A lower carrier enabling airflow

Abstract

The present invention relates to a lower carrier (1) which is placed on a bottom part of a cooker and on which elements belonging to the cooker are mounted, and which prevents the heating of the elements (components on a circuit board, etc.) by enabling airflow with the aid of a guiding portion (15) and an air leakage preventer (16).

Description

[0001] A LOWER CARRIER ENABLING AIRFLOW

[0002] Technical Field

[0003] The invention relates to a lower carrier for cookers.

[0004] More specifically, the invention relates to a lower carrier which is placed on a bottom part of a cooker and on which components belonging to the cooker are mounted, which enables the air blown by a fan to be directed to a heat sink block without flow separation, which prevents air from escaping to a dead zone during the directing, and which thereby provides high-efficiency cooling of the components intended to be cooled.

[0005] State of the Art

[0006] A cooker is a household appliance used for cooking or heating food. This device, generally located on a kitchen countertop or above the countertop, is used for preparing meals (heating, cooking). There are various types of cookers, such as gas or electricity. In induction hobs, which are a type of electric cooker, lower carrier structures are used to accommodate components with different functions.

[0007] In induction hobs, the part (lower carrier) where the electronic components and the fan are placed plays a critical role in the safe and efficient operation of the device. The lower carrier provides mechanical protection for the electronic circuits and ensures durability against external factors. The lower carrier contributes to the uninterrupted operation of the circuits by ensuring that the electronic components remain in a fixed position. The structure of the lower carrier is expected to facilitate the overall assembly of the device and simplify its maintenance. Lower carriers significantly increase the performance and durability of induction hobs.

[0008] In the structuring of the carrier where electronic components and the fan are placed in induction hobs, airflow is of great importance. Airflow ensures that the heat generated inside the device is effectively expelled, thereby preventing the components from overheating. Structures created without paying attention to airflow hinder the efficient operation of the fan, leading to inadequate cooling. This situation causes the electronic circuits to heat up, leading to performance loss and damage to the components. Inadequate airflow shortens the lifespan of the device and causes malfunctions. As malfunctions increase, maintenance costs also rise. On the other hand, energy efficiency may also decrease as a result of overheating, which in turn increases the user's electricity bill. When airflow is not properly provided, the fan operates more. When the fan operates more, it leads to higher noise levels. Therefore, optimizing the airflow in the structuring of lower carriers that carry electronic components, fans, etc. used in induction hobs is of critical importance for the safe, efficient, and long- lasting operation of the device.

[0009] In induction hobs, the mounting method, angle, and direction of rotation of the fan to be precisely adjusted for the airflow to reach the targeted regions. While the air blown by the fan needs to be directed to the region to be cooled, the airflow is distributed in different directions due to incorrect adjustment of the mounting angle or deviations caused by the fan's direction of rotation. In this case, the air is directed to undesired regions instead of reaching the heat sink block or critical components, and sufficient airflow cannot be provided to the areas that need to be cooled. This situation is called flow separation and reduces thermal efficiency by causing the components to overheat. In the lower tray where the fan and other components are placed, it is extremely critical that the air blown by the fan reaches the heat sink block in an uninterrupted manner. The fan ensures the effective cooling of the heat sink block with the air it directs to the heat sink block. The uninterrupted flow of air to the heat sink block increases thermal efficiency and prevents the hob components from overheating. If the air directed by the fan to the heat sink block undergoes flow separation for any reason, the airflow cannot be distributed properly on the heat sink block, which reduces the effectiveness of the cooling. Hot air accumulation can occur in the regions where flow separation occurs. This situation prevents the heat sink block from being cooled sufficiently. Therefore, it is critically important for the airflow to reach the heat sink block without flow separation for the efficient operation and longevity of the components.

[0010] During the assembly of the fan and other components in the lower tray in induction hobs, for reasons such as the heat sink block not being able to be placed flush against the edge of the lower tray, the airflow generated by the fan can escape into the parts called the dead zone, which is the area between the side surface of the heat sink block and the edge of the lower tray. This situation creates interruptions in the air's access to the heat sink block and prevents an effective heat transfer. The escape of air into the dead zone reduces the thermal performance on the heat sink block, causing the components to overheat. The inability to effectively dissipate heat increases the operating temperature of the electronic parts, and the temperature increase leads to performance loss or even malfunctioning of the components.

