Electronic device including shield can

Abstract

An electronic device according to embodiments may include a printed circuit board, a processor, a heat transfer member, and a shield can. The shield can may be formed to have a first length in a first direction, and may be formed to have a second length, which is shorter than the first length, in a second direction perpendicular to the first direction. The shield can may include a first portion that is formed on one side of the shield can and extends in the first direction. The first portion may include: a peripheral section having a first width; and a pickup guide section having a second width that is greater than the first width. The shield can may include a second portion that extends in the first direction and is formed on the opposite side to the one side. The processor may be positioned closer to the second portion than to the first portion.

Description

Electronic device including a shield can

[0001] The present disclosure relates to an electronic device comprising a shield can.

[0002] As technology advances, microelectronic components are being mounted in electronic devices, and electromagnetic components between these components can cause interference or generate noise. Accordingly, structures are being developed to minimize interference or noise between electronic components.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] An electronic device according to one embodiment of the present disclosure may include a printed circuit board. The electronic device may include a processor disposed on the printed circuit board. The electronic device may include a heat transfer member disposed to cover the processor. The electronic device may include a shield can disposed on the printed circuit board and having an opening corresponding to the heat transfer member. The shield can may be formed to have a first length in a first direction and may be formed to have a second length shorter than the first length in a second direction perpendicular to the first direction. The shield can may include a first portion formed on one side of the shield can and extending along the first direction. The first portion may include a peripheral portion having a first width and a pickup guide portion having a second width wider than the first width. The shield can may include a second portion formed on the other side opposite to the first side and extending in the first direction. The processor may be disposed closer to the second portion than to the first portion.

[0005] An electronic device according to one embodiment of the present disclosure may include a printed circuit board. The electronic device may include a processor disposed on the printed circuit board. The electronic device may include a heat transfer member disposed to cover the processor. The electronic device may include a shield can disposed on the printed circuit board and having an opening corresponding to the heat transfer member. The shield can may be formed to have a first length in a first direction and may be formed to have a second length shorter than the first length in a second direction perpendicular to the first direction. The shield can may include a first portion formed on one side of the shield can and extending in the first direction. The shield can may include a second portion formed on the other side opposite to the one side and extending in the first direction. The shield can may include a first connecting portion that connects the first portion and the second portion to cross the opening and includes a pickup guide portion.

[0006] An electronic device according to one embodiment of the present disclosure may include a printed circuit board. The electronic device may include a processor disposed on the printed circuit board. The electronic device may include a heat transfer member disposed to cover the processor. The electronic device may include a shield can disposed on the printed circuit board and having an opening corresponding to the heat transfer member. The shield can may be formed to have a first length in a first direction and may be formed to have a second length shorter than the first length in a second direction perpendicular to the first direction. The shield can may include a first portion and a second portion extending in the first direction. The shield can may include a third portion and a fourth portion extending in the second direction and connecting the first portion and the second portion. The third portion may include a first pickup guide portion. The fourth portion may include a second pickup guide portion.

[0007] FIG. 1 is a perspective view showing the front of an electronic device according to one embodiment.

[0008] FIG. 2 is a perspective view showing the rear side of an electronic device according to one embodiment.

[0009] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0010] FIG. 4 is an exploded perspective view of a shield can assembly according to one embodiment.

[0011] FIG. 5 is a drawing showing a shield can adsorbed to a nozzle according to one embodiment.

[0012] FIG. 6 is a rear view of a nozzle according to one embodiment.

[0013] FIG. 7 is a drawing illustrating a shield can including a pickup guide portion according to one embodiment.

[0014] FIG. 8 is a drawing illustrating a shield can including an inspection hole according to one embodiment.

[0015] FIG. 9 is a drawing illustrating a shield can including a bridge portion according to one embodiment.

[0016] FIG. 10 is a drawing illustrating a shield can including a plurality of pickup guide parts according to one embodiment.

[0017] FIG. 11 is a drawing illustrating a first connecting part including a pickup guide part according to one embodiment.

[0018] FIG. 12 is a drawing illustrating a pickup guide portion formed at the intersection of a first connecting portion and a second connecting portion according to one embodiment.

[0019] FIG. 13 is a drawing illustrating a first connection portion including a plurality of bridge portions according to one embodiment.

[0020] FIG. 14 is a drawing illustrating a second connecting part including a bridge part according to one embodiment.

[0021] FIG. 15 is a block diagram of an electronic device in a network environment according to one embodiment.

[0022] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0023] Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments and should be understood to include various modifications, equivalents, and / or alternatives of the embodiments of the present invention.

[0024] FIG. 1 is a perspective view showing the front of an electronic device according to one embodiment. FIG. 2 is a perspective view showing the rear of an electronic device according to one embodiment.

[0025] Referring to FIGS. 1 and 2, an electronic device (100) according to one embodiment may include a housing (110) comprising a first surface (or front) (110A), a second surface (or rear) (110B), and a side (110C) surrounding the space between the first surface (110A) and the second surface (110B). In one embodiment (not shown), the housing may refer to a structure forming some of the first surface (110A) of FIG. 1, the second surface (110B) of FIG. 2, and the side (110C). According to one embodiment, the first surface (110A) may be formed by a front plate (102) in which at least a portion is substantially transparent (e.g., as a front plate, a glass plate or a polymer plate including various coating layers). In one embodiment, the front plate (102) may be coupled to the housing (110) to form an internal space together with the housing (110). In various embodiments, the term 'internal space' may refer to an internal space of the housing (110) that accommodates at least a portion of the display (101).

[0026] According to various embodiments, the second surface (110B) may be formed by a substantially opaque back plate (111). The back plate (111) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. The side surface (110C) may be formed by a side bezel structure (or "side member") (118) comprising a metal and / or polymer, which is combined with the front plate (102) and the back plate (111). In various embodiments, the back plate (111) and the side bezel structure (118) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0027] In the illustrated embodiment, the front plate (102) may include two first regions (110D) (e.g., curved regions) that are curved and seamlessly extended from the first surface (110A) toward the rear plate (111) at both ends of the long edge of the front plate (102). In the illustrated embodiment, the rear plate (111) may include two second regions (110E) (e.g., curved regions) that are curved and seamlessly extended from the second surface (110B) toward the front plate (102) at both ends of the long edge. In various embodiments, the front plate (102) (or the rear plate (111)) may include only one of the first regions (110D) (or the second regions (110E)). In one embodiment, some of the first regions (110D) or second regions (110E) may not be included. In the above embodiments, when viewed from the side of the electronic device (100), the side bezel structure (118) may have a first thickness (or width) on the side that does not include the first region (110D) or second region (110E) as said above (e.g., the side where the connector hole (108) is formed), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (110D) or second region (110E) (e.g., the side where the key input device (117) is placed).

