Printing device and method for controlling printing device

Abstract

This printing device (100) comprises: a squeegee (31) that is positioned above a mask (300) and that prints a coating material (303) on the mask onto a substrate (200); a substrate holding part (2) that is positioned below the mask and that holds the substrate; a load detection unit (6) that is positioned in the substrate holding part and that detects the load borne by the substrate holding part; and a control unit (8) that, on the basis of the detection result of the load detection unit during substrate production, performs control to acquire at least one of the tension of the mask, the printing pressure applied to the mask by the squeegee, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate.

Description

Printing device and control method for a printing device

[0001] The present invention relates to a printing device and a control method for a printing device, and particularly to a printing device for printing a coating material on a mask onto a substrate and a control method for a printing device.

[0002] Conventionally, a printing device for printing a coating material on a mask onto a substrate is known. Such a printing device is disclosed, for example, in Japanese Patent Application Laid-Open No. 2019 / 116545.

[0003] Japanese Patent Application Laid-Open No. 2019 / 116545 discloses a screen printing machine (printing device) for printing cream solder (coating material) on a mask onto a substrate. This screen printing device includes a mask tension measuring device for measuring the tension of the mask. The mask tension measuring device includes an air cylinder that presses the mask downward and a laser displacement meter that measures the height of the lower surface of the mask. The height of the lower surface of the mask is measured by the laser displacement meter in each state before and after the mask is pressed downward by the air cylinder. Thereby, the tension of the mask is measured. The measurement of the tension of the mask is performed when it is not during the production of the substrate, such as during a setup change.

[0004] Japanese Patent Application Laid-Open No. 2019 / 116545

[0005] In the screen printing machine described in Japanese Patent Application Laid-Open No. 2019 / 116545, since the measurement of the tension of the mask is performed when it is not during the production of the substrate, the tension of the mask during the production of the substrate is not obtained. In this case, since a value in a state different from the state during the production of the substrate is obtained as the tension of the mask, it is difficult to obtain an accurate value as the tension of the mask. Therefore, it is difficult to accurately manage the operation of printing the coating material on the substrate. Also, there are similar problems when obtaining values other than the tension of the mask. Therefore, it is desired to accurately manage the operation of printing the coating material on the substrate. [[ID=十六]] [[ID=十七]]

[0006] This invention was made to solve the above-mentioned problems, and one of its objectives is to provide a printing apparatus and a control method for the printing apparatus that can accurately manage the process of printing a coating material onto a substrate.

[0007] A printing apparatus according to the first aspect of this invention comprises a squeegee positioned above a mask and printing the coating material on the mask onto a substrate; a substrate holding unit positioned below the mask and holding the substrate; a load detection unit positioned in the substrate holding unit and detecting the load applied to the substrate holding unit; and a control unit that performs control to acquire at least one of the following based on the detection result of the load detection unit during substrate production: the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate.

[0008] In the printing apparatus according to the first aspect of this invention, as described above, a load detection unit is provided in the substrate holding section for detecting the load applied to the substrate holding section, and a control unit is provided to perform control to acquire at least one of the following based on the detection result of the load detection unit during substrate production: the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate. As a result, at least one of the following values ​​can be acquired during substrate production: the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate. This makes it possible to acquire accurate values ​​for at least one of the following: the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate. As a result, accurate control of the process of printing the coating material on the substrate can be performed.

[0009] In the printing apparatus according to the first aspect described above, preferably, a substrate holder drive unit is further provided to drive the substrate holder in the height direction, and the control unit acquires the tension of the mask based on the detection result of the load detection unit during substrate production, and based on the tension of the mask, controls the substrate holder drive unit to adjust the position of the substrate held in the substrate holder in the height direction during plate alignment, bringing the substrate held in the substrate holder into contact with the mask. With this configuration, the tension of the mask can be adjusted to an appropriate value by adjusting the position of the substrate held in the substrate holder in the height direction during plate alignment. As a result, the deterioration of printing quality caused by changes in the tension of the mask over time can be suppressed. In addition, since an accurate value of the tension of the mask can be acquired, the position of the substrate held in the substrate holder in the height direction during plate alignment can be accurately adjusted. As a result, the tension of the mask can be accurately adjusted, which enhances the effect of suppressing the deterioration of printing quality caused by changes in the tension of the mask over time.

[0010] In this case, preferably, when the tension of the mask decreases by a predetermined amount from the reference tension, the control unit controls the substrate holding unit drive unit to raise the position of the substrate held in the substrate holding unit in the height direction so that the tension of the mask becomes the reference tension. With this configuration, the tension of the mask can be easily adjusted to an appropriate value, and thus the deterioration of print quality caused by changes in the tension of the mask over time can be easily suppressed.

[0011] In the printing apparatus according to the first aspect described above, preferably, a squeegee drive unit is further provided to drive the squeegee in the height direction, and the control unit acquires the printing pressure of the squeegee on the mask based on the detection result of the load detection unit during substrate production, and controls the squeegee drive unit to adjust the position of the squeegee in the height direction when printing the coating material on the mask onto the substrate based on the printing pressure of the squeegee on the mask. With this configuration, the printing pressure of the squeegee on the mask can be adjusted to an appropriate value by adjusting the position of the squeegee in the height direction when printing the coating material on the mask onto the substrate. As a result, the deterioration of printing quality caused by changes in the printing pressure of the squeegee on the mask over time can be suppressed. In addition, since an accurate value of the printing pressure of the squeegee on the mask can be acquired, the position of the squeegee on the mask can be accurately adjusted in the height direction when printing the coating material on the mask onto the substrate. As a result, the printing pressure of the squeegee on the mask can be accurately adjusted, which enhances the effect of suppressing the deterioration of printing quality caused by changes in the printing pressure of the squeegee on the mask over time.

[0012] In the printing apparatus according to the first aspect described above, preferably, a coating material supply unit is further provided to supply coating material onto a mask. The control unit obtains the current weight of the coating material on the mask based on the detection result of the load detection unit during substrate production, and controls the supply of coating material onto the mask by the coating material supply unit based on the current weight of the coating material on the mask. With this configuration, if the amount of coating material on the mask decreases due to printing, the amount of coating material that has decreased can be compensated for by supplying coating material onto the mask. As a result, a decrease in print quality caused by a decrease in the amount of coating material can be suppressed. In addition, since the current weight of the coating material on the mask can be accurately obtained, the coating material can be accurately supplied onto the mask. As a result, the effect of suppressing a decrease in print quality caused by a decrease in the amount of coating material can be enhanced.

[0013] In the printing apparatus according to the first aspect described above, preferably, the control unit performs control to acquire the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate, based on the detection results of the load detection unit in each of the following states: the state in which the substrate held in the substrate holding unit is held in the substrate holding unit before plate alignment in which the substrate held in the substrate holding unit is brought into contact with the mask, the state in which plate alignment is performed, the state in which printing pressure is applied to the mask by the squeegee, and the state in which the substrate held in the substrate holding unit is held in the substrate holding unit after plate separation in which the substrate held in the substrate holding unit is separated from the mask. With this configuration, the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate can be easily and accurately acquired based on the detection results of the load detection unit in each of the above states which are states during substrate production.