[0011] TR 2022 / 015507 discloses a system that provides long-lasting use by utilizing uniform, more practical, and superior composite materials instead of metal, plastic, and glass materials used in cookers. EP2498577B1 discloses a carrier plate made of plastic that houses a circuit carrier equipped with electronic components and a metal cover structure detachably attached to the underside of the carrier plate. A latching element placed on the cover engages horizontally with a locking recess formed on the carrier plate and extends in a direction facing away from the outer side of the bottom cover toward the inner side. The latching element is configured as a curved plate in the form of a spring tongue. The document provides a solution related to the fixation and attachment of the carrier plate but does not offer any solution for airflow.

[0012] TR 2021 / 021325 discloses a cooling device comprising a body defining a storage compartment and at least one control unit provided on an outward-facing outer wall surface of the body for controlling the operation of the cooling device. The document describes the positioning of the tray in different locations.

[0013] As a result, considering the prior art and the aforementioned drawbacks, there is a need for a lower carrier that allows for the easy placement of electronic circuits, fans, etc., provides airflow with high efficiency, and conveys the air to the heat sink block without flow separation and without entering a dead zone.

[0014] Object and Brief Description of the Invention

[0015] An object of the invention is to provide a lower carrier that allows the majority of the air blown by a fan to be conveyed to a heat sink block without flow separation and without air escaping into a dead zone.

[0016] Another object of the invention is to provide a lower carrier for cookers (hobs, ovens, etc.) that efficiently distribute airflow.

[0017] Another object of the invention is to provide a lower carrier that accommodates electronic circuits (electronic boards, etc.), fans, and other cooker elements.

[0018] Another object of the invention is to provide for the prevention of heating of electronic components by enabling airflow.

[0019] Another object of the invention is to provide for the cooling of elements intended to be cooled by enabling airflow.

[0020] A lower carrier which is placed on a bottom part of a cooker and on which components belonging to the cooker are mounted, for the purpose of directing the air blown by a fan to a heat sink block without flow separation, preventing air from escaping to a dead zone during directing, and thereby enabling high-efficiency cooling of the components intended to be cooled, the lower carrier comprises:

[0021] - at least one air duct formed on a second edge, which enables the outlet of the air that is blown by the fan and directed to a heat sink block and a board region, thereby generating airflow in the heat sink block and the board region and in this way providing cooling of the components in the heat sink block and the board region,

[0022] - at least one guiding portion connected to a bottom surface, positioned between the fan and the heat sink block, which blocks the air that is blown by the fan, tends to flow away from the heat sink block and directs it to the heat sink block, thereby preventing flow separation and allowing the desired airflow to flow to the heat sink block,

[0023] - at least one air leakage preventer connected to the bottom surface, to a fan edge, and to the second edge so as to be parallel to a first edge, which starts from the fan edge and extends to the second edge, closing the gap between the first edge and the heat sink block and the fan, and thereby preventing air from passing into the dead zone and ensuring that the airflow is directed to the heat sink block.

[0024] The present invention relates to a lower carrier which is placed on a bottom part of a cooker and on which elements belonging to the cooker are mounted, and which prevents the heating of components on a circuit board, etc., by enabling airflow with the aid of a guiding portion and an air leakage preventer.

[0025] Brief Description of the Figures

[0026] Figure-1 A rear, angled, perspective view of the lower carrier and the components placed on the lower carrier is provided.

[0027] Figure-2 A rear, angled, perspective view depicting the regions on the lower carrier is provided.

[0028] Figure-3 A top view depicting the regions on the lower carrier is provided.

[0029] Figure-4 A top view of the lower carrier and the components placed on the lower carrier is provided.

[0030] Figure-5 A front, angled, perspective view of the lower carrier and the components placed on the lower carrier is provided.

[0031] Figure-6 A front, angled, perspective view of the lower carrier is provided.

[0032] Figure-7 A side view of the lower carrier and the air duct is provided. Figure-8 A side, cross-sectional view of the lower carrier and the heat sink block is provided.

[0033] Figure-9 A top view depicting the airflow in the lower carrier is provided.

