments, the number and arrangement position of the second connection portions 211 of the circuit board 20 can correspond to the number and position of the first electrical connection portions 131 shown in FIG3b, FIG3c and FIG3d, which will not be described again here. When the first electrical connection portion 131 of the non-light-emitting area 13 of the display chip 10 includes at least two parts, the inclusion of at least two parts in the first electrical connection portion 131 can increase the number of electrical connection contacts included in the first electrical connection portion 131, which is beneficial to increasing data transmission efficiency. On the other hand, distributing the first electrical connection portion 131 on different sides of the light-emitting area 12 can further make reasonable use of space and contribute to the miniaturization of the packaging structure of the micro-display chip.

[0048] Referring to Figure 4, the circuit board 20 is ring-shaped, and the shape of the circuit board 20 corresponds to the ring structure of the non-light-emitting area 13. The ring-shaped circuit board 20 surrounds and forms a hollow area 22. The position of the hollow area 22 corresponds to the position of the light-emitting area 12 of the display chip 10, and the shape and size of the hollow area 22 are adapted to the shape and size of the light-emitting area 12 of the display chip 10. The light emitted by the light-emitting area 12 of the display chip 10 can pass through the hollow area and be emitted outward.

[0049] Referring to Figure 4, the width of the side of the circuit board 20 with the second electrical connection portion 211 is d1, and the width of the side of the circuit board 20 without the second electrical connection portion 211 is d2, where d1 is greater than or equal to d2. After the circuit board 20 is mounted on the light-emitting surface 11 of the display chip 10, the end of the circuit board 20 with the second electrical connection portion 211 extends to the outside of the display chip 10; the end of the circuit board 20 without the second electrical connection portion 211 is flush with or located inside the display chip 10. By reducing the width of the side of the circuit board 20 without the second electrical connection portion 211, the size of the packaging structure in that direction can be reduced, which helps to miniaturize the overall packaging structure. It is understood that since the side of the circuit board 20 without the second electrical connection portion 211 does not have the second electrical connection portion 211, reducing the width of the circuit board 20 on that side will not affect the function of the circuit board 20 and will help to reduce the overall size of the packaging structure.

[0050] Referring to Figure 5, the connection terminal 21 of the circuit board 20 is stacked on the non-light-emitting area 13 of the display chip 10, and the first electrical connection portion 131 and the second electrical connection portion 211 are electrically connected to each other. In the micro-display chip packaging structure provided in this application, the connection terminal 21 of the circuit board 20 is stacked on the non-light-emitting area 13 of the display chip 10, so that the first electrical connection portion 131 of the display chip 10 and the second electrical connection portion 211 of the circuit board 20 are electrically connected and contacted, making the micro-display chip packaging structure more compact and more conducive to the miniaturization of the micro-display chip packaging structure.

[0051] Referring to FIG. 5, in some embodiments, the display chip 10 further includes a solder block 132 disposed between the first electrical connection portion 131 and the second electrical connection portion 211, the solder block 132 being electrically connected to the first electrical connection portion 131 and the second electrical connection portion 211 respectively. In some modified embodiments, the display chip 10 further includes a first solder block disposed between the first electrical connection portion 131 and the second electrical connection portion 211, and being electrically connected to both the first electrical connection portion 131 and the second electrical connection portion 211 respectively. The circuit board 20 further includes a second solder block disposed between the second electrical connection portion 211, the first solder block and the second solder block being electrically connected. The first solder block and the second solder block are located between the first electrical connection portion 131 and the second electrical connection portion 211, and are electrically connected to both the first electrical connection portion 131 and the second electrical connection portion 211 respectively. Preferably, the first solder block and the second solder block are spherical in shape. In some embodiments, the first solder block and the second solder block may also be blocky in shape. As long as the first electrical connection portion 131 and the second electrical connection portion 211 can be electrically connected, the shapes of the first solder block and the second solder block should not constitute a limitation on this application.

