Power distribution device and charging apparatus

Abstract

The embodiments of the present application relate to the technical field of energy. Provided are a power distribution device and a charging apparatus comprising the power distribution device. The power distribution device is used for distributing an input electric current into at least one branch and outputting same. The power distribution device comprises a printed circuit board and a plurality of electronic components, wherein the plurality of electronic components are all fixed on the printed circuit board. The power distribution device further comprises an enclosure frame, an adhesive layer and a partition rib, wherein the enclosure frame is fixed on the printed circuit board, and the plurality of electronic components include at least one electronic component located inside the enclosure frame and at least two electronic components located outside the enclosure frame; the adhesive layer is located in the enclosure frame and fixed on the printed circuit board; the at least one electronic component located inside the enclosure frame comprises a component housing and a pin fixed on the component housing, the pin being electrically connected to the printed circuit board, and the adhesive layer covering the pin; and the partition rib is located outside the enclosure frame, the partition rib being fixed on the enclosure frame or on the printed circuit board, and the at least two electronic components located outside the enclosure frame being distributed on different sides of the partition rib.

Description

Power distribution device and charging equipment

[0001] This application claims priority to Chinese Patent Application No. 202422965956.7, filed on November 29, 2024, entitled "Power Distribution Device and Charging Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of energy technology, and in particular to a power distribution device and a charging device. Background Technology

[0003] Due to the complex application scenarios of charging stations, frequent charging and discharging can cause frequent temperature fluctuations in charging equipment. However, in order to meet current requirements, the internal circuit board of the power distribution device has a large copper content. Under high temperature cycling, condensation can form on the surface of the internal circuit board of the power distribution device, posing a risk of short circuit and damage to the circuit board.

[0004] In related technologies, a plastic component is used to surround the circuit board, and then adhesive is poured into the space enclosed by the plastic component, so that the adhesive covers the entire circuit board and completely encapsulates its surface. However, this protective method is costly and not conducive to heat dissipation for some electronic components.

[0005] Utility Model Content

[0006] This application provides a power distribution device and a charging device including the power distribution device, which reduces the risk of short circuits or damage to the circuit board caused by condensation and reduces the amount of adhesive used.

[0007] To achieve the above objectives, this application adopts the following technical solution:

[0008] A first aspect of this application provides a power distribution device for distributing an input current into at least one output path. The power distribution device includes a circuit board and multiple electronic components, all of which are fixed on the circuit board. The power distribution device also includes a frame, an adhesive layer, and a partition. The frame is fixed on the circuit board. The multiple electronic components include at least one electronic component located inside the frame and at least two electronic components located outside the frame. The adhesive layer is located inside the frame and fixed on the circuit board. The at least one electronic component located inside the frame includes a device housing and pins fixed on the device housing. The pins are electrically connected to the circuit board, and the adhesive layer covers the pins. The partition is located outside the frame and is fixed on the frame or the circuit board. The at least two electronic components located outside the frame are distributed on different sides of the partition.

[0009] The circuit board of the power distribution device carries multiple electronic components and distributes power through the circuit board and these components, ensuring that the input current is distributed into at least one output path. A frame is mounted on the circuit board, and then adhesive is poured into the inside of the frame. After the adhesive solidifies, it forms an adhesive layer that covers the circuit board inside the frame and its pins. This ensures that at least one electronic component inside the frame has no exposed metal conductors (pins), protecting the components and reducing the risk of short circuits or damage to the circuit board caused by condensation. Furthermore, baffles are located outside the frame and separate the electronic components outside the frame, increasing the creepage distance between them. This also helps to block and guide some condensation outside the frame, reducing the risk of condensation contacting multiple electronic components and causing circuit board malfunction. In other words, adhesive is applied and formed only on the inner side of the frame. The outer side of the frame does not require adhesive application, and ribs are used to separate the electronic components and high-voltage networks in the un-applied areas. This allows for more targeted adhesive application, providing better protection, reducing the risk of short circuits or damage to the circuit board caused by condensation, and also reducing the amount of adhesive used, thus lowering production costs. Furthermore, after adhesive application, the frame remains inside the power distribution device and is fixed to the circuit board. In this way, the frame also serves as insulation, enhancing the insulation performance between the electronic components on the outer and inner sides of the frame.

[0010] In one embodiment of this application, the partition is fixed to the frame and extends outward from the frame, and the partition is bonded and fixed to the surface of the circuit board.

[0011] The partition bars are fixed to the frame. During frame installation, the partition bars can also be installed onto the circuit board along with the frame. After the frame and partition bars are installed on the circuit board, the surface of the partition bars is bonded to the circuit board surface, reducing the possibility of the partition bars warping or bending. This also reduces the risk of relative displacement between the partition bars and the circuit board during and after the glue application process, facilitating a smooth glue application. Furthermore, the partition bars are fixed to the circuit board via adhesive, meaning they are fixed to the circuit board without screws or soldering, which facilitates the assembly of the frame (with the partition bars located on it) and the circuit board.

[0012] In one embodiment of this application, the power distribution device further includes a flexible adhesive strip, and the surface of the rib facing the circuit board is bonded and fixed to the surface of the circuit board by the adhesive strip.

[0013] The flexible adhesive strip can deform under force. When the surface of the partition facing the circuit board has dimensional errors or unevenness, the adhesive strip can absorb the tolerance through deformation, so that the partition can be stably bonded to the circuit board. It is also beneficial for the installation and fixation of the frame.

[0014] In one embodiment of this application, the power distribution device further includes a mounting base, a protective shell, and fasteners. The mounting base and the protective shell are fixed by the fasteners. The circuit board is located within the space enclosed by the mounting base and the protective shell. The circuit board is fixed on the mounting base or on the protective shell. The frame and the partition are both located on the surface of the circuit board facing the protective shell. The protective shell abuts against the partition.

[0015] The mounting base and protective housing protect the circuit board. The circuit board is installed between the mounting base and the protective housing. After the protective housing and the mounting base are connected by fasteners, the protective housing will abut against the rib, thereby pressing the rib tightly onto the circuit board. This reduces the possibility of the rib lifting or bending, allowing the rib to better increase the creepage distance and reducing the risk of rib failure.

