Electronic device

Abstract

The present application relates to the technical field of heat dissipation, and in particular relates to an electronic device. The electronic device comprises a rear cover, a middle frame, an air duct support, a fan, and a first heat sink, wherein the air duct support is mounted on the middle frame, the middle frame is connected to the rear cover, and an air duct space allowing flow-through of air is formed between the rear cover and the air duct support, the electronic device being provided with a first air inlet in communication with the air duct space; the fan and the first heat sink are both located in the air duct space, and the fan is mounted on the rear cover or a decorative member on the rear cover, the fan being provided with a second air inlet; and the first heat sink is located on the side of the fan close to the first air inlet, and the fan can draw air that has passed through the first heat sink into the second air inlet. The first heat sink has a first end and a second end that are disposed opposite each other, the first air inlet being disposed close to the first end, and the second air inlet being disposed close to the second end, such that the flow path of air flowing from the first air inlet to the second air inlet is extended, improving the heat-exchanging efficiency of the first heat sink, and thereby improving the heat dissipation efficiency of the electronic device.

Description

An electronic device

[0001] This application claims priority to Chinese patent application filed on November 27, 2024, with application number 202411731457X and entitled "An Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heat dissipation technology, and more particularly to an electronic device. Background Technology

[0003] The heat dissipation solutions for mobile terminals are mainly passive, with the heat generated by the chip being transferred to the casing through various internal structural components and ultimately to the external environment. However, with the continuous development of mobile terminal technology, the power consumption of terminal devices is constantly increasing, causing passive heat dissipation designs to be unable to meet design requirements.

[0004] In recent years, active cooling has been increasingly adopted in mobile terminals. The main principle is to draw air from the environment through a fan, and the air exchanges heat with the heat sink fins and other structural components inside the device, raising its temperature before being expelled from the device, thereby improving the heat dissipation capacity of the mobile terminal.

[0005] However, for actual mobile terminal devices, in order to achieve compact component arrangement for miniaturization and an aesthetically pleasing appearance, the airflow space used to house fans and heat sink fins is often irregular. Irregular airflow space may result in less airflow passing through the heat sink fins, affecting heat dissipation efficiency.

[0006] Application content

[0007] This application provides an electronic device designed to improve the heat dissipation efficiency of electronic devices with irregular airflow spaces.

[0008] This application provides an electronic device, the electronic device comprising:

[0009] Back cover;

[0010] The middle frame is connected to the rear cover;

[0011] A duct support is installed on the middle frame, and there is a duct space between the rear cover and the duct support that allows air to flow. The electronic device is provided with a first air inlet that communicates with the duct space.

[0012] A fan located in the air duct space, the fan having a second air inlet;

[0013] The first heat sink is located in the air duct space and is located on the side of the fan near the first air inlet. The fan can draw air passing through the first heat sink into the second air inlet. Along the thickness direction of the electronic device, the first heat sink has a first end and a second end that are disposed opposite to each other. The first air inlet is disposed near the first end, and the second air inlet is disposed near the second end.

[0014] In this embodiment, the first heat sink can exchange heat with the heat-generating device, and the fan can exhaust the heat from the first heat sink from the electronic device, enabling the entire electronic device to achieve rapid air circulation. By accelerating the airflow, the heat around the first heat sink is removed, thereby accelerating the heat dissipation speed of the electronic device.

[0015] In essence, this embodiment of the application places the first air inlet near the first end of the first heat sink and the second air inlet near the second end of the first heat sink, resulting in a significant height difference between the first and second air inlets along the thickness direction of the electronic device. This extends the airflow path from the first air inlet to the second air inlet. As air flows from the first air inlet to the second air inlet, airflow occurs over most or even the entire area of ​​the first heat sink, improving the heat exchange efficiency of the first heat sink and thus enhancing the heat dissipation efficiency of the electronic device.

[0016] In one possible design, the second air inlet is positioned towards the mid-frame along the thickness direction of the electronic device, and there is an airflow space between the second air inlet and the mid-frame.

[0017] In this embodiment, by setting the second air inlet of the fan to face the middle frame, the second air inlet is made closer to the second end of the first heat sink, thereby increasing the height difference between the first air inlet and the second air inlet along the thickness direction of the electronic device, and further extending the flow path of air from the first air inlet to the second air inlet.

[0018] In one possible design, the electronic device further includes a heat-generating device mounted on the mid-frame;

[0019] Along the thickness direction of the electronic device, there is a gap between the fan and the heat-generating device.

[0020] In this embodiment, by placing the fan away from the heat-generating device, the operating temperature of the fan is reduced, thereby improving the fan's reliability and service life.

[0021] In one possible design, the fan is mounted on the rear cover; or,

[0022] The electronic device further includes a decorative element mounted on the rear cover, and the fan is mounted on the decorative element; or,

[0023] The electronic device also includes a bracket, which is mounted on the back cover, the middle frame, or the decorative piece, and the fan is mounted on the bracket.