[0014] In the printing apparatus according to the first aspect described above, preferably, the control unit performs control to acquire the initial weight of the coating material on the mask based on the detection result of the load detection unit in the plate alignment state in which the substrate held in the substrate holding unit is brought into contact with a mask on which no coating material is placed, and the detection result of the load detection unit in the first plate alignment state in which the substrate held in the substrate holding unit is brought into contact with a mask on which the coating material is placed, or performs control to acquire the initial weight of the coating material on the mask based on the detection result of the load detection unit when supplying coating material onto the mask in the plate alignment state in which the substrate held in the substrate holding unit is brought into contact with a mask on which no coating material is placed. With this configuration, the initial weight of the coating material on the mask can be accurately acquired, and based on the initial weight of the coating material on the mask, at least one of the following can be accurately acquired: the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate.

[0015] In this case, preferably, the control unit performs control to acquire the mask tension, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate, based on the detection results of the load detection unit and the initial weight of the coating material on the mask for each of the states described above, which are states during substrate production, based on the detection results of the load detection unit and the initial weight of the coating material on the mask.

[0016] In the printing apparatus according to the first aspect described above, preferably, the control unit controls the recording of at least one of the following: the tension of the mask, the pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate. With this configuration, accurate values ​​can be recorded for at least one of the following: the tension of the mask, the pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate, thereby enabling accurate control of the process of printing the coating material on the substrate. For example, if a problem occurs in the production of the substrate, it is possible to accurately determine where the problem occurred based on the recorded values.

[0017] In the printing apparatus according to the first aspect described above, preferably, one or more load detection units are arranged in the substrate holding unit. With this configuration, if there is only one load detection unit, an increase in the number of parts can be suppressed, and structural complexity can be suppressed. If there are multiple load detection units, the load can be detected more accurately by using the multiple load detection units.

[0018] In the printing apparatus according to the first aspect described above, preferably, the substrate holding section includes a conveyor section for transporting substrates, a substrate support section for supporting substrates placed on the conveyor section from below, and a conveyor base section for supporting the conveyor section from below, and the load detection section is located in at least one of the conveyor section, the substrate support section, and the conveyor base section. With this configuration, the load detection section can be easily and appropriately located in the substrate holding section.

[0019] In the printing apparatus according to the first aspect described above, preferably, the coating material includes solder. With this configuration, in a printing apparatus that prints solder as a coating material, it is possible to accurately control the process of printing solder as a coating material onto a substrate.

[0020] A second aspect of the present invention relates to a method for controlling a printing apparatus, comprising: a squeegee positioned above a mask and printing a coating material on the mask onto a substrate; and a substrate holding unit positioned below the mask and holding the substrate, the method comprising: detecting a load on the substrate holding unit using a load detection unit positioned on the substrate holding unit; and performing control to obtain at least one of the following based on the detection result of the load detection unit during substrate production: the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate.

[0021] In the second aspect of the present invention, the control method for a printing apparatus includes the steps of: detecting the load on the substrate holder using a load detection unit located in the substrate holder; and performing control to acquire at least one of the following based on the detection result of the load detection unit during substrate production: the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate. As a result, values ​​closer to the actual situation can be obtained for at least one of the following: the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate.

[0022] According to the present invention, as described above, it is possible to accurately control the process of printing a coating material onto a substrate.

[0023] This is a schematic side view showing a printing apparatus according to one embodiment. This is a block diagram showing the control configuration of a printing apparatus according to one embodiment. This is a schematic diagram for explaining the printing operation of a squeegee according to one embodiment. This is Figure (1) for explaining the acquisition of the weight of the first coating material according to one embodiment. This is Figure (2) for explaining the acquisition of the weight of the first coating material according to one embodiment. This is a diagram for explaining the control of the tension of the mask according to one embodiment. This is a diagram for explaining the control of the printing pressure according to one embodiment. This is a diagram for explaining the control of the supply of the coating material according to one embodiment. This is Figure (1) for explaining the arrangement of the load detection unit according to one embodiment. This is Figure (2) for explaining the arrangement of the load detection unit according to one embodiment. This is Figure (3) for explaining the arrangement of the load detection unit according to one embodiment. This is Figure (4) for explaining the arrangement of the load detection unit according to one embodiment. This is Figure (5) for explaining the arrangement of the load detection unit according to one embodiment.

[0024] The following describes embodiments of the present invention based on the drawings.

[0025] The structure of a printing apparatus 100 according to one embodiment of the present invention will be described with reference to Figures 1 to 13.

[0026] (Overall configuration of the printing apparatus) The printing apparatus 100 according to this embodiment has the function of printing a coating material 303 onto the surface of the substrate 200 in a predetermined pattern of openings 302 formed in the mask 300. The coating material 303 is solder (solder paste). Hereinafter, the transport direction of the substrate 200 will be referred to as the X direction, the direction perpendicular to the X direction in the horizontal plane will be referred to as the Y direction, and the height direction (up and down direction) perpendicular to the X and Y directions will be referred to as the Z direction. Furthermore, the upward direction of the up and down directions will be referred to as the Z1 direction, and the downward direction will be referred to as the Z2 direction.

[0027] As shown in Figure 1, the printing apparatus 100 comprises a base 1, a substrate table 2 mounted on the base 1 for holding the substrate 200 and aligning the substrate 200 with respect to the mask 300, and a squeegee unit 3 positioned above the substrate table 2. The printing apparatus 100 has the function of printing on the substrate 200 that is fed in by the input conveyor section 4a, and then unloading the printed substrate 200 by the output conveyor section 4b. Note that the substrate table 2 is an example of the "substrate holding section" in the claims.

[0028] The substrate table 2 is positioned below the mask 300 (on the Z2 side). The substrate table 2 includes a pair of conveyor sections 21, an X-axis movement mechanism 22, a Y-axis movement mechanism 23, an R-axis movement mechanism 24, a Z-axis movement mechanism 25, and a substrate support section 26.

[0029] As shown in Figures 1 and 2, the X-axis movement mechanism 22 includes an X-axis table 221, an X-axis rail 222, and a table X-axis drive unit 223. The X-axis movement mechanism 22 moves the substrate 200 held on the substrate table 2 in the X direction by moving the X-axis table 221 along the X-axis rail 222 using the table X-axis drive unit 223. The table X-axis drive unit 223 is a motor such as a servo motor.

[0030] The Y-axis movement mechanism 23 includes a Y-axis table 231, a Y-axis rail 232, and a table Y-axis drive unit 233. The Y-axis movement mechanism 23 moves the substrate 200 held on the substrate table 2 in the Y-direction by moving the Y-axis table 231 along the Y-axis rail 232 using the table Y-axis drive unit 233. The table Y-axis drive unit 233 is a motor such as a servo motor.

[0031] The R-axis movement mechanism 24 includes an R-axis table 241 and a table R-axis drive unit 242. The R-axis movement mechanism 24 rotates the R-axis table 241 around a rotation axis extending in the Z direction using the table R-axis drive unit 242, thereby rotating the substrate 200 held on the substrate table 2 around a rotation axis extending in the Z direction. The table R-axis drive unit 242 is a motor such as a servo motor.

[0032] The Z-axis movement mechanism 25 includes a Z-axis table 251 and a table Z-axis drive unit 252. The Z-axis movement mechanism 25 moves the substrate 200 held on the substrate table 2 in the Z-axis direction by moving the Z-axis table 251 in the Z-axis direction using the table Z-axis drive unit 252. The table Z-axis drive unit 252 drives the Z-axis table 251 of the substrate table 2 in the Z-axis direction, which is the height direction. As a result, the table Z-axis drive unit 252 drives the conveyor section 21 supported by the Z-axis table 251, and the substrate 200 supported by the conveyor section 21, in the height direction. The table Z-axis drive unit 252 is a motor such as a servo motor. The Z-axis table 251 supports the conveyor section 21 from below. Note that the Z-axis table 251 is an example of the "conveyor base section" in the claims.

