Distal end assembly of endoscope and endoscope
By employing a circuit board structure combining flexible circuit boards and rigid board units in the endoscope tip assembly, the problems of insufficient space utilization of rigid circuit boards and easy deformation of flexible circuit boards are solved, achieving compact arrangement and stable fixation of electronic components.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- GUANGZHOU RED PINE MEDICAL INSTR CO LTD
- Filing Date
- 2025-10-24
- Publication Date
- 2026-05-15
AI Technical Summary
In existing endoscope tip-end components, rigid circuit boards cannot effectively utilize space to accommodate a large number of electronic components, while flexible circuit boards are prone to problems such as solder joint deformation and detachment.
The circuit board structure adopts a combination of flexible circuit board and multiple rigid board units. The rigid board units are spaced apart along the extension direction of the flexible circuit board. The camera device, lighting device and electronic components are supported by rigid board units at their respective positions. The positions are adjusted by the support of the rigid board units and the deformation of the flexible circuit board to achieve a compact arrangement.
It effectively prevents solder joint deformation and detachment, increases the density of electronic components in advanced components, makes full use of limited space, and facilitates assembly and positioning.
Smart Images
Figure CN2025129780_15052026_PF_FP_ABST
Abstract
Description
Endoscope tip components, endoscope Technical Field
[0001] This application relates to the field of medical device technology, and in particular to advanced components of endoscopes and endoscopes. Background Technology
[0002] In medical endoscopes, the advanced components typically include a camera and an illumination device, which are connected to other circuits via circuit boards. To obtain better image quality, the image accuracy requirements for the camera are becoming increasingly stringent, and correspondingly, the image transmission lines and the use of various electronic components are becoming more complex.
[0003] Traditional advanced component designs often employ rigid circuit boards. However, due to limited space in advanced components, rigid circuit boards cannot effectively utilize the space to accommodate a large number of electronic components. Some advanced component designs utilize flexible circuit boards, but these are prone to solder joint deformation and detachment under stress. Summary of the Invention
[0004] Based on this, it is necessary to address the technical problems in the prior art where rigid circuit boards cannot effectively utilize space to accommodate a large number of electronic components, and where flexible circuit boards are prone to solder joint deformation and detachment under stress, by providing an endoscope's advanced component and an endoscope.
[0005] One embodiment of this application provides an imaging module, the imaging module comprising:
[0006] The circuit board structure includes a flexible circuit board and multiple rigid board units, wherein the rigid board units are attached to the flexible circuit board along the thickness direction, and the multiple rigid board units are spaced apart from each other along the extension direction of the flexible circuit board.
[0007] A camera device is mounted on the circuit board structure, and the circuit board structure has a corresponding rigid board unit at the position corresponding to the camera device.
[0008] A lighting device is disposed on the circuit board structure, and the circuit board structure has a corresponding rigid board unit at the position corresponding to the lighting device; and
[0009] Electronic components are electrically connected to the circuit board structure, and the circuit board structure has corresponding rigid board units at the positions corresponding to the electronic components.
[0010] In one embodiment, the rigid board unit corresponding to the position of the camera device on the circuit board structure is a first rigid board unit; the camera device and the lighting device are located on the same side of the first rigid board unit.
[0011] In one embodiment, the rigid board unit corresponding to the position of the lighting device on the circuit board structure is a second rigid board unit; the second rigid board unit is arranged parallel to the first rigid board unit; the second rigid board unit and the first rigid board unit are perpendicular to the portion of the flexible circuit board between them.
[0012] Alternatively, the rigid board unit at the position corresponding to the camera device on the circuit board structure and the rigid board unit at the position corresponding to the lighting device on the circuit board structure are the same rigid board unit.
[0013] In one embodiment, there are two lighting devices, with two second rigid board units corresponding to the two lighting devices one-to-one; the two lighting devices are respectively located on both sides of the camera device along the second direction; the portion of the flexible circuit board between the second rigid board unit and the first rigid board unit is located on one side of the first rigid board unit along the third direction, and the first direction, the second direction, and the third direction are perpendicular to each other, with the first direction being the thickness direction of the first rigid board unit.
[0014] In one embodiment, the rigid board unit corresponding to the position of the camera device on the circuit board structure is a first rigid board unit; the rigid board unit corresponding to the position of the electronic component on the circuit board structure is a third rigid board unit; the third rigid board unit is located on the side of the first rigid board unit facing away from the camera device;
[0015] The number of the third rigid plate units is one; or the number of the third rigid plate units is at least two, with two adjacent third rigid plate units arranged in parallel and opposite directions.
