Holding part and processing device provided with holding part

Abstract

A holding part in which a diamond-like carbon film (DLC film) is provided in at least a partial region of a holding surface for holding a member, the holding part being characterized in that the DLC film contains 0.1-4.0 at% of boron, and the hydrogen content is 5.0 at% or less.

Description

Retention part, processing apparatus provided with retention part

[0001] The present invention relates to a retention part and a processing apparatus provided with the retention part.

[0002] In an exposure apparatus, an exposure process is performed on a substrate made of silicon, glass, SiC, GaN, or the like. These substrates are fixed on a retention plate called a chuck by vacuum suction or electrostatic force and are exposed in an aligned state. Further, in the exposure apparatus, there are a transfer hand, lift pins, etc. as means for transferring the substrate. These can be collectively called a substrate retention plate.

[0003] Such a substrate retention plate may cause problems such as partial wear on the surface due to long - term use, deterioration of the flatness of the retained substrate, or adhesion of the generated wear powder to the substrate as foreign matter. Therefore, it is required to improve the durability of the substrate retention plate. Patent Document 1 discloses a substrate retention plate with improved durability by coating a DLC (Diamond Like Carbon) film on the substrate retention surface of the substrate retention plate.

[0004] Japanese Patent Application Laid - Open No. 2015 - 94002

[0005] However, even when using a substrate retention plate coated with DLC as disclosed in Patent Document 1, the retention surface of the substrate retention plate does not completely wear. In recent years, exposure apparatuses are required to further improve overlay accuracy, and a substrate retention plate that can improve durability even a little is required.

[0006] Therefore, an object of the present invention is to provide a technology capable of improving the durability of a member.

[0007] One aspect of the present disclosure is a member provided with a DLC (Diamond Like Carbon) film, wherein the DLC film contains boron at 0.1 at% or more and 4.0 at% or less, and the hydrogen content is 5.0 at% or less.

[0008] According to the present disclosure, it is possible to provide an advantageous technology for improving the durability of a member.

[0009] This is a schematic diagram of an exposure apparatus according to the present invention. This is a perspective view of the substrate holding plate. This is a schematic cross-sectional view of the substrate holding plate according to the first embodiment. This is a schematic cross-sectional view of the substrate holding plate according to the second embodiment. This is a schematic cross-sectional view of the substrate holding plate according to the third embodiment. This is an enlarged view of area 102 in Figure 4A. This is a diagram illustrating the film formation method of the first embodiment. This is a diagram illustrating the film formation method of the second embodiment. This is a diagram illustrating the film formation method of the second embodiment.

[0010] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, the embodiments described below are only one embodiment of the invention and are not limited thereto. In the following description and drawings, common reference numerals are used for components that are common to multiple drawings.

[0011] <First Embodiment> (Exposure Apparatus) The substrate holding plate (substrate holding part) of the present invention can be used as a part of an exposure apparatus. Figure 1 schematically represents an exposure apparatus. The exposure apparatus 10 includes a light source 11 and mirrors 12 and 13 that constitute an illumination optical system. The exposure apparatus 10 also includes a reticle stage 15 that supports a reticle 14 which is a pattern forming means, a projection optical system 16 that projects the pattern formed on the reticle 14, and a substrate holding plate 18 that supports a substrate 17. The substrate holding plate 18 is fixed on a substrate holding plate stage 19, for example, by vacuum suction.

[0012] The substrate holder 18 that holds the substrate 17 within the exposure apparatus 10 is sometimes called a chuck. To transport the substrate 17 to directly above the substrate holder 18, for example, the substrate 17 can be transported while being vacuum-suctioned by a transport hand (not shown). To lower the substrate 17 from directly above the substrate holder 18 to the upper surface of the substrate holder 18, or to raise the substrate 17 from the substrate holder 18 to directly above the substrate holder 18, the lift pins 20 are driven up and down. The substrate holder 18 is provided with multiple through holes 25 for the lift pins so that the lift pins can pass through. The chuck, transport hand, and lift pins described here are types of substrate holders and are examples of embodiments of the present invention.

