Translucent member
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ALPS ALPINE CO LTD
- Filing Date
- 2025-11-19
- Publication Date
- 2026-06-25
AI Technical Summary
Existing technologies face challenges in improving the visibility of antennas in light-transmitting components while maintaining antenna sensitivity and preventing radio wave interference.
A translucent member with a configuration that includes power supply wiring patterns and a metal antenna pattern, where the gap between metal wires is wider than the width of the wires, and a dummy metal wiring pattern is added to reduce parasitic capacitance and radio wave interference, enhancing invisibility and sensitivity.
The configuration achieves improved invisibility of antennas on translucent substrates while preventing a decrease in sensitivity and reducing radio wave interference.
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Figure JP2025040364_25062026_PF_FP_ABST
Abstract
Description
Light-transmissive member
[0001] The present invention relates to a light-transmissive member.
[0002] Patent Document 1 discloses a system for determining a line-of-sight detection position, including a device configured to be worn on the head of a wearer, and one or more illumination light sources attached to the device within the visual field of the eyes of the wearer wearing the device. The one or more illumination light sources are arranged to illuminate the eyes, and the one or more illumination light sources are configured to minimize interference with the vision of the wearer within the visual field. One or more illumination light sources, an eye detection camera attached to the device and arranged to view the eyes, and a processor connected to the eye detection camera for analyzing an image of the eyes acquired by the eye detection camera to identify one or more flashes reflected from the eyes from the one or more illumination light sources, and identifying the position of the features of the eyes relative to the one or more flashes, and determining the position being visually recognized by the wearer.
[0003] Patent Document 2 discloses an assembly including a transparent substrate including a first surface and a second surface opposite the first surface, wherein the first surface includes a visual region through which light passes before reaching an eye box, and a plurality of microdevices attached to the first surface and coupled to respective conductive paths arranged in a pseudo-random pattern, the plurality of microdevices including at least one microdevice arranged within the visual region.
[0004] Patent Document 3 discloses an antenna device in which a mesh-like antenna pattern is formed on a transparent base member by a plurality of first metal lines extending along the direction in which an antenna current flows and a plurality of second metal lines extending along a direction intersecting the first metal lines, and the interval at which the second metal lines are arranged is larger than the interval at which the first metal lines are arranged.
[0005] Patent Document 4 discloses a wiring circuit board comprising a transparent substrate, a first terminal portion formed on the transparent substrate, a second terminal portion formed on the transparent substrate, and a wiring layer formed on the transparent substrate to connect the first terminal portion and the second terminal portion, wherein a slit extending continuously from the first terminal portion to the second terminal portion is formed in the wiring layer.
[0006] Japanese Patent Publication No. 2014-532542, Japanese Patent Publication No. 2021-534837, Japanese Patent Publication No. 2013-172384, Japanese Patent Publication No. 2023-086005
[0007] When placing antennas with conductive wiring in the field of view or optical path, such as in components worn in front of the eyes like glasses or goggles, or in light-transmitting components, it is necessary to improve the visibility of these antennas. On the other hand, it is also necessary to prevent a decrease in sensitivity as an antenna while improving its visibility.
[0008] The present invention aims to provide a translucent member that can achieve both improved invisibility of an antenna provided on a translucent substrate and prevention of a decrease in sensitivity.
[0009] One aspect of the present invention is a translucent insulating substrate, a plurality of power supply wiring patterns provided on the insulating substrate, and a metal antenna pattern arranged in parallel with the power supply wiring patterns, wherein the plurality of power supply wiring patterns have a first power supply wiring pattern composed of an external connection pad formed on the outer edge side of the insulating substrate, a first connection pad, and a connection wire connecting the external connection pad and the first connection pad, the connection wire has a parallel section having a plurality of spaced-apart metal wires, in the parallel section the gap between two adjacent metal wires is formed to be wider than the width of the metal wires, the metal antenna pattern has a plurality of spaced-apart metal fine wires whose extension direction is the same as that of the plurality of metal wires in the parallel section, and a floating dummy metal wiring pattern extending in the same direction as the extension direction is formed between the first power supply wiring pattern and the metal antenna pattern, making it a translucent member.
[0010] This configuration reduces the difference in density between the power supply wiring pattern and the metal antenna pattern, ensuring invisibility, and also reduces parasitic capacitance with the power supply wiring pattern, preventing a decrease in the sensitivity of the metal antenna pattern. Furthermore, the dummy metal wiring pattern reduces radio wave interference from the power supply wiring pattern and improves the directivity of the metal antenna pattern.
