Substrate inspection device, substrate inspection method, and component mounting system

Abstract

This substrate inspection device is disposed on the downstream side in the conveyance direction of a substrate with respect to a work device that performs work for producing a mounting substrate, and comprises: a management unit; a measurement unit; and an inspection processing unit. The management unit generates inspection data in which an inspection site, an inspection condition, and an inspection item are set, and manages inspection of the mounting substrate performed on the basis of the inspection data. The measurement unit refers to the inspection site and the inspection condition in the inspection data, captures an image of the mounting substrate in accordance with the inspection condition while moving the imaging field of view in accordance with the position of the inspection site, and acquires shape data of the inspection site on the basis of the image. The inspection processing unit refers to the inspection site and the inspection item in the inspection data, and inspects the inspection site for the inspection item on the basis of the shape data acquired by the measurement unit. The management unit outputs inspection proposal information related to the settings of the inspection site, the inspection condition, and the inspection item in the inspection data on the basis of comparison between the inspection time and the work time.

Description

Substrate inspection apparatus, substrate inspection method, and component mounting system

[0001] The present invention relates to a substrate inspection apparatus, a substrate inspection method, and a component mounting system for inspecting a mounting substrate on which components are mounted.

[0002] In a component mounting line that produces a mounting substrate on which components are mounted on a substrate, a substrate inspection apparatus for inspecting the mounting substrate is incorporated on the downstream side in the substrate conveyance direction with respect to a working apparatus that performs operations for producing the mounting substrate. The substrate inspection apparatus automatically performs inspections such as the state of an inspection site by referring to inspection data in which information about an inspection site to be inspected on the mounting substrate is set. The inspection data affects the inspection time required to inspect one mounting substrate in the substrate inspection apparatus and the quality of the inspection of the mounting substrate. Since the inspection time of the substrate inspection apparatus affects the productivity of the entire component mounting line and the inspection quality affects the quality of the mounting substrate, it is important to set information such as inspection sites in the inspection data.

[0003] Patent Document 1 discloses a technique related to the generation of inspection data. In the technique disclosed in Patent Document 1, necessary data is read from pre-stored operation information of an inspection apparatus and component information, and inspection target components are determined for a single or a plurality of inspection apparatuses. Then, inspection data is generated by converting it into machine data to be actually loaded into the inspection apparatus.

[0004] However, in the technique disclosed in Patent Document 1, when generating inspection data, the production status of the mounting substrate based on the operations of the working apparatus upstream of the substrate inspection apparatus is not considered. For this reason, when inspecting the mounting substrate based on the inspection data in the substrate inspection apparatus, there may be cases where an accurate inspection cannot be performed according to the production status of the mounting substrate based on the operations of the working apparatus.

[0005] Japanese Patent Laid-Open No. 8-62275

[0006] An object of the present invention is to provide a substrate inspection apparatus, a substrate inspection method, and a component mounting system capable of performing an accurate inspection according to the production status of a mounting substrate based on the operations of a working apparatus.

[0007] A substrate inspection apparatus according to one aspect of the present invention is an apparatus positioned downstream in the transport direction of the substrate from a work apparatus that performs work for producing mounted substrates on which components are mounted, and inspects the mounted substrate that has been transported to a predetermined inspection position. This substrate inspection apparatus comprises: a management unit that generates inspection data in which inspection areas, inspection conditions, and inspection items to be inspected on the mounted substrate are set; a measurement unit that refers to the inspection areas and inspection conditions of the inspection data, moves the imaging field according to the position of the inspection areas on the mounted substrate, and performs imaging processing to capture an image of the mounted substrate according to the inspection conditions, and acquires shape data of the inspection areas within the imaging field based on the image; and an inspection processing unit that refers to the inspection areas and inspection items of the inspection data, and performs inspection processing of the inspection items on the inspection areas based on the shape data acquired by the measurement unit. The management unit outputs inspection proposal information indicating suggestions regarding the setting of the inspection area, inspection conditions, and inspection items in the inspection data, based on a comparison between the inspection time required for one mounted substrate from the start of the imaging process by the measurement unit to the completion of the inspection process by the inspection processing unit and the work time required for the work device to produce one mounted substrate.

[0008] Another aspect of the present invention relates to a substrate inspection method, which involves a substrate inspection device positioned downstream in the transport direction of the substrate from a work device that performs work to produce mounted substrates on which components are mounted, and involves inspecting a mounted substrate that has been brought to a predetermined inspection position. This substrate inspection method includes the steps of: generating inspection data in which inspection areas, inspection conditions, and inspection items to be inspected on the mounted substrate are set; performing an imaging process in which an image of the mounted substrate is captured according to the inspection conditions, while moving the imaging field of view according to the position of the inspection area on the mounted substrate, referring to the inspection area and inspection conditions of the inspection data, and acquiring shape data of the inspection area in the imaging field of view based on the image; and performing an inspection process for the inspection items on the inspection area based on the shape data, referring to the inspection area and inspection items of the inspection data. In the step of generating the inspection data, based on a comparison of the inspection time required for the substrate inspection device to inspect one mounted substrate and the work time required for the work device to produce one mounted substrate, the device outputs inspection suggestion information indicating suggestions regarding the setting of the inspection area, inspection conditions, and inspection items in the inspection data.

[0009] A component mounting system according to another aspect of the present invention comprises a work apparatus that performs work for producing mounted substrates on which components are mounted, and a substrate inspection apparatus positioned downstream of the work apparatus in the transport direction of the substrate, for inspecting the mounted substrates that have been transported to a predetermined inspection position.

[0010] This figure shows the configuration of a component mounting system to which a substrate inspection apparatus according to an embodiment of the present invention is applied. This is a block diagram showing the configuration of the substrate inspection apparatus. This is a cross-sectional view showing the measurement unit provided in the substrate inspection apparatus. This figure explains the processing content of the imaging process of the measurement unit and the inspection process of the inspection processing unit in the substrate inspection apparatus. This is a flowchart showing the processing flow of the management unit provided in the substrate inspection apparatus. This is a flowchart relating to the primary generation process of inspection data performed by the management unit. This is a flowchart relating to the secondary generation process of inspection data performed by the management unit. This is a flowchart relating to the secondary generation process of inspection data performed by the management unit. This is a flowchart relating to the auxiliary suggestion process performed by the management unit. This is a flowchart relating to a modified form of the secondary generation process of inspection data performed by the management unit. This is a flowchart relating to a modified form of the secondary generation process of inspection data performed by the management unit.

[0011] Hereinafter, a substrate inspection apparatus, a substrate inspection method, and a component mounting system according to embodiments of the present invention will be described with reference to the drawings. The substrate inspection apparatus according to this embodiment is applied to a component mounting system that produces mounted substrates on which components are mounted, such as printed circuit boards, and is an apparatus for inspecting mounted substrates. A mounted substrate is a product on which circuit patterns are printed, and on which components such as chip components such as chip resistors and chip capacitors, electronic components such as ball bump components and packaged components such as ICs, power supply-related components such as capacitors and transformers, connectors, and heat sinks are mounted.

[0012] [Overall Configuration of the Component Mounting System] Figure 1 shows the configuration of a component mounting system MS to which the board inspection device 3 according to this embodiment is applied. The component mounting system MS includes a component mounting line ML which includes the board inspection device 3. The component mounting line ML produces multiple mounted boards B2, each with components mounted on a board B1, in lot units. The board inspection device 3 sequentially inspects the multiple mounted boards B2 produced in lot units in the component mounting line ML.