[0052] Preferably, the material of the solder block is selected from one or more combinations of Sn and Au. It is understood that the material of the solder block 132 can also be other conductors, as long as the conduction between the first electrical connection 131 and the second electrical connection 211 can be achieved, and the type and shape of the material of the solder block 132 should not constitute a limitation on this application.

[0053] Referring to Figure 5, the packaging structure of the microdisplay chip further includes a sealant 30 located at the connection between the circuit board 20 and the display chip 10. The sealant 30 is disposed in the gap between the overlapping portion of the connection end 21 and the non-light-emitting area 13, and the sealant 30 includes the first solder block and the second solder block. Preferably, the sealant 30 also covers the portions of the first electrical connection portion 131 and the second electrical connection portion 211 that are not covered by the first solder block and the second solder block.

[0054] Preferably, the sealant is made of epoxy resin, thermosetting adhesive, UV adhesive, UV thermosetting adhesive, moisture-wicking adhesive, etc.

[0055] Referring to Figure 5, a first electrical connection portion 131, a second electrical connection portion 211, a first solder block, and a second solder block form an electrical connection structure 141. At least two rows of the electrical connection structure groups 14 are present between the circuit board 20 and the non-light-emitting area 13, and each row of the electrical connection structure group 14 includes a plurality of the electrical connection structures 141. In some embodiments, the connection end 21 of the circuit board 20 and the non-light-emitting area 13 may also have one row or three or more rows of the electrical connection structure groups 14; the specific number of rows of the electrical connection structure groups 14 should not constitute a limitation of this application.

[0056] Referring to Figures 5 and 6, preferably, the size of the heat sink 40 is larger than the size of the display chip 10, and the display chip 10 is preferably located in the middle of the heat sink 40. The microdisplay chip's packaging structure further includes a first packaging frame 51 located between the circuit board 20 and the display chip 10. The first packaging frame 51 provides support for the portion of the circuit board 20 extending beyond the display chip 10. The first packaging frame 51 surrounds the display chip 10 and also provides protection for the display chip 10 from the outside.

[0057] Referring to Figures 5 and 6, the packaging structure of the microdisplay chip further includes a second molding compound 52 disposed on the surface of the circuit board 20 away from the display chip 10. The second molding compound 52 surrounds the outside of the circuit board 20, providing protection to the circuit board 20 from the outside. Referring to Figures 5 and 6, the ends of the first molding compound 51 and the second molding compound 52 away from the light-emitting area 12 are flush with the ends of the circuit board 20 away from the light-emitting area 12. In some embodiments, the ends of the first molding compound 51 and the second molding compound 52 away from the display chip 10 both extend beyond the circuit board 20, and the first molding compound 51 and the second molding compound 52 are connected. That is, the first molding compound 51 and the second molding compound 52 surround the circuit board 20, providing better protection for the circuit board 20.

[0058] Preferably, the materials of the first molding frame 51 and the second molding frame 52 are both selected from epoxy resin, silicon dioxide, and aluminum oxide; the thickness of the first molding frame 51 ranges from 150 to 350 μm; and the thickness of the second molding frame ranges from 50 to 500 μm. Preferably, both the first injection molding frame 51 and the second injection molding frame 52 are formed by injection molding using a molding process.

[0059] Furthermore, the type of the circuit board 20 is FPC or RFPCB.

[0060] Referring to Figures 5 and 6, the end of the circuit board 20 furthest from the light-emitting area 12 extends to the outside of the display chip 10. In the embodiments shown in Figures 5 and 6, due to the large lateral dimension of the circuit board, a thinner circuit board 20 can be used, which helps to reduce the overall thickness of the microdisplay chip's packaging structure.

[0061] Referring to Figure 7, the end of the circuit board 20 furthest from the light-emitting area 12 is flush with the end of the display chip 10. In the embodiment shown in Figure 7, the lateral dimension of the circuit board 20 is reduced, which helps to reduce the lateral dimension of the packaging structure and facilitates the miniaturization of the overall packaging structure.

