Substrate polishing apparatus featuring substrate transfer shuttle

Abstract

The present invention relates to a semiconductor substrate polishing apparatus. Conventionally, in order to address a bottleneck effect in substrate transfer and low space utilization occurring when placing a plurality of polishing units, in the present invention, a substrate shuttle and a plurality of transfer means are configured in a specific structure. Specifically, the substrate shuttle is configured to efficiently transfer substrates among the plurality of polishing units, and is moved through a path utilizing the upper or lower space of the substrate transfer means. As such, effects of remarkably improving the productivity of equipment and improving space utilization efficiency are provided.

Description

Substrate polishing device equipped with a substrate transfer shuttle

[0001] The present invention relates to Korean Patent Application No. 10-2024-0188417 filed on December 17, 2024, Korean Patent Application No. 10-2025-0017649 filed on February 11, 2025, Korean Patent Application No. 10-2025-0017650 filed on February 11, 2025, Korean Patent Application No. 10-2025-0019857 filed on February 17, 2025, Korean Patent Application No. 10-2025-0020446 filed on February 17, 2025, Korean Patent Application No. 10-2025-0021518 filed on February 19, 2025, and Korean Patent Application No. Benefits are granted for Korean patent application No. 10-2025-0021853, filed March 1, 2025, Korean patent application No. 10-2025-0027149, filed March 1, 2025, Korean patent application No. 10-2025-0027154, filed March 9, 2025, Korean patent application No. 10-2025-0030270, filed March 11, 2025, Korean patent application No. 10-2025-0031748, and Korean patent application No. 10-2025-0065547, filed May 20, 2025, which are incorporated herein by reference.

[0002] The present invention relates to an apparatus and method for polishing a substrate used in the manufacture of semiconductor devices.

[0003] A substrate polishing device for polishing semiconductor wafers removes insulating films or metal films on the surface of the substrate by polishing them using an abrasive on the polishing surface. As the substrate polishing process is increasingly used in the semiconductor device manufacturing process, there is a demand for substrate polishing devices that provide high productivity. Since the polishing device consists of multiple polishing units, it is important to reduce bottlenecks that may occur during the process of transferring and retrieving substrates to and from the multiple polishing units in order to increase productivity.

[0004] In addition, depending on the type of film being polished, there are cases where polishing is completed on a single polishing surface using one type of abrasive (1-stage polishing), cases where 2-stage polishing is required by using a different type of abrasive on another polishing surface after the 1-stage polishing, and cases where 3-stage polishing is required by using another type of abrasive on another polishing surface after the 2-stage polishing. Therefore, a polishing device that can be applied to all of these various cases and provide high productivity is required.

[0005] In addition, since substrate polishing equipment is installed and used in cleanrooms where construction and maintenance costs are high, it is important to reduce the footprint. To reduce the footprint, the components of the substrate polishing equipment must be arranged and operated in a space-efficient manner.

[0006] The present invention provides a substrate polishing apparatus and method for semiconductor substrates that improve productivity by reducing bottlenecks caused by substrate transfer means.

[0007] The present invention provides a substrate polishing apparatus and method for a semiconductor substrate suitable for multi-stage polishing while reducing bottlenecks caused by substrate transfer means.

[0008] The purpose is to provide a semiconductor substrate polishing device with a reduced footprint by efficiently arranging the components of the substrate polishing device.

[0009] A substrate polishing device according to an embodiment of the present invention includes an EFEM, a substrate polishing unit, and a substrate cleaning unit. A first substrate transfer means is disposed in the EFEM, a second substrate transfer means is disposed between the substrate polishing unit and the substrate cleaning unit, and a third substrate transfer means is disposed in the substrate polishing unit. A cleaning device including a substrate input terminal and a substrate output terminal is disposed in the substrate cleaning unit. A first and second polishing unit and at least one substrate shuttle are disposed in the substrate polishing unit. The first substrate transfer means transfers a substrate to the at least one substrate shuttle and retrieves it from the substrate output terminal of the cleaning device. The third substrate transfer means transfers a substrate from the at least one substrate shuttle to the first and second polishing units, retrieves it after polishing is completed, and transfers it to the at least one substrate shuttle. The second substrate transfer means withdraws a substrate from the at least one substrate shuttle and transfers it to the substrate input terminal of the cleaning device.

[0010] The above-mentioned at least one substrate shuttle travels back and forth between the first to third positions and transports a substrate between the first to third substrate transport means. The first substrate transport means delivers a substrate to the at least one substrate shuttle located at the first position. The third substrate transport means withdraws a substrate from the at least one substrate shuttle located at the second position and delivers it to the first and second polishing units, and after polishing is completed, retrieves it again and delivers it to the at least one substrate shuttle. The second substrate transport means withdraws a substrate from the at least one substrate shuttle located at the third position and delivers it to the substrate input terminal of the cleaning device.

[0011] In one embodiment, the at least one substrate shuttle may be composed of a single first substrate shuttle.

[0012] In another embodiment, the at least one substrate shuttle may be composed of a first and a second substrate shuttle. In this embodiment, the first substrate shuttle receives a substrate to be polished from a first substrate transfer means at a first position, moves to a second position, and then transfers it to a third substrate transfer means. On the other hand, the second substrate shuttle receives a polished substrate from a third substrate transfer means, moves to a third position, and then transfers it to a second substrate transfer means.

[0013] In one embodiment, the substrate polishing unit may further include a third polishing unit and a fourth substrate transfer means. The first to third polishing units are arranged in a line with respect to each other, and the at least one substrate shuttle transports a substrate between the first to fourth substrate transfer means while reciprocating between the first to fourth positions. The first substrate transfer means transfers a substrate to be polished to the at least one substrate shuttle located at the first position. The third substrate transfer means withdraws a substrate from the at least one substrate shuttle located at the second position and transfers it to the first polishing unit, and after polishing is completed, retrieves the substrate and transfers it to the at least one substrate shuttle. The fourth substrate transfer means withdraws a substrate from the at least one substrate shuttle located at the third position and transfers it to the third polishing unit, and after polishing is completed, retrieves it and transfers it to the at least one substrate shuttle. The second substrate transfer means withdraws a substrate polished by the first or third polishing unit from the at least one substrate shuttle at the fourth position and transfers it to the substrate input terminal of the cleaning device.

[0014] In one embodiment, the at least one substrate shuttle may be composed of a first and a second substrate shuttle. The first substrate shuttle transports a substrate by reciprocating between the first, third, and fourth substrate transport means, receives a substrate from the first substrate transport means at a first position, transfers it to the third substrate transport means at a second position, and transfers it to the fourth substrate transport means at a third position. The second substrate shuttle transports a substrate by reciprocating between the second, third, and fourth substrate transport means, receives a substrate from the third substrate transport means at a second position and from the fourth substrate transport means at a third position, respectively, and transfers it to the second substrate transport means at a fourth position.

[0015] In one embodiment, the substrate cleaning unit is disposed in the upper space of the substrate polishing unit. The second substrate transfer means withdraws the substrate from the at least one substrate shuttle, moves it upward in a vertical direction, and then transfers it to the substrate input terminal of the cleaning device disposed in the substrate cleaning unit.

[0016] In one embodiment, the substrate polishing unit is further provided with a cleaning chamber. The cleaning chamber is positioned opposite the EFEM, and the second substrate transfer means withdraws a substrate from the at least one substrate shuttle and transfers it to the cleaning chamber, and when cleaning is completed, retrieves it and transfers it to the substrate input terminal of the cleaning device.

[0017] A substrate polishing device according to an embodiment of the present invention includes an EFEM, a substrate polishing unit, and a substrate cleaning unit. The substrate cleaning unit is disposed in the upper space of the substrate polishing unit. A first substrate transfer means is disposed in the EFEM, and a second substrate transfer means and a cleaning device are disposed in the substrate cleaning unit. A first and second polishing unit, a first substrate holder, and a third substrate transfer means are disposed in the substrate polishing unit, and a second substrate holder is provided for transporting a substrate from the substrate polishing unit to the substrate cleaning unit.

[0018] The first substrate transfer means transfers the substrate to the first substrate holder and retrieves the substrate from the substrate output terminal of the cleaning device. The third substrate transfer means transfers and retrieves the substrate from the first substrate holder to the first and second polishing units, and transfers it to the second substrate holder at the first vertical position. The second substrate holder rises to the second vertical position, and the second substrate transfer means transfers the substrate from the second substrate holder to the substrate input terminal of the cleaning device.

[0019] In one embodiment, the substrate polishing unit further includes a third substrate holder, a third polishing unit, and a fourth substrate transfer means. The first to third polishing units are arranged in a line. The third substrate transfer means transfers a substrate from the first substrate holder to the third substrate holder, and the fourth substrate transfer means transfers a substrate from the third substrate holder to the third polishing unit, retrieves it, and transfers it to the second substrate holder at a first vertical position.

[0020] In this embodiment, the second substrate holder transports the substrate received from the third and fourth substrate transport means to the second substrate transport means.

[0021] In one embodiment, the third substrate holder is placed in the space below the second substrate holder at the first vertical position.

[0022] A substrate polishing device according to an embodiment of the present invention includes an EFEM, a substrate polishing unit, a substrate transfer unit, and a substrate cleaning unit. The substrate polishing unit and the substrate cleaning unit are positioned opposite each other with the substrate transfer unit in between. A first substrate transfer means is disposed in the EFEM. The substrate polishing unit includes first to fourth polishing units arranged in a row. The substrate cleaning unit includes a cleaning device comprising a substrate input terminal and a substrate output terminal, and a second substrate transfer means for transferring a substrate from the substrate transfer unit to the substrate input terminal. The substrate transfer unit includes third and fourth substrate transfer means and at least one substrate shuttle that reciprocates between first to fourth positions and transports a substrate between the first to fourth substrate transfer means.

[0023] In one embodiment, the substrate attachment means of the first to fourth polishing units are arranged to face the substrate transfer unit. A first position is arranged near the substrate attachment means of the first polishing unit, a second position near the substrate attachment means of the second polishing unit, a third position near the substrate attachment means of the third polishing unit, and a fourth position near the substrate attachment means of the fourth polishing unit.

[0024] In one embodiment, the at least one substrate shuttle may be configured as a first substrate shuttle. The first substrate shuttle may receive a substrate from a first substrate transfer means, move to a first position, and transfer it to a third substrate transfer means, or move to a third position by traversing the upper or lower space of the third substrate transfer means and transfer the substrate to a fourth substrate transfer means. Additionally, it may receive a substrate from the third substrate transfer means at a second position and transfer it to a second substrate transfer means by traversing the upper or lower space of the fourth substrate transfer means, or receive a substrate from the fourth substrate transfer means at a fourth position and transfer it to a second substrate transfer means.

[0025] In one embodiment, the first substrate shuttle may include first and second substrate holders. The first substrate transfer means transfers the substrate before polishing to the first substrate holder, and the second substrate transfer means withdraws the polished and completed substrate from the second substrate holder. The third and fourth substrate transfer means withdraw the substrate before polishing from the first substrate holder and transfer the polished substrate to the second substrate holder.

[0026] In one embodiment, the at least one substrate shuttle may be composed of first and second substrate shuttles that move independently. The first substrate shuttle receives a substrate from a first substrate transfer means, moves to a first position, and transfers it to a third substrate transfer means, or moves to a third position and transfers it to a fourth substrate transfer means. The second substrate shuttle receives a substrate from a third substrate transfer means at a second position and transfers it to a second substrate transfer means, or receives a substrate from a fourth substrate transfer means at a fourth position and transfers it to a second substrate transfer means.

[0027] In one embodiment, the at least one substrate shuttle is configured to mount the substrate in a vertical position. This substrate shuttle may be placed in the space between the substrate transfer unit and the substrate cleaning unit.

[0028] In one embodiment, the substrate polishing unit may include at least one substrate holder disposed in the upper or lower space of the first to fourth positions. Additionally, the substrate transfer unit may include a substrate holder disposed in the upper or lower space of the first position, and the first substrate transfer means transfers a substrate to the substrate holder, and the third substrate transfer means transfers and retrieves the substrate from the substrate holder to the first polishing unit and transfers it to the at least one substrate shuttle.

[0029] In one embodiment, the substrate transfer unit may include a substrate holder disposed in the upper or lower space of the fourth position. A fourth substrate transfer means transfers a substrate to the substrate holder, and a second substrate transfer means withdraws the substrate from the substrate holder and transfers it to the substrate input terminal of the cleaning device.

[0030] In one embodiment, the substrate transfer unit may include a fifth substrate transfer means disposed between the second and third polishing units. The fifth substrate transfer means withdraws a substrate from the at least one substrate shuttle and transfers it to at least one of the second and third polishing units, and recovers a polished substrate and transfers it to the at least one substrate shuttle. Additionally, the fifth substrate transfer means may be configured to transfer a substrate from a substrate attachment means of the second polishing unit to a substrate attachment means of the third polishing unit.

[0031] In one embodiment, when the first substrate shuttle is located at a first position, the second substrate shuttle may be located at a second position. In this embodiment, the third substrate transfer means transfers a substrate from the second polishing unit to the second substrate shuttle at the second position, transfers a substrate from the first polishing unit to the second polishing unit, and transfers a substrate from the first substrate shuttle at the first position to the first polishing unit.

[0032] In one embodiment, when the first substrate shuttle is located at a third position, the second substrate shuttle may be located at a fourth position. In this embodiment, the fourth substrate transfer means transfers a substrate from the fourth polishing unit to the second substrate shuttle at the fourth position, transfers a substrate from the third polishing unit to the fourth polishing unit, and transfers a substrate from the first substrate shuttle at the third position to the third polishing unit. Additionally, when the first substrate shuttle is located at a first or third position, the second substrate shuttle may be positioned at the fourth position.

[0033] A substrate polishing device according to an embodiment of the present invention includes an EFEM, a substrate polishing unit, a substrate transfer unit, and a substrate cleaning unit. The substrate polishing unit and the substrate cleaning unit are positioned opposite each other with the substrate transfer unit in between. A first substrate transfer means is disposed in the EFEM. The substrate polishing unit may include first to sixth polishing units arranged in a row. The substrate cleaning unit includes a cleaning device comprising a substrate input terminal and a substrate output terminal, and a second substrate transfer means for transferring a substrate from the substrate transfer unit to the substrate input terminal. The substrate transfer unit includes third to fifth substrate transfer means and at least one substrate shuttle that transports a substrate between the first to fifth substrate transfer means while reciprocating between the first to sixth positions.

[0034] In one embodiment, the substrate attachment means of the first to sixth polishing units are arranged to face the substrate transfer unit. A first position is positioned near the substrate attachment means of the first polishing unit, a second position near the substrate attachment means of the second polishing unit, a third position near the substrate attachment means of the third polishing unit, a fourth position near the substrate attachment means of the fourth polishing unit, a fifth position near the substrate attachment means of the fifth polishing unit, and a sixth position near the substrate attachment means of the sixth polishing unit.

[0035] In one embodiment, the at least one substrate shuttle may be configured as a first substrate shuttle. The first substrate shuttle receives a substrate from a first substrate transfer means and transfers it to a third substrate transfer means at a first position, moves to a third position through the upper or lower space of the third substrate transfer means and transfers it to a fourth substrate transfer means, or moves to a fifth position through the upper or lower space of the third and fourth substrate transfer means and transfers it to a fifth substrate transfer means. Additionally, it receives a substrate from a third substrate transfer means at a second position and transports it to a second substrate transfer means through the upper or lower space of the fourth and fifth substrate transfer means, or receives a substrate from a fourth substrate transfer means at a fourth position and transfers it to a second substrate transfer means through the upper or lower space of the fifth substrate transfer means.

[0036] In one embodiment, the first substrate shuttle may include first and second substrate holders. The first substrate transfer means transfers a substrate to be polished to the first substrate holder. The second substrate transfer means withdraws the polished substrate from the second substrate holder. The third, fourth, and fifth substrate transfer means withdraw the substrate to be polished from the first substrate holder and transfer the polished substrate to the second substrate holder.