[0028] According to one embodiment, the electronic device (100) may include at least one of a display (101), an audio module (103, 107, 114), a sensor module (104), a camera module (105, 155), a key input device (117), a light-emitting element (106), and a connector hole (108, 109). In various embodiments, the electronic device (100) may omit at least one of the components (e.g., a key input device (117), or a light-emitting element (106)) or additionally include other components.

[0029] The display (101) may be exposed, for example, through a significant portion of the front plate (102). In various embodiments, at least a portion of the display (101) may be exposed through the front plate (102) forming the first surface (110A) and the first area (110D) of the side (110C). In various embodiments, the corners of the display (101) may be formed to be generally the same as the adjacent outer shape of the front plate (102). In one embodiment (not shown), in order to expand the area where the display (101) is exposed, the gap between the outer edge of the display (101) and the outer edge of the front plate (102) may be formed to be generally the same.

[0030] In one embodiment (not shown), a recess or opening may be formed in a part of the screen display area (e.g., active area) or an area outside the screen display area (e.g., inactive area) of the display (101), and at least one of an audio module (114), a sensor module (104), a camera module (105, 155), and a light-emitting element (106) may be included that are aligned with the recess or the opening. In one embodiment (not shown), at least one of an audio module (114), a sensor module (104), a camera module (105, 155), and a light-emitting element (106) may be included on the back surface of the screen display area of ​​the display (101). In one embodiment (not shown), the display (101) may be combined with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor module (104) and / or at least a portion of the key input device (117) may be placed in the first regions (110D) and / or the second regions (110E).

[0031] The audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (107, 114). A microphone for acquiring external sound may be placed inside the microphone hole (103), and in various embodiments, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (107, 114) may include an external speaker hole (107) and a receiver hole (114) for communication. In various embodiments, the speaker hole (107, 214) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included without the speaker hole (107, 114) (e.g., a piezo speaker).

[0032] The sensor module (104) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. The sensor module (104) may include, for example, a first sensor module (104) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or another sensor module (not shown) (e.g., HRM sensor or fingerprint sensor) disposed on a second surface (110B) of the housing (110). The fingerprint sensor may be disposed on the second surface (110B) as well as on the first surface (110A) (e.g., display (101)) of the housing (110). The electronic device (100) may further include at least one of an unillustrated sensor module, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (104).

[0033] The camera module (105, 155) may include a first camera device (105) disposed on a first surface (110A) of the electronic device (100) and a second camera device (155) disposed on a second surface (110B). The camera module (105, 155) may include one or more lenses, an image sensor and / or an image signal processor. A flash, not illustrated, may be disposed on the second surface (110B). The flash may include, for example, a light-emitting diode or a xenon lamp. In various embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (100).

[0034] A key input device (117) may be placed on the side (110C) of the housing (110). In one embodiment, the electronic device (100) may not include some or all of the aforementioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (101).

[0035] A light-emitting element (106) may be disposed, for example, on a first surface (110A) of a housing (110). The light-emitting element (106) may, for example, provide state information of an electronic device (100) in the form of light. In one embodiment, the light-emitting element (106) may, for example, provide a light source that is coupled with the operation of a camera module (105). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0036] The connector holes (108, 109) may include a first connector hole (108) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and a second connector hole (e.g., an earphone jack) (109) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0037] However, the configuration of the electronic device (100) shown in FIGS. 1 and 2 is provided as an example and is not limited thereto. For example, some of the components of the electronic device (100) shown in FIGS. 1 and 2 may be omitted, the location of the components may be changed, or they may be replaced with other components.

[0038] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0039] According to one embodiment of the present disclosure, for example, the electronic device (200) of FIG. 3 may correspond to the electronic device (100) of FIG. 1 and FIG. 2. For example, the plate (210), front plate (220), and rear plate (280) of FIG. 3 may correspond to the housing (110) of FIG. 1 and FIG. 2. For example, the display (230) of FIG. 3 may correspond to the display (101) of FIG. 1 and FIG. 2.

[0040] Referring to FIG. 3, the electronic device (200) may include a plate (210) (e.g., a side bezel structure), a first support member (211) (e.g., a bracket or support structure), a front plate (220) (e.g., a front cover), a display (230), a substrate (240) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (250), a second support member (260) (e.g., a rear case), an antenna (270), and a rear plate (280) (e.g., a rear cover). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or additionally include other components.

[0041] The first support member (211) may be disposed inside the electronic device (200) and connected to the plate (210), or may be formed integrally with the plate (210). The first support member (211) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. The first support member (211) may have a display (230) attached to one side and a substrate (240) attached to the other side. The substrate (240) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0042] Memory may include, for example, volatile memory or non-volatile memory.

[0043] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0044] The battery (250) is a device for supplying power to at least one component of the electronic device (200) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially coplanar with, for example, the substrate (240). The battery (250) may be integrally disposed inside the electronic device (200). In another embodiment, the battery (250) may be disposed detachably from the electronic device (200).

[0045] An antenna (270) may be positioned between the rear plate (280) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In other embodiments, the antenna structure may be formed by a part or combination thereof of the side bezel structure (110) and / or the first support member (211).

[0046] FIG. 4 is an exploded perspective view of a shield can assembly according to one embodiment.

[0047] According to one embodiment of the present disclosure, the electronic device (100) may include a shield can assembly (300). For example, the shield can assembly (300) may be placed on the substrate (240) of FIG. 3. For example, the shield can assembly (300) may dissipate heat generated inside the shield can assembly (300) to the outside of the shield can assembly (300). For example, the shield can assembly (300) may block electromagnetic waves generated inside or outside the shield can assembly (300).

[0048] According to one embodiment of the present disclosure, a shield can assembly (300) may include a printed circuit board (310), at least one electronic component (320), a shield can (330), a heat transfer member (340), and a shielding member (350). For example, the heat transfer member (340) may include a first heat transfer member (341) and a second heat transfer member (342). For example, the shielding member (350) may include a first shielding member (351) and a second shielding member (352).

[0049] According to one embodiment of the present disclosure, at least one electronic component (320) may be disposed inside a shield can assembly (300). For example, at least one electronic component (320) may be disposed on a printed circuit board (310). For example, at least one electronic component (320) may be disposed on the front surface of the printed circuit board (310) facing the +z-axis direction. For example, at least one electronic component (320) may include at least one processor (e.g., CPU, GPU), at least one passive component (e.g., capacitor, inductor), at least one memory, and / or at least one charging IC.

