Headphone device having antenna module

Abstract

This antenna module comprises: a dielectric formed in a hexahedral shape; a metal patch disposed on a first surface of the dielectric; a PCB disposed on a second surface of the dielectric; a ground region formed on the second surface of the dielectric or the PCB in correspondence to a region in which the metal patch is formed; an inner slot including a first slot formed in a first length in a first axial direction of the metal patch, and a second slot and a third slot formed in a second length in a second axial direction from end portions of the first slot; and an outer slot having a feeding point formed on the metal patch in an inner region of the inner slot, and including a fourth slot formed in a third length in the first axial direction so as to surround the inner slot, and a fifth slot and a sixth slot formed in a fourth length in the second axial direction from end portions of the fourth slot.

Description

headphone device equipped with an antenna module

[0001] This specification relates to a headphone device having an antenna module, and more specifically, to a broadband operating antenna module and a headphone device having the same.

[0002] Electronic devices, such as electronic accessories for mobile phones, computers, and other electronic equipment, may include wireless circuits. For example, speakers, headphones, or earphones may be used as electronic devices that communicate wirelessly with mobile phones and other equipment.

[0003] In this regard, speakers, headphones, or earphones may be used for sound output. The headphone device may be worn by placing a headband portion over the user's head and completely covering the user's ears. The headphone device can reduce external noise by primarily shielding it. By shielding it from external noise, the headphone device can provide the user with an experience that allows them to focus on the music. The headphone device can output sound by connecting to a user terminal wirelessly or via a wire.

[0004] Headphone devices can transmit and receive audio signals by wirelessly connecting to electronic devices such as computers or smartphones using Bluetooth (BT). However, there is a problem in that it is difficult to transmit high-quality music due to the narrow bandwidth when transmitting and receiving audio signals using Bluetooth (BT).

[0005] In addition, high latency causes the audio signal to be transmitted later than the screen, and this high latency can be a problem, especially in real-time games.

[0006] To address these issues, wireless signal transmission and reception between headphone devices and electronic devices can be achieved by utilizing the wide-band UWB (ultra-wide band) frequency range. However, when using UWB with its wide bandwidth, wireless radiation performance may be degraded due to its higher frequency characteristics and lower transmission power compared to Bluetooth.

[0007] The purpose of the present disclosure to solve the aforementioned problems is to address the issue that high-quality music transmission is difficult due to the narrow bandwidth when transmitting and receiving audio signals using Bluetooth (BT).

[0008] In addition, the purpose of the present disclosure is to solve the problem where the audio signal is transmitted later than the screen due to high latency.

[0009] In addition, the purpose of the present disclosure is to solve the problem in which the audio signal is transmitted later than the screen due to high latency of the audio signal in real-time games, etc.

[0010] Furthermore, the purpose of the present disclosure is to solve the problem of degraded wireless radiation performance due to higher frequency characteristics and lower transmission power compared to Bluetooth when using UWB with a wide bandwidth.

[0011] An antenna module disposed in a headphone device according to an embodiment to achieve the above or other purposes comprises: a dielectric formed as a cuboid; a metal patch disposed on a first surface of the dielectric; a PCB disposed on a second surface of the dielectric; a ground area formed on the second surface of the dielectric or on the PCB corresponding to the area where the metal patch is formed; an inner slot comprising a first slot formed with a first length in the first axial direction of the metal patch, a second slot formed with a second length in the second axial direction at the ends of the first slot, and a third slot; and an outer slot comprising a fourth slot formed with a third length in the first axial direction to surround the inner slot, a fifth slot formed with a fourth length in the second axial direction at the ends of the fourth slot, and a sixth slot formed with a fourth length in the second axial direction at the ends of the fourth slot, wherein a feeding point is formed on the metal patch in the inner area of ​​the inner slot.

[0012] According to an embodiment, the ground area may be formed with a slot area so that a signal line is arranged. A first point between the first side in the second axis direction of the metal patch and the outer edge of the fifth slot may be connected to a second point of the ground area. A third point between the second side in the second axis direction of the metal patch and the outer edge of the sixth slot may be connected to a fourth point of the ground area. The second axis direction may be formed orthogonally to the first axis direction. The third length of the fourth slot of the outer slot may be formed to be longer than the first length of the first slot of the inner slot. The fourth length of the fifth slot and the sixth slot of the outer slot may be formed to be longer than the second length of the second slot and the third slot of the inner slot.

[0013] A headphone device according to an embodiment comprises: a headband; a first headphone unit connected to one end of the headband; a second headphone unit electrically connected to the first headphone unit through the headband and connected to the other end of the headband; a first PCB disposed inside the first headphone unit; a second PCB disposed inside the second headphone unit; a first antenna module disposed in a first area of ​​the first PCB and configured to receive a wireless signal; and a second antenna module disposed in a second area of ​​the second PCB corresponding to the first area and configured to receive the wireless signal.

[0014] According to an embodiment, the first antenna module comprises: a dielectric formed as a cuboid; a metal patch disposed on a first surface of the dielectric; a PCB disposed on a second surface of the dielectric; a ground area formed on the second surface of the dielectric or on the PCB corresponding to the area where the metal patch is formed; an inner slot including a first slot formed with a first length in the first axial direction of the metal patch, a second slot formed with a second length in the second axial direction at the ends of the first slot, and a third slot; and an outer slot including a fourth slot formed with a third length in the first axial direction to surround the inner slot, a fifth slot formed with a fourth length in the second axial direction at the ends of the fourth slot, and a sixth slot, wherein a feeding point is formed on the metal patch in the inner area of ​​the inner slot.

[0015] A dielectric formed as a cuboid; a metal patch disposed on a first surface of the dielectric; a PCB disposed on a second surface of the dielectric; a ground area formed on the second surface of the dielectric or on the PCB corresponding to the area where the metal patch is formed; an inner slot comprising a first slot formed with a first length in the first axial direction of the metal patch, a second slot formed with a second length in the second axial direction at the ends of the first slot, and a third slot; and an outer slot comprising a fourth slot formed with a third length in the first axial direction to surround the inner slot, a fifth slot formed with a fourth length in the second axial direction at the ends of the fourth slot, and a sixth slot, wherein a feeding point is formed on the metal patch in the inner region of the inner slot.

[0016] The technical effects of a headphone device equipped with such an antenna module are described as follows.

[0017] According to the present specification, wide bandwidth and low latency characteristics can be secured by using an antenna module operating in the UWB frequency band.

[0018] According to the present specification, a ground area is placed at the bottom of the metal patch of the antenna module so that the antenna module can be designed so that there is almost no change in the resonant frequency caused by the human body.

[0019] According to the present specification, a wide beam width can be realized by forming an omnidirectional radiation pattern through a structure in which current flows from a feed point located at the center point of a metal patch of an antenna module to ground vias disposed on one side and the other side.

[0020] According to the present specification, by forming an omnidirectional radiation pattern having a wide beam width through internal slots, external slots, and ground vias, the reception and transmission performance of wireless signals including audio signals can be improved.

[0021] According to the present specification, an antenna module can be provided with a wide bandwidth by adding an internal slot and an external slot to the surface of a metal patch. Thus, an antenna module that operates across the entire band of the UWB frequency band can be provided.

[0022] According to the present specification, by applying the first and second antenna modules to the left and right sides of the headphone device, respectively, it is possible to prevent the electronic device and wireless communication performance from degrading in the direction of the human body.

[0023] Further scopes of the applicability of the present invention will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of the present invention are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of the present invention, should be understood as being given merely as examples.

[0024] FIG. 1 is a configuration diagram of an exemplary system including an electronic device that communicates wirelessly with a headphone device according to the present specification.

[0025] Figure 2 shows the internal structure of a headphone device in which an antenna module operating in the Bluetooth frequency band is placed.

[0026] Figure 3 shows the omnidirectional radiation pattern of the antenna module and the structure placed on the PCB.

[0027] Figure 4 shows the radiation pattern and VSWR when a user wears a headphone device with an antenna module supporting UWB wireless communication placed in the headphone device.

[0028] Fig. 5 is a plan view of the PCB on which the antenna module is placed and an enlarged view of the antenna module.

[0029] Figure 6 shows an exploded view of the structure in which the metal patch and ground area of ​​the antenna module of Figure 5 are connected to feed vias and ground vias.

[0030] Figure 7 shows a perspective view of an antenna module in which a metal patch of the antenna module of Figure 5 is formed on the front surface of the dielectric.

[0031] Figure 8 shows the top view, side view, and voltage standing wave ratio of an antenna module placed on a PCB.