[0033] The substrate support section 26 supports the substrate 200 placed on the conveyor section 21 from below. The substrate support section 26 includes a plurality of substrate support members 261. The substrate support members 261 are backup pins.

[0034] The substrate table 2 holds the transported substrate 200 in a predetermined position on the conveyor section 21. The substrate table 2 is also configured to move the substrate 200 using the X-axis movement mechanism 22, the Y-axis movement mechanism 23, and the R-axis movement mechanism 24 to position it relative to the mask 300, and then raise the substrate 200 to a predetermined position where it is in close contact with the lower surface of the mask 300 using the Z-axis movement mechanism 25.

[0035] The pair of conveyor sections 21 are provided to extend along the transport direction (X direction) of the substrate 200. The pair of conveyor sections 21 are also arranged parallel to each other at a predetermined distance in the Y direction. Furthermore, the pair of conveyor sections 21 are configured to allow adjustment of the distance between them in the Y direction to correspond to the width of the substrate 200 being transported. Specifically, the distance (width) between the pair of conveyor sections 21 is adjusted by a motor.

[0036] Furthermore, the pair of conveyor sections 21 transport the substrate 200 in the X direction by a motor. The pair of conveyor sections 21 are supported from below (Z2 direction side) by a Z-axis table 251 and are configured to be movable in the vertical direction (Z direction) by a Z-axis movement mechanism 25. The pair of conveyor sections 21 also have the function of receiving the substrate 200 before printing from the input conveyor section 4a and transporting the printed substrate 200 to the output conveyor section 4b.

[0037] Furthermore, the substrate table 2 is provided with a substrate support section 26 including a plurality of substrate support members 261 above the Z-axis table 251 (on the Z1 direction side). The plurality of substrate support members 261 of the substrate support section 26 are configured to support the substrate 200 from below. Specifically, the substrate 200 conveyed by the pair of conveyor sections 21 is moved upward by a predetermined height from the pair of conveyor sections 21 by the plurality of substrate support members 261. Then, the substrate 200, which has been raised to a predetermined height position relative to the pair of conveyor sections 21, is clamped by the substrate clamping mechanism. In this state, as described above, the substrate 200 is aligned with the mask 300 and raised to make close contact with the lower surface of the mask 300, and the substrate 200 is held at a predetermined printing position on the lower surface of the mask 300.

[0038] The mask 300 has openings 302 (see Figure 3) formed in a predetermined pattern. The mask 300 also has a rectangular shape in plan view, and a frame 301 is attached to its outer circumference. The mask 300 is fixedly held above the substrate table 2 by the frame 301 being clamped by the mask clamp portion 5. The mask 300 also includes an elastic member portion to which the frame 301 is attached, and a metal portion positioned inside the elastic member portion. The metal portion of the mask 300 is made of aluminum, iron, or the like. The elastic member portion is made of resin, rubber, or the like.

[0039] The squeegee unit 3 is positioned above the mask 300. The squeegee unit 3 has the function of reciprocating in the Y direction, thereby scraping and spreading the coating material 303 supplied onto the upper surface of the mask 300. As a result, the coating material 303 is printed onto the surface of the substrate 200 through the opening 302 of the mask 300. Specifically, the squeegee unit 3 includes a squeegee 31, a squeegee Z-axis movement mechanism 32, a squeegee Y-axis movement mechanism 33, and a squeegee R-axis movement mechanism 34.

[0040] The squeegee 31 reciprocates on the mask 300, printing the coating material 303 (roll-shaped coating material 303) on the mask 300 onto the substrate 200. Specifically, the squeegee 31 contacts the upper surface of the mask 300 and moves in the Y direction, printing the coating material 303 on the upper surface of the mask 300 onto the substrate 200 through the opening 302 of the mask 300. The squeegee 31 is formed to extend in the X direction.

[0041] Furthermore, the squeegee 31 has a pressing surface 311 that presses the coating material 303, and slides in the Y direction relative to the upper surface of the mask 300, thereby pressing and moving the coating material 303 on the upper surface of the mask 300 with the pressing surface 311. In addition, the same pressing surface 311 is used for both the forward and return printing of the squeegee 31.

[0042] The squeegee Z-axis moving mechanism 32 moves the squeegee 31 in the Z direction. Specifically, the squeegee Z-axis moving mechanism 32 includes a squeegee Z-axis driving part 321 and a Z-axis ball screw shaft. By driving the Z-axis ball screw shaft by the squeegee Z-axis driving part 321, the squeegee 31 is moved in the Z direction. The squeegee Z-axis driving part 321 is a motor such as a servo motor. The squeegee Z-axis driving part 321 drives the squeegee 31 in the Z direction.

[0043] The squeegee Y-axis moving mechanism 33 moves the squeegee 31 in the printing direction (Y direction). Specifically, the squeegee Y-axis moving mechanism 33 includes a squeegee Y-axis driving part 331 (see FIG. 3), a Y-axis support part 332, and a Y-axis rail 333. By driving the Y-axis support part 332 along the Y-axis rail 333 by the squeegee Y-axis driving part 331, the squeegee 31 is moved in the Y direction. The squeegee Y-axis driving part 331 is a motor such as a servo motor.

[0044] The squeegee R-axis moving mechanism 34 rotates the squeegee 31 around a rotation axis extending in the X direction. Specifically, the squeegee R-axis moving mechanism 34 includes a squeegee R-axis driving part 341 and a squeegee support shaft. By rotating the squeegee support shaft around the rotation axis by the squeegee R-axis driving part 341, the squeegee 31 is rotated around the rotation axis. The squeegee R-axis driving part 341 is a motor such as a servo motor.

[0045] The printing device 100 includes a load detection part 6. The load detection part 6 is arranged on the substrate table 2 and detects the load received by the substrate table 2. For example, the load detection part 6 is a load cell. Note that the load detection part 6 may be a strain gauge or the like.

[0046] The printing device 100 includes a coating material supply part 7. The coating material supply part 7 is arranged in the squeegee unit 3 and supplies the coating material 303 onto the mask 300. The coating material supply part 7 includes a storage part for storing the coating material 303 and a nozzle for discharging the coating material 303 stored in the storage part onto the mask 300.

[0047] The printing device 100 includes a control unit 8. The control unit 8 is a control circuit that controls the operation of the printing device 100. The control unit 8 includes a processor such as a CPU (Central Processing Unit), and memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory). The control unit 8 controls the operation of printing the coating material 303 on the substrate 200 using the substrate table 2, the squeegee unit 3, and the mask 300.

[0048] (Printing operation during substrate production) As shown in FIG. 3, a printing operation is performed during the production of the substrate 200. The printing operation is performed under the control of the control unit 8. First, the substrate 200 is held on the substrate table 2. Then, the substrate 200 held on the substrate table 2 is moved by the table X-axis drive unit 223 of the X-axis moving mechanism 22, the table Y-axis drive unit 233 of the Y-axis moving mechanism 23, and the table R-axis drive unit 242 of the R-axis moving mechanism 24, and the substrate 200 is positioned with respect to the mask 300. Then, the substrate 200 held on the substrate table 2 is moved upward (in the Z1 direction) by the table Z-axis drive unit 252 of the Z-axis moving mechanism 25, and alignment of the plate is performed to bring the substrate 200 held on the substrate table 2 into contact with the mask 300. In plate alignment, the substrate 200 is moved upward by the table Z-axis drive unit 252 of the Z-axis moving mechanism 25 to a position where the upper surface of the substrate 200 slightly presses the mask 300 so that the upper surface of the substrate 200 adheres to the lower surface of the mask 300.

