Hot-press molding die for bamboo-wood floor and use thereof

Abstract

A hot-press molding die for a bamboo-wood floor, comprising an upper die and a lower die, wherein the upper die abuts against the top of a floor board; the lower die abuts against the bottom of the floor board and fixes the floor board; the bottom surface of the upper die is provided with at least one rectangular groove, the width of the rectangular groove is the same as the width of a bamboo floor, and inner chamfers are formed on the bottom edges of two sides of the rectangular groove. When a paint-free bamboo-wood floor product is molded, paint-free processing and chamfer processing are simultaneously performed in hot-press paint-free processing, so that a paint-free surface and the chamfers are integrally formed, thereby avoiding the phenomena of cracking, water absorption, mildewing and the like at the chamfers, saving the material costs, and simplifying the processing technology.

Description

Bamboo Wood Floor Hot Pressing Molding Die and Its Application Technical Field

[0001] The invention belongs to the field of bamboo processing, and particularly relates to a bamboo wood floor hot pressing molding die and its application. Background Art

[0002] Bamboo grows fast and has a high has a high yield. Compared with the rapidly depleting wood resources with a long production cycle and non-degradable plastic products, bamboo products are increasingly favored by the low-carbon environmental protection market. However, when bamboo products are used outdoors, there are many difficult-to-solve problems such as easy decay, discoloration, mildew, and cracking. The traditional treatment method is to apply paint to avoid cracking and mildew. However, because bamboo products have a high density and it is difficult for paint to penetrate, the paint is prone to peeling and fading during use, and regular painting maintenance is required, which increases a large amount of labor costs.

[0003] Therefore, the commonly used technical means is to hot press and cure a film-free coating on the surface of bamboo products. For example, Chinese Patent CN202120924531.5 provides a recombinant bamboo board integrating concave-convex wood grain decoration and protection functions, including a recombinant bamboo layer and a hot press cured film layer with concave-convex wood grain decoration on the surface of the recombinant bamboo layer. Compared with the existing recombinant bamboo grain processing technology, the recombinant bamboo board integrating concave-convex wood grain decoration and protection functions of the present utility model has both the decorative property of wood grain patterns and anti-corrosion, anti-mildew and weather resistance, can reduce material costs, simplify the processing process, reduce labor and equipment costs, improve the forming efficiency, and at the same time, the hot press cured film can be used as a dense protective layer, and no subsequent reprocessing such as shaving, sanding and painting is required during outdoor application, which is more convenient and fast. Tests show that the protection effect and durability are better than the paint effect of ordinary recombinant bamboo boards.

[0004] It is also possible to lay a film-coated paper on the surface of bamboo products and hot press and cure it. For example, Chinese Patent CN202410459699.1 provides a film-coated bamboo plywood and its production method, including the following steps: weaving bamboo slices into a bamboo mat, drying, soaking in a flame retardant solution, sealing and storing at 70-90°C for 1-2 hours, impregnating with an aqueous phenolic resin solution for 1-2 hours, fishing out and draining to obtain an impregnated bamboo mat; coloring the film-coated paper with phenolic resin, and the dosage of phenolic resin is 0.3-0.45 kg / m<supgt;2< / supgt;; arranging the impregnated film-coated paper, multiple layers of impregnated bamboo mats, and impregnated film-coated paper in sequence to form a blank, where the multiple layers of impregnated bamboo mats are 5-7 layers, and the adjacent two layers of impregnated bamboo mats are stacked in a vertical and horizontal cross pattern, feeding into a board machine, with the temperature at 40-50°C during blank feeding, and returning to normal pressure and room temperature after programmed hot pressing to obtain a film-coated bamboo plywood. The invention has good flame retardant effect, and the flame retardant performance of the product reaches A2 level. At the same time, the flame retardant has good compatibility with phenolic resin glue, and the bonding is more firm.