[0013] Exposure light 21 from the light source 11 is reflected by mirrors 12 and 13 of the illumination optical system and guided to the reticle 14. The exposure light 21 that has passed through the reticle 14 is focused by the projection optical system 16 and projects the pattern formed on the reticle onto the substrate 17. The substrate 17 is coated with photoresist, and the photoresist is exposed by the exposure light 21. The substrate 17 may be a semiconductor wafer or a glass substrate for an FPD (flat panel display). The exposure light 21 of the exposure apparatus is typically ultraviolet light. The wavelength of the exposure light is 436 nm for a g-line light source and approximately 365 nm for an i-line light source. For a KrF excimer laser light source, it is approximately 248 nm, for an ArF excimer laser light source, it is approximately 193 nm, and for an EUV (extreme ultraviolet) light source, it is 10-20 nm. The projection optical system may be a reduction projection type, a 1:1 projection type, or a magnification projection type. A transmission type reticle 14 is exemplified here, but a reflection type reticle may also be used. The projection optical system may be a refractive type using a transmissive lens, or a reflective type using a mirror.

[0014] Furthermore, modern exposure equipment requires extremely high overlay accuracy. Wear on the substrate holder surface can worsen the flatness of the substrate and cause pattern distortion. Distortion is said to be a major cause of reduced overlay accuracy. Therefore, in order to improve overlay accuracy, it is necessary to minimize wear on the substrate holder as much as possible.

[0015] Figure 2A shows a perspective view of the substrate holder according to this embodiment. Figure 2B shows a schematic cross-sectional view of a part of the substrate holder 18 in Figure 2A. The substrate holder 18 has a base portion 22 and a plurality of protrusions 23 on at least the upper surface of the base portion 22. The substrate holder 18 is also provided with suction holes 24 for vacuum adsorption of the substrate 17 and through holes 25 for lift pins to pass through. The upper surfaces of each of the numerous protrusions 23 on the surface of the substrate holder 18 are processed to be of uniform height, and the substrate 17 is held on the substrate holder 18 in contact with the covering on the upper surface of the protrusions 23. A covering layer 26 is applied to the upper surface of the protrusions 23 or the upper surface of the base portion 22. The covering layer 26 covers the substrate, which is the base material.

[0016] By supporting the substrate 17 on the upper surface of the protrusion 23, the contact area between the substrate 17 and the substrate holder plate 18 can be reduced compared to the case without the protrusion 23. As a result, when removing the substrate 17 from the substrate holder plate 18, gas from the atmosphere can easily enter between the substrate 17 and the protrusion 23, allowing the substrate 17 to be lifted and detached with less force.

[0017] The shape of the protrusion 23 may be a rotated trapezoid as shown in Figure 2B, but is not limited to that. The size and arrangement pitch of the protrusion 23 only need to be such that the substrate 17 can be supported. For example, the protrusion 23 may be φ0.1 mm or more and φ10 mm or less, with an arrangement pitch of 1 mm or more and 100 mm.

[0018] In Figure 2A, the substrate holder plate 18 is depicted as a circle, but it is not limited to this; it may be rectangular or square, or multiple rectangular or square substrate holder plates may be arranged to form a substrate holder unit.

[0019] The substrate 17 can be, for example, a semiconductor substrate such as a Si wafer or SiC wafer, an insulating substrate such as a glass wafer, a plastic wafer, or sapphire. It may also be a glass substrate, resin substrate, or sapphire substrate used in the manufacture of organic EL displays, liquid crystal displays, solar panels, etc.

[0020] The materials constituting the base portion 22 and the protrusion portion 23 may be ceramics, glass, plastic, metal, etc., but ceramics are particularly preferred. Examples of ceramics include alumina, black alumina, zirconia, silicon carbide, silicon nitride, cordierite, etc. The base portion 22 and the protrusion portion 23 may be made of the same material or formed from different materials. The materials constituting the base portion 22 and the protrusion portion 23 are the base material, and can be referred to as the substrate.

[0021] The substrate holding plate 18 shown in Figures 2A and 2B can be used not only for exposure apparatuses but also for processing apparatuses equipped with processing units that perform some kind of processing on substrates held by the substrate holding plate, such as for film deposition apparatuses and etching apparatuses. Furthermore, the coating layer 26 of the present invention may be applied to components other than substrates that have a holding portion for holding them, or to components that require wear resistance.

[0022] The coating layer 26 provided on the protrusion 23 is a DLC (Diamond-Like Carbon) film, and furthermore, the DLC film contains 0.1 at% to 4.0 at% boron and 5.0 at% or less hydrogen.

