Computer chassis with integrated fluid cooling

Abstract

A computer including a chassis with integrated fluid cooling includes computer components, including a processing unit, an external body with integrated fluid cooling housing the plurality of computer components, and a pump. The external body includes top and bottom distribution boards, each forming therethrough channels through which fluid can flow, side walls, and an air-cooling assembly through which fluid can flow and configured to draw air into and out of the external body from the front wall to the back wall. The pump is configured to pump the fluid through the top and bottom distribution boards and the air-cooling assembly. A flow path is formed by the top and bottom distribution boards, air cooling assembly, and pump. The fluid can absorb heat from the processing unit, and air drawn into and out of the external body by the air-cooling assembly can remove heat from the fluid.

Description

DOCKET NO.: 267441.000102 PATENTCOMPUTER CHASSIS WITH INTEGRATED FLUID COOLINGCROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of priority of US Provisional Patent Application Serial No. 63 / 713,306 filed on October 29, 2024, the entire contents of which is hereby incorporated by reference herein.TECHNICAL FIELD

[0002] The present disclosure relates generally to computer cooling and, more particularly, to integrated fluid cooling systems for computers with high power components. BACKGROUND

[0003] Heat dissipation is a top restrictor of personal computer (PC) and other types of computing device performance, and the quest for increased cooling capacity often results in desktops that are too large to fit on top of the desks that they serve.

[0004] Conventional solutions are made almost exclusively to work with a small air central processing unit (CPU) cooler and can only accommodate “mini”-line graphics cards with stock air coolers. As a result, conventional aftermarket cases that are small enough to be considered portable are limited to low-power components.

[0005] The present disclosure is directed to overcoming these and other problems of the prior art.SUMMARY

[0006] Embodiments of the present disclosure address and overcome one or more of the above shortcomings and drawbacks by providing systems and apparatuses related to a computer chassis with integrated fluid cooling.

[0007] In an exemplary embodiment, a computer having chassis with integrated fluid cooling is provided. The computer includes computer components, a chassis with integrated fluid cooling, a cooling assembly, and at least one pump. The computer components include at least one processing unit. The chassis with integrated fluid cooling at least partially enclosing the computer components. The chassis includes a first and a second distribution board each forming therethrough at least one channel through which fluid can flow. The first distribution board forms at least part of a first face of the chassis and the second distribution board is opposite the first distribution board and forms at least part of a second face of the chassis. Heat from the at least one processing unit is absorbed by fluid in one of the first and second distribution boards. The cooling assembly forms a third face and a fourth face of theDOCKET NO.: 267441.000102 PATENT chassis. The cooling assembly includes at least one radiator for cooling the heated fluid. The at least one pump is configured to cause the fluid to move.

[0008] In some embodiments, the computer further includes a case enclosing one or more of the computer components. The first distribution board forms at least part of a first external face of the case, the second distribution board forms at least part of a second external face of the case. The at least one processing unit includes a full-length graphics processing unit. The computer is sized to be portable.

[0009] In some embodiments, the computer is sized to be portable when it is less than 12” in length, 11” in width, and 5” in thickness.

[0010] In some embodiments, the fluid is water.

[0011] In some embodiments, the first and the second distribution boards, the cooling assembly, and the at least one pump are in fluid communication with each other and together form a fluid path.

[0012] In some embodiments, the at least one radiator includes a first and a second radiator, and fluid flows from the first distribution board to the first radiator, from the first radiator to the second distribution board, from the second distribution board to the second radiator, and from the second radiator to the first distribution board.

[0013] In some embodiments, the cooling assembly further includes at least one fan configured to cause air to move from the third face to the fourth face of the chassis to cool at least some of the computer components. The flow path of the air from the third face to the fourth face is unobstructed by tubing for cooling the computer components. This passageway through which air flows (from the third face to the fourth face) is unobstructed by cooling components, e.g., tubing for cooling fluid.

[0014] In some embodiments, the cooling assembly further includes at least one fan configured to cause air to move from the third face to the fourth face of the chassis for cooling at least some of the computer components. At least some of the computer components are attached to one of the first and second distribution boards such that internal supports for the computer components are not needed such that a flow path of the air from the third face to the fourth face is unobstructed by internal supports for the computer components.

[0015] In some embodiments, at least one of the computer components is indirectly attached to one of the first and second distribution boards.DOCKET NO.: 267441.000102 PATENT

[0016] In some embodiments, the computer further includes at least one processing unit block for absorbing heat from the at least one processing unit. The at least one processing unit block is directly attached to the at least one processing unit and the first distribution board. The at least one radiator includes a first and a second radiator. Fluid flows from the first distribution board to the at least one processing unit block, from the at least one processing unit block to the first distribution board, from the first distribution board to the first radiator, from the first radiator to the second distribution board, from the second distribution board to the second radiator, and from the second radiator to the first distribution board.

[0017] In some embodiments, the at least one processing unit includes a first processing unit and a second processing unit and the at least one radiator includes a first and a second radiator, the first processing unit block being directly attached to the first distribution board and for absorbing heat from the first processing unit and the second processing unit block being directly attached to the second processing unit and for absorbing heat from the second processing unit. Fluid flows from the first distribution board to the first processing unit block, from the first processing unit block to the first distribution board, from the first distribution board to the first radiator, from the first radiator to the second distribution board, from the second distribution board to the second processing unit block, from the second processing unit block to the second distribution board, from the second distribution board to the second radiator, and from the second radiator to the first distribution board.

[0018] In some embodiments, the computer further includes a pump housing at least partially enclosing the at least one pump. The pump housing is directly attached to the second distribution board such that, before the fluid flows from the second distribution board to the second radiator, the fluid flows from the second distribution board into the pump housing, and from the pump housing to the second distribution board.

[0019] In some embodiments, the at least one radiator includes an inlet aligned with an aperture formed through one of the first and the second distribution boards. The computer further includes a hollow fastener connecting the radiator to the one of the first and second distribution boards at the aperture and a plug for placing within the hollow fastener. By removing the plug, the fluid can enter the chassis via the hollow fastener to fill the chassis and fluid can exit the chassis via the hollow fastener to empty the chassis without disassembling the chassis.DOCKET NO.: 267441.000102 PATENT

[0020] In another exemplary embodiment, a computer having a chassis with integrated fluid cooling includes a computer components, a chassis with integrated fluid cooling, and at least one pump. The computer components includes at least one processing unit. The chassis with integrated fluid cooling at least partially encloses the computer components. The chassis includes a first and a second distribution board each forming therethrough at least one channel through which fluid can flow. The first distribution board forms at least part of a first face of the chassis and the second distribution board is opposite the first distribution board and forms at least part of a second face of the chassis. Heat from the at least one processing unit is absorbed by fluid in one of the first and second distribution boards. The at least one pump is configured to cause fluid to move.

