Cell, module and photovoltaic system
By setting an isolation section with a width greater than the main grid line on the solar cell main grid line, the problem of microcracks during soldering of the solder strip was solved, and the production yield of photovoltaic modules was improved.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ZHEJIANG AIKO SOLAR ENERGY TECH CO LTD
- Filing Date
- 2025-11-26
- Publication Date
- 2026-07-09
AI Technical Summary
In existing solar cells, during the soldering process, burrs on the edge of the solder strip can easily come into contact with the cell, causing microcracks in the cell and reducing the production yield of photovoltaic modules.
An isolation section with a width greater than the main grid line is set on the main grid line of the solar cell. The isolation section is connected to the solder joint to isolate the solder ribbon from the surface of the cell, so as to prevent the burrs on the edge of the solder ribbon from contacting the cell.
This effectively avoids contact between the solder ribbon and the surface of the solar cell, reduces the rate of microcracks in the solar cell, and improves the production yield of photovoltaic modules.
Smart Images
Figure CN2025137905_09072026_PF_FP_ABST
Abstract
Description
Batteries, modules and photovoltaic systems
[0001] Cross-references to related applications
[0002] Priority is claimed to Chinese Patent Application No. 202423319591.7, filed with the China National Intellectual Property Administration on December 31, 2024, entitled “A Solar Cell, Photovoltaic Module and Photovoltaic System”, the entire contents of which are incorporated herein by reference. Technical Field
[0003] This disclosure relates to the field of solar cell technology, specifically to a solar cell, a photovoltaic module, and a photovoltaic system. Background Technology
[0004] Interdigitated back contact (IBC) solar cells, also known as interdigitated back contact cells, have both their positive and negative electrode grids located on the back of the cell. This completely eliminates the shading caused by the metal grids on the front surface, preventing optical losses. Furthermore, the electrode grids can be designed to be wider than existing types, reducing series resistance losses and significantly improving cell conversion efficiency. Additionally, the absence of electrode grids on the front results in a more aesthetically pleasing product, making it suitable for a variety of applications.
[0005] In related technologies, when solar cells are assembled into photovoltaic modules using solder ribbons, the edges of the solder ribbons may have burrs after cutting. When the solder ribbons are placed on the solar cells, the burrs on the edges of the solder ribbons can easily come into contact with the solar cells. In particular, when the solder joints on the edge main grid of the solar cell are welded to the solder ribbons, the solder ribbons can easily come into contact with the four corners of the solar cell, causing microcracks in the solar cells, which leads to low yield in the production of photovoltaic modules.
[0006] Public content
[0007] This disclosure provides a solar cell designed to address the problem that, during the welding of the edge main grid and the solder strip in existing solar cells, microcracks are easily caused in the cells, resulting in low production yield.
[0008] This disclosure provides a solar cell, comprising:
[0009] The silicon wafer includes a first edge and a second edge disposed opposite to each other along a first direction, and a third edge and a fourth edge disposed opposite to each other along a second direction;
[0010] A first main gate is disposed on a first surface of a silicon wafer and near a first edge. The first main gate has a first solder joint near a third edge, a first isolation portion connected to the first solder joint and extending towards the third edge in a second direction, a second solder joint near a fourth edge, and a second isolation portion connected to the second solder joint and extending towards the fourth edge in a second direction. The widths of the first and second isolation portions are greater than the width of the first main gate.
[0011] A second main gate is disposed on the first surface of the silicon wafer and near the second edge. The second main gate has a third solder joint near the third edge, a third isolation portion connected to the third solder joint and extending towards the third edge in the second direction, a fourth solder joint near the fourth edge, and a fourth isolation portion connected to the fourth solder joint and extending towards the fourth edge in the second direction. The width of the third isolation portion and the fourth isolation portion is greater than the width of the second main gate.
[0012] In some embodiments, the widths of the first isolation portion and the second isolation portion are uniformly arranged, and the widths of the third isolation portion and the fourth isolation portion are uniformly arranged.
