Method for manufacturing glass substrate having through electrode and glass substrate having through electrode manufactured thereby

Abstract

The present invention relates to a method for manufacturing a glass substrate having a through electrode and a glass substrate manufactured by the method. A method for manufacturing a glass substrate having a through electrode according to the present invention comprises: a through electrode forming step of forming a plurality of protruding through electrodes on one surface of a conductor plate; a die mating step of mounting the conductor plate on a lower die so that the plurality of through electrodes face upward, mounting a glass substrate on the top of the plurality of through electrodes, and mounting an upper die on the top of the glass substrate; a step of heating the mated die and the glass substrate so that the glass substrate reaches a temperature equal to or higher than a softening point; a through electrode insertion step of pressing the upper die so that mating surfaces of the upper die and the lower die come into contact with each other, and inserting the plurality of protruding through electrodes into the glass substrate to form a conductor plate-glass substrate assembly; a step of cooling the mated die and the conductor plate-glass substrate assembly; a step of separating the conductor plate-glass substrate assembly from the mated die; and an electrode exposure flattening step of flattening the glass substrate so that the plurality of through electrodes are exposed to the upper surface of the glass substrate of the conductor plate-glass substrate assembly.

Description

Method for manufacturing a glass substrate having a through electrode and a glass substrate having a through electrode manufactured by the method

[0001] The present invention relates to a method for manufacturing a glass substrate having a through electrode and a glass substrate manufactured by the method.

[0002] With the high integration of semiconductor devices, three-dimensional chip stacking is being performed, and for this purpose, an interposer is placed between stacked semiconductor chips or between a stacked semiconductor chip and a substrate. The interposer is equipped with through-electrodes to electrically connect the stacked semiconductor chips and the chips or between the stacked semiconductor chips and the substrate. Organic materials, silicon, glass, etc., are used as materials for the interposer.

[0003] Organic interposers are inexpensive but have problems such as being unsuitable for use on large-area substrates due to insufficient rigidity, being susceptible to heat, and having a rough surface that makes it difficult to form fine wiring.

[0004] Silicon interposers are silicon substrates with through-electrodes. Due to their material properties, they possess high thermal stability as their coefficient of thermal expansion is the same as that of integrated circuits. Additionally, they offer the advantage of enabling the formation of fine wiring and through-silicon vias using existing semiconductor manufacturing processes. However, silicon interposers present a problem of high manufacturing costs, as the silicon substrate itself is expensive and insulation treatment is required before and after forming through-holes and filling them with conductors such as copper.

[0005] Glass interposers possess the advantages of silicon interposers, such as a smooth surface and a low coefficient of thermal expansion, while offering the advantage of being cheaper than silicon. Furthermore, glass interposers exhibit superior electrical characteristics due to lower dielectric loss compared to silicon interposers. Consequently, glass substrates with through-glass vias are attracting attention.

[0006] To manufacture a glass interposer, a plurality of through holes must be formed in a glass substrate, and each through hole must be filled with a conductor.

[0007] Korean Registered Patent Publication No. 10-2391793 (Title of Invention: Method for Manufacturing a Glass Substrate with a Through-Electrode and Glass Substrate) discloses a method for forming a glass through-electrode by irradiating a laser onto a glass substrate to form a through-hole and filling the inner circumference of the through-hole with a conductor such as copper by electroplating. The method for forming a through-hole includes a process for forming a altered portion by irradiating a laser onto a glass substrate to form an altered portion in the portion irradiated by the laser, and a process for forming a through-hole in the glass substrate by etching at least the altered portion using an etching solution in which the etching rate for the altered portion is greater than the etching rate for the portion of the glass substrate where the altered portion is not formed.

[0008] Korean Patent Publication No. 10-2024-0036450 (Title of Invention, Method for Selectively Filling a Glass Through-Electrode) discloses a method for forming a through-electrode in a glass substrate by using a laser to form a through-hole in a glass substrate, forming a seed layer on the inner wall of the through-hole and the surface of the substrate, forming a blocking layer on the upper and lower surfaces of the glass substrate, and filling the through-hole with copper by electroplating.

[0009] As described above, the method of forming through holes in a glass substrate using a laser has the problem that the glass on the substrate surface melts due to the heat of the laser, or that the molten glass scatters, thereby reducing the flatness of the glass surface. Furthermore, thermal stress is generated in the glass substrate by the heat of the laser, and there is a possibility that fine cracks may occur in the glass substrate due to this thermal stress. Additionally, when filling the through holes in the glass substrate with a conductor such as copper by electroplating, if the length is significantly longer than the diameter of the through hole, there is a risk that voids may form inside the through electrode because the plating speed at the entrance of the through hole is faster than the plating speed inside the through hole.

[0010] Meanwhile, Korean Registered Patent Publication No. 10-1722268 (Title of Invention: Method for Manufacturing a Glass Substrate Having a Through-Electrode and Method for Manufacturing an Electrode) discloses a method for manufacturing a glass substrate having a through-electrode by forming a through hole in a glass substrate, inserting a through-electrode into the through hole, and heating the glass substrate with the through-electrode inserted into the through hole above its softening point to weld the glass substrate and the through-electrode together. Additionally, the through hole in the glass substrate is formed by using a mold to form a concave portion in the glass substrate and grinding the opposite side of the glass substrate where the concave portion is formed so that the concave portion communicates with the opposite side.

