PCBA board heat dissipation structure for intelligent robot

Abstract

This utility model relates to the field of electronic engineering and thermal management technology, and in particular to a heat dissipation structure for a PCBA board used in intelligent robots. This utility model provides a heat dissipation structure for a PCBA board used in intelligent robots, including a circuit board, electronic components, a connecting plate, a quick-release structure, heat dissipation fins, fixing cylinders, and heat pipes. The circuit board has various types of electronic components, and a connecting plate is located on the upper part of the circuit board. A quick-release structure is provided between the connecting plate and the circuit board. Multiple heat dissipation fins are located on the upper part of the connecting plate, and multiple fixing cylinders are fixedly connected to the lower part of the connecting plate. Each fixing cylinder has a heat pipe slidably connected inside. This utility model effectively directs the heat generated by the electronic components to the heat dissipation fins quickly through the high thermal conductivity of the thermally conductive silicone pads and heat pipes. Combined with the cooling fan, this provides a stable, efficient, and easy-to-maintain thermal management solution for intelligent robots.

Description

Technical Field

[0001] This utility model relates to the fields of electronic engineering and thermal management technology, and in particular to a heat dissipation structure for a PCBA board used in intelligent robots. Background Technology

[0002] The PCBA board used in intelligent robots refers to a complete circuit module formed by soldering electronic components (such as chips, resistors, capacitors, sensors, etc.) onto a printed circuit board. It is one of the core hardware components of intelligent robots and is responsible for functions such as control, communication, data processing, and power management.

[0003] As the core of control, the PCBA board's performance increases with the chip's power consumption, but this also easily leads to a sharp increase in heat generation. Currently, common heat dissipation solutions mainly rely on using metal heat sinks directly attached to the surface of heat-generating components (such as CPUs and power chips) to dissipate heat through natural air convection. However, the temperature of intelligent robots may exceed 80°C during continuous operation, and heat sinks alone are not very efficient for heat dissipation. They are only suitable for low-power scenarios, and the accumulation of heat over a long period of time may damage electronic components and shorten the lifespan of the circuit board.

[0004] Therefore, it is necessary to design a heat dissipation structure for PCBA boards used in intelligent robots. Utility Model Content

[0005] In order to overcome the shortcomings of existing PCBA boards in terms of heat dissipation efficiency, which cannot meet the requirements of high power consumption scenarios, this utility model provides a heat dissipation structure for PCBA boards used in intelligent robots.

[0006] A heat dissipation structure for a PCBA board used in intelligent robots includes a circuit board, electronic components, a connecting plate, a quick-release structure, heat dissipation fins, a fixing cylinder, a heat pipe, and a second elastic element. The circuit board has various types of electronic components. A connecting plate is located on the upper part of the circuit board, and a quick-release structure is provided between the connecting plate and the circuit board. Multiple heat dissipation fins are located on the upper part of the connecting plate, and multiple fixing cylinders are fixedly connected to the lower part of the connecting plate. A heat pipe is slidably connected inside each fixing cylinder. The heat pipes are all located directly above the circuit board and electronic components. A second elastic element connects the heat pipe to each fixing cylinder. The fixing cylinder, connecting plate, heat pipe, and second elastic element are all made of thermally conductive material.

[0007] Furthermore, it is particularly preferred that the quick-release structure includes threaded rods, first elastic elements, and nuts. Threaded rods are fixedly connected to the front, rear, left, and right sides of the upper part of the circuit board. The four threaded rods are slidably inserted into the connecting plate, and the connecting plate is located directly above the circuit board and electronic components. Multiple first elastic elements are provided between the connecting plate and the circuit board. The first elastic elements are all wrapped around the threaded rods. The upper part of the first elastic elements abuts against the connecting plate, and the lower part of the first elastic elements is fixedly connected to the circuit board. Nuts are threadedly connected to the threaded rods.

[0008] In addition, preferably, it also includes a fixed frame, a cooling fan, a control unit, an electrostatic filter, and a temperature monitor. Fixed frames are fixed to the front, back, and left and right sides of the connecting plate. Cooling fans are installed inside the fixed frames. Control units are installed on the top of the fixed frames. An electrostatic filter is provided on the side of the fixed frame away from the center of the circuit board. A temperature monitor is installed on the circuit board. The temperature monitor is electrically connected to the cooling fan and the control unit.

[0009] In addition, it is particularly preferred that the device also includes a thermally conductive silicone pad, with a thermally conductive silicone pad fitted at the bottom of each heat pipe.

[0010] In addition, it is particularly preferred that the plate also includes handles, with handles fixed to both the left and right sides of the upper part of the connecting plate.

[0011] Furthermore, it is particularly preferred that the handle be made of nylon.

[0012] Beneficial effects:

[0013] 1. This utility model utilizes the high thermal conductivity of thermally conductive silicone pads and heat pipes to effectively and quickly direct the heat generated by electronic components to the heat dissipation fins. Combined with the cooling fan, it provides a stable, efficient, and easy-to-maintain thermal management solution for intelligent robots.