[0023] Here, DLC refers to a general term for amorphous materials primarily composed of carbon, possessing both diamond and graphite bonds. In the ternary phase diagram of DLC proposed by C. Ferrai and J. Robertson, DLC films are classified into four types—ta-C, a-C, ta-C:H, and a-C:H—based on the amount of diamond bonds (sp3), graphite bonds (sp2), and hydrogen content. Among these, ta-C and a-C have a hydrogen content of 5% or less and are also called hydrogen-free DLC. Furthermore, ta-C has an SP3 bond / (SP2 bond + SP3 bond) ratio of 50% or more and is known to have high hardness among DLCs.

[0024] The coating layer 26 only needs to be present on at least a portion of the upper surface of the protrusion 23, and may or may not be present on the side of the protrusion or on the upper surface of the base 22 where there is no protrusion 23 (referred to as the bottom). Furthermore, the coating layer 26 does not need to be a single layer, and only needs to be on the outermost surface of the protrusion 23. In other words, it may be a multilayer structure in which an adhesion layer or a low-resistance layer is laminated between the coating layer 26 and the upper surface of the protrusion 23.

[0025] The inventors have found that a DLC film containing 0.1 at% to 4.0 at% boron and 5.0 at% or less hydrogen yields a film with higher hardness compared to a DLC film that does not contain boron and has a hydrogen content of 5.0 at% or less, thereby improving the wear resistance of the substrate holder.

[0026] The reason why adding a small amount of boron to a DLC film increases its hardness is thought to be as follows: In a DLC film, carbon atoms are bonded to each other, but there are bond defects at some point. When boron is added to this state, it is thought that boron, being an element that forms strong bonds with carbon, compensates for the bond defects and makes the film stronger. On the other hand, it is known that adding too much boron to a DLC film decreases its hardness. This is thought to be because boron atoms substitute for carbon atoms where normal bonds have formed between carbon atoms, forming B-C bonds that are weaker than the bonds between carbon atoms.

[0027] Therefore, by providing a DLC film containing 0.1 at% to 4.0 at% boron and 5.0 at% or less hydrogen as the coating layer 26 of the protrusion 23, it is possible to provide a substrate holding plate with improved durability.

[0028] (Film Formation Method) Next, the film formation method for the first DLC film will be explained using Figure 5. The first DLC film (a DLC film containing 0.1 at% to 4.0 at% boron and 5.0 at% or less hydrogen) can be formed using a filtered arc deposition apparatus.

[0029] A graphite target 37, to which boron has been pre-doped in a predetermined proportion, is used as the target. An arc current of several tens of amperes is passed through the target to induce an arc discharge, generating C ions 36 and boron ions 38. The trajectory of the C ion beam is then controlled by an electromagnetic field applied to a filter, allowing for the formation of a first DLC coating layer 26 with a nearly uniform thickness on the substrate. Furthermore, the amount of boron in the DLC film can be changed by changing the amount of boron added to the graphite target 37.

[0030] <Second Embodiment> Next, the substrate holder plate 18 of this embodiment will be described using Figure 3. In the first embodiment, an example was described in which all of the protrusions 23 were covered with a DLC film containing boron and hydrogen as a coating layer 26. However, this embodiment differs in that the DLC film coating layer covering the protrusions 23 is provided with at least two different compositions depending on the location. In this embodiment, the parts that differ from the first embodiment will be described in detail, and the parts that are similar will be omitted from the description.

[0031] The outermost surface of the substrate-holding plate 18 in this embodiment is provided with a region having a coating layer 26 made of the same first DLC film as in the first embodiment, and a region having a coating layer 28 made of a second DLC film with lower film hardness than the first DLC film. The first DLC film contains 0.1 at% to 4.0 at% boron and 5.0 at% or less hydrogen, similar to the first embodiment. The second DLC film is not particularly limited as long as it is a DLC film other than the first DLC film, but it is preferably an a-C:H, a-C, ta-C DLC film.

[0032] Since the first DLC film has higher wear resistance than the second DLC film, at least the coating layer 26 of the first DLC film is provided on the outermost surface of the substrate holding surface in areas that are prone to wear due to friction on the substrate holding plate. Then, by providing the coating layer 28 of the second DLC film on the outermost surface of areas that are less prone to wear, the deterioration of flatness due to partial wear of the surface of the substrate holding plate 18 can be reduced.

