Display device and manufacturing method for display device
By designing photosensitive patterns and bonding structures on the cover plate, the problems of large space occupation, high cost, high power consumption and high failure rate of ambient light sensors are solved, thus realizing the thinning of the display module and the improvement of photosensitivity.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2024-12-20
- Publication Date
- 2026-06-25
AI Technical Summary
In existing technologies, ambient light sensors occupy a large space, have high cost and high power consumption, and are not sensitive. Furthermore, the flexible circuit board has a high failure rate due to warping, which affects the brightness adjustment effect of the display module.
By designing a photosensitive pattern on the cover plate and connecting it to the display component through a bonding structure with conductive parts, a large area of photosensitive detection area is formed, eliminating the need for an ambient light sensor and its peripheral components, thus achieving a thinner and lighter design.
This improved the light sensitivity of the display module, reduced power consumption and cost, decreased the warping defect rate, and enabled more efficient ambient light detection.
Smart Images
Figure CN2024141152_25062026_PF_FP_ABST
Abstract
Description
Display device and method of manufacturing display device Technical Field
[0001] This invention relates to the field of display technology, and more particularly to a display device and a method for manufacturing the display device. Background Technology
[0002] In related technologies, ambient light sensors (ALS) are typically placed on a main flexible printed circuit (MFPC) or a touch flexible printed circuit (TFPC). The basic working principle is that the ambient light sensor collects the ambient light intensity and transmits the information to the host processor via an inter-integrated circuit (IIC) communication network. The host processor then instructs the driver IC to change the brightness of the display module. Summary of the Invention
[0003] This disclosure provides a display device and a method for manufacturing the display device. The display device has a display area and a peripheral area located around the display area, wherein the display device includes:
[0004] A display component having a binding structure in the peripheral area;
[0005] A cover plate includes: a substrate, a photosensitive pattern located on the side of the substrate facing the display component, and an electrode located on the side of the photosensitive pattern facing the display component and in contact with the photosensitive pattern; the photosensitive pattern is disposed around the display area and is broken at a first position to form a notch; the electrode is located at the end of the photosensitive pattern near the notch;
[0006] A conductive portion is located in the peripheral area between the display component and the cover plate, and the electrode is electrically connected to the bonding structure through the conductive portion.
[0007] In one possible implementation, the peripheral area includes: a binding area disposed opposite to each other, a binding opposite side area, and two side areas connecting the binding area and the binding opposite side area;
[0008] The photosensitive pattern includes: a first photosensitive pattern portion, a second photosensitive pattern portion, and a third photosensitive pattern portion connecting one end of the first photosensitive pattern portion and one end of the second photosensitive pattern portion, and a fourth photosensitive pattern portion connecting the other end of the first photosensitive pattern portion and the other end of the second photosensitive pattern portion; the first photosensitive pattern portion is located in the binding area, the second photosensitive pattern portion is located in the binding opposite side area, and the third photosensitive pattern portion and the fourth photosensitive pattern portion are respectively located in the two side areas;
[0009] The notch is located in the first photosensitive pattern area.
[0010] In one possible implementation, the width of the notch in the first direction is the same as the width of the second photosensitive pattern portion in the first direction.
[0011] In one possible implementation, the cover plate further includes ink located on the side of the electrode facing the substrate; the ink is disposed around the display area;
[0012] The ink covers the orthographic projection of the substrate, the orthographic projection of the photosensitive pattern on the substrate, and the orthographic projection of the notch on the substrate.
[0013] In one possible implementation, the ink has an opening that exposes at least a portion of the electrode.
[0014] In one possible implementation, the ink includes: a first sub-ink layer, and a second sub-ink layer located on the side of the first sub-ink layer facing the display component;
[0015] The opening includes: a first sub-opening and a second sub-opening; the first sub-opening is located in the first sub-ink layer; the second sub-opening is located in the second sub-ink layer; the size of the first sub-opening is smaller than the size of the second sub-opening.
[0016] In one possible implementation, the electrode includes a first sub-electrode and a second sub-electrode; the first sub-electrode is located at one end of the photosensitive pattern near the notch, and the second sub-electrode is located at the other end of the photosensitive pattern near the notch.
