Contact unit, contact system, and method for assembling the contact system
Patent Information
- Application Number
- PCT/EP2026/054393
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-20
- Filing Date
- 2026-02-18
- Publication Date
- 2026-08-27
Smart Images
Figure EP2026054393_27082026_PF_FP_ABST
Abstract
Description
[0001] TE Connectivity Solutions GmbH AMP19311PC 1
[0002] Description
[0003] Contact unit, contact system, and method for assembling the contact system
[0004] The invention relates to a contact unit according to Patent Claim 1, to a contact system according to Patent Claim 8, and to a method for assembling the contact system according to Patent Claim 12.
[0005] Known from WO 2023 / 078917 is a plug connector, a plug connector assembly, as well as a tool and a method for assembling the plug connector assembly.
[0006] It is an object of the invention to provide an improved contact unit, an improved contact system and an improved method for assembling the contact system.
[0007] This object is achieved by means of a contact unit according to Patent Claim 1 , by a contact system according to Patent Claim 8, and by a method according to Patent Claim 12. Advantageous embodiments are set forth in the dependent claims.
[0008] It has been recognized that an improved contact unit can be provided in that the contact unit for contacting a flexible circuit film has a housing which encloses a housing interior and has a contact housing part, and a contact assembly which has at least one contact element disposed in a row of contacts. The contact element extends along a plug-in axis. The contact element has at least one blade assembly, a first solder portion which is disposed opposite the blade assembly, and a connecting portion which is disposed between the first solder portion and the blade assembly. The contact housing part has a base portion and a first opening assembly which is disposed on the base portion and has at least one contact opening. The connecting portion bears on the base portion on a side that faces the blade assembly. The first solder portion penetrates the contact opening and protrudes along the plug-in axis beyond the base portion on a side that faces away from the blade assembly. The first solder portion has a first solder pad.
[0009] This design embodiment has the advantage that the contact unit can at the first solder pad be soldered, for example by a reflow soldering method, directly to an assigned first solder contact pad of a printed circuit board.TE Connectivity Solutions GmbH AMP19311PC 2
[0010] Furthermore, owing to the solder pad the contact unit is of a particularly compact construction and has a small installation space requirement, in particular along the plug-in axis.
[0011] Furthermore, an assigned first conductor path of the flexible circuit film can be easily contacted by means of the blade assembly. In particular, each of the contact elements can electrically contact the respectively assigned first conductor path of the flexible circuit film in such a way that the assigned first conductor path of the flexible circuit film is electrically connected directly to the assigned first solder contact pad of the printed circuit board by way of the first solder pad and the contact element. As a result, an electrical resistance between the first conductor path and the printed circuit board is reduced.
[0012] In a further embodiment, the contact element has a second solder portion, wherein the connecting portion is connected to the second solder portion on a side that faces away from the blade assembly. The second solder portion is disposed on the connecting portion so as to be offset from the first solder portion. The second solder portion has a second solder pad. The contact element can likewise be soldered on the second solder pad and be connected to a second solder contact pad of the printed circuit board. This design embodiment has the advantage that two solder contact pads of the printed circuit board can be contacted by means of the contact element. Furthermore, owing to this fact the contact element is particularly well connected mechanically to the printed circuit board in such a way that tilting or unintentional releasing of the contact element from the printed circuit board can be avoided, in particular when the contact unit is under flexural stress.
[0013] In a further embodiment, the contact housing part has at least one first housing support element, wherein the first housing support element is disposed on the base portion and extends away from the base portion on a side that faces away from the blade assembly. The first housing support element has a first housing support face on a side that faces away from the blade assembly. On the housing support face, the contact housing part can bear on a printed circuit board lateral face, and in this way forces, in particular flexural forces, can be dissipated from the contact unit by way of the housing support element and the housing support face, so as to mechanically destress the soldered connection.
[0014] In a further embodiment, the contact housing part has at least one centring pin, wherein the centring pin is disposed on the base portion and extends away from the base portion so as to face away from the blade assembly. The centring pin is disposed so as to be offset from the contact assembly. For example, the centring pin can engage in a centring receptacle ofTE Connectivity Solutions GmbH AMP19311PC 3
[0015] the printed circuit board in such a way that, as a result of the engagement, the contact unit is aligned in a defined manner with respect to the printed circuit board.
[0016] In a further embodiment, the first solder portion is configured to be board-shaped. The first solder pad is configured to be substantially planar or convex. This design embodiment has the advantage that the contact unit is disposed on the printed circuit board in particular by means of a reflow soldering method, in particular in a SMT construction mode.
[0017] In a further embodiment, the first solder portion is configured to be pin-shaped and extends along the plug-in axis. The first solder pad is disposed so as to be circumferential on the first solder portion. This design embodiment has the advantage that in particular the solder portion can be inserted into the printed circuit board through a passage opening, this enabling a THT construction mode.
[0018] In a further embodiment, the housing has a film housing part, wherein the film housing part is disposed on the contact housing part on a side that faces away from the base portion. The contact housing part and the film housing part engage in one another and enclose the housing interior at least in portions. The film housing part has in the housing interior a receptacle space and a film passage opening that opens into the receptacle space. Furthermore, the film housing part and the contact housing part are disposed so as to be displaceable relative to one another along the plug-in axis, between an assembly position and a contact position, wherein in the contact position the blade assembly protrudes into the receptacle space. As a result, in the assembled state of the contact unit, the respectively assigned conductor path is contacted by the blade assembly in the contact position.
[0019] An improved contact system can be provided in that the contact system has the abovedescribed contact unit, a printed circuit board and a flexible circuit film. The circuit film has at least one first conductor path assembly with at least one first conductor path. The printed circuit board has at least one second conductor path assembly with a first solder contact pad. The first solder pad of the first solder portion of the contact element and the first solder contact pad of the second conductor path assembly are soldered. The flexible circuit film is at least in portions disposed in the housing interior, wherein the first blade element of the blade assembly penetrates the flexible circuit film at least in portions and electrically contacts the first conductor path. The contact element is configured to be electrically conductive and connects the first conductor path electrically to the first solder contact pad of the second conductor path assembly.TE Connectivity Solutions GmbH AMP19311PC 4
[0020] This design embodiment has the advantage that a direct connection between the first conductor path of the flexible circuit film and the first solder contact pad of the second conductor path assembly is established via the contact element, a transition resistance between the first solder contact pad and the first conductor path therefore being particularly minor. As a result, a data signal, for example of a temperature sensor, can be particularly well transmitted, and / or a voltage signal can be transmitted with particularly minor losses.