[0013] In some embodiments, the widths of the first isolation portion and the second isolation portion are not uniformly distributed, and the minimum width of the first isolation portion and the second isolation portion is greater than the width of the first main gate.
[0014] In some embodiments, the widths of the third isolation portion and the fourth isolation portion are not uniformly distributed, and the minimum width of the third isolation portion and the fourth isolation portion is greater than the width of the second main gate.
[0015] In some embodiments, the first isolation portion, the second isolation portion, the third isolation portion, and the fourth isolation portion each include an end portion near the edge of the silicon wafer and a start portion near the middle of the silicon wafer, wherein the width of the end portion is greater than the width of the start portion.
[0016] In some embodiments, the widths of the first isolation portion, the second isolation portion, the third isolation portion, and the fourth isolation portion gradually increase from the starting end to the ending end.
[0017] In some embodiments, the distance from the first isolation portion to the third edge is 2mm to 15mm, and the distance from the second isolation portion to the fourth edge is 2mm to 15mm.
[0018] In some embodiments, the distance from the third isolation portion to the third edge is 2mm to 15mm, and the distance from the fourth isolation portion to the fourth edge is 2mm to 15mm.
[0019] This disclosure also provides a photovoltaic module, including a first solder strip, a second solder strip, and the aforementioned solar cell;
[0020] The first solder strip extends along the second direction and is connected to the first solder joint and the second solder joint. The width of the first isolation portion and the second isolation portion is greater than the width of the first solder strip. The second solder strip extends along the second direction and is connected to the third solder joint and the fourth solder joint. The width of the third isolation portion and the fourth isolation portion is greater than the width of the second solder strip.
[0021] This disclosure also provides a photovoltaic system including the photovoltaic module described above.
[0022] The solar cell disclosed herein features a first isolation portion connected to a first solder joint and a second isolation portion connected to a second solder joint on a first main grid, and a third isolation portion connected to a third solder joint and a fourth isolation portion connected to a fourth solder joint on a second main grid. When the solder strip is welded to the first and second solder joints, the first and second isolation portions isolate the solder strip from the cell surface, preventing burrs on the solder strip edge from contacting the cell surface and causing microcracks at the cell edge. When the solder strip is welded to the third and fourth solder joints, the third and fourth isolation portions isolate the solder strip from the cell surface, preventing burrs on the solder strip edge from contacting the cell surface and causing microcracks at the cell edge. Therefore, by using the first, second, third, and fourth isolation portions to isolate the solder strip from the cell surface, contact between the solder strip and the four corners of the cell is avoided during soldering, thereby reducing the cell cracking rate and improving the production yield of the photovoltaic module. Attached Figure Description
[0023] Figure 1 is a schematic diagram of the structure of a solar cell provided in an embodiment of this disclosure;
[0024] Figure 2 is a schematic diagram of a partial structure of a solar cell provided in an embodiment of this disclosure;
[0025] Figure 3 is a schematic diagram of the second type of solar cell structure provided in the embodiment of this disclosure;
[0026] Figure 4 is a schematic diagram of the third type of solar cell structure provided in the embodiments of this disclosure;
[0027] Figure 5 is a partial schematic diagram of the solar cell connected to the first solder strip according to an embodiment of this disclosure;
[0028] Figure 6 is a partial schematic diagram of the connection between the solar cell and the second solder strip provided in the embodiment of this disclosure. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this disclosure.
[0030] The solar cell provided in this disclosure has a first isolation portion connected to a first solder joint and a second isolation portion connected to a second solder joint on the first main grid, and a third isolation portion connected to a third solder joint and a fourth isolation portion connected to a fourth solder joint on the second main grid. When the solder strip is welded to the first and second solder joints, the first and second isolation portions isolate the solder strip from the surface of the solar cell, preventing burrs on the edge of the solder strip from contacting the surface of the solar cell and causing microcracks at the edge of the solar cell. When the solder strip is welded to the third and fourth solder joints, the third and fourth isolation portions isolate the solder strip from the surface of the solar cell, preventing burrs on the edge of the solder strip from contacting the surface of the solar cell and causing microcracks at the edge of the solar cell. Therefore, by using the first, second, third, and fourth isolation portions to isolate the solder strip from the surface of the solar cell, the solder strip is prevented from contacting the four corners of the solar cell when it is welded to the solar cell, thereby reducing the solar cell cracking rate and improving the production yield of the photovoltaic module.
