Thermal management system, heating and cooling box device, and vehicle

Abstract

A thermal management system, a heating and cooling box device, and a vehicle. The thermal management system is applied to a heating and cooling box (100), and the heating and cooling box (100) comprises a box body (1) and a semiconductor sheet (2) provided in the box body (1). The thermal management system comprises a heat exchanger assembly (3), wherein the heat exchanger assembly (3) is arranged on one side of the semiconductor sheet (2) and is located outside the box body (1); and the heat exchanger assembly (3) comprises a heat exchanger (31) and a throttling member (32) which are integrally assembled, the heat exchanger (31) and the throttling member (32) are located on the same side of the semiconductor sheet (2), and the heat exchanger (31) is attached to the semiconductor sheet (2). By means of the semiconductor sheet arranged in the box body and the attachment of the heat exchanger to the semiconductor sheet, the characteristic of high heat exchange efficiency of the semiconductor sheet is utilized, and by reducing the volume of the entire thermal management system, a heat exchange path is further shortened, thereby improving the heat exchange effect of the thermal management system.

Description

Thermal management system, heating and cooling box unit and vehicle Cross-references to related applications

[0001] This application claims priority to Chinese Patent Application No. 2024225282222, filed on October 18, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to, but is not limited to, the field of thermal management, and particularly to a thermal management system, a heating / cooling box device, and a vehicle. Background Technology

[0003] Thermal management technology plays a crucial role in the automotive industry for temperature regulation and control, ensuring the safe operation of vehicles. The vehicle's insulator / heatbox, as a device that requires temperature regulation, also necessitates the use of vehicle thermal management technology. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0005] This application provides a thermal management system, a heating / cooling box device, and a vehicle that are small in size, simple in structure, easy to install, and have good heat exchange effect.

[0006] This application provides a thermal management system for use in a heating and cooling box. The heating and cooling box includes a box body and a semiconductor chip disposed on the box body. The thermal management system includes a heat exchanger assembly disposed on one side of the semiconductor chip and located outside the box body. The heat exchanger assembly includes an integrally assembled heat exchanger and a throttling device. The heat exchanger and the throttling device are located on the same side of the semiconductor chip, and the heat exchanger is in contact with the semiconductor chip.

[0007] Optionally, the thermal management system includes at least one heat dissipation component, which is located on the side of the heat exchanger away from the semiconductor wafer; and / or the heat dissipation component is located on the side of the semiconductor wafer away from the heat exchanger and within the housing.

[0008] Optionally, the heat dissipation assembly includes a heat sink and at least one fan disposed around the periphery of the heat sink.

[0009] Optionally, the number of fans is set to multiple, and the multiple fans are located on the same side of the heat sink.

[0010] Optionally, the heat sink includes multiple heat dissipation vents, and the fan is located at the heat dissipation vents.

[0011] Optionally, the heat sink is integrally formed with the heat exchanger; and / or integrally assembled.

[0012] Optionally, the thermal management system includes a controller electrically connected to the throttling device and the heat dissipation assembly; the heating / cooling box includes a first operating condition and a second operating condition; wherein, when the heating / cooling box is in the first operating condition, the controller controls the throttling device to open and controls the heat dissipation assembly to close; when the heating / cooling box is in the second operating condition, the controller controls the heat dissipation assembly to open and controls the throttling device to close; wherein the load of the first operating condition is greater than the load of the second operating condition.

[0013] Optionally, the heating / cooling box includes a plurality of semiconductor chips, which are disposed on the periphery of the box body; the thermal management system includes a plurality of heat exchanger assemblies, which are correspondingly arranged with respect to the plurality of semiconductor chips.

[0014] Optionally, the heat exchanger is provided with a flow pipeline, and the throttling element includes an inlet and an outlet, the inlet and the outlet being connected to the flow pipeline and located on the same side of the flow pipeline.

[0015] Optionally, the throttling element includes an electronic expansion valve.

[0016] Optionally, the semiconductor chip is disposed between the inner wall and the outer wall of the housing.

[0017] Optionally, the semiconductor chip is disposed on the outer or inner wall of the housing.

[0018] Optionally, the semiconductor chip is a thermoelectric cooler.