[0021] In a further embodiment, the first solder contact pad of the second conductor path assembly of the printed circuit board and the first solder pad are aligned so as to be substantially mutually parallel. This design embodiment has the advantage that, for example by means of a reflow soldering method in the context of a SMD construction mode, the contact unit is fastened to the printed circuit board in order to connect the flexible circuit film both mechanically and electrically to the printed circuit board, the latter being of a stiff configuration.
[0022] In a further embodiment, the printed circuit board has a first contact receptacle, wherein the first solder portion engages in the first contact receptacle, in particular penetrating the latter. The first solder contact pad is disposed on the first contact receptacle. This design embodiment has the advantage that the contact unit can be assembled and soldered on the printed circuit board, for example in the context of through-hole technology (THT), so as to be fastened as a THW component to the printed circuit board. This design embodiment has in particular the advantage that the second conductor path assembly can be disposed opposite the contact unit on the printed circuit board, and through-contact is enabled by way of the board opening.
[0023] In a further embodiment, the printed circuit board has a printed circuit board lateral face which faces the contact unit. The housing support face of the first housing support element bears on the printed circuit board lateral face. This design embodiment has the advantage that a shear stress on the soldered connection between the first solder pad and the solder contact pad can be avoided by supporting a force between the housing support element and the printed circuit board. The printed circuit board here is particularly advantageously of a stiff configuration and can comprise, for example, a glass fibre-reinforced material as the carrier material. Owing to the support, the force can be transmitted into the printed circuit board substantially by way of the housing support face instead of the soldered connection and be support on the housing support face.TE Connectivity Solutions GmbH AMP19311PC 5
[0024] An improved method for assembling the above-described contact system can be provided in that a flexible circuit film, a printed circuit board and the above-described contact unit are provided. The first solder pad of the first solder portion of the contact element and the first solder contact pad of the second solder path assembly are soldered. The flexible circuit film is at least in portions disposed in the housing interior. In particular, the flexible circuit film can in the process preferably be guided completely through the housing interior. The first blade element is pushed through the flexible circuit film in such a way that it penetrates the flexible circuit film and electrically contacts the first conductor path. The first contact element connects the first conductor path electrically to the first solder contact pad of the second conductor path assembly. This design embodiment has the advantage that, by means of the above-described contact unit and the assembly method, particularly few assembly steps are required for linking the flexible circuit film to the printed circuit board, such that the contact system can be produced particularly easily and rapidly as a result.
[0025] For example, it is particularly advantageous when the specified assembly steps are carried out in the chronological order stated.
[0026] The invention will be explained in more detail hereunder by means of figures in which:
[0027] Figure 1A shows a perspective illustration of a contact system according to a first embodiment, with a contact unit in a contact position;
[0028] Figure 1 B shows a perspective illustration of the contact system shown in Figure 1 , with the contact unit in an assembly position;
[0029] Figure 2 shows a sectional view along a section plane A-A shown in Figure 1A through the contact system shown in Figure 1A;
[0030] Figure 3 shows a perspective illustration of the contact housing part of the contact unit shown in Figures 1A to 2;
[0031] Figure 4 shows a view from below of the contact housing part shown in Figure 3;
[0032] Figure 5 shows a sectional view along a section plane B-B shown in Figure 3 through the contact housing part shown in Figure 3;
[0033] Figure 6 shows a perspective illustration of a partially assembled contact unit;TE Connectivity Solutions GmbH AMP19311PC
[0034] Figure 7 shows a lateral view onto the contact element shown in Figure 6;
[0035] Figure 8 shows a lateral view onto the contact element shown in Figure 2 in the contact position;
[0036] Figure 9 shows a perspective illustration of the film housing part;
[0037] Figure 10 shows a sectional view along a section plane C-C shown in Figure 9 through the film housing part;
[0038] Figure 11 shows a sectional view along a section plane D-D shown in Figure 9 through the film housing part;
[0039] Figure 12 shows a sectional view along the section plane A-A shown in Figure 1A of the contact system 10, in a partially assembled state;
[0040] Figure 13 shows a sectional view along the section plane D-D shown in Figure 9 through the contact system, in the assembled position of the contact unit;
[0041] Figure 14 shows a perspective illustration of a contact unit of the contact system according to a second embodiment;
[0042] Figure 15 shows a lateral view of the contact element shown in Figure 14; and
[0043] Figure 16 shows a perspective illustration of the contact unit shown in Figures 14 and 15 of the contact system according to the second embodiment.
[0044] For better understanding, reference is made to a coordinate system in the figures hereunder. The coordinate system has an x-axis, a y-axis and a z-axis. By way of example, the coordinate system is configured as a right-hand system.
[0045] Figure 1A shows a perspective illustration of a contact system 10 according to a first embodiment, with a contact unit 15 in a contact position, and Figure 1B shows a perspective illustration of the contact system 10 shown in Figure 1, with the contact unit 15 in an assembly position.TE Connectivity Solutions GmbH AMP19311PC 7
[0046] Figures 1A and 1B will be explained conjointly hereunder.
[0047] Apart from the contact unit 15 and the contact element 70, the contact system 10 has a flexible circuit film 20. In the contact position, the contact unit 15 is connected to the flexible circuit film 20 and contacts the flexible circuit film 20 (cf. Figure 1A). In the assembly position, the flexible circuit film 20 is introduced into the contact unit 15, or has been removed from the contact unit 15 (Figure 1B).
[0048] The flexible circuit film 20 has at least one first carrier layer 25 and one first conductor path assembly 30. The first conductor path assembly 30 has at least one electrically conductive first conductor path 35. In the embodiment, a plurality of first conductor paths 35 are by way of example disposed so as to be mutually parallel along the x-axis. Here, each of the first conductor paths 35 extends along the x-axis, for example, and is disposed so as to be spaced apart at a path spacing b from the respectively closest first conductor path 35. The first conductor paths 35 are embedded in the first carrier layer 25 and are electrically isolated from one another by the first carrier layer 25. In particular, the first conductor paths 35 are isolated not only along the x-axis but also in the y-direction so as to also be isolated in relation to an environment by the first carrier layer 25.
[0049] The first conductor path 35 is produced, for example, from an electrically conductive material, for example copper. For example, the first conductor path 35 can be configured to transmit a signal, for example a data signal, for example of a temperature sensor, or to transmit a voltage signal or an electrical output.