[0013] The component mounting line ML is a line that includes multiple work devices 1, a reflow oven 2, and a board inspection device 3, which perform operations to produce mounted boards B2 with components mounted on board B1. The multiple work devices 1 include a printing device 11, a printing inspection device 12, and a mounting device 13. In the component mounting line ML, the printing device 11, the printing inspection device 12, the mounting device 13, the reflow oven 2, and the board inspection device 3 are arranged in tandem from the upstream side to the downstream side of the transport direction TD on the board transport path TP that transports board B1 in the transport direction TD. A loader LD that loads board B1 into the printing device 11 is located at the upstream end of the component mounting line ML, and an unloader ULD that removes the produced mounted board B2 from the board inspection device 3 is located at the downstream end.

[0014] The printing device 11 performs the operation of printing solder paste, such as solder paste, onto the substrate B1, for example, using a screen printing method. The printing device 11 has a printing unit 11U. The printing unit 11U captures an image of the substrate B1 and acquires an image, and based on the image it recognizes the FID (fiducial) marks on the substrate B1 and the size of the substrate B1, and then prints the solder paste onto the substrate B1.

[0015] The printing inspection device 12 performs the task of inspecting whether the position, amount, and height of the solder paste printed on the substrate B1 are appropriate. The printing inspection device 12 has an inspection unit 12U. The inspection unit 12U takes an image of the substrate B1 on which the solder paste is printed and acquires an image, and based on the image it recognizes the FID mark and the size of the substrate B1, and inspects the position and amount of solder paste on the substrate B1.

[0016] The mounting device 13 performs the work of mounting components onto a substrate B1 on which solder paste has been printed, thereby producing a mounted substrate B2. The mounting device 13 has a mounting unit 13U. The mounting unit 13U captures images of the substrate B1 and the components, acquires captured images, and based on these captured images, recognizes the FID mark on the substrate B1, the size of the substrate B1, the shape of the components, etc., and mounts the components onto the substrate B1. Figure 1 shows an example in which three mounting devices 13 are arranged in a row. That is, in the component mounting line ML, the first mounting device 13A, the second mounting device 13B, and the third mounting device 13C are arranged in tandem from the upstream side.

[0017] The reflow oven 2 heats the mounted substrate B2 produced based on the work of each work device 1 of the printing device 11, printing inspection device 12, and mounting device 13 to melt the solder and fix the components to the substrate B1.

[0018] The circuit board inspection device 3 inspects the mounted circuit board B2 produced on the component mounting line ML.

[0019] [Configuration of the PCB Inspection Device] The PCB inspection device 3 will be described with reference to Figure 2 in addition to Figure 1. Figure 2 is a block diagram showing the configuration of the PCB inspection device 3. The PCB inspection device 3 is positioned on the PCB transport path TP of the component mounting line ML, downstream of the multiple work devices 1 in the transport direction TD. The PCB inspection device 3 performs the processing of each step of the PCB inspection method to inspect the condition of each component A and other inspection target area on the mounted PCB B2 that has been transported to a preset inspection position P2 while placed on the conveyor 51.

[0020] The substrate inspection apparatus 3 may have an inspection receiving position P1 set upstream of the inspection position P2 in the transport direction TD, capable of holding a predetermined number of mounted substrates B2. In the example shown in Figure 2, a substrate holding unit 52, such as a buffer conveyor, capable of holding a predetermined number of mounted substrates B2, is arranged at the inspection receiving position P1. The substrate holding unit 52 transports the held mounted substrates B2 one by one to the conveyor 51 where the inspection position P2 is set. Alternatively, the inspection receiving position P1 may be set upstream of the inspection position P2 on the conveyor 51.

[0021] The substrate inspection apparatus 3 comprises a measuring unit 4 and a processing unit 6 as components for performing each step of the substrate inspection method. The measuring unit 4 is a unit that acquires shape data D1 of inspection areas in order to inspect the condition of each component A and other inspection areas on the mounted substrate B2 that has been brought into the inspection position P2. The measuring unit 4 is movable above the mounted substrate B2 by a moving mechanism 43. The processing unit 6 generates inspection data AD which is referenced when inspecting the mounted substrate B2, performs processing to analyze the shape data D1 acquired by the measuring unit 4, and also performs processing to control the operation of the measuring unit 4.

[0022] The inspection data AD is data in which the following information is set: inspection area AD1, inspection conditions AD2, and inspection items AD3. Inspection area AD1 indicates the object to be inspected, such as component A on the mounting board B2, and includes information such as the shape and position of the object to be inspected. Inspection conditions AD2 indicates the conditions for performing the inspection of inspection area AD1 on the mounting board B2, and includes information such as the number of projectors 421 used for light irradiation from among the multiple projectors 421 provided in the measurement unit 4 shown in Figure 3 below. Inspection items AD3 indicate the items for performing the inspection of inspection area AD1 on the mounting board B2, and include information such as component condition inspection and foreign object inspection. Component condition inspection is an inspection item AD3 with component A on the mounting board B2 as the inspection area AD1, and is an item for inspecting the mounting state of component A on the mounting board B2. Examples of inspection items AD3 for component condition inspection include component height, lead overhang, and lead lifting. Foreign object inspection is an inspection item AD3 in which the entire mounted substrate B2 is the inspection area AD1, and it is an item that inspects for foreign objects other than components A mounted on the mounted substrate B2.

[0023] Details of the process by which the processing unit 6 generates the inspection data AD will be described later.

[0024] <About the Measurement Unit> The measurement unit 4 will be explained with reference to Figures 3 and 4 in addition to Figure 2. Figure 3 is a cross-sectional view of the measurement unit 4, and Figure 4 is a diagram illustrating the processing details of the imaging process of the measurement unit 4. The measurement unit 4 is configured to refer to the inspection area AD1 and inspection conditions AD2 of the inspection data AD, and to acquire two-dimensional data D2 and three-dimensional data D3 of the inspection area AD1 on the mounted substrate B2 as shape data D1. In the substrate inspection method, the measurement unit 4 moves the imaging field of view FV by the moving mechanism 43 according to the position of the inspection area AD1 on the mounted substrate B2, and performs an imaging process to capture an image of the mounted substrate B2 according to the inspection conditions AD2, and performs the step of acquiring two-dimensional data D2 and three-dimensional data D3 of the inspection area AD1 within the imaging field of view FV as shape data D1 based on the image.

[0025] If only component condition inspection is set as inspection item AD3 in the inspection data AD, the imaging field of view FV for the mounted board B2 is divided so that each component A, which is the inspection area AD1 on the mounted board B2, is located within at least one of the imaging fields of view FV. On the other hand, if both component condition inspection and foreign object inspection are set as inspection items AD3 in the inspection data AD, the entire mounted board B2 is set as inspection area AD1, so the imaging field of view FV is divided so that each component A is located within at least one of the imaging fields of view FV, and the imaging field of view FV is also set in areas of the mounted board B2 where no component A is present. Therefore, the number of fields of view in the imaging field of view FV when the measurement unit 4 performs imaging processing is greater when both component condition inspection and foreign object inspection are set as inspection items AD3 than when only component condition inspection is set as inspection item AD3. The inspection time required to inspect one mounted board B2 in the board inspection device 3 tends to increase as the number of fields of view in the imaging field of view FV when the measurement unit 4 performs imaging processing increases. Therefore, when component condition inspection and foreign object inspection are both set as inspection item AD3, the quality of the inspection of the mounted board B2 improves as foreign object inspection is performed, but the inspection time also increases, compared to when only component condition inspection is set as inspection item AD3.

