Sealing assembly and electroplating device

Abstract

The present application provides a sealing assembly and an electroplating device. The sealing assembly is used for sealing the electroplating device. The electroplating device comprises a cavity and a substrate clamping assembly, the cavity being provided with an opening. The sealing assembly comprises a cover body and a connecting apparatus. The cover is sleeved on the substrate clamping assembly to seal the opening after a chuck enters the cavity, causing the cavity to be in a closed state. The cover body and the substrate clamping assembly are configured to be movable relative to each other, so as to enable the chuck to move relative to the cover body inside the cavity after the cover body has sealed the opening. The connecting apparatus is connected to the substrate clamping assembly, and is used to drive the cover body to move and seal the opening when the chuck enters the cavity through the opening, and / or to drive the cover body to move and disengage from the opening when the chuck moves out of the cavity through the opening. Even if the substrate clamping assembly moves within the cavity, the cover body is not affected by the movement of the substrate clamping assembly and is still capable of sealing the opening, thereby protecting an electroplating solution in the cavity from being oxidized and improving the stability of the electroplating solution.

Description

Enclosed components and electroplating equipment Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment, and in particular to a closed component and electroplating equipment. Background Technology

[0002] In the electroplating process, the stability of the electroplating solution composition is particularly important for the reliability of the electroplated products.

[0003] In semiconductor electroplating processes, electroplating equipment has a process state and a standby state. In the process state, the substrate clamping assembly of the electroplating equipment lowers the substrate and immerses the plating surface of the substrate in the electroplating solution in the process chamber for electroplating. In the standby state, the substrate clamping assembly of the electroplating equipment rises and detaches from the electroplating solution in the process chamber.

[0004] However, whether in operation or standby mode, the electroplating solution in the process chamber is exposed to the air, leading to stability issues. For example, gold plating solutions are easily oxidized by air, resulting in unstable process parameters and a shorter service life. This increases downtime for machine maintenance, causing inconvenience to production and management.

[0005] Therefore, solving the stability problem caused by the easy oxidation of the electroplating solution in the process chamber has become an urgent task. Summary of the Invention

[0006] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a closed component and electroplating equipment to solve the problem of how to improve the stability of the electroplating solution in the process chamber of the prior art electroplating equipment, which is easily oxidized.

[0007] To achieve the above and other related objectives, one aspect of this application provides a sealing assembly for sealing an electroplating apparatus. The electroplating apparatus includes a cavity and a substrate clamping assembly. The cavity has an opening, and the bottom of the substrate clamping assembly has a clamping plate for clamping a substrate. The clamping plate is configured to enter and exit the cavity through the opening. The sealing assembly includes a cover and a connecting device. The cover is sleeved on the substrate clamping assembly to close the opening after the clamping plate enters the cavity, thus sealing the cavity. The cover and the substrate clamping assembly are configured to be relatively movable, so that after the cover closes the opening, the clamping plate can move relative to the cover within the cavity. The connecting device is connected to the substrate clamping assembly and is used to move the cover and close the opening when the clamping plate enters the cavity through the opening; and / or, to move the cover and disengage from the opening when the clamping plate moves out of the cavity through the opening.

[0008] In some embodiments, the connecting device includes a support member fixedly connected to the substrate clamping assembly; wherein the support member includes a support portion located below the cover and extending radially outward, the radial dimension of the support portion being smaller than the radial dimension of the opening and larger than the inner diameter of the cover.

[0009] In some embodiments, the connecting device includes a retractable connector, one end of which is fixedly connected to the substrate clamping assembly, and the other end is fixedly connected to the cover.

[0010] In some embodiments, the retractable connector is sleeved on the substrate clamping assembly and forms a closed space around the substrate clamping assembly.

[0011] In some embodiments, the retractable connector is configured to cause the cover to press against the cavity when the cover closes the opening.

[0012] In some embodiments, the cover is configured to slope radially downward from the inside out.

[0013] In some embodiments, the cover includes a positioning portion for radially positioning relative to the opening when the opening is closed.

[0014] Another aspect of this application provides an electroplating apparatus, including a cavity, a substrate clamping assembly, and the aforementioned enclosure assembly; wherein the cavity has an opening, the substrate clamping assembly has a clamping plate at its bottom, and the clamping plate is configured to enter and exit the cavity through the opening.