[0032] Figures 9 and 10 compare the current distribution, radiation pattern, and VSWR depending on the presence or absence of ground vias on the surface of a metal patch.

[0033] Figure 11 shows radiation patterns according to antenna structures.

[0034] Figure 12 shows radiation patterns radiated through a headphone device in which the antenna structures of Figure 11 are arranged.

[0035] FIG. 13 is an enlarged view of PCBs in which antenna modules are arranged inside a headphone device according to the present specification.

[0036] Figure 14 shows a diagram of PCBs and electronic components arranged in the headphone device of Figure y1.

[0037] FIG. 15 shows a block diagram in which the first and second antenna modules are connected to the processor through a switch and a cable.

[0038] FIG. 16 is a conceptual diagram showing wireless communication performance with an electronic device according to the radiation pattern of a headphone device in which an antenna module is placed internally.

[0039] FIG. 17 shows a flowchart of a control method performed by a processor that selects one of the first and second antenna modules of a headphone device according to the present specification.

[0040] FIG. 18 shows a block diagram in which the first and second antenna modules are connected through a switch and a processor.

[0041] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols will be assigned the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, in describing embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted. Additionally, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification; the technical concept disclosed in this specification is not limited by the attached drawings, and it should be understood that they include all modifications, equivalents, and substitutions that fall within the spirit and technical scope of the present invention.

[0042] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0043] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0044] A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0045] In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0046] The electronic devices described herein may be computers, mobile terminals, laptops, or wearable devices. Headphone devices may communicate with host devices. The use of wireless hosts, such as cellular phones, computers, or wristwatches, may occasionally be described in this specification as examples. Additionally, any suitable headphone device may communicate wirelessly with a wireless host. The use of headphone devices to communicate with a wireless host is merely illustrative.

[0047] An electronic device can communicate wirelessly with an accessory device, such as a headphone device. In this regard, FIG. 1 is a configuration diagram of an exemplary system including an electronic device that communicates wirelessly with a headphone device according to the present specification.

[0048] Referring to FIG. 1, the electronic device (100) may be a mobile terminal or a headphone device (300) or other wearable device capable of performing wireless communication, but is not limited thereto. The electronic device (100) may be implemented as any host device capable of performing wireless communication with the headphone device (300), such as a computer, a laptop computer, a content playback device of a home network, or a communication device of a vehicle. The electronic device (100) may be referred to as a host device.

[0049] The headphone device (300) may be configured to include various components. In this regard, the headphone device (300) may be configured to include an antenna module (200), an RF circuit (310), and a sensor module (320). The headphone device (300) may be configured to further include a control circuit (330), a battery (340), and a speaker (350). Meanwhile, the electronic device (100) may be configured to include an antenna module (60) and an RF circuit (10) to perform wireless communication with the headphone device (300). The electronic device (100) may be configured to further include a sensor module (20), a control circuit (30), a battery (40), and a speaker (50), but is not limited thereto. The electronic device (100) may be configured to include more components than the headphone device (300).

[0050] The antenna module (200) may be configured to receive a wireless signal containing voice content from the electronic device (100). The antenna module (200) may be configured to receive a wireless signal in the Bluetooth frequency band and / or UWB frequency band from the electronic device (100). In this regard, the wireless communication link between the electronic device (100) and the headphone device (300) is not limited to Bluetooth communication. Any wireless communication link capable of supporting short-range wireless communication between the electronic device (100) and the headphone device (300), such as a short-range wireless communication link in a 2.4 GHz, 5 GHz, 3.1 to 10.6 GHz, or other frequency band, may be used. Depending on the application, a wireless communication link in a mobile communication frequency band or a wireless communication link in a millimeter wave band that supports IoT wireless communication may also be used.

[0051] Additionally, when user input is applied by an operation button provided in the headphone device (300), a control command to control playback and volume of voice content, etc., can be transmitted to the electronic device (100) through the antenna module (200). The antenna module (200) of the electronic device (100) can receive a wireless signal containing the control command in the Bluetooth frequency band and / or UWB frequency band.

[0052] The antenna module (200) can be operably coupled with the RF circuit (310). The antenna module (200) can be connected to the signal pattern of the RF circuit (310) via a feed point (FP). The antenna module (200) can be connected to the ground pattern of the RF circuit (310) via a ground point (GP). The RF circuit (310) can be configured to amplify, filter, and process signals transmitted and received through the antenna module (200).

[0053] The sensor module (320) may be configured to include at least one sensor. The sensor module (320) may be configured to include a proximity sensor capable of detecting user movement and proximity, a touch sensor capable of detecting user input, and a pressure sensor, but is not limited thereto. The sensor module (320) may further include an accelerometer and a gyroscope.

[0054] The control circuit (330) can be operably coupled with the sensor module (320), battery (340), and speaker (350). The control circuit (330) can be configured to control the operation of the sensor module (320), battery (340), and speaker (350).

[0055] The battery (340) may be configured to supply power to various electronic components placed inside the headphone device (300). The battery (340) may be configured to store power when power is received from a charger and to supply power to various electronic components. The speaker (350) may be configured to play voice content received from the host electronic device (100a).

[0056] Meanwhile, an antenna module may be disposed inside the headphone device according to the present specification. The purpose of the present disclosure is to solve the problem that high-quality music transmission is difficult due to a narrow bandwidth when transmitting and receiving audio signals using Bluetooth (BT). Furthermore, the purpose of the present disclosure is to solve the problem that the audio signal is transmitted later than the screen due to high latency. Furthermore, the purpose of the present disclosure is to solve the problem that the audio signal is transmitted later than the screen due to high latency in real-time games, etc. Additionally, the purpose of the present disclosure is to solve the problem that wireless radiation performance is degraded due to higher frequency characteristics and lower transmission power than Bluetooth when using UWB with a wide bandwidth.

[0057] In this regard, FIG. 2 illustrates the internal structure of a headphone device in which an antenna module operating in a Bluetooth frequency band is positioned. Referring to FIG. 2, the headphone device (300) may include a headband (301), a first headphone unit (302), a second headphone unit (303), and a cable (304). The headphone device (300) may include a first ear pad (301a), a second ear pad (302a), a battery (340), a first speaker (351), and a second speaker (352).

[0058] A first headphone unit (302) may be connected to one end of the headband (301). The first headphone unit (302) and the second headphone unit (303) may be electrically connected through the headband (301). The second headphone unit (303) may be connected to the other end of the headband (301). The first ear pad (301a) and the second ear pad (302a) may be formed on the inner surfaces of the first headphone unit (302) and the second headphone unit (303) to correspond to the user's ear portion.

[0059] The headphone device (300) may be configured to include a first PCB (150), a second PCB (150b), and an antenna module (200a). The antenna module (200a) may be configured to radiate a wireless signal in a Bluetooth frequency band. The antenna module (200a) may be configured to receive and / or transmit a signal in the Bluetooth frequency band of 2.4 to 2.4835 GHz.

[0060] A first PCB (150) may be placed inside the first headphone unit (302) so as to be laminated to the first ear pad (301a). An antenna module (200a) may be placed in the first region (R1) of the first PCB (150). A second PCB (150b) and a battery (340) may be placed inside the second headphone unit (303) so as to be laminated to the second ear pad (302a). A battery (340) may be placed adjacent to the second PCB (150b). A battery (340) may be placed on the lower part of the second PCB (150b) in the Y-axis direction. The size of the second PCB (150b) where the antenna module is not placed may be formed to be smaller than the size of the first PCB (150).

[0061] A first speaker (351) may be placed between the first PCB (150) and the first ear pad (301a). A second speaker (352) may be placed between the second PCB (150b) and the second ear pad (302a). A first antenna module (200) may be placed in the first area (R1) of the first PCB (150) and configured to receive a wireless signal.

[0062] Meanwhile, an isotropic radiation pattern can be implemented through an antenna module formed inside one side of the headphone device according to the present specification. In this regard, FIG. 3 shows the isotropic radiation pattern of the antenna module and a structure placed on a PCB. FIG. 3(a) shows that an isotropic radiation pattern (RP) is formed as the antenna module (200a) of FIG. 2 is placed in the headphone device (300).

[0063] FIGS. 3(b) and FIGS. 3(c) show a plan view and a side view of an antenna module (200a) placed on a PCB (150). The antenna module (200a) may be placed offset in the vertical axis (Y-axis) direction of the PCB (150). The antenna module (200a) may be placed in a first region (R1) of the PCB (150). The antenna module (200a) may be placed in a first region (R1) which is a dielectric region where the ground pattern of the PCB (150) has been removed.

