Light-emitting substrate and display apparatus

Abstract

The present application belongs to the technical field of display. Disclosed are a light-emitting substrate and a display apparatus. The light-emitting substrate comprises: a base substrate, light-emitting units, an electromagnetic touch-control layer, a first driving portion, and a second driving portion. The light-emitting units are driven by means of the first driving portion, and the electromagnetic touch-control layer is driven by means of the second driving portion, such that the light-emitting substrate can have both a touch-control function and a display function. Moreover, since the electromagnetic touch-control layer and the first and second driving portions are respectively located on two sides of the base substrate, during the process of the second driving portion processing an electromagnetic signal, which is generated by the electromagnetic touch-control layer, to sense a touch position of an active electromagnetic pen and the first driving portion driving a plurality of light-emitting units to emit light, neither the first driving portion nor the second driving portion affects the electromagnetic signal generated by the electromagnetic touch-control layer, such that the light-emitting substrate can more accurately sense the touch position of the active electromagnetic pen, thereby improving the touch-control accuracy of the light-emitting substrate.

Description

Light-emitting substrate and display device Technical Field

[0001] This application relates to the field of display technology, and in particular to a light-emitting substrate and a display device. Background Technology

[0002] With the continuous development of science and technology, touch display devices are being used more and more widely in people's work and daily life, bringing great convenience to people's work and daily life, and becoming an indispensable tool for people today.

[0003] Touch display panels are the main components that enable touch display functions in display devices. Currently, display panels that achieve touch functionality through electromagnetic induction technology offer numerous advantages, such as precise positioning, high accuracy, and fast response speed. Meanwhile, display panels that achieve display functionality through light-emitting diodes (LEDs) offer advantages such as small size, high resolution, high brightness, high luminous efficiency, and low power consumption.

[0004] However, electromagnetic induction technology is currently difficult to apply to LED display panels.

[0005] Summary of the Invention

[0006] This application provides a light-emitting substrate and a display device. It solves the problem of low electromagnetic touch accuracy in existing LED display panels. The technical solution is as follows:

[0007] On one hand, a light-emitting substrate is provided, the light-emitting substrate having a display area and a non-display area distributed around the display area; the light-emitting substrate includes: a substrate, a light-emitting unit, an electromagnetic touch layer, a first driving part and a second driving part;

[0008] The substrate has a plurality of first conductive portions and a plurality of second conductive portions, both of which penetrate the substrate. The plurality of first conductive portions are distributed in the display area, and the plurality of second conductive portions are distributed in the non-display area.

[0009] The number of light-emitting units is multiple, and the multiple light-emitting units are distributed on the same side of the substrate, and the multiple light-emitting units are electrically connected to the multiple first conductive parts.

[0010] The electromagnetic touch layer is located on the side of the substrate on which the plurality of light-emitting units are disposed, and is insulated from the plurality of light-emitting units. The electromagnetic touch layer is electrically connected to the plurality of second conductive parts.

[0011] Both the first driving unit and the second driving unit are located on the side of the substrate away from the plurality of light-emitting units, and the first driving unit is electrically connected to the plurality of first conductive parts, and the second driving unit is electrically connected to the plurality of second conductive parts.

[0012] Optionally, the electromagnetic touch layer includes: a first coil layer and a second coil layer stacked together, wherein the first coil layer is insulated from the second coil layer, and the first coil layer is closer to the substrate than the second coil layer;

[0013] The first coil layer includes at least a plurality of first signal lines distributed within the display area, the overall extension direction of the first signal lines being parallel to a first direction; the second coil layer includes at least a plurality of second signal lines distributed within the display area, the overall extension direction of the second signal lines being parallel to a second direction; the first direction and the second direction intersect.

[0014] Optionally, the first coil layer further includes: multiple first connecting lines and multiple second connecting lines;

[0015] The plurality of first signal lines are divided into a plurality of groups of first signal lines, and each group of first signal lines includes two adjacent first signal lines; the plurality of groups of first signal lines correspond one-to-one with the plurality of first connecting lines and one-to-one with the plurality of second connecting lines.

[0016] In this configuration, the two ends of one of the first connecting lines are respectively connected to the first ends of two adjacent first signal lines in a corresponding set of first signal lines; the two ends of one of the second connecting lines are respectively connected to the second ends of two adjacent first signal lines in a corresponding set of first signal lines.

[0017] Optionally, the plurality of first signal lines correspond one-to-one with a portion of the plurality of second conductive parts, and the first signal line is electrically connected to the corresponding second conductive part.

[0018] Optionally, the first signal line includes: a plurality of straight segments and a plurality of bent segments, wherein the plurality of straight segments and the plurality of bent segments are arranged alternately, and adjacent straight segments are connected to bent segments;

[0019] The straight line segment extends in a direction parallel to the first direction.

[0020] Optionally, the overall extension direction of the bent segment is parallel to the second direction, and the two ends of the bent segment are respectively connected to the ends of two straight segments distributed on both sides of the bent segment in the first direction.

[0021] Optionally, the plurality of light-emitting units are divided into multiple groups of light-emitting units, and each group of light-emitting units includes at least three light-emitting units, and the at least three light-emitting units in a group of light-emitting units are connected in series from end to end;

[0022] The orthographic projection of the bent segment on the substrate is located within the area enclosed by the orthographic projections of a group of light-emitting units on the substrate.

[0023] Optionally, the second coil layer further includes: multiple third connecting lines and multiple fourth connecting lines, wherein the multiple third connecting lines and the multiple fourth connecting lines are respectively distributed on both sides of the display area in the second direction, and the multiple third connecting lines and the multiple fourth connecting lines are alternately arranged in the first direction;

[0024] In this configuration, the first end of one of the second signal lines is connected to one end of one of the third connecting lines, and the second end of one of the second signal lines is connected to the fourth connecting line.

[0025] Optionally, the ends of the two outermost second signal lines in the first direction are respectively connected to two of the multiple second conductive parts.

[0026] Optionally, the orthographic projection of the light-emitting unit on the substrate does not coincide with the orthographic projection of the first coil layer on the substrate, nor with the orthographic projection of the second coil layer on the substrate.

[0027] Optionally, the light-emitting substrate further includes: a first driving circuit layer and a second driving circuit layer;

[0028] The first driving circuit layer is located on the side of the substrate facing the plurality of light-emitting units. The first driving circuit layer is electrically connected to the plurality of light-emitting units and to the first conductive part.

[0029] The second driving circuit layer is located on the side of the substrate opposite to the first driving circuit layer. The second driving circuit layer is electrically connected to the first driving part and to the plurality of first conductive parts.

[0030] Optionally, the light-emitting substrate further includes: a first passivation layer, a second passivation layer, and a third passivation layer;

[0031] The first passivation layer is located on the side of the first driving circuit layer away from the substrate, the first coil layer and the second coil layer are stacked on the side of the first passivation layer away from the substrate, and the second passivation layer is located on the side of the second coil layer away from the substrate.

[0032] The third passivation layer is located on the side of the second driving circuit layer that is away from the substrate.

[0033] The thickness of the third passivation layer is greater than the thickness of the first passivation layer.

[0034] Optionally, the light-emitting substrate further includes a planarization layer located between the first coil layer and the second coil layer;

[0035] The light-emitting substrate has a plurality of first vias penetrating the planarization layer and the first passivation layer, and a third conductive portion located in each of the first vias, the two ends of the third conductive portion being electrically connected to the first driving circuit layer and the light-emitting unit, respectively.