[0016] In one embodiment of this application, the side of the partition rib facing away from the circuit board has a groove, and the protective shell for abutting the partition rib extends into the groove.

[0017] Since the protective shell is fixed to the mounting base via fasteners, and the circuit board is fixed between the protective shell and the mounting base, the possibility of relative displacement between the protective shell, circuit board, and fasteners is low. However, there is still a risk of relative displacement between the frame and the circuit board. Therefore, with the protective shell pressing against the rib, the portion of the protective shell that abuts against the rib extends into the groove of the rib, thus forming a fit and limiting position. This interlocking fit between the protective shell and the groove reduces the possibility of frame loosening, allowing the frame to be firmly fixed to the circuit board. Furthermore, it also further reduces the risk of the rib bending or kinking.

[0018] In one embodiment of this application, the frame includes a fixed surrounding frame and positioning posts. The surrounding frame surrounds at least one of the multiple electronic components, and the positioning posts are fixed on the surrounding frame. The circuit board has positioning holes, and the positioning posts are inserted into the positioning holes.

[0019] During the installation of the enclosure, the positioning pins on the enclosure can be aligned with the positioning holes on the circuit board and inserted. The fit between the positioning pins and the positioning holes serves a positioning function, facilitating the installation of the enclosure on the circuit board and ensuring a more accurate installation position. The surrounding frame also restricts the injection of adhesive, ensuring that the adhesive layer formed after solidification is located inside the enclosure.

[0020] In one embodiment of this application, the frame further includes a barrier plate fixed to the surrounding frame. The barrier plate protrudes toward the inside of the surrounding frame and there is a gap between the barrier plate and the circuit board. The distance between the barrier plate and the circuit board is greater than the distance between the device shell of at least one electronic component located inside the surrounding frame and the circuit board.

[0021] After the frame is installed on the circuit board, during the process of potting adhesive into the inside of the frame, the frame acts as an outer confinement for the adhesive, keeping it within the area enclosed by the frame. The barrier plate limits the height of the adhesive, which is poured into the gap between the barrier plate and the circuit board (or slightly beyond the barrier plate). The barrier plate hinders the flow of adhesive, reducing the possibility of it overflowing from the top of the frame. Furthermore, the distance between the barrier plate and the circuit board is greater than the distance between the component housing and the circuit board, ensuring that the pins on the component housing are covered by the adhesive layer. At least one electronic component located inside the frame has no metal conductors (pins) exposed outside the adhesive layer, thus protecting the electronic components within the frame.

[0022] In one embodiment of this application, at least one electronic component located inside the frame includes a switching device for controlling on / off states. The switching device includes a housing and pins. In the thickness direction of the circuit board, the height of the housing of the switching device is greater than the height of the frame.

[0023] Switching devices control the on / off state of current and distribute it. A frame is set on the board surface where the switching devices are located. Since the height of the frame is lower than the height of the switching devices, after the glue is poured inside the frame, the glue layer will not cover the entire device shell of the switching device. This reduces the height of the glue layer, effectively protecting the pins of the switching devices, reducing the impact of the glue layer on the heat dissipation of the switching devices, reducing the amount of glue used and the material required for the frame, saving production costs, and reducing the weight of the circuit board and power distribution device.

[0024] In one embodiment of this application, the power distribution device further includes a metal sheet and a bottom frame. Multiple electronic components are fixed on the same surface of the circuit board. The metal sheet is fixed on the surface of the circuit board away from the multiple electronic components. The metal sheet is electrically connected to at least one of the multiple electronic components. The bottom frame covers the metal sheet and forms a potting space with the circuit board. The circuit board has a potting hole communicating with the potting space. The potting hole is located inside the frame.

[0025] The current input or output through the metal sheet can be distributed through corresponding electronic components (e.g., switching devices). During the potting process, potting compound can first be poured into the potting space within the base frame through the potting hole. Once the potting space is full, the compound will overflow from the potting hole. Then, the space enclosed by the frame is filled with compound. After the frame is filled and solidified, the compound layer will cover the circuit board inside the frame and fill at least part of the gaps between the electronic components and the circuit board, thus protecting the electrical connection points between the electronic components and the circuit board.

[0026] A second aspect of this application provides a charging device, which includes a power conversion device, a plurality of charging interfaces, and the aforementioned power distribution device. The power distribution device is electrically connected to the power conversion device and the plurality of charging interfaces, and is used to distribute the DC power output by the power conversion device to at least one charging interface.

[0027] The power distribution device can allocate the current from the power conversion device according to the needs of the charging interface, distributing the current output by the power conversion device to one or more corresponding charging interfaces. The charging device provided in this application includes the aforementioned power distribution device; therefore, the charging device provided in this application and the power distribution device of the above-mentioned technical solutions can solve the same technical problems and have the same technical effects, which will not be elaborated further here.

[0028] In one embodiment of this application, the power distribution device further includes a metal sheet and a busbar. Multiple electronic components include a switching device for controlling on / off states. The metal sheet is electrically connected to the switching device, and the busbar contacts the metal sheet. The busbar is electrically connected to the output terminal of the power conversion device and / or the input terminal of at least one charging interface.

[0029] The current output from the power conversion device passes through the corresponding busbar, metal plates, and switching devices, and is then delivered to the input of one or more charging ports. The switching devices control the flow of the current, distributing the output current from the power conversion device to the corresponding charging ports. Attached Figure Description

[0030] Figure 1 is a schematic diagram of a charging device provided in an embodiment of this application;

[0031] Figure 2 is a schematic diagram of another charging device provided in an embodiment of this application;

[0032] Figure 3 is a schematic diagram of a power distribution device provided in an embodiment of this application;

[0033] Figure 4 is a split view of a power distribution device provided in an embodiment of this application;

[0034] Figure 5 is a schematic diagram of the structure of an adhesive layer provided in an embodiment of this application;

[0035] Figure 6 is an enlarged view of point A in Figure 5;

[0036] Figure 7 is a diagram showing an arrangement of multiple electronic components provided in an embodiment of this application;

[0037] Figure 8 is a diagram showing another arrangement of multiple electronic components provided in the embodiments of this application;

[0038] Figure 9 is a schematic diagram of a protective shell provided in an embodiment of this application;

[0039] Figure 10 is a magnified view of part B in Figure 9;

[0040] Figure 11 is a schematic diagram of another protective shell provided in an embodiment of this application;

[0041] Figure 12 is a schematic diagram of the structure of an adhesive strip provided in an embodiment of this application;

[0042] Figure 13 is a schematic diagram of the structure of a frame provided in an embodiment of this application;

[0043] Figure 14 is a schematic diagram of a barrier plate provided in an embodiment of this application;

[0044] Figure 15 is a schematic diagram of the height of a frame provided in an embodiment of this application;

[0045] Figure 16 is a schematic diagram of the structure of a bottom frame provided in an embodiment of this application.