[0031] Please refer to Figures 1-2. This disclosure provides a solar cell 100, comprising:
[0032] Silicon wafer 1 includes a first edge 11 and a second edge 12 disposed opposite to each other along a first direction X, and a third edge 13 and a fourth edge 14 disposed opposite to each other along a second direction Y;
[0033] A first main gate 2 is disposed on the first surface of silicon wafer 1 and near the first edge 11. The first main gate 2 has a first solder joint 31 near the third edge 13, a first isolation portion 32 connected to the first solder joint 31 and extending along the second direction Y towards the third edge 13, a second solder joint 33 near the fourth edge 14, and a second isolation portion 34 connected to the second solder joint 33 and extending along the second direction Y towards the fourth edge 14. The widths of the first isolation portion 32 and the second isolation portion 34 are greater than the width of the first main gate 2.
[0034] A second main gate 4 is disposed on the first surface of silicon wafer 1 and near the second edge 12. The second main gate 4 is provided with a third solder joint 51 near the third edge 13, a third isolation portion 52 connected to the third solder joint 51 and extending towards the third edge 13 in the second direction Y, a fourth solder joint 53 near the fourth edge 14, and a fourth isolation portion 54 connected to the fourth solder joint 53 and extending towards the fourth edge 14 in the second direction Y. The width of the third isolation portion 52 and the fourth isolation portion 54 is greater than the width of the second main gate 4.
[0035] In this embodiment, the first direction X and the second direction Y are perpendicular to each other. The solar cell can be a back-contact solar cell or a double-sided contact solar cell. The first surface of the silicon wafer 1 can be the front or back of the solar cell. For example, when the silicon wafer 1 is a back-contact cell, the first surface is the back of the solar cell. The first main grid 2 and the second main grid 4 are the edge main grids of the solar cell, respectively. The first solder joint 31 and the first isolation part 32 are an integral structure, and the second solder joint 33 and the second isolation part 34 are an integral structure. The first solder joint 31 and the first isolation part 32 can be printed at once or in stages using a printing process. The second solder joint 33 and the second isolation part 34 can be printed at once or in stages using a printing process. The third solder joint 51 and the third isolation part 52 are an integral structure, and the fourth solder joint 53 and the fourth isolation part 54 are an integral structure. They can be printed at once or in stages using a printing process.
[0036] The first isolation section 32, the second isolation section 34, the third isolation section 52, and the fourth isolation section 54 are respectively disposed at the four corners of the solar cell 100. The first isolation section 32, the second isolation section 34, the third isolation section 52, and the fourth isolation section 54 can be screen-printed onto the corresponding main grids. The metal paste can be silver paste, aluminum paste, etc. Here, there are no restrictions on the specific material of the metal paste; in actual use, technicians can select a suitable material according to their needs.
[0037] In this embodiment of the present disclosure, when the solder ribbon is welded to the first solder joint 31 and the second solder joint 33 on the first main grid 2, the first isolation portion 32 and the second isolation portion 34 isolate the solder ribbon from the first surface of the cell, thus preventing the burrs on the edge of the solder ribbon from contacting the first surface of the cell and preventing the solder ribbon from contacting the edge of the cell and causing microcracks. Similarly, when the solder ribbon is welded to the third solder joint 51 and the fourth solder joint 53 on the second main grid 4, the third isolation portion 52 and the fourth isolation portion 54 isolate the solder ribbon from the first surface of the cell, thus preventing the burrs on the edge of the solder ribbon from contacting the surface of the cell and causing microcracks at the edge of the cell. Therefore, by using the first isolation portion 32, the second isolation portion 34, the third isolation portion 52 and the fourth isolation portion 54 to isolate the solder ribbon from the surface of the cell, the problem of microcracks at the four corners of the cell is avoided when the solder ribbon is welded to the solder joints on the edge main grid, thereby improving the production yield of photovoltaic modules.
