Atomization core, manufacturing method for atomization core, atomizer, and electronic atomization apparatus

Abstract

Embodiments of the present application provide an atomization core, a manufacturing method for the atomization core, an atomizer, and an electronic atomization apparatus. The atomization core comprises a substrate, a heating element, and a porous structural layer; the heating element is arranged on a flat surface of the substrate; the porous structural layer is arranged on the side of the substrate close to the heating element and is attached to the heating element so as to cover at least part of the region of the heating element; when the heating element is in an operating state, the heat flux density of the porous structural layer is greater than or equal to 1 W / mm2 and less than or equal to 8 W / mm2.

Description

Atomizer coil, atomizer coil manufacturing method, atomizer and electronic atomization device

[0001] Cross-reference to related applications

[0002] This application is based on and claims priority to Chinese Patent Application No. 2025102056264, filed on February 24, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of atomization technology, and in particular to an atomizing core, a method for manufacturing the atomizing core, an atomizer, and an electronic atomization device. Background Technology

[0004] Electronic atomizing devices atomize liquid into an aerosol for users to inhale. However, in related technologies, during operation, the atomizing coil of electronic atomizing devices cannot adequately wet the heating element with the atomizing liquid, resulting in poor liquid supply from the substrate to the heating element. This leads to the problem of scorching during inhalation and fails to produce a good inhalation experience. Summary of the Invention

[0005] This application aims to at least partially address one of the technical problems in the related art.

[0006] Therefore, the first aspect of this application provides an atomizing core, comprising:

[0007] The substrate has a flat surface;

[0008] A heating element disposed on the flat surface;

[0009] A porous structure layer is disposed on the side of the substrate near the heating element and is attached to the heating element to cover at least a portion of the heating element;

[0010] When the heating element is in operation, the heat flux density of the porous structure layer is greater than or equal to 1 W / mm². 2 And less than or equal to 8W / mm 2 .

[0011] In one embodiment, the substrate includes a first liquid supply region and a second liquid supply region, the heating element has a first atomizing region corresponding to the first liquid supply region and a second atomizing region corresponding to the second liquid supply region, and the porous structure layer is in contact with at least one of the first atomizing region and the second atomizing region.

[0012] In one embodiment, the porous structure layer includes a first covering area that is attached to the first atomizing area and a second covering area that is attached to the second atomizing area;

[0013] The thickness of the first coverage area is greater than the thickness of the second coverage area; and / or,

[0014] The porosity of the first covering area is greater than that of the second covering area; and / or,

[0015] The pore size of the first coverage area is larger than that of the second coverage area.

[0016] In one embodiment, the heat flux density of the first coverage area is greater than that of the second coverage area.

[0017] In one embodiment, the heating element is a mesh heating element, and the heat flux density of the first atomization zone is greater than the heat flux density of the second atomization zone;

[0018] The wire diameter of the first atomizing region is smaller than that of the second atomizing region; and / or,

[0019] The gap ratio of the first atomization zone is greater than that of the second atomization zone.

[0020] In one embodiment, the atomizing core further includes a control circuit electrically connected to the power supply assembly, wherein the first atomizing region and the second atomizing region are electrically connected to the power supply assembly through the same control circuit, and the resistances of the first atomizing region and the second atomizing region are different; or,

[0021] The atomizing core also includes a first control circuit and a second control circuit. The first atomizing area is electrically connected to the power supply component through the first control circuit, and the second atomizing area is electrically connected to the power supply component through the second control circuit.

[0022] In one embodiment, when the heating element is in the operating state, the heat flux density of the porous structure layer is greater than or equal to 2.5 W / mm². 2 And less than or equal to 6W / mm 2 ; and / or,

[0023] The porosity of the porous structure layer is greater than or equal to 40% and less than or equal to 80%; and / or,

[0024] The thermal conductivity of the porous structure layer is greater than or equal to 0.1 W / (m·K) and less than or equal to 10 W / (m·K).

[0025] In one embodiment, the substrate is a porous substrate, and the micropore diameter of the porous structure layer is smaller than the micropore diameter of the substrate; and / or,

[0026] The porosity of the porous structure layer is less than the porosity of the matrix; and / or,

[0027] The micropore diameter of the porous structure layer is greater than or equal to 5 μm and less than or equal to 100 μm.

[0028] In one embodiment, the micropore diameter of the substrate is greater than or equal to 20 μm and less than or equal to 60 μm; and / or,

[0029] The porosity of the matrix is ​​greater than or equal to 50% and less than or equal to 80%; and / or,

[0030] The thickness of the substrate is greater than or equal to 1 mm and less than or equal to 2 mm.