[0046] Reference numerals: 100-Charging equipment; 101-Equipment cabinet; 102-Charging gun; 103-Charging host; 104-Charging terminal; 105-Power conversion device; 1051- Power module; 106-Power distribution device; 107-Charging interface; 108-Cable; 109-Busbar; 1-Circuit board; 11-Through hole; 12-Potting hole; 13-Potting hole; 2-Electronic component; 21-Component housing; 22-Pin; 23-Switch device; 3-Frame; 31-Wrap-around frame; 32-Potting post; 33-Barrier plate; 34-Arc segment; 4-Glue layer; 5-Separator; 51-Groove; 6-Glue strip; 7-Outer shell; 71-Mounting base; 72-Protective shell; 721-Shell part; 722-Protruding rib part; 73-Fastener; 8-Metal sheet; 9-Bottom frame; 91-Potting space; 92-Wrap-around plate; 93-Bottom plate. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0048] In this application, the terms "first," "second," etc., are used for descriptive purposes only to distinguish one element from another, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0049] In this application, unless otherwise expressly stated and limited, "multiple" means two or more.

[0050] Furthermore, in this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0051] In the accompanying drawings of the embodiments of this application, solid structures such as parts and components are represented by guide lines; hollow structures such as openings, holes, spaces, and cavities are represented by guide lines with arrows.

[0052] This application provides a charging device 100, which can be a charging pile, such as an integrated charging pile. FIG1 exemplarily shows the structure of a charging device 100 (integrated charging pile). Referring to FIG1, the charging device 100 includes a device cabinet 101 and at least one charging gun 102. For example, FIG1 shows the case of multiple charging guns 102. When the charging gun 102 is not performing a charging operation, the charging gun 102 can be plugged into the device cabinet 101 for personnel to use at any time.

[0053] For example, the charging device 100 can also be a split-type charging pile. Figure 2 exemplarily shows the structure of another charging device 100 (split-type charging pile). Referring to Figure 2, the charging device 100 includes a charging host 103, at least one charging terminal 104, and at least one charging gun 102. For example, Figure 2 shows a case with multiple charging terminals 104 and multiple charging guns 102. Each charging terminal 104 is electrically connected to the charging host 103, and each charging terminal 104 corresponds to one or more charging guns 102. When the charging gun 102 is not performing a charging operation, the charging gun 102 can be plugged into the corresponding charging terminal 104 for use by personnel.

[0054] Furthermore, referring to Figures 1 and 2, the charging device 100 also includes a power conversion device 105, a power distribution device 106, and multiple charging interfaces 107. The input terminal of the power conversion device 105 is used to receive alternating current (AC), and the output terminal of the power conversion device 105 is used to output direct current (DC). For example, the power conversion device 105 may include multiple power modules 1051, which include multiple AC-DC modules. In some other examples, the multiple power modules 1051 include multiple AC-DC modules and multiple DC-DC modules. The output terminals of the multiple AC-DC modules are connected to the input terminals of the multiple DC-DC modules via a DC bus, and the output terminals of the multiple DC-DC modules output DC power. The output terminal of the power conversion device 105 is electrically connected to the input terminal of the power distribution device 106. The output terminal of the power distribution device 106 is electrically connected to the input terminals of multiple charging ports 107. The power distribution device 106 is used to distribute the DC power output by the power conversion device 105 to one or more corresponding charging ports 107, and to make the output terminal of the charging port 107 output DC power, thereby charging the device to be charged (e.g., an electric vehicle) through the charging gun 102.

[0055] In an example where the charging device 100 is an integrated charging pile, referring to Figure 1, the power conversion device 105, the power distribution device 106, and multiple charging interfaces 107 can all be housed within the equipment cabinet 101. Each charging interface 107 can be electrically connected to a corresponding charging gun 102 via a cable 108. In an example where the charging device 100 includes a charging host 103 and at least one charging terminal 104, referring to Figure 2, the power conversion device 105 and the power distribution device 106 can be housed within the charging host 103, and the charging interfaces 107 can be housed within the terminal cabinet of the charging terminal 104. Each charging interface 107 is electrically connected to a corresponding charging gun 102 via a cable 108.

[0056] It should be noted that the charging devices 100 shown in Figures 1 and 2 are merely examples of two types of charging devices 100 provided in this application, and are not intended to limit the charging devices 100 of this application.

[0057] This application embodiment also provides a power distribution device 106, wherein the power distribution device 106 is used to distribute the input current into at least one path and output it. FIG3 exemplarily shows the overall structure of a power distribution device 106, and FIG4 exemplarily shows the disassembled structure of a power distribution device 106. Referring to FIG3 and FIG4, the power distribution device 106 includes a housing 7 and a circuit board 1. The circuit board 1 can be disposed inside the housing 7, and the circuit board 1 can be a printed circuit board (PCB).

[0058] The housing 7 can be any suitable structure. It can be a one-piece molded shell or a separate shell. For example, the power distribution device 106 includes a mounting base 71, a protective shell 72, and fasteners 73. The mounting base 71 and the protective shell 72 are secured to each other by fasteners 73 (e.g., screws, rivets, etc.). The circuit board 1 is fixed within the space enclosed by the mounting base 71 and the protective shell 72. The mounting base 71, the protective shell 72, and the fasteners 73 constitute at least part of the housing 7. The housing 7 protects the internal circuit board 1. In some other embodiments, the power distribution device 106 may not have a housing 7, meaning the circuit board 1 is exposed.

