Circuit structure
The circuit structure addresses space and heat dissipation challenges by integrating heat dissipation fins and a vibration suppression mechanism, achieving efficient heat management and compact design in electric vehicle busbars.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- AUTONETWORKS TECH LTD
- Filing Date
- 2025-11-21
- Publication Date
- 2026-06-04
AI Technical Summary
Existing circuit structures in electric vehicles face challenges in securing sufficient volume and heat dissipation performance for busbars due to limited space, and the increased Joule heat generation from higher currents, necessitating improved heat dissipation and vibration suppression mechanisms.
The circuit structure incorporates heat dissipation fins protruding from the busbar into the case's empty space, with a vibration suppression mechanism using opposing wall portions and pressure contact ribs to stabilize the fins, enhancing heat dissipation and reducing vibrations.
This configuration effectively utilizes case space for heat dissipation, improves heat dissipation performance, and stabilizes fins against vibrations, ensuring compactness and efficient heat management without additional space requirements.
Smart Images

Figure JP2025040840_04062026_PF_FP_ABST