[0031] In one embodiment, when the heating element is in the operating state, the heat flux density of the heating element is greater than or equal to 1 W / mm². 2 And less than or equal to 8W / mm 2 ; and / or,

[0032] The heating element is made of at least one of stainless steel and iron-chromium-aluminum; and / or,

[0033] The thickness of the heating element is greater than or equal to 0.3 μm and less than or equal to 200 μm.

[0034] In one embodiment, the porous structure layer has a first upper surface on the side opposite to the substrate, and the heating element has a second upper surface on the side opposite to the substrate;

[0035] The first upper surface is flush with the second upper surface; or,

[0036] The first upper surface is located on the side of the second upper surface closer to the substrate; or,

[0037] The first upper surface is located on the side of the second upper surface that is away from the substrate.

[0038] In one embodiment, the porous structure layer has a first upper surface on the side opposite to the substrate, and the heating element has a second upper surface on the side opposite to the substrate;

[0039] The first upper surface is located on the side of the second upper surface closer to the substrate, and the distance between the first upper surface and the second upper surface is less than or equal to 20 μm; or,

[0040] The first upper surface is located on the side of the second upper surface away from the substrate, and the distance between the first upper surface and the second upper surface is less than or equal to 200 μm.

[0041] The second aspect of this application provides a method for manufacturing an atomizing core, for use in any of the atomizing cores described above, the manufacturing method comprising the following steps;

[0042] The heating element is disposed on the flat surface and sintered.

[0043] The porous structure layer is disposed on the side of the substrate near the heating element and covers at least a portion of the heating element, and is then sintered in a secondary manner.

[0044] A third aspect of this application provides an atomizer, which includes any of the atomizing cores described above.

[0045] A fourth aspect of this application provides an electronic atomizing device, which includes a power supply assembly and any of the atomizers described above, wherein the power supply assembly is electrically connected to the heating element.

[0046] This application provides an atomizing core, a method for manufacturing the atomizing core, an atomizer, and an electronic atomizing device. The atomizing core includes a substrate, a heating element, and a porous structure layer. The porous structure layer is disposed on the side of the substrate near the heating element and is attached to the heating element to cover at least a portion of the heating element. Because the porous structure layer has a porous structure, the porous effect or capillary effect of the porous structure layer facilitates the supply of atomizing liquid to the heating element, thereby confining the liquid film on the surface of the heating element. This improves the wetting effect of the atomizing liquid on the heating element, ensuring a sufficient liquid film at the heating element during atomization, reducing the problem of scorching during vaping, and producing a better vaping experience. Furthermore, when the heating element is in operation, the heat flux density of the porous structure layer is greater than or equal to 1 W / mm². 2 And less than or equal to 8W / mm 2 When the heating element is working, controlling the heat flux density of the porous structure layer within the above-mentioned range, and in conjunction with the covering effect of the porous structure layer, allows the heating element to generate sufficient evaporation, concentration, and splattering processes during atomization, resulting in better atomization of sweet and other flavor substances and greatly improving the atomization effect. Attached Figure Description

[0047] Figure 1 is a schematic diagram of the structure of an atomizing core according to an embodiment of this application;

[0048] Figure 2 is an exploded view of the atomizer core in Figure 1;

[0049] Figure 3 is a schematic diagram of the structure of an atomizing core according to another embodiment of this application;

[0050] Figure 4 is an exploded view of the atomizer core in Figure 3;

[0051] Figure 5 is a schematic diagram of the large droplet collection volume per mouth of the atomizing core under different heat flux densities in Figure 1.

[0052] Figure 6 is a flowchart of a method for manufacturing an atomizing core according to an embodiment of this application. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of this application, and are therefore only examples, and should not be used to limit the scope of protection of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0054] In the description of the embodiments of this application, technical terms such as "first," "second," and "third" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0055] One embodiment of this application provides an atomizing core, as shown in Figures 1 to 4. The atomizing core includes a substrate 10, a heating element 20, and a porous structure layer 30.

[0056] The substrate 10 has a flat surface 10a. The heating element 20 is disposed on the flat surface 10a.

[0057] The porous structure layer 30 is disposed on the side of the substrate 10 close to the heating element 20 and is attached to the heating element 20 to cover at least a portion of the heating element 20.

[0058] When the heating element 20 is in operation, the heat flux density of the porous structure layer 30 is greater than or equal to 1 W / mm². 2 And less than or equal to 8W / mm 2 .

[0059] Another embodiment of this application provides an atomizer, which includes the atomizing core described in any embodiment of this application.

[0060] Another embodiment of this application provides an electronic atomizing device, which includes a power supply assembly and an atomizer as described in any embodiment of this application. The power supply assembly is electrically connected to the heating element 20.