[0037] In one embodiment, the at least one substrate shuttle may be composed of a first and a second substrate shuttle that move independently. The first substrate shuttle receives a substrate from a first substrate transfer means, moves to a first position to transfer it to a third substrate transfer means, moves to a third position to transfer it to a fourth substrate transfer means, or moves to a fifth position to transfer it to a fifth substrate transfer means. The second substrate shuttle receives a substrate from a third substrate transfer means at a second position to transfer it to a second substrate transfer means, receives a substrate from a fourth substrate transfer means at a fourth position to transfer it to a second substrate transfer means, or receives a substrate from a fifth substrate transfer means at a sixth position to transfer it to a second substrate transfer means.

[0038] In one embodiment, the at least one substrate shuttle is configured to mount the substrate vertically. This substrate shuttle may be positioned in the space between the substrate transfer unit and the substrate cleaning unit.

[0039] In one embodiment, the substrate transfer unit includes a substrate holder disposed in the upper or lower space of a first position. A first substrate transfer means transfers a substrate to the substrate holder, and a third substrate transfer means transfers a substrate from the substrate holder to a first polishing unit, recovers the polished substrate, and transfers it to the at least one substrate shuttle.

[0040] In one embodiment, the substrate transfer unit may include a substrate holder disposed in the upper or lower space of the sixth position. A fifth substrate transfer means transfers a substrate to the substrate holder, and a second substrate transfer means withdraws the substrate from the substrate holder and transfers it to the substrate input terminal of the cleaning device.

[0041] In one embodiment, the substrate is polished by passing through at least one of the first and second polishing units and at least one of the fifth and sixth polishing units. In this embodiment, a first substrate transfer means transfers the substrate to a first substrate shuttle or a substrate holder near a first position, and a third substrate transfer means transfers the substrate from the first substrate shuttle or substrate holder at the first position to at least one of the first and second polishing units, retrieves it after polishing is completed, and transfers it to a second substrate shuttle at a second position. The second substrate shuttle moves to a fifth position, and a fifth substrate transfer means withdraws the substrate from the second substrate shuttle and transfers it to at least one of the fifth and sixth polishing units, retrieves the polished substrate, and transfers it to a third substrate shuttle at a sixth position or a substrate holder near the sixth position. The second substrate transfer means withdraws the substrate from the third shuttle or the substrate holder at the sixth position and transfers it to the substrate input terminal of the cleaning device.

[0042] In one embodiment, the substrate is polished by passing through at least one of the third and fourth polishing units and at least one of the fifth and sixth polishing units. In this embodiment, the first substrate transfer means transfers the substrate to the first substrate shuttle, and the fourth substrate transfer means transfers the substrate from the first substrate shuttle at the third position to at least one of the third and fourth polishing units, retrieves the polished substrate, and transfers it to the second substrate shuttle at the fourth position. The second substrate shuttle moves to the fifth position, and the fifth substrate transfer means withdraws the substrate from the second substrate shuttle and transfers it to at least one of the fifth and sixth polishing units, retrieves it after polishing is complete, and transfers it to the third substrate shuttle or substrate holder at the sixth position. The second substrate transfer means withdraws the substrate from the third substrate shuttle or substrate holder and transfers it to the substrate input terminal of the cleaning device.

[0043] A substrate polishing device according to an embodiment of the present invention includes a substrate polishing unit and a substrate transfer unit. The substrate polishing unit includes first to sixth polishing units. The first, third, and fifth polishing units are arranged in a line on one side of the substrate transfer unit, and the second, fourth, and sixth polishing units are arranged in a line on the opposite side. The substrate transfer unit includes first to third substrate transfer means and at least one substrate shuttle. The at least one substrate shuttle reciprocates between first and second positions to transfer a substrate from the first substrate transfer means to the second and third substrate transfer means, and transfers a substrate from the second and third substrate transfer means to the first substrate transfer means. The first position is positioned between the first and second substrate transfer means, and the second position is positioned between the second and third substrate transfer means. The second substrate transfer means is positioned in the space between the first to fourth polishing units, and the third substrate transfer means is positioned between the third to sixth polishing units. The first substrate transfer means is positioned opposite the third substrate transfer means with the second substrate transfer means in between. The first substrate transfer means transfers a substrate to the at least one substrate shuttle and retrieves a substrate from the at least one substrate shuttle. The second substrate transfer means transfers a substrate from the at least one substrate shuttle at a first position to the first and second polishing units, retrieves it, and transfers it to the at least one substrate shuttle; and the third substrate transfer means transfers a substrate from the at least one substrate shuttle at a second position to the fifth and sixth polishing units, retrieves it after polishing is completed, and transfers it to the at least one substrate shuttle.

[0044] In one embodiment, the second substrate transfer means transfers the substrate from the at least one substrate shuttle to the third and fourth polishing units, retrieves it after polishing is completed, and transfers it to the at least one substrate shuttle.

[0045] In one embodiment, the second substrate transfer means transfers the substrate from the at least one substrate shuttle to the third and fourth polishing units, retrieves it after polishing is completed, and transfers it to the at least one substrate shuttle.

[0046] In one embodiment, the second substrate transfer means transfers the substrate between the first to third polishing units, retrieves it after polishing is completed, and transfers it to the at least one substrate shuttle.

[0047] In one embodiment, the third substrate transfer means transfers the substrate between the fourth to sixth polishing units, retrieves it after polishing is completed, and transfers it to the at least one substrate shuttle.

[0048] In one embodiment, the substrate attachment means of the first polishing unit faces the polishing surface of the third polishing unit, and the substrate attachment means of the third polishing unit and the substrate attachment means of the fifth polishing unit are arranged to face each other.

[0049] In one embodiment, the at least one substrate shuttle is configured as a first shuttle. The first shuttle receives a substrate from a first substrate transfer means and transfers it to a second substrate transfer means at a first position, or moves through the upper or lower space of the second substrate transfer means to transfer the substrate. Additionally, the first shuttle receives a substrate from a second substrate transfer means and transfers it to a second substrate transfer means at a first position, or receives a substrate from a third substrate transfer means and moves through the upper or lower space of the second substrate transfer means to a first substrate transfer means to transfer the substrate to a first substrate transfer means.

[0050] In one embodiment, the first shuttle includes first and second substrate holders. The first substrate transfer means transfers a substrate to be polished to the first substrate holder and withdraws a polished substrate from the second substrate holder. The second and third substrate transfer means withdraw a substrate to be polished from the first substrate holder and transfer a polished substrate to the second substrate holder.

[0051] In one embodiment, the at least one substrate shuttle may include first and second substrate shuttles that move independently. The first substrate shuttle moves a substrate received from the first substrate transfer means through the upper or lower space of the second substrate transfer means and transfers it to the third substrate transfer means. The second substrate shuttle moves a substrate received from the third substrate transfer means through the upper or lower space of the second substrate transfer means and transfers it to the first substrate transfer means.

[0052] In one embodiment, the first substrate shuttle transfers a substrate received from the first substrate transfer means to the second substrate transfer means, and the second substrate shuttle transfers a substrate received from the second substrate transfer means to the first substrate transfer means.

[0053] In one embodiment, the substrate transfer unit includes at least one substrate holder disposed between the first and second substrate transfer means. The first substrate transfer means transfers a substrate to the at least one substrate holder, and the second substrate transfer means transfers the substrate from the at least one substrate holder to at least one of the first and second polishing units, retrieves the substrate after polishing is completed, and transfers it to the at least one substrate holder.

[0054] In one embodiment, the at least one substrate holder includes a first and a second substrate holder, the first substrate transfer means transfers a substrate to be polished to the first substrate holder, and the second substrate transfer means transfers a polished substrate to the second substrate holder.

[0055] In one embodiment, the substrate polishing unit may further include seventh and eighth polishing units. The seventh polishing unit is positioned opposite the third polishing unit with the fifth polishing unit in between, and the eighth polishing unit is positioned opposite the fourth polishing unit with the sixth polishing unit in between. A third substrate transfer means is positioned in the space between the fifth to eighth polishing units. A third position is positioned between the fifth and sixth polishing units. A second substrate transfer means transfers a substrate with the at least one substrate shuttle or the at least one substrate holder and the first to fourth polishing units. A third substrate transfer means transfers a substrate with the at least one substrate shuttle and the fifth to eighth polishing units.

[0056] The present invention provides a substrate polishing apparatus and method for a semiconductor substrate that improves productivity by improving the bottleneck phenomenon caused by the substrate transfer means.

[0057] The present invention provides a substrate polishing apparatus and method for a semiconductor substrate suitable for multi-stage polishing while improving the bottleneck phenomenon caused by the substrate transfer means.

[0058] The present invention provides a semiconductor substrate polishing device that reduces the footprint by efficiently arranging the components of the substrate polishing device.

[0059] FIG. 1 is a side view of a substrate polishing apparatus according to an embodiment of the present invention.

[0060] FIG. 2 is a plan view of a substrate polishing section according to an embodiment of the present invention.

[0061] Figure 3 is a side view of a substrate polishing unit.

[0062] FIG. 3 is a plan view of a substrate cleaning unit according to an embodiment of the present invention.

[0063] FIG. 4 is a plan view of a substrate polishing section according to an embodiment of the present invention.

[0064] FIG. 5 is a plan view of a substrate polishing section according to an embodiment of the present invention.

[0065] FIG. 6 is a flowchart of a substrate processing process according to an embodiment of the present invention.

[0066] FIG. 7 is a plan view of a substrate polishing section according to an embodiment of the present invention.

[0067] FIG. 8 is a side view of a substrate vertical shuttle according to an embodiment of the present invention.

[0068] FIG. 9 is a plan view of a substrate cleaning unit according to an embodiment of the present invention.

[0069] FIG. 10 is a plan view of a substrate polishing section according to an embodiment of the present invention.

[0070] FIG. 11 is a flowchart of a substrate processing process according to an embodiment of the present invention.

[0071] FIGS. 12 and 13 are plan views of a substrate polishing section according to an embodiment of the present invention.

[0072] FIG. 14 is a flowchart of a substrate processing process according to an embodiment of the present invention.

[0073] FIG. 15 is a plan view of a substrate polishing section according to an embodiment of the present invention.

[0074] FIG. 16 is a flowchart of a substrate processing process according to an embodiment of the present invention.

[0075] FIGS. 17 and 18 are plan views of a substrate polishing section according to an embodiment of the present invention.

[0076] FIG. 19 is a flowchart of a substrate processing process according to an embodiment of the present invention.

[0077] FIG. 20 is a plan view of a substrate polishing device according to an embodiment of the present invention.

[0078] FIGS. 21(a) and 21(b) are side views of a substrate shuttle according to an embodiment of the present invention.

[0079] FIG. 22 is a plan view of a substrate polishing device according to an embodiment of the present invention.

[0080] FIGS. 23 and 24 are flowcharts of a substrate processing process according to an embodiment of the present invention.

[0081] FIG. 25 is a plan view of a substrate polishing device according to an embodiment of the present invention.

[0082] FIG. 26 is a flowchart of a substrate processing process according to an embodiment of the present invention.

[0083] FIG. 27 is a plan view of a substrate polishing apparatus according to an embodiment of the present invention.

[0084] FIG. 28 is a flowchart of a substrate processing process according to an embodiment of the present invention.

[0085] FIGS. 29 and FIGS. 30 are plan views of a substrate polishing apparatus according to an embodiment of the present invention.

[0086] FIG. 31 is a flowchart of a substrate processing process according to an embodiment of the present invention.

[0087] FIG. 32 is a plan view of a substrate polishing device according to an embodiment of the present invention.

[0088] FIGS. 33 and FIGS. 34 are flowcharts of a substrate processing process according to an embodiment of the present invention.

[0089] FIG. 35 is a perspective view of a substrate shuttle according to an embodiment of the present invention.

[0090] FIG. 36 is a plan view of a substrate polishing device according to an embodiment of the present invention.

[0091] FIG. 37 is a flowchart of a substrate processing process according to an embodiment of the present invention.

[0092] FIG. 38 is a plan view of a substrate polishing apparatus according to an embodiment of the present invention.

[0093] FIG. 39 is a flowchart of a substrate processing process according to an embodiment of the present invention.

[0094] FIG. 40 is a plan view of a substrate polishing device according to an embodiment of the present invention.

[0095] FIGS. 41 and FIGS. 42 are flowcharts of a substrate processing process according to an embodiment of the present invention.

[0096] FIG. 43 is a plan view of a substrate polishing device according to an embodiment of the present invention.

[0097] FIG. 44 is a plan view of a substrate polishing device according to an embodiment of the present invention.

[0098] FIG. 45 is a front view of a substrate shuttle according to an embodiment of the present invention.

[0099] FIG. 46 is a plan view of a substrate polishing apparatus according to an embodiment of the present invention.

[0100] FIG. 47 is a flowchart of a substrate processing process according to an embodiment of the present invention.

[0101] FIG. 48 is a plan view of a substrate polishing device according to an embodiment of the invention.

[0102] The following embodiments mainly refer to Korean Patent Application No. 10-2024-0188417 filed on December 17, 2024, and also refer to other reference materials.

[0103] Referring to FIG. 1, a substrate polishing device (500) according to an embodiment of the present invention is described. The substrate polishing device (500) includes an EFEM (12, Equipment Front End Module) comprising a first substrate transfer means (1) and a load port (11, substrate storage unit), a substrate polishing unit (100), a substrate cleaning unit (300), and a second substrate transfer means (2). In the second layer, the substrate cleaning unit (300) is stacked and arranged on top of the substrate polishing unit (100). The first substrate transfer means (1) transfers a substrate from the load port (11) to the substrate polishing unit (100), and recovers the substrate from the substrate cleaning unit (300) and returns it to the load port (11). The second substrate transfer means (2) transfers a substrate from the substrate polishing unit (100) to the substrate cleaning unit (300). The second substrate transfer means (2) is positioned on the opposite side of the EFEM (12) with the substrate polishing section (100) and the substrate cleaning section (300) in between. The first and second substrate transfer means (1, 2) move between the first layer substrate polishing section (100) and the second layer substrate cleaning section (300) and transfer the substrate in a vertical direction.

[0104] A substrate polishing unit (100) is described with reference to FIG. 2. The substrate polishing unit (100) may include first and second polishing modules (101, 102) and a substrate transfer unit (200). The first polishing module (101) may be configured such that a first polishing unit (100A), a third substrate transfer means (3), and a second polishing unit (100B) are arranged in a line from the EFEM (12) in the aforementioned order. The second polishing module (102) may be configured such that a third polishing unit (100C), a fourth substrate transfer means (4), and a fourth polishing unit (100D) are arranged in a line from the EFEM (12) in the aforementioned order.

[0105] A substrate transfer unit (200) may be positioned between the first and second polishing modules (101, 102) and includes a first substrate shuttle (60, shuttle) for transporting substrates. The first substrate shuttle (60) reciprocates between a first position (60a) and a second position (60b), and at the first position (60a), receives a substrate from the first substrate transfer means (1). At the second position (60b), at least one of the third and fourth substrate transfer means (3, 4) withdraws a substrate from the first substrate shuttle (60). The third and fourth substrate transfer means (3, 4) transfer the withdrawn substrate to at least one substrate attachment means (120) among the first to fourth polishing units (100A to 100D). When polishing of the substrate is completed in at least one of the first to fourth polishing units (100A to 100D), the third and fourth substrate transfer means (3, 4) withdraw the substrate from the corresponding substrate attachment / detachment means (120) and transfer it to the first substrate shuttle (60) at the second position (60b). The first position (60a) may be positioned between the first and third polishing units (100A, 100C). The second position (60b) may be positioned opposite the EFEM (12) with the first position (60a) in between.

