Electrode structure, surface-mount electronic component, and electronic device

Abstract

The present application discloses an electrode structure, a surface-mount electronic component, and an electronic device. The electrode structure comprises an electrode body and a soldering portion, the soldering portion is arranged on and protrudes from an end surface of the electrode body, and the side surface of the soldering portion facing away from the end surface is a first arc surface. The first arc surface protrudes in a direction facing away from the end surface, and the first arc surface is used for being in contact with a circuit board. In the thickness direction of the soldering portion, the first arc surface has a contact point, and the minimum distance h between the end surface and the contact point satisfies 0 mm < h ≤ 0.15 mm. The electrode structure disclosed in the present application uses the first arc surface to reduce bubbles in solder when the electrode structure is soldered to the circuit board, thereby enhancing the soldering strength between the electrode structure and the circuit board. In addition, since the overall thickness of the soldering portion is relatively small, the first arc surface of the soldering portion has minimal impact on the placement stability of the electronic component on the circuit board, facilitating stable placement of the electronic component on the circuit board during soldering.

Description

Electrode structures, surface-mount electronic components and electronic devices

[0001] Related cross-references

[0002] This application claims priority to Chinese Patent Application No. 202411742827X, filed on November 29, 2024, entitled “Electrode Structure, Surface Mount Electronic Components and Electronic Equipment”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of electronic components technology, and in particular to an electrode structure, a surface-mount electronic component, and an electronic device. Background Technology

[0004] In related technologies, surface-mount electronic components are typically soldered using reflow soldering. During reflow soldering, the solder at the connection point between the surface-mount electronic component's electrode and the circuit board melts, causing internal contraction and forming bubbles. If these bubbles are not eliminated, they remain in the solder after cooling, forming solder bubbles. This can affect the mechanical strength and reliability of the solder joint between the electrode and the circuit board, significantly increasing the risk of the surface-mount electronic component detaching from the circuit board. Summary of the Invention

[0005] This application discloses an electrode structure, a surface-mount electronic component, and an electronic device, which are used to improve the soldering stability of surface-mount electronic components on circuit boards.

[0006] To achieve the above objectives, the first aspect of this application discloses an electrode structure, comprising:

[0007] An electrode body, the electrode body having an end face;

[0008] A welding portion is provided on the end face and protrudes from the end face. The side surface of the welding portion away from the end face is formed as a first arc surface. The first arc surface protrudes in a direction away from the end face and is configured to contact the circuit board.

[0009] In the thickness direction of the welded portion, the first arc surface has a contact point for contacting the circuit board, and there is a minimum distance between the end face and the contact point, the minimum distance being h, wherein the following relationship is satisfied: 0mm<h≤0.15mm.

[0010] As an optional implementation of this application, the first arc surface is connected to the end face.

[0011] As an optional implementation of this application, the intersection point of the first arc surface and the end face forms a line with the contact point, and the line forms an angle θ with the end face, wherein 0°<θ≤10°.

[0012] As an optional embodiment of this application, the end face includes a plane, and the welded portion is formed on the plane by electroplating, coating, or vapor deposition.

[0013] As an optional implementation of this application, the end face includes a second arc surface, and the welded portion covers the second arc surface so that the welded portion forms the first arc surface.

[0014] As an optional implementation of this application, the second arc surface is integrally formed with the end face.

[0015] As an optional embodiment of this application, the end face has an edge side, and at least a portion of the edge side is provided with the welding portion.

[0016] The second aspect of this application discloses a surface mount electronic component, which includes a component body and an electrode structure as described in any of the above claims. The electrode structure includes at least two electrodes, both of which are connected to the component body and are spaced apart on the component body.

[0017] As an optional implementation, the electrode structure protrudes from the component body, and / or the surface-mount electronic component further includes an electrode coil disposed within the component body, with a portion of the electrode coil extending into and connected to the electrode structure.

[0018] A third aspect of this application discloses an electronic device, the electronic device including a circuit board and surface-mount electronic components as described in any of the preceding claims, the surface-mount electronic components being connected to the circuit board.