[0049] Then, the squeegee 31 is moved downward (in the Z2 direction) by the squeegee Z-axis drive unit 321 of the squeegee Z-axis moving mechanism 32, and the squeegee 31 is brought into contact with the mask 300. At this time, the squeegee 31 is moved downward by the squeegee Z-axis drive unit 321 of the squeegee Z-axis moving mechanism 32 to a position where the squeegee 31 slightly presses the mask 300 downward. Thereby, a printing pressure (printing load) is applied to the mask 300 by the squeegee 31. Then, the squeegee 31 is moved in the Y direction by the squeegee Y-axis drive unit 331 of the squeegee Y-axis moving mechanism 33. At this time, the coating material 303 on the mask 300 is printed (transferred) onto the substrate 200 through the opening 302 of the mask 300.

[0050] Then, the squeegee 31 is moved upward (in the Z1 direction) by the squeegee Z-axis drive unit 321 of the squeegee Z-axis movement mechanism 32, and the squeegee 31 is separated from the mask 300. Then, the substrate 200 held on the substrate table 2 is moved downward (in the Z2 direction) by the table Z-axis drive unit 252 of the Z-axis movement mechanism 25, and the substrate 200 held on the substrate table 2 is separated from the mask 300, performing a plate separation.

[0051] (Acquisition of Mask Tension, etc.) In this embodiment, the control unit 8 performs control to acquire at least one of the following based on the detection result of the load detection unit 6 during the production of the substrate 200: the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200 (the amount of coating material 303 transferred). The control unit 8 may acquire all of the following: the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200, or it may acquire one or more of these instead of all of them.

[0052] Here, the detection results (loads A, B, C, and D) of the load detection unit 6 in each of the following states can be expressed as follows: the state in which the substrate 200 is held on the substrate table 2 before plate alignment, the state in which plate alignment is performed, the state in which printing pressure is applied to the mask 300 by the squeegee 31, and the state in which the substrate 200 is held on the substrate table 2 after plate separation. Using loads A, B, C, and D, it is possible to obtain at least one of the following: the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200. Load A: Weight of the substrate 200 Load B: Weight of the substrate 200 + Tension of the mask 300 + Weight of the coating material 303 on the mask 300 Load C: Weight of the substrate 200 + Tension of the mask 300 + Weight of the coating material 303 on the mask 300 + Printing pressure load of the squeegee 31 on the mask 300 D: Weight of the substrate 200 + Weight of the coating material 303 printed on the substrate 200 (Amount of coating material 303 transferred)

[0053] Furthermore, the printing apparatus 100 is configured to allow switching between a simplified mode, which is used when the influence of the coating material 303 on the mask 300 can be considered negligible (when the influence of the coating material 303 on the mask 300 can be ignored), and a detailed mode, which is used when the influence of the coating material 303 on the mask 300 cannot be considered negligible (when the influence of the coating material 303 on the mask 300 cannot be ignored). For example, the user uses the operation panel of the printing apparatus 100 to select and set either the simplified mode or the detailed mode. The control unit 8 performs control to set the mode selected by the user from the simplified mode and the detailed mode.

[0054] When the simplified mode is set, the control unit 8 can perform control to acquire the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, and the weight of the coating material 303 printed on the substrate 200, based on the detection results (loads A, B, C, and D) of the load detection unit 6 in each of the following states: when the substrate 200 is held on the substrate table 2 before plate alignment, when plate alignment is performed, when printing pressure is applied to the mask 300 by the squeegee 31, and when the substrate 200 is held on the substrate table 2 after plate separation.

[0055] For example, the control unit 8 performs control to acquire the tension of the mask 300 based on the detection result (load B) of the load detection unit 6 in the plate alignment state. Specifically, the control unit 8 performs control to acquire the detection result (load B) of the load detection unit 6 in the plate alignment state as the tension of the mask 300. The detection result (load B) of the load detection unit 6 in the plate alignment state includes the weight of the coating material 303 on the mask 300, but since the influence of the coating material 303 on the mask 300 on the tension of the mask 300 can be considered minute, the influence of the coating material 303 on the mask 300 is ignored. In addition, the detection result (load B) of the load detection unit 6 in the plate alignment state includes the weight of the substrate 200 held on the substrate table 2, but since the weight of the substrate 200 held on the substrate table 2 can be considered approximately constant, the influence of the substrate 200 held on the substrate table 2 is ignored.

[0056] Furthermore, for example, the control unit 8 performs control to acquire the printing pressure of the squeegee 31 on the mask 300 based on the detection results (loads B and C) of the load detection unit 6 in each state: the state of plate alignment and the state in which printing pressure is applied to the mask 300 by the squeegee 31. Specifically, the control unit 8 performs control to acquire the value (C-B) obtained by subtracting the detection result (load B) of the load detection unit 6 in the state of plate alignment from the detection result (load C) of the load detection unit 6 in the state in which printing pressure is applied to the mask 300 by the squeegee 31, as the printing pressure of the squeegee 31 on the mask 300.

[0057] Furthermore, for example, the control unit 8 performs control to acquire the weight of the coating material 303 printed on the substrate 200 based on the detection results (loads A and D) of the load detection unit 6 in each state: when the substrate 200 is held on the substrate table 2 before plate alignment, and when the substrate 200 is held on the substrate table 2 after plate separation. Specifically, the control unit 8 performs control to acquire the weight of the coating material 303 printed on the substrate 200 by subtracting the detection result (load A) of the load detection unit 6 when the substrate 200 is held on the substrate table 2 before plate alignment from the detection result (load D) of the load detection unit 6 when the substrate 200 is held on the substrate table 2 after plate separation (D), which is then used as the weight of the coating material 303 printed on the substrate 200.

[0058] When the detailed mode is set, the control unit 8 can perform control to acquire the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200, based on the detection results (loads A, B, C, and D) of the load detection unit 6 in each of the following states: the state in which the substrate 200 is held on the substrate table 2 before plate alignment, the state in which plate alignment is performed, the state in which printing pressure is applied to the mask 300 by the squeegee 31, and the state in which the substrate 200 is held on the substrate table 2 after plate separation. Specifically, the control unit 8 can perform control to acquire the tension of the mask 300, the printing pressure applied by the squeegee 31 to the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200, based on the detection results of the load detection unit 6 and the initial weight of the coating material 303 on the mask 300 in each of the following states: when the substrate 200 is held on the substrate table 2 before plate alignment, when plate alignment is performed, when printing pressure is applied to the mask 300 by the squeegee 31, and when the substrate 200 is held on the substrate table 2 after plate separation.

[0059] The process for obtaining the printing pressure of the squeegee 31 on the mask 300 and the current weight of the coating material 303 on the mask 300 in detailed mode is the same as in simplified mode. Therefore, a detailed explanation is omitted.

[0060] For example, the control unit 8 performs control to obtain the current weight of the coating material 303 on the mask 300 based on the previous weight of the coating material 303 on the mask 300 and the weight of the coating material 303 printed on the substrate 200. Specifically, the control unit 8 performs control to obtain the current weight of the coating material 303 on the mask 300 by subtracting the weight of the coating material 303 printed on the substrate 200 from the previous weight of the coating material 303 on the mask 300. The control unit 8 performs control to obtain the current weight of the coating material 303 on the mask 300 by sequentially subtracting the weight of the coating material 303 printed on the substrate 200 from the initial weight of the coating material 303 on the mask 300.