[0038] In this embodiment, the widths of the first isolation portion 32 and the second isolation portion 34 are both greater than the width of the first main gate 2, and the specific widths of the first isolation portion 32 and the second isolation portion 34, as well as the width of the first main gate 2, can be flexibly set according to actual needs. Similarly, the widths of the third isolation portion 52 and the fourth isolation portion 54 are both greater than the width of the second main gate 4, and the widths of the third isolation portion 52 and the fourth isolation portion 54, as well as the width of the second main gate 4, can be flexibly set according to actual needs. For example, if the widths of the first isolation portion 32 and the second isolation portion 34 are 1.1 to 1.2 times the width of the first main gate 2, and the widths of the third isolation portion 52 and the fourth isolation portion 54 are 1.1 to 1.2 times the width of the second main gate 4, the first isolation portion 32, the second isolation portion 34, the third isolation portion 52, and the fourth isolation portion 54 can effectively isolate the solder ribbon from the surface of the battery cell.
[0039] Preferably, the widths of the first isolation portion 32, the second isolation portion 34, the third isolation portion 52, and the fourth isolation portion 54 are all the same, and the widths of the first main grid 2 and the second main grid 4 are the same, which facilitates printing.
[0040] As an embodiment of this disclosure, the first main gate 2 is further provided with a fifth solder joint 35 located between the first solder joint 31 and the second solder joint 33. The specific number of the fifth solder joint 35 is not limited. It can be one, two, or more. The second main gate 4 is further provided with a sixth solder joint 55 located between the third solder joint 51 and the fourth solder joint 53. The specific number of the sixth solder joint 55 is not limited. It can be one, two, or more.
[0041] As one embodiment of this disclosure, the solar cell further includes a plurality of intermediate main grids 6 located between the first main grid 2 and the second main grid 4, and each intermediate main grid 6 is provided with a plurality of seventh solder points 61. The specific number of intermediate main grids 6 is not limited and can be one, two, or more. When the solar cell is a back-contact cell, each main grid is located on the back side of the silicon wafer 1, and the polarities of adjacent main grids are opposite. When the solar cell is a double-sided contact cell, each main grid is located on either the front or back side of the silicon wafer 1, and the polarities of adjacent main grids are the same.
[0042] As one embodiment of this disclosure, the widths of the first isolation portion 32 and the second isolation portion 34 are uniformly arranged, as are the widths of the third isolation portion 52 and the fourth isolation portion 54. The width direction of the first isolation portion 32, the second isolation portion 34, the third isolation portion 52, and the fourth isolation portion 54 is a first direction X, and the length direction of the first isolation portion 32, the second isolation portion 34, the third isolation portion 52, and the fourth isolation portion 54 is a second direction Y.
[0043] As shown in Figure 2, in this embodiment, the widths of the first isolation portion 32 and the second isolation portion 34 are uniformly arranged, as are the widths of the third isolation portion 52 and the fourth isolation portion 54, which facilitates the width design and printing preparation of the first isolation portion 32, the second isolation portion 34, the third isolation portion 52, and the fourth isolation portion 54. For example, the widths of the first isolation portion 32 and the second isolation portion 34 are uniformly arranged, while the third isolation portion 52 and the fourth isolation portion 54 can be elongated.
[0044] Referring to Figure 3, as another embodiment of this disclosure, the widths of the first isolation portion 32 and the second isolation portion 34 are not uniformly arranged. The minimum width of the first isolation portion 32 and the second isolation portion 34 is greater than the width of the first main grid 2. The widths of the first isolation portion 32 and the second isolation portion 34 can be reduced locally to reduce the printing paste of the first isolation portion 32 and the second isolation portion 34.