[0005] However, bamboo products require chamfering during processing to prevent cuts to hands and feet and other injuries caused by sharp edges. Current technologies employ a process of hot-pressing first, followed by chamfering after cooling. If a pre-coated surface is added during hot-pressing, it will inevitably be damaged during the subsequent chamfering process, affecting both aesthetics and its protective effect. Without regular maintenance and painting of the chamfered areas, cracking, water absorption, and mold growth will still occur. Conversely, if the chamfering is done first, followed by adding the pre-coated surface, it requires re-hot-pressing, significantly increasing processing costs and potentially causing deformation at the chamfer due to the secondary hot-pressing process, making it technically impossible to implement. Summary of the Invention

[0006] To address the aforementioned problems, the present invention aims to provide a hot-press molding die for bamboo and wood flooring that can simultaneously perform paint-free processing and chamfering during the hot-press molding process, thereby forming the paint-free surface and the chamfered edges into a single unit. This not only avoids cracking, water absorption, and mold growth at the chamfered edges but also saves processing costs.

[0007] To achieve the above objectives, the present invention provides a hot-press forming mold for bamboo and wood flooring, comprising an upper mold and a lower mold. The upper mold abuts against the top of the flooring material, and the lower mold abuts against the bottom of the flooring material and fixes the flooring material. The bottom surface of the upper mold is provided with at least one rectangular groove, the width of which is the same as the width of the bamboo and wood flooring, and the bottom edges of the rectangular groove are provided with inner chamfers.

[0008] Based on the above scheme, the bottom surface of the upper mold is provided with at least two rectangular grooves, and the spacing between adjacent rectangular grooves is the same.

[0009] Based on the above scheme, the upper mold is formed by horizontally splicing and fixing at least two sub-upper molds, and the bottom surface of each sub-upper mold is provided with at least one rectangular groove, with the same spacing between adjacent rectangular grooves.

[0010] Based on the above scheme, the inner chamfer can be a round chamfer, an elliptical chamfer, an oblique chamfer, or a stepped round chamfer.

[0011] Preferably, the width L of the upper mold is 55-2550mm, the height H of the upper mold is 2-25mm, the width a of the rectangular groove is 50-2500mm, the depth b of the rectangular groove is 0.1-20mm, and the inner chamfer is a round chamfer with a radius r of 0.1-10mm and a central angle of 30-90 degrees, or a chamfer with a slope height c of 0.1-10mm and an angle of 30-60 degrees with the horizontal plane, or a stepped round chamfer with a step height d of 0.1-10mm and an angle of 90-120 degrees with the step surface.

[0012] Preferably, the width L of the upper mold is 55-2550mm, the height H of the upper mold is 2-25mm, the width a of the rectangular groove is 50-2500mm, the depth b of the rectangular groove is 0.1-20mm, and the spacing w between adjacent rectangular grooves is 0.5-10mm.

[0013] Based on the above scheme, the bottom surface of the rectangular groove is provided with raised or recessed textures.

[0014] Preferably, the raised height of the texture is 0.05-15mm, or the concave depth is 0.05-15mm.

[0015] Preferably, the texture is a raised or recessed imitation leather texture, imitation wood grain texture, vertical stripes, or irregular stripes.

[0016] Preferably, the width of the vertical stripes or irregular stripes is 0.5 to 50 mm.

[0017] Another objective of this invention is to provide a paint-free bamboo and wood flooring based on the above-mentioned hot-pressing mold for bamboo and wood flooring, wherein the upper surface edge of the bamboo and wood flooring is chamfered, and the upper surface and the chamfered edge are covered with a hot-pressed paint-free layer.

[0018] Based on the above scheme, the chamfer can be a round chamfer, an elliptical chamfer, an oblique chamfer, or a stepped round chamfer.