[0061] Specifically, the atomizing core is an atomizing component in an atomizer used to atomize the atomizing liquid to form an aerosol.

[0062] The substrate 10 can transfer the atomizing liquid, allowing the atomizing liquid in the oil tank of the atomizer to be transferred to the heating element 20, so that the heating element 20 can heat and atomize the atomizing liquid.

[0063] The heating element 20 is disposed on one side of the flat surface 10a of the substrate 10 for heating and atomizing the atomizing liquid supplied to the flat surface 10a.

[0064] The porous structure layer 30 is a structure layer with multiple micropores inside, and it is located on the same side of the substrate 10 as the heating element 20.

[0065] It should be noted that the porous structure layer 30 is attached to the heating element 20. Since the porous structure layer 30 has many micropores, it can form a porous effect or capillary effect, which can absorb the atomizing liquid to form an atomizing liquid film on the periphery of the heating element 20. Therefore, it can improve the wetting effect of the heating element 20, so as to facilitate the atomization of the heating element 20.

[0066] Depending on the actual situation, the porous structure layer 30 may cover the entire area of ​​the heating element 20 or only a part of the heating element 20.

[0067] For example, the heating element 20 includes an atomizing region and an electrode region, and the porous structure layer 30 covers at least a portion of the atomizing region, thereby reducing the size of the porous structure layer 30 while ensuring the wetting effect of the heating element 20.

[0068] Furthermore, depending on the actual situation, the porous structure layer 30 may only cover a portion of the atomization zone to meet the atomization requirements of different regions of the heating element 20 for different liquid film states.

[0069] Of course, the porous structure layer 30 can also cover the entire atomization zone to ensure that the entire heating element 20 is completely wetted with atomizing liquid. In the full power range of high and low power, it is not easy to have insufficient liquid supply. Not only is the atomization consumption ratio high and it is not easy to burn, but the porous thick liquid film state can produce more frying liquid and enhance the sweetness.

[0070] Furthermore, the porous structure layer 30 can be attached to the circumferential side surface of the heating element 20 to cover the circumferential side surface of the heating element 20, or it can be attached to the top surface of the heating element 20 (i.e., the side facing away from the substrate 10) to cover the top surface of the heating element 20, or it can be attached to both the circumferential side surface and the top surface of the heating element 20. Its arrangement can be determined according to the actual situation.

[0071] The specific material of the porous structure layer 30 can be determined according to the actual situation, such as porous ceramics.

[0072] The heating element 20 is in a working state where it is energized and heats up to atomize the atomized liquid.

[0073] By controlling the heat flux density of the porous structure layer 30 to 1 W / mm² when the heating element 20 is energized and heated. 2 ~8W / mm 2 Within the range, such as 1W / mm 2 2.5W / mm 2 3W / mm 2 4W / mm 2 5W / mm 2 6W / mm 2 7W / mm 2 and 8W / mm 2 It can improve the atomization effect and the smoking experience.

[0074] For example, when the heating element 20 is in operation, the heat flux density of the porous structure layer 30 is greater than or equal to 2.5 W / mm². 2 And less than or equal to 6W / mm 2 By controlling the heat flux density within the above range, the atomized liquid can produce more evaporation, concentration, and splattering effects, thereby further improving the smoking experience.

[0075] For example, please refer to Figure 5, at a heat flux density of 2.5 W / mm² 2 At that time, the collection volume of each large droplet was approximately 14 mg / puff. Furthermore, as the heat flux density gradually increases, the collection volume of large droplets can be gradually increased, resulting in better flammation effect.

[0076] In fact, in related technologies, to increase the power of the atomizing core, it is necessary to improve the liquid conduction capacity of the substrate, which poses a certain risk of leakage. Furthermore, due to the weak climbing ability of the atomizing liquid on the surface of the heating element, it is easy to have insufficient liquid supply, resulting in scorching. At the same time, due to the lack of a liquid film, there is no high-explosion liquid effect and the sweetness is low.

[0077] In the atomizing core of this application embodiment, on the one hand, since the porous structure layer 30 has a porous structure, the porous effect or capillary effect of the porous structure layer 30 facilitates the supply of atomizing liquid to the heating element 20, thereby confining the liquid film on the surface of the heating element 20. This improves the wetting effect of the atomizing liquid on the heating element 20, ensuring sufficient liquid film at the heating element 20 during atomization, reducing the problem of scorching during suction, and producing a better suction experience. On the other hand, when the heating element 20 is in working condition, the heat flux density of the porous structure layer 30 is greater than or equal to 1 W / mm². 2 And less than or equal to 8W / mm 2When the heating element 20 is working, the heat flux density of the porous structure layer 30 is controlled within the above-mentioned range. In conjunction with the covering effect of the porous structure layer 30, the heating element 20 can generate sufficient evaporation, concentration and splattering processes during atomization, resulting in better atomization of sweet and other flavor substances and greatly improving the atomization effect.

