Sticker element and powered integrated circuit component

Abstract

The present disclosure presents in various aspects a sticker element and a powered integrated circuit component with at least one such sticker element. In illustrative embodiments herein, a a sticker element is provided. In the illustrative embodiments of the first aspect, the sticker element comprises a substrate, preferably a substrate pouch, with at least two contact terminals exposed in at least one outer main surface of the substrate, an electrical battery arrangement completely included into the substrate, and an adhesive layer formed directly on at least a portion of at least one of the exposed outer main surfaces of the substrate. Herein, the electrical battery arrangement comprises a cathode comprising a cathode-side current collector and a cathode-side active material over the cathode-side current collector, an anode comprising an anode-side current collector and an anode-side active material over the anode-side current collector, and an electrolyte layer over at least one of the cathode-side active material and the anode-side active material. Furthermore, the cathode-side current collector is electrically connected to at least a first of the contact terminals for providing at least one cathode contact terminal and the anode-side current collector is electrically connected to at least a second of the contact terminals for providing at least one anode contact terminal.

Description

[0001] Sticker Element and Powered Integrated Circuit Component

[0002] Field of the Disclosure

[0003] The present disclosure relates to a sticker element and a powered integrated circuit component with at least one such sticker element. In particular, the present disclosure relates to a battery structure provided by the sticker element for an actively powered integrated circuit component, such as an active RFID component, a tracker component, a throwaway electronic component etc.

[0004] Technological Background

[0005] Tags and labels are increasingly used for monitoring and tracking items. Typically, tags and labels suitable fortracking and monitoring may comprise a radio-frequency identification (RFID) component. The RFID component may be actively powered, thereby providing active RFID tags or labels, or passively powered, thereby providing passive RFID tags or labels. Passive RFID tags or labels have no internal power source and are used exclusively in environments such as retail, whereas active RFID tags or labels are self-powered by further including a battery, allowing continuous transmission of signals and / or continuous powering of a processor and / or a memory included into the tag or label.

[0006] In many applications, active RFID tag or labels come equipped with a battery and an internal transmitter, e.g., in the form of a beacon or transponder. Such an active tag or label is able to continuously transmit signals to an RFID reader up to 150 meters away, depending on frequency levels. Equipping active RFID tags or labels with a power source, such as a battery component, costs are considerably increased. Furthermore, battery components for such labels or tags are bulky and make handling of such tags or labels inconvenient, as well as possibly making a housing for accommodating the battery necessary. Despite of the increased costs of active RFID tags or labels compared to passive RFID tags or labels, this makes the use of an active RFID tag or label popular among businesses wanting to track assets in real-time and build an accurate real-time location system (RTLS).

[0007] Document EP 1030240 A2 shows an electronic price label comprising a housing, circuitry within the housing including a volatile memory, and a battery storage apparatus within the housing. The battery storage apparatus includes a first electrical contact for simultaneously providing a first electrical path to first polarity sides of a plurality of batteries, a second electrical contact for simultaneously providing a second electrical path to second polarity sides of the plurality of the batteries, and a retainer which maintains at least a single one of the batteries in contact with the first and second electrical contacts during removal of a number of other batteries in order to maintain power to the memory.

[0008] In view of the above described situation, it is desirable to provide a sticker element suitable for powering an actively powered integrated circuit component and an actively powered integrated circuit component.

[0009] Brief Summary of the Disclosure

[0010] The above described problems and issues are solved by a sticker element in accordance with independent claim 1, more illustrative embodiments being defined in the dependent claims 2 to 10. Furthermore, at least some of the above described issues are solved by a powered integrated circuit component in accordance with at least one of independent claims 11 to 16.

[0011] In the present disclosure, a battery is understood as representing a device that converts the chemical energy contained in its active materials directly into electric energy by means of an electrochemical oxidation-reduction (redox) reaction. A redox reaction involves the transfer of electrons from one material to another through an electric circuit. While the term “battery” is often used, the basic electrochemical unit being referred to is the “cell.” A battery consists of one or more of these cells, connected in series or parallel, or both, depending on the desired output voltage and capacity. The cell consists of three major components, an anode or negative electrode (also referred to as reducing orfuel electrode) which sup-plies electrons to an external circuit (the anode is oxidized during the electrochemical reaction), a cathode or positive electrode (also referred to as oxidizing electrode) which accepts electrons from the external circuit (the cathode is reduced during the electrochemical reaction), and an electrolyte (functioning as ionic conductor) which provides the medium for transfer of charge (as ions) inside the cell between the anode and cathode. Anode and cathode electrodes are electronically isolated in the cell to prevent internal short-circuiting, but are surrounded by the electrolyte.

[0012] In various aspects of the present disclosure, a battery cell has a sequence of patterned or unpatterned sheets or rolls of thermoplastics (e.g., PVC, PC, PLA, PS, PET or others) which may be laminated together into a laminated structure providing a pouch. Cavities may be provided within the sheets being filled with redox active materials to form the battery cell structure. Herein, individual layers of the sequence of sheets may have predefined functionalities, for example outer layers having etched or printed or wire embedded contacts, current collectors, interior layers interposed between outer layers having and / or acting as a membrane. Some layers may be redox active layers comprising redox active composites or materials so as to form battery half-cells and, when combined into the laminated structure, a full battery cell structure functioning as a battery cell is provided. A chemistry for the battery cell may depend on the intended use and requirements for the battery cell, e.g., use as primary or secondary cells. For example, the chemistry may be determined by Leclanche, alkaline, AgO, Lilon, LiPolymer etc. The redox active materials can be either dispensed during fabrication of the battery cell in a respective receptacle formed by a respective cavity in a layer provided on another layer closing the cavity on one side, e.g., the redox active material being provided as a slurry. Alternatively, the redox active material may be inserted into a cavity when provided as a prepatterned film adapted for insertion into the cavity or receptacle, or it may be laminated as a prepatterned film or printed onto an outer layer. Furthermore, halfcells in the battery cell may be separated by a membrane for only allowing conductive ions passing among the half-cells in the battery cell. Ideally, the membrane may be laminated to the receptacles and is chemically inert to electrolyte material in the battery cell structure, where the electrolyte may be applied onto the membrane by dispensing and / or it may be of a gel type to prevent unintentional leakage. For example, wires of the current collectors may be bare wires or coated with different metals (e.g., Sn, Ag, Ni, Au, bi or ternary alloys, or alloys comprising at least one of these listed metals) before embedding into the outer layers to increase chemical resistance to the anode and cathode materials or for injection reasons. The laminated structure may be obtained by pressing (hot or cold) during lamination. The process for fabricating the battery cell may employ smart card manufacturing processes.

[0013] The present disclosure provides for substrates which may be provided in accordance with smart card technologies (e.g., lamination, cutouts, wire embedding, etc.), therefore these substrates being compatible with smart card fabrication techniques and battery cell structures fabricated on the basis of these substrates being compatible with smart card technologies. On the other hand, advantages of smart card fabrication techniques may be employed in the fabrication of battery cells such that battery cells may be fabricated with high fabrication volume and under high reproducibility. Furthermore, very flat or planar battery cells may be provided as sticker elements, e.g., planar and / or flexible battery cells, and / or battery cells may be easily integrated into the fabrication of smart cards such that it becomes possible to manufacture a battery cell as a sticker element in an easy and cost-efficient manner. For example, the sticker elements in accordance with the present disclosure make use of the flatness and the possibility to manufacture a battery cells in roll to roll or large size sheets in combination with converting methods. Battery cells of any shape and size can be designed and printed. Furthermore, battery cells may be easily combined because the setup of the batteries can be either stacked or coplanar. Coplanar has the advantage of simple design and only a few layers. A battery cell in accordance with the present disclosure may have an adhesive layer on at least one side which allows to stick the battery cell on a substrate or PCB as a power sticker. Parts of the adhesive layer may be conductive and act as electrical connection to the substrate.

[0014] In a first aspect of the present disclosure, a sticker element is provided. The sticker element may be a sheet-type sticker element, e.g., a thickness of the sticker element along a direction perpendicular to a main surface of the sticker element being smaller than a smallest of a width and length dimension of the sticker element (width and length mutually perpendicular to the thickness) by a at least a factor of 10 or 20 or 50 or 100. In the illustrative embodiments of the first aspect, the sticker element comprises a substrate, preferably a flexible substrate, more preferably a substrate pouch, with at least two contact terminals exposed in at least one outer main surface of the substrate, an electrical battery arrangement completely included (such as integrated, e.g., laminated) into the substrate, and an adhesive layer formed directly on at least a portion of at least one of the exposed outer main surfaces of the substrate. Herein, the electrical battery arrangement comprises a cathode comprising a cathode-side current collector and a cathode-side active material over the cathode-side current collector, an anode comprising an anode-side current collector and an anode-side active material over the anode-side current collector, and an electrolyte layer over at least one of the cathode-side active material and the anode-side active material. Furthermore, the cathode-side current collector is electrically connected to at least a first of the contact terminals for providing at least one cathode contact terminal and the anode-side current collector is electrically connected to at least a second of the contact terminals for providing at least one anode contact terminal.

