Light-emitting assembly and display substrate

Abstract

The present application belongs to the technical field of display. Disclosed are a light-emitting assembly and a display substrate. The light-emitting assembly comprises: a first base, a color conversion unit, and a light-emitting unit. In the color conversion unit, the orthographic projection, on the first base, of a first end disposed on the side of an opening region of a defining dam that faces the first base may be located within the orthographic projection of a filter portion on the first base. In this way, it can be ensured that the filter portion is not distributed in the opening region of the defining dam, and thus a gap generated between the filter portion and the defining dam in a direction parallel to the first base can be eliminated, so as to ensure that the flatness of the side, away from the first base, of the portion of the filter portion that is exposed by the opening region is relatively good. Accordingly, ink that is inkjet-printed into the opening region can be fully spread on the filter portion having good flatness, such that the side, away from the first base, of an optical functional portion formed by means of curing has relatively good flatness.

Description

Light-emitting components and display substrates Technical Field

[0001] This application relates to the field of display technology, and in particular to a light-emitting component and a display substrate. Background Technology

[0002] With the development of display technology, LED chips have become the most advantageous next-generation display media due to their advantages such as pure color, wide dynamic range, high brightness, high definition, low operating voltage, low power consumption, long life, impact resistance, wide viewing angle, and stable and reliable operation. They have already been widely used. Summary of the Invention

[0003] This application provides a light-emitting component and a display substrate. The technical solution is as follows:

[0004] On one hand, a light-emitting component is provided, including: a first substrate, a light-emitting unit, and a color conversion unit, wherein the color conversion unit is located on the light-emitting side of the light-emitting unit, and the color conversion unit is closer to the first substrate relative to the light-emitting unit;

[0005] The color conversion unit includes: a light-shielding layer, a light-filtering layer, a limiting dam, and an optical functional unit;

[0006] The light-shielding layer is located on one side of the first substrate, and the light-filtering layer is located on the side of the light-shielding layer away from the first substrate; the limiting dam is located on the side of the light-filtering layer away from the first substrate, and the limiting dam has an opening area, the opening area being a region that penetrates the limiting dam; the optical functional part is located within the opening area, and at least a portion of the optical functional part is used to convert the color of light entering the optical functional part;

[0007] The opening region has a first end on the side facing the first substrate, the filter layer includes a filter portion, and the orthographic projection of the first end of the opening region onto the first substrate is located within the orthographic projection of the filter portion onto the first substrate.

[0008] Optionally, the light-shielding layer has a light-transmitting hole, and at least a portion of the light-filtering portion is located within the light-transmitting hole;

[0009] Wherein, the orthogonal projection of the light-transmitting aperture onto the first substrate is located within the orthogonal projection of the light-filtering portion onto the first substrate.

[0010] Optionally, the central portion of the filter is located within the light-transmitting hole, and the edge portion of the filter is located on the side of the light-shielding layer away from the first substrate.

[0011] Optionally, the orthographic projection of the defining dam on the first substrate overlaps with the orthographic projection of the edge portion of the filter portion on the first substrate.

[0012] Optionally, the thickness of the filter layer is greater than the thickness of the light-shielding layer.

[0013] Optionally, the color conversion unit further includes a first encapsulation layer, which is located between the defining dam and the filter layer;

[0014] Wherein, the first end of the opening region is projected onto the first substrate in the orthographic projection of the first encapsulation layer onto the first substrate, and the optical functional part is disposed in contact with the first encapsulation layer.

[0015] Optionally, the portion of the first encapsulation layer exposed at the first end of the opening region that is away from the first substrate is a plane parallel to the first substrate.

[0016] Optionally, the opening region has a second end on the side away from the first substrate; the orthographic projection of the second end of the opening region on the first substrate lies within the orthographic projection of the first end of the opening region on the first substrate, and the opening area of ​​the second end of the opening region is smaller than the opening area of ​​the first end of the opening region.

[0017] Optionally, the area of ​​the cross section in the opening region on the plane parallel to the first substrate gradually increases and then gradually decreases along the direction from the first end to the second end of the opening region.

[0018] Optionally, the first encapsulation layer is a continuously distributed film layer covering the light-shielding layer and the light-filtering layer; the orthographic projections of the light-shielding layer and the light-filtering layer on the first substrate are both located within the orthographic projection of the first encapsulation layer on the first substrate;

[0019] The first encapsulation layer includes a first annular portion that extends beyond the outer contour of the light-shielding layer, and the first annular portion is disposed in contact with the first substrate.

[0020] Optionally, the color conversion unit further includes a second encapsulation layer, at least a portion of which is located on the side of the defining dam and the optical functional portion away from the first substrate.

[0021] Optionally, the second encapsulation layer is a continuously distributed film layer covering the defining dam and the optical functional part, wherein the orthographic projections of the defining dam and the optical functional part onto the first substrate are both located within the orthographic projection of the second encapsulation layer onto the first substrate;

[0022] The second encapsulation layer includes a second annular portion that extends beyond the outer contour of the defined dam, and the second annular portion is disposed in contact with the first annular portion.

[0023] Optionally, the light-shielding layer has at least one annular slot, and the orthographic projection of the light-transmitting hole on the first substrate is located within the area enclosed by the orthographic projection of the annular slot on the first substrate;

[0024] A portion of the first encapsulation layer is located within the annular through groove.

[0025] Optionally, the orthographic projection of the annular channel on the first substrate lies within the orthographic projection of the defining dam on the first substrate.

[0026] Optionally, the light-emitting component further includes a connecting layer, at least a portion of which is located between the light-emitting unit and the color conversion unit.

[0027] Optionally, the light-emitting component is a light-emitting chip.

[0028] Optionally, the light-emitting unit includes: a plurality of sub-light-emitting functional layers, each of which is used to emit a first light ray, wherein the first light ray is at least one of blue light and ultraviolet light;

[0029] The color conversion unit includes a plurality of optical functional units, each of which corresponds to a plurality of sub-light-emitting functional layers. The orthographic projection of the sub-light-emitting functional layer on the first substrate is located within the orthographic projection of the corresponding optical functional unit on the first substrate.

[0030] Optionally, the plurality of optical functional units include: a first optical functional unit for emitting red light, a second optical functional unit for emitting green light, and a third optical functional unit for emitting blue light.

[0031] On the other hand, a display substrate is provided, including: a driving backplate, and a plurality of light-emitting components arranged in an array on one side of the driving backplate, wherein the light-emitting components are the light-emitting components described above.

[0032] The beneficial effects of the technical solutions provided in this application include at least the following:

[0033] In the color conversion unit, the orthographic projection of the first end of the limiting dam's opening area facing the first substrate onto the first substrate can be located within the orthographic projection of the filter portion onto the first substrate. This ensures that the filter portion is not distributed within the opening area of ​​the limiting dam, thereby eliminating gaps between the filter portion and the limiting dam in the direction parallel to the first substrate. This ensures better flatness on the side of the filter portion exposed through the opening area away from the first substrate, and also prevents hydrophobic materials containing fluorine from leaving residues inside the opening area during the formation of the limiting dam. In this way, inkjet-printed into the opening area can spread sufficiently on the well-flat filter portion, resulting in better flatness on the side of the cured optical functional portion away from the first substrate. This ensures a smaller distance between the color conversion unit and the light-emitting unit after connection, effectively improving the aperture ratio and yield of the light-emitting component. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 is a top view of a light-emitting component provided in an embodiment of this application;

[0036] Figure 2 is a schematic diagram of the film structure of the light-emitting component at A-A' shown in Figure 1;

[0037] Figure 3 is a schematic diagram of a partial film structure of a color conversion unit provided in an embodiment of this application;

[0038] Figure 4 is a schematic diagram of another film structure of the light-emitting component shown in Figure 1 at A-A';

[0039] Figure 5 is a partial film layer schematic diagram of the actual structure of a light-emitting component provided in an embodiment of this application;

