Information protection structure and circuit, and electronic device
By setting a carrier and a second safety winding in a 2-layer FPC structure, combined with solder pads, the information transmission security problem of the I2C communication bus is solved, achieving flexible signal line protection and improved cost-effectiveness, making it suitable for electronic devices in the financial field.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SHANGHAI SUMI TECH CO LTD
- Filing Date
- 2025-10-16
- Publication Date
- 2026-06-04
AI Technical Summary
In the existing technology, the information transmission security of electronic devices in the financial field on the I2C communication bus is low, which is difficult to effectively protect with existing solutions. In addition, adding a third layer of circuitry or PCB board will affect production costs and circuit layout flexibility.
The system employs a two-layer FPC structure. By setting a second safety winding and pad on the carrier, combined with the first safety winding, it achieves comprehensive coverage and protection of the signal lines, reduces production costs, minimizes the size of the circuit structure, and triggers an alarm by detecting level changes through a safety circuit.
It achieves flexible protection for I2C signal lines, reduces production costs, decreases circuit structure size, improves information security, prevents external attacks, and eliminates the need for additional circuit layers.
Smart Images
Figure CN2025127983_04062026_PF_FP_ABST
Abstract
Description
Information protection structures, circuits, and electronic equipment Technical Field
[0001] This application relates to the field of information protection technology, and in particular to an information protection structure, circuit, and electronic device. Background Technology
[0002] For security reasons, electronic devices in the financial sector require not only software-level information security protection but also hardware-level information security. For example, in a Point of Sale (POS) management system, to ensure the secure transmission of information via the I2C communication bus, the I2C traces need to be protected by winding throughout to prevent signal cracking using physical tools such as probes. Therefore, the security of signal lines in electronic devices deserves attention.
[0003] Utility Model Content
[0004] In view of this, this application provides an information protection structure, circuit, and electronic device to solve the technical problem of low security of signal lines in electronic devices. In a first aspect, an information protection structure is provided, comprising: a first circuit layer on which signal lines are disposed; a second circuit layer on which a first security winding is disposed, the first security winding being configured to partially cover the signal lines; and a carrier on which a second security winding and a plurality of pads are disposed; wherein the second security winding is configured to supplementally cover the signal lines and is connected to the first security winding via the plurality of pads.
[0005] The above information protection structure, through the carrier and the second safety winding on the carrier, can provide security protection for the signal lines on the first circuit layer, improving the security of electronic devices. At the same time, the design of the carrier and pads can flexibly accommodate different signal line routing designs, providing ample protection for the signal lines, increasing the flexibility of the electronic device's circuit board layout, and eliminating the need for a third circuit layer, thus reducing production costs and the overall circuit structure size.
[0006] Optionally, the second safety winding is also configured to cover multiple pads.
[0007] Optionally, the second safety winding and multiple pads are disposed on the same side or different sides of the carrier.
[0008] Optionally, the carrier further includes a third safety winding disposed opposite to the second safety winding on the carrier and connected to the second safety winding via a via, the third safety winding being configured to cover a plurality of pads.
[0009] Optionally, one or more of the first safety winding, the second safety winding, or the third safety winding may be a serpentine structure.
[0010] Optionally, the shape of the carrier is determined based on the signal lines to be covered, including: regular or irregular shapes.
[0011] Optionally, the carrier is rectangular; there are 4 pads, which are respectively set at the four vertices of the carrier.
[0012] Optionally, the first circuit layer and the second circuit layer are flexible circuit boards; the carrier is made of silver paste; the flexible circuit board is provided with a welding structure corresponding to the pads on the carrier; the carrier is connected to the flexible board by bonding process through the pads and welding structure.
[0013] In a second aspect, an information protection circuit is provided, comprising: the information protection structure provided in the first aspect; and a security circuit connected to a second security winding and configured to detect level changes on the second security winding.
