Electronic device

Abstract

The present application belongs to the field of electronic devices. Disclosed is an electronic device. The electronic device comprises a frame, a support beam and a pressure-sensing module, wherein the frame is provided with an accommodating groove; the support beam comprises a first fixed portion, a second fixed portion and a support portion, the first fixed portion and the second fixed portion being respectively fixedly connected to two opposite ends of the support portion; two side portions of the accommodating groove are respectively configured to mount the first fixed portion and the second fixed portion, the middle portion of the accommodating groove is configured to accommodate the support portion, and a deformation gap is provided between the support portion and the groove bottom of the accommodating groove; and the pressure-sensing module is stacked on the surface of one side of the support portion in the support direction of the support portion.

Description

electronic devices

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411540995.0, filed with the Chinese Patent Office on October 31, 2024, entitled “Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0004] Driven by user demand for waterproofing in mobile phones and other electronic devices, pressure-sensitive buttons have replaced physical switches, eliminating the need for through holes on the device's frame that correspond to physical switches. Current pressure-sensitive buttons incorporate intermittent steel plates, with pressure-sensitive material overlapping between adjacent plates to deform under pressure and provide haptic feedback. However, due to the brittle nature of pressure-sensitive materials, the manufacturing and assembly process requires interlocking structural elements for connection and assembly. During this process, the edge areas of the pressure-sensitive material within the steel plates experience strong and concentrated stress, making these areas prone to cracking or even breakage, leading to button malfunction. Summary of the Invention

[0005] The purpose of this application is to provide an electronic device to solve the problem that pressure-sensitive buttons in current electronic devices are prone to cracking or even breaking due to stress concentration during assembly, leading to button failure.

[0006] This application discloses an electronic device comprising a frame, a support beam, and a pressure-sensitive module. The frame is provided with a receiving groove. The support beam includes a first fixing part, a second fixing part, and a support part. The first fixing part and the second fixing part are respectively fixedly connected to opposite ends of the support part. The two sides of the receiving groove are respectively used to install the first fixing part and the second fixing part. The middle part of the receiving groove is used to accommodate the support part, and a deformation gap is provided between the support part and the bottom of the receiving groove. The pressure-sensitive module is stacked on one side surface of the support part along the support direction of the support part.

[0007] This application discloses an electronic device whose frame has a receiving groove, which is divided into a middle part and two side parts. A first fixing part and a second fixing part of a support beam are respectively installed in the side parts of the receiving groove. A support part of the support beam, which connects the first fixing part and the second fixing part, is received in the middle part of the receiving groove, and a deformation gap is provided between the support part and the bottom of the receiving groove, so that when the support part is subjected to a pressing force, it can move and deform closer to the bottom of the receiving groove. At the same time, a pressure-sensitive module is stacked on one side surface of the support part along the support direction of the support part, so that the pressure-sensitive module can also deform during the deformation of the support part to output a pressure-sensitive signal. Furthermore, the support part can also provide good support for the pressure-sensitive module, thereby preventing stress concentration at any position on the pressure-sensitive module during the assembly of the electronic device, and thus improving the service life of the pressure-sensitive module. Attached Figure Description

[0008] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0009] Figures 1-4 are schematic diagrams of different structures of the electronic devices disclosed in the embodiments of this application;

[0010] Figure 5 is a schematic diagram of the structure of the pressure-sensitive module in the electronic device disclosed in the embodiments of this application;

[0011] Figure 6 is a schematic diagram of the structure of an electronic device using another pressure-sensitive module disclosed in an embodiment of this application.

[0012] Reference numerals: 100-Frame, 101-Deformation gap, 102-Receiving groove, 200-Support beam, 210-First fixing part, 211-Avoidance notch, 220-Second fixing part, 230-Support part, 300-Pressure-sensitive module, 310-Circuit board, 320-Pressure-sensitive material, 330-Conductive component, 340-Solder pad, 350-Insulating protective layer, 360-Piezoelectric device, 410-Keycap, 420-Adhesive layer, 430-Insert, 440-First connecting layer, 450-Second connecting layer. Detailed Implementation

[0013] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0014] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0015] As shown in Figures 1-6, this application discloses an electronic device, which includes a frame 100, a support beam 200 and a pressure-sensitive module 300. Of course, electronic devices may also include other components such as a display screen and a battery. For the sake of brevity, they will not be described in detail here.

