Electronic device comprising cover glass, and manufacturing method therefor

Abstract

An electronic device according to the present disclosure comprises: a display panel; a cover glass including a first surface facing the front of the electronic device, and a second surface opposite to the first surface, wherein the second surface includes a first area disposed on at least a portion of the display panel and a second area formed to be inclined with respect to the first area; a support member including a supporting portion for supporting an edge portion of the cover glass, and a recessed portion in which the display panel is accommodated; and a reflective layer which is formed in the second area of the cover glass, and which includes a third area attached to the display panel and a fourth area that excludes the third area, wherein the thickness of the third area of the reflective layer can be formed to be smaller than the thickness of the fourth area of the reflective layer because of the pressure between the cover glass and the display panel.

Description

Electronic device including cover glass and method of manufacturing the same

[0001] The present disclosure relates to an electronic device including a cover glass and a method for manufacturing the same.

[0002] Recently, as the gap between hardware and software among electronic device manufacturers narrows, there is growing interest not only in improving the performance of electronic devices but also in enhancing their aesthetic appeal and differentiating them through design. For example, there is an increasing number of electronic devices adopting full-display designs that maximize the display area. Electronic devices with full-displays utilize cover glass to protect the display surface. In particular, glass materials are being used to manufacture devices that protect the display surface due to their high surface hardness and excellent optical performance. However, design limitations are becoming apparent due to the characteristics of glass materials and the printing methods used on the full-display glass.

[0003] Accordingly, when implementing a cover glass for a front display design in an electronic device, it is necessary to find a way to introduce a new type of design while protecting the cover glass.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] An electronic device according to the present disclosure comprises a display panel, a cover glass including a first surface facing forward of the electronic device and a second surface opposite to the first surface, wherein the second surface includes a first region disposed on at least a portion of the display panel and a second region formed inclined with respect to the first region, a supporting portion supporting an edge portion of the cover glass, and a recessed portion receiving the display panel, and a reflective layer including a third region formed on the second region of the cover glass and attached to the display panel and a fourth region excluding the third region, wherein, by pressure between the cover glass and the display panel, the thickness of the third region of the reflective layer may be formed to be smaller than the thickness of the fourth region of the reflective layer.

[0006] A method for manufacturing an electronic device including a cover glass according to the present disclosure may include the steps of: providing a display panel; processing the second surface of the cover glass, which includes a first surface facing the front of the electronic device and a second surface opposite to the first surface, such that the second region of the second surface is formed at an angle with respect to the first region; placing a reflective layer on the second region of the cover glass, which includes a third region attached to the display panel and a fourth region excluding the third region; forming a support member comprising a support portion supporting the edge portion of the cover glass and a recessed portion receiving the display panel; and placing the cover glass such that the fourth region of the reflective layer is attached to the support portion of the support member and the third region of the reflective layer is attached to the display panel, wherein in the step of placing the cover glass, the thickness of the third region of the reflective layer is such that, due to pressure between the cover glass and the display panel, the thickness of the fourth region of the reflective layer It can be formed smaller than the thickness.

[0007] FIG. 1 is a drawing for illustrating an overview of the structure of an electronic device according to various embodiments of the present disclosure.

[0008] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment.

[0009] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment.

[0010] FIG. 4 is a drawing showing a part of the cross-section of a cover glass according to one embodiment.

[0011] FIG. 5 is a drawing illustrating a process of placing a cover glass in an electronic device according to one embodiment and a part of a cross-section of the electronic device in a state where the cover glass is placed.

[0012] FIG. 6 is a drawing showing a part of the cross-section of a cover glass to explain a method for processing a cover glass according to one embodiment.

[0013] FIG. 7 is a drawing showing a part of the cross-section of a cover glass to explain a method for processing a cover glass according to one embodiment.

[0014] FIG. 8 is a drawing for explaining an example of processing a second area of ​​a second surface of a cover glass in an electronic device including a reflective layer of a constant thickness according to one embodiment.

[0015] FIG. 9 is a drawing for explaining an example of processing a second area of ​​a second surface of a cover glass in an electronic device including a reflective layer of a constant thickness according to one embodiment.

[0016] FIG. 10 is a drawing for explaining an example of processing a second area of ​​a second surface of a cover glass in an electronic device including a reflective layer of a constant thickness according to one embodiment.

[0017] FIG. 11 is a drawing showing a part of the exterior of an electronic device according to one embodiment.

[0018] FIG. 12 is a flowchart illustrating the process of forming an electronic device by arranging the components of the electronic device according to one embodiment.

[0019] FIG. 13 is a block diagram of an electronic device in a network environment according to various embodiments.

[0020] Hereinafter, embodiments are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. However, the disclosed embodiments may be implemented in various different forms and are not limited to the embodiments described herein.

[0021] FIG. 1 is a drawing for explaining an overview of the structure of an electronic device (200) according to various embodiments of the present disclosure.

[0022] An electronic device (200) according to one embodiment may include a display (201).

[0023] A display (201) of an electronic device (200) according to one embodiment may include a display panel (120).

[0024] A display (201) of an electronic device (200) according to one embodiment may include a cover glass (110). The cover glass (110) according to the present disclosure may be configured in various forms and methods. For example, the cover glass (110) may have the shape of the cover glass (110) shown in FIG. 4.

[0025] In one embodiment, the cover glass (110) may include a second surface (112) facing in a direction opposite to the front (e.g., +z direction) of the electronic device (200). The second surface (112) may include a first area (113) disposed on at least a portion of the display panel (120) and a second area (114) formed at an angle with respect to the first area.

[0026] According to one embodiment, in the cover glass (110), the thickness of the cover glass (110) corresponding to the second region (114) of the second surface (112) may decrease as it approaches the edge of the cover glass (110).

[0027] In one embodiment, a reflective layer (150) may be disposed in a second region (114) of a second surface (112) of a cover glass (110). The reflective layer (150) may include a third region (153) attached to a display panel (120) and a fourth region (154) excluding the third region (153). The third region (153) of the reflective layer (150) may be compressed by the pressure between the cover glass (110) and the display panel (120) as the cover glass (110) and the display panel (120) are attached. Thus, the volume of the third region (153) of the reflective layer (150) may be reduced. As the volume of the third region (153) of the reflection layer (150) decreases, the thickness of the third region (153) of the reflection layer (150) can be formed to be smaller than the thickness of the fourth region (154) of the reflection layer (150).

