Vapor chamber and electronic device

Abstract

Embodiments of the present application provide a vapor chamber and an electronic device. The vapor chamber comprises a first cover plate, a second cover plate, and a capillary layer. The first cover plate and the second cover plate are laminated, the first cover plate and the second cover plate are connected, the first cover plate and the second cover plate enclose to form a cavity, and the capillary layer is located in the cavity. The second cover plate comprises a first metal layer and a first polymer material layer, the first metal layer and the first polymer material layer are laminated, the first metal layer is connected between the first polymer material layer and the first cover plate, and the surface roughness of the surface of the first metal layer connected to the first polymer material layer Rz∈[0.5 μm, 5 μm]. According to the solution of the embodiments of the present application, the yield of a manufacturing process of vapor chambers can be increased, so that the vapor chambers have good structural reliability and working performance.

Description

Heat spreader and electronic equipment

[0001] This application claims priority to Chinese Patent Application No. 202411593370.0, filed on November 7, 2024, entitled "Evaporative Heat Dissipation Plate and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heat dissipation technology, and more particularly to a heat spreader and electronic device. Background Technology

[0003] Electronic devices such as mobile phones, computers, and servers often incorporate vapor chambers (VCs). The working fluid within the vapor chamber circulates in a two-phase cycle, dispersing heat from the heat source over a larger area and preventing heat accumulation in localized areas that could lead to overheating. This improves the reliability and performance of the electronic device. However, conventional vapor chambers have poor manufacturability and are prone to manufacturing defects such as structural delamination and surface blistering. This results in unreliable vapor chamber structures, affecting their operational performance. Summary of the Invention

[0004] This application provides a vapor chamber and an electronic device that can improve the manufacturing yield of the vapor chamber and give it better structural reliability and performance.

[0005] In a first aspect, embodiments of this application provide a heat spreader, including a first cover plate, a second cover plate, and a capillary layer. The first cover plate and the second cover plate are stacked and connected, forming a cavity, and the capillary layer is located within the cavity. The second cover plate includes a first metal layer and a first polymer material layer, which are stacked together. The first metal layer is connected between the first polymer material layer and the first cover plate, and the surface roughness Rz of the surface of the first metal layer connected to the first polymer material layer is [0.5μm, 5μm]. In embodiments of this application, the areas of the first cover plate and the second cover plate may be substantially the same, and the periphery of the first cover plate may be connected to the periphery of the second cover plate; or, one of the first cover plate and the second cover plate may have a larger area, and the other may have a smaller area. The cover plate with the smaller area may be located within the boundary of the cover plate with the larger area, and the periphery of the cover plate with the smaller area may be connected to the cover plate with the larger area.

[0006] In this embodiment, by setting the surface roughness of the surface of the first metal layer connected to the first polymer material layer within the above range, the surface where the first metal layer and the first polymer material layer are bonded can be made smoother, significantly reducing pores at the microscopic interface between the two, enhancing the bonding tightness between the two, and improving problems such as blistering on the surface of the heat spreader and delamination of the metal layer and the polymer material layer caused by gas expansion in the pores during the local high-temperature process in the heat spreader manufacturing process. This can improve the process yield of the heat spreader and give the heat spreader better structural reliability and working performance.

[0007] In this embodiment, by using composite materials to manufacture the second cover plate, the advantages of metal materials and polymer materials can be combined, so that the second cover plate has both good thermal conductivity and strength, as well as good flexibility and light weight.

[0008] In one implementation of the first aspect, the capillary layer and the first metal layer are integrally connected. Here, "integrated" means that the capillary layer and the first metal layer are not assembled together by mechanical parts (such as screws, rivets, clips, or adhesives), and the connection between the capillary layer and the first metal layer does not have a significant interface gap, but rather presents a continuous or fused state.

[0009] For example, a capillary layer is formed on a first metal layer through a surface treatment and forming process, and the capillary layer is a part of the first metal layer. This surface treatment and forming process includes, but is not limited to, etching, laser engraving, electroplating, 3D printing, etc. For example, the capillary layer is welded to the first metal layer.

[0010] By integrating the capillary layer with the first metal layer, the two layers can be fully bonded, reducing the air gap between them and improving the heat dissipation performance of the vapor chamber. Furthermore, it avoids the need for mechanical components to connect the capillary layer and the first metal layer, allowing for a thinner and lighter vapor chamber.

[0011] In one implementation of the first aspect, the capillary layer includes a capillary via layer and a plurality of supports, the plurality of supports being connected between the capillary via layer and a first metal layer; the capillary via layer is provided with a plurality of capillary vias, among which a first capillary via is provided, and a channel is formed between any two adjacent supports, and at least a portion of the projection of the first capillary via in the thickness direction of the capillary via layer falls between the two adjacent supports.

[0012] In this implementation, the first metal layer can be a flat layer structure. Multiple supports and a capillary via layer can be formed on the first metal layer. The supports support the capillary via layer and form flow channels for the working fluid. The capillary vias on the capillary via layer communicate with these channels, providing capillary force so that the working fluid can flow from the channels into the capillary vias. This implementation, by designing gas-liquid channels within the capillary layer, can improve the thermal conductivity of the vapor chamber, increase its maximum heat transfer capacity (Qmax), and reduce its weight. This helps improve the heat dissipation capacity of electronic devices, increases the maximum clock speed of chips within the electronic devices, and facilitates the achievement of a thinner and lighter overall design.

[0013] In one implementation of the first aspect, the first polymer material layer includes a first base layer and a plurality of first protrusions, the plurality of first protrusions being protruding from the first base layer on the side facing the first cover plate; the first metal layer covers the first base layer, and each support body is covered with a first protrusion.

[0014] In this implementation, each support and its covering protrusions can be considered to together constitute a support column structure. Since the support and its covering protrusions together form a support column structure, and the protrusions are made of a relatively lightweight polymer material, the support column structure is lightweight, which helps reduce the weight of the heat spreader. Furthermore, this structure has high processing precision, ensuring the structural accuracy of the heat spreader.

[0015] In one implementation of the first aspect, the second cover plate has a plurality of first recesses on the side facing away from the first cover plate, each first recess being recessed toward the first cover plate, the portion of the first metal layer located in each first recess serving as a support, and a channel being formed between any two adjacent supports; each support is connected to a capillary layer; the capillary layer has a plurality of capillary through holes, among which a first capillary through hole is located, and at least a portion of the projection of the first capillary through hole in the thickness direction of the capillary layer falls between two adjacent supports.

[0016] In this implementation, the first metal layer can be used to form a support, thus reducing the thickness and weight of the second cover plate. Furthermore, the second cover plate has high machining precision, ensuring the structural accuracy of the heat exchanger.

[0017] In one implementation of the first aspect, each first recess is filled with a thermally conductive material. The thermally conductive material has good thermal conductivity and includes, but is not limited to, thermally conductive adhesives containing graphene, phase change materials (PCMs), etc. The thermally conductive material is used to expel air from the recess (air is a poor conductor of heat) to enhance thermal conductivity between the second cover plate and the heat source.

[0018] In one implementation of the first aspect, the plurality of capillary pores include multiple groups arranged sequentially along a first direction, each group including at least two capillary pores arranged sequentially along a second direction, the first direction intersecting the second direction; for any two adjacent groups, along the second direction, at least one capillary pore from the other group is distributed between each two adjacent capillary pores in one group.

[0019] In this implementation, the arrangement of capillary pores can be referred to as a cross arrangement. Compared to matrix or checkerboard arrangements, given a fixed area of ​​the capillary layer, a cross arrangement can increase the density and number of capillary pores in the capillary layer. This allows more parts of the capillary layer to provide capillary force, ensuring that the liquid working fluid is continuously subjected to capillary force during flow. This, in turn, increases the replenishment and reflux rates, which is beneficial for improving heat conduction and heat dissipation efficiency.

[0020] In one implementation of the first aspect, at least two of the multiple capillary pores have different opening areas.

[0021] In this implementation, locations with smaller opening areas can be closer to the heat source. These locations have greater capillary force, enabling rapid replenishment and reflux of the working fluid, which is beneficial for rapid heat conduction and dissipation in the high-temperature zone. Conversely, locations with larger opening areas can be farther from the heat source. These locations have lower flow resistance, facilitating the return of condensed working fluid through the capillary holes to the channels between the supports, thus increasing the reflux rate and consequently improving heat conduction and dissipation efficiency. For example, in this implementation, the opening area of ​​the capillary holes can exhibit an increasing trend.

[0022] In one implementation of the first aspect, at least one of the multiple supports is a columnar structure or a strip structure.

[0023] In this implementation, the support structure is made into a columnar shape, allowing the supports to be distributed in a point-like pattern, forming a channel network between them. When the vapor chamber is working, after the working fluid evaporates at a certain point in the channel network, multiple surrounding points can replenish the liquid working fluid to that point. This design makes the vapor chamber insensitive to the location of heat sources; the vapor chamber can correspond to multiple heat sources and conduct heat dissipation for multiple heat sources. Alternatively, the position of the vapor chamber can be fixed while the position of the heat sources can be adjusted as needed, ensuring that the vapor chamber can always conduct heat dissipation normally. Furthermore, this design also improves the situation where a certain point does not receive liquid working fluid replenishment after evaporation, leading to excessive temperature rise at that point, and reduces the instability of the working fluid boiling and evaporation flow.

[0024] In this implementation, the support is made into a strip structure. Since the width of the channel between adjacent supports is basically constant, the liquid working fluid in the channel has strong flow directionality and low flow resistance. This allows the liquid working fluid to be quickly replenished to the evaporation position, thereby ensuring the heat conduction and heat dissipation effect.

[0025] In one implementation of the first aspect, a plurality of first supports are provided among the plurality of supports, the plurality of first supports are arranged sequentially along a first direction, and each first support is a strip structure extending along a second direction, the first direction and the second direction intersect.