[0017] In one possible implementation, the bonding structure includes: a bonding terminal group, a first conductive pad located on one side of the bonding terminal group, and a second conductive pad located on the other side of the bonding terminal group;
[0018] The orthographic projection of the first conductive pad on the substrate overlaps with the orthographic projection of the first sub-electrode on the substrate; the orthographic projection of the second conductive pad on the substrate overlaps with the orthographic projection of the second sub-electrode on the substrate.
[0019] In one possible implementation, the bonding terminal group includes: a plurality of terminals arranged along a second direction;
[0020] The first conductive pad is larger in size in the second direction than the terminal is in size in the second direction; the second conductive pad is larger in size in the second direction than the terminal is in size in the second direction.
[0021] In one possible implementation, the area of the first sub-electrode projected onto the substrate is larger than the area of the first conductive pad projected onto the substrate; the area of the second sub-electrode projected onto the substrate is larger than the area of the second conductive pad projected onto the substrate.
[0022] In one possible implementation, the conductive portion includes: a first conductive portion and a second conductive portion;
[0023] The first sub-electrode is connected to the first conductive pad through the first conductive part, and the second sub-electrode is connected to the second conductive pad through the second conductive part.
[0024] In one possible implementation, the conductive portion includes: conductive adhesive.
[0025] In one possible implementation, the display component includes: a display panel and a touch panel located on the side of the display panel facing the cover plate;
[0026] The bonding structure is located on the side of the touch panel facing the cover plate.
[0027] This disclosure also provides a method for manufacturing a display device as described in this disclosure, comprising:
[0028] A cover plate with a photosensitive pattern and electrodes is formed;
[0029] Form a display component with a binding structure;
[0030] A conductive portion is formed at the bonding structure of the display component, and the cover plate is attached to the display component so that the bonding structure of the display component and the electrodes of the cover plate are electrically connected through the conductive portion.
[0031] In one possible implementation, forming the cover plate having a photosensitive pattern and electrodes includes:
[0032] A photosensitive pattern is formed on one side of the substrate by spraying, and a notch is formed in the photosensitive pattern at the first position.
[0033] An electrode is formed on the side of the photosensitive pattern that faces away from the substrate and at the end of the photosensitive pattern near the notch;
[0034] Ink is formed on the side of the electrode layer opposite to the photosensitive pattern layer. Attached Figure Description
[0035] Figure 1A is a top view of the display device provided in an embodiment of this disclosure;
[0036] Figure 1B is a top view of the single film layer of the photosensitive pattern in Figure 1A;
[0037] Figure 1C is a top view of the ink film layer in Figure 1A;
[0038] Figure 1D is a top view of the components shown in Figure 1A;
[0039] Figure 1E is a partially enlarged schematic diagram of the binding structure in Figure 1D;
[0040] Figure 2 is a schematic cross-section along the dashed line e1 in Figure 1A;
[0041] Figure 3A is a schematic cross-sectional view of the cover plate;
[0042] Figure 3B is a schematic diagram of the first sub-ink layer and the second sub-ink layer at the opening;
[0043] Figure 4 is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure. Detailed Implementation
[0044] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.
[0045] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.
[0046] As used herein, “approximately” or “substantially the same” includes the stated value and means within an acceptable range of deviations from the specific value, as determined by a person skilled in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., limitations of the measurement system). For example, “substantially the same” may mean a difference relative to the stated value within one or more standard deviations, or within ±30%, 20%, 10%, or 5%.
[0047] In the accompanying drawings, the thicknesses of layers, films, panels, regions, etc., are enlarged for clarity. Exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Thus, deviations from the shapes shown in the drawings will be expected as a result of, for example, manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather include deviations in shape caused, for example, by manufacturing processes. For example, regions illustrated or described as flat may typically have rough and / or non-linear characteristics. Furthermore, sharp corners illustrated may be rounded. Thus, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the regions, nor are they intended to limit the scope of the claims.
[0048] To keep the following description of the embodiments of this disclosure clear and concise, detailed descriptions of known functions and known components are omitted.
[0049] In related technologies, the location and communication of the ambient light sensor in the display module are as follows:
[0050] The ambient light sensor and its peripheral components are placed on a flexible circuit board. After the flexible circuit board is bonded to the display, the ambient light sensor collects ambient light and feeds the collected information back to the central processing unit (CPU) of the motherboard. After processing the data, the CPU sends instructions to the display module driver IC, thus realizing module dimming. Regarding the ambient light sensor and this communication process, the following points need to be addressed for their obvious shortcomings:
[0051] Firstly, the ambient light sensor and peripheral components consist of at least four parts, two voltage regulator and filter capacitors for the two power supplies, plus pull-up resistors, which limits the space on the flexible circuit board and increases the cost of the components.