[0019] Compared with the prior art, this application has the following beneficial effects:

[0020] The electrode structure, surface-mount electronic components, and electronic devices provided in this application include an electrode body and a soldering portion. The soldering portion is located on and protrudes from the end face of the electrode body, and the surface of the soldering portion facing away from the end face is a first arc surface. This first arc surface protrudes in the direction away from the end face and is used to contact the circuit board. In the thickness direction of the soldering portion, the first arc surface has a contact point, and there is a minimum distance h between the end face and the contact point, satisfying 0mm < h ≤ 0.15mm. When the electrode structure disclosed in this application is soldered to the circuit board, the solder between the electrode structure and the circuit board adheres to the shape of the first arc surface of the soldering portion. Before the solder solidifies, due to the low density of air bubbles, the bubbles float in the solder and contact the first arc surface, eventually discharging outwards along the first arc surface. This improves the soldering strength between the electrode structure and the circuit board. Furthermore, because the overall thickness of the soldering portion is small, the first arc surface of the soldering portion has little impact on the stability of the electronic components placed on the circuit board, thus facilitating the stable placement of the electronic components on the circuit board during soldering. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 is a schematic diagram of the first structure of the electrode structure disclosed in the embodiment of this application;

[0023] Figure 2 is a schematic diagram of the application of the electrode structure disclosed in the embodiments of this application;

[0024] Figure 3 is a schematic diagram of the second structure of the electrode structure disclosed in the embodiments of this application;

[0025] Figure 4 is a schematic diagram of the third structure of the electrode structure disclosed in the embodiments of this application;

[0026] Figure 5 is a bottom view of the surface-mount electronic component disclosed in the embodiments of this application;

[0027] Figure 6 is a schematic diagram of the structure of the surface-mount electronic component disclosed in the embodiments of this application;

[0028] Figure 7 is a partial structural schematic diagram of the electronic device disclosed in the embodiments of this application.

[0029] Explanation of main reference numerals: 1-Electrode structure; 1a-Connection; 11-Electrode body; 111-End face; 111a-Second arc surface; 12-Soldering part; 12a-First arc surface; 13-Plating; 10-Surface mount electronic component; 101-Component body; 102-Electrode coil; 20-Circuit board; 30-Solder. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] In this application, the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0032] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0033] Furthermore, the terms "installation," "setup," "equipped with," and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0034] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0035] In related technologies, electronic components are typically soldered onto circuit boards using through-hole or surface-mount methods. To prevent surface-mount electronic components from detaching from the circuit board, the adhesion of the components to the circuit board is crucial during the soldering process. However, in these technologies, air bubbles can form in the solder at the connection between the electrodes of surface-mount electronic components and the circuit board. These bubbles affect the mechanical strength of the solder at the connection point, thus impacting the reliability of the surface-mount electronic components' soldering on the circuit board. This results in poor adhesion, making the components prone to detachment and affecting their usability.

[0036] Based on this, this application discloses an electrode structure, a surface-mount electronic component, and an electronic device. By setting the contact surface between the electrode structure and the circuit board as a first arc surface, this application can help reduce air bubbles generated during the soldering of the electrode structure and the circuit board, thereby improving the soldering strength at the connection between the electrode and the circuit board to meet the adhesion requirements of the electronic components on the circuit board.

[0037] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0038] In a first aspect, referring to Figures 1 and 2, this application discloses an electrode structure 1, including an electrode body 11 and a welding portion 12. The welding portion 12 is disposed on the end face 111 of the electrode body 11, and the surface of the welding portion 12 facing away from the end face 111 is a first arc surface 12a. The first arc surface 12a protrudes towards the end face 111. When the electrode structure 1 is welded to a circuit board 20, the first arc surface 12a is configured to contact the circuit board 20. The first arc surface 12a has a contact point in the thickness direction of the welding portion 12, and there is a minimum distance h between the end face 111 and the contact point, where h satisfies: 0 mm < h ≤ 0.15 m. When the welding portion 12 contacts the circuit board 20, the first arc surface 12a protrudes downward in the thickness direction, and the contact point is the lowest point of the first arc surface 12a in the thickness direction (the side facing away from the electrode body 11 is the lowest side).

[0039] This application discloses an electrode structure 1, in which a welding portion 12 is provided on one end face 111 of the electrode body 11, such that the surface of the welding portion 12 in contact with the circuit board 20 forms a first arc surface 12a. When the first arc surface 12a contacts the circuit board 20, the first arc surface 12a protrudes towards the circuit board 20. When solder 30 is placed between the first arc surface 12a and the circuit board 20, the solder 30 is distributed along the first arc surface 12a, and the air bubbles generated inside the solder 30 during the welding process float along the first arc surface 12a. Due to the low density of the air bubbles, the air bubbles move towards the edge of the first arc surface 12a as they float on it. Finally, the air bubbles can be discharged from the edge of the first arc surface 12a. In this way, the residual air bubbles in the solder 30 are reduced, which is beneficial to improving the structural strength of the solder 30 during solidification and helps the auxiliary electrode structure 1 of the solder 30 to better adhere to the circuit board 20.