[0019] Optionally, the semiconductor chip is a Peltier element.

[0020] This application also provides a heating / cooling box device, comprising: a heating / cooling box, including a box body and a semiconductor chip disposed on the box body; and the aforementioned thermal management system.

[0021] This application also provides a vehicle, including: the aforementioned heated / cooled box device.

[0022] The thermal management system, heating / cooling box device, and vehicle provided in this application simplify the structure of the heat exchanger assembly by using an integrated heat exchanger and throttling device, making it easy to assemble and reducing the overall volume of the thermal management system, resulting in a compact structure. By using a semiconductor plate located in the box body, with the heat exchanger and semiconductor plate in close contact, the high heat exchange efficiency of the semiconductor plate is utilized. Furthermore, by reducing the overall volume of the thermal management system, the heat exchange path is shortened, thereby improving the heat exchange effect of the thermal management system.

[0023] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects can be understood. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0025] Figure 1 is a schematic diagram of an embodiment of the thermal management system of this application.

[0026] Figure 2 shows a schematic diagram of another embodiment of the thermal management system of this application.

[0027] Figure 3 shows a schematic diagram of another embodiment of the thermal management system of this application.

[0028] Figure 4 shows a schematic diagram of another embodiment of the thermal management system of this application.

[0029] Figure 5 shows a schematic diagram of an embodiment of the heat exchanger assembly and heat dissipation assembly of the thermal management system of this application.

[0030] Figure 6 shows a schematic diagram of another embodiment of the heat exchanger assembly and heat dissipation assembly of the thermal management system of this application.

[0031] Figure 7 is a schematic diagram of another embodiment of the heat exchanger assembly and heat dissipation assembly of the thermal management system of this application.

[0032] Figure 8 is a schematic diagram of an embodiment of the heat exchanger of the thermal management system of this application.

[0033] Figure 9 shows a schematic block diagram of the controller of the thermal management system of this application.

[0034] Explanation of reference numerals in the attached drawings: 10; 100; 200; 300; 1; 2; 2; 21; 22; 3; 3; 31; 311; 32; 321; 322; 4; 41; 411; 412; 42; 42. Detailed Implementation

[0035] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0036] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0037] In related technologies, heating and cooling boxes exchange heat through a thermal management system. However, the thermal management system is large in size and has complex piping, resulting in a large footprint, complicated structure, difficulty in installation, and low heat exchange efficiency.

[0038] This application provides a thermal management system, a heating / cooling box device, and a vehicle. The thermal management system is applied to a heating / cooling box, which includes a box body and a semiconductor plate disposed on the box body. The thermal management system includes a heat exchanger assembly disposed on one side of the semiconductor plate and located outside the box body. The heat exchanger assembly includes an integrally assembled heat exchanger and a throttling device, located on the same side of the semiconductor plate, with the heat exchanger in close contact with the semiconductor plate. This configuration, through the integrally assembled heat exchanger and throttling device, simplifies the structure of the heat exchanger assembly, facilitates assembly, and reduces the overall volume of the thermal management system, resulting in a compact structure. The high heat exchange efficiency of the semiconductor plate is utilized by the heat exchanger being in close contact with it, and the heat exchange path is further shortened by reducing the overall volume of the thermal management system, thereby improving the heat exchange effect of the thermal management system.

[0039] This application provides a thermal management system, a heating / cooling box device, and a vehicle. The thermal management system, heating / cooling box device, and vehicle of this application will be described in detail below with reference to the accompanying drawings.

