Voltage transformation control device, motor controller, and vehicle

Abstract

The present disclosure relates to a voltage transformation control device, a motor controller, and a vehicle. The voltage transformation control device comprises: a transformer, wherein the transformer comprises a first circuit board; a main board, wherein the main board comprises a second circuit board; a first reinforcement connection layer located on the side of the first circuit board facing the second circuit board, wherein the first reinforcement connection layer comprises a first reinforcement pad; and a second reinforcement connection layer located on the side of the second circuit board facing the first circuit board, wherein the second reinforcement connection layer comprises a second reinforcement pad, the first reinforcement pad is fixed to the second reinforcement pad by welding, and the first reinforcement pad is not electrically connected to the second reinforcement pad. By means of the technical solution of the present disclosure, the use reliability of the transformer is improved, the risk of the transformer falling off from the main board is reduced, no additional area is required for the transformer, and the cost of the voltage transformation control device is reduced.

Description

Transformer control unit, motor controller and vehicle

[0001] Cross-references to related applications

[0002] This disclosure is based on and claims priority to Chinese Patent Application No. 202411535352.7, filed on October 30, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of vehicle technology, and more particularly to a transformer control device, a motor controller, and a vehicle. Background Technology

[0004] With the development of modern technology, new energy vehicles are becoming increasingly popular, and their controllers are integrating more and more functions while requiring smaller sizes. Hybrid electric vehicles typically include two motors: one as the main drive motor and the other as a generator. Both require a motor controller for control, and the motor controller is placed close to the generator and drive motor.

[0005] In related technologies, in dual-electric control systems, such as the generator and drive motor in range-extended vehicles, the distance between them is too close. If the transformer in the motor controller is still fixed to the main board using the original pins for electrical connection, it cannot meet the new vibration requirements. During use, excessive vibration can easily cause the transformer to detach from the main board, leading to transformer failure. Furthermore, simply increasing the number of pins for electrical connection not only requires increasing the transformer area but also does not significantly improve vibration resistance. Summary of the Invention

[0006] To solve the above-mentioned technical problems, or at least partially solve them, this disclosure provides a transformer control device, a motor controller, and a vehicle, which improves the reliability of transformer use, reduces the risk of transformer detaching from the main board, eliminates the need to increase the transformer area, and reduces the cost of the transformer control device.

[0007] In a first aspect, this disclosure provides a transformer control device, comprising: a transformer; the transformer including a first circuit board;

[0008] Motherboard; the motherboard includes a second circuit board;

[0009] A first reinforcing connection layer is located on the side of the first circuit board facing the second circuit board; the first reinforcing connection layer includes a first reinforcing pad;

[0010] The second reinforcing connection layer is located on the side of the second circuit board facing the first circuit board; the second reinforcing connection layer includes a second reinforcing pad;

[0011] The first reinforcing pad is welded and fixed to the second reinforcing pad, so that the first circuit board and the second circuit board do not form an electrical connection.

[0012] In some embodiments, the first reinforcing connection layer does not form an electrical connection with the first circuit board; and / or the second reinforcing connection layer does not form an electrical connection with the second circuit board.

[0013] In some embodiments, the first reinforcing pad includes a plurality of spaced-apart first reinforcing sub-pads, and the second reinforcing pad includes a plurality of spaced-apart second reinforcing sub-pads, wherein the first reinforcing sub-pads and the second reinforcing sub-pads are welded and fixed in a one-to-one correspondence.

[0014] In some embodiments, the plurality of first reinforced sub-pads and the plurality of second reinforced sub-pads are arranged in a grid array.

[0015] In some embodiments, the area of ​​the second reinforcing sub-pad is greater than or equal to the area of ​​the first reinforcing sub-pad.

[0016] In some embodiments, the first circuit board further includes a wiring layer; the first reinforcing connection layer further includes a plurality of first functional pads; the first functional pads are electrically connected to the wiring layer via vias; the second reinforcing connection layer further includes a plurality of second functional pads; the first functional pads and the second functional pads are electrically connected.

[0017] In some embodiments, the first functional pad and the first hardening pad are spaced apart, and the second functional pad and the second hardening pad are spaced apart.

[0018] In some embodiments, the spacing between adjacent first reinforcing sub-pads is less than or equal to the spacing between adjacent first reinforcing sub-pads and the first functional pad;

[0019] And / or, the spacing between adjacent second reinforced sub-pads is less than or equal to the spacing between adjacent second reinforced sub-pads and the second functional pad.