[0011] As described above, the method of forming through holes in a glass substrate using a mold and forming through electrodes by inserting electrode material into the through holes has a problem in that the process of forming through holes and the process of inserting through electrodes into through holes become increasingly difficult as the size of the through holes becomes smaller or the spacing between through holes becomes narrower. In addition to the method described above, through holes in a glass substrate can be formed by methods such as sandblasting, drill grinding, and chemical etching. However, when the through electrode is directly inserted into the through holes without filling them with through electrodes using an electroplating method, the problem remains the same in that the process of forming through holes and the process of inserting through electrodes become increasingly difficult as the diameter of the through holes decreases and the spacing between through holes becomes narrower.

[0012] With the increasing integration of semiconductor chips, market interest is growing in methods to economically manufacture glass interposers that can replace silicon interposers. In particular, there is a growing market demand for new glass interposer manufacturing methods that enable the technical and economical mass production of through-glass electrodes (TGVs) for glass interposers.

[0013] [Prior Art Literature]

[0014] (Patent Document 1) Korean Registered Patent Publication No. 10-2391793, Method for manufacturing a glass substrate having a through electrode and a glass substrate

[0015] (Patent Document 2) Korean Published Patent Application No. 10-2024-0036450, Method for Selectively Filling a Glass-Through Electrode

[0016] (Patent Document 3) Korean Registered Patent Publication No. 10-1722268, Method for manufacturing a glass substrate having a through electrode and method for manufacturing an electrical component

[0017] The present invention is intended to solve the problems of the conventional method for manufacturing a glass substrate (glass interposer) having a through electrode as described above.

[0018] The object of the present invention is to provide a new method for manufacturing a glass substrate having a through electrode by directly inserting a through electrode into a glass substrate without forming a through hole in the glass substrate.

[0019] Another objective of the present invention is to provide a new method for manufacturing a glass substrate having through electrodes by applying glass powder to a substrate having through electrodes formed thereon and firing it without forming through holes in the glass substrate.

[0020] Another objective of the present invention is to provide a glass substrate having a through electrode manufactured by the new method described above.

[0021] According to one aspect of the present invention, a method for manufacturing a glass substrate having a through electrode is provided. A method for manufacturing a glass substrate having through electrodes according to the present invention comprises: a through electrode forming step of forming a plurality of through electrodes protruding from one surface of a conductive plate; a die joining step of mounting a conductive plate on a lower die such that the plurality of through electrodes face upward, mounting a glass substrate on the upper surface of the plurality of through electrodes, and mounting an upper die on the upper surface of the glass substrate; a step of heating the joined die and the glass substrate such that the glass substrate reaches a temperature above its softening point; a through electrode insertion step of pressing the upper die so that the joining surfaces of the upper die and the lower die come into contact, thereby inserting the protruding plurality of through electrodes into the glass substrate to form a conductive plate-glass substrate assembly; a step of cooling the joined die and the conductive plate-glass substrate assembly; a step of separating the conductive plate-glass substrate assembly from the joined die; and an electrode exposure flattening step of flattening the glass substrate so that the plurality of through electrodes are exposed to the upper surface of the glass substrate of the conductive plate-glass substrate assembly.

[0022] It is preferable that the upper die and the lower die use a carbon material having excellent release properties with respect to glass. In addition, it is preferable that the ends of the plurality of through electrodes on which the lower surface of the glass substrate rests be formed to be pointed so that the plurality of through electrodes can be easily inserted into the glass substrate. Furthermore, in the method for manufacturing a glass substrate having through electrodes according to the present invention, when the joined die and the glass substrate are heated and the glass substrate reaches a temperature above the softening point, it is preferable that a portion of the ends of the through electrodes are inserted into the softened glass substrate by the weight of the upper die, and then the upper die is pressed so that all the through electrodes are inserted into the glass substrate.

[0023] In some embodiments, the through electrode forming step may include a cutting step of forming a plurality of through electrodes by partially removing one side of a conductor plate by cutting. Additionally, the through electrode forming step may include a forging step of forming a plurality of through electrodes by a forging process in which a press is applied to one side of a conductor plate. Additionally, the through electrode forming step may include an electrical discharge machining step of forming a plurality of through electrodes by electrical discharge machining one side of a conductor plate. Furthermore, the through electrode forming step may further include an etching sizing step of etching the conductor plate on which the plurality of protruding through electrodes are formed to size the shape of the plurality of protruding through electrodes. Additionally, the through electrode forming step may further include an irregularity forming step of sanding the through electrodes to form irregularities on the surface of the through electrodes.

[0024] In addition, the through-electrode forming step may include an electrode pattern printing step of printing an electrode pattern on one side of a conductor plate and an etching step of removing parts other than the printed electrode pattern by etching.

[0025] In some embodiments, the electrode exposure flattening step may further include a conductor plate removal step in which the conductor plate is removed by etching so that the through electrode is exposed to the through electrode insertion surface of the glass substrate.

[0026] In some embodiments, the method for manufacturing a glass substrate having through electrodes according to the present invention may further include a cutting step of cutting and separating the glass substrate having a plurality of through electrodes after an electrode exposure flattening step, and a crack removal step of heating and melting the edge side of the cut glass substrate to remove the cutting crack of the glass substrate.

[0027] In some embodiments, a surface strengthening step may be further included to chemically strengthen the surface of the glass substrate having the through electrode.

[0028] In some embodiments, the manufacturing method according to the present invention may further include the step of forming a conductive layer on at least one surface of the glass substrate.