[0021] In some embodiments, the first and the second distribution boards each include a first layer and a second layer having mirrored grooves that, when the first and the second layers are placed in contact with one another, together form the at least one channel.

[0022] In some embodiments, the computer further includes at least one processing unit block for absorbing heat from the at least one processing unit. The at least one processing unit block is directly attached to the at least one processing unit and the first distribution board.

[0023] In some embodiments, the at least one processing unit includes a full-length graphics processing unit, and the computer is sized to be portable.

[0024] In some embodiments, the computer is sized to be portable when it is less than 12” in length, 11” in width, and 5” in thickness.

[0025] In yet another exemplary embodiment, a computer having a chassis with integrated fluid cooling is provided. The computer includes computer components and a chassis. The computer components at least one processing unit. The chassis at least partially encloses the computer components. The chassis has integrated fluid cooling such a passageway through which air flows over one or more of the plurality of computer components is unobstructed (e.g., by cooling components like coolant tubing), and at least some of the computer components are directly or indirectly attached to the chassis such that internal supports for the computer components are not needed. The chassis includes a first face, a second face opposite the first face, and an air-cooling assembly forming a third and a fourth face of the chassis. The third and the fourth face are perpendicular to the first and the second face, and the air-cooling assembly configured to draw air through the chassis in aDOCKET NO.: 267441.000102 PATENT direction parallel to the first and second faces from the third face to the fourth face to cool at least some of the computer components, unobstructed by internal supports within the chassis.

[0026] In some embodiments, the at least one processing unit includes a full-length graphics processing unit, and the computer is sized to be portable.

[0027] This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Additional features and advantages of the disclosed technology will be made apparent from the following detailed description of illustrative embodiments that proceeds with reference to the accompanying drawings.BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The foregoing and other aspects of the present technology are best understood from the following detailed description when read in connection with the accompanying drawings. For the purpose of illustrating the technology, there are shown in the drawings certain embodiments and examples, it being understood, however, that the invention is not limited to the specific instrumentalities disclosed. Included in the drawings are the following Figures:

[0029] FIGS. 1A-1D illustrate various views of a computer with a chassis with integrated fluid cooling, with a side panel removed, according to an embodiment of the present disclosure.

[0030] FIGS. 2A-2F illustrate various views of a computer with a chassis with integrated fluid cooling, according to an embodiment of the present disclosure.

[0031] FIGS. 3 A and 3B illustrate an exploded view and an assembled view, respectively, of a chassis with integrated fluid cooling, according to an embodiment of the present disclosure.

[0032] FIGS. 4A and 4B show an outer layer and an inner layer, respectively, of a top distribution board.

[0033] FIG. 5 is a diagram showing fluid flow through a computer with a chassis with integrated fluid cooling, according to an embodiment of the present disclosure.

[0034] FIG. 6 is a diagram showing fluid flow through a computer with a chassis with integrated fluid cooling, according to an embodiment of the present disclosure.

[0035] FIG. 7 shows a detail view of a connection point between a distribution board and a radiator, according to an embodiment of the present disclosure.DOCKET NO.: 267441.000102 PATENT

[0036] FIG. 8 illustrates a hollow, threaded fastener, according to an embodiment of the present disclosure.

[0037] FIG. 9A and 9B show an assembled and an exploded view, respectively, of a housing assembly for a computer, according to an embodiment of the present disclosure.

[0038] FIG. 10 shows an exploded view of a computer, according to an embodiment of the present disclosure.

[0039] FIGS. 11 A and 1 IB show an assembled view and an exploded view, respectively, of certain components of a computer, according to an embodiment of the present disclosure.

[0040] FIGS. 12A and 12B show an assembled view and an exploded view, respectively, a bottom assembly for an exemplary computer with a chassis with integrated fluid cooling, according to an embodiment of the present disclosure.

[0041] FIGS. 13A and 13B show an assembled view and an exploded view, respectively, of a top assembly for an exemplary computer with a chassis with integrated fluid cooling, according to an embodiment of the present disclosure.

[0042] FIG. 14 is a part that can be used with a computer chassis with integrated fluid cooling, according to an embodiment of the present disclosure.DETAILED DESCRIPTION

[0043] The present disclosure describes a computer chassis with integrated fluid cooling. Certain functions, like software development, 3D design, engineering, data analysis, film, finance, and architecture, require the use of computers with powerful computing capabilities. The computer chassis described herein makes it possible to have a computer with these powerful computing capabilities, in a footprint small enough to be portable. For example, in some embodiments, the computer chassis described herein can be used for a game consolesized and portable desktop computer with full length graphics processing unit (GPU) support and enough cooling capacity for high-power components. The computer chassis with integrated fluid cooling disclosed herein in some examples has an internal layout in which the motherboard and graphics card can be mounted directly to their water blocks, which are inset into water distribution boards that compose the exterior faces of the case. By integrating the water flow into the case exterior, the need for internal tubing, which can occupy a significant amount of space in traditional water-cooled PCs, is eliminated, and a linear airflow across the case interior is created, unobstructed by internal supports, resulting in increased cooling capacity and reduced fan noise. The external distribution boards also allow the cooling loop to be easily drained, cleaned, and refilled without any disassembly of the case itself.DOCKET NO.: 267441.000102 PATENT

[0044] The high thermal density of water allows for faster and more efficient heat dissipation from the chips, resulting in lower temperatures, increased computing capacity, and hardware longevity. In some embodiments, the computer chassis with integrated fluid cooling disclosed herein can achieve the thermal performance of a full-size desktop by leveraging water cooling and organizing the system of radiators, distribution boards, and water blocks to create an external chassis which contains the internal components.

[0045] In some embodiments, at 8.4 liters, the computer chassis with integrated fluid cooling disclosed herein takes up about the same space as two textbooks stacked together. To make this size possible, a water-cooling system is integrated into the chassis.

[0046] Conventional portable small form factor cases are often made to work with small air CPU coolers and can only accommodate “mini”-line graphics cards with stock air coolers. As a result, aftermarket cases comparable in size to the computer chassis disclosed herein are limited to low-power components. In contrast, in some embodiments, the computer chassis with integrated fluid cooling disclosed herein is small enough to be portable but can accommodate an increased number of CPUs or GPUs. Additionally, computing devices utilizing this technology are not limited to the smallest air CPU coolers, “mini”-line graphics cards with stock air coolers or other lower-power components.

