Lidar system and manufacturing method having semiconductor- based optical components coupled together with solder
The solder coupling method with flip-chip bonding and thermal management techniques address alignment and heat dissipation challenges in LIDAR systems, enhancing their structural integrity and performance.
WO2026117302A1PCT designated stage Publication Date: 2026-06-04AURORA OPERATIONS INC
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- AURORA OPERATIONS INC
- Filing Date
- 2025-09-23
- Publication Date
- 2026-06-04
AI Technical Summary
Technical Problem
Existing LIDAR systems face challenges in achieving sub-micron out-of-plane alignment accuracy and effective heat dissipation for high power laser diodes and semiconductor optical amplifier chips without active alignment, leading to insufficient bonding and thermal interference issues.
Method used
A method involving solder coupling with flip-chip bonding and heat application to achieve sub-micron alignment accuracy and heat dissipation, using fiducial marks and mechanical stops for precise alignment, and heat spreaders for thermal management.
Benefits of technology
Ensures secure and accurate coupling of optical components, improving structural integrity and performance of LIDAR systems by achieving sub-micron alignment and effective heat dissipation without active alignment.
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Smart Images
Figure US2025047481_04062026_PF_FP_ABST
Abstract
A method for manufacturing a semiconductor-based light detection and ranging (LIDAR) system for a vehicle, includes: coupling a first optical component with solder disposed on a first portion of the first optical component to a second optical component in a first alignment operation, where the solder disposed on the first portion of the first optical component is not in contact with the second optical component and coupling the first optical component to a third optical component with solder disposed on a first portion of the third optical component in a second alignment operation, where the solder disposed on the first portion of the third optical component is not in contact with a second portion of the first optical component. Heat is then applied to the solder disposed on the first portion of the first optical component and the solder disposed on the first portion of the third optical component.
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