[0029] According to another aspect of the present invention, a method for manufacturing a glass substrate having through electrodes is provided. The method for manufacturing a glass substrate having through electrodes according to the present invention comprises: a through electrode forming step of forming a plurality of through electrodes protruding from one surface of a conductive plate; a glass powder coating step of applying glass powder to the surface of the conductive plate where the through electrodes are formed to form a glass powder layer; a firing step of firing the glass powder layer to integrate the conductive plate with the fired glass layer; and an electrode exposure flattening step of flattening the fired glass layer so that the through electrodes are exposed to the outer surface of the fired glass layer of the conductive plate-fired glass layer combination.

[0030] In some embodiments, the electrode exposure flattening step may further include a conductor plate removal step in which the conductor plate is removed by etching so that the through electrode is exposed to the through electrode insertion surface of the glass substrate.

[0031] In some embodiments, the method for manufacturing a glass substrate having through electrodes according to the present invention may further include, after an electrode exposure flattening step, a cutting step of cutting and separating the glass substrate having a plurality of through electrodes, and a crack removal step of heating and melting the edge side of the cut glass substrate to remove the cutting crack of the glass substrate.

[0032] In some embodiments, the method for manufacturing a glass substrate having a through electrode according to the present invention may further include a surface strengthening step of chemically strengthening the surface of the glass substrate having the through electrode.

[0033] According to another aspect of the present invention, a glass substrate having a through electrode is provided. The glass substrate having a through electrode according to the present invention comprises a glass substrate and a through electrode inserted into the glass substrate, wherein both inserted ends are exposed to the upper and lower surfaces of the glass substrate, and the edge surface of the glass substrate is formed into a convex shape formed by melting by flame heating and then solidifying to remove cutting cracks.

[0034] In some embodiments, the surface of the glass substrate having the through electrode may be a chemically strengthened glass substrate. Additionally, the through electrode of the glass substrate having the through electrode may be a through electrode having irregularities formed on its outer surface.

[0035] In some embodiments, the glass substrate having a through electrode may further include a conductive layer formed on the upper or lower surface of the glass substrate.

[0036] The method for manufacturing a glass substrate having through electrodes according to the present invention involves inserting a plurality of through electrodes into a softened glass substrate by directly applying an external force, without forming through holes in the glass substrate.

[0037] In addition, the method for manufacturing a glass substrate having a through electrode according to the present invention involves applying glass powder to a conductive plate having a through electrode formed thereon to form a glass powder layer, and firing the plate so that the through electrode is inserted into the fired glass powder layer.

[0038] According to the present invention, since a through electrode is directly inserted without forming a through electrode in a glass substrate, defects caused by cracks or thermal deformation in the glass substrate during the process of forming the through electrode using a laser or the like can be prevented. In addition, since the through electrode is directly inserted into a softened glass substrate, the adhesion between the glass substrate and the through electrode is excellent. Furthermore, since the through electrode is not formed by plating, no voids are generated in the through electrode, thereby ensuring excellent electrical conductivity.

[0039] In addition, since voids are not formed in the through-electrode of the glass substrate, the glass substrate can be chemically strengthened to prevent damage to the glass substrate.

[0040] In addition, the method for manufacturing a glass substrate having a through electrode according to the present invention removes a cutting crack formed at the edge of the glass substrate by melting it.

[0041] In addition, according to the present invention, cracks formed at the edges of a glass substrate are removed, thereby preventing the glass substrate from being damaged by the growth of cracks.

[0042] In addition, according to the present invention, when a conductive layer is formed on both sides of a glass substrate into which a plurality of through electrodes are inserted by plating, the plurality of through electrodes and the conductive layer are firmly bonded by plating, so that the conductive layer can be prevented from peeling off even after long-term use.

[0043] FIG. 1 is a perspective view of one embodiment of a glass substrate having a through electrode manufactured by the method of the present invention.

[0044] FIG. 2 is a cross-sectional view showing the edge convex shape of another embodiment of a glass substrate having a through electrode manufactured by the method according to the present invention.

[0045] FIG. 3 is an explanatory diagram showing a method of forming a convex shape by melting the edge of a glass substrate having a through electrode of the embodiment shown in FIG. 2 with a flame.

[0046] FIG. 4 is a flowchart of an embodiment of a method for manufacturing a glass substrate having a through electrode according to the present invention.

[0047] FIG. 5 is an explanatory diagram of a method for manufacturing a glass substrate having a through electrode by the method illustrated in FIG. 4.

[0048] FIG. 6 is a flowchart of one embodiment of another method for manufacturing a glass substrate having a through electrode according to the present invention.

[0049] FIG. 7 is an explanatory diagram of a method for manufacturing a glass substrate having a through electrode by the method illustrated in FIG. 6.

[0050] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0051] FIG. 1 is a perspective view of one embodiment of a glass substrate having through electrodes manufactured by the method of the present invention. The glass substrate (100) having through electrodes comprises a glass substrate (30) and a plurality of through electrodes (22) inserted into the glass substrate (30). The glass substrate (30) has a lower surface (31) and an upper surface (32). The lower surface (31) and the lower surface (32) are parallel and are flattened by processing such as polishing. The thickness (distance between the lower surface and the upper surface) of the flattened glass substrate (30) is not particularly limited. The glass substrate (30) may have a thickness suitable for use as a glass interposer, for example, a thickness in the range of 0.05 mm to 1 mm. Preferably, the thickness of the glass substrate (30) may be in the range of 30 μm to 400 μm. The glass substrate may be made by stacking a plurality of glass substrates to form a single unit. For example, a glass substrate made integrally by laminating substrates with a thickness of 0.03 to 0.1 mm can be used.

