Portable electronic device comprising socket structure

Abstract

Disclosed are a portable electronic device and a modified example thereof, the device comprising: a socket structure (110_sk); a first housing (110) in which a connector port (107) related to the socket structure is formed, and which has at least a portion to be used as an antenna; a first circuit board (110_pb2) disposed at a first position of the first housing; a flexible board (110_fb) connected to the first circuit board and the socket structure; and a support substrate (110_sco) for supporting the socket structure while supporting the first circuit board, wherein the support substrate includes: a first support portion (110_sco1) disposed to overlap the first circuit board in a first direction and formed of a metal material; and a second support portion (110_sco2) which is coupled to the first support portion, has at least a portion overlapping the socket structure in the first direction, and is formed of a non-conductive material.

Description

Portable electronic device including a socket structure

[0001] Various embodiments of this document relate to a portable electronic device that supports a connection function with an external electronic device through a socket structure.

[0002] Portable electronic devices, such as smartphones, can support calling, content search, and content output functions based on various types of applications. In the process of providing these various functions, portable electronic devices can output screens corresponding to each function. Users may desire to use a larger screen when utilizing the various functions mentioned above. In general portable electronic devices, if the display device is to be expanded for screen display, the overall size of the electronic device must increase, which may result in reduced portability. Accordingly, foldable electronic devices are provided that allow the display to be folded in order to increase the screen size while maintaining portability. Foldable electronic devices can have folded and unfolded states. Foldable electronic devices may include a plurality of housings to support each area of ​​the display in the unfolded state, and a hinge structure connecting the plurality of housings to each other. Various advancements are being applied to such foldable electronic devices to reduce weight or slim the design, similar to bar-type portable electronic devices.

[0003] A portable electronic device (or foldable electronic device, portable electronic device, foldable electronic device, or foldable electronic device having a communication function) according to one embodiment of the present invention comprises a socket structure (110_sk), a first housing (110) configured such that a connector port (107) associated with the socket structure is formed and at least a portion thereof is used as an antenna, a first circuit board (110_pb2) disposed at a first position of the first housing, a flexible substrate (110_fb) connected to the first circuit board and the socket structure, and a support substrate (110_sco) that supports the socket structure while supporting the first circuit board, wherein the support substrate may include a first support portion (110_sco1) formed of a metal material and disposed to overlap the first circuit board with respect to a first direction, and a second support portion (110_sco2) formed of a non-conductive material that is coupled to the first support portion and overlaps at least a portion thereof with the socket structure with respect to the first direction.

[0004] A portable electronic device according to one embodiment of the present invention comprises a socket structure (110_sk_ch), a first housing (110) configured such that a connector port (107) associated with the socket structure is formed and at least a portion thereof is used as an antenna, a first circuit board (110_pb2_ch) disposed at a first position of the first housing and having the socket structure mounted (or fixed), a flexible board (110_fb_ch) connected to the first circuit board, and a support board (110_sco_ch) that supports the socket structure while supporting the first circuit board, wherein the support board may include a first support portion (110_sco1_ch) formed of a metal material and disposed to overlap the first circuit board with respect to a first direction, and a second support portion (110_sco2_ch) formed of a non-conductive material that is coupled to the first support portion and overlaps at least a portion thereof with the socket structure with respect to the first direction.

[0005] FIG. 1a is a front perspective view of an electronic device according to one embodiment.

[0006] FIG. 1b is a plan view of the rear direction of an electronic device according to one embodiment.

[0007] FIG. 2 is a partially exploded perspective view of the electronic device of FIG. 1a and FIG. 1b including a hinge device according to one embodiment.

[0008] FIG. 3 is a diagram showing an example of a portable electronic device configuration in an unfolded state according to one embodiment.

[0009] FIG. 4 is a drawing showing an example of an exploded perspective view of a part of a portable electronic device according to one embodiment.

[0010] FIG. 5 is a drawing showing an example of a cross-section of a portable electronic device cut along the CC' cutting line of FIG. 4 according to one embodiment.

[0011] FIG. 6 is a drawing showing an example of a first surface of a support substrate according to one embodiment.

[0012] FIG. 7 is a drawing showing a part of the first support portion of a support substrate according to one embodiment.

[0013] FIG. 8 is a drawing showing an example of a state in which a support substrate and a socket structure are combined according to one embodiment.

[0014] FIG. 9 is a drawing showing an example of a cross-sectional configuration cut along the AA` cutting line and BB` cutting line of FIG. 8.

[0015] FIG. 10 is a drawing showing an example of a structure in which the battery sidewall of a portable electronic device including a socket structure according to one embodiment is reinforced.

[0016] FIG. 11 is a drawing showing an example of a first housing of a portable electronic device including a structure in which the battery sidewall is reinforced according to one embodiment.

[0017] FIG. 12 is a drawing showing an example of a part configuration of a first deformation portable electronic device including a deformation assisting structure according to one embodiment.

[0018] FIG. 13 is a drawing showing an example of a configuration of a second deformation portable electronic device including a second deformation assisting structure according to one embodiment.

[0019] FIG. 14 is a drawing showing an example of a part configuration of a third modified portable electronic device in which the position of the socket structure according to one embodiment is changed.

[0020] Figure 15 shows the H-Field simulation results of a portable electronic device according to one embodiment and a comparison group.

[0021] Hereinafter, various embodiments of this document are described with reference to the attached drawings.

[0022] A portable electronic device (or foldable electronic device) according to various embodiments of the present document may include a socket structure (or connector structure, connection interface structure, connection structure) with its shell removed, which is used for connection with an external electronic device to reduce thickness, and may provide a structure in which a support substrate is partially formed of a non-metallic material and disposed on a flexible substrate connected to the socket structure to prevent the ingress of noise (e.g., electromagnetic noise generated from the antenna of the portable electronic device or electromagnetic noise generated from various other electronic elements of the portable electronic device) while preventing movement of the socket structure. The structure of the support substrate described herein may be substantially applied in the same way even if the portable electronic device is a bar-type structure that is not a foldable electronic device but includes a socket structure.

[0023] In addition, the foldable electronic device described below exemplifies a device comprising two housing portions and at least one hinge structure connecting the two housing portions, but the embodiments of this description are not limited thereto. For example, the composite structure of a support substrate comprising a non-metallic material and a metallic material and the shape of an auxiliary structure supporting the mounting of a flexible substrate connected to a socket structure of this description can be applied to various electronic devices (e.g., bar-type portable electronic devices, two-stage foldable electronic devices, three-stage foldable electronic devices, slate PCs, or laptops) that can be connected to an external electronic device through a connection hole (or connector port).

[0024] For example, the external electronic device includes a device connected to a portable electronic device via a USB (universal serial bus) cable, the connection hole includes a hole into which the USB cable can be inserted, and the socket structure may include a socket into which the USB connector can be connected. Additionally, or generally, the preceding description referred to a structure in which the socket structure does not include a shell; however, in the embodiments of this invention, the support substrate of the composite structure may be arranged in a manner that supports the shell of the socket structure. Accordingly, the embodiments of this invention may be applied in the same or similar manner to socket structures that include a shell.

[0025] Other intended purposes according to the embodiments described herein will be mentioned as necessary during the process of explaining each embodiment.

[0026] FIG. 1a is a front perspective view of a portable electronic device according to one embodiment. FIG. 1b is a rear plan view of a portable electronic device according to one embodiment.

[0027] Referring to FIGS. 1a and 1b, a portable electronic device (100) (or electronic device, foldable electronic device, foldable electronic device, portable communication device) may be foldably coupled to each other with respect to a folding axis (F) through at least one hinge device (140, 140-1) (e.g., hinge module or hinge structure) and may include a first housing (110) (e.g., first housing structure) including a first side member (113) (e.g., side bezel) and a second housing (120) (e.g., second housing structure) including a second side member (123) (e.g., side bezel). For example, the first housing (110) and the second housing (120) may be formed as a foldable housing (e.g., housing structure). For example, a portable electronic device (100) may include a first display (130) (e.g., a flexible display, a foldable display, or a main display) positioned to be supported by a first housing (110) and a second housing (120). For example, the first housing (110) may include a first surface (111) and a second surface (112) facing in the opposite direction (e.g., the -z axis direction) of the first surface (111). For example, the second housing (120) may include a third surface (121) and a fourth surface (122) facing in the opposite direction (e.g., the -z axis direction) of the third surface (121). For example, the first housing (110) may include a first rear cover (114) coupled with a first side member (113). For example, the second housing (120) may include a second rear cover (124) combined with a second side member (123). For example, when the portable electronic device (100) is in a fully unfolded first state (e.g., unfolded state or unfolded state), the first surface (111) and the third surface (121) may be operated so that they face substantially the same direction (e.g., z-axis direction).For example, when the portable electronic device (100) is in a completely folded second state (e.g., a folded state or a folded state), the first side (111) and the third side (121) may be operated to face each other or face in opposite directions. For example, the portable electronic device (100) may be operated to maintain a third state (e.g., an intermediate state) between the first state and the second state.

[0028] According to one embodiment, the portable electronic device (100) may include a receiver (101) disposed on a first side (111) of a first housing (110), at least one sensor module (104) (e.g., an ambient light sensor) and / or at least one first camera module (105) (e.g., a UDC, under display camera). For example, the portable electronic device (100) may include at least one key (106) disposed on a first side member (113). For example, the portable electronic device (100) may include a second display (131) (e.g., a sub-display), at least one second camera module (108) and / or a flash (109) disposed on a second side (112) (e.g., a first rear cover (114)) of the first housing (110). For example, the second display (131) may be disposed to be visible from the outside through at least a portion of the first rear cover (114). For example, the portable electronic device (100) may include a speaker (102), a microphone (103), or a connector port (107) disposed on a second side member (123). At least some of the aforementioned plurality of components may be repositioned in the first housing (110) and / or the second housing (120). For example, the portable electronic device (100) may further include at least one third camera module (125) disposed below the second display (131) (e.g., a front camera that acquires an image through the second display (131)), at least one sensor module (126) (e.g., an ambient light sensor), or a speaker (127).

[0029] According to one embodiment, the first display (130) (e.g., flexible display) may include a first region (130a) (e.g., first planar portion) corresponding to at least a portion of the first surface (111), a second region (130b) (e.g., second planar portion) corresponding to at least a portion of the third surface (121), and a third region (130c) (e.g., flexible portion) connecting the first region (130a) and the second region (130b), to which the portable electronic device (100) is deformed in a second state (e.g., folded state) and / or a third state (e.g., intermediate state). For example, the third region (130c) may be positioned to overlap at least partially with at least one hinge device (140, 140-1) when the first display (130) is viewed from above (e.g., in the z-axis direction). For example, the first display (130) may be positioned so as not to be seen from the outside in the second state, with the first surface (111) and the third surface (121) facing each other (e.g., inward-fold type). For example, the first display (130) may be positioned so as to be seen from the outside in the second state, with the first surface (111) and the third surface (121) facing in opposite directions (e.g., outward-fold type).

[0030] FIG. 2 is a partially exploded perspective view of the electronic device of FIG. 1a and FIG. 1b including a hinge device according to one embodiment.

[0031] Referring to FIG. 2, the portable electronic device (100) may include at least one hinge device (140, 140-1) (e.g., hinge module or hinge structure) connecting the first housing (110) and the second housing (120) below the first display (130) (e.g., in the -z axis direction). For example, the at least one hinge device (140, 140-1) may include a first hinge device (140) and a second hinge device (140-1) spaced apart from the first hinge device (140) along a direction parallel to the folding axis (F) (e.g., in the ± y axis direction). For example, at least one hinge device (140, 140-1) may be supported by a first support member (1131) extending from a first side member (113) into a first space (1101) of a first housing (110) and a second support member (1231) extending from a second side member (123) into a second space (1201) of a second housing (120). For example, at least one hinge device (140, 140-1) may be positioned between the first housing (110) and the second housing (120) so as not to be seen from the outside through a hinge housing (150) (e.g., a hinge cover).

[0032] According to one embodiment, the first hinge device (140) may include a first rotation member (141) (e.g., a first arm or a first rotator) disposed on a first support member (1131) of a first housing (110), a second rotation member (142) (e.g., a second arm or a second rotator) disposed on a second support member (1231) of a second housing (120), and a gear assembly (143) connected to the first rotation member (141) and the second rotation member (142) so that the first housing (110) and the second housing (120) rotate symmetrically with respect to each other. For example, the gear assembly (143) may include a plurality of gears (e.g., spur gears and / or worm gears) that are geared to each other. For example, the gear assembly (143) may include a cam coupling structure for providing a free stop at various folding angles, which presses the first housing (110) and the second housing (120) with respect to each other in a direction intended to transition from a first state (e.g., unfolded state) to a second state (e.g., folded state) or from a second state to a first state. For example, the second hinge device (140-1) may be substantially symmetric to or have substantially the same configuration as the first hinge device (140).