[0024] In this embodiment, by mounting the fan on the back cover, decorative piece, or bracket, a certain distance is maintained between the fan and the heat-generating device. Compared to mounting the fan on the mid-frame, this keeps the fan away from the heat-generating device, thereby reducing the fan's operating temperature.

[0025] In one possible design, the first air inlet is located in the middle frame and is positioned close to the back cover along the thickness direction of the electronic device;

[0026] The first air inlet is positioned close to the first heat sink.

[0027] In this embodiment, the first air inlet and the first air outlet can be located on the middle frame near the back cover, and are distributed on both sides of the middle frame along the length or width of the electronic device. Furthermore, the first air inlet is positioned close to the first heat sink, allowing airflow into the first air inlet to directly reach the first heat sink.

[0028] In one possible design, the first air inlet is located on the rear cover and is positioned close to the first heat sink.

[0029] In this embodiment, the first air inlet is positioned close to the first heat sink, so that the space entering the first air inlet can flow directly to the first heat sink.

[0030] In one possible design, the first air inlet is located on the decorative element and is positioned close to the first heat sink.

[0031] In this embodiment, the first air inlet is positioned close to the first heat sink, so that the space entering the first air inlet can flow directly to the first heat sink.

[0032] In one possible design, the first air inlet is located on the air duct bracket and is positioned close to the first heat sink.

[0033] In this embodiment, the first air inlet can be opened on one side of the air duct bracket along the length or width of the electronic device, and the first air inlet is located close to the first heat sink, so that the space entering the first air inlet can flow directly to the first heat sink.

[0034] In one possible design, the electronic device further includes a second heat sink disposed in the air duct space;

[0035] Along the thickness direction of the electronic device, the second heat sink is located at the gap between the fan and the heat-generating device, and the fan can draw air passing through the first heat sink and the second heat sink into the second air inlet.

[0036] In this embodiment, based on the first heat sink upstream of the fan, a second heat sink is provided at the interval between the fan and the heat-generating device along the thickness direction of the electronic device, thereby improving the utilization rate of the air duct space, increasing the heat dissipation area in the air duct space, and thus improving the heat dissipation capacity of the electronic device.

[0037] In one possible design, the fan also has a second air outlet;

[0038] The electronic device also includes a third heat sink disposed in the air duct space. The third heat sink is disposed close to the second air outlet, and the air blown out by the fan through the second air outlet can be directed toward the third heat sink.

[0039] In this embodiment, a first heat sink is provided upstream of the fan and a third heat sink is provided downstream of the fan. A combination of exhaust and blowing is used to dissipate heat from the electronic device, maximizing the use of the air duct space and increasing the heat dissipation area within the air duct space, thereby improving the heat dissipation capacity of the electronic device.

[0040] In one possible design, the electronic device includes a first air outlet connected to the air duct space for discharging air from the air duct space to the external environment.

[0041] The first air outlet is located in the middle frame; or,

[0042] The first air outlet is located on the rear cover; or,

[0043] The electronic device further includes a decorative element, which is mounted on the rear cover, and the first air outlet is formed in the decorative element; or...

[0044] The first air outlet is located on the air duct support.

[0045] In this embodiment, the first air outlet can be located on the same component as the first air inlet, such as both the first air inlet and the first air outlet being located on the middle frame. Alternatively, the first air outlet can be located on different components than the first air inlet, such as the first air inlet being located on the back cover and the first air outlet being located on the middle frame.

[0046] In one possible design, the electronic device further includes a baffle disposed in the air duct space, the baffle being able to prevent air from flowing directly to the first air outlet without passing through the fan.

[0047] In this embodiment of the application, by setting the blocking member, air is prevented from flowing directly to the first air outlet along the air duct space, so that most of the air can enter the second air inlet of the fan. Attached Figure Description

[0048] Figure 1 is a schematic diagram of an electronic device in one embodiment;

[0049] Figure 2 is a cross-sectional schematic diagram of a portion of the structure of an electronic device in one embodiment;

[0050] Figure 3 is a schematic diagram of the air duct space in Figure 2;

[0051] Figure 4 is a cross-sectional schematic diagram of a portion of the electronic device in another embodiment;

[0052] Figure 5 is a schematic diagram of the air duct space in another embodiment;

[0053] Figure 6 is a schematic diagram of the air duct space in another embodiment;

[0054] Figure 7 is a schematic diagram of a portion of the structure of the electronic device provided in this application in one embodiment;

[0055] Figure 8 is a schematic diagram of the air duct space in another embodiment;

[0056] Figure 9 is a schematic diagram of a portion of the structure of the electronic device provided in this application in another embodiment;

[0057] Figure 10 is a schematic diagram of a portion of the structure of the electronic device provided in this application in another embodiment;

[0058] Figure 11 is a schematic diagram of the air duct space in another embodiment;

[0059] Figure 12 is a schematic diagram of a portion of the structure of the electronic device provided in this application in another embodiment.