[0052] In this embodiment, the glass substrate (30) has a square shape, but is not limited thereto and may have a shape suitable for use as a glass eater, such as a circle, triangle, or hexagon. Additionally, the glass substrate (30) may be borosilicate glass, aluminosilicate glass, soda-lime glass, titanium-containing silicate glass, or alkali-free glass. When a plurality of glass substrates are stacked to form an integrated glass substrate, different types of glass substrates with different insulating properties or dielectric properties may be used.

[0053] The through electrode (22) can be any conductive material. For example, copper, silver, gold, nickel, platinum, palladium, ruthenium, tin, and alloys thereof can be used as the through electrode (22). Additionally, a nickel-iron alloy can be used as the through electrode (22). It is preferable to use a metal or alloy for the through electrode (22) that has excellent adhesion to the glass substrate (30) and has a coefficient of thermal expansion similar to that of the glass substrate (30). Furthermore, if a through electrode (22) with a coefficient of thermal expansion similar to that of the glass substrate (30) is used, the bending of the glass substrate (30) due to thermal deformation during use can be reduced, the adhesion of the interface between the glass substrate (30) and the through electrode (22) can be maintained, and cracks in the glass substrate (30) due to thermal residual stress can be prevented.

[0054] The shape of the through electrode is preferably a cylinder shape, but is not limited thereto. The diameter of the through electrode may be in the range of 40 μm to 100 μm. In addition, the spacing between the through electrodes may be in the range of 20 μm to 100 μm, but is not limited thereto. The diameter of the through electrode and the spacing between the through electrodes can be selected to be appropriate for the manufacture of the glass interposer.

[0055] In a glass substrate (100) having a through electrode according to the present invention, a plurality of electrode members (20) are exposed such that both ends inserted into the glass substrate (30) coincide with the upper surface (32) and lower surface (31) of the glass substrate (30). To insert the through electrode into the glass substrate (30), the glass substrate is heated to a temperature above the softening point. A portion of the through electrode (22) is inserted into the glass substrate (30) by the weight of an upper die placed on the upper surface (32) of the glass substrate (30), and a portion can be inserted into the glass substrate (30) by the pressure of the upper die. Additionally, the ends of the plurality of through electrodes (22) exposed to the upper surface (32) of the glass substrate (30) are exposed by removing a portion of the upper surface of the glass substrate (30) through a flattening process. Additionally, the ends of the plurality of through electrodes (22) exposed to the lower surface (31) of the glass substrate (20) are exposed by removing a portion of the lower surface (31) of the glass substrate (30) through a flattening process.

[0056] Although not illustrated in FIG. 1, a glass substrate (100) having a through electrode according to the present invention may further include a conductive layer on a lower surface (31) and / or an upper surface (32). The conductive layer may be formed by methods such as sputtering, deposition, or plating. The conductive layer may be formed from copper, silver, nickel, or platinum. When forming a conductive layer by plating, a seed layer may be formed on the lower surface (31) or the upper surface (32) by electroless plating, and then the conductive layer may be formed by electrolytic plating.

[0057] FIG. 2 is a cross-sectional view showing the edge convex shape of another embodiment of a glass substrate having a through electrode manufactured by the method according to the present invention. The glass substrate (101) having a through electrode of this embodiment comprises a glass substrate (30) and a plurality of through electrodes (22) inserted into the glass substrate. The difference between the glass substrate (101) having a through electrode of this embodiment and the glass substrate (100) shown in FIG. 1 is that the edge side (33) of the glass substrate (30) is configured in a convex shape.

[0058] Generally, when a glass substrate (30) is cut to a desired size using a laser or a scriber, fine cracks are created at the cutting edges. Fine cracks created at the cutting edges grow due to external impact or temperature changes, resulting in damage to the glass substrate. FIG. 3 is an explanatory diagram showing a method of forming a convex shape by melting the edge of a glass substrate having a through electrode of the embodiment shown in FIG. 2 with a flame. As shown in FIG. 3, when the cutting surface (33) is heated with a flame (34) to melt the edge of the glass substrate, the cracks created at the edge of the cutting surface are eliminated by melting, and when the melted edge portion solidifies, it takes on a convex shape due to surface tension.

[0059] Conventional methods for forming through-electrodes on glass substrates involve creating through-holes using lasers and forming the through-electrodes through plating; however, this results in defects caused by the formation of voids in the through-electrodes. Furthermore, the presence of voids in the through-electrodes makes it difficult to chemically strengthen the surface of the glass substrate. Chemical strengthening of the glass surface is achieved by using high-temperature salt solutions, such as KNO3 or NaNO3, to induce ion exchange on the glass surface. If the voids formed in the through-electrodes are exposed to the salt solution used for chemical strengthening, corrosion may occur due to oxidation reactions or the formation of nitrates, which can impair the function of the electrode.

[0060] On the other hand, the glass substrate (100, 101) of the present invention has a through electrode (20) inserted directly into the glass substrate (30), and unlike conventional glass substrates, there are no voids in the through electrode. Therefore, the glass substrate (100, 101) equipped with a through electrode according to the present invention may be a glass substrate with a surface (31, 32) that is chemically strengthened.