[0061] As shown in Figure 4, for example, the control unit 8 performs control to acquire the initial weight of the coating material 303 on the mask 300 based on the detection result (load E) of the load detection unit 6 in the state where the substrate 200 held on the substrate table 2 is brought into contact with the mask 300 on which the coating material 303 is not placed, and the detection result (load F) of the load detection unit 6 in the first state where the substrate 200 held on the substrate table 2 is brought into contact with the mask 300 on which the coating material 303 is placed. Before starting production of the substrate 200, the control unit 8 performs control to bring the substrate 200 held on the substrate table 2 into contact with the mask 300 on which the coating material 303 is not placed, and acquires the detection result (load E) of the load detection unit 6 in this state of plate alignment. Furthermore, after production of the substrate 200 begins, the control unit 8 performs the initial plate alignment by bringing the substrate 200 held on the substrate table 2 into contact with the mask 300 on which the coating material 303 is placed, and controls the acquisition of the detection result (load F) of the load detection unit 6 in this plate alignment state. The control unit 8 then performs the control to acquire the initial weight of the coating material 303 on the mask 300 by subtracting the detection result (load E) of the load detection unit 6 in the plate alignment state where the substrate 200 held on the substrate table 2 is in contact with the mask 300 on which the coating material 303 is placed from the detection result (load F) of the load detection unit 6 in the initial plate alignment state where the substrate 200 held on the substrate table 2 is in contact with the mask 300 on which the coating material 303 is placed.

[0062] Furthermore, for example, as shown in Figure 5, the control unit 8 performs control to acquire the initial weight of the coating material 303 on the mask 300 based on the detection result (load G) of the load detection unit 6 when supplying the coating material 303 onto the mask 300 in a state of plate alignment in which the substrate 200 held on the substrate table 2 is brought into contact with the mask 300 on which the coating material 303 is not placed. When preparing for the production of the substrate 200, the control unit 8 performs plate alignment in which the substrate 200 held on the substrate table 2 is brought into contact with the mask 300 on which the coating material 303 is not placed, and also performs control to supply the coating material 303 onto the mask 300 in this state of plate alignment. At this time, the control unit 8 performs control to acquire the detection result (load G) of the load detection unit 6. The control unit 8 then performs control to acquire the increased detection result of the load detection unit 6 during the supply of the coating material 303 onto the mask 300 as the initial weight of the coating material 303 on the mask 300. In other words, the control unit 8 performs control to acquire the detection result of the load detection unit 6, which increased from the start of supplying the coating material 303 onto the mask 300 until the stop of supplying the coating material 303 onto the mask 300, as the initial weight of the coating material 303 on the mask 300.

[0063] Furthermore, as shown in Figure 3, for example, the control unit 8 performs control to acquire the tension of the mask 300 based on the detection results (loads A and B) of the load detection unit 6 and the current weight of the coating material 303 on the mask 300, in each state: when the substrate 200 is held on the substrate table 2 before plate alignment and when plate alignment is performed. Specifically, the control unit 8 performs control to acquire the tension of the mask 300 by subtracting the detection result (load A) of the load detection unit 6 when the substrate 200 is held on the substrate table 2 before plate alignment and the current weight of the coating material 303 on the mask 300 from the detection result (load B) of the load detection unit 6 in the plate alignment state (B - A - current weight of the coating material 303 on the mask 300).

[0064] In this embodiment, the control unit 8 controls the recording of at least one of the following: the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200. Specifically, the control unit 8 controls the recording of the acquired values ​​of the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200, as a time-series log associated with the time information at which the values ​​were acquired, in at least one of the storage unit and external storage unit of the printing apparatus 100. The recorded log can be referenced, for example, if a problem occurs in the production of the substrate 200.

[0065] (Control of mask tension) Here, the tension of the mask 300 changes over time due to its use in the production of the substrate 200. Specifically, the tension of the mask 300 gradually decreases due to, for example, repeated plate alignment in the production of the substrate 200. When the tension of the mask 300 decreases, it may not be possible to sufficiently adhere the substrate 200 to the mask 300 during plate alignment. In this case, it may not be possible to print the desired amount of coating material 303 onto the substrate 200, or the position where the coating material 303 is printed on the substrate 200 may be misaligned. In this case, the print quality deteriorates.

[0066] Therefore, as shown in Figure 8, the control unit 8 performs control to acquire the tension of the mask 300 based on the detection result of the load detection unit 6 during the production of the substrate 200, as described above. Then, based on the tension of the mask 300, the control unit 8 performs control to adjust the position of the substrate 200 held on the substrate table 2 in the height direction, Z direction, using the table Z-axis drive unit 252. Specifically, if the tension of the mask 300 decreases by a predetermined amount from the reference tension, the control unit 8 performs control to raise the position of the substrate 200 held on the substrate table 2 in the Z1 direction using the table Z-axis drive unit 252 so that the tension of the mask 300 becomes the reference tension. The reference tension is a tension that is determined in advance through experiments or the like. For example, the tension of the mask 300 in the first production of the substrate 200, and representative values ​​of the tension of the mask 300 in past productions of the substrate 200 can be used as the reference tension.

[0067] When adjusting the tension of the mask 300, the control unit 8 controls the sequential acquisition of the tension of the mask 300 based on the detection result of the load detection unit 6 while raising the position of the substrate 200 held on the substrate table 2 in the Z1 direction during plate alignment. The control unit 8 controls the position of the substrate 200 held on the substrate table 2 in the Z1 direction using the table Z-axis drive unit 252 until the tension of the mask 300 acquired based on the detection result of the load detection unit 6 matches the reference tension. In Figure 6, the control unit 8 controls the position of the substrate 200 held on the substrate table 2 in the plate alignment from a height H1 to a height H1 + h1. Note that if the amount of rise required for the mask 300 tension to reach the reference tension is known in advance through experiments or other means, it is not necessary for the load detection unit 6 to detect the load. In this case, the position of the substrate 200 held on the substrate table 2 in the Z1 direction may be raised by a predetermined amount using the table Z-axis drive unit 252.

[0068] (Control of the printing pressure of the squeegee on the mask) Here, the printing pressure of the squeegee 31 on the mask 300 changes over time due to its use in the production of the substrate 200. Specifically, the printing pressure of the squeegee 31 on the mask 300 gradually decreases, for example due to the deterioration of the squeegee 31 over time. When the printing pressure of the squeegee 31 on the mask 300 decreases, it may not be possible to make the squeegee 31 sufficiently close to the mask 300. In this case, it may not be possible to print the desired amount of coating material 303 on the substrate 200, or the position where the coating material 303 is printed on the substrate 200 may be misaligned. In this case, the print quality deteriorates.

[0069] Therefore, as shown in Figure 7, the control unit 8 performs control to acquire the printing pressure of the squeegee 31 on the mask 300 based on the detection result of the load detection unit 6 during the production of the substrate 200, as described above. Then, based on the printing pressure of the squeegee 31 on the mask 300, the control unit 8 performs control to adjust the position of the squeegee 31 in the Z direction, which is the height direction, when printing the coating material 303 on the mask 300 onto the substrate 200 using the squeegee Z-axis drive unit 321. Specifically, when the printing pressure of the squeegee 31 on the mask 300 decreases by a predetermined amount from the reference printing pressure, the control unit 8 performs control to lower the position of the squeegee 31 in the Z2 direction using the squeegee Z-axis drive unit 321 so that the printing pressure of the squeegee 31 on the mask 300 becomes the reference printing pressure. The reference printing pressure is a printing pressure that is determined in advance through experiments or the like. For example, the printing pressure of the squeegee 31 on the mask 300 during the initial production of the substrate 200, and representative values ​​of the printing pressure of the squeegee 31 on the mask 300 during past production of the substrate 200, can be used as the reference printing pressure.