[0033] According to one embodiment, the portable electronic device (100) may be coupled with at least one hinge device (140, 140-1) and may include at least one detent module (144) for providing a stopping sensation at various angles. For example, at least one hinge device (140, 140-1) and / or detent module (144) may form substantially the same plane as the first support member (1131) and the second support member (1231) when the portable electronic device (100) is in a first state. For example, the second hinge device (140-1) may be substantially symmetric to the first hinge device (140) or have substantially the same configuration.

[0034] According to one embodiment, the portable electronic device (100) may further include a first wing plate (161) and a second wing plate (162) positioned to cover at least a portion of the first hinge device (140) and the second hinge device (140-1). The first wing plate (161) and the second wing plate (162) may be positioned between the first display (130) and the hinge housing (150) (or between the first hinge device (140) and the second hinge device (140-1). Alternatively, the first wing plate (161) and the second wing plate (162) may be combined with the first hinge device (140) and the second hinge device (140-1) to perform a partial rotational movement together with at least a portion of the hinge devices (140, 140-1) during the hinge operation of the hinge devices (140, 140-1). During the partial rotational movement, the first wing plate (161) and the second wing plate (162) may support at least a portion of the rear surface of the first display (130).

[0035] FIG. 3 is a drawing showing an example of a configuration of a portable electronic device in an unfolded state according to one embodiment. FIG. 4 is a drawing showing an example of an exploded perspective view of a part of a portable electronic device according to one embodiment. Here, FIG. 3 is a drawing showing an example of a configuration in which rear covers disposed on the rear of each housing (110, 120) of the portable electronic device (100) are removed. FIG. 4 is an exploded perspective view of a portable electronic device (100) including at least some of the remaining components, excluding at least some area including the first circuit board of FIG. 3.

[0036] Referring to FIGS. 1a through 2, FIGS. 3 and FIG. 4, a portable electronic device (100) according to one embodiment comprises a display (130) (e.g., first display (130), flexible display, foldable display, or main display)), a first housing (110), a battery (110_bat), a first circuit board (e.g., first circuit board (110_pb2) of FIG. 4) (or first printed circuit board) disposed at the bottom of the first housing (110) (e.g., the inner -y-axis edge of the first housing (110), a first position, or a second position depending on the viewing direction), a second circuit board (110_pb1) (or second printed circuit board, second printed circuit board) disposed at the top of the first housing (110) (e.g., the inner y-axis edge of the first housing (110), a second position, or a first position depending on the viewing direction), and a flexible It may include a substrate (110_fb) (or flexible printed circuit board, FPCB), a support substrate (110_sco), a socket structure (110_sk), a wireless antenna module (110_fm), a rear cover (110_rco), a second housing (120), or a second housing placement element (120_in).

[0037] The first display (130) may include a configuration identical or similar to the first display described previously in FIG. 1a, FIG. 1b and FIG. 2. For example, the first display (130) may include a first area (130a) disposed in a first housing (110), a second area (130b) disposed in a second housing (120), and a third area (130c) disposed between the first housing (110) and the second housing (120). An adhesive member (130_ad) may be disposed on the rear surface (face facing the -z-axis direction) of the first area (130a). The adhesive member (130_ad) may adhere at least a portion of the first area (130a) to the first housing (110). In this regard, the adhesive member (130_ad) may be disposed on the edge area of ​​the first area (130a). Additionally, generally, a heat dissipation structure may be further disposed on the rear surface of the first region (130a). A driving circuit related to driving the first display (130) may be disposed on the rear surface of the second region (130b). The driving circuit may be connected to the first display (130) through the display flexible substrate (130_dfb). The first display (130) may include a window disposed (or laminated) on the front surface and a display panel disposed below the window, and may include a plurality of layers disposed (or laminated) on the rear surface. For example, a shock absorption layer related to shock absorption (e.g., an embossed layer) or a heat dissipation layer supporting a heat dissipation function (e.g., a metal layer or a copper layer) may be disposed (or laminated) on the rear surface of the first display (130). Additionally, or generally, a lattice layer may be included on the rear surface of the first display (130). The above lattice layer may be placed at least partially (or over the entire rear) on the rear of the first display (130).For example, a first lattice area (130_lat1), a second lattice area (130_lat2), and a third lattice area (130_lat3) may be disposed on the rear side of the third area (130c). The second lattice area (130_lat2) and the third lattice area (130_lat3) may be disposed side by side on both sides centered on the first lattice area (130_lat1). The thickness (e.g., x-axis length) of the first lattice area (130_lat1) may be formed to be greater than the thickness (e.g., x-axis length) of the second lattice area (130_lat2) and the third lattice area (130_lat3). The distance between the first lattice area (130_lat1) and the second lattice area (130_lat2) and the distance between the first lattice area (130_lat1) and the third lattice area (130_lat3) may be the same or similar. The lattice areas (130_lat1, 130_lat2, 130_lat3) may be formed such that the length in the length direction (e.g., y-axis or -y-axis or folding axis direction) is longer than the length in the width direction (e.g., x-axis or -x-axis direction).

[0038] The first housing (110) may include a configuration identical or similar to the first housing (110) described above in FIG. 1a, FIG. 1b and FIG. 2. For example, the first housing (110) may include a first side member (113), and the first side member (113) may include a plurality of slits (113_sl1, 113_sl2, 113_sl3). For instance, the first side member (113) may include a first slit (113_sl1) and a second slit (113_sl2) positioned in the -y-axis direction, and a third slit (113_sl3) positioned in the x-axis direction. The first side member (113) may include at least a first side wall portion (113_at1), a second side wall portion (113_at2), and a third side wall portion (113_at3), which are separated by the plurality of slits (113_sl1, 113_sl2, 113_sl3) and used as a communication antenna of a portable electronic device (100). The first side wall portion (113_at1) is located between the first slit (113_sl1) and the second slit (113_sl2), the second side wall portion (113_at2) is located between the first slit (113_sl1) and the third slit (113_sl3), and the third side wall portion (113_at3) may be positioned in the -x-axis direction of the second slit (113_sl2). Alternatively, the first side wall portion (113_at1) may be positioned between the second side wall portion (113_at2) and the third side wall portion (113_at3).

[0039] According to one embodiment, each of the first to third sidewall portions (113_at1, 113_at2, 113_at3) may be used as a communication antenna of a different frequency band. Alternatively, at least two of the first to third sidewall portions (113_at1, 113_at2, 113_at3) may be used as communication antennas of the same or similar frequency band. For example, at least one of the first to third sidewall portions (113_at1, 113_at2, 113_at3) may be used as at least part of an antenna that transmits and receives a communication signal defined as a low-band frequency band among the frequency bands of a 3G, 4G, 5G, or 6G mobile communication method. Meanwhile, in the above description, three slits (113_sl1, 113_sl2, 113_sl3) are exemplified in the first housing (110), but the present description is not limited thereto. For example, additional slits may be further oriented at the -y-axis edge portion of the first housing (110). As an example, at least one or a plurality of slits may be oriented in the second housing (120).

[0040] At least one hole penetrating vertically (e.g., in the y-axis and -y-axis directions) may be formed at at least one location of the first side wall portion (113_at1). For example, at least one microphone hole related to a microphone device located within the first housing (110), at least one speaker hole related to a speaker device, a card insertion hole related to insertion and removal of an external memory card, a physical key hole in which at least one physical key is placed, a sensor hole used as a passage for transmitting and receiving sensor signals of a sensor, or a connector port (107) for connecting a signal line (or cable) with an external electronic device may be placed in the first side wall portion (113_at1).

[0041] For example, the connector port (107) may be positioned in the first sidewall portion (113_at1). Alternatively, the connector port (107) may be positioned in the center of the first sidewall portion (113_at1). However, the present description is not limited thereto, and the connector port (107) may be positioned at one edge of the first sidewall portion (113_at1), or may be positioned in another sidewall portion. The connector port (107) may be formed as a through hole to connect the inside and outside of the first housing (110). The connector port (107) may include a shape corresponding to the shape of a structure that is inserted and removed, such as a USB connector.

[0042] At least a portion of the inner side of the first housing (110) may have a battery placement space (110_bat_s) formed therein where a battery (110_bat) can be placed. At least a portion of the battery placement space (110_bat_s) may have a shape corresponding to the outer shape of the battery (110_bat). For example, the battery placement space (110_bat_s) may include a space corresponding to the x-axis, y-axis, and z-axis lengths of the battery (110_bat). In this regard, the battery placement space (110_bat_s) may include a battery bottom portion (110_bwb) on which the front (e.g., one side in the z-axis direction) of the battery (110_bat) is placed, a first battery sidewall (110_bw1) facing the first side edge (e.g., -y-axis edge) of the battery (110_bat), a second battery sidewall (110_bw2) facing the second side edge (e.g., x-axis edge) of the battery (110_bat), a third battery sidewall (110_bw3) facing the third side edge (e.g., -x-axis edge) of the battery (110_bat), and a fourth battery sidewall (110_bw4) facing the fourth side edge (e.g., y-axis edge) of the battery (110_bat). The battery bottom portion (110_bwb) may include a portion of the bottom in the rear direction (e.g., -z-axis direction) of the first housing (110). The first battery sidewall (110_bw1) may extend in the -z-axis direction from the -y-axis edge of the battery bottom portion (110_bwb), and the second battery sidewall (110_bw2) may extend in the -z-axis direction from the x-axis edge of the battery bottom portion (110_bwb). The third battery sidewall (110_bw3) may extend in the -z-axis direction from the -x-axis edge of the battery bottom portion (110_bwb), and the fourth battery sidewall (110_bw4) may extend in the -z-axis direction from the y-axis edge of the battery bottom portion (110_bwb).As an example, at least one of the first to fourth battery sidewalls (110_bw1, 110_bw2, 110_bw3, 110_bw4) may include a partially open area or gap (e.g., at least one gap penetrating the y-axis and -y-axis).

[0043] According to one embodiment, at least a portion of a second circuit board (110_pb1), a first circuit board (110_pb2), a battery (110_bat), a socket structure (110_sk), a support board (110_sco), or a vibration module (110_hpt) may be disposed inside the first housing (110). Here, the vibration module (110_hpt) may be disposed in the second housing (120). Additionally, or generally, at least one of placement elements related to various user functions, such as a camera module, a sensor module, a structure equipped with an antenna pattern supporting signal transmission and reception of various frequency bands, a microphone device, or a speaker device, may be further disposed inside the first housing (110). At least a portion of at least one hinge structure may be disposed on one edge of the first housing (110) (e.g., the edge disposed adjacent to the second housing (120) when the portable electronic device (100) is in an unfolded state). A portion of a flexible circuit board that supports an electrical connection with a second housing (120) may be disposed on one side of the first housing (110).

[0044] The battery (110_bat) can supply power to a portable electronic device (100). The battery (110_bat) can be wirelessly charged via a wireless charging device or charged via a wired cable. For example, the battery (110_bat) can be charged using power supplied through the socket structure (110_sk). The battery (110_bat) may include a pack shape of a certain thickness in which the height of the z-axis is shorter than the length of the x-axis or y-axis. However, the battery (110_bat) described herein is not limited to this shape, and may include a variety of shapes, such as at least a portion of the surface facing the z-axis being polygonal or curved. The battery (110_bat) may be fixed within the battery placement space (110_bat_s) of the first housing (110). In this regard, an adhesive member may be placed between the battery (110_bat) and the battery bottom portion (110_bwb). Alternatively, a double-sided adhesive member may be placed on the front surface (e.g., z-axis direction) of the battery (110_bat), and while placing the battery (110_bat) in the battery placement space (110_bat_s), the battery (110_bat) may be adhesively fixed to the battery bottom portion (110_bwb) by the double-sided adhesive member. Additionally, or generally, an ejection structure for ejecting the battery (110_bat) (e.g., a pull tape for ejecting the battery (110_bat)) may be placed on one side of the battery (110_bat). The battery (110_bat) may be protected by the first to fourth battery side walls (110_bw1, 110_bw2, 110_bw3, 110_bw4). In this regard, the z-axis height of the battery (110_bat) may be formed to be similar to (or slightly higher than, between tens of µm and several mm) the height of the first to fourth battery sidewalls (110_bw1, 110_bw2, 110_bw3, 110_bw4).A portion of the flexible substrate (110_fb) may be disposed on the lower surface (e.g., the surface in the -z-axis direction) of the battery (110_bat).