[0011] In the above-described translucent member, the dummy metal wiring pattern may be discontinuous due to intermittent sections. This reduces the parasitic capacitance of the dummy metal wiring pattern and prevents a decrease in the sensitivity of the metal antenna pattern.
[0012] In the above-described translucent member, the dummy metal wiring pattern may be discontinuous due to multiple intermittent sections. This further reduces the parasitic capacitance of the dummy metal wiring pattern, preventing a decrease in the sensitivity of the metal antenna pattern.
[0013] In the above-described translucent member, the metal antenna pattern has multiple metal connection wires for antennas that electrically connect multiple metal wires and external connection pads for antennas, extending in the same direction as the extension direction and spaced apart from each other, and multiple metal grounding patterns that extend in the same direction as the extension direction and spaced apart from each other may be formed between the multiple metal connection wires for antennas and the first feed wiring pattern. This prevents noise from entering the metal antenna pattern due to radio wave interference between the first feed wiring pattern and the metal connection wires for antennas, and improves invisibility by eliminating differences in density.
[0014] In the above-described translucent member, the metal grounding pattern may extend between the dummy metal wiring pattern and the first power supply wiring pattern. This prevents noise from entering the antenna due to radio wave interference from the first power supply wiring pattern to the metal antenna pattern, and eliminates differences in density, ensuring invisibility.
[0015] In the above-described translucent member, the first power supply wiring pattern may be formed on the inner surface of the insulating substrate, and the metal antenna pattern may be formed on the outer surface of the insulating substrate. This prevents noise from entering the antenna due to radio wave interference from the first power supply wiring pattern to the metal antenna pattern, and improves antenna sensitivity by positioning the metal antenna pattern outside the insulating substrate.
[0016] The above-described translucent member may further include a translucent grounding pattern formed on the inner surface of the insulating substrate facing the metal antenna pattern. This further prevents noise from entering the antenna due to radio wave interference from the first power supply wiring pattern or the human body to the metal antenna pattern.
[0017] According to the present invention, it is possible to provide a translucent member that can achieve both improved invisibility of an antenna provided on a translucent substrate and prevention of a decrease in sensitivity.
[0018] This is a schematic plan view illustrating a translucent member according to the first embodiment. This is a cross-sectional view taken along the line A1-A1' in Figure 1A. This is a cross-sectional view taken along the line A2-A2' in Figure 1A. This is an enlarged view of part A in Figure 1A. This is a cross-sectional view taken along the line A3-A3' in Figure 2A. This is an enlarged view showing an example of another metal grounding pattern. This is a cross-sectional view taken along the line A4-A4' in Figure 3A. This is a schematic plan view illustrating a translucent member according to the second embodiment. This is a cross-sectional view taken along the line B1-B1' in Figure 4A. This is a schematic plan view illustrating a translucent member according to the third embodiment. This is a cross-sectional view taken along the line C1-C1' in Figure 5A. This is a schematic plan view illustrating a translucent member according to the fourth embodiment. This is a cross-sectional view taken along the line D1-D1' in Figure 6A. This is a schematic cross-sectional view illustrating metal wiring. This is a schematic cross-sectional view illustrating metal wiring. This is a schematic cross-sectional view illustrating metal wiring. This is a schematic cross-sectional view showing an example of another connection wiring and connection pad. This figure shows an example of wiring components for eyewear. It is a magnified schematic diagram of the lens portion.
[0019] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, the same reference numerals will be used for identical components, and components that have already been described will be omitted from the description as appropriate.
[0020] (First Embodiment) Figure 1A is a schematic plan view illustrating a translucent member according to the first embodiment. Figure 1B is a cross-sectional view taken along the line A1-A1' in Figure 1A. Figure 1C is a cross-sectional view taken along the line A2-A2' in Figure 1B.
[0021] The light-transmitting member 1A according to the first embodiment comprises a light-transmitting insulating substrate 10, a plurality of power supply wiring patterns 20 provided on the insulating substrate 10, and a metal antenna pattern 55 arranged in parallel with the power supply wiring patterns 20. Examples of materials for the insulating substrate 10 include resin (for example, PET (Polyethylene Terephthalate), COP (Cyclo Olefin Polymer), acrylic, CPI (Colorless and Transparent Polyimide)), and glass. A specific example of the insulating substrate 10 is the lens portion of eyeglasses (eyewear).