[0060] Reference numerals: 1-Electronic device; 1a-Air duct space; 11-Back cover; 12-Middle frame; 12a-Air duct bracket; 121-First air inlet; 122-First air outlet; 13-Display screen; 14-Fan; 141-Second air inlet; 142-Second air outlet; 15-First heat sink; 151-First end; 152-Second end; 16-Heat-generating device; 17-Blocking component; 18-Second heat sink; 19-Third heat sink; Z-Thickness direction; Y-Length direction; X-Width direction; S-Flow direction. Detailed Implementation

[0061] As the functionality of electronic devices improves, the heat generated by their components also increases. Currently, the primary method of heat dissipation for electronic devices is passive cooling, where the generated heat is transferred to the outer casing through various internal structural components and ultimately to the external environment. Due to considerations for human tactile comfort, the temperature of the outer casing is limited. Furthermore, to meet the needs of hand grip and portability, the size of electronic devices is often restricted. Therefore, the overall power consumption of electronic devices based on natural heat dissipation is also limited to a certain value.

[0062] However, with the continuous development of terminal chip technology, large-scale games and 5G services, the power consumption of electronic devices is constantly increasing, causing passive heat dissipation design to be unable to meet design requirements.

[0063] In some embodiments, heat dissipation can be achieved through active cooling methods for heat-generating components inside electronic devices, including but not limited to mobile phones, tablets, or e-readers. The following description uses a mobile phone as an example.

[0064] The main principle of active cooling is to draw air from the environment using a fan. This air exchanges heat with the heat sink and other structural components inside the electronic device, and the increased air temperature is then expelled from the device, thus improving its heat dissipation capacity. The relevant internal structures of the electronic device will be described in detail below with reference to the accompanying drawings.

[0065] Figure 1 shows a schematic diagram of an electronic device, with X, Y, and Z directions. The electronic device can be a cuboid structure, and the X, Y, and Z directions in the figure represent the width, length, and thickness directions relative to the electronic device.

[0066] Please refer to Figure 1. The electronic device 1 includes a back cover 11, a middle frame 12, and a display screen 13. Along the thickness direction Z of the electronic device 1, the back cover 11 is connected to one side of the middle frame 12, and the display screen 13 is connected to the other side of the middle frame 12. The back cover 11 has high rigidity, is not easily damaged by external forces, has good wear resistance, and can effectively protect the internal components of the electronic device. It can also better resist external environmental factors such as water, oil, and dust. The middle frame 12 is the frame of the electronic device, supporting various internal components such as the battery, motherboard, ribbon cables, and sensors. The middle frame 12 also protects the internal components of the electronic device from external impacts and damage. The display screen 13 is used to display images, text, and other information. The display screen 13 can be a liquid crystal display (LCD), an OLED (Organic Light-Emitting Diode) display, or other display-enabled devices.

[0067] Figure 2 shows a cross-sectional view of part of the structure of electronic device 1 in one embodiment. Electronic device 1 includes a display screen 13, a middle frame 12, an air duct bracket 12a, a back cover 11, a fan 14, a first heat sink 15, and a heat-generating device 16. Along the thickness direction Z of electronic device 1, the display screen 13 is mounted on one side of the middle frame 12, and the back cover 11 is connected to the other side of the middle frame 12, forming an accommodating space (not shown in the figure). The air duct bracket 12a is disposed in the accommodating space and is mounted on the side of the middle frame 12 facing the back cover 11. The fan 14 and the first heat sink 15 are disposed on the air duct bracket 12a along the length direction Y or the width direction X of electronic device 1, and the heat-generating device 16 is mounted in the clearance space of the middle frame 12 (not shown in the figure).

[0068] It should be noted that the heat-generating device 16 can be a component in the electronic device 1 that generates heat, such as a CPU (Central Processing Unit), GPU (graphics processing unit), battery, and power management module, etc., but this embodiment does not limit it.

[0069] It should be noted that the first heat sink 15 refers to a plurality of heat sink fins arranged in sequence, with gaps between adjacent heat sink fins to allow airflow.

[0070] Along the length Y or width X of the electronic device 1, the cross-section of the air duct support 12a is U-shaped. An air duct space 1a, allowing air to pass through, exists between the air duct support 12a and the rear cover 11. The fan 14 and the first heat sink 15 are both located within the air duct space 1a. The first heat sink 15 is positioned close to the heat-generating device 16, enabling heat exchange between them. The fan 14 blows the heat from the first heat sink 15 out of the electronic device 1, achieving rapid air circulation throughout the electronic device 1. This accelerated airflow removes heat from around the first heat sink 15, thus accelerating the heat dissipation speed of the electronic device 1.

[0071] It should be noted that, along the thickness direction Z of the electronic device 1, the heat-generating device 16 can be positioned opposite to the air duct support 12a, and the heat generated by the heat-generating device 16 can be transferred to the first heat sink 15 on the air duct support 12a via the air duct support 12a. Alternatively, along the thickness direction Z of the electronic device 1, the heat-generating device 16 can be offset from the air duct support 12a and positioned close to the air duct support 12a, so that the first heat sink 15 on the air duct support 12a can be positioned close to the heat-generating device 16, so that the heat generated by the heat-generating device 16 can be transferred to the first heat sink 15.