[0052] Secondly, the data processing during communication between the ambient light sensor and the CPU causes a sharp increase in motherboard power consumption;
[0053] Thirdly, due to the bonding requirements of ambient light sensors and display panels, the flexible circuit board structure is irregular. The flexible circuit board needs to be softened, and the defect rate of warping after bonding is high. The flexible circuit board is difficult to control for different flexible circuit board manufacturers.
[0054] In summary, ambient light sensors and peripheral devices in related technologies occupy a large amount of space. Moreover, since the ambient light sensor needs to be bonded to the display panel, and the flexible circuit board has a certain degree of rigidity, defects such as warping may occur after the light sensor is bonded to the flexible circuit board under stress. In addition, the ambient light sensor is limited by its own size, resulting in a limited amount of light flux that it can sense from the external environment, leading to problems such as untimely or insensitive sensing.
[0055] In view of the above, this disclosure provides a display device. Referring to Figures 1A-1D, 2, and 3A, Figure 1B is a schematic diagram of a single film layer of the photosensitive pattern in Figure 1A, Figure 1C is a schematic diagram of the ink film layer in Figure 1A, Figure 1D is a schematic diagram of the display component in Figure 1A, Figure 2 is a schematic cross-sectional view along the dashed line e1 in Figure 1A, and Figure 3A is a schematic cross-sectional view of the cover plate. The dashed line P in Figure 1A represents the outer contour of the display panel. The display device has a display area AA and a peripheral area BB located around the display area AA. The display device includes:
[0056] Display component 100, display component 100 has a binding structure 30 in the peripheral area BB;
[0057] The cover plate 200 includes: a substrate 21, a photosensitive pattern 22 located on the side of the substrate 21 facing the display component 100, and an electrode 23 located on the side of the photosensitive pattern 22 facing the display component 100 and in contact with the photosensitive pattern 22; the photosensitive pattern 22 is disposed around the display area AA and is broken at a first position to form a notch Q; the electrode 23 is located at the end of the photosensitive pattern 22 near the notch Q;
[0058] The conductive part 300 is located in the peripheral area BB between the display component 100 and the cover plate 200. The electrode 23 and the bonding structure 30 are electrically connected through the conductive part 300.
[0059] In this embodiment, the cover plate 200 includes a photosensitive pattern 22 and an electrode 23 in contact with the photosensitive pattern 22. That is, by designing the photosensitive pattern 22 on the cover plate 200 and connecting it to the bonding structure 30 of the display component 100 through the conductive part 300, the brightness of the display module can be adjusted by sensing the brightness of the external environment. Moreover, compared with the conventional method of setting the ambient light sensor on a flexible circuit board, the ambient light detection scheme provided by this embodiment can increase the photosensitive area and improve the photosensitive sensitivity performance of the display module. On the other hand, the display module can also omit the ambient light sensor and its peripheral components, realizing a thinner and lighter design.
[0060] In one possible implementation, referring to FIG1A, the first position can be the area of the cover plate 100 corresponding to the bonding structure 30 of the display component 200. In this embodiment of the present disclosure, by breaking the photosensitive pattern 22 at the first position to form a notch Q, and setting the electrode 23 near the notch Q, on the one hand, a larger area of photosensitive pattern 22 can be formed, improving the sensitivity of the display module to ambient light; on the other hand, it is also convenient to connect the electrode 23 to the bonding structure 20 of the display component 100 at the first position, improving the feasibility of detecting ambient light through the photosensitive pattern 22 in this embodiment of the present disclosure.
[0061] In one possible implementation, the peripheral area BB includes: a binding area BB1 disposed opposite to each other, a binding opposite side area BB1, and two side areas connecting the binding area BB1 and the binding opposite side area BB2 (which may be a first side area BB3 and a second side area BB4 respectively).