[0016] Specifically, the frame 100 may include the outer frame of the electronic device. That is, during the use of the electronic device, at least a portion of the outer surface of the frame 100 may be exposed so that the user can touch the outer surface of the frame 100 and interact with the electronic device by directly or indirectly pressing the pressure-sensitive module 300 set on the frame 100.

[0017] The frame 100 can be made of rigid materials such as metal or plastic, as shown in the figure. The frame 100 is provided with a receiving groove 102. Specifically, the receiving groove 102 is recessed from the outer surface of the frame 100, so that both the support beam 200 and the pressure-sensitive module 300 can be installed in the receiving groove 102, and the user can press the pressure-sensitive module 300 from the outer surface of the frame 100. Of course, the shape and depth of the receiving groove 102 can be flexibly designed according to the thickness and other dimensions of the support beam 200 and the pressure-sensitive module 300, and this article does not limit this.

[0018] Meanwhile, in order to ensure that the pressure-sensitive module 300 can deform normally and generate a pressure-sensitive signal when pressed, in the electronic device disclosed in this application embodiment, the receiving groove 102 includes a middle part and two side parts respectively located in the aforementioned middle part. Of course, both side parts are connected to the middle part, so that the receiving groove 102 of this form can accommodate the support beam 200. At the same time, the receiving groove 102 can provide support for the support beam 200, so that the support part 230 located in the middle position of the support beam 200 can be deformed under pressure, and the pressure-sensitive module 300 is deformed accordingly, and a deformation signal is output.

[0019] More specifically, the support beam 200 includes a first fixing part 210, a second fixing part 220, and a support part 230, wherein the first fixing part 210 and the second fixing part 220 are respectively fixedly connected to opposite ends of the support part 230. Optionally, the first fixing part 210, the second fixing part 220, and the support part 230 can all be formed of materials with relatively high structural strength, such as metal, and can be formed separately by a split molding method. Then, the first fixing part 210 and the second fixing part 220 can be fixedly connected to opposite ends of the support part 230 by welding or other methods. In other embodiments of this application, the support beam 200 can be formed by integral molding of materials with relatively high structural strength, such as metal. In a specific embodiment of this application, the support beam 200 can be a steel plate with relatively thin thickness, and along the length direction of the steel plate, it sequentially includes the first fixing part 210, the support part 230, and the second fixing part 220. It should be noted that the support beam 200 has good structural strength and deformability. That is, the support beam 200 is an elastic deformation component. When the support beam 200 is made of metal material, by making the thickness of the support beam 200 relatively small, it is also possible to ensure that the support beam 200 has both good elastic deformation capability and high structural strength.

[0020] As described above, the receiving groove 102 is used to accommodate the support beam 200. Specifically, the two side portions of the receiving groove 102 can be used to install the first fixing part 210 and the second fixing part 220, respectively, and the middle portion of the receiving groove 102 is used to accommodate the support part 230. That is, during the assembly of electronic equipment, the first fixing part 210 and the second fixing part 220 can be installed in the two side portions of the receiving groove 102, respectively, and correspondingly, the support part 230 is accommodated in the middle portion of the receiving groove 102. Of course, in order to ensure that the support part 230 still has the ability to be deformed under pressure, in this embodiment of the application, as shown in the figure, a deformation gap 101 is provided between the support part 230 and the bottom of the receiving groove 102, so that when the side surface of the support part 230 away from the bottom of the receiving groove 102 is subjected to a pressing force, the support part 230 can move towards the bottom of the receiving groove 102 to deform. The bottom of the receiving groove 102 is the inner wall facing the opening of the receiving groove 102, and the support direction of the support part 230 is the depth direction of the receiving groove 102. Of course, the specific size of the deformation gap 101 in the depth direction of the receiving groove 102 can be determined according to the actual situation such as the deformability of the pressure-sensitive module 300. This article does not limit it.

[0021] Accordingly, to ensure that the electronic device disclosed in this application has pressure-sensing capability, as shown in the figure, the pressure-sensitive module 300 is stacked on one side surface of the support portion 230 along the support direction of the support portion 230. Thus, during the deformation of the support portion 230 under pressure, the pressure-sensitive module 300 can also deform, thereby causing the pressure-sensitive module 300 to output a pressure-sensitive signal. Of course, in the electronic device, the pressure-sensitive module 300 also needs to form an electrical connection with components such as the motherboard of the electronic device, so that the pressure-sensitive signal generated by the pressure-sensitive module 300 can be transmitted to the motherboard and converted into corresponding control commands, etc.