[0050] The conductor path assembly 30 is disposed, in particular embedded, in the first carrier layer 25. Due to the flexible design embodiment of the first carrier layer 25, the flexible circuit film 20 can be reversibly bent in a non-destructive manner at least 10 to 1000 times about an angle of 30° to 300°. The flexible circuit film 20 is configured in the manner of a film and, in particular in the region of the contact unit 15, can extend so as to be substantially planar in a plane, for example the x-z plane.
[0051] The contact unit 15 has a housing 60 and a contact assembly 65 with a plurality of contact elements 70 which are disposed so as to be mutually spaced apart in the x-direction, for example. A number of contact elements 70 of the contact assembly 65 preferably corresponds to a number of first conductor paths 35 of the flexible circuit film 20. For example in Figures 1 A and 1 B, each of the first conductor paths 35 is electrically connectedTE Connectivity Solutions GmbH AMP19311PC 8
[0052] by means of one of the contact elements 70 and contacts the assigned first conductor path 35 in the contact position (cf. Figure 1A).
[0053] The electrically isolating housing 60 has a contact housing part 75 and a film housing part 80. The contact housing part 75 and the film housing part 80 engage in one another in the assembly position as well as in the contact position. In order to be transferred between the assembly position (cf. Figure 1B) and the contact position (cf. Figure 1A), the film housing part 80 and the contact housing part 75 can be moved along a plug-in axis 115. The plugin axis 115 extends parallel to the y-axis, for example, and is preferably aligned so as to be inclined, in particular perpendicular, to the flexible circuit film 20 in the region of the contact unit 15. In particular, a normal vector of the flexible circuit film 20 can extend along the plugin axis 115 on the contact unit 15.
[0054] In the contact position (cf. Figure 1A), the film housing part 80 and the contact housing part 75 are furthermore connected to one another in a form-fitting manner. The form-fitting connection 85 can be configured as a latching connection, for example. Additionally, a further form-fitting connection 86 can be provided (cf. Figure 1B), wherein in the further form-fitting connection 86 the film housing part 80 is held in the assembly position and the form-fitting connection 85 is unlocked. The further form-fitting connection 86 is unlocked in the contact position, for example.
[0055] Figure 2 shows a sectional view along a section plane A-A shown in Figure 1A through the contact system 10 shown in Figure 1A.
[0056] The printed circuit board 21 has, for example, a second carrier layer 40. The second carrier layer 40 is configured to be stiff in relation to the first carrier layer 25 of the flexible circuit film 20 and can be configured, for example, as hard paper or as fibre-reinforced plastics material. In particular, a wall thickness of the second carrier layer 40 is also significantly increased in relation to a material thickness of the first carrier layer 25 of the flexible circuit film 20.
[0057] The printed circuit board 21 has a second conductor path assembly 45 on the second carrier layer 40, wherein the second conductor path assembly 45 is indicated in Figure 2. The second conductor path assembly 45 has at least one second conductor path 50. In the embodiment, the second conductor path assembly 45 is disposed, for example, on a printed circuit board lateral face 55 that faces the contact unit 15. The printed circuit board lateralTE Connectivity Solutions GmbH AMP19311PC 9
[0058] face 55 here can be configured to be planar, for example, and extend substantially in an x-z plane.
[0059] The second conductor path assembly 45 has a first solder contact pad 56 on the side that faces the contact unit 15. The first solder contact pad 56 can be configured to be planar, for example, and is electrically connected to the second conductor path 55. Additionally, the second conductor path assembly 45 can have a second solder contact pad 57. The second solder contact pad 57 is electrically connected to the assigned second conductor path 50. The connection to the second conductor path 50 can be configured on the first solder contact pad 56 and / or on the second solder contact pad 57 in such a manner that the second conductor path 50 is guided towards the corresponding solder contact pad 56, 57.
[0060] In the embodiment, the second conductor path assembly 45 has for each contact element 70 in each case at least the first solder contact pad 56 and preferably the second solder contact pad 57.
[0061] The contact housing part 75 of the housing 60 faces the printed circuit board 21, and the film housing part 80 is disposed on the contact housing part 75 so as to face away from the printed circuit board 21. The housing 60 encloses a housing interior 130.
[0062] The contact housing part 75 has a base portion 95, wherein the base portion 95 extends substantially in an x-z plane and is aligned, for example, parallel to the second carrier layer 40. Laterally, the contact housing part 75 has a housing wall 100, wherein the housing wall 100 extends away from the base portion 95 in the direction of the film housing part 80, thus in a direction that faces away from the printed circuit board 21.
[0063] In the base portion 95, the contact housing part 75 has a first opening assembly 105 with at least one contact opening 110. The contact opening 110 is configured as a passage opening in the base portion 95 and extends substantially in the y-direction. The contact opening 110 here is disposed so as to be spaced apart from the housing wall 100, for example. The contact opening 110 can be configured in the form of a slot and opens out into the housing interior 130.
[0064] On a side that faces away from the first opening assembly 105, the contact housing part 75 has a first housing opening 116 which is disposed on the housing wall 100. A first housing interior portion 135 here extends between the contact opening 110 and the first housing opening 116.TE Connectivity Solutions GmbH AMP19311PC 10
[0065] The film housing part 80 has a second housing opening 120 on the side that faces the contact housing part 75, and has a third housing opening 125 on a side that faces away from the contact housing part 75. Between the second housing opening 120 and the third housing opening 125, the film housing part 80 delimits a second housing interior portion 140.
[0066] In the contact position as illustrated in Figure 2, the contact housing part 75 at the first housing opening 116 engages in the second housing interior portion 140 of the film housing part 80.
[0067] Figure 3 shows a perspective illustration of the contact housing part 75 of the contact unit 15 shown in Figures 1A to 2.
[0068] The contact housing wall 90 has a first lateral wall 145 and a second lateral wall 150, wherein the first lateral wall 145 and the second lateral wall 150 are disposed so as to be mutually opposite in the z-direction. The base portion 95 extends between the first lateral wall 145 and the second lateral wall 150. For example, the first lateral wall 145 and / or the second lateral wall 150 can protrude in the y-direction beyond a base area 155 that faces the film housing part 80. Furthermore, the first lateral wall 145 and / or the second lateral wall 150 can be configured so as to be substantially board-shaped.
[0069] Externally, a first latching cam assembly of the form-fitting connection 85 can be disposed on the first lateral wall 145 and / or the second lateral wall 150 (obscured in Figure 3), for example.
