Sub-surface laser additive manufacturing system and method

Abstract

A system includes: a frame; a tank defining a volume configured to hold uncured resin; a laser emitting device configured to produce a laser beam; an actuation system to provide relative movement between the laser emitting device and the tank; and a controller configured to: receive print information regarding a three-dimensional object to be printed into the volume of the tank; operate the actuation system based on the print information to move the laser emitting device relative to the tank so that the focal point of the focused laser beam moves within the volume of the tank; and operate the focused laser beam based on the print information, so that movement of the focal point of the focused laser beam inside the volume of the tank energizes a local portion of uncured resin to polymerize the local portion of the uncured resin and to thereby additively manufacture the three-dimensional object.

Description

SUB-SURFACE LASER ADDITIVE MANUFACTURING SYSTEM AND METHODBACKGROUND

[0001] The present disclosure relates generally to additive manufacturing and more particularly the present disclosure relates to resin-based additive manufacturing.

[0002] Additive manufacturing (e.g., material extrusion, material jetting, binder jetting, laser additive manufacturing, etc.) is often utilized in engineering, design, and manufacturing environments to construct three-dimensional (3D) objects from a digital model, such as a computer-aided design (CAD) model.SUMMARY

[0003] In some aspects, the techniques described herein relate to an additive manufacturing system including: a frame; a tank coupled to the frame and defining a volume configured to hold uncured resin; a laser emitting device coupled to the frame and configured to produce a focused laser beam defining a focal point; an actuation system coupled between the tank and the laser emitting device to provide relative movement between the laser emitting device and the tank; and a controller including a processor and a memory storing instructions thereon that, when executed by the processor, cause the controller to: receive print information regarding a three-dimensional object to be printed into the volume of the tank; operate the actuation system based on the print information to move the laser emitting device relative to the tank so that the focal point of the focused laser beam moves within the volume of the tank; and operate the focused laser beam based on the print information, so that movement of the focal point of the focused laser beam inside the volume of the tank energizes a local portion of uncured resin to polymerize the local portion of the uncured resin and to thereby additively manufacture the three-dimensional object.

[0004] In some aspects, the techniques described herein relate to a system, further including: a chamber sized to receive the tank and including a heating device configured to heat the volume of the tank to a threshold temperature.

[0005] In some aspects, the techniques described herein relate to a system, wherein the tank includes a base and a side-wall that is at least partially transparent.

[0006] In some aspects, the techniques described herein relate to a system, further including the uncured resin, and wherein the uncured resin includes a bio-resin.

[0007] In some aspects, the techniques described herein relate to a system, wherein the uncured resin includes Tung Oil C57H92O6, Butyl Methacrylate C8H14O2, and Divinylbenzene C10H10.

[0008] In some aspects, the techniques described herein relate to a system, further including the uncured resin, wherein the uncured resin is semisolid and inhibits natural convection, and wherein the semisolid uncured resin supports a solidified portion of the three-dimensional object formed within the uncured resin.

[0009] In some aspects, the techniques described herein relate to a system, further including the uncured resin, and wherein the uncured resin includes an initiator.

[0010] In some aspects, the techniques described herein relate to a system, wherein the initiator includes Di-tert-butyl Peroxide C8H18O2.

[0011] In some aspects, the techniques described herein relate to a system, wherein the initiator is at least one of Diphenyl Phosphine Oxide C22H21O2P, and Eosin Y C20H8Br4O5.

[0012] In some aspects, the techniques described herein relate to a system, wherein the initiator is at least one of a thermal initiator and a photoinitiator, and wherein the uncured resin includes a pigment configured to absorb laser energy at a wavelength of the focused laser beam,

[0013] In some aspects, the techniques described herein relate to a system, wherein the laser emitting device includes a diode-pumped solid-state laser (DPSSL).

[0014] In some aspects, the techniques described herein relate to a system, wherein the DPSSL is a diode- umped neodymium-doped yttrium aluminum garnet (ND: YAG) laser with wavelengths in on a nanometer scale.

[0015] In some aspects, the techniques described herein relate to a system, further including a second laser emitting device configured to emit a second focused laser beam defining a second focal point, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to: direct the second laser beam into the volume of the tank based on the print information.

[0016] In some aspects, the techniques described herein relate to a system, wherein the second focused laser beam passes through a sidewall of the tank.

[0017] In some aspects, the techniques described herein relate to a system, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to direct the focused laser beam and the second focused laser beam to intersect within the volume of the tank based on the print information.

[0018] In some aspects, the techniques described herein relate to a system, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to: operate the focused laser beam to print a first portion of the three-dimensional object based on the print instructions; and operate the second laser beam to print a second portion of the three-dimensional object based on the print information.

[0019] In some aspects, the techniques described herein relate to a system, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to: operate the focused laser beam and the second laser beam simultaneously based on the print information.

[0020] In some aspects, the techniques described herein relate to a system, wherein a first print layer of the three-dimensional object is at a first print depth of the volume of the tank, and a final print layer of the three-dimensional object is at a second print depth less than the first print depth and below a surface of the uncured resin.

[0021] In some aspects, the techniques described herein relate to an additive manufacturing system, including: a tank configured to contain a volume of uncured resin; a chamber housing the tank and including a heating device; a laser emitting device configured to selectively produce a focused laser beam defining a focal point; and a controller including a processor and a memorystoring instructions thereon that, when executed by the processor, cause the controller to: receive print information regarding a three-dimensional object to be printed into the volume of uncured resin; operate the heating device based on the print information to heat the volume of uncured resin to a threshold temperature; operate the laser emitting device based on the print information to position the focal point of the focused laser beam to a first sub-surface localized portion of the volume of uncured resin; operate the laser emitting device to solidify the first sub-surface localized portion of the volume of uncured resin to thereby create a solidified first sub-surface portion; subsequently, operate, based on the print information, the laser emitting device to position the focal point of the focused laser beam to a second sub-surface localized portion of the volume of uncured resin different than the first sub-surface localized portion; and operate the laser emitting device to solidify the second sub-surface localized portion to thereby create a solidified second sub-surface portion; wherein the solidified first sub-surface portion and the solidified second sub-surface portion define a unitary body, and the unitary body is suspended within the volume of uncured resin.

[0022] In some aspects, the techniques described herein relate to a system, wherein the volume of uncured resin is semisolid.

[0023] In some aspects, the techniques described herein relate to a system, wherein the uncured resin includes Tung Oil C57H92O6, Butyl Methacrylate C8H14O2, and Divinylbenzene (DVB) C10H10.

[0024] In some aspects, the techniques described herein relate to a system, wherein the laser emitting device includes a diode-pumped solid-state laser (DPSSL).

[0025] In some aspects, the techniques described herein relate to a system, wherein the DPSSL is a diode-pumped neodymium-doped yttrium aluminum garnet (ND: YAG) laser with wavelengths on a nanometer scale.

[0026] In some aspects, the techniques described herein relate to a system, further including a second laser emitting device configured to emit a second focused laser beam including a second focal point, wherein the memory is further configured to store instructions thereon that, whenexecuted by the processor, cause the controller to: direct the second focused laser beam into the volume of the tank based on the print information.

[0027] In some aspects, the techniques described herein relate to a system, wherein the second focused laser beam passes through a sidewall of the tank.

[0028] In some aspects, the techniques described herein relate to a method for additive manufacturing, including: receiving print information regarding a three-dimensional object to be printed into a volume of uncured resin; operating a heating device based on the print information to heat the volume of uncured resin to a threshold temperature; operating a laser emiting device based on the print information to position a focal point of a focused laser beam to a first subsurface localized portion of the volume of uncured resin; operating the laser emiting device to solidify the first sub-surface localized portion of the volume of uncured resin to thereby create a solidified first sub-surface portion; subsequently, operating, based on the print information, the laser emitting device to position the focal point of the focused laser beam to a second sub-surface localized portion of the volume of uncured resin different than the first sub-surface localized portion; and operating the laser emitting device to solidify the second sub-surface localized portion to thereby create a solidified second sub-surface portion.

[0029] In some aspects, the techniques described herein relate to a method, further including: retrieving the solidified portions from the volume of uncured resin; removing uncured resin from the retrieved solidified portions; and returning the removed uncured resin to the volume of uncured resin.