[0020] In some embodiments, the area of ​​the first reinforcing pad is greater than or equal to the area of ​​the first functional pad; and / or, the area of ​​the second reinforcing pad is greater than or equal to the area of ​​the second functional pad.

[0021] In a second aspect, this disclosure also provides a motor controller, including the transformer control device as described in the first aspect.

[0022] Thirdly, this disclosure also provides a vehicle including a transformer control device as described in the first aspect, or a motor controller as described in the second aspect.

[0023] The technical solution provided in this disclosure has the following advantages compared with the prior art:

[0024] The transformer control device, motor controller, and vehicle disclosed herein include: a transformer; the transformer includes a first circuit board; a main board; the main board includes a second circuit board; a first reinforcing connection layer located on the side of the first circuit board facing the second circuit board; the first reinforcing connection layer includes a first reinforcing pad; a second reinforcing connection layer located on the side of the second circuit board facing the first circuit board; the second reinforcing connection layer includes a second reinforcing pad; the first reinforcing pad and the second reinforcing pad are welded and fixed so that the first circuit board and the second circuit board do not form an electrical connection. Therefore, by setting a first reinforcing pad for fixing to the motherboard on the first reinforcing connection layer, the first circuit board of the transformer is fixed to the second circuit board of the motherboard through the first and second reinforcing pads. After the first and second circuit boards are fixed by welding the first and second reinforcing pads, no electrical connection is formed. This increases the fixing area between the transformer and the motherboard, and improves the connection strength between the transformer and the motherboard. Since the transformer is set in the motor controller, which is close to the generator and drive motor, the problem of the transformer in the motor controller falling off the motherboard and failing due to the increased vibration level caused by the close proximity of the generator and drive motor in the existing dual-control system is avoided. This improves the reliability of the transformer, reduces the risk of the transformer falling off the motherboard, and retains the original size of the transformer without increasing the transformer area, thus reducing the cost of the transformer control device. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0026] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0027] Figure 1 is an exploded structural diagram of a transformer control device provided in an embodiment of this disclosure;

[0028] Figure 2 is a schematic diagram of the planar structure of a transformer provided in an embodiment of this disclosure;

[0029] Figure 3 is a schematic diagram of a planar structure of a motherboard provided in an embodiment of this disclosure;

[0030] Figure 4 is a schematic diagram of the back structure of a transformer control device provided in an embodiment of this disclosure.

[0031] The correspondence between the reference numerals and the structural names in the attached drawings is as follows: 1. Transformer; 2. Main board; 3. First reinforced connection layer; 4. Second reinforced connection layer; 5. Wiring layer; 6. Magnetic core structure; 11. First circuit board; 21. Second circuit board; 31. First reinforced pad; 32. First functional pad; 41. Second reinforced pad; 42. Second functional pad; 310. First reinforced sub-pad; 410. Second reinforced sub-pad; 110. First hollow structure; 120. Second hollow structure. Detailed Implementation

[0032] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0033] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0034] In related technologies, both the motor and the drive motor generally require a motor controller, which is placed close to the generator and the drive motor. In a dual-control system, the generator and the drive motor are too close together. If the transformer in the motor controller is still fixed to the main board using the original electrical connection pins, it cannot meet the new vibration requirements. During use, the transformer is prone to detaching from the main board due to excessive vibration, resulting in transformer failure.

[0035] To address the aforementioned problems, this disclosure provides a transformer control device. The transformer control device includes: a transformer; the transformer includes a first circuit board; a main board; the main board includes a second circuit board; a first reinforcing connection layer located on the side of the first circuit board facing the second circuit board; the first reinforcing connection layer includes a first reinforcing pad; a second reinforcing connection layer located on the side of the second circuit board facing the first circuit board; the second reinforcing connection layer includes a second reinforcing pad; the first reinforcing pad and the second reinforcing pad are welded and fixed. By providing a first reinforcing pad for fixing to the main board on the first reinforcing connection layer, the first circuit board of the transformer is fixed to the second circuit board of the main board via the first and second reinforcing pads. This increases the fixing area between the transformer and the main board, improves the connection strength between the transformer and the main board, and avoids the problem in existing dual-control systems where the close proximity of the generator and drive motor leads to a significant increase in vibration level, causing the transformer to detach from the main board and resulting in transformer failure. This improves the reliability of the transformer, reduces the risk of the transformer detaching from the main board, and retains the original size of the transformer without requiring additional transformer area, thus reducing the cost of the transformer control device.

