Electronic component
A laminate structure with specific ceramic compositions and crystal components addresses high dielectric loss and material strength issues in low-temperature fired ceramics, enhancing the reliability and durability of electronic components by reducing surface scratches and cracks.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- MURATA MFG CO LTD
- Filing Date
- 2025-12-17
- Publication Date
- 2026-07-02
AI Technical Summary
Existing ceramic materials for multilayer wiring boards face issues with high dielectric loss and material strength, leading to surface scratches and cracks during low-temperature firing, which affect the reliability of electronic components.
A laminate structure comprising low-dielectric ceramic layers with specific compositions of RO-ZnO-Al2O3-B2O3-SiO2 and ceramic crystal components like SiO2BaAl2Si2O8, ZnAl2O4, and Zn2SiO4, along with controlled ratios of RO, ZnO, and Al in the glass component, reduces dielectric loss and enhances material strength, minimizing surface scratches and cracks.
The solution provides electronic components with low dielectric loss and improved resistance to surface scratches, ensuring reliability and durability even when using low-temperature fired ceramics.
Smart Images

Figure JP2025044195_02072026_PF_FP_ABST