[0059] Referring to Figure 4, the power distribution device 106 further includes a plurality of electronic components 2, which may include at least one of relays, contactors, inductors, capacitors, and chips. All electronic components 2 are fixed on the circuit board 1. For example, all electronic components 2 are fixed on the same surface of the circuit board 1. In other examples, the multiple electronic components 2 may be fixed on different surfaces of the circuit board 1. The multiple electronic components 2 may include various different electronic components 2, or they may be multiple identical electronic components 2; this application does not impose specific limitations in this regard.

[0060] In addition, referring to FIG4, the power distribution device 106 also includes a frame 3 (similar to a ring structure), which is fixed on the circuit board 1. The material of the frame 3 can be selected as needed. For example, the frame 3 can be a rubber frame or a plastic frame. This application does not make specific limitations in this regard.

[0061] Referring to Figure 4, the plurality of electronic components 2 includes at least one electronic component 2 located inside the frame 3 (the frame 3 surrounds this portion of the electronic component 2), and at least two electronic components 2 located outside the frame 3. That is, at least one electronic component 2 among the plurality of electronic components 2 on the circuit board 1 is located inside the frame 3, and at least two electronic components 2 among the plurality of electronic components 2 on the circuit board 1 are located outside the frame 3. Alternatively, the frame 3 surrounds a portion of the electronic components 2 on the circuit board 1, and all electronic components 2 on the circuit board 1 except the electronic components 2 inside the frame 3 are located outside the frame 3.

[0062] For example, in the example shown in Figure 4, multiple electronic components 2 are provided both inside and outside the frame 3. In some other examples, one electronic component 2 is provided inside the frame 3, and multiple electronic components 2 are provided outside the frame 3.

[0063] Referring to Figure 4, the power distribution device 106 further includes an adhesive layer 4, which may be formed by injecting adhesive into the inner side of the frame 3 and allowing the adhesive to solidify. Figure 5 illustrates an exemplary structure of an adhesive layer 4. Referring to Figure 5, the adhesive layer 4 is located inside the frame 3 and fixed to the circuit board 1. At least one electronic component 2 located inside the frame 3 includes a device housing 21 (the internal structure of the device housing 21 is not shown in the figure) and pins 22 fixed to the device housing 21. The adhesive layer 4 covers the pins 22, specifically the portion of the pins 22 located on the side of the circuit board 1 facing the device housing 21.

[0064] In this case, pin 22 is located on the side of circuit board 1 facing device housing 21. There are two possibilities. In one case, referring to Figure 6 (an enlarged view of point A in Figure 5), pin 22 passes through circuit board 1, with a portion located on the side of circuit board 1 facing device housing 21 and the other portion located on the side of circuit board 1 away from device housing 21. In this case, the portion of pin 22 on the side of circuit board 1 facing device housing 21 refers to the portion within the dashed box K1 in Figure 6. The height of adhesive layer 4 can cover the portion of pin 22 within the dashed box K1 (that is, the portion of pin 22 on the side of circuit board 1 facing device housing 21). In this way, no metal conductor of electronic component 2 is exposed outside adhesive layer 4, thereby protecting electronic component 2 within the enclosure 3 and reducing the risk of short circuit or damage to circuit board 1 caused by condensation on circuit board 1. In the other case (not shown in the figures), pin 22 can be entirely located on the side of circuit board 1 facing device housing 21. In this case, the height of adhesive layer 4 can cover the entire pin 22.

[0065] Taking one of the electronic components 2 within the enclosure 3 as an example, referring to Figure 5 (and possibly Figure 6), the electronic component 2 can be electronic component 2a. Electronic component 2a includes a housing 21 and pins 22. The pins 22 are fixed to the surface of the housing 21 facing the circuit board 1. Electronic component 2a is electrically connected to the circuit board 1 through its own pins 22. The gap between the housing 21 of electronic component 2a and the circuit board 1 (the area indicated by arrow F1), that is, the gap between the surface of the housing 21 of electronic component 2a facing the circuit board 1 and the circuit board 1, is filled with adhesive layer 4. In other words, the part of the pins 22 located on the side of the circuit board 1 facing the housing 21 is covered by adhesive layer 4. In this way, no metal conductor of electronic component 2a is exposed outside the adhesive layer 4, thereby protecting the electronic component 2 within the enclosure 3 and reducing the risk of short circuit or damage to the circuit board 1 caused by condensation on the circuit board 1.

[0066] In addition, in some examples, there are some electronic components 2 with a lower height inside the enclosure 3, and these electronic components 2 (e.g., surface mount devices, surface mount devices, etc.) will be completely covered by the adhesive layer 4.

[0067] The power distribution device 106 also includes a partition 5. Figure 7 exemplarily shows the structure of a partition 5. For easy differentiation, the electronic components 2 in Figure 7 are filled with a grid-like shaded area. Referring to Figure 7, the partition 5 is fixed to the frame 3 and extends outward from the frame 3. The partition 5 can be long and narrow, or it can be bent or flexed. This application does not impose any specific limitations on this. The number of partition 5 can also be set as needed. For example, one partition 5 can be provided, or multiple partition 5 can be provided. Figure 7 shows the case where multiple partition 5 are provided.

[0068] In the example shown in Figure 7, the partition 5 is fixed to the frame 3. During the installation of the frame 3, the partition 5 can also be installed on the circuit board 1 together with the frame 3. In some other examples, the partition 5 is not connected to the frame 3, and the partition 5 is located on the outside of the circuit board 1. The partition 5 is installed on the circuit board 1 separately. For example, the frame 3 is installed on the circuit board 1 first, and then the partition 5 is installed on the circuit board 1. This design allows for more flexible and targeted installation of the partition 5.

[0069] At least two electronic components 2 located outside the frame 3 are distributed on different sides of the partition 5. In the example shown in Figure 7, there are multiple electronic components 2 outside the frame 3, and there may also be multiple partitions 5 on the frame 3, which separate the multiple electronic components 2 into multiple regions. For example, electronic components 2b and 2c are located on different sides of partition 5a, and electronic components 2d and 2e are located on the same side of partition 5b, and electronic components 2f and 2g are located on the same side of partition 5b.

[0070] In other examples, one side of a rib 5 may have an electronic component 2, and the other side of the rib 5 may have multiple electronic components 2.