[0062] Referring to FIG8a, this application further provides a microdisplay chip packaging structure group, the packaging structure group including two or more packaging structures as described in the above embodiments arranged side by side, the circuit boards 20 of adjacent microdisplay chip packaging structures being integrally connected. In the microdisplay chip packaging structure group, two or more packaging structures as described in the above embodiments share the same external circuit board 23.

[0063] Referring to FIG8a, the microdisplay chip packaging structure group includes two packaging structures described in the above embodiments, and the two packaging structures are arranged side by side. Referring to FIG8b, the circuit board 20 between the two light-emitting areas 12 of the microdisplay chip packaging structure group is shared by two display chips 10.

[0064] Referring to Figure 9, the packaging structure group of the microdisplay chip includes three of the packaging structures described in the above embodiments. The three packaging structures are arranged side by side, and the lines connecting the centers of the light-emitting areas 12 of the three microdisplay chip packaging structures are on the same straight line.

[0065] Referring to FIG10, in some embodiments, the lines connecting the centers of the light-emitting regions 12 of the three packaging structures described in the above embodiments form a triangle. Preferably, in the embodiment shown in FIG10, the lines connecting the centers of the three light-emitting regions 12 described in the above embodiments form a right-angled triangle. In other embodiments, the lines connecting the centers of the three light-emitting regions 12 described in the above embodiments can also form an isosceles triangle. The specific positional arrangement of the packaging structures of the two or more microdisplay chips included in the microdisplay chip packaging structure group can be adjusted as needed, and the specific arrangement of the microdisplay chip packaging structures should not constitute a limitation of this application.

[0066] Furthermore, the three microdisplay chips 10 included in the microdisplay chip packaging structure group can emit red, green and blue light respectively, and the three colors of light can converge to form colored light.

[0067] Referring to Figures 11, 12, 13, and 14, the packaging structure group of the microdisplay chip further includes a first packaging structure group that further includes two or more lens groups 61. The two or more lens groups 61 are correspondingly disposed on the light emission path of the light emission area 12 of the packaging structure of the microdisplay chip. The lens group 61 can converge the light emitted by the corresponding light emission area 12 so that the light emitted by the light emission area 12 can be better displayed.

[0068] Referring to Figures 11 and 12, the packaging structure of the microdisplay chip further includes a lens mounting frame 62, which is mounted on the light-emitting surface 11 of the packaging structure of the microdisplay chip. The lens mounting frame 62 has two or more light-emitting holes 620 corresponding to two or more light-emitting areas 12, and two or more lens groups 61 are fixedly installed in the two or more light-emitting holes 620.

[0069] Referring to Figures 11 and 12, a portion of the circuit board 20 of the package structure of two or more microdisplay chips extends outward to form the external circuit board segment 23, which is adapted to be electrically connected to an external circuit. Further, the external circuit board segment 23 has a predetermined angle with the circuit board 20. Preferably, the angle between the external circuit board segment 23 and the circuit board 20 is 90°. In some embodiments, the external circuit board segment 23 is a flexible circuit board that can be adjusted to a suitable angle as needed.

[0070] Referring to Figure 15, this application further provides AR glasses, which include a frame 71 comprising a lens 711 and temples 712, the temples 712 being connected to the lens 711. The AR glasses also include an optical waveguide 72, which is fixedly mounted on the lens 711. The AR glasses further include a microdisplay chip packaging structure assembly as described in the above embodiments, the microdisplay chip packaging structure assembly being mounted at the connection between the lens 711 and the temples 712, the light-emitting surface 11 of the microdisplay chip packaging structure assembly facing the optical waveguide 72, and the external circuit board segment 23 of the packaging structure being disposed within the temples 712. During operation, the light emitted by the microdisplay chip packaging structure assembly after being powered on can enter the optical waveguide 72 and be displayed at a preset position on the optical waveguide 72.