[0028] The present disclosure may provide a method for processing a wider area of ​​the edge portion of a display (210) by a third region (153) of a reflective layer (150) that is compressed by pressure between the cover glass (110) and the display panel (120) and has its volume reduced. Accordingly, a higher aesthetic quality may be provided to the user in the edge portion of the display (210).

[0029] FIG. 2 is a perspective view showing the front of an electronic device (200) according to one embodiment. FIG. 3 is a perspective view showing the rear of an electronic device (200) according to one embodiment.

[0030] Referring to FIGS. 2 and 3, an electronic device (200) according to one embodiment may include a housing (210, e.g., a support member (140) of FIG. 1) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In another embodiment (not shown), the housing may refer to a structure forming some of the first surface (210A) of FIG. 1, the second surface (210B) and the side (210C) of FIG. 2. According to one embodiment, the first surface (210A) may be formed by a front plate (202) in which at least a portion is substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers as the front plate). In another embodiment, the front plate (202) may be coupled to the housing (210) to form an internal space together with the housing (210). In various embodiments, the term 'internal space' may refer to an internal space of the housing (210) that accommodates at least a portion of the display (201).

[0031] According to various embodiments, the second surface (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. The side surface (210C) may be formed by a side bezel structure (or "side member") (218) comprising a metal and / or polymer, which is combined with the front plate (202) and the back plate (211). In various embodiments, the back plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0032] In the illustrated embodiment, the front plate (202) may include two first regions (210D) (e.g., curved regions) that are curved and seamlessly extended from the first surface (210A) toward the rear plate (211) at both ends of the long edge of the front plate (202). In the illustrated embodiment, the rear plate (211) may include two second regions (210E) (e.g., curved regions) that are curved and seamlessly extended from the second surface (210B) toward the front plate (202) at both ends of the long edge. In various embodiments, the front plate (202) (or the rear plate (211)) may include only one of the first regions (210D) (or the second regions (210E)). In other embodiments, some of the first regions (210D) or second regions (210E) may not be included. In the embodiments, when viewed from the side of the electronic device (200), the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or second region (210E) as described above (e.g., the side where the connector hole (208) is formed), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or second region (210E) (e.g., the side where the key input device (217) is placed).

[0033] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 207, 214), a sensor module (204), a camera module (205, 255), a key input device (217), a light-emitting element (206), and a connector hole (208, 209). In various embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or a light-emitting element (206)) or additionally include other components.

[0034] The display (201) may be exposed, for example, through a significant portion of the front plate (202). In various embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). In various embodiments, the corners of the display (201) may be formed to be generally identical to the adjacent outer shape of the front plate (202). In another embodiment (not shown), to expand the area where the display (201) is exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be generally identical.

[0035] In another embodiment (not shown), a recess or opening may be formed in a part of the screen display area (e.g., active area) or an area outside the screen display area (e.g., inactive area) of the display (201), and at least one of an audio module (214), a sensor module (204), a camera module (205, 255), and a light-emitting element (206) may be included that are aligned with the recess or the opening. In another embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205, 255), and a light-emitting element (206) may be included on the back surface of the screen display area of ​​the display (201). In another embodiment (not shown), the display (201) may be combined with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor module (204) and / or at least a portion of the key input device (217) may be placed in the first regions (210D) and / or the second regions (210E).

[0036] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). A microphone for acquiring external sound may be placed inside the microphone hole (203), and in various embodiments, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for communication. In various embodiments, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0037] The sensor module (204) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or another sensor module (not shown) (e.g., an HRM sensor or a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the second surface (210B) as well as on the first surface (210A) (e.g., a display (201)) of the housing (210). The electronic device (200) may further include at least one of an unillustrated sensor module, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0038] The camera module (205, 255) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (200) and a second camera device (255) disposed on a second surface (210B). The camera module (205, 255) may include one or more lenses, an image sensor and / or an image signal processor. A flash, not illustrated, may be disposed on the second surface (210B). The flash may include, for example, a light-emitting diode or a xenon lamp. In various embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0039] A key input device (217) may be placed on the side (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).

[0040] The light-emitting element (206) may be disposed, for example, on a first surface (210A) of the housing (210). The light-emitting element (206) may, for example, provide state information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element (206) may, for example, provide a light source that is coupled with the operation of the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0041] The connector holes (208, 209) may include a first connector hole (208) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and a second connector hole (e.g., an earphone jack) (209) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0042] However, the configuration of the electronic device (200) shown in FIGS. 2 and FIGS. 3 is provided as an example and is not limited thereto. For example, some of the components of the electronic device (200) shown in FIGS. 2 and FIGS. 3 may be omitted, the location of the components may be changed, or they may be replaced with other components.

[0043] FIG. 4 is a drawing showing a part of the cross-section of a cover glass (110) according to one embodiment.

[0044] In one embodiment, the cover glass (110) of the electronic device (200) may include a first surface (111) and a second surface (112) opposite to the first surface (111). In the cover glass (110) of the electronic device (200) according to one embodiment, the second surface (112) may include a first area (113) disposed on at least a portion of the display panel of the electronic device (200) and a second area (114) formed at an angle with respect to the first area (113). In one embodiment, the first surface (111) may be disposed facing the front of the electronic device (200). In one embodiment, the first area (113) of the second surface (113) may be disposed facing the rear of the electronic device (200).

[0045] According to one embodiment, in the cover glass (110), the thickness of the cover glass (110) corresponding to the second region (114) of the second surface (112) may decrease as it approaches the edge of the cover glass (110).

[0046] In one embodiment, the slope of the second region (114) of the cover glass (110) may be formed uniformly. For example, the surface of the second region (114) of the cover glass (110) may include a plane. For example, when a cross-section of the second region (114) cut parallel to the xz plane is viewed from the -y direction, the surface portion of the second region (114) may have a straight line shape.