[0022] The insulating substrate 10 may or may not be light-transmitting. The insulating substrate 10 may form part of a product to which the power supply wiring pattern 20 and the metal antenna pattern 55 are applied, or it may temporarily hold the power supply wiring pattern 20 and the metal antenna pattern 55 and be removed (e.g., peeled off) after the power supply wiring pattern 20 and the metal antenna pattern 55 are transferred to the product to which they are applied.
[0023] The multiple power supply wiring patterns 20 provided on the insulating substrate 10 have a first power supply wiring pattern 21 composed of a first external connection pad 30A formed on the outer edge side of the insulating substrate 10, a first connection pad 31, and a connection wire 201 connecting the first external connection pad 30A and the first connection pad 31. The connection wire 201 includes a parallel section 202 having multiple metal wires 50 spaced apart from each other. As shown in Figure 1C, in the parallel section 202, the gap S between two adjacent metal wires 50 is wider than the width L of the metal wires 50. As a result, compared to the case where a single thick metal wire 50 constitutes the conductive wiring, the conductive wiring is divided into multiple wires and dispersed, improving invisibility without increasing electrical resistance.
[0024] In the light-transmitting member 1A, the connection wiring 201 and a plurality of connection pads (such as the first connection pad 31) of the power supply wiring pattern 20 are formed on one surface 10a of the insulating substrate 10. A wiring protection layer 40 (see Figures 1B and 1C) is formed on the connection wiring 201.
[0025] The metal antenna pattern 55 has multiple thin metal wires 55a for antennas, the extension direction of the multiple metal wires 50 of the parallel section 202 of the connecting wiring 201 is the same, and the wires are spaced apart from each other. The metal antenna pattern 55 is electrically connected to the external antenna connection pad 58 via multiple antenna metal connecting wires 57.
[0026] The length of the metal antenna pattern 55 is set according to the wavelength of the radio wave to be received. For example, the wavelength (λ) for the 2400 MHz band (Bluetooth®, Wi-Fi®) is 125 mm, λ / 2 is 62.5 mm, and λ / 4 is 31.25 mm. Also, the wavelength (λ) for the 5000 MHz band (Wi-Fi®) is 60 mm, λ / 2 is 30 mm, and λ / 4 is 15 mm. Also, the wavelength (λ) for the 6000 MHz band (Wi-Fi®) is 50 mm, λ / 2 is 25 mm, and λ / 4 is 12.5 mm. From the viewpoint of reception performance and miniaturization, it is preferable to match the length of the metal antenna pattern 55 to λ / 4.
[0027] A floating dummy metal wiring pattern 60 is formed between the first power supply wiring pattern 21 and the metal antenna pattern 55, extending in the same direction as their extension direction X. The dummy metal wiring pattern 60 reduces radio wave interference from the first power supply wiring pattern 21 and improves the directivity of the metal antenna pattern 55.
[0028] The dummy metal wiring pattern 60 may be provided between the first power supply wiring pattern 21 and the metal antenna pattern 55, as well as at appropriate positions on the insulating substrate 10. In the translucent member 1A, it is provided around the central region of the insulating substrate 10. By providing the dummy metal wiring pattern 60 adjacent to the power supply wiring pattern 20 and the metal antenna pattern 55 with the same width and spacing as them, the invisibility of the power supply wiring pattern 20 and the metal antenna pattern 55 is improved.
[0029] The multiple power supply wiring patterns 20 in the light-transmitting member 1A include a first power supply wiring pattern 21, a second power supply wiring pattern 22, a third power supply wiring pattern 23, a fourth power supply wiring pattern 24, and a fifth power supply wiring pattern 25.
[0030] The second power supply wiring pattern 22 consists of a second external connection pad 30B formed on the outer edge side of the insulating substrate 10, a second connection pad 32, and a connection wire 201 connecting the second external connection pad 30B and the second connection pad 32.
[0031] The third power supply wiring pattern 23 consists of a third connection pad 33, a fourth connection pad 34, and a connection wire 201 connecting the third connection pad 33 and the fourth connection pad 34. The third connection pad 33 is positioned adjacent to the first connection pad 31, with a gap between them.
[0032] The fourth power supply wiring pattern 24 consists of a fifth connection pad 35, a sixth connection pad 36, and a connection wire 201 connecting the fifth connection pad 35 and the sixth connection pad 36. The fifth connection pad 35 is positioned adjacent to the fourth connection pad 34, with a gap between them.