[0040] Figure 6 is a top view of a light-shielding layer distributed on a first substrate according to an embodiment of this application;

[0041] Figure 7 is a schematic diagram of the film structure of another light-emitting component provided in an embodiment of this application;

[0042] Figure 8 is a top view of another light-emitting component provided in another embodiment of this application;

[0043] Figure 9 is a schematic diagram of the film structure of the light-emitting component at B-B' shown in Figure 8;

[0044] Figure 10 is a schematic diagram of the film structure of the light-emitting component at C-C' shown in Figure 8;

[0045] Figure 11 is a top view of a first semiconductor layer provided in an embodiment of this application;

[0046] Figure 12 is a top view of a light-emitting unit located on the connection layer according to an embodiment of this application;

[0047] Figure 13 is a schematic diagram of the film structure of the light-emitting unit at E-E' shown in Figure 12;

[0048] Figure 14 is a top view of another first semiconductor layer provided in an embodiment of this application;

[0049] Figure 15 is a top view of another light-emitting unit provided in an embodiment of this application;

[0050] Figure 16 is a schematic diagram of the film structure of the light-emitting unit at F-F' shown in Figure 15. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0052] Please refer to Figures 1 and 2. Figure 1 is a top view of a light-emitting component provided in an embodiment of this application, and Figure 2 is a schematic diagram of the film structure of the light-emitting component shown in Figure 1 at point A-A'. The light-emitting component 000 may include a first substrate 100, a light-emitting unit 300, and a color conversion unit 200. The color conversion unit 200 in the light-emitting component 000 may be located on the light-emitting side of the light-emitting unit 300. In one possible implementation, the color conversion unit 200 in the light-emitting component 000 is closer to the first substrate 100 than the light-emitting unit 300. That is, the color conversion unit 200 in the light-emitting component 000 may be located on one side of the first substrate 100, and the light-emitting unit 300 in the light-emitting component 000 may be located on the side of the color conversion unit 200 away from the first substrate 100. In this case, the light emitted from the light-emitting unit 300 can be directed towards the color conversion unit 200, and then emitted after passing through the color conversion unit 200 and the first substrate 100.

[0053] The color conversion unit 200 in the light-emitting component 000 may include: a light-shielding layer 201, a light-filtering layer 202, a limiting dam 203, and an optical functional part 204.

[0054] In the color conversion unit 200, the light-shielding layer 201 may be located on one side of the first substrate 100. The light-filtering layer 202 may be located on the side of the light-shielding layer 201 away from the first substrate 100. The limiting dam 203 may be located on the side of the light-filtering layer 202 away from the first substrate 100, and the limiting dam 203 may have an opening region K1, which is a region penetrating the limiting dam 203. The optical functional unit 204 may be located within the opening region K1 of the limiting dam 203.

[0055] In this application, the light-shielding layer 201 in the color conversion unit 200 may have a light-transmitting aperture K2, and the light-filtering layer 202 may have a light-filtering portion 202a, at least a portion of which may be located within the light-transmitting aperture K2. Here, the light-transmitting aperture K2 may overlap with the opening region K1, and the orthographic projection of the light-transmitting aperture K2 on the first substrate 100 may overlap with the orthographic projection of the opening region K1 on the first substrate 100. In this case, the orthographic projection of the optical functional unit 204 on the first substrate 100 may overlap with the orthographic projection of the light-filtering portion 202a on the first substrate 100. For example, the orthographic projection of the light-transmitting aperture K2 on the first substrate 100 may be located within the orthographic projection of the opening region K1 on the first substrate 100, and correspondingly, the orthographic projection of the optical functional unit 204 on the first substrate 100 may be located within the orthographic projection of the light-filtering portion 202a on the first substrate 100.

[0056] For example, the light-emitting unit 300 in the light-emitting component 000 may include a plurality of sub-light-emitting functional layers 300a. Each of the plurality of sub-light-emitting functional layers 300a may emit light toward the color conversion unit 200, and the light is emitted after passing through the color conversion unit 200 and the first substrate 100.

[0057] Here, the number of opening regions K1 in the dam 203 can also be multiple, and multiple opening regions K1 can correspond one-to-one with multiple sub-light-emitting functional layers 300a. The orthographic projection of each sub-light-emitting functional layer 300a on the first substrate 100 can be located within the orthographic projection of the corresponding opening region K1 on the first substrate 100. Correspondingly, the number of light-transmitting holes K2 in the light-absorbing layer 200 can also be multiple, and multiple light-transmitting holes K2 can also correspond one-to-one with multiple sub-light-emitting functional layers 300a. The orthographic projection of each sub-light-emitting functional layer 300a on the first substrate 100 can be located within the orthographic projection of the corresponding light-transmitting hole K2 on the first substrate 100.

[0058] Therefore, the light emitted from each sub-light-emitting functional layer 300a can pass through the optical functional units 204 distributed within the corresponding opening region K, then through the filter block 202a within the corresponding light-transmitting aperture K2, and finally exit through the first substrate 100. At least a portion of the optical functional units 204 in the color conversion unit 200 is used to convert the color of the light entering the optical functional units 204. For example, after the light emitted from the sub-light-emitting functional layer 300a is directed towards the optical functional units 204 distributed within the corresponding opening region K, the color of the light can be converted by the optical functional units 204 before it is emitted. The filter units 202a in the filter layer 202 can filter the light entering the filter units 202a to ensure that only light of a specific color will subsequently pass through the first substrate 100 and be emitted.

[0059] In the embodiments of this application, the light-emitting component 000 can be a light-emitting chip. That is, in the process of manufacturing the light-emitting component 000, a color conversion unit 200 can be formed on the first substrate 100 firstly, and then the prepared light-emitting unit 300 can be connected to the side of the color conversion unit 200 away from the first substrate 100.

[0060] In the process of forming the color conversion unit 200, it is usually necessary to use inkjet printing technology to prepare the optical functional part 204 located in the opening area K1 of the limiting dam 200. For example, in the process of preparing the optical functional part 204 using inkjet printing technology, ink containing organic material can be inkjet printed in the opening area K1 of the limiting dam 203. After the printing is completed and the ink is cured, the optical functional part 204 located in the opening area K1 can be obtained.

[0061] It should be noted that after the color conversion unit 200 and the light-emitting unit 300 are connected, the distance between them should not be too large. Otherwise, in order to ensure that the light emitted from different sub-light-emitting functional layers 300a of the light-emitting component 000 does not have crosstalk problems, the distance between different sub-light-emitting functional layers 300a in the light-emitting component 000 needs to be increased, which will lead to a lower aperture ratio and yield of the light-emitting component 000. Here, since the color conversion unit 200 is usually obtained by cutting a motherboard containing many color conversion units 200 and light-emitting units 300, the yield of the light-emitting component 000 can refer to the number of light-emitting components 000 obtained after cutting the motherboard.

[0062] To ensure a small distance between the color conversion unit 200 and the light-emitting unit 300 after connection, it is necessary to ensure good flatness on the side of the optical functional part 204 in the color conversion unit 200 away from the first substrate 100. Typically, during the inkjet printing process to form the optical functional part 204, the inkjet-printed ink needs to be sufficiently expanded within the opening area K1 of the limiting dam 203 to ensure good flatness on the side of the optical functional part 204 away from the first substrate 100 after subsequent curing.

[0063] Inside the opening area K1 of the limiting dam 203, near the first substrate 100, a filter section 202a is typically distributed. Ink printed into the opening area K1 is distributed on the side of the filter section 202a away from the first substrate 100. However, when the orthographic projection of the filter section 202a onto the first substrate 100 lies within the orthographic projection of the opening area K1 onto the first substrate 100, a gap usually exists between the outer edge of the filter section 202a and the inner edge of the opening area K1, making it difficult for the ink printed into the opening area K1 to spread effectively at this gap. Furthermore, during the formation of the limiting dam 203, a hydrophobic material containing fluorine is typically used. This hydrophobic material easily leaves residues at the gap between the outer edge of the filter section 202a and the inner edge of the opening area K1. The residue of this hydrophobic material further increases the difficulty for the ink printed into the opening area K1 to spread at this gap. Ultimately, this will cause the side of the optical functional part 204 that is formed by curing to bulge outward away from the first substrate 100.