[0045] The first circuit board (110_pb2) is positioned at the bottom of the first housing (110) (e.g., the -y-axis edge, or the first position), and electronic elements supporting various signal processing of the portable electronic device (100) may be positioned thereon. For example, at least a portion of a communication circuit related to the formation of a communication channel of the portable electronic device (100) may be positioned on the first circuit board (110_pb2). For example, the first circuit board (110_pb2) may be electrically (or functionally) connected to at least one of the first to third sidewall portions (113_at1, 113_at2, 113_at3) to control the transmission and reception of signals of a specific frequency band. Additionally, or generally, the first circuit board (110_pb2) may be positioned with elements related to configuration control of at least one of a microphone device or speaker device, at least one sensor, or a vibration module (110_hpt). The first circuit board (110_pb2) can be electrically connected to the second circuit board (110_pb1) through a first portion of the flexible substrate (110_fb). The first circuit board (110_pb2) can be connected to the bottom portion of the first housing (110) (e.g., at least one portion of a metal housing portion or an injection portion of a non-metal material) through a connecting means (e.g., at least one of a screw, a clip, or an adhesive member).

[0046] According to one embodiment, the second circuit board (110_pb1) is positioned on the top (e.g., the y-axis edge) of the first housing (110), and electronic elements supporting various signal processing of the portable electronic device (100) may be positioned thereon. For example, at least one of a processor, memory, or communication circuit may be positioned on the second circuit board (110_pb1). Alternatively, a power control circuit supporting the charging and discharging of a battery (110_bat) may be positioned on the second circuit board (110_pb1), or the power control circuit may be operatively (or electrically, functionally, physically) connected thereto. The second circuit board (110_pb1) may have a camera control circuit related to the operation of a camera module (e.g., the first camera module 105 of FIG. 1a, camera modules 108 and 125 of FIG. 1b) mounted thereon, or may be operatively connected to the camera control circuit. The second circuit board (110_pb1) may have a sensor control circuit mounted thereon related to the control of at least one sensor module (e.g., sensor module 104 of FIG. 1a, sensor module 126 of FIG. 1b) or may be operatively (or electrically, functionally) connected to the sensor control circuit. The second circuit board (110_pb1) may be connected to at least one circuit board placed in the second housing (120) through a circuit board in which at least a portion is formed flexibly.

[0047] According to one embodiment, a second circuit board (110_pb1) may be operatively (or electrically, functionally) connected to the first circuit board (110_pb2) through a flexible substrate (110_fb). For example, the second circuit board (110_pb1) may include a receiving connector into which a connector formed on one edge of the flexible substrate (110_fb) can be inserted. The second circuit board (110_pb1) may perform signal transmission and reception related to the operation of the first circuit board (110_pb2) through the flexible substrate (110_fb). According to one embodiment, the second circuit board (110_pb1) may be operatively (or electrically, functionally) connected to a socket structure (110_sk) through the flexible substrate (110_fb). The second circuit board (110_pb1) can communicate with an external electronic device connected to the socket structure (110_sk) through the flexible board (110_fb) and the socket structure (110_sk). Alternatively, when a power supply device is connected to the socket structure (110_sk), the second circuit board (110_pb1) can control the power supplied by the power supply device to be supplied to a power control circuit that controls the charging and discharging of the battery (110_bat).

[0048] The flexible substrate (110_fb) can electrically connect the first circuit board (110_pb2) and the second circuit board (110_pb1). In this regard, the flexible substrate (110_fb) may include insertion connectors positioned at the top and bottom, and a wiring portion positioned between the insertion connectors and having a plurality of wires arranged therein. According to one embodiment, the flexible substrate (110_fb) may include a wiring portion capable of connecting the second circuit board (110_pb1) and a socket structure (110_sk). For example, the flexible substrate (110_fb) may be formed in a Y shape and may include a first insertion connector connected to a first circuit board (110_pb2), a second insertion connector connected to a second circuit board (110_pb1), and a substrate header on which the socket structure (110_sk) is seated. It may also include a first wiring portion disposed between the first insertion connector and the second insertion connector, and a second wiring portion disposed between the second insertion connector and the substrate header. A portion of the first wiring portion disposed adjacent to the second circuit board (110_pb1) and a portion of the second wiring portion may be integrated to form a single body, and a portion adjacent to the first circuit board (110_pb2) and the socket structure (110_sk) may form a split shape.

[0049] The socket structure (110_sk) may include an interface that can be physically (or electrically, functionally, or kinetically) connected to an external electronic device. One side of the socket structure (110_sk) may be connected to one end of the flexible substrate (110_fb). Alternatively, the socket structure (110_sk) may be placed on a substrate header formed at one end of the flexible substrate (110_fb). For example, the socket structure (110_sk) may be fixed to the substrate header of the flexible substrate (110_fb) through a soldering operation. Additionally, or generally, the socket structure (110_sk) may be connected to the bottom surface of the first housing (110) (e.g., a bottom portion formed by an injection molding) through a connecting means (e.g., at least one of a screw, a clip, or an adhesive member). The socket structure (110_sk) is located within the first housing (110), and at least a portion of the socket structure (110_sk) and the connector port (107) can be aligned with respect to the xy plane. The connector port (107) may include a hole in which at least a portion of the socket structure (110_sk) is placed and an outer wall forming said hole. As the connector port (107) is formed to penetrate the upper and lower portions (e.g., the side wall in the y-axis or -y-axis direction) on one side of the first side wall portion (113_at1) as previously mentioned, at least a portion of the socket structure (110_sk) placed inside the connector port (107) (e.g., inside the hole) can be observed from the outside. In the illustrated drawing, the socket structure (110_sk) is illustrated in a form in which at least a portion of the shell has been removed. However, the present description is not limited thereto, and the socket structure (110_sk) may be replaced with a structure including an exterior.

[0050] The support substrate (110_sco) may be formed such that the x-axis length or y-axis length is greater than the z-axis height. For example, the x-axis length of a part of the support substrate (110_sco) may be formed to be longer than the y-axis length of a part of the support substrate (110_sco). At least a portion of the support substrate (110_sco) may be formed of a metal material to ensure set rigidity while supporting the first circuit board (110_pb2). For example, the support substrate (110_sco) may include a portion formed of a metal material (e.g., SUS) and a portion formed of a non-metal material (e.g., non-metal injection molded). At least a portion of the support substrate (110_sco) may overlap with the first circuit board (110_pb2) with respect to the front direction (e.g., z-axis direction) or the rear direction (e.g., -z-axis direction).

[0051] As an example, a first substrate area of ​​the support substrate (110_sco) may be positioned below the first circuit board (110_pb2) with respect to the front direction and may be joined to the first circuit board (110_pb2) by a joining means (e.g., screw or adhesive member). As an example, the size of the support substrate (110_sco) may be formed to be equal to or larger than the size of the first circuit board (110_pb2). As an example, a portion of the surface of the support substrate (110_sco) may be positioned to cover the rear surface (e.g., the surface in the -z-axis direction) of the first circuit board (110_pb2). A second substrate area of ​​the support substrate (110_sco) may overlap with at least a portion of the socket structure (110_sk) with respect to the front direction (e.g., z-axis direction) or the rear direction (e.g., -z-axis direction). As an example, another part of the support substrate (110_sco) with respect to the front direction may be positioned below the socket structure (110_sk) to support the socket structure (110_sk) in the front direction (e.g., z-axis direction). A third substrate area of ​​the support substrate (110_sco) may be positioned to cover at least a part of the vibration module (110_hpt). Here, the vibration module (110_hpt) may be omitted, in which case the third area of ​​the support substrate (110_sco) may be removed.

[0052] According to one embodiment, as the socket structure (110_sk) is positioned adjacent to a sidewall portion used as at least part of the antenna (e.g., at least one sidewall portion among the first to third sidewall portions (113_at1, 113_at2, 113_at3)), noise caused by the communication signal (or noise generated by the antenna of the portable electronic device (100)) may be induced in the socket structure (110_sk) by the surrounding structure while a communication signal is transmitted or received through the sidewall portion. For example, while a wireless signal is transmitted (or received) through at least one sidewall among the first to third sidewall portions (113_at1, 113_at2, 113_at3), an H-field is formed, and noise may be introduced into a structure formed of a metal material (e.g., a support substrate (110_sco)). In relation to the reduction of such noise ingress (or ingress), at least a portion of the support substrate (110_sco) is formed of a non-metallic material, and at least a portion of the non-metallic material of the support substrate (110_sco) may include a part that supports the socket structure (110_sk). As the support substrate (110_sco) supports the socket structure (110_sk) through the part formed of the non-metallic material, at least a portion of the noise introduced into the support substrate (110_sco) is not transmitted to the socket structure (110_sk) and can be blocked or reduced.

[0053] The wireless antenna module (110_fm) may be positioned between the rear cover (110_rco) and the battery (110_bat). The wireless antenna module (110_fm) may include, for example, a Near Field Communication (NFC) antenna and an antenna for wireless charging of the battery (110_bat). Alternatively, the wireless antenna module (110_fm) may further include an antenna related to the operation of near-field communication of the portable electronic device (100). At least a portion of the flexible substrate (110_fb) may be positioned between the wireless antenna module (110_fm) and the battery (110_bat).

[0054] The rear cover (110_rco) may be positioned to cover the rear surface of the first housing (110) (e.g., the surface facing the -z-axis direction). As an example, the rear cover (110_rco) may be positioned to cover the wireless antenna module (110_fm). Additionally, the rear cover (110_rco) may be positioned to cover the support substrate (110_sco). Such a rear cover (110_rco) may include a structure identical or similar to the first rear cover (114) described in FIG. 1b.

[0055] The second housing (120) may include a configuration identical or similar to the second housing (120) described above in FIG. 1a, FIG. 1b and FIG. 2. For example, the second housing (120) may include a second side member similar to the first side member (113) of the first housing (110). The second housing (120) may include a placement space where a battery may be placed, and a space or structure where other second housing placement elements (120_in) may be placed. The second housing (120) may be coupled to the first housing (110) so as to be hinge-operable via a hinge device (e.g., hinge device 140, 140-1 of FIG. 2).

[0056] For example, the second housing placement element (120_in) may include, for instance, a battery, an upper circuit board placed at the top of the second housing (120), a lower circuit board placed at the bottom of the second housing (120), and a flexible board connecting the upper circuit board and the lower circuit board, similar to the elements placed inside the first housing (110) described above. For example, the second housing placement element (120_in) may include a socket structure and a support board similar to the socket structure (110_sk) placed in the first housing (110) described above. When at least one side wall portion of the second side member (e.g., FIG. 1a or FIG. 1b, FIG. 2, second side member 123) of the second housing (120) is used as an antenna for wireless communication, the support substrate disposed in the second housing (120) includes a composite structure (e.g., a structure in which a metal material and a non-metal material are partially mixed and disposed), and the non-metal material portion of the composite structure may be disposed to support a portion of a socket structure disposed within the second housing (120).

[0057] FIG. 5 is a drawing showing an example of a cross-section of a portable electronic device cut along the CC' cutting line of FIG. 4 according to one embodiment.

[0058] Referring to FIGS. 1a through 5, a portable electronic device (100) observed through a cross-section may include a first housing (110), a rear cover (110_rco), a display (130) (or the first display), a battery (110_bat), a socket structure (110_sk), a first circuit board (110_pb2), a support board (110_sco), a flexible board (110_fb), or a wireless antenna module (110_fm).