[0033] The fifth power supply wiring pattern 25 consists of a seventh connection pad 37, an eighth connection pad 38, and a connection wire 201 connecting the seventh connection pad 37 and the eighth connection pad 38. The seventh connection pad 37 is positioned adjacent to the sixth connection pad 36 with a gap between them, and the eighth connection pad 38 is positioned adjacent to the second connection pad 32 with a gap between them.
[0034] The first connection pad 31 and the third connection pad 33 constitute a connection unit with device D. That is, the first connection pad 31 and the third connection pad 33 are used as pads for mounting device D, and device D is mounted so as to straddle the space between the first connection pad 31 and the third connection pad 33.
[0035] Similarly, the fourth connection pad 34 and the fifth connection pad 35 constitute a connection unit with device D, the sixth connection pad 36 and the seventh connection pad 37 constitute a connection unit with device D, and the eighth connection pad 38 and the second connection pad 32 constitute a connection unit with device D. In the light-transmitting member 1A, the first power supply wiring pattern 21, the third power supply wiring pattern 23, the fourth power supply wiring pattern 24, the fifth power supply wiring pattern 25, and the second power supply wiring pattern 22 are arranged to form a series circuit via the connection unit with device D.
[0036] Figure 2A is an enlarged view of section A in Figure 1A. Figure 2B is a cross-sectional view taken along the line A3-A3' in Figure 2A. The metal antenna pattern 55 has a plurality of antenna metal wires 55a that extend in the same direction as the extension direction X and are arranged parallel to each other. As shown in Figure 2B, it is preferable that the width La of each of the plurality of antenna metal wires 55a is the same as the width L of each of the plurality of metal wirings 50 in the parallel section 202. It is also preferable that the gap Sa between two adjacent antenna metal wires 55a, 55a is the same as the gap S between two adjacent metal wirings 50 in the parallel section 202. This ensures the invisibility of the metal antenna pattern 55.
[0037] Furthermore, the dummy metal wiring pattern 60 has a plurality of dummy metal wires 60a that extend in the same direction as the extension direction X and are arranged parallel to each other. As shown in Figure 2B, it is preferable that the width Lb of each of the plurality of dummy metal wires 60a is the same as the width L of each of the plurality of metal wires 50 in the parallel section 202. Also, it is preferable that the gap Sb between two adjacent dummy metal wires 60a is the same as the gap S between two adjacent metal wires 50 in the parallel section 202. In other words, the plurality of dummy metal wires 60a, the plurality of thin metal wires 55a for the antenna, and the plurality of metal wires 50 in the parallel section 202 are arranged with the same line width and the same spacing. This ensures the invisibility of the dummy metal wiring pattern 60.
[0038] The dummy metal wiring pattern 60 may be provided on both sides of the metal antenna pattern 55. This places the metal antenna pattern 55 between the dummy metal wiring patterns 60, further improving the invisibility of the metal antenna pattern 55.
[0039] As shown in Figure 2A, the dummy metal wiring pattern 60 may be discontinuous due to intermittent sections 61. In this case, the dummy metal wiring pattern 60 may be discontinuous due to multiple intermittent sections 61. This reduces the parasitic capacitance of the dummy metal wiring pattern 60 and prevents a decrease in the sensitivity of the metal antenna pattern 55.
[0040] Furthermore, as shown in Figure 2A, multiple metal grounding patterns 75 may be formed between the multiple antenna metal connection wires 57 and the first power supply wiring pattern 21, extending in the same direction as the extension direction X and spaced apart from each other. This prevents noise from entering the metal antenna pattern 55 due to radio wave interference between the first power supply wiring pattern 21 and the antenna metal connection wires 57, and also improves visibility by eliminating differences in density.
[0041] Furthermore, the metal grounding pattern 75 may be provided on both sides of the multiple antenna metal connection wires 57. This arranges the multiple antenna metal connection wires 57 between the metal grounding patterns 75, which more effectively prevents noise from entering the metal antenna pattern 55 and improves the visibility of the multiple antenna metal connection wires 57.
[0042] Figure 3A is an enlarged view showing an example of another metal grounding pattern. Figure 3B is a cross-sectional view taken along line A4-A4' in Figure 3A. The metal grounding pattern 75 shown in Figure 3A extends between the dummy metal wiring pattern 60 and the first power supply wiring pattern 21. That is, multiple (for example, two) extension portions 75a, which are part of the metal grounding pattern 75, are provided extending in the extension direction X between the dummy metal wiring pattern 60 and the first power supply wiring pattern 21.