[0078] In fact, by setting a porous structure layer 30 and controlling the heat flux density of the porous structure layer 30 at 1W / mm², 2 ~8W / mm 2 Within a certain range, the liquid film around the heating element 20 can undergo high-temperature evaporation, overheating, and boiling processes, resulting in liquid film breakage and splattering, thus generating large-sized aerosol particles. Simultaneously, during evaporation, low-boiling components in the atomizing liquid evaporate first, while high-boiling components, such as sweeteners like neotame, are enriched in the porous structure layer 30. The aerosol generated during splattering consists of high-concentration droplet particles. Specifically, flavor molecules in the atomizing liquid are first released through high-temperature evaporation. The greater the superheat (temperature higher than the boiling point of the aroma), the higher the release efficiency and the better the aroma perception. Meanwhile, flavor substances in the atomizing liquid, such as sweetness, with boiling points higher than the atomization temperature, are difficult to evaporate and are present in large aerosol particles through liquid film splattering. Due to evaporation, the concentration of enriched flavor substances is higher, resulting in a higher concentration of flavor substances in the large droplets and better flavor perception. Therefore, this significantly improves the atomization effect and vaping experience.

[0079] In one embodiment, referring to Figures 3 and 4, the substrate 10 includes a first liquid supply region 11 and a second liquid supply region 12, the heating element 20 has a first atomizing region 21 corresponding to the first liquid supply region 11 and a second atomizing region 22 corresponding to the second liquid supply region 12, and the porous structure layer 30 is attached to at least one of the first atomizing region 21 and the second atomizing region 22.

[0080] Specifically, the first liquid supply zone 11 and the second liquid supply zone 12 are different liquid supply areas on the substrate 10, both of which can supply liquid to the heating element 20. The first atomization zone 21 and the second atomization zone 22 are different atomization areas on the heating element 20, both of which can atomize the atomized liquid to form an aerosol.

[0081] The first liquid supply zone 11 supplies liquid to the first atomizing zone 21, enabling the first atomizing zone 21 to atomize the liquid from the first liquid supply zone 11. The second liquid supply zone 12 supplies liquid to the second atomizing zone 22, enabling the second atomizing zone 22 to atomize the liquid from the second liquid supply zone 12. The substrate 10 and heating element 20, through partitioning, can achieve the purpose of atomizing different components of the atomizing liquid, or atomizing atomizing liquids with different components.

[0082] Depending on the actual situation, the porous structure layer 30 may only be attached to the first atomizing region 21 to cover part or all of the first atomizing region 21. Alternatively, it may only be attached to the second atomizing region 22 to cover part or all of the second atomizing region 22. Or it may be attached to both the first atomizing region 21 and the second atomizing region 22 to cover both.

[0083] Therefore, the atomization requirements of different atomization areas on a single heating element 20 can be met according to actual needs, such as different thicknesses of porous structure layer 30, different liquid film states, and different atomization temperature zones. This allows for the generation of different atomization states to meet the needs of different atomization conditions of different components in the atomizing liquid, resulting in better atomization effects and a richer and better taste of the aerosol.

[0084] In one embodiment, referring to Figures 3 and 4, the porous structure layer 30 includes a first covering region 31 that is attached to the first atomizing region 21, and a second covering region 32 that is attached to the second atomizing region 22. The thickness of the first covering region 31 is greater than the thickness of the second covering region 32. Therefore, by using different thicknesses of the covering regions, the atomization requirements of different atomizing regions on the thickness of the porous structure layer 30 can be better matched, thereby improving the atomization effect.

[0085] Specifically, the first coverage area 31 can cover part or all of the area of ​​the first atomizing area 21, and can form a liquid film around the periphery of the first atomizing area 21, thereby improving the atomization effect of the first atomizing area 21. The second coverage area 32 can cover part or all of the area of ​​the second atomizing area 22, and can form a liquid film around the periphery of the second atomizing area 22, thereby improving the atomization effect of the second atomizing area 22.

[0086] In one embodiment, referring to Figures 3 and 4, the porous structure layer 30 includes a first covering region 31 that is attached to the first atomizing region 21, and a second covering region 32 that is attached to the second atomizing region 22. The porosity of the first covering region 31 is greater than that of the second covering region 32. Therefore, by using different porosities in the covering regions, the atomization requirements of different atomizing regions on the porosity of the porous structure layer 30 can be better matched, thereby improving the atomization effect.

[0087] In fact, the specific porosity of the porous structure layer 30 can be determined according to the actual situation.