[0050] According to one embodiment of the present disclosure, a shield can (330) may form at least a portion of the exterior of a shield can assembly (300). For example, the shield can (330) may be placed on a printed circuit board (310). For example, the shield can (330) may be placed on the front surface of the printed circuit board (310). For example, the shield can (330) may be placed to cover at least a portion of the printed circuit board (310). For example, the shield can (330) may be placed to cover at least one electronic component (320) placed on the printed circuit board (310). For example, the shield can (330) may form an internal space of the shield can assembly (300) together with the printed circuit board (310). For example, at least one electronic component (320) may be placed in said internal space. For example, the shield can (330) may protrude to have a predetermined length along the +z-axis direction to form the internal space.

[0051] According to one embodiment of the present disclosure, the shield can (330) may include a material capable of shielding electromagnetic waves. For example, the shield can (330) may prevent electromagnetic waves generated by at least one electronic component (320) disposed within the space formed by the shield can (330) and the printed circuit board (310) from being emitted to the outside of the shield can assembly (300). For example, the shield can (330) may prevent electromagnetic waves generated by an electronic component provided outside the shield can assembly (300) from entering into the inside of the shield can assembly (300).

[0052] According to one embodiment of the present disclosure, the first heat transfer member (341) may be positioned to cover at least one electronic component (320). For example, the first heat transfer member (341) may be positioned within the space formed by the shield can (320) and the printed circuit board (310). For example, the first heat transfer member (341) may be provided between the upper surface facing the +z-axis direction of the shield can (330) and the front surface facing the +z-axis direction of the printed circuit board (310). For example, the first heat transfer member (341) may be positioned to accommodate at least one electronic component (320). For example, the first heat transfer member (341) may form at least a portion of the upper surface of the shield can (330).

[0053] According to one embodiment of the present disclosure, the first heat transfer member (341) may include a material having heat dissipation performance. For example, the first heat transfer member (341) may include at least one material in a solid or liquid state and may be appropriately modified within the scope to achieve the purpose of transferring heat generated from at least one electronic component (320) to the outside of the shield can assembly (300). For example, the first heat transfer member (341) may include thermal interface materials (TIM). For example, the first heat transfer member (341) may include a thermal pad, thermal grease, thermal adhesive, and / or thermal tape. For example, the first heat transfer member (341) may include a polymer resin (e.g., silicone and / or acrylic) and a thermally conductive filler (e.g., aluminum (Al2O3 (aluminum oxide)), boron nitride, carbon, PP (polypropylene), PTFE (polytetrafluoroethylene), silver, and / or copper).

[0054] According to one embodiment of the present disclosure, a shielding member (350) may be positioned to cover a shield can (330) and a first heat transfer member (341). For example, a shielding film (351) among the shielding members (350) may be positioned to cover the edge of the upper surface of the shield can (330). For example, a shielding sheet (352) among the shielding members (350) may be positioned to cover the shielding film (351) and the first heat transfer member (341). According to one embodiment, the shielding member (350) may include a material capable of shielding electromagnetic waves. For example, the shielding member (350) may block electromagnetic waves generated from at least one electronic component (320) inside the shield can assembly (300) from being emitted to the outside of the shield can assembly (300) through the first heat transfer member (341). For example, the shielding member (350) can block electromagnetic waves generated by electronic components outside the shield can assembly (300) from entering the interior of the shield can assembly (300).

[0055] According to one embodiment of the present disclosure, a second heat transfer member (342) may be disposed on a shield member (350). For example, the second heat transfer member (342) may be disposed to cover the shield member (350). According to one embodiment, heat generated by at least one electronic component (320) can be more effectively dissipated to the outside of the shield can assembly (300) when the shield can assembly (300) includes a second heat transfer member (342) together with the first heat transfer member (341) than when the shield can assembly (300) includes only the first heat transfer member (341). The second heat transfer member (342) may include a material having heat dissipation performance. For example, the second heat transfer member (342) may include thermal interface materials (TIM). For example, the second heat transfer member (342) may include a thermal pad, thermal grease, thermal adhesive, and / or thermal tape. For example, the second heat transfer member (342) may include a polymer resin (e.g., silicone and / or acrylic) and a thermally conductive filler (e.g., aluminum (Al2O3 (aluminum oxide)), boron nitride, carbon, PP (polypropylene), PTFE (polytetrafluoroethylene), silver, and / or copper).

[0056] According to one embodiment of the present disclosure, the first heat transfer member (341), the shielding sheet (352), and the second heat transfer member (342) may be attached to each other. For example, the second heat transfer member (352) may be attached to the upper surface of the shielding sheet (352). For example, the first heat transfer member (341) may be attached to the lower surface of the shielding sheet (352) opposite to the upper surface.

[0057] According to one embodiment of the present disclosure, the shielding film (351) may include an adhesive material. For example, a shielding sheet (352) and a shield can (330) may be bonded by the shielding film (351). For example, a shielding sheet (352) may be attached to the upper surface of the shielding film (351). For example, a shield can (330) may be attached to the lower surface of the shielding film (351) opposite to the upper surface.

[0058] According to one embodiment of the present disclosure, the first heat transfer member (341), the shielding film (351), the shielding sheet (352), and the second heat transfer member (342) can be bonded together by an adhesive material and combined as a whole with the shield can (330).

[0059] FIG. 5 is a drawing showing a shield can adsorbed to a nozzle according to one embodiment. FIG. 6 is a rear view of a nozzle according to one embodiment.

[0060] According to one embodiment of the present disclosure, with reference to FIG. 5, a shield can (330) can be placed on a printed circuit board (310) by means of a nozzle (400). For example, the shield can (330) can be lifted by adsorption by the nozzle (400), and the shield can (330) lifted by the nozzle (400) can be placed at a designated location on the printed circuit board (310). For example, a portion of the edge of the upper surface of the shield can (330) facing the +z-axis direction can be adsorbed by the nozzle (400) and moved to a designated location on the printed circuit board (310).