[0026] In this implementation, at least a portion of the support is made into a strip structure. Since the width of the channel between adjacent first supports is basically constant, the flow direction of the liquid working fluid in the channel is strong and the flow resistance is small. This allows the liquid working fluid to be quickly replenished to the evaporation position, thereby ensuring the heat conduction and heat dissipation effect.

[0027] In one implementation of the first aspect, the plurality of first supports include a first group and a second group, the first group and the second group are adjacent and arranged along a first direction, and both the first group and the second group include at least two first supports arranged sequentially along a second direction; the projection of the gap between any two adjacent first supports in the first group in the first direction falls on one of the first supports in the second group.

[0028] In this implementation, the strip-shaped first support bodies can be arranged in a crisscross pattern, and the channels extending along the second direction between the first support bodies can be called grooves. Due to the formation of these grooves, the liquid working fluid within them exhibits strong flow directionality and low flow resistance, facilitating rapid replenishment of the liquid working fluid to the evaporation location and ensuring effective heat conduction and dissipation. Furthermore, gaps can be formed between adjacent support bodies within each group, and these gaps communicate with the grooves to form a network of interconnected channels. When the vaporizer is operating, after the working fluid at a certain location in the channel network vaporizes, multiple surrounding locations can replenish that location with liquid working fluid. This makes the vaporizer insensitive to the location of heat sources, allowing it to correspond to multiple heat sources and conduct heat dissipation for them. Alternatively, the position of the vaporizer can be fixed while the position of the heat sources is adjusted as needed, ensuring that the vaporizer always performs normal heat conduction and dissipation. This also improves the situation where a location does not receive sufficient liquid working fluid replenishment after vaporization, leading to excessive temperature rise at that location, and reduces the instability of the working fluid's boiling and evaporation flow. In addition, the gap between adjacent supports in each group is small, which can be smaller than the width of the groove between adjacent supports. This gap can provide a certain capillary force, which is beneficial to improve the fluidity of the liquid working fluid, ensure the rapid replenishment of the liquid working fluid, and thus improve the heat conduction and heat dissipation effect.

[0029] In one implementation of the first aspect, the second cover plate further includes a second metal layer, wherein the first metal layer, the first polymer material layer and the second metal layer are stacked in sequence, the second metal layer is connected to the first polymer material layer, and the surface roughness Rz of the surface of the second metal layer connected to the first polymer material layer is [0.5μm, 5μm].

[0030] In this implementation, adding a second metal layer increases the structural strength and rigidity of the second cover plate, improving its mechanical properties. Using composite materials to manufacture the second cover plate combines the advantages of both metal and polymer materials, resulting in a cover plate with good thermal conductivity and strength, good flexibility, and light weight. By setting the surface roughness of the surface of the second metal layer connected to the first polymer material layer within the aforementioned range, the bonding surface between the two layers becomes smoother, significantly reducing pores at the microscopic interface and enhancing their bonding tightness. This improves issues such as blistering on the surface of the heat spreader and delamination of the metal and polymer layers caused by gas expansion within pores during localized high-temperature processes in the heat spreader manufacturing process. This improves the process yield of the heat spreader, giving it better structural reliability and performance.

[0031] In one implementation of the first aspect, the first cover plate includes a working area that participates in forming a cavity; the working area includes a plurality of second protrusions and a plurality of second recesses, the plurality of second protrusions and the plurality of second recesses are arranged alternately, and a plurality of second protrusions are provided around each second recess; each second protrusion protrudes in a direction away from the second cover plate; each second recess is recessed toward the second cover plate and connected to the capillary layer.

[0032] In this implementation, the first cover plate can be a structure of uniform thickness. By making the first cover plate have an alternating concave and convex structure, support columns for the heat exchange plate can be manufactured on the first cover plate, ensuring the rigidity and strength of the heat exchange plate and improving its mechanical properties.

[0033] In one implementation of the first aspect, the first cover plate includes a working area that participates in forming a cavity; the working area includes a second base layer and a plurality of third protrusions, all of which protrude from the second base layer on the side facing the second cover plate and are connected to the capillary layer.

[0034] In this implementation, the first cover plate can be of unequal thickness. By forming protrusions on the first cover plate, support columns for the heat exchanger can be manufactured on the first cover plate, ensuring the rigidity and strength of the heat exchanger and improving its mechanical properties.

[0035] In one implementation of the first aspect, the first cover plate includes a third metal layer connected to the first metal layer.

[0036] In this implementation, the third metal layer can be a single material or a composite material of metals. This type of first cover plate has lower cost and better mechanical properties.

[0037] In one implementation of the first aspect, the first cover plate further includes a second polymer material layer connected to the third metal layer. The second polymer material layer, the third metal layer, and the first metal layer are stacked in sequence, and the surface roughness Rz of the surface of the third metal layer connected to the second polymer material layer is [0.5μm, 5μm].

[0038] In this implementation, by using composite materials to manufacture the first cover plate, the advantages of both metallic and polymeric materials can be combined, resulting in a first cover plate with good thermal conductivity and strength, good flexibility, and light weight. By setting the surface roughness of the surface of the third metal layer connected to the second polymeric material layer within the above-mentioned range, the bonding surface between the third metal layer and the second polymeric material layer can be made smoother, significantly reducing pores at the microscopic interface between the two, enhancing the bonding tightness, and improving problems such as blistering on the surface of the heat spreader and delamination of the metal layer and polymeric material layer caused by gas expansion in pores during the local high-temperature process in the heat spreader manufacturing process. This improves the process yield of the heat spreader, giving it better structural reliability and working performance.

[0039] In one implementation of the first aspect, the first cover plate further includes a fourth metal layer, the fourth metal layer, the second polymer material layer and the third metal layer are stacked in sequence, the fourth metal layer is connected to the second polymer material layer, and the surface roughness Rz of the surface of the fourth metal layer connected to the second polymer material layer is [0.5μm, 5μm].

[0040] In this implementation, by adding a fourth metal layer, the structural strength and rigidity of the first cover plate can be increased, thereby improving its mechanical properties. By setting the surface roughness of the surface of the fourth metal layer connected to the second polymer material layer within the range described above, the bonding surface between the fourth metal layer and the second polymer material layer can be made smoother, significantly reducing pores at the microscopic interface between the two, enhancing their bonding tightness, and improving problems such as blistering on the surface of the heat spreader and delamination of the metal layer and polymer material layer caused by gas expansion within pores during the local high-temperature process in the heat spreader manufacturing process. This improves the process yield of the heat spreader, giving it better structural reliability and working performance.

[0041] In one implementation of the first aspect, the polymer material layer in the heat spreader includes polyimide, polypropylene, polytetrafluoroethylene, polyethylene terephthalate, polyethylene naphthalate, polydimethylsiloxane, polyethylene, polymethylethylene carbonate, polyvinyl chloride, polyvinylidene chloride, polystyrene, or polyamide. These materials are polymer materials, and they are reliable and easy to mass-produce. This polymer material layer is either the first polymer material layer or the second polymer material layer in the aforementioned implementations.

[0042] In one implementation of the first aspect, the glass transition temperature of the polymer material layer in the vapor chamber is greater than or equal to 320°C. This polymer material layer is either the first polymer material layer or the second polymer material layer in the aforementioned implementations. The glass transition temperature, also known as the glass transition temperature, is usually represented by Tg. The glass transition temperature is the temperature at which a polymer transitions from a highly elastic state to a glassy state. By setting the glass transition temperature of the polymer material layer within the aforementioned larger range, the polymer material layer can possess better high-temperature resistance, ensuring stable performance during localized high-temperature processes in the vapor chamber manufacturing process (such as welding the first and second cover plates, manufacturing capillary layers at temperatures above 300°C, etc.). This improves the process yield of the vapor chamber and gives it better structural reliability and operational performance.

[0043] Secondly, embodiments of this application provide an electronic device, including a housing and a vapor chamber, with the vapor chamber located within the housing. The vapor chamber in the electronic device of this application embodiment has good structural reliability and operational performance, which can improve the heat dissipation capacity of the electronic device, increase the maximum clock speed of the chips within the electronic device, and facilitate the achievement of a thinner and lighter overall design.

[0044] In one implementation of the second aspect, the electronic device further includes a display screen disposed on the housing and forming a receiving space with the housing, and a heat spreader located in the receiving space.

[0045] In this implementation, the heat spreader can be connected to the display screen, allowing it to avoid the components below it. This results in a larger surface area for the heat spreader, which in turn improves its heat conduction. Alternatively, the heat spreader can be connected to the housing, depending on the requirements. Attached Figure Description

[0046] Figure 1 is a schematic diagram of the assembly structure of an electronic device according to an embodiment of this application;

[0047] Figure 2 is an exploded view of the electronic device in Figure 1;

[0048] Figure 3 is a schematic diagram of the AA cross-sectional structure in Figure 1;

[0049] Figure 4 is a side cross-sectional view of a heat spreader according to one embodiment;

[0050] Figure 5 is a side sectional view of the second cover plate of the heat spreader in Figure 4.

[0051] Figure 6 is a schematic diagram showing the interface between the first metal layer and the first polymer material layer in the second cover plate;

[0052] Figure 7 is a side sectional view of the first cover plate of the heat spreader in Figure 4.

[0053] Figures 8 and 9 are both schematic diagrams of bubbling abnormalities caused by localized high-temperature processes;

[0054] Figure 10 is a schematic diagram of structural delamination anomalies caused by localized high-temperature processes.

[0055] Figure 11 is a schematic diagram of another side section structure of the first cover plate;

[0056] Figure 12 is a schematic diagram of the connection structure between the capillary layer and the second cover plate in the heat exchange plate.

[0057] Figure 13 is a schematic diagram of the side cross-section of the capillary layer;

[0058] Figure 14 is a schematic diagram of the three-dimensional structure of the capillary layer;

[0059] Figure 15 is a partial top view of the capillary pore layer in the capillary layer of Figure 14.