[0047] In one embodiment, the slope of the second region (114) may be formed in a non-uniform manner. In one embodiment, the slope of the second region (114) may be formed to increase as it approaches the edge of the second region (114). In one embodiment, the slope of the second region (114) may be formed to decrease as it approaches the edge of the second region (114). In one embodiment, the slope of the second region (114) may decrease without regularity. For example, the slope of the second region (114) may become greater as it approaches the edge of the cover glass (110). For example, the cross-section of the second region (114) may have a curved shape when viewed from the -y direction of the cross-section of the cover glass. When the cross-section of the second region (114) cut parallel to the xz plane is viewed from the -y direction, the surface portion of the second region (114) may have a curved shape. For example, the second region (114) may form a curved surface. For example, the second region (114) may include a curved surface that is convex toward the rear (e.g., -z direction) of the electronic device (200). For example, the second region (114) may include a plurality of planes having different slopes.

[0048] Of course, the shape of the cover glass (110) is not limited to the embodiment described above.

[0049] In one embodiment, a reflective layer (150) may be disposed in a second region (114) of a second surface (112) of a cover glass (110). A reflective layer (150) may be attached to a second region (114) of a second surface (112) of a cover glass (110). A reflective layer (150) may be formed by applying a material forming the reflective layer (150) to the surface of a second region (114) of a second surface (112) of a cover glass (110). For example, the reflective layer (150) may be formed by printing a material forming the reflective layer (150) onto the second region (114). For example, the reflective layer (150) may be formed by printing ink onto the second region (114). For example, the reflective layer (150) may be formed by printing ink onto the second region (114) once. For example, the reflective layer (150) can be formed by printing ink multiple times on the second area (114). The reflective layer (150) can be formed by printing ink on the surface of the second area (114) and allowing it to harden. For example, the reflective layer (150) can be formed by printing black ink on the second area (114) of the second surface (112) of the cover glass (110). For example, the reflective layer (150) can be printed in black so that the color of at least one of the support member (140) or the display panel (120) is not visible when looking from the front to the rear of the electronic device (200).

[0050] In one embodiment, the reflective layer (150) may have a predetermined reflectance. For example, the reflective layer (150) may have a reflectance greater than a predetermined reflectance. For example, the reflective layer (150) may include an ink having a predetermined reflectance. For example, the reflective layer (150) may include an opaque material having a predetermined reflectance. For example, the reflective layer (150) may be made of an ink containing an opaque material having a predetermined reflectance. For example, the reflective layer (150) may include a plurality of particles having a predetermined reflectance. For example, the reflective layer (150) may be formed by printing an ink containing a plurality of particles having a predetermined reflectance onto a second region (114) of a second surface (112) of a cover glass (110). Accordingly, the reflective layer (150) may reflect light. Light incident from outside the electronic device (200) through the cover glass (110) can be reflected by the reflective layer (150). The reflective layer (150) can cause the light incident through the cover glass (110) to be diffusely reflected. Due to the reflective layer (150), the depth (410) created by the slope of the second region (114) of the cover glass (110) may appear deeper than the actual depth. Accordingly, the aesthetics provided to the user may be increased.

[0051] In one embodiment, the reflective layer (150) may have a constant thickness. For example, the reflective layer (150) may have a constant thickness by printing ink on the second area (114) an equal number of times. In one embodiment, the thickness of the reflective layer (150) may be a first length (430). For example, the reflective layer (150) may be formed with a constant thickness of the first length (430).

[0052] For example, the reflective layer (150) may have a thicker thickness as it approaches the edge of the second region (114). For example, the reflective layer (150) may have a thicker thickness as it approaches the edge of the second region (114) by printing ink more times as it approaches the edge of the second region (114). In this case, even if the reflective layer (150) is subjected to pressure while the cover glass (110) is placed on the display panel (120), the material forming the reflective layer (150) may not be allowed to encroach into the first region (113) of the second surface (112) of the cover glass (110).

[0053] FIG. 5 is a drawing illustrating a process in which a cover glass (110) is placed in an electronic device according to one embodiment, and a part of a cross-section of an electronic device (200) in a state in which the cover glass (110) is placed.

[0054] Referring to identification number 510, the cover glass (110) can receive a force (515) directed toward the display panel (120).

[0055] Referring to identification number 520, the cover glass (110) can be attached to the display panel (120) by receiving a force (515) directed toward the display panel (120). The cover glass (110) can be laminated onto the display panel (120).

[0056] An electronic device (200) according to one embodiment may include a support member (140). In one embodiment, the support member (140) may include a support portion (143) that supports at least a portion of a cover glass (110), a recessed portion (145) in which a display panel (120) is received, and a protruding portion (141) that protrudes toward the front of the electronic device (200).

[0057] According to one embodiment, the protruding portion (141) may be spaced apart from the cover glass (110). According to one embodiment, the protruding portion (141) may be positioned to minimize the area in contact with the cover glass (110). For example, the edge of the cover glass (110) may be formed at a position equal to or lower than the height of the protruding portion (141) of the support member (140) when the electronic device (200) is viewed from the side (e.g., +x direction, +y direction) of the electronic device (200). In this case, even if the electronic device (200) is impacted through the protruding portion (141) of the support member (140), the protruding portion (141) of the support member (140) and the cover glass (110) do not come into direct contact, or even if they do come into contact, the contact area is minimized, thereby reducing the amount of impact applied to the cover glass (110).

[0058] According to one embodiment, the electronic device (200) may further include an adhesive member (160) disposed between a display panel (120) and a cover glass (110). For example, the cover glass (110) may be bonded to the display panel (120) through the adhesive member (160). A first region (113) of a second surface (112) of the cover glass (110) and a third region (153) of a reflective layer (150) may be attached through the adhesive member (160). A first region (113) of a second surface (112) of the cover glass (110) and a third region (153) of the reflective layer (150) may be directly attached through the adhesive member (160). For example, the adhesive member (160) may include an optical adhesive material. For example, the adhesive member (160) may include at least one of OCA (optically clear adhesive) or OCR (optically clear resin). For example, between the first region (113) of the second surface (112) of the cover glass (110) and the third region (153) of the reflective layer (150), no other layer other than the adhesive member (160) may be included. Of course, it is not limited thereto.