[0016] In one embodiment, the third rigid plate unit adjacent to the first rigid plate unit is perpendicular to the first rigid plate unit.
[0017] In one embodiment, the flexible circuit board between the first rigid board unit and the adjacent third rigid board unit includes a first segment, a second segment, and a third segment connected in sequence. The first segment extends in a first direction relative to the first rigid board unit in a direction away from the camera device. The second segment and the third segment are both located on the side of the first rigid board unit away from the camera device. The second segment extends in a direction parallel to the first rigid board unit, and the third segment extends in the first direction, which is the thickness direction of the first rigid board unit.
[0018] In one embodiment, a single rigid board unit includes a first rigid layer and a second rigid layer, the first rigid layer and the second rigid layer being located on different sides of the flexible circuit board, respectively.
[0019] In one embodiment, a single rigid board unit includes a first rigid layer located on one side of the flexible circuit board, and the first rigid layer is an insulating layer.
[0020] In one embodiment, a single rigid board unit includes a second rigid layer located on one side of the flexible circuit board and electrically connected to the flexible circuit board.
[0021] One embodiment of this application provides an advanced component including an imaging module of any of the above embodiments.
[0022] One embodiment of this application provides an endoscope including the front-end components described in the above embodiment.
[0023] The aforementioned imaging module, advanced components, endoscope, and camera device are mounted on a circuit board structure, with corresponding rigid board units at the camera device's location. The lighting device is also mounted on the circuit board structure, with corresponding rigid board units at its location. Similarly, electronic components are mounted on the circuit board structure, with corresponding rigid board units at their locations. Thus, supported by the rigid board units corresponding to the camera device, lighting device, and electronic components, the solder joints of these components at their respective locations on the circuit board structure are less prone to deformation, preventing them from detaching. Furthermore, adjacent rigid board units can adjust their relative positions through deformation of the flexible circuit board between them, allowing for a compact arrangement of the electronic components, camera device, lighting device, and their corresponding rigid board units. This facilitates the placement of a larger number of electronic components within the limited space of the advanced components. Attached Figure Description
[0024] Figure 1 is a schematic diagram of the circuit board structure of an imaging module in an embodiment when it is in a flat state.
[0025] Figure 2 is a schematic diagram of the imaging module structure when the second rigid plate unit is parallel to and opposite to the first rigid plate unit in one embodiment.
[0026] Figure 3 is a schematic diagram of the structure of a mounting bracket according to an embodiment.
[0027] Figure 4 is a schematic diagram of the mounting bracket shown in Figure 3 from another perspective.
[0028] Figure 5 is a schematic diagram of an imaging module about to be installed into a mounting bracket according to an embodiment.
[0029] Figure 6 is a schematic diagram of the first rigid plate unit of the imaging module in Figure 5 after it enters the limiting groove of the mounting bracket.
[0030] Figure 7 is a schematic diagram of the second rigid plate unit of the imaging module in Figure 6 and the lighting device placed on the mounting bracket.
[0031] Figure 8 is a schematic diagram of the third rigid plate unit of the imaging module in Figure 6 placed in the recess of the mounting bracket.
[0032] Figure 9 is a schematic diagram of the imaging module in another embodiment.
[0033] Figure 10 is a side view of Figure 9.
[0034] Z, first direction; X, second direction; Y, third direction;
[0035] 100. Imaging module;
[0036] 111, Flexible circuit board; 1111, First flexible portion; 1112, Second flexible portion; 1112a, First segment; 1112b, Second segment; 1112c, Third segment; 1113, Third flexible portion; 112, Rigid board unit; 112a, First rigid board unit; 112b, Second rigid board unit; 112c, Third rigid board unit; 1121, First rigid layer; 1122, Second rigid layer;
[0037] 120. Camera device;
[0038] 130. Lighting fixture; 131. Raising block;
[0039] 140. Electronic components;
[0040] 150. Signal transmission line;
[0041] 200. Mounting bracket; 201. Cavity; 202. Limiting groove;
[0042] 210. First side plate; 220. Second side plate; 221. Clearance groove; 230. Third side plate; 240. Support plate; 241. Notch;
[0043] 250. Baffle; 251. First stop section; 252. Second stop section; 253. Clearance space;
[0044] 260. Placement platform; 261. Placement slot; 262. Placement opening;
[0045] 271. First limiting part; 272. Second limiting part;
[0046] 280. Circumferential boss. Detailed Implementation
[0047] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0048] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0051] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0052] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0053] Please refer to Figures 1, 2 and 5. One embodiment of this application provides an imaging module 100, which includes: a circuit board structure, a camera device 120, an illumination device 130 and electronic components 140.