[0106] In one embodiment, the first substrate shuttle (60) may reciprocate between the first to third positions (60a, 60b, 60c). The third position (60c) may be positioned between the second and fourth polishing units (100B, 100D). At the third position (60c), the second substrate transfer means (2) withdraws the substrate from the first substrate shuttle (60). The first to third positions (60a, 60b, 60c) are arranged in the order of the first, second, and third positions (60a, 60b, 60c) from the first substrate transfer means (1).

[0107] In one embodiment, the substrate transport unit (200) may further include a second substrate shuttle (62) for transporting a substrate. The second substrate shuttle (62) reciprocates between a second position (60b) and a third position (60c). At the second position (60b), at least one of the third and fourth substrate transport means (3, 4) retrieves a substrate polished in at least one of the first to fourth polishing units (100A to 100D) and transfers the substrate to the second substrate shuttle (62). At the third position (60c), the second substrate transport means (2) retrieves the substrate from the second substrate shuttle (62).

[0108] Referring to FIG. 3, the first to fourth polishing units (100A to 100D) include a polishing plate (108) that provides a polishing surface (110) to which a polishing pad (112) is attached and to which a substrate is polished, a substrate attachment means (120, loading & unloading unit), and at least one polishing head (130A, 130B). The polishing head (130A, 130B) alternately polishes a substrate on the polishing surface (110), moves to the substrate attachment means (120) to detach the polished substrate, and then attaches a new substrate to be polished. The operation of the polishing head (130A, 130B) moving (134) in a vertical direction and a rotational direction between the polishing surface (110) and the substrate attachment means (120) is controlled by a polishing head driving module (132). In FIG. 3, an embodiment is shown in which the substrate attachment means (120) is positioned in the upper space of the polishing surface (110), but the substrate attachment means (120) may also be positioned on the side of the polishing surface (110). The substrate transfer means (3, 4) enters the space between the polishing head (130A or 130B) placed above the substrate attachment means (120) and the substrate attachment means (120) to transfer and retrieve the substrate to the substrate attachment means (120).

[0109] Referring to FIG. 2, the third substrate transfer means (3) is configured to transfer a substrate to at least one of the substrate attachment means (120) of the first and second polishing units (100A, 100B) and to retrieve it, and the fourth substrate transfer means (4) may be configured to transfer a substrate to at least one of the substrate attachment means (120) of the third and fourth polishing units (100C, 100D) and to retrieve it. The first and second polishing units (100A, 100B) may be arranged so that the substrate attachment means (120) faces the third substrate transfer means (3). The third and fourth polishing units (100C, 100D) may be arranged so that the substrate attachment means (120) faces the fourth substrate transfer means (4).

[0110] Referring to FIG. 4, the cleaning unit (300) of the substrate polishing device (500) is described. The cleaning unit (300) may include first and second cleaning devices (350). The first and second cleaning devices (350) may be placed on a support plate (150). A workspace (360) may be provided between the first and second cleaning devices (350) so that a worker steps on the support plate (150) to enter and maintain the first and second cleaning devices (350). A through hole (152) may be provided in the support plate (150) to allow the second substrate transfer means (2) to pass through. The first and second cleaning devices (350) include a substrate input terminal (320) and a substrate output terminal (330). The second substrate transfer means (2) transfers the substrate to the cleaning device (350) through the substrate input terminal (320), and the first substrate transfer means (1) withdraws the substrate from the substrate output terminal (330) and transfers it to the load port (11). The substrate input terminal (320) is a cleaning chamber configured to clean the substrate, and the substrate output terminal (330) may be configured as a drying chamber for drying the cleaned substrate.

[0111] Referring to FIG. 5, the substrate polishing unit (100) may further include fifth and sixth polishing units (100E, 100F) and fifth and sixth substrate transfer means (5, 6). The first polishing unit (100A), the third substrate transfer means (3), the second polishing unit (100B), the fifth substrate transfer means (5), and the fifth polishing unit (100E) may be arranged in a line in the above order. The third polishing unit (100C), the fourth substrate transfer means (4), the fourth polishing unit (100D), the sixth substrate transfer means (6), and the sixth polishing unit (100F) may also be arranged in a line in the above order. The fifth substrate transfer means (5) can be configured to transfer a substrate to the substrate attachment means (120) of the fifth polishing unit (100E) and retrieve it, and the sixth substrate transfer means (6) can be configured to transfer a substrate to the substrate attachment means (120) of the sixth polishing unit (100F) and retrieve it.

[0112] In this embodiment, the substrate transfer unit (200) may have first to fourth positions (60a, 60b, 60c, 60d) arranged therein. The first substrate shuttle (60) reciprocates between these positions and performs the following operations at each position. At the first position (60a), a substrate to be polished is received from at least one of the first to sixth polishing units (100A to 100F) from the first substrate transfer means (1). At the second position (60b), at least one of the third and fourth substrate transfer means (3, 4) withdraws the substrate from the first substrate shuttle (60) and transfers it to at least one of the first to fourth polishing units (100A to 100D) substrate attachment means (120), and when polishing is completed, the substrate is retrieved from the corresponding substrate attachment means (120) and returned to the first substrate shuttle (60) at the second position (60b). At the third position (60c), at least one of the fifth and sixth substrate transfer means (5, 6) retrieves a substrate from the first substrate shuttle (60) and transfers it to at least one of the fifth and sixth polishing units (100E, 100F), and when polishing is completed, retrieves it and returns it to the first substrate shuttle (60) at the third position (60c). At the fourth position (60d), the second substrate transfer means (2) retrieves a substrate that has been polished in at least one of the first to sixth polishing units (100A to 100F) from the first substrate shuttle (60). In this embodiment, the fourth position (60d) may be positioned between the fifth and sixth polishing units (100E, 100F).

[0113] In one embodiment, the substrate transfer unit (200) may further include a second substrate shuttle (62). In this embodiment, the first substrate shuttle (60) may be configured to reciprocate between first to third positions (60a, 60b, 60c), receive a substrate from the first substrate transfer means (1) at the first position (60a), move to the second position (60b) to transfer it to at least one of the third and fourth substrate transfer means (3, 4), or move to the third position (60c) to transfer it to at least one of the fifth and sixth substrate transfer means (5, 6). The second substrate shuttle (62) may be configured to reciprocate between the second to fourth positions (60b, 60c, 60d), receive a substrate polished at at least one of the first to fourth polishing units (100A to 100D) from the third and fourth substrate transfer means (3, 4) at the second position (60b), receive a substrate polished at at least one of the fifth and sixth polishing units (100E, 100F) from the fifth and sixth substrate transfer means (5, 6) at the third position (60c), and deliver a substrate polished at at least one of the first to sixth polishing units (100A to 100F) to the second substrate transfer means (2) at the fourth position (60d).

[0114] As described above, the first substrate shuttle (60) can reciprocate between the first to third positions (60a, 60b, 60c), receive a substrate to be polished in the substrate polishing device (500) from the first substrate transfer means (1), and transport it to at least one of the third to sixth substrate transfer means (3, 4, 5, 6), and the second substrate shuttle (62) can reciprocate between the second to fourth positions (60b, 60c, 60d), receive a substrate polished in the substrate polishing device (500) from at least one of the third to sixth substrate transfer means (3, 4, 5, 6), and transport it to the second substrate transfer means (2). The first and second substrate shuttles (60, 62) may be configured to be connected to a single guide rail (64, transfer track) and move independently of each other.

[0115] Referring to FIGS. 2 and 5, a cleaning chamber (310a, 310b) may be disposed on the opposite side of the EFEM (12) in the substrate polishing unit (100). In the cleaning chamber (310a, 310b), the substrate is cleaned, and polishing byproducts on the surface of the substrate can be removed using a buffing pad (192). In this embodiment, a second substrate transfer means (2) takes out a substrate from the first or second substrate shuttle (60, 62) and transfers it to at least one cleaning chamber (310a, 310b), and when cleaning is completed, the substrate is recovered and transferred to the substrate input terminal (320) of the cleaning device (350) of the cleaning unit (300).

[0116] Referring to FIG. 6, a method for processing a substrate in the substrate polishing device (500) of FIG. 2 and FIG. 5 is described. In one embodiment, the substrate may be processed through steps 610, 612, 614, 616, 618, 620, 622, 624, 626, and 628. In this embodiment, the substrate is polished in three steps by passing through the first, second, and fifth polishing units (100A, 100B, 100E). In one embodiment, steps 620 to 628 may proceed after steps 610 to 614 are completed. In this embodiment, the substrate is polished in two steps by passing through the first and fifth polishing units (100A, 100E). In one embodiment, step 628 may proceed after steps 610 to 620 are completed. In this embodiment, the substrate is polished in two stages by passing through the first and second polishing units (100A, 100B). In one embodiment, steps 620 and 628 may be performed after steps 610 to 614 have been performed. In this embodiment, the substrate is polished only in the first polishing unit (100A).

[0117] In FIG. 6, step 610 is a step in which the first substrate transfer means (1) transfers a substrate to the first substrate shuttle (60). Step 612 is a step in which the third substrate transfer means (3) transfers a substrate from the first substrate shuttle (60) to the substrate attachment / detachment means (120) of the first polishing unit (100A). Step 614 is a step in which the substrate is polished in the first polishing unit (100A). Step 616 is a step in which the third substrate transfer means (3) transfers a substrate from the substrate attachment / detachment means (120) of the first polishing unit (100A) to the substrate attachment / detachment means (120) of the second polishing unit (100B). Step 618 is a step in which the substrate is polished in the second polishing unit (100B). Step 620 is a step in which the third substrate transfer means (3) transfers a substrate from the substrate attachment means (120) of the second polishing unit (100B) to the first or second substrate shuttle (60, 62). Step 622 is a step in which the fifth substrate transfer means (5) transfers a substrate from the first or second substrate shuttle (60, 62) to the substrate attachment means (120) of the fifth polishing unit (100E). Step 624 is a step in which the substrate is polished in the fifth polishing unit (100E). Step 626 is a step in which the fifth substrate transfer means (5) transfers a substrate to the first or second substrate shuttle (60, 62) via the substrate attachment means (120) of the fifth polishing unit (100E). Step 628 is a step in which the second substrate transfer means (2) withdraws a substrate from the first or second substrate shuttle (60, 62).

[0118] With reference to FIG. 7, another embodiment of the substrate polishing device (500) is described. According to this embodiment, a first substrate holder (70, substrate holder) is disposed between the first and third polishing units (100A, 100C), and a second substrate holder (80, substrate holder) is disposed between the second and fourth polishing units (100B, 100D). A first substrate transfer means (1) transfers a substrate to the first substrate holder (70), and a third substrate transfer means (3) transfers a substrate between the first and second substrate holders (70, 80) and the substrate attachment means (120) of the first to fourth polishing units (100A to 100D).

[0119] Referring to FIG. 8, the second substrate holder (80) may be configured to move vertically between a first vertical position (80a) and a second vertical position (80b) inside the isolation chamber (90). The first vertical position (80a) may be located in the substrate polishing section (100), and the second vertical position (80b) may be located in the substrate cleaning section (300). A moving mechanism (not shown), such as a linear track, may be provided inside the isolation chamber (90) to move the second substrate holder (80) vertically. In the isolation chamber (90), a first substrate input port (92a) may be provided at the first vertical position (80a), and a substrate output port (94) may be provided at the second vertical position (80b). The third substrate transfer means (3) can transfer a substrate to the second substrate holder (80) through the first substrate input port (92a), and the second substrate transfer means (2) can withdraw a substrate from the second substrate holder (80) through the substrate output port (94).

[0120] Referring to FIG. 9, the second substrate holder (80) can move upward from the first vertical position (80a) of the substrate polishing unit (100) to the second vertical position (80b) of the substrate cleaning unit (300) by passing through the opening (152) provided in the support plate (150). The second substrate transfer means (2) may be configured to be positioned in the cleaning unit (300) to withdraw a substrate from the second substrate holder (80) at the second vertical position (80b) and transfer it to the substrate input terminal (320) of the cleaning device (350).

[0121] Referring to FIG. 10, the substrate polishing unit (100) of FIG. 7 may further include fifth and sixth polishing units (100E, 100F), a fourth substrate transfer means (4), and a third substrate holder (72, substrate holder). The fifth polishing unit (100E) is positioned opposite the first polishing unit (100A) with the second polishing unit (100B) in between, and the sixth polishing unit (100F) is positioned opposite the second polishing unit (100B) with the fourth polishing unit (100D) in between. The fourth substrate transfer means (4) may be positioned in the space between the second, fourth, fifth, and sixth polishing units (100B, 100D, 100E, 100F). The third substrate holder (72, substrate holder) may be placed in the lower space of the second substrate holder (80) between the second and fourth polishing units (100B, 100D). In this embodiment, the first, second, and third substrate holders (70, 80, 72) and the third and fourth substrate transfer means (3, 4) constitute a substrate transfer unit (200).

[0122] According to this embodiment, the substrate is transferred from the first substrate holder (70) to the third substrate holder (72) by the third substrate transfer means (3). Then, the fourth substrate transfer means (4) withdraws the substrate from the third substrate holder (72) and transfers it to the substrate attachment means (120) of the fifth and sixth polishing units (100E, 100F), and when polishing is completed, it is retrieved and transferred to the second substrate holder (80). Afterward, the second substrate holder (80) moves to a second vertical position (80b) in the vertical direction with reference to FIG. 8, and the second substrate transfer means (2) withdraws the substrate from the second substrate holder (80) at the second vertical position (80b).

[0123] Referring to FIG. 8, a second substrate inlet (92b) may be positioned in the isolation chamber (90) at a first vertical position (80a) of a second substrate holder (80). The second substrate inlet (92b) may be positioned on the opposite side of the first substrate inlet (92a). A fourth substrate transfer means (4) transfers a substrate to the second substrate holder (80) through the second substrate inlet (92b). A third substrate holder (72) may be positioned in the lower space of the first vertical position (80a). The third substrate holder (72) may be positioned in the lower space of the isolation chamber (90).

[0124] Referring to FIG. 11, a method for polishing a substrate in the substrate polishing device (500) of FIG. 7 is described. In one embodiment, the substrate may be processed through steps 650, 652, 654, 656, 658, and 660. In step 650, a first substrate transfer means (1) transfers the substrate to a first substrate holder (70). In step 652, a third substrate transfer means (3) transfers the substrate from the first substrate holder (70) to at least one substrate attachment / detachment means (120) among the first to fourth polishing units (100A to 100D). In step 654, the substrate is polished in at least one of the first to fourth polishing units (100A to 100D). In step 656, the third substrate transfer means (3) transfers a substrate from at least one substrate attachment / detachment means (120) among the first to fourth polishing units (100A to 100D) to the second substrate holder (80) positioned at the first vertical position (80a). In step 658, the second substrate holder (80) rises to the second vertical position (80b). In step 660, the second substrate transfer means (2) withdraws the substrate from the second substrate holder (80) and transfers it to the substrate input terminal (320) of the cleaning device (350).

[0125] Referring to FIG. 11, a method of polishing a substrate in the substrate polishing device (500) of FIG. 10 may include steps 670, 672, 674, 676, and 658 following step 654. Step 670 is a step in which a third substrate transfer means (3) transfers a substrate from a substrate attachment / detachment means (120) of the first to fourth polishing units (100A to 100D) to a third substrate holder (72). Step 672 is a step in which a fourth substrate transfer means (4) transfers a substrate from the third substrate holder (72) to a substrate attachment / detachment means of the fifth or sixth polishing unit (100E, 100F). Step 674 is a step of polishing the substrate in the fifth or sixth polishing unit (100E, 100F). Step 676 is a step in which the fourth substrate transfer means (4) transfers the substrate polished in the fifth or sixth polishing unit (100E, 100F) to the second substrate holder (80) placed at the first vertical position (80a). According to one embodiment, following step 650, steps 670, 672, 674, 676, and 658 may proceed.