[0014] 2. This utility model simplifies the disassembly and assembly process of the heat dissipation module through the quick-release structure design, reduces the difficulty of operation, and is suitable for scenarios requiring frequent maintenance. At the same time, the temperature monitor can dynamically adjust the heat dissipation intensity of the fan to prevent overheating and damage to components, while the electrostatic filter reduces the heat dissipation performance degradation caused by dust accumulation. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0016] Figure 2 This is a three-dimensional structural diagram of the circuit board, electronic components, and threaded rod of this utility model.

[0017] Figure 3 This is a three-dimensional structural diagram of the connecting plate, heat dissipation fins, and handle components of this utility model.

[0018] Figure 4 This is an enlarged view of section A of this utility model.

[0019] Figure 5 This is a three-dimensional structural diagram of the components of this utility model, including the fixed frame, electrostatic filter, and control unit.

[0020] The above-mentioned figures include the following reference numerals: 1. Circuit board, 2. Electronic component, 3. Connecting plate, 4. Threaded rod, 5. First elastic element, 6. Nut, 7. Heat sink fin, 8. Handle, 9. Fixing cylinder, 10. Heat pipe, 11. Second elastic element, 12. Thermal conductive silicone pad, 13. Fixing frame, 14. Cooling fan, 15. Control unit, 16. Electrostatic filter, 101. Temperature monitor. Detailed Implementation

[0021] Example: A heat dissipation structure for a PCBA board used in intelligent robots, such as... Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the device includes a circuit board 1, electronic components 2, a connecting plate 3, a quick-release structure, heat dissipation fins 7, a fixing cylinder 9, a heat pipe 10, and a second elastic element 11. The circuit board 1 is equipped with various types of electronic components 2. The connecting plate 3 is located on the upper part of the circuit board 1. A quick-release structure is provided between the connecting plate 3 and the circuit board 1. The upper part of the connecting plate 3 is equipped with multiple heat dissipation fins 7. Multiple fixing cylinders 9 are fixedly connected to the lower part of the connecting plate 3. A heat pipe 10 is slidably connected inside each fixing cylinder 9. The heat pipes 10 are all located directly above the circuit board 1 and the electronic components 2. A second elastic element 11 is connected between the heat pipe 10 and the fixing cylinder 9. The fixing cylinder 9, the connecting plate 3, the heat pipe 10, and the second elastic element 11 are all made of thermally conductive material.

[0022] like Figure 1 and Figure 2 As shown, the quick-release structure includes threaded rods 4, first elastic elements 5, and nuts 6. Threaded rods 4 are fixedly connected to the front, back, left, and right sides of the upper part of the circuit board 1. The four threaded rods 4 are slidably inserted into the connecting plate 3. The connecting plate 3 is located directly above the circuit board 1 and the electronic components 2. Multiple first elastic elements 5 are provided between the connecting plate 3 and the circuit board 1. The first elastic elements 5 are all wrapped around the threaded rods 4. The upper part of the first elastic elements 5 abuts against the connecting plate 3, and the lower part of the first elastic elements 5 is fixedly connected to the circuit board 1. Nuts 6 are threadedly connected to the threaded rods 4.

[0023] like Figure 1 and Figure 5 As shown, it also includes a fixed frame 13, a cooling fan 14, a control unit 15, an electrostatic filter 16, and a temperature monitor 101. Fixed frames 13 are fixed to the front, back, left and right sides of the connecting plate 3. Cooling fans 14 are installed inside the fixed frames 13. Control units 15 are installed on the upper part of the fixed frames 13. Electrostatic filters 16 are provided on the side of the fixed frames 13 away from the center of the circuit board 1. The temperature monitor 101 is installed on the circuit board 1. The temperature monitor 101 is electrically connected to the cooling fan 14 and the control unit 15.

[0024] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, it also includes a thermally conductive silicone pad 12 and a handle 8. Each heat pipe 10 is fitted with a thermally conductive silicone pad 12 at its bottom. The upper left and right sides of the connecting plate 3 are fixed with handles 8. The handles 8 are made of nylon material. Nylon is a commonly used engineering plastic with high strength and toughness, and its thermal conductivity is relatively low, so that users will not feel uncomfortable or burn their hands due to excessive temperature when disassembling and maintaining.

[0025] When using this device, the user must first complete the installation of the heat dissipation components. The operator can lift the connecting plate 3 using the handle 8, and then align its four sliding holes with the four threaded rods 4 above the circuit board 1 and connect them. After releasing the handle, the first elastic element 5 will be compressed due to the gravity of the connecting plate 3 itself, and the connecting plate 3 will gradually approach the circuit board 1. Subsequently, the operator will tighten the four nuts 6 onto the corresponding threaded rods 4. As the nuts 6 are screwed in, the connecting plate 3 will be subjected to downward pressure, and the first elastic element 5 will be further compressed. At this time, the thermally conductive silicone pads 12 located at the bottom of the heat pipe 10 will begin to contact the electronic components 2 on the circuit board 1 one by one. Since the electronic components 2 are of various types and different heights, some thermally conductive silicone pads 12 will first contact the higher electronic components, thereby driving the heat pipe 10 to slide upward in the fixed cylinder 9, compressing the second elastic element 11, while the other lower thermally conductive silicone pads 12 will continue to move downward with the connecting plate 3 until most of the thermally conductive silicone pads 12 are effectively attached to the surface of the electronic components 2 or the circuit board 1.