[0034] Reference Numerals

[0035] 1 Lower carrier

[0036] 2 Bottom surface

[0037] 10 First edge

[0038] 11 Second edge

[0039] 12 Third edge

[0040] 13 Fourth edge

[0041] 14 Air duct

[0042] 15 Guiding portion

[0043] 16 Air leakage preventer

[0044] 20 Heat sink block

[0045] 20.1 Switching element

[0046] 30 Board region

[0047] 30.1 Electronic board

[0048] 40 Fan region

[0049] 40.1 Fan

[0050] 40.2 Fan edge

[0051] 40.3 Blowing opening 50 Dead zone

[0052] Detailed Description of the Invention

[0053] The invention relates to a lower carrier (1) which is placed on the bottom part of a cooker and on which elements belonging to the cooker are mounted, and which prevents the heating of the elements (circuit board, components on the circuit board, etc.) by enabling airflow with the aid of a guiding portion (15) and an air leakage preventer (16) (Figure 1).

[0054] Cookers are devices generally used for cooking and heating food, and there are various types such as electricity, gas, induction, etc. The cooking hobs are mostly used in the kitchen areas of homes. In cases where cookers (such as induction hobs) contain elements intended to be cooled (e.g., electronic boards), cooling systems are used. In some systems, a fan (40.1) is used for the cooling process. In cases where the fan (40.1) is used, the air blown by the fan (40.1) needs to be properly distributed within the lower carrier (1) where the elements to be cooled are placed and, in particular, directed toward components that overheat excessively (e.g., microprocessor, switching element (20. 1), etc.). The mounting method, angle, and direction of rotation of the fan (40.1) are important for the airflow to reach the targeted regions. While the air blown by the fan (40.1) needs to be directed to the region to be cooled, the airflow can be distributed in different directions due to incorrect adjustment of the mounting angle or deviations caused by the direction of rotation of the fan (40.1). In this case, the air is directed to undesired regions instead of reaching critical components, and sufficient airflow cannot be provided to the areas that need to be cooled. This situation is called flow separation. In the present invention, due to the direction of rotation of the fan (40.1), the blown air tends to go largely to a board region (30), and the air intended to be directed to the heat sink block (20) undergoes flow separation and goes to the board region (30). To prevent this situation, in the present invention, the guiding portions (15) placed at the air outlet section block the tendency of the air to escape to the board region (30) and direct the airflow to the heat sink block (20). Due to the manufacturing method, a functionally useless region for cooling, where only mechanical mounting parts exist, emerges between the heat sink block (20) and the carrier edge. This region is called the dead zone (50). The air directed to the heat sink block (20) escapes to the dead zone as it is easier to advance there. This situation means that insufficient airflow is provided to the heat sink block (20). The present invention, while ensuring that the majority of the airflow blown by the fan (40.1) is directed to the heat sink block (20) thanks to the guiding portion (15), also blocks the air trying to escape to the dead zone thanks to the air leakage preventer (16) and ensures it is directed to the heat sink block (20). The remaining airflow is directed to the electronic board (30.1) and provides for the cooling of the heated components. In the preferred embodiment of the invention, the cooker is an induction hob.

[0055] The present invention fundamentally consists of: at least one bottom surface (2), at least one first edge (10), at least one second edge (11), at least one third edge (12), at least one fourth edge (13), at least one air duct (14), at least one guiding portion (15), at least one air leakage preventer (16), at least one heat sink block (20), at least one board region (30), and at least one fan region (40). The heat sink block (20) preferably comprises at least one switching element (20.1). The board region (30) preferably comprises at least one electronic board (30.1). The fan region (40) preferably comprises at least one fan (40.1), at least one fan edge (40.2) environmentally surrounding the fan (40.1), and at least one blowing opening (40.3) where the air outlet occurs. Depending on the mounting situation, a dead zone (50) forms between the heat sink block (20) and the fan edge (40.2) and the first edge (10).

[0056] The lower carrier (1) is configured in the geometry of a rectangular prism with an open top. The base of the lower carrier (1) is referred to as the bottom surface (2). The lower carrier (1) is preferably configured such that, when viewed from the top, it appears flat, and when viewed from the side, a specific triangular region is formed on the first edge (10) side by removing parts to form various regions (board region (30), fan region (40), etc.), starting from the level of the second edge (11) at its bottom part and up to the upper side of its end on the fourth edge (13) side (Figure 2, 3). Components such as the heat sink block (20), the electronic board (30.1), and the fan (40.1) are placed on the lower carrier (1).