[0015] A main surface may be understood as a surface of the substrate having a maximum surface area when viewed along a projective view along a direction perpendicular to the surface (i.e., along a normal direction of said surface). It is understood that the substrate has two opposite main surfaces separated by at least one circumferential surface with a surface area determined along a projective view onto the at least one circumferential surface smaller than the surface area of at least one of the two oppositely arranged main surfaces.

[0016] In case of providing the substrate as a substrate pouch, the substrate is flexible or foldable. For example, the substrate may be folded to provide a pouch into which the electrical battery arrangement is included and accommodated. The electrical battery arrangement may be provided on one of the main surfaces of the unfolded substrate and the substrate may be folded to form the pouch.

[0017] The first aspect may provide a sticker element for use as a power sticker providing a low cost selfassembling battery cell in the form of a sticker for low cost electronics. Such sticker elements may be suitable for placing on contact pads of an integrated circuit provided on a PCB or other substrate to power the integrated circuit. The sticker element may be provided by a flexible tape or sheet comprising a plurality of such sticker elements. In some illustrative examples, one side of the sticker element may be equipped with an adhesive layer where at least two regions are designed to be conductive and act as electrical contact between the sticker element and a PCB or the consumer circuit, suitable for establishing an electrical connection by a sticking process.

[0018] Advantageously, the sticker element is thin and flexible and can be assembled to any substrate with standard assembly machines. In other advantages, no soldering, welding, crimping or rivets are necessary for assembly of the sticker element with a PCB or consumer circuit. The sticker element may allow for a stacked or coplanar geometry and / or be a series connection of several sticker elements (as individual battery cells) to achieve higher operational voltages.

[0019] In some illustrative embodiments of the first aspect, the sticker element may further comprise a plurality of electrically conductive adhesion pads, each of the plurality of electrically conductive adhesion pads being formed on an associated one of the at least two contact terminals. Accordingly, easy electrical connection may be established by the electrically conductive adhesion pads without the need for soldering, welding, crimping or rivets.

[0020] In some other illustrative embodiments of the first aspect, the substrate may have only two contact terminals, the two contact terminals being formed in only one outer main surface of the substrate. For example, the contact terminals may be provided by exposed end portions of each of the cathode-side current collector and the anode-side current collector. Accordingly, a single-sided contactable sticker element may be provided where contacting on only one side is possible, while the sticker element allows for electrical isolation as contacts are only provided on one side.

[0021] In some other illustrative embodiments of the first aspect, the substrate may have at least two contact terminals formed in each of two opposing outer main surfaces of the substrate and at least two via element extending in the substrate, each two contact terminals being in alignment with each other on the opposing outer main surfaces are connected by an associate via element of the at least two via elements extending between the two opposing outer main surfaces and electrically interconnecting the aligned two contact terminals. Accordingly, the sticker element may have double-sided contacts, allowing easy combination of plural sticker elements in stacking arrangements. In special illustrative examples herein, a first pair of aligned contact terminals may be interconnected by a first via element of the at least two via elements and a second pair of aligned contact terminals may be interconnected by a second via element of the at least two via elements. For example, one of the first pair of aligned contact terminals and the first via element may be in mechanical contact with one of the cathode-side current collector and the anode-side current collector, and one of the second pair of aligned contact terminals and the second via element may be in mechanical contact with the other one of the cathode-side current collector and the anodeside current collector. In some more illustrative examples herein, the sticker element may further comprise at least one third pair of aligned contact terminals interconnected by a third via element, the third pair of contact terminals being electrically disconnected from any of the first and second pairs of aligned contact terminals. In some more illustrative alternative examples herein, the sticker element may further comprise a third pair of aligned contact terminals interconnected by a third via element and a fourth pair of aligned contact terminals interconnected by a fourth via element, wherein each of the third and fourth pairs of contact terminals are electrically islanded pairs of aligned contact terminals, each of which being electrically disconnected from any other of the pairs of aligned contact terminals. For example, the first to fourth pairs of aligned contact terminals may be arranged in top view in alignment with corners of a polygon, such as a regular polygon.

[0022] In a second aspect of the present disclosure, a powered integrated circuit component is provided. In illustrative embodiments of the second aspect, the powered integrated circuit comprises a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having at least two power supply contact pads exposed in at least one main surface of the base substrate, and at least one sticker element attached to the base substrate for contacting the at least two power supply contact pads, wherein each of the at least one sticker element is provided in accordance with the sticker element of the first aspect. Any pair of power supply contact pads is electrically connected with an associated pair of anode and cathode contact terminals of the at least one sticker element.

[0023] In a third aspect of the present disclosure, a powered integrated circuit component is provided In illustrative embodiments of the third aspect, the powered integrated circuit comprises a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having two power supply contact pads exposed in one main surface of the base substrate, and the sticker element of the first aspect attached to the base substrate for bringing the two power supply contact pads into electrical contact with the anode and cathode contact terminals.

[0024] In a fourth aspect of the present disclosure, a powered integrated circuit component is provided In illustrative embodiments of the fourth aspect, the powered integrated circuit comprises a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having four power supply contact pads exposed in one main surface of the base substrate, and two sticker elements, each of which being provided in accordance with the first aspect attached to the base substrate for bringing each two power supply contact pads into electrical contact with each pair of anode and cathode contact terminals. The integrated circuit has conductive track lines routed for connecting the four power supply contact pads such that an electrical series connection of the two sticker elements is provided.

[0025] In a fifth aspect of the present disclosure, a powered integrated circuit component is provided In illustrative embodiments of the fifth aspect, the powered integrated circuit comprises a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having two power supply contact pads exposed in one main surface of the base substrate, and two sticker elements, each of which being provided in accordance with the first aspect. Herein, a first sticker element of the two sticker elements is attached to the base substrate for bringing the two power supply contact pads into electrical contact with aligned pairs of contact terminals of the first sticker element connecting to the pairs of anode and cathode contact terminals of the first sticker element. A second sticker element of the two sticker elements is arranged in a stacking arrangement on the first sticker element so as to bring the aligned pair of contact terminals of the first sticker element connecting to the pairs of anode and cathode contact terminals of the first sticker element into contact with aligned pairs of contact elements of the second sticker element connecting to the pairs of anode and cathode contact terminals of the second sticker element.

[0026] In a sixth aspect of the present disclosure, a powered integrated circuit component is provided In illustrative embodiments of the sixth aspect, the powered integrated circuit comprises a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having two power supply contact pads exposed in one main surface of the base substrate, and at least two sticker elements, each of which being provided in accordance with the first aspect. Herein, a first sticker element of the at least two sticker elements is attached to the base substrate for bringing the two power supply contact pads into electrical contact with first and second aligned pairs of contact terminals of the first sticker element, the first pair of aligned pairs of contact terminals connecting to one pair of pairs of anode and cathode contact terminals of the first sticker element, the second pair of aligned pairs of contact terminals being an islanded pair. A second sticker element of the at least two sticker elements is arranged in a stacking arrangement on the first sticker element so as to bring the first pair into contact with an islanded pair of aligned pairs of contact terminals of the second sticker element, while bringing the second pair into contact with a pair of aligned pairs of contact terminals of the second sticker element connecting to one pair of pairs of anode and cathode contact terminals of the second sticker element having opposite polarity with respect to the first pair. In a seventh aspect of the present disclosure, a powered integrated circuit component is provided In illustrative embodiments of the seventh aspect, the powered integrated circuit comprises a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having two power supply contact pads exposed in one main surface of the base substrate, and three sticker elements, each of which being provided in accordance with the first aspect. Herein, a first sticker element of the three sticker elements is attached to the base substrate for bringing the two power supply contact pads into electrical contact with first and second aligned pairs of contact terminals of the first sticker element, the first pair of aligned pairs of contact terminals being an islanded pair, the second pair of aligned pairs of contact terminals connecting to one pair of pairs of anode and cathode contact terminals of the first sticker element. A second sticker element of the three sticker elements is arranged in a stacking arrangement on the first sticker element so as to bring the first pair into contact with an islanded pair of aligned pairs of contact terminals of the second sticker element, while bringing the second pair into contact with another islanded pair of aligned pairs of contact terminals of the second sticker element, while bringing the other one pair of pairs of anode and cathode contact terminals of the first sticker element into contact with an aligned pair of contact terminals of the second sticker element connecting to one pair of pairs of anode and cathode contact terminals of the second sticker element having opposite polarity with respect to the other one pair of pairs of anode and cathode contact terminals of the first sticker element. Furthermore, a third sticker element of the three sticker elements is arranged in the stacking arrangement on the second sticker element so as to bring the islanded pair of aligned pairs of contact terminals of the second sticker element into contact with one pair of pairs of anode and cathode contact terminals of the third sticker element having opposite polarity with respect to the second pair, while bringing the other one pair of pairs of anode and cathode contact terminals of the third sticker element having same polarity as the second pair into contact with the pair of pairs of anode and cathode contact terminals of the second sticker element having opposite polarity with respect to the second pair.