[0061] According to one embodiment of the present disclosure, with reference to FIG. 6, the nozzle (400) may include a suction portion (410). For example, the suction portion (410) may be formed on the rear surface of the nozzle (400). For example, the suction portion (410) may be formed on the rear surface of the nozzle (400) that contacts the shield can (330). For example, when the suction portion (410) is in contact with the shield can (330), the shield can (330) may be adsorbed to the nozzle (400) and moved to a designated location on the printed circuit board (310). According to one embodiment, depending on the location where the shield can (330) is adsorbed, a misalignment may occur during the process of being adsorbed and moved by the adsorption portion (410) of the nozzle (400). According to one embodiment, during the process of placing the shield can (330) adsorbed to the nozzle (400) onto the printed circuit board (310), lifting may occur on the shield can (330).

[0062] FIG. 7 is a drawing illustrating a shield can including a pickup guide portion according to one embodiment. For example, FIG. 7 may be a top view of the shield can (330). For example, FIG. 7 may be a view of the shield can (330) in a direction perpendicular to one surface of a printed circuit board (310) (e.g., z-axis direction).

[0063] According to one embodiment of the present disclosure, the shield can (330) may be formed to have a first length (d1) along a first direction (e.g., the y-axis direction). For example, the first length (d1) may be a length formed in the longitudinal direction of the shield can (330). According to one embodiment, the shield can (330) may be formed to have a second length (d2) shorter than the first length (d1) along a second direction (e.g., the x-axis direction) perpendicular to the first direction. For example, the second length (d2) may be a length formed in the width direction of the shield can (330).

[0064] According to one embodiment of the present disclosure, the shield can (330) may include an opening (520). For example, the opening (520) may be formed to penetrate the shield can (330) along the z-axis direction. For example, the opening (520) may be formed to connect the upper surface of the shield can (330) facing the +z-axis direction and the front surface of the printed circuit board (310) facing the +z-axis direction. For example, when the opening (520) is viewed from above the shield can (330), at least a portion of at least one electronic component (320) may be exposed to the outside of the shield can (330) through the opening (520). According to one embodiment, a first heat transfer member (341) may be positioned to cover at least one electronic component (320) inside the shield can (330) through the opening (520). For example, the opening (520) may have a size corresponding to the first heat transfer member (341).

[0065] According to one embodiment of the present disclosure, the shield can (330) may include a first portion (610), a second portion (620), a third portion (630), and a fourth portion (640). For example, the first portion (610), the second portion (620), the third portion (630), and the fourth portion (640) may be formed to extend from the side of the shield can (330) to cover at least a portion of the printed circuit board (310). For example, the first portion (610), the second portion (620), the third portion (630), and the fourth portion (640) may be formed to surround an opening (520). For example, the first portion (610), the second portion (620), the third portion (630), and the fourth portion (640) may form the inner surface of the opening (520). For example, the first part (610), the second part (620), the third part (630), and the fourth part (640) may form the edges of the upper surface of the shield can (330). For example, the first part (610), the second part (620), the third part (630), and the fourth part (640) may be formed to surround at least one electronic component (320).

[0066] According to one embodiment of the present disclosure, the first part (610) and the second part (620) may be parts extended in a first direction (e.g., the y-axis direction). For example, the first part (610) and the second part (620) may be formed parallel to each other. For example, the first part (610) and the second part (620) may be formed facing each other. For example, the first part (610) may be a part formed on one side of the shield can (330). For example, the second part (620) may be a part formed on the other side opposite to the one side of the shield can (330).

[0067] According to one embodiment of the present disclosure, the third part (630) and the fourth part (640) may be parts extended in a second direction (e.g., x-axis direction) perpendicular to the first direction (e.g., y-axis direction). For example, the third part (630) and the fourth part (640) may be formed parallel to each other. For example, the third part (630) and the fourth part (640) may be formed facing each other. The third part (630) and the fourth part (640) may be parts extended from the first part (610) to the second part (620). For example, the third part (630) and the fourth part (640) may be parts formed between the first part (610) and the second part (620).

[0068] According to one embodiment of the present disclosure, at least one electronic component (320) may include an application processor chipset (510). For example, the application processor chipset (510) may include at least one of a central processing unit or a graphic processing unit. For example, the CPU and GPU may be located closer to the second part (620) than to the first part (610). For example, the CPU and GPU may be located in the center part of the shield can (330).

[0069] According to one embodiment of the present disclosure, the first portion (610) may include a pickup guide portion (530). For example, the pickup guide portion (530) may be a portion to which the nozzle (400) is adsorbed. For example, the pickup guide portion (530) may be a portion that guides the adsorption position of the adsorption portion (410) of the nozzle (400). For example, the nozzle (400) may adsorb the pickup guide portion (530) to move the shield can (330) to a designated position.

[0070] According to one embodiment of the present disclosure, the first portion (610) may include a peripheral portion formed to have a first width (w1) in a second direction (e.g., x-axis direction) and a pickup guide portion (530) formed to have a second width (w2) greater than the first width (w1). For example, the pickup guide portion (530) may be formed to have a second width (w2) greater than the first width (w1) so that the nozzle (400) can be adsorbed. For example, the pickup guide portion (530) may protrude toward the inside of the opening (520) so that the nozzle (400) can be adsorbed. For example, the pickup guide portion (530) may protrude toward the center of the upper surface of the shield can (330).

[0071] According to one embodiment of the present disclosure, the pickup guide portion (530) may be formed in the first portion (610) which is formed to have a longer length than the third portion (630) and the fourth portion (640). For example, the distance between the first portion (610) and the center of gravity (700) of the shield can (330) is formed to be shorter than the distance between the third portion (630) to the fourth portion (640) and the center of gravity (700). This allows for less distortion of the shield can (330) to occur when the pickup guide portion (530) is formed in the first portion (610) compared to when the pickup guide portion (530) is formed in the third portion (630) to the fourth portion (640) during the process of the nozzle (400) lifting the shield can (330).

[0072] According to one embodiment of the present disclosure, the pickup guide portion (530) may be formed in the first portion (610), which is relatively farther away from the CPU to GPU than the second portion (620). For example, the distance between the first portion (610) and the CPU to GPU may be longer than the distance between the second portion (620) and the CPU to GPU. For example, if the pickup guide portion (530) is formed in the second portion (620) which is positioned close to the CPU to GPU, the area of ​​the first heat transfer member (341) covering the CPU to GPU may be reduced due to the pickup guide portion (530) protruding inwardly into the opening (520) to form the pickup guide portion (530). For example, if the area of ​​the first heat transfer member (341) covering the CPU to GPU is reduced, the heat dissipation performance of the shield can assembly (300) may be reduced. For example, to increase the heat dissipation performance of the shield can assembly (300), a pickup guide portion (530) may be formed in the first portion (610), which is located relatively far from the CPU or GPU, relative to the second portion (620).