[0071] Referring to Figure 16, in the AR glasses, the packaging structure group of the microdisplay chip corresponding to one of the optical waveguides 72 includes three microdisplay chips, and the line connecting the centers of the light-emitting areas of the three microdisplay chips forms a triangle. The specific positional arrangement of the packaging structures of two or more microdisplay chips included in the packaging structure group can be adjusted as needed, for example, the line connecting the centers of the light-emitting areas of the three microdisplay chips can be a straight line. The specific arrangement of the packaging structure of the microdisplay chips should not constitute a limitation of this application. Preferably, the packaging structure group of the microdisplay chips in the AR glasses includes three microdisplay chips that can emit three different colors: red, green, and blue. In some embodiments, the packaging structure group of the microdisplay chip corresponding to one of the optical waveguides 72 in the AR glasses may also include one microdisplay chip. The specific number of microdisplay chips should not constitute a limitation of this application.

[0072] Referring to Figure 17, the frame 711 has a first mounting groove 7110, and the temple 712 has a second mounting groove 7120. The main body of the microdisplay chip packaging structure assembly is disposed in the first mounting groove 7110, and the external circuit board segment 23 of the microdisplay chip packaging structure assembly is mounted in the second mounting groove 7120. The frame 711 has an opening corresponding to the position of the light-emitting area of ​​the display chip in the microdisplay chip packaging structure assembly, and the light emitted from the light-emitting area can be emitted outward through the opening.

[0073] It should be noted that the aforementioned microdisplay chip packaging structure has a very small volume, with length and width dimensions between 500 μm and 50,000 μm. The light-emitting area of ​​the aforementioned microdisplay chip packaging structure is very small, for example, 1 mm × 1 mm, 2.64 mm × 2.02 mm, 3 mm × 5 mm, etc. The light-emitting area of ​​the aforementioned microdisplay chip packaging structure includes multiple micro-LED pixels arranged in an array, with specific pixel arrangements such as 320 × 240, 640 × 480, 1600 × 1200, 1920 × 1080, and 2560 × 1440. The size of a single micro-LED pixel is between 100 nm and 100 micrometers. In some embodiments, the size of a single micro-LED pixel is between 150 nm and 15 micrometers. In some embodiments, the size of a single micro-LED pixel can be less than 10 micrometers.

[0074] A driving backplane is disposed on the back of the micro-LED pixel array. The driving backplane is electrically connected to the micro-LEDs in the micro-LED pixel array. The driving backplane can acquire signals such as image data from the outside world and can control the corresponding micro-LEDs to emit light or not emit light. The driving backplane is a TFT (Thin Film Transistor) board or an IC (Integrated Circuit) board. For example, the driving backplane of the above-mentioned micro-display chip packaging structure integrates a frame buffer, a column driving circuit, and a row driving circuit. The frame buffer includes a first pixel storage area, and the micro-LED pixel array includes a second pixel storage area. A complete frame of pixel grayscale data from the outside world can first enter the first pixel storage area of ​​the frame buffer. The column driving circuit can load the pixel grayscale data in the first pixel storage area of ​​the frame buffer into the second pixel storage area of ​​the micro-LED pixel array. The row driving circuit can scan the pixel grayscale data in the second pixel storage area and generate a pulse modulation signal to achieve the purpose of displaying different grayscale levels. When driving multiple micro-LED pixels in the micro-LED pixel array, either a single pixel can be driven independently, or multiple pixel units can be driven independently. The specific driving method should not constitute a limitation of this application.

[0075] It should be noted that relational terms in this document, such as “first” and “second”, are used only to distinguish an entity or operation from another entity or operation, without requiring or implying any actual relationship or order between these entities or operations. Furthermore, the words “including,” “having,” and “containing,” as well as other similar forms, are intended to be equivalent in meaning and are open-ended; one or more items following any of these words do not imply an exhaustive list of such items or that the list is limited to only one or more items.

[0076] As used herein, unless expressly stated otherwise, the term "or" covers all possible combinations unless impractical. For example, if a component is stated to include A or B, then unless expressly stated otherwise or impractical, the component may include A, or B, or A and B. As a second example, if a component is stated to include A, B, or C, then unless expressly stated otherwise or impractical, the component may include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C.

