Substrate clamping fixture and substrate clamping method
By setting air grooves and support parts on the pressure plate to form a negative pressure to flatten the warped substrate, and adjusting the pressure according to the substrate information, the clamping problem of the warped substrate in the electroplating equipment is solved, achieving safe clamping and efficient space utilization.
WO2026149131A1PCT designated stage Publication Date: 2026-07-16ACM RES (SHANGHAI) INC
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ACM RES (SHANGHAI) INC
- Filing Date
- 2025-12-12
- Publication Date
- 2026-07-16
AI Technical Summary
Technical Problem
Warped substrates are difficult to hold securely in electroplating equipment, leading to substrate wear or breakage.
Method used
A pressure plate with air grooves and support is used to create negative pressure by evacuating air to flatten the substrate. The support supports the back of the substrate, and the pressure is adjusted according to the warpage and material information of the substrate by combining a pressure adjustment component.
Benefits of technology
It effectively flattens warped substrates, avoids wear or breakage, adapts to the clamping requirements of different types of substrates, and reduces the space occupied by the clamp in the vertical direction.
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Smart Images
Figure CN2025142008_16072026_PF_FP_ABST
Abstract
Provided in the present application are a substrate clamping fixture and a substrate clamping method. The substrate clamping fixture is used for clamping a substrate, and comprises: a clamping plate, which is configured to enclose a clamping space; a sealing member, which is configured to form a seal between the substrate and the clamping plate when the substrate is clamped; a pressing plate, which is configured to press down on the back surface of the substrate to bring the substrate into pressing contact with the sealing member; and a pressing plate lifting assembly, which is configured to drive the pressing plate to ascend or descend. The pressing plate is provided with a gas groove, a support portion and an outer peripheral portion, wherein the gas groove and the support portion are located on the inner side of the outer peripheral portion; the gas groove is configured to be connected to an evacuating device and create a negative pressure between the pressing plate and a substrate when the evacuating device evacuates the gas groove, thereby flattening the substrate; and the bottom of the support portion is flush with the bottom of the outer peripheral portion, and is configured to come into contact with and support the back surface of the substrate. By creating a negative pressure between the pressing plate and the substrate to flatten the warped substrate, and by allowing the support portion to come into contact with the outer peripheral portion and support the substrate, it is possible to prevent the substrate from reverse warping or cracking during evacuation of the gas groove.
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