[0061] The glass substrate (100, 101) equipped with a through electrode according to the present invention has excellent electrical conductivity because no voids are generated in the through electrode. In addition, since the glass substrate (100, 101) equipped with a through electrode according to the present invention is manufactured by directly inserting the through electrode into the glass substrate (30) without forming a through electrode in the glass substrate, there are no defects caused by cracks or thermal deformation in the glass substrate during the process of forming the through electrode with a laser, etc. Furthermore, because the through electrode (22) is directly inserted into the softened glass substrate (30), the adhesion between the glass substrate (30) and the through electrode (22) is excellent. In addition, the glass substrate (100, 101) equipped with a through electrode according to the present invention is resistant to thermal deformation because the glass substrate (30) has a chemically reinforced surface.

[0062] FIG. 4 is a flowchart of an embodiment of a method for manufacturing a glass substrate having a through electrode according to the present invention, and FIG. 5 is an explanatory diagram of a method for manufacturing a glass substrate having a through electrode by the method illustrated in FIG. 4. Hereinafter, with reference to FIG. 4 and FIG. 5, an embodiment of a method for manufacturing a glass electrode having a through electrode according to the present invention will be described in detail.

[0063] First, a plurality of through electrodes (22) protruding from one surface of a conductor plate (20) are formed (S100). As shown in FIG. 5(a), a plurality of through electrode patterns (21) are formed on the conductor plate (20). The through electrode patterns (21) include a plurality of through electrodes (22) formed by being arranged at predetermined positions on the upper surface (23) of the conductor plate (20). The through electrodes (22) on the upper surface (23) of the conductor plate (20) can be formed by various processes. For example, the upper surface (23) of the conductor plate (20) can be machined to remove parts other than the through electrodes (22) so that a plurality of through electrodes (22) protrude. In addition, a plurality of through electrodes (22) can be formed to protrude by a forging process in which the upper surface (23) of the conductor plate (20) is pressed with a press. Additionally, the upper surface (23) of the conductor plate (20) can be formed to have a plurality of through electrodes (22) protruding by electrical discharge machining. Any conductive material that can be used as a through electrode (22) can be used for the conductor plate (20). For example, copper, silver, gold, nickel, platinum, palladium, ruthenium, tin, and alloys thereof can be used for the conductor plate (20). Additionally, a nickel-iron alloy can be used for the conductor plate (20). It is preferable to use a metal or alloy for the conductor plate (20) that has excellent adhesion to the glass substrate (30) and has a coefficient of thermal expansion similar to that of the glass substrate (30).

[0064] Additionally, although not illustrated, the through electrode forming step (S100) may further include an etching sizing step in which a conductor plate (20) having a plurality of protruding through electrodes (22) formed thereon is etched to size the shape of the plurality of protruding through electrodes. Through the etching sizing step, the protruding through electrodes (22) are removed by etching to a desired extent, thereby allowing the diameter or width (in the case of a square shape) of the through electrode (22) and the height of the through electrode (22) to be finely adjusted to a desired size. Additionally, although not illustrated, the through electrode forming step (S100) may further include an irregularity forming step in which the through electrode (22) is sanded with fine particles to form irregularities on the surface of the through electrode (22). By forming irregularities on the outer surface of the through electrode (22), the through electrode (22) inserted into the glass substrate (30) can be prevented from easily coming out.

[0065] Next, a glass substrate (30) is mounted on the upper portion of the plurality of through electrodes (22) of the conductor plate (20), and the upper and lower dies (10, 40) are joined (S110). It is preferable to use a carbon material that has good release properties with the glass substrate for the upper die (40) and the lower die (10).

[0066] Referring to FIG. 5(b), a conductor plate (20) is mounted on the lower die (10) such that a plurality of through electrodes (22) face upward. The lower die (10) is provided with a rim (12) at the edge to define a receiving space for receiving a glass substrate (30). Referring to FIG. 5(c), a glass substrate (30) is mounted on the upper part of a conductor plate (20). The lower surface (31) of the glass substrate (30) mounted on the electrode member (20) is raised by a through electrode (22). The rim (12) of the lower die (10) is configured to a height for receiving the glass substrate (30), and the rim (12) is provided with a mating surface (12a). Referring to FIG. 5(d), a pressing surface (42) is formed protrudingly in the center of the upper die (40) to press the upper surface (32) of the glass substrate (30). Additionally, the upper die (40) is provided with a channel (43) for receiving the rim (12) of the lower die (10) and defining the pressing surface (42). The channel (43) It is formed at a position corresponding to the edge of the upper die (40) to accommodate the edge (12) of the lower die (10) during mating. A rim (41) is formed on the edge of the upper die (40), and the rim (41) defines the channel (43). The bottom of the channel (43) forms a mating surface (43a).

[0067] As shown in FIG. 5(d), the rim (12) of the lower die (10) is inserted into the channel (43) of the upper die (40), the upper surface (32) of the glass substrate (30) and the pressing surface (42) of the upper die (40) are in contact, and the junction surface (12a) of the lower die (10) and the junction surface (43a) of the upper die (40) are not in contact.

[0068] Next, the joined die (10, 40) and the glass substrate (30) are heated so that the glass substrate (30) reaches a temperature above the softening point (S120).