[0022] More specifically, in the electronic device disclosed in the embodiments of this application, in a plane perpendicular to the support direction of the support portion 230, the projection of the surface of the support portion 230 used to mount the pressure-sensitive module 300 can cover the projection of the surface of the pressure-sensitive module 300 that is in contact with the support portion 230. In this case, any position on the pressure-sensitive module 300 can be supported by the support portion 230. Thus, during the assembly of the electronic device, even if the pressure-sensitive module 300 and the support portion 230 are subjected to mutual squeezing forces, the support portion 230 can provide more comprehensive support for the pressure-sensitive module 300, thereby preventing the pressure-sensitive module 300 from being damaged due to local stress concentration.

[0023] This application discloses an electronic device whose frame 100 is provided with a receiving groove 102, which is divided into a middle part and two side parts. The first fixing part 210 and the second fixing part 220 of the support beam 200 are respectively installed in the two side parts of the receiving groove 102. The support part 230 of the support beam 200, which connects the first fixing part 210 and the second fixing part 220, is received in the middle part of the receiving groove 102. A deformation gap 101 is provided between the support part 230 and the bottom of the receiving groove 102 so that when the support part 230 is subjected to a pressing force, the support part 230 can move and deform closer to the bottom of the receiving groove 102. Meanwhile, the pressure-sensitive module 300 is stacked on one side surface of the support portion 230 along the support direction of the support portion 230, so that the pressure-sensitive module 300 can deform together with the support portion 230 during the deformation process to output pressure-sensitive signals. In addition, the support portion 230 can also provide good support for the pressure-sensitive module 300, thereby preventing stress concentration at any position on the pressure-sensitive module 300 during the assembly of electronic devices, thus improving the service life of the pressure-sensitive module 300.

[0024] As described above, the pressure-sensitive module 300 is attached to one side surface of the support portion 230. Optionally, the pressure-sensitive module 300 is located on the side of the support portion 230 facing the opening of the receiving groove 102. In this case, when the user applies pressure through the opening of the receiving groove 102, it can be ensured that the pressure is applied to the pressure-sensitive module 300, thereby deforming the pressure-sensitive module 300 and generating a pressure signal.

[0025] To increase the deformation of the pressure-sensitive module 300, thereby increasing its signal strength and improving its sensitivity and accuracy, in another embodiment of this application, the pressure-sensitive module 300 can be located on the side of the support portion 230 facing the bottom of the receiving groove 102. In this case, when the pressure applied to the support portion 230 is equal, the deformation of the pressure-sensitive module 300 in the technical solution disclosed in this application is relatively larger. Specifically, the pressure-sensitive module 300 can be bonded to the surface of the support portion 230 facing the bottom of the receiving groove 102 using double-sided tape or glue.

[0026] In addition, in order to improve the appearance of the electronic device and reduce the difficulty of pressing the pressure-sensitive module 300, in this embodiment, a keycap 410 can be provided on the side of the support 230 away from the bottom of the groove. At the same time, the keycap 410 can also form an adhesive layer 420 by using double-sided tape or glue, so that the keycap 410 is fixed to the surface of the support 230 away from the bottom of the groove. On the one hand, this ensures that the keycap 410 can be stably assembled in the electronic device. On the other hand, when the keycap 410 is pressed, the pressure transmission efficiency and accuracy can be relatively higher. During the bonding process of keycap 410, keycap 410 can be fixedly bonded to the surface of support 230 by cold pressing. Of course, since there is a deformation gap 101 between support 230 and the bottom of receiving groove 102, in order to improve the bonding reliability of keycap 410 and prevent support 230 from being damaged by large pressing pressure during the assembly process of keycap 410, a hard pad can be placed in deformation gap 101 first when bonding keycap 410, and the hard pad can be removed from deformation gap 101 after the bonding process of keycap 410 is completed.