[0043] As shown in Figure 3B, it is preferable that the width Lc of each of the multiple extension portions 75a is the same as the width L of each of the multiple metal wires 50 in the parallel section 202. Also, it is preferable that the gap Sc between two adjacent extension portions 75a is the same as the gap S between two adjacent metal wires 50 in the parallel section 202. In other words, the multiple dummy metal wires 60a, the multiple thin metal antenna wires 55a, the multiple extension portions 75a, and the multiple metal wires 50 in the parallel section 202 are arranged with the same line width and the same spacing. This prevents noise from entering the antenna due to radio wave interference from the first power supply wiring pattern 21 to the metal antenna pattern 55, and eliminates differences in density, ensuring invisibility.
[0044] (Second Embodiment) FIG. 4A is a plan view schematically illustrating a light-transmissive member according to the second embodiment. FIG. 4B is a cross-sectional view taken along line B1 - B1' of FIG. 4A. The light-transmissive member 1B according to the second embodiment includes an insulating base material 10, a plurality of power supply wiring patterns 20, and a metal antenna pattern 55. In the light-transmissive member 1B, the metal antenna pattern 55 is provided on a side (for example, the other surface 10b) of the insulating base material 10 where the power supply wiring pattern 20 is not provided. Further, a ground pattern 76 may be provided on a side opposite to the side of the insulating base material 10 where the metal antenna pattern 55 is provided (for example, one surface 10a), and this ground pattern 76 may be light-transmissive (light-transmissive ground pattern).
[0045] By separating the metal antenna pattern 55 from the power supply wiring pattern 20, it becomes easier to suppress radio wave interference between the metal antenna pattern 55 and the power supply wiring pattern 20. Also, for example, when the light-transmissive member 1B is provided in the lens portion of eyewear, by placing the metal antenna pattern 55 on the outside (opposite side to the face), it becomes easier to receive radio waves sent from the outside.
[0046] (Third Embodiment) FIG. 5A is a plan view schematically illustrating a light-transmissive member according to the third embodiment. FIG. 5B is a cross-sectional view taken along line C1 - C1' of FIG. 5A. The light-transmissive member 1C according to the third embodiment has the same configuration as the light-transmissive member 1B according to the second embodiment, but the circuit configuration is different.
[0047] That is, the plurality of power supply wiring patterns 20 in the light-transmissive member 1C include, in addition to the first power supply wiring pattern 21, a second power supply wiring pattern 22, a third power supply wiring pattern 23, a sixth power supply wiring pattern 26, a seventh power supply wiring pattern 27, and an eighth power supply wiring pattern 28.
[0048] The second power supply wiring pattern 22 includes a second external connection pad 30B formed on the outer edge side of the insulating base material 10, a second connection pad 32, and a connection wiring 201 connecting between the second external connection pad 30B and the second connection pad 32.
[0049] The third power supply wiring pattern 23 consists of a third connection pad 33, a fourth connection pad 34, and a connection wire 201 connecting the third connection pad 33 and the fourth connection pad 34. The third connection pad 33 is positioned adjacent to the first connection pad 31 with a gap between them, and the fourth connection pad 34 is positioned adjacent to the second connection pad 32 with a gap between them.
[0050] The first connection pad 31 and the third connection pad 33 constitute a connection unit with device D, and the second connection pad 32 and the fourth connection pad 34 also constitute a connection unit with device D. The first power supply wiring pattern 21, the third power supply wiring pattern 23, and the second power supply wiring pattern 22 are arranged to form a series circuit via the connection unit with device D.
[0051] The sixth power supply wiring pattern 26 consists of a third external connection pad 30C formed on the outer edge side of the insulating substrate 10, a ninth connection pad 319, and a connection wire 201 connecting the third external connection pad 30C and the ninth connection pad 319.
[0052] The seventh power supply wiring pattern 27 consists of a fourth external connection pad 30D formed on the outer edge side of the insulating substrate 10, a tenth connection pad 310, and a connection wire 201 connecting the fourth external connection pad 30D and the tenth connection pad 310.
[0053] The eighth power supply wiring pattern 28 consists of an eleventh connection pad 311, a twelfth connection pad 312, a connection wire 201 connecting the eleventh connection pad 311 and the twelfth connection pad 312, and a fifth external connection pad 30E to which the twelfth connection pad 312 is connected by the connection wire 201. The eleventh connection pad 311 is positioned adjacent to the tenth connection pad 310 with a gap in between, and the twelfth connection pad 312 is positioned adjacent to the ninth connection pad 319 with a gap in between.