[0062] The photosensitive pattern 22 includes: a first photosensitive pattern portion 221 and a second photosensitive pattern portion 222 disposed opposite to each other; a third photosensitive pattern portion 223 connecting one end of the first photosensitive pattern portion 221 and one end of the second photosensitive pattern portion 222; and a fourth photosensitive pattern portion 224 connecting the other end of the first photosensitive pattern portion 221 and the other end of the second photosensitive pattern portion 222. The first photosensitive pattern portion 221 is located in the binding area BB1, the second photosensitive pattern portion 222 is located in the binding opposite side area BB2, and the third photosensitive pattern portion 223 and the fourth photosensitive pattern portion 224 are respectively located in two side areas. For example, the third photosensitive pattern 223 is located in the first side area BB3, and the fourth photosensitive pattern 224 is located in the second side area BB4. The notch Q is located in the first photosensitive pattern portion 221.
[0063] In this embodiment of the present disclosure, photosensitive patterns 22 can be provided in each partition of the peripheral area BB surrounding the display area AA of the display device, and the photosensitive patterns 22 can be integrated into a strip pattern. Electrodes 23 are provided at the two ends of the strip pattern to realize the export of photogenerated carriers, thereby realizing photosensitive detection.
[0064] In one possible implementation, the photosensitive pattern 22 may be made of a semiconductor material that generates electrons when illuminated. The material of the photosensitive pattern 22 may include: low-temperature polycrystalline silicon, or rare-earth-doped metal oxides. The metal oxide semiconductor material may include any one or more of the following: amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), or indium zinc tin oxide (IZTO), indium gallium zinc oxide (IGZO), indium gallium oxide (IGO), indium gallium zinc tin oxide (IGZTO), indium zinc oxide (IZO), and rare-earth-doped metal oxides (RE-OS), wherein the rare-earth-doped metal oxide may include lanthanide-doped metal oxides (Ln-OS).
[0065] In one possible implementation, referring to FIG1A, in the area other than the notch Q, the orthographic projection of the photosensitive pattern 22 onto the substrate 21 can coincide with the orthographic projection of the ink 24 onto the substrate 21; in another possible implementation, referring to FIG1A, in the area other than the notch Q, the orthographic projection of the ink 24 onto the substrate 21 can cover the orthographic projection of the photosensitive pattern 22 onto the substrate 21, that is, the photosensitive pattern 22 is recessed relative to the inner and outer edges of the ink 24.
[0066] In one possible implementation, referring to FIG1B, the width a1 of the notch Q in the first direction X is the same as the width a2 of the second photosensitive pattern portion 222 in the first direction X. The bonding area BB1 can extend along the second direction Y, and the first direction X can be perpendicular to the extension direction of the bonding area BB1. In this embodiment of the present disclosure, the width a1 of the notch Q in the first direction X is the same as the width a2 of the second photosensitive pattern portion 222 in the first direction X. That is, the photosensitive pattern 22 is completely broken in the first direction X, so as to avoid the problem that when the photosensitive pattern 22 is a complete ring structure, when the electrode 23 is set in a fixed position, the photosensitive pattern 22 forms a short circuit-like situation in the area between the two electrodes 23, resulting in a small effective detection area and poor detection sensitivity.
[0067] In one possible implementation, referring to Figures 1A-1D and Figure 3A, the cover plate 200 further includes ink 24 located on the side of the electrode 23 facing the substrate 21; the ink 24 is disposed around the display area AA; the orthographic projection of the ink 24 on the substrate 21 covers the orthographic projection of the photosensitive pattern 22 on the substrate 21 and the orthographic projection of the notch Q on the substrate 21. In this embodiment of the present disclosure, the orthographic projection of the ink 24 on the substrate 21 covers the orthographic projection of the photosensitive pattern 22 on the substrate 21 and the orthographic projection of the notch Q on the substrate 21. That is, the photosensitive pattern 22 is disposed in the area where the ink 24 is located. Since the area where the ink 24 is located is usually a non-display area, the normal display of the display device can be avoided due to the placement of the photosensitive pattern 22; in addition, the photosensitive pattern 22 is located between the substrate 21 and the ink 24, that is, ambient light first enters the layer where the photosensitive pattern 22 is located, and then enters the ink 24. This avoids the problem that if the photosensitive pattern 22 is located on the side of the ink 24 away from the substrate 21, the light will be blocked by the ink 24, and the detection of ambient light will not be possible.