[0019] Preferably, the length of the bamboo flooring is 1500-18000mm, the thickness T is 9-300mm, the width A of the paint-free layer is 50-2500mm, the height B is 0.1-20mm, and the chamfer is a round chamfer with a radius R of 0.1-10mm and a central angle of 30-90 degrees, or a bevel chamfer with a slope height C of 0.1-10mm and an angle of 30-60 degrees with the horizontal plane, or a step round chamfer with a step height D of 0.1-10mm and an angle of 90-120 degrees.

[0020] Based on the above scheme, the upper surface of the paint-free layer is provided with raised or recessed textures.

[0021] Preferably, the raised height of the texture is 0.05-15mm, or the concave depth is 0.05-15mm.

[0022] Preferably, the texture is a raised or recessed imitation leather texture, imitation wood grain texture, vertical stripes, or irregular stripes.

[0023] Preferably, the width of the vertical stripes or irregular stripes is 0.5 to 50 mm.

[0024] Based on the above scheme, the bamboo flooring is made of bamboo, wood, or a mixture of bamboo and wood.

[0025] Another objective of this invention is to provide a manufacturing process for paint-free bamboo and wood flooring based on the aforementioned hot-pressing mold, including a hot-pressing paint-free treatment. The hot-pressing paint-free treatment refers to fixing a flooring board with a film-coated paper on its upper surface onto the lower mold of the hot-pressing mold, and then snapping the upper mold together to perform a hot-pressing process, achieving paint-free and chamfered finishes in one hot-pressing process.

[0026] Based on the above scheme, the temperature of the hot pressing process is 100-160℃ and the pressure is 15-28MPa.

[0027] Preferably, the flooring material is a substrate that has not undergone hot pressing, and the hot pressing process takes 20-60 minutes.

[0028] Preferably, the flooring material is a substrate that has undergone hot pressing, and the hot pressing process takes 7-20 minutes.

[0029] Based on the above scheme, the flooring board is a substrate that can simultaneously hot-press and paint-free process at least two bamboo and wood flooring pieces, with a spacing W between adjacent bamboo and wood flooring pieces being 0.5 to 10 mm. After the substrate undergoes hot-press and paint-free processing, the space between adjacent bamboo and wood flooring pieces is cut off.

[0030] The beneficial effects of this invention are as follows: The paint-free bamboo and wood flooring products formed using the mold of this invention undergo paint-free processing and chamfering during the hot-pressing paint-free treatment, making the paint-free surface and chamfering integrally formed. This can avoid cracking, water absorption and mold growth at the chamfering, which is beneficial for outdoor use and expands the scope of application. It can also save material costs, simplify the processing technology, reduce labor and equipment costs, improve molding efficiency, and ensure stable product quality. Attached Figure Description

[0031] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, wherein:

[0032] Figure 1 is a schematic cross-sectional view of the upper mold in Embodiment 1 of the present invention;

[0033] Figure 2 is a schematic cross-sectional view of the substrate after hot-pressing paint-free treatment according to Embodiment 1 of the present invention;

[0034] Figure 3 is a schematic cross-sectional view of the upper mold in Embodiment 2 of the present invention;

[0035] Figure 4 is a schematic cross-sectional view of the substrate after hot-pressing paint-free treatment according to Embodiment 2 of the present invention;

[0036] Figure 5 is a schematic cross-sectional view of the upper mold in Embodiment 3 of the present invention;

[0037] Figure 6 is a schematic cross-sectional view of the substrate after hot-pressing paint-free treatment according to Embodiment 3 of the present invention;

[0038] Figure 7 is a schematic cross-sectional view of the upper mold in Embodiment 4 of the present invention;

[0039] Figure 8 is a schematic cross-sectional view of the substrate after hot-pressing paint-free treatment according to Embodiment 4 of the present invention;

[0040] Figure 9 is a top view of the substrate after hot-pressing and paint-free treatment according to Embodiment 4 of the present invention. Detailed Implementation

[0041] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and claims. It should be noted that the drawings are all in a very simplified form and use non-precise ratios, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0042] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0043] Example 1