[0026] The measurement unit 4 includes a first measurement unit 41 that acquires two-dimensional data D2 and a second measurement unit 42 that acquires three-dimensional data D3 using the phase shift method.

[0027] The measurement unit 4 includes a first camera 40. The first camera 40 is shared by the first measurement unit 41 and the second measurement unit 42. The first camera 40 includes a camera body 401 and a lens barrel 402. The camera body 401 includes an imaging sensor 403 that performs imaging. The imaging sensor 403 is a sensor in which pixels made of photoelectric conversion elements are arranged in a matrix. For example, a CMOS sensor can be used as the imaging sensor 403. The lens barrel 402 includes a plurality of optical lenses that focus the light image of the mounting substrate B2, which is the object, onto the light-receiving surface of the imaging sensor 403. A half mirror 404 that forms the measurement optical path of the first measurement unit 41 is disposed on the optical path inside the lens barrel 402.

[0028] The first measurement unit 41 includes a coaxial illumination unit 411 and a multidirectional illumination unit 412 as an illumination system, and a camera body 401 as an imaging system. The coaxial illumination unit 411 irradiates the mounting substrate B2, which is the object, with coaxial illumination light. The coaxial illumination unit 411 includes an LED light-emitting unit and is mounted on the side surface of the lens barrel 402. The coaxial illumination light emitted from the coaxial illumination unit 411 is reflected by the half mirror 404 and irradiated onto the mounting substrate B2 along the imaging optical axis of the first camera 40. The reflected light from the mounting substrate B2 enters the camera body 401 through the lens barrel 402 and is received by the imaging sensor 403.

[0029] The multi-directional illumination unit 412 includes an upper illumination unit 414, a middle illumination unit 415, and a lower illumination unit 416, all of which consist of LED light-emitting units. The upper illumination unit 414 is attached to the lower end of the first camera 40 and illuminates the mounting substrate B2 with upper illumination light at an illumination angle close to the vertical. The upper illumination light is, for example, white light, or a combination of white light and infrared light. The reflected light of the upper illumination light along the imaging optical axis is also received by the imaging sensor 403.

[0030] The intermediate illumination unit 415 illuminates the mounting substrate B2 with intermediate illumination light at an illumination angle that is more inclined with respect to the vertical than the upper illumination light. The intermediate illumination light is, for example, white light. A dome reflector 4131 with a hemispherical reflective surface is attached to the lower end of the first camera 40. The intermediate illumination unit 415 is positioned facing upward, and the intermediate illumination light is reflected by the dome reflector 4131 and illuminated onto the mounting substrate B2.

[0031] The lower illumination unit 416 illuminates the mounting substrate B2 with lower illumination light at an illumination angle that is even more inclined with respect to the vertical than that of the middle illumination light. The lower illumination light is, for example, white light. A retaining plate 4132, which has a larger diameter than the dome reflector 4131, is attached to the lower end of the dome reflector 4131. The lower illumination unit 416 is mounted on the retaining plate 4132 at a predetermined inclination. The reflected light of the middle illumination light and the lower illumination light along the imaging optical axis is also received by the imaging sensor 403.

[0032] The camera body 401 of the first camera 40 functions as a camera that captures a two-dimensional image of the mounting substrate B2 in the first measurement unit 41 that acquires two-dimensional data D2. When the first measurement unit 41 acquires two-dimensional data D2, one or more of the coaxial illumination unit 411, upper illumination unit 414, middle illumination unit 415, and lower illumination unit 416 are selected. By enabling illumination with coaxial illumination light, upper illumination light, middle illumination light, and lower illumination light, the mounting substrate B2 can be illuminated from multiple angles. As a result, the first measurement unit 41 can acquire two-dimensional data D2 that shows a clear two-dimensional image of the inspection area AD1 on the mounting substrate B2.

[0033] The second measuring unit 42 includes a plurality of projectors 421 as an illumination system and a camera body 401 as an imaging system. The projectors 421 are arranged around the imaging optical axis of the first camera 40 with a predetermined inclination. That is, the light projection axis of the projectors 421 is inclined by a predetermined angle with respect to the imaging optical axis. For example, eight projectors 421 are arranged at equal distances and equal intervals in the circumferential direction surrounding the imaging optical axis.

[0034] The second measurement unit 42, employing a phase shift method, performs imaging while changing the phase of the light irradiated onto the mounting substrate B2, which is the target object, and acquires three-dimensional data D3 of the surface of the mounting substrate B2. Eight projectors 421 each irradiate the mounting substrate B2 with patterned light such as a sine wave pattern or a stripe pattern. Reflected light from the patterned light, along the imaging optical axis, is incident on the first camera 40. The imaging sensor 403 of the camera body 401 receives the reflected light.

[0035] The first camera 40 captures an image of the mounting substrate B2 each time pattern light is emitted from each of the eight projectors 421. The second measurement unit 42 can switch between a first number indicating "8" and a second number indicating "4," which is fewer than the first number, for the number of projectors 421 used to emit pattern light. The second measurement unit 42 analyzes the phase change originating from the surface shape of the mounting substrate B2 based on the brightness change in the images captured according to the number of projectors 421 used. Then, based on the analysis results, the second measurement unit 42 acquires three-dimensional data D3 of the inspection area AD1 on the mounting substrate B2.

[0036] In the second measurement unit 42, the number of images captured when acquiring the three-dimensional data D3 of the inspection area AD1 changes according to the number of projectors 421 used, which are set as the inspection condition AD2 of the inspection data AD. The number of images captured in the second measurement unit 42 is greater when the number of projectors 421 used in inspection condition AD2 is set to the first number "8" than when the number of projectors 421 used in inspection condition AD2 is set to the second number "4". The inspection time required to inspect one mounted substrate B2 in the substrate inspection apparatus 3 tends to increase as the number of images captured in the second measurement unit 42 increases. For this reason, when the number of projectors 421 used in inspection condition AD2 is set to the first number "8", the quality of inspection of the mounted substrate B2 is improved, but the inspection time is longer, compared to when the number of projectors 421 used in inspection condition AD2 is set to the second number "4".

[0037] <About the Processing Unit> The processing unit 6 will be explained with reference to Figure 4 in addition to Figure 2. Figure 4 shows the processing details of the imaging process of the measurement unit 4, as well as the processing details of the inspection process of the inspection processing unit 62 provided in the processing unit 6. The processing unit 6 is composed of a processor that operates by loading a predetermined program. The processing unit 6 generates inspection data AD which is referenced when inspecting the mounted substrate B2, and performs inspection processing to inspect the inspection area AD1 on the mounted substrate B2 by analyzing shape data D1 which includes two-dimensional data D2 and three-dimensional data D3 acquired by the measurement unit 4, and further performs processing to control the operation of the measurement unit 4. In addition, the processing unit 6 performs processing to control the display unit 71 and the operation unit 72 provided in the substrate inspection device 3.

[0038] The display unit 71 is a display that shows various information and data. The operation unit 72 consists of a keyboard, mouse, or a touch panel provided on the display unit 71. The operation unit 72 accepts input operations of various commands from the operator.

[0039] The processing unit 6 comprises, functionally, a management unit 61, an inspection processing unit 62, a storage unit 63, and a communication unit 64.

[0040] The management unit 61 performs comprehensive control of the operations of the inspection processing unit 62, storage unit 63, communication unit 64, display unit 71, and operation unit 72, and also performs control of the operation of the measurement unit 4 via the inspection processing unit 62. In addition, the management unit 61 performs the process of generating inspection data AD in the substrate inspection method, in which the inspection area AD1, inspection condition AD2, and inspection item AD3 are set. Furthermore, after the generation of the inspection data AD, the management unit 61 performs management processing to manage the inspection of the mounted substrate B2 based on the inspection data AD. Details of the processing performed by the management unit 61 will be described later.