[0047] In some embodiments, to achieve its reduced size, the computer chassis uses 80 x 240 mm radiators and 80 mm slim fans. In this configuration, the radiators and fans can be oriented perpendicular to the motherboard and graphics card at the ends of the case. This results in not only a slimmer exterior size but also creates a high velocity linear airflow through the case from front to back (or side to side), providing sufficient cooling to the passively cooled components on the motherboard.

[0048] Turning now to the Figures, the Figures illustrate various views of an exemplary computer chassis with integrated fluid cooling disclosed herein, according to some embodiments of the present disclosure.

[0049] The present disclosure describes a water-cooled desktop or other computer in which the rigid water cooling system composes the structural chassis, which contains and supports the internal computer hardware. A goal of this design is to reduce the size of high- powered computers without losing thermal dissipation, and consequently computing performance, compared to larger convention solutions.

[0050] FIGS. 1A-1D illustrate various views of a computer 100 with a chassis 200 with integrated fluid cooling, with a side housing panel 102 removed, according to an embodimentDOCKET NO.: 267441.000102 PATENT of the present disclosure. FIGS. 2A-2F illustrate various views of a computer 100 with a chassis 200 with integrated fluid cooling, according to an embodiment of the present disclosure. In some embodiments, the computer can include a handle or a strap 122 so the computer 100 can be easily grabbed. In some embodiments, the strap 122 is mounted to the VO panel. In other embodiments, the strap mountings are located on the side housing panel 102, closer to the corners of the case.

[0051] FIGS. 3A and 3B illustrate an exploded view and an assembled view, respectively, of a chassis 200 with integrated fluid cooling, according to an embodiment of the present disclosure. The computer chassis 200 disclosed herein is formed by top 210 and bottom 220 distribution boards that form the top and bottom faces of the chassis 200, respectively, and first 230 and second 240 radiators that form the first and second sides of the chassis 200, respectively. Each of the distribution boards 210, 220 includes at least one channel through which fluid can flow from one radiator into the distribution board and out of the distribution board into the other radiator such that a flow loop is formed by the two distribution boards 210, 220 and the two radiators 230, 240.

[0052] FIGS. 4 A and 4B show an outer layer 211 and an inner layer 212, respectively, of a top distribution board 210. In some embodiments, one or more of the distribution boards, in this case, the top distribution board 210, is made of two layers - an inner layer 212 and an outer layer 211. Each of the layers has machined cavities (e.g., 216, 217) that are a mirror image of the machined cavities in the other layer (e.g., 218, 219), such that, when the layers are mated, their machined cavities together form the channels. In some embodiments, such as the one shown in FIGS. 4A and 4B, the layers have two channels 216, 217. In these embodiments, fluid will exit one of the channels (e.g. 216) and enter, e.g., a pump housing or a processing unit block (e.g., at 214a), then leave that component and enter the other channel (e.g., 217, at, e.g., 214b). Similarly, the bottom distribution board 220 can be made of two layers - an inner layer 222 and an outer layer 221.

[0053] Returning to FIGS. 3 A and 3B, the distribution boards 210, 220 are substantially parallel to one another, and the radiators 230, 240, which are substantially perpendicular to the distribution boards 210, 220, are substantially parallel to each other, such that, together with the distribution boards 210, 220, they form a box with open sides. In this configuration, computer components can be attached (directly or indirectly) to the chassis 200 (e.g., at either distribution board), minimizing or obviating the need for internal supports for computer components.DOCKET NO.: 267441.000102 PATENT

[0054] In use, heat created by a computer component (e.g., a graphic processing unit (GPU) or a central processing unit (CPU)) is absorbed by fluid in at least one of the distribution boards (whichever distribution board to which it is attached) via a water block. That heated fluid cools as it moves through one of the two radiators (whichever it encounters first), until it enters the other distribution board where it can absorb heat from another computer component. Exemplary fluid paths are shown in FIGS. 5 and 6.

[0055] For additional fluid cooling, some embodiments include one or more sets of fans 250, 260 proximate to the radiators 230, 240. For example, in some embodiments, a set of three cooling fans is installed on the outside of each radiator. Each set of fans 250, 260 can be oriented to move air in the same direction such that the two sets of fans 250, 260 can work together to move air from one side of the chassis 200 to the other. This can help remove heat from the fluid within the radiators 230, 240. In addition, it can help remove heat from the computer components as it passes through the chassis 200, over these components, unobstructed by internal supports.

[0056] FIG. 5 is a diagram showing fluid flow through a computer 100 with a chassis 2- with integrated fluid cooling, according to an embodiment of the present disclosure. As shown in FIG. 5, the computer 100 includes a pump 270 to cause the fluid in the chassis 200 to move. In some embodiments, the computer 100 further includes a pump housing 271 in fluid communication with the fluid loop to remove heat from the pump 270. In other words, fluid flows from a distribution board (e.g., the bottom distribution board 220) into the pump housing 271 , and then out of the pump housing 271 , back to the same distribution board (e.g. , the bottom distribution board 220). The fluid absorbs heat from the pump 270 as it travels through the pump housing 271. That heated fluid cools as it travels through the radiator 240. It is noted that the pump 270 can be integrated anywhere along the fluid’s path of travel.

[0057] Similarly, one or more processing unit blocks may form part of the fluid path and remove heat from their respective processing units. For example, the computer can include a graphics processing unit (GPU) 310 and a GPU block 311 attached to the GPU 310, and a central processing unit (CPU) 320 and a CPU block 321 attached to the CPU 320. Like the pump housing 271, the GPU 311 and CPU 321 blocks may each form a part of the fluid loop. For example, the GPU 311 and CPU 321 blocks may be attached directly to one or more of the distribution boards (i.e., both blocks can be attached to one distribution board, or each distribution board can have attached to it one of the blocks) and be in fluid communication with them such that fluid flows out of the distribution board, into the block, and then out ofDOCKET NO.: 267441.000102 PATENT the block, back into the same distribution board. In this way, the block absorbs heat from its processing unit, and that heated fluid cools as it travels through a radiator.