[0059] The first housing (110) may include a battery bottom portion (110_bwb) on which a battery (110_bat) is placed, a first battery sidewall (110_bw1) extending in the -z-axis direction from the battery bottom portion (110_bwb), a housing bottom portion (110_bt) on which a part of a flexible substrate (110_fb), a first circuit board (110_pb2), and a socket structure (110_sk) are placed, or a structure forming a connector port (107). The connector port (107) may include a hole shape (or opening) penetrating from the -y-axis in the y-axis direction. For example, the connector port (107) may be included in a first housing (110) and may include a first port injection portion (107_r_up) and a first port housing portion (107_h_up) forming the top (or bottom when the z-axis is upward) of the connector port (107) (or the top of the hole shape corresponding to the connector port (107)), and a second port injection portion (107_r_dn) and a second port housing portion (107_h_dn) forming the bottom (or top when the z-axis is upward) of the connector port (107) (or the bottom of the hole shape corresponding to the connector port (107). The first port injection portion (107_r_up) and the first port housing portion (107_h_up) may be connected to each other and arranged side by side with respect to the -y-axis or y-axis direction. The second port injection portion (107_r_dn) and the second port housing portion (107_h_dn) are connected to each other and may be arranged parallel to each other with respect to the -y-axis or y-axis direction. According to one embodiment, the first port injection portion (107_r_up) and the second port injection portion (107_r_dn) may be connected through the side to form a port hole. The first port housing portion (107_h_up) and the second port housing portion (107_h_dn) may be connected through the side and arranged to surround the port hole.

[0060] The first port injection portion (107_r_up) and the first port housing portion (107_h_up) may be spaced apart from the second port injection portion (107_r_dn) and the second port housing portion (107_h_dn) in proportion to the size of the connector port (107) in the z-axis direction. In the illustrated drawings, the top and bottom of the connector port (107) are described while explaining the cross-section, but the present description is not limited thereto. For example, as shown in FIG. 5 above, the connector port (107) may have a polygonal or elliptical shape (or a polygon including a curved surface) with a closed z-axis cross section. Accordingly, the connector port (107) includes respective sides connecting the top edge and the bottom edge, and at least a portion of the sides may include a curved surface. The first housing (110) may include an upper portion (107_w_up) of the first side wall portion positioned above the first port injection portion (107_r_up) and a lower portion (107_w_dn) of the first side wall portion positioned below the second port injection portion (107_r_dn). According to various embodiments, although the -z-axis direction is defined as the upper portion in the illustrated drawings, when based on the z-axis direction, the upper portion (107_w_up) of the first side wall portion may be referred to as the lower portion of the first side wall portion, and the lower portion (107_w_dn) of the first side wall portion may be referred to as the upper portion of the first side member. As an example, the first port injection portion (107_r_up) may be formed on the upper portion (107_w_up) of the first side wall portion through an injection process, and the second port injection portion (107_r_dn) may be formed on the lower portion (107_w_dn) of the first side wall portion through an injection process.

[0061] In one example, the inlet portion of the connector port (107) (e.g., the -y-axis edge, or the first port injection portion (107_r_up), the second port injection portion (107_r_dn), and some side portions connecting both edges of the first port injection portion (107_r_up) and the second port injection portion (107_r_dn)) may be formed as an injection molded part, and the central portion of the connector port (107) (e.g., a position spaced a certain distance in the y-axis direction from the inlet portion, or the first port housing portion (107_h_up), the second port housing portion (107_h_dn), and some side portions connecting both edges of the first port housing portion (107_h_up) and the second port housing portion (107_h_dn) adjacent to the port injection portions) may be formed of a metal material (e.g., aluminum, or stainless steel). The outlet portion of the connector port (107) (e.g., the y-axis edge, or the portion adjacent to the housing injection bottom portion (110_rg_bt) among some side portions connecting the first port housing portion (107_h_up), the second port housing portion (107_h_dn), and the two sides of the first port housing portion (107_h_up) and the second port housing portion (107_h_dn)) may be formed so that the front and rear surfaces are penetrated with respect to the y-axis direction. At least a portion of the socket structure (110_sk) may be disposed in the outlet portion of the connector port (107).

[0062] The first housing (110) may include a housing injection bottom portion (110_rg_bt) that is connected to the second port housing portion (107_h_dn) and forms the housing bottom portion (110_bt). One side of the housing injection bottom portion (110_rg_bt) in the z-axis direction (e.g., the front direction where the display (130) displays the screen) supports a part of the display (130), and one side in the -z-axis direction (e.g., the rear direction of the display (130) or the rear cover (110_rco) direction from the display (130) may support a substrate header (110_fb_hd) of a flexible substrate (110_fb). On the housing injection bottom portion (110_rg_bt), at least a portion of a support structure (110_rg_sp) supporting a socket structure (110_sk), a substrate header (110_fb_hd) of a flexible substrate (110_fb), and a wiring portion (110_fb_bd) of a flexible substrate (110_fb) may be disposed. On one edge (e.g., -y-axis edge) of the housing injection bottom portion (110_rg_bt), a rubber member (110_rb) (or an elastic member, a waterproof member, an adhesive waterproof member, or an adhesive member) disposed between the socket header (110_sk_hd) of the socket structure (110_sk) and the socket body (110_sk_bd) may be disposed.

[0063] A rear adhesive member (110_rco_ad) (or waterproof member) that blocks the gap may be disposed between the first port housing portion (107_h_up) and the rear cover (110_rco). A front adhesive member (130_ad) (or waterproof member) that blocks the gap may be disposed between the second port housing portion (107_h_dn) and the display (130). The rear adhesive member (110_rco_ad) and the front adhesive member (130_ad) may be disposed in a strip form along the edge of the first housing (110). A deco (110_dec) may be disposed on the lower portion (107_w_dn) of the first side wall portion (e.g., on one side in the z-axis direction). The deco (110_dec) may be disposed to protect one side edge of the display (130). The portable electronic device (100) may include a deco adhesive member (110_dec_ad) (or deco waterproof member) that closes the gap between the deco (110_dec) and the display (130). The second port injection portion (107_r_dn) and the lower portion of the first side wall portion (107_w_dn) may form a groove into which the deco (110_dec) can be inserted. For example, the groove (or groove) into which the deco (110_dec) is inserted may be formed by a part of the second port injection portion (107_r_dn) and a part of the lower portion of the first side wall portion (107_w_dn).

[0064] A battery (110_bat) is seated on a battery bottom portion (110_bwb) that forms a part of the first housing (110) (or a part of the housing bottom portion (110_bt)), and a first battery side wall (110_bw1) may be formed in the z-axis direction from the battery bottom portion (110_bwb) to support the battery (110_bat), while distinguishing between the area where the first circuit board (110_pb2) is placed and the area where the battery (110_bat) is placed. The z-axis height of the first battery side wall (110_bw1) may be formed lower than the z-axis height of the battery (110_bat). When oriented from the z-axis to the -z-axis direction, at least a portion of the flexible substrate (110_fb) may be placed on one side of the battery (110_bat) (e.g., the end in the -z-axis direction) beyond one end of the first battery sidewall (110_bw1) (e.g., the end in the -z-axis direction) (e.g., the upper surface of the battery (110_bat) when the -z-axis direction is upward).

[0065] As an example, with respect to the z-axis in the direction of the -z-axis (or when facing the z-axis in the direction of the -z-axis), the portable electronic device (100) may include a structure in which a display (130), a part of a housing bottom portion (110_bt), a part of a housing injection bottom portion (110_rg_bt), a support structure (110_rg_sp), a part of a flexible substrate (110_fb), a support member (110_spn) (e.g., a support structure, a sponge, a mesh-type elastic member, an elastic member made of non-metallic material, or rubber), a part of a first circuit board (110_pb2), a part of a support substrate (110_sco), and a rear cover (110_rco) are laminated. At least a part of the display (130) may be disposed on one side of the housing bottom portion (110_bt) (e.g., a side facing the z-axis direction).

[0066] For example, the socket structure (110_sk) may include a socket header (110_sk_hd) disposed inside the connector port (107) and a socket body (110_sk_bd) disposed on a substrate header (110_fb_hd) of the flexible substrate (110_fb). Additionally or generally, the socket structure (110_sk) (or portable electronic device (100)) may include a rubber member (110_rb) (e.g., an elastic member, a waterproof member, an adhesive waterproof member, or an adhesive member) disposed between the socket header (110_sk_hd) and the socket body (110_sk_bd) of the socket structure (110_sk). The rubber member (110_rb) may include a ring shape (or a square ring shape or a polygon or a polygon including a curved surface corresponding to a portion of the cross-section of the socket body (110_sk_bd). The above rubber member (110_rb) can prevent foreign matter or moisture from entering the inside of the first housing (110) through the connector port (107).

[0067] The length of the socket header (110_sk_hd) may be formed to be shorter than the hole depth in the -y-axis or y-axis direction of the connector port (107). The socket header (110_sk_hd) may generally be formed of a non-metallic material (e.g., plastic material) and may include at least one metallic electrode (or terminal) that can be electrically connected to an external electronic device, and the at least one electrode may be positioned to be exposed to the outside of the socket header (110_sk_hd). The at least one electrode positioned in the socket header (110_sk_hd) may be connected to the substrate header (110_fb_hd) of the flexible substrate (110_fb) through wiring formed within the socket body (110_sk_bd). The socket body (110_sk_bd) has a rectangular cross-section in the z-axis direction (or a polygonal shape including a curved surface or a polygonal shape) and can support a socket header (110_sk_hd) protruding in the -y-axis direction from the center of the socket body (110_sk_bd). A portion of the support substrate (110_sco) may be in contact with one side of the socket body (110_sk_bd) (e.g., the upper surface when the -z-axis direction is defined as the upper side, or the lower surface when the z-axis direction is defined as the upper side). For example, a non-metallic portion of the support substrate (110_sco) may be in contact with one side of the socket body (110_sk_bd). Accordingly, the socket body (110_sk_bd) is positioned between the support substrate (110_sco) and the substrate header (110_fb_hd) of the flexible substrate (110_fb), and the socket body (110_sk_bd) can be fixed in response to the support substrate (110_sco) pressing the socket body (110_sk_bd) in the direction of the substrate header (110_fb_hd). The thickness (e.g., thickness in the z-axis direction) of the socket structure (110_sk) (e.g., socket body (110_sk_bd)) may be greater than the thickness of the first circuit board (110_pb2).The thickness of the socket body (110_sk_bd) may be greater than the size (or height) of the outlet hole of the connector port (107).

[0068] The flexible substrate (110_fb) may include a substrate header (110_fb_hd) and a wiring portion (110_fb_bd). The substrate header (110_fb_hd) may be placed on the first housing injection portion (110_rg_bt). A socket structure (110_sk) (e.g., a socket body (110_sk_bd)) may be placed on the substrate header (110_fb_hd). For example, the socket body (110_sk_bd) may be fixed on the substrate header (110_fb_hd) through soldering. One side of the substrate header (110_fb_hd) may be connected to the wiring portion (110_fb_bd). One end of the wiring portion (110_fb_bd) (e.g., the -y-axis edge) is connected to one side of the substrate header (110_fb_hd), extends toward the first battery sidewall (110_bw1), and at least a portion may be placed on the upper surface of the battery (110_bat) (e.g., the surface facing the -z-axis direction). The other end of the wiring portion (110_fb_bd) of the flexible substrate (110_fb) (e.g., the y-axis edge) may be connected to the second circuit board (110_pb1). In this regard, an insertion connector that can be connected to a receiving connector formed on the second circuit board (110_pb1) may be placed at the other end of the wiring portion (110_fb_bd). At least a portion of the flexible substrate (110_fb) may be disposed, for example, between the support structure (110_rg_sp) and the support member (110_spn). In relation to blocking the inflow of noise into the flexible substrate (110_fb) (or the inflow of electromagnetic noise generated by the antenna of the portable electronic device (100) or the inflow of electromagnetic noise generated by various electronic elements of the portable electronic device (100)), the support structure (110_rg_sp) and the support member (110_spn) may be formed of a non-metallic material.

[0069] The first circuit board (110_pb2) may be disposed between the support board (110_sco) and the support member (110_spn). One side of the first circuit board (110_pb2) (e.g., the upper side when the -z-axis direction is defined as the upper side, and the lower side when the z-axis direction is defined as the upper side) may be in contact with the metal material portion of the support board (110_sco). The first circuit board (110_pb2) includes a plurality of layers, and may include, for example, a ground layer. As an example, the ground layer of the first circuit board (110_pb2) may be connected to the support board (110_sco). A support member (110_spn) may be disposed between the first circuit board (110_pb2) and the housing bottom portion (110_bt).