[0036] Figure 1 is an exploded structural diagram of a transformer control device provided in an embodiment of this disclosure; Figure 2 is a planar structural diagram of a transformer provided in an embodiment of this disclosure; and Figure 3 is a planar structural diagram of a motherboard provided in an embodiment of this disclosure. Referring to Figures 1 to 3, to increase the connection strength between the transformer 1 and the motherboard 2 and improve the vibration resistance of the transformer control device, the transformer control device provided in this embodiment of this disclosure includes a first reinforcing connection layer 3. The first reinforcing connection layer 3 is located on the side of the first circuit board 11 facing the second circuit board 21, and includes a first reinforcing pad 31. The transformer control device also includes a second reinforcing connection layer 4, located on the side of the second circuit board 21 of the motherboard 2 facing the first circuit board 11. Due to perspective issues, the second reinforcing connection layer 4 is not specifically shown in Figure 1. Furthermore, a second reinforcing pad 41 is provided on the second reinforcing connection layer 4. The first reinforcing pad 31 and the second reinforcing pad 41 are correspondingly provided, and the first reinforcing pad 31 and the second reinforcing pad 41 are fixedly connected by welding. The soldering method for the first reinforcing pad 31 and the second reinforcing pad 41 can be, for example, SMT (Surface Mount Technology). SMT is a circuit assembly technology that mounts leadless or short-lead surface mount components onto the surface of a printed circuit board or other substrate, and then assembles them by reflow soldering or dip soldering. SMT allows the first reinforcing pad 31 and the second reinforcing pad 41 to be soldered together, ensuring consistency in the soldering process. The specific soldering parameters and methods of SMT are well known to those skilled in the art, and will not be elaborated upon here.

[0037] It should be noted that the transformer provided in this embodiment can be an isolation transformer in vehicle electronic control. For example, the isolation transformer can include a skeleton transformer and a planar transformer. This embodiment does not limit the specific type of transformer.

[0038] Therefore, this embodiment of the present disclosure provides a first reinforcing pad 31 on the first reinforcing connection layer 3 for fixing to the motherboard 2, so that the first circuit board 11 of the transformer 1 is fixed to the second circuit board 21 of the motherboard 2 through the first reinforcing pad 31 and the second reinforcing pad 41. This increases the fixing area between the transformer 1 and the motherboard 2, improves the connection strength between the transformer 1 and the motherboard 2, and avoids the problem of the transformer 1 falling off the motherboard 2 due to the large vibration level caused by the close distance between the generator and the drive motor in the existing dual-electric control system. This improves the reliability of the transformer 1, reduces the risk of the transformer 1 falling off the motherboard 2, and retains the original size of the transformer 1 without increasing the area of ​​the transformer 1, thus reducing the cost of the transformer control device.

[0039] In the above implementation process, the first reinforcing connection layer 3 and the second reinforcing connection layer 14 are not used for electrical wiring. That is, after the first reinforcing pad 31 and the second reinforcing pad 41 are fixedly connected by welding, the first circuit board 11 and the second circuit board 21 do not form an electrical connection, thereby achieving the goal of not changing the original electrical wiring of the transformer.

[0040] Specifically, the first reinforcing connection layer 3 does not form an electrical connection with the first circuit board 11; and, the second reinforcing connection layer 14 does not form an electrical connection with the second circuit board 21.

[0041] In some embodiments, referring to Figures 1 to 3, the first reinforcing pad 31 includes a plurality of first reinforcing sub-pads 310, and the second reinforcing pad 41 includes a plurality of second reinforcing sub-pads 410. The first reinforcing sub-pads 310 and the second reinforcing pads 410 are welded and fixed in a one-to-one correspondence.