[0041] The memory unit 63 stores various data and setting values ​​necessary for the operation of the circuit board inspection device 3. For example, the memory unit 63 stores the inspection data AD generated by the management unit 61.

[0042] The communication unit 64 is an interface circuit that connects a plurality of working devices 1 composed of a printing device 11, a printing inspection device 12, and a mounting device 13 on the component mounting line ML and a board inspection device 3 so that they can communicate data. The communication unit 64 acquires the working time WT required for each working device 1 to produce one mounting board B2 from each working device 1. The working time WT of each working device 1 acquired by the communication unit 64 is input to the management unit 61.

[0043] Note that the working time WT of the printing device 11 is represented by the time required for the printing unit 11U to print solder paste on one board B1, and can be calculated in advance before the production of the mounting board B2 based on information such as the operating speed and operating distance of the printing unit 11U. The working time WT of the printing inspection device 12 is represented by the time required for the inspection unit 12U to inspect the position and amount of the solder paste on one board B1, and can be calculated in advance before the production of the mounting board B2 based on information such as the operating speed and operating distance of the inspection unit 12U. The working time WT of the mounting device 13 is represented by the time required for the mounting unit 1'3U to mount all components A on one board B1, and can be calculated in advance before the production of the mounting board B2 based on information such as the operating speed and operating distance of the mounting unit 13U.

[0044] In the board inspection method, the inspection processing unit 62 refers to the inspection site AD1 and inspection item AD3 of the inspection data AD, and performs a step of inspection processing for the inspection item AD3 on the inspection site AD1 of the mounting board B2 based on the shape data D1 acquired by the measurement unit 4. The inspection processing unit 62 performs inspection processing on the mounting board B2 carried into the inspection position P2 in conjunction with the production of the mounting board B2 by each working device 1 on the component mounting line ML.

[0045] As shown in Figure 4, the inspection processing unit 62 generates shape information DA for the inspection area AD1 on the mounting board B2 by comparing the information for the inspection area AD1 set in the inspection data AD with the shape data D1 acquired by the measurement unit 4. Then, based on the generated shape information DA, the inspection processing unit 62 inspects the state of the inspection area AD1 with respect to inspection item AD3. If component state inspection is set as inspection item AD3 in the inspection data AD, the inspection processing unit 62 inspects the mounting state of component A on the mounting board B2, treating component A on the mounting board B2 as inspection area AD1. If foreign object inspection is set as inspection item AD3 in the inspection data AD, the inspection processing unit 62 inspects whether there are any foreign objects other than component A already mounted on the mounting board B2, treating the entire mounting board B2 as inspection area AD1.

[0046] Next, we will explain the details of the processes performed by the management unit 61, referring to the flowcharts in Figures 5 to 9.

[0047] The management unit 61 performs the primary generation process S1 of inspection data AD, the secondary generation process S2 of inspection data AD, the auxiliary suggestion process S3, and the management process S4 for the inspection of the mounted board B2. The management unit 61 performs the primary generation process S1 and the secondary generation process S2 of inspection data AD, as well as the auxiliary suggestion process S3, before the inspection process of the inspection processing unit 62, which is linked to the production of mounted board B2 by each work device 1 in the component mounting line ML. In addition, the management unit 61 performs the management process S4 to manage the inspection of the mounted board B2 based on the inspection data AD while the mounted board B2 is being produced by each work device 1 in the component mounting line ML.

[0048] (Primary generation process of inspection data) As shown in FIG. 6, in the primary generation process S1 of inspection data AD, the management unit 61 converts the board data for the mounting device used in the mounting device 13 into initial inspection data AD for the board inspection device (step S11). The board data for the mounting device is data in which information such as the board B1 and the component A used in the production of the mounting board B2 is recorded. In the board data, information such as the shape is recorded as information of the board B1, and information such as the shape and the mounting position is recorded as information of the component A. Subsequently, the management unit 61 causes the measurement unit 4 to acquire an overall image of the prototype board (step S12). The prototype board is a board prototyped by the mounting device 13 before the production of the mounting board B2, and is a board on which components are mounted in the same manner as the mounting board B2. The management unit 61 sets the information of the FID mark of the board in the initial inspection data AD based on the overall image of the prototype board (step S13).

[0049] Subsequently, the management unit 61 causes the measurement unit 4 to acquire shape data D1 including two-dimensional data D2 and three-dimensional data D3 in units of the imaging field FV of the prototype board (step S14). Then, based on the shape data D1 of the prototype board, the management unit 61 sets the information of the inspection site AD1 in the initial inspection data AD, and sets the information of the inspection condition AD2 and the inspection item AD3 in the initial inspection data AD in association with the inspection site AD1 (step S15). Thereby, the management unit 61 determines the initial inspection data AD in which the inspection site AD1, the inspection condition AD2, and the inspection item AD3 are set (step S16).

[0050] (Secondary generation processing of inspection data) Once the initial inspection data AD is finalized, the management unit 61 performs secondary generation processing S2 to finalize the final inspection data AD. As shown in Figures 7 and 8, in secondary generation processing S2, the management unit 61 calculates the inspection time IT based on the initial inspection data AD (step S21). The inspection time IT is the time required for the board inspection apparatus 3 to inspect one mounted board B2. Specifically, the inspection time IT is the time required for one mounted board B2 from the time the measurement unit 4 starts imaging processing until the inspection processing unit 62 finishes the inspection processing. As previously described, the inspection time IT tends to increase as the number of fields of view in the imaging field of view FV increases when the measurement unit 4 performs imaging processing. For this reason, if component condition inspection and foreign object inspection are set as inspection items AD3 in the initial inspection data AD, the inspection time IT will be longer than when only component condition inspection is set as inspection item AD3. Furthermore, the inspection time IT tends to increase as the number of images captured by the measurement unit 4 increases. For this reason, if the number of projectors 421 used in inspection condition AD2 is set to the first number "8" in the initial inspection data AD, the inspection time IT will be longer compared to when the number of projectors 421 used in inspection condition AD2 is set to the second number "4".

[0051] Next, the control unit 61 obtains the work time WT required to produce one mounted circuit board B2 in each work device 1 (step S22). Then, the control unit 61 compares the longest work time WT among the work times WT of each work device 1 with the inspection time IT and determines whether the inspection time IT is less than the work time WT (step S23). If the inspection time IT is less than the work time WT (YES in step S23), the control unit 61 determines whether foreign object inspection is set as inspection item AD3 in the initial inspection data AD (step S24).

[0052] If foreign object inspection is set as inspection item AD3 (YES in step S24), the management unit 61 confirms the initial inspection data AD as the final inspection data AD (step S29). On the other hand, if foreign object inspection is not set as inspection item AD3 (NO in step S24), the management unit 61 calculates the inspection time IT if foreign object inspection is set as inspection item AD3 (step S25), and determines whether the calculated inspection time IT is less than the work time WT (step S26). If the inspection time IT when foreign object inspection is set is not less than the work time WT, but is greater than or equal to the work time WT (NO in step S26), the management unit 61 confirms the initial inspection data AD as the final inspection data AD (step S29). On the other hand, if the inspection time IT when foreign object inspection is set is less than the work time WT (YES in step S26), the management unit 61 outputs inspection suggestion information DD1 that proposes setting foreign object inspection in addition to part condition inspection as inspection item AD3 (step S27). The management unit 61 displays the outputted inspection suggestion information DD1 on, for example, the display unit 71.

