Substrate processing device, film deposition system, control method, and electronic device manufacturing method
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- CANON TOKKI CORP
- Filing Date
- 2025-10-15
- Publication Date
- 2026-06-25
Smart Images
Figure JP2025036271_25062026_PF_FP_ABST
Abstract
Claims
1. A substrate processing apparatus comprising: an electrostatic chuck for adsorbing a substrate to be deposited on; a detection means for detecting the behavior of the substrate when adsorption by the electrostatic chuck is released; and a control means for setting the driving conditions of the electrostatic chuck based on the detection result of the detection means.
2. A substrate processing apparatus according to claim 1, wherein the detection means detects the number of vibrations of the substrate as a behavior of the substrate.
3. A substrate processing apparatus according to claim 1, wherein the detection means detects the position of the substrate relative to the electrostatic chuck as a behavior of the substrate.
4. A substrate processing apparatus according to claim 1, comprising a substrate support means for supporting the peripheral edge of the substrate that has been brought in and for transferring the substrate to the electrostatic chuck, wherein when the suction by the electrostatic chuck is released, the peripheral edge of the substrate is supported by the substrate support means.
5. A substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a film deposition apparatus comprising a deposition means for releasing a deposition material onto the substrate via a mask.
6. A substrate processing apparatus according to claim 5, wherein the film deposition apparatus is a deposit-up type film deposition apparatus.
7. A substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is a measuring apparatus equipped with a measuring means for measuring the thickness of a film formed on the substrate adsorbed by the electrostatic chuck.
8. A substrate processing apparatus according to claim 1, characterized in that it comprises a means for removing static electricity from the substrate.
9. A film deposition system for depositing a vapor-deposited material onto a substrate, comprising: a first device and a second device, wherein the first device comprises: a first electrostatic chuck for adsorbing the substrate to be deposited; and a first detection means for detecting the behavior of the substrate when the adsorption by the first electrostatic chuck is released; and the second device comprises: a second electrostatic chuck for adsorbing the substrate to be deposited; and the driving conditions for the second electrostatic chuck are set based on the detection result of the first detection means.
10. A film deposition system according to claim 9, characterized in that, in the order of transporting the substrate, the first device is a device that transports the substrate before the second device.
11. A film deposition system according to claim 9, characterized in that, in the order of transporting the substrate, the second device is a device that transports the substrate before the first device.
12. A film deposition system according to claim 9, characterized in that the driving conditions for the second electrostatic chuck are the driving conditions when the second electrostatic chuck adsorbs the same substrate as the substrate adsorbed by the first electrostatic chuck.
13. A film deposition system according to claim 9, characterized in that the driving conditions for the second electrostatic chuck are the driving conditions when the second electrostatic chuck adsorbs a substrate different from the substrate adsorbed by the first electrostatic chuck.
14. A film deposition system according to claim 9, wherein the second apparatus comprises a second detection means for detecting the behavior of the substrate when the adsorption by the second electrostatic chuck is released, and the driving conditions for the second electrostatic chuck are set based on the detection result of the first detection means and the detection result of the second detection means.
15. A film deposition system according to claim 9, characterized in that the driving condition is a condition relating to the voltage applied to the electrodes of the second electrostatic chuck.
16. A film deposition system according to claim 9, characterized in that it comprises a static elimination means for removing static electricity from the substrate.
17. A control method characterized by comprising: a step of adsorbing a substrate to be deposited on using an electrostatic chuck; a detection step of detecting the behavior of the substrate when the adsorption by the electrostatic chuck is released; and a setting step of setting the driving conditions of the electrostatic chuck based on the detection result of the detection step.
18. A control method characterized by comprising: a step of adsorbing a substrate to be deposited on with a first electrostatic chuck; a detection step of detecting the behavior of the substrate when the adsorption by the first electrostatic chuck is released; and a setting step of setting the driving conditions for a second electrostatic chuck that adsorbs the substrate to be deposited on, based on the detection result of the detection step.
19. A method for manufacturing an electronic device, characterized by comprising a film deposition step of depositing a film on a substrate using the film deposition apparatus described in claim 5.
20. A method for manufacturing an electronic device, characterized by comprising a film deposition step of depositing a film on a substrate using the film deposition system described in claim 9.