[0040] Figure 1 shows a schematic diagram of an embodiment of the thermal management system 200 of this application. In the embodiment shown in Figure 1, the vehicle includes a refrigerator / heater unit 10. The refrigerator / heater unit 10 includes a refrigerator / heater unit 100 and a thermal management system 200. The thermal management system 200 is used to regulate the temperature of the refrigerator / heater unit 100 and exchange heat with the refrigerator / heater unit 100. The refrigerator / heater unit 100 can be an in-vehicle refrigerator / heater unit. The refrigerator / heater unit 100 includes a housing 1 and a semiconductor chip 2 disposed on the housing 1. In this embodiment, the semiconductor chip 2 is disposed between the inner wall and the outer wall of the housing 1. In some other embodiments, the semiconductor chip 2 can also be disposed on the outer wall or the inner wall of the housing 1, and is not limited thereto. In this embodiment, the semiconductor chip 2 can be a thermoelectric cooler, which can be a semiconductor material, such as a Peltier element, utilizing the thermoelectric effect generated when current passes through the semiconductor material to form a temperature difference. The semiconductor chip 2 is smaller in size and has lower noise, making it convenient for in-vehicle use. When current flows into the semiconductor chip 2, one side of the semiconductor chip 2 becomes the heat-absorbing surface 21, and the other side becomes the heat-dissipating surface 22. The temperature of the heat-absorbing surface 21 of the semiconductor chip 2 can be adjusted by controlling the magnitude of the current through the power supply. In this embodiment, the side of the semiconductor chip 2 near the inner wall of the housing 1 is the heat-absorbing surface 21, and the side near the outer wall of the housing 1 is the heat-dissipating surface 22. In other embodiments, the cooling / heating box 100 can be switched from cooling mode to heating mode by switching the positive and negative terminals of the semiconductor chip 2. In this case, the side of the semiconductor chip 2 near the inner wall of the housing 1 becomes the heat-dissipating surface 22, and the side near the outer wall of the housing 1 becomes the heat-absorbing surface 21. This configuration allows for easy switching between cooling and heating modes of the cooling / heating box 100. The heat exchanger assembly 3 of the thermal management system 200 is located on one side of the semiconductor chip 2 and outside the housing 1. The heat exchanger assembly 3 is used to exchange heat with the cooling / heating box 100 through a fluid medium, such as a refrigerant. This configuration makes it easy to assemble the heat exchanger assembly 3 with other components. In some embodiments, the thermal management system 200 further includes a compressor, other heat exchangers, and other structures connected sequentially to the heat exchanger assembly 3, thereby allowing a fluid medium to circulate and exchange heat therein. In some embodiments, the compressor and other heat exchangers may be a vehicle-mounted compressor and vehicle-mounted heat exchangers.

[0041] In the embodiment shown in Figure 1, the thermal management system 200 is applied to the warm / cold box 100. The warm / cold box 100 switches between cooling and heating modes to meet low-temperature or high-temperature storage needs. The thermal management system 200 includes a heat exchanger assembly 3, which is located on one side of the semiconductor chip 2 and outside the box body 1. The heat exchanger assembly 3 includes an integrally assembled heat exchanger 31 and a throttling element 32. In this embodiment, the integrally assembled heat exchanger 31 and throttling element 32 can be integrated into a single unit, or they can be disassembled. In this embodiment, the heat exchanger 31 can be an evaporator, such as a microchannel evaporator. In this embodiment, the throttling element 32 includes an electronic expansion valve. Electronic expansion valves are easy to control, easy to adjust, and low in cost. The heat exchanger 31 and the throttling element 32 are located on the same side of the semiconductor chip 2, and the heat exchanger 31 is in contact with the semiconductor chip 2. This configuration, through the integrated heat exchanger 31 and throttling element 32, simplifies the structure of the heat exchanger assembly 3, facilitates assembly, and reduces the overall volume of the thermal management system 200, resulting in a compact structure. By using the semiconductor chip 2 located in the housing 1, and with the heat exchanger 31 in close contact with the semiconductor chip 2, the high heat exchange efficiency of the semiconductor chip 2 is utilized. Furthermore, by reducing the overall volume of the thermal management system 200, the heat exchange path is shortened, thereby improving the heat exchange effect of the thermal management system 200.

[0042] Figure 2 shows a schematic diagram of another embodiment of the thermal management system 200 of this application. In the embodiment shown in Figure 2, the thermal management system 200 includes at least one heat dissipation component 4. The heat dissipation component 4 is used to disperse heat. In this embodiment, there is one heat dissipation component 4. In some other embodiments, there may be two, three, etc., heat dissipation components 4, and the number is not limited thereto. The heat dissipation component 4 is located on the side of the heat exchanger 31 away from the semiconductor plate 2. In this embodiment, the heat dissipation component 4 is located on the outside of the heating / cooling box 100, and the heat dissipation component 4 is used to disperse the heat on the outside of the heating / cooling box 100. This arrangement can improve the heat exchange efficiency on the outside of the heating / cooling box 100 and enrich the heat dissipation methods of the thermal management system 200.