[0126] Referring to FIG. 48, the substrate polishing device (500) of FIG. 10 may be configured to include a substrate shuttle (60) in place of the first and third substrate holders (70, 72). The substrate shuttle (60) is configured to reciprocate between a first position (60a) and a second position (60b) along a guide rail (64). The first position (60a) is positioned between the first and third substrate transfer means (1, 3), and the second position (60b) is positioned between the third and fourth substrate transfer means (3, 4). The substrate shuttle (60) receives a substrate from the first substrate transfer means (1) at the first position (60a) and transfers a substrate to the fourth substrate transfer means (4) at the second position (60b). The fourth substrate transfer means (4) is configured to transfer a substrate drawn from the substrate shuttle (60) to at least one of the fifth and sixth polishing units (100E, 100F), and when polishing is completed, to draw it out again and transfer it to the second substrate holder (80). The second position (60b) may be placed in the lower space of the second substrate holder (80). The substrate shuttle (60) may be configured to move along the guide rail (64) through the upper or lower space of the third substrate transfer means (3).

[0127] According to one embodiment, the substrate polishing device (500) may further include a first substrate holder (70) located in the upper space of a first position (60a). A first substrate transfer means (1) transfers a substrate to the first substrate holder (70), and a third substrate transfer means (3) withdraws the substrate from the first substrate holder (70) and transfers it to at least one of the first to fourth polishing units (100A to 100D), after which the polished substrate is withdrawn again and transferred to a second substrate holder (80).

[0128] According to this embodiment, a substrate being polished in the first to fourth polishing units (100A to 100D) is transferred to the first substrate holder (70) by the first substrate transfer means (1). Subsequently, the third substrate transfer means (3) retrieves the substrate and transfers it to at least one of the first to fourth polishing units (100A to 100D), and then retrieves the polished substrate again and transfers it to the second substrate holder (80). A substrate being polished in at least one of the fifth and sixth polishing units (100E, 100F) is transferred to a substrate shuttle (60) located at the first position (60a) by the first substrate transfer means (1). After the fourth substrate transfer means (4) retrieves the substrate from the substrate shuttle (60) that has moved to the second position (60b) and transfers it to at least one of the fifth and sixth polishing units (100E, 100F), the polished substrate is retrieved and transferred to the second substrate holder (80).

[0129] The following embodiments mainly refer to FIGS. 25 to 31 of Korean Patent Application No. 10-2025-0020446 filed on February 17, 2025, and also refer to other reference materials.

[0130] With reference to FIG. 12, another embodiment of the substrate polishing device (500) illustrated in FIG. 2 is described. The first and second polishing units (100A, 100B) are arranged to face each other with the first substrate holder (70) in between, and the third and fourth polishing units (100C, 100D) are arranged to face each other with the second substrate holder (72) in between. The substrate attachment means (120) of the first and third polishing units (100A, 100C) may be arranged to face each other, and the substrate attachment means (120) of the second and fourth polishing units (100B, 100D) may be arranged to face each other. In the substrate transfer unit (200), components may be arranged in the order of the first substrate holder (70), the third substrate transfer means (3), and the second substrate holder (72) from the EFEM (12). The first substrate transfer means (1) transfers the substrate to be polished to the first substrate holder (70), and the third substrate transfer means (3) transfers the said substrate from the first substrate holder (70) to at least one of the first to fourth polishing units (100A to 100D). The polished substrate is recovered and transferred to the second substrate holder (72). Finally, the second substrate transfer means (2) withdraws the polished substrate from the second substrate holder (72) and transfers it to the cleaning chamber (310), and recovers it and transfers it to the substrate input terminal (320) of the cleaning device (350) shown in FIG. 4.

[0131] Referring to FIG. 13, the substrate polishing device (500) illustrated in FIG. 12 may further include fifth and sixth polishing units (100E, 100F) arranged to face each other with the substrate transfer unit (200) in between. The fifth polishing unit (100E) is arranged to face the first polishing unit (100A) with the third polishing unit (100C) in between, and the sixth polishing unit (100F) is arranged to face the second polishing unit (100B) with the fourth polishing unit (100D) in between. According to this embodiment, at least one substrate holder (70, 72, 74) may be arranged in the substrate transfer unit (200). The first substrate holder (70) may be positioned between the first and third substrate transfer means (1, 3), the second substrate holder (72) between the third and fourth substrate transfer means (3, 4), and the third substrate holder (74) between the fourth and second substrate transfer means (4, 2). Additionally, the first, third, and fifth polishing units (100A, 100C, 100E) may be positioned in a line on one side of the substrate transfer section (200), and the second, fourth, and sixth polishing units (100B, 100D, 100F) may be positioned in a line on the opposite side with the substrate transfer section (200) in between.

[0132] At least one substrate shuttle (60, 62) may be disposed in the substrate transfer unit (200). The first substrate shuttle (60) may be configured to transport a substrate by reciprocating between the first to third positions (60a, 60b, 60c). After receiving a substrate from the first substrate transfer means (1) at the first position (60a), the first substrate shuttle (60) moves across the upper or lower space of the third substrate transfer means (3) to the second position (60b) and transfers it to the fourth substrate transfer means (4). The first position (60a) may be disposed in the upper or lower space of the first substrate holder (70), and the second position (60b) may be disposed in the upper or lower space of the second substrate holder (72). According to one embodiment, the first substrate shuttle (60) may be configured to receive a substrate from the third substrate transfer means (3) at the second position (60b), then move through the upper or lower space of the fourth substrate transfer means (4) to the third position (60c) to transfer the substrate to the second substrate transfer means (2). The third position (60c) may be placed in the upper or lower space of the third substrate holder (74).

[0133] The second substrate shuttle (62) may be configured to transport a substrate by reciprocating between the first and second positions (62a, 62b). The second substrate shuttle (62) may be configured to receive a substrate from the third substrate transport means (3) at the first position (62a), then move through the upper or lower space of the fourth substrate transport means (4) to the second position (62b) and deliver the substrate to the second substrate transport means (2). The first position (62a) of the second substrate shuttle (62) may be placed in the upper or lower space of the second substrate stand (72), and the second position (62b) may be placed in the upper or lower space of the third substrate stand (74). The first and second substrate shuttles (60, 62) may be configured to move horizontally in a straight line at different heights so as not to collide with each other.

[0134] The first substrate transfer means (1) may be configured to transfer a substrate to the first substrate shuttle (60) or the first substrate holder (70) at the first position (60a). The third substrate transfer means (30) may be configured to transfer a substrate to the first substrate shuttle (60) or the first substrate holder (70) at the first position (60a) after withdrawing the substrate from the first substrate shuttle (60) or the first substrate holder (70) at the first position (60a), the second substrate shuttle (62) or the second substrate holder (72) at the second position (62a). The fourth substrate transfer means (4) may be configured to transfer a substrate to the first substrate shuttle (60) at the second position (60b), the second substrate shuttle (62) at the first position (62a), or the second substrate holder (72) after withdrawing the substrate from the second position (60b). The second substrate transfer means (2) may be configured to withdraw a substrate from the first substrate shuttle (60) at the third position (60c), the second substrate shuttle (62) at the second position (62b), or the third substrate holder (74).

[0135] Referring to FIG. 14, an embodiment of polishing a substrate in the substrate polishing device (500) of FIG. 13 is described. The substrate may be polished by sequentially passing through steps A1 to A6. Between steps A3 and A4, at least one of Y5 and Y6 is performed. According to this embodiment, the substrate is polished in one or two steps while passing through at least one of the fifth and sixth polishing units (100E, 100F). Between steps A5 and A6, step C1 may be performed. In FIG. 14, A1 is a step in which a first substrate transfer means (1) transfers a substrate to a first substrate shuttle (60) placed at a first position (60a). A2 is a step in which the first substrate shuttle (60) moves from the first position (60a) to a third position (60c). A3 is a step in which a fourth substrate transfer means (3) retrieves a substrate from the first substrate shuttle (60) placed at the third position (60c). A4 is a step in which the fourth substrate transfer means (4) transfers the substrate to the third substrate holder (74). A5 is a step in which the second substrate transfer means (2) retrieves the substrate from the third substrate holder (74). A6 is a step in which the second substrate transfer means (2) transfers the substrate to the cleaning device (350) of the cleaning unit (300). C1 is a step in which the second substrate transfer means transfers the substrate to the cleaning chamber (310) and retrieves it. The substrate may be transferred after being cleaned once in the cleaning chamber (310) before being transferred to the cleaning device (350). Y5 and Y6 are steps in which the fourth substrate transfer means (4) transfers the substrate to the fifth and sixth polishing units (100E, 100F), respectively, and retrieves it when polishing is finished.

[0136] Referring to FIG. 14, another embodiment of polishing a substrate in the substrate polishing device (500) of FIG. 13 is described. The substrate may be polished by sequentially passing through steps B1, B2, B3, B4, B5, and A6. Between steps B2 and B3, at least one of Y1 to Y4 is performed. The substrate may be polished in steps 1, 2, 3, or 4 while passing through at least one of the first and fourth polishing units (100A to 100D). In FIG. 14, B1 is a step in which the first substrate transfer means (1) transfers the substrate to the first substrate holder (70). B2 is a step in which the third substrate transfer means (3) retrieves the substrate from the first substrate holder (70). B3 is a step in which the third substrate transfer means (3) transfers the substrate to the first substrate shuttle (60) at the second position (60b). B4 is a step in which the first substrate shuttle (60) moves from the second position (60b) to the third position (60c). B5 is a step in which the second substrate transfer means (2) takes a substrate from the first substrate shuttle (60) at the third position (60c). Y1 to Y4 are steps in which the third substrate transfer means (3) transfers the substrate to the first to fourth polishing units (100A to 100D), respectively, and retrieves it when polishing is finished.

[0137] With reference to FIG. 14, another embodiment of polishing a substrate in the substrate polishing device (500) of FIG. 13 is described. In this embodiment, steps B3, B4, and B5 are replaced with B3', B4', and B5'. B3' is a step in which the third substrate transfer means (3) transfers a substrate to the second substrate shuttle (62) at the first position (62a). B4' is a step in which the second substrate shuttle (62) moves from the first position (62a) to the second position (62b). B5' is a step in which the second substrate transfer means (2) retrieves a substrate from the second substrate shuttle (62) at the second position (62b).

[0138] The substrate polishing device (500) of FIG. 13 can reduce the substrate delivery time by eliminating bottlenecks in the polishing section (100) through the distribution of substrate delivery operations between the first to fourth substrate delivery means (1, 2, 3, 4) by one or more substrate shuttles (60, 62) and at least one substrate holder (70, 70, 74). Additionally, the footprint of the polishing section (100) can be reduced by placing the substrate shuttles (60, 62) in the upper space of at least one substrate holder (70, 72, 74). In addition, by placing the cleaning chamber (310) near the second substrate transfer means (2) and having the second substrate transfer means (2) immediately transfer the substrate polished in the polishing unit (100) to the cleaning chamber (310) to perform cleaning, and then transferring it to the cleaning device (350) of the cleaning unit (300), the problem of substrate corrosion that may occur during the process of transferring the substrate exposed to the polishing agent to the cleaning device (350) can be prevented.

[0139] The following embodiments mainly refer to FIGS. 2 to 24 of Korean Patent Application No. 10-2025-0020446 filed on February 17, 2025, FIGS. 1 to 9 of Korean Patent Application No. 10-2025-0021853 filed on February 19, 2025, and FIGS. 1 to 9 of Korean Patent Application No. 10-2025-0027149 filed on March 1, 2025, and also refer to other reference materials.

[0140] Referring to FIG. 15, a substrate polishing device (600) according to an embodiment of the present invention is described. The substrate polishing device (600) includes a polishing section (100) and a substrate transfer section (200). The polishing section (100) includes first to fourth polishing units (100A to 100D) arranged in a line from the EFEM (12). The substrate transfer section (200) includes a substrate shuttle (60), a third substrate transfer means (3) arranged between the first and second polishing units (100A, 100B), a fourth substrate transfer means (4) arranged between the third and fourth polishing units (100C, 100D), and a second substrate transfer means (2) arranged on the opposite side of the EFEM (12). The substrate shuttle (60) reciprocates along the guide rail (64) to the first to fourth positions (60a to 60d) and transports the substrate between the first to fourth substrate transport means (1, 2, 3, 4). The first to fourth positions (60a to 60d) are each positioned adjacent to the first to fourth polishing units (100A to 100D).

[0141] The polishing surface (110) of the first polishing unit (100A), the substrate attachment means (120), and the first position (60a) are arranged in a line, and the polishing surface (110) of the second polishing unit (100B), the substrate attachment means (120), and the second position (60b) are arranged in a line. The polishing surface (110) of the third polishing unit (100C), the substrate attachment means (120), and the third position (60c) are arranged in a line, and the polishing surface (110) of the fourth polishing unit (100D), the substrate attachment means (120), and the fourth position (60d) may be arranged in a line. The third substrate transfer means (3) is placed in the space between the substrate attachment means (120) of the first and second polishing units (100A, 100B) and the first and second positions (60a, 60b). The fourth substrate transfer means (4) is positioned in the space between the substrate attachment means (120) of the third and fourth polishing units (100C, 100D) and the third and fourth positions (60c, 60d).

[0142] In the plan view of FIG. 15, parts of the third and fourth substrate transfer means (3, 4) may be positioned below the movement trajectory (66) of the substrate shuttle (60). The third substrate transfer means (3) may be positioned lower than the substrate shuttle (60) while the substrate shuttle (60) moves across the upper space to prevent collision with the substrate shuttle (60). Likewise, the fourth substrate transfer means (4) may also be positioned lower than the substrate shuttle (60) to prevent collision when the substrate shuttle (60) passes through the upper space.

[0143] The substrate shuttle (60) receives a substrate to be polished in the first or second polishing unit (100A, 100B) from the first substrate transfer means (1) and transfers it from the first position (60a) to the third substrate transfer means (3). Additionally, it receives a substrate to be polished in the third or fourth polishing unit (100C, 100D) from the first substrate transfer means (1), moves it to the third position (60c), and then transfers it to the fourth substrate transfer means (4). Furthermore, it receives a substrate polished in the first or second polishing unit (100A, 100B) from the third substrate transfer means (3) at the second position (60b) and transports it to the second substrate transfer means (2), and receives a substrate polished in the third or fourth polishing unit (100C, 100D) from the fourth substrate transfer means (4) at the fourth position (60d) and transports it to the second substrate transfer means (2). When the substrate shuttle (60) moves from the first position (60a) to the third position (60c), it moves through the upper space of the third substrate transfer means (3). In one embodiment, the third and fourth substrate transfer means (3, 4) may be arranged in a shape that hangs downward from the upper space of the substrate transfer unit (200) instead of being installed on the bottom surface of the substrate transfer unit (200). In this embodiment, the substrate shuttle (60) reciprocates between the first substrate transfer means (1) and the second substrate transfer means (2) through the lower space of the third and fourth substrate transfer means (3, 4).

[0144] The first substrate transfer means (1) transfers the substrate to be polished in the first to fourth polishing units (100A to 100D) to the substrate shuttle (60), for example, at the first position (60a). The third substrate transfer means (3) withdraws the substrate from the substrate shuttle (60), for example, at the first position (60a), transfers it to the first and second polishing units (100A, 100B), recovers the substrate after polishing is finished, and returns it to the substrate shuttle (60), for example, at the second position (60b). The fourth substrate transfer means (4) withdraws the substrate from the substrate shuttle (60), for example, at the third position (60c), transfers it to the third and fourth polishing units (100C, 100D), recovers it after polishing is finished, and returns it to the substrate shuttle (60), for example, at the fourth position (60d). The second substrate transfer means (2) retrieves the substrate polished in the first to fourth polishing units (100A to 100D) from the substrate shuttle (60), for example, at the fourth position (60d).