[0064] In this embodiment of the application, as shown in FIG3, FIG3 is a schematic diagram of a partial film structure of a color conversion unit provided in this embodiment of the application. Here, for ease of viewing, the optical functional part 204 in the color conversion unit 200 is not shown in FIG3. The opening region K1 of the defining dam 203 has a first end S1 on the side facing the first substrate 100. The orthographic projection of the first end S1 of the opening region K1 on the first substrate 100 can be located within the orthographic projection of the filter part 202a on the first substrate 100.

[0065] In this configuration, the filter portion 202a is not distributed within the opening area K1 of the limiting dam 203, thereby eliminating the gap between the filter portion 202a and the limiting dam 203 in the direction parallel to the first substrate 100. This ensures better flatness on the side of the filter portion 202a exposed through the opening area K1 away from the first substrate 100, and also ensures that hydrophobic materials containing fluorine are less likely to leave residues inside the opening area K1 during the formation of the limiting dam 203. In this way, the ink printed into the opening area K1 can be fully expanded on the well-flat filter portion 202a, resulting in better flatness on the side of the cured optical functional portion 204 away from the first substrate 100. This ensures a smaller distance between the color transfer unit 200 and the light-emitting unit 300 after connection, effectively improving the aperture ratio and yield of the light-emitting component 000.

[0066] In summary, the light-emitting component provided in this application includes a first substrate, a color conversion unit, and a light-emitting unit. In the color conversion unit, the orthographic projection of the first end of the opening area of ​​the limiting dam facing the first substrate can be located within the orthographic projection of the filter portion on the first substrate. This ensures that the filter portion is not distributed within the opening area of ​​the limiting dam, thereby eliminating the gap generated between the filter portion and the limiting dam in the direction parallel to the first substrate. This ensures better flatness on the side of the filter portion exposed through the opening area away from the first substrate, and also ensures that hydrophobic materials containing fluorine are less likely to leave residues inside the opening area during the formation of the limiting dam. Thus, the ink printed into the opening area can be fully expanded on the well-flat filter portion, resulting in better flatness on the side of the cured optical functional portion away from the first substrate. This ensures a smaller distance between the color conversion unit and the light-emitting unit after connection, effectively improving the aperture ratio and yield of the light-emitting component.

[0067] In this application, as shown in Figures 2 and 3, the orthographic projection of the light-transmitting aperture K2 of the light-shielding layer 201 in the color conversion unit 200 onto the first substrate 100 can be located within the orthographic projection of the filter portion 202a of the filter layer 202 onto the first substrate 100. For example, the central portion of the filter portion 202a can be located within the light-transmitting aperture K2, and the edge portion of the filter portion 202a can be located on the side of the light-shielding layer 201 away from the first substrate 100.

[0068] In this case, it is only necessary to make the orthographic projection of the limiting dam 203 on the first substrate 100 overlap with the orthographic projection of the edge portion of the filter portion 202a located on the side of the light-shielding layer 201 away from the first substrate 100 on the first substrate 100, so that the gap generated between the filter portion 202a and the limiting dam 203 in the direction parallel to the first substrate 100 can be eliminated.

[0069] For example, the opening area of ​​the first end S1 of the opening region K1 in the limiting dam 203 can be made smaller than the area of ​​the orthographic projection of the filter portion 202a on the first substrate 100. That is, there is a certain distance between the outer boundary of the orthographic projection of the first end K1 on the first substrate 100 and the outer boundary of the orthographic projection of the filter portion 202a on the first substrate 100. This ensures that the orthographic projection of the limiting dam 203 on the first substrate 100 overlaps with the orthographic projection of the filter portion 202a on the first substrate 100.

[0070] Furthermore, when the orthographic projection of the limiting dam 203 on the first substrate 100 intersects with the orthographic projection of the edge portion of the filter portion 202a on the first substrate 100, the central portion of the filter portion 202a has better elasticity on the side away from the first substrate 100, thereby ensuring that the ink printed into the opening area K1 can be better extended on the central portion of the filter portion 202a.

[0071] In this application, since both the light-shielding layer 201 and the light-filtering layer 202 in the color conversion unit 200 are organic materials, when it is necessary for the central portion of the light-filtering portion 202a to be located within the light-transmitting hole K2, and the edge portion of the light-filtering portion 202a to be located on the side of the light-shielding layer 201 away from the first substrate 100, it is necessary to ensure that the thickness of the light-filtering layer 202 is greater than the thickness of the light-shielding layer 201.

[0072] Optionally, Figure 4 is a schematic diagram of another film layer structure of the light-emitting component shown in Figure 1 at A-A'. The color conversion unit 200 may further include a first encapsulation layer 205. The first encapsulation layer 205 may be located between the defining dam 203 and the filter layer 202. In this case, the side of the defining dam 203 facing the first substrate 100 may contact the side of the first encapsulation layer 205 away from the first substrate 100. For this purpose, the orthographic projection of the opening region K1 of the defining dam 203 on the first substrate 100 may lie within the orthographic projection of the first encapsulation layer 205 on the first substrate 100, and the optical functional part 204 located in the opening region K1 may be disposed in contact with the first encapsulation layer 205.

[0073] It should be noted that the first encapsulation layer 205 can be a film structure made of inorganic materials. For example, the material of the first encapsulation layer 205 may include one or more inorganic insulating materials such as silicon nitride, silicon oxide, and silicon oxynitride. The filter portion 202a is made of an organic material with filtering properties. Because inorganic materials are more hydrophilic than organic materials with filtering properties, the contact angle of ink droplets on the first encapsulation layer 205 is smaller, while the contact angle of ink droplets on the filter portion 202a is larger. In this case, when the first encapsulation layer 205 is located on the side of the filter layer 202 away from the first substrate 100, the ink printed into the opening area K1 can directly contact the side of the first encapsulation layer 205 away from the first substrate 100. Since the contact angle of ink droplets on the first encapsulation layer 205 is smaller, the ink printed into the opening area K1 can spread better, which can further improve the flatness of the cured optical functional portion 204 on the side away from the first substrate 100.

[0074] In this embodiment of the application, as shown in FIG5, FIG5 is a partial film layer schematic diagram of the actual structure of a light-emitting component provided in this embodiment of the application. Since the first encapsulation layer 205 is a film layer structure made of inorganic materials, the thickness of the first encapsulation layer 205 is basically the same at various locations. That is to say, the first encapsulation layer 205 also exhibits up-and-down undulation characteristics depending on the degree of up-and-down undulation of the light-shielding layer 201 and the light-filtering layer 202 on the side away from the first substrate 100. Furthermore, since the optical functional part 204 distributed in the opening region K1 will directly contact the first encapsulation layer 205, in order to further improve the spreadability of inkjet printed into the opening region K1, it is necessary to ensure that the flatness of the portion of the first encapsulation layer 205 exposed through the first end S1 of the opening region K1 is good.

[0075] Here, the undulating morphology of the first encapsulation layer 205 is related to the morphology of the light-shielding layer 201 and the filter layer 202 on the side facing away from the first substrate 100. Therefore, when the orthographic projection of the limiting dam 203 onto the first substrate 100 overlaps with the edge region of the orthographic projection of the filter portion 202a onto the first substrate 100, the flatness of the portion of the filter portion 202a corresponding to the first end S1 of the opening region K1 can be ensured to be good. This ensures that the flatness of the portion of the first encapsulation layer 205 exposed through the first end S1 of the opening region K1 is good. That is, the side of the first encapsulation layer 205 exposed through the first end S1 of the opening region K1 away from the first substrate 100 is a plane parallel to the first substrate 100. This further improves the spreadability of inkjet-printed ink into the opening region K1.