[0068] In one possible implementation, referring to FIG3A, the ink 24 has an opening K that exposes at least a portion of the electrode 23. In this embodiment of the present disclosure, the ink 24 has an opening K that exposes at least a portion of the electrode 23, thereby facilitating electrical connection of the electrode 23 to the bonding structure 30 of the display assembly 100 through the opening K.
[0069] In one possible implementation, referring to FIG3A, the ink 24 includes: a first sub-ink layer 241, and a second sub-ink layer 242 located on the side of the first sub-ink layer 241 facing the display component 100; the opening K includes: a first sub-opening K1, and a second sub-opening K2; the first sub-opening K1 is located on the first sub-ink layer 241; the second sub-opening K2 is located on the second sub-ink layer 242; the size of the first sub-opening K1 is smaller than the size of the second sub-opening K2. In this embodiment of the present disclosure, the size of the first sub-opening K1 is smaller than the size of the second sub-opening K2, which can avoid the problem that if the size of the second sub-opening K2 is smaller, the electrode 23 and the bonding structure 30 may not be able to conduct through the conductive part 300 when a process deviation occurs.
[0070] In one possible implementation, referring to Figures 3A and 3B, the size of the first sub-opening K1 is smaller than the size of the second sub-opening K2. This can be that the size b1 of the first sub-opening K1 in the second direction Y is smaller than the size b2 of the second sub-opening K2 in the second direction Y, and the size b3 of the first sub-opening K1 in the first direction X is smaller than the size b4 of the second sub-opening K2 in the first direction X.
[0071] In another possible implementation, the size of the first sub-opening K1 can also be larger than the size of the second sub-opening K2.
[0072] In one possible implementation, referring to FIG1B, electrode 23 includes: a first sub-electrode 231 and a second sub-electrode 232; the first sub-electrode 231 is located at one end of the photosensitive pattern 22 near the notch Q, and the second sub-electrode 232 is located at the other end of the photosensitive pattern 22 near the notch Q.
[0073] In one possible implementation, referring to FIG1B, the outer edge f1 of the first sub-electrode 231 facing the notch Q along the first direction X may coincide with one of the outer edges f2 of the photosensitive pattern 22 near the notch Q; the outer edge f3 of the second sub-electrode 232 facing the notch Q along the first direction X may coincide with another outer edge f4 of the photosensitive pattern 22 near the notch Q.
[0074] In one possible implementation, referring to FIG1B, the bonding structure 30 includes: a bonding terminal group 31, a first conductive pad 321 located on one side of the bonding terminal group 31, and a second conductive pad 322 located on the other side of the bonding terminal group 31; the orthographic projection of the first conductive pad 321 onto the substrate 21 overlaps with the orthographic projection of the first sub-electrode 231 onto the substrate 21; the orthographic projection of the second conductive pad 322 onto the substrate 21 overlaps with the orthographic projection of the second sub-electrode 232 onto the substrate 21. This facilitates electrical connection between the first sub-electrode 231 and the first conductive pad 321, and between the second sub-electrode 232 and the second conductive pad 322.
[0075] In one possible implementation, referring to FIG1E, which is a partially enlarged schematic diagram of the bonding structure 20, the bonding terminal group 31 includes: a plurality of terminals 310 arranged along the second direction Y; a first conductive pad 321 with a dimension c1 in the second direction Y, which is larger than the dimension c3 of the terminal 310 in the second direction Y; and a second conductive pad 322 with a dimension c2 in the second direction Y, which is larger than the dimension c3 of the terminal 310 in the second direction Y. In this embodiment, the first conductive pad 321 and / or the second conductive pad 322 are larger than the size of the terminal 310. That is, by separately manufacturing the larger first conductive pad 321 and the second conductive pad 322, it is easier to electrically connect with the first sub-electrode 231 and the second sub-electrode 232. This avoids the problem that if the first sub-electrode 231 and the second sub-electrode 232 are directly connected to the bonding terminal 310 of the display component 100, the bonding terminal 310 is small in size and the spacing between two adjacent bonding terminals 310 is small. When connecting them with conductive adhesive later, the first sub-electrode 231 (or the second sub-electrode 232) may be connected to multiple terminals 310 at the same time, resulting in abnormal bonding and the inability to perform normal ambient light detection.