[0040] For example, h can be 0.01mm-0.03mm, 0.03mm-0.05mm, 0.05mm-0.07mm, 0.07mm-0.09mm, 0.09mm-0.11mm, 0.11mm-0.13mm, 0.13mm-0.15mm, etc., such as 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, etc. To avoid uneven soldering of electronic components onto the circuit board 20, the thickness of the soldering portion 12 is set between 0.01mm and 0.15mm. This results in a relatively small overall thickness of the soldering portion 12, leading to a gentler first arc surface and a larger radius of curvature. This first arc surface 12a helps maintain the stability of the electronic components placed on the circuit board 20, facilitating soldering. At the same time, the first arc surface 12a maintains an effective curvature, allowing the electrode structure 1 to be placed stably on the circuit board 20 while also enabling air bubbles in the solder 30 to escape during the soldering process.

[0041] In some embodiments, the first arc surface 12a is connected to the end face 111 so that the first arc surface 12a intersects with the end face 111. That is, when the welding part 12 is disposed on the end face 111, the first arc surface 12a can directly connect with the end face 111, i.e., the welding part 12 is arc-shaped as a whole. Furthermore, since the overall thickness of the welding part 12 is relatively small, the arc of the welding part 12 is relatively gentle. In this way, when the electrode structure 1 is placed on the circuit board 20, it is beneficial to maintain the stability of the electrode structure 1.

[0042] Optionally, the first arc surface 12a can be a circular arc surface. Thus, when the first arc surface 12a is connected to the end face 111, the cross-sectional shape of the welding part 12 can be approximately convex arc, while the cross-section of the first arc surface 12a is an arc. The arc and the end face 111 of the electrode body 11 form two intersection points. Along the thickness direction of the welding part 12, both of these intersection points are located on the end face.

[0043] Optionally, the intersection point and the contact point of the arc surface form a connecting line 1a, and the connecting line 1a has an angle θ with the end face 111, where 0° < θ ≤ 10°. For example, θ can be 1°-3°, 2°-4°, 3°-5°, 4°-6°, 5°-7°, 6°-8°, 7°-9°, 8°-10°, etc. For instance, θ can be 1°, 2°, 3°, 4°, 5°, 6°, 7°, 8°, 9°, 10°, etc. This application sets θ in the range of 0°-10°, which is beneficial for making the first arc surface 12a relatively gentle. For example, when the electrode structure 1 is located on the circuit board 20, the connecting line 1a and the surface of the circuit board 20 also have θ, that is, the first arc surface 12a is relatively gentler than the surface of the circuit board 20 and the end face 111, which is beneficial for the electrode structure 1 to be placed stably on the circuit board 20.

[0044] Please refer to Figure 1. In some embodiments, the end face 111 includes a plane, and the welding portion 12 can be formed on the plane by electroplating and / or coating. In this application, when setting the welding portion 12, the surface of the welding portion 12 is formed with a first arc surface 12a by electroplating and coating. This is beneficial for controlling parameters such as the thickness and θ angle of the welding portion 12, so that the electrode structure 1 can be placed stably on the circuit board 20, and the curvature of the first arc surface 12a can be used to expel air bubbles in the solder 30 during the welding process.

[0045] Alternatively, the weld portion 12 can also be formed on a plane by, for example, physical vapor deposition. By depositing metal material on a plane using physical vapor deposition, the weld portion 12 forms a denser structure on the plane, which is beneficial to improving the weldability and oxidation resistance of the weld portion 12.

[0046] Optionally, the welding part 12 can be formed using metal materials such as silver, nickel, tin, and copper. The welding part 12 may include one or more metal materials selected from silver, nickel, tin, and copper. One or more layers of metal material can be deposited on the end face 111 by electroplating, coating, or physical vapor deposition to form the welding part 12. By depositing one or more layers of metal material on the electrode body 11, this application is beneficial to improving the connectivity between the welding part 12 and the electrode body 11, the oxidation resistance of the welding part 12 itself, and the weldability between the welding part 12 and the circuit board 20.