[0058] FIG. 6 is a diagram showing fluid flow through a computer 100 with a chassis 200 with integrated fluid cooling, according to an embodiment of the present disclosure. In some embodiments, computer components are indirectly attached to a distribution board. For example, in FIG. 6, the motherboard 320 is indirectly attached to the bottom distribution board 220 because it does not directly attach to the bottom distribution board 220, but rather, the motherboard 320 attaches to a component that is directly attached to the bottom distribution board 220, or to a component that is directly attached to another component that is directly attached to the bottom distribution board 220. In FIG. 6, the motherboard 320 is attached to the CPU block 321, which is attached to the pump housing 271, which is attached to the bottom distribution board 220. In this configuration, fluid leaves the bottom distribution board 220 and enters the pump housing 271, then leaves the pump housing 271 and enters the CPU block 321, then leaves CPU block 321 and enters the pump housing 271, then leaves the pump housing 271 and enters the bottom distribution board 220. In this configuration, the fluid absorbs heat from both the pump housing 271 (which absorbs heat from the pump 270) and the CPU block 321 (which absorbs heat from the motherboard 320). While this configuration may have some advantages, in some embodiments, if a more robust pump is desired, it may be desirable for each of the pump housing 271 and the CPU block 321 to directly attach to the distribution board in order to minimize the height of the computer 100.

[0059] FIG. 7 shows a detail view of a connection point between a distribution board and a radiator, according to an embodiment of the present disclosure. In some embodiments, the chassis 200 is configured such that it does not need to be disassembled to be filled or emptied. For example, in some embodiments, at least one of the distribution boards can form therethrough an aperture 213 (unthreaded) that aligns with a threaded aperture in a radiator. To assemble, the distribution board’s inner layer 212 and the radiator 230 are positioned such that their apertures align, with the inner layer’s 212 machined cavities facing away from the radiator 230. Then, these components are fastened together with a hollow, threaded fastener 207, such as the one shown in FIG. 8. In some embodiments, a gasket 202 is located between the head of the hollow fastener 207 and the inner layer 2111. Then, the outer layer 211 of the distribution board 210 can be positioned such that its machined cavities face the inner layer’s 212 machined cavities and their apertures align, and the two layers 211, 212 can be connectedDOCKET NO.: 267441.000102 PATENT to one another. To fill the fluid loop, fluid can enter through the aperture 213 in the outer layer 211 of distribution board 220 and through the inner layer 212 via the hollow fastener 207 until it enters the radiator 230. To remove the fluid, the fluid can travel in the reverse direction. In this way, the hollow fastener 207 acts as both a physical attachment and a path for fluid flow. When the computer is in use, a plug 204 can be installed in the outer layer’s 211 aperture 213.

[0060] Additionally, or alternatively, such a connection can also be located at other locations. In these embodiments, the distribution board’s inner layer and, e.g., a processing unit block, are positioned such that their apertures align, with the inner layer’s machined cavities facing away from the processing block. Then, these components are fastened together with a hollow, threaded fastener 207. Then, the outer layer of the distribution board can be positioned such that its machined cavities face the inner layer’s machined cavities, and their apertures align, and the two layers can be connected to one another.

[0061] Returning to FIGS. 3A and 3B, in some embodiments, the chassis can also include one or more gaskets 202, hardware 201, connectors 206, radiator tubes with barb fittings 205, fittings 203 (e.g., Gl / 4 fittings), a CPU socket 261, a GPU plate (in some embodiments, with a jet plate and engine insert), and a CPU cooler 262.

[0062] FIG. 9A and 9B show an assembled and an exploded view, respectively, of a housing assembly 110 for a computer 100, according to an embodiment of the present disclosure. In some embodiments, the housing assembly 110 can include a main housing panel assembly 101, a side housing panel 102, a top housing panel 103, and a bottom housing panel 104. One or more of the panels (including the main housing panel assembly) may form therethrough a plurality of apertures 115 through which air can flow into and out of the computer case.

[0063] The top 103 and bottom 104 housing panels may be substantially “L” shaped. A distribution panel can be received into the open area of the “L,” such that that housing panel, together with the distribution board, form a full top or bottom, as applicable, face of the computer case. The top 103 and bottom 104 housing panels, together with the distribution boards 210, 220, the main housing panel assembly 101, and the side housing panel 102 form the external case of the computer 100.

[0064] To facilitate the connection between the top 103 and bottom 104 housing panels with the distribution boards, each of the top 103 and bottom 104 housing panels has at least one lip 121 extending substantially perpendicularly from the panel. This lip 121 can beDOCKET NO.: 267441.000102 PATENT placed in contact with the side of a distribution panel, and a fastener can connect them together, e.g., by extended the fastener through the lip 121 into the distribution board.

[0065] In some embodiments, the housing assembly 110 further includes mounting tabs 106 (e.g., press-fit threaded inserts) to improve structural rigidity. In some embodiments, the housing assembly 110 includes eight mounting tabs 106. Three are located at the upper edge of the main housing panel assembly 101, one at approximately the center of each face, three are similarly located at the lower edge of the main housing panel assembly 101, one at approximately the center of each face, and the seventh and eighth mounting tabs are located at the upper and lower edges, respectively, of the side housing panel 102, at approximately a center point of the upper and lower edges. In some embodiments, the housing assembly 110 may include main housing brackets 107, assembly hardware 108, rubber feet 109, and speaker brackets 105.

[0066] FIG. 10 shows an exploded view of a computer 100, according to an embodiment of the present disclosure. As shown in FIG. 10, in some embodiments, the computer 100 can include a top distribution board 210, a first set of three side cooling fans 260, a first radiator assembly 230, a handle strap 122, a GPU 310, a CPU 320, a side housing panel 102, a CPU cooler and socket 322, a radiator tube with barbs 205, a pump 270, a bottom distribution board 220, rubber feet 109, a bottom housing panel 104, a main housing panel assembly 101, a second set of three side cooling fans 250, a second radiator assembly 240, two speakers 340, two speaker brackets 105, a power supply 330, two top cooling fans 111, and a top housing panel 103.

[0067] FIGS. 11 A and 1 IB show an assembled view and an exploded view, respectively, of certain components of a computer, according to an embodiment of the present disclosure. These Figures show how the following components can be assembled, according to an embodiment of the present disclosure, with quantities shown in parenthesis, House Main (1) 101, Housing Comer Bracket (8) 122, Housing Side (1) 102, Interface Bracket (1) 124, Speaker Bracket (2) 105, Corsair BSF600 (1) 126, Speaker (1) 340, Power Button (1) 128, Interface Connectors (1) 129, 18-8 Stainless Steel Press-Fit Nut for Sheet Metal (12) 130, Moisture-Resistant Cushioning Washer (4) 131, Button Head Hex Drive Screw (2) 132, 18-8 Stainless Steel Nylon-Insert Eocknut (2) 133, Super-Corrosion-Resistant 316 Stainless Steel Socket Head Screw (4) 135, and 1 inch Webbing (1) 136. In some embodiments, the computer 100 can also include Alloy Steel Low-Profile Socket Head Screw (4) and Light Duty Slides (1).DOCKET NO.: 267441.000102 PATENT

[0068] As described above, in some embodiments, the exemplary computer 100 includes a bottom distribution board 220, a pump 270, a motherboard 320, a graphics card 310, and a top distribution board 210. The computer 100 has a radiator 230, 240 along each end, which are connected to the distribution boards 210, 220, with the power supply positioned on the opposite side of the motherboard 320 from the I / O ports. In some embodiments, the computer can be thought of as having an upper assembly (FIGS. 12A and 12B), a lower assembly (FIGS. 13A and 13B), each comprising one or more of the aforementioned components.