[0064] Meanwhile, in the headphone device according to the present specification, the antenna module may be equipped with an antenna operating in a wider frequency band in addition to an antenna operating in the Bluetooth frequency band. The Bluetooth frequency band of 2.4 to 2.4835 GHz may be configured with classic channels or with BLE channels having an extended bandwidth. In this regard, the classic channel bandwidth is set to 1 MHz, and a total of 79 channels may be used. The BLE channel bandwidth is set to 2 MHz, and a total of 40 channels may be used. Since the channel bandwidth of the Bluetooth frequency band is set to 1 MHz or 2 MHz, it may be difficult to transmit high-quality music due to insufficient bandwidth.

[0065] To address issues related to high-quality music transmission, an antenna module supporting UWB wireless communication can be placed inside the headphone device. The frequency band of UWB wireless communication can be set to 3.1 GHz to 10.6 GHz, and the channel bandwidth can be set to 500 MHz. Meanwhile, due to high latency, the audio signal received by the headset device may be transmitted later than the screen of the electronic device. Most electronic devices and headset devices supporting Bluetooth wireless communication have a latency of 100 ms or more. Therefore, the immersion of the game may be hindered by the high latency of the audio signal on the electronic device where the game is running.

[0066] Meanwhile, an antenna module supporting UWB wireless communication can be placed on the PCB. In this regard, FIG. 4 shows the radiation pattern and VSWR when a user wears the headphone device with the antenna module supporting UWB wireless communication placed on the headphone device.

[0067] Referring to FIGS. 3 and FIGS. 4(a), a PCB (150) may be placed on one side of a headphone device (300). An antenna module (200) supporting UWB wireless communication may be placed in a first region (R1) of the PCB (150). For an omnidirectional radiation pattern, the first region (R1) of the PCB (150) may be implemented as a dielectric region by removing the ground pattern. As the antenna module (200) is placed in the first region (R1), which is a dielectric region of the PCB (150), a first radiation pattern (RP1) may be formed on one side of the headphone device (300).

[0068] The radiation pattern (RP) of the antenna module (200a) operating in the Bluetooth frequency band is implemented as an omnidirectional radiation pattern. On the other hand, the first radiation pattern (RP1) of the antenna module (200) operating in the UWB frequency band can be formed in a unidirectional direction.

[0069] Referring to FIGS. 3(b) to FIGS. 4(b), (i) when an antenna module (200) operating in the UWB frequency band approaches the user's head, the resonant frequency shifts to a lower frequency band. (ii) when an antenna module (200) operating in the UWB frequency band moves away from the user's head, the resonant frequency shifts to a higher frequency band.

[0070] Referring to FIGS. 3 and 4, the radiation pattern (RP) of the antenna module (200a) operating in the Bluetooth frequency band is implemented as an omnidirectional radiation pattern. On the other hand, the first radiation pattern (RP1) of the antenna module (200) operating in the Bluetooth frequency band may be formed in a unidirectional direction. Therefore, wireless communication performance with the electronic device (100a) in the other direction of the headphone device (300) may be degraded.

[0071] Meanwhile, since the UWB frequency band is set higher than the Bluetooth frequency band, the change in the characteristics of the antenna module (200) may occur more significantly than the change in the characteristics of the antenna module (200a) when wearing the headphone device. Therefore, when referring to the first radiation pattern (RP1) of the antenna module (200) inside the headset device to which 8GHz band UWB is applied, the power value transmitted to the other side has a low value below the threshold level. Since the radiated power value is low in the other side, which is the opposite direction of the one side where the antenna module (200) is placed, wireless communication with the electronic device (100a) placed on the other side is not easy.

[0072] Meanwhile, the maximum radiated power through UWB is lower than the maximum radiated power through Bluetooth, resulting in low antenna radiation in the direction of the human body. Therefore, the antenna module (200) operating in the UWB frequency band has a lower radiated power value in one direction than the antenna module (200a) operating in the Bluetooth frequency band, and thus has a shorter reach in one direction. Additionally, the antenna module (200) operating in the UWB frequency band has a lower radiated power value in the other direction than the antenna module (200a) operating in the Bluetooth frequency band, and thus has an even shorter reach in the other direction. In this regard, the maximum radiated power through Bluetooth is +20dBm (100mW) at 6dBi according to FCC standards. On the other hand, the maximum radiated power through UWB is -41.3dBm / MHz according to FCC standards.

[0073] Hereinafter, an antenna module operating in the UWB frequency band, which is placed in a headphone device according to the present specification, will be described. In this regard, FIG. 5 is a plan view of a PCB on which an antenna module is placed and an enlarged view of the antenna module. FIG. 6 shows an exploded view of a structure in which a metal patch and a ground region of the antenna module of FIG. 5 are connected by feed vias and ground vias. FIG. 7 shows a perspective view of an antenna module in which a metal patch of the antenna module of FIG. 5 is formed on the front surface of a dielectric.

[0074] Referring to FIGS. 5 through 7, an antenna module disposed in a headphone device according to the present specification is described. The antenna module (200) may be configured to include a dielectric (110), a PCB (150), a metal patch (220) and a ground area (230), an internal slot (210s) and an external slot (220s).

[0075] The dielectric (110) may be formed into a cuboid having a first dielectric constant. The first and second faces of the dielectric (110) may correspond to the front and back faces. A metal patch (220) may be placed on the first face of the dielectric (110). The dielectric (110) may be placed on a PCB (150).

[0076] A ground area (230) may be disposed on the second surface of the dielectric (110) or the PCB (150) corresponding to the area where the metal patch (220) is formed. In the ground area (230), a slot area (SR) may be formed in which the dielectric area is exposed by removing the metal pattern so that a signal line (SL) is disposed therein.

[0077] The internal slot (210s) may be composed of a plurality of slot portions. The internal slot (210s) may be configured to include a first slot (S1), a second slot (S2), and a third slot (S3). The first slot (S1) may be formed with a first length (L1) in the first axial direction of the metal patch (220). The second slot (S2) and the third slot (S3) may be formed with a second length (L2) in the second axial direction at the ends of the first slot (S1).

[0078] A feeding point (FP) may be formed on a metal patch (220) in the inner region of the inner slot (210s). An outer slot (220s) may be formed to surround the inner slot (210s). The outer slot (220s) may be composed of a plurality of slot portions. The outer slot (220s) may be configured to include a fourth slot (S4), a fifth slot (S5), and a sixth slot (S6).

[0079] A fourth slot (S4) may be formed with a third length (L3) in the first axial direction to surround the inner slot (210s). A fifth slot (S5) and a sixth slot (S6) may be formed with a fourth length (L4) in the second axial direction at the ends of the fourth slot (S4). The length of the outer slot (220s) may be formed to be longer than the length of the inner slot (210s). The third length (L3) of the fourth slot (S4) of the outer slot (220s) may be formed to be longer than the first length (L1) of the first slot (S1) of the inner slot (210s). The fourth length (L4) of the fifth slot (S5) of the outer slot (220s) may be formed to be longer than the second length (L2) of the second slot (S2) of the inner slot (210s). The fourth length (L4) of the sixth slot (S6) of the outer slot (220s) can be formed to be longer than the second length (L2) of the third slot (S3) of the inner slot (210s).

[0080] A first point (P1) between the first side of the second axis direction of the metal patch (220) and the outer edge of the fifth slot (S5) can be connected to a second point (P2) of the ground area (230). A third point (P3) between the second side of the second axis direction of the metal patch (220) and the outer edge of the sixth slot (S6) can be connected to a fourth point (P4) of the ground area (230). The second axis direction can be formed orthogonally to the first axis direction. The first axis direction and the second axis direction can correspond to the X-axis direction and the Y-axis direction.

[0081] Meanwhile, the inner slots (210s) may be formed into a first U-shape by removing the metal pattern of the metal patch (220) to expose the first dielectric region on the left, right, and bottom. The first slot (S1), second slot (S2), and third slot (S3) of the inner slots (210s) may be positioned on the left, right, and bottom of the metal patch (220) on the XY plane. The outer slots (220s) may be formed into a second U-shape by removing the metal pattern of the metal patch (220) to expose the second dielectric region on the left, right, and top. The fourth slot (S4), fifth slot (S5), and sixth slot (S6) of the outer slots (220s) may be positioned on the left, right, and top of the metal patch (220) on the XY plane.