[0088] For example, the porosity of the porous structure layer 30 is greater than or equal to 40% and less than or equal to 80%. For example, 40%, 50%, 60%, 70%, or 80%. Using the above porosity can better facilitate the formation of a liquid film on the periphery of the heating element 20 by the porous structure layer 30, so as to facilitate atomization.

[0089] In one embodiment, referring to Figures 3 and 4, the porous structure layer 30 includes a first covering region 31 that is attached to the first atomizing region 21, and a second covering region 32 that is attached to the second atomizing region 22. The micropore diameter of the first covering region 31 is larger than that of the second covering region 32. Therefore, by using different micropore diameters in the covering regions, the atomization requirements of different atomizing regions on the micropore diameter of the porous structure layer 30 can be better matched, thereby improving the atomization effect.

[0090] In fact, the specific size of the micropores in the porous structure layer 30 can be determined according to the actual situation.

[0091] For example, the micropore diameter of the porous structure layer 30 is greater than or equal to 5 μm and less than or equal to 100 μm. Examples include 5 μm, 10 μm, 40 μm, 60 μm, 80 μm, or 100 μm. Using the aforementioned micropore diameter facilitates the formation of a liquid film around the heating element 20, thereby enabling atomization of the heating element 20.

[0092] In one embodiment, the heat flux density of the first coverage area 31 is greater than that of the second coverage area 32. Therefore, by using different heat flux densities, the atomization requirements of different atomization regions on the atomization temperature range can be better matched, thereby improving the atomization effect.

[0093] It should be noted that in some embodiments, the heat flux density and thickness of the first covering region 31 are both greater than those of the second covering region 32. That is, for the porous structure layer 30, the heat flux density of the thicker covering region is greater than that of the thinner covering region. This allows for a more sufficient concentration of the frying liquid in the thicker covering region, resulting in better atomization of sweet and other flavor substances. It also allows for a more sufficient evaporation process in the thinner covering region, resulting in better atomization of aroma substances.

[0094] For example, the first covering region 31 extends to the side of the heating element 20 away from the substrate 10, and the thickness of the region of the first covering region 31 on the side of the heating element 20 away from the substrate 10 is greater than or equal to 30 μm and less than or equal to 100 μm. For example, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, or 100 μm. Furthermore, the heat flux density of the first covering region 31 is greater than or equal to 3 W / mm². 2 And less than or equal to 5W / mm 2 Therefore, it is possible to effectively atomize the flavor substances in the atomizing liquid.

[0095] For example, the second covering region 32 extends to the side of the heating element 20 away from the substrate 10, and the thickness of the region of the second covering region 32 on the side of the heating element 20 away from the substrate 10 is less than or equal to 50 μm, such as 100 μm, 20 μm, 30 μm, 40 μm, or 50 μm. Furthermore, the heat flux density of the second covering region 32 is greater than or equal to 2 W / mm². 2 And less than or equal to 4W / mm 2 Therefore, it is possible to effectively atomize the aroma substances in the atomizing liquid.

[0096] For example, the second covering area 32 is located on the side of the heating element 20 closest to the substrate 10, and the distance between the side of the second covering area 32 facing away from the substrate 10 and the side of the heating element 20 facing away from the substrate 10 is less than or equal to 20 μm and greater than or equal to 0 μm. Therefore, the aroma substances in the atomizing liquid can be atomized more effectively.

[0097] In some embodiments, the heat flux density and porosity of the first covering region 31 are both greater than those of the second covering region 32. That is, the heat flux density needs to be matched with the liquid supply. Regions with higher porosity have higher heat flux, which can increase the amount of liquid to be dispensed and produce larger droplet aerosols, resulting in better atomization.

[0098] In some embodiments, the heat flux density and micropore size of the first covering region 31 are both greater than those of the second covering region 32. This also allows for a greater volume of liquid to be deposited and larger droplet aerosols, resulting in better atomization.

[0099] In some embodiments, the structural shape of the heating element 20 may be matched with the heat flux density to meet atomization requirements.

[0100] For example, the heating element 20 is a mesh heating element, the heat flux density of the first atomization zone 21 is greater than that of the second atomization zone 22, and the wire diameter of the first atomization zone 21 is smaller than that of the second atomization zone 22. This allows for an increase in the amount of frying liquid, thereby improving the atomization effect.

[0101] The wire diameter of the heating element 20 is the diameter of the wire body of the heating element 20.

[0102] For example, the heating element 20 is a mesh heating element. The heat flux density of the first atomization zone 21 is greater than that of the second atomization zone 22, and the gap ratio of the first atomization zone 21 is greater than that of the second atomization zone 22. In fact, per unit volume, the heating element 20 of the first atomization zone 21 has a smaller area, a larger gap ratio, and a higher matching heat flux density, which can increase the amount of frying liquid and improve the atomization effect.