[0070] When adjusting the printing pressure of the squeegee 31 on the mask 300, the control unit 8 lowers the position of the squeegee 31 in the Z2 direction when printing the coating material 303 on the mask 300 onto the substrate 200, and sequentially acquires the printing pressure of the squeegee 31 on the mask 300 based on the detection result of the load detection unit 6. The control unit 8 uses the squeegee Z-axis drive unit 321 to lower the position of the squeegee 31 in the Z2 direction when printing the coating material 303 on the mask 300 onto the substrate 200 until the printing pressure of the squeegee 31 acquired based on the detection result of the load detection unit 6 matches the reference printing pressure. In Figure 7, the control unit 8 is performing control to lower the position of the squeegee 31 from a height H2 to a height H2-h2 when printing the coating material 303 on the mask 300 onto the substrate 200. Furthermore, if the amount of downward movement required for the printing pressure of the squeegee 31 on the mask 300 to become the standard printing pressure is known in advance through experiments or other means, it is not necessary for the load detection unit 6 to detect the load. In this case, the squeegee Z-axis drive unit 321 may be used to lower the position of the squeegee 31 in the Z2 direction by a predetermined amount of downward movement when printing the coating material 303 on the mask 300 onto the substrate 200.

[0071] (Control of the supply of coating material onto the mask) Here, the coating material 303 on the mask 300 is used for printing onto the substrate 200, and is consumed as the production of the substrate 200 progresses. That is, the weight of the coating material 303 on the mask 300 gradually decreases. For this reason, it is necessary to supply the coating material 303 onto the mask 300 as needed.

[0072] Therefore, as shown in Figure 8, the control unit 8 performs control to acquire the current weight of the coating material 303 on the mask 300 based on the detection result of the load detection unit 6 during the production of the substrate 200, as described above. Then, the control unit 8 performs control to supply the coating material 303 onto the mask 300 by the coating material supply unit 7 based on the current weight of the coating material 303 on the mask 300. Specifically, if the current weight of the coating material 303 on the mask 300 falls below a weight threshold, the control unit 8 performs control to supply the coating material 303 onto the mask 300 by the coating material supply unit 7 to compensate for the decrease in weight of the coating material 303 on the mask 300.

[0073] In this case, the control unit 8 supplies the coating material 303 onto the mask 300 by the coating material supply unit 7 and controls the system to sequentially acquire the current weight of the coating material 303 on the mask 300 based on the detection result of the load detection unit 6. Based on the current weight of the coating material 303 on the mask 300 acquired based on the detection result of the load detection unit 6, the control unit 8 controls the supply of the coating material 303 onto the mask 300 by the coating material supply unit 7 until it is determined that the amount equivalent to the decrease in the weight of the coating material 303 on the mask 300 has been supplied onto the mask 300. Note that if the weight of the coating material 303 supplied onto the mask 300 by the coating material supply unit 7 can be determined from the discharge amount of the coating material supply unit 7, it is not necessary for the load detection unit 6 to detect the load. In this case, the coating material 303 may be supplied onto the mask 300 by the coating material supply unit 7 for a predetermined discharge amount.

[0074] (Arrangement of Load Detection Units) As shown in Figures 9 to 13, one or more load detection units 6 are arranged on the substrate table 2. Specifically, the load detection unit 6 is arranged on at least one of the conveyor unit 21, the substrate support unit 26, and the Z-axis table 251. When there are multiple load detection units 6, it is possible to use the average value of the detection results of the multiple load detection units 6 as the detection result of the load detection unit 6. In this case, the detection result of the load detection unit 6 may be a value obtained by simply averaging the detection results of the multiple load detection units 6, or the detection result of the load detection unit 6 may be a value obtained by weighting the detection results of the multiple load detection units 6 according to their positions.

[0075] For example, as shown in Figure 9, the load detection unit 6 is located on one of the pair of conveyor units 21. In this case, the load detection unit 6 is positioned to correspond to the center of the substrate 200 held on the substrate table 2 in the X direction. Alternatively, as shown in Figure 10, the load detection unit 6 is located on both of the pair of conveyor units 21. In this case, the two load detection units 6 are positioned to correspond to the center of the substrate 200 held on the substrate table 2 in the X direction.

[0076] Furthermore, as shown in Figure 11, for example, the load detection unit 6 is located on the substrate support unit 26. In this case, the load detection unit 6 is located so as to correspond to the center of the substrate 200 held on the substrate table 2 in the X direction and the center of the Y direction. Also, as shown in Figure 12, for example, the load detection unit 6 is located on both of the pair of conveyor units 21 and on the substrate support unit 26. In this case, the two load detection units 6 corresponding to the pair of conveyor units 21 are located so as to correspond to the center of the substrate 200 held on the substrate table 2 in the X direction. Additionally, the one load detection unit 6 corresponding to the substrate support unit 26 is located so as to correspond to the center of the substrate 200 held on the substrate table 2 in the X direction and the center of the Y direction.

[0077] Furthermore, as shown in Figure 13, for example, the load detection unit 6 is located on the Z-axis table 251. In this case, the load detection unit 6 is located so as to correspond to the center of the substrate 200 in the X direction and the center of the substrate in the Y direction held by the substrate table 2. The load detection unit 6 may be located on one of the pair of conveyor units 21 and the substrate support unit 26, or on the substrate support unit 26 and the Z-axis table 251, or on one of the pair of conveyor units 21 and the Z-axis table 251, or on both of the pair of conveyor units 21 and the Z-axis table 251, or on both of the pair of conveyor units 21, the substrate support unit 26 and the Z-axis table 251.

[0078] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0079] In this embodiment, as described above, a load detection unit 6 is placed on the substrate table 2 and detects the load applied to the substrate table 2, and a control unit 8 is provided that performs control to acquire at least one of the following based on the detection results of the load detection unit 6 during the production of the substrate 200: the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200. As a result, at least one value of the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200 can be acquired during the production of the substrate 200, so that an accurate value of at least one of the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200 can be acquired. As a result, the process of printing the coating material 303 onto the substrate 200 can be accurately controlled.

[0080] Furthermore, in this embodiment, as described above, a table Z-axis drive unit 252 is further provided to drive the substrate table 2 in the height direction. The control unit 8 acquires the tension of the mask 300 based on the detection result of the load detection unit 6 during the production of the substrate 200, and, based on the tension of the mask 300, controls the table Z-axis drive unit 252 to adjust the position of the substrate 200 held on the substrate table 2 in the height direction during plate alignment, bringing the substrate 200 held on the substrate table 2 into contact with the mask 300. By adjusting the position of the substrate 200 held on the substrate table 2 in the height direction during plate alignment, the tension of the mask 300 can be adjusted to an appropriate value. As a result, a decrease in print quality caused by changes in the tension of the mask 300 over time can be suppressed. In addition, since an accurate value of the tension of the mask 300 can be acquired, the position of the substrate 200 held on the substrate table 2 during plate alignment can be accurately adjusted in the height direction. As a result, the tension of the mask 300 can be accurately adjusted, thereby enhancing the effect of suppressing a decrease in print quality caused by changes in the tension of the mask 300 over time.

