Peripheral surface treatment apparatus and peripheral surface treatment method for cylindrical workpiece

Abstract

The present invention provides a peripheral surface treatment apparatus and a peripheral surface treatment method for a cylindrical workpiece which make it possible to perform a precise peripheral surface treatment regardless of the workpiece machining accuracy and the accuracy of fixation to a rotary shaft.　The peripheral surface treatment apparatus for a cylindrical workpiece includes a rotary shaft, a peripheral surface treatment device, a control device, a peripheral surface displacement sensor, and a rotation angle sensor. The displacement during one full rotation of the cylindrical workpiece is measured by the peripheral surface displacement sensor in synchronization with a signal of the rotation angle sensor, the eccentricity and the eccentricity direction when the cylindrical workpiece is fixed to the rotary shaft are estimated from the measured displacement for one full rotation, correction data is calculated from the estimated eccentricity and the estimated eccentricity direction, the signal of the rotation angle sensor is corrected on the basis of the correction data, and the peripheral surface treatment device is controlled by the control device.

Description

Circumferential Surface Processing Apparatus and Method for Cylindrical Workpiece

[0001] The present invention relates to a circumferential surface processing apparatus and method for a cylindrical workpiece, and more particularly to a circumferential surface processing apparatus and method for a cylindrical workpiece that enable high-precision circumferential surface processing regardless of workpiece accuracy and fixing accuracy to a rotating shaft.

[0002] Cylindrical workpieces have been conventionally used in various technologies. For example, there is a gravure printing plate-making roll used in gravure printing. The gravure printing plate-making roll is a hollow roll that is plate-made through a plate-making process.

[0003] In the case of such a gravure printing plate-making roll, in the process of transferring an image from an original painting to the gravure printing plate-making roll in the plate-making process, the hollow roll, which is a cylindrical workpiece, is fixed to a rotating shaft, and an image recording operation is performed on the plate surface while rotating. Conventionally, the accuracy of such a cylindrical workpiece itself and the fixing accuracy to the rotating shaft of the cylindrical workpiece have not been particularly problematic. However, in the case of a gravure printing plate-making roll, in recent high-precision printing, the influence on dimensional errors during printing cannot be ignored. The fixing accuracy to the rotating shaft of the cylindrical workpiece can be mechanically improved to a certain level, but there is a problem that satisfactory accuracy cannot be ensured due to factors such as the type of the cylindrical workpiece and aging deterioration.

[0004] For example, as an automatic measurement method for tubular products, there is one described in Patent Document 1. However, in the case of Patent Document 1, although the wall thickness and surface shape of the tubular product can be measured, when the tubular product is eccentric, etc., it cannot be dealt with, and even when applied to a gravure printing plate-making roll required for recent high-precision printing, it is not a technology that can obtain satisfactory accuracy.

[0005] Japanese Patent Laid-Open No. 3-87606

[0006] The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to provide a circumferential surface processing apparatus and method for a cylindrical workpiece that enable high-precision circumferential surface processing regardless of workpiece accuracy and fixing accuracy to a rotating shaft.

[0007] To solve the above problems, the cylindrical workpiece circumferential processing device of the present invention includes a rotating shaft on which a cylindrical workpiece is mounted and rotated, a circumferential processing device for performing a predetermined process on the circumferential surface of the rotating cylindrical workpiece, a control device for controlling the circumferential processing device, a circumferential displacement sensor capable of measuring the displacement of the circumferential surface of the cylindrical workpiece by sensing the surface of the rotating cylindrical workpiece, and a rotation angle sensor provided on the rotating shaft for measuring the rotation angle of the cylindrical workpiece. The circumferential displacement sensor measures the amount of displacement of the cylindrical workpiece for one full rotation in synchronization with the signal from the rotation angle sensor, estimates the eccentricity and direction of eccentricity when the cylindrical workpiece is fixed to the rotating shaft from the measured amount of displacement for one full rotation, calculates correction data from the estimated eccentricity and direction of eccentricity, corrects the signal from the rotation angle sensor based on the correction data, and controls the circumferential processing device by the control device.

[0008] The circumferential surface processing device is preferably an exposure laser device or an electronic engraving device.

[0009] Preferably, the cylindrical workpiece is a plate base material for gravure printing, a plate base material for flexographic printing, or a plate base material for rotary screen printing.