[0045] As an embodiment of this disclosure, the widths of the third isolation portion 52 and the fourth isolation portion 54 are not uniformly arranged, and the minimum width of the third isolation portion 52 and the fourth isolation portion 54 is greater than the width of the second main gate 4. The widths of the third isolation portion 52 and the fourth isolation portion 54 can be reduced locally, which can reduce the printing paste of the third isolation portion 52 and the fourth isolation portion 54.
[0046] Referring to Figure 3, as an embodiment of this disclosure, the first isolation portion 32, the second isolation portion 34, the third isolation portion 52 and the fourth isolation portion 54 each include an end portion 321 near the edge of the silicon wafer 1 and a starting portion 322 near the middle of the silicon wafer 1, and the width of the end portion 321 is greater than the width of the starting portion 322.
[0047] Specifically, the first isolation portion 32, the second isolation portion 34, the third isolation portion 52, and the fourth isolation portion 54 all have the same structure. The width of the end of the first isolation portion 32 near the third edge 13 is greater than the width of the end near the first solder joint 31. The width of the second isolation portion 34 near the fourth edge 14 is greater than the width of the second isolation portion 34 near the second solder joint 33. The width of the third isolation portion 52 near the third edge 13 is greater than the width of the third isolation portion 52 near the third solder joint 51. The width of the fourth isolation portion 54 near the fourth edge 14 is greater than the width of the fourth isolation portion 54 near the fourth solder joint 53.
[0048] In this embodiment, since the ends 321 of the first isolation portion 32, the second isolation portion 34, the third isolation portion 52 and the fourth isolation portion 54 are closer to the edge of the silicon wafer 1, by widening the width of the ends 321 of the first isolation portion 32, the second isolation portion 34, the third isolation portion 52 and the fourth isolation portion 54, the isolation effect on the solder ribbon can be further improved, the solder ribbon can be further prevented from contacting the edge of the silicon wafer 1, and the risk of microcracks in the silicon wafer 1 can be further reduced.
[0049] Referring to Figure 4, as another embodiment of this disclosure, the widths of the first isolation portion 32, the second isolation portion 34, the third isolation portion 52 and the fourth isolation portion 54 gradually increase from the starting end 322 to the ending end 321.
[0050] In this embodiment, the widths of the first isolation portion 32, the second isolation portion 34, the third isolation portion 52, and the fourth isolation portion 54 gradually increase from the starting end 322 to the ending end 321, respectively. This gradual increase in width from the starting end 322 to the ending end 321 is beneficial because the risk of microcracks in the silicon wafer 1 gradually increases from the middle to the edge. Therefore, the gradual increase in width from the starting end 322 to the ending end 321 not only improves the isolation effect of the solder ribbon and further reduces the risk of microcracks in the silicon wafer 1, but also ensures that less printing paste is used in the first isolation portion 32, the second isolation portion 34, the third isolation portion 52, and the fourth isolation portion 54, thus reducing production costs and achieving a balance between lower printing paste costs and a lower microcrack rate in the silicon wafer 1. For example, the cross-sections of the first isolation section 32, the second isolation section 34, the third isolation section 52, and the fourth isolation section 54 are trapezoidal.
[0051] As an embodiment of this disclosure, the distance from the first isolation portion 32 to the third edge 13 is 2mm to 15mm, and the distance from the second isolation portion 34 to the fourth edge 14 is 2mm to 15mm.
[0052] As an embodiment of this disclosure, the distance from the third isolation portion 52 to the third edge 13 is 2mm to 15mm, and the distance from the fourth isolation portion 54 to the fourth edge 14 is 2mm to 15mm.
[0053] In this embodiment, the distance from the first isolation portion 32 to the third edge 13 is 2mm to 15mm, the distance from the second isolation portion 34 to the fourth edge 14 is 2mm to 15mm, the distance from the third isolation portion 52 to the third edge 13 is 2mm to 15mm, and the distance from the fourth isolation portion 54 to the fourth edge 14 is 2mm to 15mm. In this embodiment, the distance from the first isolation portion 32 to the third edge 13 can be any value among 2mm, 3mm, 5mm, 8mm, 10mm, and 15mm, and is not specifically limited here; similarly, the distance from the second isolation portion 34 to the fourth edge 14 is any value among 2mm to 15mm, the distance from the third isolation portion 52 to the third edge 13 is any value among 2mm to 15mm, and the distance from the fourth isolation portion 54 to the fourth edge 14 is any value among 2mm to 15mm.