[0027] The first to seventh aspects as described above are not necessarily understood as separate and unrelated, but may be understood as being interrelated. Accordingly, the disclosure presented above explicitly in the context of one aspect of the first to seventh aspects may apply to at least one other of the first to seventh aspects, as well. Particularly, various embodiments and examples as described with respect to one of the first to seventh aspects, may be combined at least partially with at least one other embodiment and / or example of at least one other of the first to seventh aspects. For example, at least two of the powered integrated circuit components in accordance with the second to seventh aspect may be combined, e.g., by combining different base substrates associated with each integrated circuit component and / or providing a common base substrate with contact pads arranged for receiving two or more sticker elements of at least two of the second to seventh aspects.

[0028] Brief Description of the Drawings

[0029] Various illustrative embodiments and other advantages of the various aspects of the present disclosure will become apparent from the detailed description of the accompanying Figures as presented below.

[0030] Fig. 1 shows in schematic top view a sticker element in accordance with some illustrative embodiments of the present disclosure.

[0031] Fig. 2 schematically shows a cross-sectional view along line ll-ll in Fig. 1.

[0032] Fig. 3 schematically shows a top view of a band of sticker elements in accordance with some illustrative embodiments of the present disclosure.

[0033] Fig. 4 to 6 schematically show top views on portions of powered integrated circuits in accordance with various illustrative embodiments of the present disclosure.

[0034] Fig. 7 schematically shows a top view of a sticker element in accordance with some other illustrative embodiments of the present disclosure.

[0035] Fig. 8 schematically shows a cross-sectional view along line VIII-VIII in Fig. 7.

[0036] Fig. 9 schematically shows a cross-sectional view along line IX-IX in Fig. 7.

[0037] Fig. 10 schematically shows a top view on a portion of powered integrated circuits in accordance with other illustrative embodiments of the present disclosure.

[0038] Fig. 11 schematically shows a top view on a portion of powered integrated circuits in accordance with other illustrative embodiments of the present disclosure.

[0039] Fig. 12 shows a schematic circuit diagram of the top view shown in Fig. 11.

[0040] Fig. 13 schematically shows a top view on a portion of powered integrated circuits in accordance with other illustrative embodiments of the present disclosure.

[0041] Fig. 14 shows a schematic circuit diagram of the top view shown in Fig. 13. Fig. 15 schematically shows a top view on a portion of powered integrated circuits in accordance with other illustrative embodiments of the present disclosure.

[0042] Fig. 16 shows a schematic circuit diagram of the top view shown in Fig. 15.

[0043] The Figures accompanying the present disclosure are only provided for schematically showing some concepts and aspects of the present disclosure without showing all possible details of certain embodiments and without necessarily being actually to scale.

[0044] Detailed Description of Preferred Embodiments

[0045] Fig. 1 shows a schematic top view of a sticker element 1 acting as a single battery cell for providing a power sticker element. The sticker element 1 has a substrate 2 from which an anode contact 3a and a cathode contact 3b of an electrical battery arrangement 5 are exposed in an outer main surface 2s of the substrate 2 as exterior contacts of the sticker element 1. Over the outer main surface 2s of the substrate 2, an adhesive layer? is formed. The adhesive layer? is formed directly on an exposed portion of the outer main surface 2s of the substrate 2.

[0046] With reference to Fig. 2 some illustrative embodiments are described in greater detail, where Fig.

[0047] 2 shows an illustrative cross-sectional view along line ll-ll in Fig. 1. As shown in Fig. 2, the sticker element 1 may be provided by the substrate 2 forming a substrate pouch into which the electrical battery arrangement 5 is partially accommodated or encapsulated. For examples, the substrate 2 may be provided as a flexible substrate folded to provide the substrate pouch, thereby providing an easy way of encapsulating the electrical battery arrangement 5 into the substrate 2.

[0048] With ongoing reference to Fig. 1 and 2, the anode contact 3a and the cathode contact 3b may be electrically connected to a cell stacking of the electrical battery arrangement 5 via current collectors, such as an anode-side current collector 6 coupled to the anode contact 3a via an exposed terminal 6a in the outer main surface 2s. Similarly, a cathode-side current collector (not illustrated) may be coupled to the cathode contact 3b via an exposed terminal (not illustrated) in the outer main surface 2s. The cell stacking arrangement of the electrical battery arrangement 5 may be formed of an active layer anode, an active layer cathode, an electrolyte contacting the active layer anode, and electrolyte contacting the active layer cathode, wherein a separator is interposed between and physically separating the electrolytes against each other but allowing interchange of charge carriers among the electrolytes.

[0049] As indicated above, the substrate 2 in the illustration of Fig. 2 may provide for housing the cell stacking of the sticker element 1 formed of a folded substrate having the current collectors formed on a main surface of the substrate 2 in an unfolded condition, while when folding the substrate 2 into the pouch illustrated in Fig. 2, the cell stacking shown in Fig. 2 is achieved. For example, the substrate 2 may comprise at least one of PVC, PC, PLA, PS, PET, paper, a paper-based or papercomprising material etc. The substrate 2 may be a flexible substrate and may be provided as a planar sheet or body with two dimensions length, width greater than a third dimension height, i.e., length > height and width > height. For example, a smaller one of length and width may be at least 5 or 10 or 20 or 50 or 100 times greater than height. In some non-limiting examples herein, the substrate 2 may be provided in accordance with materials compatible with smart card technologies.

[0050] In some illustrative examples, the current collectors, such as the current collector 6, may be formed by printing a metal paste, e.g., an Ag-paste, onto a surface of the substrate 2 in the unfolded condition. In some illustrative but non limiting examples herein, the cell stacking of the electrical battery arrangement 5 may be based on a Zn / MnC>2 redox pair with electrolytes provided by ZnCI / NFUCI, NaOH, KOH or others. Alternatively, the current collectors may be provided by wireembedding or cladding technology. For example, a wire may be used for wire routing, the wire being an electrical conductor material obtained by subjecting an electrically conductive material to punching and / or drawing and / or rolling processes for forming the electrical conductor material into a desired shape. The wire may be formed of copper (Cu) or aluminum (Al) or a combination of both materials. The wire may be at least partially coated with at least one of tin (Sn), silver (Ag), nickel (Ni), gold (Au), an alloy comprising at least one of these metals, and bi or ternary alloys. In case of a partially coated wire, a core of the coated wire is formed of copper (Cu) or aluminum (Al) or a combination of both materials, the cladding being formed of with at least one of tin (Sn), silver (Ag), nickel (Ni), gold (Au), and bi or ternary alloys which only coat a surface portion of the core such that an exposed surface region of the wire in the substrate is coated, while unexposed surface regions are not coated. Alternatively, the wire may be uncoated. A coated wire may represent a wire which is so as to increase chemical resistance of the wire to the anode and cathode active materials, while using an uncoated wire may decrease fabrication and product costs and result in easier fabrication. Alternatively, the current collectors may be formed of an electrical conductor material obtained by subjecting an electrically conductive material to punching and / or drawing and / or rolling processes for forming the electrical conductor material into a desired shape. The current collectors may be formed of a material comprising copper (Cu) or aluminum (Al) or a combination of both materials. The current collectors may be at least partially coated with at least one of tin (Sn), silver (Ag), nickel (Ni), gold (Au), an alloy comprising at least one of these metals, and bi or ternary alloys. In case of partially coated current collectors, a core of the coated materials may be formed of copper (Cu) or aluminum (Al) or a combination of both materials, the cladding being formed of with at least one of tin (Sn), silver (Ag), nickel (Ni), gold (Au), and bi or ternary alloys which only coat a surface portion of the core such that an exposed surface region of the current collectors in the substrate 2 is coated, while unexposed surface regions are not coated. Alternatively, the current collectors may be uncoated. A coated material may provide for current collectors which have increased chemical resistance to anode and cathode active materials, while using an uncoated current collectors may decrease fabrication and product costs and result in easier fabrication.

[0051] Upon providing the adhesive layer 7 on the outer main surface 2s of the substrate 2, the sticker element 1 may be provided as a self-adhesive battery cell element. The adhesive layer 7 may be a low-sticky layer, a permanent sticky layer or a strong-sticky layer. For example, a low-sticky layer may be characterized by an adhesive strength of at most 19N / 25mm, whereas a permanent sticky layer may be characterized by an adhesive strength of 20 to 28N / 25mm, and a strong-sticky layer may be characterized by an adhesive strength of at least 29N / 25mm. Herein, the adhesive strength may be determined in accordance with DIN EN ISO 4624. In an exemplary and nonlimiting process, adhesive strength may be determined, e.g., by pasting a piece of a medium with adhesive layer on a galvanized steel surface, leaving it pasting for 24 h on the steel surface, then removing the medium from the steel surface under an angle of 90 degrees to the steel surface and measuring the mechanical force employed for removing the medium.