[0047] Referring to Figure 3, in some embodiments, the end face 111 includes a second arc surface 111a, and the welding portion 12 covers the second arc surface 111a, so that the welding portion 12 forms the first arc surface 12a. In other words, when the welding portion 12 is provided on the end face 111, the welding portion 12 can naturally form the first arc surface 12a according to the shape of the second arc surface 111a. For example, the end face 111 on the electrode body 11 is processed to form the second arc surface 111a, and then the welding portion 12 is provided on the second arc surface 111a, so that the welding portion 12 passively follows the shape of the second arc surface 111a to form the first arc surface 12a, without the need to adjust the shape and parameters of the welding portion 12. This helps to reduce the processing difficulty of the first arc surface 12a of the welding portion 12.

[0048] Optionally, the second arc surface 111a can be formed by molding and / or grinding, so that the end face 111 and the second arc surface 111a are integrally formed. In one example, the electrode body 11 can be placed in a mold, and a portion of the electrode body 11 can protrude from the end face 111 along the shape of the mold, thus forming a protrusion with the second arc surface 111a. In another example, the second arc surface 111a can be directly formed on the end face 111 by grinding, cutting, or other methods. In this way, the forming of the second arc surface 111a is convenient and quick, easy to operate, and beneficial to improving the processing efficiency of the electrode structure 1.

[0049] Please refer to Figure 4. In some embodiments, the first arc surface of the welded portion 12 is further coated with a plating layer 13. Applying one or more layers of plating layer 13 to the outside of the welded portion 12 in this application is beneficial for improving the oxidation resistance and welding performance of the welded portion 12.

[0050] Optionally, the material of the coating 13 may be a metal coating, such as nickel, tin, etc., which is not specifically limited in this application.

[0051] Optionally, the coating 13 can be applied to the first arc surface 12a by methods such as electroplating or physical vapor deposition, and this application does not make specific limitations.

[0052] It is understandable that the shape of the coating matches the first arc surface. That is, the shape of the coating is also arc-shaped and has an angle θ.

[0053] It is understandable that when the weld portion 12 is formed on the end face 111 of the electrode body 11 by means of silver paste coating, the plating layer can be plated on the weld portion 12. By plating the layer to protect the silver paste-coated weld portion 12, it is beneficial to improve welding performance, oxidation resistance, etc.

[0054] Referring to Figure 5, in some embodiments, the end face 111 has edge sides, and at least a portion of the edge sides are provided with welding portions 12. In one example, taking the end face 111 as a square surface, the end face may have four edge sides, and welding portions 12 may be provided on at least one edge side, or on two, three, or four edge sides. In another example, taking the end face 111 as a circular surface, welding portions 12 may be provided on a portion of the circular edge side, or welding portions 12 may be provided on the entire edge side. By providing welding portions 12 on the edge sides of the end face 111, this application reduces the impact of the first arc surface 12a of the welding portion 12 on the stability of the end face 111, and also reduces the residue of air bubbles in the solder 30 during welding.

[0055] It is understandable that when multiple welded portions 12 are provided on the edge side, these multiple welded portions 12 can be spaced apart.

[0056] Optionally, the end face 111 also has a middle portion, with an edge side surrounding the middle portion, and a welding portion 12 is disposed in the middle portion. In one example, the welding portion 12 may be disposed only in the middle portion, so that the middle portion forms a first arc surface 12a. In another example, the welding portion 12 may be disposed in both the middle portion and the edge side, so that the first arc surface 12a covers the entire end face 111. This application may provide the welding portion 12 in both the edge side and / or the middle portion, so that the first arc surface 12a covers the end face 111 on the front. During welding, the entire surface of the first arc surface 12a contacts the circuit board 20, which is beneficial for the entire surface to expel air bubbles located in the solder 30, thereby improving the adhesion of the electrode structure 1 to the circuit board 20.

[0057] Secondly, referring to Figures 5 and 6, this application also discloses a surface-mount electronic component 10, including a component body 101 and electrode structures 1 as described in the first aspect. The electrode structures 1 include at least two, both connected to the component body 101 and spaced apart on the component body 101. It is understood that one of the two electrode structures 1 can be connected to the positive terminal of a power supply, and the other can be connected to the negative terminal of the power supply.

[0058] The surface mount electronic component 10 in this application, by setting the electrode structure 1 disclosed in the first aspect, enables the soldering portion 12 of the electrode structure 1 of the surface mount electronic component 10 to reduce air bubbles in the solder 30 during soldering when the surface mount electronic component 10 is soldered onto the circuit board 20, effectively improving the adhesion between the surface mount electronic component 10 and the circuit board 20. Moreover, the overall thickness of the soldering portion 12 of the electrode structure 1 is small, so when the surface mount electronic component 10 is placed on the circuit board 20, the soldering portion 12 has little impact on the overall stability of the surface mount electronic component 10 on the circuit board 20, which is beneficial to the stability of the electronic component placed on the circuit board 20 during surface mount, and facilitates the soldering of the surface mount electronic component 10 to the circuit board 20.