[0072] It should also be noted that the airflow space 1a refers to the space where the fan 14, heat sink 15, etc., are placed, and this space allows airflow so that the air can carry away the heat from the heat sink. The middle frame 12 is generally a component with a hollow structure to accommodate the various internal components of the electronic device 1. Therefore, an airflow support 12a is provided on the middle frame 12 to form an airflow space 1a that allows for regular airflow, thus preventing air from flowing into the hollow parts of the middle frame 12 and affecting the heat dissipation effect. If the area of ​​the middle frame 12 corresponding to the formed airflow space 1a does not have a hollow structure, the airflow support 12a can be omitted. The specific design can be determined according to the actual situation, and this embodiment does not impose any limitations on it.

[0073] Specifically, please continue referring to Figure 2. The back cover 11 is provided with a first air inlet 121 and a first air outlet 122. Both the first air inlet 121 and the first air outlet 122 are connected to the air duct space 1a, so that the air from the external environment can enter the air duct space 1a through the first air inlet 121 and carry the heat in the air duct space 1a out through the first air outlet 122. The first air inlet 121 and the first air outlet 122 are distributed relatively on both sides of the middle frame 12 along the length direction Y or the width direction X of the electronic device 1, and both the first air inlet 121 and the first air outlet 122 are located close to the back cover 11.

[0074] The fan 14 is provided with a second air inlet 141 and a second air outlet 142. Along the thickness direction Z of the electronic device 1, the second air inlet 141 is positioned towards the rear cover 11, and there is a flow space between the second air inlet 141 and the rear cover 11. The second air outlet 142 is positioned towards the first heat sink 15, and the first heat sink 15 is located between the second air outlet 142 and the first air outlet 142.

[0075] Specifically, in Figure 2, the curve represents the airflow direction S. Air can enter the air duct space 1a through the first air inlet 121, and then enter the fan 14 through the second air inlet 141. The fan 14 blows the air out from the second air outlet 142 at a high flow rate towards the first heat sink 15. The air flows within the air duct space 1a and exchanges heat with the first heat sink 15 or other components, finally being discharged from the first air outlet 122, thus achieving heat dissipation for the electronic device 1.

[0076] Further, referring to Figure 2, the electronic device 1 also includes a blocking member 17, which is disposed in the air duct space 1a. Along the thickness direction Z of the electronic device 1, one end of the blocking member 17 is connected to the rear cover 11, and the other end is connected to the fan 14. Along the airflow direction S, the blocking member 17 is disposed behind the second air inlet 141 and in front of the first heat sink 15. By setting this blocking member 17, air is prevented from flowing directly along the air duct space 1a to the first air outlet 122, so that most of the air can enter the second air inlet 141 of the fan 14, thereby accelerating the airflow speed and blowing it towards the first heat sink 15, increasing the airflow speed and improving the heat dissipation efficiency.

[0077] The blocking component 17 can be made of materials such as foam or plastic. The specific material can be set according to the actual situation, and this embodiment does not limit it.

[0078] Figure 3 shows a schematic diagram of the air duct space 1a in Figure 2. The air duct space 1a is relatively regular. The fan 14 is arranged on one side of the air duct space 1a, and the first heat sink 15 is located downstream of the fan 14 along the air flow direction S, so as to optimize the heat dissipation capacity of the first heat sink 15.

[0079] Figure 4 shows a cross-sectional view of part of the structure of electronic device 1 in another embodiment. The embodiment shown in Figure 4 differs from the embodiment shown in Figure 2 in that a second heat sink 18 is added. Along the airflow direction S, the first heat sink 15 is located upstream of the fan 14, and the second heat sink 18 is located downstream of the fan 14. The remaining details can be found in the embodiment shown in Figure 2, and will not be repeated here. This embodiment improves the heat dissipation capacity of electronic device 1 by adding the second heat sink 18, thereby increasing the heat dissipation area.

[0080] Compared to a regular airflow space 1a, an irregular airflow space 1a generally presents two fan 14 arrangement scenarios. The first scenario is illustrated in Figure 5, a schematic diagram of one embodiment of the airflow space 1a. The airflow space 1a is irregularly shaped or curved, with the fan 14 located in the middle region. There is space upstream and downstream of the fan 14 for arranging heat sinks. Specifically, along the airflow direction S, the first heat sink 15 is located downstream of the fan 14, and the second heat sink 18 is located upstream of the fan 14. The second scenario is illustrated in Figure 6, a schematic diagram of another embodiment of the airflow space 1a. The airflow space 1a is curved, with the fan 14 located on one side of the airflow. Specifically, along the airflow direction S, the first heat sink 15 is located downstream of the fan 14.

[0081] In the first scenario, referring to Figures 4 and 5, a second heat sink 18 is arranged upstream of the fan 14 along the airflow direction S. Since the first air inlet 121 is located close to the rear cover 11, and the second air inlet 141 faces the rear cover 11, the height difference between the first air inlet 121 and the second air inlet 141 is small along the thickness direction Z of the electronic device 1. Air flows along the shortest path between the first air inlet 121 and the second air inlet 141, resulting in almost no airflow to the second heat sink fins below the height of the second air inlet 141, thus leading to low heat exchange efficiency of the second heat sink 18.