[0052] Referring to Fig. 3, a band 10 comprising a plurality of sticker elements 11 is shown in a schematic top view. For example, the band 10 may be provided by a reel or as sheets including a predefined number of sticker elements 11. Each of the sticker elements 11 may be provided in accordance with the sticker element 1 as disclosed above, the disclosure of which being incorporated by reference in its entirety.

[0053] In some illustrative embodiments, the band 10 may comprise a plurality of recesses 12, the recesses 12 extending as a repetitive pattern of recesses of equal size along at least one edge of the band 10, e.g., along two opposite edges of the band 10. For examples, the recesses 12 may be formed along basically one direction in parallel to an edge of the band 10, the direction indicating a feed or supply direction of the band 10 in a manufacturing process in which the sticker elements 11 are formed.

[0054] Although Fig. 3 shows the plurality of sticker elements 11 in a matrix arrangement of two lines and 6 columns, this does not impose any limitation and the number of lines and columns may be and desired number of lines and columns compatible with geometric sizes of the band 10 and individual geometric sizes of each sticker element of the plurality of sticker elements 11. Referring to Fig. 4, a powered integrated circuit component is shown in a schematic planar view. The powered integrated circuit component comprises a base substrate (Fig. 4 illustrates an enlarged surface portion 13 of the base substrate) having two power supply contact pads 14a and 14b formed in an exposed surface of the base substrate for contacting a power source so as to supply electrical power to an integrated circuity 14c formed in and / or on the base substrate. A sticker element 15 may provide for the power source of the powered integrated circuit component. The sticker element 15 may be provided in accordance with the sticker element 1 disclosed above (the disclosure of which is incorporated by reference in its entirety) and is arranged on the base substrate of the powered integrated circuit component such that the power supply contact pads 14a and 14b are brought into electrical connection with contact terminals 15a and 15b of the sticker element 15 such that the anode-side contact terminal 15a is in contact with the contact pad 14a indicated as an anode contact pad in the illustration of Fig. 4, while the cathode-side contact terminal 15b is in contact with the contact pad 14b indicated as a cathode contact pad in the illustration of Fig. 4.

[0055] It is noted that the illustration in Fig. 4 shows the contact terminals 15a and 15b in the illustrated top view only for reasons of clarity so as to indicate an orientation of the sticker element 15 and its contact terminals 15a, 15b with respect to contact pads 14a, 14b of the integrated circuitry 14c of the powered integrated circuit component. In particular, the sticker element 15 is arranged on the base substrate in a manner such that the contact terminals 15a, 15b of the sticker element 15 face towards the contact pads 14a, 14b, while an adhesive layer (not illustrated) of the sticker element 15 is only at most partially overlapping each of the contact pads 14a, 14b.

[0056] Referring to Fig. 5, a powered integrated circuit component is shown in a schematic planar view. The powered integrated circuit component comprises a base substrate (Fig. 5 illustrates an enlarged surface portion 13’ of the base substrate) having four power supply contact pads 14a’ to 14d’ formed in an exposed surface of the base substrate for contacting a power source provided by two sticker elements 15, 15’ so as to supply electrical power to an integrated circuity 14e’ formed in and / or on the base substrate. Each of two sticker elements 15’, 15’ may be formed in accordance with the sticker element 1 as disclosed above (the disclosure of which is incorporated by reference in its entirety) and is arranged on the base substrate of the powered integrated circuit component such that the power supply contact pads 14a’ and 14b’ are brought into electrical connection with contact terminals 15a and 15b of the sticker element 15, while the power supply contact pads 14c’ and 14d’ are brought into electrical connection with contact terminals 15a’ and

[0057]

[0058] element 15 is in contact with the contact pad 14a’ indicated as an anode contact pad in the illustration of Fig. 5 and the anode-side contact terminal 15a’ of the sticker element 15’ is in contact with the contact pad 14c’ indicated as another anode contact pad in the illustration of Fig. 5, while the cathode-side contact terminal 15b is in contact with the contact pad 14b’ indicated as a cathode contact pad in the illustration of Fig. 5 and the cathode-side contact terminal 15b’ is in contact with the contact pad 14d’ indicated as another cathode contact pad in the illustration of Fig. 5. Upon the integrated circuitry 14e’ comprising a series connection of the cathode-side contact pad 14b’ with the anode-side contact pad 14c’, the anode-side contact terminal 15a’ of the sticker element 15’ is connected in series with the cathode-side contact terminal 15b of the sticker element 15, where the anode-side contact pad 14a’ and the cathode-side contact pad 14d’ represent supply contacts pads of the integrated circuitry 14e’. Accordingly, a series connection of sticker elements 15, 15’ is easily implemented in the powered integrated circuit component shown in Fig.

[0059] 5.

[0060] It is noted that the illustration in Fig. 5 shows the contact terminals 15a, 15a’ and 15b, 15b’ of the sticker elements 15, 15’ in the illustrated top view only for reasons of clarity so as to indicate an orientation of the sticker elements 15, 15’ and their contact terminals 15a, 15b, 15a’, 15b’ with respect to contact pads 14a’ to 14d’ of the integrated circuitry 14e’ of the powered integrated circuit component. In particular, each of the sticker elements 15, 15’ is arranged on the base substrate in a manner such that the contact terminals 15a, 15b of sticker element 15 and 15a’, 15b’ of sticker element 15’ face towards the respective contact pads 14a’ to 14d’, while an adhesive layer (not illustrated) of each of the sticker elements 15, 15’ is only at most partially overlapping each of the contact pads 14a’ to 14d’.

[0061] Referring to Fig. 6, a powered integrated circuit component is shown in a schematic planar view. The powered integrated circuit component comprises a base substrate (Fig. 5 illustrates an enlarged surface portion 13” of the base substrate) having four power supply contact pads 14a” to 14d” formed in an exposed surface of the base substrate for contacting a power source provided by two sticker elements 15, 15’ so as to supply electrical power to an integrated circuity 14e” formed in and / or on the base substrate. Each of the two sticker elements 15’, 15’ is arranged on the base substrate of the powered integrated circuit component such that the power supply contact pads 14a” and 14b” are brought into electrical connection with contact terminals 15a and 15b of the sticker element 15, while the power supply contact pads 14c” and 14d” are brought into electrical connection with contact terminals 15a’ and 15b’ of the sticker element 15’. In particular, the anode-side contact terminal 15a of the sticker element 15 is in contact with the contact pad 14a” indicated as an anode contact pad in the illustration of Fig. 5 and the anode-side contact terminal 15a’ of the sticker element 15’ is in contact with the contact pad 14c” indicated as another anode contact pad in the illustration of Fig. 5, while the cathode-side contact terminal 15b is in contact with the contact pad 14b” indicated as a cathode contact pad in the illustration of Fig. 5 and the cathode-side contact terminal 15b’ is in contact with the contact pad 14d” indicated as another cathode contact pad in the illustration of Fig. 5. Upon the integrated circuitry 14e” comprising a connection of the anode-side contact pad 14a” with the anode-side contact pad 14c” via a branched routing 14f”, the anode-side contact terminal 15a’ of the sticker element 15’ is connected in series with the anode-side contact terminal 15a of the sticker element 15, where the cathodeside contact pad 14b” and the cathode-side contact pad 14d” are connected by a routing line of the integrated circuitry 14e” which represent supply contacts pads of the integrated circuitry 14e” which are connected in a series connection, while the contact pads 14a” and 14c” provide for a common anode supply pad of the integrated circuitry 14e”. Accordingly, a parallel connection of sticker elements 15, 15’ is easily implemented in the powered integrated circuit component shown in Fig. 6.

[0062] It is noted that the illustration in Fig. 6 shows the contact terminals 15a, 15a’ and 15b, 15b’ of the sticker elements 15, 15’ in the illustrated top view only for reasons of clarity so as to indicate an orientation of the sticker elements 15, 15’ and their contact terminals 15a, 15b, 15a’, 15b’ with respect to contact pads 14a” to 14d” of the integrated circuitry 14e” of the powered integrated circuit component. In particular, each of the sticker elements 15, 15’ is arranged on the base substrate in a manner such that the contact terminals 15a, 15b of sticker element 15 and 15a’, 15b’ of sticker element 15’ face towards the respective contact pads 14a” to 14d”, while an adhesive layer (not illustrated) of each of the sticker elements 15, 15’ is only at most partially overlapping each of the contact pads 14a” to 14d”.

