Circuit structure

The circuit structure addresses space and heat dissipation challenges by integrating heat dissipation fins and a vibration suppression mechanism, achieving efficient heat management and compact design in electric vehicle busbars.

WO2026116271A1PCT designated stage Publication Date: 2026-06-04AUTONETWORKS TECH LTD +2
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
PCT/JP2025/040840
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-27
Filing Date
2025-11-21
Publication Date
2026-06-04

AI Technical Summary

Technical Problem

Existing circuit structures in electric vehicles face challenges in securing sufficient volume and heat dissipation performance for busbars due to limited space, and the increased Joule heat generation from higher currents, necessitating improved heat dissipation and vibration suppression mechanisms.

Method used

The circuit structure incorporates heat dissipation fins protruding from the busbar into the case's empty space, with a vibration suppression mechanism using opposing wall portions and pressure contact ribs to stabilize the fins, enhancing heat dissipation and reducing vibrations.

Benefits of technology

This configuration effectively utilizes case space for heat dissipation, improves heat dissipation performance, and stabilizes fins against vibrations, ensuring compactness and efficient heat management without additional space requirements.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure JP2025040840_04062026_PF_FP_ABST
    Figure JP2025040840_04062026_PF_FP_ABST
Patent Text Reader

Abstract

Disclosed is a circuit structure in which free space in a case is effectively utilized, and a required volume and heat dissipation performance required for an energization bus bar can be effectively ensured.　A circuit structure 10 comprises: a case 16; an energization bus bar 14 routed in the case 16 and constituting an energization path 12; a heat dissipation fin portion 18 provided protrusively on the energization bus bar 14 and protruding from the energization bus bar 14 toward an empty space in the case 16; and a vibration suppression portion 20, provided to the case 16, contacting the heat dissipation fin portion 18 to suppress vibration of the heat dissipation fin portion 18.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Radiation structure of electronic apparatus

    JP2002093959A

  • Electronic module

    WO2021020255A1

  • Circuit configuration

    WO2021153373A1

  • Circuit unit

    WO2021230077A1

  • Electrical junction box

    WO2024058184A1