[0069] Referring to FIG. 5(e), the upper and lower die assembly (50) with the glass substrate (30) inserted is placed into the chamber (55), and then the internal temperature of the chamber (55) is maintained at a temperature above the softening temperature of the glass substrate (30) to soften the glass substrate (30). When the glass substrate (30) is softened, the upper die (40) presses the organic substrate (30) by gravity, and a portion of the end of the through electrode (22) supporting the glass substrate (30) on the lower surface (31) of the glass substrate (30) is inserted into the interior of the glass substrate (30). The end of the through electrode (22) can be formed to be pointed to facilitate the insertion of the through electrode (22) into the glass substrate (30). Additionally, vibration (57) can be applied to the lower die (10) to facilitate the insertion of the electrode member (20) into the glass substrate (30). Additionally, nitrogen or the like may be injected into the chamber (55) to prevent the penetrating electrode (22) from combining with oxygen and oxidizing. Furthermore, a gas such as nitrogen may be injected into the chamber (55) to prevent the upper die (40) or lower die (10) formed of carbon from oxidizing. Additionally, a vacuum below atmospheric pressure may be formed in the chamber (55) to prevent the penetrating electrode (22) from oxidizing.

[0070] Next, the upper die (40) is pressed so that the mating surfaces (12a, 43a) of the upper die (40) and the lower die (10) come into contact, thereby inserting a plurality of through electrodes (22) into the glass substrate (30) (S130). Referring to FIG. 5(f), when the upper surface (45) of the upper die (40) is pressed with a pressure plate (60) with an appropriate force inside the chamber (55), the lower surface (31) of the glass substrate (30) comes into close contact with the upper surface (23) of the conductor plate (20), and at the same time, the upper surface (32) of the glass substrate (30) and the pressure surface (42) of the upper die (40) come into close contact. In addition, the mating surface (12a) of the lower die (10) and the mating surface (43a) of the upper die (40) come into close contact. Thus, all protruding parts of the through electrodes (22) are inserted into the interior of the glass substrate (30).

[0071] According to the present invention, since the through electrode (22) is directly inserted into the softened glass substrate (30) by applying pressure without forming a through hole in the glass substrate (30), defects caused by cracks or thermal deformation around the through hole of the glass substrate during the process of forming the through hole with a laser, etc. are prevented. In addition, since the through electrode (22) is directly inserted into the softened glass substrate (30), the adhesion between the glass substrate (30) and the through electrode (22) is excellent. Also, since the through electrode is not formed by plating, no voids are created in the through electrode (22), so excellent electrical conductivity can be secured. In addition, when a conductive layer is formed by plating on both sides of the glass substrate (30) into which a plurality of through electrodes (22) are inserted, the plurality of through electrodes (22) and the conductive layer are firmly bonded by plating, so the conductive layer can be prevented from peeling off even after long-term use.

[0072] Next, the joined die and the conductor plate-glass substrate assembly are cooled (S140), and the conductor plate-glass substrate assembly is separated from the joined die (S150). When cooling the glass substrate, the temperature of the chamber (55) is gradually lowered to appropriately control the cooling speed of the softened glass substrate (30) contained in the upper and lower die assemblies (50), thereby reducing the deformation remaining on the glass substrate (30), maintaining the close contact between the through electrode (22) and the glass substrate (30), and preventing cracks from occurring on the glass substrate (30). Referring to FIG. 5(g), when a plurality of through electrodes (22) are inserted into the glass substrate (30), the conductor plate (20) and the glass substrate (30) are integrally joined to form a conductor plate-glass substrate assembly (35).

[0073] Next, the glass substrate is flattened so that a plurality of through electrodes (22) are exposed on the upper surface (32) of the glass substrate (30) of the conductor plate-glass substrate assembly (35). The flattening of the glass substrate (30) is performed through a well-known process such as polishing. The flattening step of exposing the through electrodes (22) on the upper surface (32) of the glass substrate (30) includes a step (S160) of etching and removing the conductor plate (20) from the conductor plate-glass substrate assembly (35) so that the through electrodes (22) inserted into the lower surface (31) of the glass substrate (30) are exposed, and a step (S170) of polishing the upper surface (32) of the glass substrate to expose the through electrodes (22) on the upper surface (32). If necessary, the step (S160) of etching and removing the conductor plate (20) so that the through electrode (22) inserted into the lower surface (31) of the glass substrate (30) is exposed may be omitted. The conductor plate (20) may be used as a heat sink by flattening the conductor plate (20) without removing it from the conductor plate-glass substrate assembly (35) so that the through electrode (22) is exposed only to the upper surface (32) of the glass substrate (30).

[0074] Next, when a plurality of through-electrode patterns (21) are formed on the conductor plate (20), the glass substrate (30) into which the through-electrode (22) is inserted is cut in pattern units (S180). The cutting of the glass substrate can be done by known methods such as laser or scribing.

[0075] Next, the crack formed by cutting at the edge of the cut glass substrate (30) is removed (S190), and the surface of the glass substrate (30) is chemically strengthened (S200). As shown in FIG. 3, the process of removing the crack involves heating the edge cut surface (33) of the glass substrate (30) with a flame to melt it so that the cut surface becomes convex due to surface tension when it solidifies. Chemically strengthening the surface of the glass substrate can improve the physical properties of the glass surface, thereby enhancing strength, durability, and impact resistance.