[0071] In an example where multiple ribs 5 are provided, one electronic component 2 can be provided between two adjacent ribs 5, and multiple electronic components 2 can also be provided between two adjacent ribs 5. Alternatively, one electronic component 2 can be provided between any two ribs 5 in a plurality of (four or more) ribs 5, and multiple electronic components 2 can be provided between the other two ribs 5 in a plurality of ribs 5.

[0072] In some other examples, only one rib 5 may be fixed on the frame 3, and a portion of the multiple electronic components 2 outside the frame 3 may be located on one side of the rib 5, while another portion may be located on the other side of the rib 5.

[0073] In other words, the partition 5 on the frame 3 can separate at least two electronic components 2 located outside the frame 3. Fixing the partition 5 to the outside of the frame 3 and separating multiple electronic components 2 outside the frame 3 increases the creepage distance between multiple electronic components 2 outside the frame 3. It also plays a role in blocking and guiding condensation on the outside of the frame 3, reducing the risk of condensation on the outside of the frame 3 contacting multiple electronic components 2 and causing the circuit board 1 to malfunction.

[0074] Glue is applied to the inside of the frame 3 to form an adhesive layer 4. No glue is needed on the outside of the frame 3. By setting ribs 5, the electronic components 2 and the high-voltage network in the un-glued area are separated. This makes the glue application more targeted. Through the cooperation of ribs 5 and adhesive layer 4, the circuit board 1 can be well protected, reducing the risk of short circuit or damage to the circuit board 1 caused by condensation. It also reduces the amount of adhesive layer 4 used and lowers the production cost.

[0075] After the potting is completed and the adhesive layer 4 is formed, the frame 3 remains inside the power distribution device 106 and is fixed on the circuit board 1. The frame 3 can also serve as an insulator, strengthening the insulation performance between the electronic components 2 on the outside of the frame 3 and the electronic components 2 on the inside of the frame 3, further ensuring the normal operation of the circuit board 1.

[0076] Figure 7 shows only one arrangement of multiple electronic components 2, and Figure 8 shows an exemplary arrangement of multiple electronic components 2. In both Figure 7 and Figure 8, the electronic components 2 are filled with grid-like shadows. The electronic components 2 inside the frame 3 and the electronic components 2 outside the frame 3 can be any suitable electronic components 2. Furthermore, the electronic components 2 inside the frame 3 and the electronic components 2 outside the frame 3 can be arranged in any suitable manner, which will not be specified in this application.

[0077] In some examples, the electronic components 2 inside the frame 3 may include one or more switching devices 23 (e.g., relays, contactors, etc.) for controlling the on / off state of current. For example, in the example shown in Figure 7, all the electronic components 2 inside the frame 3 may be switching devices 23, which control the on / off state of current to achieve current distribution. Alternatively, the electronic components 2 inside the frame 3 may not have any switching devices 23. For example, in the example shown in Figure 8, none of the electronic components 2 inside the frame 3 are switching devices 23.

[0078] Furthermore, in the example shown in Figure 7, the circuit board 1 also has a through hole 11 for bolts to pass through. The bolts can pass through the through hole 11 and lock the circuit board 1 to other structures. For example, the power distribution device 105 also includes a busbar 109 (the busbar 109 can be further referenced to Figures 1 and 2), and the bolts can lock the circuit board 1 to the busbar 109 (e.g., a copper busbar). To facilitate the electrical connection between the circuit board 1 and the busbar 109, referring back to Figure 6, the power distribution device 106 may also include a metal sheet 8, which can be a copper busbar, copper foil, or aluminum busbar, etc. Multiple electronic components 2 are fixed on the same surface of the circuit board 1, and the metal sheet 8 is fixed on the surface of the circuit board 1 opposite to the multiple electronic components 2, and the metal sheet 8 is electrically connected to at least one electronic component 2. After the bolts lock the circuit board 1 and the busbar 109, the metal sheet 8 can contact the busbar 109 to realize the electrical connection between the busbar 109 and the corresponding electronic component 2. In the above example, the current on the busbar 109 and the metal sheet 8 will also flow through the bolts of the corresponding through holes 11. When there are multiple through holes 11 and bolts, a partition 5 can be set between two adjacent through holes 11. The creepage distance between two adjacent bolts is increased by the partition 5, which reduces the possibility of short circuit between two adjacent bolts.

[0079] In some examples, referring back to FIG1, the power conversion device 105 includes a plurality of power modules 1051, a busbar 109(a) is electrically connected to the output terminal of the power module 1051(a), and the busbar 109(a) is also electrically connected to the input terminal of the charging interface 107(a) corresponding to the power module 1051(a). The current output by the power module 1051(a) can be directly transmitted to the corresponding charging interface 107(a) through the busbar 109(a). When the charging interface 107(b) needs to draw current from the power module 1051(a), the current from the power module 1051(a) can be delivered through the busbar 109(a) to the metal piece 8 corresponding to the busbar 109(a), and then flow through the switching device 23 electrically connected to the metal piece 8. The switching device 23 distributes the current to the busbar 109(b), which is electrically connected to the charging interface 107(b). This achieves the allocation of the current from the power module 1051(a) to the charging interface 107(b).

[0080] In some other examples, referring to Figure 2, the output terminal of the power conversion device 105 is connected to busbar 109(c), and the input terminal of the charging interface 107 is connected to busbar 109(d). Busbar 109(c) and busbar 109(d) respectively contact different metal plates 8. That is, the busbar 109(c) connected to the output terminal of the power conversion device 105 is not directly connected to or in contact with the busbar 109(d) connected to the input terminal of the charging interface 107. The current output from the power conversion device 105 must pass through the power distribution device 106 before it can be delivered to the charging interface 107.

[0081] Referring again to Figures 5 and 6, in an example where the power distribution device 106 also includes a metal sheet 8, and referring to Figure 15, one or more metal sheets 8 may be provided (this application shows the case of multiple metal sheets 8), and the metal sheet 8 is fixed to the board surface of the circuit board 1 away from the multiple electronic components 2. For example, the metal sheet 8 can be fixed to the circuit board 1 by any suitable method such as pressing, bonding, or welding. This application does not impose specific limitations on the fixing method of the metal sheet 8 to the circuit board 1.