[0060] Figure 16 is a schematic diagram of another partial top view of the capillary pore layer;

[0061] Figure 17 is a schematic diagram of another partial top view of the capillary porous layer;

[0062] Figure 18 is a schematic diagram of another partial top view of the capillary pore layer;

[0063] Figure 19 is a partial top view of the support structure in the capillary layer of Figure 14;

[0064] Figure 20 is a partial top view of another structural diagram of the support;

[0065] Figure 21 is a schematic diagram of another partial top view of the support structure;

[0066] Figure 22 is a schematic diagram of a three-dimensional arrangement structure of the support;

[0067] Figure 23 is a schematic diagram of another three-dimensional arrangement structure of the support;

[0068] Figure 24 is a top view of the arrangement of the support structure in Figure 23;

[0069] Figures 25-28 illustrate the positional relationship between the capillary holes and the support in several embodiments from a top-down perspective.

[0070] Figure 29 is a schematic diagram of the connection structure between the capillary layer and the second cover plate in another embodiment;

[0071] Figure 30 is a schematic diagram of the connection structure between the capillary layer and the second cover plate in another embodiment;

[0072] Figure 31 is a schematic diagram of the connection structure between the capillary layer and the second cover plate in another embodiment;

[0073] Figure 32 is a side cross-sectional view of the heat spreader in another embodiment;

[0074] Figure 33 is a side sectional view of the first cover plate in one embodiment;

[0075] Figure 34 is a side cross-sectional view of the heat spreader in another embodiment;

[0076] Figure 35 is a side cross-sectional view of the heat spreader in another embodiment;

[0077] Figure 36 is a side sectional view of the first cover plate in another embodiment;

[0078] Figure 37 is a side sectional view of the first cover plate in another embodiment;

[0079] Figure 38 is a side sectional view of the first cover plate in another embodiment;

[0080] Figure 39 is a side sectional view of the first cover plate in another embodiment. Detailed Implementation

[0081] This application provides an electronic device and a heat spreader within the electronic device. The electronic device includes, but is not limited to, mobile phones (such as candybar phones and foldable phones), laptops, tablets, desktop computers, in-vehicle devices, wearable devices, smart speakers, smart screens, servers, network devices (such as switches and routers), communication devices (such as base stations and data centers), LED lighting fixtures, or industrial production equipment.

[0082] Figure 1 illustrates a three-dimensional structure of an electronic device 1, Figure 2 is an exploded view of the electronic device 1 in Figure 1, and Figure 3 is a cross-sectional view of Figure 1.

[0083] As shown in Figures 1 and 2, the electronic device 1 can be, for example, a mobile phone. The electronic device 1 may include a display screen 11, a housing 12, and a heat spreader 13, etc.

[0084] The housing 12 can be a component assembled from several parts, or it can be a single part. For example, the housing 12 can be a mid-frame. As shown in Figures 1-3, the display screen 11 is mounted on one side of the housing 12 and can form a receiving space 1a with the housing 12. Several components 14 can be arranged within the receiving space 1a; these components 14 can be mechanical parts or electronic devices. As shown in Figure 3, the electronic device 1 can also include a housing 15, which is connected to the housing 12 and located on opposite sides of the housing 12, respectively, along with the display screen 11. The housing 15 can be, for example, a rear shell. The housing 15 and the housing 12 can form the receiving space 1a, within which several electronic devices can be arranged, including but not limited to circuit boards, batteries, speakers, and rear cameras.

[0085] Some electronic components in electronic device 1 are heat sources. A heat source refers to a single device or a module composed of several single devices that has a certain function and can generate heat when working. Heat sources include, but are not limited to, camera modules, sensors, system-on-chip (SOC), charging modules (Charge IC), batteries, system-in-package (SIP) modules, speaker modules, circuit board assemblies, etc.

[0086] As shown in Figure 3, the heat spreader 13 can be located within the accommodating space 1a. For example, the heat spreader 13 can be connected to the display screen 11, thus allowing the heat spreader 13 to avoid the component 14 below it, which facilitates a larger area for the heat spreader 13 and improves its heat conduction effect. If necessary, the heat spreader 13 can also be connected to the housing 12.

[0087] It is understood that the heat spreader 13 is arranged near the heat source. For example, the heat source may not be connected to the heat spreader 13, but rather separated by other components (not referring to the thermal interface material), through which heat is conducted. For instance, as shown in Figure 3, the electronic device within the housing space 1a serves as the heat source, separated from the heat spreader 13 by a housing 12 (e.g., the middle plate of the frame), and heat is conducted between them through the housing 12. Alternatively, the heat source may be connected to the heat spreader 13, for example, through a thermal interface material. For example, referring to Figure 3, the middle plate may have through-holes through which the electronic device within the housing space 1a can connect to the heat spreader 13 within the housing space 1a.

[0088] It is understood that the descriptions of the position, quantity, and shape of the heat spreader 13 above are merely examples, and the embodiments of this application do not impose any limitations on them. For example, the heat spreader 13 can be arranged at any position within the housing of the electronic device 1, and is not limited to the accommodating space 1a.

[0089] The structure of the heat spreader 13 in the embodiments of this application will be described in detail below.

[0090] Figure 4 shows a partial side cross-sectional structure of the heat spreader 13 in Embodiment 1.

[0091] As shown in Figure 4, the heat spreader 13 may include a first cover plate 131, a second cover plate 132, and a capillary layer 133. Both the first cover plate 131 and the second cover plate 132 can be generally plate-shaped structures and can be stacked, i.e., arranged along their own thickness direction. The periphery of the first cover plate 131 is connected to the periphery of the second cover plate 132, forming the periphery 13a of the heat spreader 13. This periphery 13a can be referred to as the connecting area 13a. The middle portion of the first cover plate 131 protrudes relative to its periphery, and the middle portion of the second cover plate 132 protrudes relative to its periphery. Both the middle portions of the first cover plate 131 and the middle portions of the second cover plate 132 can protrude in opposite directions, forming a cavity 13c. The middle portions of the first cover plate 131 and the middle portions of the second cover plate 132 can constitute the middle portion 13b of the heat spreader 13, which can be referred to as the working area 13b. Understandably, the connecting region 13a surrounds the outer periphery of the working region 13b. The capillary layer 133 is located within the cavity 13c, or in other words, within the working region 13b.

[0092] The cavity 13c can be filled with a working fluid, including but not limited to water, acetone, ethanol, methanol, etc. The working fluid can conduct heat through two-phase change (i.e., through evaporation and condensation, switching between liquid and gas phases).

[0093] In Embodiment 1, the second cover plate 132 can face the heat source, and the first cover plate 131 can face away from the heat source. Referring to Figures 3 and 4, for example, the first cover plate 131 can face the display screen 11, and the second cover plate 132 can face away from the display screen 11.

[0094] The following will describe each structure of the heat spreader 13 one by one.

[0095] Figure 5 illustrates the second cover plate 132 in Figure 4. As shown in Figure 5, the second cover plate 132 may include a first metal layer 132a, a first polymer material layer 132b, and a second metal layer 132c, which are arranged sequentially along the thickness direction of the second cover plate 132. The first polymer material layer 132b connects the first metal layer 132a and the second metal layer 132c. As shown in Figure 4, the first metal layer 132a faces the first cover plate 131.

[0096] As shown in Figure 5, the first metal layer 132a has a surface 132d facing the first polymer material layer 132b, which is connected (or bonded) to the first polymer material layer 132b. The surface roughness Rz of the surface 132d is in the range of [0.5μm, 5μm], for example, Rz can be 0.5μm, 1.5μm, 2μm, 5μm, etc. In this embodiment, the surface roughness Rz is defined according to national standards, for example, it can represent the sum of the maximum profile peak height and the maximum valley depth within a sampling length. The sampling length is determined based on the range of surface roughness Rz.

[0097] Figure 6 illustrates the microstructure of surface 132d of the first metal layer 132a, or the microstructure of the interface between the first metal layer 132a and the first polymer material layer 132b.

[0098] As shown in Figure 5, the second metal layer 132c has a surface 132e facing the first polymer material layer 132b, which is connected (or bonded) to the first polymer material layer 132b. The surface roughness Rz of the surface 132e is in the range of [0.5μm, 5μm], for example, Rz can be 0.5μm, 1.5μm, 2μm, 5μm, etc.

[0099] In this embodiment, the surface roughness of at least one of surface 132d and surface 132e can be limited as described above.

[0100] In this embodiment, for convenience, the first metal layer 132a, the second metal layer 132c, and the third metal layer 131a and the fourth metal layer 131c (described below) can be collectively referred to as metal layers, and the first polymer material layer 132b and the second polymer material layer 131b (described below) can be collectively referred to as polymer material layers. By setting the surface roughness of the surface of the metal layer connected to the polymer material layer within the above range, the surface where the metal layer and the polymer material layer are bonded can be made smoother, significantly reducing pores at the microscopic interface between the two, enhancing the bonding tightness between them, and improving problems such as blistering on the surface of the heat spreader and delamination of the metal layer and the polymer material layer caused by gas expansion in the pores during the local high-temperature process (e.g., temperature ≥300°) in the manufacturing process of the heat spreader 13. This can improve the process yield of the heat spreader, giving it better structural reliability and working performance. This effect will be further explained below.

[0101] As shown in Figure 5, along the extension direction, the second cover plate 132 can be divided into a connecting area 132f and a working area 132g. The connecting area 132f surrounds and connects to the outer periphery of the working area 132g, and the working area 132g protrudes relative to the connecting area 132f. The working area 132g can be a flat plate-like structure. The connecting area 132f is used to connect with the first cover plate 131, and the working area 132g is used to participate in forming the cavity 13c. It can be understood that the first metal layer 132a, the first polymer material layer 132b, and the second metal layer 132c can all be distributed in the connecting area 132f and the working area 132g.

[0102] In Example 1, the material of the first metal layer 132a is metal, including but not limited to pure copper, copper alloy, stainless steel, titanium alloy, aluminum, magnesium, etc.

[0103] In Example 1, the material of the first polymer material layer 132b is a polymer material, including but not limited to polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyvinylidene chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), and polyamide (PA).