[0070] Between the first lateral wall 145 and the second lateral wall 150, the contact housing part 75 has a support element assembly 160 with at least one, preferably a plurality of, support elements 165 which are disposed so as to be mutually spaced apart in the x-direction. The support element 165 is configured, for example, so as to be cuboid. Here, on a side that faces away from the film housing part 80, the support element 165 is disposed on the base portion 95 and protrudes beyond the base area 155 in the y-direction. Furthermore, the respective support element 165 can adjoin the respective adjacent closest contact opening 110 in the x-direction so as to be in each case laterally flush with the latter. Here, an opening lateral face 170 of the contact opening 110 and a support element lateral face 175 can be configured to be flush.TE Connectivity Solutions GmbH AMP19311PC 11
[0071] Figure 4 shows a view from below of the contact housing part 75 shown in Figure 3.
[0072] In the embodiment, the contact opening 110 of the first opening assembly 105 is configured in the shape of a slot and in its main direction of extent extends substantially in the z-direction between the first lateral wall 145 and the second lateral wall 150. Here, the contact opening 110 can in each case terminate so as to be spaced apart in the z-direction from the respectively closest lateral wall 145, 150.
[0073] At least one first housing support element 180 can be disposed on the side that faces away from the housing interior 130 and towards the printed circuit board 21. Preferably, a plurality of first housing support elements 180 which are disposed so as to be mutually offset in the x-direction are disposed here, wherein in the z-direction, for example, the first housing support element 180 is disposed between the first opening assembly 105 and a first external side 185 of the first lateral wall 145.
[0074] Additionally, the contact housing part 75 can have at least one second housing support element 190 which is disposed in the z-direction so as to be opposite the first housing support element 180. In particular, the second housing support element 190 here can be disposed between the first opening assembly 105 and a second external side 195 of the second lateral wall 150.
[0075] Furthermore, the contact housing part 75 can have at least one first centring pin 200 and preferably a second centring pin 205, wherein the first centring pin 200 is disposed so as to be closest to a short side of the contact housing part 75, for example. In particular, the first centring pin 200 here can be disposed in the x-direction between the first opening assembly 105 and the short side.
[0076] Disposed opposite in the x-direction is the second centring pin 205, for example between the opposite short side of the contact housing part 75 and the first opening assembly 105.
[0077] The first centring pin 200 and / or the second centring pin 205 extend away from the base portion 95 to which they are fastened, thus in the y-direction away from the base portion 95. A cross section of the first centring pin 200 here can be chosen to be different from that of the second centring pin 205.
[0078] Figure 5 shows a sectional view along a section plane B-B shown in Figure 3 through the contact housing part 75 shown in Figure 3.TE Connectivity Solutions GmbH AMP19311PC 12
[0079] It can be clearly seen in Figure 5 that the first and the second housing support elements 180, 190 protrude in the y-direction beyond a housing lower side 210 of the contact housing part 75 that in the assembled state faces the printed circuit board 21. The first and the second housing support elements 180, 190 here can be disposed on the inside, so as to be level with the first opening assembly 105 in the x-direction, and thus be disposed on the inside in relation to the first and the second centring pins 200, 205.
[0080] Likewise, the first and / or the centring pins 200, 205 protrude beyond the housing lower side 210.
[0081] For example, the support element 165 of the support element assembly 160 can on the side that faces the housing interior 130 be configured in the manner of a hollow member, such that a material requirement for producing the contact housing part 75 is reduced. In particular, the contact housing part 75 can be produced, for example, by an injectionmoulding method or by 3D printing from an electrically non-conductive material, for example plastics material.
[0082] Figure 6 shows a perspective illustration of a partially assembled contact unit 15.
[0083] Illustrated in Figure 6 are the contact assembly 65 with the contact elements 70, and the contact housing part 75. In Figure 6, the contact unit 15 has not yet been contacted and is thus in the assembly position.
[0084] The contact elements 70 of the contact assembly 65 are disposed in the x-direction so as to be mutually spaced apart at the path spacing b. In the embodiment, the contact elements 70 here are of identical configuration. For this reason, only one of the contact elements 70 will be explained hereunder. The explanations apply to all contact elements 70.
[0085] Each of the contact elements 70 has a blade assembly 215 which is disposed on a side of the respective contact element 70 that faces away from the base portion 95 and extends away from the contact housing part 75.
[0086] In Figure 6, a connecting portion 220 adjoins the blade assembly 215 on the lower side, on a side that faces the contact housing part 75. The connecting portion 220 can be configured in the shape of a board and extend substantially in the z-direction. The connecting portion 220 is preferably partially disposed between two support elements 165 of the supportTE Connectivity Solutions GmbH AMP19311PC 13
[0087] element assembly 160 and bears in each case on the facing support element lateral face 175. Tilting of the contact element 70 in the contact housing part 75 is avoided as a result.
[0088] The blade assembly 215 can have at least one first blade element 225 and, for example, one second blade element 230. In the embodiment, the blade assembly 215 has two first blade elements 225, wherein the second blade element 230 is disposed in the z-direction between the two first blade elements 225.
[0089] Figure 7 shows a lateral view onto the contact element 70 shown in Figure 6.
[0090] The shape of the contact element 70 shown in Figure 7 has the contact element 70 in the assembly position, before the blade assembly 215 is deformed in particular during the assembly of the contact unit 15 (cf. Figure 8).
[0091] Additionally, the contact element 70 can have a first solder portion 235 which is disposed opposite the blade assembly 215. The first solder portion 235 adjoins the connecting portion 220 on the side that faces away from the blade assembly 215. Preferably, the contact element 70 can have a second solder portion 240, wherein the second solder portion 240 is disposed in the z-direction so as to be offset from the first solder portion 235. Likewise, the second solder portion 240 adjoins the connecting portion 220 in the y-direction on the side that faces away from the blade assembly 215.
[0092] First solder portion 235 and / or the second solder portion 240 are configured in the shape of a board, for example, and have, for example, a substantially rectangular design embodiment in the lateral view.
[0093] For example, a clearance 245 can be disposed between the first solder portion 235 and the second solder portion 240, wherein the clearance 245 extends in the y-direction up to the connecting portion 220, for example.