[0053] After the output of the inspection proposal information DD1, the management unit 61 accepts, for example, an input operation by an operator using the operation unit 72 to edit the settings of the inspection data AD (step S28). By confirming the inspection proposal information DD1, the operator can perform the editing work to set foreign object inspection in addition to part condition inspection as inspection item AD3. Then, the management unit 61 confirms the data in which the settings of inspection item AD3 have been edited according to the inspection proposal information DD1 as the final inspection data AD (step S29).

[0054] As described above, the management unit 61 outputs inspection proposal information DD1, which suggests setting foreign object inspection as inspection item AD3 in addition to component condition inspection, when the inspection time IT is less than the work time WT. In this case, by outputting inspection proposal information DD1, the management unit 61 can propose setting foreign object inspection as inspection item AD3, which improves the quality of inspection of the mounted board B2, within the range that satisfies the condition that the inspection time IT is less than the work time WT.

[0055] If the inspection time IT based on the initial inspection data AD is greater than or equal to the work time WT, and not less than the work time WT (NO in step S23), the management unit 61 determines whether or not foreign object inspection is set as inspection item AD3 in the initial inspection data AD (step S231).

[0056] If foreign object inspection is set as inspection item AD3 (YES in step S231), the management unit 61 calculates the inspection time IT if foreign object inspection is not set as inspection item AD3 (step S232), and determines whether the calculated inspection time IT is less than the work time WT (step S233). If the inspection time IT if foreign object inspection is not set is less than the work time WT (YES in step S233), the management unit 61 outputs inspection proposal information DD1 that suggests setting part condition inspection as inspection item AD3 but not setting foreign object inspection (step S234). The management unit 61 displays the outputted inspection proposal information DD1 on, for example, the display unit 71.

[0057] After the output of the inspection proposal information DD1, the management unit 61 accepts, for example, an input operation by an operator using the operation unit 72 to edit the settings of the inspection data AD (step S235). By confirming the inspection proposal information DD1, the operator can perform editing work such as not setting foreign object inspection as the inspection item AD3. Then, the management unit 61 confirms the data in which the settings of the inspection item AD3 have been edited according to the inspection proposal information DD1 as the final inspection data AD (step S236).

[0058] As described above, the management unit 61 outputs inspection proposal information DD1 that suggests setting part condition inspection as inspection item AD3 and not setting foreign object inspection when the inspection time IT is equal to or greater than the work time WT. In this case, by outputting inspection proposal information DD1, the management unit 61 can suggest setting only part condition inspection as inspection item AD3 so that the inspection time IT is less than the work time WT.

[0059] If the inspection time IT based on the initial inspection data AD is greater than or equal to the work time WT, and only component condition inspection is set as inspection item AD3 and no foreign object inspection is set (NO in step S231), or if the inspection time IT when no foreign object inspection is set is greater than or equal to the work time WT (NO in step S233), the management unit 61 determines whether the number of projectors 421 used in inspection condition AD2 is set to the first number "8" in the initial inspection data AD (step S237). If the number of projectors 421 used in inspection condition AD2 is not set to the first number but is set to the second number "4" (NO in step S237), the management unit 61 performs the auxiliary suggestion process S3 described below.

[0060] On the other hand, if the number of projectors 421 used in inspection condition AD2 is set to the first number (YES in step S237), the management unit 61 calculates the inspection time IT when the number of projectors 421 used in inspection condition AD2 is set to the second number (step S238), and determines whether the calculated inspection time IT is less than the work time WT (step S239). If the inspection time IT when the number of projectors 421 used is set to the second number is not less than the work time WT, but is greater than or equal to the work time WT (NO in step S239), the management unit 61 performs the auxiliary suggestion process S3 described below.

[0061] On the other hand, if the inspection time IT is less than the work time WT when the number of projectors 421 used is set to the second number (YES in step S239), the management unit 61 outputs inspection suggestion information DD1 that proposes setting the number of projectors 421 used to the second number in inspection condition AD2 (step S240). The management unit 61 displays the outputted inspection suggestion information DD1 on, for example, the display unit 71.

[0062] After the output of the inspection proposal information DD1, the management unit 61 accepts, for example, an input operation by an operator using the operation unit 72 to edit the settings of the inspection data AD (step S241). By confirming the inspection proposal information DD1, the operator can perform the editing work to set the number of projectors 421 used as inspection condition AD2 to a second number. Then, the management unit 61 confirms the data in which the settings of inspection condition AD2 have been edited according to the inspection proposal information DD1 as the final inspection data AD (step S242).

[0063] As described above, when the control unit 61 has set component condition inspection as inspection item AD3 but has not set foreign object inspection, and the inspection time IT is equal to or greater than the work time WT, it outputs inspection suggestion information DD1 that proposes setting the number of projectors 421 used in inspection condition AD2 to a second number. In this case, by outputting inspection suggestion information DD1, the control unit 61 can propose setting the number of projectors 421 used in inspection condition AD2 to a second number so that the inspection time IT is less than the work time WT.

[0064] As explained above, the management unit 61 outputs inspection proposal information DD1, which shows suggestions for setting the inspection area AD1, inspection conditions AD2, and inspection items AD3 in the inspection data AD, based on a comparison of the work time WT and the inspection time IT. By outputting the inspection proposal information DD1, the management unit 61 can make suggestions for setting the inspection data AD appropriately according to the production status of the mounted board B2 based on the work time WT of each work device 1. In this case, for example, the operator can check the inspection proposal information DD1 and edit the settings of the inspection data AD appropriately according to the production status of the mounted board B2. As a result, in the board inspection device 3, the measurement unit 4 and the inspection processing unit 62 can perform an accurate inspection according to the production status of the mounted board B2 in each work device 1 based on the final inspection data AD edited according to the inspection proposal information DD1.

[0065] (Auxiliary suggestion processing) When the inspection data AD has been set to part condition inspection as inspection item AD3 but no foreign object inspection has been set, and the number of projectors 421 used as inspection condition AD2 has been set to the second number "4", and the inspection time IT is equal to or greater than the work time WT, the management unit 61 performs auxiliary suggestion processing S3.

[0066] As shown in Figure 9, in the auxiliary proposal processing S3, the management unit 61 outputs work change information DD2 (step S31) or inspection acceptance method information DD3 (step S32). Alternatively, the management unit 61 may output either the work change information DD2 or the inspection acceptance method information DD3. The management unit 61 displays the outputted work change information DD2 and inspection acceptance method information DD3 on, for example, the display unit 71.

[0067] The work change information DD2 is information that proposes changing the working conditions of each work device 1 to conditions that can improve the mounting accuracy of component A onto the substrate B1. Examples of working conditions that can improve the mounting accuracy of component A include conditions that reduce the operating speed when the mounting unit 13U mounts component A onto the substrate B1 in the mounting device 13. In other words, the work change information DD2 is information that proposes changing the working conditions to conditions that can improve the quality of the mounted substrate B2, even though the working time WT required to produce one mounted substrate B2 in the work device 1 will be longer. The management unit 61 outputs the work change information DD2 when the inspection time IT is greater than or equal to the working time WT, thereby proposing to change the working conditions to conditions that can improve the quality of the mounted substrate B2 while suppressing the occurrence of mounted substrate B2 waiting for inspection by the substrate inspection device 3 due to the inspection time IT being greater than or equal to the working time WT.