[0054] The circuit board structure includes a flexible circuit board 111 and multiple rigid board units 112, which are attached to the flexible circuit board 111 along the thickness direction. The multiple rigid board units 112 are spaced apart from each other along the extension direction of the flexible circuit board 111. As shown in Figures 1 and 2, in this embodiment, the flexible circuit board 111 is a single piece of structure. Therefore, along the extension direction of the flexible circuit board 111, there is a portion of the flexible circuit board 111 between any two adjacent rigid board units 112. Thus, the relative position of two adjacent rigid board units 112 can be adjusted by the deformation of the portion of the flexible circuit board 111 between them.
[0055] A camera device 120 is mounted on a circuit board structure, and a corresponding rigid board unit 112 is provided on the circuit board structure at the position corresponding to the camera device 120. A lighting device 130 is mounted on the circuit board structure, and a corresponding rigid board unit 112 is provided on the circuit board structure at the position corresponding to the lighting device 130. An electronic component 140 is mounted on the circuit board structure, and a corresponding rigid board unit 112 is provided on the circuit board structure at the position corresponding to the electronic component 140.
[0056] The imaging module 100 described above includes a camera device 120 mounted on a circuit board structure, with a corresponding rigid board unit 112 at the location of the camera device 120. An illumination device 130 is also mounted on the circuit board structure, with a corresponding rigid board unit 112 at the location of the illumination device 130. Electronic components 140 are also mounted on the circuit board structure, with a corresponding rigid board unit 112 at the location of the electronic components 140. Thus, supported by the rigid board units 112 corresponding to each of the camera device 120, illumination device 130, and electronic components 140, the solder joints of the corresponding positions of the camera device 120, illumination device 130, and electronic components 140 on the circuit board structure are less prone to deformation, thereby preventing the camera device 120, illumination device 130, and electronic components 140 from detaching. Furthermore, the relative positions of two adjacent rigid board units 112 can be adjusted by the deformation of a portion of the flexible circuit board 111 between them, thereby adjusting the relative positions of the electronic components 140, the camera device 120, and the lighting device 130, so that the electronic components 140, the camera device 120, the lighting device 130 and their respective corresponding rigid board units 112 are arranged compactly, thus facilitating the arrangement of a large number of electronic components in the limited space of the front-end assembly.
[0057] Furthermore, when assembling the imaging module 100 into the front-end assembly, the imaging module 100 can be assembled into a whole first, and then the position and angle of the electronic components 140, the camera device 120, and the lighting device 130 can be adjusted by the deformation of the flexible circuit board 111 between the two adjacent rigid board units 112, so that the various components of the imaging module 100 can be assembled into the front-end housing, which facilitates assembly.
[0058] Referring to Figures 7 and 8, in some embodiments, the rigid board unit 112 corresponding to the position of the camera device 120 on the circuit board structure is the first rigid board unit 112a. The camera device 120 and the illumination device 130 are located on the same side of the first rigid board unit 112a. When the imaging module 100 is assembled into the front housing, the thickness direction of the first rigid board unit 112a is the length direction of the front assembly. In this way, the camera device 120 and the illumination device 130 can both be arranged on one side of the first rigid board unit 112a along the thickness direction, resulting in a compact structure.
[0059] Referring to Figures 1 and 2, in some embodiments, the rigid board unit 112 corresponding to the position of the lighting device 130 on the circuit board structure is a second rigid board unit 112b. The portion of the flexible circuit board 111 between the second rigid board unit 112b and the first rigid board unit 112a is defined as the first flexible portion 1111. The second rigid board unit 112b and the first rigid board unit 112a are perpendicular to the first flexible portion 1111.
[0060] Specifically, by bending the first flexible portion 1111 relative to the first rigid plate unit 112a along the first direction Z, the first flexible portion 1111 is perpendicular to the first rigid plate unit 112a, as shown in Figures 5 and 6; then, the second rigid plate unit 112b is bent relative to the first flexible portion 1111 along the third direction Y, so that the second rigid plate unit 112b is perpendicular to the first flexible portion 1111, as shown in Figures 2 and 7. In this way, the second rigid plate unit 112b and the first rigid plate unit 112a are parallel and opposite to each other. The camera device 120 and the lighting device 130 are both arranged on the same side of the first rigid plate unit 112a, as shown in Figure 7. In this embodiment, the lighting device 130 and the camera device 120 are located on different sides of the flexible circuit board 111 in the thickness direction. Thus, after the bending process of the first flexible portion 1111 described above, the lighting area of the lighting device 130 can be prevented from being blocked by the second rigid board unit 112b.