[0076] In this embodiment of the application, as shown in FIG5, the side of the opening region K1 in the limiting dam 203 away from the first substrate 100 may have a second end S2. For the first end S1 and the second end S2 of the same opening region K1 in the limiting dam 203, the orthographic projection of the second end S2 of the opening region K1 on the first substrate 100 may be located within the orthographic projection of the first end S1 of the opening region K1 on the first substrate 100, and the opening area of ​​the second end S2 of the opening region K1 is smaller than the opening area of ​​the first end S1 of the opening region K1. In this case, the angle between the side of the limiting dam 203 facing the first substrate 100 and the inner wall of the opening region K1 is an obtuse angle, and the angle between the side of the limiting dam 203 away from the first substrate 100 and the inner wall of the opening region K1 is an acute angle.

[0077] In this application, as shown in FIG5, for the opening region K1 of the limiting dam 203, the area of ​​the cross section of the opening region K1 on the plane parallel to the first substrate 100 can gradually increase and then gradually decrease along the direction from the first end S1 to the second end S2 of the opening region K1.

[0078] In this case, the inner wall of the opening region K1 can exhibit an inwardly concave shape. Thus, under the premise that the orthographic projection of the first end S1 of the opening region K1 on the first substrate 100 is located within the orthographic projection of the filter portion 202a on the first substrate 100, and that there is a certain distance between the outer boundary of the orthographic projection of the first end S1 of the opening region K1 on the first substrate 100 and the outer boundary of the orthographic projection of the filter portion 202a on the first substrate 100, more optical functional portions 204 can be accommodated inside the opening region K1, thereby ensuring that the optical functional portions 204 have a better light conversion effect.

[0079] Optionally, as shown in Figures 4 and 5, the first encapsulation layer 205 can be a continuously distributed film layer covering the light-shielding layer 201 and the light-filtering layer 202. The orthographic projections of the light-shielding layer 201 and the light-filtering layer 202 on the first substrate 100 are both located within the orthographic projection of the first encapsulation layer 205 on the first substrate 100.

[0080] The first encapsulation layer 205 may include a first annular portion 2051 extending beyond the outer contour of the light-shielding layer 201. This first annular portion 2051 may be in contact with the first substrate 100. In this application, the first encapsulation layer 205 may further include a first encapsulation body 2052 connected to the first annular portion 2051. The first encapsulation body 2052 may be located on the side of the light-shielding layer 201 and the light-filtering layer 202 away from the first substrate 100, and the first encapsulation body 2052 may cover the light-shielding layer 201 and the light-filtering layer 202.

[0081] It should be noted that in the color conversion unit 200, the fabrication processes of the filter layer 202 and the limiting dam 203 both require exposure to high-temperature environments, and the subsequent connection process between the color conversion unit 200 and the light-emitting unit 300 also requires exposure to high-temperature environments. If the first encapsulation layer 205 in the color conversion unit 200 is fabricated before the filter layer 202, the first encapsulation layer 205 on the first substrate 100 will experience an excessively long period of exposure to the subsequent high-temperature environment, causing the first annular portion 2051 in the first encapsulation layer 205 to easily separate from the first substrate 100, thereby resulting in low reliability of the light-emitting component 000.

[0082] In this embodiment, the filter layer 202 is located on the side of the first encapsulation layer 205 facing the first substrate 100, meaning the filter layer 202 is fabricated first, followed by the first encapsulation layer 205. This eliminates the need for the first encapsulation layer 205 on the first substrate 100 to undergo the high-temperature environment involved in fabricating the filter layer 202, effectively shortening the time the first encapsulation layer 205 experiences subsequent high-temperature conditions. This reduces the probability of the first annular portion 2051 in the first encapsulation layer 205 separating from the first substrate 100, thereby effectively improving the reliability of the light-emitting component 000.

[0083] Optionally, the color conversion unit 200 may further include a second encapsulation layer 206. At least a portion of the second encapsulation layer 206 may be located on the side defining the dam 203 and the optical functional portion 204 away from the first substrate 100.

[0084] For example, the second encapsulation layer 206 may also be a continuously distributed film layer covering the defining dam 203 and the optical functional portion 204. The orthographic projections of the defining dam 203 and the optical functional portion 204 on the first substrate 100 may both lie within the orthographic projection of the second encapsulation layer 206 on the first substrate 100.

[0085] The second encapsulation layer 206 may include a second annular portion 2061 extending beyond the outer contour of the defining dam 203. This second annular portion 206 may contact the first annular portion 2051 in the first encapsulation layer 205. In this application, the second encapsulation layer 206 may further include a second encapsulation body 2062 connected to the second annular portion 2061. The second encapsulation body 2062 may be located on the side of the defining dam 203 and the optical functional portion 204 away from the first substrate 100, and the second encapsulation body 2062 may cover the defining dam 203 and the optical functional portion 204.

[0086] In this configuration, after the first annular portion 2051 in the first encapsulation layer 205 and the second annular portion 2061 in the second encapsulation layer 206 come into contact, the contacted first annular portion 2051 and the second encapsulation layer 2061 can be distributed around the limiting dam 203. Furthermore, since the first encapsulation layer 205 can be located on the side of the limiting dam 203 and the optical functional part 204 facing the first substrate 100, and the second encapsulation layer 206 can be located on the side of the limiting dam 203 and the optical functional part 204 away from the first substrate 100, the cooperation of the first encapsulation layer 205 and the second encapsulation layer 206 completely encapsulates the limiting dam 203 and the optical functional part 204, thereby improving the encapsulation effect on the limiting dam 203 and the optical functional part 204. Here, after the limiting dam 203 and the optical functional part 204 are completely encapsulated by the cooperation of the first encapsulation layer 205 and the second encapsulation layer 206, it can be ensured that both the limiting dam 203 and the optical functional part 204 are isolated from the external environment, preventing water and oxygen in the external environment from corroding the optical functional part 204.

[0087] Optionally, as shown in Figures 6 and 7, Figure 6 is a top view of a light-shielding layer distributed on a first substrate according to an embodiment of this application, and Figure 7 is a schematic diagram of the film structure of another light-emitting component according to an embodiment of this application. The light-shielding layer 201 in the color conversion unit 200 may have at least one annular groove U. The orthographic projection of the light-transmitting hole K2 in the light-shielding layer 201 onto the first substrate 100 may be located within the area enclosed by the orthographic projection of the annular groove U onto the first substrate 100. A portion of the first encapsulation layer 205 within the color conversion unit 200 may be located within the annular groove U.

[0088] It should be noted that the portion of the first encapsulation layer 205 located within the annular groove U can directly contact the first substrate 100, allowing this portion to act as a barrier. This barrier can block externally intruding moisture in a direction parallel to the first substrate 100, thereby further reducing the probability of water and oxygen from the external environment eroding the optical functional part 304. Furthermore, during the process of cutting the motherboard to obtain the light-emitting component 000, microcracks generated in the first substrate 100 or the first encapsulation layer 205 can also be blocked by this barrier, preventing the microcracks from spreading into the interior region of the light-shielding layer 201, thus improving the yield of the light-emitting component 000 obtained after the cutting process.

[0089] In this embodiment, the orthographic projection of the annular groove U on the first substrate 100 can be located within the orthographic projection of the limiting dam 203 on the first substrate 100. Preferably, the orthographic projection of the annular groove U on the first substrate 100 can be located within the orthographic projection of the side of the limiting dam 203 facing the first substrate 100 on the first substrate 100.

[0090] In this application, as shown in Figures 8, 9, and 10, Figure 8 is a top view of another light-emitting component provided in another embodiment of this application, Figure 9 is a schematic diagram of the film structure of the light-emitting component shown in Figure 8 at B-B', and Figure 10 is a schematic diagram of the film structure of the light-emitting component shown in Figure 8 at C-C'. The plurality of sub-light-emitting functional layers in the light-emitting unit 300 may include: a first sub-light-emitting functional layer 300a1, a second sub-light-emitting functional layer 300a2, and a third sub-light-emitting functional layer 300a3. Here, the first sub-light-emitting functional layer 300a1, the second sub-light-emitting functional layer 300a2, and the third sub-light-emitting functional layer 300a3 are all used to emit a first light beam in the working state.