[0073] According to one embodiment of the present disclosure, the pickup guide portion (530) may be formed at a position corresponding to the center of gravity (700) on the first portion (610). For example, the pickup guide portion (530) may be formed at a position close to the center of gravity. For example, the pickup guide portion (530) may be formed on the inner side of the first portion (610) closer to the center of gravity (700) than on the edge of the first portion (610). According to one embodiment, when the pickup guide portion (530) is formed at a position closer to the center of gravity (700) than when the pickup guide portion (530) is formed on the edge of the first portion (610), less distortion may occur in the shield can (330) during the process in which the nozzle (400) adsorbs and moves the shield can (330).

[0074] FIG. 8 is a drawing illustrating a shield can including an inspection hole according to one embodiment.

[0075] According to one embodiment of the present disclosure, the shield can (330) may include an inspection hole (710). For example, the inspection hole (710) may be a hole for checking whether a shielding member (350) is placed on the shield can (330). For example, the inspection hole (710) may be a hole for checking whether the shield can (330) is covered to the extent that the shielding member (350) can block electromagnetic waves from at least one electronic component (320) inside the shield can (330).

[0076] According to one embodiment of the present disclosure, an inspection hole (710) may be formed in a corner area of ​​a shield can (330). For example, the inspection hole (710) may be formed in a corner area where a first part (610) intersects with a third part (630) or a fourth part (640). For example, the inspection hole (710) may be formed in a corner area where a second part (620) intersects with a third part (630) or a fourth part (640). According to one embodiment, the inspection hole (710) may be formed in a corner area where a first part (610) and a third part (630) intersect, which are relatively far from the CPU and GPU among the corner areas.

[0077] According to one embodiment of the present disclosure, the corner area where the inspection hole (710) is formed may protrude toward the inside of the opening (520). For example, the corner area where the inspection hole (710) is formed may protrude toward the inside of the opening (520) to secure a predetermined area for forming the inspection hole (710). The inspection hole (710) may be formed in the corner area so as not to reduce the area where the first heat transfer member (341) is placed by the area for forming the inspection hole (710). For example, by forming the inspection hole (710) in a corner area far from the CPU and GPU, which have a higher heat generation amount than other electronic components, the area where the first heat transfer member (341) covers the CPU and GPU may not be reduced by the area for forming the inspection hole (710).

[0078] FIG. 9 is a drawing illustrating a shield can including a bridge portion according to one embodiment.

[0079] According to one embodiment of the present disclosure, the shield can (330) may include at least one bridge portion (810). For example, at least a portion of the pickup guide portion (530) may be removed as the at least one bridge portion (810) is cut. For example, as the at least one bridge portion (810) is cut, the portion of the pickup guide portion (530) protruding inwardly into the opening (520) may be removed. For example, after the shield can (330) is placed on the printed circuit board (310) by the nozzle (400), the at least one bridge portion (810) may be cut.

[0080] According to one embodiment of the present disclosure, the area in which the first heat transfer member (341) covers at least one electronic component (320) may be reduced by the area of ​​the portion of the pickup guide portion (530) protruding toward the inside of the opening (520), and the heat dissipation performance of the shield can (330) may be reduced due to the reduced area. According to one embodiment, in order to increase the area in which the first heat transfer member (341) is placed, the portion of the pickup guide portion (530) protruding toward the inside of the opening (520) may be removed as at least one bridge portion (810) is cut.

[0081] FIG. 10 is a drawing illustrating a shield can including a plurality of pickup guide parts according to one embodiment.

[0082] According to one embodiment of the present disclosure, a shield can (330) may include a plurality of pickup guide sections. For example, the plurality of pickup guide sections may include a first pickup guide section (910) and a second pickup guide section (920). For example, the first pickup guide section (910) may be formed in a third section (630). For example, the second pickup guide section (920) may be formed in a fourth section (640). For example, the first pickup guide section (910) and the second pickup guide section (920) may be formed symmetrically with respect to the center of gravity (700). According to one embodiment, by forming the first pickup guide section (910) and the second pickup guide section (920) symmetrically with respect to the center of gravity (700), the shield can (330) can be lifted in a balanced manner by the nozzle (400). For example, as the shield can (330) is lifted evenly by the nozzle (400), less distortion may occur in the shield can (330), and the shield can (330) can be placed more accurately at a designated location on the printed circuit board (310).

[0083] FIG. 11 is a drawing illustrating a first connecting part including a pickup guide part according to one embodiment.

[0084] According to one embodiment of the present disclosure, the shield can (330) may include a first connecting portion (1010). For example, the first connecting portion (1010) may be formed to span across an opening (520). For example, the first connecting portion (1010) may be a portion extending from a first portion (610) to a second portion (620). For example, the first connecting portion (1010) may be formed parallel to a third portion (630) and / or a fourth portion (640). For example, the first connecting portion (1010) may be formed close to the center of gravity (700). For example, the distance between the first connecting portion (1010) and the center of gravity (700) may be shorter than the distance between the first connecting portion (1010) and the third portion (630).

[0085] According to one embodiment of the present disclosure, a pickup guide portion (530) may be formed on a first connecting portion (1010). For example, the pickup guide portion (530) may be formed on a portion of the first connecting portion (1010) that is close to the center of gravity (700). For example, the pickup guide portion (530) may be formed on a central portion of the first connecting portion (1010). For example, the pickup guide portion (530) may be formed at a position corresponding to the center of gravity (700) on the first connecting portion (1010). According to one embodiment, by forming the pickup guide portion (530) on the first connecting portion (1010) that is closer to the center of gravity (700) than the third portion (630), less distortion may occur in the shield can (330) during the process in which the nozzle (400) adsorbs the pickup guide portion (530).

[0086] According to one embodiment of the present disclosure, the first heat transfer member (341) may be placed after the shield can (330) is placed on the printed circuit board (310). According to one embodiment, the opening (520) may be divided into two regions by the first connecting portion (1010). For example, the first heat transfer member (341) may be placed in each of the two regions that are divided from each other by the first connecting portion (1010).

[0087] FIG. 12 is a drawing illustrating a pickup guide portion formed at the intersection of a first connecting portion and a second connecting portion according to one embodiment.

[0088] According to one embodiment of the present disclosure, the shield can (330) may include a second connecting portion (1020). For example, the second connecting portion (1020) may be formed between the third portion (630) and the first connecting portion (1010). For example, the second connecting portion (1020) may be a portion extending from the third portion (630) to the first connecting portion (1010). According to one embodiment, a pickup guide portion (530) may be formed in the area where the second connecting portion (1020) and the first connecting portion (1010) intersect. For example, by forming the pickup guide portion (530) in the area where the second connecting portion (1020) and the first connecting portion (1010) intersect, the shield can (330) can be lifted more evenly by the nozzle (400).