[0104] For example, the glass transition temperature (Tg) of the first polymer material layer 132b is ≥320°. The glass transition temperature, also known as the glass transition temperature, is the temperature at which a polymer transitions from a highly elastic state to a glassy state. By setting the glass transition temperature of the first polymer material layer 132b within the aforementioned large range, it can achieve better high-temperature resistance, ensuring stable performance during localized high-temperature processes in the fabrication of the heat spreader 13 (e.g., welding the first cover plate 131 and the second cover plate 132, manufacturing the capillary layer 133 at temperatures above 300°C). This improves the yield rate of the heat spreader 13, resulting in better structural reliability and operational performance.

[0105] In Embodiment 1, the material of the second metal layer 132c is a metal, including but not limited to pure copper, copper alloys, stainless steel, titanium alloys, aluminum, magnesium, and metal oxides, wherein the metal oxides include but are not limited to titanium dioxide and aluminum oxide. The material of the second metal layer 132c may be the same as or different from the material of the first metal layer 132a.

[0106] In Embodiment 1, the second cover plate 132 can be made entirely of flexible copper clad laminate (FCCL) material, such as adhesive-free FCCL double-sided panel material. The first metal layer 132a and the second metal layer 132c are both copper foils, and the first polymer material layer 132b can be a PI film.

[0107] As described above, the second cover plate 132 is composed of a metal and a non-metal composite, and the second cover plate 132 can be referred to as a metal-non-metal composite layer.

[0108] In this embodiment, by using composite materials to manufacture the second cover plate 132, the advantages of metal materials and polymer materials can be combined, so that the second cover plate 132 has both good thermal conductivity and strength, as well as good flexibility and light weight.

[0109] Figure 7 illustrates a partial side cross-sectional structure of the first cover plate 131 in Figure 4. As shown in Figure 7, the first cover plate 131 may include a fourth metal layer 131c, a second polymer material layer 131b, and a third metal layer 131a, which are arranged sequentially along the thickness direction of the first cover plate 131. The second polymer material layer 131b connects the third metal layer 131a and the fourth metal layer 131c. Referring to Figures 7 and 4, the third metal layer 131a faces the second cover plate 132.

[0110] As shown in Figure 7, the third metal layer 131a has a surface 131d facing the second polymer material layer 131b, which is connected (or bonded) to the second polymer material layer 131b. The surface roughness Rz of the surface 131d is [0.5μm, 5μm], for example, Rz can be 0.5μm, 1.5μm, 2μm, 5μm, etc. The fourth metal layer 131c has a surface 131e facing the second polymer material layer 131b, which is connected (or bonded) to the second polymer material layer 131b. The surface roughness Rz of the surface 131e is [0.5μm, 5μm], for example, Rz can be 0.5μm, 1.5μm, 2μm, 5μm, etc. In this embodiment, the surface roughness of at least one of the surfaces 131d and 131e can be defined as above.

[0111] In Example 1, by setting the surface roughness of the surface of the metal layer connected to the polymer material layer within the range described above, the surface of the metal layer can be made smoother. This significantly reduces the air gap between the metal layer and the polymer material layer after they are bonded together, enhances the bonding tightness between them, and improves problems such as the generation of bubbles (as shown in Figures 8-9) and delamination (as shown in Figure 10, where the first metal layer 132a and the first polymer material layer 132b delaminate) that occur in the local high-temperature process (e.g., process temperature ≥300°) during the fabrication of the heat spreader 13. This effect will be further explained below.

[0112] In one embodiment of this invention, as shown in FIG7, along the extending direction, the first cover plate 131 can be divided into a connecting area 131f and a working area 131g. The connecting area 131f surrounds and connects to the outer periphery of the working area 131g, and the working area 131g protrudes relative to the connecting area 131f. It is understood that the third metal layer 131a, the second polymer material layer 131b, and the fourth metal layer 131c can all be distributed in the connecting area 131f and the working area 131g. The connecting area 131f is used to connect with the first cover plate 131, and the working area 131g is used to participate in forming the cavity 13c.

[0113] As shown in Figure 7, the working area 131g can have an uneven structure on both sides in the thickness direction. The working area 131g can include multiple protrusions 131h and multiple recesses 131i. The protrusions 131h are convex upwards relative to the connecting area 131f. As shown in Figures 7 and 4, the protrusions 131h protrude in a direction away from the second cover plate 132, and the protrusions 131h and the second cover plate 132 are spaced apart and opposite each other. The recesses 131i are concave downwards relative to the connecting area 131f. As shown in Figures 7 and 4, the recesses 131i are recessed towards the second cover plate 132 and are connected to the capillary layer 133. The recesses 131i serve as support columns within the heat spreader 13, ensuring the rigidity and strength of the heat spreader 13 and improving its mechanical properties.

[0114] As shown in Figure 7, the protrusions 131h and concave portions 131i in the working area 131g can be arranged alternately, i.e., in the manner of protrusion 131h-concave portion 131i-protrusion 131h-concave portion 131i-protrusion 131h… It can be understood that Figure 7 is a side view; from a top view, multiple protrusions 131h can be distributed around each concave portion 131i. Except for the protrusions 131h connected to the connecting area 131f (e.g., the two protrusions 131h on the far left and far right in Figure 7), multiple concave portions 131i can be distributed around each protrusion 131h at other locations. This arrangement of concave portions 131i and protrusions 131h allows multiple support columns to be formed at various locations on the heat spreader 13, giving the heat spreader 13 sufficient rigidity and strength, and thus better mechanical properties.

[0115] The thickness of the first cover plate 131 in Figure 7 is basically the same at all locations. A different first cover plate 131, with varying thicknesses at different locations, will be described below.

[0116] In another embodiment of this invention, as shown in FIG11, one side (e.g., the lower side) of the working area 131g has an uneven structure, while the other side (e.g., the upper side) is a flat surface. The working area 131g may include a base layer 131j, which has a flat structure. Multiple protrusions 131k are provided on the same side (e.g., the lower side) of the base layer 131j, and these protrusions 131k are spaced apart from each other. Referring to FIG11 and FIG4, the protrusions 131k face the second cover plate 132 and are connected to the capillary layer 133. The protrusions 131k serve as support columns within the heat exchange plate 13, ensuring the rigidity and strength of the heat exchange plate 13 and improving its mechanical properties.

[0117] In Embodiment 1, the material of the first cover plate 131 and the material of the second cover plate 132 can be the same.

[0118] For example, the material of the third metal layer 131a is a metal, including but not limited to pure copper, copper alloy, stainless steel, titanium alloy, aluminum, magnesium, etc.

[0119] For example, the material of the second polymer material layer 131b is a polymer material, including but not limited to polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyvinylidene chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc.

[0120] For example, the glass transition temperature (Tg) of the second polymer material layer 131b is ≥320°. By setting the glass transition temperature of the second polymer material layer 131b within the aforementioned large range, the second polymer material layer 131b can have better high-temperature resistance, enabling it to maintain stable performance during local high-temperature processes in the fabrication of the heat spreader 13 (such as welding the first cover plate 131 and the second cover plate 132, manufacturing the capillary layer 133 at temperatures above 300°C, etc.), which is beneficial to improving the process yield of the heat spreader 13 and giving the heat spreader 13 better structural reliability and working performance.

[0121] For example, the material of the fourth metal layer 131c is a metal, including but not limited to pure copper, copper alloys, stainless steel, titanium alloys, aluminum, magnesium, and metal oxides, wherein the metal oxides include but are not limited to titanium dioxide, aluminum oxide, etc. The material of the fourth metal layer 131c may be the same as or different from the material of the third metal layer 131a.

[0122] For example, the first cover plate 131 can be made entirely of FCCL material, such as adhesive-free FCCL double-sided panel material. The third metal layer 131a and the fourth metal layer 131c are both copper foil, and the second polymer material layer 131b can be a PI film.

[0123] As described above, the first cover plate 131 is made of a metal-nonmetal composite, and the first cover plate 131 can be referred to as a metal-nonmetal composite layer.

[0124] In this embodiment, by using composite materials to manufacture the first cover plate 131, the advantages of metal materials and polymer materials can be combined, so that the first cover plate 131 has both good thermal conductivity and strength, as well as good flexibility and light weight.

[0125] Referring to Figures 7 (or 11), 5, and 4, the connection area 131f of the first cover plate 131 is connected to the connection area 132f of the second cover plate 132, for example, by welding. The connection areas 131f and 132f constitute the connection area 13a of the heat spreader 13. The working areas 131g of the first cover plate 131 and 132g of the second cover plate 132 are spaced apart and opposite each other, with the area between them forming the cavity 13c. Together, they constitute the working area 13b of the heat spreader 13.

[0126] As described above, the connection area 131f of the first cover plate 131 and the connection area 132f of the second cover plate 132 can be welded together. Welding generates localized high temperatures, such as up to 300°C. As described above, this embodiment, by setting the surface roughness of the surface of the metal layer connected to the polymer material layer within a small range, makes the surface where the metal layer and the polymer material layer are bonded smoother, significantly reducing pores at the microscopic interface between them, enhancing the bonding tightness, and thus improving problems such as blistering on the surface of the heat spreader and delamination between the metal layer and the polymer material layer caused by gas expansion within the pores during welding. This, in turn, improves the process yield of the heat spreader 13, giving it better structural reliability and performance.

[0127] In one embodiment of this invention, the capillary layer 133 can be pre-manufactured and assembled into the cavity 13c. As shown in FIG12, the capillary layer 133 can be connected to the first metal layer 132a, for example, it can be welded to the first metal layer 132a and integrated with the first metal layer 132a. "Integrated" means that the capillary layer 133 and the first metal layer 132a are not assembled together by mechanical parts (such as screws, rivets, clips, or adhesives), and the connection between the capillary layer 133 and the first metal layer 132a has no obvious interface gap, but rather presents a continuous or fused state. The above explanation regarding "integrated" applies to the following text.