[0030] This summary is illustrative only and is not intended to be in any way limiting. Other aspects, inventive features, and advantages of the devices or processes described herein will become apparent in the detailed description set forth herein, taken in conjunction with the accompanying figures, wherein like reference numerals refer to like elements.BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG. 1 is a schematic diagram of an additive manufacturing system, according to an exemplary implementation;

[0032] FIGS. 2-4 are schematic diagrams of the additive manufacturing system printing a 3D object into a volume of resin, according to some implementations;

[0033] FIG. 5 is a schematic diagram of 3D objects printed into a volume of resin, according to some implementations;

[0034] FIG. 6 is a flow diagram of a process for subsurface laser additive manufacturing, according to some implementations,

[0035] FIG. 7 A is a schematic diagram of the relative intensity of a gaussian beam, according to some implementations;

[0036] FIG. 7B is a schematic diagram of the relative intensity of a flat top beam, according to some implementations;

[0037] FIG. 8 is a list of example ingredients of a base resin and a list of example ingredients of the initiators of a resin, and a list of example heat sources for curing the resin, and a list of example measurement devices for measuring properties of the resin, according to some implementations;

[0038] FIG. 9 is a schematic diagram of a chemical process for polymerizing the resin, and properties of a cured resin, according to some implementations;

[0039] FIG. 10 is a schematic diagram of subsurface laser additive manufacturing and a list of ad vantages of subsurface laser additive manufacturing, according to some implementations;

[0040] FIG. HA is an image of a translucent tank containing a volume of polymerizing resin, according to some implementations;

[0041] FIG. 1 IB is a plot of a resins energy absorbance at different wavelengths of light, according to some implementations;

[0042] FIG. 12A is an image of a side perspective view of a resin with laser- induced polymerized objects within the resin, according to some implementations;

[0043] FIG. 12B is a top perspective view of the resin of FIG. 12A, according to some imp 1 ementations;

[0044] FIG. 12C is an image of the resin of FIG. 12B at a 20x zoom, according to some imp 1 ementation s;

[0045] FIG. 12D is an image of the resin of FIG. 12B at 5 Ox zoom, according to some impl ementati on s,

[0046] FIG. 12E is an image of the resin of FIG. 12B at 150x zoom, according to some impl ementati on s,

[0047] FIG. 13 A is an image of a side perspective view of a resin with laser-induced polymerized objects within the resin, according to some implementations;

[0048] FIG. 13B is an image of a top perspective view of the resin of FIG. 13 A at a 20x zoom, according to some implementation;

[0049] FIG. 13C is an image of a top perspective view of the resin of FIG. 13 A at 50x zoom, according to some implementation;

[0050] FIG. 13D is an image of a top perspective view of the resin of FIG. 13 at 150x zoom, according to some implementation;

[0051] FIG. 14A is an image of a side perspective view of a resin with laser-induced polymerized objects within the resin, according to some implementations;

[0052] FIG. 14B is a top perspective view of the resin of FIG. 14A, according to some implementations;

[0053] FIG. 14C is an image of the resin of FIG. 14B at a 20x zoom, according to some implementations;

[0054] FIG. 14D is an image of the resin of FIG. 14B at 50x zoom, according to some implementations;

[0055] FIG. 14E is an image of the resin of FIG. 14B at 150x zoom, according to some implementations;

[0056] FIG. 15A is an image of a side perspective view of a resin with laser-induced photo polymerized objects within the resin, according to some implementations;

[0057] FIG. 15B is an image of a top perspective view of the resin of FIG. 15 A, according to some impl ementati on s,

[0058] FIG. 15C is a backlit image of a top perspective view of the resin of FIG. 15 A, according to some implementations;

[0059] FIG. 16A is an image of a side perspective view of a resin with laser-induced photo polymerized objects within the resin, according to some implementations;

[0060] FIG. 16B is an image of a top perspective view of the resin of FIG. 16A at a 20x zoom, according to some implementation;

[0061] FIG. 16C is an image of a top perspective view' of the resin of FIG. 16 at 50x zoom, according to some implementation;

[0062] FIG. 17 A is an image of a side perspective view of a resin with laser-induced photo polymerized objects within the resin, according to some implementations;

[0063] FIG. 17B is an image of a top perspective view' of the resin of FIG. 17A, according to some implementations;

[0064] FIG. 18 is an image of a top perspective view of a resin with a laser-induced thermal polymerized square object printed below' the surface of the resin, according to some implementation;

[0065] FIG. 19 is an image of a square sheet made of micro-solids within a volume of resin, according to some implementations;

[0066] FIG. 20 is an image of an additive manufacturing system, according to some implementations; and

[0067] FIG. 21 is an image of a laser emitting device directing the focal point of a laser beam into a volume of uncured resin to induce thermal polymerization of the resin at the focal point of the laser beam, according to some implementations.DETAILED DESCRIPTION

[0068] Before turning to the figures, which illustrate the exemplary implementations m detail, it should be understood that the present application is not limited to the details or methodology set forth in the description or illustrated in the figures. It should also be understood that the terminology is for the purpose of description only. Like reference numerals in the figures may represent and refer to the same or similar element, feature, or function.

[0069] As utilized herein, “uncured resin” (i.e., non-cured resin) refers to resin that has not been fully cured.

[0070] Described in detail herein are systems and methods for subsurface laser additive manufacturing (SSLAM). Laser additive manufacturing (LAM), such as stereolithography appearance (SLA) and selective laser sintering, are techniques in which light energy is used to heat or solidify a material to form layers of a 3D object. SLA (i.e., vat photopolymerization, optical fabrication, photo solidification, resin printing) involves the chemical process of photopolymerization, which is the ability to polymerize a substance, utilizing light as the initiator. In SLA, a light source (e.g., an ultra-violet laser, a digital light processing projector, a laser projector, etc.) is directed onto a thin surface layer of a vat of photopolymer resin, and exposure to the concentrated light photochemical ly solidifies the exposed portions of the surface layer onto a build plate. Subsequently, the photochemically solidified layer is covered with a thin layer of uncured photopolymer resin, and the new surface-layer of photopolymer resin is then photochemically solidified onto the previously solidified layer(s).

[0071] However, additive manufacturing poses many technical challenges and can be difficult and burdensome. For example, conventional additive manufacturing may involve burdensome post processing requirements, produce rough surface finishes, warping, and print failures due to a premature release from the build plate.

[0072] The subsurface laser additive manufacturing system and methods described herein provide solutions to these and other technical problems through an additive manufacturing system that facilitates additive manufacturing of 3D objects within an interior of a volume of uncured resin by directing concentrated energy (e.g., laser energy) to subsurface target locations (e.g., points) inside the volume of uncured resin to solidify (cure, polymerize, etc.) the uncured resin at the subsurface target locations. The uncured resin surrounding the solidified portions of the 3D object can provide a support structure that suspends and holds in place the solidified portions of the 3D object within the volume of uncured resin. The printed 3D object can be extracted from the volume of uncured resin. Advantageously, the SSLAM systems and methods described herein provide a user the flexibility to additively manufacture (3D print) a 3D object having enhanced mechanical properties such as surface quality, strength, and structure, without strictly defined layer lines, without a build plate for the part to build from, and without printed print supports (e.g., overhang supports, raft supports, brim supports, etc.) as the cured portions of the 3D object are suspended in and supported by the uncured resin.

[0073] Referring now- to FIGS. 1-5, an additive manufacturing system 100 according to some implementations is illustrated. The additive manufacturing system 100 is configured for subsurface laser additive manufacturing. The additive manufacturing system 100 includes a frame 106, a tank 102, a laser emitting device 112, an actuation system 110, and a controller 200, according to some implementations.

[0074] In some implementations, the frame 106 supports the actuation system 110 and the laser emitting device 112. The frame 106 may include one or more rigid members such as vertical supports and cross beams. In some implementations, the frame 106 may be a cartesian frame providing support to the actuation system 110 and laser emitting device 112 at various cartesian coordinates. In other implementations, the frame 106 may be a coreXY frame, a delta frame, a robotic arm, or combinations thereof

[0075] In some implementations, the additive manufacturing system 100 includes an actuation system 110 coupled between the tank 102 and the laser emitting device 112 to provide relative movement between the laser emitting device 112 and the tank 102. For example, the actuation system 110 may include a first actuator 162 (e.g,, a linear actuator) operably coupled to a firsttransmission 164 (e.g., belt and pully, chain and sprocket, screw, etc.) configured to selectively translate the laser emitting device 112 in a first direction 165 relative to the tank 102 (e.g., an X-direction). The actuation system HO may include a second actuator 166 (e.g., linear actuator) operably coupled to a second transmission 168 configured to translate the laser emitting device 112 in a second direction 169 relative to the tank 102 (e.g., Y-direction). In some implementations, the actuation system 110 may include a third actuator 171 operably coupled to a third transmission 173 configured to selectively translate the laser emitting device 112 in a third direction 175 relative to the tank 102 (e.g., a Z-direction). In some implementations, a fourth actuator 108 is coupled to the laser emitting device 112 and is configured to pivot the laser emitting device 112 relative to the tank 102. It is contemplated that each of the first actuator 162, second actuator 166, third actuator 171, and / or fourth actuator 108 are configured to move the laser emitting device 112 in the same or different directions relative to the tank 102.

[0076] In some implementations, the actuation system 110 is configured to move and position the laser emitting device 112 around the tank 102 such that the tank 102 and resin within the tank remain relatively stationary to one another. Holding the tank 102 relatively stationary during subsurface laser additive manufacturing helps to prevent circulating, agitating, or otherwise disturbing the uncured resin 104 within the tank 102.

[0077] In some implementations, the actuation system 110 is configured to move the tank 102 relative to the laser emitting device 112 and / or the frame 106. For example, the tank 102 may be coupled to a two-axis table (e.g., an x-y table), a three-axis table (e.g., x-y-z table), a four-axis table (e.g., a pivoting x-y-z table), etc., that facilitates relative motion of the tank 102 relative to the laser emitting device 11 and / or frame 106.