[0091] Accordingly, the multiple opening areas in the defined dam 203 may include: a first opening area K11, a second opening area K12, and a third opening area K13. The first opening area K11 may be positioned opposite to the first sub-light-emitting functional layer 300a1, the second opening area K12 may be positioned opposite to the second sub-light-emitting functional layer 300a2, and the third opening area K13 may be positioned opposite to the third sub-light-emitting functional layer 300a3.

[0092] Here, the first opening region K11 and the third opening region K13 are arranged in a row along the first direction X, and the third opening region K13 and the second opening region K12 are arranged in a row along the second direction Y. The first direction X intersects the second direction Y. For example, the first direction X can be perpendicular to the second direction Y. In this application, the area enclosed by the outer contour of the dam 203 is defined as rectangular; the shapes of the first opening region K11, the second opening region K12, and the third opening region K13 are all rectangular.

[0093] The color conversion unit 200 may include a plurality of optical functional units 204 for emitting red light, a second optical functional unit 204b for emitting green light, and a third optical functional unit 204c for emitting blue light. The first optical functional unit 204a may be located within a first opening region K11, the second optical functional unit 204b may be located within a second opening region K12, and the third optical functional unit 204c may be located within a third opening region K13.

[0094] In this configuration, the first light emitted from the first sub-light-emitting functional layer 300a1 can be directed to the first optical functional unit 204a, where it is converted into light of another color. The first light emitted from the second sub-light-emitting functional layer 300a1 can be directed to the second optical functional unit 204b, where it is converted into light of a different color. The first light emitted from the third sub-light-emitting functional layer 300a3 can be directed to the third optical functional unit 204c, where it can either pass through or be converted by the third optical functional unit 204c.

[0095] For example, the light-emitting component 000 may have a red sub-pixel R, a green sub-pixel G, and a blue sub-pixel B. The first light emitted by the first sub-light-emitting functional layer 300a1, the second sub-light-emitting functional layer 300a2, and the third sub-light-emitting functional layer 300a3 in the light-emitting unit 300 all include at least one of blue light and ultraviolet light.

[0096] Here, the first optical functional unit 204a is used to convert the first light ray into red light. For example, the first optical functional unit 204a includes red quantum dots that convert the first light ray into red light; preferably, the first optical functional unit 204a also includes scattering particles for scattering the light. Here, the first light ray emitted from the first sub-light-emitting functional layer 300a1, after striking the first optical functional unit 204a distributed within the first opening region K11, is converted into red light by the red quantum dots, and the first light ray and red light are scattered by the scattering particles. This ensures that more of the first light ray can be converted into red light by the red quantum dots, and that the converted red light has a large emission angle, thus ensuring a large viewing angle for the display substrate integrating this light-emitting component 000. Therefore, the red sub-pixel R in the light-emitting component 000 can include: the first sub-light-emitting functional layer 300a1 and the first optical functional unit 204a.

[0097] The second optical functional unit 204b is used to convert the first light beam into green light. For example, the second optical functional unit 204b includes green quantum dots for converting the first light beam into green light; preferably, the second optical functional unit 204b also includes scattering particles for scattering the light. Here, the first light beam emitted from the second sub-light-emitting functional layer 300a2, after striking the second optical functional unit 204b distributed within the second opening region K12, is converted into green light by the green quantum dots, and the scattering particles scatter both the first light beam and the green light, ensuring that more of the first light beam can be converted into green light by the green quantum dots, and ensuring that the converted green light has a large exit angle, thus ensuring a large viewing angle for the display substrate integrating this light-emitting component 000. Therefore, the green sub-pixel G in the light-emitting component 000 may include: the second sub-light-emitting functional layer 300a2 and the second optical functional unit 204b.

[0098] The third optical functional unit 204c is used to convert the first light beam into blue light or maintain the emission of blue light. For example, when the first light beam contains only blue light, the third optical functional unit 204c can be a transparent part or can include blue quantum dots; wherein, the transparent part is used for direct transmission of the first light beam, and the blue quantum dots can be used to convert the first light beam into blue light with a wavelength different from that of the first light beam. Preferably, the third optical functional unit 204c also includes scattering particles that scatter light. Here, the first light beam emitted by the third sub-light-emitting functional layer 300a3, after striking the third optical functional unit 204c distributed in the third opening region K13, can be scattered by the scattering particles to ensure a large emission angle of blue light, thereby ensuring a large viewing angle of the display substrate integrating this light-emitting component 000. For example, when the first light ray contains ultraviolet light, the third optical functional unit 204c includes blue quantum dots that convert the first light ray into blue light, or the third optical functional unit 204c simultaneously contains scattering particles for scattering light and blue quantum dots for converting ultraviolet light into blue light. Here, after the first light ray emitted from the second sub-light-emitting functional layer 300a2 strikes the third optical functional unit 204c distributed within the third opening region K13, the blue quantum dots convert the ultraviolet light in the first light ray into blue light, and the scattering particles scatter both the first light ray and the blue light, ensuring that more ultraviolet light is converted into blue light by the blue quantum dots, and ensuring that the emitted angle of the converted blue light is large, thus ensuring a large viewing angle for the display substrate integrating this light-emitting component 000. Therefore, the blue sub-pixel B in the light-emitting component 000 may include: the third sub-light-emitting functional layer 300a3 and the third optical functional unit 204c.

[0099] In this application, when the material of the limiting dam 203 includes a reflective organic material, light emitted from the side of the optical functional section 204 can be reflected back to the optical functional section 204 by the limiting dam 203. This allows the quantum dots in the optical functional section 204 to convert the blue or ultraviolet light in the reflected light into light of the corresponding color, thereby further improving the excitation efficiency of the quantum dots. Furthermore, the light reflected back by the limiting dam 203 can be emitted from the optical functional section 204 toward the first substrate 100, thus effectively improving the light extraction efficiency of the light-emitting component 000.

[0100] Optionally, as shown in Figures 9 and 10, the multiple filter portions within the filter layer 202 of the light-emitting component 000 may include a first filter portion 2021, a second filter portion 2022, and a third filter portion 2023. Here, the first filter portion 2021 may be correspondingly disposed with the first optical functional portion 204a, the second filter portion 2022 may be correspondingly disposed with the second optical functional portion 204b, and the third filter portion 2023 may be correspondingly disposed with the third optical functional portion 204c. Therefore, the red sub-pixel R in the light-emitting component 000 may further include the first filter portion 2021; the green sub-pixel G in the light-emitting component 000 may further include the second filter portion 2022; and the blue sub-pixel B in the light-emitting component 000 may further include the third filter portion 2023.

[0101] For example, the first light emitted by the first sub-light-emitting functional layer 300a1, the second sub-light-emitting functional layer 300a2, and the third sub-light-emitting functional layer 300a3 in the light-emitting unit 300 is all blue light. The first filter 2021 can be a red color resist, which can transmit red light and absorb light of other colors. In this way, the light emitted from the first optical functional unit 204a can pass through the first filter 2021 before being emitted, and the first filter 2021 can filter out light of other colors except red light, so as to ensure that the red sub-pixel R in the light-emitting component 000 can filter out the blue light component. It should be noted that, in other possible implementations, the first filter section 2021 can also be a film layer for transmitting red light and reflecting blue light. In this way, after the light emitted from the first optical functional section 204a is directed to the first filter section 2021, the red light in these rays can pass through the first filter section 2021 and be emitted again, while the blue light in these rays can be reflected back to the first optical functional section 204a by the first filter section 2021. This allows the red quantum dots in the first optical functional section 204a to be excited into red light, thereby further improving the excitation efficiency of the red quantum dots.