[0128] Alternatively, in another embodiment of this invention, the capillary layer 133 may also be formed concurrently with the manufacturing process of the second cover plate 132, with the capillary layer 133 itself being a part of the second cover plate 132, and the capillary layer 133 being integrally connected with the first metal layer 132a. For example, the capillary layer 133 can be formed on the first metal layer 132a through surface treatment and molding processes, including but not limited to etching, laser engraving, electroplating, 3D printing, etc.

[0129] In this embodiment, by integrating the capillary layer 133 with the first metal layer 132a, the capillary layer 133 and the first metal layer 132a can be fully bonded, reducing the air gap between them and improving the heat dissipation performance of the heat spreader 13. Furthermore, it avoids the use of mechanical parts to connect the capillary layer 133 and the first metal layer 132a, enabling the heat spreader 13 to be made thinner and lighter.

[0130] As described above, the integrated capillary layer 133 can be manufactured through several processes, such as welding and laser engraving. These processes generate localized high temperatures, such as up to 300°C. In this embodiment, by setting the surface roughness of the surface of the metal layer connected to the polymer material layer within a small range, the surface where the metal layer and the polymer material layer are bonded is smoother, significantly reducing pores at the microscopic interface between them and enhancing their bonding tightness. This improves problems such as blistering on the surface of the heat spreader and delamination of the metal layer and the polymer material layer caused by gas expansion within the pores during the manufacturing process of the capillary layer 133. Consequently, the process yield of the heat spreader 13 can be improved, giving the heat spreader 13 better structural reliability and working performance.

[0131] In another embodiment, the connection method between the capillary layer 133 and the first metal layer 132a is not limited, as long as the capillary layer 133 is fixed within the cavity 13c. The following description will continue with the example of the capillary layer 133 and the first metal layer 132a being integrally connected.

[0132] Figure 13 illustrates the side cross-sectional structure of the capillary layer 133 in one embodiment of this invention.

[0133] As shown in Figure 13, the capillary layer 133 may include a capillary through-hole layer 133a and a plurality of supports 133c.

[0134] The capillary via layer 133a can be a generally planar layered structure with a thickness of, for example, less than or equal to 30 μm. A plurality of capillary vias 133b are provided on the capillary via layer 133a. The capillary vias 133b are used to provide capillary force. For example, the opening area of ​​the capillary vias 133b is ≤2000 μm². 2 The center-to-center distance between adjacent capillary pores 133b is ≤500μm.

[0135] All supports 133c are connected to one side of the capillary via layer 133a, and these supports 133c are spaced apart from each other. As shown in Figures 13 and 12, the capillary via layer 133a and the first metal layer 132a are stacked and arranged alternately, and the supports 133c are connected between the capillary via layer 133a and the first metal layer 132a. The supports 133c serve to support the capillary via layer 133a, and the gaps between the supports 133c can also serve as channels (to be further explained below).

[0136] As shown in Figure 13, compared to the diameter of the capillary via 133b, the width of the support 133c is larger, and the gap between two adjacent supports 133c is also larger. At least one first capillary via is present in the capillary via 133b on the capillary layer 133. At least a portion of the projection of this first capillary via along the thickness direction of the capillary via layer 133a falls into the gap, meaning that the first capillary via is connected to the gap.

[0137] Figure 14 illustrates a three-dimensional exploded structure of the capillary layer 133 in one embodiment. As shown in Figure 14, the capillary through-hole 133b can be or approximately circular, and the support 133c can be or approximately cylindrical. It is understood that Figure 14 is merely an example and is not intended to limit the construction, size, number, or relative position of the capillary through-hole 133b and the support 133c in this embodiment.

[0138] Figures 15 to 18 illustrate the arrangement of capillary holes 133b in several embodiments.

[0139] As shown in Figure 15, in one embodiment, the capillary vias 133b on the capillary via layer 133a can be arranged in a matrix or a checkerboard pattern. These capillary vias 133b can be arranged in multiple columns in a first direction and multiple rows in a second direction. The centers of all capillary vias 133b in any two rows (or any two columns) can form a rectangle. The first direction intersects the second direction, for example, the first direction is perpendicular to the second direction. In Figure 15, the first direction is horizontal and the second direction is vertical; this is just an example, and the embodiments of this application do not actually limit this. The arrangement shown in Figure 15 is convenient for manufacturing.

[0140] As shown in Figure 16, in another embodiment, the capillary vias 133b on the capillary via layer 133a may include multiple groups arranged sequentially along a first direction, such as group H1, group H2, group H3, group H4, and group H5. Each group includes at least two capillary vias 133b arranged sequentially along a second direction. For any two adjacent groups, along the second direction, at least one capillary via 133b from the other group is distributed between every two adjacent capillary vias 133b in one group. For example, for adjacent groups H1 and H2, along the second direction, one capillary via 133b from group H2 is distributed between every two adjacent capillary vias 133b in group H1, and one capillary via 133b from group H1 is distributed between every two adjacent capillary vias 133b in group H2. This arrangement can be called a cross arrangement. The scheme in Figure 16 can be considered as being based on the scheme in Figure 15, adjusting the pore diameter and / or pore spacing of the capillary vias 133b, and adding a set between adjacent sets, thereby changing the density and number of capillary vias. This allows more portions of the capillary via layer 133a to provide capillary force, ensuring that the liquid working fluid is continuously subjected to capillary force during flow. It is understood that the number and relative positions of the capillary vias 133b shown in Figure 16 are merely illustrative, and the embodiments of this application do not actually limit this.

[0141] As shown in Figure 17, in another embodiment, among all the capillary vias 133b on the capillary via layer 133a, at least two capillary vias 133b have different opening areas. For example, the three capillary vias 133b shown in Figure 17 have different opening areas. For circular holes, different opening areas mean different hole diameters. The positions of these capillary vias 133b with different opening areas can be determined as needed and are not limited to those shown in Figure 17.

[0142] For example, along a certain direction, such as the first direction shown in Figure 17, the opening area of ​​the capillary vias 133b on the capillary via layer 133a can increase in a progressively larger manner, for example, from group H1 to group H3, the opening area of ​​the capillary vias 133b increases sequentially. This "progressive increase" includes a gradual increase, as well as an overall increase in opening area but with local variations. For example, locations with smaller opening areas can be closer to the heat source, where the capillary force of the capillary vias 133b is greater, enabling rapid replenishment and reflux of the working fluid; locations with larger opening areas can be farther from the heat source, where the flow resistance is smaller, facilitating the condensed working fluid to flow back through the capillary vias 133b to the channels between the support bodies 133c. It is understood that even capillary vias 133b with larger opening areas can provide sufficient capillary force.

[0143] As shown in Figure 18, in another embodiment, the capillary vias 133b can be elongated slits, the opening area of ​​which is sufficient to provide capillary force. Exemplarily, multiple such capillary vias 133b can be arranged regularly, for example, sequentially along a first direction. It is understood that such capillary vias 133b can also be arranged arbitrarily as needed, and are not limited to those shown in Figure 18. All capillary vias 133b on the capillary via layer 133a can be slits, or only a portion of the capillary vias 133b can be slits.

[0144] Figures 14 to 18 only list some possible structures and arrangements of capillary pores 133b, and do not exhaustively list all structures and arrangements. Depending on actual needs, the capillary layer 133 may have one or more capillary pore 133b structures, and may also have one or more capillary pore 133b arrangements. Furthermore, each capillary pore 133b structure can be combined with one or more arrangements.

[0145] Figures 19 to 21 illustrate the top view structure and arrangement of the support 133c in different embodiments. As shown in Figure 19, the cross-section of the support 133c can be or approximately circular, and the support 133c can be or approximately cylindrical. As shown in Figure 20, the cross-section of the support 133c can be or approximately elliptical, and the support 133c can be or approximately elliptical cylinder. As shown in Figure 21, the cross-section of the support 133c can be or approximately rectangular, and the support 133c can be a square prism. In another embodiment, the support 133c can be a prism of other shapes, with a cross-section of any other polygon, such as a pentagon, hexagon, etc.

[0146] As shown in Figures 19-21, multiple supports 133c can be distributed in a point-like pattern, forming gaps in various directions, i.e., channels in various directions, and these channels are interconnected to form a channel network. When the heat spreader 13 is working, when the working fluid evaporates at a certain location in the channel network, multiple surrounding locations can replenish the liquid working fluid to that location. Therefore, the heat spreader 13 is not sensitive to the location of the heat source; it can correspond to multiple heat sources and conduct heat dissipation for them; or, the position of the heat spreader 13 can be fixed while the position of the heat source is adjusted as needed, ensuring that the heat spreader 13 can always conduct heat dissipation normally. Furthermore, it can also improve the defect of excessive temperature rise at a certain location due to insufficient liquid working fluid replenishment after evaporation, reducing the phenomenon of unstable boiling and evaporation flow of the working fluid. The above principles will be further explained below.

[0147] Figure 22 illustrates the three-dimensional structure and arrangement of the support 133c in another embodiment. As shown in Figure 22, multiple supports 133c can be arranged sequentially along a first direction, and each support 133c can be a strip-shaped structure extending along a second direction. The second direction is the length direction of the support 133c, and the dimension of each support 133c along the second direction is larger than its dimension along other directions. Thus, a channel extending along the second direction can be formed between any two adjacent supports 133c, and this channel can be called a trench. The width of the trench can be consistent or substantially consistent at all points, and the trenches can be parallel. The trench is used to supply the flow of liquid working fluid. Referring to Figure 22, since the width of the trench is substantially constant, the flow direction of the liquid working fluid in the trench is strong, and the flow resistance is small. This allows the liquid working fluid to be quickly replenished to the evaporation position, thereby ensuring the heat conduction and heat dissipation effect. The above principle will be further explained below.

[0148] In this embodiment, all supports 133c in the capillary layer 133 can adopt the structure and arrangement shown in FIG22, and such supports 133c can be referred to as the first supports. Alternatively, only a portion of the supports 133c adopts the structure and arrangement shown in FIG22, and such supports 133c can be referred to as the first supports; the other portion of the supports 133c can adopt other structures and arrangements, such as one or more of the structures and arrangements in FIG19-FIG21.