[0042] Specifically, referring to Figures 1 to 3, when soldering a large area of ​​pads, such as using SMT soldering, voids or unpredictable cracks can easily occur during reflow soldering, thus affecting the connection strength between the transformer 1 and the motherboard 2. Therefore, in this embodiment, the first reinforcing pad 31 may include multiple first reinforcing sub-pads 310, and the second reinforcing sub-pads 410 may include multiple second reinforcing sub-pads 410. In some embodiments, as shown in Figure 2, nine first reinforcing sub-pads 310 are respectively provided on opposite sides of the first reinforcing connection layer 3, and nine second reinforcing sub-pads 410 are respectively provided on opposite sides of the second reinforcing connection layer 4. The positions of the first reinforcing sub-pads 310 on the first reinforcing connection layer 3 and the second reinforcing sub-pads 410 on the second reinforcing connection layer 4 can be correspondingly set so that the first reinforcing sub-pads 310 and the second reinforcing sub-pads 410 are soldered and fixed in a one-to-one correspondence. It should be noted that the specific placement of the first reinforcing sub-pad 310 and the second reinforcing sub-pad 410 in this embodiment is not limited, as long as it meets the usage requirements of the transformer control device.

[0043] By dividing the entire first reinforcing pad 31 into multiple first reinforcing sub-pads 310 and the entire second reinforcing pad 41 into multiple first reinforcing sub-pads 310, the probability of voids and cracks appearing during the soldering of the first reinforcing sub-pads 310 and the second reinforcing sub-pads 410 is reduced, further improving the connection strength between the transformer 1 and the main board 2, avoiding the problem of reduced connection strength due to voids and cracks, improving the reliability of the transformer control device, and reducing the risk of the transformer 1 falling off the main board 2.

[0044] In some embodiments, the side length of the first reinforcing sub-pad 310 and the side length of the second reinforcing sub-pad 410 may be less than or equal to 2.5 mm. Since pads larger than 2.5 mm are more prone to solder voids and cracks during reflow soldering, the side lengths of the first reinforcing sub-pad 310 and the second reinforcing sub-pad 410 are set to be less than or equal to 2.5 mm. Furthermore, the minimum value of the side lengths of the first reinforcing sub-pad 310 and the second reinforcing sub-pad 410 can be set according to, for example, the placement accuracy of SMT soldering technology; this disclosure does not limit this specific value.

[0045] It should be noted that the number of the first reinforcing sub-pad 310 and the second reinforcing sub-pad 410 can be set according to the actual welding requirements of the transformer control device, and this embodiment does not limit this.

[0046] In some embodiments, in conjunction with Figures 1 to 3, a plurality of first reinforcing sub-pads 310 and a plurality of second reinforcing sub-pads 410 are arranged in a grid array.

[0047] Specifically, referring to Figures 1 to 3, the multiple first reinforcing sub-pads 310 and multiple second reinforcing sub-pads 410 are all arranged in a land grid array (LGA). The first reinforcing sub-pads 310 and the second reinforcing sub-pads 410 arranged in a grid array can improve the overall aesthetics of the transformer control device. On the other hand, more solder joints can be contacted and welded between the first reinforcing sub-pads 310 and the second reinforcing sub-pads 410, which improves the welding strength between the first reinforcing sub-pads 310 and the second reinforcing sub-pads 410, and thus also improves the connection strength between the transformer 1 and the main board 2.

[0048] In some embodiments, referring to Figures 1 to 3, the area of ​​the second reinforcing sub-pad 410 is greater than or equal to the area of ​​the first reinforcing sub-pad 310.

[0049] Specifically, referring to Figures 1 to 3, in order to improve the connection strength between the motherboard 2 and the transformer 1, the area of ​​the second reinforcing pad 410 can be set to be greater than or equal to the area of ​​the first reinforcing pad 310, so that the first reinforcing pad 310 can be fully soldered to the second reinforcing pad 410, that is, the transformer 1 can be fully connected to the motherboard 2. This increases the soldering area between the first reinforcing pad 310 and the second reinforcing pad 410, ensuring the connection strength between the first circuit board 11 and the second circuit board 21, and thus also improving the connection strength between the transformer 1 and the motherboard 2, reducing the risk of the transformer 1 falling off the motherboard 2.

[0050] In some embodiments, as shown in FIG2, the first circuit board 11 further includes a wiring layer 5; the first reinforcing connection layer 3 further includes a plurality of first functional pads 32; the first functional pads 32 are electrically connected to the wiring layer 5 through vias; the second reinforcing connection layer 4 further includes a plurality of second functional pads 42; the first functional pads 32 and the second functional pads 42 are electrically connected.