[0082] The metal sheet 8 is electrically connected to at least one of the multiple electronic components 2. For example, one metal sheet 8 is electrically connected to one electronic component 2; another example is that one metal sheet 8 is electrically connected to multiple electronic components 2; yet another example is that multiple metal sheets 8 are electrically connected to one electronic component 2; and yet another example is that multiple metal sheets 8 are correspondingly electrically connected to multiple electronic components 2. This application does not impose specific limitations in this regard. There are various ways in which the metal sheet 8 is electrically connected to the electronic component 2. In one example provided in this application, the pin 22 of the switching device 23 passes through the circuit board 1 and is connected to the metal sheet 8. The metal sheet 8 can be electrically connected to one or more switching devices 23 through corresponding pins 22.

[0083] Referring to Figures 7 and 8, the rib 5 can be elongated (e.g., rib 5a) or bent (e.g., rib 5c). The bent shape of the rib 5c can avoid the electronic components 2 outside the frame 3.

[0084] In some examples, the rib 5 can be pressed against the circuit board 1. For example, in an example where the power distribution device 106 also includes a mounting base 71, a protective shell 72, and a fastener 73, the rib 5 can be pressed against the circuit board 1 by the protective shell 72. Figure 9 illustrates an exemplary structure of the protective shell 72, wherein the mounting base 71 and the protective shell 72 are fixed by the fastener 73, the circuit board 1 is fixed within the space enclosed by the mounting base 71 and the protective shell 72, the frame 3 and the rib 5 are both located on the surface of the circuit board 1 facing the protective shell 72, and the protective shell 72 abuts against the rib 5.

[0085] For example, the protective shell 72 includes a shell portion 721 and a raised rib portion 722 (or a protruding portion). The raised rib portion 722 is fixed to the side of the shell portion 721 facing the circuit board 1. When the shell portion 721 covers the circuit board 1, the raised rib portion 722 abuts against the partition rib 5. The raised rib portion 722 can be integrally formed with the shell portion 721, or it can be fixed to the shell portion 721 by screws or rivets. Alternatively, the raised rib portion 722 can be glued to the shell portion 721. This application does not impose specific limitations on the fixing method of the raised rib portion 722 and the shell portion 721.

[0086] The circuit board 1 is installed between the mounting base 71 and the protective shell 72. After the protective shell 72 and the mounting base 71 are connected by the fastener 73, the protective shell 72 will abut against the partition 5, for example, by abutting the partition 5 through the protruding part 722, thereby pressing the partition 5 onto the circuit board 1, reducing the possibility of the partition 5 lifting or bending, so that the partition 5 can better play the role of increasing the creepage distance of the electronic components 2 on both sides, and reducing the risk of the partition 5 failing.

[0087] In addition, the protective shell 72 can also be inserted into the partition 5. For example, the partition 5 has a groove 51 on the side away from the circuit board 1. FIG10 shows an exemplary structure of the groove 51. The part of the protective shell 72 that abuts against the partition 5 extends into the groove 51. For example, the convex part 722 (or protruding part) of the protective shell 72 is inserted into the groove 51.

[0088] Since the protective shell 72 and the mounting base 71 are connected and fixed by fasteners 73, and the circuit board 1 is fixed between the protective shell 72 and the mounting base 71, the possibility of relative displacement between the protective shell 72, the circuit board 1, and the fasteners 73 is low. However, there is still a risk of relative displacement between the frame 3 and the circuit board 1. Therefore, when the protective shell 72 presses against the partition 5, the part of the protective shell 72 that abuts against the partition 5 extends into the groove 51 of the partition 5, thereby forming a fit and limiting. Through the insertion fit between the protective shell 72 and the groove 51, the possibility of the frame 3 loosening is reduced, and the frame 3 can be firmly attached to the circuit board 1, reducing the possibility of relative displacement between the frame 3 and the circuit board 1. In addition, the risk of bending or folding of the partition 5 can also be further reduced.

[0089] In some other examples, the groove 51 may not be provided on the rib 5. In such examples, the protective shell 72 does not need to be inserted into the rib 5. Figure 11 shows an exemplary protective shell 72 that can be applied to this example. In this example, the raised rib portion 722 (or protruding portion) of the protective shell 72 abuts against the rib 5, thereby pressing the rib 5 onto the circuit board 1.

[0090] In some examples, the surface of the partition 5 facing the circuit board 1 can be fixed to the circuit board 1 by adhesive bonding. That is, the frame 3 is installed on the circuit board 1, and the surface of the partition 5 is bonded to the surface of the circuit board 1. This further reduces the possibility of the partition 5 warping or bending during and after the potting process, and reduces the risk of relative displacement between the partition 5 and the circuit board 1, which is conducive to the smooth progress of the potting process. In addition, using a screwless and solderless method (adhesive bonding) to fix the partition 5 to the circuit board 1 is beneficial to manufacturing.

[0091] The bonding method between the partition 5 and the circuit board 1 can be varied. For example, the power distribution device 106 can also include a flexible adhesive strip 6. Figure 12 exemplarily shows the structure of an adhesive strip 6. The adhesive strip 6 can be any structure with adhesiveness and flexibility, such as foam adhesive, rubber strips with adhesive on both sides, etc. This application does not impose specific limitations on this. The flexible adhesive strip 6 can deform under force, and the surface of the partition 5 facing the circuit board 1 is bonded and fixed to the board surface of the circuit board 1 by the adhesive strip 6. In the case of dimensional errors or unevenness on the surface of the partition 5 facing the circuit board 1, the adhesive strip 6 can absorb the fit tolerance by deformation, so that the partition 5 can be stably bonded to the circuit board 1, which is also beneficial to the installation and fixation of the frame 3.

[0092] In addition, the surface of the frame 3 facing the circuit board 1 and the circuit board 1 can also be fixed by adhesive bonding. For example, the surface of the frame 3 and the board surface of the circuit board 1 can be bonded together by adhesive layer. During the potting process, the adhesive layer can reduce the possibility of relative displacement between the frame 3 and the circuit board 1, and also play a sealing role, reducing the risk of glue leakage from the frame 3 and the circuit board 1 to the outside, which is conducive to the smooth progress of the potting process.