[0043] Figure 3 shows a schematic diagram of another embodiment of the thermal management system 200 of this application. In the embodiment shown in Figure 3, the heat dissipation component 4 is disposed on the side of the semiconductor plate 2 away from the heat exchanger 31 and located inside the housing 1. In this embodiment, the heat dissipation component 4 is disposed on the inner wall of the housing 1 and close to the semiconductor plate 2. The heat dissipation component 4 is located inside the heating / cooling box 100 and is used to disperse the heat inside the heating / cooling box 100. This arrangement can improve the heat exchange efficiency inside the heating / cooling box 100 and enrich the heat dissipation methods of the thermal management system 200.

[0044] Figure 4 shows a schematic diagram of another embodiment of the thermal management system 200 of this application. In the embodiment shown in Figure 4, the heat dissipation component 4 is disposed on the side of the heat exchanger 31 away from the semiconductor chip 2, and the heat dissipation component 4 is disposed on the side of the semiconductor chip 2 away from the heat exchanger 31 and located inside the housing 1. In this embodiment, two heat dissipation components 4 are configured. The heat dissipation component 4 located on the outside of the heating / cooling box 100 is used to disperse the heat on the outside of the heating / cooling box 100, and the heat dissipation component 4 located on the inside of the heating / cooling box 100 is used to disperse the heat on the inside of the heating / cooling box 100. This configuration can improve the heat exchange efficiency on the inside and outside of the heating / cooling box 100 and enrich the heat dissipation methods of the thermal management system 200. In some embodiments, the heating / cooling box 100 includes a plurality of semiconductor chips 2, which are disposed on the periphery of the housing 1. In this embodiment, one semiconductor chip 2 is configured, but it can also be configured as two, three, four, or other quantities, and is not limited thereto. The thermal management system 200 includes a plurality of heat exchanger components 3, which are correspondingly configured with the plurality of semiconductor chips 2. In this embodiment, one heat exchanger assembly 3 is used. In some other embodiments, when the number of semiconductor wafers 2 is two, the number of heat exchanger assemblies 3 is also two. The number of heat exchanger assemblies 3 corresponds to the number of semiconductor wafers 2. This arrangement allows for the addition or reduction of the corresponding heat exchanger assemblies 3 and semiconductor wafers 2 according to the heat exchange requirements of different heating / cooling boxes 100, thereby meeting the heat exchange requirements while reducing energy consumption.

[0045] Figure 5 shows a schematic diagram of one embodiment of the heat exchanger assembly 3 and heat dissipation assembly 4 of the thermal management system 200 of this application. In the embodiment shown in Figure 5, the heat dissipation assembly 4 includes a heat sink 41 and at least one fan 42 disposed around the periphery of the heat sink 41. The heat sink 41 is used for heat dissipation, and the fan 42 is used to accelerate the heat exchange rate. This arrangement improves heat exchange efficiency, and the fan 42 facilitates heat exchange control. In this embodiment, the heat sink 41 and the heat exchanger 31 are integrally formed. This arrangement makes the structure more stable and the heat dissipation effect better. In some other embodiments, the heat sink 41 and the heat exchanger 31 are integrally assembled. This arrangement facilitates the disassembly and assembly of the heat sink 41 and the heat exchanger 31, making operation convenient.

[0046] Figure 6 shows a schematic diagram of another embodiment of the heat exchanger assembly 3 and heat dissipation assembly 4 of the thermal management system 200 of this application. In the embodiment shown in Figure 6, the heat sink 41 includes a plurality of heat dissipation ports 412. A fan 42 is located at the heat dissipation port 412. In this embodiment, the heat sink 41 includes a plurality of spaced blades 411 arranged sequentially from top to bottom, the heat dissipation ports 412 are located between the plurality of spaced blades 411, and the fan 42 is located at the heat dissipation port 412 and is disposed on the periphery of the heat dissipation assembly 4. This arrangement ensures that the fan 42 can accelerate the heat exchange speed to the maximum extent and improve the heat exchange efficiency. In some embodiments, the number of fans 42 is set to multiple. In this embodiment, there are two fans 42. In some other embodiments, the number of fans 42 can also be one, three, four, etc., and the number is not limited to these. Multiple fans 42 are located on the same side of the heat sink 41. This arrangement ensures that the heat of the heat sink 41 can be evenly dissipated, and the heat is dissipated towards the same side of the heat sink 41, which facilitates heat management.