[0145] Referring to FIG. 16, an embodiment of polishing a substrate in the substrate polishing device (600) of FIG. 15 is described. The substrate is polished by sequentially passing through steps A1, A2, A3, A4, A5, A6, and A7. Between steps A2 and A3, at least one of Y1 and Y2 may be performed. Between steps A4 and A5, at least one of Y3 and Y4 may be performed. Between steps A2 and A3, B1 is performed. Between steps A5 and A6, B2 is performed. In an embodiment where Y1, Y2, Y3, and Y4 are all performed, the substrate is polished in four steps by passing through all four polishing units (100A to 100D). In an embodiment where three of Y1, Y2, Y3, and Y4 are performed, the substrate is polished in three steps by passing through three polishing units. In an embodiment where only two of Y1 to Y4 are performed, the substrate is polished in two steps by passing through two polishing units. In an embodiment where only one is performed in Y1 to Y4, the substrate is polished in one step while passing through one polishing unit.

[0146] In FIG. 16, A1 is a step in which the first substrate transfer means (1) transfers a substrate to the substrate shuttle (60). For example, it is a step of transferring a substrate to the substrate shuttle (60) located at the first position (60a). A2 is a step in which the third substrate transfer means (3) retrieves a substrate from the substrate shuttle (60). For example, it is a step of retrieving a substrate from the substrate shuttle (60) located at the first position (60a). A3 is a step in which the third substrate transfer means (3) transfers a substrate to the substrate shuttle (60). For example, it is a step of transferring a substrate to the substrate shuttle (60) located at the second position (60b). A4 is a step in which the substrate shuttle (60) moves from the second position (60b) to the third position (60c). A5 is a step in which the fourth substrate transfer means (4) retrieves a substrate from the substrate shuttle (60). For example, it is a step of retrieving a substrate from the substrate shuttle (60) located at the third position (60c). A6 is a step in which the fourth substrate transfer means (4) transfers a substrate to the substrate shuttle (60). For example, it is a step of transferring a substrate to the substrate shuttle (60) located at the fourth position (60d). A7 is a step in which the second substrate transfer means (2) retrieves a substrate from the substrate shuttle (60). For example, it is a step in which a substrate is retrieved from the substrate shuttle (60) located at the fourth position (60d). B1 is a step in which the substrate shuttle (60) moves from the first position (60a) to the second position (60b). B2 is a step in which it moves from the third position (60c) to the fourth position (60d). Y1 and Y2 are steps in which the third substrate transfer means (3) transfers a substrate to the first and second polishing units (100A, 100B), respectively, and retrieves the substrate when polishing is finished. Y3 and Y4 are steps in which the fourth substrate transfer means (4) transfers the substrate to the third and fourth polishing units (100C, 100D), respectively, and brings the substrate back when polishing is finished.

[0147] Referring to FIG. 17, the substrate polishing device (600) of FIG. 15 may further include a fifth substrate transfer means (5) that transfers a substrate between the second and third polishing units (100B, 100C) and at least one of them. The fifth substrate transfer means (5) may withdraw a substrate from the substrate shuttle (60) and transfer it to at least one of the second and third polishing units (100B, 100C), and then retrieve the polished substrate and transfer it back to the substrate shuttle (60). The fifth substrate transfer means (5) may withdraw a substrate from the substrate shuttle (60) when the substrate shuttle (60) is located at the second position (60b), and transfer it back to the substrate shuttle (60) when the substrate shuttle (60) is located at the third position (60c).

[0148] The substrate polishing device (600) may further include a first substrate holder (70) positioned near a first position (60a). In this embodiment, the first substrate transfer means (1) transfers a substrate to the first substrate holder (70), and the third substrate transfer means (3) withdraws the substrate from the first substrate holder (70) and transfers it to at least one of the first and second polishing units (100A, 100B), and then recovers the polished substrate and transfers it to the substrate shuttle (60) at the second position (60b). The substrate polishing device (600) may further include a second substrate holder (72) positioned near a fourth position (60d). In this embodiment, the fourth substrate transfer means (4) transfers the substrate to the second substrate holder (72), and the second substrate transfer means (2) withdraws the substrate from the second substrate holder (72). The substrate polishing device (600) may further include a third substrate holder (74) positioned near the second position (60b). In this embodiment, the third substrate transfer means (3) can transfer a substrate to the third substrate holder (74), and the fifth substrate transfer means (5) can withdraw the substrate from the third substrate holder (74) and transfer it to the substrate shuttle (60). The substrate polishing device (600) may further include a fourth substrate holder (76) positioned near the third position (60c). In this embodiment, the fifth substrate transfer means (5) can transfer a substrate to the fourth substrate holder (76), and the fourth substrate transfer means (4) can withdraw the substrate from the fourth substrate holder (76) and transfer it to at least one of the third and fourth polishing units (100C, 100D), and then retrieve the polished substrate and transfer it to the second substrate holder (72) at the fourth position (60d).

[0149] Referring to FIG. 18, the substrate transfer unit (200) of the substrate polishing device (600) of FIG. 15 and FIG. 17 may include first and second substrate shuttles (60, 62). In this embodiment, the first substrate shuttle (60) may be configured to reciprocate between the first and fourth substrate transfer means (1, 4), receive a substrate from the first substrate transfer means (1) at a first position (60a), move to a third position (60c), and transfer the substrate to the fourth substrate transfer means (4). The second substrate shuttle (62) may be configured to reciprocate between the third and second substrate transfer means (3, 2), receive a substrate from the third substrate transfer means (3) at a second position (60b), move to a fourth position (60d), and transfer the substrate to the second substrate transfer means (2).

[0150] Referring to FIG. 19, an embodiment of polishing a substrate in the substrate polishing device (600) of FIG. 18 is described. A first substrate (W1) may be polished by sequentially passing through steps A1 to A5. Between steps A2 and A3, at least one of Y1 and Y2 is performed. A second substrate (W2) may be polished by sequentially passing through steps A1, B1, B2, B3, and A5. Between steps B2 and B3, at least one of Y3 and Y4 is performed. According to this embodiment, the first substrate (W1) is polished in at least one of the first and second polishing units (100A, 100B), and the second substrate (W2) is polished in at least one of the third and fourth polishing units (100C, 100D). In FIG. 19, A1 is a step in which a first substrate transfer means (1) transfers a substrate to a first substrate shuttle (60) placed at a first position (60a). A2 is a step in which the third substrate transfer means (3) withdraws a substrate from the substrate shuttle (60). A3 is a step in which the third substrate transfer means (3) transfers a substrate to the substrate shuttle (62) located at the second position (60b). A4 is a step in which the second substrate shuttle (62) moves from the second position (60b) to the fourth position (60d). A5 is a step in which the second substrate transfer means (2) withdraws a substrate from the second substrate shuttle (62) located at the fourth position (60d). B1 is a step in which the first substrate shuttle (60) moves from the first position (60a) to the third position (60c). B2 is a step in which the fourth substrate transfer means (4) withdraws a substrate from the first substrate shuttle (60) located at the third position (60c). B3 is a step in which the fourth substrate transfer means (4) transfers the substrate to the second substrate shuttle (62) placed at the fourth position (60d). Y1 to Y4 are the same as in FIG. 16.

[0151] Referring to FIG. 19, the substrate may be polished through steps A1, A2, A3, C1, C2, B3, and A5. C1 is a step in which the second substrate shuttle (62) moves from the second position (60b) to the third position (60c), and C2 is a step in which the fourth substrate transfer means (4) withdraws the substrate from the second substrate shuttle (62) located at the third position (60c). In this embodiment, between steps A2 and A3, at least one of Y1 and Y2 is performed, and between steps C2 and B3, at least one of Y3 and Y4 is performed. After the substrate is polished in at least one of the first and second polishing units (100A, 100B), it is further polished in at least one of the third and fourth polishing units (100C, 100D).

[0152] Referring to FIG. 20, the substrate polishing device (600) of FIG. 15, 17 and 18 may be configured such that the substrate cleaning unit (300) is located opposite the polishing unit (100) with the substrate transfer unit (200) in between. The substrate input terminal (320) of the cleaning device (350) is positioned near the second substrate transfer means (2), and the substrate output terminal (330) is positioned adjacent to the EFEM (12). The second substrate transfer means (2) transfers a substrate from the substrate shuttle (60, 62) or substrate holder (72) of the substrate transfer unit (200) to the substrate input terminal (320), and the first substrate transfer means (1) of the EFEM (12) withdraws the substrate from the substrate output terminal (330) and transfers it to the substrate storage unit (11).

[0153] Referring to FIG. 21, the substrate shuttle (60, 62) may be configured to mount the substrate vertically. The substrate shuttle (60, 62) moves along the guide rail (64). The substrate shuttle (60, 62) may be positioned between the substrate transfer unit (200) and the cleaning unit (300), or between the substrate transfer unit (200) and the first to fourth polishing units (100A to 100D).

[0154] The following embodiments primarily refer to FIGS. 10 to 12 of Korean Patent Application No. 10-2025-0021853 filed on February 19, 2025, FIGS. 10 to 20 of Korean Patent Application No. 10-2025-0027149 filed on March 1, 2025, and FIGS. 21 to 23 of Korean Patent Application No. 10-2025-0031748 filed on March 11, 2025, and also refer to other reference materials.

[0155] Referring to FIG. 22, the substrate polishing device (600) of FIG. 20 may further include fifth and sixth polishing units (100E, 100F) and a fifth substrate transfer means (5). The substrate polishing device (600) of FIG. 15, 17, and 18 may likewise further include fifth and sixth polishing units (100E, 100F) and a fifth substrate transfer means (5). The fifth and sixth polishing units (100E, 100F) are arranged in a line with the first to fourth polishing units (100A, 100D) opposite the third polishing unit (100C) with the fourth polishing unit (100D) in between. The fifth substrate transfer means (5) is positioned in the space between the substrate attachment means (120) of the fifth and sixth polishing units (100E, 100F) and the fifth and sixth positions (60e, 60f). The fifth position (60e) is positioned between the fifth polishing unit (100E) and the cleaning device (350), and the sixth position (60f) is positioned between the sixth polishing unit (100F) and the cleaning device (350).

[0156] The first substrate shuttle (60) moves back and forth in the order of the first position (60a), the third position (60c), the first position (60a) again, and the fifth position (60e). The first substrate shuttle (60) receives a substrate from the first substrate transfer means (1) at the first position (60a) and transfers it to the second substrate transfer means (2). Then, it receives the next substrate again at the first position (60a), moves to the third position (60c), and transfers the substrate to the third substrate transfer means (3). Subsequently, the first substrate shuttle (60) returns to the first position (60a) to receive a substrate, moves to the fifth position (60e), and transfers it to the fifth substrate transfer means (5).

[0157] The second substrate shuttle (62) moves back and forth in the order of the second position (60b), the sixth position (60f), the fourth position (60d), and then the sixth position (60f). The second substrate shuttle (62) first receives a substrate polished from the first or second polishing unit (100A, 100B) from the third substrate transfer means (3) at the second position (60b), moves to the sixth position (60f), and then delivers it to the fourth substrate transfer means (4). Afterward, it moves to the fourth position (60d), receives a substrate polished from the third or fourth polishing unit (100C, 100D) from the third substrate transfer means (3), moves to the sixth position (60f), and delivers it to the fourth substrate transfer means (4). Next, the second substrate shuttle (62) receives a substrate polished in the fifth or sixth polishing unit (100E, 100F) from the fifth substrate transfer means (5) at the sixth position (60f), and then transfers it to the fourth substrate transfer means (4).

[0158] The third substrate transfer means (3) takes out a substrate from the first substrate shuttle (60) at the first position (60a) and transfers it to at least one of the first or second polishing units (100A, 100B), and when polishing is finished, retrieves the substrate and transfers it to the second substrate shuttle (62) at the second position (60b). The fourth substrate transfer means (4) takes out a substrate from the first substrate shuttle (60) at the third position (60c) and transfers it to at least one of the third or fourth polishing units (100C, 100D), and when polishing is finished, retrieves it and transfers it to the second substrate shuttle (62) at the fourth position (60d). The fifth substrate transfer means (5) takes out a substrate from the first substrate shuttle (60) at the fifth position (60e) and transfers it to at least one of the fifth or sixth polishing units (100E, 100F), and when polishing is finished, it retrieves the substrate and transfers it to the second substrate shuttle (62) at the sixth position (60f).

[0159] Referring to FIG. 23, an embodiment of polishing a substrate in the substrate polishing device (600) of FIG. 22 is described. The substrate is polished through steps A1, A2, A3, A4, A5, A6, and A7. Between steps A2 and A3, at least one of Y1 and Y2 is performed, and between steps A5 and A6, at least one of Y5 and Y6 is performed. In FIG. 23, A1 is a step in which a first substrate transfer means (1) transfers a substrate to a first substrate shuttle (60) at a first position (60a). A2 is a step in which a third substrate transfer means (3) withdraws a substrate from the first substrate shuttle (60). A3 is a step in which a third substrate transfer means (3) transfers a substrate to a first or second substrate shuttle (60, 62) at a second position (60b). A4 is a step in which the first or second substrate shuttle (60, 62) moves to a fifth position (60e). A5 is a step in which the fifth substrate transfer means (5) withdraws a substrate from the first or second substrate shuttle (60, 62). A6 is a step in which the fifth substrate transfer means (5) transfers a substrate to the first or second substrate shuttle (60, 62) at the sixth position (60f). A7 is a step in which the second substrate transfer means (2) withdraws a substrate from the first or second substrate shuttle (60, 62). Y1 and Y2 are steps in which the third substrate transfer means (3) transfers and retrieves a substrate to the first and second polishing units (100A, 100B), respectively. Y5 and Y6 are steps in which the fifth substrate transfer means (5) transfers and retrieves a substrate to the fifth and sixth polishing units (100E, 100F), respectively.

[0160] With reference to FIG. 24, another embodiment of polishing a substrate in the substrate polishing device (600) of FIG. 22 is described. The substrate is polished through steps A1, B1, B2, B3, B4, A5, A6, and A7. Between steps B2 and B3, at least one of Y3 and Y4 is performed, and between steps A5 and A6, at least one of Y5 and Y6 is performed. B1 is a step in which the first substrate shuttle (60) moves to a third position (60c). B2 is a step in which the fourth substrate transfer means (4) withdraws the substrate from the first substrate shuttle (60). B3 is a step in which the fourth substrate transfer means (4) transfers the substrate to the first or second substrate shuttle (60, 62) at the fourth position (60d). B4 is a step in which the first or second substrate shuttle (60, 62) moves to a fifth position (60e). Y3 and Y4 are steps in which the third substrate transfer means (3) transfers and retrieves the substrate to the third and fourth polishing units (100C, 100D), respectively. Steps A1, A5, A6, A7, Y5, and Y6 are identical to those in FIG. 23.

[0161] According to one embodiment, in the embodiments of FIG. 22, FIG. 23 and FIG. 24, the substrate polishing device (600) may not include a second substrate shuttle (62), in which case the role of the second substrate shuttle (62) may be performed by the first substrate shuttle (60) instead.

[0162] Referring to FIG. 25, the substrate polishing device (600) of FIG. 22 may further include sixth and seventh substrate transfer means (6, 7). The sixth substrate transfer means (6) may be configured to be positioned between the second and third polishing units (100B, 100C) to transfer a substrate from the substrate attachment means (120) of the second polishing unit (100B) to the substrate attachment means (120) of the third polishing unit (100C). The seventh substrate transfer means (7) may be positioned between the fourth and fifth polishing units (100D, 100E) to transfer a substrate from the substrate attachment means (120) of the fourth polishing unit (100D) to the substrate attachment means (120) of the fifth polishing unit (100E).

[0163] The substrate polishing device (600) of FIG. 25 may include a first substrate shuttle (60). According to this embodiment, the first substrate shuttle (60) may be configured to reciprocate between a first position (60a), a third position (60c), a fourth position (60d), and a sixth position (60f). At the first position (60a), a substrate is received from a first substrate transfer means (1) and transferred to a third substrate transfer means (3); at the third position (60c), a substrate is received from a sixth substrate transfer means (6); at the fourth position (60d), a substrate is transferred to a seventh substrate transfer means (7); and at the sixth position (60f), a substrate is received from a fifth substrate transfer means (5) and transferred to a second substrate transfer means (2).