[0054] In this embodiment, the distances from the first isolation portion 32, the second isolation portion 34, the third isolation portion 52 and the fourth isolation portion 54 to their respective edges are controlled to be between 2mm and 15mm, which facilitates printing and can better isolate the solder ribbon from the surface of the battery cell.
[0055] Referring to Figures 5 and 6, this disclosure also provides a photovoltaic module, including: a first solder ribbon 200, a second solder ribbon 300, and a solar cell 100 as described in the above embodiment. The first solder ribbon 200 extends along the second direction Y and is connected to a first solder joint 31 and a second solder joint 33. The widths of the first isolation portion 32 and the second isolation portion 34 are greater than the width of the first solder ribbon 200. The second solder ribbon 300 extends along the second direction Y and is connected to a third solder joint 51 and a fourth solder joint 53. The widths of the third isolation portion 52 and the fourth isolation portion 54 are greater than the width of the second solder ribbon 300.
[0056] When the first solder ribbon 200 is soldered to the first solder joint 31 and the second solder joint 33 on the first main busbar 2 of the solar cell 100, the first isolation portion 32 and the second isolation portion 34 isolate the first solder ribbon 200 from the first surface of the solar cell 100, thus preventing the burrs on the edge of the first solder ribbon 200 from contacting the first surface of the cell and preventing the first solder ribbon 200 from contacting the cell and causing microcracks. Similarly, when the second solder ribbon 300 is soldered to the third solder joint 51 and the fourth solder joint 53 on the second main busbar 4, the third isolation portion 52 and the fourth isolation portion 54 isolate the second solder ribbon 300 from the first surface of the cell, thus preventing the burrs on the edge of the second solder ribbon 300 from contacting the cell surface and causing microcracks in the cell, thereby improving the production yield of the photovoltaic module.
[0057] In this embodiment, multiple solar cells in the photovoltaic module are connected in series by solder ribbons to form a cell string, thereby achieving series current collection and output. It is understood that in such an embodiment, the photovoltaic module may also include a metal frame, a backsheet, photovoltaic glass, and an encapsulating film. The encapsulating film can be filled between the front and back of the solar cells, the photovoltaic glass, and adjacent cells. As a filler, it can be a transparent colloid with good light transmittance and aging resistance; for example, the encapsulating film can be EVA film or POE film, and the specific choice can be made according to the actual situation, without limitation.
[0058] Photovoltaic glass can be applied to the encapsulating film on the front of solar cells. This photovoltaic glass can be ultra-clear glass, possessing high light transmittance, high transparency, and superior physical, mechanical, and optical properties. For example, ultra-clear glass can achieve a light transmittance of over 92%, protecting the solar cells while minimizing impact on their efficiency. Simultaneously, the encapsulating film bonds the photovoltaic glass and the solar cells together, providing sealing, insulation, and waterproofing / moisture protection for the solar cells.
[0059] The backsheet can be attached to the encapsulating film on the back of the solar cell. The backsheet protects and supports the solar cell, providing reliable insulation, water resistance, and aging resistance. Multiple backsheet options are available, typically including tempered glass, acrylic glass, and aluminum alloy TPT composite encapsulating film, etc., with specific choices depending on the specific circumstances. The backsheet, solar cell, encapsulating film, and photovoltaic glass can be mounted on a metal frame. The metal frame serves as the main external support structure for the entire solar photovoltaic module, providing stable support and installation. For example, the solar photovoltaic module can be installed at the desired location using the metal frame.
[0060] This disclosure also provides a photovoltaic system, which includes the photovoltaic modules described in the above embodiments. It should be noted that this photovoltaic system has the same or similar beneficial effects as the solar cells described above, and the related aspects between the two can be referred to each other; to avoid repetition, they will not be repeated here.