[0027] As described above, the pressure-sensitive module 300 is used to output a pressure-sensitive signal by deforming under pressure. In a specific embodiment of this application, the device in the pressure-sensitive module 300 that provides pressure-sensing function can be a pressure-sensitive material 320. The pressure-sensitive material 320 is formed of a pressure-sensitive material. During the deformation process under pressure, due to the difference in bending radii of its two opposite surfaces, the resistance change of the pressure-sensitive material 320 on its two opposite surfaces is different. Since the deformation and resistance of the surface of the pressure-sensitive material 320 are linearly related, the pressure difference between the two ends of the opposite two surfaces of the pressure-sensitive material 320 can be detected according to the Wheatstone bridge principle to determine the specific magnitude of the pressure on the pressure-sensitive material 320. The pressure is then converted into an electrical signal to achieve the purpose of pressure sensing. Of course, when the pressure-sensitive module 300 is located on the side of the support 230 facing the bottom of the groove, and the pressure-sensitive module 300 includes the pressure-sensitive material 320, the size of the pressure-sensitive module 300 in the thickness direction needs to be smaller than the size of the deformation gap 101 mentioned above, so as to ensure that the support 230 can still deform towards the side where the bottom of the receiving groove 102 is located when it is under pressure.

[0028] Therefore, in one specific embodiment of this application, the pressure-sensitive module 300 may include a circuit board 310 and a pressure-sensitive material component 320. As described above, the pressure on the pressure-sensitive material component 320 can be determined by utilizing the changes in resistance values ​​of its two opposing surfaces. Therefore, in one specific embodiment of this application, the pressure-sensitive material component 320 may be provided only on one side of the circuit board 310. In this case, the two ends of the pressure-sensitive material component 320 facing the circuit board 310, respectively near the first fixing part 210 and the second fixing part 220, are electrically connected to the circuit board 310, and the two ends of the pressure-sensitive material component 320 facing away from the circuit board 310, respectively near the first fixing part 210 and the second fixing part 220, are also electrically connected to the circuit board 310. This allows the pressure changes of the opposing surfaces of a single pressure-sensitive material component 320 to be transmitted via the circuit board 310 to devices such as a motherboard.

[0029] More intuitively, if we take the surface of the pressure-sensitive material 320 closest to the circuit board 310 as the inner surface and the surface furthest from the circuit board 310 as the outer surface, then in this embodiment, both the inner and outer surfaces of the pressure-sensitive material 320 located on the side of the circuit board 310 are electrically connected to the circuit board 310. Thus, by detecting the difference in resistance between the inner and outer surfaces of the pressure-sensitive material 320, we can detect whether the pressure-sensitive module 300 is under pressure.

[0030] As described above, the pressure-sensitive material component 320 can be provided only on one side of the circuit board 310. Optionally, the pressure-sensitive material component 320 is located between the circuit board 310 and the support portion 230. In this case, the support portion 230 and the circuit board 310 can be used to protect the pressure-sensitive material component 320, preventing it from getting damp or rusting, thereby extending the service life of the pressure-sensitive material component 320 and the entire pressure-sensitive module 300.

[0031] In another embodiment of this application, the circuit board 310 can be connected to the support portion 230. More specifically, the circuit board 310 can be connected to the side surface of the support portion 230 facing the bottom of the receiving groove 102. At the same time, the pressure-sensitive material 320 is disposed on the side of the circuit board 310 away from the support portion 230. That is, the pressure-sensitive material 320 is disposed on the side surface of the circuit board 310 facing the bottom of the receiving groove 102. In this case, the deformation capability of the pressure-sensitive material 320 can be further improved, thereby improving the pressure detection accuracy and sensitivity of the pressure-sensitive module 300 and making the functions of the pressure-sensitive module 300 more diversified.

[0032] To further improve the pressure detection accuracy and sensitivity of the pressure-sensitive module 300, in another embodiment of this application, pressure-sensitive material elements 320 can be provided on both opposite sides of the circuit board 310, and the difference in resistance between the two pressure-sensitive material elements 320 is used to characterize the pressure applied to the pressure-sensitive module 300. In this embodiment, since the two pressure-sensitive material elements 320 are located on opposite sides of the circuit board 310, the difference in deformation between the two pressure-sensitive material elements 320 is relatively large when the pressure-sensitive module 300 is subjected to the same pressure, thereby improving the pressure detection accuracy of the pressure-sensitive module 300.

[0033] In detail, in the embodiments of this application, pressure-sensitive material components 320 can be provided on the side of the circuit board 310 facing the support portion 230 and the side of the circuit board 310 away from the support portion 230, respectively. The two ends of each pressure-sensitive material component 320, which are close to the first fixing portion 210 and the second fixing portion 220, are electrically connected to the circuit board 310.