[0061] As shown in Figures 9 and 10, in some embodiments, the rigid board unit 112 at the position corresponding to the camera device 120 and the rigid board unit 112 at the position corresponding to the lighting device 130 on the circuit board structure are the same rigid board unit 112 (i.e., the first rigid board unit 112a). This allows the camera device 120 and the lighting device 130 to be arranged on the same side of the first rigid board unit 112a. As shown in Figure 9, to better illuminate the camera device 120, in some embodiments, a shim 131 is provided between the lighting device 130 and the first rigid board unit 112a, so that the lighting device 130 is closer to the end of the camera device 120 away from the first rigid board unit 112a, achieving a better lighting effect.
[0062] Referring to Figures 2 and 7, in one embodiment, there are two lighting devices 130, with two second rigid plate units 112b corresponding to each of the two lighting devices 130. The two lighting devices 130 are located on both sides of the camera device 120 along the second direction X. The first flexible portion 1111 is located on one side of the first rigid plate unit 112a along the third direction Y. The first direction Z, the second direction X, and the third direction Y are perpendicular to each other, and the first direction Z is the plate thickness direction.
[0063] Two lighting devices 130 are spaced apart along the second direction X. Thus, after the bending process of the first flexible portion 1111 described above, the camera device 120 is located within the spaced area between the two lighting devices 130 (two second rigid plate units 112b), with the first flexible portion 1111 located on one side of the first rigid plate unit 112a along the third direction Y. In this way, the two lighting devices 130 and the camera device 120 have a compact structure, and the two lighting devices 130 on both sides of the camera device 120 can effectively illuminate the camera device 120.
[0064] Referring to Figures 1, 2, and 8, in one embodiment, the rigid board unit 112 corresponding to the position of the camera device 120 on the circuit board structure is the first rigid board unit 112a. The rigid board unit 112 corresponding to the position of the electronic component 140 on the circuit board structure is the third rigid board unit 112c. The third rigid board unit 112c is located on the side of the first rigid board unit 112a facing away from the camera device 120. It should be noted that the number of third rigid board units 112c can be one or at least two. The portion of flexible circuit board 111 between the third rigid board unit 112c (i.e., the third rigid board unit 112c adjacent to the first rigid board unit 112a) and the first rigid board unit 112a is defined as the second flexible portion 1112.
[0065] Specifically, by bending the second flexible portion 1112 to the side of the first rigid plate unit 112a away from the camera device 120, the third rigid plate unit 112c and its electronic components 140 can be folded to the side of the first rigid plate unit 112a away from the camera device 120. This allows the electronic components 140 to be arranged on the side of the first rigid plate unit 112a away from the camera device 120 along the thickness direction, resulting in a compact structure. This facilitates the efficient use of the limited space in the front-end assembly to accommodate a larger number of electronic components 140 when the imaging module 100 is assembled into the front-end housing.
[0066] In one embodiment, when the imaging module 100 is assembled into the front housing, the thickness direction of the first rigid plate unit 112a is the length direction of the front assembly. The third rigid plate unit 112c adjacent to the first rigid plate unit 112a is perpendicular to the first rigid plate unit 112a. In this way, the size of the third rigid plate unit 112c can be sufficiently expanded along the thickness direction of the first rigid plate unit 112a, which is beneficial for arranging more electronic components 140 on the third rigid plate unit 112c.
[0067] Referring to Figures 1, 2, and 8, in one embodiment, when the number of third rigid board units 112c is at least two, the portion of flexible circuit board 111 between two adjacent third rigid board units 112c is defined as the third flexible portion 1113. By bending the third flexible portion 1113, adjacent third rigid board units 112c can be arranged parallel and opposite to each other, that is, two third rigid board units 112c are stacked, thereby making the arrangement of adjacent third rigid board units 112c compact, saving space, and facilitating the arrangement of more electronic components 140.
[0068] In the embodiment shown in Figure 8, the number of third rigid plate units 112c is two. In other embodiments, the number of third rigid plate units 112c is not limited to two, but may be more.
[0069] Referring to Figures 2 and 8, in one embodiment, a signal transmission line 150 is provided at the output end of the circuit board structure. The signal transmission line 150 is used to connect to the main unit of the endoscope. A third rigid board unit 112c is also provided on the circuit board structure at the position corresponding to the signal transmission line 150. That is, the third rigid board unit 112c at the output end of the circuit board structure can be used to support both the electronic components 140 and the signal transmission line 150.