[0082] The antenna module (200) may be configured to include a feed via (FV) and at least one ground structure. The at least one ground structure may be formed by at least one ground via. The feed via (FV) may be formed to connect a feed point (FP) of a metal patch (220) and a connection point (CP) adjacent to one end of a feed line (210f). The feed via (FV) may be formed to vertically connect the metal patch (220) where the feed point (FP) is located and the ground area (230) where the connection point (CP) is located.

[0083] A first ground via (GV1) may be formed to connect a first point (P1) of a metal patch (220) and a second point (P2) of a ground area (230). A first ground via (GV1) may be formed to vertically connect the metal patch (220) where the first point (P1) is placed and the ground area (230) where the second point (P2) is placed.

[0084] A second ground via (GV2) may be formed to connect a third point (P3) of a metal patch (220) and a fourth point (P4) of a ground area (230). The second ground via (GV2) may be formed to vertically connect the metal patch (220) where the third point (P3) is located and the ground area (230) where the fourth point (P4) is located.

[0085] A substrate (120) may be disposed on the second surface of the dielectric (110). The dielectric (110) may include a substrate (120) disposed on the second surface of the dielectric (110). A ground area (230) may be disposed on the second surface of the substrate (120) corresponding to an area where a metal patch (220) is formed. A feed line (210f) may be formed on the second surface of the dielectric (110) or on the first surface of the substrate (120).

[0086] A feed via (FV) can be connected to a feed line (210f) to form a feed structure (FS). The feed structure (FS) can be configured to include a feed via (FV), a feed line (210f), a signal line (SL), and a connection via (CV). The feed via (FV) can be formed to vertically connect a feed point (FP) of the metal patch (220) and a connection point (CP) of the feed line (210f). The feed line (210f) can be formed to be connected to the feed via (FV) at one end. The feed line (210f) can be formed to be connected to the connection via (CV) at the other end.

[0087] A signal line (SL) may be formed on a second surface of the substrate (120). The signal line (SL) may be placed in a slot area (SR) where a ground area (230) of the substrate (120) is formed. Ground areas (230) may be formed on one side and the other side of the signal line (SL) to form a CPW (Co-Planar Waveguide) structure. A connecting via (CV) may be formed to vertically connect the other end of the feed line (210f) and the signal line (SL).

[0088] Meanwhile, the antenna module according to the present specification may be configured to resonate in dual bands for UWB wireless communication. In this regard, the antenna module (200) may be configured to resonate in a first frequency band of 5.0 to 8.5 GHz and a second frequency band of 8.5 to 10.6 GHz for UWB wireless communication. The length of the external slot (220s) may be formed within a predetermined range based on a wavelength (λ) corresponding to 9 GHz within the second frequency band.

[0089] The length of the metal patch (220) can be formed within a predetermined range based on 0.5λ, which is 0.5 times the wavelength corresponding to 7 GHz. The length of the metal patch (220) can be formed within a predetermined range based on 12 mm. The length of the slot (S1 + S4 + S6) forming the outer slot (220s) can be formed within a predetermined range based on 1.0λ, which is 1.0 times the wavelength corresponding to 9 GHz.

[0090] The third length (L3) of the fourth slot (S4) forming the outer slot (220s) can be formed within a predetermined range based on 6mm. The fourth length (L4) of the second slot (S2) and the third slot (S3) forming the outer slot (220s) can be formed within a predetermined range based on 8mm.

[0091] Meanwhile, the antenna module disposed on the PCB according to the present specification may be disposed inside the headphone device. As the user wears the headphone device, the resonant frequency and reflection coefficient characteristics of the antenna module may change. In this regard, FIG. 8 shows a top view, a side view, and a voltage standing wave ratio of the antenna module disposed on the PCB.

[0092] FIGS. 8(a) and FIGS. 8(b) show a top view and a side view of a PCB (150) on which an antenna module (200) is placed. Referring to FIGS. 5 through FIGS. 8(b), the antenna module (200), having a metal patch (220) formed on a first surface of a dielectric (110), operates in the UWB frequency band. To minimize changes in antenna performance depending on the proximity of a user's head in the UWB frequency band, a ground area (230) is placed on a second surface of the dielectric (110).

[0093] The antenna module (200) can be positioned on the PCB (1500) offset in the vertical axis (Y-axis) direction. The antenna module (200) can be positioned in the first region (R1) of the PCB (150).

[0094] Referring to Fig. 8(c), as the user wears the headphone device and the user's head approaches the antenna module, the resonant frequency and voltage standing wave ratio (VSWR) may change.

[0095] Referring to FIGS. 2 through 8, the electrical characteristics of the antenna module (200) can be changed as the user wears the headphone device (300) in which the antenna module (200) is positioned. In this regard, as the ground of the PCB (1500) is widely distributed in the direction of the user's head, there is almost no shift in the resonant frequency. Specifically, (i) as the user's head approaches the antenna module, the operating frequency band shifts slightly to the left as the resonant frequency shifts to a lower frequency. Meanwhile, (ii) if the user's head is not near the antenna module, the operating frequency band shifts slightly to the right as the resonant frequency shifts to a higher frequency.

[0096] Meanwhile, the current distribution on the surface of the metal patch may be changed according to the shape of the metal patch of the antenna module according to the present specification, thereby changing the antenna performance. In this regard, FIGS. 9 and FIGS. 10 compare the current distribution, radiation pattern, and VSWR depending on the presence or absence of ground vias on the surface of the metal patch.

[0097] FIG. 9(a) shows a perspective view of an antenna module (200a) in which a metal patch (220) is disposed on a first surface of a dielectric (110) and a ground plane (230) is disposed on a second surface. Referring to FIG. 9(a), a feed point (FP) may be formed at a point on the surface of the metal patch (220). A current distribution is formed along one axis on the surface of the metal patch (220) centered on the feed point (FP). FIG. 9(b) shows a side view and a radiation pattern (RP) of the antenna module (200a) of FIG. 9(a).

[0098] Referring to FIG. 9(b), a dielectric (110) may be placed on a PCB (150). A metal patch (220) may be placed on the first surface of the dielectric (110), and a ground plane (230) may be placed on the second surface of the dielectric or on the first surface of the PCB (150). As the ground plane (230) is placed, the radiation pattern (RPa) of the antenna module (200a) is formed in the upward direction of the PCB (150).

[0099] Referring to FIG. 9(a) and FIG. 9(c), the antenna module (200a) can be configured to resonate at a single frequency of the resonant frequency (f0). The antenna module (200a) has a VSWR value of less than or equal to a certain level at the resonant frequency (f0). The antenna module (200a) can be configured to operate in a single frequency band of the resonant frequency (f0) by not forming separate slots in the metal patch (220).

[0100] FIG. 10(a) shows a perspective view of an antenna module (200a) having a metal patch (220) disposed on a first surface of a dielectric (110) having an internal slot (210s) and an external slot (220s) formed thereon, and a ground plane (230) disposed on a second surface. The internal slot (210s) may include a first slot (S1), a second slot (S2) and a third slot (S3) formed by extending from one end and the other end of the first slot (S1). The external slot (220s) may include a fourth slot (S4), a fifth slot (S5) and a sixth slot (S6) formed by extending from one end and the other end of the fourth slot (S4).

[0101] Referring to FIG. 10(a), a feed via (FV) may be connected at a point on the surface of the metal patch (220). A first ground via (GV1) and a second ground via (GV2) may be placed on one side and the other side of the metal patch (220) centered around the feed via (FV). The first ground via (GV1) and the second ground via (GV2) may be placed outside the outer slot (220s). A current distribution is formed along the direction in which the inner slot (210s) and the outer slot (220s) are formed centered around the feed point (FP). As the current path increases with the formation of the inner slot (210s) and the outer slot (220s), an antenna module (200) may be implemented with a smaller size than the metal patch (220) of FIG. 9(a). Therefore, an antenna module (200) that operates in a wider bandwidth with a smaller size can be implemented.

[0102] FIG. 10(b) shows a side view of the antenna module (200) of FIG. 10(a) and a first radiation pattern (RP1). Referring to FIG. 10(b), a dielectric (110) may be placed on a PCB (150). A metal patch (220) having an internal slot and an external slot formed on the first surface of the dielectric (110) may be placed, and a ground plane (230) may be placed on the second surface of the dielectric or on the first surface of the PCB (150). As the ground plane (230) is placed, the main radiation pattern of the first radiation pattern (RP1) of the antenna module (200) is formed in the upper direction of the PCB (150). Even though the ground plane (230) is placed, the first radiation pattern (RP1) may also be partially formed in the lower direction as the internal slot and the external slot are formed in the metal patch (220).