[0044] As shown in Figure 1, this embodiment provides a hot-press forming mold for bamboo and wood flooring, including an upper mold and a lower mold. The upper mold abuts against the top of the flooring board, and the lower mold abuts against the bottom of the flooring board and fixes the flooring board. The bottom surface of the upper mold is provided with ten rectangular grooves. The width L of the upper mold is 1550mm, the height H of the upper mold is 20mm, the width a of the rectangular grooves is 140mm, the depth b of the rectangular grooves is 10mm, the spacing w between adjacent rectangular grooves is 10mm, and the bottom edges of the rectangular grooves are provided with inner chamfers. The inner chamfers are rounded chamfers with a radius r of 2mm and a central angle of 90 degrees.

[0045] The preparation process of paint-free bamboo and wood flooring based on the hot-pressing molding mold of bamboo and wood flooring in Embodiment 1 includes a paint-free treatment process. The hot-pressing paint-free treatment refers to fixing the flooring board with a film-coated paper on the upper surface onto the lower mold of the hot-pressing molding mold of bamboo and wood flooring. The flooring board is a substrate that has undergone hot-pressing treatment. The upper mold is then snapped together to perform a hot-pressing process. The temperature of the hot-pressing process is 160°C, the pressure is 15MPa, and the time is 7 minutes. The paint-free process and the chamfering are hot-pressed in one step.

[0046] As shown in Figure 2, a paint-free bamboo and wood flooring based on the hot-pressing molding mold of bamboo and wood flooring in Embodiment 1 is provided. The flooring board is a substrate that can simultaneously hot-press and paint-free process ten bamboo and wood floorings. The spacing W between adjacent bamboo and wood floorings is 10mm. The upper surface edge of the bamboo and wood flooring is chamfered. The upper surface and the chamfered edge are covered with a hot-pressed paint-free layer. The length of the bamboo and wood flooring is 18000mm, the thickness T is 300mm, the width A of the paint-free layer is 140mm, the height B is 10mm, the spacing W between adjacent paint-free bamboo and wood floorings is 10mm, and the chamfer is a round chamfer with a radius R of 2mm and a central angle of 90 degrees.

[0047] The coating material in the flooring board with the upper surface covered with film paper can be acrylic resin, silicone modified resin and phenolic resin, or other flooring boards with the surface covered with film paper or coating that are suitable for the process of this invention.

[0048] Example 2

[0049] As shown in Figure 3, this embodiment 2 provides a hot-press forming mold for bamboo and wood flooring. The inner chamfer is a chamfer with a slope height c of 2mm and an angle of 45 degrees with the horizontal plane. Other structures and methods are the same as in embodiment 1.

[0050] As shown in Figure 4, a paint-free bamboo and wood flooring based on the hot-pressing molding mold of bamboo and wood flooring in Embodiment 2 is provided. The chamfer is a slanted chamfer with a height C of 2mm and an angle of 45 degrees with the horizontal plane. Other structures and methods are the same as in Embodiment 1.

[0051] Example 3

[0052] As shown in Figure 5, this embodiment three provides a hot pressing mold for bamboo and wood flooring. The inner chamfer is a stepped round chamfer with a step height d of 2mm and an included angle of 90 degrees between the step surfaces. Other structures and methods are the same as in embodiment one.

[0053] As shown in Figure 6, a paint-free bamboo and wood flooring based on the hot-pressing molding mold of bamboo and wood flooring in Embodiment 3 is provided. The chamfer is a beveled chamfer with a step height D of 2mm and an included angle of 90 degrees on the step surface. Other structures and methods are the same as in Embodiment 1.