[0047] Figure 7 shows a schematic diagram of another embodiment of the heat exchanger assembly 3 and the heat dissipation assembly 4 of the thermal management system 200 of this application. Figure 8 shows a schematic diagram of an embodiment of the heat exchanger 31 of the thermal management system 200 of this application. In the embodiments shown in Figures 7 and 8, the heat exchanger 31 is provided with a flow pipe 311. The flow pipe 311 is used for the flow of fluid medium. The throttling element 32 includes an inlet 321 and an outlet 322, which are respectively connected to the flow pipe 311 and located on the same side of the flow pipe 311. This arrangement facilitates the assembly and disassembly of other pipes of the throttling element 32, making operation more convenient. In this embodiment, the fluid medium enters the flow pipe 311 through the inlet 321 of the throttling element 32, and then passes through the outlet 322 of the throttling element 32. In this embodiment, the fluid medium flows through the flow pipe 311 in the direction shown by the arrow in the figure. In some embodiments, the flow pipe 311 can be a U-shaped pipe, a Z-shaped pipe, or other types of pipes, and is not limited thereto. This configuration lengthens the path of the fluid medium within the flow pipe 311, ensuring that the fluid medium contacts the heat exchanger 31 as much as possible, thus improving heat exchange efficiency. In this embodiment, the flow pipe 311 is laid flat on the inner surface of the heat exchanger 31, covering as much of the inner surface as possible. This configuration ensures that the fluid medium passes through the flow pipe 311 as much as possible, resulting in more uniform heat exchange.

[0048] Figure 9 shows a schematic block diagram of the controller 300 of the thermal management system 200 of this application. In the embodiment shown in Figure 9, the thermal management system 200 includes a controller 300. The controller 300 may be a system controller 300. The controller 300 is electrically connected to the throttling element 32 and the heat dissipation assembly 4. The controller 300 is used to control the operating states of the throttling element 32 and the heat dissipation assembly 4. The cooler / warmer 100 includes a first operating condition and a second operating condition. The first operating condition is a high-load state, which refers to the operating state of the cooler / warmer 100 in a higher temperature environment or when storing a large amount of food, requiring high energy consumption; the second operating condition is a low-load state, which refers to the operating state of the cooler / warmer 100 in a lower temperature environment or when storing less food, requiring lower energy consumption than the first operating condition. When the cooler / warmer 100 is in the first operating condition, the controller 300 controls the throttling element 32 to open and controls the heat dissipation assembly 4 to close. In this embodiment, when the heating / cooling box 100 is in cooling mode and operating under the first condition, the semiconductor chip 2 cools, and the fluid medium, after passing through components such as the compressor, enters the inlet 321 of the throttling device 32. Through the flow pipe 311 and outlet 322 of the throttling device 32, heat is transferred from the heat-absorbing surface 21 of the semiconductor chip 2 to the heat-dissipating surface 22. The heat is then exchanged with the heat exchanger 31 via the heat-dissipating surface 22 of the semiconductor chip 2, thereby transferring heat to the fluid medium. The fluid medium then enters other heat exchange components in the thermal management system for further heat exchange. During this time, the heat dissipation assembly 4 is not operating. With this configuration, when the heating / cooling box 100 has high energy consumption, the throttling device 32 needs to be opened to accelerate heat exchange efficiency. When the heating / cooling box 100 is operating under the second condition, the controller 300 controls the heat dissipation assembly 4 to open and controls the throttling device 32 to close. The load in the first operating condition is greater than the load in the second operating condition. In this embodiment, when the heat exchanger 100 is in cooling mode and operating under the second condition, the semiconductor chip 2 cools down, and heat is transferred to the heat dissipation component 4 via the semiconductor chip 2. The fan 42 then dissipates heat from the semiconductor chip 2, and the throttling device 32 is closed. This configuration ensures that when the heat exchanger 100 has low energy consumption, the heat dissipation component 4 needs to be turned on, thus maintaining efficient heat exchange under low energy consumption. By switching the operating states of the throttling device 32 and the heat dissipation component 4, heat exchange requirements for different operating conditions of the heat exchanger 100 can be met, satisfying heat exchange needs while avoiding excessive energy consumption.

