Circuit board assembly and electronic device
By employing two separate circuit board structures and flexible circuit board connections in electronic devices, the spatial layout of the circuit board assembly is optimized, solving the problem of large space occupation by the circuit board assembly and achieving thinner electronic devices and improved space utilization.
WO2026091958A1PCT designated stage Publication Date: 2026-05-07HUAWEI TECH CO LTD
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2025-09-18
- Publication Date
- 2026-05-07
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Figure CN2025122338_07052026_PF_FP_ABST
Abstract
The embodiments of the present application relate to the technical field of electronic devices, and provide a circuit board assembly and an electronic device. The circuit board assembly comprises: a first circuit board having a first surface and a second surface opposite one another in a first direction; a second circuit board having a third surface and a fourth surface opposite one another in the first direction, orientations of the third surface and the first surface being the same, the second circuit board and the first circuit board being arranged spaced apart in a second direction, and the second direction being perpendicular to the first direction; a system-on-chip provided on the first surface of the first circuit board; and a first electronic device provided on the third surface of the second circuit board, the first electronic device having a thickness less than that of the system-on-chip. The circuit board assembly of the present application reduces component density, increases space utilization rate within electronic devices, and facilitates electronic device thinning.
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Citation Information
Patent Citations
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