[0059] In one embodiment, when the thickness of the reflective layer (150) is formed to a constant first length (430), the reflective layer (150) can be compressed up to the maximum first length (430). As the cover glass (110) and the display panel (120) are attached, the reflective layer (150) can be deformed to have a thickness shorter than the first length (430) due to the pressure between the cover glass (110) and the display panel (120). Accordingly, the thickness of the reflective layer (150) can increase as it moves further away from the part adjacent to the first region (113) of the second surface (112) of the cover glass (110). Accordingly, in the state of identification number 520, the adhesive member (160), the third region (153) of the reflective layer (150), and the cover glass (110) can be arranged without gaps in the area corresponding to the third region (153). Additionally, in the state of identification number 520, the first region (113) of the first surface (112) of the cover glass (110) can be directly attached to the display panel (120) through the adhesive member (160). By the reflective layer (150), the depth (410) created by the slope of the second region (114) of the cover glass (110) can be made to appear deeper than the actual depth, thereby increasing the aesthetic appeal provided to the user. By forming the reflective layer (150) not only in the fourth region (154) but also in the third region (153), the reflective layer (150) can be placed over a wider area, and accordingly, the depth (410) created by the slope of the second region (114) can be made to appear deeper than the actual depth, thereby further increasing the aesthetic appeal provided to the user.

[0060] An electronic device (200) according to one embodiment may include a sealing member (170). The sealing member (170) may be positioned between a support member (140) and a cover glass (110) to attach the support member (140) and the cover glass (110). The sealing member (170) may be positioned between a support portion (143) of the support member (140) and a second region (114) of a second surface (112) of the cover glass (110). The sealing member (170) may attach at least a portion of the support portion (143) and the second region (114). Accordingly, an edge portion of the cover glass (110) may be supported by the support portion (143) of the support member (140).

[0061] FIG. 6 is a drawing showing a part of the cross-section of a cover glass to explain a processing method of a cover glass (110) according to one embodiment.

[0062] Referring to identification numbers 610 and 620, the second surface (112) of the cover glass (110) can be processed into various shapes. The cover glass (110) of identification numbers 610 and 620 can each correspond to the cover glass (110) of FIG. 4.

[0063] For example, the area on the second area (114) corresponding to the third area (153) of the reflection layer (150) and the area on the second area (114) corresponding to the fourth area (154) may include curved surfaces having different curvatures. For example, the curvature of the area on the second region (1140) corresponding to the fourth region (154) of the reflective layer (150) may be greater than the curvature of the area on the second region (114) corresponding to the third region (153) of the reflective layer (150). Accordingly, the reflective layer (150) of the third region (153) can be compressed by the pressure between the cover glass (110) and the display panel (120) and placed without gaps between the cover glass (110) and the display panel (120), and the reflective layer (150) of the fourth region (154) can have a higher curvature, thereby enhancing the sense of depth and aesthetics provided to the user. For example, the area on the second region (1140) corresponding to the fourth region (154) of the reflective layer (150) may have a greater curvature than the area on the second region (114) corresponding to the third region (153) of the reflective layer (150). The curvature may be smaller. In this case, the second region (114) of the second surface (112) of the cover glass (110) can be processed less, and accordingly, the cost required for processing can be reduced.

[0064] For example, referring to identification number 610, when the second region (114) of the cover glass (110) is viewed from the y-axis direction, the thickness in the z-axis direction may be 0.15. For example, the region on the second region (114) corresponding to the third region (153) of the reflective layer (150) may include a curved surface having a curvature of 2.13R, and the region on the second region (114) corresponding to the fourth region (154) may include a curved surface having a curvature of 2.28R.

[0065] For example, referring to identification number 620, when the second region (114) of the cover glass (110) is viewed from the y-axis direction, the thickness in the z-axis direction may be 0.1. For example, the region on the second region (114) corresponding to the third region (153) of the reflective layer (150) may include a curved surface having a curvature of 2.13R, and the region on the second region (114) corresponding to the fourth region (154) may include a curved surface having a curvature of 5.36R.

[0066] Compared to the embodiment of identification number 620, the embodiment of identification number 610 can form a greater slope in the area corresponding to the fourth area (154) of the reflective layer (150) on the second area (114) of the cover glass (110). Accordingly, the sense of depth and aesthetics provided to the user can be enhanced.

[0067] FIG. 7 is a drawing showing a part of the cross-section of a cover glass (110) to explain a processing method of a cover glass (110) according to one embodiment.

[0068] Referring to identification numbers 710 and 720, the second surface (112) of the cover glass (110) can be processed into various shapes. The cover glass (110) of identification numbers 710 and 720 can each correspond to the cover glass (110) of FIG. 4.

[0069] For example, on the second surface (112) of the cover glass (110), the area included in the second region (114) may have various widths and various widths. For example, the second region (114) on the second surface (112) may be processed to include a wider area. In this case, as the width of the second region (114) is increased, the reflective layer (150) may be placed over a wider area on the second region (114). Thus, as the width of the second region (114) is increased, when viewing the electronic device (200) from the front (e.g., in the -z-axis direction), the visual effect provided by the reflective layer (150) can be greater for the user, and the aesthetics provided to the user may be increased accordingly. Additionally, accordingly, even if the second surface (112) is processed to have the same curvature, the thickness in the z-axis direction can be processed to be thicker when viewing the second region (114) of the cover glass (110) from the y-axis direction. Accordingly, the sense of depth of the edge portion of the cover glass (110) provided to the user can be increased.

[0070] Referring to identification number 710, the second area (114) may have a width of 1.094 in the x-axis direction. Referring to identification number 720, the second area (114) may have a width of 0.864 in the x-axis direction. That is, the embodiment of identification number 710 may have a wider width in the x-axis direction than the embodiment of identification number 720. In the embodiment of identification number 720, the width of the second area (114) is wider than in the embodiment of identification number 710, so that the reflective layer (150) can be placed over a wider area of ​​the second area (114). Accordingly, as the width of the second area (114) is widened, when viewing the electronic device (200) from the front (e.g., in the -z-axis direction), the visual effect provided by the reflective layer (150) can be provided to the user more significantly, and accordingly, the aesthetics provided to the user can be increased.