[0149] Based on the embodiment shown in FIG22, FIG23 illustrates the three-dimensional structure and arrangement of the support 133c in another embodiment, and FIG24 is a top view of FIG23.

[0150] As shown in Figures 23 and 24, multiple supports 133c can be arranged into multiple groups along a first direction, such as group S1, group S2, group S3, group S4, group S5, and group S6. Each group can include at least two supports 133c arranged sequentially along a second direction. For example, group S1 has two supports 133c arranged sequentially along the second direction, and group S2 has three supports 133c arranged sequentially along the second direction. One of any two adjacent groups can be called the first group, and the other can be called the second group. For example, group S1 can be called the first group, and group S2 can be called the second group, or group S1 can be called the second group, and group S2 can be called the second group. Of course, group S2 and group S3 can also be called the first group and the second group, respectively. It is understood that the number of supports 133c in Figures 23 and 24 is merely illustrative and is not a limitation of the embodiments of this application.

[0151] As shown in Figure 24, the projection of the gap between any two adjacent supports 133c in the first group in the first direction falls on one of the supports 133c in the second group. For example, the projection of the gap G1 between two adjacent supports 133c in group S1 in the first direction can fall on the middle support 133c in group S2; the projection of the gap G2 between two adjacent supports 133c in group S2 in the first direction can fall on the upper support 133c in group S1; and the projection of the gap G3 between two adjacent supports 133c in group S2 in the first direction can fall on the lower support 133c in group S1.

[0152] As shown in Figure 24, a groove (referring to a channel extending along the second direction) is formed between each pair of adjacent groups, and the width of the groove is basically constant.

[0153] Based on the above description, it can be understood that the embodiment shown in Figure 24 combines the advantages of the embodiments in Figure 22 and Figure 21. Specifically, the formation of grooves gives the liquid working fluid within them strong flow directionality and low flow resistance, facilitating rapid replenishment of the liquid working fluid to the evaporation location and ensuring effective heat conduction and dissipation. Furthermore, gaps (e.g., gaps G1, G2, and G3) can be formed between adjacent supports 133c within each group. These gaps also act as channels between adjacent supports 133c. These gaps communicate with the grooves to form a network of interconnected channels. When the heat spreader 13 is operating, after the working fluid at a certain location in the channel network vaporizes, multiple surrounding locations can replenish the liquid working fluid to that location. This makes the heat spreader 13 insensitive to the location of heat sources, allowing it to correspond to multiple heat sources and conduct heat for them. Alternatively, the position of the heat spreader 13 can be fixed while adjusting the position of the heat sources as needed, ensuring that the heat spreader 13 always performs normal heat conduction and dissipation. This also improves the defect of excessive temperature rise at a certain location due to insufficient liquid replenishment after the working fluid vaporizes and evaporates, reducing the instability of working fluid boiling and evaporation flow. Furthermore, the gaps between adjacent supports 133c within each group (e.g., gaps G1, G2, and G3) are relatively small, even smaller than the width of the groove between adjacent supports 133c. These gaps provide a certain amount of capillary force, which helps improve the fluidity of the liquid working fluid, ensuring rapid replenishment and thus improving heat conduction and dissipation. The above principles will be further explained below.

[0154] In this embodiment, all supports 133c in the capillary layer 133 can adopt the scheme shown in FIG. 22; or, all supports 133c can adopt the scheme shown in FIG. 24; or, some supports 133c can adopt the scheme shown in FIG. 22, and other supports 133c can adopt the scheme shown in FIG. 24; or, some supports 133c can adopt the schemes shown in FIG. 22 and / or FIG. 24, and other supports 133c can adopt one or more of the schemes shown in FIG. 19-FIG. In this embodiment, any support 133c that adopts the scheme shown in FIG. 22 or FIG. 24 can be referred to as the first support.

[0155] Figures 19 to 24 only list some possible structures and arrangements of the support 133c, and do not exhaust all structures and arrangements. Depending on actual needs, the capillary layer 133 may have one or more structures of support 133c, and may also have one or more arrangements of support 133c. Furthermore, each structure of support 133c can be combined with one or more arrangements.

[0156] Figures 25-28, viewed from above, illustrate the positional relationship between the capillary vias 133b and the support 133c in several embodiments, with the support 133c below the capillary via layer 133a indicated by dashed lines. It is understood that the structures and arrangements of the capillary vias 133b and the support 133c in Figures 25-28 are merely examples and not intended to limit this embodiment.

[0157] As shown in Figure 25, in one embodiment, the support 133c may overlap with at least one capillary aperture 133b, meaning that the support 133c can block at least a portion of the capillary aperture 133b. For example, the support 133c may overlap with multiple capillary apertures 133b; there may be multiple such supports 133c, for example, each support 133c in the capillary layer 133 may overlap with multiple capillary apertures 133b.

[0158] Unlike Figure 25, as shown in Figure 26, in another embodiment, at least one support 133c does not overlap with the capillary via 133b, meaning the support 133c completely avoids the capillary via 133b. This support 133c can be located in the un-perforated area of ​​the capillary via layer 133a. For example, each support 133c in the capillary layer 133 does not overlap with the capillary via 133b; that is, each support 133c can be located in the un-perforated area.

[0159] Unlike Figure 26, as shown in Figure 27, the circular capillary pore 133b can be paired with the strip-shaped support 133c.

[0160] As shown in Figure 28, in another embodiment, the capillary through-hole 133b can be a slit, and the support 133c can be a strip-shaped structure, with the extension direction of the slit intersecting the extension direction of the strip-shaped structure. Thus, the support 133c can overlap with multiple capillary through-holes 133b, and the groove between two adjacent supports 133c can communicate with multiple slits. It is understood that the width of the groove between two adjacent supports 133c can be relatively large to accommodate a larger amount of liquid working fluid, allowing the multiple slits communicating with the groove to fully absorb the liquid working fluid, ultimately ensuring thermal conductivity efficiency.

[0161] Based on Figures 25 to 28, it can be understood that in this embodiment, the design of the capillary through-hole 133b (including at least one of the structure and arrangement patterns) can be used in combination with the design of the support 133c (including at least one of the structure and arrangement patterns), and each design of the capillary through-hole 133b can be combined with one or more designs of the support 133c.

[0162] In the above embodiments, as shown in FIG12, the working area 132g of the second cover plate 132 is basically a flat layer structure, and the support body 133c is directly protruding on the first metal layer 132a. Based on the above embodiments, the structure of the working area 132g can be adjusted to have multiple protrusions, and then the support body 133c covering these protrusions can be formed. This will be explained below.

[0163] Figure 29 illustrates a partial side cross-sectional structure of the capillary layer 133 and the second cover plate 132 in another embodiment, where the second metal layer 132c is not shown. As shown in Figure 29, the first polymer material layer 132b may include a base layer 132h and a plurality of protrusions 132i. The base layer 132h may be a flat layer structure, and these protrusions 132i protrude from the same side (e.g., the upper side) of the base layer 132h. Referring to Figures 29 and 4, the protrusions 132i protrude from the base layer 132h on the side facing the first cover plate 131. The first metal layer 132a covers the base layer 132h. Each support 133c covers one protrusion 132i and connects the first metal layer 132a and the capillary through-hole layer 133a. It can be considered that each support 133c and its covering protrusion 132i together constitute a support column structure.

[0164] For example, the first metal layer 132a and the support 133c can be made of the same material, such as pure copper or copper alloy.

[0165] For example, a first polymer material layer 132b with protrusions 132i can be manufactured by processes such as etching (e.g., PI etching), laser engraving, and hot pressing, and then a copper layer can be formed on the first polymer material layer 132b by electroplating. In this copper layer, the portion covering the base layer 132h can be referred to as the first metal layer 132a, and the portion covering the protrusions 132i can be referred to as the support 133c. It is understood that Figure 29 illustrates the boundary line between the first metal layer 132a and the support 133c, which is only for clarity.

[0166] Compared to the embodiment shown in Figure 12, in the embodiment shown in Figure 29, since the support 133c and its covering protrusion 132i together constitute a support column structure, and the protrusion 132i is made of a lighter polymer material, the support column structure is lighter, which helps to reduce the weight of the heat spreader 13. In addition, this structure has higher processing precision, which can ensure the structural accuracy of the heat spreader 13.

[0167] Figure 30 illustrates a partial side-section of the working area 132g and the capillary layer 133 in another embodiment, where the second metal layer 132c is not shown. As shown in Figure 30, the thickness of the second cover plate 132 can be substantially uniform at various locations, and multiple recesses 132j ​​can be provided on the side of the working area 132g facing away from the first cover plate 131. The recesses 132j ​​are formed by the first metal layer 132a and the first polymer material layer 132b. The recesses 132j ​​can be pits or grooves, with an opening diameter, for example, between 100μm and 200μm, and a depth, for example, around 20μm. Referring to Figures 30 and 4, each recess 132j ​​is recessed toward the first cover plate 131, or toward the cavity 13c of the heat spreader 13. Therefore, each recess 132j ​​forms a protrusion on the inner wall of the cavity 13c, and recesses are formed between adjacent protrusions. The portion of the first metal layer 132a located in each recess 132j ​​serves as a support 133c, and each support 133c is connected to the capillary via layer 133a. A channel is formed between any two adjacent supports 133c, the shape of which can be determined as needed, for example, it can be a strip-shaped groove or a pit-shaped slot. This channel communicates with the capillary via 133b. In this embodiment, the capillary layer 133 can be considered as the capillary via layer 133a, or the capillary layer 133 can include the capillary via layer 133a and the portion of the first metal layer 132a located in each recess 132j.

[0168] Compared to the embodiment shown in FIG12, the embodiment shown in FIG30 can utilize the first metal layer 132a to form the support 133c, thus reducing the thickness and weight of the second cover plate 132. Furthermore, the second cover plate 132 of FIG30 has higher processing precision, ensuring the structural accuracy of the heat spreader 13.