[0051] Specifically, as shown in Figure 2, the first circuit board 11 further includes, for example, a wiring layer 5. The wiring layer 5 may include, for example, the winding structure of the transformer 1. The winding structure is shown by the thick lines in Figure 2. The first reinforcing connection layer 3 also includes a plurality of first functional pads 32. The first functional pads 32 are electrically connected to the wiring layer 5 through vias. The second reinforcing connection layer 4 includes, for example, electrical traces of the motherboard 2. The second functional pads 42 are electrically connected to the electrical traces in the motherboard 2. In some embodiments, in order to achieve the electrical connection between the first functional pads 32 and the second functional pads 42, thereby achieving the electrical connection between the transformer 1 and the motherboard 2, the first functional pads 32 and the second functional pads 42 may be soldered using an SMT process, for example, to ensure the consistency of the soldering process. By setting the wiring layer 5 and the first reinforcing connection layer 3 in different layers, the number, size, and position of the first reinforcing pads 31 will not affect the routing of the winding structure in the wiring layer 5, avoiding the impact on the electrical connection between the first circuit board 11 and the second circuit board 21, and improving the reliability of the transformer control device.

[0052] It should be noted that the number and specific shape of the first functional pad 32 and the second functional pad 42 in this embodiment can be set according to the actual usage requirements of the transformer control device, and this embodiment does not limit this.

[0053] In some embodiments, referring to Figures 2 and 3, the first functional pad and the first hardening pad are spaced apart, and the second functional pad and the second hardening pad are spaced apart.

[0054] Specifically, referring to Figures 2 and 3, the first functional pad and the first reinforced pad can be set to be spaced apart to avoid the first reinforced pad affecting the electrical connection function of the first functional pad, and the second functional pad and the second reinforced pad can be set to be spaced apart to avoid the second reinforced pad affecting the electrical connection function of the second functional pad.

[0055] In some embodiments, the spacing between adjacent first reinforcing sub-pads 310 is less than or equal to the spacing between adjacent first reinforcing sub-pads 310 and first functional pads 32; and / or, the spacing between adjacent second reinforcing sub-pads 410 is less than or equal to the spacing between adjacent second reinforcing sub-pads 410 and second functional pads 42.

[0056] Specifically, referring to Figures 2 and 3, since the first functional pad 32 is electrically connected to the wiring layer 5, if the distance between the first functional pad 32 and the first reinforcing sub-pad 310 is too small, a short circuit will occur between the first reinforcing sub-pad 310 and the first functional pad 32, affecting the electrical safety of the first circuit board 11. Therefore, in this embodiment, the distance between adjacent first reinforcing sub-pads 310 is set to be less than or equal to the distance between adjacent first reinforcing sub-pads 310 and the first functional pad 32, increasing the distance between the first reinforcing sub-pad 310 and the first functional pad 32, avoiding the problem of short circuit between the first reinforcing sub-pad 310 and the first functional pad 32, and improving the safety of the transformer control device.

[0057] In other embodiments, the second functional pad 42 is electrically connected to the electrical traces in the motherboard 2. If the distance between the second functional pad 42 and the second reinforcing sub-pad 410 is too small, the second reinforcing sub-pad 410 will also have a short circuit problem with the second functional pad 42, affecting the electrical safety of the second circuit board 21. Therefore, in this embodiment, the distance between adjacent second reinforcing sub-pads 410 is set to be less than or equal to the distance between adjacent second reinforcing sub-pads 410 and the second functional pad 42, thereby increasing the distance between the second reinforcing sub-pads 410 and the second functional pad 42, avoiding the problem of short circuit between the second reinforcing sub-pads 410 and the second functional pad 42, and improving the safety of the transformer control device.

[0058] It should be noted that, in this embodiment of the present disclosure, the spacing between adjacent first reinforcing sub-pads 310 may be set to be less than or equal to the spacing between adjacent first reinforcing sub-pads 310 and first functional pads 32, or the spacing between adjacent second reinforcing sub-pads 410 may be set to be less than or equal to the spacing between adjacent second reinforcing sub-pads 410 and second functional pads 42, or the spacing between adjacent first reinforcing sub-pads 310 may be set to be less than or equal to the spacing between adjacent first reinforcing sub-pads 310 and first functional pads 32, and the spacing between adjacent second reinforcing sub-pads 410 may be set to be less than or equal to the spacing between adjacent second reinforcing sub-pads 410 and second functional pads 42. The settings can be made according to the actual usage requirements of the transformer control device, and this embodiment of the present disclosure does not limit this.