[0071] Compared to the embodiment of identification number 720, even if the second surface (112) is processed to have the same curvature, the embodiment of identification number 710 may have a thicker thickness in the z-axis direction when the second region (114) of the cover glass (110) is viewed from the y-axis direction. For example, when the second surface (112) is formed to have the same curvature, the thickness in the z-axis direction when the second region (114) is viewed from the y-axis direction in the embodiment of identification number 710 may be 0.15, and the thickness in the z-axis direction when the second region (114) is viewed from the y-axis direction in the embodiment of identification number 720 may be 0.145. Accordingly, the user may be provided with a greater sense of depth at the edge portion of the cover glass (110) in identification number 710.

[0072] FIG. 8 is a drawing for explaining an example of processing a second region (114) of a second surface (112) of a cover glass (110) in an electronic device (200) including a reflective layer (150) of a constant thickness according to one embodiment. FIG. 9 is a drawing for explaining an example of processing a second region (114) of a second surface (112) of a cover glass (110) in an electronic device (200) including a reflective layer (150) of a constant thickness according to one embodiment. FIG. 10 is a drawing for explaining an example of processing a second region (114) of a second surface (112) of a cover glass (110) in an electronic device (200) including a reflective layer (150) of a constant thickness according to one embodiment.

[0073] The cover glass (110) of FIGS. 8 to 10 may correspond to the cover glass (110) of FIG. 4.

[0074] Referring to identification numbers 800, 900, and 1000 of FIGS. 8 to 10, the second region (114) of the second surface (112) of the cover glass (110) may have a predetermined slope with respect to the first region (113).

[0075] According to one embodiment, the second region (114) may include a first portion (830, 930, 1030) where the slope with respect to the first region (113) begins. The second region (114) may include a second portion (820, 920, 1020) positioned in a direction toward the front of the electronic device (200) (e.g., +z direction) at the edge of the adhesive member (160). The second region (114) may include a third portion (810, 910, 1010) which is an edge portion located at the edge of the second surface (112). In a direction toward at least one of the direction toward the rear of the electronic device (200) (e.g., -z direction) or the opposite direction (e.g., +z direction) from the front of the electronic device (200), the combined thickness of the thickness of the reflective layer (150) and the thickness of the adhesive member (160) may be a. In one embodiment, the region corresponding to the area between the first part (830, 930, 1030) and the second part (820, 920, 1020) may have a slope within a predetermined angle with respect to the first region (113). The region corresponding to the area between the first part (830, 930, 1030) and the second part (820, 920, 1020) may have a length equal to or less than a in a direction facing at least one of the direction from the front of the electronic device (200) toward the rear of the electronic device (200) (e.g., -z direction) or the opposite direction (e.g., +z direction). Accordingly, as at least one of the reflective layer (150) or the adhesive member (160) is compressed by the pressure between the cover glass (110) and the display panel (120), the cover glass (110) and the display panel (120) can be attached so as not to have any gap between the cover glass (110) and the display panel (120) on the area corresponding to the first part (830, 930, 1030) and the second part (820, 920, 1020).The area corresponding to the second part (820, 920, 1020) and the third part (810, 910, 1010) may have a steeper slope with respect to the first area (113) compared to the area corresponding to the second part (820, 920, 1020) in a direction facing at least one of the direction from the front of the electronic device (200) toward the rear of the electronic device (200) (e.g., -z direction) or the opposite direction (e.g., +z direction). Alternatively, the area corresponding to the second part (820, 920, 1020) and the third part (810, 910, 1010) may have a gentler slope with respect to the first area (113) than the area corresponding to the second part (820, 920, 1020) in a direction facing at least one of the direction from the front of the electronic device (200) toward the rear of the electronic device (200) (e.g., -z direction) or the opposite direction (e.g., +z direction). Alternatively, the area corresponding to the second part (820, 920, 1020) and the third part (810, 910, 1010) may have the same slope as the area corresponding to the first part (830, 930, 1030) and the second part (820, 920, 1020) with respect to the first area (113), in a direction facing at least one of the direction from the front of the electronic device (200) toward the rear of the electronic device (200) (e.g., -z direction) or the opposite direction (e.g., +z direction).

[0076] Referring to identification number 800 in FIG. 8, the region corresponding to the area between the first part (830) and the second part (820) has a length equal to or less than a in a direction toward at least one of the direction toward the rear of the electronic device (200) from the front of the electronic device (200) toward the rear of the electronic device (200) (e.g., -z direction) or the opposite direction (e.g., +z direction), and may have a convex shape toward the rear of the electronic device (200) (e.g., -z direction). For example, the second region (114) may have a convex shape toward the rear of the electronic device (200) (e.g., -z direction). For example, the area corresponding to the second part (820) and the third part (810) may include a curved surface with a steeper slope than the first area (113) compared to the area corresponding to the second part (830) and the second part (820), in a direction facing at least one of the direction from the front of the electronic device (200) toward the rear of the electronic device (200) (e.g., -z direction) or the opposite direction (e.g., +z direction).

[0077] Referring to identification number 900 in FIG. 9, the area corresponding between the first part (930) and the second part (920) may include a plane having a length equal to or less than a in a direction facing at least one of the direction facing from the front of the electronic device (200) toward the rear of the electronic device (200) (e.g., -z direction) or the opposite direction (e.g., +z direction). For example, the second area (114) may include a plane. For example, the area corresponding between the second part (920) and the third part (910) may have the same slope as the area corresponding between the first part (930) and the second part (920) and the first area (113) in a direction facing at least one of the direction facing from the front of the electronic device (200) toward the rear of the electronic device (200) (e.g., -z direction) or the opposite direction (e.g., +z direction).

[0078] Referring to identification number 1000 of FIG. 10, the region corresponding to the area between the first part (1030) and the second part (1020) may include a plane having a length equal to or less than a, in a direction facing at least one of the direction from the front of the electronic device (200) toward the rear of the electronic device (200) (e.g., -z direction) or the opposite direction (e.g., +z direction). For example, the second region (114) may include a plurality of planes having different slopes. For example, the area corresponding to the second part (1020) and the third part (1010) may include a plane having a steeper slope with respect to the first area (113) compared to the area corresponding to the second part (1020) in a direction facing at least one of the direction from the front of the electronic device (200) toward the rear of the electronic device (200) (e.g., -z direction) or the opposite direction (e.g., +z direction).

[0079] FIG. 11 is a drawing showing a part of the exterior of an electronic device (200) according to one embodiment.