[0063] Referring to Fig. 7 to 9, a sticker element 20 acting as a single battery cell for providing a power sticker element is shown in various views. Fig. 7 shows a schematic top view of the sticker element 20, while Fig. 8 and 9 show respective schematic cross-sectional views of the sticker element 20 along lines VI ll-VII I and IX-IX in Fig. 7. The sticker element 20 has a substrate 22 from which anode contacts 23a 1 , 23a2 and cathode contacts 23b1 , 23b2 of an electrical battery arrangement 25 are exposed in two oppositely arranged outer main surfaces of the substrate 22. The anode contact 23a 1 together with the cathode contact 23b1 provide for exterior contacts of the sticker element 20 in one of the two opposite outer main surfaces, while the anode contact 23a2 together with the cathode contact 23b2 provide for exterior contacts of the sticker element 20 in the other one of the two opposite outer main surfaces. Over one of the outer main surfaces of the substrate 22, an adhesive layer 27 is formed. The adhesive layer 27 may be formed directly on one exposed portion of one of the two opposite arranged outer main surfaces of the substrate 22. In order to provide for a planar common surface not disturbed by the contacts 23a1 , 23b1 of the sticker element 20, the contacts 23a1 , 23b1 may be formed within recesses in the surface so as to substantially be in coplanar alignment with the adhesive layer 27. However, this does not impose any limitation and the adhesive material of the adhesive layer 27 may be formed directly adjacent the contacts 23a1, 23b1 such that upper surface portions of the contacts 23a1, 23b1 are substantially coplanar with an upper surface of the adhesive layer 27.

[0064] Although Fig. 8 and 9 only show on of the two oppositely arranged main surfaces of the substrate 22 having the adhesive layer 7 formed thereon, this does not impose any limitation and the two oppositely arranged main surfaces of the substrate 22 may be formed in accordance with illustration of the upper one of the main surfaces as shown in Fig. 8 and 9 and described in the preceding paragraph. E.g., each of contacts 23a1, 23a2, 23b1, 23b1 may be formed in a recess of the corresponding main surface of the substrate 22, while both main surfaces of the substrate 22 may have an adhesive layer in accordance with the adhesive layer 27 formed thereon, while alternatively, adhesive material of adhesive layers may be formed directly adjacent contacts 23a1 , 23b1 , 23b1, 23b2 in each main surface such that upper surface portions of the contacts 23a1 , 23b1 , 23a2, 23b2 are substantially coplanar with an upper surface of each corresponding adhesive layer in each respective main surface of the substrate 22.

[0065] With reference to Fig. 8, an illustrative cross-sectional view along line VIII-VIII in Fig. 7 is illustrated, while Fig. 9 shows a cross-sectional view along line IX-IX in Fig. 7.

[0066] As shown in Fig. 8, the sticker element 20 may be provided by the substrate 22 forming a substrate pouch into which the electrical battery arrangement 25 is partially accommodated or encapsulated. For examples, the substrate 22 may be provided as a flexible substrate folded to provide the substrate pouch, thereby providing an easy way of encapsulating the electrical battery arrangement 25 into the substrate 22.

[0067] With ongoing reference to Fig. 7 and 8, the anode contact 23a1 and the cathode contact 23b1 may be electrically connected to a cell stacking of the electrical battery arrangement 25 via current collectors, such as an anode-side current collector 26a coupled to the anode contact 23a1 via an exposed terminal 26a1 in the upper main surface of the substrate 22. Similarly, a cathode-side current collector 26b may be coupled to the cathode contact 23b1 via an exposed terminal (not illustrated) in the outer main surface of the substrate 22. The cell stacking arrangement of the electrical battery arrangement 25 may be formed of an active layer anode, an active layer cathode, an electrolyte contacting the active layer anode, and electrolyte contacting the active layer cathode, wherein a separator is interposed between and physically separating the electrolytes against each other but allowing interchange of charge carriers among the electrolytes.

[0068] As indicated above, the substrate 22 in the illustration of Fig. 8 may provide for housing the cell stacking of the sticker element 20 formed of a folded substrate having the current collectors 26a, 26b formed on a main surface of the substrate 22 in an unfolded condition, while when folding the substrate 22 into the pouch illustrated in Fig. 8, the cell stacking shown in Fig. 8 is achieved. For example, the substrate 22 may comprise at least one of PVC, PC, PLA, PS, PET, paper, a paperbased or paper-comprising material etc. The substrate 22 may be a flexible substrate and may be provided as a planar sheet or body with two dimensions length, width greater than a third dimension height, i.e., length > height and width > height. For example, a smaller one of length and width may be at least 5 or 10 or20 or 50 or 100 times greaterthan height. In some non-limiting examples herein, the substrate 22 may be provided in accordance with materials compatible with smart card technologies.

[0069] In some illustrative examples, the current collectors, such as the current collectors 26a and 26b, may be formed by printing a metal paste, e.g., an Ag-paste, onto a surface of the substrate 22 in the unfolded condition. In some illustrative but non limiting examples herein, the cell stacking of the electrical battery arrangement 25 may be based on a Zn / MnC>2 redox pair with electrolytes provided by ZnCI / NFUCI, NaOH, KOH or others. Alternatively, the current collectors may be provided by wire-embedding or cladding technology. For example, a wire may be used for wire routing, the wire being an electrical conductor material obtained by subjecting an electrically conductive material to punching and / or drawing and / or rolling processes for forming the electrical conductor material into a desired shape. The wire may be formed of copper (Cu) or aluminum (Al) or a combination of both materials. The wire may be at least partially coated with at least one of tin (Sn), silver (Ag), nickel (Ni), gold (Au), an alloy comprising at least one of these metals, and bi or ternary alloys. In case of a partially coated wire, a core of the coated wire is formed of copper (Cu) or aluminum (Al) or a combination of both materials, the cladding being formed of with at least one of tin (Sn), silver (Ag), nickel (Ni), gold (Au), and bi or ternary alloys which only coat a surface portion of the core such that an exposed surface region of the wire in the substrate is coated, while unexposed surface regions are not coated. Alternatively, the wire may be uncoated. A coated wire may represent a wire which is so as to increase chemical resistance of the wire to the anode and cathode active materials, while using an uncoated wire may decrease fabrication and product costs and result in easier fabrication. Alternatively, the current collectors may be formed of an electrical conductor material obtained by subjecting an electrically conductive material to punching and / or drawing and / or rolling processes for forming the electrical conductor material into a desired shape. The current collectors may be formed of a material comprising copper (Cu) or aluminum (Al) or a combination of both materials. The current collectors may be at least partially coated with at least one of tin (Sn), silver (Ag), nickel (Ni), gold (Au), an alloy comprising at least one of these metals, and bi or ternary alloys. In case of partially coated current collectors, a core of the coated materials may be formed of copper (Cu) or aluminum (Al) or a combination of both materials, the cladding being formed of with at least one of tin (Sn), silver (Ag), nickel (Ni), gold (Au), and bi or ternary alloys which only coat a surface portion of the core such that an exposed surface region of the current collectors in the substrate 22 is coated, while unexposed surface regions are not coated. Alternatively, the current collectors may be uncoated. A coated material may provide for current collectors which have increased chemical resistance to anode and cathode active materials, while using an uncoated current collectors may decrease fabrication and product costs and result in easier fabrication.

[0070] Upon providing the adhesive layer 27 on at least the upper outer main surface of the substrate 22, the sticker element 20 may be provided as a self-adhesive battery cell element.

[0071] The adhesive layer 27 may be a low-sticky layer, a permanent sticky layer or a strong-sticky layer. For example, a low-sticky layer may be characterized by an adhesive strength of at most 19N / 25mm, whereas a permanent sticky layer may be characterized by an adhesive strength of 20 to 28N / 25mm, and a strong-sticky layer may be characterized by an adhesive strength of at least 29N / 25mm. Herein, the adhesive strength may be determined in accordance with DIN EN ISO 4624. In an exemplary and non-limiting process, adhesive strength may be determined, e.g., by pasting a piece of a medium with adhesive layer on a galvanized steel surface, leaving it pasting for 24 h on the steel surface, then removing the medium from the steel surface under an angle of 90 degrees to the steel surface and measuring the mechanical force employed for removing the medium.

[0072] With ongoing reference to Fig. 8, the anode contact 23a 1 and the cathode contact 23b1 are formed on the upper main surface of the substrate 22. The anode contact 23a1 is connected with the anode-side current collector 26a within the substrate 22 by a via 24a extending along a direction perpendicular or substantially perpendicular to the main surface at least partially through the substrate 22. Accordingly, a thickness of the substrate 22 may be decoupled from a location of the anode contact 23a1 on a main surface of the substrate 22. The cathode contact 23b1 is connected with the cathode-side current collector 26b within the substrate 22 by a via 24b extending along a direction perpendicular or substantially perpendicular to the main surface at least partially through the substrate 22. The vias 24a and 24b may be oriented in parallel or substantially in parallel. Accordingly, a thickness of the substrate 22 may be decoupled from a location of the cathode contact 23b1 on a main surface of the substrate 22. By using at least one of the vias 24a and 24b, the anode contact 23a1 and cathode contact 23b1 may be formed in the same main surface of the substrate 22.