[0082] For the second case, please refer to Figures 2 and 6. Due to the irregularity of the air duct space 1a, the air outlet direction of the second air outlet 142 of the fan 14 is different from the arrangement direction of the first heat sink 15, which causes the air to flow poorly on the first heat sink 15, which can easily cause vibration and abnormal noise.

[0083] The electronic device 1 provided in this embodiment can solve the above-mentioned technical problems.

[0084] Figure 7 shows a cross-sectional view of part of the structure of electronic device 1 in another embodiment. Electronic device 1 includes a display screen 13, a middle frame 12, an air duct bracket 12a, a back cover 11, a fan 14, a first heat sink 15, and a heat-generating device 16. Along the thickness direction Z of electronic device 1, the display screen 13 is mounted on one side of the middle frame 12, and the back cover 11 is connected to the other side of the middle frame 12, forming an accommodating space (not shown in the figure). The air duct bracket 12a is disposed in the accommodating space and is mounted on the side of the middle frame 12 facing the back cover 11. The fan 14 and the first heat sink 15 are disposed in the accommodating space along the width direction X or the length direction Y of electronic device 1, and the heat-generating device 16 is mounted in the clearance space of the middle frame 12 (not shown in the figure).

[0085] Along the length Y or width X of the electronic device 1, the cross-section of the air duct support 12a is U-shaped. There is an air duct space 1a between the air duct support 12a and the rear cover 11, allowing air to pass through. The fan 14 and the first heat sink 15 are both located in the air duct space 1a. The first heat sink 15 can exchange heat with the heat-generating device 16, and the fan 14 can expel the heat from the first heat sink 15 from the electronic device 1, enabling rapid air circulation throughout the electronic device 1. By accelerating airflow, the heat around the first heat sink 15 is carried away, thus accelerating the heat dissipation speed of the electronic device 1.

[0086] Specifically, referring to Figure 7, the electronic device 1 has a first air inlet 121 and a first air outlet 122. Both the first air inlet 121 and the first air outlet 122 are connected to the air duct space 1a, allowing air from the external environment to enter the air duct space 1a through the first air inlet 121 and carrying away the heat in the air duct space 1a through the first air outlet 122. A first heat sink 15 is disposed on the side of the fan 14 near the first air inlet 121, i.e., along the airflow direction S. The first heat sink 15 is located upstream of the fan 14, and the fan 14 can draw air passing through the first heat sink 15 and discharge it to the first air outlet 122, thereby accelerating the airflow speed in the area of ​​the first heat sink 15.

[0087] Since the air duct space 1a is irregular, this embodiment places the first heat sink 15 upstream of the fan 14, so that the fan 14 accelerates the air flow by using a suction method, thereby achieving a more uniform flow field and lower noise. Compared with placing the first heat sink 15 downstream of the fan 14, this avoids the accelerated air hitting the first heat sink 15 and causing abnormal noise and vibration.

[0088] The first air inlet 121 and the first air outlet 122 can be located on the middle frame 12 near the back cover 11. The first air inlet 121 and the first air outlet 122 are distributed along the length Y or width X of the electronic device 1 on both sides of the middle frame 12, with the first air inlet 121 positioned near the first heat sink 15. Alternatively, the first air inlet 121 and the first air outlet 122 can be located on the back cover 11, with the first air inlet 121 positioned near the first heat sink 15. Or, the first air inlet 121 and the first air outlet 122 can be located on a decorative piece (not shown) for mounting a camera module, with the first air inlet 121 positioned near the first heat sink 15. Alternatively, the first air inlet 121 and the first air outlet 122 can be located on an air duct bracket 12a, with the first air inlet 121 positioned near the first heat sink 15. The first air inlet 121 and the first air outlet 122 can be set according to the actual structure of the electronic device 1, and this embodiment does not make specific limitations here.

[0089] It should be noted that the first air outlet 122 can be located on the same component as the first air inlet 121, such as both the first air inlet 121 and the first air outlet 122 being located on the middle frame 12. Alternatively, the first air outlet 122 can be located on different components than the first air inlet 121, such as the first air inlet 121 being located on the rear cover 11 and the first air outlet 122 being located on the middle frame 12. The specific configuration can be determined according to the actual situation, and this embodiment does not impose any limitations on it.

[0090] It should also be noted that the remaining structure of the electronic device 1 is provided with an air intake channel that allows air from the external environment to enter the first air intake 121, and an air outlet channel that discharges air to the external environment along the first air outlet 122. The air intake channel and the air outlet channel can be set according to the actual situation, and this embodiment does not limit them here.

[0091] Please refer to Figure 7. The fan 14 is provided with a second air inlet 141 and a second air outlet 142. The curve in Figure 7 represents the airflow direction S. Air can enter the air duct space 1a through the first air inlet 121 and flow to the first heat sink 15. The fan 14 can draw the air passing through the first heat sink 15 into the second air inlet 141, accelerate the airflow in the area of ​​the first heat sink 15, and then discharge the air in the fan 14 through the second air outlet 142. Finally, the air is discharged from the air duct space 1a from the first air outlet 122.