[0103] In one embodiment, the atomizing core further includes a control circuit electrically connected to the power supply component. The first atomizing region 21 and the second atomizing region 22 are electrically connected to the power supply component through the same control circuit, and the resistances of the first atomizing region 21 and the second atomizing region 22 are different. That is, when each atomizing region of the heating element 20 is electrically connected to the power supply component through the same line, the heat flux density of the first atomizing region 21 and the second atomizing region 22 can be changed by using different resistances, thereby matching the different atomization requirements of different atomizing regions.

[0104] Depending on the actual situation, the first atomization zone 21 and the second atomization zone 22 can be connected in series or in parallel.

[0105] In one embodiment, the atomizing core further includes a first control circuit and a second control circuit. The first atomizing region 21 is electrically connected to the power supply component through the first control circuit, and the second atomizing region 22 is electrically connected to the power supply component through the second control circuit. That is, each atomizing region of the heating element 20 is electrically connected to the power supply component using a different control circuit. Since each control circuit is independent of the others, the heat flux density of each atomizing region can be changed by adjusting the power.

[0106] In one embodiment, the thermal conductivity of the porous structure layer 30 is greater than or equal to 0.1 W / (m·K) and less than or equal to 10 W / (m·K). Examples include 0.1 W / (m·K), 1 W / (m·K), 4 W / (m·K), 8 W / (m·K), or 10 W / (m·K). The porous structure layer 30, with its aforementioned thermal conductivity, facilitates better heat transfer, thereby enabling the heating element 20 to atomize the atomized liquid.

[0107] In one embodiment, the substrate 10 is a porous substrate 10, and the micropore diameter of the porous structure layer 30 is smaller than the micropore diameter of the substrate 10. It should be noted that the substrate 10 also has a structure with multiple micropores. When the micropore diameter of the porous structure layer 30 is lower than the micropore diameter of the substrate 10, the atomizing liquid transmitted from the substrate 10 can be confined in the porous structure layer 30 to form a liquid-locking structure, which can prevent leakage and fully utilize the high liquid conductivity of the large-pore porous substrate 10 to improve the atomization power range.

[0108] In one embodiment, the porosity of the porous structure layer 30 is less than that of the substrate 10. That is, when the porosity of the porous structure layer 30 is lower than that of the substrate 10, the atomizing liquid transported from the substrate 10 can also be confined within the porous structure layer 30 to form a liquid-locking structure, which can prevent leakage and fully utilize the high liquid conductivity of the large-pore porous substrate 10 to improve the atomization power range.

[0109] In fact, by using a porous structure layer 30 with a porosity and / or a micropore diameter smaller than that of the substrate 10, it is easy to achieve high-power atomization of the atomizer core (such as 10W to 50W), while the oil tank capacity of the atomizer can be further increased without easily leaking.

[0110] It should be noted that the micropore size and porosity of the matrix 10 can be set according to the actual situation.

[0111] For example, the micropore diameter of the substrate 10 is greater than or equal to 20 μm and less than or equal to 60 μm, such as 20 μm, 30 μm, 40 μm, 50 μm, or 60 μm. This allows for better liquid supply.

[0112] For example, the porosity of the matrix 10 is greater than or equal to 50% and less than or equal to 80%, such as 50%, 60%, 70%, or 80%. This provides a better liquid supply effect.

[0113] The thickness of the substrate 10 can also be set according to the actual situation.

[0114] For example, the thickness of the substrate 10 is greater than or equal to 1 mm and less than or equal to 2 mm, such as 1 mm, 1.5 mm, or 2 mm. This provides a better liquid supply effect. It should be noted that the thickness of the substrate 10 needs to be related to the required liquid supply; that is, when the micropore diameter and porosity are constant, the substrate 10 needs to be thinner to have a stronger liquid supply capacity.

[0115] In one embodiment, when the heating element 20 is in operation, the heat flux density of the heating element 20 is greater than or equal to 1 W / mm². 2 And less than or equal to 8W / mm 2 For example, 1W / mm 2 2.5W / mm 2 3W / mm 2 4W / mm 2 5W / mm 2 6W / mm 2 7W / mm 2 and 8W / mm 2 The atomization effect and sucking taste can be improved by dividing the power applied to the heating element 20 by the surface area of ​​the heating element 20.

[0116] The heat flow of the heating element 20 can be uniform across the entire surface, or it can be distributed in a way that allows for localized high heat flow and localized low heat flow.

[0117] The material and thickness of the heating element 20 are not limited.