[0076] In one possible implementation, as shown in FIG1A, the area of the first sub-electrode 231 projected onto the substrate 21 is larger than the area of the first conductive pad 321 projected onto the substrate 21; the area of the second sub-electrode 232 projected onto the substrate 21 is larger than the area of the second conductive pad 322 projected onto the substrate 21. In this embodiment of the present disclosure, the area of the first sub-electrode 231 projected onto the substrate 21 is larger than the area of the first conductive pad 321 projected onto the substrate 21; the area of the second sub-electrode 232 projected onto the substrate 21 is larger than the area of the second conductive pad 322 projected onto the substrate 21. That is, by making the sizes of the first sub-electrode 231 and the second sub-electrode 232 larger, the effective contact between the first sub-electrode 231 and the second sub-electrode 232 and the photosensitive pattern 22 can be increased, thereby improving the reliability of the ambient light detection device in this embodiment of the present disclosure.
[0077] In one possible implementation, as shown in FIG1A, the conductive part 300 includes: a first conductive part 301 and a second conductive part 302; the first sub-electrode 231 is connected to the first conductive pad 231 through the first conductive part 301, and the second sub-electrode 232 is connected to the second conductive pad 322 through the second conductive part 302.
[0078] In one possible implementation, the conductive part 300 includes conductive adhesive. In a specific implementation, the conductive part 300 can be formed by dispensing adhesive. When dispensing adhesive, the amount of adhesive can be made relatively full so that after the cover plate 200 is attached to the display component 100, the contact points (i.e., the first sub-electrode 231 or the second sub-electrode 232) on the cover plate 200 can be electrically connected to the contact points (i.e., the first conductive pad 321 or the second conductive pad 322) on the display component 100, thereby forming a structure similar to a photoresistor.
[0079] In another possible implementation, the conductive part 200 may also be other structures, for example, it may also be a connecting wire.
[0080] In one possible implementation, referring to FIG2, the display assembly 100 includes: a display panel 10, a touch panel 20 located on the side of the display panel 10 facing the cover plate 200, and a bonding structure 30 located on the side of the touch panel 20 facing the cover plate 200. In this embodiment, the bonding structure 30 may be a structure of a touch flexible circuit board. In this embodiment, since the touch panel 20 is usually close to the cover plate 200, electrically connecting the electrodes 23 of the cover plate 200 to the bonding structure 30 of the nearby touch panel 20 can reduce the difficulty of connecting the electrodes 23 to external circuits and facilitate fabrication.
[0081] In this embodiment of the disclosure, the touch panel can be an on-cell touch panel. The touch panel 20 can be a separate structure independent of the display panel 10.
[0082] Based on the same inventive concept, this disclosure also provides a method for manufacturing a display device as provided in this disclosure, wherein, as shown in FIG4, the manufacturing method includes:
[0083] Step S100: Form a cover plate with a photosensitive pattern and electrodes;
[0084] Step S200: Form a display component with a binding structure;
[0085] Step S300: A conductive part is formed at the bonding structure of the display component, and the cover plate is attached to the display component so that the electrodes of the bonding structure of the display component and the cover plate are electrically connected through the conductive part.
[0086] In one possible implementation, step S100, forming a cover plate with a photosensitive pattern and electrodes, includes:
[0087] Step S101: A photosensitive pattern is formed on one side of the substrate by the direction of spraying, and a notch is formed in the photosensitive pattern at the first position;
[0088] Step S102: An electrode is formed on the side of the photosensitive pattern away from the substrate and at the end of the photosensitive pattern near the notch.
[0089] Step S103: Form ink on the side of the electrode layer that is opposite to the photosensitive pattern layer.
[0090] To better understand the manufacturing method of the display device provided in the embodiments of this disclosure, the following further explanation is provided:
[0091] Step 1: Apply photosensitive material to the ink area on the back of the cover plate using spraying or other methods (considering the photosensitive material has a certain color, to avoid display problems, the photosensitive material is only applied to the ink area; the impedance of the photosensitive material is inversely proportional to the brightness of the light). However, an area without photosensitive material needs to be designed above the bonding area of the TFPC (only two layers of insulating ink are needed). Next, create two large metal electrode areas on the edge of the photosensitive material (to enhance the effective contact of the circuit) as electrodes. Finally, screen print two sheets of conventional ink, ensuring that the two conductive contact points are exposed.
[0092] Step 2: Add additional contact points (i.e., the first conductive pad 321 or the second conductive pad 322) to the touch panel of the display panel, that is, add additional contact points on both sides of the bonding terminal (PIN) of the conventional touch sensor.