[0092] Referring to Figure 7, along the thickness direction Z of the electronic device 1, the first heat sink 15 has a first end 151 and a second end 152 disposed opposite to each other. A first air inlet 121 is disposed near the first end 151, and a second air inlet 141 is disposed near the second end 152. That is, most of the structure of the first heat sink 15 is disposed in the area between the first air inlet 121 and the second air inlet 141 along the thickness direction Z of the electronic device 1. Specifically, by distributing the first air inlet 121 near the first end 151 of the first heat sink 15 and the second air inlet 141 near the second end 152 of the first heat sink 15, a significant height difference is formed between the first air inlet 121 and the second air inlet 141 along the thickness direction Z of the electronic device 1, thus extending the airflow path from the first air inlet 121 to the second air inlet 141. When air flows from the first air inlet 121 to the second air inlet 141, air flows through most or even the entire area of ​​the first heat sink 15, improving the heat exchange efficiency of the first heat sink 15 and thus improving the heat dissipation efficiency of the electronic device 1.

[0093] More specifically, the second air inlet 141 can be positioned towards the mid-frame 12 and along the thickness direction Z of the electronic device 1. An airflow space exists between the second air inlet 141 and the mid-frame 12, allowing air to enter the second air inlet 141. The second air outlet 142 is located on the side of the fan 14 away from the first air inlet 121. In this embodiment, by positioning the second air inlet 141 of the fan 14 towards the mid-frame 12, the second air inlet 141 is positioned closer to the second end 152 of the first heat sink 15, thereby increasing the height difference between the first air inlet 121 and the second air inlet 141 along the thickness direction Z of the electronic device 1, further extending the airflow path from the first air inlet 121 to the second air inlet 141.

[0094] Alternatively, in some embodiments, the second air inlet 141 may be positioned toward the first heat sink 15, and the second air inlet 141 may be located on the side of the fan 14 near the mid-frame.

[0095] Alternatively, in some embodiments, the second air inlet 141 may be arc-shaped, with part of the second air inlet 141 facing the middle frame 12 and part of the second air inlet 141 facing the first heat sink 15.

[0096] Figure 8 shows a schematic diagram of the air duct space 1a in one embodiment. This air duct space 1a is an irregular space, and the fan 14 is located on one side of the air duct space 1a. Along the airflow direction S, the first heat sink 15 is located upstream of the fan 14. Referring to Figures 7 and 8, in the case of the air duct space 1a shown in Figure 8, the fan 14 and the first heat sink 15 can be distributed as shown in the embodiment of Figure 7. In this embodiment, by placing the first heat sink 15 upstream of the fan 14, and having the second air inlet 141 of the fan 14 face the inner side of the device (middle frame 12), the height difference between the first air inlet 121 and the second air inlet 141 is increased, allowing air to pass evenly through the first heat sink 15. By forming an irregular air duct space 1a within the electronic device 1, the heat dissipation capacity of the electronic device 1 is improved while reducing fluid noise.

[0097] Please continue referring to Figure 7. Along the thickness direction Z of the electronic device 1, there is a gap between the fan 14 and the heat-generating device 16. That is to say, in this embodiment, the fan 14 is not mounted on the middle frame 12 and has a certain gap with the middle frame 12. This allows the fan 14 and the heat-generating device 16 mounted on the middle frame 12 to also have a certain gap along the thickness direction Z of the electronic device 1. This allows the fan 14 to be positioned away from the heat-generating device 16, thereby reducing the operating temperature of the fan 14 and improving the reliability and service life of the fan 14.

[0098] For example, the fan 14 can be mounted on the back cover 11, specifically by means of bonding or screws. By mounting the fan 14 on the back cover 11, compared to mounting the fan 14 on the middle frame 12, the fan 14 is positioned further away from the heat-generating device 16, thereby reducing the operating temperature of the fan 14 and improving its reliability and lifespan.

[0099] Alternatively, the electronic device 1 may also include a decorative element mounted on the back cover 11. The fan 14 can be mounted on the decorative element, sharing the decorative space with the camera module. Specifically, the fan 14 can be mounted to the decorative element using adhesive or screws. By mounting the fan 14 on the decorative element, compared to mounting it on the mid-frame 12, the fan 14 is positioned further away from the heat-generating device 16, thereby reducing the operating temperature of the fan 14 and improving its reliability and lifespan.

[0100] Alternatively, the electronic device 1 may also include a bracket (not shown in the figure), which is mounted on the back cover 11, the middle frame 12, or a decorative piece. The fan 14 is mounted on the bracket, creating a gap between the fan 14 and the heat-generating device 16. Specifically, the fan 14 can be mounted on the bracket using methods such as snap-fit, adhesive, or screws. By mounting the fan 14 on the bracket, compared to mounting it on the frame, the fan 14 is positioned further away from the heat-generating device 16, thereby reducing the operating temperature of the fan 14 and improving its reliability and lifespan.