[0015] In some embodiments, the substrate clamping assembly includes a driving device and a rotation driving device; wherein the cover is sleeved on the rotation driving device.

[0016] In some embodiments, the system further includes a gas supply section and a gas exhaust section, wherein the gas supply section is used to introduce sealed gas into the inner cavity; and the gas exhaust section is used to exhaust gas from the inner cavity.

[0017] As described above, this application provides a sealed component and an electroplating apparatus, which have at least the following beneficial effects:

[0018] (1) Even if the substrate clamping assembly moves in the cavity, the cover is not affected by the movement of the substrate clamping assembly and can still close the opening. In different states such as process state and standby state, the cavity can be sealed by a cover, thereby protecting the electroplating solution in the cavity from oxidation and improving the stability of the electroplating solution;

[0019] (2) The cover is lifted and lowered by the connecting device to avoid the cover affecting the entry and exit of the substrate clamping component into the cavity, which can improve the automation level of the electroplating equipment. The cover can be lifted and lowered without manual operation or additional driving components.

[0020] (3) By sealing the opening of the cavity with the sealing component, and by forming a uniform positive pressure in the cavity through the air supply and exhaust section, it can effectively prevent air outside the cavity from entering the cavity, thereby preventing air from contacting the electroplating solution and improving the stability of the electroplating solution.

[0021] Overview of the attached figures

[0022] The features and performance of this application are further described by the following embodiments and accompanying drawings.

[0023] Figures 1 to 3 show schematic diagrams of the structure of an electroplating apparatus using the enclosed component in Embodiment 1 of this application;

[0024] Figure 4 shows a perspective view of the cover of the sealing component in Embodiment 1 of this application;

[0025] Figure 5 shows a perspective view of the connection device of the enclosed component in Embodiment 1 of this application;

[0026] Figures 6 to 8 show schematic diagrams of the structure of an electroplating apparatus using the enclosed component in Embodiment 2 of this application;

[0027] Figure 9 shows a perspective view of the connection device of the enclosed component in Embodiment 2 of this application;

[0028] Figure 10 shows a perspective view of the cover of the sealing component in Embodiment 2 of this application; and

[0029] Figure 11 shows a perspective view of the support member of the closed component in Embodiment 2 of this application.

[0030] Preferred embodiments of this application

[0031] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or adjusted based on different viewpoints and applications without departing from the spirit of this application.

[0032] It should be noted that the accompanying drawings are only schematic representations of the basic concept of this application. Although the drawings only show components related to this application and are not drawn according to the actual number, shape and size of the components, the shape, quantity and proportion of each component can be arbitrarily adjusted in actual implementation, and the layout of the components may also be more complex.

[0033] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses consistent with some aspects of this application as detailed in the appended claims.

[0034] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0035] In the description of this application, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0036] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another.

[0037] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., which may be used to indicate the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0038] Example 1

[0039] Embodiment 1 of this application provides a sealing component for sealing an electroplating apparatus. Referring to Figures 1 to 4, Figures 1 to 3 show a structural schematic diagram of an electroplating apparatus using the sealing component of Embodiment 1, and Figure 4 shows a perspective schematic diagram of the cover of the sealing component of Embodiment 1.

[0040] Referring to Figures 1 to 3, the electroplating apparatus 10 includes a cavity 11 and a substrate clamping assembly 12. The cavity 11 has an opening 110 and an inner cavity 111. The inner cavity 111 is located inside the cavity 11 and is used to contain the electroplating solution. Exemplarily, during the electroplating process, the electroplating solution is typically supplied from the bottom of the inner cavity 111 upwards. The bottom of the substrate clamping assembly 12 has a clamping plate 120 for clamping the substrate, and the clamping plate 120 is configured to enter and exit the cavity 11 through the opening 110. A closing assembly includes a cover 21, which is sleeved on the substrate clamping assembly 12 and located above the clamping plate 120 to close the opening 110 after the clamping plate 120 enters the cavity 11, thus closing the cavity 11. The cover 21 and the substrate clamping assembly 12 are configured to be relatively movable so that after the cover 21 closes the opening 110, the substrate clamping assembly 12 can move relative to the cover 21. Referring to Figure 4, in this first embodiment, the cover 21 is configured as an annular cover with an inner diameter D1 and an outer diameter D2.