[0118] For example, the heating element 20 may be made of at least one of stainless steel and iron-chromium-aluminum. Of course, it may also be made of other conductive materials, or a combination of the above materials.

[0119] For example, the thickness of the heating element 20 is greater than or equal to 0.3 μm and less than or equal to 200 μm. Examples include 0.3 μm, 1 μm, 10 μm, 50 μm, 100 μm, 150 μm, or 200 μm. This results in a better atomization effect.

[0120] The positional relationship between the porous structure layer 30 and the heating element 20 can be set according to the actual situation.

[0121] For example, referring to Figures 1 and 2, the porous structure layer 30 has a first upper surface 30a on the side facing away from the substrate 10, and the heating element 20 has a second upper surface 20a on the side facing away from the substrate 10. The first upper surface 30a and the second upper surface 20a are flush. That is, the porous structure layer 30 and the heating element 20 are flush with each other on the side facing away from the substrate 10, and the distance between the first upper surface 30a and the second upper surface 20a is 0, meaning they are both in the same plane.

[0122] For example, the porous structure layer 30 has a first upper surface 30a on the side facing away from the substrate 10, and the heating element 20 has a second upper surface 20a on the side facing away from the substrate 10. The first upper surface 30a is located on the side of the second upper surface 20a closer to the substrate 10. In other words, the porous structure layer 30 is entirely located on the side of the heating element 20 closer to the substrate 10, which can meet the requirement of covering part of the heating element 20.

[0123] It should be noted that when the first upper surface 30a is located on the side of the second upper surface 20a that is close to the substrate 10, the distance between the two should not be too large, so as to avoid affecting the formation of the liquid film.

[0124] For example, the first upper surface 30a is located on the side of the second upper surface 20a closer to the substrate 10, and the distance between the first upper surface 30a and the second upper surface 20a is less than or equal to 20 μm, such as 1 μm, 5 μm, 10 μm, 15 μm, or 20 μm. This ensures better formation of the liquid film.

[0125] For example, the porous structure layer 30 has a first upper surface 30a on the side facing away from the substrate 10, and the heating element 20 has a second upper surface 20a on the side facing away from the substrate 10. The first upper surface 30a is located on the side of the second upper surface 20a facing away from the substrate 10. In other words, a portion of the porous structure layer 30 extends to the side of the heating element 20 facing away from the substrate 10, which can meet the need to cover more areas of the heating element 20, so as to form as much liquid film as possible around the heating element 20, thereby improving the atomization effect.

[0126] It should be noted that when the first upper surface 30a is located on the side of the second upper surface 20a away from the base 10, the distance between the two should not be too large in order to reduce the structural size.

[0127] For example, the first upper surface 30a is located on the side of the second upper surface 20a away from the substrate 10, and the distance between the first upper surface 30a and the second upper surface 20a is less than or equal to 200 μm, such as 10 μm, 50 μm, 100 μm, 150 μm, or 200 μm. This facilitates the atomization of the heating element 20.

[0128] Another embodiment of this application provides a method for manufacturing an atomizer core, which is used for the atomizer core described in any embodiment of this application. Please refer to FIG6. The manufacturing method includes the following steps:

[0129] Step S1: Place the heating element 20 on the flat surface 10a and sinter it.

[0130] Step S2: The porous structure layer 30 is disposed on the side of the substrate 10 near the heating element 20 and covers at least a portion of the heating element 20, and then sintered in a second stage.

[0131] Specifically, step S2 follows step S1, and the atomizing core is formed using a two-step sintering process. First, the heating element 20 is placed on the substrate 10, thus achieving a single-step sintering process. At this point, the heating element 20 and the substrate 10 are tightly and firmly bonded together, without any cracks or gaps. Then, a porous structure layer 30 is fabricated on the surface of the heating element 20, covering it, and a second sintering process is performed. At this point, the heating element 20 is tightly and firmly bonded to the substrate 10, reducing the cracking problem caused by the large difference in thermal expansion coefficients between the heating element 20 and the substrate 10. This allows the porous structure layer 30, the substrate 10, and the heating element 20 to form a stable heating element 20.

[0132] In the description of this application, the references to terms such as "in one embodiment," "in some embodiments," "in a specific embodiment," or "exemplary," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the embodiments of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine the different embodiments or examples described in this application, as well as the features of the different embodiments or examples.

[0133] The above are merely preferred embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the protection scope of this application.

Claims

1. An atomizing core, comprising: The substrate has a flat surface; A heating element disposed on the flat surface; A porous structure layer is disposed on the side of the substrate near the heating element and is attached to the heating element to cover at least a portion of the heating element; When the heating element is in operation, the heat flux density of the porous structure layer is greater than or equal to 1 W / mm². 2 And less than or equal to 8W / mm 2 .