[0078] Referring to FIGS. 1-5, according to some implementations, the tank 102 (e.g., vat, container, tub, basin, vile, cup, etc.) defines a contained volume configured to hold a volume of uncured resin 104. In some implementations, the tank 102 is removably coupled to the frame 106 fixing the position of the tank 102 relative to the frame 106. For example, the tank 102 may be mounted on a platform or floor of the frame 106. In some implementations, the tank 102 is rested on a supportive surface in a fixed position relative to the base of the frame 106. For example, as illustrated in FIG. 20, the tank 102 is rested on a supportive surface and the base of the frame 106is also rested on the supportive surface. In some implementations, the tank 102 is open on one side (e.g., an open-top container). In some implementations, the tank 102 includes a base 134 and a sidewall 136 that is at least partially transparent. As described in more details herein, the focused laser beam emitted from the laser emitting device 112 is directed through the open side and / or transparent sidewall 136 of the tank 102. As illustrated in FIG. 11, the tank 102 may be cylindrical and may be capped or covered.

[0079] In some implementations, the laser emitting device 112 is coupled to the frame 106 and is configured to produce a focused laser beam 114. In some implementations, the laser emitting device 112 may produce a laser beam having a focal point 116 a distance from the laser emitting device 112. In some implementations, the laser emitting device 112 includes an actuatable focusing lens (e.g., convex lens) that can adjust the focal length of the focused laser beam 114. In some implementations, the laser emitting device 112 includes a lens with a wide focal angle. The wide focal angle may be used to disperse the energy out through the laser beam’s cross-sectional area, and prevent the non-focal point portions of the laser beam from inducing unwanted polymerization of the uncured resin, according to some implementations.

[0080] Referring to FIGS. 7A-7B, plots of the relative intensities of a gaussian beam and flat top beam. In some implementations, the maximum energy density of the focused laser beam 114 may be calculated according to Equations 1-4:yr * { F cal Point Dia. (mm )2Beam Are aGaussian(cm2) = - -- - 2 * 100 Eqn. 2 n * Focal Point Dia. mm))2“ 800l(mm) * w (mm)Beam AreaSquare(cm2) Eqn. 3Where the beam area of a gaussian beam (FIG. 7A) is calculated according to Equation 2, and the beam area of a flat top beam (FIG. 7B) is calculated according to Equation 3. In some implementations, the laser beam 114 is a gaussian beam. In some implementations, the laser beam 114 is a square beam.

[0081] In some implementations, the laser emitting device 112 is or includes a diode-pumped solid-state laser (DPSSL). For example, the laser emitting device 112 may be or include a diode-pumped neodymium-doped yttrium aluminum garnet (ND: YAG) laser with wavelengths on a nanometer scale. In some implementations, the wavelength of the laser beam 114 is within the visible spectrum. In other implementations, the wavelength of the laser beam 114 is outside of the visible spectrum (e.g., ultra violet, infrared, etc,). In some implementations, the laser emiting device 112 is a 7.5 watt power output (PO), blue (450 ran), square laser with a resolution of 80 micrometers and a repetition rate of 9.9 Hz. In some implementations, the laser emitting device 112 is a 1 wat PO, 532 nm (green), Gaussian laser with a resolution of 20 micrometers and a repetition rate of 3 kHz. In some implementations, the laser emitting device is a 0.7 watt PO, 405 nm, square laser with a resolution of 80 micrometers and a repetition rate of 9.9 Hz. In some implementations, the focal length of the focused laser beam 114 is 43 millimeters (mm), or 106 millimeters (mtn). In some implementations, the focal length of the laser is variable. For example, the focal length of the laser may be variable between 43 millimeters and 106 millimeters. Example specifications of the laser emitting device 112 are tabulated in Table 1.Table 1: Example Laser Specifications

[0082] Although diode pumped lasers with wavelengths in the nanometer scale are shown in FIG. I, the laser emitting device 112 may be or include other lasers (e.g., gas lasers such as CO2 lasers, fiber lasers, liquid lasers, etc.).

[0083] Referring to FIGS. 1-5, the additive manufacturing system 100 includes a second laser emitting device 150 configured to produce a second focused laser beam 152 including a second focal point 154, according to some implementations. The second laser emitting device 150 may include some or all of the functions and features described with respect to the laser emitting device 112. For example, the second laser emitting device 150 may produce a second focused laser beam 152 defining a second focal point 154, and / or may be or include a DPSSL.

[0084] Referring to FIG. 1, according to some implementations, the second focused laser beam 152 may pass through a sidewall 136 of the tank 102. For example, the sidewall 136 may be made of an optically permissive material (e.g., glass), and the converging portion of the second focused laser beam 152 may pass through the optically permissive material of the sidewall 136. In some implementations, the second focused laser beam 152 may pass through a glass window in the sidewall 136 of the tank 102 and then into the contained volume of the tank 102. Although the second focused laser beam 152 is illustrated as extending linearly through the sidewall 136 to the volume of uncured resin 104, the second focused laser beam 152 may refract as it passes between two isotopic mediums (e.g., isotopic medium of the tank 102, isotropic medium(s) of uncured resin 104, isotropic medium of air ambient to the tank 102, etc.). The present additive manufacturing system 100 can account for the refraction to ensure that the focal point 116 of the laser beam 114 is placed onto the target locations within the uncured resin 104. In some implementations, the additive manufacturing system 100 may estimate the path of the first laser beam 114 and / or the second focused laser beam 152 based on Snell’s Law. For example, the additive manufacturing system 100 may calculate the refractions of the laser beam as the beam passes through the outer boundary' of the sidewall 136, (e.g., air to wall) then the inner boundary of the sidewall 136 (e.g., wall to uncured resin).

[0085] In some implementations, the second focused laser beam 152 may intersect with the first focused laser beam 114 within the volume of the tank 102 and solidify the localized portion 120 of the uncured resin 104 at the intersection of the beams. In some implementations, the additivemanufacturing system 100 may direct one or more focal points (e.g., focal point 116, focal point 154) of one or more laser beams (e.g., first focused laser beam 114, second focused laser beam 152), to the same target location within the volume of uncured resin to solidify the uncured resin at the target location (e.g., the local portion 120). Directing multiple focused laser beams with multiple focal points to a single target location allows for lower energy of the respective beams, which can prevent inadvertent curing of the uncured resin 104 along the non-focal point portions of an individual beam, but while still delivering the dose of laser energy to the target location to cure the resin at the target location.

[0086] In some implementations, the actuation system 110 pivots the focused laser beam 114 about the focal point 116 while the focal point 116 is held at the target location to cure the uncured resin at the target location. Pivoting the focused laser beam 114 about the focal point 116 can reduce the amount of energy delivered to the uncured resin at the non-focal point portions of the beam (e.g., the converging portion and the diverging portion of the beam). Reducing the amount of energy delivered to the uncured resin at the non-focal point portions of the beam can prevent the uncured resin at the non-focal point portions of the beam from being inadvertently cured. For example, the actuation system 110 may pivot the focused laser beam 114 around the focal point 116 while the laser emitting device 112 discharges a dose of laser energy to the target location. In this example, the target location may receive laser energy for the full time duration of the dose, while the surrounding uncured resin receives laser energy for a lesser period of time than at the target location because the beam travels during the dose, except for at the target location.

[0087] Referring to FIGS. 1-5, according to some implementations, the additive manufacturing system 100 includes a chamber 130 sized to receive the tank 102. The chamber 130 may include one or more sidewalls that define an internal volume. In some implementations, the chamber 130 is sized to receive the laser emitting device 11, actuation system 110, tank 102, and frame 106. In some implementations, the chamber 130 is or includes a pressure chamber (e.g,, a vacuum chamber, a negative pressure chamber, a positive pressure chamber, etc.). The pressure chamber can provide a positive or negative pressure to adjust the behavior of the uncured resin during polymerization. For example, the uncured resin (e.g., the initiators of the uncured resin) may be pressure-sensitive and may become more easily activated under higher or lower atmospheric conditions, or under changing atmospheric conditions.

[0088] In some implementations, the chamber 130 facilitates a climate controlled environment to enhance the resin curing process. For example, the chamber 130 may include a heating device 132, a cooling device, a ventilating device, a humidity control device, and / or a pressure control device. The heating device 132 may be configured to heat the contents of the chamber 130 and / or the uncured resin 104. For example, the heating device 132 may be a conductive heating device (e.g., a heating pad), a convective heating device (e.g., a hot air blower), or a radiative heating device (e.g., a radiator), or a combination thereof. In some implementations, the chamber 130 includes a fan or blower configured to circulate gas (e.g., air) within the chamber 130 and / or heat the uncured resin 104 via forced convection. In some implementations, the chamber 130 includes one or more air temperature sensors and one or more resin temperature sensors configured to detect the temperature of the uncured resin.

[0089] As described herein, the temperature of the tank 102 and / or resin can be controlled to a threshold temperature. For example, in some implementations, the heating device 132 is configured to heat the tank 102 and / or the resin to the threshold temperature. Similarly, in some implementations, the cooling device is configured to cool the tank 102 and / or resin to the threshold temperature. In some implementations, the threshold temperature is a temperature value below the solidification temperature of the uncured resin, where the laser energy at the focal point 116 is sufficient to elevate the temperature of a small, localized volume of uncured resin at the focal point 116 to a temperature above the solidification temperature. In some implementations, the resin is heated to a threshold temperature and held at the threshold temperature to partially cure the uncured resin and transition the resin from a liquid into a semi-solid (e.g., gel). In the present implementation, it has been found that a partially cured resin can avoid vigorous convections within the resin during printing. In some implementations, the uncured resin 104 is partially cured in the chamber 130, and / or in an oven. In some implementations, the uncured resin 104 may be sealed within the tank 102 during the partial curing process to reduce or promote off-gassing that occurs during the curing process. In some implementations, the volume of uncured resin 104 is homogenous prior to the solidification of the initial target location of a 3D print. In some implementations, the surface of the uncured resin 104 is smooth.