[0093] Step 3: After the flexible circuit board bonding process of the touch panel, apply conductive adhesive to the contact points, ensuring a full application of adhesive. Then, perform the cover plate bonding operation. Because the adhesive is applied fully to the contact points, the contact points on the cover plate are electrically connected to the contact points on the touch panel, thus forming a structure similar to a photoresistor. The entire device or display module uses the resistance value as feedback to control the brightness of the display module, achieving the function of light sensing.
[0094] In some embodiments, the display panel provided in this disclosure may further include a liquid crystal layer between an array substrate and a counter substrate, a first polarizer on the side of the array substrate away from the counter substrate, and a second polarizer on the side of the counter substrate away from the array substrate, wherein the polarization direction of the first polarizer and the polarization direction of the second polarizer are perpendicular to each other. Other essential components of the display panel are those which should be understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting the scope of this disclosure.
[0095] Based on the same inventive concept, this disclosure also provides a display device, comprising the display panel described above and a backlight module located on the light-incident side of the display panel. The backlight module can be a direct-lit backlight module or an edge-lit backlight module. Optionally, the edge-lit backlight module may include LED strips, stacked reflective sheets, light guide plates, diffusers, prism groups, etc., with the LED strips located on one side of the thickness direction of the light guide plate. The direct-lit backlight module may include a matrix light source, a reflective sheet, a diffuser plate, and a brightness enhancement film stacked on the light-emitting side of the matrix light source, with the reflective sheet including openings directly opposite the positions of the LEDs in the matrix light source. The LEDs in the LED strips and the LEDs in the matrix light source can be light-emitting diodes (LEDs), such as miniature LEDs (Mini LEDs, Micro LEDs, etc.).
[0096] Micro-LEDs, at the sub-millimeter or even micrometer scale, are self-emissive devices, just like organic light-emitting diodes (OLEDs). Like OLEDs, they offer a range of advantages, including high brightness, ultra-low latency, and ultra-wide viewing angles. Furthermore, because inorganic LEDs emit light based on more stable and lower-resistance metal semiconductors, they offer advantages over organic LEDs, such as lower power consumption, better resistance to high and low temperatures, and longer lifespan. When used as backlights, micro-LEDs can achieve more precise dynamic backlighting effects, effectively improving screen brightness and contrast while eliminating glare caused by traditional dynamic backlighting between bright and dark areas, thus optimizing the visual experience.
[0097] In some embodiments, the display device provided in this disclosure can be any product or component with display function, such as a projector, 3D printer, virtual reality device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, smartwatch, fitness wristband, or personal digital assistant. Optionally, the display device provided in this disclosure includes, but is not limited to, components such as a radio frequency unit, network module, audio output & input unit, sensor, display unit, user input unit, interface unit, and control chip. Optionally, the control chip is a central processing unit, digital signal processor, system-on-a-chip (SoC), etc. For example, the control chip may also include a memory, a power module, etc., and achieve power supply and signal input / output functions through additionally provided wires, signal lines, etc. For example, the control chip may also include hardware circuits and computer-executable code. The hardware circuit may include conventional very-large-scale integrated circuits (VLSI) or gate arrays, as well as existing semiconductors or other discrete components such as logic chips and transistors; the hardware circuit may also include field-programmable gate arrays, programmable array logic, programmable logic devices, etc. Furthermore, those skilled in the art will understand that the above structure does not constitute a limitation on the display device provided in the embodiments of this disclosure. In other words, the display device provided in the embodiments of this disclosure may include more or fewer of the above components, or combine certain components, or have different component arrangements.
[0098] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.
[0099] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if these modifications and variations to the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.
Claims
1. A display device having a display area and a peripheral area located around the periphery of the display area, wherein, The display device includes: A display component having a binding structure in the peripheral area; A cover plate includes: a substrate, a photosensitive pattern located on the side of the substrate facing the display component, and an electrode located on the side of the photosensitive pattern facing the display component and in contact with the photosensitive pattern; the photosensitive pattern is disposed around the display area and is broken at a first position to form a notch; the electrode is located at the end of the photosensitive pattern near the notch; A conductive portion is located in the peripheral area between the display component and the cover plate, and the electrode is electrically connected to the bonding structure through the conductive portion.
