A semiconductor package, a heatsink, and methods of manufacturing them
The semiconductor package design with interleaved terminal clips and a suspended heatsink addresses thermal management issues in GaN packages by ensuring efficient heat dissipation and electrical isolation, maintaining package functionality.
WO2026139636A2PCT designated stage Publication Date: 2026-07-02NEXPERIA BV
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- NEXPERIA BV
- Filing Date
- 2025-12-27
- Publication Date
- 2026-07-02
Smart Images
Figure EP2025089044_02072026_PF_FP_ABST
Abstract
This disclosure pertains to a semiconductor package comprising a heatsink, said heatsink, and methods of manufacturing them for thermal management of said semiconductor packages. The semiconductor package comprises a substrate, a semiconductor die mounted onto the substrate, a first terminal clip comprising at least two first clip protrusions electrically and thermally connected to the semiconductor die, and a second terminal clip comprising at least one second clip protrusion electrically and thermally connected to the semiconductor die and electrically isolated from the at least two first protrusions, wherein the at least one second clip protrusion is interleaved with the at least two first clip protrusions. The semiconductor package further comprises a first heatsink electrically and thermally mounted onto the at least two first clip protrusions and electrically isolated from the at least one second clip protrusion, wherein the heatsink is suspended above the second die surface of the semiconductor die.
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