[0041] It should be understood that in the semiconductor electroplating process, the electroplating equipment 10 has a process state and a standby state. As shown in Figure 3, in the process state, the substrate clamping assembly 12 of the electroplating equipment 10 lowers the substrate (not shown) and immerses the plating surface of the substrate in the electroplating solution (not shown) in the cavity 11 to perform electroplating on the substrate. As shown in Figure 2, in the standby state, it is necessary to raise the substrate clamping assembly 12 of the electroplating equipment 10 and detach it from the electroplating solution in the cavity 11.

[0042] In some embodiments of this application, since the substrate clamping assembly 12 can move relative to the cover 21 after the cover 21 closes the opening 110, even if the substrate clamping assembly 12 rises to detach the clamping plate 120 from the electroplating solution in the cavity 11, the cover 21 is not affected by the movement of the substrate clamping assembly 12 and can still close the opening 110. In other words, in some embodiments of this application, whether in the process state or the standby state, the cavity 11 can be sealed by a cover 21, thereby protecting the electroplating solution in the cavity 11 from oxidation and improving the stability of the electroplating solution.

[0043] It should be noted that the above-mentioned process state and standby state are only examples of some application scenarios. In addition to the process state and standby state, in other application scenarios, such as when testing the electroplating equipment 10, the substrate clamping assembly 12 also needs to move within the cavity 11. Using the sealing assembly provided in this application, even if the substrate clamping assembly 12 moves within the cavity 11, the cover 21 is not affected by the movement of the substrate clamping assembly 12 and can still close the opening 110.

[0044] It should be understood that after the substrate has been electroplated, as shown in Figure 1, the substrate clamping assembly 12 needs to be controlled to lift the substrate and remove it from the cavity 11 via the clamping plate 120. Furthermore, after the electroplating equipment 10 has been operating for a period of time, it should be maintained and serviced, which also requires removing the clamping plate 120 from the cavity 11. During the process of the substrate clamping assembly 12 moving in and out of the cavity 11, if the cover 21 cannot detach from the opening 110, the substrate clamping assembly 12 needs to pass through the cover 21. This will restrict the inner diameter of the cover 21 and the radial dimension of the clamping plate 120, and may affect the coverage area of ​​the cover 21, thereby affecting the sealing effect. To prevent the cover 21 from affecting the entry and exit of the clamping plate 120 into the cavity 11, in some embodiments, the sealing assembly further includes a connecting device connected to the substrate clamping assembly 12. The connecting device is used to move the cover 21 and close the opening 110 when the clamping plate 120 enters the cavity 11 through the opening 110, as shown in Figures 2 and 3, where the cover 21 covers the opening 110 to close the opening 110; and / or, when the clamping plate 120 moves out of the cavity 11 through the opening 110, the cover 21 is moved and disengaged from the opening 110, as shown in Figure 1, where the cover 21 disengages from the opening 110 and is positioned above the opening 110.

[0045] Referring again to Figures 1 to 3, as an example, the substrate clamping assembly 12 includes a lifting drive device 121 and a rotation drive device 122. The lifting drive device 121 is used to drive the substrate clamping assembly 12 to move up and down, and the rotation drive device 122 is used to drive the substrate clamping assembly 12 to rotate. Exemplarily, the rotation drive device 122 is connected to the clamping plate 120 via a bracket 123. A cover 21 is fitted onto the rotation drive device 122. As an example, the rotation drive device 122 typically includes a driver and a housing covering the driver; when the driver rotates the clamping plate 120, the housing does not rotate accordingly. The cover 21 is fitted onto the housing of the rotation drive device 122. Referring to Figures 2 and 3, since the radial dimension of the rotation drive device 122 is typically smaller than the radial dimension of the opening 110 of the cavity 11, it can partially enter the cavity 11 through the opening 110.

[0046] Referring to Figures 1 to 3 and in conjunction with Figure 5, Figure 5 shows a perspective view of the connection device of the closure component in Embodiment 1. Exemplarily, in this Embodiment 1, the connection device includes a support member 221, which is sleeved on the substrate clamping assembly 12 and fixedly connected to the substrate clamping assembly 12; wherein, the support member 221 includes a support portion 2211, which is located below the cover 21 and extends radially outward, and the radial dimension of the support portion 2211 is smaller than the radial dimension of the opening 110 and larger than the inner diameter of the cover 21.