[0059] Optionally, the electrode structure 1 may include multiple electrodes, wherein two electrode structures 1 are respectively connected to the positive and negative terminals of the power supply, one electrode structure 1 may be grounded, and the other electrode structures 1 may be connected to the circuit of the circuit board 20. This application does not make specific limitations here.

[0060] In some embodiments, the electrode structure 1 protrudes from the component body 101. Considering that the electrode structure 1 of the surface mount electronic component 10 can be effectively connected to the circuit board 20, this application exemplarily allows a portion of the electrode structure 1 to protrude from the component body 101 during the packaging process. Specifically, the portion of the electrode structure 1 with a soldering portion 12 protrudes from the component body 101 to facilitate soldering of the electrode structure 1 to the circuit board 20.

[0061] Optionally, the surface mount electronic component 10 also includes an electrode coil 102 (as shown by the circular dashed box in Figure 7). The electrode coil 102 is disposed within the component body 101, with a portion of the electrode coil 102 extending into the electrode structure 1. Specifically, during the packaging of the surface mount electronic component 10, the electrode structure 1 is led out to the outside of the component body 101, and the electrode coil 102 located within the component body 101 is led out along with the electrode structure 1, so that a portion of the electrode coil 102 is located within the electrode structure 1 protruding from the component body 101. In this way, when the surface mount electronic component 10 is soldered to the circuit board 20, the electrode structure 1 can achieve electrical conductivity with the circuit board 20 and the component body 101.

[0062] Thirdly, referring to Figure 7, this application also discloses an electronic device, including the surface-mount electronic component 10 disclosed in the second aspect and a circuit board 20. The surface-mount electronic component 10 is connected to the circuit board 20 by soldering. Exemplarily, after the surface-mount electronic component 10 is soldered, the solder 30 located between the surface-mount electronic component 10 and the circuit board 20 can expel air bubbles through the first arc surface 12a on the electrode structure 1 of the surface-mount electronic component 10, thereby improving the adhesion between the surface-mount electronic component 10 and the circuit board 20 and helping to prevent the electronic component from falling off.

[0063] Optionally, the electronic device may be, but is not limited to, mobile phones, smartwatches, televisions, laptops, etc., and this application does not make specific limitations.

[0064] To facilitate a further understanding of the solution in this application, the following explanation will use the fabrication process of surface-mount electronic components as an example.

[0065] In the first example, the manufacturing process includes:

[0066] 301. Place the surface-mount electronic components into the mold;

[0067] 302. Extend the electrode body located inside the component body to the outside of the component body, and introduce the electrode coil located inside the component body into the electrode body located outside the component body;

[0068] 303. According to the shape of the mold, the end face of the electrode body located outside the main body of the component is made into a second arc surface. The second arc surface protrudes relative to the end face and has an angle θ, which is 4.3°.

[0069] 304. A metal layer is electroplated on the second arc surface to form a welded part. The welded part forms a first arc surface according to the shape of the second arc surface. The arc apex of the first arc surface has a minimum distance h between it and the end face of the electrode body, where h is 0.06 mm.

[0070] The electrode structure of the final surface-mount electronic component can be seen in Figure 3.

[0071] A comparative experiment was conducted between the surface-mount electronic components fabricated in the first example (hereinafter referred to as this embodiment) and surface-mount electronic components in related technologies (comparative examples), and the results are shown in Table 1 below:

[0072] Table 1

[0073] As can be seen from Table 1, after soldering, the surface-mount electronic components using this embodiment exhibit significantly improved adhesion to the circuit board, and the amount of solder is greatly reduced, even to the point of being almost nonexistent. In other words, the soldering strength between the surface-mount electronic components and the circuit board is effectively improved, which helps prevent soldering failure and thus improves the yield rate of electronic equipment.

[0074] In the second example, the manufacturing process includes:

[0075] 301. Expose the electrode body and electrode coil located inside the component body, and make the surface of the electrode body into a flat surface to facilitate the adhesion of metal materials;

[0076] 302. Apply silver paste to the surface of the electrode body so that the silver paste is connected to the electrode body and electrode coil inside the component body;

[0077] 303. After the silver paste solidifies, a welded part is formed. Utilizing the thixotropic properties and surface tension of the silver paste, the surface of the solidified welded part forms a first arc surface, and the thickness h of the welded part is 0.06 mm, and the θ angle of the first arc surface is 4.3°.