[0070] According to one embodiment, the support substrate (110_sco) may include a first support portion (110_sco1) and a second support portion (110_sco2). The first support portion (110_sco1) may be formed of a metal material (e.g., SUS, or aluminum alloy, other metal material, or metal alloy). The second support portion (110_sco2) may be formed of a non-metal injection molded material. When oriented in the z-axis direction or the -z-axis direction, at least a portion of the first support portion (110_sco1) may be positioned to overlap with the first circuit board (110_pb2). For example, the first support portion (110_sco1) may be coupled to the first circuit board (110_pb2) through a coupling means. At least a portion of the second support portion (110_sco2) may be positioned to overlap with the socket body (110_sk_bd). Alternatively, at least a portion of the second support portion (110_sco2) may be in contact with at least a portion of the socket body (110_sk_bd). For example, the thickness of the first support portion (110_sco1) overlapping with the first circuit board (110_pb2) may be formed to be thinner than the thickness of the second support portion (110_sco2) overlapping with the socket body (110_sk_bd).

[0071] According to various embodiments, one end of the first support portion (110_sco1) (e.g., -y-axis edge) may be positioned to overlap the second support portion (110_sco2) vertically (e.g., z-axis direction). One end of the second support portion (110_sco2) may be positioned to contact the socket body (110_sk_bd) and to press the socket body (110_sk_bd) in the z-axis direction. The support substrate (110_sco) may be positioned below the rear cover (110_rco) (e.g., below in the -z-axis direction, above in the z-axis direction). For example, at least a portion of the support substrate (110_sco) may be spaced apart from the rear cover (110_rco). Alternatively, an air gap may be formed between the support substrate (110_sco) and the rear cover (110_rco). As another example, at least a portion of the rear cover (110_rco) and the support substrate (110_sco) are in contact, so that while at least a portion of the support substrate (110_sco) (e.g., a second support portion (110_sco2)) presses the socket body (110_sk_bd), at least a portion of the rear cover (110_rco) can support at least a portion of the support substrate (110_sco) in the z-axis direction.

[0072] FIG. 6 is a drawing showing an example of a first surface of a support substrate according to one embodiment. FIG. 7 is a drawing showing a part of a first support portion of a support substrate according to one embodiment.

[0073] Referring to FIGS. 1 to 6, a support substrate (110_sco) according to one embodiment may include a first substrate region (110_sco_p1), a second substrate region (110_sco_p2), and a third substrate region (110_sco_p3). Alternatively, the support substrate (110_sco) may include a first support portion (110_sco1) formed of a metal material and a second support portion (110_sco2) formed of a non-metal material.

[0074] According to one embodiment, the first substrate region (110_sco_p1) may have a first portion (601a) of a first support portion (110_sco1) made of metal material and a first portion (601b) of a second support portion (110_sco2) made of non-metal material arranged thereon. Based on the illustrated drawing, the first portion (601a) of the first support portion (110_sco1) may be arranged in the y-axis direction, and the first portion (601b) of the second support portion (110_sco2) may be arranged in the -y-axis direction. The first portion (601a) of the first support portion (110_sco1) and the first portion (601a) of the second support portion (110_sco2) may have a combined state. For example, the support substrate (110_sco) may include an area in which at least a portion of the first support portion (110_sco1) and at least a portion of the second support portion (110_sco2) are arranged to overlap each other. At least a portion of the first circuit board (110_pb2) may be arranged in the lower part (e.g., in the -z-axis direction) of the first substrate area (110_sco_p1). For example, the width of the y-axis length of the first substrate area (110_sco_p1) may be formed to be the same as or similar to the width of the y-axis length of the first circuit board (110_pb2).

[0075] According to one embodiment, the second substrate region (110_sco_p2) may be formed by a second portion (602a) of a first support portion (110_sco1) made of metal material and a second portion (602b) of a second support portion (110_sco2) made of non-metal material. The second portion (602a) of the first support portion (110_sco1) may be formed by extending in the -x-axis direction from the -x-axis edge of the first support portion (110_sco1). Based on the illustrated drawing, the second portion (602a) of the first support portion (110_sco1) may be positioned so that at least a portion of it is surrounded by the second portion (602b) of the second support portion (110_sco2). At least a portion of the second portion (602a) of the first support portion (110_sco1) and the second portion (602b) of the second support portion (110_sco2) may overlap vertically (e.g., in the z-axis direction). For example, the width in the y-axis direction of the second substrate area (110_sco_p2) may be shorter than the width in the y-axis direction of the first substrate area (110_sco_p1).

[0076] According to one embodiment, the third substrate region (110_sco_p3) may include a third portion (603a) of a first support portion (110_sco1) made of metal material. The third portion (603a) of the first support portion (110_sco1) may extend in the -x-axis direction from the -x-axis edge of the second portion of the first support portion (110_sco1). The y-axis width of the third portion (603a) of the first support portion (110_sco1) may be larger than the y-axis width of the first portion (601a) of the first support portion (110_sco1). As an example, a vibration module (110_hpt) may be disposed in the lower part (e.g., in the -z-axis direction) of the third substrate region (110_sco_p3). For example, the shape of the support substrate (110_sco) described above may include a shape in which the second substrate region (110_sco_p2) is more concave in the y-axis direction than the first substrate region (110_sco_p1) or the third substrate region (110_sco_p3) based on the -y-axis edge.

[0077] Referring to FIGS. 1 through 7, the first support portion (110_sco1) is formed entirely of a metal material and at least a portion may be formed flat. Alternatively, the first support portion (110_sco1) may include a portion that protrudes in the z-axis direction or is engraved in the -z-axis direction relative to one flat surface. At least a portion of the first support portion (110_sco1) may have a through hole that penetrates the front and rear surfaces (e.g., from the -z-axis to the z-axis direction). At least one through hole formed in the first support portion (110_sco1) may be used for coupling the first support portion (110_sco1) with other components (e.g., a first circuit board (110_pb2), or a first housing (110)). In this regard, a portion of a coupling means may be inserted into at least one through hole of the first support portion (110_sco1).

[0078] According to one embodiment, a portion of a socket structure (110_sk) may be disposed in the lower portion of the second substrate area (110_sco_p2) of the first support portion (110_sco1). For example, a socket body (110_sk_bd) of the socket structure (110_sk) may be disposed in the lower portion of the second substrate area (110_sco_p2) of the first support portion (110_sco1). A curved portion (110_sco_cv) may be formed on one edge of the second substrate area (110_sco_p2) (e.g., the -y-axis edge) so as to press the socket body (110_sk_bd) in the z-axis direction upon contact with the socket body (110_sk_bd). The above-mentioned curved portion (110_sco_cv) may be formed in at least a portion between the boundary line of the first substrate area (110_sco_p1) and the second substrate area (110_sco_p2) and the boundary line of the second substrate area (110_sco_p2) and the third substrate area (110_sco_p3). For example, the curved portion (110_sco_cv) may include a cross-section in the z-axis direction from the -z-axis direction that is S-shaped, an L-shaped or Z-shaped that is rotated 180 degrees to the right. A plurality of support holes (110_sco_h) may be formed in the area where the curved portion (110_sco_cv) is formed. The curved portion (110_sco_cv) may include a plurality of support holes (110_sco_h). The plurality of support holes (110_sco_h) are formed to penetrate from the -z axis in the z-axis direction, and the spacing of the plurality of support holes (110_sco_h) can be formed uniformly in the x-axis direction. The plurality of support holes (110_sco_h) can be used to more firmly connect with the second part (602a) of the first support part (110_sco1) located in the second substrate area (110_sco_p2) during the process of forming the second part (602b) of the second support part (110_sco2).For example, as an injection molded material is injected into the plurality of support holes (110_sco_h), a second part (602b) of the second support part (110_sco2) can be formed to cover the upper and lower parts of the curved portion (110_sco_cv) of the first support part (110_sco1). At this time, after the injection molded material injected into the plurality of support holes (110_sco_h) hardens, it acts as a pillar, thereby allowing the curved portion (110_sco_cv) of the first support part (110_sco1) and the second support part (110_sco2) to be supported or joined more firmly.

[0079] FIG. 8 is a drawing showing an example of a state in which a support substrate and a socket structure are combined according to one embodiment. FIG. 9 is a drawing showing an example of a partial configuration among the cross-sectional configurations cut along the AA' cutting line and the BB' cutting line of FIG. 8. For example, FIG. 9 shows only the configuration of the support substrate (110_sco), excluding the socket structure (110_sk) among the configurations cut along each cutting line.

[0080] Referring to FIGS. 1 through 8, a socket structure (110_sk) may be disposed on the lower side of the support substrate (110_sco) (e.g., when the -z axis is defined as the upper side). Here, the support substrate (110_sco) described in FIG. 8 may include a structure identical or similar to the support substrate (110_sco) described in FIG. 6, excluding the socket structure (110_sk). As an example, the support substrate (110_sco) may include a first substrate region (110_sco_p1), a second substrate region (110_sco_p2), or a third substrate region (110_sco_p3). The first substrate region (110_sco_p1) and the second substrate region (110_sco_p2) may have a structure identical or similar to the first substrate region (110_sco_p1) and the second substrate region (110_sco_p2) described in FIG. 6. The above third substrate region (110_sco_p3) may be arranged so that the third part (603b) of the second support part (110_sco2) made of a non-metallic material is coupled to the third part (603a) of the first support part (110_sco1) or to the third part (603a) of the first support part (110_sco1). However, the embodiments of the present invention are not limited thereto, and only the third part (603a) of the first support part (110_sco1) made of a metallic material may be arranged in the third substrate region (110_sco_p3).

[0081] As an example, the support substrate (110_sco) includes a plurality of through holes formed in the z-axis direction, and coupling means (Scr_1, Scr_2, Scr_3, Scr_4) may be disposed in each of the plurality of through holes. As an example, the first coupling means (Scr_1) is disposed through a through hole formed in the first substrate area (110_sco_p1) and may be used to combine the support substrate (110_sco) with a first circuit board (110_pb2) disposed below the support substrate (110_sco). The second coupling means (Scr_2) is disposed through a through hole formed in the second substrate area (110_sco_p2) and may be used to combine the first circuit board (110_pb2) or a socket structure (110_sk) disposed below the support substrate (110_sco) with the support substrate (110_sco). The third coupling means (Scr_3) and the fourth coupling means (Scr_4) are positioned to penetrate a through hole formed in the third substrate region (110_sco_p3) and can be used to coupling the support substrate (110_sco) to at least one of the vibration module (110_hpt) or the bottom portion of the first housing (110) positioned below the support substrate (110_sco). For example, the plurality of coupling means (Scr_1, Scr_2, Scr_3, Scr_4) may include screws.

[0082] According to one embodiment, the socket structure (110_sk) is formed extending in one direction from the socket body (110_sk_bd) and may include coupling structures used to fix the socket body (110_sk_bd). The coupling structures (So_con1, So_con2) may each include a ring-shaped structure including through holes that penetrate vertically. Socket coupling means (So_Scr1, So_Scr2) used to connect the socket structure (110_sk) to the bottom portion of the first housing (110) may be disposed in the coupling structures (So_con1, So_con2). For example, the socket coupling means (So_Scr1, So_Scr2) may include, for instance, a screw (or thread).

[0083] Referring to FIGS. 1 through 9, a cross-section taken along the AA' cutting line can be seen, as illustrated, that the first support portion (110_sco1) may include an area formed entirely flat and a curved portion (110_sco_cv) positioned at one end of the flat area (e.g., the -y-axis edge). For example, the curved portion (110_sco_cv) may be formed by bending in the z-axis direction from one end of the flat area of ​​the first support portion (110_sco1). The curved portion (110_sco_cv) may extend in the -y-axis direction from the -y-axis edge of the first support portion (110_sco1) and may be connected to the second support portion (110_sco2). At least a portion of the curved portion (110_sco_cv) may include a peripheral portion forming a plurality of support holes (110_sco_h) as described in FIG. 7. One end (y-axis edge) of the flat area of ​​the first support portion (110_sco1) where the curved portion (110_sco_cv) is formed may be positioned to overlap with a part of the second support portion (110_sco2). Alternatively, one end (e.g., y-axis edge) of the second support portion (110_sco2) may be positioned to cover at least a part of the curved portion (110_sco_cv).