[0059] In some embodiments, the area of ​​the first reinforcing pad 31 is greater than or equal to the area of ​​the first functional pad 32; and / or, the area of ​​the second reinforcing pad 41 is greater than or equal to the area of ​​the second functional pad 42.

[0060] In some embodiments, referring to Figures 1 and 2, since the first functional pad 32 needs to achieve electrical connection, if the area of ​​the first functional pad 32 is set too large, the electrical insulation of the first circuit board 11 will be poor. In addition, in order to avoid short circuit between the first reinforcing pad 31 and the first functional pad 32, the distance between the first reinforcing pad 31 and the first functional pad 32 will be increased, resulting in the first reinforcing pad 31 occupying less area on the first reinforcing connection layer 3, thereby affecting the connection strength between the motherboard 2 and the transformer 1. Therefore, in this embodiment, the area of ​​the first reinforcing pad 31 is set to be greater than or equal to the area of ​​the first functional pad 32. On the one hand, it can increase the welding area of ​​the first reinforcing connection layer 3, thereby increasing the welding area between the first circuit board 11 and the second circuit board 21 and enhancing the connection strength between the motherboard 2 and the transformer 1. On the other hand, it also avoids the problem of short circuit between the first functional pad 32 and the first reinforcing pad 31, and improves the electrical safety of the first circuit board 11.

[0061] In some embodiments, since the second functional pad 42 also needs to achieve electrical connection, if the area of ​​the second functional pad 42 is set too large, the electrical insulation of the second circuit board 21 will be poor. In order to avoid short circuit between the second reinforcing pad 41 and the second functional pad 42, the distance between the second reinforcing pad 41 and the second functional pad 42 will be increased, resulting in the second reinforcing pad 41 occupying less area on the second reinforcing connection layer 4, thereby affecting the connection strength between the motherboard 2 and the transformer 1. Therefore, in this embodiment, the area of ​​the second reinforcing pad 41 is set to be greater than or equal to the area of ​​the second functional pad 42. On the one hand, this can increase the welding area of ​​the second reinforcing connection layer 4, thereby increasing the welding area between the first circuit board 11 and the second circuit board 21 and enhancing the connection strength between the motherboard 2 and the transformer 1. On the other hand, it also avoids the problem of short circuit between the second functional pad 42 and the second reinforcing pad 41, and improves the electrical safety of the second circuit board 21.

[0062] Figure 4 is a schematic diagram of the back structure of a transformer control device provided in an embodiment of this disclosure. In some embodiments, referring to Figures 1 to 4, the transformer 1 further includes a magnetic core structure 6; the first circuit board 11 includes a first hollow structure 110; the magnetic core structure 6 is located in the first hollow structure 110; and the first reinforcing connection layer 3 is disposed around the first hollow structure 110.

[0063] Specifically, referring to Figures 1 to 4, the transformer 1 may also include a magnetic core structure 6. The magnetic core structure 6 is disposed within a first cutout structure 110 on the first circuit board 11, so that the winding structure located in the wiring layer 5 of the first circuit board 11 surrounds the magnetic core structure 6, thereby enabling the transformer 1 to change the AC voltage using the principle of electromagnetic induction. Furthermore, a first reinforcing connection layer 3 is disposed around the first cutout structure 110. The magnetic core structure 6 may, for example, be disposed on the first circuit board 11 facing the second circuit board 21. In some embodiments, as shown in Figures 1 and 4, the magnetic core structure 6 may be a cuboid structure, for example. This disclosure does not limit the specific shape of the magnetic core structure 6, as long as it meets the usage requirements of the transformer control device.

[0064] In some embodiments, referring to Figures 1 to 4, the second circuit board 21 includes a second cutout structure 120; the second cutout structure 120 corresponds to the first cutout structure 110 and exposes the magnetic core structure 6.

[0065] Specifically, referring to Figures 1 to 4, at the position corresponding to the first cutout structure 110, the second circuit board 21 is also provided with a second cutout structure 120. The second cutout structure 120 is used to expose the magnetic core structure 6. When the first circuit board 11 and the second circuit board 21 are soldered together, the presence of the second cutout structure 120 can greatly improve the heat dissipation capacity of the transformer 1 control device. The heat generated by the transformer 1 during operation can be discharged through the second cutout structure 120, avoiding the problem that the side of the first circuit board 11 close to the second circuit board 21 is completely attached to the second circuit board 21, which would prevent the heat generated by the transformer 1 from being unable to dissipate and accumulate on the first circuit board 11, causing the transformer 1 to malfunction. This improves the reliability of the transformer control device.