[0026] After this process is completed, the thermally conductive silicone pad 12 can form a good heat conduction path with the heat-generating electronic component 2. The soft thermally conductive silicone pad 12 not only ensures close contact but also avoids damage or scratches to the electronic component 2 due to excessive pressure, thus ensuring stable heat dissipation performance during long-term operation. Next, the heat generated by the electronic component 2 during operation will be conducted sequentially through the thermally conductive silicone pad 12, heat pipe 10, connecting plate 3, and fixing cylinder 9 to the top heat dissipation fins 7. The heat dissipation fins 7 adopt a densely arranged thin sheet structure design, which greatly increases the contact area with air, thereby improving the efficiency of natural convection heat dissipation. Through airflow, heat can be continuously carried away from the equipment, achieving a good cooling effect. Meanwhile, the temperature monitor 101 continuously monitors the temperature changes of key heat-generating areas. When it detects that the temperature of the electronic component 2 has risen above the set threshold due to prolonged operation, the temperature monitor 101 will send a signal to the control unit 15. After receiving the signal, the control unit 15 will automatically start the cooling fans 14 installed on the four sides of the connecting plate 3. By actively supplying air, the air circulation is accelerated, which significantly improves the heat dissipation capacity of the equipment under high load operation. Finally, in order to prevent external dust from entering the heat dissipation area and affecting the stability of the system, an electrostatic filter 16 is provided at each fan outlet. This filter can effectively intercept dust particles sucked in by the air when the fan is running, reduce the internal dust accumulation, thereby extending the service life of the equipment and maintaining good heat dissipation performance.

Claims

1. A heat dissipation structure for a PCBA board used in intelligent robots, characterized in that: The device includes a circuit board (1), electronic components (2), a connecting plate (3), a quick-release structure, heat dissipation fins (7), a fixing cylinder (9), a heat pipe (10), and a second elastic element (11). The circuit board (1) is provided with various types of electronic components (2). The upper part of the circuit board (1) is provided with a connecting plate (3). A quick-release structure is provided between the connecting plate (3) and the circuit board (1). The upper part of the connecting plate (3) is provided with multiple heat dissipation fins (7). The lower part of the connecting plate (3) is fixedly connected with multiple fixing cylinders (9). Each fixing cylinder (9) is slidably connected with a heat pipe (10). The heat pipes (10) are all located directly above the circuit board (1) and the electronic components (2). A second elastic element (11) is connected between the heat pipe (10) and the fixing cylinder (9). The fixing cylinder (9), the connecting plate (3), the heat pipe (10), and the second elastic element (11) are all made of heat-conducting material.

2. The heat dissipation structure for a PCBA board for an intelligent robot according to claim 1, characterized in that: The quick-release structure includes a threaded rod (4), a first elastic element (5), and a nut (6). The upper front, rear, left and right sides of the circuit board (1) are all fixed with threaded rods (4). The four threaded rods (4) are slidably inserted into the connecting plate (3). The connecting plate (3) is located directly above the circuit board (1) and the electronic components (2). Multiple first elastic elements (5) are provided between the connecting plate (3) and the circuit board (1). The first elastic elements (5) are all wrapped around the threaded rods (4). The upper part of the first elastic elements (5) is in contact with the connecting plate (3), and the lower part of the first elastic elements (5) is fixed to the circuit board (1). The threaded rods (4) are all threaded with nuts (6).

3. The heat dissipation structure for a PCBA board for an intelligent robot according to claim 2, characterized in that: It also includes a fixed frame (13), a cooling fan (14), a control unit (15), an electrostatic filter (16), and a temperature monitor (101). The connecting plate (3) is fixed with a fixed frame (13) on the front, back, left and right sides. A cooling fan (14) is installed inside the fixed frame (13). A control unit (15) is installed on the upper part of the fixed frame (13). An electrostatic filter (16) is provided on the side of the fixed frame (13) away from the center of the circuit board (1). A temperature monitor (101) is installed on the circuit board (1). The temperature monitor (101) is electrically connected to the cooling fan (14) and the control unit (15).

4. A heat dissipation structure for a PCBA board for an intelligent robot according to claim 3, characterized in that: It also includes a thermally conductive silicone pad (12), with a thermally conductive silicone pad (12) fitted at the bottom of each heat pipe (10).

5. A heat dissipation structure for a PCBA board for an intelligent robot according to claim 4, characterized in that: It also includes handles (8), and handles (8) are fixed to the left and right sides of the upper part of the connecting plate (3).

6. A heat dissipation structure for a PCBA board for an intelligent robot according to claim 5, characterized in that: The handle (8) is made of nylon.

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