[0014] Thirdly, an electronic device is provided, comprising: the information protection circuit provided in the second aspect. Attached Figure Description
[0015] The accompanying drawings used in the description of the embodiments of this disclosure are briefly introduced below:
[0016] Figure 1 shows a schematic diagram of an information protection structure provided in some embodiments of this application;
[0017] Figure 2 shows a schematic diagram of another information protection structure provided in some embodiments of this application;
[0018] Figure 3 shows a schematic diagram of a structure of multiple pads and a carrier provided in some embodiments of this application;
[0019] Figure 4 shows a schematic diagram of another information protection structure provided in some embodiments of this application;
[0020] Figure 5 shows a schematic diagram of the structure of an information protection circuit provided in some embodiments of this application. Detailed Implementation
[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the specific implementation methods of this application will be described below with reference to the accompanying drawings. The accompanying drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings or embodiments can be obtained based on these drawings or embodiments without creative effort. Adjustments and improvements made without departing from the concept of this application are all within the protection scope of this application.
[0022] In this application, unless otherwise expressly specified and limited, ordinal numbers, such as "first," "second," etc., are used only to distinguish and describe related objects, and should not be construed as indicating or implying the relative importance or order between related objects; furthermore, they do not represent the quantity of related objects. "Multiple" includes two or more, and other quantifiers are similar. " / " is used to describe the relationship between related objects, indicating an "or" relationship between them. "And / or" is used to describe the relationship between related objects, including any combination relationship between them, such as "a and / or b" including: "a alone," "b alone," or "a and b." "One or more" or "at least one" of multiple objects refers to any object or any combination of multiple objects, such as "one or more of a1, a2, a3" or "at least one of a1, a2, a3" including: "a1 alone," "a2 alone," "a3 alone," "a1 and a2," "a1 and a3," "a2 and a3," or "a1, a2 and a3."
[0023] For security reasons, electronic devices in the financial sector require not only software-level information security protection but also hardware-level information security. For example, in Point of Sale (POS) systems, to ensure the secure transmission of information via the I2C communication bus, the I2C traces need to be protected by wire wrapping throughout the entire circuit to prevent signal cracking using physical tools such as probes. Similarly, in the INCELL process for electronic device screens, flexible printed circuit boards (LCD FPCs) typically consist of a two-layer structure. Because financial POS products require security protection, the screen's I2C signals need to be securely wrapped throughout. A two-layer LCD FPC solution may not be able to fully cover the I2C traces with secure wire wrapping, failing to meet information security requirements. One solution is to make the LCD FPC three-layered, adding a layer with secure wire wrapping to protect the I2C signals, thus passing financial security certification. However, this three-layer LCD FPC structure results in longer lead times and higher costs for manufacturers, impacting product competitiveness. Another approach is to add a PCB protection board above the LCD FPC, using a rigid board with safety windings to protect the FPC below, allowing the LCD FPC to be made of only two layers. However, this approach affects the overall stacking and circuit layout, has many limitations, and has high production costs. Therefore, this application uses a two-layer FPC as a base, placing a carrier in the area where the I2C signal is not covered by the safety windings, and setting safety windings on the carrier. These windings are then connected to the signal lines on the protected FPC via pads, thereby achieving more flexible signal line protection, reducing production costs, and decreasing the overall circuit structure size.
[0024] The following description is in conjunction with the accompanying drawings:
[0025] Please refer to Figure 1, which shows a schematic diagram of an information protection structure provided in some embodiments of this application. This information protection structure includes at least: a first circuit layer 110 on which a signal line 111 is disposed; a second circuit layer 120 on which a first safety winding 121 is disposed, the first safety winding 121 being configured to partially cover the signal line 111 in a first direction F1; and a carrier 130, on which a second safety winding 131 and a plurality of pads 132 are disposed; wherein the second safety winding 131 is configured to supplement the coverage of the signal line 111 and is connected to the first safety winding 121 through the plurality of pads 132.