[0069] FIG. 12A is a front perspective view and FIG. 12B is an exploded perspective view of a bottom assembly for an exemplary computer chassis 200 with integrated fluid cooling, according to an embodiment of the present disclosure. In some embodiments, the bottom assembly can include a distribution board 220 with machined cavities 226, 227 for fluid flow (e.g., water). In some embodiments the distribution board 220 may be 20 mm thick and made of two 10 mm acrylic plates 221, 222. In some embodiments, a first channel, formed by machined cavities 226a and 227a, sends cooled water from the outlet of a first radiator 230 to the inlet of the pump housing 271 located near the center of the distribution board 220. In some embodiments, the pump housing 271 contains the CPU block on the face opposite the distribution board 220, where the water pulls heat from the CPU 320 before being pumped back out to the distribution board 220. A second cavity, formed by machined cavities 226b and 227b, in the distribution board 220 sends that heated water from the outlet of the pump housing 271 to the inlet of a second radiator 240 where it is cooled and delivered to the upper assembly (shown in FIGS. 13A and 13B).

[0070] As described above, in some embodiments, the pump 270 may be located near the center of the bottom distribution board 220, which can reduce or eliminate bubbles in the flow path. However, it is noted that the pump 270 may be located anywhere in the flow path in other examples.

[0071] FIG. 13A is a front perspective view and FIG. 13B is an exploded perspective view of an upper assembly for an exemplary computer 100 with a chassis 200 with integrated fluid cooling, according to an embodiment of the present disclosure. Once at the upper assembly, that cooled water goes through the outlet of the second radiator 240 into the top distribution board 210 via the first channel formed by machined cavities 216a and 217a, to the inlet of the GPU block 311 where heat is pulled from the GPU 310. The heated water thenDOCKET NO.: 267441.000102 PATENT enters a second channel, formed by machined cavities 216b and 217b, from the outlet of the GPU block 311 to the inlet of the first radiator 230, and the cycle starts again.

[0072] In some embodiments, the size, construction and general layout of the top distribution board 210 are the same as the bottom distribution board 220, except that there is no pump 270 on the top distribution board 210, so the water goes directly into the GPU block 311 rather than to the pump housing 271.

[0073] In some embodiments, the connections between the distribution boards 210, 220, radiators 230, 240, and pump housing 271 all use hollow G‘A threaded bolts 207, which screw in from the outside through the interior layer 212 or 221 of the distribution boards 210, 220 to their respective inlet / outlet ports before the exterior layer 211 or 222 of the distribution boards 210, 220 is installed. These hollow bolts 207 create a secure, flush mechanical connection between components while allowing coolant to flow through to fill the chassis 200, and, in some embodiments, are the only points of attachment between the cooling components (e.g., the distribution boards 210, 220, and the radiators 230, 240) as well as internal hardware, resulting in no internal supports and a cooling system rigid and robust enough to serve as its own chassis. In particular, in some embodiments, each of the top 210 and bottom 220 distribution boards form therethrough holes 213 that align with an inlet to one of the radiators 230, 240 such that when fluid is injected into the hollow bolt 207, it flows through the distribution board 210 or 220, as applicable, and into the radiator 230 or 240.

[0074] In some embodiments, a standard power supply is used and mounted to the outer skin 110 that wraps around the outer edge of the system and mounts to the distribution board 210, 220 faces at each of their four corners. However, the system 100 could use a larger power supply, external intra-cable power supply like a laptop charger, or a custom internal power supply, and still be functionally the same.

[0075] In some embodiments, the operational use of the computer 100 disclosed herein is the same as any desktop computer, for example, but the organization and cooling layout reduces the overall volume compared to conventional desktop computers. In some embodiments, service-wise, other than for air travel, the coolant will only need to be drained and replaced once a year. In some embodiments, because the computer 100 disclosed herein uses some standard desktop internal components (e.g., a mini motherboard, full size graphics card, a standard power supply) unlike laptops and consoles, they can be easily swapped andDOCKET NO.: 267441.000102 PATENT upgraded, with only the GPU block needing to be replaced to match an upgraded GPU, increasing the functional lifetime of the system as a whole.

[0076] In some embodiments, the components of the computer chassis described herein are mainly steel (e.g., outer skin of the case), aluminum (e.g., water blocks and radiators), and acrylic (e.g., distribution boards). However, the system layout and function could be achieved with a very wide variety of materials and sizes. The water blocks and radiators could be made of any alternate metal, e.g., copper. The outer case could be made of any rigid material, and the distribution boards can be made from any rigid and / or impermeable material.