[0066] In some embodiments, referring to Figures 1 to 4, a heat dissipation medium is also provided between the first hollow structure 110 and the magnetic core structure 6, and / or between the second hollow structure 120 and the magnetic core structure 6.

[0067] In some embodiments, referring to Figures 1 to 4, a heat dissipation medium can be provided between the first hollow structure 110 and the magnetic core structure 6. This heat dissipation medium enhances the heat dissipation capacity of the first circuit board 11, allowing the heat generated by the transformer 1 during operation to dissipate quickly. Furthermore, since the magnetic core structure 6 is exposed through the second hollow structure 120 after the first circuit board 11 is soldered to the second circuit board 21, a heat dissipation medium can also be provided between the second hollow structure 120 and the magnetic core to quickly dissipate the heat generated by the magnetic core structure 6 during operation, thereby improving the heat dissipation capacity of the transformer control device.

[0068] It should be noted that the heat dissipation medium can be, for example, thermally conductive silicone grease or other materials with excellent heat dissipation performance, as long as it can meet the actual use requirements of the transformer control device. This disclosure does not limit this aspect.

[0069] It should be noted that a heat dissipation medium may be provided only between the first hollow structure 110 and the magnetic core structure 6, or only between the second hollow structure 120 and the magnetic core, or both between the first hollow structure 110 and the magnetic core structure 6 and between the second hollow structure 120 and the magnetic core structure 6. This embodiment does not limit the scope of the invention.

[0070] In some embodiments, referring to Figures 1 to 4, a reinforcing medium is also provided between the first hollow structure 110 and the magnetic core structure 6, and / or between the second hollow structure 120 and the magnetic core structure 6.

[0071] Specifically, referring to Figures 1 to 4, a reinforcing medium can be provided between the first hollow structure 110 and the magnetic core structure 6 to enhance the connection strength between the magnetic core structure 6 and the first circuit board 11, preventing the magnetic core structure 6 from detaching from the first hollow structure 110 due to excessive vibration. Alternatively, a reinforcing medium can also be provided between the second hollow structure 120 and the magnetic core structure 6. When the first circuit board 11 and the second circuit board 21 are fixedly connected, the reinforcing medium between the second hollow structure 120 and the magnetic core structure 6 can further improve the connection strength between the first circuit board 11 and the second circuit board 21, reducing the risk of the transformer 1 detaching from the motherboard 2.

[0072] It should be noted that the fixing medium can be, for example, a fixing adhesive or other material, as long as it meets the fixing requirements of the transformer control device. This disclosure does not limit this aspect.

[0073] It should be noted that the reinforcing medium may be provided only between the first hollow structure 110 and the magnetic core structure 6, or only between the second hollow structure 120 and the magnetic core structure 6, or both between the first hollow structure 110 and the magnetic core structure 6 and between the second hollow structure 120 and the magnetic core structure 6. This embodiment does not limit the scope of the present disclosure.

[0074] In actual testing, the vibration resistance of the transformer control device provided in this embodiment increased from the original root mean square vibration strength of 9g to over 22g. That is, the transformer control device can pass the vibration test of 22g for a single board. It can be seen that the connection strength of the transformer control device provided in this embodiment is greatly increased.

[0075] This embodiment of the present disclosure provides a first reinforcing pad 31 on the first reinforcing connection layer 3 for fixing to the motherboard 2. This allows the first circuit board 11 of the transformer 1 to be fixed to the second circuit board 21 of the motherboard 2 via the first reinforcing pad 31 and the second reinforcing pad 41. This increases the fixing area between the transformer 1 and the motherboard 2, improves the connection strength between the transformer 1 and the motherboard 2, and avoids the problem in existing dual-electric control systems where the close proximity of the generator and drive motor leads to a significant increase in vibration level, causing the transformer 1 to detach from the motherboard 2 and resulting in transformer 1 failure. This improves the reliability of the transformer 1, reduces the risk of the transformer 1 detaching from the motherboard 2, and retains the original size of the transformer 1 without needing to increase the area of ​​the transformer 1, thus reducing the cost of the transformer control device.

[0076] Secondly, this disclosure also provides a motor controller, including the transformer control device as described in the above embodiments. Therefore, the motor controller provided in this disclosure has the beneficial effects described in the above embodiments.