[0047] Exemplarily, in this first embodiment, the support member 221 is sleeved on the rotary drive device 122 of the substrate clamping assembly 12. Optionally, the support member 221 further includes a fixing part 2212 for fixed connection with the substrate clamping assembly 12. Optionally, in one example, the fixing part 2212 is a tubular structure that extends upward from the inner edge of the support part 2211 and is integrally formed with the support part 2211. The fixing part 2212 is sleeved on the rotary drive device 122 of the substrate clamping assembly 12. Exemplarily, the fixing part 2212 is also provided with a mounting hole 22121, which can be fixedly connected to the rotary drive device 122 by fasteners such as screws passing through the mounting hole 22121. The cover 21 is sleeved on the outside of the fixing part 2212 and there is a gap between the cover 21 and the fixing part 2212, so that when the cover 21 closes the opening 110, the rotary drive device 122 of the substrate clamping assembly 12 can move relative to the cover 21.

[0048] As shown in Figure 1, when the cover 21 disengages from the opening 110, the support portion 2211 of the support member 221 abuts against the lower surface of the cover 21, supporting the cover 21 and preventing it from falling downwards. When the substrate clamping assembly 12 enters or exits the cavity 11 from above, the support member 221 moves up and down under the drive of the substrate clamping assembly 12. During the lifting and lowering process of the support member 221, the support portion 2211 abuts against the lower surface of the cover 21, and the support member 221 drives the cover 21 to lift and lower through the support portion 2211. This avoids the cover 21 affecting the entry and exit of the substrate clamping assembly 12 into and out of the cavity 11, improves the automation level of the electroplating equipment 10, and allows the cover 21 to be lifted and lowered without manual operation or additional drive components.

[0049] As shown in Figures 2 and 3, as an example, when the electroplating equipment 10 is in standby or process mode, the cover 21 covers the opening 110 of the cavity 11, and the top of the side wall of the cavity 11 provides support for the cover 21. The support portion 2211 can be separated from the cover 21. Furthermore, when the electroplating equipment 10 is in process mode, as shown in Figure 3, the support portion 2211 enters the cavity 11 together with the substrate clamping assembly 12, without affecting the normal operation of the cover 21.

[0050] Furthermore, it should be understood that there is a gap between the support member 221 and the cover 21, which may affect the sealing effect of the cover 21. Therefore, in some embodiments, a flexible member can be provided between the support member 221 and the cover 21. The flexible member is stretchable and is sleeved on the substrate clamping assembly 12, which can form a closed space around the substrate clamping assembly 12.

[0051] Optionally, in some embodiments, as shown in Figures 1 to 3, the cover 21 is configured to slope downwards radially from the inside out. In other words, the cover 21 has a downward slope from the center to the edge. This design, on the one hand, increases the stability of the cover 21 during lifting and lowering, as well as the sealing effect when in the closed position. On the other hand, since the lower surface of the cover 21 is exposed in the cavity 11, liquid may adhere to the lower surface of the cover 21. The configuration of the cover 21 to slope downwards radially from the top outwards can effectively drain the liquid adhering to the lower surface of the cover 21.

[0052] Optionally, in some embodiments, the cover 21 includes a positioning portion 211 for radially positioning relative to the opening 110 when the opening 110 is closed. As shown in Figures 1 and 3, in this first embodiment, the positioning portion 211 is a flange protruding downward from the outer edge of the cover 21. After the cover 21 closes the opening 110, the positioning portion 211 is located radially outside the cavity 11. By providing a flange on the outer edge of the cover 21, it can be radially positioned relative to the opening 110, ensuring that the cover 21 completely covers the opening 110 when it is closed. Furthermore, in some embodiments, the flange can also be configured such that the cover 21 is close to or in contact with the outer wall of the cavity 11 when the opening 110 is closed, achieving a better sealing effect. It should be understood that the structure of the positioning portion 211 described above is only exemplary, and other positioning methods can be used in other embodiments.

[0053] Example 2

[0054] Embodiment 2 of this application provides a closed component, which differs from Embodiment 1 mainly in the implementation of the connecting device. Referring to Figures 6 and 8, Figures 6 to 8 show a schematic diagram of an electroplating apparatus using the closed component of Embodiment 2.

[0055] In this second embodiment, the sealing assembly includes a cover 61 and a connecting device. The connecting device includes a telescopic connector 621, one end of which is fixedly connected to the substrate clamping assembly 12, and the other end is fixedly connected to the cover 61.