[0102] For example, the first light emitted by the first sub-light-emitting functional layer 300a1, the second sub-light-emitting functional layer 300a2, and the third sub-light-emitting functional layer 300a3 in the light-emitting unit 300 is all blue light. The second filter 2022 can be a green color resist, which can transmit green light and absorb light of other colors. In this way, the light emitted from the second optical functional unit 204b can pass through the second filter 2022 before exiting, and the second filter 2022 can filter out light of other colors except green light, so as to ensure that the green sub-pixel G in the light-emitting component 000 can filter out the blue light component. It should be noted that, in other possible implementations, the second filter 2022 can also be a film layer for transmitting green light and reflecting blue light. In this way, after the light emitted from the second optical functional unit 204b is directed to the second filter 2022, the green light in these rays can pass through the second filter 2022 and be emitted again, while the blue light in these rays can be reflected back to the second optical functional unit 204b by the second filter 2022. This allows the green quantum dots in the second optical functional unit 204b to be excited into green light, thereby further improving the excitation efficiency of the green quantum dots.

[0103] It should be noted that the film structure of the first filter part 2021 and the second filter part 2022 can be the same and can be prepared by the same process; for example, both the first filter part 2021 and the second filter part 2022 are films that transmit red and green light and reflect blue light.

[0104] For example, the first light emitted by the first sub-light-emitting functional layer 300a1, the second sub-light-emitting functional layer 300a2, and the third sub-light-emitting functional layer 300a3 in the light-emitting unit 300 is all blue light. The third filter 2023 can be a blue color resist, which can transmit blue light and absorb other colors of light. In this way, the light emitted from the third optical functional unit 204c can pass through the third filter 2023 before being emitted, and the third filter 2023 can filter out light of other colors except blue light, so as to ensure that the blue sub-pixel B in the light-emitting component 000 can emit relatively pure blue light.

[0105] For example, the first light emitted by the first sub-light-emitting functional layer 300a1, the second sub-light-emitting functional layer 300a2, and the third sub-light-emitting functional layer 300a3 in the light-emitting unit 300 is blue light, and the third filter part 2023 can be a transparent block that can transmit blue light.

[0106] Optionally, the light-emitting unit 300 in the light-emitting component 000 may further include a first semiconductor layer 301 located on the light-emitting side of the plurality of sub-light-emitting functional layers 300a. To more clearly see the structure of the first semiconductor layer 301, please refer to FIG11, which is a top view of a first semiconductor layer provided in an embodiment of this application. The first semiconductor layer 301 may include a plurality of connecting portions 3011 corresponding one-to-one with the plurality of sub-light-emitting functional layers 300a, and auxiliary portions 3012 connected to the plurality of connecting portions 3011.

[0107] Each connection portion 3011 in the first semiconductor layer 301 can be connected to the corresponding sub-light-emitting functional layer 300a, and the outer boundary of the orthographic projection of each connection portion 3011 on the first substrate 100 can completely coincide with the outer boundary of the orthographic projection of the corresponding sub-light-emitting functional layer 300a on the first substrate 100.

[0108] In this application, the plurality of connection portions 3011 and auxiliary portions 3012 in the first semiconductor layer 301 are integrally formed, and the material of the connection portions 3011 in the first semiconductor layer 301 can be the same as the material of the auxiliary portions 3012. It is understood that the plurality of connection portions 3011 and auxiliary portions 3012 in the first semiconductor layer 301 are arranged in a direction parallel to the extension surface of the first substrate 100, and the first semiconductor layer 301 is a planar structure formed as a single layer. The portion of the first semiconductor layer 301 other than the plurality of connection portions 3011 is entirely composed of auxiliary portions 3012. The plurality of connection portions 3011 can be connected through the auxiliary portions 3012 in the first semiconductor layer 301.

[0109] To more clearly see the structure of the light-emitting unit 300 in the light-emitting component 000, please refer to Figures 12 and 13. Figure 12 is a top view of a light-emitting unit located on the connection layer according to an embodiment of this application, and Figure 13 is a schematic diagram of the film structure of the light-emitting unit shown in Figure 12 at E-E'. The light-emitting unit 300 may further include: a first pin electrode 302 and a plurality of second pin electrodes 303.

[0110] The first pin electrode 302 in the light-emitting unit 300 can be electrically connected to the first semiconductor layer 301; the multiple second pin electrodes 303 in the light-emitting unit 300 can correspond one-to-one with multiple sub-light-emitting functional layers 300a, and each second pin electrode 303 can be distributed on the side of the corresponding sub-light-emitting functional layer 300a away from the first semiconductor 301, and can be electrically connected to the corresponding sub-light-emitting functional layer 300a.

[0111] In this application, each sub-light-emitting functional layer 300a in the light-emitting unit 300 may include a current spreading layer 304, a second semiconductor layer 305, and a light-emitting layer 306 stacked along a direction perpendicular to and toward the first substrate 100. That is, the light-emitting layer 306 in the sub-light-emitting functional layer 300a is closer to the first semiconductor layer 301 than the current spreading layer 304.

[0112] In each sub-light-emitting functional layer 300a, the light-emitting layer 306 can be connected to the first semiconductor layer 301. Here, since the first semiconductor layer 301 in the light-emitting unit 300 is located on the light-emitting side of each sub-light-emitting functional layer 300a, and the first semiconductor layer 301 is closer to the first substrate 100 than each sub-light-emitting functional layer 300a, the first semiconductor layer 301 can contact the side of the light-emitting layer 306 in each sub-light-emitting functional layer 300a that is away from the second semiconductor layer 305.

[0113] In this application, one side of the current spreading layer 304 in each sub-light-emitting functional layer 300a can contact the second semiconductor layer 305, and the other side can overlap with the second pin electrode 303. That is, the side of the current spreading layer 304 in each sub-light-emitting functional layer 300a facing away from the second semiconductor layer 305 can overlap with the corresponding second pin electrode 303. Therefore, by overlapping the current spreading layer 304 in the sub-light-emitting functional layer 300a with the second pad electrode 303, an electrical connection between the second pad electrode 303 and the sub-light-emitting functional layer 300a can be achieved. Optionally, the material of the current spreading layer 304 is ITO (indium tin oxide). Setting the current spreading layer 304 in the sub-light-emitting functional layer 300a is beneficial for hole transport and improves the electrical performance of the light-emitting component 000.

[0114] In this embodiment, the light-emitting unit 300 may further include a common electrode layer 307 connected to the auxiliary portion 3012 in the first semiconductor layer 301. The side of the common electrode layer 307 facing away from the first semiconductor layer 301 can overlap with the first pin electrode 302. Therefore, one side of the common electrode layer 307 can be connected to the first semiconductor layer 301, and the other side can be connected to the first pin electrode 302, thereby achieving an electrical connection between the first pin electrode 302 and the first semiconductor layer 302. Optionally, the common electrode layer 307 also has a current amplification function.

[0115] In this application, please refer to Figures 14, 15, and 16. Figure 14 is a top view of another first semiconductor layer provided in an embodiment of this application, Figure 15 is a top view of another light-emitting unit provided in an embodiment of this application, and Figure 16 is a schematic diagram of the film structure of the light-emitting unit shown in Figure 15 at F-F'. It should be noted that, for ease of viewing, the insulating protective layer 308, the first lead electrode 302, and the second lead electrode 304 in the light-emitting unit are not shown here. Multiple connection portions 3011 in the first semiconductor layer 301 can correspond one-to-one with multiple second lead electrodes 303. The orthographic projection of each connection portion 3011 on the first substrate 100 can overlap with the orthographic projection of the corresponding second lead electrode 303 on the first substrate 100. For example, the outer boundary of the orthographic projection of each connection portion 3011 on the first substrate 100 coincides with the outer boundary of the orthographic projection of the corresponding second lead electrode 303 on the first substrate 100.

[0116] The auxiliary portion 3012 in the first semiconductor layer 301 may include: a first auxiliary portion 3012a, a second auxiliary portion 3012b, and a third auxiliary portion 3013c.