[0103] Referring to FIG. 10(a) and FIG. 10(c), the antenna module (200) may be configured to perform dual resonance at first and second resonance frequencies with respect to the resonance frequency (f0). The antenna module (200a) has a VSWR value below a certain level in a bandwidth including first and second resonance frequencies (f1, f2) with respect to the resonance frequency (f0). The antenna module (200a) may be configured to operate in a dual frequency band including first and second resonance frequencies by forming an inner slot (210s) and an outer slot (220s) in a metal patch (220).

[0104] Meanwhile, in an antenna module disposed in a headphone device according to the present specification, the radiation pattern may be formed differently depending on the antenna structure. In this regard, FIG. 11 shows radiation patterns according to antenna structures. FIG. 12 shows radiation patterns radiated through a headphone device in which the antenna structures of FIG. 11 are disposed.

[0105] FIG. 11(a) shows the radiation pattern (RPa) of the antenna module (200a) of FIG. 9. In the antenna module (200a), a metal patch (220) and a ground area (230) are disposed on the first and second surfaces of the dielectric (110). As the ground area (230) is disposed, the radiation pattern (RPa) is formed in one direction. The beam width of the radiation pattern (RPa) of the antenna module (200a) can be formed to a level of ±60 degrees.

[0106] FIG. 11(b) shows the radiation pattern (RPb) of a monopole antenna (220b). The monopole antenna (220b) can be placed in the upper region of the PCB (150) where the ground region (230) is formed. The radiation pattern (RPb) of the monopole antenna (220b) is formed as an omni-directional radiation pattern.

[0107] FIG. 11(c) shows the first radiation pattern (RP1) of the antenna module (200) of FIG. 10. The antenna module (200) can be placed in the first region (R1) of the PCB (150) where the ground region (230) is formed. As the ground plane (230) is placed, the main radiation pattern of the first radiation pattern (RP1) of the antenna module (200) is formed in one direction of the PCB (150). Even though the ground plane (230) is placed, as the internal slot and external slot are formed in the metal patch (220), the first radiation pattern (RP1) can also be partially formed in the other direction. Therefore, the first radiation pattern (RP1) of the antenna module (200) can be formed similarly to an omnidirectional radiation pattern.

[0108] FIG. 12(a) shows the radiation pattern (RP2a) of the antenna module (200a) when the antenna module (200a) of FIG. 11(a) is placed on one side of the headphone device (300). Referring to FIG. 11(a) and FIG. 12(a), the radiation pattern (RP2a) of the antenna module (200a) placed on one side of the headphone device (300) is formed in the direction of one side of the ground area (230). The beam width of the radiation pattern (RP2a) of the antenna module (200a) placed on one side of the headphone device (300) can be formed at a level of ±60 degrees. Thus, wireless communication is possible in the direction of one side of the headphone device (300). However, wireless communication performance is degraded in the other side direction, the front direction, and the rear direction of the headphone device (300).

[0109] FIG. 12(b) shows the radiation pattern (RP2b) of the monopole antenna (220b) of FIG. 11(b) when the monopole antenna (220b) is placed on one side of the headphone device (300). Referring to FIG. 11(b) and FIG. 12(b), the radiation pattern (RP2b) of the monopole antenna (220b) placed on one side of the headphone device (300) is formed in the direction of one side and the other side of the ground area (230). Due to the ground area (230) and electronic components within the headphone device, the main radiation direction of the radiation pattern (RP2b) is the direction of one side of the headphone device.

[0110] The beam width of the radiation pattern (RP2b) of the monopole antenna (220b) positioned on one side of the headphone device (300) can be formed to a level of ±80 degrees. Accordingly, wireless communication is possible in the direction of one side of the headphone device (300). However, wireless communication performance is degraded in the other side and front directions of the headphone device (300).

[0111] FIG. 12(c) shows the first radiation pattern (RP1) of the antenna module (200) when the antenna module (200) of FIG. 11(c) is placed on one side of the headphone device (300). Referring to FIG. 11(c) and FIG. 12(c), the first radiation pattern (RP1) of the antenna module (200) placed on one side of the headphone device (300) is formed in the direction of one side and the direction of the other side of the ground area (230).

[0112] The beam width of the radiation pattern (RP2b) of the monopole antenna (220b) positioned on one side of the headphone device (300) can be formed to a level of ±135 degrees. Accordingly, wireless communication is possible in the direction of one side and the other side of the headphone device (300). Wireless communication performance may be partially degraded in some areas of the direction of the other side of the headphone device (300). However, as the beam width is formed to be the widest, wireless communication is possible in most areas of the direction of one side and the other side of the headphone device (300).

[0113] An antenna module disposed in a headphone device according to one aspect of the present disclosure has been described. Hereinafter, a headphone device disposed with an antenna module according to another aspect of the present disclosure has been described. In this regard, FIG. 13 is an enlarged view of PCBs in which antenna modules are disposed inside a headphone device according to the present specification. FIG. 14 shows a view in which PCBs and electronic components are disposed in the headphone device of FIG. 13.

[0114] Referring to FIGS. 5 to 14, the headphone device (300) may be configured to include a headband (301), a first headphone unit (302), a second headphone unit (303), a first PCB (150), a second PCB (150b), a first antenna module (200), and a second antenna module (200b).

[0115] A first headphone unit (302) may be connected to one end of the headband (301). The first headphone unit (302) and the second headphone unit (303) may be electrically connected through the headband (301). The second headphone unit (303) may be connected to the other end of the headband (301).

[0116] A first PCB (150) may be placed inside the first headphone unit (302). A second PCB (150b) may be placed inside the second headphone unit (303). A first antenna module (200) may be placed in a first area (R1) of the first PCB (150) and configured to receive a wireless signal. A second antenna module (200b) may be placed in a second area (R2) of the second PCB (150b) corresponding to the first area (R1) of the first PCB (150) and configured to receive a wireless signal.

[0117] The first antenna module (200) may be configured to include a dielectric (110), a PCB (150), a metal patch (220), a ground area (230), an internal slot (210s), and an external slot (220s). The second antenna module (200b) may be configured to include a dielectric (110), a PCB (150), a metal patch (220), a ground area (230), an internal slot (210s), and an external slot (220s). The first antenna module (200) may be placed in a first area (R1) of the first PCB (150). The second antenna module (200b) may be placed in a second area (R2) of the second PCB (150b) corresponding to the first area (R1) of the first PCB (150).

[0118] The dielectric (110) may be formed into a cuboid having a first dielectric constant. The first and second faces of the dielectric (110) may correspond to the front and back faces. A metal patch (220) may be placed on the first face of the dielectric (110). The dielectric (110) may be placed on a PCB (150).

[0119] A ground area (230) may be disposed on the second surface of the dielectric (110) or the PCB (150) corresponding to the area where the metal patch (220) is formed. A slot area (SR) may be formed in the ground area (230) so that a signal line (SL) is disposed therein.

[0120] The internal slot (210s) may be composed of a plurality of slot portions. The internal slot (210s) may be configured to include a first slot (S1), a second slot (S2), and a third slot (S3). The first slot (S1) may be formed with a first length (L1) in the first axial direction of the metal patch (220). The second slot (S2) and the third slot (S3) may be formed with a second length (L2) in the second axial direction at the ends of the first slot (S1).

[0121] A feeding point (FP) may be formed on a metal patch (220) in the inner region of the inner slot (210s). An outer slot (220s) may be formed to surround the inner slot (210s). The outer slot (220s) may be composed of a plurality of slot portions. The outer slot (220s) may be configured to include a fourth slot (S4), a fifth slot (S5), and a sixth slot (S6).

[0122] A fourth slot (S4) may be formed with a third length (L3) in the first axial direction to surround the inner slot (210s). A fifth slot (S5) and a sixth slot (S6) may be formed with a fourth length (L4) in the second axial direction at the ends of the fourth slot (S4). The length of the outer slot (220s) may be formed to be longer than the length of the inner slot (210s). The third length (L3) of the fourth slot (S4) of the outer slot (220s) may be formed to be longer than the first length (L1) of the first slot (S1) of the inner slot (210s). The fourth length (L4) of the fifth slot (S5) of the outer slot (220s) may be formed to be longer than the second length (L2) of the second slot (S2) of the inner slot (210s). The fourth length (L4) of the sixth slot (S6) of the outer slot (220s) can be formed to be longer than the second length (L2) of the third slot (S3) of the inner slot (210s).