[0094] The first solder portion 235 has a first solder pad 250 on a side that faces away from the connecting portion 220. The first solder pad 250 is configured to be planar, for example. It is also possible that the first solder pad 250, when viewed from the connecting portion 220, is formed to be bulged, in particular convex. In the embodiment, the first solder pad 250 extends substantially in an x-z plane and can be aligned parallel to the first solder contact pad 56 of the printed circuit board 21.TE Connectivity Solutions GmbH AMP19311PC 14
[0095] The second solder portion 240 can be configured so as to be identical to the first solder portion 235. In the embodiment, the second solder portion 240 by way of example has a second solder pad 255, wherein the second solder pad 255 in the embodiment is by way of example configured to be planar. Of course, it is also possible that the second solder pad 255, when viewed from the connecting portion 220, is formed to be bulged, in particular convex.
[0096] In the embodiment, the first solder pad 250 and the second solder pad 255 are disposed, for example, in a common plane which is configured as the x-z plane, for example. In other words, by way of example, proceeding from the connecting portion 220 in the Y-direction, the first solder portion 235 and the second solder portion 240 have an identical extent.
[0097] It can be clearly seen in Figure 7 that in a non-assembled state of the contact element 70, for example, the first blade element 225 is configured to be significantly longer than the second blade element 230. Furthermore, the first blade element 225 and the second blade element 230 are disposed so as to be mutually spaced apart in the z-direction.
[0098] In the embodiment, the blade elements 225, 230 are formed so as to taper towards a tip 260 of the respective blade element 225, 230, wherein the tip 260 is configured to penetrate the flexible circuit film 20.
[0099] The connecting portion 220 has a first sub-region 265 and a second sub-region 270. The first sub-region 265 is disposed on the upper side in Figure 7, wherein the blade assembly 215 adjoins the first sub-region 265.
[0100] The second sub-region 270 of the connecting portion 220 adjoins the first sub-region 265 on the lower side, thus on a side that faces away from the blade assembly 215, wherein the solder portion 235, 240 adjoins in each case the second sub-region 270 on a side that faces away from the first sub-region 265.
[0101] The first sub-region 265 is in the z-direction preferably configured to be wider than the second sub-region 270 and has a shoulder area 275 on a side that faces the second subregion 270 and thus faces away from the blade assembly 215. The shoulder area 275 can be aligned, for example, so as to be parallel to the first solder pad 250 and / or the second solder pad 255, and is disposed on the side of the first sub-region 265 that faces the second sub-region 270.TE Connectivity Solutions GmbH AMP19311PC 15
[0102] Owing to the larger extent in the z-direction, the first sub-region 265 protrudes beyond the second sub-region 270 in the z-direction. The first sub-region 265 here has a shoulder area 275 on a side that faces the second sub-region 270.
[0103] The first sub-region 265 preferably protrudes beyond the second sub-region 270 on both sides, so that the first sub-region 265 preferably has the shoulder area 275 on both sides in the z-direction.
[0104] Additionally, a second blade assembly 280 can be provided on the connecting portion 220, in particular in the region of the second sub-region 270. The second blade assembly 280 preferably has a third blade element 285, wherein the third blade element 285 protrudes from the second sub-region 270 in the z-direction.
[0105] Figure 8 shows a lateral view onto the contact element 70 shown in Figure 2 in the contact position.
[0106] In the contact position, the blade assembly 215 is deformed in such a way, for example, that the first blade element 225 is curved outwards in comparison to the non-deformed state shown in Figure 7. The second blade element 230 is configured to be rectilinear.
[0107] Figure 9 shows a perspective illustration of the film housing part 80.
[0108] The film housing part 80 can be configured to be elongate and preferably has in each case a film passage opening 300 on the long side. The film passage opening 300 is configured in the shape of a slot and opens into the second housing interior portion 140. Preferably, the film housing part 80 has two film passage openings 300 which are disposed opposite one another and which are in each case of identical configuration and are disposed so as to be opposite in the z-direction. The two film passage openings 300 here are preferably co-aligned. The film passage opening 300 is used for the spatial orientation of the flexible circuit film 20 in the contact unit 15.
[0109] The film housing part 80 furthermore has a second opening assembly 305, wherein the second opening assembly 305 is formed so as to correspond to the blade assembly 215. The design embodiment of the second opening assembly 305 will be discussed in the figures hereunder.TE Connectivity Solutions GmbH AMP19311PC 16
[0110] Figure 10 shows a sectional view along a section plane C-C shown in Figure 9 through the film housing part 80.
[0111] The film housing part 80 has a receptacle space 315, wherein the receptacle space 315 is disposed between the two film passage openings 300. The receptacle space 315 is configured to receive the flexible circuit film 20 and has a height in the y-direction that can correspond substantially to a thickness of the flexible circuit film 20.
[0112] The second opening assembly 305 is disposed between the second housing opening 120 and the third housing opening 125. The second opening assembly 305 has in each case one web assembly 310 for an assigned contact element 70, wherein the web assembly 310 is disposed in the second housing interior portion 140 and forms the second opening assembly 305. The web assembly 310 extends substantially between the second housing opening 120 and the third housing opening 125, substantially along the plug-in axis 115.
[0113] The web assembly 310 is disposed at least between the receptacle space 315 and the third housing opening 125. However, the web assembly 310 can also extend further beyond the receptacle space 315, thus in the y-direction in the direction of the second housing opening 120. The web assembly 310 is interrupted in the region of the receptacle space 315.
[0114] By way of example, the web assembly 310 has at least one first web 320 and, for example, one second web 325. The first web 320 is disposed on the inside so as to be closest to a film housing wall 326 of the film housing part 80, on the side that faces the film passage opening 300. The second web 325 can be disposed on the inside of the first web 320, so as to be spaced apart from the first web 320. Preferably, at least to second webs 325 are disposed next to one another.
[0115] Furthermore, the first web 320 as well as the second web 325 extend additionally in the x-direction. The first web 320 terminates in the y-direction so as to be spaced apart from the third housing opening 125, for example, whereas the second web 325 continues to extend to the third housing opening 125. A film receptacle 330 can be disposed between the first web 320 and the film housing wall 326.
[0116] A first blade receptacle 335 is disposed between the first web 320 and the closest second web 325 on the inside. The first blade receptacle 335 as well as the film receptacle 330 open out into the receptacle space 315. Proceeding from the receptacle space 315, the first blade receptacle 335 as well as the film receptacle 330 extend along the plug-in axis 115 inTE Connectivity Solutions GmbH AMP19311PC 17
[0117] the direction of the third housing opening 125, thus in a y-direction that faces away from the contact housing part 75.
[0118] Furthermore, disposed between the first web 320 and the third housing opening 125 is a bending space 340 in the second housing interior portion 140, wherein the bending space 340 extends in the y-direction up to the first web 320. The film receptacle 330 and the first blade receptacle 335 open out into this bending space 340.