[0054] Example 4

[0055] As shown in Figure 7, this embodiment four provides a hot-press forming mold for bamboo and wood flooring. The upper mold is formed by horizontally splicing and fixing a first, second, third, and fourth sub-upper mold. The bottom surface of the first sub-upper mold has two rectangular grooves, the bottom surface of the second sub-upper mold has two rectangular grooves, the bottom surface of the third sub-upper mold has three rectangular grooves, and the bottom surface of the fourth sub-upper mold has three rectangular grooves. The bottom surface of the rectangular groove of the first sub-upper mold has raised imitation wood grain patterns, the bottom surface of the rectangular groove of the second sub-upper mold has raised imitation leather grain patterns, the bottom surface of the rectangular groove of the third sub-upper mold has raised vertical stripes, and the bottom surface of the rectangular groove of the fourth sub-upper mold has raised irregular stripes. The raised height of the grain is 0.5 mm, and the width of the vertical stripes and the irregular stripes is 0.5 mm. Other structures and methods are the same as in embodiment one.

[0056] As shown in Figures 8 and 9, a paint-free bamboo and wood flooring based on the hot-pressing molding die of Embodiment 3 is described. The bamboo and wood flooring undergoes simultaneous hot-pressing and paint-free treatment on ten pieces. From top to bottom, the upper surface of the paint-free layer of the first and second bamboo and wood flooring pieces has a concave wood grain pattern; the upper surface of the paint-free layer of the third and fourth bamboo and wood flooring pieces has a concave leather grain pattern; the upper surface of the paint-free layer of the fifth, sixth, and seventh bamboo and wood flooring pieces has concave vertical stripes; and the upper surface of the paint-free layer of the eighth, ninth, and tenth bamboo and wood flooring pieces has concave irregular stripes. The concave depth of the grain is 0.5 mm, and the width of the vertical and irregular stripes is 0.5 mm. Other structures and methods are the same as in Embodiment 1.

[0057] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, if these changes fall within the scope of the claims of the present invention and their equivalents, they shall still fall within the protection scope of the present invention.

Claims

1. A hot-press forming mold for bamboo and wood flooring, comprising an upper mold and a lower mold, wherein the upper mold abuts against the top of the flooring material, and the lower mold abuts against the bottom of the flooring material and fixes the flooring material, characterized in that: The bottom surface of the upper mold is provided with at least one rectangular groove, the width of which is the same as the width of the bamboo flooring, and the bottom edges of the rectangular groove are provided with inner chamfers.

2. The hot pressing mold for bamboo and wood flooring according to claim 1, characterized in that: The bottom surface of the upper mold is provided with at least two rectangular grooves, and the spacing between adjacent rectangular grooves is the same.

3. The bamboo and wood flooring hot pressing mold according to claim 1, characterized in that: The upper mold is formed by horizontally splicing and fixing at least two sub-upper molds. Each sub-upper mold has at least one rectangular groove on its bottom surface, and the spacing between adjacent rectangular grooves is the same.

4. A hot-press forming mold for bamboo and wood flooring according to any one of claims 1-3, characterized in that: The inner chamfer can be a rounded chamfer, an elliptical chamfer, a beveled chamfer, or a stepped rounded chamfer.

5. The hot pressing mold for bamboo and wood flooring according to claim 4, characterized in that: The upper mold has a width L of 55–2550 mm, a height H of 2–25 mm, a width a of 50–2500 mm, a depth b of 0.1–20 mm, and an inner chamfer with a radius r of 0.1–10 mm and a central angle of 30–90 degrees, or a chamfer with a slope height c of 0.1–10 mm and an angle of 30–60 degrees with the horizontal plane, or a stepped chamfer with a step height d of 0.1–10 mm and an angle of 90–120 degrees with the stepped surfaces.

6. A hot-press forming mold for bamboo and wood flooring according to claim 2 or 3, characterized in that: The upper mold has a width L of 55–2550 mm, a height H of 2–25 mm, a width a of 50–2500 mm, a depth b of 0.1–20 mm, and a spacing w between adjacent rectangular grooves of 0.5–10 mm.