[0123] A first point (P1) between the first side of the second axis direction of the metal patch (220) and the outer edge of the fifth slot (S5) can be connected to a second point (P2) of the ground area (230). A third point (P3) between the second side of the second axis direction of the metal patch (220) and the outer edge of the sixth slot (S6) can be connected to a fourth point (P4) of the ground area (230). The second axis direction can be formed orthogonally to the first axis direction. The first axis direction and the second axis direction can correspond to the X-axis direction and the Y-axis direction.

[0124] Meanwhile, the first antenna module (200) and the second antenna module (200b) of the headphone device according to the present specification may be configured to receive wireless signals in the UWB frequency band. Additionally, the headphone device (300) may further include other antenna modules and electronic components. In this regard, FIG. 15 shows a block diagram in which the first and second antenna modules are connected to a processor via a switch and a cable. With reference to FIGS. 5 through 15, a headphone device (300) equipped with the first and second antenna modules (200, 200b) according to the present specification will be described.

[0125] The first antenna module (200) and the second antenna module (200b) may be configured to receive wireless signals in the UWB frequency band. The headphone device (300) may be configured to further include a third antenna module (200c), a cable (304), a switch (305), and a processor (330).

[0126] The third antenna module (200c) may be configured to receive a wireless signal in the Bluetooth (BT) frequency band in the third area (R3) of the first PCB. A cable (304) may be housed inside the headband (301). The cable (304) may be formed to electrically connect the first PCB (150) and the second PCB (150b). A switch (305) may be placed in the fourth area (R4) between the first area (R1) and the third area (R3) of the first PCB (150). A processor (330) may be operably coupled with the switch (305) and the third antenna module (200c). The processor (330) may be connected to either the first antenna module (200) or the second antenna module (200b) through the switch (305).

[0127] Meanwhile, if an antenna module is disposed on one side of a headphone device according to the present specification and an electronic device is disposed on the other side, wireless communication performance may be degraded. In this regard, FIG. 16 is a conceptual diagram showing wireless communication performance with an electronic device according to the radiation pattern of a headphone device in which an antenna module is disposed internally.

[0128] Referring to FIGS. 13 to 15 and FIG. 16(a), when a first antenna module (200a) is operated on one side of the headphone device, the first radiation pattern (RP1) is formed such that the value on one side is larger than the value on the other side. The first radiation pattern (RP1) may be formed with an asymmetric structure such that the value on the other side is below a certain level. Accordingly, wireless communication performance with an electronic device (100a) placed on the other side of the headphone device may be degraded.

[0129] Referring to FIGS. 13 to 15 and FIG. 16(b), when the second antenna module (200b) is operated on the other side of the headphone device, the second radiation pattern (RP2) is formed such that the value on the other side is greater than the value on the one side. The first radiation pattern (RP1) may be formed with an asymmetric structure such that the value on the one side is below a certain level. Accordingly, wireless communication performance with the electronic device (100b) placed on one side of the headphone device may be degraded.

[0130] Referring to FIGS. 13 to 15 and FIG. 16(c), when the first antenna module (200a) and the second antenna module (200b) are operated on one side and the other side of the headphone device, the third radiation pattern (RP3) is formed such that the value on the one side and the value on the other side are identical or similar within a predetermined range. The third radiation pattern (RP3) can be formed with a symmetrical structure such that the value on the one side and the value on the other side are identical or similar within a predetermined range. Accordingly, wireless communication performance with the electronic devices (100a, 100b) placed on one side and the other side of the headphone device can be maintained at a certain level or higher. Therefore, when the first antenna module (200a) and the second antenna module (200b) are placed on one side and the other side of the headphone device and operated selectively, communication with the electronic devices is possible in all directions.

[0131] Meanwhile, a headphone device having antenna modules arranged according to the present specification can select one of the first and second antenna modules (200, 200b) through a switch. In this regard, FIG. 17 shows a flowchart of a control method performed by a processor that selects one of the first and second antenna modules of the headphone device according to the present specification. FIG. 18 shows a block diagram in which the first and second antenna modules are connected through a switch and a processor.

[0132] Referring to FIGS. 13, 15, and 18, the first antenna module (200) and the second antenna module (200b) may be configured to receive and transmit wireless signals in the UWB frequency band. The third antenna module (200c) may be configured to receive and transmit wireless signals in the Bluetooth band. The first antenna module (200) and the second antenna module (200b) may be placed on the first PCB (150) and the second PCB (150b) on one side and the other side of the headphone device (300). The third antenna module (200c) may be placed on the first PCB (150) on one side of the headphone device (300).

[0133] The first antenna module (200) and the second antenna module (200b) can be operably coupled to the switch (305) through the first and second low-noise amplifiers (306a, 306b). The switch (305) can be operably coupled to the processor (330) through the low-noise amplifier (307) and the first bandpass filter (308). The processor (330) can be operably coupled to the third antenna module (200c) through the second bandpass filter (309). The first and second low-noise amplifiers (306a, 306b), the low-noise amplifier (307), and the first bandpass filter (308) can constitute the RF circuit (310) of the headphone device (300). The RF circuit (310) may further include the second bandpass filter (309).

[0134] The first bandpass filter (308) may be configured to pass signals in the UWB frequency band and block signals in the Bluetooth band. The second bandpass filter (309) may be configured to pass signals in the Bluetooth band and block signals in the UWB frequency band. The processor (330) may be configured to receive and transmit wireless signals by selecting at least one of the first antenna module (200) and the second antenna module (200b).

[0135] Referring to FIGS. 1 through 18, a method for controlling a headphone device performed by a processor (330) is described. The processor (330) can receive sound source data and dummy data (S110) through a first antenna module (200) and a second antenna module (200b), respectively. Dummy data is data received to compare an index associated with a received signal. Dummy data is data received to compare the received signal strength index (RSSI). Unlike sound source data, dummy data is not played back as sound source.

[0136] The processor (330) can determine (S120) whether sound source data is received from the first antenna module (200). When sound source data is received from the first antenna module (200), the processor (330) controls (S130) that the sound source data be played through the speakers (351, 352). Additionally, the processor (330) can determine (S140) whether the RSSI value of the sound source data received from the first antenna module (200) is higher than the RSSI value of the dummy data received from the second antenna module (200b).

[0137] If the RSSI value of the sound source data received from the first antenna module (200) is higher than the RSSI value of the dummy data received from the second antenna module (200b), the processor (330) can perform step S110. The processor (330) can receive the next data received through the first antenna module (200) as sound source data and receive the dummy data through the second antenna module (200b) (S110). If the RSSI value received from the first antenna module (200) is lower than the RSSI value of the dummy data received from the second antenna module (200b), the processor (330) can perform step S150. The processor (330) can receive the next data received through the second antenna module (200b) as sound source data and receive the dummy data from the first antenna module (200) (S150).

[0138] In this regard, the processor (330) can control the first and second connection states by time-division switching with a single switch (305) so that data is received from both the first antenna module (200) and the second antenna module (200b).

[0139] Meanwhile, if sound source data is not received from the first antenna module (200), the processor (330) can control (S150) so that sound source data is received through the second antenna module (200b). The processor (330) can control (S150) so that dummy data is received through the first antenna module (200) and sound source data is received through the second antenna module (200b).

[0140] The processor (330) can determine (S160) whether sound source data is received from the second antenna module (200b). If sound source data is received from the second antenna module (200b), the processor (330) controls (S170) that the sound source data be played through the speakers (351, 352). If sound source data is not received from the second antenna module (200b), the processor (330) can return to step S110. The processor (330) can receive sound source data and dummy data, respectively, through the first antenna module (200) and the second antenna module (200b) (S110).

[0141] If sound source data is not received from the first antenna module (200) and the second antenna module (200b), the processor (330) can determine whether the number of times sound source data has not been received is greater than a certain number of times (e.g., 10 times). If the number of times sound source data has not been received is greater than a certain number of times, the processor (330) can receive a wireless signal in the Bluetooth frequency band through the third antenna module (200c), which is a Bluetooth antenna.

[0142] The processor (330) can determine (S180) whether the RSSI value of the sound source data received through the second antenna module (200b) is higher than the RSSI value of the dummy data received from the first antenna module (200). If the RSSI value of the sound source data received from the second antenna module (200b) is higher than the RSSI value of the dummy data received from the first antenna module (200), the processor (330) can perform step S150. The processor (330) can receive the next data received through the second antenna module (200b) as sound source data and receive the dummy data through the first antenna module (200) (S150).