[0010] The present invention relates to a method for processing the circumferential surface of a cylindrical workpiece, which is a method for processing the circumferential surface of a cylindrical workpiece using the circumferential surface processing device for a cylindrical workpiece, and includes the steps of: attaching the cylindrical workpiece to a rotating shaft and rotating it; sensing the surface of the rotating cylindrical workpiece and measuring the amount of displacement of the cylindrical workpiece over one rotation using the circumferential displacement sensor in synchronization with the signal of the rotation angle sensor; estimating the amount of eccentricity and direction of eccentricity when the cylindrical workpiece is fixed to the rotating shaft from the measured amount of displacement over one rotation; calculating correction data from the estimated estimated amount of eccentricity and direction of eccentricity and correcting the signal of the rotation angle sensor based on the correction data; and a circumferential surface processing step of controlling the circumferential surface processing device with the control device and performing a predetermined processing on the circumferential surface of the cylindrical workpiece.

[0011] The present invention provides a method for manufacturing a product having a cylindrical portion with a circumferentially treated surface, which involves using a circumferentially treated cylindrical workpiece processing device, and includes the steps of: attaching a cylindrical workpiece forming the cylindrical portion to a rotating shaft and rotating it; sensing the surface of the rotating cylindrical workpiece and measuring the amount of displacement of the cylindrical workpiece over one rotation using a circumferential displacement sensor in synchronization with the signal of the rotation angle sensor; estimating the amount of eccentricity and direction of eccentricity when the cylindrical workpiece is fixed to the rotating shaft from the measured amount of displacement over one rotation; calculating correction data from the estimated amount of eccentricity and direction of eccentricity and correcting the signal of the rotation angle sensor based on the correction data; controlling the circumferentially treated device with the control device and performing a predetermined processing on the circumferentially treated surface of the cylindrical workpiece; and removing the cylindrical workpiece with the circumferentially treated surface from the rotating shaft.

[0012] The present invention has the significant advantage of providing a circumferential surface processing apparatus and a circumferential surface processing method for cylindrical workpieces that enable high-precision circumferential surface processing regardless of the workpiece accuracy or the accuracy of fixing to the rotating shaft.

[0013] This is a schematic diagram showing one embodiment of the cylindrical workpiece surface treatment apparatus of the present invention. This is a graph showing the displacement amount for one rotation of the cylindrical workpiece surface treatment apparatus of the present invention. This is a graph showing the correction data for the cylindrical workpiece surface treatment apparatus of the present invention. This is a graph showing the corrected rotation angle sensor signal data for the cylindrical workpiece surface treatment apparatus of the present invention. This is a graph showing the exposure error range of Example 1. This is a graph showing the exposure error range of Comparative Example 1.

[0014] The embodiments of the present invention are described below, but these embodiments are illustrative examples, and it goes without saying that various modifications are possible as long as they do not deviate from the technical concept of the present invention. The same components are denoted by the same reference numerals.

[0015] In Figure 1, reference numeral 10 indicates one embodiment of the circumferential surface treatment device for cylindrical workpieces according to the present invention.

[0016] The cylindrical workpiece circumferential processing device 10 includes a rotating shaft 12 on which a cylindrical workpiece W is mounted and rotated, a circumferential processing device 14 for performing a predetermined process on the circumferential surface of the rotating cylindrical workpiece W, a control device 16 for controlling the circumferential processing device 14, a circumferential displacement sensor 18 that can measure the displacement of the circumferential surface of the cylindrical workpiece W by sensing the surface of the rotating cylindrical workpiece W, and a rotation angle sensor 20 provided on the rotating shaft 12 for measuring the rotation angle of the cylindrical workpiece W.

[0017] The cylindrical workpiece circumferential processing device 10 measures the displacement amount of the cylindrical workpiece W over one rotation using the circumferential displacement sensor 18, in synchronization with the signal from the rotation angle sensor 20. From the measured displacement amount over one rotation, the eccentricity amount and direction of eccentricity when the cylindrical workpiece W is fixed to the rotation axis 12 are estimated. Correction data is calculated from the estimated eccentricity amount and direction of eccentricity, and the signal from the rotation angle sensor 20 is corrected based on the correction data, and the circumferential processing device 14 is controlled by the control device 16.

[0018] Any known circumferential surface processing device can be used as the circumferential surface processing device 14, as long as it is a device that processes the circumferential surface of a cylindrical workpiece. In the present invention, it is particularly preferable that the circumferential surface processing device 14 is an exposure laser device or an electronic engraving device. In the illustrated example, an example is shown in which an exposure laser device is used as the circumferential surface processing device 14.