[0033] Figure 3 is a schematic cross-sectional view of a substrate 17 being placed on a substrate holder 18. The substrate 17 is lowered while being supported by the lift pins 20. At this time, the substrate 17 bends under its own weight, as shown in Figure 3, so that the area between the lift pins 20 becomes convex downwards. The substrate 17, which has bent under its own weight, first makes contact with the substrate holder 18 at the area enclosed by 101. Because a strong force is applied at the time of the first contact, the area enclosed by circle 101 of the substrate holder 18 will wear down more significantly than other areas. For this reason, a coating layer 26 made of a first DLC film with high wear resistance is provided in the area of ​​the substrate holder that is most likely to wear down, that is, in the area between adjacent lift pins, and a coating layer 28 made of a second DLC film is provided in the area other than that area. In this way, even if the type of DLC film is different depending on the relationship with the lift pins 20, wear resistance comparable to that obtained when the entire surface is coated with the first DLC film can be obtained.

[0034] Next, the advantages of being able to reduce the deposition area of ​​the first DLC film will be explained. As a result of diligent research, the inventors found that the first DLC film, which contains 0.1 at% to 4.0 at% boron and 5.0 at% or less hydrogen, has higher film stress compared to other DLCs, for example, that do not contain boron. If a film with such high film stress is deposited on the entire surface of the substrate holder 18, the effects of the film stress may cause problems such as delamination of the coating layer or deformation of the substrate holder. In this embodiment, since the first DLC film is limited to the minimum necessary area, the deposition area can be narrowed, and the effects of film stress can be reduced, which is advantageous in that it can reduce problems such as delamination and deformation of the substrate holder.

[0035] Furthermore, in this embodiment, if a DLC film of the DLC classification ta-C is used as the second DLC film provided on the coating layer 28, even more advantageous effects can be obtained. Generally, when the surface of a single substrate holder is coated with multiple different types of films, as in this embodiment, there is a possibility that the friction coefficients of the two films will differ. If the friction coefficients differ, the sliding of the substrate on the substrate holder 18 will become unstable, and the reproducibility of substrate installation will deteriorate. Also, if the electrical resistance values ​​of the two films differ, there is a possibility that problems such as electrostatic discharge will occur at the interface between the films.

[0036] However, the inventors have found that a first DLC film containing 0.1 at% to 4.0 at% boron and 5.0 at% or less hydrogen has a coefficient of friction and electrical resistance very close to that of a DLC film classified as ta-C. Therefore, the first DLC film containing 0.1 at% to 4.0 at% boron and 5.0 at% or less hydrogen is used as the coating layer 26, and the second DLC film classified as ta-C is used as the coating layer 28. This makes it possible to make the difference in the coefficient of friction and the difference in electrical resistance between the first DLC film and the second DLC film very small. Consequently, the slipperiness of the substrate and the electrical resistance can be kept constant across the entire surface of the substrate holder 18, and the risks expected when coating different films on a single surface can be avoided.

[0037] (Film Formation Method) Next, two different methods for forming DLC ​​films according to this embodiment will be explained using Figures 6A and 6B.

[0038] First, as shown in Figure 6A, a graphite target 33 is placed in the filtered arc deposition apparatus 32, and an arc discharge is initiated to deposit a film on the substrate holder plate 18. At this time, a mask 35 is placed directly in front of the substrate holder plate 18 to prevent C ions 36 from reaching a specific location on the substrate holder plate 18. By depositing the film in this state, a second DLC film is formed on a part of the surface of the substrate holder plate 18. The process is the same as for depositing the second DLC film, except that a graphite target (without elemental doping) is used as the target. The second DLC film deposited by this method corresponds to a DLC film classified as ta-C.

[0039] Next, as shown in Figure 6B, a boron-doped graphite target 37 is placed in the filtered arc deposition apparatus 32, and an arc discharge is generated to deposit a film on the substrate holder plate 18. At this time, the mask 39 is positioned so that the areas that were blocked by the mask 35 in the process shown in Figure 6A are left open, and the film is deposited. By depositing the film in this state, the coating layer 26 of the first DLC film can be formed on the surface of the substrate holder plate 18 where the coating layer 28 of the second DLC film is not present.