[0081] Furthermore, in this embodiment, as described above, when the tension of the mask 300 decreases by a predetermined amount from the reference tension, the control unit 8 controls the table Z-axis drive unit 252 to raise the position of the substrate 200 held on the substrate table 2 in the height direction so that the tension of the mask 300 becomes the reference tension. This makes it easy to adjust the tension of the mask 300 to an appropriate value, and thus it is easy to suppress the deterioration of print quality caused by changes in the tension of the mask 300 over time.

[0082] Furthermore, in this embodiment, as described above, the system is further equipped with a squeegee Z-axis drive unit 321 that drives the squeegee 31 in the height direction. The control unit 8 acquires the printing pressure of the squeegee 31 on the mask 300 based on the detection result of the load detection unit 6 during the production of the substrate 200, and, based on the printing pressure of the squeegee 31 on the mask 300, controls the squeegee Z-axis drive unit 321 to adjust the position of the squeegee 31 in the height direction when printing the coating material 303 on the mask 300 onto the substrate 200. By adjusting the position of the squeegee 31 in the height direction when printing the coating material 303 on the mask 300 onto the substrate 200, the printing pressure of the squeegee 31 on the mask 300 can be adjusted to an appropriate value. As a result, a decrease in print quality caused by changes in the printing pressure of the squeegee 31 on the mask 300 over time can be suppressed. Furthermore, since the precise value of the printing pressure of the squeegee 31 on the mask 300 can be obtained, the position of the squeegee 31 can be precisely adjusted in the height direction when printing the coating material 303 on the mask 300 onto the substrate 200. As a result, the printing pressure of the squeegee 31 on the mask 300 can be precisely adjusted, thereby enhancing the effect of suppressing the deterioration of print quality caused by changes in the printing pressure of the squeegee 31 on the mask 300 over time.

[0083] Furthermore, in this embodiment, as described above, a coating material supply unit 7 is further provided to supply coating material 303 onto the mask 300. The control unit 8 obtains the current weight of the coating material 303 on the mask 300 based on the detection result of the load detection unit 6 during the production of the substrate 200, and controls the supply of coating material 303 onto the mask 300 by the coating material supply unit 7 based on the current weight of the coating material 303 on the mask 300. As a result, if the amount of coating material 303 on the mask 300 decreases due to printing, the amount of coating material 303 that has decreased can be compensated for by supplying coating material 303 onto the mask 300. As a result, a decrease in print quality caused by a decrease in the amount of coating material 303 can be suppressed. In addition, since the accurate value of the current weight of the coating material 303 on the mask 300 can be obtained, the coating material 303 can be supplied accurately onto the mask 300. As a result, the effect of suppressing a decrease in print quality caused by a decrease in the amount of coating material 303 can be enhanced.

[0084] Furthermore, in this embodiment, as described above, the control unit 8 performs control to acquire the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200, based on the detection results of the load detection unit 6 in each of the following states: the state in which the substrate 200 is held on the substrate table 2 before plate alignment in which the substrate 200 held on the substrate table 2 is brought into contact with the mask 300, the state in which plate alignment is performed, the state in which printing pressure is applied to the mask 300 by the squeegee 31, and the state in which the substrate 200 is held on the substrate table 2 after plate separation in which the substrate 200 held on the substrate table 2 is separated from the mask 300. As a result, based on the detection results of the load detection unit 6 in each of the above states, which represent the production state of the substrate 200, the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200 can be easily and accurately obtained.

[0085] Furthermore, in this embodiment, as described above, the control unit 8 controls the acquisition of the initial weight of the coating material 303 on the mask 300 based on the detection result of the load detection unit 6 in the state where the substrate 200 held on the substrate table 2 is brought into contact with the mask 300 on which the coating material 303 is not placed, and the detection result of the load detection unit 6 in the first state where the substrate 200 held on the substrate table 2 is brought into contact with the mask 300 on which the coating material 303 is placed, or controls the acquisition of the initial weight of the coating material 303 on the mask 300 based on the detection result of the load detection unit 6 when supplying the coating material 303 onto the mask 300 in the state where the substrate 200 held on the substrate table 2 is brought into contact with the mask 300 on which the coating material 303 is not placed. This allows for the precise acquisition of the initial weight of the coating material 303 on the mask 300. Based on this initial weight of the coating material 303 on the mask 300, at least one of the following can be precisely determined: the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200.

[0086] Furthermore, in this embodiment, as described above, the control unit 8 performs control to acquire the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the mask 200, based on the detection results of the load detection unit 6 and the initial weight of the coating material 303 on the mask 300 in each of the following states: the state in which the substrate 200 is held on the substrate table 2 before plate alignment in which the substrate 200 held on the substrate table 2 is brought into contact with the mask 300, the state in which plate alignment is performed, the state in which printing pressure is applied to the mask 300 by the squeegee 31, and the state in which the substrate 200 is held on the substrate table 2 after plate separation in which the substrate 200 held on the substrate table 2 is separated from the mask 300. This makes it possible to more easily and accurately obtain the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200, based on the detection results of the load detection unit 6 in each of the above states which represent the production state of the substrate 200, and the initial weight of the coating material 303 on the mask 300.

[0087] Furthermore, in this embodiment, as described above, the control unit 8 controls the recording of at least one of the following: the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200. This allows for the recording of accurate values ​​for at least one of the following: the tension of the mask 300, the printing pressure of the squeegee 31 on the mask 300, the current weight of the coating material 303 on the mask 300, and the weight of the coating material 303 printed on the substrate 200, thereby enabling accurate management of the process of printing the coating material 303 on the substrate 200. For example, if a problem occurs in the production of the substrate 200, it is possible to accurately determine where the problem occurred based on the recorded values.

[0088] Furthermore, in this embodiment, as described above, one or more load detection units 6 are arranged on the substrate table 2. This allows for an increase in the number of components and a reduction in structural complexity when there is only one load detection unit 6. When there are multiple load detection units 6, the load can be detected more accurately using the multiple units 6.

[0089] Furthermore, in this embodiment, as described above, the substrate table 2 includes a conveyor section 21 for transporting the substrate 200, a substrate support section 26 for supporting the substrate 200 placed on the conveyor section 21 from below, and a Z-axis table 251 for supporting the conveyor section 21 from below. The load detection unit 6 is located on at least one of the conveyor section 21, the substrate support section 26, and the Z-axis table 251. This allows the load detection unit 6 to be easily and appropriately positioned on the substrate table 2.

[0090] Furthermore, in this embodiment, as described above, the coating material 303 includes solder. This allows the printing apparatus 100, which prints solder as the coating material 303, to accurately control the process of printing solder as the coating material 303 onto the substrate 200.

[0091] [Modifications] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims rather than the description of the embodiments above, and further includes all modifications (modifications) within the meaning and scope equivalent to the claims.

[0092] For example, in the above embodiment, an example was shown in which the control unit of the printing apparatus performs control related to the present invention, such as control to acquire at least one of the following: the tension of the mask, the printing pressure of the squeegee on the mask, the weight of the coating material on the mask, and the weight of the coating material printed on the substrate. However, the present invention is not limited thereto. For example, an external control unit located outside the printing apparatus may perform control related to the present invention, such as control to acquire at least one of the following: the tension of the mask, the printing pressure of the squeegee on the mask, the weight of the coating material on the mask, and the weight of the coating material printed on the substrate.