[0034] During the electrical connection of any pressure-sensitive material component 320 and the circuit board 310, the opposite ends of the side surface of any pressure-sensitive material component 320 closest to the circuit board 310 can be connected to the circuit board 310. In this case, the connection difficulty between the pressure-sensitive material component 320 and the circuit board 310 can be significantly reduced. In another embodiment of this application, the side surface of each pressure-sensitive material component 320 away from the circuit board 310 can be electrically connected to the circuit board 310. That is, each pressure-sensitive material component 320 forms an electrical connection with the circuit board 310 through its respective outer surface. In this case, since the distance between the outer surfaces of the two pressure-sensitive material components 320 is the largest, the difference in the deformation of the outer surfaces of the two pressure-sensitive material components 320 is relatively larger when the support portion 230 is subjected to the same pressure. This results in a relatively large difference in resistance generated when the pressure-sensitive module 300 deforms, thereby further improving the signal quantity of the pressure-sensitive module 300 and making the detection accuracy of the pressure-sensitive module 300 higher.

[0035] To ensure a reliable electrical connection between the surface of any pressure-sensitive material component 320 facing away from the circuit board 310 and the circuit board 310, in one specific embodiment of this application, the surface of the pressure-sensitive material component 320 facing away from the circuit board 310 can be electrically connected to the circuit board 310 via a conductive element 330. Furthermore, the circuit board 310 may have pads 340, allowing the conductive element 330 to be electrically connected to the pads 340, thereby achieving the purpose of electrically connecting the surface of the pressure-sensitive material component 320 facing away from the circuit board 310 to the circuit board 310. More specifically, the conductive element 330 can be a wire, and to reduce the size of the conductive element 330, it can be formed by curing a conductive paste.

[0036] As described above, the pressure-sensitive material component 320 can be disposed on the side surface of the circuit board 310 away from the support portion 230. In this case, the pressure-sensitive module 300 may optionally include an insulating protective layer 350. By covering the pressure-sensitive material component 320, the conductive component 330 and the pad 340 with the insulating protective layer 350, the aforementioned conductive devices can be protected by the insulating protective layer 350, thereby improving the reliability and service life of the pressure-sensitive module 300.

[0037] As described above, the device providing pressure sensing in the pressure-sensitive module 300 can be a pressure-sensitive material 320. In another embodiment of this application, the device providing pressure sensing can also be a piezoelectric device 360. The piezoelectric device 360 ​​can generate current when subjected to pressure, and the magnitude of the current is positively correlated with the magnitude of the pressure applied to the piezoelectric device 360. Therefore, in another embodiment of this application, the pressure-sensitive module 300 can also include a circuit board 310 and a piezoelectric device 360. The piezoelectric device 360 ​​can specifically include a pressure chip or a piezoelectric ceramic component, both of which can generate a current of a corresponding magnitude when subjected to pressure. By connecting the piezoelectric device 360 ​​to the circuit board 310, the current generated by the piezoelectric device 360 ​​can be detected by the corresponding device in the electronic device to determine the pressure applied to the piezoelectric device 360. Of course, in this embodiment of the application, in order to ensure that the piezoelectric device 360 ​​can undergo compression deformation during the pressure process, the pressure-sensitive module 300 needs to be sandwiched between the support portion 230 and the bottom of the receiving groove 102 during the assembly of the electronic device.

[0038] In addition, the piezoelectric device 360 ​​can be positioned on the side of the circuit board 310 facing the bottom of the groove, so that the circuit board 310 can form a good fit and support relationship with the support part 230, preventing the circuit board 310 from being damaged by the piezoelectric device 360 ​​during the assembly of the pressure-sensitive module 300.

[0039] As described above, the first fixing part 210 and the second fixing part 220 can be respectively installed in the two side portions of the receiving groove 102. The structure and assembly method of the first fixing part 210 and the second fixing part 220 can be the same. Therefore, taking the first fixing part 210 as an example, the first fixing part 210 does not necessarily need to form a fixed connection with the two side portions of the receiving groove 102. For example, by forming an interference fit between the first fixing part 210 and the two side portions of the receiving groove 102 in the support direction of the support part 230, it can be ensured that the first fixing part 210 can be stably fixed in the two side portions of the receiving groove 102. In this case, the dimension of the first fixing part 210 in the aforementioned support direction can be slightly larger than the dimension of the two side portions of the receiving groove 102, thereby ensuring that the first fixing part 210 can form an interference fit with the two side portions of the receiving groove 102 to achieve the purpose of relative fixation.