[0068] The inspection acceptance configuration information DD3 is information that proposes an inspection acceptance configuration for the substrate inspection device 3, which involves arranging a substrate holding unit 52 capable of holding a predetermined number of substrates B2 on the upstream side of the transport direction TD relative to the inspection position P2, or adding a measurement unit 4 and an inspection processing unit 62. Note that adding a measurement unit 4 and an inspection processing unit 62 includes adding multiple substrate inspection devices 3. The management unit 61 outputs the inspection acceptance configuration information DD3 when the inspection time IT is equal to or greater than the work time WT, thereby proposing an inspection acceptance configuration for the substrate inspection device 3 that can suppress the occurrence of work stoppages for each work device 1 due to waiting for inspection by the substrate inspection device 3 caused by the inspection time IT being equal to or greater than the work time WT.

[0069] (Management Processing) After the generation of inspection data AD, the management unit 61 performs management processing S4 to manage the inspection of the mounted board B2 based on the inspection data AD, which is linked to the production of mounted board B2 by each work device 1 in the component mounting line ML.

[0070] In management processing S4, the management unit 61 acquires history information LOD from each work device 1 via the communication unit 64, as shown in Figure 2. When an event that may cause foreign matter to be generated occurs in the work for producing the mounted substrate B2, each work device 1 adds information about that event as history information LOD to the mounted substrate B2. For this reason, the history information LOD registers information about events that may cause foreign matter to be generated, such as component drop information, error information, and solder replacement information, in association with substrate identification information. Component drop information is information registered in the history information LOD when an event occurs in the mounting device 13 where the mounting unit 13U drops component A while performing the work of mounting component A onto the substrate B1. Error information is information registered in the history information LOD when an event occurs in the printing device 11 where the printing unit 11U needs to replace the solder paste used when printing on the substrate B1.

[0071] If foreign object inspection is set as inspection item AD3 in the inspection data AD, the management unit 61 will have the measurement unit 4 perform imaging processing for foreign object inspection, treating the entire mounted board B2 as inspection area AD1, and will also have the inspection processing unit 62 perform foreign object inspection, only if history information LOD is assigned to the mounted board B2. As a result, the management unit 61 can have the measurement unit 4 perform imaging processing for foreign object inspection and the inspection processing unit 62 perform inspection processing with foreign object inspection as inspection item AD3, only when an event that could cause foreign object generation occurs in the production of mounted board B2 based on the work of each work device 1.

[0072] [Modified Embodiments] Although embodiments of the present invention have been described above, the present invention is not limited thereto, and for example, the following modified embodiments may be taken.

[0073] Figures 10 and 11 are flowcharts showing modified versions of the secondary generation process of inspection data AD performed by the management unit 61.

[0074] In the modified secondary generation process S2 shown in Figures 10 and 11, the management unit 61 calculates the inspection time IT based on the initial inspection data AD (step S21). Next, the management unit 61 obtains the work time WT for each work device 1 (step S22). Then, the management unit 61 compares the longest work time WT among the work times WT for each work device 1 with the inspection time IT and determines whether the inspection time IT is less than the work time WT (step S23). If the inspection time IT is less than the work time WT (YES in step S23), the management unit 61 determines whether the number of projectors 421 used in the inspection condition AD2 in the initial inspection data AD is set to the first number "8" (step S24).

[0075] If the number of projectors 421 used in inspection condition AD2 is set to the first number (YES in step S24), the management unit 61 confirms the initial inspection data AD as the final inspection data AD (step S29). On the other hand, if the number of projectors 421 used in inspection condition AD2 is not set to the first number but is set to the second number "4" (NO in step S24), the management unit 61 calculates the inspection time IT when the number of projectors 421 used in inspection condition AD2 is set to the first number (step S25), and determines whether the calculated inspection time IT is less than the work time WT (step S26). If the inspection time IT when the number of projectors 421 used is set to the first number is not less than the work time WT, but is greater than or equal to the work time WT (NO in step S26), the management unit 61 confirms the initial inspection data AD as the final inspection data AD (step S29). On the other hand, if the inspection time IT is less than the work time WT when the number of projectors 421 used is set to a first number (YES in step S26), the management unit 61 outputs inspection suggestion information DD1 which proposes setting the number of projectors 421 used to a first number as the inspection item AD3 (step S27). The management unit 61 displays the outputted inspection suggestion information DD1 on, for example, the display unit 71.

[0076] After the output of the inspection proposal information DD1, the management unit 61 accepts, for example, an input operation by an operator using the operation unit 72 to edit the settings of the inspection data AD (step S28). By confirming the inspection proposal information DD1, the operator can perform the editing work to set the number of projectors 421 used in the inspection condition AD2 to a first number. The management unit 61 then confirms the data in which the settings of the inspection condition AD2 have been edited according to the inspection proposal information DD1 as the final inspection data AD (step S29).

[0077] As described above, the management unit 61 outputs inspection suggestion information DD1 that proposes setting the number of projectors 421 used as inspection condition AD2 to a first number when the inspection time IT is less than the work time WT. In this case, by outputting the inspection suggestion information DD1, the management unit 61 can propose setting the number of projectors 421 used as inspection condition AD2 to a first number, which will improve the quality of inspection of the mounted board B2, within the range that satisfies the condition that the inspection time IT is less than the work time WT.

[0078] If the inspection time IT based on the initial inspection data AD is greater than or equal to the work time WT, and not less than the work time WT (NO in step S23), the management unit 61 determines whether the number of projectors 421 used in the inspection condition AD2 in the initial inspection data AD is set to a first number (step S231).

[0079] If the number of projectors 421 used in inspection condition AD2 is set to a first number (YES in step S231), the management unit 61 calculates the inspection time IT when the number of projectors 421 used in inspection condition AD2 is set to a second number (step S232), and determines whether the calculated inspection time IT is less than the work time WT (step S233). If the inspection time IT when the number of projectors 421 used is set to a second number is less than the work time WT (YES in step S233), the management unit 61 outputs inspection suggestion information DD1 that sets the component condition inspection as inspection item AD3 and proposes setting the number of projectors 421 used in inspection condition AD2 to a second number (step S234). The management unit 61 displays the outputted inspection suggestion information DD1 on, for example, the display unit 71.

[0080] After the output of the inspection proposal information DD1, the management unit 61 accepts, for example, an input operation by an operator using the operation unit 72 to edit the settings of the inspection data AD (step S235). By confirming the inspection proposal information DD1, the operator can perform the editing work to set the number of projectors 421 used in inspection condition AD2 to a second number. The management unit 61 then confirms the data in which the settings of inspection condition AD2 have been edited according to the inspection proposal information DD1 as the final inspection data AD (step S236).

[0081] As described above, the management unit 61 outputs inspection suggestion information DD1 that proposes setting the number of projectors 421 used in inspection condition AD2 to a second number when the inspection time IT is equal to or greater than the work time WT. In this case, by outputting the inspection suggestion information DD1, the management unit 61 can propose setting the number of projectors 421 used in inspection condition AD2 to a second number so that the inspection time IT is less than the work time WT.

[0082] If the inspection time IT based on the initial inspection data AD is greater than or equal to the work time WT, and the number of projectors 421 used in inspection condition AD2 is set to the second number (NO in step S231), or if the inspection time IT when the number of projectors 421 used is set to the second number is greater than or equal to the work time WT (NO in step S233), the management unit 61 determines whether or not foreign object inspection is set as inspection item AD3 in the initial inspection data AD (step S237). If foreign object inspection is not set as inspection item AD3 (NO in step S237), the management unit 61 performs auxiliary suggestion processing S3.