[0080] The edge portion (1100) of the electronic device (200) of the present disclosure may include a structure disclosed by identification number 520 of FIG. 5. For example, referring to identification number 520 of FIG. 5, a third region (153) of the reflective layer (150) may overlap with a black region of the display panel (110). For example, referring to identification number 520 of FIG. 5, the reflective layer (150) may be positioned so that it is visible to the user when the edge portion (1100) of the electronic device (200) is viewed from the front of the electronic device (200) (e.g., in the +z direction). Accordingly, the electronic device (200) including the cover glass (110) according to the present disclosure may provide the user with a sense of depth and high aesthetic appeal at the edge portion (1100) of the cover glass (110).

[0081] FIG. 12 is a flowchart illustrating the process of forming an electronic device by arranging the components of the electronic device according to one embodiment.

[0082] In identification number 1210, a display panel (120) may be provided.

[0083] In identification number 1220, a cover glass (110) may be processed. The cover glass (110) may be formed to correspond to the cover glass (110) of FIG. 4. On the second surface (112) of the cover glass (110), the cover glass (110) may be processed such that a second region (114) is inclined with respect to the first region (113). For example, the cover glass (110) may be processed such that the second region (114) is inclined with respect to the first region (113) by cutting off the edge portion of the flat cover glass (110). For example, the cover glass (110) may be processed to have the shape of the cover glass (110) shown in FIG. 4, FIG. 8, FIG. 9, and FIG. 10. However, it is not limited thereto.

[0084] In identification number 1230, a reflective layer (150) may be disposed in a second region (114) of the cover glass (110). The reflective layer (150) may be formed to correspond to the reflective layer (150) of FIG. 4. The reflective layer (150) may include a third region (153) attached to the display panel (120) and a fourth region (154) excluding the third region (153). For example, the reflective layer (150) may be formed by applying ink to the second region (114). For example, the reflective layer (150) may be formed by applying ink to the second region (114) with a certain thickness.

[0085] In identification number 1240, a support member (140) may be formed. The support member (140) may be formed to correspond to the housing (210) of FIGS. 2 and FIGS. 3. In one embodiment, the support member (140) may be formed to include a support portion (143) that supports at least a portion of the cover glass (110), a recessed portion (145) in which the display panel (120) is received, and a protruding portion (141) that protrudes toward the front of the electronic device (200).

[0086] In identification number 1250, a cover glass (110) may be positioned so that a third region (153) of the reflective layer (150) is attached to the display panel (120). The third region (153) of the reflective layer (150) may receive pressure between the cover glass (110) and the display panel (120) as the cover glass (110) and the display panel (120) are attached. For example, it may receive the force (510) of FIG. 5.

[0087] In identification number 1260, the thickness of the reflective layer (150) of the third region (153) can be deformed to be smaller than the thickness of the reflective layer (150) of the fourth region (154) by the pressure between the cover glass (110) and the display panel (120). As the volume of the third region (153) of the reflective layer (150) decreases, the thickness of the third region (153) of the reflective layer (150) can be formed to be smaller than the thickness of the fourth region (154) of the reflective layer (150).

[0088] FIG. 13 is a block diagram of an electronic device (1301) in a network environment (1300) according to various embodiments.

[0089] The electronic device (1301) of FIG. 13 may correspond to the electronic device (200) of the present disclosure. However, the electronic device (200) of the present disclosure does not have to include all the components mentioned in FIG. 13, and may include only some of them.

[0090] Referring to FIG. 13, in a network environment (1300), an electronic device (1301) may communicate with an electronic device (1302) through a first network (1398) (e.g., a short-range wireless communication network) or with at least one of an electronic device (1304) or a server (1308) through a second network (1399) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1301) may communicate with the electronic device (1304) through a server (1308). According to one embodiment, the electronic device (1301) may include a processor (1320), memory (1330), input module (1350), sound output module (1355), display module (1360), audio module (1370), sensor module (1376), interface (1377), connection terminal (1378), haptic module (1379), camera module (1380), power management module (1388), battery (1389), communication module (1390), subscriber identification module (1396), or antenna module (1397). In some embodiments, at least one of these components (e.g., connection terminal (1378)) may be omitted from the electronic device (1301), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (1376), camera module (1380), or antenna module (1397)) may be integrated into a single component (e.g., display module (1360)).

[0091] The processor (1320) can, for example, execute software (e.g., program (1340)) to control at least one other component (e.g., hardware or software component) of the electronic device (1301) connected to the processor (1320) and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (1320) can store commands or data received from other components (e.g., sensor module (1376) or communication module (1390)) in volatile memory (1332), process the commands or data stored in volatile memory (1332), and store the resulting data in non-volatile memory (1334). According to one embodiment, the processor (1320) may include a main processor (1321) (e.g., a central processing unit or an application processor) or an auxiliary processor (1323) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (1301) includes a main processor (1321) and an auxiliary processor (1323), the auxiliary processor (1323) may be configured to use less power than the main processor (1321) or to be specialized for a specified function. The auxiliary processor (1323) may be implemented separately from the main processor (1321) or as part thereof.

[0092] The auxiliary processor (1323) may control at least some of the functions or states associated with at least one component of the electronic device (1301) (e.g., display module (1360), sensor module (1376), or communication module (1390)) on behalf of the main processor (1321) while the main processor (1321) is in an inactive (e.g., sleep) state, or together with the main processor (1321) while the main processor (1321) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (1323) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (1380) or communication module (1390)). According to one embodiment, the auxiliary processor (1323) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (1301) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (1308)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0093] The memory (1330) can store various data used by at least one component of the electronic device (1301) (e.g., processor (1320) or sensor module (1376)). The data may include, for example, input data or output data for software (e.g., program (1340)) and related commands. The memory (1330) may include volatile memory (1332) or non-volatile memory (1334).

[0094] The program (1340) may be stored as software in memory (1330) and may include, for example, an operating system (1342), middleware (1344), or an application (1346).

[0095] The input module (1350) can receive commands or data to be used for a component of the electronic device (1301) (e.g., processor (1320)) from outside the electronic device (1301) (e.g., user). The input module (1350) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0096] The sound output module (1355) can output a sound signal to the outside of the electronic device (1301). The sound output module (1355) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0097] The display module (1360) can visually provide information to an external (e.g., user) of the electronic device (1301). The display module (1360) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (1360) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0098] The audio module (1370) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (1370) can acquire sound through the input module (1350) or output sound through the sound output module (1355) or an external electronic device (e.g., electronic device (1302)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (1301).