[0036] Optionally, the thickness of the second coil layer is greater than the thickness of the first coil layer;

[0037] At least a portion of the second coil layer and the third conductive portion are formed simultaneously in the same process.

[0038] Optionally, the width of the orthographic projection of the first signal line on the substrate is greater than the width of the orthographic projection of the second signal line on the substrate.

[0039] On the other hand, a display device is also provided, comprising any of the light-emitting substrates described above.

[0040] The beneficial effects of the technical solutions provided in this application include at least the following:

[0041] By driving the light-emitting units with a first driving unit and driving the electromagnetic touch layer with a second driving unit, the light-emitting substrate can simultaneously possess touch display functionality. Since the electromagnetic touch layer and the first and second driving units are located on opposite sides of the substrate, the second driving unit processes the electromagnetic signals generated by the electromagnetic touch layer to sense the touch position of the active electromagnetic pen. Furthermore, during the process of the first driving unit driving multiple light-emitting units to emit light, neither the first nor the second driving unit affects the electromagnetic signals generated by the electromagnetic touch layer. This allows the light-emitting substrate to more accurately sense the touch position of the active electromagnetic pen, improving the touch precision of the light-emitting substrate. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 is a top view of a light-emitting substrate provided in an embodiment of this application;

[0044] Figure 2 is a cross-sectional view of the light-emitting substrate shown in Figure 1 at point A-A';

[0045] Figure 3 is a cross-sectional view of the light-emitting substrate shown in Figure 1 at point B-B';

[0046] Figure 4 is a top view of the back of a light-emitting substrate provided in an embodiment of this application;

[0047] Figure 5 is a top view of another light-emitting substrate provided in an embodiment of this application;

[0048] Figure 6 is a cross-sectional view of the light-emitting substrate shown in Figure 5 at point C-C';

[0049] Figure 7 is a top view of a set of first signal lines provided in an embodiment of this application;

[0050] Figure 8 is a top view of a second coil layer provided in an embodiment of this application;

[0051] Figure 9 is a partially enlarged top view of the light-emitting substrate shown in Figure 5;

[0052] Figure 10 is another cross-sectional view of the light-emitting substrate shown in Figure 1 at point A-A';

[0053] Figure 11 is another cross-sectional view of the light-emitting substrate shown in Figure 1 at point B-B';

[0054] Figure 12 is a schematic diagram of a fourth passivation layer and a fifth passivation layer formed on both sides of a substrate according to an embodiment of this application;

[0055] Figure 13 is a schematic diagram of forming a first conductive part according to an embodiment of this application;

[0056] Figure 14 is a schematic diagram of forming a first driving circuit layer and a second driving circuit layer according to an embodiment of this application;

[0057] Figure 15 is a schematic diagram of forming a first passivation layer and a second passivation layer according to an embodiment of this application;

[0058] Figure 16 is a schematic diagram of forming a first coil layer according to an embodiment of this application;

[0059] Figure 17 is a schematic diagram of a planarization layer provided in an embodiment of this application;

[0060] Figure 18 is a schematic diagram of another planarization layer provided in an embodiment of this application;

[0061] Figure 19 is a schematic diagram of a second coil layer provided in this application example;

[0062] Figure 20 is a schematic diagram of a third conductive part formed according to an embodiment of this application. Detailed Implementation

[0063] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0064] This application provides a light-emitting substrate. Please refer to Figures 1, 2, 3, and 4. Figure 1 is a top view of the light-emitting substrate provided in this application embodiment. Figure 2 is a cross-sectional view of the light-emitting substrate shown in Figure 1 along line A-A'. Figure 3 is a cross-sectional view of the light-emitting substrate shown in Figure 1 along line B-B'. Figure 4 is a top view of the back side of the light-emitting substrate provided in this application embodiment. The light-emitting substrate may have a display area M and a non-display area N distributed around the display area M. The light-emitting substrate may include: a substrate 100, a light-emitting unit 200, an electromagnetic touch layer 300, a first driving part 401, and a second driving part 402. It should be noted that the light-emitting unit 200 and the electromagnetic touch layer 300 shown in Figure 1 are enlarged views, and the first driving part 401 and the second driving part 402 shown in Figure 4 are also enlarged views.

[0065] The substrate 100 in the light-emitting substrate may have a plurality of first conductive portions 101 and a plurality of second conductive portions 102. The plurality of first conductive portions 101 may be distributed in the display area M, and the plurality of second conductive portions 102 may be distributed in the non-display area N. Both the first conductive portions 101 and the second conductive portions 102 penetrate the substrate 100. Here, the substrate 100 may have a plurality of through holes penetrating the substrate 100. Through an electroplating process, a metallic conductive material can be filled into the through holes of the substrate 100 to form the first conductive portions 101 or the second conductive portions 102 in different through holes.

[0066] The number of light-emitting units 200 in the light-emitting substrate can be multiple, and the multiple light-emitting units 200 are all distributed on the same side of the substrate 100, and the multiple light-emitting units 200 can be electrically connected to the multiple first conductive parts 101 respectively. Here, the light-emitting units 200 in the light-emitting substrate can be used to emit light to realize the light emission of the light-emitting substrate.

[0067] The electromagnetic touch layer 300 in the light-emitting substrate can be located on one side of the substrate 100 where multiple light-emitting units 200 are disposed, and can be insulated from the multiple light-emitting units 200. The electromagnetic touch layer 300 can be electrically connected to the second conductive part 102.

[0068] The first driving portion 401 and the second driving portion 402 in the light-emitting substrate can both be located on the side of the substrate 100 away from the plurality of light-emitting units 200. The first driving portion 401 can be electrically connected to the plurality of first conductive portions 101, and the second driving portion 402 can be electrically connected to the second conductive portions 102. As shown in FIG4, the first driving portion 401 in the light-emitting substrate can be distributed opposite to the plurality of first conductive portions 101 on the side of the substrate 100 away from the light-emitting units 200, and the second driving portion 402 in the light-emitting substrate can be distributed opposite to the plurality of second conductive portions 102 on the side of the substrate 100 away from the electromagnetic touch layer 300.

[0069] In this way, the first driving unit 401 in the light-emitting substrate can drive multiple light-emitting units 200 to emit light through multiple first conductive parts 101, thereby realizing the display of the image on the light-emitting substrate. The second driving unit 402 in the light-emitting substrate can drive the electromagnetic touch layer 300 through multiple second conductive parts 102, so that the light-emitting substrate has electromagnetic touch function. Here, the electromagnetic touch layer 300 can generate a magnetic field. When the user touches the light-emitting substrate with an active electromagnetic pen, the magnetic field at the position corresponding to the touch position in the magnetic field generated by the electromagnetic touch layer 300 will be disturbed, and an induced current will be generated at the position corresponding to the touch position in the electromagnetic touch layer 300 as an electromagnetic touch signal. The second driving unit 402 can process the induced current to convert the corresponding electromagnetic touch signal into corresponding position information, so as to determine the position of the user touching the light-emitting substrate with the active electromagnetic pen. Then, the first driving unit 401 can drive the light-emitting unit 200 at that position to emit light, thereby realizing the touch display function of the user controlling the display of the light-emitting substrate with the active electromagnetic pen.