[0084] Referring to FIGS. 1 through 9, when looking at the cross-section cut along the BB' cutting line, as illustrated, the first support portion (110_sco1) may include an area formed entirely flat and a plurality of support holes (110_sco_h) disposed at one end of the flat area. The plurality of support holes (110_sco_h) of the first support portion (110_sco1) may be filled by one edge (e.g., the y-axis edge) of the second support portion (110_sco2). As the plurality of support holes (110_sco_h) are formed across the curved portion (110_sco_cv), when looking at the BB' cutting plane, one edge of the curved portion (110_sco_cv) may be disposed on the inside of the second support portion (110_sco2). At least a portion of the above-mentioned curve (110_sco_cv) may be positioned to overlap with the socket structure (110_sk) (e.g., socket body (110_sk_bd)) with respect to the z-axis direction or the -z-axis direction. According to one embodiment, the second support portion (110_sco2) may wrap around the curve (110_sco_cv) to prevent or minimize (or reduce) physical contact between the metal curve (110_sco_cv) and the socket body (110_sk_bd). For example, when viewed from the z-axis direction in the -z-axis direction, the support substrate (110_sco) may include a structure in which a portion of a second support part (110_sco2) disposed on the upper part of a socket body (110_sk_bd), at least a portion of a curved part (110_sco_cv) disposed inside the second support part (110_sco2), and another portion of the second support part (110_sco2) disposed on at least a portion of the curved part (110_sco_cv) are stacked. Meanwhile, the stacking order may be referred to as reverse order or other order depending on the reference direction.

[0085] FIG. 10 is a drawing showing an example of a structure in which the battery sidewall of a portable electronic device is reinforced, including a socket structure according to one embodiment. FIG. 11 is a drawing showing an example of a first housing of a portable electronic device including a structure in which the battery sidewall is reinforced, according to one embodiment. As an example, FIG. 10 may be a drawing showing another example of a face cut along the CC' cutting line shown in FIG. 4.

[0086] Referring to FIGS. 1a through 10, the portable electronic device (100) may include a first housing (110), a rear cover (110_rco), a display (130) (or the first display), a battery (110_bat), a socket structure (110_sk), a first circuit board (110_pb2), a support board (110_sco), a flexible board (110_fb), or a wireless antenna module (110_fm). Alternatively, at least some of the above-described components may be omitted. A portable electronic device (100) according to one embodiment having such a configuration may include a structure identical or similar to each component of the portable electronic device (100) described above in FIG. 5, except for a part of the first battery sidewall (110_bw1) and the configuration of the flexible board (110_fb). Accordingly, the detailed description of the remaining components, excluding the first battery sidewall (110_bw1) and the flexible substrate (110_fb), may be replaced or supplemented by the description of the configuration of the portable electronic device (100) described in FIGS. 4 to 9.

[0087] Meanwhile, referring to FIGS. 1a through 11, the first housing (110) of the portable electronic device (100) includes a battery placement space (110_bat_s) in which a battery (110_bat) is seated, and the battery placement space (110_bat_s) may include a battery bottom portion (110_bwb), a first battery sidewall (110_bw1), or a second battery sidewall (110_bw2). Additionally, as previously described in FIG. 3 or FIG. 4, the battery placement space (110_bat_s) may further include a third battery sidewall and a fourth battery sidewall. The first housing (110) includes a first side member (113), and the first side member (113) may include a plurality of slits (113_sl1, 113_sl2, 113_sl3) and a plurality of side wall portions (113_at1, 113_at2, 113_at3). At least one of the plurality of side wall portions (113_at1, 113_at2, 113_at3) may be used as an antenna to support signal transmission and reception during the process of performing communication functions of a portable electronic device (100). A connector port (107) may be disposed in the first side wall portion (113_at1) among the plurality of side wall portions (113_at1, 113_at2, 113_at3). A socket placement space (110_sk_s) in which a socket structure (110_sk) is placed may be placed in the inner side (e.g., housing bottom portion (110_bt)) of the first housing (110) which is aligned with the area where the connector port (107) is placed in the first direction (e.g., y-axis direction). In the socket placement space (110_sk_s), at least a portion of the previously described socket structure (110_sk) (e.g., socket body (110_sk_bd)) may be placed, and another portion of the socket structure (110_sk) (e.g., at least a portion of the socket header (110_sk_hd)) may be placed within a hole (or empty space) corresponding to the connector port (107).

[0088] The first battery sidewall (110_bw1) may be formed to face one edge (e.g., the -y-axis edge) of the battery (110_bat) as previously described. As an example, the height of the first battery sidewall (110_bw1) along the -z-axis may be smaller than the thickness of the battery (110_bat). One side of the first battery sidewall (110_bw1) (e.g., the side facing the y-axis direction, or the side facing the battery (110_bat)) may be formed flat. The first battery sidewall (110_bw1) may be formed from, for example, a metal material or a material identical to that of the first housing (110). For example, an auxiliary structure (110_bw_rg) may be placed on the other side of the first battery sidewall (110_bw1) (e.g., the side facing the -y-axis edge). The other side of the first battery side wall (110_bw1) may be formed in an uneven shape. Alternatively, the other side of the first battery side wall (110_bw1) may include at least one protrusion protruding in the -y-axis direction or at least one groove engraved in the y-axis direction.

[0089] According to one embodiment, the auxiliary structure (110_bw_rg) may be disposed on the other side (e.g., one side in the -y-axis direction) of the first battery sidewall (110_bw1). The auxiliary structure (110_bw_rg) may be formed from, for example, a non-metallic material. As an example, the auxiliary structure (110_bw_rg) may be formed as an injection molded product. The shape of the auxiliary structure (110_bw_rg) in the first direction (e.g., the y-axis direction) may include a shape corresponding to the other side (e.g., one side in the -y-axis direction) of the first battery sidewall (110_bw1). For example, the shape of the auxiliary structure (110_bw_rg) in the first direction may include at least one protruding part or at least one engraved part (or concave part). The protruding portion of the auxiliary structure (110_bw_rg) is inserted into a groove formed on the other side of the first battery sidewall (110_bw1), and a projection to be formed on the other side of the first battery sidewall (110_bw1) may be disposed in the engraved portion of the auxiliary structure (110_bw_rg). As the shape of the other side of the first battery sidewall (110_bw1) and the shape of the first direction of the auxiliary structure (110_bw_rg) are formed unevenly (or in an uneven shape), rigidity can be maintained through a wider mutual contact surface. At least a portion of the second direction of the auxiliary structure (110_bw_rg) (e.g., a direction opposite to the first direction, or a -y-axis direction, a direction in which the connector port (107) is formed, or a direction in which the socket structure (110_sk) is disposed) may include an inclined surface having a first slope. The inclined surface of the auxiliary structure (110_bw_rg) may include a tilted shape having a slope greater than 0 in the y-axis direction from the -y-axis. At least a portion of the top of the auxiliary structure (110_bw_rg) (e.g., top when the -z-axis direction is defined as the upper side, bottom when the z-axis direction is defined as the upper side) may be rounded.At least a portion of the auxiliary structure (110_bw_rg) may be in contact with the flexible substrate (110_fb). Alternatively, at least a portion of the inclined surface of the auxiliary structure (110_bw_rg) may be in contact with the flexible substrate (110_fb). As described above, as the auxiliary structure (110_bw_rg) made of a non-metallic material is positioned to support one side of the flexible substrate (110_fb), it may block or reduce the entry of noise (e.g., electromagnetic noise generated by an antenna) transmitted through the first sidewall portion (113_at1) and the first battery sidewall (110_bw1) into the flexible substrate (110_fb).

[0090] As previously described in FIG. 5, the flexible substrate (110_fb) may include a substrate header (110_fb_hd), a wiring portion (110_fb_bd), and a wiring support member (110_fb_ad). The substrate header (110_fb_hd) is placed on the housing injection bottom portion (110_rg_bt), and the socket body (110_sk_bd) of the socket structure (110_sk) may be fixed on the substrate header (110_fb_hd). One end of the wiring portion (110_fb_bd) may be connected to one side of the substrate header (110_fb_hd).

[0091] One end of the wiring portion (110_fb_bd) is connected to a board header (110_fb_hd), and the other end can be connected to a second circuit board (e.g., the second circuit board (110_pb1) of FIG. 3). At least a portion of the wiring portion (110_fb_bd) may be positioned between a support member (110_spn) (e.g., a noise absorbing member or a shock absorbing member, e.g., a sponge) positioned below (or above in the case of z-axis reference) the first circuit board (110_pb2) and a support structure (110_rg_sp) positioned on the housing bottom (110_bt) (or housing injection bottom (110_fb_hd)). For example, the support member (110_spn) may be formed of a material capable of absorbing electromagnetic noise that may be induced in the flexible substrate (110_fb). Additionally, or generally, the support member (110_spn) may serve to prevent movement of the flexible substrate (110_fb) while protecting the flexible substrate (110_fb) from external shocks. Another portion of the wiring portion (110_fb_bd) may be positioned between the auxiliary It can be mounted on a structure (110_bw_rg).

[0092] According to one embodiment, the wiring support member (110_fb_ad) may be disposed on one side of the flexible substrate (110_fb). For example, the wiring support member (110_fb_ad) may be disposed between the wiring portion (110_fb_bd) of the flexible substrate (110_fb) and the auxiliary structure (110_bw_rg). Alternatively, the wiring support member (110_fb_ad) may be disposed between a portion of the wiring portion (110_fb_bd) and the inclined surface of the auxiliary structure (110_bw_rg). The wiring support member (110_fb_ad) can prevent damage or deformation resulting from contact with the auxiliary structure (110_bw_rg) while the wiring portion (110_fb_bd) of the flexible substrate (110_fb) is disposed on the auxiliary structure (110_bw_rg). In this regard, the wiring support member (110_fb_ad) may include a layer of non-metallic material. Alternatively, the wiring support member (110_fb_ad) may include an adhesive member (e.g., at least one of a double-sided adhesive member or a single-sided adhesive member). If at least a portion of the wiring support member (110_fb_ad) includes a double-sided adhesive member, the wiring support member (110_fb_ad) may contact and adhere to the inclined surface of the auxiliary structure (110_bw_rg) and may adhere and fix a portion of the wiring portion (110_fb_bd) of the flexible substrate (110_fb). Additionally or generally, the wiring support member (110_fb_ad) may include a material capable of blocking or reducing electromagnetic noise generated by the antenna of the portable electronic device (100) from being induced into the flexible substrate (110_fb). In this regard, the wiring support member (110_fb_ad) may include a noise absorbing member capable of preventing, blocking, or reducing the induction of antenna noise.Alternatively, the wiring support member (110_fb_ad) may include a support layer capable of supporting the flexible substrate (110_fb) and a blocking layer (or noise absorbing member) capable of blocking electromagnetic noise generated by an antenna from being induced into the flexible substrate (110_fb) through the battery sidewall (110_bw1). Alternatively, the wiring support member (110_fb_ad) may include an absorbing member (e.g., shock and noise absorbing) capable of blocking antenna noise induced into the flexible substrate (110_fb) while having sufficient rigidity to support the flexible substrate (110_fb).

[0093] As described above, the portable electronic device (100) according to the embodiment of the present invention can block or reduce the transmission of electromagnetic noise generated by the operation of the antenna of the portable electronic device (100) to the socket body (110_sk_bd) after it is introduced into the support substrate (110_sco) by forming a part (e.g., a second support part (110_sco2)) of the support substrate (110_sco) that supports the socket body (110_sk_bd) of the socket structure (110_sk) from a non-metallic material. Additionally, the portable electronic device (100) can block or reduce electromagnetic noise induced by an antenna from entering the metallic battery sidewall among the surrounding structures where the battery (110_bat) is mounted and transmitted to the flexible substrate (110_fb) electrically connected to the socket structure (110_sk) by placing an auxiliary structure (110_bw_rg) made of a non-metallic material on the battery sidewall (e.g., the first battery sidewall (110_bw1)). Additionally, or generally, the portable electronic device (100) can prevent damage and deformation of the wiring portion (110_fb_bd) by placing a wiring support member (110_fb_ad) on a part of the flexible substrate (110_fb) (e.g., the part in contact with the auxiliary structure (110_bw_rg). Additionally, the portable electronic device (100) can prevent flow of at least a portion of the flexible substrate (110_fb) based on an adhesive wiring support member (110_fb_ad).

[0094] FIG. 12 is a drawing showing an example of a part configuration of a first deformation portable electronic device including a deformation assisting structure according to one embodiment.

[0095] Referring to FIGS. 1a through 12, the first deformable portable electronic device (100_ch1) may include at least a housing bottom portion (110_bt), a first battery sidewall (110_bw1), a first deformable auxiliary structure (110_bw_rg1), a first placement component (110_com1), and a flexible substrate (110_fb). Here, the first deformable portable electronic device (100_ch1) may further include at least some of the components of the previously described portable electronic device (100), excluding the components described above, such as the first deformable auxiliary structure (110_bw_rg1).