[0070] Referring to Figures 8 and 9, in some embodiments, the flexible circuit board 111 (i.e., the second flexible portion 1112) between the first rigid board unit 112a, the adjacent third rigid board unit 112c, and the two units includes a first segment 1112a, a second segment 1112b, and a third segment 1112c connected in sequence. The first segment 1112a extends along a first direction Z relative to the first rigid board unit 112a in a direction away from the camera device 120. The second segment 1112b and the third segment 1112c are both located on the side of the first rigid board unit 112a away from the camera device 120. The second segment 1112b extends along a direction parallel to the first rigid board unit 112a, and the third segment 1112c extends along the first direction Z. Therefore, the first segment 1112a positions the third rigid plate unit 112c on the side of the first rigid plate unit 112a facing away from the camera device 120 along the first direction Z. The second segment 1112b positions the third rigid plate unit 112c closer to the center of the first rigid plate unit 112a along the third direction Y, rather than at the edge of the first rigid plate unit 112a, thus making the imaging module 100 more compact in the third direction Y. Furthermore, it facilitates the arrangement of more third rigid plate units 112c on the side of the first rigid plate unit 112a facing away from the camera device 120 along the first direction Z. The third segment 1112c of a certain length allows the third rigid plate unit 112c to be positioned appropriately along the first direction Z.
[0071] Referring to Figure 2, in one embodiment, a single rigid board unit 112 includes a first rigid layer 1121 and a second rigid layer 1122, which are located on different sides of the flexible circuit board 111. Specifically, in this embodiment, both the first rigid board unit 112a and the third rigid board unit 112c include the first rigid layer 1121 and the second rigid layer 1122, thereby better preventing solder joint deformation and detachment under stress.
[0072] In one embodiment, a single rigid board unit 112 includes a first rigid layer 1121 but does not include a second rigid layer 1122, as shown in the second rigid board unit 112b in FIG2. The first rigid layer 1121 is located on one side of the flexible circuit board 111.
[0073] In one embodiment, a single rigid board unit 112 includes a second rigid layer 1122 but does not include a first rigid layer 1121. The first rigid layer 1121 is located on one side of the flexible circuit board 111.
[0074] In the above embodiments, the second rigid layer 1122 can be electrically connected to the flexible circuit board 111 to facilitate the electrical connection of electronic components 140, camera device 120, or lighting device 130 to the flexible circuit board 111 through the second rigid layer 1122. That is, the second rigid layer 1122 is located on the side of the flexible circuit board 111 where electronic components 140, camera device 120, or lighting device 130 are provided.
[0075] In the above embodiment, the first rigid layer 1121 is an insulating layer. In this case, the first rigid layer 1121 is located on the side of the flexible circuit board 111 where the electronic components 140, the camera device 120, and the lighting device 130 are not disposed. The first rigid layer 1121 can also be electrically connected to the flexible circuit board 111 to achieve a certain circuit connection.
[0076] One embodiment of this application provides an advanced component including an imaging module 100 of any of the above embodiments.
[0077] One embodiment of this application provides an endoscope including the front-end components described in the above embodiment.
[0078] Please refer to Figures 3 and 4. One embodiment of this application provides an imaging module mounting bracket 200, which includes a first side plate 210, a second side plate 220, a third side plate 230, and a support plate 240.
[0079] One end of the support plate 240 is connected to one end of the first side plate 210 along the first direction Z, and the two are perpendicular to each other. One end of both the support plate 240 and the first side plate 210 along the second direction X is connected to the second side plate 220, and the other end of both the support plate 240 and the first side plate 210 along the second direction X is connected to the third side plate 230. The first side plate 210, the second side plate 220, the third side plate 230, and the support plate 240 form a cavity 201, and the opening of the cavity 201 faces the third direction Y.
[0080] On the side of the support plate 240 facing away from the cavity 201 along the first direction Z, the second side plate 220, the third side plate 230, and the support plate 240 form a limiting groove 202. The limiting groove 202 has a first opening, the orientation of which is the same as the opening orientation of the cavity 201. The first direction Z, the second direction X, and the third direction Y are perpendicular to each other.