[0073] The sticker element 20 may further comprise at least one of an additional anode contact 23a2 and an additional cathode contact 23b2, each of which formed on an opposite lower main surface of the substrate 22. The additional contact(s) 23a2 and / or 23b2 may be oppositely arranged with respect to the contacts 23a1 , 23a2 and aligned by means of the via(s) 24a and / or 24b with respect to the contacts 23a1, 23a2. Accordingly, the contacts 23a1, 23a2, 23b1, 23b2 may be contact terminals formed in each of the opposite outer main surfaces of the substrate 22, interconnected by the vias 24a, 24b extending as via elements completely in the substrate 22 between its opposite main surfaces. Each two contact terminals of the contacts 23a1, 23a2, 23b1, 23b2 are in alignment with each other on the opposing outer main surfaces of the substrate 22. The contacts 23a1 and 23a2 form a pair of aligned contact terminals of the sticker element 20 interconnected with the via 24a. The contacts 23b1 and 23b2 form a pair of aligned contact terminals of the sticker element 20 interconnected with the via 24b.

[0074] Fig. 8 shows the via 24a in contact with the anode-side current collector 26a and the via 24b in contact with the cathode-side current collector 26b. However, this does not impose any limitation and at least one of the anode-side current collector 26a and 26b may be in direct contact with the respective one of the contacts 23a1 and 23a2 and / or of the contacts 23b1 and 23b2.

[0075] Referring to Fig. 9, the cross-sectional view along line IX-IX in Fig. 7 is shown. The sticker element 20 may further comprise a pair of aligned contact terminals 23c1 , 23c2 interconnected by a via element 24c. The pair of contact terminals 23c1 , 23c2 is electrically disconnected from any of the pairs of aligned contact terminals 23a1 , 23a2 and 23b1 , 23b2. The pair of contact terminals 23c1 , 23c2 may be a dummy pair with respect to the electrical battery arrangement 25, only providing a purely vertical interconnection between the contacts 23c1 and 23c2 provided on opposite main surfaces of the substrate 22.

[0076] In some illustrative embodiments, The sticker element 20 may comprise the pair of aligned contact terminals 23c1, 23c2 interconnected by the via element 24c together with another pair of aligned contact terminals 23d1, 23d2 interconnected by a further via element 24d. Each of the pairs of contact terminals 23c1, 23c2 and 23d 1, 23d2 are electrically islanded pairs of aligned contact terminals, each of which being electrically disconnected from any other of the pairs of aligned contact terminals 23a1, 23a2 and 23b1, 23b2. The via elements 24c and 24d are disconnected vias within the substrate 22, only providing purely vertical interconnection without any connection to the electrical battery arrangement 25.

[0077] As shown in Fig. 7, the pairs of aligned contact terminals 23a1 , 23a2 and 23b1 , 23b2 and 23c1 , 23c2 and 23d1, 23d2 may be arranged, as shown in the illustrated top view, in alignment with corners of a rectangular, for example a square. Furthermore, the number of pairs of aligned contact terminals is not limited to two or three or four but any other number of pairs of aligned contact terminals may be considered. For any number of aligned contact terminals, the aligned contact terminals may be arranged in any other arrangement, e.g., on corners of a polygon, such as a regular polygon or irregular polygon.

[0078] Referring to Fig. 10, a powered integrated circuit component PCBa is shown in a schematic planar view. The powered integrated circuit component comprises a base substrate (Fig. 10 illustrates an enlarged surface portion 33 of the base substrate) having two power supply contact pads C1 and C2 formed in an exposed surface of the base substrate for contacting a power source so as to supply electrical power to an integrated circuity (not illustrated) via supply lines L1 and L2 formed in and / or on the base substrate such that the base substrate provides for a printed circuit board. A sticker element 20 may provide for the power source of the powered integrated circuit component PCBa. The sticker element 20 may be provided in accordance with the sticker element 20 disclosed above (the disclosure of which is incorporated by reference in its entirety) and is arranged on the base substrate of the powered integrated circuit component PCBa such that the power supply contact pads C1 and C2 are brought into electrical connection with contact terminals 23a and 23b of the sticker element 20 such that the cathode-side contact terminal 23a is in contact with the contact pad C2 indicated as a cathode contact pad in the illustration of Fig. 10, while the anode-side contact terminal 23b is in contact with the contact pad C1 indicated as an anode contact pad in the illustration of Fig. 10. As the sticker element 20 is provided as a double-sided contact sticker element, each of the contact terminals 23a and 23b represents a contact of an aligned pair of contact terminals corresponding to 23a1 , 23a2 and 23b1 , 23b2 as described above in the context of Fig. 7 and 8. The sticker element 20 further comprises aligned pairs of contact terminals associated with contact terminals 23c and 23d, each of which represent contact terminals interconnected by a via extending between opposite main surfaces and being disconnected from any electrical battery arrangement (not illustrated in Fig. 10 but corresponding to the electrical battery arrangement 25 as described with respect to Fig. 7 and 8) associated with the sticker element 20. It is noted that the illustration in Fig. 10 shows only contact terminals 23a and 23b on one of the main surfaces of the sticker element 20, the opposite contact terminals being connected to the respective counter contact terminals 23a and 23b. For isolation of the exposed contact terminals 23a and 23b, an isolating covering layer (not illustrated) may be attached for covering at least the contact terminals 23a, 23b.

[0079] Referring to Fig. 11 , a powered integrated circuit component PCBb is shown in a schematic planar view. The powered integrated circuit component comprises a base substrate (Fig. 11 illustrates an enlarged surface portion 43 of the base substrate) having two power supply contact pads C3 and C4 formed in an exposed surface of the base substrate for contacting a power source so as to supply electrical power to an integrated circuity (not illustrated) via supply lines L3 and L4 formed in and / or on the base substrate such that the base substrate provides for a printed circuit board. The powered integrated circuit component PCBb is configured for powering by a series connection of two sticker elements each of which being provided in the configuration of the sticker element 20 as disclosed with respect to Fig. 7 to 9 (the disclosure of which is incorporated by reference in its entirety). The sticker element 20 is arranged on the base substrate such that only one of the aligned pairs of contact terminals 23a and 23b is connected to one of the contact pads C3 and C4, while the other one of the contact pads C3 and C4 is connected to one of the aligned pairs of contact terminals 23d, 23c disconnected from the battery arrangement (not illustrated in Fig. 11) of the sticker element 20. For example, the sticker element 20 may be arranged on the base substrate of the powered integrated circuit component PCBb such that the power supply contact pads C3 and C4 are brought into electrical connection with contact terminals 23a and 23d of the sticker element 20 such that the cathode-side contact terminal 23a is in contact with the contact pad C4 indicated as a cathode contact pad of the supply line L4 in the illustration of Fig.

[0080] 11, while the contact terminal 23d (dummy contact terminal with respect to the electrical battery arrangement of the sticker element 20) is in contact with the contact pad C3 indicated as an anode contact pad of the supply line L3 in the illustration of Fig. 11.

[0081] It is noted that, as the sticker element 20 is provided as a double-sided contact sticker element, each of the contact terminals 23a and 23b representing a contact of an aligned pair of contact terminals corresponding to 23a1 , 23a2 and 23b1 , 23b2 as described above in the context of Fig.

[0082] 7 and 8. The sticker element 20 further comprises aligned pairs of contact terminals associated with contact terminals 23c and 23d, each of which represent contact terminals interconnected by a via extending between opposite main surfaces and being disconnected from any electrical battery arrangement (not illustrated in Fig. 11 but corresponding to the electrical battery arrangement 25 as described with respect to Fig. 7 and 8) associated with the sticker element 20. It is further noted that the illustration in Fig. 11 shows another sticker element 30 to be arranged on the sticker element 20 as indicated by bold-type arrows in Fig. 11. The sticker element 30 has the same configuration as the sticker element 20 as disclosed with respect to Fig. 7 to 9 and is of identical configuration with the sticker element 20 shown in Fig. 11. However, the sticker element 30 is arranged on the sticker element 20 with an orientation relative to the sticker element 20 such that the sticker element 30 is rotated clockwise relative to the sticker element 20 such that a cathode-side contact terminal 33a of the sticker element 30 contacts the anode-side contact terminal 23b of the sticker element 20. The anode-side contact terminal 33b of the sticker element 30 is brought into contact with the dummy (purely interconnecting) pair of aligned contact terminals comprising the contact terminal 23d which is disconnected from the electrical battery arrangement (not illustrated) of the sticker element 20, thereby interconnecting the contact pad C3 with the anode-side contact terminal 33b of the sticker element 30. The dummy (purely interconnecting) pair of aligned contact terminals comprising the contact terminal 23c (which is disconnected from the electrical battery arrangement (not illustrated) of the sticker element 20) and the dummy (purely interconnecting) pair of aligned contact terminals comprising the contact terminal 33d (which is disconnected from the electrical battery arrangement (not illustrated) of the sticker element 30) are brought into contact but disconnected from the supply lines L3 and L4 of the base substrate, particularly, the contact terminals 23c and 33d not being connected in the powered integrated circuit component PCBb of Fig. 11, thus representing blind contact terminals.

[0083] Referring to Fig. 12, a schematic circuit diagrammatic view of the powered integrated circuit component PCBb of Fig. 11 is schematically illustrated, showing the power source of the powered integrated circuit component PCBb as a series connection of the electrical battery arrangements of the sticker elements 20 and 30 in Fig. 11.