[0049] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A thermal management system (200) applied to a cold and warm box (100), the cold and warm box (100) comprising a box body (1) and a semiconductor sheet (2) arranged on the box body; the thermal management system (200) comprising a heat exchanger assembly (3), the heat exchanger assembly (3) being arranged on one side of the semiconductor sheet (2) and located outside the box body (1); wherein, The heat exchanger assembly (3) includes an integrally assembled heat exchanger (31) and a throttling device (32), the heat exchanger (31) and the throttling device (32) being located on the same side of the semiconductor wafer (2), and the heat exchanger (31) being attached to the semiconductor wafer (2).

2. The thermal management system according to claim 1, characterized in that, The thermal management system includes at least one heat dissipation component (4), which is located on the side of the heat exchanger (31) away from the semiconductor chip (2); and / or, the heat dissipation component (4) is located on the side of the semiconductor chip (2) away from the heat exchanger (31) and is located inside the housing (1).

3. The thermal management system according to claim 2, characterized in that, The heat dissipation assembly (4) includes a heat sink (41) and at least one fan (42) disposed on the periphery of the heat sink (41).

4. The thermal management system according to claim 3, characterized in that, The number of fans (42) is set to multiple, and the multiple fans (42) are located on the same side of the heat sink; and / or The heat sink (41) includes multiple heat dissipation ports (412), and the fan (42) is located at the heat dissipation ports (412).

5. The thermal management system according to claim 3 or 4, characterized in that, The heat sink (41) is integrally formed with the heat exchanger (31); and / or integrally assembled.

6. The thermal management system according to any one of claims 2 to 5, characterized in that, The thermal management system (200) includes a controller (300), which is electrically connected to the throttling device (32) and the heat dissipation assembly (4); the heating and cooling box (100) includes a first operating condition and a second operating condition; wherein, when the heating and cooling box (100) is in the first operating condition, the controller (300) controls the throttling device (32) to open and controls the heat dissipation assembly (4) to close; when the heating and cooling box (100) is in the second operating condition, the controller (300) controls the heat dissipation assembly (4) to open and controls the throttling device (32) to close; wherein the load of the first operating condition is greater than the load of the second operating condition.

7. The thermal management system according to any one of claims 1 to 6, characterized in that, The heating / cooling box (100) includes a plurality of semiconductor chips (2), which are disposed on the periphery of the box body (1); the thermal management system (200) includes a plurality of heat exchanger assemblies (3), which are correspondingly arranged with the plurality of semiconductor chips (2).

8. The thermal management system according to any one of claims 1 to 7, characterized in that, The heat exchanger (31) is provided with a flow pipe (311), and the throttling element (32) includes an inlet (321) and an outlet (322). The inlet (321) and the outlet (322) are respectively connected to the flow pipe (311) and are located on the same side of the flow pipe (311).

9. The thermal management system according to any one of claims 1 to 8, characterized in that, The throttling device (32) includes an electronic expansion valve.

10. The thermal management system according to any one of claims 1 to 9, characterized in that, The semiconductor chip (2) is disposed between the inner wall and the outer wall of the housing (1).

11. The thermal management system according to any one of claims 1 to 9, characterized in that, The semiconductor chip (2) is disposed on the outer or inner wall of the housing (1).

12. The thermal management system according to any one of claims 1 to 11, characterized in that, The semiconductor chip (2) is a thermoelectric cooler.

13. The thermal management system according to claim 12, characterized in that, The semiconductor chip (2) is a Peltier element.

14. A warm / cold box device (10), comprising: A hot / cold box (100) includes a box body (1) and a semiconductor chip (2) disposed on the box body; and The thermal management system (200) as described in any one of claims 1 to 8.

15. A vehicle comprising: The heating / cooling box device (10) as described in claim 14.

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