[0019] Any known cylindrical workpiece can be used as the cylindrical workpiece W. In this invention, the cylindrical workpiece W is particularly preferably, for example, a plate base material for gravure printing, a plate base material for flexographic printing, or a plate base material for rotary screen printing. All of these plate base materials are cylindrical.

[0020] The following description will use a cylindrical workpiece surface treatment device 10, which uses an exposure laser device as the aforementioned surface treatment device 14, as an example. The cylindrical workpiece surface treatment device 10 can be suitably used by being incorporated into a plate-making device that utilizes laser light.

[0021] a) An exposure laser head, which is an exposure laser device that is a circumferential surface processing device 14, is installed, and a circumferential surface displacement sensor 18 capable of measuring the displacement of the circumferential surface of the cylindrical workpiece W is installed separately from the exposure laser head of the circumferential surface processing device 14.

[0022] b) The cylindrical workpiece W is fixed to the rotating shaft 12 and rotated.

[0023] c) The amount of displacement 24 for one rotation of the cylindrical workpiece W is measured in synchronization with the signal 22 from the rotation angle sensor 20 installed on the rotating shaft 12.

[0024] d) The eccentricity 26 and eccentricity direction 28 when the cylindrical workpiece is fixed to the rotation axis are estimated from the measured displacement amount 24 for one rotation, and are used as the estimated eccentricity amount: E and estimated eccentricity direction: TE to calculate correction data. An example of the measured displacement amount 24 for one rotation is shown in Figure 2. In Figure 2, the measurement position on the horizontal axis [5000p / r] means that the rotation angle sensor 20 generates 5000 pulses per rotation, and the position in the circumferential direction is represented by the number of pulses.

[0025] e) Correction data 30 is calculated from the estimated eccentricity amount: E and the estimated eccentricity direction: TE, and the signal 22 from the rotation angle sensor 20 is corrected. An example of the correction data 30 is shown in Figure 3. In Figure 3, the data position on the horizontal axis [5000p / r] means that the rotation angle sensor 20 generates 5000 pulses per rotation, and the position in the circumferential direction is represented by the number of pulses.

[0026] As a method for calculating correction data, if the angle detected by the rotation angle sensor 20 is θ, the angle error is δ, and the cylindrical radius is R, then the exposure rotation angle for an eccentric cylindrical workpiece can be considered to be (θ + δ), and if we set Ex = E * cos(TE) and Ey = E * sin(TE) ... (1), then we can derive the relationship tan(θ) = (sin(θ + δ) + Ey / R) / (cos(θ + δ) + Ex / R) ... (2), and solving for the angle error δ, we get δ = asin((Ex * sin(θ) - Ey * cos(θ)) / R) ... (3). This allows us to calculate the angle error δ with respect to the detected angle and set an angle correction function.

[0027] In the illustrated example, the rotation angle sensor 20 is an incremental sensor and detects angular velocity rather than angular position. Therefore, in order to perform angle correction, correction data is calculated from the velocity correction function obtained by differentiating the angle correction function. In this way, the corrected signal 32 of the rotation angle sensor 20 is calculated. An example of the corrected signal 32 of the rotation angle sensor 20 is shown in Figure 4. In Figure 4, the measurement position on the horizontal axis [5000p / r] means that the rotation angle sensor 20 generates 5000 pulses per rotation, and the position in the circumferential direction is represented by the number of pulses.

[0028] f) The exposure laser head, which is an exposure laser device and is a circumferential surface processing device 14, is controlled 34 in synchronization with the corrected rotation angle sensor signal 32.

[0029] g) Continue the sub-scan while performing the above operations in parallel and continuously until the end of the image.

[0030] In this way, the circumferential surface treatment of a cylindrical workpiece can be performed using the circumferential surface treatment device 10 for cylindrical workpieces. That is, the circumferential surface treatment method for a cylindrical workpiece of the present invention is a method for treating the circumferential surface of a cylindrical workpiece, which includes the steps of: attaching a cylindrical workpiece W to a rotating shaft 12 and rotating it; sensing the surface of the rotating cylindrical workpiece W and measuring the amount of displacement 24 for one rotation of the cylindrical workpiece W by the circumferential displacement sensor 18 in synchronization with the signal 22 of the rotation angle sensor 20; estimating the amount of eccentricity and direction of eccentricity when the cylindrical workpiece W is fixed to the rotating shaft 12 from the measured amount of displacement 24 for one rotation; calculating correction data from the estimated estimated eccentricity 26 (E) and estimated eccentricity direction 28 (TE) and correcting the signal 22 of the rotation angle sensor 20 based on the correction data; and controlling the circumferential surface treatment device 14 by the control device 16 and performing a predetermined treatment on the circumferential surface of the cylindrical workpiece W. In the illustrated example, an example of an exposure process using an exposure laser head, which is an exposure laser device, is shown as a circumferential surface processing step that performs a predetermined process on the circumferential surface of a cylindrical workpiece W.