[0026] The signal line 111 on the first circuit layer 110 can transmit information related to information interaction or security authentication of the electronic device, such as user account, password, or other authentication information, as well as control commands and other data. The first security winding 121 on the second circuit layer 120 and the second security winding 131 on the carrier 130 can be a type of protection line unique to the Payment Card Industry Data Security Standard (PCIDSS), which can be used to protect sensitive signals, such as protecting the I2C bus in the LCD FPC of financial electronic devices, where the signals transmitted can reflect the user's input password information. The first security winding 121 and the second security winding 131 can be a dense winding structure, such as serpentine winding, Z-shaped winding, or loop winding. With this winding method, if an attacker probes the lower layer's I2C signal from the outside, and the probe attack causes an open circuit or short circuit in the first security winding 121 or the second security winding 131, it will immediately trigger an alarm in the electronic device and clear sensitive information stored inside the machine, such as passwords, card numbers, or user personal identification information. In the information protection structure of this application, the first security winding 121 and the second security winding 131 can cover the signal line 111 in the vertical projection direction of the first circuit layer 110, that is, from top to bottom, the carrier 130, the second circuit layer 120, and the first circuit layer 110, or in a direction with a certain angle range from the vertical projection direction of the first circuit layer 110, covering the signal line 111. The first security winding 121 may not fully cover the signal line 111 to be protected because other traces may occupy the circuit layer, thus posing a security risk. The second security winding 131 can supplement the portion not covered by the first security winding 121, and the protection of the signal line 111 is achieved jointly by the first security winding 121 and the second security winding 131. Figure 2 shows a schematic diagram of another information protection structure provided in some embodiments of this application. The second safety winding 131 can be disposed on any side of the carrier 130. For example, the second safety winding 131 can be disposed on the side of the carrier 130 away from the first circuit layer 110, as shown in Figure 1; or the second safety winding 131 can be disposed on the side of the carrier 130 close to the first circuit layer 110, as shown in Figure 2. No specific limitation is made here.Multiple pads 132, through a bonding process, can fix the carrier 130 and the second security winding 131 on the carrier to the second circuit layer 110. The pads 132 can electrically connect the second security winding 131 and the first security winding 121. Once an attacker attacks through a probe or other physical means, and one or both of the first security winding 121 and the second security winding 131 are broken, the device's security management module can detect this behavior and take corresponding actions, such as interrupting the data transmission and communication of the signal line 111. The carrier 130 can be made of silver paste material, and the shape and size of the carrier 130 can be designed according to the shape and size of the signal line area to be protected. This application bonds the first circuit layer 110 and the second circuit layer 120 of the LCD FPC together with the carrier 130, which serves as the silver paste winding. This achieves protection for the LCD FPC signal lines without requiring a third PCB layer or LCD FPC, reducing the overall circuit layer count from three to two. This significantly saves production costs and time, and reduces the space occupied by the overall circuit, further minimizing the device size. Simultaneously, the carrier 130 can be flexibly positioned where the LCD FPC signal lines are not fully protected. Its size and shape can be designed and adjusted according to the shape of the signal line area to be covered, improving the flexibility of the electronic device's circuit board layout. Due to the thin and light design of the carrier 130, the coverage area of the second security winding 131 is more flexible, effectively complementing the first security winding 121, improving the overall circuit security, and preventing external attacks from cracking the signal line information.
[0027] In some embodiments of this application, the second safety winding 131 is also configured to cover a plurality of pads 132.
[0028] Pad 132 can be the starting point of the second security winding 131 signal. Since the area of pad 132 is relatively large, it is relatively easy for external attackers to use probes to attack it. Therefore, the second security winding 131 can be used to cover and protect pad 132 to ensure the security of the source input signal of the second security winding 131 on the carrier 130.
[0029] In some embodiments of this application, the second safety winding 131 and the plurality of pads 132 are disposed on the same side or different sides of the carrier 130.