[0090] In some implementations, the uncured resin 104 may be self supporting. For example, the uncured resin 104 may be partially cured (gehfied) to the point that it is self-supporting, whileremaining uncured. In some implementations, self-supporting uncured resin 104 may be provided without a tank 102. For example, uncured resin 104 may be partially cured in a mold, and then released from the mold and placed on a surface without being within a tank 102. One or more 3D objects may be printed into the molded self-supporting uncured resin 104 and the one or more 3D objects may be retrieved from the self-supporting uncured resin 104. In some implementations, the self-supporting uncured resin 104 may be provided in a rectangular box shape, a dome shape, a cylindrical shape, a triangular shape, a spherical shape, or combinations thereof. The particular shapes of the self-supporting uncured resin 104 may be associated with particular printing profiles (e.g., sets of printing rules) that modify the print instructions according to the shape of the self-supporting uncured resin 104. A self-supporting uncured resin 104, provided without a tank 102, can allow the second focused laser beam 152 to access the uncured resin 104 without passing through a sidewall 136 of the tank 102, which can avoid possible refractions or diffusion that may occur when passing a laser beam through the sidewall 136. The printed 3D objects may be more easily retrieved from a stand-alone self-supporting uncured resin 104 as the stand-alone self-supporting uncured resin 104 is easily broken apart while not confined by the tank 102.

[0091] Referring to FIG. 1, a schematic diagram of the controller 200 is shown according to an example implementation. As shown in FIG. 1, the controller 200 includes a processing circuit having a processor 202 and a memory’ device 204, a control system 206 having a printing circuit 208 and an environmental control circuit 210, and a communications interface 212 including a user interface 214. Generally, the controller 200 is structured to operate the laser emitting devices (e.g., laser emitting device 112, laser emitting device 150), actuation system 110, and climate control devices (e.g., heating device 132). In some implementations, the controller 200 is structured to direct the focal point 116 of the laser beam 114 to various target locati ons within the resin based on print information. In some implementations, the print information may be or include a 3D CAD object, and the controller 200 may determine a sequence of target locations and corresponding laser operations for printing the 3D CAD object into the uncured resin 104. In some implementations, the controller 200 may determine a sequence of operations according to one or more printing rules or printing preferences.

[0092] In one configuration, the circuits of the control system 206 are in the form of machine or computer-readable media that is executable by a processor, such as processor 202. The machme-readable media facilitates performance of operations to enable reception and transmission of data. For example, the machine-readable media may provide an instruction (e.g., command, etc.) to acquire data. The computer readable program code may be executed on one processor, multiple co-located processors, multiple remote processors, or any combination of local and remote processors. Remote processors may be connected to each other through any type of network (e.g., CAN bus, etc.).

[0093] In another configuration, the circuits of the control system 206 are implemented as hardware units, such as electronic control units. As such, the circuits of the control system 206 may be implemented as one or more circuitry components including, but not limited to, processing circuitry, network interfaces, peripheral devices, input devices, output devices, sensors, etc. In some implementations, the circuits of the control system 206 may take the form of one or more analog circuits, electronic circuits (e.g., integrated circuits (IC), discrete circuits, system on a chip (SOCs) circuits, microcontrollers, etc.), telecommunication circuits, hybrid circuits, and any other type of “circuit.” For example, a circuit as described herein may include one or more transistors, logic gates (e.g., NAND, AND, NOR, OR, XOR, NOT, XNOR, etc.), resistors, multiplexers, registers, capacitors, inductors, diodes, wiring, and so on). The circuits of the control system 206 may also include programmable hardware devices such as field programmable gate arrays, programmable array logic, programmable logic devices or the like. The circuits of the control system 206 may include one or more memory devices for storing instructions that are executable by the processor(s) of the circuits of the control system 206. In some hardware unit configurations, the circuits of the control system 206 may be geographically dispersed throughout separate locations. Alternatively, and as shown, the circuits of the control system 206 may be implemented in or within a single unit / housing, which is shown as the controller 200. In some implementations, the controller 200 is coupled to the frame 106. In some implementations, the user interface 214 is coupled to the frame 106.

[0094] In the example shown, the controller 200 includes the processing circuit having the processor 202 and the memory device 204, The processing circuit may be structured or configured to execute or implement the instructions, commands, and / or control processes described herein with respect to the circuits of the control system 206. The depicted configuration represents the circuits of the control system 206 as machine or computer-readable media. However, as mentionedabove, this illustration is not meant to be limiting as the present disclosure contemplates other implementations where the circuits of the control system 206, or at least one circuit of the circuits of the control system 206, is configured as a hardware unit. All such combinations and variations are intended to fall within the scope of the present disclosure.

[0095] The hardware and data processing components used to implement the various processes, operations, illustrative logics, logical blocks, modules and circuits described in connection with the implementations disclosed herein (e.g., the processor 202) may be implemented or performed with a general purpose single- or multi-chip processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, or, any conventional processor, or state machine. A processor also may be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.

[0096] The memory device 204 (e.g., memory, memory unit, storage device) may include one or more devices (e.g., RAM, ROM, Flash memory; hard disk storage) for storing data and / or computer code for completing or facilitating the various processes, layers and modules described in the present disclosure. The memory device 204 may be communicably connected to the processor 202 to provide computer code or instructions to the processor 202 for executing at least some of the processes described herein. Moreover, the memory device 204 may be or include tangible, non-transient volatile memory or non-volatile memory. Accordingly, the memory device 204 may include database components, object code components, script components, or any other type of information structure for supporting the various activities and information structures described herein.

[0097] In so e implementations, the printing circuit 208 is structured to receive print information regarding a three-dimensional object to be printed into the volume of the tank 102. The printing circuit 208 can then operate the actuation system 110 based on the print information to move the laser emiting device 112 relative to the tank 102 so that the focal point 116 of the focused laserbeam 114 moves within the volume of the tank 102 and / or operate the focused laser beam 114 based on the print information, so that movement of the focal point 116 of the focused laser beam 114 inside the volume of the tank 102 energizes a local portion 120 of uncured resin 104 to solidify the local portion 120 of the uncured resin 104 and to thereby additively manufacture the three-dimensional object. In some implementations, the printing circuit 208 operates the focused laser beam 114 to print a first portion of the three-dimensional object based on the print information, and also operate the second focused laser beam 152 to print a second portion of the three-dimensional object based on the print information. In some implementations, the printing circuit 208 operates the focused laser beam 114 and the second focused laser beam 152 simultaneously based on the print information. In some implementations, the printing circuit 208 is configured to direct the focal point 154 of the second focused laser beam 152 into the contained volume of the tank 102 based on the print information.

[0098] In some implementations, the printing circuit 208 coordinates the operations of the laser emitting device 112 and the laser emitting device 150. In some implementations, the printing circuit 208 is configured to slice the 3D CAD model in a first direction according to the position or range of motion of the first laser emitting device 112, and a second direction according to the position or range of motion of the second laser emitting device 150. In some implementations, the print layers of the 3D object are planar. In other implementations, the print layers are non-planar and may be 3D surfaces that account for the range of motion of the laser emitting device 112 and the reach of the focal point 116. For example, the print layers may concave and / or convex and be nested within each other, according to the print instructions. In some implementations, the 3D object is sliced based on incremental distances (e.g,, radii) relative to the lens of the second laser emitting device 150, For example, in terms of a spherical coordinate system, a first layer may be within the surface area of a first sphere, and the second layer may be within the surface area of a second sphere nested within the first sphere. The layer area and layer shape within the spherical surface area maps the solid body of the 3D object. The 3D printer may fully print the first, print layer prior to printing the second print layer. In some implementations, the print layers are surfaces within the spherical surface, where the origin of the spherical coordinate system is located at a point within the tank 102, and / or within the 3D object. In some implementations, the 3D CAD object may be sliced in a first direction to accommodate the reach of the focal point. 116 of the focused laser beam 114 and sliced in a second direction to accommodate the reach of the focalpoint 154 of the second focused iaser beam 152. In some implementations, the printing circuit 208 may direct the second focused laser beam 152 to cure distal target locations prior to proximal target locations to ensure that the proximal target locations, when cured, do not obstruct a line of sight between the second laser emitting device 150 and the subsequent target locations. In some implementations, the printing circuit 208 may determine a sequence of target locations that cures the innermost portions of a 3D object prior to the outermost portions of the 3D object, as the outermost portions, when cured, may block or interfere with a line of sight to the innermost portions of the 3D object.

[0099] In some implementations, the environmental control circuit 210 is structured to enhance the environment local to the tank 102. For example, the environmental control circuit 210 may operate the heating device 132 to elevate the temperature of the air surrounding the tank 102 and / or the resin within the tank 102. The environmental control circuit 210 may receive sensor data (e.g., temperature data, humidity data, pressure data) and selectively operate one or more environmental control devices (e.g., humidifier, dehumidifier, heater, cooler, etc.) to maintain a predetermined environmental condition based on the received sensor data.

[0100] While various circuits with particular functionality are shown in FIG. 1, it should be understood that the controller 200 may include any number of circuits for completing the functions described herein. For example, the activities and functionalities of the circuits of the control system 206 may be combined in multiple circuits or as a single circuit. Additional circuits with additional functionality’ may also be included. Further, the controller 200 may further control other activity’ beyond the scope of the present disclosure.