[0070] In this application, since the electromagnetic touch layer 300 in the light-emitting substrate is located on both sides of the substrate 100, the first driving part 401 and the second driving part 402 are respectively located on both sides of the substrate 100. Therefore, when the second driving part 402 processes the electromagnetic touch layer 300 to generate electromagnetic signals to sense the touch position of the active electromagnetic pen, and when the first driving part 401 drives the multiple light-emitting units 200 to emit light, neither the first driving part 401 nor the second driving part 402 will interfere with the electromagnetic signals generated by the electromagnetic touch layer 300. This allows the light-emitting substrate to sense the touch position of the active electromagnetic pen more accurately, thereby improving the touch accuracy of the light-emitting substrate.

[0071] In summary, this application provides a light-emitting substrate, including: a substrate, light-emitting units, an electromagnetic touch layer, a first driving unit, and a second driving unit. By driving the light-emitting units through the first driving unit and driving the electromagnetic touch layer through the second driving unit, the light-emitting substrate can simultaneously possess touch display functionality. Furthermore, since the electromagnetic touch layer and the first and second driving units are located on opposite sides of the substrate, the second driving unit processes the electromagnetic signals generated by the electromagnetic touch layer to sense the touch position of the active electromagnetic pen. During the process of the first driving unit driving multiple light-emitting units to emit light, neither the first nor the second driving unit affects the electromagnetic signals generated by the electromagnetic touch layer. This allows the light-emitting substrate to more accurately sense the touch position of the active electromagnetic pen, improving the touch accuracy of the light-emitting substrate.

[0072] Optionally, please refer to Figures 5 and 6. Figure 5 is a top view of another light-emitting substrate provided in an embodiment of this application, and Figure 6 is a cross-sectional view of the light-emitting substrate shown in Figure 5 at point C-C'. The electromagnetic touch layer 300 in the light-emitting substrate may include a first coil layer 301 and a second coil layer 302 stacked together. The first coil layer 301 may be insulated from the second coil layer 302. Furthermore, the first coil layer 301 in the electromagnetic touch layer 300 may be closer to the substrate 100 than the second coil layer 302.

[0073] The first coil layer 301 in the electromagnetic touch layer 300 may include at least a plurality of first signal lines 3011 distributed within the display area M of the light-emitting substrate, and the overall extension direction of the first signal lines 3011 may be parallel to the first direction X. The second coil layer 302 in the electromagnetic touch layer 300 may include at least a plurality of second signal lines 3021 distributed within the display area M of the light-emitting substrate, and the overall extension direction of the second signal lines 3021 may be parallel to the second direction Y. Here, the first direction X may intersect with the second direction Y; for example, the first direction X may intersect the second direction Y perpendicularly.

[0074] Thus, after a user touches the light-emitting substrate with an active electromagnetic pen, the second driving unit 102 can determine the position information of the touch location in the first direction X through the electromagnetic signal generated by the first coil layer 301. Simultaneously, the second driving unit 102 can also determine the position information of the touch location in the second direction Y through the electromagnetic signal generated by the second coil layer 302. In this way, by positioning the first coil layer 301 and the second coil layer 302 in the first direction X and the second direction Y respectively, the specific location of the touch can be determined.

[0075] Optionally, as shown in Figures 5 and 7, Figure 7 is a top view of a set of first signal lines provided in an embodiment of this application. The first coil layer 301 in the electromagnetic touch layer 300 may further include: multiple first connecting lines 3012 and multiple second connecting lines 3013. The multiple first signal lines 3011 in the first coil layer 301 may be divided into multiple sets of first signal lines, and a set of first signal lines may include two adjacent first signal lines 3011. The multiple sets of first signal lines may correspond one-to-one with the multiple first connecting lines 3012 and one-to-one with the multiple second connecting lines 3013. The two ends of a first connecting line 3012 may be connected to the first ends of two adjacent first signal lines 3011 in a corresponding set of first signal lines. The two ends of a second connecting line 3012 may be connected to the second ends of two adjacent first signal lines 3011 in a corresponding set of first signal lines.

[0076] Thus, in a set of first signal lines, a first connecting line 3012, a first signal line 3011, a second connecting line 3013, and another first signal line 3011 can be connected end to end to form a closed-loop coil A. Therefore, the first coil layer 301 in the electromagnetic touch layer 300 can be a multi-turn coil layer including multiple closed-loop coils A. When a user touches the light-emitting substrate with an active electromagnetic pen, the closed-loop coil A in the first coil layer 301 corresponding to the touch position will generate an induced current as an electromagnetic touch signal. The second driving unit 402 can process this induced current to convert the corresponding electromagnetic touch signal into corresponding position information in the first direction X.

[0077] Optionally, as shown in Figure 5, multiple sets of first signal lines in the first coil layer 301 can correspond one-to-one with a portion of the multiple second conductive parts 102, and the first signal line 3011 can be electrically connected to the corresponding second conductive part 102. In this way, multiple closed-loop coils A in the first coil layer 301 can correspond one-to-one with a portion of the multiple second conductive parts 102, and through the electrical connection of the first signal line 3011 to the corresponding second conductive part 102, each closed-loop coil A can be electrically connected to its corresponding second conductive part 102.

[0078] It should be noted that the overall extension direction of the closed-loop coil A can be parallel to the first direction X, and multiple closed-loop coils A can be arranged sequentially in the second direction Y. In this way, a portion of the multiple second conductive portions 102 corresponding to the multiple closed-loop coils A can be arranged in a row along the second direction Y within the non-display area N of the light-emitting substrate. Two adjacent first signal lines 3011 in a closed-loop coil A can be connected to a second connecting line 3013 at their ends facing the second conductive portion 102. Therefore, a closed-loop coil A can achieve electrical connection with its corresponding second conductive portion 102 through the connection between the second connecting line 3013 and the corresponding second conductive portion 102.

[0079] In this way, when the user touches the light-emitting substrate with an active electromagnetic pen, the induced current generated at the position corresponding to the touch position in the corresponding closed-loop coil A can be conducted to the corresponding second conductive part 102 through the first signal line 3011 and the second connecting line 3013, and then conducted to the second driving part 402 through the corresponding second conductive part 102, so that the second driving part 402 processes the received current to convert the electromagnetic touch signal into corresponding position information, thereby determining the position information of the touch position in the first direction X.

[0080] Optionally, as shown in Figure 7, the first signal line 3011 in the first coil layer 301 may include multiple straight segments 3011a and multiple bent segments 3011b. The multiple straight segments 3011a and multiple bent segments 3011b in a single first signal line 3011 may be arranged alternately, and adjacent straight segments 3011a and bent segments 3011b may be connected. The extension direction of the straight segments 3011a in the first signal line 3011 may be parallel to the first direction X, thus ensuring that the overall extension direction of the first signal line 3011 is parallel to the first direction X.

[0081] The overall extension direction of the bent segment 3011b in the first signal line 3011 can be parallel to the second direction Y, and the two ends of the bent segment 3011b distributed in the second direction Y can be connected to the ends of the two straight segments 3011a distributed on both sides of the bent segment 3011b in the first direction X, respectively. That is, for a bent segment 3011b, one of the two straight segments 3011a distributed on both sides of the bent segment 3011b in the first direction X can be connected to the first end of the bent segment 3011b arranged in the second direction Y, and the other straight segment 3011a can be connected to the second end of the bent segment 3011b arranged in the second direction Y. In this way, by alternating the arrangement of multiple straight segments 3011a and multiple bends 3011b, a first signal line 3011 can be connected.