[0077] In some embodiments, the computer 100 disclosed herein includes the following components, with quantities shown in parenthesis: Housing Main (1), Housing Corner Bracket (8), Housing Side (1), Housing Top (1), Housing Bottom (1), Distribution Board (Top) Layer 1 (1), Distribution Board (Top) O-Ring (1), Distribution Board (Top) Aux O- Ring (1), Distribution Board (Top) Layer 2 (1), Distribution Board (Bottom) Layer 1 (1), Distribution Board (Bottom) Layer 2 (1), Distribution Board (Bottom) O-Ring (1), Distribution Board (Bottom) Aux O-Ring (1), Motherboard Support (4), Interface Bracket (1), Speaker Bracket (2), Radiator Assembly (2), G 1-4 Hollow Stud (7), Motherboard assembly (1), Waterblock RTX 3070 Ti Founders edition_Oring (1), Waterblock RTX 3070 Ti Founders edition_Inter (1), Waterblock RTX 3070 Ti Founders edition_PCB (1), Water Pump Cover (1), Corsair BSF600 (1), Cooling Fan (8), Speaker (2), Power Button (1), Interface Connectors (1), 90 Degree M-F (1), 90 Degree Swivel (3), Plastic Gl-4 Plug (5), Confined-Space Conical Compression Spring (4), Stainless Steel Ultra-Low-Profile Socket Head Screw (2), Unthreaded Bumper (4), Stainless Steel Hex Drive Flat Head Screw (50), Steel Round-Base Weld Nut (8), Stainless Steel Press-Fit Nut for Sheet Metal (12), Moisture- Resistant Cushioning Washer (16), Button Head Hex Drive Screw (10), Stainless Steel Hex Drive Flat Head Screw (6), Water- and Steam-Resistant High-Temperature EPDM O-Ring (5), Stainless Steel Nylon-Insert Locknut (2), Alloy Steel Low-Profile Socket Head Screw (4), Super-Corrosion-Resistant 316 Stainless Steel Socket Head Screw (4), Stainless Steel Sealing Flat Head Screws (11), Stainless Steel Low-Profile Socket Head Screws (5), linch Webbing (1), Light Duty Slides (1), Aluminum Unthreaded Spacer (6), Stainless Steel Ultra- Low-Profile Socket Head Screw (6), Button Head Hex Drive Screw (8), Stainless Steel Press- Fit Nut for Sheet Metal (4), and Steel Rounded Head Thread-Forming Screws (6).

[0078] FIGS. 12A and 12B show an assembled view and an exploded view, respectively, a top assembly for an exemplary computer with a chassis with integrated fluid cooling,DOCKET NO.: 267441.000102 PATENT according to an embodiment of the present disclosure. In some embodiments, the upper assembly can include the following components, with quantities shown in parenthesis: Housing Top (1) 103, Distribution Board (Top) Layer 1 (1) 211, Distribution Board (Top) O- Ring (1) 253, Distribution Board (Top) Aux O-Ring (1) 254, Distribution Board (Top) Layer 2 (1) 212, Radiator Assembly (1) 240, G 1-4 Hollow Stud (2) 207, Waterblock RTX 3070 Ti Founders edition_Oring (1) 258, Waterblock RTX 3070 Ti Founders edition_Inter (1) 259, Waterblock RTX 3070 Ti Founders edition_PCB (1) 260, Cooling Fan (5) 111, Gl-4 90 Degree Swivel (1) 206, Plastic Gl-4 Plug (1), Stainless Steel Ultra-Low-Profile Socket Head Screw (1), Stainless Steel Hex Drive Flat Head Screw (23) 275, Steel Round-Base Weld Nut (8) 256, Moisture-Resistant Cushioning Washer (4), Button Head Hex Drive Screw (8) 268, Stainless Steel Hex Drive Flat Head Screw (3) 269, Water- and Steam-Resistant High- Temperature EPDM ORing (1), Stainless Steel Sealing Flat Head Screws (11) 271, Stainless Steel Low-Profile Socket Head Screws (3), Aluminum Unthreaded Spacer (3), Stainless Steel Ultra-Low-Profile Socket Head Screw (3) 274, and Steel Rounded Head Thread-Forming Screws (3). FIGS. 12A and 12B show an assembled view and an exploded view, respectively, of a bottom assembly for an exemplary computer with a chassis with integrated fluid cooling, according to an embodiment of the present disclosure. In some embodiments, the bottom assembly can include the following components, with quantities shown in parenthesis: Housing Bottom (1) 104, Distribution Board (Bottom) Layer 1 (1) 221, Distribution Board (Bottom) Layer 2 (1) 222, Distribution Board (Bottom) O-Ring (1) 154, Distribution Board (Bottom) Aux O-Ring (1), Motherboard Support (4), Radiator Assembly (1), G 1-4 Hollow Stud (5) 207, Motherboard assembly (1) 156, Water Pump Cover (1) 169, Cooling Fan (3) 250, Gl-4 90 Degree M-F (1) 206, Gl-4 90 Degree Swivel (2) 206, Plastic Gl-4 Plug (4) 204, Confined-Space Conical Compression Spring (4) 166, Stainless Steel Ultra-Low-Profile Socket Head Screw (1), Unthreaded Bumper (4) 167, Stainless Steel Hex Drive Flat Head Screw (27), Moisture -Resistant Cushioning Washer (8), Stainless Steel Hex Drive Flat Head Screw (3) 170, Water- and Steam-Resistant High-Temperature EPDM O-Ring (4) 181, Stainless Steel Low-Profile Socket Head Screws (3), Aluminum Unthreaded Spacer (3) 173, 316 Stainless Steel Ultra-Low-Profile Socket Head Screw (3), Button Head Hex Drive Screw (8), Stainless Steel Press-Fit Nut for Sheet Metal (4), and Steel Rounded Head Thread- Forming Screws (3) 177.

[0079] FIG. 14 is a part that can be used with a computer chassis with integrated fluid cooling, according to an embodiment of the present disclosure.DOCKET NO.: 267441.000102 PATENT

[0080] Orientational references are used throughout the disclosure for convenience of explanation but should not be intended to be limiting. The present disclosure describes a computing device that is substantially in the shape of a rectangular prism having a top, bottom, front, back, and left and right sides, although other shapes could also be used in other examples. References in the above specification and below claims to “top” and “bottom” (or similar phrases) could also refer to bottom and top, front and back, and left and right.Similarly, references to front and back could also refer to back and front, bottom and top, and left and right; and references to left and right could also refer to right and left, bottom and top, and front and back.

[0081] The following is a table comparing an exemplary computer as described and illustrated herein to conventional solutions of similar size.

[0082] In some embodiments, an exemplary computer as disclosed herein has the following specifications: Size: 290.5x262x1 12*mm (11.44x10.315x4.4*in) (* in some embodiments, thickness may be reduced thru further optimization of distribution boards before production), CPU: AMD Ryzen 5800x, GPU: Nvidia RTX 3070 Ti Founders Edition, Motherboard: MSI MPG B550i Gaming Edge Max Wifi, RAM: 32gb (2x16gb) Oloy Blade DDR4 3200Mhz, Storage: 1TB PCIe 4.0 M.2 2280 SSD, Power Supply: Cooler Master SFX 750, Audio: (2x) Tang Band TI-18155A Planar Transducer, Fans: (8x) Cooler Master 80mm Slim (5 intake, 3 outlet), Pump: 12v DDC PWM, and Radiators: (2x) 80x240mm.DOCKET NO.: 267441.000102 PATENT

[0083] While various illustrative embodiments incorporating the principles of the present teachings have been disclosed, the present teachings are not limited to the disclosed embodiments. Instead, this application is intended to cover any variations, uses, or adaptations of the present teachings and use its general principles, and various of the abovedisclosed and other features and functions, or alternatives thereof, may be combined into many other different systems or applications. Further, this application is intended to cover such departures from the present disclosure that are within known or customary practice in the art to which these teachings pertain, and various presently unforeseen or unanticipated alternatives, modifications, variations or improvements therein may be subsequently made by those skilled in the art.