[0054] The 11th connection pad 311 and the 10th connection pad 310 form a connection unit with device D, and the 12th connection pad 312 and the 9th connection pad 319 form a connection unit with device D. As a result, the 8th power supply wiring pattern 28 is used as a common wiring, and the 6th power supply wiring pattern 26 and the 7th power supply wiring pattern 27 are arranged to form a parallel circuit.
[0055] For example, in the connection unit of the first power supply wiring pattern 21, the third power supply wiring pattern 23, and the second power supply wiring pattern 22 which form a series circuit, device D1 mounted between the first connection pad 31 and the third connection pad 33, and device D2 mounted between the fourth connection pad 34 and the second connection pad 32 are light source devices (such as LEDs).
[0056] Furthermore, for example, among the connection units of the sixth power supply wiring pattern 26, the seventh power supply wiring pattern 27, and the eighth power supply wiring pattern 28 which form a parallel circuit, the device D3 mounted between the ninth connection pad 319 and the twelfth connection pad 312, and the device D4 mounted between the tenth connection pad 310 and the eleventh connection pad 311 are image sensors.
[0057] (Fourth Embodiment) Figure 6A is a schematic plan view illustrating a translucent member according to the fourth embodiment. Figure 6B is a cross-sectional view taken along the line D1-D1' in Figure 6A. The translucent member 1D according to the fourth embodiment has a similar configuration to the translucent member 1C according to the third embodiment, but further includes a shield portion 70 on some of the connecting wiring 201. The shield portion 70 is provided at a position that overlaps with the connecting wiring 201 when viewed in the thickness direction of the insulating substrate 10. As shown in Figure 6B, it is preferable that the shield portion 70 is provided on both one side surface 10a and the other side surface 10b of the insulating substrate 10 at the location of the connecting wiring 201 to be shielded. By providing the shield portion 70, it is possible to suppress the intrusion of noise signals into the connecting wiring 201 from the outside.
[0058] For example, if devices D3 and D4 are image sensors, high-frequency signals flow through the connection wirings 201 of the sixth power supply wiring pattern 26, the seventh power supply wiring pattern 27, and the eighth power supply wiring pattern 28, which are conductive with the image sensors. By providing a shielding section 70 on the connection wiring 201 to which the image sensors are connected, it becomes easier to suppress the leakage of noise signals generated by the high-frequency signals to the outside.
[0059] (Example of metal wiring) Figures 7A to 7C are schematic cross-sectional views illustrating metal wiring. The metal wiring 50 shown in Figure 7A is provided on an insulating substrate 10 and is composed of a laminate of a patterned adhesion layer 51 and a main conductive layer 52 formed on the adhesion layer 51. For example, a CuNi alloy is used for the adhesion layer 51. For example, Cu is used for the main conductive layer 52.
[0060] The metal wiring 50 shown in Figure 7B is composed of a laminate of an adhesion layer 53 provided on an insulating substrate 10 and a main conductive layer 52 formed on the adhesion layer 53. For example, an easy-adhesion layer can be used for the adhesion layer 53. The insulating adhesion layer 53 does not need to be patterned.
[0061] The metal wiring 50 shown in Figure 7C is composed of a laminate of an adhesion layer 53 provided on an insulating substrate 10, a patterned adhesion layer 51 formed on the adhesion layer 53, and a main conductive layer 52 formed on the adhesion layer 51. For example, an easy-adhesion layer is used for the adhesion layer 53, a CuNi alloy is used for the adhesion layer 51, and Cu is used for the main conductive layer 52.
[0062] (Other Examples of Metal Wiring and Connecting Pads) Figures 8A to 8C are schematic cross-sectional views showing other examples of metal wiring. The metal wiring 50 shown in Figure 8A has a conductor portion 5011 and an optical function portion 5012. The conductor portion 5011 is patterned with a metallic material such as Cu. The optical function portion 5012 is provided on at least a portion of the surface of the conductor portion 5011. In the example shown in Figure 8A, the optical function portion 5012 is provided on the upper and lower surfaces of the conductor portion 5011. That is, the conductor portion 5011 is provided between the upper and lower optical function portions 5012.