[0083] On the other hand, if foreign object inspection is set as inspection item AD3 (YES in step S237), the management unit 61 calculates the inspection time IT if foreign object inspection is not set as inspection item AD3 (step S238), and determines whether the calculated inspection time IT is less than the work time WT (step S239). If the inspection time IT if foreign object inspection is not set is not less than the work time WT, but is greater than or equal to the work time WT (NO in step S239), the management unit 61 performs the auxiliary suggestion process S3.

[0084] On the other hand, if the inspection time IT when foreign object inspection is not set is less than the work time WT (YES in step S239), the management unit 61 outputs inspection suggestion information DD1 that proposes not setting foreign object inspection as inspection item AD23 (step S240). The management unit 61 displays the outputted inspection suggestion information DD1 on, for example, the display unit 71.

[0085] After the output of the inspection proposal information DD1, the management unit 61 accepts, for example, an input operation by an operator using the operation unit 72 to edit the settings of the inspection data AD (step S241). By confirming the inspection proposal information DD1, the operator can perform editing work such as not setting foreign object inspection as the inspection item AD3. Then, the management unit 61 confirms the data in which the settings of the inspection item AD3 have been edited according to the inspection proposal information DD1 as the final inspection data AD (step S242).

[0086] As described above, when the number of projectors 421 used as inspection condition AD2 is set to the second number, the management unit 61 outputs inspection suggestion information DD1 that proposes not setting foreign object inspection as inspection item AD3 if the inspection time IT is equal to or greater than the work time WT. In this case, by outputting the inspection suggestion information DD1, the management unit 61 can propose not setting foreign object inspection as inspection item AD3 so that the inspection time IT is less than the work time WT.

[0087] [Inventions included in the above embodiments] The embodiments described above include inventions having the following configurations.

[0088] A substrate inspection apparatus according to one aspect of the present invention is an apparatus positioned downstream in the transport direction of the substrate from a work apparatus that performs work for producing mounted substrates on which components are mounted, and inspects the mounted substrate that has been transported to a predetermined inspection position. This substrate inspection apparatus comprises: a management unit that generates inspection data in which inspection areas, inspection conditions, and inspection items to be inspected on the mounted substrate are set; a measurement unit that refers to the inspection areas and inspection conditions of the inspection data, moves the imaging field according to the position of the inspection areas on the mounted substrate, and performs imaging processing to capture an image of the mounted substrate according to the inspection conditions, and acquires shape data of the inspection areas within the imaging field based on the image; and an inspection processing unit that refers to the inspection areas and inspection items of the inspection data, and performs inspection processing of the inspection items on the inspection areas based on the shape data acquired by the measurement unit. The management unit outputs inspection proposal information indicating suggestions regarding the setting of the inspection area, inspection conditions, and inspection items in the inspection data, based on a comparison between the inspection time required for one mounted substrate from the start of the imaging process by the measurement unit to the completion of the inspection process by the inspection processing unit and the work time required for the work device to produce one mounted substrate.

[0089] Furthermore, a component mounting system according to another aspect of the present invention comprises a work device that performs work for producing mounted substrates on which components are mounted, and the above-described substrate inspection device which is positioned downstream of the work device in the transport direction of the substrate and inspects the mounted substrate that has been transported to a predetermined inspection position.

[0090] According to the above-described substrate inspection apparatus, the control unit outputs inspection suggestion information that provides suggestions regarding the setting of inspection areas, inspection conditions, and inspection items in the inspection data, based on a comparison of the working time of the work apparatus and the inspection time of the substrate inspection apparatus. By outputting the inspection suggestion information, the control unit can make suggestions regarding the setting of inspection data that are appropriate according to the production status of the mounted substrates based on the working time of the work apparatus. In this case, for example, the operator can review the inspection suggestion information and edit the inspection data to set the appropriate parameters according to the production status of the mounted substrates. As a result, in the substrate inspection apparatus, the measurement unit and the inspection processing unit can perform accurate inspections according to the production status of the mounted substrates in the work apparatus based on the inspection data edited according to the inspection suggestion information.

[0091] In the above-described substrate inspection apparatus, the control unit may output inspection suggestion information that, if the inspection time is less than the work time, sets a component status inspection as an inspection item that inspects the mounting state of the components on the mounted substrate, with the components on the mounted substrate as the inspection area, and sets a foreign object inspection as an inspection item that inspects foreign objects on the mounted substrate, with the entire mounted substrate as the inspection area. Furthermore, if the inspection time is equal to or greater than the work time, the control unit may output inspection suggestion information that sets the component status inspection as an inspection item but does not set the foreign object inspection.

[0092] In this embodiment, the management unit outputs inspection proposal information suggesting that, if the inspection time is less than the working time, foreign object inspection be added as an inspection item in addition to component condition inspection. In this case, by outputting the inspection proposal information, the management unit can propose setting foreign object inspection as an inspection item, which improves the quality of inspection of the mounted board, within the range that satisfies the condition that the inspection time is less than the working time. Furthermore, the management unit outputs inspection proposal information suggesting that, if the inspection time is greater than or equal to the working time, foreign object inspection not be set as an inspection item. In this case, by outputting the inspection proposal information, the management unit can propose setting only component condition inspection as an inspection item so that the inspection time is less than the working time.

[0093] In the above-described substrate inspection apparatus, the measurement unit includes a plurality of projectors that each emit pattern light with different phases, and a camera body that captures the image each time the pattern light is emitted from the plurality of projectors, and the number of projectors used to emit the pattern light from the plurality of projectors may be switchable between a first number and a second number that is less than the first number. Furthermore, if the inspection time is less than the work time, the management unit may set a component status inspection as the inspection item, which inspects the mounting state of the component on the mounted substrate, and output inspection suggestion information that proposes setting the number of projectors used to the first number as the inspection condition for the component status inspection. Also, if the inspection time is equal to or greater than the work time, the management unit may set the component status inspection as the inspection item and output inspection suggestion information that proposes setting the number of projectors used to the second number as the inspection condition for the component status inspection.

[0094] In this embodiment, the control unit outputs inspection suggestion information that proposes setting the number of projectors used to a first number as an inspection condition when the inspection time is less than the working time. In this case, by outputting the inspection suggestion information, the control unit can propose setting the number of projectors used to a first number as an inspection condition that improves the quality of inspection of the mounted board, within the range that satisfies the condition that the inspection time is less than the working time. Furthermore, the control unit outputs inspection suggestion information that proposes setting the number of projectors used to a second number as an inspection condition when the inspection time is greater than or equal to the working time. In this case, by outputting the inspection suggestion information, the control unit can propose setting the number of projectors used to a second number as an inspection condition so that the inspection time is less than the working time.

[0095] In the above-described substrate inspection apparatus, if the control unit has set the component condition inspection as an inspection item but has not set the foreign object inspection, and the inspection time is equal to or greater than the work time, it may output work change information suggesting that the work conditions of the work apparatus be changed to conditions that can improve the mounting accuracy of the components.

[0096] In this embodiment, if the inspection time exceeds the working time, the management department can propose changing the working conditions to improve the quality of the mounted substrate, even though this will increase the working time in the work equipment.

[0097] In the above-described substrate inspection apparatus, the control unit may output inspection acceptance information that proposes, as an acceptance mode for the inspection of mounted substrates, to arrange a substrate holding unit capable of holding a predetermined number of mounted substrates on the upstream side in the transport direction relative to the inspection position, or to add the measurement unit and the inspection processing unit, when the inspection time is equal to or greater than the work time, after setting the component condition inspection as an inspection item but not setting the foreign object inspection.

[0098] In this embodiment, the management department can propose an inspection acceptance method for the substrate inspection device that can suppress the occurrence of work stoppages of work equipment due to waiting for inspection by the substrate inspection device when the inspection time exceeds the work time.