[0101] Alternatively, the fan 14 can also be installed in other components within the electronic device 1. The specific installation can be determined according to the actual situation, and this embodiment does not impose any limitations on it.

[0102] It should be noted that the bracket has a hollow structure and will not obstruct airflow. The specific installation position of the fan 14 can be set according to the actual situation, as long as there is a certain distance between the fan 14 and the heat-generating device 16. This embodiment does not impose any limitations on this.

[0103] Referring to Figure 7, the electronic device 1 also includes a blocking member 17, which is disposed in the air duct space 1a. Along the thickness direction Z of the electronic device 1, one end of the blocking member 17 is connected to the fan 14, and the other end is connected to the middle frame 12. Along the airflow direction S, the blocking member 17 is disposed behind the second air inlet 141 and in front of the first air outlet 122. By setting this blocking member 17, air is prevented from flowing directly along the air duct space 1a to the first air outlet 122, so that most of the air can enter the second air inlet 141 of the fan 14.

[0104] The blocking component 17 can be made of materials such as foam or plastic. The specific material can be set according to the actual situation, and this embodiment does not limit it.

[0105] Figure 9 shows a cross-sectional view of part of the structure of electronic device 1 in another embodiment. Electronic device 1 includes a display screen 13, a middle frame 12, a back cover 11, a fan 14, a first heat sink 15, a second heat sink 18, a blocking member 17, and a heat-generating device 16. The embodiment shown in Figure 9 differs from the embodiment shown in Figure 7 in that a second heat sink 18 is added, and the second heat sink 18 is disposed in the air duct space 1a. Along the thickness direction Z of electronic device 1, the second heat sink 18 can be disposed at the gap between the heat-generating device 16 and the fan 14. Along the airflow direction S (the curve in the figure represents the airflow direction S), the second heat sink 18 is also located upstream of the fan 14, allowing the fan 14 to draw air passing through the first heat sink 15 and the second heat sink 18 into the second air inlet 141. The remaining details can be found in the embodiment shown in Figure 7, and will not be repeated here.

[0106] In this embodiment, based on the first heat sink 15 set upstream of the fan 14, a second heat sink 18 is set at the interval between the fan 14 and the heat-generating device 16 along the thickness direction Z of the electronic device 1, thereby improving the utilization rate of the air duct space 1a, increasing the heat dissipation area in the air duct space 1a, and thus improving the heat dissipation capacity of the electronic device 1.

[0107] Figure 10 shows a cross-sectional view of part of the structure of electronic device 1 in another embodiment. Electronic device 1 includes a display screen 13, a middle frame 12, a back cover 11, a fan 14, a first heat sink 15, a third heat sink 19, a blocking member 17, and a heat-generating device 16. The embodiment shown in Figure 10 differs from the embodiment shown in Figure 7 in that a third heat sink 19 is added. The third heat sink 19 is disposed in the airflow space 1a. Along the airflow direction S (the curve in the figure represents the airflow direction S), the third heat sink 19 is disposed downstream of the fan 14, near the second air outlet 142 of the fan 14. The fan 14 can blow accelerated air through the second air outlet 142 towards the third heat sink 19, accelerating the heat dissipation of the third heat sink 19 and improving heat dissipation efficiency.

[0108] In this embodiment, a first heat sink 15 is provided upstream of the fan 14, and a third heat sink 19 is provided downstream of the fan 14. The heat dissipation method combining exhaust and blowing is used to dissipate heat from the electronic device 1, maximizing the utilization of the air duct space 1a and increasing the heat dissipation area within the air duct space 1a, thereby improving the heat dissipation capacity of the electronic device 1.

[0109] The air duct space 1a shown in Figure 11 is an irregular space, and the fan 14 is located in the middle of the air duct space 1a. There is space upstream and downstream of the fan 14 for arranging heat sinks. In the case of the air duct space 1a shown in Figure 11, the fan 14, the first heat sink 15 and the third heat sink 19 can be distributed as shown in the embodiment in Figure 10.

[0110] Figure 12 shows a cross-sectional view of part of the structure of electronic device 1 in another embodiment. Electronic device 1 includes a display screen 13, a middle frame 12, a back cover 11, a fan 14, a first heat sink 15, a second heat sink 18, a third heat sink 19, a blocking member 17, and a heat-generating device 16. The embodiment shown in Figure 12 differs from the embodiment shown in Figure 10 in that a second heat sink 18 is added, and the second heat sink 18 is disposed in the air duct space 1a. Along the thickness direction Z of electronic device 1, the second heat sink 18 can be disposed at the interval between the heat-generating device 16 and the fan 14. Along the air flow direction S (the curve in the figure represents the air flow direction S), the second heat sink 18 is also located upstream of the fan 14, so that the fan 14 can draw air passing through the first heat sink 15 and the second heat sink 18 into the second air inlet 141, and the fan 14 can also blow the accelerated air through the second air outlet 142 towards the third heat sink 19.