[0164] According to another embodiment, the substrate polishing device (600) may further include a second substrate shuttle (62). The second substrate shuttle (62) may be configured to reciprocate between a third position (60c) and a sixth position (60f). At the third position (60c), it may receive a substrate from the sixth substrate transfer means (3) in place of the first substrate shuttle (60), and at the sixth position (60f), it may be configured to receive a substrate from the fifth substrate transfer means (5) in place of the first substrate shuttle (60) and transfer it to the second substrate transfer means (2).

[0165] According to one embodiment, the first substrate shuttle (60) may be configured to move to a seventh position (60a'). The seventh position (60a') is positioned between the first substrate transfer means (1) and the first position (60a). The first substrate shuttle (60) may be configured to receive a substrate from the first substrate transfer means (1) at the seventh position (60a'), move to the first position (60a), and then transfer the substrate to the third substrate transfer means (3).

[0166] Additionally, the first and second substrate shuttles (60, 62) may be configured to move to an eighth position (60g). The eighth position (60g) is positioned between the second substrate transfer means (2) and the sixth position (60f). The second substrate shuttle (62) may be configured to receive a substrate from the fifth substrate transfer means (5) at the sixth position (60f), move to the eighth position (60g), and then transfer the substrate to the second substrate transfer means (2).

[0167] Referring to FIG. 26, an embodiment of polishing a substrate in the substrate polishing device (600) of FIG. 25 is described. A first substrate (W1) is polished by sequentially passing through steps A1, A2, Y1, Y2, Y2', Y3, A3, A4, and A5. In particular, between steps A2 and A3, Y1, Y2, Y2', and Y3 are performed sequentially. A second substrate (W2) is polished by sequentially passing through steps A1, B1, B2, Y4, Y5, Y5', Y6, B3, B4, and A5, and between steps B2 and B3, Y4, Y5, Y5', and Y6 are performed sequentially. While the first substrate (W1) moves along its own path in the substrate polishing device (600), the second substrate (W2) is also fed into the substrate polishing device (600) and moves along its own path. According to this embodiment, the first substrate (W1) is polished in three stages while passing through the first to third polishing units (100A to 100C), and the second substrate (W2) is polished in three stages while passing through the fourth to sixth polishing units (100D to 100F).

[0168] In FIG. 26, A1 is a step in which the first substrate transfer means (1) transfers a substrate to the first substrate shuttle (60) at the first position (60a). A2 is a step in which the third substrate transfer means (3) withdraws a substrate from the first substrate shuttle (60). A3 is a step in which the sixth substrate transfer means (6) transfers a substrate to the first or second substrate shuttle (60, 62) located at the third position (60c). A4 is a step in which the first or second substrate shuttle (60, 62) moves from the third position (60c) to the eighth position (60g). A5 is a step in which the second substrate transfer means (2) withdraws a substrate from the first or second substrate shuttle (60, 62) located at the eighth position (60g). B1 is a step in which the first substrate shuttle (60) moves from the first position (60a) to the fourth position (60d). B2 is a step in which the seventh substrate transfer means (7) withdraws a substrate from the first substrate shuttle (60) located at the fourth position (60d). B3 is a step in which the fifth substrate transfer means (5) transfers a substrate to the first or second substrate shuttle (60, 62) located at the sixth position (60f). B4 is a step in which the first or second substrate shuttle (60, 62) moves to the eighth position (60g).

[0169] Y1 is a step in which the second substrate transfer means (2) transfers the substrate to the first polishing unit (100A) and retrieves it when polishing is finished. Y2 is a step in which the second substrate transfer means (2) transfers the substrate to the second polishing unit (100B). Y2' is a step in which the sixth substrate transfer means (6) retrieves the substrate from the second polishing unit (100B). Y3 is a step in which the sixth substrate transfer means (6) transfers the substrate to the third polishing unit (100C) and retrieves it when polishing is finished. Y4 is a step in which the seventh substrate transfer means (7) transfers the substrate to the fourth polishing unit (100D) and retrieves it when polishing is finished. Y5 is a step in which the seventh substrate transfer means (7) transfers the substrate to the fifth polishing unit (100E). Y5' is a step in which the seventh substrate transfer means (7) retrieves the substrate from the fifth polishing unit (100E). Y6 is a step in which the fifth substrate transfer means (5) transfers the substrate to the sixth polishing unit (100F), and when polishing is finished, it is retrieved again.

[0170] In FIG. 26, step A1 may be replaced with steps A1' and A1". Step A1' is a step in which the first substrate transfer means (1) transfers a substrate to the first substrate shuttle (60) at the seventh position (60a'), and step A1" is a step in which the first substrate shuttle (60) moves to the first position (60a). According to one embodiment, in FIG. 26, the sixth position (60f) and the eighth position (60g) may be the same position.

[0171] The following embodiments primarily refer to Korean Patent Application No. 10-2025-0017649 filed on February 11, 2025, and also refer to other reference materials.

[0172] Referring to FIG. 27, the substrate polishing device (600) may include first to fourth polishing units (100A to 100D) arranged in a row, a substrate transfer unit (200), and a substrate cleaning device (350). The substrate cleaning device (350) is positioned opposite the first to fourth polishing units (100A to 100D) with the substrate transfer unit (200) in between. In this embodiment, a substrate attachment / detachment means (120) may be positioned in the upper space of the polishing surface (110). The first substrate shuttle (60) may be configured to transport a substrate between the first to fourth substrate transfer means (1, 2, 3, 4) by reciprocating between the first to third positions (60a, 60b, 60c) across the third and fourth substrate transfer means (3, 4) in the upper space of the third and fourth substrate transfer means (3, 4). A first position (60a) is positioned between the first polishing unit (100A) and the substrate output terminal (330) of the cleaning device (350), a second position (60b) is positioned between the boundary of the second and third polishing units (100B, 100C) and the cleaning device (350), and a third position (60c) can be positioned between the fourth polishing unit (100D) and the fourth substrate transfer means (4).

[0173] In one embodiment, the substrate transport unit (200) may include first and second substrate shuttles (60, 62). The first substrate shuttle (60) may be configured to transport a substrate between the first, third, and fourth substrate transport means (1, 3, 4) by reciprocating between the first and second positions (60a, 60b), and the second substrate shuttle (62) may be configured to transport a substrate between the third, fourth, and second substrate transport means (3, 4, 2) by reciprocating between the third and fourth positions (60c, 60d).

[0174] The substrate polishing device (600) may further include at least one of a first substrate holder (70) positioned below a first position (60a), a second substrate holder (72) positioned below a second position (60b), and a third substrate holder (74) positioned below a third position (60c). The first substrate transfer means (1) may be configured to transfer a substrate to the first substrate holder (70), the second substrate transfer means (2) may be configured to withdraw a substrate from the first substrate holder (70) and transfer it to the second substrate holder (72), the third substrate transfer means (3) may be configured to withdraw a substrate from the second substrate holder (72) and transfer it to the third substrate holder (74), and the fourth substrate transfer means (4) may be configured to withdraw a substrate from the third substrate holder (74) and transfer it to the substrate cleaning device (350).

[0175] Referring to FIG. 28, an embodiment of polishing a substrate in the substrate polishing device (600) of FIG. 27 is described. A first substrate (W1) moves sequentially through steps A1 to A5. Between steps A2 and A3, at least one of steps Y1 and Y2 is performed. While the first substrate (W1) moves along the path, a second substrate (W2) moves sequentially through steps B1 to B5. Between steps B3 and B4, at least one of steps Y3 and Y4 is performed. In FIG. 28, A1 is a step in which the first substrate transfer means (1) transfers the substrate to the first substrate holder (70). A2 is a step in which the third substrate transfer means (3) withdraws the substrate from the first substrate holder (70). A3 is a step in which the third substrate transfer means (3) transfers the substrate to the first or second substrate shuttle (60, 62) at the second position (60b). A4 is a step in which the first or second substrate shuttle (60, 62) moves from the second position (60b) to the third position (60c). A5 is a step in which the second substrate transfer means (2) withdraws a substrate from the first or second substrate shuttle (60, 62) at the third position (60c). B1 is a step in which the first substrate transfer means (1) transfers a substrate to the first substrate shuttle (60) at the first position (60a). B2 is a step in which the first substrate shuttle (60) moves from the first position (60a) to the second position (60b). B3 is a step in which the fourth substrate transfer means (4) withdraws a substrate from the first substrate shuttle (60) at the second position (60b). B4 is a step in which the fourth substrate transfer means (4) transfers a substrate to the third substrate holder (74). B5 is a step in which the second substrate transfer means (2) withdraws the substrate from the third substrate holder (74). Y1 and Y2 are steps in which the third substrate transfer means (3) transfers the substrate to the first and second polishing units (100A, 100B), respectively, and retrieves it when polishing is finished.Y3 and Y4 are steps in which the fourth substrate transfer means (4) each transfers the substrate to the third and fourth polishing units (100C, 100D), respectively, and retrieves it when polishing is finished.

[0176] According to one embodiment, the substrate may be polished through steps A1, A2, A3, B3, B4, and B5. In this embodiment, the substrate may be polished through at least one of Y1 and Y2, and may be further polished through at least one of Y3 and Y4.

[0177] The following embodiments primarily refer to Korean Patent Application No. 10-2025-0017649 filed on February 11, 2025, Korean Patent Application No. 10-2025-0021518 filed on February 19, 2025, Korean Patent Application No. 10-2025-0027154 filed on March 1, 2025, and Korean Patent Application No. 10-2025-0030270 filed on March 9, 2025, and also refer to other reference materials.

[0178] Referring to FIG. 29, a substrate polishing device (700) according to another embodiment of the present invention is described. The substrate polishing device (700) includes first to fourth polishing units (100A to 100D) and a substrate transfer unit (200). The first and third polishing units (100A, 100C) are positioned opposite the second and fourth polishing units (100B, 100D) with the substrate transfer unit (200) in between. In the substrate transfer unit (200), a first substrate transfer means (1), a first substrate holder (70), a second substrate transfer means (2), a second substrate holder (72), a third substrate transfer means (3), a third substrate holder (74), and a fourth substrate transfer means (4) may be arranged in a line in this order. One or more substrate shuttles (60, 62) may be arranged in the substrate transfer unit (200). Additionally, a cleaning chamber (310) may be disposed adjacent to one side of the first polishing unit (100A) and the second substrate transfer means (2). The first substrate shuttle (60) may be configured to reciprocate between the first to third positions (60a to 60c) along the guide rail (64). The first substrate shuttle (60) may be configured to receive a substrate from the first substrate transfer means (1) at the first position (60a), then move through the upper space of the second substrate transfer means (2) to the second position (60b) to transfer it to the third substrate transfer means (3) so that it can be polished in the first to fourth polishing units (100A to 100D), or move through the upper space of the second and third substrate transfer means (2, 3) to the third position (60c) to transfer it to the fourth substrate transfer means (4). The first substrate shuttle (60) can be configured to mount the substrate horizontally or to mount the substrate vertically as shown in FIG. 21.

[0179] The first substrate transfer means (1) may be configured to transfer a substrate to the first substrate shuttle (60) located at the first position (60a) and also to withdraw the substrate from the first substrate holder (70). The second substrate transfer means (2) may be configured to be positioned between the first and second substrate holders (70, 72) and the cleaning chamber (310) to transfer from the second substrate holder (72) to the cleaning chamber (310) and from the cleaning chamber (310) to the first substrate holder (70). The third substrate transfer means (3) may be configured to withdraw the substrate from the first substrate shuttle (60) at the second position (60b) and transfer it to the substrate attachment means (120) of the first and second polishing units (100A, 100B), and to withdraw it after polishing is completed and transfer it to the second substrate holder (72). The fourth substrate transfer means (4) may be configured to withdraw a substrate from the first substrate shuttle (60) at the third position (60c) and transfer it to the substrate attachment means (120) of the third and fourth polishing units (100C, 100D), and after polishing is completed, withdraw it and transfer it to the third substrate holder (74).

[0180] The substrate polishing device (700) may further include a second substrate shuttle (62). The second substrate shuttle (62) may be positioned in the space immediately below or immediately above the first substrate shuttle (60). The second substrate shuttle (62) may be configured to mount the substrate horizontally or to mount the substrate vertically as shown in FIG. 21. The second substrate shuttle (62) may be configured to reciprocate between the fourth and fifth positions (60d, 60e) along the guide rail (64'). The fourth position (60d) may be positioned in the space above the third substrate holder (74), and the fifth position (60e) may be positioned in the space above the second substrate holder (72). The second substrate shuttle (62) may be configured to receive the substrate from the fourth substrate transfer means (4) at the fourth position (60d) and move across the upper space of the third substrate transfer means (3) to the fifth position (60e). The second substrate transfer means (2) may be configured to withdraw a substrate from the second substrate shuttle (62) located at the fifth position (60e) and transfer it to the cleaning chamber (310).

[0181] In this embodiment, the first substrate shuttle (60) receives a substrate to be polished in the first to fourth polishing units (100A to 100D) from the first substrate transfer means (1) and transfers it to the third and fourth substrate transfer means (3, 4). Meanwhile, the second substrate shuttle (62) receives a substrate polished in the third and fourth polishing units (100C, 100D) from the fourth substrate transfer means (4) at the fourth position (60d), moves it to the fifth position (60e), and then transfers it to the second substrate transfer means (2).

[0182] According to one embodiment, a fifth polishing unit (100E, not shown) may be additionally disposed between the first and third polishing units (100A, 100C), and a sixth polishing unit (100E, not shown) may be additionally disposed between the second and fourth polishing units (100B, 100D). In this embodiment, the third substrate transfer means (3) may be configured to transfer and retrieve a substrate to the substrate attachment means (120) of the fifth and sixth polishing units (100E, 100F).

[0183] According to another embodiment, the fifth polishing unit (100E) may be positioned opposite the first polishing unit (100A) with the third polishing unit (100C) in between, and the sixth polishing unit (100F) may be positioned opposite the second polishing unit (100B) with the fourth polishing unit (100D) in between. In this embodiment, the fourth substrate transfer means (4) may be configured to transfer and retrieve a substrate to the substrate attachment means (120) of the fifth and sixth polishing units (100E, 100F).

[0184] In FIG. 29, the first position (60a) may be positioned between the first and second substrate transfer means (1, 2), the second position (60b) and the fifth position (60e) may be positioned between the second and third substrate transfer means (2, 3), and the third position (60c) and the fourth position (60d) may be positioned between the third and fourth substrate transfer means (3, 4).

[0185] Referring to FIG. 30, the substrate polishing device (700) of FIG. 29 may be configured to include one or more substrate shuttles (60, 62) that are fastened and moved on a guide rail (64). The substrate polishing device (700) may include first and second substrate cleaning devices (350, 350'). The first substrate cleaning device (350) is arranged in line with the first and third polishing units (100A, 100C), and the second substrate cleaning device (350') is arranged in line with the second and fourth polishing units (100B, 100D). The substrate output terminal (330) of the substrate cleaning device (350, 350') is positioned toward the first substrate transfer means (1), and the substrate input terminal (320) is positioned toward the second substrate transfer means (2). The substrate cleaning device (350, 350') is equipped with a substrate transfer means (340) for transferring a substrate from a substrate input terminal (320) to a substrate output terminal (330). A plurality of cleaning chambers are arranged between the substrate input terminal (320) and the substrate output terminal (330), and the substrate is transferred to the substrate output terminal (330) while being cleaned as it passes through these cleaning chambers.