[0143] If the RSSI value received from the second antenna module (200b) is lower than the RSSI value of the dummy data received from the first antenna module (200), the processor (330) can return to step S110 to receive the next received data. If no sound source data is received from the second antenna module (200b), the processor (330) can return to step S110 to receive the next received data. The processor (330) can receive the next received data as sound source data through the first antenna module (200) and receive dummy data (S110) through the second antenna module (200b).

[0144] In this regard, the processor (330) can control the first and second connection states by time-division switching with a single switch (305) so that data is received from both the first antenna module (200) and the second antenna module (200b).

[0145] Meanwhile, if the RSSI value of the sound source data received from the second antenna module (200b) is higher than the RSSI value of the dummy data received from the first antenna module (200), step S150 can be repeated. The processor (330) can control (S150) so that dummy data is received through the first antenna module (200) and sound source data is received through the second antenna module (200b).

[0146] The antenna module (200) may be configured to include a feed via (FV) and at least one ground structure. The at least one ground structure may be formed by at least one ground via. The feed via (FV) may be formed to connect a feed point (FP) of a metal patch (220) and a connection point (CP) adjacent to one end of a feed line (210f). The feed via (FV) may be formed to vertically connect the metal patch (220) where the feed point (FP) is located and the ground area (230) where the connection point (CP) is located.

[0147] A first ground via (GV1) may be formed to connect a first point (P1) of a metal patch (220) and a second point (P2) of a ground area (230). A first ground via (GV1) may be formed to vertically connect the metal patch (220) where the first point (P1) is placed and the ground area (230) where the second point (P2) is placed.

[0148] A second ground via (GV2) may be formed to connect a third point (P3) of a metal patch (220) and a fourth point (P4) of a ground area (230). The second ground via (GV2) may be formed to vertically connect the metal patch (220) where the third point (P3) is located and the ground area (230) where the fourth point (P4) is located.

[0149] A substrate (120) may be disposed on the second surface of the dielectric (110). The dielectric (110) may include a substrate (120) disposed on the second surface of the dielectric (110). A ground area (230) may be disposed on the second surface of the substrate (120) corresponding to an area where a metal patch (220) is formed. A feed line (210f) may be formed on the second surface of the dielectric (110) or on the first surface of the substrate (120).

[0150] A feed via (FV) can be connected to a feed line (210f) to form a feed structure (FS). The feed structure (FS) can be configured to include a feed via (FV), a feed line (210f), a signal line (SL), and a connection via (CV). The feed via (FV) can be formed to vertically connect a feed point (FP) of the metal patch (220) and a connection point (CP) of the feed line (210f). The feed line (210f) can be formed to be connected to the feed via (FV) at one end. The feed line (210f) can be formed to be connected to the connection via (CV) at the other end.

[0151] A signal line (SL) may be formed on a second surface of the substrate (120). The signal line (SL) may be placed in a slot area (SR) where a ground area (230) of the substrate (120) is formed. Ground areas (230) may be formed on one side and the other side of the signal line (SL) to form a CPW (Co-Planar Waveguide) structure. A connecting via (CV) may be formed to vertically connect the other end of the feed line (210f) and the signal line (SL).

[0152] Meanwhile, the antenna module according to the present specification may be configured to resonate in dual bands for UWB wireless communication. In this regard, the antenna module (200) may be configured to resonate in a first frequency band of 5.0 to 8.5 GHz and a second frequency band of 8.5 to 10.6 GHz for UWB wireless communication. The length of the external slot (220s) may be formed within a predetermined range based on a wavelength (λ) corresponding to 9 GHz within the second frequency band.

[0153] The length of the metal patch (220) can be formed within a predetermined range based on 0.5λ, which is 0.5 times the wavelength corresponding to 7 GHz. The length of the metal patch (220) can be formed within a predetermined range based on 12 mm. The length of the slot (S1 + S4 + S6) forming the outer slot (220s) can be formed within a predetermined range based on 1.0λ, which is 1.0 times the wavelength corresponding to 9 GHz.

[0154] The third length (L3) of the fourth slot (S4) forming the outer slot (220s) can be formed within a predetermined range based on 6mm. The fourth length (L4) of the second slot (S2) and the third slot (S3) forming the outer slot (220s) can be formed within a predetermined range based on 8mm.

[0155] Meanwhile, the dielectric (110) having the metal patch (220) formed thereon can be placed on the PCB (150). The dielectric (110) having the metal patch (220) formed thereon can be placed on the first surface of the PCB (150) in the first area (R1) where the first ground area (GR1) has been removed. One end of the metal patch (220) can be placed adjacent to the boundary of the PCB (150) compared to the other end. Accordingly, the metal patch (220) of the first antenna module (200) can be placed offset from the center of the PCB (150) toward the lower boundary side. Meanwhile, the third antenna module (200c) can be placed offset from the center of the PCB (150) toward the upper boundary side.

[0156] The metal patch (200) of the first antenna module (200) may be positioned offset from the center of the first PCB (150) toward the lower boundary side in the second axial direction. The second antenna module (200b) may be positioned offset from the center of the second PCB (150b) toward the first axial direction. The third antenna module (200c) may be positioned offset from the center of the first PCB (150) toward the upper boundary side in the second axial direction.

[0157] The second antenna module (200b) may be placed in an area offset from the center of the second PCB (150b). The metal patch (220) of the first antenna module (200) may be placed in the first area (R1) of the PCB (150) so as not to overlap with the area where the second antenna module (200b) is placed. In this regard, the first distance (D1) between one end of the metal patch (220) and one end of the first area (R1) may be formed shorter than the second distance (D2) between the other end of the metal patch (220) and the other end of the first area (R1). The first distance (D1) may be formed longer than the third distance (D3) between the top end of the metal patch (220) and the end of the first ground area (GR1). The second distance (D2) can be formed to be longer than the third distance (D3) at the end of the first ground area (GR1) at the top of the metal patch (220).

[0158] The configuration of an antenna module operating in the UWB frequency band and a headphone device equipped therewith has been described in detail above. The technical effects of the antenna module operating in the UWB frequency band and the headphone device equipped therewith can be summarized as follows, but are not limited thereto.

[0159] According to the present specification, wide bandwidth and low latency characteristics can be secured by using an antenna module operating in the UWB frequency band.

[0160] According to the present specification, a ground area is placed at the bottom of the metal patch of the antenna module so that the antenna module can be designed so that there is almost no change in the resonant frequency caused by the human body.

[0161] According to the present specification, a wide beam width can be realized by forming an omnidirectional radiation pattern through a structure in which current flows from a feed point located at the center point of a metal patch of an antenna module to ground vias disposed on one side and the other side.

[0162] According to the present specification, by forming an omnidirectional radiation pattern having a wide beam width through internal slots, external slots, and ground vias, the reception and transmission performance of wireless signals including audio signals can be improved.

[0163] According to the present specification, an antenna module can be provided with a wide bandwidth by adding an internal slot and an external slot to the surface of a metal patch. Thus, an antenna module that operates across the entire band of the UWB frequency band can be provided.

[0164] According to the present specification, by applying the first and second antenna modules to the left and right sides of the headphone device, respectively, it is possible to prevent the electronic device and wireless communication performance from degrading in the direction of the human body.

[0165] Further scopes of the applicability of the present invention will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of the present invention are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of the present invention, should be understood as being given merely as examples. Accordingly, the above detailed description should not be interpreted restrictively in all respects but should be considered exemplary. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are included within the scope of the present invention.