[0076] Next, a glass substrate (30) with flattened sides is plated to form a conductive layer on both sides (S210). The conductive layer can be formed by plating copper. Additionally, the conductive layer can be formed by sputtering or deposition. When forming the conductive layer by plating, a seed layer can be formed on the surface of the glass substrate (30) first by electroless plating, and then a conductive layer can be formed by electroplating copper.

[0077] FIG. 6 is a flowchart of one embodiment of another method for manufacturing a glass substrate having a through electrode according to the present invention, and FIG. 7 is an explanatory diagram of a method for manufacturing a glass substrate having a through electrode by the method shown in FIG. 6.

[0078] First, a plurality of through electrodes (22) protruding from one surface of a conductor plate (20) are formed (S300). As shown in FIG. 7(a), a plurality of through electrode patterns (21) are formed on the conductor plate (20). The through electrode patterns (21) include a plurality of through electrodes (22) formed by being arranged at predetermined positions on the upper surface (23) of the conductor plate (20). The method of forming the through electrodes (22) on the upper surface (23) of the conductor plate (20) can be formed by various processes as described with respect to FIG. 5(a). The material of the conductor plate (20) can be any conductive material that can be used as a through electrode (22). For example, copper, silver, gold, nickel, platinum, palladium, ruthenium, tin, and alloys thereof can be used as the conductor plate (20). Additionally, a nickel-iron alloy can be used as the conductor plate (20).

[0079] Next, glass powder is applied to the upper surface (23) of the conductor plate (20) to form a glass powder layer (S310). Referring to FIG. 7(b), the conductor plate (20) is first placed in the receiving space of the lower die (10), and glass powder is applied to the upper surface (23) of the conductor plate (20) to form a glass powder layer (80). The lower die (10) is provided with a rim (12) at the edge to define the receiving space for receiving the conductor plate (20). As glass powder for forming the glass powder layer (80), borosilicate glass powder, fused silica glass powder, aluminosilicate glass powder, fluoroaluminosilicate glass powder, phosphate glass powder, glass-ceramic hybrid powder, etc., may be used. The particle size of the glass powder may be micron powder in the range of 1 to 10 micrometers, or sub-micron powder of 1 micrometer or less.

[0080] Next, the glass powder layer (80) is fired to integrate the conductor plate (30) and the fired glass layer (81) (S320). Referring to FIG. 7(c), the conductor plate (20) mounted on the lower die (10) and the glass powder layer (80) are placed in the chamber (55), and the glass powder layer (80) is heated to a firing temperature to be fired, thereby integrating the conductor plate (20) and the fired glass layer (81). The firing temperature varies depending on the type of glass powder, but in the case of borosilicate glass powder, it is in the range of 800°C to 1000°C, and in the case of glass-ceramic hybrid powder, it is in the range of 800°C to 1000°C. The chamber (55) maintains a low vacuum state with a nitrogen atmosphere, and a generally known firing process temperature profile for glass powder can be applied. Although not illustrated, in the glass powder firing fixation, an upper mold (40) as shown in FIG. 5(f) may be mounted on a lower mold (10) and the glass powder layer (80) may be pressed.

[0081] When the firing of the glass powder layer (80) is completed and the conductor plate (20) and the fired glass layer (81) are integrated, the chamber (55) is cooled, and the integrated conductor plate-fired glass layer combination (85) is discharged from the die (10) as shown in FIG. 7(d) (S330).

[0082] Next, the fired glass layer (81) is flattened so that a plurality of through electrodes (22) are exposed to the upper surface (82) of the fired glass layer (81) of the conductor plate-fired glass layer assembly (85). The flattening of the fired glass layer (81) is performed through a well-known process such as polishing. The flattening step of exposing the through electrodes (22) to the upper surface (82) of the fired glass layer (81) includes a step (S340) of etching and removing the conductor plate (20) from the conductor plate-fired glass layer assembly (85) so that the through electrodes (22) are exposed to the lower surface (83) of the fired glass layer (81), and a step (S350) of polishing the upper surface (82) of the fired glass layer (81) to expose the through electrodes (22) to the upper surface (82). If necessary, the step (S350) of etching and removing the conductor plate (20) so that the through electrode (22) is exposed to the lower surface (83) of the fired glass layer (81) may be omitted. The conductor plate (20) may be flattened so that the through electrode (22) is exposed only to the upper surface (82) of the fired glass layer (81) without removing the conductor plate (20) from the conductor plate-fired glass layer combination (85), and the conductor plate (20) may be used as a heat sink.

[0083] Next, when a plurality of through-electrode patterns (21) are formed on the conductor plate (20), the fired glass layer (81) containing the through-electrode (22) is cut in pattern units (S360). The cutting of the fired glass layer (81) can be done by known methods such as laser or scribing.

[0084] Next, the crack formed by cutting at the edge of the cut fired glass layer (81) is removed (S370), and the surface of the fired glass layer (81) is chemically strengthened (S380). As shown in FIG. 3, the process of removing the crack involves heating the cut edge of the fired glass layer (81) with a flame to melt it so that the cut edge becomes convex due to surface tension when it solidifies. Chemically strengthening the surface of the fired glass layer (81) can improve the physical properties of the glass surface, thereby enhancing strength, durability, and impact resistance.

[0085] Next, a flattened fired glass layer (81) on both sides is plated to form a conductive layer on both sides (S390). The conductive layer can be formed by plating copper. Additionally, the conductive layer can be formed by sputtering or deposition. When forming the conductive layer by plating, a seed layer can be formed on the surface of the fired glass layer (81) first by electroless plating, and then a conductive layer can be formed by electroplating copper.