[0186] The first substrate shuttle (60) receives a substrate from the first substrate transfer means (1) at the first position (60a), moves to the second and third positions (60b, 60c), and delivers it to the third and fourth substrate transfer means (3, 4), respectively. The second substrate shuttle (62) receives a substrate polished in the third and fourth polishing units (100C, 100D) from the fourth substrate transfer means (4) at the third position (60c), moves to the second position (60b), and the second substrate transfer means (20) pulls out the substrate from the second substrate shuttle (62) at the second position (60b) and delivers it to the substrate input terminal (320) of the cleaning device (350, 350'). According to one embodiment, the first substrate shuttle (60) may replace the substrate transport by the second substrate shuttle (62). According to one embodiment, a substrate holder (72) may be placed in the upper or lower space of the second position (60b).

[0187] The first substrate transfer means (1) transfers the substrate to the first substrate shuttle (60) at the first position (60a) and retrieves the substrate from the substrate output terminal (330). The second substrate transfer means (2) retrieves the substrate from the first or second substrate shuttle (60, 62) or substrate holder (72) at the second position (60b) and transfers it to the substrate input terminal (320). The third substrate transfer means (3) retrieves the substrate from the first substrate shuttle (60) at the second or third position (60b, 60c) and transfers the substrate to the first and second polishing units (100A, 100B), retrieves it after polishing is completed, and transfers it to the first or second substrate shuttle (60, 62) or substrate holder (72) at the second position (60b). The fourth substrate transfer means (4) takes out a substrate from the first substrate shuttle (60) at the third position (60c), transfers the substrate to the third and fourth polishing units (100C, 100D), and after polishing is completed, retrieves it and transfers it to the first or second substrate shuttle (60, 62) at the third position (60c).

[0188] Referring to FIG. 31, an embodiment of polishing a substrate with reference to the substrate polishing device (700) of FIG. 30 is described. The substrate may be polished and cleaned through steps A1 to A8. According to another embodiment, steps B5 and B6 may be performed instead of steps A5, A6, and A7. Between A3 and A4, at least one of Y3 and Y4 may be performed, and between A5 and A6, at least one of Y1 and Y2 may be performed.

[0189] In FIG. 31, A1 is a step in which the first substrate transfer means (1) transfers a substrate to the first substrate shuttle (60) at the first position (60a). A2 is a step in which the first substrate shuttle (60) moves to the third position (60c). A3 is a step in which the fourth substrate transfer means (4) withdraws a substrate from the first or second substrate shuttle (60, 62) at the third position (60c). A4 is a step in which the fourth substrate transfer means (4) transfers a substrate to the first or second substrate shuttle (60, 62) at the third position (60c). A5 is a step in which the third substrate transfer means (3) withdraws a substrate from the first or second substrate shuttle (60, 62) at the third position (60c). A6 is a step in which the third substrate transfer means (3) transfers a substrate to the substrate holder (72). A7 is a step in which the second substrate transfer means (2) withdraws a substrate from the substrate holder (72). A8 is a step in which the second substrate transfer means (2) transfers a substrate to the substrate input terminal (320) of the cleaning device (350). B5 is a step in which the first or second substrate shuttle (60, 62) moves from the third position (60c) to the second position (60b). B6 is a step in which the second substrate transfer means (2) withdraws a substrate from the first or second substrate shuttle (60, 62) at the second position (60b). Y1 and Y2 are steps in which the third substrate transfer means (3) transfers a substrate to the first and second polishing units (100A, 100B), respectively, and retrieves it after polishing is completed. Y3 and Y4 are steps in which the fourth substrate transfer means (4) transfers the substrate to the third and fourth polishing units (100C, 100D), respectively, and retrieves it after polishing is completed.

[0190] Referring to FIG. 32, the first substrate shuttle (60) of the substrate transfer unit (210) of FIG. 30 may be separated into a first-1 substrate shuttle (60') and a first-2 substrate shuttle (60"). Accordingly, the substrate transfer unit (200) may include first to fourth substrate transfer means (1, 2, 3, 4), a first-1 substrate shuttle (60'), and a first-2 substrate shuttle (60"). According to one embodiment, the substrate transfer unit (200) may further include a second substrate shuttle (62). In this embodiment, the first-1 substrate shuttle (60') transfers a substrate between the first substrate transfer means (1) and the second substrate transfer means (2), and the first-2 substrate shuttle (60') may be configured to transfer a substrate between the second substrate transfer means (2) and the fourth substrate transfer means (4). The first-1 substrate shuttle (60') may be configured to receive a substrate from the first substrate transfer means (1) at a first position (60a) and move to a sixth position (60f). The sixth position (60f) is positioned between the first and second substrate transfer means (1, 2).

[0191] In this embodiment, the second substrate transfer means (2) takes a substrate from the first-1 substrate shuttle (60') at the sixth position (60f) and transfers it to the first-2 substrate shuttle (60") at the second position (60b). Subsequently, the first-2 substrate shuttle (60") moves across the third substrate transfer means (3) to the third position (60c), and the fourth substrate transfer means (4) takes a substrate from the first-2 substrate shuttle (60) at the third position (60c) and transfers it to the third and fourth polishing units (100C, 100D). When substrate polishing is finished in the third and fourth polishing units (100C, 100D), the fourth substrate transfer means (4) retrieves the substrate and transfers it to the first-second substrate shuttle (60) at the third position (60c). Then, the first-second substrate shuttle (60) moves to the second position (60b), and the second substrate transfer means (2) retrieves the substrate from the first-second substrate shuttle (60) and transfers it to the substrate input terminal (320) of the cleaning device (350).

[0192] In one embodiment, the fourth substrate transfer means (4) may be configured to transfer a substrate to the second substrate shuttle (60d) at the fourth position (60d) instead of the first-second substrate shuttle (60). Then, the second substrate shuttle (62) may move across the upper space of the third substrate transfer means (3) to the fifth position (60e), and then the second substrate transfer means (2) may be configured to withdraw the substrate from the second substrate shuttle (62) and transfer it to the substrate input terminal (320) of the cleaning device (350).

[0193] The substrate polishing device (700) may be configured to include a first substrate holder (70) in place of a first-1 substrate shuttle (60'). The first substrate holder (70) is positioned between the first and second substrate transfer means (1, 2). The first substrate transfer means (1) can transfer a substrate to the first substrate holder (70), and the second substrate transfer means (2) can withdraw a substrate from the first substrate holder (70) and transfer it to the first-2 substrate shuttle (60) at the second position (60b).

[0194] Referring to FIG. 33, an embodiment of polishing a substrate in the substrate polishing device (700) of FIG. 32 is described. The substrate moves sequentially along steps A1, A2, A3, A4, A5, A6, A7, A8, A9, and Z2. At least one of steps Y3 and Y4 is performed between steps A6 and A7. In FIG. 33, A1 is a step in which a first substrate transfer means (1) transfers a substrate to a first-1 substrate shuttle (60') at a first position (60a). A2 is a step in which the first-1 substrate shuttle (60') moves from the first position (60a) to a sixth position (60f). A3 is a step in which a second substrate transfer means (2) withdraws a substrate from the first-1 substrate shuttle (60') at the sixth position (60f). A4 is a step in which the second substrate transfer means (2) transfers a substrate to the first-second substrate shuttle (60) at the second position (60b). A5 is a step in which the first-second substrate shuttle (60) moves from the second position (60b) to the third position (60c). A6 is a step in which the fourth substrate transfer means (4) withdraws a substrate from the first-second substrate shuttle (60) at the third position (60c). A7 is a step in which the fourth substrate transfer means (4) transfers a polished substrate to the first-second substrate shuttle (60) at the third position (60c). A8 is a step in which the first-second substrate shuttle (60) moves from the third position (60c) to the second position (60b). A9 is a step in which the second substrate transfer means (2) withdraws a substrate from the first-second substrate shuttle (60) at the second position (60b). Z2 is a step in which the second substrate transfer means (2) transfers the substrate to the substrate input terminal (320) of the cleaning device (350). Y3 and Y4 are steps in which the fourth substrate transfer means (4) transfers the substrate to the third and fourth polishing units (100C, 100D), respectively, and then retrieves it after polishing is finished.

[0195] Steps A1, A2, and A3 of FIG. 33 can be replaced with steps A1' and A2'. A1' is a step in which the first substrate transfer means (1) transfers a substrate to the first substrate holder (70). A2' is a step in which the second substrate transfer means (2) retrieves a substrate from the first substrate holder (70).

[0196] Referring to FIG. 34, another embodiment of polishing a substrate in the substrate polishing device (700) of FIG. 32 is described. In this embodiment, steps A7, A8, and A9 of FIG. 33 are replaced with steps A7', A8', and A9', respectively. A7' is a step in which the fourth substrate transfer means (4) transfers a substrate to the second substrate shuttle (62) at the fourth position (60d). A8' is a step in which the second substrate shuttle (62) moves from the fourth position (60d) to the fifth position (60e). A9' is a step in which the second substrate transfer means (2) retrieves a substrate from the second substrate shuttle (62) at the fifth position (60e). According to this embodiment, the first and second substrate shuttles (60) and the second substrate shuttle (62) are characterized by moving independently of each other.

[0197] Referring to FIG. 35, a stacked substrate shuttle (160) is described. The stacked substrate shuttle (160) can be used to replace the first-second substrate shuttle (60) and the second substrate shuttle (62) in the substrate polishing device (700) of FIG. 32. The stacked substrate shuttle (160) is composed of a single unit in which the first-first substrate shuttle (60-1) and the first-second substrate shuttle (60-2) are stacked in a vertical direction, and they can be configured to move simultaneously along a guide rail (64). At this time, the first-first substrate shuttle (60-1) can be configured to perform the role of the first-second substrate shuttle (60) of FIG. 32, and the first-second substrate shuttle (60-2) can be configured to perform the role of the second substrate shuttle (62) of FIG. 32.

[0198] Referring to FIG. 36, the substrate polishing device (700) of FIG. 32 may be configured to include first to sixth polishing units (100A to 100F). Additionally, the substrate attachment means (120) of the first to sixth polishing units (100A to 100F) may be configured to be positioned outside the polishing surface (130), unlike FIG. 32. The first, third, and fifth polishing units (100A, 100C, 100E) are arranged in a row, and the second, fourth, and sixth polishing units (100B, 100D, 100F) are arranged in a row opposite each other with the substrate transfer unit (200) in between. The substrate attachment means (120) of the first and third polishing units (100A, 100C) are arranged to face each other, and the substrate attachment means (120) of the fifth polishing unit (100E) may be arranged to face the polishing surface (110) of the third polishing unit (100C). Additionally, the substrate attachment means (120) of the second and fourth polishing units (100B, 100D) are arranged to face each other, and the substrate attachment means (120) of the sixth polishing unit (100F) may be arranged to face the polishing surface (110) of the fourth polishing unit (100D).

[0199] In FIG. 36, unlike FIG. 32, the position of the substrate shuttle (60) positioned between the second and third substrate transfer means (2, 3) is indicated as the first position (60a), and the position of the substrate shuttle (60) positioned between the third and fourth substrate transfer means (3, 4) is indicated as the second position (60b).

[0200] The substrate shuttle (60) receives the substrate (W1) to be polished from the second substrate transfer means (2) at the first position (60a) and moves to the second position (60b). Subsequently, the fourth substrate transfer means (4) retrieves the polished substrate (W2) from the fifth polishing unit (100E) and transfers it to the substrate shuttle (60) at the second position (60b), and retrieves the new substrate (W1) to be polished from the substrate shuttle (60) and transfers it to the fifth polishing unit (100E). The substrate shuttle (60) returns to the first position (60a), and the second substrate transfer means (2) retrieves the polished substrate (W2) from the substrate shuttle (60). Subsequently, the second substrate transfer means (2) transfers the next substrate (W3) to be polished to the substrate shuttle (60). Next, the third substrate transfer means (3) takes out the substrate (W4) polished in the third polishing unit (100C) and transfers it to the substrate shuttle (60), and takes out the substrate (W3) to be polished anew from the substrate shuttle (60) and transfers it to the third polishing unit (100C).

[0201] In one embodiment, the substrate polishing device (700) of FIG. 36 may use the stacked substrate shuttle (160) of FIG. 35 instead of the substrate shuttle (60). In this embodiment, the second substrate transfer means (2) transfers the substrate (W1) to be polished to the first-1 substrate shuttle (60-1) at the first position (60a), and the fourth substrate transfer means (4) transfers the substrate (W2) polished in the fifth polishing unit (100E) to the first-2 substrate shuttle (60-2) at the second position (60b). Subsequently, the fourth substrate transfer means (4) withdraws the substrate (W1) to be polished from the first-1 substrate shuttle (60-1) and transfers it to the fifth polishing unit (100E).

[0202] Referring to FIG. 37, steps for processing a substrate are described in an embodiment in which the substrate polishing device (700) of FIG. 36 includes the stacked substrate shuttle (160) of FIG. 35. The substrate may be processed through steps A1, A2, A3, A4, A5, A6, and A7. Between steps A3 and A4, at least one of steps Y5 and Y6 is performed. Between steps A5 and A6, at least one of steps Y1, Y2, Y3, and Y4 is performed. In FIG. 37, A1 is a step in which a second substrate transfer means (2) transfers a substrate to a first-1 substrate shuttle (60-1) at a first position (60a). A2 is a step in which the substrate shuttle (160) moves to a second position (60b). A3 is a step in which a fourth substrate transfer means (4) withdraws a substrate from the first substrate shuttle (60-1) at the second position (60b). A4 is a step in which the fourth substrate transfer means (4) transfers a substrate polished at at least one of the fifth and sixth polishing units (100E, 100F) to the second substrate shuttle (60-2) at the second position (60b). A5 is a step in which the third substrate transfer means (3) withdraws a substrate from the first-second substrate shuttle (60-2) at the second position (60b). A6 is a step in which the third substrate transfer means (3) transfers a substrate polished at at least one of the first to fourth polishing units (100A to 100D) to the first-second substrate shuttle (60-2) at the first position (60a). A7 is a step in which the second substrate transfer means (2) withdraws a substrate from the first-second substrate shuttle (60-2) at the first position (60a). Y1 to Y4 are steps in which the third substrate transfer means (3) transfers the substrate to the first to fourth polishing units (100A to 100D), respectively, and retrieves it when polishing is finished. Y5 and Y6 are steps in which the fourth substrate transfer means (4) transfers the substrate to the fifth and sixth polishing units (100E and 100F), respectively, and retrieves it when polishing is finished.In this embodiment, the first substrate (W1) can be polished in three stages by sequentially passing through the fifth, third, and first polishing units (100E, 100C, 100A), and the second substrate (W2) can be polished in three stages by sequentially passing through the sixth, fourth, and second polishing units (100F, 100D, 100B).

[0203] Referring to FIG. 38, the substrate polishing device (700) of FIG. 36 may be configured to include at least one substrate holder (70, 72) positioned at a higher position than the moving trajectory of the substrate shuttle (60). The first and second substrate holders (70, 72) are positioned between the second substrate transfer means (2) and the third substrate transfer means (3) in the substrate transfer unit (200). One of the first and second substrate holders (70, 72) may be positioned in the upper space of the other. In this embodiment, the substrate to be polished in the first to fourth polishing units (100A to 100D) is transferred to the first substrate holder (70) by the second substrate transfer means (2), and the third substrate transfer means (3) withdraws it from the first substrate holder (70) and transfers it to the first to fourth polishing units (100A to 100D), and when polishing is finished, it is recovered and transferred to the second substrate holder (72). Subsequently, the second substrate transfer means (2) recovers the polished substrate from the second substrate holder (72) and transfers a new substrate to be polished to the first substrate holder (70). In this embodiment, the substrate shuttle (60) receives the substrate from the second substrate transfer means (2) and transfers it to the fourth substrate transfer means (4), and transfers the substrate received from the fourth substrate transfer means (4) to the second substrate transfer means (2).