[0101] As mentioned above and in one configuration, the “circuits” may be implemented in machine-readable medium for execution by’ various types of processors, such as the processor 202 of FIG. 1. An identified circuit of executable code may, for instance, comprise one or more physical or logical blocks of computer instructions, which may, for instance, be organized as an object, procedure, or function. Nevertheless, the executables of an identified circuit need not be physically located together, but may comprise disparate instructions stored in different locations which, when joined logically together, comprise the circuit and achieve the stated purpose for the circuit. Indeed, a circuit of computer readable program code may be a single instruction, or manyinstructions, and may even be distributed over several different code segments, among different programs, and across several memory devices. Similarly, operational data may be identified and illustrated herein within circuits, and may be implemented in any suitable form and organized within any suitable type of data structure. The operational data may be collected as a single data set, or may be distributed over different locations including over different storage devices, and may exist, at least partially, merely as electronic signals on a system or network.

[0102] Referring to FIGS. 1-5, during operation, the three-dimensional object is stationary relative to the tank 102 and is encased by the uncured resin 104. As illustrated in FIG. 2, a first print layer 160 of the three-dimensional object is at a first print depth 163 of the volume of the tank 102, and a second print layer 161 of the three-dimensional object is at a second print depth 167 less than the first print depth 163 and below the surface 105 of the uncured resin 104, according to some implementations. In some implementations, the second print layer 161 is the final print layer of the 3D object. In some implementations, the 3D object is fixed in place relative to the tank 102 during printing, and the completed 3D object may be surrounded on all sides by uncured resin 104 during printing. In some implementations, the volume of uncured resin 104 may be liquid, semiliquid, or semisolid, and may surround the cured portions of the three-dimensional object. In some implementations, upon the completion of printing the 3D object, the three-dimensional object is retrieved from the uncured resm 104, and the uncured resin is removed (e.g., washed off) the surfaces of the completed 3D object.

[0103] Referring to FIGS. 8-10, the example resm includes a base bio-resin including tung oil and two co-monomers combined with a chemical initiator, according to some implementations. To start the chemical reaction of the resin polymerization, an initiator is activated by a form of energy, such as thermal energy or photonic energy. Using a laser to provide the energy to activate a resin’s initiator to accomplish resin polymerization is usually seen as impractical as the energy emitted is very localized and short-lasting compared to an oven or lamp that can encapsulate the resin in a large energy gradient, activating a large quantity of initiator molecules in a short amount of time. However, the present disclosure provides that the preciseness of the laser’s energy emission can be beneficial for subsurface laser additive manufacturing as the precision of the beam can target and solidify specific molecules of resin at target locations within the container of resin.

[0104] In some implementations, the uncured resin 104 is configured to resist natural convection within the tank 102 during printing. For example, the uncured resin may be a semi-liquid or semisolid (e.g., gelatinous, viscoelastic, etc.). In some implementations, the uncured resin 104 supports the cured portion 140 of a three-dimensional object while the 3D object is being printed into the uncured resin 104.

[0105] In some implementations, the uncured resin 104 includes a tung oil bio-resin. For example, the uncured resin may be greater than or equal to 50% (w / w) Tung Oil, C57H92O6. In some implementations, the uncured resin 104 includes Tung Oil C57H92O6, Butyl Methacrylate (BMA) C₈H₁₄O₂, and Divinylbenzene (DVB) C10H10. In some implementations, the uncured resin is 50% (w / w) Tung Oil C57H92O6, 30% (w / w) Butyl Methacrylate (BMA) C₈H₁₄O₂, and 20% (w / w) Divinylbenzene (DVB) C10H10. In some implementations, the composition of the bio-resin is as shown in Table 2.Table 2: Example Bio-Resin Ingredients

[0106] In some implementations, the uncured resin includes a resin base (e.g., synthetic resin, bioresin, tung oil, butyl methacrylate, divinylbenzene, etc.) and one or more initiators (e.g., thermal initiators, photo initiators, etc.). In some implementations, the resin is cured via thermal initiator polymerization and / or photo initiator polymerization.

[0107] As utilized herein, a “photo initiator” is any chemical initiator that is excited by light energy. Photo initiators are generally categorized by their peak wavelength absorbance value; as the more energy that can be absorbed by the chemical initiator leads to easier activation of the chemical process. In some implementations, the photoinitiator is a visible light photo initiator. In some implementations, the photo initiator is or includes Eosin Y The present inventors have foundthat Eosin Y has a wide range of wavelength absorbance and can be effective for polymerization initiation in subsurface target locations. Eosin Y is a Type II initiator, so it may be provided with a co-initiator, such as triethylamine. In this example. Eosin Y may be the energy absorbent chemical, and the triethylamine is the electron sharing chemical that allows the chemical reaction to take place.

[0108] A thermal initiator can initiate the chain reaction for polymerization. Thermal initiators are activated by thermal energy (e.g., heat). In some implementations, the thermal initiator may allow the focal point 116 of the laser to be the point in the laser beam path where enough energy is transferred to activate the thermal initiator and start the resin polymerization. In some implementations, the laser beam 114 is configured to provide energy to heat the uncured resin 104 and activate the thermal imtiator(s) at the focal point 116 of the beam 114.

[0109] In some implementations, the uncured resin 104 includes an initiator that is or includes Ditert-butyl Peroxide (DTBP) C₈H₁₈O₂. In some implementations, the initiator is at least one of Diphenyl (2,4,6-Trimethylbenzoyl) Phosphine Oxide (TPO), C₂₂H₂₁O₂P, and Eosin Y, C₂₀H₈Br₄O₅. In some implementations, the uncured resin is 5% (w / w) an initiator. In some implementations, the initiator is one or more of the initiators shown in Table 3.Table 3: Example Initiators

[0110] In some implementations, different percentages of thermal initiator, photo initiator and a combination are mixed with the base resin. In some implementations, the percentage values consist of the following: 5% thermal, 10% thermal, 5% photo, 10% photo, and a combination of5% thermal + 5% photo. In some implementations, the resin includes a mixture percentage of thermal initiator and / or photo initiator between 0% (w / w) and approximately 10% (w / w).

[0111] In some implementations, the uncured resin 104 includes an additive for enhancing laser energy absorbance of the uncured resin 104.. Additives may be used to enhance the behavior of the resin during and / or after polymerization. For example, additives can be used to create specific visual characteristics in the uncured resin 104 or raise the absorbance value of the resin itself. In some implementations, the additives may increase the energy absorbance as well as shift the wavelength sensitivity of the uncured resin 104. FIG. 1 IB illustrates a plot of absorbance over a range of wavelengths of a bio-resin having a composition as shown in Table 2 with a with a 5% mixture percentage (w / w) of DTB.

[0112] In some implementations, the resin 104 includes a pigment that is compatible with the base material (e.g., the bio-resin and initiators). The present inventors have found that pigment additives can enhance the resin’s laser energy absorbance value. In some implementations, the additives are oil-soluble pigments that interact with the resin and the energy of the laser beam 114. In some implementations, the wavelength of the pigment additive is selected based on the wavelength of the laser emitting device 112. For example, the pigment additive may be the laser’s complimentary color using the RYB color wheel. In a specific and nonlimiting example, if the focused laser beam 114 is a green laser (e.g., the 532 nm Nd: YAG laser in Table 1), which has a visible color of green, a pigment additive color of blue-violet may be added and thereby increase the absorptivity of the resin at the green laser’s wavelength.

[0113] In some implementations, the base resin, thermal initiators, photo initiators, and additives are translucent or transparent when combined together. In some implementations, the uncured resin 104 has a translucent nature. In some implementations, the resin includes a small quantity, (e.g., 0.00025% (wt.)) of a pigment color additive.

[0114] In some implementations, the additive is or includes Titanium Dioxide (TiOz). Titanium Dioxide may raise the resin’s laser energy absorbance value. Increasing the resin’s laser energy absorbance value for the wavelength of the laser allows the resin to absorb the laser energy more quickly, which can improve curing efficiency and lower the possibility of thermal energy expansion into molecules adjacent to the target location. In some implementations, the uncuredresin 104 is configured to restrict thermal propagation. In some implementations, the initiator is at least one of a thermal initiator and a photoinitiator, and the resin includes a pigment configured to increase the laser energy absorptivity at a wavelength of the focused laser beam 114.

[0115] In some implementations, the uncured resin 104 is configured to absorb enough laser energy in the correct wavelength to activate the initiators to polymerize the uncured resin; but not too absorbent where the entire laser beam path of resin 104 is cured. In some implementations, the uncured resin 104 and laser pairing are configured to cure a focal point of resin in a fraction of a second without all the uncured resin 104 around the focal point area to also curing.

[0116] In some implementations, the uncured resin 104 includes a polymerization catalyst.

[0117] Referring to FIG. 6, a flowchart of a process 300 for subsurface laser additive man facturing (SSLAM) is shown, according to an exemplary implementation. The process 300 can be performed using the additive manufacturing system 100 and the controller 200. In some implementations, the process 300 begins with a step 302.

[0118] In step 302, according to some implementations, the process 300 includes obtaining a subsurface laser additive manufacturing system. For example, the step 302 may include obtaining an additive manufacturing system 100. In some implementations, the additive manufacturing system 100 is provided as part of a kit. In some implementations, the process 300 continues with a step 304.