7. The hot pressing mold for bamboo and wood flooring according to claim 6, characterized in that: The bottom surface of the rectangular groove is provided with a raised surface with a height of 0.05 to 15 mm, or a recessed surface with a depth of 0.05 to 15 mm.

8. The hot pressing mold for bamboo and wood flooring according to claim 7, characterized in that: The texture is a raised or recessed imitation leather texture, imitation wood grain texture, vertical stripes, or irregular stripes.

9. A hot-press forming mold for bamboo and wood flooring according to claim 8, characterized in that: The width of the vertical stripes or irregular stripes is 0.5 to 50 mm.

10. A paint-free bamboo and wood flooring based on the hot-pressing mold of bamboo and wood flooring according to any one of claims 1-9, characterized in that: The upper surface edge of the bamboo and wood flooring is chamfered, and the upper surface and the chamfered edges are covered with a hot-pressed, paint-free layer.

11. A paint-free bamboo and wood flooring according to claim 10, characterized in that: The chamfer can be a rounded chamfer, an elliptical chamfer, a beveled chamfer, or a stepped rounded chamfer.

12. The paint-free bamboo and wood flooring according to claim 11, characterized in that: The thickness T of the bamboo and wood flooring is 9-300mm, the width A of the paint-free layer is 50-2500mm, the height B is 0.1-20mm, and the chamfer is a round chamfer with a radius R of 0.1-10mm and a central angle of 30-90 degrees, or a bevel chamfer with a slope height C of 0.1-10mm and an angle of 30-60 degrees with the horizontal plane, or a step round chamfer with a step height D of 0.1-10mm and an angle of 90-120 degrees with the step surface.

13. The paint-free bamboo and wood flooring according to claim 10, characterized in that: The upper surface of the paint-free layer is provided with raised or recessed textures.

14. The paint-free bamboo and wood flooring according to claim 13, characterized in that: The raised height of the texture is 0.05–15 mm, or the concave depth is 0.05–15 mm.

15. A paint-free bamboo and wood flooring according to claim 14, characterized in that: The texture is a raised or recessed imitation leather texture, imitation wood grain texture, vertical stripes, or irregular stripes.

16. A paint-free bamboo and wood flooring according to claim 15, characterized in that: The width of the vertical stripes or irregular stripes is 0.5 to 50 mm.

17. A paint-free bamboo and wood flooring according to any one of claims 10-16, characterized in that: The bamboo flooring is made of bamboo, wood, or a mixture of bamboo and wood.

18. A process for preparing paint-free bamboo and wood flooring based on a hot-pressing mold according to any one of claims 1-9, comprising hot-pressing paint-free treatment, characterized in that: The aforementioned hot-press paint-free treatment refers to fixing the floorboard with a film-coated paper on its upper surface onto the lower mold of the bamboo and wood flooring hot-press forming mold, snapping the upper mold together to perform the hot-pressing process, and hot-pressing to form the paint-free and chamfered surfaces in one step.

19. The preparation process of a paint-free bamboo and wood flooring according to claim 18, characterized in that: The hot pressing process is performed at a temperature of 100–160°C and a pressure of 15–28 MPa.

20. The preparation process of a paint-free bamboo and wood flooring according to claim 19, characterized in that: The flooring material is a substrate that has not undergone hot pressing, and the hot pressing process takes 20-60 minutes.

21. The preparation process of a paint-free bamboo and wood flooring according to claim 19, characterized in that: The flooring material is a substrate that has undergone hot pressing, and the hot pressing process takes 7-20 minutes.

22. The preparation process of a paint-free bamboo and wood flooring according to any one of claims 18-21, characterized in that: The flooring material is a substrate that can simultaneously hot-press and paint-free process at least two bamboo and wood flooring pieces. The spacing W between adjacent bamboo and wood flooring pieces is 0.5 to 10 mm. After the substrate is hot-pressed and paint-free processed, the space between adjacent bamboo and wood flooring pieces is cut off.

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