[0030] In some embodiments of this application, please continue to refer to FIG1. One or more of the first safety winding 121, the second safety winding 131, or the third safety winding are serpentine structures. The serpentine structure of the safety winding can be formed by first fully covering the winding material on the carrier and then forming the serpentine structure of the safety winding through etching or other methods; or by pre-constructing the serpentine structure and then setting the safety winding on the carrier 130 or the second circuit layer 120, etc.
[0031] In some embodiments of this application, the shape of the carrier 130 is determined based on the signal line 111 to be covered, including regular or irregular shapes. In this application, the shape of the carrier 130 can be a polygonal pattern, such as a triangle, quadrilateral, pentagon, etc. Or, an arc-shaped pattern, such as a circle, ellipse, etc. It can also be a regular or irregular pattern, without specific limitations. The shape can be determined based on the shape, size, etc., of the signal line 111 to be covered, to improve the flexibility of circuit design. (Figure)
[0032] In some embodiments of this application, please continue to refer to Figure 1. The carrier 130 is rectangular; there are four pads 132, respectively disposed at the four vertices of the carrier 130. The number, shape, and position of the pads 132 can be set according to the setting position and size of the signal line 111, etc., to achieve the electrical connection between the second safety winding 131 and the signal line 111. For example, the number of pads 132 can be 5, 6, 7, etc., and the shape of the pads 132 can be a polygonal pattern, an arc pattern, a regular or irregular pattern, which is not specifically limited here. When connecting the first safety winding 121 and the second safety winding 131, the pads 132 can be connected by all or part of the pads 132. For example, when there are 4 pads 132, two of the pads 132 are used to establish the connection between the first safety winding 121 and the second safety winding 131. The location of the pads 132 is not limited to the vertex position; they can be located at any position on the carrier 130. For example, the specific location of the pads 132 can be determined based on the connection position between the first safety winding 121 and the second safety winding 131. They can be concentrated on one side of the second surface of the carrier 130, or dispersed around the second surface of the carrier 130, etc. Figure 3 shows a schematic diagram of a structure of multiple pads and a carrier provided in some embodiments of this application. The carrier 130 is an irregular shape, i.e., a combination of two rectangles. The second safety winding 131 is provided in a portion of the plane of the carrier 130, and multiple pads 132 are provided in another portion of the plane of the carrier 130, with the second safety winding 131 and the multiple pads 132 on the same surface of the carrier 130.
[0033] In some embodiments of this application, Figure 4 shows a schematic diagram of another information protection structure provided in some embodiments of this application. The carrier 130 further includes a third security winding 133, disposed opposite to the second security winding 131 on the carrier 130 and connected to the second security winding 131 via a via. The third security winding 133 is configured to cover multiple pads 132. In this embodiment, the second security winding 131 can supplement the coverage of the signal line 111 by the first security winding 121; similarly, the third security winding 133 can also supplement the coverage of the signal line 111 by the first security winding 121 and the second security winding 131. Furthermore, since the area of the multiple pads 132 is relatively large, their security protection is also very important; the third security winding 133 can cover the multiple pads 132 to protect them from external physical attacks.
[0034] In some embodiments of this application, the first circuit layer 110 and the second circuit layer 120 are flexible circuit boards; the carrier 130 is made of silver paste. The flexible circuit board has soldering structures corresponding to the pads 132 on the carrier 130; the carrier 130 is bonded to the flexible circuit board via the pads 132 and the soldering structures. The flexible circuit board can be bent according to the actual application of the electronic device circuit. For example, when connecting the main circuit board and the display screen of an electronic device, compared to the connection method of a PCB board, the flexible circuit board can achieve a flexible connection between the main circuit board and the display screen, without placing the main circuit board and the display screen on the same plane. The silver paste carrier 130 is similar to a flexible circuit board with safety windings. Its advantage over combining two flexible circuit boards is that the carrier 130 and the soldering structures can be directly bonded to the flexible circuit board using the ACF process, thereby safely and effectively combining the carrier 130 and the second circuit layer 120 without exposing the safety pads.