[0089] According to one embodiment of the present disclosure, the opening (520) may be divided into three regions by a first connecting portion (1010) and a second connecting portion (1020). For example, the first heat transfer member (341) may be placed in each of the three regions divided by the first connecting portion (1010) and the second connecting portion (1020).

[0090] FIG. 13 is a drawing illustrating a first connection portion including a plurality of bridge portions according to one embodiment.

[0091] According to one embodiment of the present disclosure, the shield can (330) may include a first bridge portion (1110) and a second bridge portion (1020). For example, the first bridge portion (1110) may be a portion connecting the first connection portion (1010) and the first portion (610). For example, the second bridge portion (1120) may be a portion connecting the first connection portion (1010) and the second portion (620). For example, the first bridge portion (1110) and the second bridge portion (1020) may be portions that are cut off after the shield can (330) is placed on a printed circuit board (310).

[0092] According to one embodiment of the present disclosure, as the first bridge portion (1110) and the second bridge portion (1020) are cut, the first connecting portion (1010) may be removed. For example, as the first connecting portion (1010) is removed, the area over which the first heat transfer member (341) covers at least one electronic component (320) may be increased by an area corresponding to the first connecting portion (1010).

[0093] FIG. 14 is a drawing illustrating a second connecting part including a bridge part according to one embodiment.

[0094] According to one embodiment of the present disclosure, the shield can (330) may include a third bridge portion (1130). For example, the third bridge portion (1130) may be a portion connecting the second connection portion (1020) and the third portion (630). For example, the third bridge portion (1130) may be a portion that is cut off after the shield can (330) is placed on the printed circuit board (310). For example, as the third bridge portion (1130) is cut off, the second connection portion (1020) may be removed. For example, as the second connection portion (1020) is removed, the area over which the first heat transfer member (341) covers at least one electronic component (320) may be increased by an area corresponding to the second connection portion (1020).

[0095] FIG. 15 is a block diagram of an electronic device (1501) in a network environment (1500) according to one embodiment. Referring to FIG. 15, in the network environment (1500), the electronic device (1501) may communicate with an electronic device (1502) through a first network (1598) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (1504) or a server (1508) through a second network (1599) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1501) may communicate with the electronic device (1504) through the server (1508). According to one embodiment, the electronic device (1501) may include a processor (1520), memory (1530), input module (1550), sound output module (1555), display module (1560), audio module (1570), sensor module (1576), interface (1577), connection terminal (1578), haptic module (1579), camera module (1580), power management module (1588), battery (1589), communication module (1590), subscriber identification module (1596), or antenna module (1597). In some embodiments, at least one of these components (e.g., connection terminal (1578)) may be omitted from the electronic device (1501), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (1576), camera module (1580), or antenna module (1597)) may be integrated into a single component (e.g., display module (1560)).

[0096] The processor (1520) can, for example, execute software (e.g., program (1540)) to control at least one other component (e.g., hardware or software component) of the electronic device (1501) connected to the processor (1520) and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (1520) can store commands or data received from other components (e.g., sensor module (1576) or communication module (1590)) in volatile memory (1532), process the commands or data stored in volatile memory (1532), and store the resulting data in non-volatile memory (1534). According to one embodiment, the processor (1520) may include a main processor (1521) (e.g., a central processing unit or an application processor) or an auxiliary processor (1523) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (1501) includes a main processor (1521) and an auxiliary processor (1523), the auxiliary processor (1523) may be configured to use lower power than the main processor (1521) or to be specialized for a specified function. The auxiliary processor (1523) may be implemented separately from the main processor (1521) or as part thereof.

[0097] The auxiliary processor (1523) may control at least some of the functions or states associated with at least one component of the electronic device (1501) (e.g., display module (1560), sensor module (1576), or communication module (1590)) on behalf of the main processor (1521) while the main processor (1521) is in an inactive (e.g., sleep) state, or together with the main processor (1521) while the main processor (1521) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (1523) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (1580) or communication module (1590)). According to one embodiment, the auxiliary processor (1523) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (1501) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (1508)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0098] The memory (1530) can store various data used by at least one component of the electronic device (1501) (e.g., processor (1520) or sensor module (1576)). The data may include, for example, software (e.g., program (1540)) and input or output data for related commands. The memory (1530) may include volatile memory (1532) or non-volatile memory (1534).

[0099] The program (1540) may be stored as software in memory (1530) and may include, for example, an operating system (1542), middleware (1544), or an application (1546).

[0100] The input module (1550) can receive commands or data to be used for a component of the electronic device (1501) (e.g., processor (1520)) from outside the electronic device (1501) (e.g., user). The input module (1550) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0101] The sound output module (1555) can output a sound signal to the outside of the electronic device (1501). The sound output module (1555) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0102] The display module (1560) can visually provide information to an external (e.g., user) of the electronic device (1501). The display module (1560) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (1560) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0103] The audio module (1570) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (1570) can acquire sound through an input module (1550) or output sound through an audio output module (1555) or an external electronic device (e.g., electronic device (1502)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (1501).

[0104] The sensor module (1576) can detect the operating state of the electronic device (1501) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (1576) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0105] The interface (1577) may support one or more specified protocols that can be used for the electronic device (1501) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (1502)). According to one embodiment, the interface (1577) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0106] The connection terminal (1578) may include a connector through which the electronic device (1501) can be physically connected to an external electronic device (e.g., electronic device (1502)). According to one embodiment, the connection terminal (1578) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0107] The haptic module (1579) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (1579) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0108] The camera module (1580) can capture still images and video. According to one embodiment, the camera module (1580) may include one or more lenses, image sensors, image signal processors, or flashes.

[0109] The power management module (1588) can manage the power supplied to the electronic device (1501). According to one embodiment, the power management module (1588) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0110] The battery (1589) can supply power to at least one component of the electronic device (1501). According to one embodiment, the battery (1589) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0111] The communication module (1590) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (1501) and an external electronic device (e.g., electronic device (1502), electronic device (1504), or server (1508)), and the performance of communication through the established communication channel. The communication module (1590) may include one or more communication processors that operate independently of the processor (1520) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1590) may include a wireless communication module (1592) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (1594) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (1504) via a first network (1598) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (1599) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1592) can identify or authenticate the electronic device (1501) within a communication network such as the first network (1598) or the second network (1599) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (1596).