[0082] In this way, the multiple straight segments 3011a in the first signal line 3011 can ensure that the overall extension direction of the first signal line 3011 is parallel to the first direction X. The multiple bent segments 3011b in the first signal line 3011 extending along the second direction Y can increase the overall routing path of the first signal line 3011 while keeping the length of the first signal line 3011 in the first direction X unchanged, thereby increasing the strength of the electromagnetic touch signal generated by the first coil layer 301.

[0083] It should be noted that, as shown in Figure 7, the routing path of the bend segment 3011b in the first signal line 3011 in the second direction Y can be S-shaped. The S-shaped routing not only increases the routing path of the first signal line 3011 in the first direction X, but also increases the routing path of the first signal line 3011 in the second direction Y, making the overall routing path of the first signal line 3011 more uniform.

[0084] It should also be noted that, as shown in Figure 7, when the routing path of the bend segment 3011b in the first signal line 3011 in the second direction Y can be S-shaped, in order to ensure the normal connection of the multiple straight segments 3011a and multiple bend segments 3011a arranged alternately in the first signal line 3011, the routing path of one bend segment 3011b of two adjacent bend segments 3011b can be S-shaped, and the routing path of the other bend segment 3011b can be inverted S-shaped.

[0085] In addition, to ensure that in a set of first signal lines, one first connecting line 3012, one first signal line 3011, one second connecting line 3013 and another first signal line 3011 can be connected end to end to form a closed loop coil A, both ends of the two first signal lines 3011 can end with a straight line segment 3011a, the first connecting line 3012 can be connected to the straight line segment 3011a, and the second connecting line 3013 can be connected to the straight line segment 3011a.

[0086] Optionally, as shown in Figure 8, which is a top view of a second coil layer provided in an embodiment of this application, the second coil layer 302 in the electromagnetic touch layer 300 may further include: multiple third connecting lines 3022 and multiple fourth connecting lines 3023 extending in the first direction X. The multiple third connecting lines 3022 and multiple fourth connecting lines 3023 in the second coil layer 302 may be distributed on both sides of the display area M of the light-emitting substrate in the second direction Y, and the multiple third connecting lines 3022 and multiple fourth connecting lines 3023 may be arranged alternately in the first direction X. Specifically, the first end of a second signal line 3021 in the second coil layer 302 may be connected to one end of a third connecting line 3022, and the second end of a second signal line 3021 may be connected to a fourth connecting line 3023.

[0087] For example, a third connecting line 3022, a second signal line 3021, and a fourth connecting line 3023 connected in sequence can be arranged in a Z-shape, and a fourth connecting line 3023, a second signal line 3021, and a third connecting line 3022 connected in sequence can be arranged in an inverted Z-shape. Furthermore, when the first direction X is perpendicular to the second direction Y, the extension direction of the third connecting line 3022 is perpendicular to the extension direction of the second signal line 3021, and the extension direction of the fourth connecting line 3023 is perpendicular to the extension direction of the second signal line 3021.

[0088] Since the extension direction of the second signal line 3021 is parallel to the second direction Y, multiple second signal lines 3021 in the second coil layer 302 can be arranged sequentially along the first direction X, thus arranging multiple second signal lines 3021 within the display area M of the light-emitting substrate. Furthermore, the multiple second signal lines 3021 arranged within the display area M can be sequentially connected together by multiple third connecting lines 3022 and multiple fourth connecting lines 3023 to form the routing path of the second coil layer 302.

[0089] As shown in Figure 8, the ends of the two outermost second signal lines 3021 in the first direction X of the plurality of second signal lines 3021 in the second coil layer 302 can be respectively connected to two of the plurality of second conductive parts 102. In this way, both ends of the entire trace path in the second coil layer 302 can be respectively connected to two second conductive parts 102, so that the second coil layer 302 can form a complete closed-loop coil. Therefore, the second coil layer 302 in the electromagnetic touch layer 300 can be a single-turn coil layer.

[0090] In this way, when a user touches the light-emitting substrate with an active electromagnetic pen, a second signal line 3021 in the second coil layer 302 corresponding to the touch position will generate an induced current as an electromagnetic touch signal. This induced current can be conducted to the second driving unit 402 through the two second conductive parts 102, so that the second driving unit 402 can process the received induced current to convert the corresponding electromagnetic touch signal into corresponding position information, thereby determining the position information of the touch position in the second direction Y.

[0091] It should be noted that, as shown in Figure 8, the second coil layer 302 may further include two fifth connecting lines 3024 extending in the first direction X. These two fifth connecting lines 3024 may be located on both sides of the display area M disposed opposite to each other in the second direction Y. Specifically, the ends of the two outermost second signal lines 3021 in the first direction X may be connected to the two fifth connecting lines 3024, and the two fifth connecting lines 3024 may be correspondingly connected to two of the multiple second conductive parts 102.

[0092] As shown in Figures 5 and 8, the plurality of second conductive portions 102 may include two second conductive portions 102 electrically connected to the second coil layer 302, and a plurality of second conductive portions 102 electrically connected to the first coil layer 301. After the plurality of second conductive portions 102 electrically connected to the first coil layer 301 are arranged in a row along the second direction Y in the non-display area N of the light-emitting substrate, the two second conductive portions 102 electrically connected to the second coil layer 302 may be located at opposite ends of this row of second conductive portions 102 in the second direction Y. Therefore, the plurality of second conductive portions 102 in the light-emitting substrate may be arranged in a row along the second direction Y in the non-display area N of the light-emitting substrate.

[0093] In this way, the first coil layer 301 in the electromagnetic touch layer 300 can be a multi-turn coil layer, and the second coil layer 302 in the electromagnetic touch layer 300 can be a single-turn coil layer. This allows the plurality of second conductive portions 102 in the substrate 100 used to connect the second driving portion 402 and the electromagnetic touch layer 300 to be arranged in a row along the second direction Y in the non-display area N of the light-emitting substrate. Thus, in the non-display area N distributed around the display area M, it is only necessary to ensure that the portion of the non-display area N located on one side of the display area M has sufficient width to accommodate the plurality of second conductive portions 102 arranged in a row. This results in a smaller width for the portions of the non-display area N located on the other side of the display area M, which is beneficial for the narrow bezel design of the light-emitting substrate.

[0094] It should be noted that, as shown in Figure 8, one of the multiple third connecting lines 3022 and multiple fourth connecting lines 3023 distributed on both sides of the display area M in the second direction Y can be located in the display area M, and the other can be distributed in the non-display area N. Both fifth connecting lines 3024 can be distributed in the non-display area N.

[0095] For example, when multiple third connecting lines 3022 are distributed within the display area M, and multiple fourth connecting lines 3023 are distributed within the non-display area N, among the multiple second signal lines 3021, the two outermost second signal lines 3021 located in the first direction X, the two ends of the second signal line 3021 furthest from the second conductive parts 102 arranged in a row, can both be located within the non-display area N, and the two ends of this second signal line 3021 can be connected to one of the two fifth connecting lines 3024 and one of the fourth connecting lines 3023, respectively. Similarly, among the multiple second signal lines 3021, the two outermost second signal lines 3021 located in the first direction X, the two ends of the second signal line 3021 closest to the second conductive parts 102 arranged in a row, can be connected to one third connecting line 3022 and the other of the two fifth connecting lines 3024, respectively, in the second direction Y.