[0119] Disposed on the inside between the two second webs 325 disposed next to one another is a second blade receptacle 345, wherein the second blade receptacle 345 is formed to be parallel to the first blade receptacle 335. Proceeding from the receptacle space 315, the second blade receptacle 345 also extends substantially in the y-direction up to the third housing opening 125.
[0120] In the embodiment, the film receptacle 330 as well as the first blade receptacle 335 are additionally provided twice, and thus by way of example provided so as to be opposite in the z-direction in such a way that the second blade receptacle 345 is disposed between two first blade receptacles 335.
[0121] Figure 11 shows a sectional view along a section plane D-D shown in Figure 9 through the film housing part 80.
[0122] For each contact element 70 the second opening assembly 305 has the film receptacle 330, described in Figure 10, as well as the first blade receptacle 335 and the second blade receptacle 345. The blade receptacles 335, 345 and the film receptacles 330 here each open out into the receptacle space 315.
[0123] Figure 12 shows a sectional view along the section plane A-A shown in Figure 1A of the contact system 10, in a partially assembled state, in particular in the assembly position of the contact unit 15.
[0124] In the partially assembled state, the first solder pad 250 at the first solder contact pad 56, and the solder pad 255 at the second solder contact pad 57, are in each case connected in particular electrically to one another in a materially integral manner by a soldered connection 350. As a result, the position of the respective contact element 70 relative to the printed circuit board 21 is fixed in a defined manner.TE Connectivity Solutions GmbH AMP19311PC 18
[0125] Additionally, the contact housing part 75 can be connected to the printed circuit board 21 in a form-fitting manner, for example by way of the first and / or the second centring pin 200, 205.
[0126] In the assembly position, the film housing part 80 is disposed so as to be further spaced apart from the contact housing part 75 along the plug-in axis 115 than in the contact position. In particular, none of the blade elements 225, 230 of the blade assembly 215 engages in the receptacle space 315, so that the flexible circuit film 20 can be introduced along the z-axis by way of the film passage opening 300 in the assembly position.
[0127] Furthermore, the connecting portion 220 by way of the second sub-region 270 penetrates the respectively assigned contact opening 110 in such a way that the solder portion 235, 240 protrudes beyond the base portion 95 in the direction of the printed circuit board 21. In the process, the shoulder area 275 bears on the inside on the base area 155. Furthermore, the second blade assembly 280 is pressed into a material, in particular into a plastics material, of the contact housing part 75 in such a way that the third blade element 285 engages in the contact housing part 75 at the contact opening 110 and is fastened in a form-fitting manner in the contact housing part 75.
[0128] The first sub-region 265 of the connecting portion 220 engages in the first housing interior portion 135 of the contact housing part 75 and can in portions protrude beyond the first housing opening 116 in the y-direction.
[0129] Figure 13 shows a sectional view along the section plane D-D shown in Figure 9 through the contact system 10, in the assembly position of the contact unit 15.
[0130] Clearly to be seen in Figure 13 is the engagement of the centring pins 200, 205 in each case in an assigned centring receptacle 400, 405 of the printed circuit board 21, wherein the respective centring pin 200, 205 cannot only engage in the centring receptacle 400, 405, but can also have a form-fitting or force-fitting connection to the printed circuit board 21. Due to the centring receptacle 400, 405 being designed so as to correspond to the assigned centring pin 200, 205, a defined alignment of the contact unit 15 relative to the printed circuit board 21 is fixed.
[0131] It can furthermore be seen that the first solder pad 250 is disposed so as to be spaced apart from the second solder pad 255 (not illustrated in Figure 13), wherein the clearance 245 is disposed in the region of the spacing.TE Connectivity Solutions GmbH AMP19311PC 19
[0132] For assembly of the contact system 10, the contact unit 15, the flexible circuit film 20 and the printed circuit board 21 are provided in the first assembly step. The contact unit 15 is provided in the assembly position (cf. Figures 1B, 7 and 10).
[0133] In a second assembly step (cf. Figure 13), the contact unit 15 is positioned on the printed circuit board 21 in such a manner that the centring pin 200, 205 engages in the assigned centring receptacle 400, 405.
[0134] In a third assembly step following the second assembly step (cf. Figure 12), the contact assembly 65 is soldered to the printed circuit board 21, for example by a reflow soldering method, at the solder pads 250, 255, and the soldered connection 350 is in each case formed. Preparatory steps for the reflow soldering method, for example a targeted application of solder to the solder contact pads 56, 57, can be carried out during the first and the second assembly steps. Owing to the direct soldered connection 350, the contact unit 15 is surface-mounted on the printed circuit board 21 in the sense of SMT (surfacemounting technology).
[0135] In a fourth assembly step following the third assembly step, the flexible circuit film 20 is in the assembly position introduced into the receptacle space 315 by way of the film passage opening 300, preferably guided through the receptacle space 315 in such a way that the flexible circuit film 20 is disposed completely in the receptacle space 315 (cf. Figure 1B).
[0136] In a fifth assembly step following the fourth assembly step, a tool is brought to bear on the third housing opening 125 of the film housing part 80, and the printed circuit board 21 is supported opposite the tool, on a side that faces away from the contact unit 15.
[0137] In the fifth assembly step (cf. Figure 2), the film housing part 80 and the contact housing part 75 conjointly with the printed circuit board 21 are compressed along the plug-in axis 115 in such a way that the film housing part 80 transitions from the assembly position to the contact position. In the process, the film housing part 80 acts on the flexible circuit film 20 and supports the flexible circuit film 20 by means of the web assembly 310 in the receptacle space 315, so that the respective blade assembly 215 by way of the tip 260 of the respective first and / or second blade element 225, 230 penetrates the flexible circuit film 20 in the region of the assigned first conductor path 35.TE Connectivity Solutions GmbH AMP19311PC 20
[0138] The tip 260 of the first blade element 120 in the bending space 340 runs to a bending face of the tool and, owing to the oblique design embodiment of the bending face, is bent in the bending space 340, for example outwards in the direction of the film housing wall 326 in such a manner that a curved sub-portion of the first blade element 225 is formed (cf. Figure 8). The curved sub-portion can in the process be braced in the bending space 340 in such a manner that the flexible circuit film 20 is pressed against the film housing part 80 (cf. Figure 2). Part of the flexible circuit film 20 is furthermore pressed into the film receptacle 330 and in the latter mechanically fixed as strain relief.