[0056] Referring to Figures 6 to 8, the upper end of the retractable connector 621 is fixedly connected to the substrate clamping assembly 12, and the lower end of the retractable connector 621 is fixedly connected to the cover 61. It should be understood that in other embodiments, the upper end of the retractable connector 621 may be fixedly connected to the cover 61, and the lower end of the retractable connector 621 may be fixedly connected to the substrate clamping assembly 12.

[0057] As shown in Figure 6, the cover 61 disengages from the opening 110, and the retractable connector 621 prevents the cover 61 from falling downwards. Referring to Figures 6 to 8, when the substrate clamping assembly 12 enters or exits the cavity 11 from above, the retractable connector 621 moves up and down under the influence of the substrate clamping assembly 12. During this movement, the cover 61 is also raised and lowered. This prevents the cover 61 from interfering with the substrate clamping assembly 12's entry and exit from the cavity 11, thereby improving the automation level of the electroplating equipment 10. The cover 61 can be raised and lowered without manual operation or additional drive components.

[0058] For example, when the electroplating equipment 10 is in standby mode, as shown in FIG. 7, the cover 61 covers the opening 110 to close the opening 110, and the retractable connector 621 does not affect the closing effect of the cover 61. When the electroplating equipment 10 is in process mode, as shown in FIG. 8, the cover 61 covers the opening 110 to close the opening 110. Since the retractable connector 621 is retractable, it does not hinder the substrate clamping assembly 12 from continuing to descend from the position shown in FIG. 7.

[0059] In some embodiments, the retractable connector 621 is sleeved on the substrate clamping assembly 12 and forms a closed space around the substrate clamping assembly 12. Referring to FIG9, FIG9 shows a perspective view of the connection device of the closed assembly in this second embodiment. Exemplarily, in some embodiments, the retractable connector 621 includes a bellows 6211. The bellows 6211 has a first connecting end 6211a and a second connecting end 6211b. The first connecting end 6211a is used for fixed connection with the substrate clamping assembly 12, and the second connecting end 6211b is used for fixed connection with the cover 61.

[0060] Referring to Figures 6 to 9, in this second embodiment, the substrate clamping assembly 12 includes a lifting drive device 121 and a rotation drive device 122. The lifting drive device 121 is used to drive the substrate clamping assembly 12 to move up and down, and the rotation drive device 122 is used to drive the substrate clamping assembly 12 to rotate. A bellows 6211 is sleeved on the rotation drive device 122 of the substrate clamping assembly 12. A first mounting hole 6211a is provided on the first connecting end 6211a of the bellows 6211, and the first connecting end 6211a can be fixedly connected to the rotation drive device 122 by fasteners such as screws passing through the first mounting hole 62111.

[0061] A second mounting hole 62112 is provided on the second connecting end 6211b of the bellows 6211. Referring to Figure 10, which shows a three-dimensional schematic diagram of the cover of the sealing assembly in this embodiment two, the cover 61 is an annular cover with an annular groove 610 on its inner ring and a cover connecting hole 6101 on the annular groove 610. The second connecting end 6211b is fitted into the annular groove 610, and the second connecting end 6211b is fixedly connected to the cover 61 by fasteners such as screws passing through the second mounting hole 62112 and the cover connecting hole 6101. The bellows 6211 not only enables the connection between the cover 61 and the substrate clamping assembly 12, but also has a certain sealing function, forming a closed space around the rotary drive device 122, thereby enhancing the sealing effect of the cover 61.

[0062] Furthermore, in some embodiments, the retractable connector 621 is configured to press the cover 61 against the cavity 11 when the cover 61 closes the opening 110, thereby enhancing the sealing effect of the cover 61. Exemplarily, as shown in Figures 7 and 8, the substrate clamping assembly 12 can compress the bellows 6211 after descending a certain stroke. With the bellows 6211 compressed, the cover 61 can press against the cavity 11, thereby enhancing the sealing effect of the cover 61. It should be understood that in other possible embodiments, for example, the upper end of the bellows 6211 is fixedly connected to the cover 61, and the lower end of the bellows 6211 is fixedly connected to the substrate clamping assembly 12, i.e., the bellows 6211 is located below the cover 61. The bellows 6211 can be stretched after the substrate clamping assembly 12 descends a certain stroke, similarly allowing the cover 61 to press against the cavity 11.