[0084] Referring to Fig. 13, a modified powered integrated circuit component PCBa is shown in a schematic planarviewas a modification of the powered integrated circuit PCBa of Fig. 10. The modified powered integrated circuit component PCBa comprises a base substrate (Fig. 13 illustrates an enlarged surface portion 33 of the base substrate identical with the configuration of supply lines shown in Fig. 10) having the two power supply contact pads C1 and C2 formed in the exposed surface of the base substrate for contacting a power source so as to supply electrical power to an integrated circuity (not illustrated) via the supply lines L1 and L2 formed in and / or on the base substrate such that the base substrate provides for a printed circuit board. The modified powered integrated circuit component PCBa of Fig. 13 is configured for powering by a parallel connection of two sticker elements each of which being provided in the configuration of the sticker element 20 as disclosed with respect to Fig. 7 to 9 (the disclosure of which is incorporated by reference in its entirety). The sticker element 20 is arranged on the base substrate such the aligned pairs of contact terminals 23a and 23b are connected to the contact pads C1 and C2 in the same manner as described with respect to Fig. 10. For example, the sticker element 20 may be arranged on the base substrate of the modified powered integrated circuit component PCBa such that the cathodeside contact terminal 23a is in contact with the contact pad C2 indicated as a cathode contact pad of the supply line L2 in the illustration of Fig. 13, while the anode-side contact terminal 23b is in contact with the contact pad C1 indicated as an anode contact pad of the supply line L1 in the illustration of Fig. 13.

[0085] It is noted that, as the sticker element 20 is provided as a double-sided contact sticker element, each of the contact terminals 23a and 23b representing a contact of an aligned pair of contact terminals corresponding to 23a1 , 23a2 and 23b1 , 23b2 as described above in the context of Fig.

[0086] 7 and 8. The sticker element 20 further comprises aligned pairs of contact terminals associated with contact terminals 23c and 23d, each of which represent contact terminals interconnected by a via extending between opposite main surfaces and being disconnected from any electrical battery arrangement (not illustrated in Fig. 13 but corresponding to the electrical battery arrangement 25 as described with respect to Fig. 7 and 8) associated with the sticker element 20.

[0087] It is further noted that the illustration in Fig. 13 shows another sticker element 30 to be arranged on the sticker element 20 as indicated by bold-type arrows in Fig. 13. The sticker element 30 has the same configuration as the sticker element 20 as disclosed with respect to Fig. 7 to 9 and is of identical configuration with the sticker element 20 shown in Fig. 13. However, the sticker element 30 is arranged on the sticker element 20 with an orientation relative to the sticker element 20 such that the sticker element 30 is not rotated relative to the sticker element 20. In particular, a cathodeside contact terminal 33a of the sticker element 30 contacts the cathode-side contact terminal 23a of the sticker element 20. The anode-side contact terminal 33b of the sticker element 30 is brought into contact with the anode-side contact terminal 23b of the sticker element 20. Thereby, the contact pad C1 is in contact with the anode-side contact terminal 23b of the sticker element 20 and the contact pad C2 is in contact with the cathode-side contact terminal 23a of the sticker element 20. In parallel to the anode of the sticker element 20, the anode-side contact terminal 33b of the sticker element 30 is connected to the contact pad C1. Similarly, the cathode of the sticker element 20 is connected in parallel to the cathode-side contact terminal 33a of the sticker element 30 which is connected to the contact pad C2. The dummy (purely interconnecting) pairs of aligned contact terminals comprising the contact terminals 23c, 23d (which are disconnected from the electrical battery arrangement (not illustrated) of the sticker element 20) and the dummy (purely interconnecting) pairs of aligned contact terminals comprising the contact terminals 33c, 33d (which are disconnected from the electrical battery arrangement (not illustrated) of the sticker element 30) are brought into contact but disconnected from the supply lines L1 and L2 of the base substrate, particularly, the contact terminals 23c, 23d, 33c, and 33d not being connected in the modified powered integrated circuit component PCBa of Fig. 13, thus representing blind contact terminals.

[0088] Referring to Fig. 14, a schematic circuit diagrammatic view of the modified powered integrated circuit component PCBa of Fig. 13 is schematically illustrated, showing the power source of the modified powered integrated circuit component PCBa as a parallel connection of the electrical battery arrangements of the sticker elements 20 and 30 in Fig. 13.

[0089] Referring to Fig. 15, a further modified powered integrated circuit component PCBa is shown in a schematic planar view as a modification of the powered integrated circuit PCBa of Fig. 13. The further modified powered integrated circuit component PCBa comprises a base substrate (Fig. 15 illustrates an enlarged surface portion 33 of the base substrate identical with the configuration of supply lines shown in Fig. 10 and 13) having the two power supply contact pads C1 and C2 formed in the exposed surface of the base substrate for contacting a power source so as to supply electrical power to an integrated circuity (not illustrated) via the supply lines L1 and L2 formed in and / or on the base substrate such that the base substrate provides fora printed circuit board. The further modified powered integrated circuit component PCBa of Fig. 15 is configured for powering by a series connection of three sticker elements 20, 30, and 40 each of which being provided in the configuration of the sticker element 20 as disclosed with respect to Fig. 7 to 9 (the disclosure of which is incorporated by reference in its entirety). The sticker element 20 is arranged on the base substrate such only one of the aligned pairs of contact terminals 23a and 23b is connected to the contact pads C1 and C2, an orientation of the sticker element 20 in Fig. 15 differing from an orientation of the sticker element 20 in Fig. 13 by a counterclockwise rotation by 90 degrees. For example, the sticker element 20 may be arranged on the base substrate of the further modified powered integrated circuit component PCBa such that the anode-side contact terminal 23b is in contact with the contact pad C1 indicated as an anode contact pad of the supply line L1 in the illustration of Fig. 15, while the dummy contact terminal 23d is in contact with the contact pad C2 indicated as a cathode contact pad of the supply line L2 in the illustration of Fig. 15. The electric battery arrangement of the sticker element 20 is, for reasons of a clear illustration, schematically indicated in Fig. 15 by the circuit diagrammatic representation of a battery.

[0090] It is noted that, as the sticker element 20 is provided as a double-sided contact sticker element, each of the contact terminals 23a and 23b representing a contact of an aligned pair of contact terminals corresponding to 23a1 , 23a2 and 23b1 , 23b2 as described above in the context of Fig. 7 and 8. As described above, the sticker element 20 comprises aligned pairs of contact terminals associated with contact terminals 23c and 23d, each of which represent contact terminals interconnected by a via extending between opposite main surfaces and being disconnected from any electrical battery arrangement (not illustrated in Fig. 15 but corresponding to the electrical battery arrangement 25 as described with respect to Fig. 7 and 8) associated with the sticker element 20.

[0091] It is further noted that the illustration in Fig. 15 the sticker element 30 arranged on the sticker element 20 as indicated by bold-type arrows in Fig. 15. The sticker element 30 has the same configuration as the sticker element 20 as disclosed with respect to Fig. 7 to 9 and is of identical configuration with the sticker element 20 shown in Fig. 13. However, the sticker element 30 is arranged on the sticker element 20 with an orientation relative to the sticker element 20 such that the sticker element 30 is rotated relative to the sticker element 20 by a counterclockwise rotation by 90 degrees. In particular, an anode-side contact terminal 33b of the sticker element 30 contacts the cathode-side contact terminal 23a of the sticker element 20. The cathode-side contact terminal 33a of the sticker element 30 is brought into contact with the dummy contact terminal 23c of the sticker element 20. The dummy contact terminal 23d of the sticker element 20 in contact with the contact pad C2 is brought into contact with the dummy contact terminal 33c of the sticker element 30. Thereby, the contact pad C2 is interconnected with the dummy contact terminal 33c of the sticker element 30. The contact pad C1 is also interconnected with the dummy contact terminal 33d with the anode-side contact terminal 23b of the sticker element 20 connected in-between.

[0092] The third sticker element 40 is arranged on the sticker element 30 as further indicated by boldtype arrows in Fig. 15. The sticker element 40 has the same configuration as the sticker element 20 as disclosed with respect to Fig. 7 to 9 and is of identical configuration with the sticker elements 20 and 30 shown in Fig. 13. However, the sticker element 40 is arranged on the sticker element 30 with an orientation relative to the sticker element 30 such that the sticker element 40 is rotated relative to the sticker element 30 by a counterclockwise rotation by 90 degrees. In particular, an anode-side contact terminal 43b of the sticker element 40 contacts the cathode-side contact terminal 33a of the sticker element 30. The cathode-side contact terminal 43a of the sticker element 40 is brought into contact with the dummy contact terminal 33c of the sticker element 30. The dummy contact terminal 33d of the sticker element 30 is in contact with the contact pad C1 and is brought into contact with the dummy contact terminal 43c of the sticker element 40. Thereby, the contact pad C2 is interconnected with the dummy contact terminal 43c of the sticker element 40. The contact pad C2 is also interconnected with the dummy contact terminal cathode-side contact terminal 43a with the dummy contact terminal 33c and the dummy contact terminal 23d connected in-between. The illustration in Fig. 15 shows, for reasons of clarity, a stacked arrangement of the sticker elements 20 to 40 in an exploded view with directly contacts indicated via broken lines and showing electric battery arrangements of the sticker elements 20 to 40, for reasons of a clear illustration, schematically as circuit diagrammatic representations of associated batteries.