[0096] The first placement component (110_com1) may include, for example, the first circuit board described above (e.g., the first circuit board (110_pb2) of FIG. 10). Alternatively, the first placement component (110_com1) may include various electronic elements that can be placed at the bottom of the first housing (e.g., the first housing (110) of FIG. 4). As an example, the first placement component (110_com1) may include at least one of a camera module, a sensor module, or a speaker module.

[0097] As previously described in FIG. 5, the flexible substrate (110_fb) may include a substrate header (e.g., the substrate header (110_fb_hd) of FIG. 5) and a wiring portion (e.g., the wiring portion (110_fb_bd) of FIG. 5). In the illustrated drawings, only the wiring portion of the configuration of the flexible substrate (110_fb) is shown. A first portion of the flexible substrate (110_fb) may be positioned between the first placement component (110_com1) and the housing bottom portion (110_bt), a second portion of the flexible substrate (110_fb) may be positioned facing the first deformation auxiliary structure (110_bw_rg1), and a third portion of the flexible substrate (110_fb) may be positioned passing through the first battery sidewall (110_bw1). Although not shown, a battery may be placed on the right side of the first battery side wall (110_bw1).

[0098] At least a portion of one side (e.g., the side facing the -y-axis) of the first deformation auxiliary structure (110_bw_rg1) may include, for example, a second inclined surface having a second inclination. The second inclination may be formed with a larger angle of inclination than the first inclination of the auxiliary structure (110_bw_rg) described in FIG. 10 or FIG. 11. For the first deformation auxiliary structure (110_bw_rg1) of such a structure, the second inclination may increase (or decrease) as the gap between the first arrangement component (110_com1) and the first deformation auxiliary structure (110_bw_rg1) narrows.

[0099] Additionally, a wiring support member (e.g., the wiring support member (110_fb_ad) of FIG. 10) may be further disposed between the flexible substrate (110_fb) and the first deformation aid structure (110_bw_rg1), identical or similar to what was previously described in FIG. 10. The wiring support member (e.g., the wiring support member (110_fb_ad) of FIG. 10) may be made of a non-metallic material and may be formed of a foam, mesh, or rubber material capable of absorbing noise (or shock). Alternatively, the wiring support member (e.g., the wiring support member (110_fb_ad) of FIG. 10) may include a structure in which at least a portion thereof is provided with an adhesive component. Alternatively, at least a portion of the wiring support member may include a material capable of blocking or reducing electromagnetic noise generated from the flexible substrate (110_fb) while protecting the flexible substrate (110_fb) from shocks caused by contact with the battery sidewall. The material or characteristics of such a wiring support member (e.g., the wiring support member (110_fb_ad) of FIG. 10) may be applied in the same or similar way to the wiring support member (110_fb_ad) described earlier in FIG. 10.

[0100] FIG. 13 is a drawing showing an example of a configuration of a second deformation portable electronic device including a second deformation assisting structure according to one embodiment.

[0101] Referring to FIGS. 1a through 13, the second deformable portable electronic device (100_ch2) may include at least a housing bottom portion (110_bt), a first battery sidewall (110_bw1), a second deformable auxiliary structure (110_bw_rg2), a second placement component (110_com2) and a third placement component (110_com3), and a flexible substrate (110_fb). Here, the second deformable portable electronic device (100_ch2) may further include at least some of the components of the previously described portable electronic device (100), excluding the aforementioned components, such as the second deformable auxiliary structure (110_bw_rg2).

[0102] The second placement component (110_com2) or the third placement component (110_com3) may include, for example, the first circuit board described above (e.g., the first circuit board (110_pb2) of FIG. 10). As another example, the second placement component (110_com2) may be a circuit board fixed to the bottom portion (110_bt) of the housing, and the third placement component (110_com3) may include a circuit board placed spaced apart from the second placement component (110_com2). Alternatively, the second placement component (110_com2) or the third placement component (110_com3) may include various electronic elements that can be placed at the bottom of the first housing (e.g., the first housing (110) of FIG. 4). For example, the second placement component (110_com2) or the third placement component (110_com3) may include at least one of a camera module, a sensor module, and a speaker module.

[0103] As previously described in FIG. 5, the flexible substrate (110_fb) may include a substrate header (e.g., the substrate header (110_fb_hd) of FIG. 5) and a wiring portion (e.g., the wiring portion (110_fb_bd) of FIG. 5). In the illustrated drawings, only the wiring portion of the configuration of the flexible substrate (110_fb) is shown. A first portion of the flexible substrate (110_fb) may be positioned between the second placement component (110_com2) and the third placement component (110_com3), a second portion of the flexible substrate (110_fb) may be positioned facing a portion of the second deformation auxiliary structure (110_bw_rg2), and a third portion of the flexible substrate (110_fb) may be positioned passing through the first battery sidewall (110_bw1). Although not shown, a battery may be placed on the right side of the first battery side wall (110_bw1).

[0104] At least one surface of the second deformation assisting structure (110_bw_rg2) (e.g., a surface facing the -y-axis) may include, for example, a portion formed parallel to the first battery sidewall (110_bw1) and a third inclined surface facing the flexible substrate (110_fb) and having a third inclination. The third inclination may be set differently depending on the degree of curvature of the flexible substrate (110_fb). For example, among the surfaces facing the second deformation assisting structure (110_bw_rg2) and the third placement component (110_com2) and the third placement component (110_com3), the portion facing the flexible substrate (110_fb) may have an inclined surface (or a third inclined surface) formed at least partially. A wiring support member (e.g., wiring support member (110_fb_ad) of FIG. 10) may be further disposed between the flexible substrate (110_fb) and the second deformation auxiliary structure (110_bw_rg2) having the inclined surface (or partial inclined surface) formed thereon. The wiring support member (e.g., wiring support member (110_fb_ad) of FIG. 10) may be made of a non-metallic material and may be formed of a shock-absorbing foam, mesh material, or rubber material. Alternatively, the wiring support member (e.g., wiring support member (110_fb_ad) of FIG. 10) may include a structure in which at least a portion is disposed with an adhesive component.

[0105] FIG. 14 is a drawing showing an example of a part configuration of a third modified portable electronic device in which the position of the socket structure according to one embodiment is changed.

[0106] Referring to FIGS. 1a through 14, the third modified portable electronic device (100_ch3) illustrates only some components related to the embodiment of the present description in contrast to the portable electronic device (100) described above in FIGS. 1 through 5. Accordingly, the third modified portable electronic device (100_ch3) shown in FIG. 14 may include at least some components of the components described above in FIGS. 1 through 13. Additionally, although the illustrated drawings show the third modified portable electronic device (100_ch3) as including only the first housing (110), the embodiment of the present description is not limited thereto. For example, the third modified portable electronic device (100_ch3) may further include a second housing and a hinge device connecting the second housing and the first housing, as described above in other drawings, and a second housing placement element disposed within the second housing.

[0107] According to one embodiment, the third deformable portable electronic device (100_ch3) may include at least a first housing (110), a battery (110_bat), a deformable flexible substrate (110_fb_ch), a deformable circuit board (110_pb2_ch), a deformable socket structure (110_sk_ch), or a deformable support substrate (110_sco_ch).

[0108] The first housing (110) may include a connector port (107) and a battery placement space (110_bat_s) in which a battery (110_bat) is placed. Additionally, the first housing (110) may further include a plurality of slits (e.g., a plurality of slits (113_sl1, 113_sl2, 113_sl3) of FIG. 5), a plurality of sidewall portions that can be used as antennas (e.g., a plurality of sidewall portions (113_at1, 113_at2, 113_at3) of FIG. 5), and a plurality of battery sidewalls (e.g., a plurality of battery sidewalls (110_bw1, 110_bw2, 110_bw3, 110_bw4) of FIG. 5), as previously described in FIG. 5. The battery (110_bat) may be placed in the battery placement space (110_bat_s). A substrate placement space (110_pb2_s) may be formed in which the modified circuit board (110_pb2_ch) is disposed between at least one of the first battery side wall (110_bw1) and the side wall portions (113_at1, 113_at2, 113_at2) among the side walls surrounding the battery placement space (110_bat_s) of the battery (110_bat).

[0109] The deformable circuit board (110_pb2_ch) can be fixed to the bottom of the housing while being seated in the substrate placement space (110_pb2_s). A substrate connector (110_pb2_cn) to which the deformable substrate header (110_fb_hd_ch) of the deformable flexible substrate (110_fb_ch) is coupled can be disposed on one side of the deformable circuit board (110_pb2_ch). A deformable socket structure (110_sk_ch) can be disposed on one side of the deformable circuit board (110_pb2_ch). The deformable socket structure (110_sk_ch) can be electrically connected to the substrate connector (110_pb2_cn) through wiring formed on the deformable circuit board (110_pb2_ch). Accordingly, the deformation substrate header (110_fb_hd_ch) is coupled to the substrate connector (110_pb2_cn) and can be electrically connected to the deformation socket structure (110_sk_ch) through the deformation circuit board (110_pb2_ch).

[0110] The deformable flexible substrate (110_fb_ch) may be connected to the deformable circuit board (110_pb2_ch) through the deformable substrate header (110_fb_hd_ch). For example, the deformable substrate header (110_fb_hd_ch) may be coupled to the substrate connector (110_pb2_cn) of the deformable circuit board (110_pb2_ch). At least a portion of the deformable flexible substrate (110_fb_ch) may be placed on the upper surface (or the lower surface with the z-axis as the upper side) of the battery (110_bat). As an example, the deformable flexible substrate (110_fb_ch) may be electrically connected to a second circuit board (e.g., the second circuit board (110_pb1) of FIG. 3) placed on the top of the first housing (110).

[0111] According to one embodiment, the deformation socket structure (110_sk_ch) may be placed on the deformation circuit board (110_pb2_ch). When the deformation circuit board (110_pb2_ch) is seated in the board placement space (110_pb2_s), the deformation socket structure (110_sk_ch) may be aligned with at least a portion of the connector port (107) in the xy plane. Alternatively, the deformation socket structure (110_sk_ch) may be observed through the connector port (107). For example, at least a portion of the deformation socket structure (110_sk_ch) may be placed in the internal hole area of ​​the connector port (107).

[0112] The deformation support substrate (110_sco_ch) may include a first deformation support portion (110_sco1_ch) and a second deformation support portion (110_sco2_ch). The first deformation support portion (110_sco1_ch) may be positioned to cover at least a portion of the deformation circuit board (110_pb2_ch). Alternatively, the deformation support substrate (110_sco_ch) may be positioned to fix the deformation circuit board (110_pb2_ch) positioned between the first housing (110). In this regard, the deformation support substrate (110_sco_ch) may be coupled to the first housing (110) by a coupling means with the deformation circuit board (110_pb2_ch) in between. Here, the second deformation support portion (110_sco2_ch) may be positioned to press at least a portion of the deformation socket structure (110_sk_ch). For example, the structure of the region in contact with the deformation socket structure (110_sk_ch) among the deformation support substrates (110_sco_ch) (or the region pressing the deformation socket structure (110_sk_ch)) may include a structure substantially identical to the second substrate region (110_sco_p2) of FIG. 6. For instance, one edge of the first deformation support portion (110_sco1_ch) may form a curve, and the second deformation support portion (110_sco2_ch) may be formed so as to overlap at least a portion with the curve of the first deformation support portion (110_sco1_ch) (e.g., the curve (110_sco_cv) of FIG. 6). In response to this, while the deformation support substrate (110_sco_ch) presses the deformation socket structure (110_sk_ch), the non-metallic material can more firmly support the deformation socket structure (110_sk_ch) in the z-axis direction by means of elasticity, as the second deformation support portion (110_sco2_ch) comes into contact with the deformation socket structure (110_sk_ch).

[0113] Meanwhile, for a first housing (110) having a structure in which a deformable socket structure (110_sk_ch) described in FIG. 14 is disposed on a deformable circuit board (110_pb2_ch), an auxiliary structure (110_bw_rg) described in FIG. 10 to 13 may be applied in the same or similar manner. For example, an auxiliary structure (110_bw_rg) described in FIG. 10 to 13 may be disposed on the first battery sidewall (110_bw1) to support at least a portion of the deformable flexible substrate (110_fb_ch). Here, the auxiliary structure (110_bw_rg) disposed at a position adjacent to the first battery sidewall (110_bw1) of FIG. 14 and the deformable flexible substrate (110_fb_ch) may include at least one of a shock-absorbing member, a double-sided adhesive member, and a non-conductive tape.