[0040] Based on the above embodiments, in the support direction, when the first fixing part 210 and the two sides of the receiving groove 102 are interference-fitted, the size of the first fixing part 210 can be larger than the size of the support part 230. At the same time, as shown in the figure, an avoidance notch 211 can be provided on the first fixing part 210, and the avoidance notch 211 is recessed from the end of the first fixing part 210 near the support part 230 toward the direction away from the second fixing part 220. In the support direction, by placing the avoidance notch 211 and the deformation gap 101 on opposite sides of the support part 230, the deformation capability of the support part 230 is relatively stronger during the deformation process in the direction of deformation toward the bottom of the receiving groove 102 and during the recovery deformation process in the direction away from the bottom of the receiving groove 102.

[0041] To reduce the processing difficulty of the first fixing part 210, in another embodiment of this application, the dimensions of the two sides of the receiving groove 102 in the support direction can be larger than the dimensions of the first fixing part 210. In this case, the electronic device can also include an insert 430, and the insert 430 can be stacked on one side of the first fixing part 210 in the support direction of the support part 230. The corresponding first fixing part 210 and insert 430 are embedded together in the two sides of the receiving groove 102, so that the first fixing part 210 and insert 430 can form an interference fit with the two sides of the receiving groove 102. In this case, the dimensions of the first fixing part 210 and the support part 230 in the support direction can be equal, and the support beam 200 including the first fixing part 210, the second fixing part 220 and the support part 230 can be directly formed using conventional materials such as steel plates of uniform thickness, which can greatly reduce the processing difficulty of the support beam 200.

[0042] To improve the assembly reliability between the insert 430 and the first fixing part 210, in this embodiment, the insert 430 and the first fixing part 210 can be pre-established with a fixed connection. Specifically, a first connecting layer 440 can be formed between the first fixing part 210 and the insert 430 by bonding or welding, so as to ensure a more stable fixed relationship between the first fixing part 210 and the insert 430. It should be noted that when using bonding, the first connecting layer 440 can be a layered structure, and when using welding, the first connecting layer 440 can be a weld point structure.

[0043] In the above embodiments of this application, the first fixing part 210 can form an interference fit with the two sides of the receiving groove 102 either alone or by cooperating with the insert 430, so that the first fixing part 210 and the two sides of the receiving groove 102 form a relatively stable relative fixing relationship. In order to prevent the first connecting layer 440 from being easily damaged by shear force for a long time and frequently when the support part 230 is under pressure, the side surface of the first fixing part 210 facing the bottom of the receiving groove 102 can also form a fixed connection with the corresponding inner wall of the two sides of the receiving groove 102. In this case, when the pressure on the support part 230 is applied to the first connecting layer 440, the two sides of the receiving groove 102 facing the inner wall of the first fixing part 210 in the support direction can provide good support for the support part 230 and the first connecting layer 440, thereby ensuring that the reliability of the first connecting layer 440 is relatively high. More specifically, the first fixing part 210 can be fixedly connected to the inner walls of the two sides of the receiving groove 102 by bonding or welding to form a second connecting layer 450.

[0044] Furthermore, when the first fixing part 210 and the two sides of the receiving groove 102 are directly fixedly connected through the second connecting layer 450, in order to facilitate the formation of the aforementioned second connecting layer 450, the size of the first fixing part 210 in the support direction can be smaller than the size of the two sides of the receiving groove 102. After the second connecting layer 450 is formed, that is, after the fixing work between the first fixing part 210 and the two sides of the receiving groove 102 is completed, any gaps that may remain between the first fixing part 210 and the two sides of the receiving groove 102 in the support direction can be further improved by filling them with a device such as an insert 430. Of course, since the first fixing part 210 and the two sides of the receiving groove 102 have already formed a relatively reliable fixed connection in the support direction through the second connecting layer 450, even if there are any gaps that may remain between the first fixing part 210 and the two sides of the receiving groove 102 in the support direction, it is not necessary to fill them with devices such as inserts 430.

[0045] As described above, the structure and assembly method of the second fixing part 220 can be the same as those of the first fixing part 210. Therefore, optionally, the assembly method between the second fixing part 220 and the two sides of the receiving groove 102 can refer to the above description of the first fixing part 210. Considering the brevity of the text, it will not be repeated here.