[0081] The mounting bracket 200 of the imaging module described above can be used to mount the imaging module 100 of any of the above embodiments. In actual operation, the first rigid plate unit 112a can be inserted from the first slot into the limiting slot 202, thereby positioning the first rigid plate unit 112a through the limiting slot 202. The first rigid plate unit 112a is then fixed to the mounting bracket 200 by means of dispensing glue, thereby fixing the position of the camera device 120. Since the orientation of the first slot is the same as the orientation of the opening of the cavity 201, the third rigid plate unit 112c can be bent so that it is located on the side of the support plate 240 away from the first rigid plate unit 112a along the first direction Z, thereby inserting the third rigid plate unit 112c into the cavity 201. The third rigid plate unit 112c is then fixed to the mounting bracket 200 by means of dispensing glue, etc. In this way, the imaging module 100 can be easily assembled into the mounting bracket 200. Finally, the mounting bracket 200 and the assembly structure of the imaging module 100 are placed together into the front housing for fixation, thus facilitating the assembly and positioning of the components in the imaging module.
[0082] In the embodiments shown in Figures 9 and 10, the camera device 120 and the lighting device 130 share the first rigid plate unit 112a. Therefore, after the first rigid plate unit 112a is positioned with the mounting bracket 200, the position of the lighting device 130 is also determined.
[0083] Referring to Figures 3 and 4, in one embodiment, the mounting bracket 200 further includes a baffle 250, which is fixedly connected to the support plate 240. The baffle 250 and the first side plate 210 are located at the same end of the support plate 240 along the third direction Y, and the baffle 250 protrudes from the support plate 240 in the first direction Z, away from the first side plate 210. Thus, when the first rigid plate unit 112a is inserted into the limiting groove 202 from the first slot in the third direction Y, the baffle 250 can stop the first rigid plate unit 112a, that is, position the first rigid plate unit 112a along the third direction Y, thereby facilitating the confirmation that the first rigid plate unit 112a is inserted in place, so as to fix the first rigid plate unit 112a in a timely manner.
[0084] Please refer to Figures 3 and 4. In one embodiment, the baffle 250 includes a first stop portion 251 and a second stop portion 252 spaced apart along the second direction X, so that a clearance space 253 is left between the first stop portion 251 and the second stop portion 252.
[0085] Referring to Figure 1, in conjunction with Figures 2 and 7, the first flexible portion 1111 includes a narrow segment 1111a and a wide segment 1111b connected together. The narrow segment 1111a is located at the middle of the wide segment 1111b along the second direction X, and the width of the wide segment 1111b along the second direction X is greater than the width of the narrow segment 1111a along the second direction X. The narrow segment 1111a is located on the side of the wide segment 1111b closest to the first rigid plate unit 112a.
[0086] Thus, after the first rigid plate unit 112a is inserted into the limiting groove 202, when the first flexible portion 1111 is bent relative to the first rigid plate unit 112a along the first direction Z, the narrow section 1111a can be located in the clearance space 253, and the wide section 1111b can be located on the side of the first stop portion 251 and the second stop portion 252 away from the first rigid plate unit 112a along the first direction Z. In this way, the first flexible portion 1111 does not interfere with the first stop portion 251 and the second stop portion 252, and the structure is compact.
[0087] Referring to Figures 3 to 5, in one embodiment, the mounting bracket 200 further includes a placement platform 260. The second side plate 220 and the third side plate 230 are each provided with a placement platform 260 at one end along the first direction Z, and the placement platform 260 is located on the side of the support plate 240 facing away from the cavity 201 along the first direction Z. Thus, the placement platform 260 can limit the first rigid plate unit 112a along the first direction Z, preventing it from shifting away from the support plate 240 after the first rigid plate unit 112a is inserted into the limiting groove 202.
[0088] Furthermore, the two lighting devices 130 and the two second rigid plate units 112b can be placed on two placement platforms 260 respectively and fixed in place, providing an installation position for the lighting devices 130.
[0089] Referring to Figures 3 to 5, in one embodiment, the placement platform 260 is provided with a placement groove 261, which has a placement opening 262 facing a third direction Y. The orientation of the placement opening 262 is opposite to the orientation of the opening of the cavity 201. Referring to Figures 6 and 7, when the second rigid plate unit 112b is bent relative to the first flexible portion 1111 along a third direction Y, the second rigid plate unit 112b and the lighting device 130 disposed thereon can enter the placement groove 261 from the placement opening 262, thereby effectively positioning the lighting device 130.
[0090] Referring to Figures 3 and 4, in one embodiment, the support plate 240 has a notch 241 recessed along the third direction Y at one end away from the first side plate 210.
[0091] Specifically, referring to Figure 8, by bending the second flexible portion 1112 so that the third rigid plate unit 112c is on the side of the first rigid plate unit 112a away from the camera device 120, the notch 241 can be used to accommodate the second flexible portion 1112, thereby avoiding the second flexible portion 1112 from occupying the space outside the support plate 240, and further making the structure compact.