[0117] The orthographic projection of the first auxiliary part 3012a on the first substrate 100 may overlap with the orthographic projection of the first pin electrode 302 on the first substrate 100. For example, the outer boundary of the orthographic projection of the first auxiliary part 3012a on the first substrate 100 coincides with the outer boundary of the orthographic projection of the first pin electrode 302 on the first substrate 100.

[0118] A portion of the second auxiliary part 3012b may be located between adjacent connecting parts 3011, and another portion may be located between the first auxiliary part 3012a and the connecting part 3011.

[0119] The third auxiliary part 3012c may be arranged around the first auxiliary part 3012a, the second auxiliary part 3012b and a plurality of connecting parts 3011.

[0120] Therefore, the first auxiliary portion 3012a, the second auxiliary portion 3012b, the third auxiliary portion 3013c and the multiple connecting portions 3011 in the first semiconductor layer 301 can form a planar structure that is set in one whole layer.

[0121] Optionally, in the light-emitting unit 300, the material of the second semiconductor layer 305 in each sub-light-emitting functional layer 300a may include: p-type doped gallium nitride; the light-emitting layer 306 in each sub-light-emitting functional layer 300a may be a multi-quantum-well layer. As shown in Figures 14 and 16, the first semiconductor layer 301 may include: a first sub-layer 301a and a second sub-layer 301b stacked along a direction perpendicular to and toward the first substrate 100. That is, the second sub-layer 301b is closer to the color conversion unit 200 than the first sub-layer 301a. It can be understood that the first semiconductor layer 301 can be divided into: an auxiliary portion 3012 and a plurality of connecting portions 3011 in a direction parallel to the extension surface of the first substrate 100, and the first semiconductor layer 301 can be divided into: a first sub-layer 301a and a second sub-layer 301b in a direction perpendicular to the extension surface of the first substrate 100.

[0122] Specifically, the first sub-layer 301a in the first semiconductor layer 301 can be located between the second sub-layer 301b and the light-emitting layer 306 in each sub-light-emitting functional layer 300a. That is, the first sub-layer 301a is closer to the light-emitting layer 306 in each sub-light-emitting functional layer 300a than the second sub-layer 301b. Here, the material of the first sub-layer 301a in the first semiconductor layer 301 can be N-type doped gallium nitride, and the second sub-layer 301b in the first semiconductor layer 301 can be a gallium nitride buffer layer.

[0123] In this case, in the light-emitting unit 300, after the first pin electrode 302 is loaded with a cathode signal, if the second pin electrode 303 in a certain sub-light-emitting functional layer 300a is loaded with an anode signal, then the light-emitting layer 304 in this sub-light-emitting functional layer 300a can emit the first light.

[0124] In this embodiment, the light-emitting unit 300 may further include an insulating protective layer 308 located on the side of the common electrode layer 307 and each sub-light-emitting functional layer 300a facing away from the first semiconductor layer 301. Here, the orthogonal projections of the plurality of sub-light-emitting functional layers 300a and the common electrode layer 307 onto the first semiconductor layer 301 are all located within the orthogonal projection of the insulating protective layer 308 onto the first semiconductor layer 301, and the first pin electrode 302 and the plurality of second pin electrodes 303 are all located on the side of the insulating protective layer 308 facing away from the first semiconductor layer 301.

[0125] In this application, the insulating protective layer 308 may have: a first connection hole V1 corresponding to the first pin electrode 302, and a plurality of second connection holes V2 corresponding to a plurality of second pin electrodes 303. The first pin electrode 302 can be connected to the side of the common electrode layer 307 away from the first semiconductor layer 301 through the first connection hole V1. The plurality of second connection holes V2 may also correspond to a plurality of sub-light-emitting functional layers 300a, and each second pin electrode 303 can be connected to the side of the current spreading layer 304 in the corresponding sub-light-emitting functional layer 300a away from the light-emitting layer 306 through the corresponding second connection hole V2.

[0126] In this application, the thickness of the common electrode layer 307 can be much greater than the thickness of the current spreading layer 304. For example, the side of the common electrode layer 307 facing away from the first semiconductor layer 301 can be flush with the side of the current spreading layer 304 facing away from the first semiconductor layer 301. That is, the thickness of the common electrode layer 307 can be equal to the sum of the thicknesses of the current spreading layer 304, the second semiconductor layer 305, and the light-emitting layer 306 in the sub-light-emitting functional layer 300a. Thus, the sides of the second lead electrode 303 and the first lead electrode 302 in the light-emitting unit 300 facing away from the first semiconductor layer 301 are also flush. Since the second lead electrode 303 and the first lead electrode 302 in the light-emitting component 000 need to be soldered to the driving backplane when the light-emitting component 000 is subsequently connected to the driving backplane, when the sides of the second lead electrode 303 and the first lead electrode 302 facing away from the first semiconductor layer 301 are flush, it can be ensured that the light-emitting component 000 can be stably fixed on the driving backplane.

[0127] In this embodiment, the common electrode layer 307 may include: a common electrode body portion 3071, a first support portion 3072 fixedly connected to the common electrode body portion 3071, and two second support portions 3073 fixedly connected to the first support portion 3072. The common electrode body portion 3071 may be electrically connected to the first pin electrode 302. The first support portions 3072 may be distributed around the common electrode body portion 3071, and each second support portion 3073 may be distributed on the side of the first support portion 3072 opposite to the common electrode body portion 3071. Furthermore, of the two second support portions 3073, one second support portion 3073 may be located between two adjacent sub-light-emitting functional layers 300a distributed in the row direction, and the other second support portion 3073 may be located between two adjacent sub-light-emitting functional layers 300a distributed in the column direction. This ensures both high intensity of the entire light-emitting unit 300 and a large volume of the common electrode layer 307, thereby reducing the resistance in the light-emitting unit 300 used for transmitting common cathode signals.

[0128] Optionally, in the light-emitting unit 300, the first pin electrode 302 can be disposed in the same layer as each of the second pin electrodes 303 and made of the same material. That is, the first pin electrode 302 and each of the second pin electrodes 303 are formed using the same patterning process.

[0129] In this embodiment, the light-emitting component 000 may further include a connecting layer 400. Here, at least a portion of the connecting layer 400 may be located between the light-emitting unit 300 and the color conversion unit 200. The light-emitting unit 300 and the color conversion unit 200 in the light-emitting component 000 may be bonded together via the connecting layer 400.

[0130] For example, the first semiconductor layer 301 in the light-emitting unit 300 can be fixed to the side of the second encapsulation layer 206 in the color conversion unit 200 away from the first substrate 100 through the connection layer 400.

[0131] It should be noted that the color conversion unit 200 and the light-emitting unit 300 in the light-emitting component 000 of this application are manufactured independently, and then the two are fixed together by the connecting layer 400 to obtain the light-emitting component 000.

[0132] In some examples, multiple color conversion units 200 can first be formed on a second substrate that is integral and has a large area.

[0133] Subsequently, multiple light-emitting units 300 can be formed on a third substrate (usually a sapphire substrate or a silicon substrate), and a temporary substrate can be formed on the side of the multiple third light-emitting units away from the third substrate.

[0134] Then, the third substrate is removed, and the light-emitting unit 300 on the side away from the temporary substrate is fixed to the corresponding color conversion unit 200 on the side away from the second substrate using the connecting layer 400.

[0135] Finally, after peeling off the temporary substrate and thinning the second substrate, the thinned second substrate is cut using a cutting process to obtain multiple light-emitting components 000.

[0136] Optionally, the connecting layer 400 in the light-emitting component 000 can be an adhesive layer. This adhesive layer is a single-layer structure, and it can bond the color conversion unit 200 and the light-emitting unit 300 together. For example, the adhesive layer is made of an epoxy resin-based organic adhesive. This adhesive layer is transparent; therefore, even if the adhesive layer covers each sub-light-emitting functional layer 300a in the light-emitting unit 300, it can ensure that each sub-light-emitting functional layer 300a can transmit light through the adhesive layer and project it towards the color conversion unit 200.