[0139] In a sixth assembly step following the fifth assembly step, the tool is removed from the bending space 340 and the contact system 10 is completely contacted.
[0140] By way of the above-described method, the first conductor paths 35 are simultaneously connected to the respectively assigned contact element 70, and at the same time it is ensured that the respective contact element 70 is reliably pressed against the flexible circuit film 20.
[0141] Furthermore, owing to the soldered connection at the respective solder pad 250, 255, an electrical as well as a mechanical connection to the printed circuit board 21 is ensured, whereby a further, additional contact unit can be dispensed with.
[0142] Figure 14 shows a perspective illustration of a contact unit 15 of the contact system 10 according to a second embodiment.
[0143] The contact system 10 is configured so as to be substantially identical to the contact system 10 according to the first embodiment, discussed in the context of Figures 1 to 13. Only the points of differentiation of the contact system 10 according to the second embodiment, shown in Figure 14, in comparison to the contact system 10 according to the first embodiment, shown in Figures 1 to 13, will be discussed hereunder.
[0144] The contact system 10 is adapted in comparison to Figures 1 to 13 in such a way that primarily the printed circuit board 21 and the contact element 70 are adapted in comparison to Figures 1 to 13. In order to provide contact through the printed circuit board 21, the first solder portion 235 and the second solder portion 240 are in each case configured in the manner of a pin.
[0145] Figure 15 shows a lateral view of the contact element 70 shown in Figure 14.TE Connectivity Solutions GmbH AMP19311PC 21
[0146] As has already been mentioned in Figure 14, the solder portions 235, 240 are configured in the shape of a pin, wherein the solder portion 235, 240, proceeding from the connecting portion 220, extends in each case along the plug-in axis 115 away from the connecting portion 220. Here, the solder portion 235, 240 is configured to be thinner than shown in Figures 1 to 13. The first solder pad 250, in terms of the plug-in axis 115, is preferably disposed circumferentially on the first solder portion 235, and the second solder pad 255 is disposed circumferentially on the second solder portion 240. At a free end of the solder portion 235, 240, which is disposed on a side that faces away from the connecting portion 220, the solder portion 235, 240 can be configured to taper, in particular towards a tip.
[0147] In the assembled state, the printed circuit board 21 has a first contact receptacle 500 on the first solder contact pad 56, and a second contact receptacle 505 on the second solder contact pad 57. The first solder portion 235 engages in the first contact receptacle 500, or penetrates the first contact receptacle 500 along the plug-in axis 115. The second solder portion 240 engages in the second contact receptacle 505, or penetrates the second contact receptacle 505 along the plug-in axis 115. By means of the solder connection 350, the assigned solder portion 235, 240 is soldered at the first and / or the second solder contact pad 56, 57.
[0148] The design embodiment shown in Figures 14 and 15 has the advantage that the contact unit 15 in the second assembly step can be assembled and fastened along the plug-in axis 115 as a TH D module (Through Hole Device) in the context of a through-the-hole assembly.
[0149] Figure 16 shows a perspective illustration of the contact unit 15 shown in Figures 14 and 15 of the contact system 10 according to the second embodiment.
[0150] For example, the first solder portion 235 and / or the second solder portion 240 are configured to be longer than the first centring pin 200 and / or the second centring pin 205. It can be ensured as a result that complete penetration of the contact receptacle 500, 505 by way of the respective solder portion 235, 240 can be ensured at the printed circuit board 21, up to the free end of the respective solder portion 235, 240. Owing to this fact, the second conductor path 50 can also be disposed on a side of the printed circuit board 21 that faces away from the contact unit 15.
[0151] In order to avoid damage to the soldering at the first and / or the second solder pad 250, 255, in particular in the event of a tensile stress of the flexible circuit film 20 in the z-direction, theTE Connectivity Solutions GmbH AMP19311PC 22
[0152] flexible circuit film 20 can be supported in that the housing support element 180, 190 by way of a housing support face 355 bears on the printed circuit board lateral face 55 (Figure 2). As a result, further bending of the contact unit 15 about the x-axis is avoided.TE Connectivity Solutions GmbH AMP19311PC
[0153] 23
[0154] List of reference signs
[0155] 10 Contact system
[0156] 15 Contact unit
[0157] 20 Flexible circuit film
[0158] 21 Printed circuit board
[0159] 22 Board
[0160] 25 First carrier layer (of the flexible circuit film)
[0161] 30 First conductor path assembly (of the flexible circuit film) 35 First conductor path (of the first conductor path assembly) 40 Second carrier layer (of the printed circuit board)
[0162] 45 Second conductor path assembly (of the circuit board)
[0163] 50 Second conductor path (of the second conductor path assembly) 55 Printed circuit board lateral face
[0164] 56 First solder contact pad
[0165] 57 Second solder contact pad
[0166] 60 Housing
[0167] 65 Contact assembly
[0168] 70 Contact element
[0169] 75 Contact housing part
[0170] 80 Film housing part
[0171] 85 Form-fitting connection
[0172] 86 Further form-fitting connection
[0173] 90 Contact housing wall
[0174] 95 Base portion
[0175] 100 Housing wall
[0176] 105 First opening assembly
[0177] 110 Contact opening
[0178] 115 Plug-in axis
[0179] 116 First housing opening
[0180] 120 Second housing opening
[0181] 125 Third housing opening
[0182] 130 Housing interior
[0183] 135 First housing interior portion
[0184] 140 Second housing interior portion
[0185] 145 First lateral wall
[0186] 150 Second lateral wallTE Connectivity Solutions GmbH AMP19311PC
[0187] 155 Base area
[0188] 160 Support element assembly
[0189] 165 Support element
[0190] 170 Opening lateral face
[0191] 175 Support element lateral face 180 First housing support element 185 First external side
[0192] 190 Second housing support element 195 Second external side
[0193] 200 First centring pin
[0194] 205 Second centring pin
[0195] 210 Housing lower side
[0196] 215 Blade assembly
[0197] 220 Connecting portion
[0198] 225 First blade element
[0199] 230 Second blade element
[0200] 235 First solder portion
[0201] 240 Second solder portion
[0202] 245 Clearance
[0203] 250 First solder pad
[0204] 255 Second solder pad
[0205] 260 Tip
[0206] 265 First sub-region
[0207] 270 Second sub-region
[0208] 275 Shoulder area
[0209] 280 Second blade assembly
[0210] 285 Third blade element
[0211] 300 Film through passage
[0212] 305 Second opening assembly
[0213] 310 Web assembly
[0214] 315 Receptacle space
[0215] 320 First web
[0216] 325 Second web
[0217] 326 Film housing wall
[0218] 330 Film receptacle
[0219] 335 First blade receptacle
[0220] 340 Bending spaceTE Connectivity Solutions GmbH AMP19311PC
[0221] 345 Second blade receptacle 350 Soldered connection 355 Housing support face 400 Centring receptacle
[0222] 405 Centring receptacle
[0223] 500 First contact receptacle 505 Second contact receptacle
[0224] b Path spacing
Claims
TE Connectivity Solutions GmbH AMP19311PC 26Patent Claims1. Contact unit (15) for contacting a flexible circuit film (20),- wherein the contact unit (15) has- a housing (60) which encloses a housing interior (130) and has a contact housing part (75),- and a contact assembly (65) which has at least one contact element (70) disposed in a row of contacts,- wherein the contact element (70) extends along a plug-in axis (115) and has at least one blade assembly (215), a first solder portion (235) which is disposed opposite the blade assembly (215), and a connecting portion (220) which is disposed between the first solder portion (235) and the blade assembly (215), - wherein the contact housing part (75) has a base portion (95) and a first opening assembly (105) which is disposed on the base portion (95) and has at least one contact opening (110),- wherein the connecting portion (220) bears on the base portion (95) on a side that faces the blade assembly (215),- wherein the first solder portion (235) penetrates the contact opening (110) and protrudes along the plug-in axis (115) beyond the base portion (95) on a side that faces away from the blade assembly (215),- wherein the first solder portion (235) has a first solder pad (250).