[0057] The air duct (14) is preferably configured to allow air exhaust, preferably at both ends of the second edge (11) and preferably in a grille structure (Figure 4, 5). The air duct (14) provides an outlet for the air directed to the heat sink block (20) and the board region (30), creating airflow along the heat sink block (20) and the board region (30). This provides cooling for the components in the heat sink block (20) and the board region (30). In other preferred embodiments of the invention, the number and positions of the air ducts (14) change according to wishes and needs, and in the invention, there are three air ducts (14). In other preferred embodiments of the invention, an air duct (14) presents on the first edge (10), the third edge (12), or the fourth edge (13), or in combinations of these edges. More specifically, the air duct (14) is formed on the second edge (11), enabling the outlet of the air generated by the fan (40.1) and directed to a heat sink block (20) and a board region (30), thereby creating airflow in the heat sink block (20) and the board region (30). In this way, the air duct (14) provides cooling for the components in the heat sink block (20) and the board region (30). In the preferred embodiment of the invention, there are three air ducts (14) configured at both ends of the second edge (11).

[0058] The guiding portion (15) is preferably configured with a rectangular structure. The guiding portion (15) is preferably connected along its rectangular short edge to the bottom surface (2) at a certain angle or a right angle, along its entire length. The guiding portion (15) is connected to the bottom surface (2) along the rectangular short edge at a certain angle, an almost perpendicular angle, or a perpendicular angle. In the preferred embodiment of the invention, there are two guiding portions (15) positioned parallel to each other and in the same alignment between the heat sink block (20) and the fan (40.1). The guiding portions (15), due to the direction of rotation of the fan (40.1), block the air that tends to pass mostly to the board region (30), preventing it from undergoing flow separation, and direct the air to the heat sink block (20). This provides efficient cooling. More specifically, the guiding portion (15) is connected to the bottom surface (2), is positioned between the fan (40.1) and the heat sink block (20), blocks the air blown by the fan (40.1) that tends to flow away from the heat sink block (20) and directs it to the heat sink block (20), thereby preventing flow separation and allowing the desired airflow to flow to the heat sink block (20). This allows the switching elements (20.1) in the heat sink block (20) to be cooled with much higher efficiency.

[0059] The air leakage preventer (16) is preferably configured in a flat structure with a rectangular shape to prevent air leakage. Preferably, one short edge of the air leakage preventer (16) is connected to the end of the fan edge (40.2), the other short edge to the second edge (11), and a long edge is connected to the bottom surface (2) along its entire length. The air leakage preventer (16) preferably starts from the end of the fan edge (40.2), extends parallel to the first edge (10) up to the second edge (11), and terminates at the second edge (11). The air leakage preventer (16) is also positioned parallel to the surface of the heat sink block (20) that faces the first edge (10). The purpose here is to prevent air from escaping into the dead zone (50) formed due to the mounting constraints of the heat sink block (20), which prevent it from being connected flush against the first edge (10), leaving a certain distance in between. More specifically, the air leakage preventer (16) is connected to the bottom surface (2), the fan edge (40.2), and the second edge (11) so as to be parallel to the first edge (10), starts from the fan edge (40.2) and extends to the second edge (11), closing the gap between the first edge (10) and the heat sink block (20) and the fan (40.1), and thereby preventing air from passing into the dead zone (50) and ensuring the airflow is directed to the heat sink block (20). Thus, the switching elements (20.1) in the heat sink block (20) are cooled.

[0060] The board region (30) refers to the region where the electronic board (30.1) is placed. In the preferred embodiment of the invention, the board region (30) is the region between the heat sink block (20), the second edge (11), and the third edge (12). The upper boundary of the board region (30) is between the first edge (10) and the third edge (12), in line with the short edge of the heat sink block (20) facing the fan (40.1).