[0137] Optionally, the light-emitting unit 300 in the light-emitting component 000 may contain multiple light-emitting components, and each light-emitting component may have a sub-light-emitting functional layer 300a. Here, the light-emitting component is an LED chip. It should be noted that the LED chip can be a regular-sized LED chip, a mini light-emitting diode (MLED) chip, or a micro LED (Micro-LED) chip. This application embodiment does not limit this.

[0138] In summary, the light-emitting component provided in this application includes a first substrate, a color conversion unit, and a light-emitting unit. In the color conversion unit, the orthographic projection of the first end of the opening area of ​​the limiting dam facing the first substrate can be located within the orthographic projection of the filter portion on the first substrate. This ensures that the filter portion is not distributed within the opening area of ​​the limiting dam, thereby eliminating the gap generated between the filter portion and the limiting dam in the direction parallel to the first substrate. This ensures better flatness on the side of the filter portion exposed through the opening area away from the first substrate, and also ensures that hydrophobic materials containing fluorine are less likely to leave residues inside the opening area during the formation of the limiting dam. Thus, the ink printed into the opening area can be fully expanded on the well-flat filter portion, resulting in better flatness on the side of the cured optical functional portion away from the first substrate. This ensures a smaller distance between the color conversion unit and the light-emitting unit after connection, effectively improving the aperture ratio and yield of the light-emitting component.

[0139] This application also provides a display substrate, which can be a display substrate in a mobile phone, laptop computer, television, electronic watch, or flat-panel computer, or a display substrate for an advertising screen. The display substrate may include a driving backplate and multiple light-emitting components located on one side of the driving backplate. Here, each light-emitting component in the display substrate can be a light-emitting component as described in the above embodiments. Furthermore, each second connecting electrode and first connecting electrode in the light-emitting component can be fixed to the driving backplate by soldering for electrical connection with the driving backplate. It should be noted that the driving backplate can provide corresponding driving signals to each light-emitting component, causing the light-emitting units in the light-emitting components to emit light, thereby allowing the display substrate to display a corresponding image.

[0140] This application also provides a display module, which may include a housing, a driving component, and a display substrate. The display module can be used in mobile phones, laptops, televisions, electronic watches, or flat-panel computers, or it can be used in advertising screens. Here, the display substrate included in the display module can be the display substrate described in the above embodiments.

[0141] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0142] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0143] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A light-emitting component, characterized in that, include: The first substrate, the light-emitting unit, and the color conversion unit are located on the light-emitting side of the light-emitting unit and are closer to the first substrate than the light-emitting unit. The color conversion unit includes: a light-shielding layer, a light-filtering layer, a limiting dam, and an optical functional unit; The light-shielding layer is located on one side of the first substrate, and the light-filtering layer is located on the side of the light-shielding layer away from the first substrate; the limiting dam is located on the side of the light-filtering layer away from the first substrate, and the limiting dam has an opening area, the opening area being a region that penetrates the limiting dam; the optical functional part is located within the opening area, and at least a portion of the optical functional part is used to convert the color of light entering the optical functional part; The opening region has a first end on the side facing the first substrate, the filter layer includes a filter portion, and the orthographic projection of the first end of the opening region onto the first substrate is located within the orthographic projection of the filter portion onto the first substrate.

2. The light-emitting component according to claim 1, characterized in that, The light-shielding layer has a light-transmitting hole, and at least a portion of the light-filtering part is located within the light-transmitting hole; Wherein, the orthogonal projection of the light-transmitting aperture onto the first substrate is located within the orthogonal projection of the light-filtering portion onto the first substrate.

3. The light-emitting component according to claim 2, characterized in that, The central portion of the filter is located within the light-transmitting hole, and the edge portion of the filter is located on the side of the light-shielding layer away from the first substrate.

4. The light-emitting component according to claim 3, characterized in that, The orthographic projection of the defined dam onto the first substrate overlaps with the orthographic projection of the edge portion of the filter onto the first substrate.

5. The light-emitting component according to claim 3, characterized in that, The thickness of the filter layer is greater than the thickness of the light-shielding layer.

6. The light-emitting component according to any one of claims 1-5, characterized in that, The color conversion unit further includes a first encapsulation layer, which is located between the limiting dam and the filter layer; Wherein, the first end of the opening region is projected onto the first substrate in the orthographic projection of the first encapsulation layer onto the first substrate, and the optical functional part is disposed in contact with the first encapsulation layer.

7. The light-emitting component according to claim 6, characterized in that, The portion of the first encapsulation layer exposed at the first end of the opening region, away from the first substrate, is a plane parallel to the first substrate.

8. The light-emitting component according to claim 7, characterized in that, The opening region has a second end on the side away from the first substrate; the orthographic projection of the second end of the opening region on the first substrate is located within the orthographic projection of the first end of the opening region on the first substrate, and the opening area of ​​the second end of the opening region is smaller than the opening area of ​​the first end of the opening region.

9. The light-emitting component according to claim 8, characterized in that, The area of ​​the cross section in the opening region on the plane parallel to the first substrate gradually increases and then gradually decreases along the direction from the first end to the second end of the opening region.

10. The light-emitting component according to claim 6, characterized in that, The first encapsulation layer is a continuously distributed film layer covering the light-shielding layer and the light-filtering layer; the orthographic projections of the light-shielding layer and the light-filtering layer onto the first substrate are both located within the orthographic projection of the first encapsulation layer onto the first substrate; The first encapsulation layer includes a first annular portion that extends beyond the outer contour of the light-shielding layer, and the first annular portion is disposed in contact with the first substrate.

11. The light-emitting component according to claim 10, characterized in that, The color conversion unit further includes a second encapsulation layer, at least a portion of which is located on the side of the defining dam and the optical functional portion away from the first substrate.

12. The light-emitting component according to claim 11, characterized in that, The second encapsulation layer is a continuously distributed film layer covering the defining dam and the optical functional part, and the orthographic projections of the defining dam and the optical functional part onto the first substrate are both located within the orthographic projection of the second encapsulation layer onto the first substrate; The second encapsulation layer includes a second annular portion that extends beyond the outer contour of the defined dam, and the second annular portion is disposed in contact with the first annular portion.

13. The light-emitting component according to any one of claims 1-5 and 7-12, characterized in that, The light-shielding layer has at least one annular slot, and the orthographic projection of the light-transmitting hole on the first substrate is located within the area enclosed by the orthographic projection of the annular slot on the first substrate. A portion of the first encapsulation layer is located within the annular through groove.

14. The light-emitting component according to claim 13, characterized in that, The orthographic projection of the annular channel on the first substrate lies within the orthographic projection of the defining dam on the first substrate.

15. The light-emitting component according to any one of claims 1-5, 7-12, and 14, characterized in that, The light-emitting component further includes a connecting layer, at least a portion of which is located between the light-emitting unit and the color conversion unit.

16. The light-emitting component according to any one of claims 1-5, 7-12, and 14, characterized in that, The light-emitting component is a light-emitting chip.

17. The light-emitting component according to any one of claims 1-5, 7-12, and 14, characterized in that, The light-emitting unit includes: multiple sub-light-emitting functional layers, each of which is used to emit a first light ray, wherein the first light ray is at least one of blue light and ultraviolet light; The color conversion unit includes a plurality of optical functional units, each of which corresponds to a plurality of sub-light-emitting functional layers. The orthographic projection of the sub-light-emitting functional layer on the first substrate is located within the orthographic projection of the corresponding optical functional unit on the first substrate.

18. The light-emitting component according to claim 17, characterized in that, The plurality of optical functional units include: a first optical functional unit for emitting red light, a second optical functional unit for emitting green light, and a third optical functional unit for emitting blue light.

19. A display substrate, characterized in that, include: A driving backplate, and a plurality of light-emitting components arranged in an array on one side of the driving backplate, wherein the light-emitting components are the light-emitting components according to any one of claims 1 to 18.

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