[0084] It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting.

[0085] With respect to the use of substantially any plural and / or singular terms herein, those having skill in the art can translate from the plural to the singular and / or from the singular to the plural as is appropriate to the context and / or application. The various singular / plural permutations may be expressly set forth herein for sake of clarity.

[0086] It will be understood by those within the art that, in general, terms used herein are generally intended as “open” terms (for example, the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” et cetera). While various compositions, methods, and devices are described in terms of “comprising” various components or steps (interpreted as meaning “including, but not limited to”), the compositions, methods, and devices can also “consist essentially of’ or “consist of’ the various components and steps, and such terminology should be interpreted as defining essentially closed-member groups.

[0087] As used in this document, the singular forms “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise. Unless defined otherwise, all technical and scientific tenus used herein have the same meanings as commonly understood by one of ordinary skill in the art. Nothing in this disclosure is to be construed as an admission that the embodiments described in this disclosure are not entitled to antedate such disclosure by virtue of prior invention.

[0088] In addition, even if a specific number is explicitly recited, those skilled in the art will recognize that such recitation should be interpreted to mean at least the recited numberDOCKET NO.: 267441.000102 PATENT(for example, the bare recitation of “two recitations,” without other modifiers, means at least two recitations, or two or more recitations). Furthermore, in those instances where a convention analogous to “at least one of A, B, and C, et cetera” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (for example, “a system having at least one of A, B, and C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and / or A, B, and C together, et cetera). In those instances where a convention analogous to “at least one of A, B, or C, et cetera” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (for example, “a system having at least one of A, B, or C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and / or A, B, and C together, et cetera). It will be further understood by those within the art that virtually any disjunctive word and / or phrase presenting two or more alternative terms, whether in the description, sample embodiments, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms. For example, the phrase “A or B” will be understood to include the possibilities of “A” or “B” or “A and B.”

[0089] A second action can be said to be “in response to” a first action independent of whether the second action results directly or indirectly from the first action. The second action can occur at a substantially later time than the first action and still be in response to the first action. Similarly, the second action can be said to be in response to the first action even if intervening actions take place between the first action and the second action, and even if one or more of the intervening actions directly cause the second action to be performed. For example, a second action can be in response to a first action if the first action sets a flag and a third action later initiates the second action whenever the flag is set.

[0090] In addition, where features of the disclosure are described in terms of Markush groups, those skilled in the art will recognize that the disclosure is also thereby described in terms of any individual member or subgroup of members of the Markush group.

[0091] Alternative embodiments. The disclosed technology described herein can be further understood according to the following alternative embodiments:

[0092] In an exemplary embodiment, a computer including a chassis with integrated fluid cooling includes a plurality of computer components, an external body with integrated fluid cooling housing the plurality of computer components, and a pump. The plurality ofDOCKET NO.: 267441.000102 PATENT computer components includes at least one processing unit. The external body includes a top and a bottom distribution board each forming therethrough channels through which fluid can flow; a plurality of side walls comprising a front, a back, a left, and a right wall; and an air- cooling assembly through which the fluid can flow and configured to draw air into and out of the external body from the front wall to the back wall. The pump is configured to pump the fluid through the top and bottom distribution boards and the air-cooling assembly. A flow path for the fluid is formed by the top and the bottom distribution boards, the air-cooling assembly, and the pump. The fluid can absorb heat from the at least one processing unit, and the air drawn into and out of the external body by the air-cooling assembly can remove heat from the fluid.

[0093] In some embodiments, the fluid is water.

[0094] In some embodiments, the top and the bottom distribution boards have a top layer and a bottom layer having mirrored grooves that, when the top and the bottom layers are attached to one another, form the channels.

[0095] In some embodiments, the at least one processing unit includes a processing unit block configured to absorb heat from the at least one processing unit. The processing unit block is in fluid communication with and directly attached to the top distribution board such that the fluid from the top distribution board can cool the fluid in the processing unit block. The air drawn into and out of the external body from the front wall to the back wall by the air-cooling assembly travels over the processing unit to remove heat therefrom.

[0096] In some embodiments, the channels formed in the top distribution board include a first channel from an exit of the air-cooling assembly to an entrance to the processing unit block and a second channel from another exit of the processing unit block and another entrance to the air-cooling assembly.

[0097] In some embodiments, the at least one processing unit includes a first processing unit including a first processing unit block configured to absorb heat from the first processing unit, wherein the first processing unit block is in communication with and directly attached to the top distribution board such that the fluid from the top distribution board can cool the fluid in the first processing unit block, and a second processing unit comprising a second processing unit block configured to absorb heat from the second processing unit, wherein the second processing unit block is in communication with and directly attached to the bottom distribution board such that the fluid from the bottom distribution board can cool the fluid in the second processing unit block. The air drawn into and out of the external body from theDOCKET NO.: 267441.000102 PATENT front wall to the back wall by the air-cooling assembly travels over the first and second processing units to remove heat therefrom.

[0098] In some embodiments, the air-cooling assembly includes a front air-cooling assembly proximate an interior face of the front wall to draw the air into the external body and a back air-cooling assembly proximate an interior face of the back wall to draw the air into the external body. Each of the front and the back air-cooling assemblies include a respective radiator through which the fluid can flow and a respective one or more fans configured to cool the fluid within the respective radiator.

[0099] In some embodiments, the at least one processing unit includes a processing unit block configured to absorb heat from the at least one processing unit and the computer further includes a pump housing containing the pump. The pump housing is in fluid communication with and directly attached to the processing unit block and the bottom distribution board such that the fluid can flow into the pump housing from the bottom distribution board, out of the pump housing into the processing unit block to absorb heat from the at least one processing unit, into the pump housing from the processing unit block, and out of the pump housing into the bottom distribution board.

[0100] In some embodiments, the top and the bottom distribution boards and the air- cooling assembly each include respective connection apertures and the computer further includes a plurality of threaded flow-through couplings connecting the top and the bottom distribution boards to the air-cooling assembly at the respective connection apertures, through which the fluid can enter the air-cooling assembly.