[0092] Referring to Figures 3, 4, and 8, in one embodiment, the side of the second side plate 220 facing the third side plate 230 is provided with an avoidance groove 221.
[0093] After the third rigid plate unit 112c enters the cavity 201, the gap width between the second side plate 220 and the third side plate 230 is adapted to the width of the third rigid plate unit 112c along the second direction X, thereby effectively positioning the third rigid plate unit 112c along the second direction X and preventing it from shaking or shifting.
[0094] However, since the third flexible portion 1113 can be bent so that the two adjacent third rigid plate units 112c are arranged parallel and opposite to each other, the third flexible portion 1113 will be located at the outer edge of the two third rigid plate units 112c along the second direction X. In this embodiment, by providing an avoidance groove 221 on the side of the second side plate 220 facing the third side plate 230, the bent third flexible portion 1113 can be placed in the avoidance groove 221, providing a receiving space for the third flexible portion 1113.
[0095] Referring to Figures 3, 4, and 8, in one embodiment, the mounting bracket 200 further includes a first limiting portion 271 and a second limiting portion 272 spaced apart along a second direction X. The first limiting portion 271 is connected to the end of the second side plate 220 away from the support plate 240 and protrudes from the second side plate 220 in a direction closer to the third side plate 230. The second limiting portion 272 is connected to the end of the third side plate 230 away from the support plate 240 and protrudes from the second side plate 220 in a direction closer to the second side plate 220.
[0096] After the third rigid plate unit 112c enters the cavity 201, the first limiting part 271 and the second limiting part 272 can limit the third rigid plate unit 112c along the first direction Z, so that the third rigid plate unit 112c is located between the support plate 240 and the first limiting part 271 and the second limiting part 272. The gap area between the first limiting part 271 and the second limiting part 272 can be used for the signal transmission line 150 to pass through.
[0097] Referring to Figures 3, 4, and 8, in one embodiment, the mounting bracket 200 further includes a circumferential boss 280. The circumferential boss 280 surrounds an axis in the first direction Z, and includes a first portion protruding from the outer surface of the first side plate 210, a second portion protruding from the outer surface of the second side plate 220, and a third portion protruding from the outer surface of the third side plate 230. The position of the circumferential boss 280 along the first direction Z does not extend beyond the side of the support plate 240 facing away from the cavity 201.
[0098] After the assembly structure of the imaging module 100 and the mounting bracket 200 is placed into the front housing, the assembly structure can be fixed to the front housing by potting glue. By providing a circumferential boss 280, the position of the circumferential boss 280 along the first direction Z does not exceed the side of the support plate 240 facing away from the cavity 201, which can prevent the potted glue from flowing to the side of the support plate 240 facing away from the cavity 201, that is, prevent the glue from flowing to the camera device 120, thus protecting the camera device 120.
[0099] Referring to Figures 3, 4, and 8, in one embodiment, two circumferential bosses 280 are spaced apart along the first direction Z, thereby providing double protection for the camera device 120. The number of circumferential bosses 280 can also be one.
[0100] One embodiment of this application provides an advanced component including a mounting bracket 200 of any of the above embodiments.
[0101] One embodiment of this application provides an endoscope including the front-end components described in the above embodiment.
[0102] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0103] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. An endoscope tip assembly, characterized in that, The endoscope's advanced components include an imaging module and a mounting bracket; The imaging module includes: a circuit board structure, a camera device, an illumination device, and electronic components. The circuit board structure includes a flexible circuit board and multiple rigid board units. The flexible circuit board is a single piece of structure. The rigid board units are attached to the flexible circuit board along the thickness direction. The multiple rigid board units are spaced apart from each other along the extension direction of the flexible circuit board. The camera device is mounted on the circuit board structure, and the circuit board structure has a corresponding rigid board unit at the position corresponding to the camera device; The lighting device is disposed on the circuit board structure, and the circuit board structure has a corresponding rigid board unit at the position corresponding to the lighting device. The electronic components are electrically connected to the circuit board structure, and the circuit board structure has a corresponding rigid board unit at the position corresponding to the electronic components. Each rigid board unit includes a first rigid layer and a second rigid layer, which are located on different sides of the flexible circuit board along the thickness direction. The mounting bracket includes: a first side plate, a second side plate, a third side plate, and a support plate; One end of the support plate is connected to one end of the first side plate along a first direction, and the two are perpendicular to each other; one end of the support plate and one end of the first side plate along a second direction are both connected to the second side plate, and the other end of the support plate and the first side plate along the second direction are both connected to the third side plate; the first side plate, the second side plate, the third side plate, and the support plate form a concave cavity, and the opening of the concave cavity faces a third direction; On the side of the support plate facing away from the cavity along the