[0086] The embodiments of the present invention disclosed in this specification and drawings are merely specific examples provided to aid understanding and are not intended to limit the scope of the present invention. Furthermore, it is obvious to those skilled in the art that, in addition to the embodiments disclosed in this specification, other variations based on the claims of the present invention are possible.

Claims

1. A through-electrode forming step of forming a plurality of through-electrodes protruding from one surface of a conductor plate, and A die fitting step of mounting a conductive plate on a lower die such that the plurality of through electrodes face upward, mounting a glass substrate on the upper portion of the plurality of through electrodes, and mounting an upper die on the upper portion of the glass substrate, and The step of heating the above-mentioned joined die and glass substrate so that the glass substrate reaches a temperature above its softening point, and A through-electrode insertion step of forming a conductor plate-glass substrate assembly by pressing the upper die so that the mating surfaces of the upper die and the lower die come into contact, and inserting the protruding plurality of through-electrodes into the glass substrate. A step of cooling the above-mentioned assembled die and the conductor plate-glass substrate assembly, and The step of separating the above conductor plate-glass substrate assembly from the above-mentioned die, and A method for manufacturing a glass substrate having through electrodes, comprising an electrode exposure flattening step of flattening the glass substrate so that the plurality of through electrodes are exposed on the upper surface of the glass substrate of the conductor plate-glass substrate assembly.

2. In Paragraph 1, The above-mentioned through-electrode forming step comprises a cutting step of forming a plurality of through-electrodes by partially removing one surface of a conductor plate by cutting, thereby forming a glass substrate having through-electrodes.

3. In Paragraph 1, The above-mentioned through-electrode forming step comprises a forging process step in which a plurality of through-electrodes are formed by a forging process in which a press is applied to one side of a conductor plate, thereby manufacturing a glass substrate having through-electrodes.

4. In Paragraph 1, The above-mentioned through-electrode forming step comprises a discharge machining step of forming a plurality of through-electrodes by discharge machining one surface of a conductor plate. A method for manufacturing a glass substrate having through-electrodes.

5. In Paragraph 1, A method for manufacturing a glass substrate having a through electrode, wherein the electrode exposure flattening step further comprises a conductor plate removal step in which the conductor plate is removed by etching so that the through electrode is exposed to the through electrode insertion surface of the glass substrate.

6. In Paragraph 1, A method for manufacturing a glass substrate having a through electrode, wherein the through electrode forming step comprises an electrode pattern printing step of printing an electrode pattern on one surface of a conductor plate and an etching step of removing a portion other than the printed electrode pattern by etching.

7. In any one of paragraphs 1 through 5, A method for manufacturing a glass substrate having through electrodes, wherein the through electrode forming step further comprises an etching sizing step of etching a conductor plate having a plurality of protruding through electrodes formed thereon to size the shape of the plurality of protruding through electrodes.

8. In Paragraph 7, After the electrode exposure flattening step, A cutting step of cutting and separating a glass substrate having the above plurality of through electrodes, and A method for manufacturing a glass substrate having a through electrode, further comprising a crack removal step of heating and melting the edge side of the cut glass substrate to remove the cut crack of the glass substrate.

9. In Paragraph 8, A method for manufacturing a glass substrate having a through electrode, further comprising a surface strengthening step of chemically strengthening the surface of the glass substrate having the through electrode.

10. In Paragraph 7, A method for manufacturing a glass substrate having a through electrode, wherein the step of forming a through electrode protruding from the above conductor plate further includes an irregularity forming step of sanding the through electrode to form irregularities on the surface of the through electrode.

11. A through electrode forming step of forming a plurality of through electrodes protruding from one surface of a conductor plate, and A glass powder application step of forming a glass powder layer by applying glass powder to the surface of the conductor plate where the through electrode is formed, and A firing step of firing the glass powder layer to integrate the conductor plate and the fired glass layer, and A method for manufacturing a glass substrate having a through electrode, comprising an electrode exposure flattening step of flattening the fired glass layer so that the through electrode is exposed on the upper surface of the fired glass layer of the conductor plate-fired glass layer combination.

12. In Paragraph 11, A method for manufacturing a glass substrate having a through electrode, wherein the electrode exposure flattening step further comprises a conductor plate removal step in which the conductor plate is removed by etching so that the through electrode is exposed to the through electrode insertion surface of the sintered glass layer.

13. In Paragraph 12, After the electrode exposure flattening step, A cutting step of cutting and separating a glass substrate having the above plurality of through electrodes, and A method for manufacturing a glass substrate having a through electrode, further comprising a crack removal step of heating and melting the edge side of the cut glass substrate to remove the cut crack of the glass substrate.

14. In Paragraph 13, A method for manufacturing a glass substrate having a through electrode, further comprising a surface strengthening step of chemically strengthening the surface of the glass substrate having the through electrode.

15. Glass substrate and, It includes a through electrode inserted into the glass substrate, wherein both inserted ends are exposed to the upper and lower surfaces of the glass substrate, and A glass substrate having a through electrode formed by solidifying after melting by flame heating the edge side of the glass substrate to remove cutting cracks.

16. In Paragraph 15, The surface of the above glass substrate is a glass substrate having a chemically strengthened through-electrode.

17. In Paragraph 14 or 15, The above-mentioned through electrode is a glass substrate having a through electrode having irregularities formed on its outer surface.

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