2. Contact unit (15) according to Claim 1 ,- wherein the contact element (70) has a second solder portion (240),- wherein the connecting portion (220) is connected to the second solder portion (240) on a side that faces away from the blade assembly (215),- wherein the second solder portion (240) is disposed on the connecting portion (220) so as to be offset from the first solder portion (235),- wherein the second solder portion (240) has a second solder pad (255).
3. Contact unit (15) according to any one of the preceding claims,- wherein the contact housing part (75) has at least one first housing support element (180),- wherein the first housing support element (180) is disposed on the base portion (95) and extends away from the base portion (95) on a side that faces away from the blade assembly (215),TE Connectivity Solutions GmbH AMP19311PC 27- wherein the first housing support element (180) has a first housing support face (355) on a side that faces away from the blade assembly (215).
4. Contact unit (15) according to any one of the preceding claims,- wherein the contact housing part (75) has at least one centring pin (200, 205), - wherein the centring pin (200, 205) is disposed on the base portion (95) and extends away from the base portion (95) so as to face away from the blade assembly (215),- wherein the centring pin (200, 205) is disposed so as to be offset from the contact assembly (65).
5. Contact unit (15) according to any one of the preceding claims,- wherein the first solder portion (235) is configured to be board-shaped,- wherein the first solder pad (250) is configured to be substantially planar or convex.
6. Contact unit (15) according to any one of the preceding claims,- wherein the first solder portion (235) is configured to extend in the shape of a pin along the plug-in axis (115),- wherein the first solder pad (250) is disposed so as to be circumferential on the first solder portion (235).
7. Contact unit (15) according to any one of the preceding claims,- wherein the housing (60) has a film housing part (80),- wherein the film housing part (80) is disposed on the contact housing part (75) on a side that faces away from the base portion (95),- wherein the contact housing part (75) and the film housing part (80) engage in one another and enclose the housing interior (130) at least in portions,- wherein the film housing part (80) has in the housing interior (130) a receptacle space (315) and a film passage opening (300) that opens into the receptacle space (315),- wherein the film housing part (80) and the contact housing part (75) are disposed so as to be displaceable relative to one another along the plug-in axis (115), between an assembly position and contact position,- wherein in the contact position the blade assembly (215) protrudes into the receptacle space (315).TE Connectivity Solutions GmbH AMP19311PC 288. Contact system (10)- having a contact unit (15) according to any one of the preceding claims, a printed circuit board (21) and a flexible circuit film (20),- wherein the circuit film (20) has at least one first conductor path assembly (30) with at least one first conductor path (35),- wherein the printed circuit board (21) has at least one second conductor path assembly (45) with a first solder contact pad (56),- wherein the first solder pad (250) of the first solder portion (235) of the contact element (70) and the first solder contact pad (56) of the second conductor path assembly (45) are soldered,- wherein the flexible circuit film (20) is at least in portions disposed in the housing interior (130),- wherein the first blade element (225) of the blade assembly (215) penetrates the flexible circuit film (20) at least in portions and electrically contacts the first conductor path (35),- wherein the contact element (70) is configured to be electrically conductive and connects the first conductor path (35) electrically to the first solder contact pad (56) of the second conductor path assembly (45).
9. Contact system (10) according to Claim 8, having a contact unit (15) according to Claim 5,- wherein the first solder contact pad (56) of the second conductor path assembly (45) of the printed circuit board (21) and the first solder pad (250) are aligned so as to be substantially mutually parallel.
10. Contact system (10) according to Claim 8, having a contact unit (15) according to Claim 6,- wherein the printed circuit board (21) has a first contact receptacle (500),- wherein the first solder portion (235) engages in the first contact opening (500), in particular penetrating the first contact opening (500),- wherein the first solder contact pad (56) is disposed on the first contact opening (500).
11. Contact system (10) according any one of Claims 8 to 10, having a contact unit (15) according to Claim 3,- wherein the printed circuit board (21) has a printed circuit board lateral face (55) which faces the contact unit (15),TE Connectivity Solutions GmbH AMP19311PC 29- wherein the housing support face (355) of the first housing support element (180) bears on the printed circuit board lateral face (55).
12. Method for assembling a contact system (10) according to one of Claims 8 to 11 , - wherein provided are a flexible circuit film (20), a printed circuit board (21), and a contact unit (15) according to one of Claims 1 to 7,- wherein the first solder pad (250) of the first solder portion (235) of the contact element (70) and the first solder contact pad (56) of the second conductor path assembly (45) are soldered,- wherein the flexible circuit film (20) is at least in portions disposed in the housing interior (130),- wherein the first blade element (225) is pushed through the flexible circuit film (20) in such a way that the first blade element (225) penetrates the flexible circuit film (20) and electrically contacts the first conductor path (35),- wherein the first contact element (70) connects the first conductor path (35) electrically to the first solder contact pad (56) of the second conductor path assembly (45).
13. Method according to Claim 12,- wherein the method is carried out in the chronological order stated.