[0063] Examples of optical functional units 5012 include those having an anti-reflection function for infrared and visible light, and a blackening function that absorbs light. Conductor parts 5011 formed from metal materials tend to reflect ambient light, which can reduce invisibility. Therefore, by providing optical functional units 5012 on the conductor part 5011, reflection of ambient light can be suppressed, and invisibility can be improved even when metal materials are used. Furthermore, in a system for determining the gaze detection position, if an infrared LED is used in device D, infrared light from the infrared LED and infrared light from the eyeball may be reflected by the metal material, potentially reducing the accuracy of gaze detection. Therefore, by providing the optical functional unit 5012 with an anti-reflection function for infrared light and a blackening function that absorbs infrared light, the accuracy of gaze detection can be improved.
[0064] Furthermore, if the insulating substrate 10 is translucent, there is a possibility that light transmitted through the insulating substrate 10 from the insulating substrate 10 side may be reflected by the conductor portion 5011. For this reason, by providing an optical functional portion 5012 between the insulating substrate 10 and the conductor portion 5011, the reflection of light from the insulating substrate 10 side can be suppressed.
[0065] The metal wiring 50 shown in Figure 8B has a conductor portion 5011 and an optical functional portion 5012 that surrounds the conductor portion 5011. By covering the conductor portion 5011 with the optical functional portion 5012, the anti-reflection function of light around the entire conductor portion 5011 can be enhanced.
[0066] Figure 8C is a schematic cross-sectional view showing an example of another connection pad. The connection pad 30 shown in Figure 8C has a conductor portion 3011 made of a metallic material and a cap layer 3012 provided on the conductor portion 3011. The cap layer 3012 is a connection stabilization layer. By providing the cap layer 3012 on the conductor portion 3011, the mechanical and electrical connection between the connection pad 30 and the external terminal is stabilized. For example, the connection stabilization layer, which is the cap layer 3012 of the connection pad 30, is formed of a single layer or lamination of metals such as Au, Ag, Ag alloy, Ni, Ni alloy, Cu, Cu alloy.
[0067] Figure 9 is a schematic cross-sectional view showing examples of other connection wiring and connection pads. Figure 9 shows an example of connection wiring 201 and connection pad 30 using an imprint mold 80. The imprint mold 80 is provided on an insulating substrate 10. For example, an imprint mold 80 is formed by pressing a convex stamp onto an imprint resin to transfer the shape of the connection wiring 201 and connection pad 30 as recesses. The connection wiring 201 and connection pad 30 are formed by embedding a conductive material in the recesses of this imprint mold 80. An insulating member 90 is provided on the connection wiring 201, and an opening for the insulating member 90 is provided on a part of the connection pad 30.
[0068] (Examples of wiring members for eyewear) Figures 10A and 10B show examples of wiring members for eyewear. Figures 10A and 10B show examples of the translucent members 1A to 1D (hereinafter collectively referred to as translucent member 1) according to this embodiment being applied to eyewear 100. Figure 10B shows an enlarged schematic diagram of the lens portion 110 of the eyewear 100.
[0069] The eyewear 100 shown in Figure 10A is of the eyeglasses type, but it may also be of other forms such as goggles or eyeglasses-type eyewear. For example, in the case of eyeglasses-type eyewear 100, it has two lens parts 110 corresponding to the positions of the left and right eyes, and left and right temple parts 120 that rest on the ears. The light-transmitting member 1 according to this embodiment is applied to the lens parts 110 of the eyewear 100 (see Figure 10B).
[0070] When eye tracking (gaze detection) is performed using the eyewear 100, a light source device (e.g., an infrared LED) and an image sensor are used as device D. That is, the light source device is mounted on one of the connection pads 30, and the image sensor is mounted on the other connection pad 30.
[0071] When applying the light-transmitting member 1 to eyewear 100, the insulating base material 10 of the light-transmitting member 1 may be attached to the lens portion 110 (for example, by adhesive), or the lens portion 110 may be used as the insulating base material 10. Alternatively, the connecting wiring 201 and connecting pad 30 may be transferred from the insulating base material 10 to the lens portion 110, and the insulating base material 10 may be peeled off after the transfer.
[0072] When attaching the insulating substrate 10 to the lens portion 110, a light-transmitting insulating substrate 10 (light-transmitting substrate) is used. In this case, the light-transmitting member 1 becomes a light-transmitting wiring member.