[0096] In this application, as shown in Figures 5 and 8, when multiple third connecting lines 3022 in the second coil layer 302 are distributed within the display area M, and multiple fourth connecting lines 3023 are distributed within the non-display area N, since the multiple fourth connecting lines 3023 and two fifth connecting lines 3024 in the second coil layer 302 are all located within the non-display area N of the light-emitting substrate, while the first coil layer 301 is located within the display area M of the light-emitting substrate, the width of the traces in the second coil layer 302 can be smaller than the width of the traces in the first coil layer 301. This ensures that the multiple fourth connecting lines 3023 and two fifth connecting lines 3024 with smaller trace widths do not occupy too much of the non-display area N, which is beneficial for the narrow bezel design of the light-emitting substrate. For example, the width of the traces in the first coil layer 301 can be twice the width of the traces in the second coil layer 302.

[0097] When the trace width of the second coil layer 302 is smaller than the trace width of the first coil layer 301, as shown in Figure 6, the thickness of the second coil layer 302 can be greater than the thickness of the first coil layer 301. This reduces the impedance of the second coil layer 302 and increases the induced current conducted from the second coil layer 302 to the second driving unit 402 when the user touches the light-emitting substrate with an active electromagnetic pen. This enhances the electromagnetic touch signal generated by the second coil layer 302, resulting in better touch performance of the light-emitting substrate. For example, the thickness of the second coil layer 302 can be four times the thickness of the first coil layer 301; for instance, the thickness of the second coil layer 302 can be greater than 3.6 micrometers.

[0098] Furthermore, the width of the traces in the second coil layer 302 is smaller than the width of the traces in the first coil layer 301, and the thickness of the traces in the second coil layer 302 is greater than the thickness of the traces in the first coil layer 301. This makes the cross-sectional area of ​​the traces in the second coil layer 302 not much different from that of the traces in the first coil layer 301. Consequently, when the user touches the light-emitting substrate with an active electromagnetic pen, the loss generated by the induced current generated by the first coil layer 301 during its conduction to the second driving unit 402 is not much different from the loss generated by the induced current generated by the second coil layer 302 during its conduction to the second driving unit 402. This allows the second driving unit 402 to more accurately convert the electromagnetic touch signal into corresponding position information, further improving the touch effect of the light-emitting substrate.

[0099] In this application, as shown in Figures 5 and 9, Figure 9 is a partially enlarged top view of the light-emitting substrate shown in Figure 5. The multiple light-emitting units 200 in the light-emitting substrate can be divided into multiple groups of light-emitting units. Each group of light-emitting units can include at least three light-emitting units 200, and these at least three light-emitting units 200 are connected in series end-to-end. The orthographic projection of the bent segment 3011b in the first coil layer 302 onto the substrate 100 can lie within the orthographic projection of the group of light-emitting units 200 onto the substrate 100.

[0100] Optionally, the orthographic projections of the plurality of light-emitting units 200 on the substrate 100 do not coincide with the orthographic projections of the first coil layer 301 on the substrate 100, and do not coincide with the orthographic projections of the second coil layer 302 on the substrate 100.

[0101] In this application, as shown in Figures 5 and 9, at least three light-emitting units 200 connected in series in a group of light-emitting units can be simultaneously connected in series with two first conductive parts 101, that is, at least three light-emitting units 200 and two first conductive parts 101 can be connected in series in a series. Furthermore, the light-emitting substrate may include multiple fifth connecting lines 500, and the at least three light-emitting units 200 and two conductive parts 101 can be connected in series via the fifth connecting lines 500. Here, a group of light-emitting units, two first conductive parts 101, and multiple fifth connecting lines 500 can form a lamp area B. Two first conductive parts 102 in a lamp area B can serve as positive and negative electrodes, respectively, to be electrically connected to a first driving part 401. That is, a lamp area B can correspond to a first driving part 401, and the first driving part 401 can drive a group of light-emitting units to emit light through the two first conductive parts 102 in the corresponding lamp area B. In this way, the first driving part 401 in the light-emitting substrate can be arranged opposite to the corresponding lamp area B on both sides of the substrate 100. That is, the arrangement of the plurality of first driving parts 401 in the light-emitting substrate depends on the arrangement of the lamp area B in the light-emitting substrate.

[0102] For example, a group of light-emitting units may include eight light-emitting units 200, and the eight light-emitting units 200 may be evenly divided into two groups of light-emitting units to be uniformly distributed on both sides of the two first conductive portions 102 in the second direction Y. The orthographic projection of the two bent segments 3011b of the two first signal lines 3011 in a closed-loop coil A onto the substrate 100 may be located within the orthographic projection of a lamp area B onto the substrate 100.

[0103] In this application, please refer to FIG10, which is another cross-sectional view of the light-emitting substrate shown in FIG1 at A-A'. The light-emitting substrate may further include a first driving circuit layer 600 and a second driving circuit layer 700. The first driving circuit layer 600 in the light-emitting substrate may be located on the side of the substrate 100 facing the plurality of light-emitting units 200, and the first driving circuit layer 600 may be electrically connected to the plurality of light-emitting units 200 and may be electrically connected to the first conductive part 101. The second driving circuit layer 700 in the light-emitting substrate may be located on the side of the substrate 100 away from the first driving circuit layer 600, and the second driving circuit layer 700 may be electrically connected to the first driving part 401 and may be electrically connected to the plurality of first conductive parts 101. In this way, the plurality of light-emitting units 200 can be electrically connected to the corresponding first conductive parts 101 through the first driving circuit layer 600, and can be electrically connected to the corresponding first driving part 401 through the electrical connection between the corresponding first conductive part 101 and the second driving circuit layer 700.

[0104] Optionally, as shown in Figures 10 and 11, where Figure 11 is another cross-sectional view of the light-emitting substrate shown in Figure 1 at point B-B', the light-emitting substrate may further include: a first passivation layer 801, a second passivation layer 802, and a third passivation layer 803. The first passivation layer 801 in the light-emitting substrate may be located on the side of the first driving circuit layer 600 facing away from the substrate 100. The first coil layer 301 and the second coil layer 302 in the electromagnetic touch layer 300 may be stacked on the side of the first passivation layer 301 facing away from the substrate 100. The second passivation layer 302 in the light-emitting substrate may be located on the side of the second coil layer 302 facing away from the substrate 100. The third passivation layer 803 in the light-emitting substrate may be located on the side of the second driving circuit layer 700 facing away from the substrate 100. The thickness of the third passivation layer 803 may be greater than the thickness of the first passivation layer 801.

[0105] Here, the first passivation layer 801 in the light-emitting substrate can be used to block water and oxygen from the external environment to ensure that the first driving circuit layer 600 does not oxidize. The third passivation layer 803 in the light-emitting substrate can be used to block water and oxygen from the external environment to ensure that the second driving circuit layer 700 does not oxidize. Since the side of the first passivation layer 801 facing the external environment, that is, the side of the first passivation layer 801 away from the substrate 100, also has a second passivation layer 802, the second passivation layer 802 can also be used to block water and oxygen from the external environment. Therefore, even if the thickness of the first passivation layer 801 is relatively thin, the first driving circuit layer 600 will not oxidize under the combined action of the first passivation layer 801 and the second passivation layer 802. In this way, the reliability of the first driving circuit layer 600 can be ensured while making the overall thickness of the light-emitting substrate relatively thin. Furthermore, the thickness of the third passivation layer 803 can be twice the thickness of the first passivation layer 801. For example, the thickness of the third passivation layer 803 can be 4800 angstroms, and the thickness of the first passivation layer 801 can be 2400 angstroms.