[0111] In this embodiment, based on the arrangement of a first heat sink 15 upstream of the fan 14 and a third heat sink 19 downstream of the fan 14, a second heat sink 18 is arranged at the interval between the fan 14 and the heat-generating device 16 along the thickness direction Z of the electronic device 1, thereby improving the utilization rate of the air duct space 1a, increasing the heat dissipation area in the air duct space 1a, and thus improving the heat dissipation capacity of the electronic device 1.

[0112] Referring to Figures 11 and 12, the air duct space 1a shown in Figure 11 is an irregular space, and the fan 14 is located in the middle of the air duct space 1a. In the case of the air duct space 1a shown in Figure 11, the fan 14, the first heat sink 15, the second heat sink 18, and the third heat sink 19 can be distributed as shown in the embodiment in Figure 12.

[0113] It should be noted that the first heat sink 15, the second heat sink 18, and the third heat sink 19 mentioned above are all provided with multiple heat dissipation fins arranged sequentially, with gaps between adjacent heat dissipation fins to allow air to flow through the gaps. The specific arrangement of the first heat sink 15, the second heat sink 18, and the third heat sink 19 can be set according to the shape of the air duct space 1a, and this embodiment is not limited thereto. The first heat sink 15, the second heat sink 18, and the third heat sink 19 can be installed on the air duct space 1a or other components, and this embodiment is not limited thereto.

[0114] Additionally, it should be noted that the above embodiments are applicable not only to irregular air duct spaces but also to regular air duct spaces. For details, please refer to the above text; these embodiments will not be repeated here.

[0115] In practical applications, in addition to the electronic devices mentioned above, the heat dissipation scheme in this embodiment can also be applied to other air-cooled devices with compact structures and irregular air ducts. This embodiment does not limit the application of this scheme.

[0116] The same or similar parts between the various embodiments in this specification can be referred to mutually. In particular, the device embodiments and terminal embodiments are basically similar to the method embodiments, so the description is relatively simple.

[0117] The above descriptions are merely specific implementations of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. An electronic device, characterized in that, The electronic device includes: Back cover; The middle frame is connected to the rear cover; A duct support is installed on the middle frame, and there is a duct space between the rear cover and the duct support that allows air to flow. The electronic device is provided with a first air inlet that communicates with the duct space. A fan located in the air duct space, the fan having a second air inlet; The first heat sink is located in the air duct space and is located on the side of the fan near the first air inlet. The fan can draw air passing through the first heat sink into the second air inlet. Along the thickness direction of the electronic device, the first heat sink has a first end and a second end that are disposed opposite to each other. The first air inlet is disposed near the first end, and the second air inlet is disposed near the second end.

2. The electronic device according to claim 1, characterized in that, Along the thickness direction of the electronic device, the second air inlet is disposed toward the middle frame, and there is an airflow space between the second air inlet and the middle frame.

3. The electronic device according to claim 2, characterized in that, The electronic device further includes a heating element, which is mounted on the middle frame; Along the thickness direction of the electronic device, there is a gap between the fan and the heat-generating device.

4. The electronic device according to claim 3, characterized in that, The fan is mounted on the rear cover; or, The electronic device further includes a decorative element mounted on the rear cover, and the fan is mounted on the decorative element; or, The electronic device also includes a bracket, which is mounted on the back cover, the middle frame, or the decorative piece, and the fan is mounted on the bracket.

5. The electronic device according to claim 2, characterized in that, The first air inlet is located in the middle frame and is positioned close to the back cover along the thickness direction of the electronic device; The first air inlet is positioned close to the first heat sink.

6. The electronic device according to claim 2, characterized in that, The first air inlet is located on the rear cover and is positioned close to the first heat sink.

7. The electronic device according to claim 2, characterized in that, The electronic device also includes a decorative element, which is installed on the rear cover. The first air inlet is opened on the decorative element and is located close to the first heat sink.

8. The electronic device according to claim 2, characterized in that, The first air inlet is located on the air duct bracket and is positioned close to the first heat sink.

9. The electronic device according to any one of claims 1 to 8, characterized in that, The electronic device also includes a second heat sink disposed in the air duct space; Along the thickness direction of the electronic device, the second heat sink is located at the gap between the fan and the heat-generating device, and the fan can draw air passing through the first heat sink and the second heat sink into the second air inlet.

10. The electronic device according to any one of claims 1 to 8, characterized in that, The fan also has a second air outlet; The electronic device also includes a third heat sink disposed in the air duct space. The third heat sink is disposed close to the second air outlet, and the air blown out by the fan through the second air outlet can be directed toward the third heat sink.

11. The electronic device according to any one of claims 1 to 8, characterized in that, The electronic device includes a first air outlet, which is connected to the air duct space and is used to discharge the air in the air duct space to the external environment. The first air outlet is located in the middle frame; or, The first air outlet is located on the rear cover; or, The electronic device further includes a decorative element, which is mounted on the rear cover, and the first air outlet is formed in the decorative element; or... The first air outlet is located on the air duct support.

12. The electronic device according to claim 11, characterized in that, The electronic device also includes a blocking component disposed in the air duct space, which can prevent air from flowing directly to the first air outlet without passing through the fan.

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