Cooling device for cooling an electronic device
The cooling device with symmetrically contoured fins addresses the high pressure drop issue in direct cooling, providing efficient and cost-effective thermal management for electronic devices.
WO2026130686A1PCT designated stage Publication Date: 2026-06-25HUAWEI TECH CO LTD +1
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2024-12-18
- Publication Date
- 2026-06-25
AI Technical Summary
Technical Problem
Existing direct cooling methods for electronic devices, such as pin-fin base plates, suffer from high pressure drops and require powerful pumps and complex configurations, which are costly and spatially demanding.
Method used
A cooling device with a base plate featuring symmetrically contoured fins that minimize flow resistance and pressure drop, allowing for efficient heat transfer and reduced pump requirements, made from materials like copper or stainless steel, and adaptable for various electronic devices.
Benefits of technology
The device achieves efficient heat dissipation with low flow resistance and pressure drop, enabling lower-cost, compact, and reliable cooling solutions suitable for high-power applications.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure EP2024087267_25062026_PF_FP_ABST
Abstract
The present disclosure relates to techniques of active cooling of an electronic device. Particularly, it is provided a cooling device comprising a base plate comprising a first main surface extending in a longitudinal direction and comprising a plurality of fins extending from the first main surface in a fin height direction. Each fin has a cross section perpendicular to the fin height direction with a contour defined by two halves of the contour that are symmetric to each other with respect to a symmetry axis perpendicular to the fin height direction, wherein the first half of the two halves of the contour consists of a first round arc region between and extending into a first and a second extension region and the second half of the two halves of the contour consists of a second round arc region between and extending into a third and a fourth extension region.
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