[0106] It should be noted that since the second passivation layer 802 in the light-emitting substrate needs to block water and oxygen in the external environment to prevent the electromagnetic touch layer 300 from oxidizing, the second passivation layer 802 also needs to have a large thickness. For example, the thickness of the second passivation layer 802 can also be 4800 angstroms.

[0107] It should also be noted that, as shown in Figures 10 and 11, the light-emitting substrate may further include a fourth passivation layer 804 and a fifth passivation layer 805. The fourth passivation layer 804 may be located between the substrate 100 and the first driving circuit layer 600, and the fifth passivation layer 805 may be located between the substrate 100 and the second driving circuit layer 700. Furthermore, the first conductive portion 101 and the second conductive portion 102 may completely penetrate the fourth passivation layer 804, the substrate 100, and the fifth passivation layer 805. Here, the fourth passivation layer 804 and the fifth passivation layer 805 may cover manufacturing defects on both sides of the substrate 100, such as bulges or surface impurities.

[0108] Optionally, as shown in Figures 10 and 11, the light-emitting substrate may further include a planarization layer 900 located between the first coil layer 301 and the second coil layer 302. The light-emitting substrate may have a plurality of first vias V1 penetrating the planarization layer 900 and the first passivation layer 801, and a third conductive portion 1100 located within each of the first vias V1. The two ends of the third conductive portion 1100 may be electrically connected to the first driving circuit layer 600 and the light-emitting element 200, respectively.

[0109] It should be noted that, as shown in Figure 10, the light-emitting substrate may have two first vias V1 at the position corresponding to one light-emitting unit 200. One end of each of the two third conductive parts 1100 located within these two first vias V1 may be connected to the positive and negative electrodes of the light-emitting unit 200, respectively. The other ends of these two third conductive parts 1100 may be connected to the first driving circuit layer 500, respectively, so as to be connected to the two first conductive parts 101 through the lines in the first driving circuit layer 500. Furthermore, the positive and negative electrodes of the light-emitting unit 200 may be electrically connected to the two third conductive parts 1100 through the two first pads 1101, respectively.

[0110] In this application, at least a portion of the second coil layer 301 in the electromagnetic touch layer 300 and the third conductive portion 1100 are formed simultaneously in the same process.

[0111] The light-emitting substrate in the above embodiments can be prepared by the following process:

[0112] Step S1: Provide a substrate.

[0113] For example, the substrate in this application can be a glass substrate. Before proceeding with subsequent processes, the glass substrate needs to be acid-washed and water-washed to obtain a clean substrate 100.

[0114] Step S2: A fourth passivation layer and a fifth passivation layer are formed on both sides of the substrate, respectively.

[0115] For example, as shown in Figure 12, which is a schematic diagram of forming a fourth passivation layer and a fifth passivation layer on both sides of a substrate according to an embodiment of this application, the fourth passivation layer 804 can be deposited on one side of the substrate 100 using a chemical vapor deposition (CVD) process. Then, the fifth passivation layer 805 can be deposited on the side of the substrate 100 opposite to the fourth passivation layer 804 using a CVD process. Here, the fourth passivation layer 804 and the fifth passivation layer 805 can cover manufacturing defects on both sides of the substrate 100, such as bulges or surface impurities.

[0116] Step S3: Form a plurality of first conductive portions and a plurality of second conductive portions penetrating the fourth passivation layer, the substrate, and the fifth passivation layer.

[0117] For example, as shown in Figure 13, which is a schematic diagram of forming a first conductive portion according to an embodiment of this application. Based on the prepared fourth passivation layer 804, substrate 100, and fifth passivation layer 805, the first conductive portion 101 and the second conductive portion 102 can be prepared using through-glass via (TGV) technology. First, a layer of photoresist can be coated on the side of the fourth passivation layer 804 facing away from the substrate 100. Then, this layer of photoresist is exposed and developed to obtain photoresist patterns corresponding to multiple first conductive portions 101 and multiple second conductive portions 102. Next, multiple second vias V2 penetrating the fourth passivation layer 804, substrate 100, and fifth passivation layer 805 can be formed using laser-induced and hydrofluoric acid wet etching processes. Finally, conductive material, such as copper, is filled into the second vias V2 by electroplating to form multiple first conductive portions 101 and multiple second conductive portions 102.

[0118] Step S4: A first driving circuit layer is formed on the side of the fourth passivation layer away from the substrate, and a second driving circuit layer is formed on the side of the fifth passivation layer away from the substrate.

[0119] For example, as shown in Figure 14, which is a schematic diagram of forming a first driving circuit layer and a second driving circuit layer according to an embodiment of this application. First, a first conductive layer can be deposited on the side of the fourth passivation layer 804 away from the substrate 100 using a physical vapor deposition (PVD) process. For example, a MoNb-Cu-MoNb material with a thickness of 1.8 micrometers can be deposited on the side of the fourth passivation layer 804 away from the substrate 100. Then, a photoresist layer can be coated on the side of the first conductive layer away from the fourth passivation layer. Next, this photoresist layer can be exposed and developed to obtain a photoresist pattern that defines the wiring lines in the first driving circuit layer 600. The portion of the first conductive layer covered by the photoresist pattern in the example is the wiring line in the first driving circuit layer 600.

[0120] Next, a second conductive layer can be deposited on the side of the fifth passivation layer 805 facing away from the substrate 100 using a PVD process. For example, a MoNb-Cu-MoNb material with a thickness of 0.9 micrometers can be deposited on the side of the fifth passivation layer 805 facing away from the substrate 100. Then, a photoresist layer can be coated on the side of the second conductive layer facing away from the fifth passivation layer. This photoresist layer can then be exposed and developed to obtain a photoresist pattern that defines the wiring in the second driving circuit layer 700. In the example, the portion of the second conductive layer covered by the photoresist pattern is the wiring in the second driving circuit layer 700.

[0121] Finally, the substrate can be etched using a copper wet etching process to remove the portions of the first conductive layer not covered by the photoresist pattern, and simultaneously etch away the portions of the second conductive layer not covered by the photoresist pattern, thereby simultaneously obtaining the wiring lines in the first driving circuit layer 600 and the second driving circuit layer 700. After removing all the photoresist, the first driving circuit layer 600 and the second driving circuit layer 700 are obtained. Since the first conductive portion 101 and the second conductive portion 102 in step S3 penetrate the fourth passivation layer 804, the substrate 100, and the fifth passivation layer 805, both ends of the first conductive portion 101 can be simultaneously connected to the corresponding lines in the first driving circuit layer 600 and the second driving circuit layer 700. The second conductive portion 102 can be connected to the corresponding lines in the second driving circuit layer 700.

[0122] It should be noted that after the first driving circuit layer 600 and the second driving circuit layer 700 are fabricated, a third via V3 that penetrates the first driving circuit layer 600 can be formed on the first driving circuit layer 600.

[0123] Step S5: A first passivation layer is formed on the side of the first driving circuit layer away from the substrate, and a third passivation layer is formed on the side of the second driving circuit layer away from the substrate.

[0124] For example, as shown in Figure 15, which is a schematic diagram of forming a first passivation layer and a second passivation layer according to an embodiment of this application. A CVD process can be used to deposit the first passivation layer 801 on the side of the first driving circuit layer 600 facing away from the substrate 100. Here, since the first driving circuit layer 600 has a third via V3, the first passivation layer 801 is also deposited within the third via V3. Next, a CVD process can be used to deposit the third passivation layer 803 on the side of the second driving circuit layer 700 facing away from the substrate 100.