[0099] The sensor module (1376) can detect the operating state of the electronic device (1301) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (1376) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0100] The interface (1377) may support one or more specified protocols that can be used for the electronic device (1301) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (1302)). According to one embodiment, the interface (1377) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0101] The connection terminal (1378) may include a connector through which the electronic device (1301) can be physically connected to an external electronic device (e.g., electronic device (1302)). According to one embodiment, the connection terminal (1378) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0102] The haptic module (1379) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (1379) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0103] The camera module (1380) can capture still images and video. According to one embodiment, the camera module (1380) may include one or more lenses, image sensors, image signal processors, or flashes.

[0104] The power management module (1388) can manage the power supplied to the electronic device (1301). According to one embodiment, the power management module (1388) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0105] The battery (1389) can supply power to at least one component of the electronic device (1301). According to one embodiment, the battery (1389) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0106] The communication module (1390) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (1301) and an external electronic device (e.g., electronic device (1302), electronic device (1304), or server (1308)), and the performance of communication through the established communication channel. The communication module (1390) may include one or more communication processors that operate independently of the processor (1320) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1390) may include a wireless communication module (1392) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (1394) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (1304) via a first network (1398) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (1399) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1392) can identify or authenticate the electronic device (1301) within a communication network such as the first network (1398) or the second network (1399) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (1396).

[0107] The wireless communication module (1392) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (1392) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (1392) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (1392) can support various requirements specified in the electronic device (1301), external electronic device (e.g., electronic device (1304)), or network system (e.g., second network (1399)). According to one embodiment, the wireless communication module (1392) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0108] An antenna module (1397) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (1397) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (1397) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (1398) or a second network (1399), may be selected from the plurality of antennas, for example, by a communication module (1390). A signal or power may be transmitted or received between the communication module (1390) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (1397).

[0109] According to various embodiments, the antenna module (1397) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0110] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0111] According to one embodiment, commands or data may be transmitted or received between the electronic device (1301) and an external electronic device (1304) through a server (1308) connected to a second network (1399). Each of the external electronic devices (1302, or 1304) may be the same or a different type of device as the electronic device (1301). According to one embodiment, all or part of the operations performed on the electronic device (1301) may be performed on one or more of the external electronic devices (1302, 1304, or 1308). For example, if the electronic device (1301) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (1301) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (1301). The electronic device (1301) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (1301) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1304) may include an Internet of Things (IoT) device. The server (1308) may be an intelligent server using machine learning and / or neural networks.According to one embodiment, an external electronic device (1304) or server (1308) may be included within the second network (1399). The electronic device (1301) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0112] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0113] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0114] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0115] Various embodiments of the present document may be implemented as software (e.g., program (1340)) comprising one or more instructions stored in a storage medium (e.g., internal memory (1336) or external memory (1338)) readable by a machine (e.g., electronic device (1301)). For example, a processor (e.g., processor (1320)) of the machine (e.g., electronic device (1301)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0116] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0117] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0118] An electronic device according to the present disclosure comprises a display panel, a cover glass including a first surface facing forward of the electronic device and a second surface opposite to the first surface, wherein the second surface includes a first region disposed on at least a portion of the display panel and a second region formed inclined with respect to the first region, a supporting portion supporting an edge portion of the cover glass, and a recessed portion receiving the display panel, and a reflective layer including a third region formed on the second region of the cover glass and attached to the display panel and a fourth region excluding the third region, wherein, by pressure between the cover glass and the display panel, the thickness of the third region of the reflective layer may be formed to be smaller than the thickness of the fourth region of the reflective layer.

[0119] As the thickness of the third region of the reflective layer increases from the portion adjacent to the first region of the second surface of the cover glass to the portion adjacent to the fourth region.

[0120] When viewed in a direction perpendicular to the first surface of the cover glass, the third region may overlap with the black region of the display panel.

[0121] The above reflective layer may include ink applied on the second region.

[0122] The above ink may include an opaque material having a predetermined reflectance.

[0123] An electronic device according to one embodiment may further include an adhesive member disposed between the display panel and the cover glass. The first region of the second surface of the cover glass and the third region of the reflective layer may be attached to the display panel through the adhesive member.

[0124] The electronic device may include a sealing member disposed between the support portion and the second region to attach a portion of the support portion and the second region.

[0125] The first region of the second surface of the cover glass and the display panel can be directly attached through the adhesive member.

[0126] The adhesive member may be part of the display panel.

[0127] The above adhesive member may include an OCA adhesive.

[0128] The support member may include a protruding portion that extends from the support portion and protrudes toward the front of the electronic device.

[0129] The above protruding portion may protrude further toward the front of the electronic device than the first surface of the cover glass.

[0130] The above cover glass may include a fifth surface facing the side of the electronic device.

[0131] The protruding portion of the support member may be spaced apart from the fifth surface of the cover glass.

[0132] One side of the above support portion may be formed to have a step difference with one side of the above protruding portion.

[0133] One side of the support portion may be formed to have a slope corresponding to the slope of the second region of the second side of the cover glass.

[0134] At least a portion of the fourth region of the above-mentioned reflective layer may correspond to the inclined surface of the above-mentioned support portion.

[0135] The second region of the second surface of the cover glass may have a predetermined curvature.

[0136] When viewed in a direction perpendicular to the first surface of the cover glass, the second region of the glass and the third region of the reflective layer may overlap.

[0137] A method for manufacturing an electronic device including a cover glass according to the present disclosure may include the steps of: providing a display panel; processing the second surface of the cover glass, which includes a first surface facing the front of the electronic device and a second surface opposite to the first surface, such that the second region of the second surface is formed at an angle with respect to the first region; placing a reflective layer on the second region of the cover glass, which includes a third region attached to the display panel and a fourth region excluding the third region; forming a support member comprising a support portion supporting the edge portion of the cover glass and a recessed portion receiving the display panel; and placing the cover glass such that the fourth region of the reflective layer is attached to the support portion of the support member and the third region of the reflective layer is attached to the display panel, wherein in the step of placing the cover glass, the thickness of the third region of the reflective layer is such that, due to pressure between the cover glass and the display panel, the thickness of the fourth region of the reflective layer It can be formed smaller than the thickness.