[0035] In some embodiments of this application, signal line 111 is an I2C signal line. Signal line 111 in this application can be an I2C signal line, or it can be other types of signal lines, such as signal lines that comply with payment card industry data security standards and can be protected.
[0036] Based on the same technical concept, this application provides an information protection circuit, including: the information protection structure provided in the above embodiments.
[0037] In some embodiments of this application, please refer to Figure 5, which shows a schematic diagram of an information protection circuit provided in some embodiments of this application. It includes: an information protection structure 510 provided in the above embodiments, and a security circuit 520 connected to the second security winding 131 in the information protection structure 510, configured to detect level changes on the second security winding 131. After the first circuit layer 110 and the carrier 130 are electrically connected through a bonding process, once the carrier 130 is peeled off, the second security winding 131 connecting the carrier 130 and the second circuit layer 120 will be disconnected, allowing the security circuit to detect the disconnection and trigger an alarm. For example, the security circuit may be configured with a set of sensors, continuously detecting signals in one or more of the structures of the second security winding 131, pad 132, and third security winding 133. An alarm will be triggered once a level change occurs. For example, if a high level is continuously present on the second security winding 131, in the event of a disconnection or short circuit, the high level will change to a low level, immediately clearing sensitive information stored inside the electronic device to ensure user information security. The connection between the security circuit 520 and the second security winding 131 of the information protection structure 510 in Figure 5 is only schematic; other connection methods are possible, such as via holes or circuit board traces. Simultaneously, the security circuit 520 can also be connected to the first security winding 121, the pad 132, or the third security winding 133. That is, by determining the connection status between the first security winding 121, the second security winding 131, the third security winding 133, and the pad 132, security monitoring can be performed to detect potential damage, thereby improving information security.
[0038] Based on the same technical concept, this application also provides an electronic device, including: the information protection circuit provided in the above embodiments.
[0039] To keep the drawings simple, each figure only schematically shows the parts relevant to the embodiment, and they do not represent the actual structure of the product. In addition, for the sake of clarity and ease of understanding, some figures only schematically show parts of components with the same structure or function, and there may actually be more or fewer components with the same structure or function.
Claims
1. An information protection structure, characterized in that, include: The first circuit layer has signal lines on it; A second circuit layer is provided thereon with a first safety winding, the first safety winding being configured to partially cover the signal line; A carrier having a second safety winding and a plurality of pads; wherein the second safety winding is configured to supplement and cover the signal line and is connected to the first safety winding through the plurality of pads.
2. The information protection structure according to claim 1, characterized in that, The second safety winding is also configured to cover the plurality of pads.
3. The information protection structure according to claim 2, characterized in that, The second safety winding and the plurality of pads are disposed on the same side or different sides of the carrier.
4. The information protection structure according to claim 3, characterized in that, The carrier further includes a third safety winding disposed opposite to the second safety winding on the carrier and connected to the second safety winding via a via, the third safety winding being configured to cover the plurality of pads.
5. The information protection structure according to any one of claims 1-4, characterized in that, One or more of the first safety winding, the second safety winding, or the third safety winding are serpentine structures.
6. The information protection structure according to claim 5, characterized in that, The shape of the carrier is determined based on the signal lines to be covered, including: regular or irregular shapes.
7. The information protection structure according to claim 6, characterized in that, The carrier is rectangular; There are four pads, which are respectively located at the four vertices of the carrier.
8. The information protection structure according to any one of claims 1-3, characterized in that, The first and second circuit layers are flexible circuit boards; the carrier is made of silver paste; the flexible circuit board has a welding structure corresponding to the pads on the carrier; the carrier is connected to the flexible board via the pads and the welding structure using a bonding process.
9. An information protection circuit, characterized in that, include: The information protection structure according to any one of claims 1-7; A safety circuit, connected to the second safety winding, is configured to detect level changes on the second safety winding.
10. An electronic device, characterized in that, include: The information protection circuit according to any one of claims 9.