[0125] It should be noted that the thickness of the third passivation layer 803 can be greater than the thickness of the first passivation layer 801. For example, the thickness of the third passivation layer 803 can be twice the thickness of the first passivation layer 801. For instance, the thickness of the third passivation layer 803 can be 4800 angstroms, and the thickness of the first passivation layer 801 can be 2400 angstroms. Here, the first passivation layer 801 in the light-emitting substrate can be used to block water and oxygen from the external environment to ensure that the first driving circuit layer 600 does not oxidize. The third passivation layer 803 in the light-emitting substrate can be used to block water and oxygen from the external environment to ensure that the second driving circuit layer 700 does not oxidize. Since a second passivation layer 802 will be subsequently formed on the side of the first passivation layer 801 facing the external environment (i.e., the side of the first passivation layer 801 facing away from the substrate 100), and the second passivation layer 802 can also block water and oxygen from the external environment, even if the thickness of the first passivation layer 801 is relatively thin, the first driving circuit layer 600 will not oxidize under the combined action of the first passivation layer 801 and the second passivation layer 802. This allows for a relatively thin overall thickness of the light-emitting substrate while ensuring the reliability of the first driving circuit layer 600.

[0126] Step S6: A first coil layer is formed on the side of the first passivation layer away from the substrate.

[0127] For example, as shown in Figure 16, which is a schematic diagram of forming a first coil layer according to an embodiment of this application, a third conductive layer is first deposited on the side of the first passivation layer 801 facing away from the substrate 100 using a PVD process. For example, a MoNb-Cu-MoNb material with a thickness of 1.8 micrometers can be deposited on the side of the first passivation layer 801 facing away from the substrate 100. Then, a photoresist layer can be coated on the side of the third conductive layer facing away from the first passivation layer. Next, this photoresist layer can be exposed and developed to obtain a photoresist pattern that defines the wiring in the first coil layer 301. The portion of the first conductive layer covered by the photoresist pattern in the example is the wiring in the first coil layer 301. Then, the substrate can be etched using a copper wet etching process to etch away the portion of the third conductive layer not covered by the photoresist pattern, thereby obtaining the wiring in the first coil layer 301. Finally, after the photoresist is stripped off, the first coil layer 301 can be obtained.

[0128] Step S7: A planarization layer is formed on the side of the first coil layer away from the substrate.

[0129] For example, as shown in Figures 17 and 18, Figure 17 is a schematic diagram of forming a planarization layer according to an embodiment of this application, and Figure 18 is a schematic diagram of forming a planarization layer according to another embodiment of this application. After the first coil layer 301 is fabricated, a planarization layer 900 can be formed on the side of the first coil layer 301 opposite to the substrate 100. Here, the planarization layer 900 can completely cover the first coil layer 301.

[0130] It should be noted that, as shown in Figure 18, after the planarization layer 900 is prepared, multiple first vias V1 that penetrate the planarization layer 900 and the first passivation layer 801 can be formed on the planarization layer 900. Here, the positions of the multiple first vias V1 can correspond to the positions of the multiple light-emitting units 200.

[0131] In step S8, a second coil layer is formed on the side of the planarization layer away from the substrate, and a third conductive portion is formed in the first via.

[0132] For example, as shown in Figures 19 and 20, Figure 19 is a schematic diagram of forming a second coil layer provided by an example of this application, and Figure 20 is a schematic diagram of forming a third conductive part provided by an embodiment of this application.

[0133] First, a fourth conductive layer can be deposited on the side of the planarization layer 900 facing away from the substrate 100 using a PVD process. For example, a MoNb-Cu-MoNb material with a thickness of 0.3 micrometers can be deposited on the side of the planarization layer 900 facing away from the substrate 100. Here, since the first via V1 penetrates the planarization layer 900 and the first passivation layer 801, conductive material will also be formed within the first via V1.

[0134] Then, a layer of photoresist can be coated on the side of the fourth conductive layer opposite to the first passivation layer. This photoresist layer can then be exposed and developed to obtain a photoresist pattern defining the wiring in the second coil layer 302. In the example, the portion of the first conductive layer covered by the photoresist pattern represents the wiring in the second coil layer 302. Next, the substrate can be etched using a copper wet etching process to remove the portion of the third conductive layer not covered by the photoresist pattern, thereby obtaining the wiring in the second coil layer 302. Finally, the photoresist can be stripped. Here, since the first via V1 penetrates the planarization layer 900 and the first passivation layer 801, after stripping the photoresist, the photoresist located within the first via V1 can be ashed to ensure complete removal of the photoresist.

[0135] Finally, the traces of the second coil layer 302 in the fourth conductive layer and the conductive portion in the first via V1 can be thickened simultaneously by electroplating process, so as to simultaneously form the second coil layer 302 and the third conductive portion 1100.

[0136] Step 9: A second passivation layer is formed on the side of the second coil layer that is away from the substrate.

[0137] For example, as shown in Figure 10, a second passivation layer 802 can be deposited on the side of the second coil layer 302 facing away from the substrate 100 using a CVD process. Here, since the second passivation layer 802 in the light-emitting substrate needs to block water and oxygen from the external environment to prevent oxidation of the electromagnetic touch layer 300, the second passivation layer 802 also needs to have a large thickness. For example, the thickness of the second passivation layer 802 can also be 4800 angstroms.

[0138] Step S10: Connect the light-emitting unit, the first driving unit, and the second driving unit.

[0139] As shown in Figure 10, after forming the second passivation layer 802, multiple openings can be formed in the second passivation layer 802 at positions corresponding to the multiple light-emitting units 200, and these positions also correspond to multiple third conductive parts 1100. For example, a position corresponding to one light-emitting unit 200 can have two first vias V1. One end of each of the two third conductive parts 1100 located within these two first vias V1 can be connected to the positive and negative electrodes of the light-emitting unit 200, respectively. The other ends of these two third conductive parts 1100 can be connected to the first driving circuit layer 500, respectively, so as to be connected to the two first conductive parts 101 through the lines in the first driving circuit layer 500. Furthermore, the positive and negative electrodes of the light-emitting unit 200 can be electrically connected to the two third conductive parts 1100 through two first pads 1101, respectively.

[0140] As shown in Figure 10, each of the first driving units 401 and each of the second driving units 402 can be electrically connected to the second driving circuit layer 700 through the second pad 1102. For this purpose, the third passivation layer 803 may also have multiple openings, and a portion of the pad 1102 may be located within the corresponding opening of the third passivation layer 803.

[0141] Thus, by connecting multiple light-emitting units 200, as well as the first driving unit 401 and the second driving unit 402, the light-emitting substrate in the above embodiment can be obtained.

[0142] In summary, this application provides a light-emitting substrate, including: a substrate, light-emitting units, an electromagnetic touch layer, a first driving unit, and a second driving unit. By driving the light-emitting units through the first driving unit and driving the electromagnetic touch layer through the second driving unit, the light-emitting substrate can simultaneously possess touch display functionality. Furthermore, since the electromagnetic touch layer and the first and second driving units are located on opposite sides of the substrate, the second driving unit processes the electromagnetic signals generated by the electromagnetic touch layer to sense the touch position of the active electromagnetic pen. During the process of the first driving unit driving multiple light-emitting units to emit light, neither the first nor the second driving unit affects the electromagnetic signals generated by the electromagnetic touch layer. This allows the light-emitting substrate to more accurately sense the touch position of the active electromagnetic pen, improving the touch accuracy of the light-emitting substrate.