[0138] A method for manufacturing an electronic device including a cover glass according to the present disclosure may include the step of forming the reflective layer by applying ink to the second region.

[0139] A method for manufacturing an electronic device including a cover glass according to the present disclosure may include the step of applying the ink to the second region with a uniform thickness.

[0140] In the step of placing the cover glass, the thickness of the ink in the third region may be reduced by the pressure between the cover glass and the display panel.

[0141] Methods according to the claims or embodiments described in the specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0142] When implemented in software, a computer-readable storage medium may be provided for storing one or more programs (software modules). One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to the claims or embodiments described in the specification of this disclosure.

[0143] In the present disclosure, the function or operation performed by an electronic device may be performed by one or more processors executing one or more instructions stored in memory. The function or operation of the electronic device mentioned in the present disclosure may be performed by a single processor executing one or more instructions, or by a combination of multiple processors executing one or more instructions. A processor mentioned in the present disclosure is understood to include a circuit for performing operations or controlling other components of the electronic device. For example, the one or more processors may include at least one of a central processing unit (CPU), a micro-processor unit (MPU), an application processor (AP), a communication processor (CP), a neural processing unit (NPU), a system on chip (SoC), an application-specific integrated circuit (ASIC), or an integrated circuit (IC) configured to execute one or more instructions. The one or more processors may be configured to perform the operation of the electronic device described above.

[0144] In the present disclosure, a program (software module, software) may be stored in a random access memory, a non-volatile memory including flash memory, a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a magnetic disc storage device, a compact disc-ROM (CD-ROM), digital versatile discs (DVDs), or other forms of optical storage devices, or a magnetic cassette. Alternatively, it may be stored in a memory composed of some or all of these. The memory may be composed of a single storage medium or a combination of multiple storage media. The one or more instructions may be stored in a single storage medium or distributed across multiple storage media.

[0145] Additionally, the above program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, Intranet, LAN (local area network), WLAN (wide LAN), or SAN (storage area network), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present disclosure.

[0146] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0147] Additionally, in the present disclosure, terms such as “part,” “module,” etc. may be a hardware component, such as a processor or circuit, and / or a software component executed by a hardware component, such as a processor.

[0148] "Parts" and "modules" may be implemented by a program that is stored on an addressable storage medium and can be executed by a processor. For example, "parts" and "modules" may be implemented by components such as software components, object-oriented software components, class components, and task components, as well as by processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables.

[0149] The specific embodiments described in this disclosure are merely examples and do not limit the scope of this disclosure in any way. For the sake of brevity, descriptions of prior electronic configurations, control systems, software, and other functional aspects of said systems may be omitted.

[0150] Additionally, in the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, comprising only b, comprising only c, or comprising a combination of two or more (comprising a and b, comprising b and c, comprising a and c, or comprising all of a, b, and c).”

[0151] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof.

Claims

1. In an electronic device, Display panel; A cover glass comprising a first surface facing forward of the electronic device and a second surface opposite to the first surface, wherein the second surface comprises a first region disposed on at least a portion of the display panel and a second region formed at an angle with respect to the first region; A support member comprising a supporting portion that supports the edge portion of the cover glass, and a recessed portion in which the display panel is received; and It includes a reflective layer formed in the second region of the cover glass and comprising a third region attached to the display panel and a fourth region excluding the third region; Due to the pressure between the cover glass and the display panel, the thickness of the third region of the reflective layer is formed to be smaller than the thickness of the fourth region of the reflective layer. Electronic device.

2. In Claim 1, As the thickness of the third region of the reflective layer increases from the portion adjacent to the first region of the second surface of the cover glass to the portion adjacent to the fourth region, Electronic device.

3. In Claim 1, When viewed in a direction perpendicular to the first surface of the cover glass, the third region overlaps with the black region of the display panel, Electronic device.

4. In Claim 1, The above reflection layer comprises ink applied on the second region, Electronic device.

5. In Claim 4, The above ink comprises an opaque material having a predetermined reflectance, Electronic device.

6. In Claim 1, It further includes an adhesive member disposed between the display panel and the cover glass, The first region of the second surface of the cover glass and the third region of the reflective layer are attached to the display panel through the adhesive member. Electronic device.

7. In Claim 1, A sealing member further comprising a member disposed between the support portion and the second region, and attaching a portion of the support portion and the second region. Electronic device.

8. In Claim 7, The first region of the second surface of the cover glass and the display panel are directly attached through the adhesive member. Electronic device.

9. In Claim 1, The support member includes a protruding portion that extends from the support portion and protrudes toward the front of the electronic device. Electronic device.

10. In Claim 9, The above protruding portion protrudes further toward the front of the electronic device than the first surface of the cover glass, Electronic device.

11. In Claim 9, The above cover glass includes a fifth surface facing the side of the electronic device, and The protruding portion of the support member is spaced apart from the fifth surface of the cover glass, Electronic device.

12. In Claim 10, One side of the above support portion is formed to have a step difference with one side of the above protruding portion, Electronic device.

13. In Claim 12, The one surface of the support portion is formed to have a slope corresponding to the slope of the second region of the second surface of the cover glass. Electronic device.

14. In Claim 13, At least a portion of the fourth region of the above-mentioned reflective layer corresponds to the inclined surface of the above-mentioned support portion, Electronic device.

15. A method for manufacturing an electronic device including a cover glass, Step of providing a display panel; A cover glass comprising a first surface facing forward of the electronic device and a second surface opposite to the first surface, wherein the second surface is processed such that a second region of the second surface is formed at an angle with respect to the first region; A step of placing a reflective layer comprising a third region attached to the display panel and a fourth region excluding the third region in the second region of the cover glass; A step of forming a support member comprising a support portion that supports the edge portion of the cover glass and a recessed portion in which the display panel is received; The method includes the step of arranging the cover glass such that the fourth region of the reflective layer is attached to the support portion of the support member and the third region of the reflective layer is attached to the display panel. In the step of placing the cover glass, the thickness of the third region of the reflective layer is formed to be smaller than the thickness of the fourth region of the reflective layer due to the pressure between the cover glass and the display panel. method.

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