2. The display device as claimed in claim 1, wherein, The surrounding area includes: a binding area disposed opposite to the binding area, a binding opposite side area, and two side areas connecting the binding area and the binding opposite side area; The photosensitive pattern includes: a first photosensitive pattern portion, a second photosensitive pattern portion, and a third photosensitive pattern portion connecting one end of the first photosensitive pattern portion and one end of the second photosensitive pattern portion, and a fourth photosensitive pattern portion connecting the other end of the first photosensitive pattern portion and the other end of the second photosensitive pattern portion; the first photosensitive pattern portion is located in the binding area, the second photosensitive pattern portion is located in the binding opposite side area, and the third photosensitive pattern portion and the fourth photosensitive pattern portion are respectively located in the two side areas; The notch is located in the first photosensitive pattern area.
3. The display device as claimed in claim 2, wherein, The width of the notch in the first direction is the same as the width of the second photosensitive pattern portion in the first direction.
4. The display device as claimed in claim 2 or 3, wherein, The cover plate also includes ink located on the side of the electrode facing the substrate; the ink is disposed around the display area; The ink covers the orthographic projection of the substrate, the orthographic projection of the photosensitive pattern on the substrate, and the orthographic projection of the notch on the substrate.
5. The display device as claimed in claim 4, wherein, The ink has an opening that exposes at least a portion of the electrode.
6. The display device as claimed in claim 4 or 5, wherein, The ink includes: a first sub-ink layer, and a second sub-ink layer located on the side of the first sub-ink layer facing the display component; The opening includes: a first sub-opening and a second sub-opening; the first sub-opening is located in the first sub-ink layer; the second sub-opening is located in the second sub-ink layer; the size of the first sub-opening is smaller than the size of the second sub-opening.
7. The display device according to any one of claims 1-6, wherein, The electrode includes a first sub-electrode and a second sub-electrode; the first sub-electrode is located at one end of the photosensitive pattern near the notch, and the second sub-electrode is located at the other end of the photosensitive pattern near the notch.
8. The display device as claimed in claim 7, wherein, The bonding structure includes: a bonding terminal group, a first conductive pad located on one side of the bonding terminal group, and a second conductive pad located on the other side of the bonding terminal group; The orthographic projection of the first conductive pad on the substrate overlaps with the orthographic projection of the first sub-electrode on the substrate; the orthographic projection of the second conductive pad on the substrate overlaps with the orthographic projection of the second sub-electrode on the substrate.
9. The display device as claimed in claim 8, wherein, The bonding terminal group includes: a plurality of terminals arranged along the second direction; The first conductive pad is larger in size in the second direction than the terminal is in size in the second direction; the second conductive pad is larger in size in the second direction than the terminal is in size in the second direction.
10. The display device as claimed in claim 8 or 9, wherein, The area of the first sub-electrode projected onto the substrate is larger than the area of the first conductive pad projected onto the substrate; the area of the second sub-electrode projected onto the substrate is larger than the area of the second conductive pad projected onto the substrate.
11. The display device according to any one of claims 8-10, wherein, The conductive portion includes: a first conductive portion and a second conductive portion; The first sub-electrode is connected to the first conductive pad through the first conductive part, and the second sub-electrode is connected to the second conductive pad through the second conductive part.
12. The display device according to any one of claims 1-11, wherein, The conductive part includes: conductive adhesive.
13. The display device according to any one of claims 1-12, wherein, The display component includes: a display panel, and a touch panel located on the side of the display panel facing the cover plate; The bonding structure is located on the side of the touch panel facing the cover plate.
14. A method for manufacturing a display device as described in any one of claims 1-13, wherein, include: A cover plate with a photosensitive pattern and electrodes is formed; Form a display component with a binding structure; A conductive portion is formed at the bonding structure of the display component, and the cover plate is attached to the display component so that the bonding structure of the display component and the electrodes of the cover plate are electrically connected through the conductive portion.
15. The manufacturing method as described in claim 14, wherein, The formation of the cover plate having a photosensitive pattern and electrodes includes: A photosensitive pattern is formed on one side of the substrate by spraying, and a notch is formed in the photosensitive pattern at the first position. An electrode is formed on the side of the photosensitive pattern that faces away from the substrate and at the end of the photosensitive pattern near the notch; Ink is formed on the side of the electrode layer opposite to the photosensitive pattern layer.