[0077] In the foregoing description, numerous specific details have been described, which may vary depending on the implementation. Certain modifications and alterations may be made to the described embodiments. Other embodiments will be apparent to those skilled in the art in light of the specification and practice of this application disclosed herein. The specification and examples are intended to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims. The sequence of steps shown in the accompanying drawings is also intended for illustrative purposes only and is not intended to limit one to any particular order of steps. Therefore, those skilled in the art will understand that these steps may be performed in different orders while achieving the same method.

[0078] Exemplary embodiments have been disclosed in the accompanying drawings and description. However, many variations and modifications can be made to these embodiments. Therefore, although specific terminology has been used, it is used in a general and descriptive sense only and not for limiting purposes.

Claims

1. A packaging structure for a microdisplay chip, characterized in that, include: The display chip has a light-emitting surface having a light-emitting area and a non-light-emitting area, and the non-light-emitting area is provided with a first electrical connection portion; A circuit board, wherein the connection end of the circuit board has a second electrical connection portion; At least a portion of the connection terminals of the circuit board are stacked with at least a portion of the non-light-emitting area of ​​the display chip, and the first electrical connection portion and the second electrical connection portion are correspondingly electrically connected.

2. The packaging structure of the microdisplay chip according to claim 1, characterized in that, The first electrical connection portion of the non-light-emitting area of ​​the display chip includes at least two parts, and the at least two parts of the first electrical connection portion are respectively disposed on at least two different sides of the light-emitting area; The second connection portion of the connection end of the circuit board includes at least two parts, and is electrically connected to at least two corresponding parts of the first electrical connection portion.

3. The packaging structure of the microdisplay chip according to claim 2, characterized in that, The non-light-emitting area of ​​the display chip surrounds the light-emitting area; the circuit board is a ring-shaped structure corresponding to the non-light-emitting area, and the hollow area formed by the ring-shaped circuit board corresponds to the light-emitting area.

4. The packaging structure of the microdisplay chip according to claim 3, characterized in that, The end of the circuit board furthest from the light-emitting area is flush with the end of the display chip.

5. The packaging structure of the microdisplay chip according to claim 3, characterized in that, The end of the circuit board furthest from the light-emitting area extends to the outside of the display chip.

6. The packaging structure of the microdisplay chip according to claim 3, characterized in that, The width of the side of the circuit board where the second electrical connection portion is provided is greater than or equal to the width of the side of the circuit board where the second electrical connection portion is not provided.

7. The packaging structure of the microdisplay chip according to claim 6, characterized in that, The end of the circuit board with the second electrical connection portion extending away from the light-emitting area extends to the outside of the display chip, while the end of the circuit board without the second electrical connection portion extending away from the light-emitting area is flush with the end of the display chip.

8. The packaging structure of the microdisplay chip according to claim 1, characterized in that, The display chip further includes a first solder block disposed on the first electrical connection portion, the first solder block being located between the first electrical connection portion and the second electrical connection portion, and being electrically connected to the first electrical connection portion and the second electrical connection portion respectively.

9. The packaging structure of the microdisplay chip according to claim 8, characterized in that, The circuit board further includes a second solder block disposed on the second electrical connection portion. The first solder block and the second solder block are electrically connected and located between the first electrical connection portion and the second electrical connection portion, and are electrically connected to the first electrical connection portion and the second electrical connection portion respectively.

10. The packaging structure of the microdisplay chip according to claim 9, characterized in that, A first electrical connection portion, a second electrical connection portion, a first solder block, and a second solder block form an electrical connection structure. There are at least two rows of the electrical connection structure groups between the circuit board and the non-light-emitting area, and each row of the electrical connection structure groups includes a plurality of the electrical connection structures.

11. The packaging structure of the microdisplay chip according to claim 10, characterized in that, A sealant is provided in the gap between the connection end of the circuit board and the portion overlapping the non-light-emitting area, and the sealant wraps around the first solder block and the second solder block.