[0093] Furthermore, while the above embodiment shows an example in which the table Z-axis drive unit (substrate holding unit drive unit) controls the position of the substrate held in the substrate table (substrate holding unit) in the plate alignment process based on the tension of the mask, the present invention is not limited to this. In the present invention, when acquiring the tension of the mask, it is not necessary to control the position of the substrate held in the substrate holding unit in the plate alignment process based on the tension of the mask using the substrate holding unit drive unit. In this case, if the tension of the mask decreases by a predetermined amount from the reference tension, information regarding the decrease in the mask tension from the reference tension may be notified to the user.

[0094] Furthermore, while the above embodiment shows an example in which the squeegee Z-axis drive unit (squeegee drive unit) controls the position of the squeegee in the height direction when printing the coating material on the mask onto the substrate based on the printing pressure of the squeegee on the mask, the present invention is not limited to this. In the present invention, when acquiring the printing pressure of the squeegee on the mask, it is not necessary to control the position of the squeegee in the height direction when printing the coating material on the mask onto the substrate based on the printing pressure of the squeegee on the mask using the squeegee drive unit. In this case, if the printing pressure of the squeegee on the mask decreases by a predetermined amount from the reference printing pressure, the user may be notified of information regarding the decrease in the printing pressure of the squeegee on the mask from the reference printing pressure.

[0095] Furthermore, while the above embodiment shows an example in which the coating material supply unit controls the supply of coating material onto the mask based on the current weight of the coating material on the mask, the present invention is not limited thereto. In the present invention, when obtaining the current weight of the coating material on the mask, it is not necessary to control the supply of coating material onto the mask by the coating material supply unit based on the current weight of the coating material on the mask. In this case, if the current weight of the coating material on the mask decreases by a predetermined amount, the user may be notified of information that the current weight of the coating material on the mask has decreased by a predetermined amount.

[0096] Furthermore, although the above embodiment shows an example where the conveyor base is a Z-axis table, the present invention is not limited to this. For example, the conveyor base may be an X-axis table, Y-axis table, or R-axis table, etc., instead of a Z-axis table. Also, the conveyor base may be arranged independently of the Z-axis table, X-axis table, Y-axis table, and R-axis table.

[0097] Furthermore, although the above embodiment shows an example where the coating material is solder, the present invention is not limited to this. For example, the coating material may be something other than solder, such as sintering paste or adhesive.

[0098] Furthermore, while the above embodiment shows an example of controlling the recording of at least one of the following as a time-series log: the tension of the mask, the pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate, the present invention is not limited thereto. For example, at least one of the following may be recorded in a format that does not include time-series information.

[0099] 2. Substrate table (substrate holding section) 6. Load detection section 7. Coating material supply section 8. Control section 21. Conveyor section 26. Substrate support section 31. Squeegee 100. Printing device 251. Z-axis table (conveyor base section) 252. Table Z-axis drive section (substrate holding section drive section) 300. Mask 303. Coating material 321. Squeegee Z-axis drive section (squeegee drive section)

Claims

1. A printing apparatus comprising: a squeegee positioned above a mask and printing the coating material on the mask onto a substrate; a substrate holding unit positioned below the mask and holding the substrate; a load detection unit positioned on the substrate holding unit and detecting the load received by the substrate holding unit; and a control unit that performs control to acquire at least one of the following based on the detection result of the load detection unit during the production of the substrate: the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate.

2. The printing apparatus according to claim 1, further comprising a substrate holding unit drive unit for driving the substrate holding unit in the height direction, wherein the control unit acquires the tension of the mask based on the detection result of the load detection unit during the production of the substrate, and controls the substrate holding unit drive unit to adjust the position of the substrate held in the substrate holding unit in the height direction in plate alignment, in which the substrate held in the substrate holding unit comes into contact with the mask, based on the tension of the mask.

3. The printing apparatus according to claim 2, wherein, when the tension of the mask decreases by a predetermined amount from the reference tension, the control unit controls the substrate holding unit drive unit to raise the position of the substrate held by the substrate holding unit in the height direction during plate alignment so that the tension of the mask becomes the reference tension.

4. The printing apparatus according to claim 1, further comprising a squeegee drive unit for driving the squeegee in the height direction, wherein the control unit acquires the printing pressure of the squeegee on the mask based on the detection result of the load detection unit during the production of the substrate, and controls the squeegee drive unit to adjust the position of the squeegee in the height direction when printing the coating material on the mask onto the substrate based on the printing pressure of the squeegee on the mask.

5. The printing apparatus according to claim 1, further comprising a coating material supply unit for supplying the coating material onto the mask, wherein the control unit obtains the current weight of the coating material on the mask based on the detection result of the load detection unit during the production of the substrate, and controls the supply of the coating material onto the mask by the coating material supply unit based on the current weight of the coating material on the mask.

6. The printing apparatus according to claim 1, wherein the control unit performs control to acquire the tension of the mask, the printing pressure applied by the squeegee to the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate, based on the detection result of the load detection unit in each of the following states: the state in which the substrate is held in the substrate holding unit before the plate alignment in which the substrate held in the substrate holding unit is brought into contact with the mask, the state in which the plate alignment is performed, the state in which printing pressure is applied to the mask by the squeegee, and the state in which the substrate is held in the substrate holding unit after the plate separation in which the substrate held in the substrate holding unit is separated from the mask.

7. The printing apparatus according to claim 1, wherein the control unit performs control to acquire the initial weight of the coating material on the mask based on the detection result of the load detection unit in a plate alignment state in which the substrate held in the substrate holding unit is brought into contact with the mask on which the coating material is not placed, and the detection result of the load detection unit in the first plate alignment state in which the substrate held in the substrate holding unit is brought into contact with the mask on which the coating material is placed, or performs control to acquire the initial weight of the coating material on the mask based on the detection result of the load detection unit when supplying the coating material onto the mask in a plate alignment state in which the substrate held in the substrate holding unit is brought into contact with the mask on which the coating material is not placed.

8. The printing apparatus according to claim 7, wherein the control unit performs control to acquire the tension of the mask, the printing pressure applied by the squeegee to the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate, based on the detection result of the load detection unit and the initial weight of the coating material on the mask, in each of the following states: the state in which the substrate is held in the substrate holding unit before plate alignment in which the substrate held in the substrate holding unit is brought into contact with the mask, the state of plate alignment, the state in which printing pressure is applied to the mask by the squeegee, and the state in which the substrate is held in the substrate holding unit after plate separation in which the substrate held in the substrate holding unit is separated from the mask.

9. The printing apparatus according to claim 1, wherein the control unit controls recording at least one of the following: the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate.

10. The printing apparatus according to claim 1, wherein one or more load detection units are arranged in the substrate holding unit.

11. The printing apparatus according to claim 1, wherein the substrate holding section includes a conveyor section for transporting the substrate, a substrate support section for supporting the substrate placed on the conveyor section from below, and a conveyor base section for supporting the conveyor section from below, and the load detection section is located on at least one of the conveyor section, the substrate support section, and the conveyor base section.

12. The printing apparatus according to claim 1, wherein the coating material includes solder.

13. A method for controlling a printing apparatus comprising: a squeegee positioned above a mask for printing a coating material on the mask onto a substrate; and a substrate holding unit positioned below the mask for holding the substrate, the method comprising: detecting a load on the substrate holding unit using a load detection unit positioned on the substrate holding unit; and performing control to obtain at least one of the following based on the detection result of the load detection unit during the production of the substrate: the tension of the mask, the printing pressure of the squeegee on the mask, the current weight of the coating material on the mask, and the weight of the coating material printed on the substrate.

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