[0031] When manufacturing a product having a cylindrical portion with a circumferential surface treatment using the cylindrical workpiece circumferential surface treatment device 10, the process is the same as the above-described method for circumferential surface treatment of a cylindrical workpiece, followed by the step of removing the cylindrical workpiece W with the circumferential surface treatment from the rotating shaft 12, thereby providing a method for manufacturing a product having a cylindrical portion with a circumferential surface treatment.

[0032] As described above, a cylindrical workpiece circumferential surface processing device and method are obtained that enable high-precision circumferential surface processing regardless of the workpiece accuracy or the accuracy of fixing to the rotating shaft. Furthermore, by incorporating the above cylindrical workpiece circumferential surface processing device into a plate-making device, a plate-making device is obtained that enables high-precision image transfer regardless of the workpiece accuracy or the accuracy of fixing to the rotating shaft.

[0033] The present invention will be described in more detail below with reference to examples, but it goes without saying that these examples are provided as illustrations and should not be interpreted as limiting. (Example 1)

[0034] <Preparation of the plate-making roll from the plate base material> A plate base material (aluminum hollow roll) with a circumference of 600 mm and a face length of 1100 mm was prepared. The plate base material (aluminum hollow roll) was placed in a copper plating tank, and the hollow roll was completely submerged in the plating solution. An 80 μm copper plating layer was formed at a current density of 30 A / dm2 and a voltage of 6.0 V. The plated surface was free of bumps and pits, and a uniform copper plating layer was obtained. The surface of this copper plating layer was polished using a two-head polishing machine (polishing machine manufactured by Think Laboratory Co., Ltd.) to create a uniform polished surface.

[0035] Next, a photosensitive material (thermal resist: TSER2104E4 (manufactured by Think Laboratory Co., Ltd.)) was applied to the surface of the roll to be treated, on which the copper plating layer was formed, using a fountain coater, and then dried. The thickness of the resulting photosensitive material was measured with a film thickness gauge (FILLMETRICS F20) and was found to be 4.5 μm.

[0036] A cylindrical workpiece surface treatment apparatus with a configuration similar to that of the cylindrical workpiece surface treatment apparatus 10 in Figure 1, which is equipped with an exposure laser head as an exposure laser device, was prepared, and exposure was performed using the cylindrical workpiece surface treatment method.

[0037] <Exposure results with correction> Cylinder runout: 36.7 [μm] Exposure error runout: 6.4 [μm] Improvement rate: 82.6 [%] The results for the exposure error runout are shown in Figure 5.

[0038] The above laser exposure was performed using a Laser Stream FX with an exposure condition of 300 mJ / cm². 2 A predetermined pattern exposure was performed. Development was carried out using a TLD developer (developer manufactured by Think Laboratory Co., Ltd.) at a developer dilution ratio (original solution 1: water 7) at 24°C for 90 seconds to form a predetermined resist pattern. Next, the copper plating layer was etched using the formed resist pattern as an etching mask. Cupric chloride solution was used as the etching solution and the process was carried out by spraying at 35°C for 100 seconds. Next, sodium hydroxide was used at a dilution ratio of 20 g / L at 40°C for 180 seconds to remove the resist from the resist pattern. In this way, numerous square recesses (gravure cells) with a depth of 10 μm and sides of 100 μm were formed in the solid areas. A 3 μm thick chromium plating layer was formed on the upper surface of the copper plating layer of the plate-making roll on which these gravure cells were formed, and the surface was polished to obtain a plate-making roll (a plate-making gravure cylinder).

[0039] (Comparative Example 1) Exposure was performed using the same circumferential surface treatment method for a cylindrical workpiece as in Example 1, except that no correction data was calculated. <Results of exposure without correction> Cylinder runout: 80 [μm] Exposure error runout: 82 [μm] Improvement rate: 0 [%] The results of the exposure error runout are shown in Figure 6.