Claims

In headphone devices, Headband; A first headphone unit connected to one end of the headband; A second headphone unit electrically connected to the first headphone unit through the headband and connected to the other end of the headband; A first PCB disposed inside the first headphone unit; A second PCB disposed inside the second headphone unit; A first antenna module configured to receive a wireless signal and disposed in a first area of ​​the first PCB; and It includes a second antenna module configured to receive the wireless signal by being disposed in the second area of ​​the second PCB corresponding to the first area, and The above-mentioned first antenna module is, A genome formed as a cuboid; A metal patch disposed on the first surface of the above dielectric; A ground area formed on the second surface of the dielectric or on the first PCB corresponding to the area where the metal patch is formed - the ground area has a slot area formed so that a signal line is disposed therein; An internal slot comprising a first slot formed with a first length in the first axial direction of the metal patch, a second slot formed with a second length in the second axial direction at the ends of the first slot, and a third slot; and A feeding point is formed in the metal patch, which is the internal region of the internal slot, and It includes an external slot comprising a fourth slot formed with a third length in the first axial direction to surround the internal slot, a fifth slot formed with a fourth length in the second axial direction at the ends of the fourth slot, and a sixth slot. A first point between the first side in the second axial direction of the metal patch and the outer side of the fifth slot is connected to a second point of the ground area, and A third point between the second side in the second axial direction of the metal patch and the outer edge of the sixth slot is connected to a fourth point of the ground area, and The second axis direction is formed orthogonally to the first axis direction, and The third length of the fourth slot of the above external slot is formed to be longer than the first length of the first slot of the above internal slot, and A headphone device in which the fourth length of the fifth slot and the sixth slot of the external slot is formed to be longer than the second length of the second slot and the third slot of the internal slot. In Article 10, The first antenna module is disposed in a first area of ​​the first PCB, and The second antenna module includes the metal patch, the ground region, the inner slot, and the outer slot, and A headphone device in which the second antenna module is disposed in the second area of ​​the second PCB corresponding to the first area of ​​the first PCB. In Article 1, The first antenna module and the second antenna module are configured to receive wireless signals in the UWB frequency band, and A third antenna module configured to receive a wireless signal in the Bluetooth (BT) frequency band in the third area of ​​the first PCB; A cable housed inside the headband and formed to electrically connect the first PCB and the second PCB; A switch disposed in a fourth region between the first region and the third region of the first PCB and configured to connect the end of the cable and the first antenna module; and A headphone device comprising a processor operably coupled to the above switch and the above third antenna module. In Paragraph 3, The above processor is, Sound source data and dummy data are received respectively through the first antenna module and the second antenna module, and When the sound source data is received by the first antenna module, the system controls the sound source data to be played, and If the RSSI value of the sound source data received by the first antenna module is higher than the RSSI value of the dummy data received by the second antenna module, the next data received through the first antenna module is received as sound source data, and the dummy data is received through the second antenna module. A headphone device that controls the reception of sound source data through the second antenna module and the reception of dummy data through the first antenna module when the sound source data is not received through the first antenna module. In Paragraph 4, The above processor is, If the sound source data is not received by the second antenna module, control is made so that the sound source data is received through the first antenna module. When the sound source data is received by the second antenna module, control is made to play the sound source data. If the RSSI value of the sound source data received by the second antenna module is higher than the RSSI value of the dummy data received by the first antenna module, the next data received through the second antenna module is received as sound source data, and the dummy data is received through the first antenna module. A headphone device that controls the reception of sound source data through the first antenna module and the reception of dummy data through the second antenna module when the sound source data is not received through the second antenna module. In Article 1, The above-mentioned first antenna module is, A feed via formed to connect the feed point of the metal patch and a connection point adjacent to one end of the feed line; A first ground via formed to connect the first point of the metal patch and the second point of the ground region; and A headphone device comprising a second ground via formed to connect the third point of the metal patch and the fourth point of the ground area. In Article 6, The above feed via is formed to vertically connect the metal patch where the feed point is located and the ground area where the connection point is located, and The first ground via is formed to vertically connect the metal patch on which the first point is located and the ground area on which the second point is located, and A headphone device, wherein the second ground via is formed to vertically connect the metal patch on which the third point is located and the ground area on which the fourth point is located. In Article 6, The above dielectric includes a substrate disposed on a second surface of the above dielectric, and The ground region is disposed on the second surface of the substrate corresponding to the region where the metal patch is formed, and A headphone device in which the feed line is formed on the second surface of the dielectric or the first surface of the substrate. In Article 8, The above-mentioned feed via is connected to the above-mentioned feed line to form a feed structure, and The above power supply structure is, The feed via formed to vertically connect the feed point of the metal patch and the connection point of the feed line; The feed line formed to be connected to the feed via at one end; The signal line formed on the second surface of the substrate; and A headphone device comprising a connecting via formed to vertically connect the other end of the feed line and the signal line. In Paragraph 3, The first antenna module and the second antenna module are configured to resonate in a first frequency band of 5.0 to 8.5 GHz and a second frequency band of 8.5 to 10.6 GHz for UWB wireless communication, and A headphone device in which the length of the above external slot is formed within a predetermined range based on a wavelength corresponding to 9 GHz within the second frequency band. In Article 10, The length of the above metal patch is formed within a predetermined range based on 12mm, and The third length of the first slot forming the external slot is formed within a predetermined range based on 6mm, and A headphone device in which the fourth length of the second slot and the third slot forming the external slot is formed within a predetermined range based on 8mm. In Article 10, The metal patch of the first antenna module is placed on the first surface of the first PCB in the first area where the first ground area is removed, and The metal patch of the second antenna module is placed on the first surface of the second PCB in the second region where the second ground region is removed, and One end of the metal patch of the first antenna module is positioned adjacent to the boundary of the first PCB compared to the other end, and A headphone device in which one end of the metal patch of the second antenna module is positioned adjacent to the boundary of the second PCB compared to the other end. In Article 12, The metal patch of the first antenna module is offset from the center of the first PCB toward the lower boundary side in the second axis direction, and The second antenna module is positioned offset from the center of the second PCB in the direction of the first axis, and A headphone device wherein the third antenna module is offset from the center of the first PCB toward the upper boundary side in the direction of the second axis. In an antenna module placed in a headphone device, A genome formed as a cuboid; A metal patch disposed on the first surface of the above dielectric; A PCB disposed on the second surface of the above dielectric; A ground area formed on the second surface of the dielectric or on the PCB corresponding to the area where the metal patch is formed - the ground area has a slot area formed therein for placing a signal line; An internal slot comprising a first slot formed with a first length in the first axial direction of the metal patch, a second slot formed with a second length in the second axial direction at the ends of the first slot, and a third slot; and A feeding point is formed on the metal patch in the inner region of the inner slot, and It includes an external slot comprising a fourth slot formed with a third length in the first axial direction to surround the internal slot, a fifth slot formed with a fourth length in the second axial direction at the ends of the fourth slot, and a sixth slot. A first point between the first side in the second axial direction of the metal patch and the outer side of the fifth slot is connected to a second point of the ground area, and A third point between the second side in the second axial direction of the metal patch and the outer edge of the sixth slot is connected to a fourth point of the ground area, and The second axis direction is formed orthogonally to the first axis direction, and The third length of the fourth slot of the above external slot is formed to be longer than the first length of the first slot of the above internal slot, and An antenna module in which the fourth length of the fifth slot and the sixth slot of the external slot is formed to be longer than the second length of the second slot and the third slot of the internal slot. In Article 14, The above internal slot is formed into a first U-shape in which the metal pattern of the metal patch is removed so that the first dielectric region is exposed on the left, right, and bottom, and The above external slot is an antenna module in which the metal pattern of the metal patch is removed so that a second dielectric region is formed in a second U-shape on the left, right, and top. In Article 15, A feed via formed to connect the feed point of the metal patch and a connection point adjacent to one end of the feed line; A first ground via formed to connect the first point of the metal patch and the second point of the ground region; and An antenna module comprising a second ground via formed to connect the third point of the metal patch and the fourth point of the ground area. In Article 16, The above feed via is formed to vertically connect the metal patch where the feed point is located and the ground area where the connection point is located, and The first ground via is formed to vertically connect the metal patch on which the first point is located and the ground area on which the second point is located, and An antenna module, wherein the second ground via is formed to vertically connect the metal patch on which the third point is located and the ground area on which the fourth point is located. In Article 16, The above dielectric includes a substrate disposed on a second surface of the above dielectric, and The ground region is disposed on the second surface of the substrate corresponding to the region where the metal patch is formed, and An antenna module in which the feed line is formed on the second surface of the dielectric or the first surface of the substrate. In Article 18, The above-mentioned feed via is connected to the above-mentioned feed line to form a feed structure, and The above power supply structure is, The feed via formed to vertically connect the feed point of the metal patch and the connection point of the feed line; The feed line formed to be connected to the feed via at one end; The signal line formed on the second surface of the substrate; and An antenna module comprising a connecting via formed to vertically connect the other end of the feed line and the signal line. In Article 14, The above antenna module is configured to resonate in a first frequency band of 5.0 to 8.5 GHz and a second frequency band of 8.5 to 10.6 GHz for UWB wireless communication, and An antenna module in which the length of the above external slot is formed within a predetermined range based on a wavelength corresponding to 9 GHz within the second frequency band. In Article 20, The length of the above metal patch is formed within a predetermined range based on 12mm, and The third length of the fourth slot forming the above external slot is formed within a predetermined range based on 6mm, and An antenna module in which the fourth length of the fifth slot and the sixth slot forming the external slot is formed within a predetermined range based on 8mm.

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