[0169] Based on Figure 30, in another embodiment, as shown in Figure 31, the second cover plate 132 may also include a second metal layer 132c, and the recess 132j ​​is formed by the first metal layer 132a, the first polymer material layer 132b, and the second metal layer 132c. The embodiment shown in Figure 31, due to the addition of the second metal layer 132c, results in better structural strength and rigidity of the second cover plate 132, and superior mechanical properties.

[0170] As shown in Figures 30 and 31, each recess 132j ​​can be filled with a thermally conductive material 132m, as an example. Figures 30 and 31 show only one recess 132j ​​filled with the thermally conductive material 132m for clarity; this is merely illustrative. The thermally conductive material 132m completely fills the recess 132j, giving the second cover plate 132 a smooth outer surface. The thermally conductive material 132m has good thermal conductivity and includes, but is not limited to, thermally conductive adhesives containing graphene, phase change materials (PCMs), etc. The thermally conductive material 132m is used to expel air (air is a poor conductor of heat) from the recess 132j, thereby enhancing the thermal conductivity between the second cover plate 132 and the heat source. It is understood that in another embodiment, the thermally conductive material 132m may not be provided.

[0171] The working principle of the heat spreader 13 is explained below.

[0172] Referring to Figure 4, the first cover plate 131 can face away from the heat source, while the second cover plate 132 can face the heat source, absorbing the heat from the heat source. In the heat spreader 13, the area closer to the heat source is the high-temperature zone, and the area farther from the heat source is the low-temperature zone. The liquid working fluid in the high-temperature zone absorbs heat and evaporates, flowing from the high-temperature zone to the low-temperature zone and condensing there. The liquid working fluid also fills the channels between adjacent supports 133c and the capillary holes 133b. At a certain point in the capillary layer 133, the evaporation of the liquid working fluid in the channels and capillary holes 133b at that point causes a drop in the liquid level. Because the capillary holes 133b can provide capillary force, this point can draw liquid working fluid from surrounding areas to replenish the liquid level, thereby achieving the circulation of the working fluid. During the flow of the working fluid, it transfers heat from the high-temperature zone to the low-temperature zone, achieving both heat conduction and heat dissipation.

[0173] Based on the above working principle, the working mechanism and technical effect of the capillary pore 133b and the support 133c can be understood.

[0174] As shown in Figure 16, the capillary through-holes 133b are arranged in a cross pattern, which can increase the density and number of capillary through-holes 133b. This allows more parts of the capillary layer 133 to be subjected to capillary force, so that the liquid working fluid can be continuously subjected to capillary force during the flow process. This can increase the replenishment and reflux speed, which is beneficial to improving heat conduction and heat dissipation efficiency.

[0175] For the capillary through-hole 133b shown in Figure 17, the opening area of ​​the capillary through-hole 133b can increase in an increasing trend. For example, from group H1 to group H3, the opening area of ​​the capillary through-hole 133b increases sequentially. For example, the positions with smaller opening areas can be closer to the heat source. The capillary force of the capillary through-hole 133b is greater at these positions, which can realize rapid replenishment and reflux of the working fluid, which is beneficial to the rapid heat conduction and dissipation in the high-temperature area. The positions with larger opening areas can be farther away from the heat source. The flow resistance is smaller at these positions, which facilitates the condensed working fluid to flow back through the capillary through-hole 133b to the channel between the support body 133c, which is beneficial to improve the reflux speed and thus improve the heat conduction and dissipation efficiency.

[0176] For the supports 133c shown in Figures 19-21, the supports 133c are distributed in a dotted pattern, forming a channel network between them. When the heat spreader 13 is working, after the working fluid evaporates at a certain location in the channel network, multiple surrounding locations can replenish the liquid working fluid to that location. This design makes the heat spreader 13 insensitive to the location of the heat source; the heat spreader 13 can correspond to multiple heat sources and conduct heat dissipation for multiple heat sources. Alternatively, the position of the heat spreader 13 can be fixed while the position of the heat source can be adjusted as needed, ensuring that the heat spreader 13 can always conduct heat dissipation normally. In addition, it can also improve the defect of excessive temperature rise at a certain location due to insufficient liquid working fluid replenishment after working fluid evaporation, reducing the phenomenon of unstable boiling and evaporation flow of the working fluid.

[0177] For the support 133c shown in Figure 22, since the width of the groove between adjacent supports 133c is basically constant, the flow direction of the liquid working fluid in the groove is strong and the flow resistance is small. This allows the liquid working fluid to be quickly replenished to the evaporation position, thereby ensuring the heat conduction and heat dissipation effect.

[0178] The support 133c shown in Figure 24 combines the advantages of the embodiments in Figures 22 and 21. Specifically, the formation of grooves gives the liquid working fluid within them strong flow directionality and low flow resistance, facilitating rapid replenishment of the liquid working fluid to the evaporation location and ensuring effective heat conduction and dissipation. Furthermore, gaps (e.g., gaps G1, G2, and G3) can be formed between adjacent supports 133c within each group, communicating with the grooves to form a network of interconnected channels. When the heat spreader 13 is operating, after the working fluid at a certain location in the channel network vaporizes, multiple surrounding locations can replenish the liquid working fluid to that location. This makes the heat spreader 13 insensitive to the location of heat sources, allowing it to correspond to multiple heat sources and conduct heat for them. Alternatively, the position of the heat spreader 13 can be fixed while adjusting the position of the heat sources as needed, ensuring that the heat spreader 13 always performs normal heat conduction and dissipation. This design can also improve the situation where a certain location experiences excessive temperature rise due to insufficient liquid replenishment after the working fluid vaporizes and evaporates, thus reducing the instability of the working fluid's boiling and evaporation flow. Furthermore, the gaps between adjacent supports 133c within each group (e.g., gaps G1, G2, and G3) are relatively small. These gaps can be smaller than the width of the groove between adjacent supports 133c. These gaps provide a certain amount of capillary force, which helps improve the fluidity of the liquid working fluid, ensuring rapid replenishment and thereby enhancing heat conduction and dissipation.

[0179] Based on the above embodiments, the material composition of the first cover plate 131 and the second cover plate 132 can be adjusted to obtain other embodiments. These will be described below.

[0180] Figure 32 illustrates a partial side cross-sectional structure of the heat spreader 13 in Embodiment 2. Comparing Figure 32 and Figure 4, compared to Embodiment 1, in Embodiment 2, the heat spreader 13 has the following features: the first cover plate 131 may include a third metal layer 131a and a second polymer material layer 131b, but not a fourth metal layer 131c; the second cover plate 132 may include a first metal layer 132a and a first polymer material layer 132b, but not a second metal layer 132c; both the first cover plate 131 and the second cover plate 132 can be glue-free FCCL single-sided panels. Because the heat spreader 13 in Embodiment 2 has two fewer metal layers, it is thinner, more flexible, more resistant to bending, and has a lower manufacturing difficulty, thus meeting product requirements.

[0181] It is understood that the structure of capillary layer 133 in Figure 32 is the same as that in Figure 4; this is merely an example. In fact, capillary layer 133 in Embodiment 2 can also adopt the structure shown in Figure 23.

[0182] As shown in Figure 32, in one embodiment of the second example, the first cover plate 131 can be designed with uniform thickness, and both sides of its thickness direction can have uneven structures to form support columns. As shown in Figure 33, in another embodiment of the second example, the first cover plate 131 can be designed with unequal thickness, and one side (e.g., the lower side) of its working area 131g has an uneven structure and forms multiple protrusions 131k, which serve as support columns; the other side (e.g., the upper side) of the working area 131g is a flat surface.

[0183] Based on Embodiment 2, Figure 34 illustrates a partial side cross-sectional structure of the heat spreader 13 in Embodiment 3. Compared to Embodiment 2, as shown in Figure 34, in Embodiment 3: the second cover plate 132 may include a first metal layer 132a, a first polymer material layer 132b, and a second metal layer 132c. The second cover plate 132 may be, for example, a glue-free FCCL double-sided panel. The first cover plate 131 in Embodiment 3, due to the reduction of one metal layer, is thinner, more flexible, more resistant to bending, and has lower manufacturing difficulty, thus meeting product requirements. Furthermore, combining Figures 34 and 3, in one embodiment, the second polymer material layer 131b in the first cover plate 131 can be connected to the display screen 11. Because the second polymer material layer 131b is relatively soft, it has less impact on the display screen 11 and also provides cushioning protection for the display screen 11.

[0184] Based on Embodiment 2, Figure 35 illustrates a partial side profile of the heat spreader 13 in Embodiment 4. Compared to Embodiment 2, as shown in Figure 35, in Embodiment 4: the first cover plate 131 may include a third metal layer 131a, a second polymer material layer 131b, and a fourth metal layer 131c. The first cover plate 131 may be, for example, a glue-free FCCL double-sided panel. The second cover plate 132 in Embodiment 4, due to the reduction of one metal layer, is thinner, more flexible, more resistant to bending, and has lower manufacturing difficulty, thus meeting product requirements. Furthermore, the first polymer material layer 132b in the second cover plate 132 can face the heat source device. Because the first polymer material layer 132b is relatively soft, its impact on the heat source device is smaller, providing a buffering and protective effect. The insulating properties of the first polymer material layer 132b ensure that it does not affect the operation of the heat source device.

[0185] In the above embodiments, the first cover plate 131 is a metal-nonmetal composite material. The following will describe embodiments where the first cover plate 131 is made of metal or a metal composite material, based on the above embodiments.

[0186] Figure 36 illustrates a partial side cross-sectional structure of the first cover plate 131 in Embodiment 5. Unlike the embodiments described above, as shown in Figure 36, the first cover plate 131 in Embodiment 5 includes a third metal layer 131a, but lacks a second polymer material layer 131b and a fourth metal layer 131c. The material of the third metal layer 131a can be pure copper or a copper alloy. The first cover plate 131 in Embodiment 5 is relatively thin and lightweight, with lower cost, and can meet product requirements.