[0077] This disclosure also provides an electric drive assembly, including a motor controller as provided in the above embodiments, or including a transformer control device as provided in the above embodiments.

[0078] This disclosure also provides a vehicle, which may include the motor controller provided in the above embodiments, or the transformer control device provided in the above embodiments, or the electric drive assembly provided in the above embodiments. Therefore, the vehicle provided in this disclosure has the beneficial effects described in the above embodiments. Furthermore, the vehicle described in this disclosure may be an autonomous vehicle, a pure electric vehicle, or a hybrid electric vehicle, etc., and this disclosure does not specifically limit it in this way.

[0079] The transformer control device, motor controller, and vehicle provided in this disclosure embodiment, by providing a first reinforcing pad on the first reinforcing connection layer for fixing to the main board, allow the first circuit board of the transformer to be fixed to the second circuit board of the main board via the first and second reinforcing pads. This increases the fixing area between the transformer and the main board, improves the connection strength between the transformer and the main board, and avoids the problem in existing dual-control systems where the close proximity of the generator and drive motor leads to a significant increase in vibration level, causing the transformer to detach from the main board and resulting in transformer failure. This improves the reliability of transformer use, reduces the risk of the transformer detaching from the main board, and retains the original size of the transformer without requiring additional transformer area, thus reducing the cost of the transformer control device.

[0080] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0081] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A transformer control device, characterized in that, include: Transformer; the transformer includes a first circuit board; Motherboard; the motherboard includes a second circuit board; First reinforced connection layer; The first reinforcing connection layer is located on the side of the first circuit board facing the second circuit board; the first reinforcing connection layer includes a first reinforcing pad; A second reinforcing connection layer; the second reinforcing connection layer is located on the side of the second circuit board facing the first circuit board; the second reinforcing connection layer includes a second reinforcing pad; The first reinforcing pad is welded and fixed to the second reinforcing pad, so that the first circuit board and the second circuit board do not form an electrical connection.

2. The transformer control device according to claim 1, characterized in that, The first reinforcing pad includes a plurality of spaced-apart first reinforcing sub-pads, and the second reinforcing pad includes a plurality of spaced-apart second reinforcing sub-pads. The first reinforcing sub-pads and the second reinforcing sub-pads are welded and fixed in a one-to-one correspondence.

3. The transformer control device according to claim 2, characterized in that, Multiple first reinforced sub-pads and multiple second reinforced sub-pads are arranged in a grid array.

4. The transformer control device according to claim 2 or 3, characterized in that, The area of ​​the second reinforcing pad is greater than or equal to the area of ​​the first reinforcing pad.

5. The transformer control device according to any one of claims 2-4, characterized in that, The first circuit board further includes a wiring layer; the first reinforcing connection layer further includes a plurality of first functional pads; the first functional pads are electrically connected to the wiring layer via vias; the second reinforcing connection layer further includes a plurality of second functional pads; the first functional pads and the second functional pads are electrically connected.

6. The transformer control device according to claim 5, characterized in that, The first functional pad and the first reinforced pad are spaced apart, and the second functional pad and the second reinforced pad are spaced apart.

7. The transformer control device according to claim 5 or 6, characterized in that, The spacing between adjacent first reinforced sub-pads is less than or equal to the spacing between adjacent first reinforced sub-pads and the first functional pad; And / or, the spacing between adjacent second reinforced sub-pads is less than or equal to the spacing between adjacent second reinforced sub-pads and the second functional pad.

8. The transformer control device according to any one of claims 5-7, characterized in that, The area of ​​the first reinforcing pad is greater than or equal to the area of ​​the first functional pad; and / or, the area of ​​the second reinforcing pad is greater than or equal to the area of ​​the second functional pad.

9. The transformer control device according to any one of claims 1-8, characterized in that, The first reinforcing connection layer does not form an electrical connection with the first circuit board; and / or the second reinforcing connection layer does not form an electrical connection with the second circuit board.

10. A motor controller, characterized in that, Includes the transformer control device as described in any one of claims 1-9.

11. An electric drive assembly, characterized in that, It includes the transformer control device as described in any one of claims 1-9, or the motor controller as described in any one of claims 10.

12. A vehicle, characterized in that, It includes the transformer control device as described in any one of claims 1-9, or the motor controller as described in claim 10, or the electric drive assembly as described in claim 11.

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