[0093] Referring to Fig. 16, a schematic circuit diagrammatic view of the further modified powered integrated circuit component PCBa of Fig. 15 is schematically illustrated, showing the power source of the modified powered integrated circuit component PCBa as a series connection of the electrical battery arrangements of the sticker elements 20 to 40 in Fig. 15.

[0094] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and / or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. “Optional” or “optionally” means that the subsequently described event or circumstance may or may not occur, and that the description includes instances where the event occurs and instances where it does not.

[0095] Approximating language, as used herein throughout the specification and claims, may be applied to modify any quantitative representation that could permissibly vary without resulting in a change in the basic function to which it is related. Accordingly, a value modified by a term or terms, such as “about”, “approximately” and “substantially”, are not to be limited to the precise value specified. In at least some instances, the approximating language may correspond to the precision of an instrument for measuring the value. Here and throughout the specification and claims, range limitations may be combined and / or interchanged, such ranges are identified and include all the subranges contained therein unless context or language indicates otherwise. “Approximately” or “substantially” as applied to a particular value of a range applies to both values, and unless otherwise dependent on the precision of the instrument measuring the value, may indicate + / - 10% of the stated value(s).

[0096] The descriptions of the various embodiments of the present invention have been presented for purposes of illustration but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used here- in was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

Claims1. A sticker element, comprising:a substrate, preferably a substrate pouch, with at least two contact terminals exposed in at least one outer main surface of the substrate;an electrical battery arrangement completely included into the substrate; andan adhesive layer formed directly on at least a portion of at least one of the exposed outer main surfaces of the substrate,wherein the electrical battery arrangement comprises:a cathode comprising a cathode-side current collector and a cathode-side active material over the cathode-side current collector,an anode comprising an anode-side current collector and an anode-side active material over the anode-side current collector, andan electrolyte layer over at least one of the cathode-side active material and the anode-side active material,wherein the cathode-side current collector is electrically connected to at least a first of the contact terminals for providing at least one cathode contact terminal,wherein the anode-side current collector is electrically connected to at least a second of the contact terminals for providing at least one anode contact terminal.

2. The sticker element of claim 1 , further comprising a plurality of electrically conductive adhesion pads, each of the plurality of electrically conductive adhesion pads being formed on an associated one of the at least two contact terminals.

3. The sticker element of claim 1 or 2, wherein the substrate has only two contact terminals, the two contact terminals being formed in only one outer main surface of the substrate.

4. The sticker element of claim 3, wherein the contact terminals are provided by exposed end portions of each of the cathode-side current collector and the anode-side current collector.

5. The sticker element of claim 1 or 2, wherein the substrate has at least two contact terminals formed in each of two opposing outer main surfaces of the substrate and at least two via element extending in the substrate, each two contact terminals being in alignment with each other on the opposing outer main surfaces are connected by an associate via elementof the at least two via elements extending between the two opposing outer main surfaces and electrically interconnecting the aligned two contact terminals.

6. The sticker element of claim 5, wherein a first pair of aligned contact terminals is interconnected by a first via element of the at least two via elements and a second pair of aligned contact terminals is interconnected by a second via element of the at least two via elements.

7. The sticker element of claim 6, wherein one of the first pair of aligned contact terminals and the first via element is in mechanical contact with one of the cathode-side current collector and the anode-side current collector, and wherein one of the second pair of aligned contact terminals and the second via element is in mechanical contact with the other one of the cathode-side current collector and the anode-side current collector.

8. The sticker element of one of claims 6 or 7, further comprising at least one third pair of aligned contact terminals interconnected by a third via element, the third pair of contact terminals being electrically disconnected from any of the first and second pairs of aligned contact terminals.

9. The sticker element of one of one of claims 6 to 7, further comprising a third pair of aligned contact terminals interconnected by a third via element and a fourth pair of aligned contact terminals interconnected by a fourth via element, wherein each of the third and fourth pairs of contact terminals are electrically islanded pairs of aligned contact terminals, each of which being electrically disconnected from any other of the pairs of aligned contact terminals.

10. The sticker element of claim 9, wherein the first to fourth pairs of aligned contact terminals are arranged in top view in alignment with corners of a polygon, such as a regular polygon.

11. A powered integrated circuit component, comprising:a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having at least two power supply contact pads exposed in at least one main surface of the base substrate;at least one sticker element attached to the base substrate for contacting the at least two power supply contact pads,wherein each of the at least one sticker element is provided in accordance with the sticker element of any of claims 1 to 10,wherein any pair of power supply contact pads is electrically connected with an associated pair of anode and cathode contact terminals of the at least one sticker element.

12. A powered integrated circuit component, comprising:a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having two power supply contact pads exposed in one main surface of the base substrate;the sticker element of one of claims 1 to 10 attached to the base substrate for bringing the two power supply contact pads into electrical contact with the anode and cathode contact terminals.

13. A powered integrated circuit component, comprising:a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having four power supply contact pads exposed in one main surface of the base substrate;two sticker elements, each of which being provided in accordance with any of claims 1 to 10 attached to the base substrate for bringing each two power supply contact pads into electrical contact with each pair of anode and cathode contact terminals,wherein the integrated circuit has conductive track lines routed for connecting the four power supply contact pads such that an electrical series connection of the two sticker elements is provided.

14. A powered integrated circuit component, comprising:a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having two power supply contact pads exposed in one main surface of the base substrate;two sticker elements, each of which being provided in accordance with any of claims 5 to 10,wherein a first sticker element of the two sticker elements is attached to the base substrate for bringing the two power supply contact pads into electrical contact with aligned pairs of contact terminals of the first sticker element connecting to the pairs of anode and cathode contact terminals of the first sticker element,wherein a second sticker element of the two sticker elements is arranged in a stacking arrangement on the first sticker element so as to bring the aligned pair of contact terminals of the first sticker element connecting to the pairs of anode and cathode contact terminals of the first sticker element into contact with aligned pairs of contact elements of the second sticker element connecting to the pairs of anode and cathode contact terminals of the second sticker element.

15. A powered integrated circuit component, comprising:a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having two power supply contact pads exposed in one main surface of the base substrate;at least two sticker elements, each of which being provided in accordance with any of claims 8 to 10,wherein a first sticker element of the at least two sticker elements is attached to the base substrate for bringing the two power supply contact pads into electrical contact with first and second aligned pairs of contact terminals of the first sticker element, the first pair of aligned pairs of contact terminals connecting to one pair of pairs of anode and cathode contact terminals of the first sticker element, the second pair of aligned pairs of contact terminals being an islanded pair,wherein a second sticker element of the at least two sticker elements is arranged in a stacking arrangement on the first sticker element so as to bring the first pair into contact with an islanded pair of aligned pairs of contact terminals of the second sticker element, while bringing the second pair into contact with a pair of aligned pairs of contact terminals of the second sticker element connecting to one pair of pairs of anode and cathode contact terminals of the second sticker element having opposite polarity with respect to the first pair.

16. A powered integrated circuit component, comprising:a base substrate, such as a flexible base substrate, with an integrated circuit, the integrated circuit having two power supply contact pads exposed in one main surface of the base substrate;three sticker elements, each of which being provided in accordance with any of claims 8 to 10,wherein a first sticker element of the three sticker elements is attached to the base substrate for bringing the two power supply contact pads into electrical contact with first andsecond aligned pairs of contact terminals of the first sticker element, the first pair of aligned pairs of contact terminals being an islanded pair, the second pair of aligned pairs of contact terminals connecting to one pair of pairs of anode and cathode contact terminals of the first sticker element,wherein a second sticker element of the three sticker elements is arranged in a stacking arrangement on the first sticker element so as to bring the first pair into contact with an islanded pair of aligned pairs of contact terminals of the second sticker element, while bringing the second pair into contact with another islanded pair of aligned pairs of contact terminals of the second sticker element, while bringing the other one pair of pairs of anode and cathode contact terminals of the first sticker element into contact with an aligned pair of contact terminals of the second sticker element connecting to one pair of pairs of anode and cathode contact terminals of the second sticker element having opposite polarity with respect to the other one pair of pairs of anode and cathode contact terminals of the first sticker element,wherein a third sticker element of the three sticker elements is arranged in the stacking arrangement on the second sticker element so as to bring the islanded pair of aligned pairs of contact terminals of the second sticker element into contact with one pair of pairs of anode and cathode contact terminals of the third sticker element having opposite polarity with respect to the second pair, while bringing the other one pair of pairs of anode and cathode contact terminals of the third sticker element having same polarity as the second pair into contact with the pair of pairs of anode and cathode contact terminals of the second sticker element having opposite polarity with respect to the second pair.

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