[0187] As shown in Figure 36, in one embodiment of Example 5, the first cover plate 131 can be designed with uniform thickness, and both sides of its thickness direction can have uneven structures to form support columns. As shown in Figure 37, in another embodiment of Example 5, the first cover plate 131 can be designed with unequal thickness, and one side (e.g., the lower side) of its working area 131g has an uneven structure and forms multiple protrusions 131k, which serve as support columns; the other side (e.g., the upper side) of the working area 131g is a flat surface.

[0188] Figure 38 illustrates a partial side profile of the first cover plate 131 in Embodiment Six. Unlike Embodiment Five, the material of the third metal layer 131a in Embodiment Six can be a metal composite material composed of different metals. As shown in Figure 38, the third metal layer 131a may include metal layer 131m and metal layer 131n, which are different metal materials. Metal layer 131m includes, but is not limited to, stainless steel, titanium, aluminum, magnesium, etc., while metal layer 131n can be pure copper or a copper alloy. Metal layer 131n faces the second cover plate 132 and is connected to it. The solution in Embodiment Six can increase the strength of the first cover plate 131 and improve its bending resistance.

[0189] As shown in Figure 38, in one embodiment of Example 6, the first cover plate 131 can be designed with uniform thickness, and both sides of its thickness direction can have uneven structures to form support columns. As shown in Figure 39, in another embodiment of Example 6, the first cover plate 131 can be designed with unequal thickness, and one side (e.g., the lower side) of its working area 131g has an uneven structure and forms multiple protrusions 131k, which serve as support columns; the other side (e.g., the upper side) of the working area 131g is a flat surface.

[0190] In this embodiment of the application, for the purpose of differentiation, the base layer 132h can be referred to as the first base layer, the base layer 131j as the second base layer, the protrusion 132i as the first protrusion, the protrusion 131h as the second protrusion, the protrusion 131k as the third protrusion, the concave portion 132j ​​as the first concave portion, and the concave portion 131i as the second concave portion.

[0191] The solution of this application embodiment can improve the thermal conductivity of the heat spreader 13, increase the maximum heat transfer Qmax of the heat spreader 13, and reduce the weight and thickness of the heat spreader 13. The solution of this application embodiment helps to improve the heat dissipation capacity of the electronic device 1, increase the maximum clock speed of the chip in the electronic device 1, and facilitate the realization of a thinner and lighter overall device.

[0192] For ease of understanding, the relevant technical terms involved in the embodiments of this application will be explained and described below.

[0193] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more.

[0194] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Features specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0195] The term "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Similarly, "fixation" should also be interpreted broadly. For example, "fixation" can be direct fixation or indirect fixation through an intermediate medium.

[0196] The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," "top," and "bottom," are only for reference to the directions in the accompanying drawings. These directional terms are used to better and more clearly explain and understand the embodiments of this application, and are not intended to explicitly or implicitly suggest that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, etc., and therefore should not be construed as limiting the embodiments of this application.

[0197] In the description of the embodiments in this application, unless otherwise stated, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone.

[0198] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat spreader (13), characterized in that, It includes a first cover plate (131), a second cover plate (132), and a capillary layer (133). The first cover plate (131) and the second cover plate (132) are stacked, and the first cover plate (131) and the second cover plate (132) are connected to form a cavity (13c). The capillary layer (133) is located in the cavity (13c). The second cover plate (132) includes a first metal layer (132a) and a first polymer material layer (132b), the first metal layer (132a) and the first polymer material layer (132b) are stacked, the first metal layer (132a) is connected between the first polymer material layer (132b) and the first cover plate (131), and the surface roughness Rz of the surface (132d) of the first metal layer (132a) connected to the first polymer material layer (132b) is [0.5μm, 5μm].

2. The temperature distribution plate (13) according to claim 1, characterized in that, The capillary layer (133) is integrally connected with the first metal layer (132a).

3. The temperature distribution plate (13) according to claim 1 or 2, characterized in that, The capillary layer (133) includes a capillary through-hole layer (133a) and a plurality of supports (133c), wherein the plurality of supports (133c) are connected between the capillary through-hole layer (133a) and the first metal layer (132a); The capillary through-hole layer (133a) is provided with a plurality of capillary through-holes (133b), among which a first capillary through-hole (133b) is provided. A channel is formed between any two adjacent supports (133c). At least a portion of the projection of the first capillary through-hole (133b) in the thickness direction of the capillary through-hole layer (133a) falls between two adjacent supports (133c).

4. The temperature distribution plate (13) according to claim 3, characterized in that, The first polymer material layer (132b) includes a first base layer (132h) and a plurality of first protrusions (132i), the plurality of first protrusions (132i) are all protruding on the side of the first base layer (132h) facing the first cover plate (131); the first metal layer (132a) covers the first base layer (132h), and each of the supports (133c) covers one of the first protrusions (132i).

5. The temperature distribution plate (13) according to claim 1 or 2, characterized in that, The second cover plate (132) has a plurality of first recesses (132j) on the side opposite to the first cover plate (131). Each first recess (132j) is recessed toward the first cover plate (131). The portion of the first metal layer (132a) located in each first recess (132j) serves as a support (133c). A channel is formed between any two adjacent supports (133c). Each support (133c) is connected to the capillary layer (133). The capillary layer (133) is provided with a plurality of capillary through holes (133b), among which a first capillary through hole (133b) is provided, and at least a portion of the projection of the first capillary through hole (133b) in the thickness direction of the capillary layer (133) falls between two adjacent supports (133c).

6. The temperature distribution plate (13) according to claim 5, characterized in that, Each of the first recesses (132j) is filled with a thermally conductive material (132m).

7. The temperature distribution plate (13) according to any one of claims 3-6, characterized in that, The plurality of capillary pores (133b) include multiple groups arranged sequentially along a first direction, each group including at least two capillary pores (133b) arranged sequentially along a second direction, the first direction intersecting the second direction; For any two adjacent groups, along the second direction, at least one capillary pore (133b) from the other group is distributed between each two adjacent capillary pores (133b) in one group.

8. The temperature distribution plate (13) according to any one of claims 3-7, characterized in that, At least two of the plurality of capillary pores (133b) have different opening areas.

9. The temperature distribution plate (13) according to any one of claims 3-8, characterized in that, At least one of the plurality of supports (133c) is a columnar structure or a strip structure.

10. The temperature distribution plate (13) according to any one of claims 3-9, characterized in that, The plurality of supports (133c) includes a plurality of first supports (133c), which are arranged sequentially along a first direction. Each first support (133c) is a strip-shaped structure extending along a second direction, which intersects with the second direction.

11. The temperature distribution plate (13) according to claim 10, characterized in that, The plurality of first supports (133c) includes a first group (S1) and a second group (S2), the first group (S1) and the second group (S2) are adjacent and arranged along the first direction, and each of the first group (S1) and the second group (S2) includes at least two first supports (133c) arranged sequentially along the second direction. The projection of the gap between any two adjacent first supports (133c) in the first group (S1) onto the first direction falls on one of the first supports (133c) in the second group (S2).

12. The temperature distribution plate (13) according to any one of claims 1-11, characterized in that, The second cover plate (132) further includes a second metal layer (132c), wherein the first metal layer (132a), the first polymer material layer (132b) and the second metal layer (132c) are stacked in sequence, the second metal layer (132c) is connected to the first polymer material layer (132b), and the surface roughness Rz of the surface (132e) of the second metal layer (132c) connected to the first polymer material layer (132b) is [0.5μm, 5μm].

13. The temperature distribution plate (13) according to any one of claims 1-12, characterized in that, The first cover plate (131) includes a working area (131g) which participates in forming the cavity (13c); The working area (131g) includes a plurality of second protrusions (131h) and a plurality of second recesses (131i), the plurality of second protrusions (131h) and the plurality of second recesses (131i) are arranged alternately, and a plurality of second protrusions (131h) are provided around each second recess (131i); each second protrusion (131h) protrudes in a direction away from the second cover plate (132); each second recess (131i) is recessed toward the second cover plate (132) and connected to the capillary layer (133).

14. The temperature distribution plate (13) according to any one of claims 1-12, characterized in that, The first cover plate (131) includes a working area (131g) which participates in forming the cavity (13c); The working area (131g) includes a second base layer (131j) and a plurality of third protrusions (131k). The plurality of third protrusions (131k) are all protruding on the side of the second base layer (131j) facing the second cover plate (132) and are all connected to the capillary layer (133).

15. The temperature distribution plate (13) according to any one of claims 1-13, characterized in that, The first cover plate (131) includes a third metal layer (131a) connected to the first metal layer (132a).

16. The temperature distribution plate (13) according to claim 15, characterized in that, The first cover plate (131) further includes a second polymer material layer (131b) connected to the third metal layer (131a). The second polymer material layer (131b), the third metal layer (131a) and the first metal layer (132a) are stacked in sequence. The surface roughness Rz of the surface (131d) of the third metal layer (131a) connected to the second polymer material layer (131b) is [0.5μm, 5μm].

17. The temperature distribution plate (13) according to claim 16, characterized in that, The first cover plate (131) further includes a fourth metal layer (131c), wherein the fourth metal layer (131c), the second polymer material layer (131b), and the third metal layer (131a) are stacked in sequence, the fourth metal layer (131c) is connected to the second polymer material layer (131b), and the surface roughness Rz of the surface (131e) of the fourth metal layer (131c) connected to the second polymer material layer (131b) is [0.5μm, 5μm].

18. The temperature distribution plate (13) according to any one of claims 1-17, characterized in that, The polymer material layer in the heat spreader includes polyimide, polypropylene, polytetrafluoroethylene, polyethylene terephthalate, polyethylene naphthalate, polydimethylsiloxane, polyethylene, polymethylethylene carbonate, polyvinyl chloride, polyvinylidene chloride, polystyrene, or polyamide.

19. The temperature distribution plate (13) according to any one of claims 1-18, characterized in that, The glass transition temperature of the polymer material layer in the heat spreader is greater than or equal to 320°C.

20. An electronic device (1), characterized in that, It includes a housing (12) and a heat spreader (13) as described in any one of claims 1-19, the heat spreader (13) being located within the housing (12).

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