[0114] FIG. 15 shows the H-Field simulation results of a portable electronic device according to one embodiment and a comparison group. For example, the simulation in FIG. 15 shows the H-Field when transmitting a signal (TX) in the LTE B5 frequency band of the LB (Low-band) band.

[0115] Referring to FIG. 15, it can be seen that the H-Field measurements at points 1, 2, and 3 of the electronic device of Comparison 1 are 41, 21, and 115, respectively, and the H-Field values ​​at points 1, 2, and 3 of the portable electronic device according to an embodiment of the present invention (e.g., at least one of 100, 100_ch1, 100_ch2, ​​and 100_ch3) are 27, 18, and 116, respectively, and the H-Field values ​​at points 1, 2, and 3 of the electronic device of Comparison 2 are 43, 22, and 116, respectively. When comparing the aforementioned Comparison 1 and Comparison 2 with the portable electronic device according to the embodiment of the present invention (e.g., at least one of 100, 100_ch1, 100_ch2, ​​and 100_ch3), it can be confirmed that noise induced in the socket structure or flexible substrate is reduced, as better H-Field values ​​(relatively lower noise values) appear at points 1 and 2. For example, it can be seen that the noise level is reduced by about 34% in the structure of the portable electronic device according to the embodiment of the present invention (e.g., at least one of 100, 100_ch1, 100_ch2, ​​and 100_ch3). Through this, it can be seen that the noise blocking effect of the portable electronic device according to the embodiment of the present invention (e.g., at least one of 100, 100_ch1, 100_ch2, ​​and 100_ch3) is improved compared to the comparison groups.

[0116] As described above, the portable electronic device (100) according to the embodiment of the present invention may provide a structure in which a support substrate (110_sco) that presses and fixes a socket structure (110_sk) (e.g., USB socket structure) and a surrounding electrical object (e.g., first circuit board (110_pb2)) together is formed from a non-metallic material (e.g., injection molding) at least a portion that overlaps with the socket structure (110_sk) to reduce noise ingress, and another portion of the support substrate (110_sco) is formed from a metallic material (e.g., SUS) to maintain rigidity. In one embodiment, the portable electronic device (100) of the present invention may provide a structure that increases rigidity by providing a plurality of support holes (110_sco_h) in the support substrate (110_sco) to support an injection-mold assembly structure. In addition, the first support portion (110_sco1) formed of a metal material of the support substrate (110_sco) is connected to the first housing (110) of a metal material through a screw, thereby connecting to the ground of the first circuit board (110_pb2) and the ground of the second circuit board (110_pb1), and thus securing electrical stability of the structure. The above-described structure supports securing ground of the socket structure (110_sk) in an environment where the outer shell of the socket structure (110_sk) is removed and grounding performance is insufficient, thereby reducing wireless signal interference (or noise).

[0117] In addition, the portable electronic device according to an embodiment of the present invention can improve performance deviations for each device that occur depending on the arrangement shape of the flexible substrate (e.g., FPCB connected to a USB socket) by arranging a part of the battery sidewall auxiliary structure to support or fix the flexible substrate. Alternatively, the portable electronic device according to an embodiment of the present invention can reduce antenna noise ingress into the flexible substrate by separating the front metal (or the part of the first housing (110) used as an antenna) into which noise is introduced through the auxiliary structure from the battery sidewall. In addition, the portable electronic device according to an embodiment of the present invention can improve (or block) antenna noise induction by forming at least a part of the support substrate with a non-metallic material. Additionally, or generally, a support member (110_spn) in the form of a non-conductive tape or an absorber tape can be placed between the flexible substrate (110_fb) and the auxiliary structure (110_bw_rg) to reduce (or block, improve) the inflow of ambient electromagnetic noise (e.g., electromagnetic noise resulting from the operation of the antenna of the portable electronic device (100)) that may be induced in the flexible substrate (110_fb). Additionally, the substrate support member (110_spn) in the form of an absorber tape can prevent damage or deformation of the flexible substrate (110_fb), and can maintain the performance of the flexible substrate (110_fb) consistently by improving the fixing performance of the flexible substrate or by uniformizing the arrangement shape of the flexible substrate (110_fb) for each portable electronic device.

[0118] As described above, a portable electronic device according to one embodiment comprises a socket structure (110_sk), a first housing (110) configured such that a connector port (107) associated with the socket structure is formed and at least a portion thereof is used as an antenna, a first circuit board (110_pb2) disposed at a first position of the first housing, a flexible substrate (110_fb) connected to the first circuit board and the socket structure, and a support substrate (110_sco) that supports the socket structure while supporting the first circuit board, wherein the support substrate may include a first support portion (110_sco1) formed of a metal material and disposed to overlap at least a portion of the first circuit board with respect to a first direction, and a second support portion (110_sco2) formed of a non-conductive material that is coupled to the first support portion and overlaps at least a portion thereof with the socket structure with respect to the first direction.

[0119] According to one embodiment, the support substrate may include a curved portion (110_sco_cv) that is bent to have elasticity at one edge of the first support portion connected to the second support portion.

[0120] According to one embodiment, at least a portion of the curved portion may be positioned to overlap with at least a portion of the second support portion with respect to the first direction.

[0121] According to one embodiment, the first support portion may include a plurality of support holes (110_sco_h) penetrating the front and rear surfaces of at least a portion of the curved portion.

[0122] According to one embodiment, at least a portion of the second support portion may be formed to fill (or cover) at least a portion of the plurality of support holes.

[0123] According to one embodiment, the connection portion between the first support portion and the second support portion can form a stacked structure based on the first direction.

[0124] According to one embodiment, the first housing includes a substrate placement space (110_pb2_s) in which the first circuit board is placed, and the substrate placement space includes a housing bottom part (110_bt) made of metal material and a housing injection bottom part (110_rg_bt) made of non-metal material, and the flexible substrate may include a substrate header (110_fb_hd) placed on the housing injection bottom part and a wiring part (110_fb_bd) connected to one side of the substrate header.

[0125] According to one embodiment, the socket structure includes a socket header (110_sk_hd) in which at least a portion is disposed within the connector port, and a socket body (110_sk_bd) connected to the socket header and in contact with a second support portion of the support substrate, and the socket body may be disposed on the substrate header.

[0126] According to one embodiment, the socket body can be mounted on the substrate header by soldering.

[0127] According to one embodiment, the portable electronic device further comprises a battery (110_bat) disposed within the first housing, and the first housing may include at least one battery sidewall (110_bw1) formed of a metal material and disposed to face the edge of the battery, and an auxiliary structure (110_bw_rg) formed of a non-metal material on the battery sidewall and facing a part of the flexible substrate.

[0128] According to one embodiment, the auxiliary structure may be formed as an injection molded product.

[0129] According to one embodiment, the auxiliary structure may include a first inclined surface on which the flexible substrate is disposed.

[0130] According to one embodiment, the auxiliary structure may include an inclined surface with a different degree of inclination corresponding to the gap between the flexible substrate and the first circuit board.

[0131] According to one embodiment, a wiring support member (110_fb_ad) disposed between the auxiliary structure and the flexible substrate may be further included.

[0132] According to one embodiment, the wiring support member may be formed as a noise absorbing member.

[0133] According to one embodiment, the wiring support member may be formed as a single-sided adhesive member.

[0134] According to one embodiment, the portable electronic device further includes a second circuit board disposed at a second position of the housing, and the flexible board may be disposed to functionally connect the first circuit board and the second circuit board.

[0135] As described above, a portable electronic device according to one embodiment comprises a socket structure (110_sk_ch), a first housing (110) configured such that a connector port (107) associated with the socket structure is formed and at least a portion thereof is used as an antenna, a first circuit board (110_pb2_ch) disposed at a first position of the first housing and having the socket structure mounted (or fixed thereon), a flexible substrate (110_fb_ch) connected to the first circuit board, and a support substrate (110_sco_ch) that supports the socket structure while supporting the first circuit board, wherein the support substrate may include a first support portion (110_sco1_ch) formed of a metal material and disposed to overlap the first circuit board with respect to a first direction, and a second support portion (110_sco2_ch) formed of a non-conductive material that is coupled to the first support portion and overlaps at least a portion thereof with the socket structure with respect to the first direction.

[0136] According to one embodiment, the support substrate may include a curved portion (110_sco_cv) that is bent to have elasticity at one edge of the first support portion connected to the second support portion.

[0137] According to one embodiment, the portable electronic device further comprises a battery (110_bat) disposed within the first housing, and the first housing may include at least one battery sidewall (110_bw1) formed of a metal material and disposed to face the edge of the battery, and an auxiliary structure (110_bw_rg) formed of a non-metal material on the battery sidewall and facing a part of the flexible substrate.

[0138] According to one embodiment, the electronic devices of the various embodiments disclosed herein may include mobile communication electronic devices and may be provided as part of a computer program product related to the operation of the mobile communication electronic device. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0139] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a portable electronic device, Socket structure(110_sk); A first housing (110) configured such that a connector port (107) related to the above socket structure is formed and at least a portion is used as an antenna; A first circuit board (110_pb2) disposed at a first position of the first housing; A flexible substrate (110_fb) connecting the first circuit board and the socket structure; It includes a support board (110_sco) that supports the socket structure while supporting the first circuit board, and The above-mentioned support substrate is, A first support portion (110_sco1) formed of a metal material and arranged to overlap with the first circuit board based on the first direction; A portable electronic device characterized by including: a second support portion (110_sco2) formed of a non-conductive material that is combined with the first support portion and overlaps at least a portion with the socket structure with respect to the first direction.

2. In Paragraph 1, A portable electronic device characterized in that one edge of the first support part connected to the second support part includes a curved portion (110_sco_cv) that is bent to have elasticity.

3. In Paragraph 2, A portable electronic device characterized in that at least a portion of the above-mentioned curved portion is positioned to overlap with at least a portion of the second support portion with respect to the first direction.

4. In Paragraph 2, The above first support part A portable electronic device characterized by including a plurality of support holes (110_sco_h) penetrating the front and rear surfaces of at least some area including the above-mentioned curved portion.

5. In Paragraph 4, At least a portion of the second support part is A portable electronic device characterized by being formed to cover the plurality of support holes mentioned above.

6. In Paragraph 1, A portable electronic device characterized in that the connecting portion between the first support portion and the second support portion forms a stacked structure based on the first direction.

7. In Paragraph 2, The above first housing is It includes a substrate placement space (110_pb2_s) in which the first circuit board is placed, and The above substrate placement space is, It includes a housing bottom part (110_bt) made of metal material and a housing injection bottom part (110_rg_bt) made of non-metal material, and The above flexible substrate is A substrate header (110_fb_hd) disposed on the bottom portion of the above-mentioned housing injection molding; and A portable electronic device characterized by including a wiring portion (110_fb_bd) having one side connected to the above-mentioned substrate header.

8. In Paragraph 7, The above socket structure is, A socket header (110_sk_hd) having at least a portion disposed within the connector port; and It includes a socket body (110_sk_bd) that is connected to the socket header and contacts the second support portion, and A portable electronic device characterized by the socket body being disposed on the substrate header.

9. In Paragraph 8, A portable electronic device characterized in that the above socket body is mounted on the above substrate header through soldering.

10. In Paragraph 1, It further includes a battery (110_bat) disposed within the first housing, and The first housing above is, At least one battery side wall (110_bw1) formed of a metal material and positioned to face the edge of the battery; A portable electronic device characterized by including an auxiliary structure (110_bw_rg) formed on the battery sidewall, formed of a non-metallic material, and facing a part of the flexible substrate.

11. In Paragraph 10, The above auxiliary structure is formed as an injection molded product, and A portable electronic device characterized by including a first inclined surface on which the flexible substrate is disposed, and including an inclined surface with a different degree of inclination corresponding to the gap between the flexible substrate and the first circuit board.

12. In Paragraph 10, A portable electronic device characterized by further including a wiring support member (110_fb_ad) disposed between the above auxiliary structure and the above flexible substrate.

13. In Paragraph 12, A portable electronic device characterized in that the above-mentioned wiring support member is formed as a noise-absorbing member.

14. In Paragraph 12, A portable electronic device characterized in that the above wiring support member is formed as a single-sided adhesive member.

15. In Paragraph 1, It further includes a second circuit board disposed at a second position of the above housing, and A portable electronic device characterized in that the flexible substrate is positioned to functionally connect the first circuit board and the second circuit board.

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