[0119] In step 304, according to some implementations, the process 300 includes obtaining print instructions regarding a 3D object to be printed. In some implementations, the controller 200 receives print information regarding a three-dimensional object to be printed into a volume of uncured resin 104. For example, the printing circuit 208 may receive a 3D CAD model and output instructions for operating the actuation system 110 and laser emitting device 112 to print the 3D CAD model into the uncured resin 104. In some implementations, the printing circuit 208 develops a 3D map for printing the 3D model. For example, the 3D map may be based on a 3D mesh of the 3D model. The 3D map may designate a 3D coordinate for each target point of the 3D model. In some implementations, the 3D map may designate a laser energy intensity for each target point in the 3D map. Changing the energy intensity of the laser applied to the target point may change thesize of the micro-solid (e.g., cured target location) formed at the focal point 116 of the laser. In some implementations, the energy intensity varies between target points in the 3D map. In some implementations, the process 300 continues with a step 306.

[0120] In step 306, according to some implementations, the process 300 includes heating a tank of uncured resin to a threshold temperature. For example, the controller 200 may operate the heating device 132 based on the print information to heat the volume of uncured resin 104 to a threshold temperature. In some implementations, the uncured resin 104 is heated to partially cure the resin from a liquid into a semisolid (e.g., gel). In some implementations, the environmental control circuit 210 is configured to enhance the environmental conditions within the chamber 130. In some implementations, the process 300 continues with a step 308.

[0121] In step 308, according to some implementations, the process 300 includes directing a laser’s focal point into the uncured resin 104. For example, the controller 200 may operate the laser emitting device 112 based on the print information to position the focal point 116 of the focused laser beam 114 to a first sub-surface localized portion 120 of the volume of uncured resin 104. In some implementations, step 308 includes operating the actuation system 110 to position the laser emitting device 112 around the tank 102. In some implementations, the process 300 continues with a step 310.

[0122] In step 310, according to some implementations, the process 300 includes operating the laser to cure the uncured resin 104 at the focal point of the laser and below the surface of the uncured resin 104. For example, the controller 200 may operate the laser emitting device 112 to solidify the first sub-surface localized portion 120 (e.g., target location) of the volume of uncured resin 104 to thereby create a solidified first sub-surface portion 140. For example, the focal point 116 of the focused laser beam 114 may be directed onto the first sub-surface localized portion 120, which may cure the first sub-surface localized portion 120 via laser induced thermal polymerization. In some implementations, the process 300 continues with a step 312.

[0123] In step 312, according to some implementations, the process 300 includes repositioning the laser’s focal point based on the print instructions and repeating step 310. For example, the controller 200 may operate, based on the print information, the laser emitting device 112 to position the focal point 116 of the focused laser beam 114 to a second sub-surface localized portion 170 ofthe volume of uncured resin 104 different than the first sub-surface localized portion 120. For example, after repositioning the laser’s focal point to a second sub-surface localized portion 170, the controller 200 may operate the laser emitting device 112 to solidify the second sub-surface localized portion 170 to thereby create a solidified second sub-surface portion 172. In some implementations, the step 312 and step 310 may be repeated according to the print instructions or until a stop condition is detected (e.g., an emergency stop button is triggered, a safety switch is tripped, an environment sensor detects an environmental condition such as a fire or poor air quality). In some implementations, the first sub-surface localized portion 120 is adjacent to the second sub-surface localized portion.

[0124] In some implementations, the printing circuit 208 may operate the laser 114 to jump the focal point 116 between different target locations during printing, and later join the cured portions by curing bridging target locations, according to the print instructions.

[0125] In some implementations, the printing circuit 208 is configured to direct the laser emitting device 112 to create a large quantity (e.g., hundreds, thousands, etc.) of micro-solids inside the volume of uncured resin 104. In some implementations, the micro-solids have a diameter of approximately 20 --- 30 pm. In some implementations, the micro-solids may be combined in a body-centered cubic lattice structure to form the 3D object. In some implementations, the laser is directed to a design area of a 3D object to enhance dot- propagation in a particular design area of the 3D object, according to the print instructions.

[0126] In some implementations, the additive manufacturing system 100 can work in the X-Y-Z ranges universally within the laser scanning region, instead of being locked onto one X-Y plane before transitioning to the next: as well as being able to create a BCC lattice structure with microsolid points via offsetting the n+1 layer in the X-Y to ultimately create vertical, horizontal, and diagonal propagation through the final solid part.

[0127] In some implementations, the printing circuit 208 is configured to move the focal point 116 of the laser beam 114 along a path between one or more target points in the 3D map, within the uncured resin 104, to cure the uncured resin 104 along the path.

[0128] In some implementations, the solidified first sub-surface portion 140 and the solidified second sub-surface portion 172 define a unitary body 176, and the unitary body 176 is suspended within the volume of uncured resin 104. In some implementations, the process 300 continues with a step 314.

[0129] In step 314, according to some implementations, the process 300 includes retrieving the printed 3D object from the uncured resin 104. For example, the solid 3D object(s) may be retrieved from the volume of uncured resin 104 by a user, or by a retrieval system such as a resin strainer and / or a resin drainage system. As illustrated in FIG. 5, the additive manufacturing system 100 can print multiple 3D objects (e.g., cube 178, unitary body 176) into a single volume of uncured resin 104. In some implementations, step 314 includes removing the multiple 3D objects from the remaining uncured resin 104. In some implementations, the process 300 continues with a step 316.

[0130] In step 316, according to some implementations, the process 300 includes removing the uncured resin 104 from the retrieved printed 3D object. For example, the uncured resin 104 may be washed off or brushed off the surfaces of the cured resin of the 3D object. In some implementations, the uncured resin 104 may be removed with a solvent and / or detergent. In some implementations, the washed-off uncured resin is recycled by returning the uncured resin to the volume of uncured resin 104. In some implementations, the process 300 concludes with a step 316.

[0131] In some implementations, the process 300 is repeated one or more times. The process 300 may be performed by multiple SSLAM systems. For example, the multiple SSLAM systems may be linked by a master controller. The multiple SSLAM systems may perform one or more steps of the process 300 concurrently. For example, the multiple SSLAM systems may coordinate operations or schedule operations to control or avoid spikes in energy consumption. For example, the controller 200 may selectively operate energy drawing devices to reduce peak energy consumption. In some implementations, the additive manufacturing system 100 includes multiple laser emitting devices 112, and each of the multiple laser emiting devices 112 may be configured to print duplicate or unique 3D objects into a communal vat of uncured resin 104.Experimental Data:

[0132] Referring to FIGS. 12A-12E, a bio-resin according to Table 2 mixed with 5% DBT (wt.) was exposed to the 450 nm Laser of Table 1 according to the conditions shown in Tables 4 and 5.Table 4: 450 nm Laser Settings and Calculations used for Vial 450-2Table 5: 450 nm Laser Settings and Calculations used for Vial 450-2 (FP 83 / 17)

[0133] Referring to FIGS. 13A-13D, a bio-resin according to Table 2 was exposed to the 450 nm Laser of Table 1 according to the conditions shown in Table 6.Table 6: 450 nm Laser Settings and Calculations used for 0.08 mm Lens Equiv. Settings, Top

[0134] Referring to FIGS. 14A-14E, a bio-resin according to Table 2 was exposed to the 450 nm Laser of Table 1 according to the conditions shown in Table 7.Table 7: 450 nm Laser Settings and Calculations used for 0,08 mm Lens Equiv. Setings

[0135] Referring to FIGS. 15A-15C, a bio-resin according to Table 2 was exposed to the 450 nm Laser of Table 1 according to the conditions shown in Table 8.Table 8: 450 nm Laser Settings and Calculations used for 0.08 mm Lens Equiv. Settings

[0136] Referring to FIGS. 16A-16C, a bio-resin according to Table 2 was exposed to the 405 nm Laser of Table 1 according to the conditions shown in Table 9. In FIGS. 16B-16C, the resin was exposed to a 14thcycle, during which the resin was burned.Table 9: 405 nm Top Surface Laser Settings and Calculations; Max Power Settings with Green #7 Additive

[0137] Referring to FIGS. 17A-17B, a bio-resin according to Table 2 was exposed to the 405 nm Laser of Table 1 according to the conditions shown in Table 10.Table 10: 405 nm (FP 83 / 17) Laser Settings and Calculations; Max Power Settings with Green #7 Dye

[0138] Referring to FIGS. 18 and 21, a semi-solid gelled bio-resin includes a sub-surface 5 mm22D sheet within the resin, that was cured via laser induced polymerization at the focal point 116 of the laser beam 114.

[0139] Referring to FIG. 19, a square sheet 250 made of tightly packed micro-solids 252 is suspended within a volume of semi-solid bio-resin 104, according to some implementations. In some implementations, the grid squares measure approximately 250 μm.