[0093] Regarding the installation method of the enclosure 3, Figure 13 exemplarily illustrates the structure of the enclosure 3. Referring to Figure 13, the enclosure 3 includes a fixed surrounding frame 31 and positioning posts 32. For example, the positioning posts 32 are integrally formed with the surrounding frame 31. The surrounding frame 31 surrounds at least one of the multiple electronic components 2, that is, the electronic components 2 located inside the enclosure 3 are also located inside the surrounding frame 31. The positioning posts 32 are fixed on the surrounding frame 31. The circuit board 1 has positioning holes 12, and the positioning posts 32 are inserted into the positioning holes 12. The cooperation between the positioning posts 32 and the positioning holes 12 can play a positioning role, which facilitates the installation of the enclosure 3 on the circuit board 1.

[0094] In the example shown in Figure 13, to make the installation position of the frame 3 more accurate, multiple positioning posts 32 can be provided (e.g., two). In some other examples, only one positioning post 32 can be provided. This application does not impose a specific limitation on the number of positioning posts 32. In the example where multiple positioning posts 32 are provided, the number of positioning holes 12 is the same as the number of positioning posts 32, wherein each positioning post 32 can be inserted into the corresponding positioning hole 12.

[0095] In some examples, the enclosure 3 may also include one or more barrier plates 33 fixed to the surrounding frame 31. For example, the surrounding frame 31 and the barrier plate 33 are integrally formed. Figure 14 illustrates an exemplary structure of the barrier plate 33. Referring to Figures 13 and 14, the barrier plate 33 protrudes from the surrounding frame 31 toward the inside of the surrounding frame 31. There is a gap between the barrier plate 33 and the circuit board 1, and the adhesive injected into the surrounding frame 31 can fill this gap. That is, after the enclosure 3 is installed on the circuit board 1, during the process of injecting adhesive into the inside of the enclosure 3, the surrounding frame 31 acts as an external constraint on the adhesive, confining the adhesive within the area enclosed by the surrounding frame 31. The barrier plate 33 limits the height of the adhesive, and the adhesive is injected and filled in the gap between the barrier plate 33 and the circuit board 1 (the adhesive may also slightly exceed the barrier plate 33). By hindering the adhesive, the barrier plate 33 reduces the possibility of the adhesive overflowing from the top of the surrounding frame 31.

[0096] Referring to Figures 13 and 14, multiple barrier plates 33 can be provided. Some barrier plates 33 protrude a shorter distance towards the inside of the surrounding frame 31, such as barrier plate 33a, while others protrude a longer distance towards the inside of the surrounding frame 31, such as barrier plate 33b. The barrier plates 33 with shorter protrusion distances can avoid some devices disposed on the circuit board 1 and located inside the surrounding frame 31. In other examples, the multiple barrier plates 33 may protrude to the inside of the surrounding frame 31 by the same distance.

[0097] When multiple barrier plates 33 are provided, they can be placed at the required positions around the frame 31 as needed. In some other examples, only one barrier plate 33 may be provided. In some other examples, the barrier plate 33 may be in a ring shape.

[0098] Furthermore, the position of the barrier plate 33 on the surrounding frame 31 can be set according to the required adhesive layer 4 thickness. For example, in one example provided in this application, referring to Figures 13 and 14, each barrier plate 33 is disposed on the side of the surrounding frame 31 opposite to the circuit board 1. In some other examples, the barrier plate 33 may also be disposed in the central region of the surrounding frame 31.

[0099] The distance between the barrier plate 33 and the circuit board 1 needs to be greater than the distance between the device housing 21 of at least one electronic component 2 located inside the surrounding frame 31 and the circuit board 1, so that the adhesive layer between the barrier plate 33 and the circuit board 1 can cover the pins 22 on the device housing 21. For example, FIG15 exemplarily shows the height of the frame 3. Referring to FIG15, L1 is the distance between the device housing 21 of the electronic component 2 and the circuit board 1, that is, the distance between the surface of the device housing 21 facing the circuit board 1 and the circuit board 1. L2 is the distance between the barrier plate 33 and the circuit board 1, that is, the distance between the surface of the barrier plate 33 facing the circuit board 1 and the circuit board 1. Wherein, the dimension of L2 is greater than the dimension of L1.

[0100] The overall height of the enclosure 3 can also be set as needed. For example, the height of the enclosure 3 can be designed according to the required height of the adhesive layer 4. Referring to Figure 15, when the electronic component 2 inside the enclosure 3 includes a switch device 23, the pin 22 of the switch device 23 can be fixed to the surface of the device housing 21 facing the circuit board 1. In the thickness direction of the circuit board 1, the distance (L1) between the surface of the device housing 21 of the switch device 23 facing the circuit board 1 and the circuit board 1 is less than the height (L3) of the enclosure 3, and the height (L4) of the device housing 21 of the switch device 23 is greater than the height (L3) of the enclosure 3. The height (L4) of the device housing 21 of the switch device 23 refers to the distance between the surface of the device housing 21 facing away from the circuit board 1 and the surface of the circuit board 1.

[0101] Since the height (L3) of the frame 3 is higher than the distance (L1) between the bottom surface of the device housing 21 of the switch device 23 and the circuit board 1, the adhesive layer 4 formed after the injected adhesive solidifies will cover the pins 22 of the switch device 23. After the adhesive is injected, the pins 22 will not be exposed outside the adhesive layer 4, which protects the electrical connection position between the switch device 23 and the circuit board 1 and reduces the possibility of condensation on the circuit board 1 wetting the pins 22 of the switch device 23 and causing a short circuit.

[0102] Furthermore, since the height (L3) of the frame 3 is lower than the height (L4) of the device shell 21 of the switching device 23, after the glue is poured into the frame 3, the glue layer 4 will not cover the entire device shell 21 of the switching device 23, thus reducing the height of the glue layer 4. This effectively protects the circuit board 1, reduces the impact of the glue layer 4 on the heat dissipation of the switching device 23, reduces the amount of glue layer 4 used and the material required for the frame 3, saves production costs, and reduces the weight of the circuit board 1 and the power distribution device 106.