[0078] 304. A metal plating layer is applied to the first arc surface by electroplating.

[0079] The electrode structure of the final surface-mount electronic component can be seen in Figure 4.

[0080] The surface-mount electronic components fabricated in the second example (hereinafter referred to as this embodiment) are compared with surface-mount electronic components in related technologies (comparative examples), and the results are shown in Table 2 below:

[0081] Table 2

[0082] As shown in Table 2 above, after soldering, the surface-mount electronic components using this embodiment exhibit significantly improved adhesion to the circuit board, and a substantial reduction in solder bubbles, with some bubbles even becoming virtually nonexistent. In other words, the soldering strength between the surface-mount electronic components and the circuit board is effectively enhanced, which helps prevent soldering failures and ultimately improves the yield rate of electronic equipment.

[0083] In the third example, the manufacturing process includes:

[0084] 301. Expose the electrode structure and electrode coil inside the component body, and lead the electrode structure and electrode coil located inside the component body to the outside of the component body;

[0085] 302. The electrode structure located outside the main body of the component is made into a plane, and the thickness of the electrode structure located outside the main body of the component is controlled to be 0.06mm;

[0086] 303. Grind the flat surface to form a second arc surface, with the angle θ between the second arc surface and the flat surface being 4.3°;

[0087] 304. A metal layer is provided on the second arc surface to form a welded part, and the welded part forms the first arc surface according to the shape of the second arc surface.

[0088] The electrode structure of the final surface-mount electronic component can be seen in Figure 3.

[0089] The surface-mount electronic components fabricated in the third example (hereinafter referred to as this embodiment) are compared with surface-mount electronic components in related technologies (comparative examples), and the results are shown in Table 3 below:

[0090] Table 3

[0091] As shown in Table 3 above, after soldering, the surface-mount electronic components using this embodiment exhibit significantly improved adhesion to the circuit board, and a substantial reduction in solder bubbles, with some bubbles even becoming virtually nonexistent. In other words, the soldering strength between the surface-mount electronic components and the circuit board is effectively enhanced, which helps prevent soldering failures and ultimately improves the yield rate of electronic equipment.

[0092] The electrode structure, surface mount electronic components, and electronic devices disclosed in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the electrode structure, surface mount electronic components, and electronic devices of this application and their core ideas. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An electrode structure, characterized in that, include: An electrode body, the electrode body having an end face; A welding portion is provided on the end face and protrudes from the end face. The side surface of the welding portion away from the end face is formed as a first arc surface. The first arc surface protrudes in a direction away from the end face and is configured to contact the circuit board. In the thickness direction of the welded portion, the first arc surface has a contact point for contacting the circuit board, and there is a minimum distance between the end face and the contact point, the minimum distance being h, wherein the following relationship is satisfied: 0mm<h≤0.15mm.

2. The electrode structure according to claim 1, characterized in that, The first arc surface is connected to the end face.

3. The electrode structure of claim 2, wherein The intersection point of the first arc surface and the end face forms a line with the contact point, and the line forms an angle θ with the end face, wherein 0°<θ≤10°.

4. The electrode structure according to claim 1, characterized in that, The end face includes a plane, and the welded part is formed on the plane by electroplating, coating, or vapor deposition.

5. The electrode structure according to claim 1, characterized in that, The end face includes a second arc surface, and the welded portion covers the second arc surface so that the welded portion forms the first arc surface.

6. The electrode structure according to claim 5, characterized in that, The second arc surface is integrally formed with the end face.

7. The electrode structure according to any one of claims 1-6, characterized in that, The end face has an edge side, and at least a portion of the edge side is provided with the welded portion.

8. A surface-mount electronic component, characterized in that, include: Component body; as well as According to any one of claims 1-7, the electrode structure comprises at least two electrodes, both of which are connected to the component body and are spaced apart on the component body.

9. The surface-mount electronic component according to claim 8, characterized in that, The electrode structure protrudes from the main body of the component, and / or the surface-mount electronic component further includes an electrode coil, which is disposed within the main body of the component, and a portion of the electrode coil extends into the electrode structure and is connected to the electrode structure.

10. An electronic device, characterized in that, include: Circuit board; According to claim 8 or 9, the surface-mount electronic component is connected to the circuit board.

Images