[0112] The wireless communication module (1592) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (1592) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (1592) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (1592) can support various requirements specified in the electronic device (1501), external electronic device (e.g., electronic device (1504)), or network system (e.g., second network (1599)). According to one embodiment, the wireless communication module (1592) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0113] An antenna module (1597) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (1597) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (1597) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (1598) or a second network (1599), may be selected from the plurality of antennas, for example, by a communication module (1590). A signal or power may be transmitted or received between the communication module (1590) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (1597).

[0114] According to various embodiments, the antenna module (1597) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0115] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0116] According to one embodiment, commands or data may be transmitted or received between the electronic device (1501) and an external electronic device (1504) through a server (1508) connected to a second network (1599). Each of the external electronic devices (1502, or 1504) may be the same or a different type of device as the electronic device (1501). According to one embodiment, all or part of the operations performed on the electronic device (1501) may be performed on one or more of the external electronic devices (1502, 1504, or 1508). For example, if the electronic device (1501) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (1501) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (1501). The electronic device (1501) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (1501) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1504) may include an Internet of Things (IoT) device. The server (1508) may be an intelligent server using machine learning and / or neural networks.According to one embodiment, an external electronic device (1504) or server (1508) may be included within the second network (1599). The electronic device (1501) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0117] The problem to be solved according to one embodiment of the present disclosure may be as follows.

[0118] According to one embodiment of the present disclosure, a shield can may be provided that includes a pickup guide portion for picking up a shield can.

[0119] According to one embodiment of the present disclosure, a shield can may be provided that includes an inspection hole for the placement of a shielding member.

[0120] According to one embodiment of the present disclosure, an electronic device may include a printed circuit board. The electronic device may include a processor disposed on the printed circuit board. The electronic device may include a heat transfer member disposed to cover the processor. The electronic device may include a shield can disposed on the printed circuit board and having an opening corresponding to the heat transfer member. The shield can may be formed to have a first length in a first direction and may be formed to have a second length shorter than the first length in a second direction perpendicular to the first direction. The shield can may include a first portion formed on one side of the shield can and extending along the first direction. The first portion may include a peripheral portion having a first width and a pickup guide portion having a second width wider than the first width. The shield can may include a second portion formed on the other side opposite to the first side and extending in the first direction. The processor may be disposed closer to the second portion than to the first portion.

[0121] According to one embodiment of the present disclosure, the electronic device may include an application processor chipset including the processor. The processor may include at least one of a central processing unit or a graphic processing unit included in the application processor chipset.

[0122] According to one embodiment of the present disclosure, the portion of the first part in which the pickup guide portion is formed may protrude toward the inside of the opening.

[0123] According to one embodiment of the present disclosure, the pickup guide may be positioned on the first portion of the shield can at a position corresponding to the center of gravity of the shield can.

[0124] According to one embodiment of the present disclosure, the shield can extends in the second direction and may include a third portion formed between the first portion and the second portion. The distance between the first portion and the center of gravity may be shorter than the distance between the third portion and the center of gravity.

[0125] According to one embodiment of the present disclosure, an inspection hole may be formed in the corner region where the first part and the third part intersect.

[0126] According to one embodiment of the present disclosure, a shielding member disposed to cover the opening and the inspection hole may be included.

[0127] According to one embodiment of the present disclosure, the corner region in which the inspection hole is formed may extend toward the inside of the opening.

[0128] According to one embodiment of the present disclosure, the pickup guide portion may be formed to be segmented by at least one bridge portion. At least a portion of the pickup guide portion may be removed as the at least one bridge portion is cut off after the shield can is placed on the printed circuit board.

[0129] According to one embodiment of the present disclosure, an electronic device may include a printed circuit board. The electronic device may include a processor disposed on the printed circuit board. The electronic device may include a heat transfer member disposed to cover the processor. The electronic device may include a shield can disposed on the printed circuit board and having an opening corresponding to the heat transfer member. The shield can may be formed to have a first length in a first direction and may be formed to have a second length shorter than the first length in a second direction perpendicular to the first direction. The shield can may include a first portion formed on one side of the shield can and extending in the first direction. The shield can may include a second portion formed on the other side opposite to the one side and extending in the first direction. The shield can may include a first connecting portion that connects the first portion and the second portion to cross the opening and includes a pickup guide portion.

[0130] According to one embodiment of the present disclosure, the shield can extends in the second direction and may include a third portion formed between the first portion and the second portion. The shield can extends in the second direction and may further include a fourth portion formed on the opposite side of the third portion. The opening may include a first region between the third portion and the first connecting portion and a second region between the fourth portion and the connecting portion. The heat transfer member may include a first heat transfer member corresponding to the first region and a second heat transfer member corresponding to the second region.

[0131] According to one embodiment of the present disclosure, the shield can may further include a second connecting portion connecting the first connecting portion and the third portion. The second region may be divided into a third region and a fourth region by the second connecting portion. The second heat transfer member may include a third heat transfer member corresponding to the third region and a fourth heat transfer member corresponding to the fourth region.

[0132] According to one embodiment of the present disclosure, the shield can may further include a first bridge portion between the first portion and the first connecting portion and a second bridge portion between the second portion and the first connecting portion. After the shield can is placed on the printed circuit board, the connecting portion may be removed as the first bridge portion and the second bridge portion are cut.

[0133] According to one embodiment of the present disclosure, an inspection hole may be formed in the corner region where the first part and the third part intersect.

[0134] According to one embodiment of the present disclosure, a shielding member disposed to cover the opening and the inspection hole may be included.

[0135] According to one embodiment of the present disclosure, the corner region in which the inspection hole is formed may extend toward the inside of the opening.

[0136] According to one embodiment of the present disclosure, an electronic device may include a printed circuit board. The electronic device may include a processor disposed on the printed circuit board. The electronic device may include a heat transfer member disposed to cover the processor. The electronic device may include a shield can disposed on the printed circuit board and having an opening corresponding to the heat transfer member. The shield can may be formed to have a first length in a first direction and may be formed to have a second length shorter than the first length in a second direction perpendicular to the first direction. The shield can may include a first portion and a second portion extending in the first direction. The shield can may include a third portion and a fourth portion extending in the second direction and connecting the first portion and the second portion. The third portion may include a first pickup guide portion. The fourth portion may include a second pickup guide portion.

[0137] According to one embodiment of the present disclosure, the processor may be disposed inside the opening.