[0040] In this embodiment, an example was described using a case where the coating layer 28 is formed as a single layer of the second DLC film. However, the coating layer 28 may also be a laminated structure of the first DLC film and the second DLC film. In that case, the first DLC film is deposited on the entire surface of the substrate holding plate 18, and a mask 39 is provided when depositing the second DLC film.

[0041] <Third Embodiment> Next, the third embodiment will be described using Figures 4A and 4B. Figure 4A is a schematic cross-sectional view of the substrate holder plate 18, and Figure 4B is an enlarged view of the region 102 in Figure 4A. This embodiment differs from the first and second embodiments in that the covering on the upper surface of the protrusion 23 has a two-layer structure. In this embodiment, the parts that differ from the first and second embodiments will be described in detail, and the parts that are similar will be omitted from the description.

[0042] The coating layer 26 of the present embodiment provides the film closer to the protrusion 23 side with a second DLC film 30 similar to that of the second embodiment, and provides the surface on the side holding the substrate 17 provided on the second DLC film 30 with a first DLC film 31. The first DLC film contains 0.1 at% or more and 4.0 at% or less of boron and 5.0 at% or less of hydrogen in the DLC film, similar to the first embodiment. The second DLC film is not particularly limited as long as it is a DLC film, but is preferably a DLC film of a-C:H, a-C, or ta-C.

[0043] As in the present embodiment, by making the coating layer 26 have at least a two-layer structure, the film thickness of the first DLC can be reduced. This is because the wear resistance of the substrate holding plate 18 depends on the hardness of the outermost surface of the coating formed on the upper surface of the protrusion 23. Therefore, if the first DLC film is coated on the outermost surface of the coating as in the present embodiment, wear resistance equivalent to that of the first embodiment can be obtained.

[0044] In addition, since the first DLC film has a smaller film formation rate than other DLC films, it takes a long time to form the film thickness of the coating layer required to ensure reliability as the substrate holding plate 18. Therefore, as in the present embodiment, only the necessary resurfacing is provided as the first DLC film, and the lower layer other than that is made of a second DLC film having a higher film formation rate than the first DLC film, so that durability and reliability can be ensured while ensuring productivity.

[0045] <Examples> The DLC film used in the present invention will be described in detail. The following (1) to (6) were used as evaluation methods. [[ID=ll]]

[0046] (1) Measurement of boron content in DLC film It was performed using an X-ray photoelectron spectrometer (XPS) (manufactured by ULVAC-PHI, Inc., Quantera II). The "boron content rate" in the text used the atomic content rate of B when the total of the atomic content rate of C and the atomic content rate of B was 10OP.

[0047] (2) Measurement of film hardness A nanoindenter tester (manufactured by Toyo Technica Co., Ltd., NanoIndenter XP) was used. A DLC film was formed on a Si wafer to a thickness of about 120 nm. A Berkovich indenter was pressed into the film surface to a depth of 500 nm, and the film hardness at a depth of 50 nm was used.

[0048] (3) Id / Ig A Raman spectrometer (manufactured by Renishaw plc, inVia Qontor) was used to obtain a Raman spectrum with a 532 nm laser beam, and the intensity ratio Id / Ig of the peak Id of the D band and the peak Ig of the G band was evaluated.

[0049] (4) Maximum wear amount of chuck pins A sample was prepared using a φ200 SiC chuck, and a Si substrate in a donut shape (outer diameter φ200, inner diameter φ50) was rotated on the chuck surface to simulate the sliding evaluation between the protrusions of the chuck and Si. The sample was taken out when the sliding distance reached 100 m, and the decrease amount of the height of the protrusion, that is, the wear amount, was measured using an interferometer. The decrease amount of the height of the protrusion with the largest decrease in height among the innumerable protrusions was used as the "maximum wear amount".

[0050] (5) Coefficient of friction A pin-on-disk type wear tester (manufactured by Resca Co., Ltd., FPR-1200) was used. A Φ5 mm Si ball and a DLC film were slid in the air. The sliding conditions were a load of 50 gw, a reciprocating linear motion with a width of 5 mm, and a sliding speed of 18 mm / sec, and the average value of the coefficient of friction for 10 minutes from the start was used.