[0204] Referring to FIG. 39, steps for processing a substrate are described in an embodiment in which the substrate polishing device (700) of FIG. 38 includes the stacked substrate shuttle (160) of FIG. 35. A first substrate (W1) is polished through steps A1, A2, A3, A4, A5, and A6, and a second substrate (W2) is polished through steps B1, B2, B3, and B4. Between steps A3 and A4, at least one of steps Y5 and Y6 is performed, and between steps B2 and B3, at least one of steps Y1 to Y4 is performed. In FIG. 39, A1 is a step in which the second substrate transfer means (2) transfers the substrate (W1) to the first-1 substrate shuttle (60-1) at the first position (60a). A2 is a step in which the substrate shuttle (160) moves to the second position (60b). A3 is a step in which the fourth substrate transfer means (4) withdraws the substrate (W1) from the first-1 substrate shuttle (60-1). A4 is a step in which the fourth substrate transfer means (4) transfers the substrate (W1) to the first-2 substrate shuttle (60-2). A5 is a step in which the substrate shuttle (160) moves from the second position (60b) to the first position (60a). A6 is a step in which the second substrate transfer means (2) withdraws the substrate (W1) from the first-2 substrate shuttle (60-2). B1 is a step in which the second substrate transfer means (2) transfers the substrate (W2) to the first substrate holder (70). B2 is a step in which the third substrate transfer means (3) withdraws the substrate (W2) from the first substrate holder (70). B3 is a step in which the third substrate transfer means (3) transfers the substrate (W2) to the second substrate holder (72). B4 is a step in which the second substrate transfer means (2) withdraws the substrate (W2) from the second substrate holder (72). Y1 to Y6 are the same as in the embodiment of FIG. 37.

[0205] With reference to FIG. 40, another embodiment of the substrate polishing device (700) of FIG. 36 is described. This embodiment may be configured to use the stacked substrate shuttle (160) of FIG. 35. Unlike FIG. 36, the substrate polishing device (700) of FIG. 40 is arranged such that the polishing surface (110) of the third polishing unit (100C) faces the substrate attachment means (120) of the first polishing unit (100A), and the substrate attachment means (120) of the third polishing unit (100C) faces the substrate attachment means (120) of the fifth polishing unit (100E). Likewise, the polishing surface (110) of the fourth polishing unit (100D) is positioned to face the substrate attachment means (120) of the second polishing unit (100B), and the substrate attachment means (120) of the fourth polishing unit (100D) is positioned to face the substrate attachment means (120) of the sixth polishing unit (100F). In this embodiment, the distance between the first and second positions (60a, 60b) where the substrate shuttle (160) reciprocates is shorter than in the embodiment of FIG. 36.

[0206] According to one embodiment, the guide rail (64) may extend across the fourth substrate transfer means (4) to the opposite side of the third substrate transfer means (3). The substrate shuttle (160) may be configured to move along this guide rail (64) to a third position (60b') located on the opposite side of the second position (60b) with the fourth substrate transfer means (4) in between. The fourth substrate transfer means (4) may withdraw a substrate from the substrate shuttle (160) located at the third position (60b') or transfer a substrate to the substrate shuttle (160). Additionally, an operator may access the substrate shuttle (160) located at the third position (60b') through the space between the fifth and sixth polishing units (100E, 100F) to perform maintenance.

[0207] Referring to FIG. 41, an embodiment of processing a substrate in the substrate polishing device (700) of FIG. 40 is described. As in FIG. 39, the substrate is processed through steps A1, A2, A3, A4, A5, A6, and A7. Between steps A3 and A4, at least one of steps Y3, Y4, Y5, and Y6 is performed. Between steps A5 and A6, at least one of steps Y1 and Y2 is performed. The first substrate (W1) can be polished in three steps by passing through the fifth, third, and first polishing units (100E, 100C, 100A), and the second substrate (W2) can be polished in three steps by passing through the sixth, fourth, and second polishing units (100F, 100D, 100B). Y1 and Y2 are steps in which the third substrate transfer means (3) transfers the substrate to the first and second polishing units (100A, 100B), respectively, and retrieves it when polishing is finished. Y3, Y4, Y5, and Y6 are steps in which the fourth substrate transfer means (4) transfers the substrate to the third, fourth, fifth, and sixth polishing units (100C, 100D, 100E, 100F), respectively, and retrieves it when polishing is finished.

[0208] In the substrate polishing device (700) of FIG. 40, as in FIG. 38, the first and second substrate holders (70, 72) may be placed between the first and second polishing units (100A, 100B). In this embodiment, the substrate is polished following the steps shown in FIG. 42. The difference between FIG. 42 and FIG. 39 is that in FIG. 42, at least one of Y3, Y4, Y5, and Y6 is performed between steps A3 and A4, and at least one of Y1 and Y2 is performed between steps B2 and B3.

[0209] The substrate polishing device (700) of FIG. 36 may be configured such that the substrate attachment / detachment means (120) is positioned on the upper part of the polishing surface (110), as shown in FIG. 43. The substrate polishing device (700) of FIG. 38 and FIG. 40 may also be configured in the same form. In this embodiment, the third substrate transfer means (3) takes out a substrate from the substrate shuttle (160) at the first position (60a) and transfers it to the substrate attachment / detachment means (120) of the first to fourth polishing units (100A to 100D), takes out the substrate after polishing is finished, and returns it to the substrate shuttle (160). The fourth substrate transfer means (4) may be configured to withdraw a substrate from the substrate shuttle (160) at the second position (60b) and transfer it to the substrate attachment means (120) of the third to sixth polishing units (100C to 100F), and to withdraw the substrate after polishing is finished and return it to the substrate shuttle (160). In particular, the substrate attachment means (120) of the third and fourth polishing units (100C, 100D) may be configured to exchange substrates with both the third and fourth substrate transfer means (3, 4).

[0210] Referring to FIG. 44, the substrate polishing device (700) of FIG. 43 may be configured to further include seventh and eighth polishing units (100G, 100H). The seventh polishing unit (100G) is positioned opposite the third polishing unit (100C) with the fifth polishing unit (100E) in between, and the eighth polishing unit (100H) is positioned opposite the fourth polishing unit (100D) with the sixth polishing unit (100F) in between. The fourth substrate transfer means (4) is positioned in the space between the fifth to eighth polishing units (100E to 100H) to transfer a substrate from the substrate attachment means (160) at the second position (60b) to the substrate attachment means (120e to 100h) of the fifth to eighth polishing units (100E to 100H), and when polishing is completed, it is withdrawn and transferred to the substrate shuttle (160). The substrate shuttle (160) reciprocates between the first position (60a) and the second position (60b) and transports and transfers the substrate between the second substrate transfer means (2) and the fourth substrate transfer means (4).

[0211] Referring to FIG. 45, the substrate shuttles (60, 160) of FIG. 36, 38, 40, 43 and 44 may be composed of first-1 and first-2 vertical shuttles (61, 63). The first-1 and first-2 vertical shuttles (61, 63) may be configured to move independently along their respective guide rails (64, 64'). Accordingly, the first-1 substrate shuttle (60-1) and the first-2 substrate shuttle (60-2) of FIG. 37, 39, 41 and 42 may be replaced, respectively, with the first-1 vertical shuttle (61) and the first-2 vertical shuttle (63) that move independently of each other.

[0212] Referring to FIG. 46, an embodiment is described in which the substrate polishing device (700) of FIG. 36 is applied to the first-1 and first-2 vertical shuttles (61, 63) of FIG. 35. The first vertical shuttle (61) reciprocates between a first position (60a) and a second position (60b), and at the first position (60a), it receives a substrate from the second substrate transfer means (2) and transfers it to the third substrate transfer means (3), or passes the third substrate transfer means (3) and moves to the second position (60b) and then transfers it to the fourth substrate transfer means (4). The second vertical shuttle (63) reciprocates between the third position (60c) and the fourth position (60d), receives a substrate polished at at least one of the fifth and sixth polishing units (100E, 100F) at the third position (60c) from the fourth substrate transfer means (4), moves past the third substrate transfer means (3) to the fourth position (60d), and then transfers it to the second substrate transfer means (2). The first-second vertical shuttle (63) receives a substrate polished at at least one of the first to fourth polishing units (100A to 100D) at the fourth position (60d) from the third substrate transfer means (3), and then the second substrate transfer means (2) may be configured to retrieve it. The first position (60a) and the fourth position (60d) are positioned between the second and third substrate transfer means (2, 3), and the second position (60b) and the third position (60c) are positioned between the third and fourth substrate transfer means (3, 4). The first position (60a) and the fourth position (60d) are positioned side-by-side with the first and second polishing units (100A, 100B), and the second position (60b) and the third position (60c) may be positioned side-by-side with the third and fourth polishing units (100C, 100D) or between the fifth and sixth polishing units (100E, 100F).

[0213] In FIG. 46, the substrate attachment means (120) of the third and fourth polishing units (100C, 100D) are arranged to face the first and second polishing units (100A, 100B), respectively, but it is also possible to arrange them to face the fifth and sixth polishing units (100E, 100F) as in FIG. 40.

[0214] Referring to FIG. 47, a method of polishing a substrate in the substrate polishing device (700) of FIG. 46 is described. A first substrate (W1) is polished through steps A1, A2, A3, A4, A5, and A6, and a second substrate (W2) may be polished through steps A1, B1, B2, and A6. Between steps A3 and A4, at least one of Y5 and Y6 is performed, and between steps B1 and B2, at least one of Y1 to Y4 is performed. In FIG. 47, A1 is a step in which the second substrate transfer means (2) transfers the substrate to the first-1 vertical shuttle (61) at the first position (60a). A2 is a step in which the first-1 vertical shuttle (61) moves to the second position (60b). A3 is a step in which the fourth substrate transfer means (4) withdraws the substrate from the first-1 vertical shuttle (61) at the second position (60b). A4 is a step in which the fourth substrate transfer means (4) transfers a substrate polished at at least one of the fifth and sixth polishing units (100E, 100F) to the first-second vertical shuttle (63) at the third position (60c). A5 is a step in which the first-second vertical shuttle (63) moves to the fourth position (60d). A6 is a step in which the second substrate transfer means (2) withdraws a substrate from the first-second vertical shuttle (63) at the fourth position (60d). B1 is a step in which the third substrate transfer means (3) withdraws a substrate from the first-first vertical shuttle (61) at the first position (60a), and B2 is a step in which the third substrate transfer means (3) transfers a substrate to the first-second vertical shuttle (63) at the fourth position (60d). Y1 to Y4 are steps in which the third substrate transfer means (3) transfers the substrate to the first to fourth polishing units (100A to 100D), respectively, and retrieves it when polishing is finished. Y5 and Y6 are steps in which the fourth substrate transfer means (4) transfers the substrate to the fifth and sixth polishing units (100E and 100F), respectively, and retrieves it when polishing is finished.

[0215] According to one embodiment of the present invention, a spray nozzle configured to spray a cleaning solution (e.g., ultrapure water) toward the space between the substrate shuttle (60, 62) and the substrate placed thereon may be disposed around the track (64). In this case, the bottom surface of the substrate is cleaned by the cleaning solution. According to another embodiment, the spray nozzle may be disposed along the track (64) to spray the cleaning solution toward the top surface of the substrate. In another embodiment, the spray nozzle may be disposed on the substrate shuttle (60, 62) and configured to spray the cleaning solution toward the bottom or top surface of the substrate. A drain may be disposed around the track to drain the used cleaning solution.

[0216] The substrate transfer means (1, 2, 3, 4, 5, 6, 7) used in the present invention may be a substrate transfer robot (substrate handler) including an arm or substrate handler that holds the substrate vacuumly or mechanically.

[0217] The substrate transfer means (3, 4, 5, 6, 7) used in the present invention may be installed in the lower or upper space of the substrate shuttle (60, 61, 62, 63, 160), and the substrate shuttle (60, 62) may be configured to move along the guide rail (64) and through the lower or upper space of the substrate transfer means (3, 4, 5, 6, 7). In the plan view of the substrate polishing device (500, 600, 700) of the present invention, that is, when looking down at the substrate polishing device in a vertical direction, at least one of the substrate transfer means (3, 4, 5, 6, 7) is characterized in that at least a part thereof overlaps below or above the movement trajectory of the substrate shuttle (60, 61, 62, 63, 160). This allows for increased space efficiency and a reduced footprint of the substrate polishing device. The substrate polishing device (500) of FIG. 15 is one embodiment thereof.

[0218] The substrate shuttle used in the present invention may be configured to mount the substrate by laying it horizontally or standing it vertically. The substrate shuttle (60, 61, 62, 63) carries the substrate received from one of the substrate transport means used in the present invention to another substrate transport means while it is mounted.

[0219] In the present specification, the expression that the substrate transfer means (2, 3, 4, 5, 6, 7) transfers the substrate to the polishing unit (100A to 100H) means that the substrate is transferred to the substrate attachment / detachment means (120) of the polishing unit (100A to 100H), and the expression that the substrate is withdrawn from the polishing unit (100A to 100H) means that the substrate is withdrawn from the attachment / detachment means (120).

[0220] Although the present invention has been described illustratively through preferred embodiments above, the present invention is not limited to such specific embodiments and may be modified, changed, or improved in various forms within the scope of the technical concept presented in the present invention, specifically as described in the claims.

[0221] The substrate polishing device of the present invention can be used in the manufacturing process of a semiconductor device.

Claims

1. First and second grinding units; At least one substrate shuttle that carries and transports substrates; A first substrate transfer means for transferring a substrate to at least one substrate shuttle; A second substrate transfer means for transferring a substrate to the first polishing unit and recovering it after polishing is completed; and A third substrate transfer means for transferring a substrate to the second polishing unit and recovering it after polishing is completed; comprising, The third substrate transfer means is positioned opposite the first substrate transfer means with the second substrate transfer means in between, and The above at least one substrate shuttle transports and delivers a substrate received from the first substrate transfer means to the third substrate transfer means, and A substrate polishing device characterized in that the third substrate transfer means withdraws a substrate from the substrate shuttle and transfers it to the second polishing unit, and when polishing is completed, retrieves it and transfers it to the at least one substrate shuttle.

2. A substrate polishing device according to claim 1, wherein the second substrate transfer means withdraws a substrate from the at least one substrate shuttle and transfers it to the first polishing unit, and then, when polishing is completed, retrieves it and transfers it to the at least one substrate shuttle.

3. In Paragraph 1, A substrate polishing device characterized in that the above-mentioned at least one substrate shuttle is configured to move through the upper or lower space of the second substrate transfer means when receiving a substrate from the first substrate transfer means and moving to the third substrate transfer means.

4. In Paragraph 1, The substrate polishing device comprises a substrate holder disposed between a first and a second substrate transfer means, wherein the first substrate transfer means transfers a substrate to be polished in the first polishing unit to the substrate holder, and the second substrate transfer means withdraws a substrate from the substrate holder and transfers it to the first polishing unit.

5. In Paragraph 1, The above substrate polishing device includes a fourth substrate transfer means positioned opposite the second substrate transfer means with the third substrate transfer means in between, and The above at least one substrate shuttle moves back and forth between the first and fourth substrate transfer means, and A substrate polishing device characterized in that the above-mentioned fourth substrate transfer means withdraws a substrate from the above-mentioned at least one substrate shuttle.

6. In Paragraph 5, A substrate polishing apparatus characterized in that the above-mentioned at least one substrate shuttle includes a first and a second substrate shuttle, wherein the first substrate shuttle receives a substrate from the first substrate transfer means and transports it to the third substrate transfer means, and the second shuttle receives a substrate from the third substrate transfer means and transports it to the fourth substrate transfer means.

7. In Paragraph 1, A substrate polishing apparatus characterized in that the above-mentioned at least one substrate shuttle includes a first and a second substrate shuttle, wherein the first substrate shuttle receives a substrate from the first substrate transfer means and transports it to the third substrate transfer means, and the second shuttle receives a substrate from the third substrate transfer means and transports it to the first substrate transfer means.

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