[0103] In one example where the power distribution device 106 includes the metal sheet 8, the power distribution device 106 may further include a structure for protecting the metal sheet 8. For example, the power distribution device 106 may also include a base frame 9. Figure 16 exemplarily shows the structure of a base frame 9. Referring to Figure 16, the base frame 9 covers the metal sheet 8 and forms a potting space 91 with the circuit board 1. For example, the base frame 9 includes a fixed surrounding plate 92 and a base plate 93, wherein the surrounding plate 92 and the base plate 93 can be integrally formed. The surrounding plate 92 surrounds the outer periphery of the plurality of metal sheets 8, and the base plate 93 is located on the side of the surrounding plate 92 away from the circuit board 1. A potting space 91 is provided between the base plate 93 and the circuit board 1.

[0104] The circuit board 1 has a potting hole 13 communicating with the potting space 91. That is, glue can be poured into the potting space 91 through the potting hole 13. After the glue solidifies, another glue layer is formed inside the bottom frame 9 (located on a different side of the circuit board 1 from the glue layer 4 inside the surrounding frame 3). The glue layer 4 inside the bottom frame 9 can protect the metal sheet 8. Furthermore, after potting, the bottom frame 9 can remain inside the power distribution device 106, forming a protective structure to prevent the circuit board 1 from being bumped or damaged during installation or transportation. Moreover, the bottom frame 9 fixed to the circuit board 1 also provides good insulation, reducing the required insulation distance between the external structure and the circuit board 1. In some other examples, the bottom frame 9 can be removed after potting.

[0105] Referring to Figure 16, the potting hole 13 is located inside the frame 3. During the potting process, the glue can be injected into the potting space 91 inside the bottom frame 9 through the potting hole 13. After the glue in the potting space 91 is filled, the glue will overflow from the potting hole 13 and then the space enclosed by the frame 3 will be filled with glue. After the frame 3 is filled with glue and solidifies, a glue layer 4 will be formed (refer to Figure 11 for the glue layer 4). The glue layer 4 inside the frame 3 will cover the circuit board 1 inside the frame 3 and fill the gap between some electronic components 2 and the circuit board 1, thus protecting the electrical connection position of the electronic components 2 inside the frame 3.

[0106] In an example where the frame 3 has an injection hole 13 inside, referring to Figure 16, the frame 3 may have an outwardly protruding arc-shaped segment 34 to surround the injection hole 13 inside the frame 3. For example, if the frame 3 includes a surrounding frame 31 (refer to Figure 14 for an auxiliary view of the surrounding frame 31), the arc-shaped segment 34 may be formed on the surrounding frame 31 and become part of the surrounding frame 31. In this example, the frame 3 is an irregularly shaped frame, and its structure is designed according to installation and fitting requirements. In some other examples, the frame 3 may also be a rectangular frame or a circular frame, and the injection hole 13 can still be surrounded inside the frame 3. In this example, the frame 3 does not have a prominent arc-shaped segment 34.

[0107] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power distribution device for distributing an input current into at least one output path, characterized in that, The power distribution device includes a circuit board and multiple electronic components, the multiple electronic components being fixed on the circuit board. The power distribution device also includes: The frame is fixed to the circuit board, and the plurality of electronic components include at least one electronic component located inside the frame and at least two electronic components located outside the frame. An adhesive layer is located within the frame and fixed to the circuit board. The at least one electronic component located inside the frame includes a device housing and pins fixed to the device housing. The pins are electrically connected to the circuit board, and the adhesive layer covers the pins. A partition bar is located outside the enclosure frame and is fixed to the enclosure frame or to the circuit board. The at least two electronic components located outside the enclosure frame are distributed on different sides of the partition bar.

2. The power distribution device according to claim 1, characterized in that, The partition rib is fixed to the frame and extends outward from the frame. The partition rib is bonded and fixed to the surface of the circuit board.

3. The power distribution device according to claim 1, characterized in that, The power distribution device also includes a flexible adhesive strip, and the surface of the rib facing the circuit board is bonded and fixed to the surface of the circuit board by the adhesive strip.

4. The power distribution device according to claim 1, characterized in that, The power distribution device further includes a mounting base, a protective shell, and fasteners. The mounting base and the protective shell are fixed by the fasteners. The circuit board is located within the space enclosed by the mounting base and the protective shell. The circuit board is fixed on the mounting base or on the protective shell. The frame and the partition are both located on the surface of the circuit board facing the protective shell. The protective shell abuts against the partition.

5. The power distribution device according to claim 4, characterized in that, The rib has a groove on the side opposite to the circuit board, and the protective shell extends into the groove to abut against the rib.

6. The power distribution device according to claim 1, characterized in that, The enclosure includes a surrounding frame and a positioning post. The surrounding frame surrounds at least one of the plurality of electronic components. The positioning post is fixed to the surrounding frame. The circuit board has a positioning hole, and the positioning post is inserted into the positioning hole.

7. The power distribution device according to claim 6, characterized in that, The enclosure also includes a barrier plate fixed to the surrounding frame, the barrier plate protruding toward the inside of the surrounding frame, and the distance between the barrier plate and the circuit board is greater than the distance between at least one device housing located inside the surrounding frame and the circuit board.

8. The power distribution device according to claim 1, characterized in that, The at least one electronic component located inside the frame includes a switching device for controlling on / off states. The switching device includes the device housing and the pins. In the thickness direction of the circuit board, the height of the device housing of the switching device is greater than the height of the frame.

9. The power distribution device according to any one of claims 1-8, characterized in that, The power distribution device further includes a metal sheet and a base frame. The plurality of electronic components are fixed on the same surface of the circuit board. The metal sheet is fixed on the surface of the circuit board opposite to the plurality of electronic components. The metal sheet is electrically connected to at least one of the plurality of electronic components. The base frame covers the metal sheet and forms a potting space with the circuit board. The circuit board has a potting hole communicating with the potting space. The potting hole is located inside the frame.

10. A charging device, characterized in that, The device includes a power conversion device, a plurality of charging interfaces, and a power distribution device as described in any one of claims 1-9, wherein the power distribution device is electrically connected to the power conversion device and the plurality of charging interfaces, and the power distribution device is used to distribute the DC power output by the power conversion device to at least one of the charging interfaces.

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