[0040] Furthermore, a plate-making roll (a gravure cylinder with a plate made on it) was obtained in the same manner as in Example 1.

[0041] The effectiveness of the correction can be seen from the exposure results with and without correction in Example 1 and Comparative Example 1. With correction, the cylinder runout and exposure error runout were extremely small, and high-precision exposure processing was possible regardless of the workpiece accuracy or the accuracy of fixing to the rotating shaft.

[0042] 10: Circumferential surface processing device for cylindrical workpiece, 12: Rotating axis, 14: Circumferential surface processing device, 16: Control device, 18: Circumferential displacement sensor, 20: Rotation angle sensor, 22: Signal, 24: Displacement amount, 26: Estimated eccentricity amount, 28: Estimated eccentricity direction, 30: Correction data, 32: Signal from rotation angle sensor, 34: Control, W: Cylindrical workpiece.

Claims

1. A cylindrical workpiece circumferential processing device comprising: a rotating shaft on which a cylindrical workpiece is mounted and rotated; a circumferential surface processing device for performing a predetermined process on the circumferential surface of the rotating cylindrical workpiece; a control device for controlling the circumferential surface processing device; a circumferential surface displacement sensor capable of measuring the displacement of the circumferential surface of the cylindrical workpiece by sensing the surface of the rotating cylindrical workpiece; and a rotation angle sensor provided on the rotating shaft for measuring the rotation angle of the cylindrical workpiece. The device comprises:

1. A cylindrical workpiece circumferential processing device comprising: a rotating shaft on which a cylindrical workpiece is mounted and rotated; 2. A circumferential surface processing device for a cylindrical workpiece, comprising:

1. A performing a predetermined process on the circumferential surface of the rotating cylindrical workpiece; 2. A circumferential surface processing device for performing a predetermined process on the circumferential surface of the rotating cylindrical workpiece; 3. A circumferential surface processing device for performing a predetermined process on the circumferential surface of the rotating cylindrical workpiece; 4. A circumferential surface processing device for performing a predetermined process on 2. The circumferential surface processing apparatus for a cylindrical workpiece according to claim 1, wherein the circumferential surface processing device is an exposure laser device or an electronic engraving device.

3. The circumferential surface processing device for a cylindrical workpiece according to claim 1, wherein the cylindrical workpiece is a plate base material for gravure printing, a plate base material for flexographic printing, or a plate base material for rotary screen printing.

4. A method for processing the circumferential surface of a cylindrical workpiece using a circumferential surface processing device for a cylindrical workpiece according to any one of claims 1 to 3, comprising: a step of mounting the cylindrical workpiece to a rotating shaft and rotating it; a step of sensing the surface of the rotating cylindrical workpiece and measuring the amount of displacement of the cylindrical workpiece over one rotation using a circumferential displacement sensor in synchronization with the signal of the rotation angle sensor; a step of estimating the amount of eccentricity and direction of eccentricity when the cylindrical workpiece is fixed to the rotating shaft from the measured amount of displacement over one rotation; a step of calculating correction data from the estimated estimated amount of eccentricity and estimated direction of eccentricity and correcting the signal of the rotation angle sensor based on the correction data; and a circumferential surface processing step of controlling the circumferential surface processing device with the control device and performing a predetermined processing on the circumferential surface of the cylindrical workpiece.

5. A method for manufacturing a product having a cylindrical portion having a circumferentially processed surface using a cylindrical workpiece circumferential processing device according to any one of claims 1 to 3, comprising: a step of attaching a cylindrical workpiece forming the cylindrical portion to a rotating shaft and rotating it; a step of sensing the surface of the rotating cylindrical workpiece and measuring the amount of displacement of the cylindrical workpiece over one rotation using a circumferential displacement sensor in synchronization with the signal of the rotation angle sensor; a step of estimating the amount of eccentricity and direction of eccentricity when the cylindrical workpiece is fixed to the rotating shaft from the measured amount of displacement over one rotation; a step of calculating correction data from the estimated estimated amount of eccentricity and estimated direction of eccentricity and correcting the signal of the rotation angle sensor based on the correction data; a circumferential processing step of controlling the circumferential processing device with the control device and performing a predetermined processing on the circumferential surface of the cylindrical workpiece; and a step of removing the cylindrical workpiece having the circumferentially processed surface from the rotating shaft.

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