[0061] The fan region (40) refers to the region where the fan (40.1) is placed and where the airflow is generated with the aid of the fan (40.1). In the preferred embodiment of the invention, the fan region (40) is the area enclosed by a fan edge (40.2). The fan edge (40.2) preferably starts from the part where the air leakage preventer (16) is connected, extends a certain distance, then curves with a certain diameter to continue, and runs parallel to the surface of the heat sink block (20) facing the fan (40.1) at a certain distance, terminating where it began. In the part of the fan edge (40.2) that runs parallel to the surface facing the fan (40.1), there is a gap-structured blowing opening (40.3) that allows the air generated by the fan (40.1) to pass to other regions. The generated air passes through the blowing opening (40.3) to reach the heat sink block (20) and the board region (30).

[0062] In the present invention, the air generated by the fan (40.1) in the fan region (40) is directed from the blowing opening (40.3) to the heat sink block (20) and the board region (30). Here, the majority of the directed air goes to the heat sink block (20), and the rest goes to the board region (30). The main purpose of the invention is to ensure that the majority of the air blown by the fan (40.1) is conveyed to the heat sink block (20), and the remaining air is conveyed to the board region (30). This way, the electronic board (30.1) and the components connected to the electronic board (30.1) are cooled. The air exiting the blowing opening (40.3), which tends to flow towards the board region (30) due to the fan's (40.1) direction of rotation, first hits the guiding portions (15) and is directed to the heat sink block (20). If the air exiting the blowing opening (40.3) attempts to pass into the dead zone (50) either before or after reaching the guiding portions (15), it hits the air leakage preventer (16) and is thereby directed to the heat sink block (20).

[0063] In this specification, the orientation or positional relationships indicated by the terms "top" and "bottom" are based on the orientation or positional relationships shown in the figures and are solely for the clarity of the technical solution and ease of explanation. They do not imply or indicate that the specified device or element requires a specific orientation, is constructed, or operates in a specific direction, and therefore should not be understood as a limitation of the invention.

Claims

CLAIMS1. A lower carrier (1) which is placed on a bottom part of a cooker and on which components belonging to the cooker are mounted, for the purpose of directing the air blown by a fan (40.1) to a heat sink block (20) without flow separation, preventing air from escaping to a dead zone (50) during directing, and thereby enabling high-efficiency cooling of the components intended to be cooled, the lower carrier (1) characterized in that it comprises:- at least one air duct (14) formed on a second edge (11), which enables the outlet of the air that is blown by the fan (40.1 ) and directed to a heat sink block (20) and a board region (30), thereby generating airflow in the heat sink block (20) and the board region (30) and in this way providing cooling of the components in the heat sink block (20) and the board region (30),- at least one guiding portion (15) connected to a bottom surface (2), positioned between the fan (40.1) and the heat sink block (20), which blocks the air that is blown by the fan (40.1), tends to flow away from the heat sink block (20) and directs it to the heat sink block (20), thereby preventing flow separation and allowing the desired airflow to flow to the heat sink block (20),- at least one air leakage preventer (16) connected to the bottom surface (2), to a fan edge (40.2), and to the second edge (11) so as to be parallel to a first edge (10), which starts from the fan edge (40.2) and extends to the second edge (11), closing the gap between the first edge (10) and the heat sink block (20) and the fan (40.1), and thereby preventing air from passing into the dead zone (50) and ensuring that the airflow is directed to the heat sink block (20).

2. The lower carrier (1) according to Claim 1 , characterized in that it comprises at least one air duct (14) configured as a grille.

3. The lower carrier (1) according to any one of the preceding Claims, characterized in that it comprises at least one guiding portion (15) configured with a rectangular structure and connected along its entire rectangular short edge to the bottom surface (2) at a certain angle or perpendicularly.

4. The lower carrier (1) according to any one of the preceding Claims, characterized in that it comprises at least one air leakage preventer (16) configured in a flat structure with a rectangular shape to prevent air leakage, wherein one short edge is connected to the end ofthe fan edge (40.2), the other short edge to the second edge (11), and a long edge is connected to the bottom surface (2) along its entire length.

5. The lower carrier (1) according to any one of the preceding Claims, characterized in that it comprises at least one air duct (14) configured at both ends of the second edge (11).

6. The lower carrier (1) according to any one of the preceding Claims, characterized in that it comprises at least one fan (40.1) placed in the fan region (40).

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