[0099] In the above-described substrate inspection apparatus, the management unit may be configured to manage the inspection of the mounted substrate based on the inspection data after the inspection data has been generated. In this case, if the inspection of foreign matter is set as an inspection item in the inspection data, the management unit may cause the measurement unit and the inspection processing unit to perform the foreign matter inspection only if historical information indicating that an event that could cause the generation of foreign matter has occurred in the work apparatus has been assigned to the mounted substrate.

[0100] In this embodiment, the control unit can, only when an event occurs that could cause foreign matter to be generated in the production of mounted circuit boards based on the work of the work equipment, have the measurement unit perform imaging processing for foreign matter inspection with the entire mounted circuit board as the inspection area, and also have the inspection processing unit perform inspection processing with foreign matter inspection as the inspection item.

[0101] Another aspect of the present invention relates to a substrate inspection method, which involves a substrate inspection device positioned downstream in the transport direction of the substrate from a work device that performs work to produce mounted substrates on which components are mounted, and involves inspecting a mounted substrate that has been brought to a predetermined inspection position. This substrate inspection method includes the steps of: generating inspection data in which inspection areas, inspection conditions, and inspection items to be inspected on the mounted substrate are set; performing an imaging process in which an image of the mounted substrate is captured according to the inspection conditions, while moving the imaging field of view according to the position of the inspection area on the mounted substrate, referring to the inspection area and inspection conditions of the inspection data, and acquiring shape data of the inspection area in the imaging field of view based on the image; and performing an inspection process for the inspection items on the inspection area based on the shape data, referring to the inspection area and inspection items of the inspection data. In the step of generating the inspection data, based on a comparison of the inspection time required for the substrate inspection device to inspect one mounted substrate and the work time required for the work device to produce one mounted substrate, the device outputs inspection suggestion information indicating suggestions regarding the setting of the inspection area, inspection conditions, and inspection items in the inspection data.

[0102] According to this substrate inspection method, in the step of generating inspection data, inspection suggestion information is output, which provides suggestions regarding the settings of inspection areas, inspection conditions, and inspection items in the inspection data, based on a comparison of the working time of the work equipment and the inspection time of the substrate inspection equipment. By outputting inspection suggestion information when generating inspection data, it is possible to make appropriate suggestions regarding the settings of inspection data according to the production status of the mounted substrates based on the working time of the work equipment. In this case, for example, the operator can check the inspection suggestion information and edit the settings of the inspection data to be appropriate according to the production status of the mounted substrates. As a result, in the step of acquiring shape data and the step of performing inspection processing, accurate inspection can be performed according to the production status of the mounted substrates in the work equipment based on the inspection data edited according to the inspection suggestion information.

Claims

1. A substrate inspection apparatus positioned downstream in the transport direction of the substrate to a work apparatus that performs work for producing mounted substrates on which components are mounted, and inspects the mounted substrate that has been transported to a predetermined inspection position, comprising: a management unit that generates inspection data in which the inspection area, inspection conditions, and inspection items to be inspected on the mounted substrate are set; a measurement unit that refers to the inspection area and inspection conditions of the inspection data, moves the imaging field according to the position of the inspection area on the mounted substrate, and performs imaging processing to capture an image of the mounted substrate according to the inspection conditions, and acquires shape data of the inspection area in the imaging field based on the image; and an inspection processing unit that refers to the inspection area and inspection items of the inspection data, and performs inspection processing of the inspection items on the inspection area based on the shape data acquired by the measurement unit, A substrate inspection apparatus, wherein the management unit outputs inspection proposal information indicating suggestions for setting the inspection area, inspection conditions, and inspection items in the inspection data, based on a comparison between the inspection time required for one mounted substrate from the time the measurement unit starts the imaging process until the inspection processing unit finishes the inspection process and the work time required for the work apparatus to produce one mounted substrate.

2. The board inspection apparatus according to claim 1, wherein the management unit outputs inspection proposal information that, if the inspection time is less than the work time, sets a component status inspection as an inspection item for inspecting the mounting state of the component on the mounting board, with the component on the mounting board as the inspection area, and sets a foreign matter inspection as an inspection item for inspecting foreign matter on the mounting board, with the entire mounting board as the inspection area, and outputs inspection proposal information that, if the inspection time is equal to or greater than the work time, sets the component status inspection as an inspection item and does not set the foreign matter inspection.

3. The substrate inspection apparatus according to claim 1, wherein the measurement unit includes a plurality of projectors that each emit pattern light of different phases, and a camera body that captures an image each time the pattern light is emitted from the plurality of projectors, the number of projectors used to emit the pattern light can be switched between a first number and a second number which is less than the first number, and the management unit, when the inspection time is less than the work time, sets a component status inspection as the inspection item for which the component on the mounting board is the inspection area, and outputs inspection proposal information that proposes setting the number of projectors used to the first number as the inspection condition for the component status inspection, and when the inspection time is equal to or greater than the work time, sets the component status inspection as the inspection item, and outputs inspection proposal information that proposes setting the number of projectors used to the second number as the inspection condition for the component status inspection.

4. The substrate inspection apparatus according to claim 2, wherein the management unit, when the component condition inspection is set as an inspection item but the foreign matter inspection is not set, outputs work change information proposing to change the working conditions of the work apparatus to conditions that can improve the mounting accuracy of the component, if the inspection time is equal to or greater than the work time.

5. The substrate inspection apparatus according to claim 2, wherein, when the control unit has set the component condition inspection as an inspection item but has not set the foreign object inspection, if the inspection time is equal to or greater than the work time, the control unit outputs inspection acceptance information that proposes, as an acceptance mode for the inspection of the mounted substrate, to arrange a substrate holding unit capable of holding a predetermined number of mounted substrates on the upstream side in the transport direction relative to the inspection position, or to add the measurement unit and the inspection processing unit.

6. The substrate inspection apparatus according to claim 2, wherein the management unit manages the inspection of the mounted substrate based on the inspection data after the generation of the inspection data, and if the inspection of foreign matter is set as the inspection item in the inspection data, it causes the measurement unit and the inspection processing unit to perform the inspection of foreign matter only if history information indicating that an event that could cause the generation of foreign matter has occurred in the work device has been assigned to the mounted substrate.

7. A substrate inspection method for inspecting a mounted substrate that has been brought to a predetermined inspection position, in a substrate inspection device positioned downstream in the transport direction of the substrate with respect to a work device that performs work for producing mounted substrates on which components are mounted, comprising: a step of generating inspection data in which inspection areas, inspection conditions, and inspection items to be inspected on the mounted substrate are set; a step of performing an imaging process in which an image of the mounted substrate is captured according to the inspection conditions, while moving the imaging field of view according to the position of the inspection area on the mounted substrate, referring to the inspection area and inspection conditions of the inspection data, and acquiring shape data of the inspection area in the imaging field of view based on the image; and a step of performing an inspection process for the inspection items on the inspection area based on the shape data, referring to the inspection area and inspection items of the inspection data, wherein in the step of generating the inspection data, inspection suggestion information is output showing suggestions regarding the setting of the inspection area, inspection conditions, and inspection items in the inspection data, based on a comparison of the inspection time required for the substrate inspection device to inspect one mounted substrate and the work time required for the work device to produce one mounted substrate.

8. A component mounting system comprising: a work apparatus for performing work to produce mounted circuit boards on which components are mounted; and a circuit board inspection apparatus according to any one of claims 1 to 6, which is positioned downstream of the work apparatus in the transport direction of the circuit board and inspects the mounted circuit boards that have been transported to a predetermined inspection position.

Images