12. The packaging structure of the microdisplay chip according to claim 11, characterized in that, The sealant material is selected from epoxy resin, thermosetting adhesive, UV adhesive, UV thermosetting adhesive, and moisture adhesive.

13. The packaging structure of the microdisplay chip according to any one of claims 1-12, characterized in that, The packaging structure of the microdisplay chip further includes a heat sink disposed on the back of the display chip.

14. The packaging structure of the microdisplay chip according to claim 13, characterized in that, The heat sink is made of graphite sheets and has a thickness ranging from 10 to 100 μm.

15. The packaging structure of the microdisplay chip according to claim 13, characterized in that, The size of the heat sink is larger than the size of the display chip; a first encapsulation frame is provided between the circuit board and the heat sink.

16. The packaging structure of the microdisplay chip according to claim 15, characterized in that, The packaging structure of the microdisplay chip further includes a second plastic encapsulation frame disposed on the surface of the circuit board away from the display chip.

17. The packaging structure of the microdisplay chip according to claim 16, characterized in that, The ends of the first and second molding frames away from the light-emitting area are flush with the ends of the circuit board away from the light-emitting area.

18. The packaging structure of the microdisplay chip according to claim 16, characterized in that, The ends of both the first and second molding frames that are furthest from the display chip extend out of the circuit board, and the first and second molding frames are connected to each other.

19. The packaging structure of the microdisplay chip according to claim 16, characterized in that, The materials of the first and second molding frames are selected from epoxy resin, silicon dioxide, and aluminum oxide; the thickness of the first molding frame ranges from 150 to 350 μm, and the thickness of the second molding frame ranges from 50 to 500 μm.

20. The packaging structure of the microdisplay chip according to claim 13, characterized in that, The circuit board is an FPC or an RFPCB.

21. A packaging structure assembly for a microdisplay chip, characterized in that, include: A packaging structure comprising two or more microdisplay chips as described in any one of claims 1-20 arranged side by side, wherein the circuit boards of adjacent packaging structures of the microdisplay chips are integrally connected to each other.

22. The packaging structure assembly for the microdisplay chip according to claim 21, characterized in that, The microdisplay chip packaging structure assembly includes three microdisplay chip packaging structures, wherein the three microdisplay chip packaging structures are respectively capable of emitting red light, green light, and blue light.

23. The packaging structure assembly for the microdisplay chip according to claim 22, characterized in that, The lines connecting the centers of the light-emitting areas of the three microdisplay chip packaging structures form a triangle; or, the lines connecting the centers of the light-emitting areas of the three microdisplay chip packaging structures lie on the same straight line.

24. The packaging structure assembly for the microdisplay chip according to claim 21, characterized in that, The packaging structure of the microdisplay chip further includes two or more lens groups, which are respectively disposed on the light emission path of the light emission area of ​​the packaging structure of the microdisplay chip.

25. The packaging structure assembly for the microdisplay chip as described in claim 24, characterized in that, The packaging structure of the microdisplay chip further includes a lens mounting frame, which is mounted on the light-emitting surface of the packaging structure of the microdisplay chip. The lens mounting frame has two or more light-emitting holes at positions corresponding to two or more light-emitting areas, and two or more lens groups are correspondingly mounted in two or more light-emitting holes.

26. The packaging structure assembly for the microdisplay chip according to claim 21, characterized in that, A portion of the circuit board of the package structure of two or more of the microdisplay chips extends outward to form an external circuit board segment, which is adapted to be electrically connected to an external circuit.

27. The packaging structure assembly for the microdisplay chip according to claim 26, characterized in that, The external circuit board segment and the circuit board have a preset angle.

28. An AR glasses, characterized in that, include: Eyeglass frames, including the frame and temples; Optical waveguide sheet, mounted on the lens frame; The microdisplay chip packaging structure assembly according to any one of claims 21 to 27, wherein the packaging structure assembly is installed at the connection between the lens frame and the temple, the light-emitting surface of the packaging structure assembly faces the optical waveguide sheet, and the external circuit board segment of the packaging structure is disposed inside the temple.

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