[0073] When the translucent member 1 is a translucent wiring member, as shown in Figure 10B, the insulating substrate 10 has a central viewing region R1 and a peripheral region R2 outside the central viewing region R1. The connection pads 30 are arranged in the peripheral region R2 of the insulating substrate 10. In addition, at least one of the connection pads 30 that will be external connection pads is positioned on the outer edge side of the insulating substrate 10 than the other connection pads 30. This allows the eyewear 100 to provide both power supply to the device D connected to the connection pads 30 and the invisibility of the connection wiring 201.
[0074] Although the embodiments described above are examples, the present invention is not limited to these examples. For example, any additions, deletions, or design modifications of components to the aforementioned embodiments, or combinations of the features of the configuration examples of each embodiment, as appropriate by those skilled in the art, are also included within the scope of the present invention, as long as they retain the essence of the present invention.
[0075] 1, 1A-1D...Translucent material 10...Insulating substrate 10a, 10b...Surface 20...Power supply wiring pattern 21...First power supply wiring pattern 22...Second power supply wiring pattern 23...Third power supply wiring pattern 24...Fourth power supply wiring pattern 25...Fifth power supply wiring pattern 26...Sixth power supply wiring pattern 27...Seventh power supply wiring pattern 28...Eighth power supply wiring pattern 30...Connection pad 30A...First external connection pad 30B...Second external connection pad 30C...Third external connection pad 30D...Fourth external connection pad 30E...Fifth external connection pad 31...First connection pad 32...Second connection pad 33...Third connection pad 34...Fourth connection pad 35...Fifth connection pad 36...Sixth connection pad 37...Seventh connection pad 38...8th connection pad 319...9th connection pad 310...10th connection pad 311...11th connection pad 312...12th connection pad 40...Wiring protection layer 50...Metal wiring 51...Adhesion layer 52...Main conductive layer 53...Adhesion layer 55...Metal antenna pattern 55a...Fine metal wire for antenna 57...Metal connection wiring for antenna 58...External connection pad for antenna 60...Dummy metal wiring pattern 60a...Dummy metal wiring 61...Intermittent section 70...Shield section 75...Metal grounding pattern 75a...Extended section 76...Grounding pattern 80...Imprint type 90...Insulating material 100...Eyewear 110...Lens section 120...Temple section 201...Connection wiring 202...Parallel section 3011...Conductor section 3012...Cap layer 5011...Conductor section 5012...Optical function section D, D1-D4...Device L, La, Lb, Lc...Width R1...Central viewing area R2...Peripheral area S, Sa, Sb, Sc...Gap X...Extension direction
Claims
1. A translucent insulating substrate, a plurality of power supply wiring patterns provided on the insulating substrate, and a metal antenna pattern arranged in parallel with the power supply wiring patterns, wherein the plurality of power supply wiring patterns have a first power supply wiring pattern composed of an external connection pad formed on the outer edge side of the insulating substrate, a first connection pad, and a connection wire connecting the external connection pad and the first connection pad, the connection wire includes a parallel section having a plurality of spaced-apart metal wires, the gap between two adjacent metal wires in the parallel section is formed to be wider than the width of the metal wires, the metal antenna pattern has a plurality of spaced-apart metal fine wires whose extension direction is the same as the plurality of metal wires in the parallel section, and a floating dummy metal wiring pattern extending in the same direction as the extension direction is formed between the first power supply wiring pattern and the metal antenna pattern.
2. The light-transmitting member according to claim 1, wherein the dummy metal wiring pattern is discontinuous due to intermittent portions.
3. The light-transmitting member according to claim 2, wherein the dummy metal wiring pattern is discontinuous due to a plurality of the intermittent portions.
4. The translucent member according to claim 1, wherein the metal antenna pattern has a plurality of antenna metal connection wires that electrically connect the plurality of metal thin wires and the external connection pad for the antenna, and extends in the same direction as the extension direction and is spaced apart from each other, and a plurality of metal grounding patterns that extend in the same direction as the extension direction and are spaced apart from each other are formed between the plurality of antenna metal connection wires and the first power supply wiring pattern.
5. The translucent member according to claim 4, wherein the metal grounding pattern extends between the dummy metal wiring pattern and the first power supply wiring pattern.
6. The light-transmitting member according to claim 1, wherein the first power supply wiring pattern is formed on the inner surface of the insulating substrate, and the metal antenna pattern is formed on the outer surface of the insulating substrate.
7. The translucent member according to claim 6, further comprising a translucent grounding pattern formed on the inner surface of the insulating substrate facing the metal antenna pattern.