2. The atomizing core according to claim 1, wherein the substrate includes a first liquid supply area and a second liquid supply area, the heating element has a first atomizing area corresponding to the first liquid supply area and a second atomizing area corresponding to the second liquid supply area, and the porous structure layer is in contact with at least one of the first atomizing area and the second atomizing area.

3. The atomizing core according to claim 2, wherein the porous structure layer includes a first covering area that is attached to the first atomizing area and a second covering area that is attached to the second atomizing area; The thickness of the first coverage area is greater than the thickness of the second coverage area; and / or, The porosity of the first covering area is greater than that of the second covering area; and / or, The pore size of the first coverage area is larger than that of the second coverage area.

4. The atomizing core according to claim 3, wherein the heat flux density of the first coverage area is greater than the heat flux density of the second coverage area.

5. The atomizing core according to any one of claims 2-4, wherein the heating element is a mesh heating element, and the heat flux density of the first atomizing region is greater than the heat flux density of the second atomizing region; The wire diameter of the first atomizing region is smaller than that of the second atomizing region; and / or, The gap ratio of the first atomization zone is greater than that of the second atomization zone.

6. The atomizing core according to any one of claims 2-4, wherein the atomizing core further comprises a control circuit electrically connected to the power supply assembly, the first atomizing region and the second atomizing region being electrically connected to the power supply assembly through the same control circuit, and the resistances of the first atomizing region and the second atomizing region being different; or, The atomizing core also includes a first control circuit and a second control circuit. The first atomizing area is electrically connected to the power supply component through the first control circuit, and the second atomizing area is electrically connected to the power supply component through the second control circuit.

7. The atomizing core according to any one of claims 1-4, wherein when the heating element is in the operating state, the heat flux density of the porous structure layer is greater than or equal to 2.5 W / mm². 2 And less than or equal to 6W / mm 2 ; and / or, The porosity of the porous structure layer is greater than or equal to 40% and less than or equal to 80%; and / or, The thermal conductivity of the porous structure layer is greater than or equal to 0.1 W / (m·K) and less than or equal to 10 W / (m·K).

8. The atomizing core according to any one of claims 1-4, wherein the substrate is a porous substrate, and the micropore diameter of the porous structure layer is smaller than the micropore diameter of the substrate; and / or, The porosity of the porous structure layer is less than the porosity of the matrix; and / or, The micropore diameter of the porous structure layer is greater than or equal to 5 μm and less than or equal to 100 μm.

9. The atomizing core according to any one of claims 1-4, wherein the micropore diameter of the substrate is greater than or equal to 20 μm and less than or equal to 60 μm; and / or, The porosity of the matrix is ​​greater than or equal to 50% and less than or equal to 80%; and / or, The thickness of the substrate is greater than or equal to 1 mm and less than or equal to 2 mm.

10. The atomizing core according to any one of claims 1-4, wherein when the heating element is in the operating state, the heat flux density of the heating element is greater than or equal to 1 W / mm². 2 And less than or equal to 8W / mm 2 ; and / or, The heating element is made of at least one of stainless steel and iron-chromium-aluminum; and / or, The thickness of the heating element is greater than or equal to 0.3 μm and less than or equal to 200 μm.

11. The atomizing core according to any one of claims 1-4, wherein the porous structure layer has a first upper surface on the side opposite to the substrate, and the heating element has a second upper surface on the side opposite to the substrate; The first upper surface is flush with the second upper surface; or, The first upper surface is located on the side of the second upper surface closer to the substrate; or, The first upper surface is located on the side of the second upper surface that is away from the substrate.

12. The atomizing core according to any one of claims 1-4, wherein the porous structure layer has a first upper surface on the side opposite to the substrate, and the heating element has a second upper surface on the side opposite to the substrate; The first upper surface is located on the side of the second upper surface closer to the substrate, and the distance between the first upper surface and the second upper surface is less than or equal to 20 μm; or, The first upper surface is located on the side of the second upper surface away from the substrate, and the distance between the first upper surface and the second upper surface is less than or equal to 200 μm.

13. A method for manufacturing an atomizing core, for use in the atomizing core according to any one of claims 1-12, the manufacturing method comprising the following steps: The heating element is disposed on the flat surface and sintered. The porous structure layer is disposed on the side of the substrate near the heating element and covers at least a portion of the heating element, and is then sintered in a secondary manner.

14. An atomizer comprising the atomizing core according to any one of claims 1-12.

15. An electronic atomizing device, the electronic atomizing device comprising a power supply assembly and the atomizer of claim 14, the power supply assembly being electrically connected to the heating element.

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