[0051] (6) Surface resistivity It was measured using a high-resistivity meter (manufactured by Nitto Seiko Analytic Co., Ltd., MCP-HT450). The probe used was a ring probe (MCP-HTP12), and the applied voltage during measurement was 100 V.

[0052] <Evaluation of DLC film> Before showing the examples and comparative examples, Table 1 shows the evaluation results of the basic physical property values of the DLC films used in Examples 1 to 12 and Comparative Examples 1 to 4. Films A to E are films with different boron contents in the DLC film. Regarding the hydrogen content, although it was evaluated by ERDA (Elastic Recoil Detection Analysis), the values are not described because they were all at the noise level for all films.

[0053]

[0054] <Examples 1-4> Samples were prepared by applying membranes A to D (DLC membranes with boron content of 0.4%, 1.0%, 1.6%, and 4.0% in the DLC membrane) to the first DLC membrane of the first embodiment.

[0055] <Comparative Example 1> A sample was prepared by applying the ta-C classification film to the first DLC film of the first embodiment.

[0056] <Comparative Example 2> A sample was prepared by applying film E (a DLC film with a boron content of 8.0%) to the first DLC film of the first embodiment.

[0057] <Examples 5-8> Samples were prepared by applying films A to D (DLC films with boron content of 0.4%, 1.0%, 1.6%, and 4.0% in the DLC film) to the first DLC film of the second embodiment. A ta-C film was used for the second DLC film.

[0058] <Comparative Example 3> A sample was prepared by applying film E (a DLC film with a boron content of 8.0%) to the first DLC film of the second embodiment. A ta-C film was used for the second DLC film.

[0059] <Examples 9-12> Samples were prepared by applying films A to D (DLC films with boron content of 0.4%, 1.0%, 1.6%, and 4.0% in the DLC film) to the first DLC film of the third embodiment. A ta-C film was used for the second DLC film.

[0060] <Comparative Example 4> A sample was prepared by applying film E (a DLC film with a boron content of 8.0%) to the first DLC film of the third embodiment. A ta-C film was used for the second DLC film.

[0061] Table 2 shows the wear test results for Examples 1 to 12 and Comparative Examples 1 to 4. The maximum wear amount of the chuck pin was determined based on the result of Comparative Example 1 (ta-C, which does not contain boron), which was 5.0 nm. Products with a wear amount of 5 nm or more were rated "C", products with a wear amount between 2.5 nm and 5 nm were rated "B", and products with a wear amount of less than 2.5 nm were rated "A". Based on the above criteria, a rating of B or higher indicates that the chuck has higher wear resistance than conventional chucks.

[0062]

[0063] <Evaluation of Examples and Comparative Examples> Examples 1 to 12 received a rating of B or higher. Therefore, it can be said that by applying films A to D as the first DLC, a substrate holder with higher wear resistance than conventional ones can be obtained. Films A to D have a boron content of 0.1 at% to 4.0 at%.

[0064] Furthermore, since membranes B and C received an A rating, it can be said that a boron content of 1.0 at% or more and less than 2.0 at% is more preferable.

[0065] Referring to Table 1, the Raman spectroscopy results for films A to D, corresponding to Examples 1 to 12 which received a B rating or higher, indicate that the intensity ratio of the D-band peak Id to the G-band peak Ig (Id / Ig) is preferably between 0.10 and 0.33. Furthermore, since films B and C received an A rating, it can be said that an Id / Ig ratio of 0.20 to 0.24 is even more preferable.

[0066] This embodiment includes the following configuration.

[0067] (Item 1) A retaining part having a DLC (Diamond-Like Carbon) film provided on at least a portion of the retaining surface that holds a member, wherein the DLC film contains 0.1 at% to 4.0 at% boron and has a hydrogen content of 5.0 at% or less.

[0068] (Item 2) The retaining part according to Item 1, characterized in that the DLC film contains boron in an amount of 1.0 at% or more and less than 2.0 at%.

[0069] (Item 3) The holding part according to Item 1 or 2, characterized in that the DLC film has an intensity ratio (Id / Ig) of 0.10 or more and 0.33 or less in the Raman spectrum when Raman spectroscopy is performed on the D band.

[0070] (Item 4) The retaining portion according to any one of items 1 to 3, characterized in that the retaining portion has a plurality of protrusions that contact the substrate on the retaining surface, and the DLC film is provided on the surface of the plurality of protrusions.