[0143] This application also provides a display device, which may include the light-emitting substrate described in the above embodiments. Based on the touch display function of the light-emitting substrate, the display device is an electromagnetic touch-enabled display device. For example, the display device may be any product or component with display function, such as electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0144] It should be noted that, in one possible scenario, the multiple light-emitting units of the light-emitting substrate in the display device can be divided into multiple light-emitting units for emitting red light, multiple light-emitting units for emitting green light, and multiple light-emitting units for emitting blue light. By controlling the light emission of different light-emitting units, the light-emitting substrate can display an image.

[0145] In another possible scenario, the light-emitting substrate in the display device can be a backlight panel. In this case, the display device may include: a backlight module integrating such a backlight panel, and a liquid crystal display panel located on the light-emitting side of the backlight module, wherein the light emitted by the backlight module can provide a backlight for the liquid crystal display panel, enabling the liquid crystal display panel in the display device to display images.

[0146] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0147] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0148] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0149] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A light-emitting substrate, characterized in that, The light-emitting substrate has a display area and a non-display area distributed around the display area; The light-emitting substrate includes: a substrate, a light-emitting unit, an electromagnetic touch layer, a first driving part, and a second driving part; The substrate has a plurality of first conductive portions and a plurality of second conductive portions, both of which penetrate the substrate. The plurality of first conductive portions are distributed in the display area, and the plurality of second conductive portions are distributed in the non-display area. The number of light-emitting units is multiple, and the multiple light-emitting units are distributed on the same side of the substrate, and the multiple light-emitting units are electrically connected to the multiple first conductive parts. The electromagnetic touch layer is located on the side of the substrate on which the plurality of light-emitting units are disposed, and is insulated from the plurality of light-emitting units. The electromagnetic touch layer is electrically connected to the plurality of second conductive parts. Both the first driving unit and the second driving unit are located on the side of the substrate away from the plurality of light-emitting units, and the first driving unit is electrically connected to the plurality of first conductive parts, and the second driving unit is electrically connected to the plurality of second conductive parts.

2. The light-emitting substrate according to claim 1, characterized in that, The electromagnetic touch layer includes: a first coil layer and a second coil layer stacked together, wherein the first coil layer is insulated from the second coil layer, and the first coil layer is closer to the substrate relative to the second coil layer; The first coil layer includes at least a plurality of first signal lines distributed within the display area, the overall extension direction of the first signal lines being parallel to a first direction; the second coil layer includes at least a plurality of second signal lines distributed within the display area, the overall extension direction of the second signal lines being parallel to a second direction; the first direction and the second direction intersect.

3. The light-emitting substrate according to claim 2, characterized in that, The first coil layer further includes: multiple first connecting lines and multiple second connecting lines; The plurality of first signal lines are divided into a plurality of groups of first signal lines, and each group of first signal lines includes two adjacent first signal lines; the plurality of groups of first signal lines correspond one-to-one with the plurality of first connecting lines and one-to-one with the plurality of second connecting lines. Wherein, the two ends of one of the first connecting lines are respectively connected to two of the corresponding set of first signal lines. The first ends of adjacent first signal lines are connected; the two ends of a second connecting line are respectively connected to the second ends of two adjacent first signal lines in a corresponding set of first signal lines.

4. The light-emitting substrate according to claim 3, characterized in that, Each of the multiple sets of first signal lines corresponds one-to-one with a portion of the multiple second conductive parts, and the first signal line is electrically connected to the corresponding second conductive part.

5. The light-emitting substrate according to claim 3, characterized in that, The first signal line includes: multiple straight segments and multiple bent segments, wherein the multiple straight segments and the multiple bent segments are arranged alternately, and adjacent straight segments are connected to bent segments; The straight line segment extends in a direction parallel to the first direction.

6. The light-emitting substrate according to claim 5, characterized in that, The overall extension direction of the bent segment is parallel to the second direction, and the two ends of the bent segment are respectively connected to the ends of the two straight segments distributed on both sides of the bent segment in the first direction.

7. The light-emitting substrate according to claim 6, characterized in that, The plurality of light-emitting units are divided into multiple groups of light-emitting units, and each group of light-emitting units includes at least three light-emitting units, and the at least three light-emitting units in a group of light-emitting units are connected in series from end to end; The orthographic projection of the bent segment on the substrate is located within the area enclosed by the orthographic projections of a group of light-emitting units on the substrate.

8. The light-emitting substrate according to claim 2, characterized in that, The second coil layer further includes: multiple third connecting lines and multiple fourth connecting lines, wherein the multiple third connecting lines and the multiple fourth connecting lines are respectively distributed on both sides of the display area in the second direction, and the multiple third connecting lines and the multiple fourth connecting lines are alternately arranged in the first direction; In this configuration, the first end of one of the second signal lines is connected to one end of one of the third connecting lines, and the second end of one of the second signal lines is connected to the fourth connecting line.

9. The light-emitting substrate according to claim 8, characterized in that, The ends of the two outermost second signal lines in the first direction are respectively connected to two of the multiple second conductive parts.

10. The light-emitting substrate according to any one of claims 2 to 9, characterized in that, The orthographic projection of the light-emitting unit on the substrate does not coincide with the orthographic projection of the first coil layer on the substrate, nor with the orthographic projection of the second coil layer on the substrate.

11. The light-emitting substrate according to claim 10, characterized in that, The light-emitting substrate further includes: a first driving circuit layer and a second driving circuit layer; The first driving circuit layer is located on the side of the substrate facing the plurality of light-emitting units. The first driving circuit layer is electrically connected to the plurality of light-emitting units and to the first conductive part. The second driving circuit layer is located on the side of the substrate opposite to the first driving circuit layer. The second driving circuit layer is electrically connected to the first driving part and to the plurality of first conductive parts.

12. The light-emitting substrate according to claim 11, characterized in that, The light-emitting substrate further includes: a first passivation layer, a second passivation layer, and a third passivation layer; The first passivation layer is located on the side of the first driving circuit layer away from the substrate, the first coil layer and the second coil layer are stacked on the side of the first passivation layer away from the substrate, and the second passivation layer is located on the side of the second coil layer away from the substrate. The third passivation layer is located on the side of the second driving circuit layer that is away from the substrate. The thickness of the third passivation layer is greater than the thickness of the first passivation layer.

13. The light-emitting substrate according to claim 12, characterized in that, The light-emitting substrate further includes: a planarization layer located between the first coil layer and the second coil layer; The light-emitting substrate has a plurality of first vias penetrating the planarization layer and the first passivation layer, and a third conductive portion located in each of the first vias, the two ends of the third conductive portion being electrically connected to the first driving circuit layer and the light-emitting unit, respectively.

14. The light-emitting substrate according to claim 13, characterized in that, The thickness of the second coil layer is greater than the thickness of the first coil layer; At least a portion of the second coil layer and the third conductive portion are formed simultaneously in the same process.

15. The light-emitting substrate according to claims 2 to 9, 11 to 14, characterized in that, The width of the orthographic projection of the first signal line on the substrate is greater than the width of the orthographic projection of the second signal line on the substrate.

16. A display device, characterized in that, Includes the light-emitting substrate described in any one of claims 1 to 15.

Images