first direction, the second side plate, the third side plate, and the support plate form a limiting groove. The limiting groove has a first opening, and the orientation of the first opening is the same as the orientation of the opening of the cavity. The first direction, the second direction, and the third direction are perpendicular to each other. The mounting bracket further includes a baffle, which is fixedly connected to the support plate. The baffle and the first side plate are located at the same end of the support plate along the third direction, and the baffle protrudes from the support plate in the direction away from the first side plate along the first direction. The baffle includes a first stop portion and a second stop portion that are spaced apart along the second direction to allow clearance between the first stop portion and the second stop portion. The mounting bracket further includes a placement platform, and the second side plate and the third side plate are respectively provided with the placement platform at one end along the first direction, and the placement platform is located on the side of the support plate facing away from the cavity along the first direction; the placement platform is provided with a placement groove, the placement groove has a placement opening facing the third direction, and the orientation of the placement opening is opposite to the orientation of the opening of the cavity; The rigid board unit corresponding to the position of the camera device on the circuit board structure is the first rigid board unit; The rigid board unit corresponding to the position of the lighting device on the circuit board structure is the second rigid board unit; the portion of the flexible circuit board between the second rigid board unit and the first rigid board unit is defined as the first flexible portion; There are two lighting devices, and the two rigid plate units are arranged in a one-to-one correspondence with the two lighting devices. The two lighting devices are respectively located on both sides of the camera device along the second direction, and the first flexible part is located on one side of the first rigid plate unit along the third direction. The rigid board unit at the position corresponding to the electronic component on the circuit board structure is the third rigid board unit; The third rigid board unit adjacent to the first rigid board and the portion of the flexible circuit board between the first rigid board unit are defined as the second flexible portion; The first rigid plate unit is inserted into the limiting groove from the first slot; by bending the second flexible part, the third rigid plate unit can be inserted into the cavity; The baffle stops the first rigid plate unit to position the first rigid plate unit along the third direction; The first flexible portion includes a connected narrow segment and a wide segment, the narrow segment being located at the middle of the wide segment along a second direction, and the narrow segment being located on the side of the wide segment close to the first rigid plate unit; the narrow segment is located in the clearance space, and the wide segment is located on the side of the first stop portion and the second stop portion away from the first rigid plate unit along the first direction; Two second rigid board units and two lighting devices are respectively placed on two placement platforms; the second rigid board units are bent relative to the first flexible portion in the third direction so that the second rigid board units and the lighting devices disposed thereon can enter the placement slot through the placement opening.
2. The endoscope tip assembly according to claim 1, characterized in that, The second rigid board unit is arranged parallel to the first rigid board unit; the second rigid board unit and the first rigid board unit are perpendicular to the portion of the flexible circuit board between them.
3. The endoscope tip assembly according to claim 1, characterized in that, The number of the third rigid plate unit is one.
4. The endoscope tip assembly according to claim 1, characterized in that, The number of the third rigid plate units is at least two, and two adjacent third rigid plate units are arranged in parallel and opposite directions.
5. The tip assembly of the endoscope according to claim 3 or 4, characterized in that, The third rigid plate unit adjacent to the first rigid plate unit is perpendicular to the first rigid plate unit.
6. The endoscope tip assembly according to claim 5, characterized in that, The flexible circuit board between the first rigid board unit and the adjacent third rigid board unit includes a first segment, a second segment, and a third segment connected in sequence. The first segment extends in a first direction relative to the first rigid board unit in a direction away from the camera device. The second segment and the third segment are both located on the side of the first rigid board unit away from the camera device. The second segment extends in a direction parallel to the first rigid board unit, and the third segment extends in the first direction, which is the thickness direction of the first rigid board unit.
7. The endoscope tip assembly according to claim 1, characterized in that, The support plate has a groove recessed along the third direction at one end away from the first side plate.
8. The endoscope tip assembly according to claim 1, characterized in that, The side of the second side plate facing the third side plate is provided with a clearance groove.
9. The endoscope tip assembly according to claim 1, characterized in that, The mounting bracket further includes a first limiting portion and a second limiting portion spaced apart along the second direction. The first limiting portion is connected to the end of the second side plate away from the support plate and protrudes from the second side plate in a direction close to the third side plate. The second limiting portion is connected to the end of the third side plate away from the support plate and protrudes from the second side plate in a direction close to the second side plate.
10. An endoscope, characterized in that, Includes the advanced component as described in any one of claims 1-9.