[0140] Referring to FIG. 20, an additive manufacturing system 400 is shown, according to some implementations. The additive manufacturing system 400 may include some or all of the features and functions of the additive manufacturing system 100. In some implementations, the additive manufacturing system 400 includes a controller 200, a laser emitting device 112, a frame 106, a tank 102, and a user interface 214.Exemplary Aspects:

[0141] Example 1. An additive manufacturing system comprising: a frame; a tank coupled to the frame and defining a volume configured to hold uncured resin; a laser emitting device coupled to the frame and configured to produce a focused laser beam defining a focal point; an actuation system coupled between the tank and the laser emitting device to provide relative movement between the laser emitting device and the tank; and a controller including a processor and a memory storing instructions thereon that, when executed by the processor, cause the controller to: receive print information regarding a three-dimensional object to be printed into the volume of the tank; operate the actuation system based on the print information to move the laser emitting device relative to the tank so that the focal point of the focused laser beam moves within the volume ofthe tank; and operate the focused laser beam based on the print information, so that movement of the focal point of the focused laser beam inside the volume of the tank energizes a local portion of uncured resin to polymerize the local portion of the uncured resin and to thereby additively manufacture the three-dimensional object.

[0142] Example 2. The additive manufacturing system according to any example herein, particularly example clause 1, further comprising: a chamber sized to receive the tank and including a heating device configured to heat the volume of the tank to a threshold temperature.

[0143] Example 3. The additive manufacturing system according to any example herein, particularly examples 1-2, wherein the tank includes a base and a sidewall that is at least partially transparent.

[0144] Example 4. The additive manufacturing system according to any example herein, particularly examples 1-3, further comprising the uncured resin, and wherein the uncured resin includes a bio-resin.

[0145] Example 5. The additive manufacturing system according to any example herein, particularly examples 1-4, wherein the uncured resin comprises Tung Oil C57H92O6, Butyl Methacrylate C8H14O2, and Divinylbenzene C10H10.

[0146] Example 6. The additive manufacturing system according to any example herein, particularly examples 1-5, further comprising the uncured resin, wherein the uncured resin is semisolid and inhibits natural convection, and wherein the semisolid uncured resin supports a solidified portion of the three-dimensional object formed within the uncured resin.

[0147] Example 7. The additive manufacturing system according to any example herein, particularly examples 1-6, further comprising the uncured resin, and wherein the uncured resin comprises an initiator.

[0148] Example 8. The additive manufacturing system according to any example herein, particularly example 7, wherein the initiator comprises Di-tert-butyl Peroxide C8H18O2.

[0149] Example 9. The additive manufacturing system according to any example herein, particularly examples 7-8, wherein the initiator is at least one of Diphenyl Phosphine Oxide C22H21O2P, and Eosin Y C20H8Br4O5.

[0150] Example 10. The additive manufacturing system according to any example herein, particularly examples 7-9, wherein the initiator is at least one of a thermal initiator and a photoinitiator, and wherein the uncured resin includes a pigment configured to absorb laser energy at a wavelength of the focused laser beam.

[0151] Example 11. The additive manufacturing system according to any example herein, particularly examples 1-7, wherein the laser emitting device includes a diode-pumped solid-state laser (DPSSL).

[0152] Clause 12. The additive manufacturing system according to any example herein, particularly example 11, wherein the DPSSL is a diode-pumped neodymium -doped yttrium aluminum garnet (ND: YAG) laser with wavelengths in on a nanometer scale.

[0153] Example 13. The additive manufacturing system according to any example herein, particularly examples 1-12, further comprising a second laser emitting device configured to emit a second focused laser beam defining a second focal point, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to: direct the second laser beam into the volume of the tank based on the print information.

[0154] Example 14. The additive manufacturing system according to any example herein, particularly example 13, wherein the second focused laser beam passes through a sidewall of the tank.

[0155] Example 15. The additive manufacturing system according to any example herein, particularly example 13, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to direct the focused laser beam and the second focused laser beam to intersect within the volume of the tank based on the print information.

[0156] Example 16. The additive manufacturing system according to any example herein, particularly examples 14-15, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to: operate the focused laser beam to print a first portion of the three-dimensional object based on the print instructions; and operate the second laser beam to print a second portion of the three-dimensional object based on the print information.

[0157] Example 17. The additive manufacturing system according to any example herein, particularly examples 14-16, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to: operate the focused laser beam and the second laser beam simultaneously based on the print information.

[0158] Example 18. The additive manufacturing system according to any example herein, particularly examples 14-17, wherein a first print layer of the three-dimensional object is at a first print depth of the volume of the tank, and a final print layer of the three-dimensional object is at a second print depth less than the first print depth and below a surface of the uncured resin.

[0159] Example 19. An additive manufacturing system, comprising: a tank configured to contain a volume of uncured resin; a chamber housing the tank and including a heating device; a laser emitting device configured to selectively produce a focused laser beam defining a focal point; and a controller including a processor and a memory storing instructions thereon that, when executed by the processor, cause the controller to: receive print information regarding a three-dimensional object to be printed into the volume of uncured resin; operate the heating device based on the print information to heat the volume of uncured resin to a threshold temperature; operate the laser emitting device based on the print information to position the focal point of the focused laser beam to a first sub-surface localized portion of the volume of uncured resin; operate the laser emitting device to solidify the first sub-surface localized portion of the volume of uncured resin to thereby create a solidified first sub-surface portion; subsequently, operate, based on the print information, the laser emitting device to position the focal point of the focused laser beam to a second subsurface localized portion of the volume of uncured resin different than the first sub-surface localized portion; and operate the laser emitting device to solidify the second sub-surface localized portion to thereby create a solidified second sub-surface portion; wherein the solidified first sub-surface portion and the solidified second sub-surface portion define a unitary body, and the unitary body is suspended within the volume of uncured resin.

[0160] Example 20. The additive manufacturing system according to any example herein, particularly example 19, wherein the volume of uncured resin is semisolid.

[0161] Example 21. The additive manufacturing system according to any example herein, particularly examples 19-20, wherein the uncured resin comprises Tung Oil C57H92O6, Butyl Methacrylate C8H14O2, and Divinylbenzene (DVB) C10H10.

[0162] Example 22. The additive manufacturing system according to any example herein, particularly examples 19-21, wherein the laser emitting device includes a diode-pumped solidstate laser (DPSSL).

[0163] Example 23. The additive manufacturing system according to any example herein, particularly example 22, wherein the DPSSL is a diode-pumped neodymium-doped yttrium aluminum garnet (ND: YAG) laser with wavelengths on a nanometer scale.

[0164] Example 24. The additive manufacturing system according to any example herein, particularly examples 19-23, further comprising a second laser emitting device configured to emit a second focused laser beam including a second focal point, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to: direct the second focused laser beam into the volume of the tank based on the print information.

[0165] Example 25. The additive manufacturing system according to any example herein, particularly example 24, wherein the second focused laser beam passes through a sidewall of the tank.

[0166] Example 26. A method for additive manufacturing, comprising: receiving print information regarding a three-dimensional object to be printed into a volume of uncured resin; operating a heating device based on the print information to heat the volume of uncured resin to a threshold temperature, operating a laser emitting device based on the print information to position a focal point of a focused laser beam to a first sub-surface localized portion of the volume of uncured resin; operating the laser emitting device to solidify the first sub-surface localized portion of thevolume of uncured resin to thereby create a solidified first sub-surface portion; subsequently, operating, based on the print information, the laser emitting device to position the focal point of the focused laser beam to a second sub-surface localized portion of the volume of uncured resin different than the first sub-surface localized portion; and operating the laser emitting device to solidify the second sub-surface localized portion to thereby create a solidified second sub-surface portion.

[0167] Example 27. The method for additive manufacturing according to any example herein, particularly example 26, further comprising: retrieving the solidified portions from the volume of uncured resin; removing uncured resin from the retrieved solidified portions; and returning the removed uncured resin to the volume of uncured resin.

[0168] For purposes of this description, certain advantages and novel features of the aspects and configurations of this disclosure are described herein. The described methods, systems, and apparatus should not be construed as limiting in any way. Instead, the present disclosure is directed toward all novel and nonobvious features and aspects of the various disclosed aspects, alone and in various combinations and sub-combinations with one another. The disclosed methods, systems, and apparatus are not limited to any specific aspect, feature, or combination thereof, nor do the disclosed methods, systems, and apparatus require that any one or more specific advantages be present or problems be solved.

[0169] As used in the specification and the appended claims, the singular forms “a”, “an”, and “the” include plural referents unless the context clearly dictates otherwise. Ranges may be expressed herein as from “about” one particular value, and / or to “about” another particular value. When such a range is expressed, another aspect includes from the one particular value and / or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about”, it will be understood that the particular value forms another aspect. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint. The terms “about” and “approximately” are defined as being “close to” as understood by one of ordinary skill in the art. In one non-limiting aspect the terms are defined to be within 10%. In another non-limiting aspect, the terms are defined to be within 5%. In still another non-limiting aspect, the terms are defined to be within 1%.

[0170] As utilized herein with respect to numerical ranges, the terms “approximately,” “about,” “substantially,” and similar terms generally mean + / - 10% of the disclosed values. When the terms “approximately,” “about,” “substantially,” and similar terms are applied to a structural feature (e.g., to describe its shape, size, orientation, direction, etc.), these terms are meant to cover minor variations in structure that may result from, for example, the manufacturing or assembly process and are intended to have a broad meaning in harmony with the common and accepted usage by those of ordinary skill in the art to which the subject matter of this disclosure pertains. Accordingly, these terms should be interpreted as indicating that insubstantial or inconsequential modifications or alterations of the subject matter described and claimed are considered to be within the scope of the disclosure as recited in the appended claims.

[0171] It should be noted that the term “exemplary” and variations thereof, as utilized herein to describe various implementations, are intended to indicate that such implementations are possible examples, representations, or illustrations of possible implementations (and such terms are not intended to connote that such implementations are necessarily extraordinary or superlative examples).