[0061] In this embodiment, the photovoltaic system can be applied in photovoltaic power plants, such as ground-mounted power plants, rooftop power plants, and floating power plants. It can also be applied to equipment or devices that utilize solar energy to generate electricity, such as user solar power supplies, solar streetlights, solar cars, and solar buildings. Of course, it is understood that the application scenarios of the photovoltaic system are not limited to these; that is, the photovoltaic system can be applied in all fields that require solar energy to generate electricity. Taking a photovoltaic power generation system network as an example, the photovoltaic system may include a photovoltaic array, a combiner box, and an inverter. The photovoltaic array may be an array combination of multiple solar photovoltaic modules; for example, multiple solar photovoltaic modules can form multiple photovoltaic arrays. The photovoltaic array is connected to the combiner box, which can collect the current generated by the photovoltaic array. The collected current flows through the inverter and is converted into AC power required by the mains power grid before being connected to the mains power grid to achieve solar power supply.
[0062] The above are merely preferred embodiments of this disclosure and are not intended to limit this disclosure. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.
Claims
1. A solar cell, comprising: A silicon wafer, the silicon wafer including a first edge and a second edge disposed opposite to each other along a first direction, and a third edge and a fourth edge disposed opposite to each other along a second direction; A first main gate is disposed on a first surface of the silicon wafer and near the first edge. The first main gate is provided with a first solder joint near the third edge, a first isolation portion connected to the first solder joint and extending towards the third edge in a second direction, a second solder joint near the fourth edge, and a second isolation portion connected to the second solder joint and extending towards the fourth edge in a second direction. The width of the first isolation portion and the second isolation portion is greater than the width of the first main gate. and A second main gate is disposed on a first surface of the silicon wafer and near the second edge. The second main gate has a third solder joint near the third edge, a third isolation portion connected to the third solder joint and extending towards the third edge in the second direction, a fourth solder joint near the fourth edge, and a fourth isolation portion connected to the fourth solder joint and extending towards the fourth edge in the second direction. The width of the third isolation portion and the fourth isolation portion is greater than the width of the second main gate.
2. The solar cell according to claim 1, wherein, The widths of the first isolation portion and the second isolation portion are uniformly arranged, and the widths of the third isolation portion and the fourth isolation portion are uniformly arranged.
3. The solar cell according to claim 1, wherein, The widths of the first isolation section and the second isolation section are not uniformly distributed, and the minimum width of the first isolation section and the second isolation section is greater than the width of the first main gate.
4. The solar cell according to claim 1, wherein, The widths of the third isolation section and the fourth isolation section are not uniformly distributed, and the minimum width of the third isolation section and the fourth isolation section is greater than the width of the second main gate.
5. The solar cell according to claim 1, wherein, The first isolation portion, the second isolation portion, the third isolation portion, and the fourth isolation portion each include an end portion near the edge of the silicon wafer and a starting end portion near the middle of the silicon wafer, wherein the width of the end portion is greater than the width of the starting end portion.
6. The solar cell according to claim 5, wherein, The widths of the first isolation section, the second isolation section, the third isolation section, and the fourth isolation section gradually increase from the starting end to the ending end.
7. The solar cell according to claim 1, wherein, The distance from the first isolation portion to the third edge is 2mm to 15mm, and the distance from the second isolation portion to the fourth edge is 2mm to 15mm.
8. The solar cell according to claim 1, wherein, The distance from the third isolation portion to the third edge is 2mm to 15mm, and the distance from the fourth isolation portion to the fourth edge is 2mm to 15mm.
9. A photovoltaic module, comprising a first solder strip, a second solder strip, and a solar cell as described in any one of claims 1 to 8; The first solder strip extends along the second direction and is connected to the first solder joint and the second solder joint. The width of the first isolation portion and the second isolation portion is greater than the width of the first solder strip. The second solder strip extends along the second direction and is connected to the third solder joint and the fourth solder joint. The width of the third isolation portion and the fourth isolation portion is greater than the width of the second solder strip.
10. A photovoltaic system comprising the photovoltaic module as described in claim 9.