[0071] (Item 5) The retaining part according to any one of items 1 to 4, wherein a DLC film other than the DLC film is provided in a region of the retaining part other than the region of the DLC film, and the DLC film has a higher film hardness than the other DLC film.

[0072] (Item 6) The retaining part according to Item 5, characterized in that the other DLC film does not contain boron.

[0073] (Item 7) The retaining part according to item 5 or 6, characterized in that the other DLC film is a ta-C film of the DLC classification.

[0074] (Item 8) The retaining part according to any one of items 1 to 7, characterized in that the retaining part is provided with a plurality of through holes through which the lift pin passes, and the DLC film is provided in the region between adjacent through holes as a part of the region.

[0075] (Item 9) The retaining part according to any one of items 1 to 4, wherein another DLC film other than the DLC film is provided between the retaining part and the DLC film, and the DLC film has a higher film hardness than the other DLC film.

[0076] (Item 10) A processing apparatus comprising: a holding part described in any one of items 1 to 9 used for holding a substrate; and a processing unit that performs processing on the substrate held by the holding part.

[0077] (Item 11) A component having a DLC film on its outermost surface that contains 0.1 at% to 4.0 at% boron and has a hydrogen content of 5.0 at% or less.

[0078] The present invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are attached to make the scope of the invention public.

[0079] This application claims priority based on Japanese Patent Application No. 2024-200565, filed on 18 November 2024, and all of its contents are incorporated herein by reference.

[0080] 10 Exposure apparatus 11 Light source 12 Mirror 13 Mirror 14 Reticle 15 Reticle stage 16 Projection optical system 17 Substrate 18 Substrate holder 19 Substrate holder stage 20 Lift pin 21 Exposure light 22 Base 23 Protrusion 24 Suction hole 25 Through hole

Claims

1. A component provided with a DLC (Diamond-Like Carbon) film, wherein the DLC film contains 0.1 at% to 4.0 at% boron, and the hydrogen content of the DLC film is 5.0 at% or less.

2. The component according to claim 1, characterized in that the DLC film contains 1.0 at% or more of boron.

3. The component according to claim 1, characterized in that the DLC film contains less than 2.0 at% boron.

4. The DLC film is characterized in that, in the Raman spectrum obtained by Raman spectroscopy, the intensity ratio (Id / Ig) of the D-band peak Id to the G-band peak Ig is 0.10 or more and 0.33 or less.

5. The member according to claim 1, characterized in that the material constituting the portion of the member coated with the DLC film is a ceramic.

6. The member according to claim 1, characterized in that the material constituting the portion of the member covered with the DLC film is alumina, black alumina, zirconia, silicon carbide, silicon nitride, or cordierite.

7. The member according to claim 1, characterized in that the material constituting the portion of the member covered with the DLC film is glass, plastic, or metal.

8. The member according to claim 1, wherein a DLC film other than the DLC film is provided between the portion of the member covered with the DLC film and the DLC film, and the DLC film has a higher film hardness than the other DLC film.

9. The member according to claim 1, wherein the surface of the member has a base and a plurality of protrusions on the base, and the DLC film is provided on at least the plurality of protrusions.

10. The member according to claim 8, characterized in that the DLC film is provided on the base.

11. The member according to claim 1, characterized in that the DLC film is a first DLC film, and a second DLC film having a lower film hardness than the first DLC film is provided.

12. The member according to claim 11, characterized in that the second DLC film does not contain boron.

13. The member according to claim 11, characterized in that the second DLC film is a ta-C film of the DLC classification.

14. The member according to claim 1, wherein the DLC film is provided on the outermost surface.

15. The member according to any one of claims 1 to 14, characterized in that it has a holding surface for holding an object, and the DLC film is provided in at least a portion of the area of ​​the holding surface.

16. The member according to claim 15, wherein a DLC film other than the DLC film is provided in the region of the retaining surface other than the region of the retaining surface other than the region of the retaining surface, and the DLC film has a higher film hardness than the other DLC film.

17. The member according to claim 15, characterized in that the base of the member is provided with a plurality of through holes through which a lift pin passes, and the DLC film is provided in the region between adjacent through holes as a part of the region.

18. An apparatus comprising: a member according to any one of claims 1 to 17 used to hold a substrate; and a processing unit that performs processing on the substrate held by the member.

Images