[0063] In some application scenarios, as shown in Figure 1, the electroplating equipment 10 also includes a gas supply unit 101 and a gas exhaust unit 102. The gas supply unit 101 is used to introduce sealed gas into the cavity 11; the gas exhaust unit 102 is used to exhaust the gas from the cavity 11. The gas supply unit 101 and the gas exhaust unit 102 work together to create a uniform positive pressure in the cavity 11. This enhances the sealing effect of the cover 61, making the gas discharge from the cavity 11 more controllable, which helps to increase the uniformity of the gas flow field in the cavity 11 and enhances the protective effect.

[0064] It should be understood that the above-described retractable connector 621 is only an example. In other possible embodiments, the retractable connector 621 may also be implemented in other ways, such as springs, retractable shafts, etc., so as to achieve a flexible connection between the cover 61 and the substrate clamping assembly 12.

[0065] Optionally, in some embodiments, the closure assembly further includes a support member 622, which is sleeved on the substrate clamping assembly 12 and fixedly connected to the substrate clamping assembly 12; wherein, the support member 622 includes a support portion 6221, which is located below the cover 61 and extends radially outward, and the radial dimension of the support portion 6221 is smaller than the radial dimension of the opening 110 and larger than the inner diameter of the cover 61.

[0066] Referring to Figure 11, Figure 11 shows a perspective view of the support member of the closed assembly in this embodiment 2. As shown in Figure 11, exemplarily, the support member 622 further includes a fixing part 6222 for fixing the support member 622 to the substrate clamping assembly 12. Exemplarily, the fixing part 6222 is an open-type fixing ring, and three support parts 6221 extend radially outward from the fixing part 6222. Referring to Figures 6 to 8, in this embodiment 2, the support member 622 is sleeved on the rotation drive device 122 of the substrate clamping assembly 12 through the fixing part 6222, and the support parts 6221 are located below the cover 61.

[0067] As shown in Figure 6, when the cover 61 is separated from the opening 110, the support member 622 abuts against the lower surface of the cover 61, providing support for the cover 61 and the telescopic connector 621, suppressing or even avoiding uncontrollable or unrecoverable tensile deformation of the telescopic connector 621, thereby improving the stability of the cover 61 and the telescopic connector 621 and extending the service life of the telescopic connector 621.

[0068] As shown in Figures 7 and 8, when the cover 61 closes the opening 110, the cover 61 covers the opening 110 of the cavity 11. The top of the side wall of the cavity 11 provides support for the cover 61 and the retractable connector 621. The support part 6221 can be separated from the cover 61. Furthermore, as shown in Figure 8, in the process state of the electroplating equipment 10, the support part 6221 enters the cavity 11 together with the substrate clamping assembly 12, without affecting the normal operation of the cover 61. It should be understood that the support part 622 in this second embodiment is only exemplary. In other embodiments, other forms of support parts can also be used, such as the support part 221 in the first embodiment.

[0069] Optionally, in this second embodiment, the cover 61 further includes a positioning part 611 for radial positioning relative to the opening 110 when the opening 110 is closed. Exemplarily, the positioning part 611 is a positioning groove facing the opening 110 and vertically aligned with the top end of the side wall of the cavity 11. When the cover 61 is in the closed position, the top end of the side wall of the cavity 11 is engaged in the positioning groove. In this second embodiment, the groove-type positioning part 611 not only has a positioning function but also enhances the sealing effect of the cover 61.

[0070] Example 3

[0071] Embodiment 3 of this application provides an electroplating apparatus. Referring to Figures 2 to 5, the electroplating apparatus 10 includes a cavity 11, a substrate clamping assembly 12, and the sealing assembly as described in Embodiment 1. It should be understood that the structure and working principle of the cavity 11, the substrate clamping assembly 12, and the sealing assembly have been described in detail in Embodiment 1, and will not be repeated here.

[0072] It should be understood that although the sealing assembly can seal the opening 110 of the cavity 11, it cannot make the cavity 11 completely sealed. Optionally, in this third embodiment, the electroplating equipment 10 further includes a gas supply section 101 and a gas exhaust section 102. The gas supply section 101 is used to introduce sealing gas into the cavity 11; the gas exhaust section 102 is used to exhaust the gas from the cavity 11.