[0046] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0047] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, comprising a frame (100), a support beam (200), and a pressure-sensitive module (300), wherein the frame (100) is provided with a receiving groove (102), the support beam (200) includes a first fixing part (210), a second fixing part (220), and a support part (230), the first fixing part (210) and the second fixing part (220) are respectively fixedly connected to opposite ends of the support part (230), the two sides of the receiving groove (102) are respectively used to install the first fixing part (210) and the second fixing part (220), the middle part of the receiving groove (102) is used to accommodate the support part (230), and a deformation gap (101) is provided between the support part (230) and the bottom of the receiving groove (102), and the pressure-sensitive module (300) is stacked on one side surface of the support part (230) along the support direction of the support part (230).

2. The electronic device according to claim 1, wherein, The pressure-sensitive module (300) is located on the side of the support (230) facing the bottom of the groove, and a keycap (410) is provided on the side of the support (230) away from the bottom of the groove.

3. The electronic device according to claim 2, wherein, In the thickness direction of the pressure-sensitive module (300), the size of the pressure-sensitive module is smaller than the size of the deformation gap (101). The pressure-sensitive module (300) includes a circuit board (310) and a pressure-sensitive material component (320). The pressure-sensitive material component (320) is formed of a pressure-sensitive material. The two ends of the pressure-sensitive material component (320) facing the circuit board (310) and near the first fixing part (210) and the second fixing part (220) are electrically connected to the circuit board (310). The two ends of the pressure-sensitive material component (320) facing away from the circuit board (310) and near the first fixing part (210) and the second fixing part (220) are also electrically connected to the circuit board (310).

4. The electronic device according to claim 3, wherein, The circuit board (310) is connected to the support (230), and the pressure-sensitive material (320) is disposed on the side of the circuit board (310) away from the support (230).

5. The electronic device according to claim 3, wherein, The pressure-sensitive module (300) includes a circuit board (310) and a pressure-sensitive material component (320). The pressure-sensitive material component (320) is formed of a pressure-sensitive material. The circuit board (310) is provided with the pressure-sensitive material component (320) on the side facing the support portion (230) and on the side of the circuit board (310) away from the support portion (230). The two ends of each of the two pressure-sensitive material components (320) near the first fixing portion (210) and the second fixing portion (220) are electrically connected to the circuit board (310).

6. The electronic device according to claim 5, wherein the surface of each pressure-sensitive material (320) facing away from the circuit board (310) is electrically connected to the circuit board (310).

7. The electronic device according to claim 4 or 6, wherein, The pressure-sensitive material component (320) is electrically connected to the pads (340) of the circuit board (310) on the side facing away from the circuit board (310) through a conductive component (330). The pressure-sensitive module (300) also includes an insulating protective layer (350) which covers the pressure-sensitive material component (320), the conductive component (330), and the pads (340).

8. The electronic device according to claim 2, wherein, The pressure-sensitive module (300) is sandwiched between the support (230) and the bottom of the receiving groove (102). The pressure-sensitive module (300) includes a circuit board (310) and a piezoelectric device (360). The piezoelectric device (360) is electrically connected to the circuit board (310). The piezoelectric device (360) includes a pressure chip or a piezoelectric ceramic component.

9. The electronic device according to claim 1, wherein, In the support direction of the support part (230), the first fixing part (210) is interference-fitted with both sides of the receiving groove (102), and the size of the first fixing part (210) is larger than the size of the support part (230). The first fixing part (210) is provided with a clearance notch (211). The clearance notch (211) is recessed from one end of the first fixing part (210) near the support part (230) toward the direction away from the second fixing part (220). In the support direction, the clearance notch (211) and the deformation gap (101) are located on opposite sides of the support part (230).

10. The electronic device according to claim 1, wherein, The electronic device further includes an insert (430). In the support direction of the support portion (230), the insert (430) is stacked on one side of the first fixing portion (210), and the first fixing portion (210) and the insert (430) are both embedded in the two sides of the receiving groove (102). The insert (430) is fixedly connected to the first fixing part (210).

11. The electronic device according to claim 1, wherein, The first fixing part (210) is fixedly connected to the inner wall of both sides of the receiving groove (102) on one side surface facing the bottom of the groove.

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