[0138] According to one embodiment of the present disclosure, an inspection hole may be formed in the corner area where the first part and the third part meet.

[0139] According to one embodiment of the present disclosure, a shielding member disposed to cover the inspection hole and the opening may be included.

[0140] The effects of the invention according to one embodiment of the present disclosure are as follows.

[0141] According to one embodiment of the present disclosure, by forming a pickup guide portion near the center of gravity of the shield can, the shield can can be prevented from lifting during the process of placing the shield can on a printed circuit board.

[0142] According to one embodiment of the present disclosure, the omission of a shielding member can be prevented through an inspection hole that can verify whether a shielding member is positioned.

[0143] In addition, various effects identified directly or indirectly through the present disclosure may be provided.

[0144] Methods according to the claims or embodiments described in the specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0145] When implemented in software, a computer-readable storage medium may be provided for storing one or more programs (software modules). One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to the claims or embodiments described in the specification of this disclosure.

[0146] Such programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, ROM (read-only memory), electrically erasable programmable read-only memory (EEPROM), magnetic disc storage devices, compact disc-ROMs (CD-ROMs), digital versatile discs (DVDs), or other forms of optical storage devices, magnetic cassettes. Alternatively, they may be stored in memory composed of some or all of these. Additionally, each constituent memory may include multiple units.

[0147] Additionally, the above program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, Intranet, LAN (local area network), WLAN (wide LAN), or SAN (storage area network), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present disclosure.

[0148] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0149] Additionally, in the present disclosure, terms such as “part,” “module,” etc. may be a hardware component, such as a processor or circuit, and / or a software component executed by a hardware component, such as a processor.

[0150] "Parts" and "modules" may be implemented by a program that is stored on an addressable storage medium and can be executed by a processor. For example, "parts" and "modules" may be implemented by components such as software components, object-oriented software components, class components, and task components, as well as by processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables.

[0151] The specific embodiments described in this disclosure are merely examples and do not limit the scope of this disclosure in any way. For the sake of brevity, descriptions of prior electronic configurations, control systems, software, and other functional aspects of said systems may be omitted.

[0152] Additionally, in the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, comprising only b, comprising only c, comprising a and b, comprising b and c, comprising a and c, or comprising all of a, b, and c.”

[0153] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof.

Claims

1. In an electronic device, Printed circuit board; A processor disposed on the above printed circuit board; A heat transfer member disposed to cover the above processor; and It includes a shield can disposed on the printed circuit board and having an opening corresponding to the heat transfer member, and The shield can is formed to have a first length in a first direction and to have a second length shorter than the first length in a second direction perpendicular to the first direction, and The above shield can is: An electronic device formed on one side of the shield can, comprising a first portion extending along the first direction, the first portion having a first width, a peripheral portion having a first width, and a pickup guide portion having a second width wider than the first width.

2. In Paragraph 1, It includes an application processor chipset including the above-mentioned processor, and The above processor includes at least one of a central processing unit or a graphic processing unit included in the application processor chipset, and The shield can above includes a second portion that extends in the first direction and is formed on the other side opposite to the one side, and An electronic device in which at least one of the central processing unit or the graphics processing unit is positioned closer to the second part than to the first part.

3. In Paragraph 1, An electronic device in which the portion of the first part above in which the pickup guide portion is formed protrudes toward the inside of the opening.

4. In Paragraph 1, An electronic device wherein the above pickup guide portion is positioned on the first portion of the shield can at a position corresponding to the center of gravity of the shield can.

5. In Paragraph 4, The shield can extends in the second direction and includes a third portion formed between the first portion and the second portion, An electronic device in which the distance between the first part and the center of gravity is shorter than the distance between the third part and the center of gravity.

6. In Paragraph 5, An electronic device having an inspection hole formed in the corner area where the first part and the third part intersect.

7. In Paragraph 6, An electronic device comprising a shielding member disposed to cover the opening and the inspection hole.

8. In Paragraph 6, An electronic device in which the corner region in which the inspection hole is formed extends toward the inside of the opening.

9. In Paragraph 1, The above pickup guide portion is formed to be segmented by at least one bridge portion, and An electronic device in which at least a portion of the above-mentioned pickup guide portion is removed as the at least one bridge portion is cut after the shield can is placed on the printed circuit board.

10. In an electronic device, Printed circuit board; A processor disposed on the above printed circuit board; A heat transfer member disposed to cover the above processor; and It includes a shield can disposed on the printed circuit board and having an opening corresponding to the heat transfer member, and The shield can is formed to have a first length in a first direction and to have a second length shorter than the first length in a second direction perpendicular to the first direction, and The above shield can is, A first portion formed on one side of the shield can and extending in the first direction; and It includes a second portion that extends in the first direction and is formed on the other side opposite to the one side, and An electronic device comprising a first connecting portion including a pickup guide portion, connecting the first portion and the second portion to cross the opening.

11. In Paragraph 10, The above shield can is, A third part extending in the second direction and formed between the first part and the second part; and It further includes a fourth part that extends in the second direction and is formed on the opposite side of the third part, and The above opening includes a first region between the third part and the first connecting part and a second region between the fourth part and the connecting part, and The above heat transfer member is an electronic device comprising a first heat transfer member corresponding to the first region and a second heat transfer member corresponding to the second region.

12. In Paragraph 11, The shield can further includes a second connecting portion connecting the first connecting portion and the third portion, and The second region is divided into a third region and a fourth region by the second connecting part, and An electronic device comprising a second heat transfer member, a third heat transfer member corresponding to the third region, and a fourth heat transfer member corresponding to the fourth region.

13. In Paragraph 10, The shield can further includes a first bridge portion between the first portion and the first connecting portion and a second bridge portion between the second portion and the first connecting portion, and An electronic device in which, after the shield can is placed on the printed circuit board, the connection portion is removed as the first bridge portion and the second bridge portion are cut.

14. In Paragraph 10, An electronic device having an inspection hole formed in the corner area where the first part and the third part intersect.

15. In electronic devices, Printed circuit board; A processor disposed on the above printed circuit board; A heat transfer member disposed to cover the above processor; and It includes a shield can disposed on the printed circuit board and having an opening corresponding to the heat transfer member, and The shield can is formed to have a first length in a first direction and to have a second length shorter than the first length in a second direction perpendicular to the first direction, and The above shield can is, It includes a first part and a second part extended in the first direction above, It extends in the second direction and includes a third part and a fourth part connecting the first part and the second part, and The above third part includes a first pickup guide part, and The above-mentioned fourth part is an electronic device including a second pickup guide part.

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