[0073] Exemplarily, the gas supply section 101 is a purge gas pipe penetrating the cavity 11, located near the opening 110 of the cavity 11. The purge gas pipe has multiple purge gas holes 1011. The exhaust section 102 is an exhaust port communicating with the outside of the cavity 11. The gas supply section 101 introduces a sealed gas into the cavity 11 through the purge gas holes 1011, and exhausts the air and sealed gas from the cavity 11 through the exhaust section 102, thereby creating a uniform positive pressure within the cavity 11. It should be understood that the sealed gas refers to a protective gas known in the art, such as nitrogen. In cases where necessary, inert gases such as argon or helium may also be used. It should be understood that this application does not specifically limit the gas supply section 101 and the exhaust section 102; those skilled in the art can reasonably configure the gas supply section 101 and the exhaust section 102 according to actual conditions.

[0074] In this third embodiment, the opening 110 of the cavity 11 is sealed by the sealing component, and a uniform positive pressure is formed in the cavity 11 by the air supply unit 101 and the exhaust unit 102. This effectively prevents air from outside the cavity 11 from entering the cavity 11, thereby preventing air from contacting the electroplating solution and improving the stability of the electroplating solution. Furthermore, since the sealing component seals the cavity 11 from the opening 110, the sealed space is limited to a small area. The air supply unit 101 only needs to purge gas into the cavity 11, without needing to purge gas into the entire electroplating equipment 10, which improves the gas supply efficiency and saves gas consumption.

[0075] Example 4

[0076] Embodiment 4 of this application provides an electroplating apparatus. Referring to Figures 6 to 11, the electroplating apparatus 10 includes a cavity 11, a substrate clamping assembly 12, and the sealing assembly as described in Embodiment 2. The main difference between Embodiment 4 and Embodiment 3 lies in the sealing assembly. It should be understood that the structure and working principle of the cavity 11, the substrate clamping assembly 12, and the sealing assembly have been described in detail in Embodiment 2, and will not be repeated here.

Claims

1. A sealing assembly for sealing an electroplating apparatus, the electroplating apparatus comprising a cavity and a substrate clamping assembly, the cavity having an opening, the substrate clamping assembly having a clamping plate at its bottom for clamping a substrate, the clamping plate being configured to enter and exit the cavity through the opening, characterized in that, The sealing assembly includes a cover and a connecting device. The cover is sleeved on the substrate clamping assembly to close the opening after the clamping plate enters the cavity, so that the cavity is in a closed state. The cover and the substrate clamping assembly are configured to be relatively movable so that after the cover closes the opening, the clamping plate can be moved relative to the cover within the cavity. The connecting device is connected to the substrate clamping assembly and is used to move the cover and close the opening when the clamping plate enters the cavity through the opening; and / or to move the cover and disengage from the opening when the clamping plate moves out of the cavity through the opening.

2. The enclosed component according to claim 1, characterized in that, The connecting device includes a support member, which is fixedly connected to the substrate clamping assembly. The support member includes a support portion located below the cover and extending radially outward. The radial dimension of the support portion is smaller than the radial dimension of the opening and larger than the inner diameter of the cover.

3. The enclosed component according to claim 1 or 2, characterized in that, The connecting device includes a telescopic connector, one end of which is fixedly connected to the substrate clamping assembly, and the other end is used to be fixedly connected to the cover.

4. The enclosed component according to claim 3, characterized in that, The retractable connector is sleeved on the substrate clamping assembly and forms a closed space around the substrate clamping assembly.

5. The enclosed component according to claim 3, characterized in that, The retractable connector is configured to cause the cover to press against the cavity when the cover closes the opening.

6. The enclosed component according to claim 1, characterized in that, The cover is configured to slope radially downward from the inside out.

7. The enclosed component according to claim 1, characterized in that, The cover includes a positioning portion for radially positioning relative to the opening when the opening is closed.

8. An electroplating device, characterized in that, Includes a cavity and a substrate clamping assembly, and a sealing assembly according to any one of claims 1 to 7; The cavity has an opening, and the bottom of the substrate clamping assembly has a clamping plate, which is configured to enter and exit the cavity through the opening.

9. The electroplating equipment according to claim 8, characterized in that, The substrate clamping assembly includes a lifting drive device and a rotating drive device, wherein the cover is sleeved on the rotating drive device.

10. The electroplating equipment according to claim 8, characterized in that, It also includes the air supply section and the exhaust section. The gas supply unit is used to introduce sealed gas into the cavity; The exhaust section is used to discharge the gas in the cavity.

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