[0172] The term “coupled” and variations thereof, as used herein, means the joining of two members directly or indirectly to one another. Such joining may be stationary (e.g., permanent or fixed) or moveable (e.g., removable or releasable). Such joining may be achieved with the two members coupled directly to each other, with the two members coupled to each other using a separate intervening member and any additional intermediate members. If “coupled” or variations thereof are modified by an additional term (e.g., directly coupled), the generic definition of “coupled” provided above is modified by the plain language meaning of the additional term (e.g., “directly coupled” means the joining of two members without any separate intervening member), resulting in a narrower definition than the generic definition of “coupled” provided above. Such coupling may be mechanical, electrical, or fluidic.

[0173] References herein to the positions of elements (e.g., “top,” “bottom,” “above,” “below”) are merely used to describe the orientation of various elements in the FIGURES. It should be noted that the orientation of various elements may differ according to other exemplaryimplementations, and that such variations are intended to be encompassed by the present disclosure.

[0174] The hardware and data processing components used to implement the various processes, operations, illustrative logics, logical blocks, modules and circuits described in connection with the implementations disclosed herein may be implemented or performed with a general purpose single- or multi-chip processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, or, any conventional processor, controller, or microcontroller. A processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration. In some implementations, particular processes and methods may be performed by circuitry’ that is specific to a given function. The memory’ (e.g., memory; memory’ unit, storage device) may’ include one or more devices (e.g., RAM, ROM, Flash memory, hard disk storage) for storing data and / or computer code for completing or facilitating the various processes, layers, and modules described in the present disclosure. The memory may be or include volatile memory or non-volatile memory, and may’ include database components, object code components, script components, or any other type of information structure for supporting the various activities and information structures described in the present disclosure. According to an exemplary' implementation, the memory is communicably connected to the processor via a processing circuit and includes computer code for executing (e.g., by the processing circuit or the processor) the one or more processes described herein.

[0175] The present disclosure contemplates methods, system and program products on any machine-readable media for accomplishing various operations. The implementations of the present disclosure may be implemented using existing computer processors, or by a special purpose computer processor for an appropriate system, incorporated for this or any other purpose, or by a hardwired system. Implementations within the scope of the present disclosure include program products comprising machine-readable media for carrying or having machine-executable instructions or data structures stored thereon. Such machine-readable media can be any availablemedia that can be accessed by a general purpose or special purpose computer or other machine with a processor. By way of example, such machine-readable media can comprise RAM, ROM, EPROM, EEPROM, or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to carry or store desired program code in the form of machine-executable instructions or data structures and which can be accessed by a general purpose or special purpose computer or other machine with a processor. Combinations of the above are also included within the scope of machine-readable media. Machine-executable instructions include, for example, instructions and data that cause a general purpose computer, special purpose computer, or special purpose processing machine to perform a certain function or group of functions.

[0176] Although the figures and description may illustrate a specific order of method steps, the order of such steps may differ from what is depicted and described, unless specified differently above. Also, two or more steps may be performed concurrently or with partial concurrence, unless specified differently above. Such variation may depend, for example, on the software and hardware systems chosen and on designer choice. All such variations are within the scope of the disclosure. Likewise, software implementations of the described methods could be accomplished with standard programming techniques with rule-based logic and other logic to accomplish the various connection steps, processing steps, comparison steps, and decision steps.

[0177] It is important to note that the construction and arrangement of the additive manufacturing system 100 as shown in the various exemplary’ implementations is illustrative only. Additionally; any element disclosed in one implementation may be incorporated or utilized with any other implementation disclosed herein. Although only one example of an element from one implementation that can be incorporated or utilized in another implementation has been described above, it should be appreciated that other elements of the various implementations may be incorporated or utilized with any of the other implementations disclosed herein.

[0178] The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present disclosure has been presented for purposes of illustration and descriptionbut is not intended to be exhaustive or limited to the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the present disclosure.

Claims

WHAT IS CLAIMED IS:

1. An additive manufacturing system comprising:a frame;a tank coupled to the frame and defining a volume configured to hold uncured resin; a laser emitting device coupled to the frame and configured to produce a focused laser beam defining a focal point;an actuation system coupled between the tank and the laser emitting device to provide relative movement between the laser emitting device and the tank; anda controller including a processor and a memory storing instructions thereon that, when executed by the processor, cause the controller to:receive print information regarding a three-dimensional object to be printed into the volume of the tank;operate the actuation system based on the print information to move the laser emitting device relative to the tank so that the focal point of the focused laser beam moves within the volume of the tank; andoperate the focused laser beam based on the print information, so that movement of the focal point of the focused laser beam inside the volume of the tank energizes a local portion of uncured resin to polymerize the local portion of the uncured resin and to thereby additively manufacture the three-dimensional object.

2. The system of claim 1, further comprising:a chamber sized to receive the tank and including a heating device configured to heat the volume of the tank to a threshold temperature.

3. The system of any one of claims 1 -2, wherein the tank includes a base and a sidewall that is at least partially transparent.

4. The system of any one of claims 1-3, further comprising the uncured resin, and wherein the uncured resin includes a bio-resin.

5. The system of any one of claims 1-4, wherein the uncured resin comprises Tung Oil C57H92O6, Butyl Methacrylate (BMA) C8H14O2, and Divinylbenzene C10H10.

6. The system of any one of claims 1-5, further comprising the uncured resin,wherein the uncured resin is semisolid and inhibits natural convection, andwherein the semisolid uncured resin supports a solidified portion of the three-dimensional object formed within the uncured resin.

7. The system of any one of claims 1 -6, further comprising the uncured resin, and wherein the uncured resin comprises an initiator.

8. The system of claim 7, wherein the initiator comprises Di-tert-butyl Peroxide C8H18O2.

9. The system of any one of claims 7-8, wherein the initiator is at least one of Diphenyl Phosphine Oxide C22H21O2P, and Eosin Y C20H6Br4O5.

10. The system of any one of claims 7-9, wherein the initiator is at least one of a thermal initiator and a photoinitiator, and wherein the uncured resin includes a pigment configured to absorb laser energy at a wavelength of the focused laser beam,11. The system of any one of claims 1 -7, wherein the laser emitting device includes a diode-pumped solid-state laser (DPSSL).

12. The system of claim 11, wherein the DPSSL is a diode-pumped neodymium-doped yttrium aluminum garnet (ND: YAG) laser with wavelengths in on a nanometer scale.

13. The system of any one of claims 1-12, further comprising a second laser emitting device configured to emit a second focused laser beam defining a second focal point,wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to:direct the second laser beam into the volume of the tank based on the print information.

14. The system of claim 13, wherein the second focused laser beam passes through a sidewall of the tank.

15. The system of any one of claims 13, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to direct the focused laser beam and the second focused laser beam to intersect within the volume of the tank based on the print information.

16. The system of any one of claims 14-15, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to:operate the focused laser beam to print a first portion of the three-dimensional object based on the print instructions; andoperate the second laser beam to print a second portion of the three-dimensional object based on the print information.

17. The system of any one of claims 14-16, wherein the memory is further configured to store instructions thereon that, when executed by the processor, cause the controller to:operate the focused laser beam and the second laser beam simultaneously based on the print information.

18. The system of any one of claims 14-17, wherein a first print layer of the three-dimensional object is at a first print depth of the volume of the tank, and a final print layer of the three-dimensional object is at a second print depth less than the first print depth and below a surface of the uncured resin.

19. An additive manufacturing system, comprising:a tank configured to contain a volume of uncured resin;a chamber housing the tank and including a heating device;a laser emitting device configured to selectively produce a focused laser beam defining a focal point; anda controller including a processor and a memory storing instructions thereon that, when executed by the processor, cause the controller to:receive print information regarding a three-dimensional object to be printed into the volume of uncured resin;operate the heating device based on the print information to heat the volume of uncured resin to a threshold temperature;operate the laser emitting device based on the print information to position the focal point of the focused laser beam to a first sub-surface localized portion of the volume of uncured resin;operate the laser emitting device to solidify the first sub-surface localized portion of the volume of uncured resin to thereby create a solidified first sub-surface portion;subsequently, operate, based on the print information, the laser emitting device to position the focal point of the focused laser beam to a second sub-surface localized portion of the volume of uncured resin different than the first sub-surface localized portion; andoperate the laser emitting device to solidify the second sub-surface localized portion to thereby create a solidified second sub-surface portion;wherein the solidified first sub-surface portion and the solidified second subsurface portion define a unitary body, and the unitary body is suspended within the volume of uncured resin.

20. A method for additive manufacturing, comprising:receiving print information regarding a three-dimensional object to be printed into a volume of uncured resin;operating a heating device based on the print information to heat the volume of uncured resin to a threshold temperature;operating a laser emitting device based on the print information to position a focal point of a focused laser beam to a first sub-surface localized portion of the volume of uncured resin;operating the laser emitting device to solidify the first sub-surface localized portion of the volume of uncured resin to thereby create a solidified first sub-surface portion;subsequently, operating, based on the print information, the laser emitting device to position the focal point of the focused laser beam to a second sub-surface localized portion of the volume of uncured resin different than the first sub-surface localized portion; andoperating the laser emitting device to solidify the second sub-surface localized portion to thereby create a solidified second sub-surface portion.

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