Claims

DOCKET NO.: 267441.000102 PATENTCLAIMSWe claim:

1. A computer having chassis with integrated fluid cooling, the computer comprising: a plurality of computer components comprising at least one processing unit; a chassis with integrated fluid cooling at least partially enclosing the plurality of computer components, the chassis comprising: a first and a second distribution board each forming therethrough at least one channel through which fluid can flow, wherein the first distribution board forms at least part of a first face of the chassis and the second distribution board is opposite the first distribution board and forms at least part of a second face of the chassis, wherein heat from the at least one processing unit is absorbed by fluid in one of the first and second distribution boards, and a cooling assembly forming a third face and a fourth face of the chassis, the cooling assembly comprising at least one radiator for cooling the heated fluid; and at least one pump configured to cause fluid to move.

2. The computer of claim 1, further comprising a case enclosing one or more of the plurality of computer components, wherein the first distribution board forms at least part of a first external face of the case and the second distribution board forms at least part of a second external face of the case, wherein the at least one processing unit comprises a full-length graphics processing unit, and wherein the computer is sized to be portable.

3. The computer of claim 2, wherein the computer is sized to be portable when it is less than 12” in length, 11” in width, and 5” in thickness.

4. The computer of claim 1, wherein the fluid is water.

5. The computer of claim 1, wherein the first and the second distribution boards, the cooling assembly, and the at least one pump are in fluid communication with each other and together form one fluid path.DOCKET NO.: 267441.000102 PATENT6. The computer of claim 5, wherein the at least one radiator comprises a first and a second radiator, wherein fluid flows from the first distribution board to the first radiator, from the first radiator to the second distribution board, from the second distribution board to the second radiator, and from the second radiator to the first distribution board.

7. The computer of claim 1, wherein the cooling assembly further comprises at least one fan configured to cause air to move from the third face to the fourth face of the chassis to cool at least some of the plurality of computer components, wherein a flow path of the air from the third face to the fourth face is unobstructed by cooling components.

8. The computer of claim 1, wherein the cooling assembly further comprises at least one fan configured to cause air to move from the third face to the fourth face of the chassis for cooling at least some of the plurality of computer components, wherein at least some of the plurality of computer components are attached to one of the first and second distribution boards such that internal supports for the plurality of computer components are not needed, wherein a flow path of the air from the third face to the fourth face is unobstructed by internal supports for the plurality of computer components.

9. The computer of claim 8, whereon at least one of the plurality of computer components is indirectly attached to one of the first and second distribution boards.

10. The computer of claim 1, wherein the computer further comprises at least one processing unit block for absorbing heat from the at least one processing unit, wherein the at least one processing unit block is directly attached to the at least one processing unit and the first distribution board, wherein the at least one radiator comprises a first and a second radiator,DOCKET NO.: 267441.000102 PATENT wherein fluid flows from the first distribution board to the at least one processing unit block, from the at least one processing unit block to the first distribution board, from the first distribution board to the first radiator, from the first radiator to the second distribution board, from the second distribution board to the second radiator, and from the second radiator to the first distribution board.

11. The computer of claim 1, wherein the at least one processing unit comprises a first processing unit and a second processing unit and the at least one radiator comprises a first and a second radiator, further comprising: a first processing unit block directly attached to the first distribution board and the first processing unit for absorbing heat from the first processing unit; and a second processing unit block directly attached to the second processing unit for absorbing heat from the second processing unit, wherein fluid flows from the first distribution board to the first processing unit block, from the first processing unit block to the first distribution board, from the first distribution board to the first radiator, from the first radiator to the second distribution board, from the second distribution board to the second processing unit block, from the second processing unit block to the second distribution board, from the second distribution board to the second radiator, and from the second radiator to the first distribution board.

12. The computer of claim 11, further comprising: a pump housing at least partially enclosing the at least one pump, the pump housing directly attached to the second distribution board, wherein before the fluid flows from the second distribution board to the second radiator, the fluid flows from the second distribution board into the pump housing, and from the pump housing to the second distribution board.

13. The computer of claim 1, wherein the at least one radiator comprises an inlet aligned with an aperture formed through one of the first and the second distribution boards, further comprising: a hollow fastener connecting the radiator to the one of the first and second distribution boards at the aperture; and a plug for placing within the hollow fastener,DOCKET NO.: 267441.000102 PATENT wherein, by removing the plug, the fluid can enter the chassis via the hollow fastener to fill the chassis and fluid can exit the chassis via the hollow fastener to empty the chassis without disassembling the chassis.

14. A computer having a chassis with integrated fluid cooling, the computer comprising: a plurality’ of computer components comprising at least one processing unit; a chassis with integrated fluid cooling at least partially enclosing the plurality of computer components, the chassis comprising: a first and a second distribution board each forming therethrough at least one channel through which fluid can flow, wherein the first distribution board forms at least part of a first face of the chassis and the second distribution board is opposite the first distribution board and fonns at least part of a second face of the chassis, wherein heat from the at least one processing unit is absorbed by fluid in one of the first and second distribution boards; and at least one pump configured to cause fluid to move.

15. The computer of claim 14, wherein the first and the second distribution boards each comprise a first layer and a second layer having mirrored grooves that, when the first and the second layers are placed in contact with one another, together form the at least one channel.

16. The computer of claim 12, wherein the computer further comprises: at least one processing unit block for absorbing heat from the at least one processing unit, wherein the at least one processing unit block is directly attached to the at least one processing unit and the first distribution board.

17. The computer of claim 14, wherein the at least one processing unit comprises a full-length graphics processing unit, and wherein the computer is sized to be portable.

18. The computer of claim 17, wherein the computer is sized to be portable when it is less than 12” in length, 11” in width, and 5” in thickness.DOCKET NO.: 267441.000102 PATENT19. A computer having a chassis with integrated fluid cooling, the computer comprising: a plurality of computer components at least one processing unit; and a chassis at least partially enclosing the plurality of computer components, where the chassis comprises integrated fluid cooling such that a passageway through which air flows over one or more of the plurality of computer components is unobstructed, wherein at least some of the plurality of computer components are directly or indirectly attached to the chassis such that internal supports for the plurality of computer components are not needed, the chassis comprising: a first face and a second face opposite the first face, and an air-cooling assembly forming a third and a fourth face of the chassis, wherein the third and the fourth face are perpendicular to the first and the second face, the air-cooling assembly configured to draw air through the chassis in a direction parallel to the first and second faces from the third face to the fourth face to cool at least some of the plurality of computer components, unobstructed by internal supports within the chassis.

20. The computer of claim 19, wherein the at least one processing unit comprises a full-length graphics processing unit, and wherein the computer is sized to be portable.

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