Electronic apparatus comprising flexible display

Abstract

An electronic apparatus according to an embodiment of the present disclosure may comprise: a foldable housing including a first housing, a second housing, and a hinge structure connecting the first housing and the second housing; and a flexible display disposed on the foldable housing and including a display panel, a plastic film disposed on the rear surface of the display panel, and a support plate disposed on the rear surface of the plastic film, wherein the support plate includes a first flat portion facing the first housing, a second flat portion facing the second housing, and a bendable portion disposed to face the hinge structure between the first flat portion and the second flat portion and formed to be bendable through a plurality of openings disposed at intervals, and a first polymer may be disposed inside the plurality of openings.

Description

Electronic device including a flexible display

[0001] Embodiments of the present disclosure relate to an electronic device including a flexible display.

[0002] As the functional gap between manufacturers of electronic devices narrows significantly, devices are becoming increasingly slimmer to satisfy consumer purchasing desires. They are also being developed to increase rigidity, enhance design aspects, and differentiate their functional elements. These electronic devices are moving away from uniform rectangular shapes and are gradually transforming into various forms. For example, electronic devices can have a deformable structure that is convenient to carry and allows for the use of a large screen display when in use.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] As part of electronic devices, foldable type electronic devices (e.g., foldable electronic devices) are continuously being released, and such foldable electronic devices may include a bendable portion in a support plate for a foldable flexible display. As part of electronic devices, rollable type electronic devices (e.g., rollable electronic devices) in which a display slides in into a housing or slides out from inside a housing are being researched and developed, and such rollable electronic devices may include a bendable portion in a support plate for supporting a bendable flexible display.

[0005] The bendable portion of the support plate may be configured to be foldable (or bendable) as a plurality of openings are spaced apart. The plurality of openings of the support plate may be a cause of visibility problems. For example, in the process of attaching the support plate to the back surface of a display panel, an assembly defect may occur in which air bubbles are trapped inside the plurality of openings of the support plate, and the air bubbles trapped inside the plurality of openings may cause visibility problems and deformation of the openings.

[0006] Embodiments of the present disclosure can provide an electronic device including a flexible display that prevents assembly defects in which bubbles are trapped inside a plurality of openings and reduces deformation of the openings to increase durability.

[0007] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below.

[0008] An electronic device according to one embodiment of the present disclosure comprises: a foldable housing including a first housing, a second housing, and a hinge structure connecting the first housing and the second housing; and a flexible display disposed on the foldable housing, the flexible display including a display panel, a plastic film disposed on the back surface of the display panel, and a support plate disposed on the back surface of the plastic film, wherein the support plate comprises a first planar portion facing the first housing, a second planar portion facing the second housing, and a bendable portion formed to be bendable through a plurality of openings disposed spaced apart and facing the hinge structure between the first planar portion and the second planar portion, and a first polymer may be disposed inside the plurality of openings.

[0009] An electronic device according to one embodiment of the present disclosure comprises: a foldable housing comprising a first housing, a second housing, and a third housing; and a flexible display disposed on the foldable housing, the flexible display comprising a display panel, a plastic film disposed on the back surface of the display panel, and a support plate disposed on the back surface of the plastic film, wherein the support plate comprises a first planar portion facing the first housing, a second planar portion facing the second housing, a third planar portion facing the third housing, a first bendable portion disposed between the first planar portion and the second planar portion and formed to be bendable through a plurality of first openings, and a second bendable portion disposed between the second planar portion and the third planar portion and formed to be bendable through a plurality of second openings, wherein a first polymer is disposed inside the plurality of first openings and a second polymer is disposed inside the plurality of second openings.

[0010] An electronic device according to one embodiment of the present disclosure comprises: a rollable housing including a first housing and a second housing movably coupled to the first housing; a flexible display including a first display area that is visually visible from the outside when the rollable housing is in a contracted state and a second display area that extends from the first display area and slides out from the inside of the rollable housing when the rollable housing transitions from the contracted state to an expanded state, the flexible display including a display panel, a plastic film disposed on the back surface of the display panel, and a support plate disposed on the back surface of the plastic film, wherein the support plate includes a flat portion corresponding to the first display area and a bendable portion formed to be bendable through a plurality of openings spaced apart corresponding to the second display area, and a first polymer may be disposed inside the plurality of openings.

[0011] The embodiments of the present disclosure can prevent assembly defects in which air bubbles are trapped inside a plurality of openings, and reduce deformation of the openings to increase durability.

[0012] Other aspects, features, and advantages according to specific embodiments of the present disclosure will become more apparent from the accompanying drawings and description.

[0013] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment.

[0014] FIG. 2a is a perspective view of an electronic device showing a flat state (or unfolding state) according to various embodiments of the present disclosure.

[0015] FIG. 2b is a plan view showing the front of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0016] FIG. 2c is a plan view showing the rear of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0017] FIG. 3a is a perspective view of an electronic device showing a folding state according to various embodiments of the present disclosure.

[0018] FIG. 3b is a perspective view of an electronic device illustrating an intermediate state according to various embodiments of the present disclosure.

[0019] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0020] FIG. 5 is an exploded perspective view illustrating a stacked structure of a flexible display according to various embodiments of the present invention.

[0021] FIG. 6 is an enlarged plan view of a portion of the support plate shown in FIG. 5.

[0022] FIG. 7 is a schematic cross-sectional view of a dipole and a support plate according to one embodiment.

[0023] FIG. 8 is a cross-sectional view illustrating an embodiment in which a second polymer covering an opening is disposed on a support plate.

[0024] FIG. 9 is a cross-sectional view illustrating an embodiment in which a second polymer according to an embodiment is arranged to correspond to the entire surface area of ​​a support plate.

[0025] FIG. 10 is a conceptual diagram illustrating a manufacturing method for filling an opening of a support plate with a first polymer according to one embodiment.

[0026] FIGS. 11 and FIGS. 12 are cross-sectional views illustrating an embodiment in which a second polymer and a third polymer are disposed on a support plate.

[0027] FIGS. 13 and FIGS. 14 are a plan view and a cross-sectional view illustrating a portion of a bendable part of a support plate according to one embodiment.

[0028] FIG. 15 is a schematic plan view of a support plate included in a rollable electronic device according to one embodiment.

[0029] FIGS. 16 and FIGS. 17 are schematic cross-sectional views of the support plate shown in FIGS. 15.

[0030] FIGS. 18 and 19 are schematic plan views of a multi-foldable electronic device and a support plate included therein according to one embodiment.

[0031] FIGS. 20 to 23 are schematic cross-sectional views of the support plate shown in FIG. 18.

[0032] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0033] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0034] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0035] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0036] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0037] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0038] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0039] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0040] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0041] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0042] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0043] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0045] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0046] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0047] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0049] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0050] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0051] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0052] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0053] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0054] The electronic device according to the various embodiments disclosed in this disclosure may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this disclosure is not limited to the devices described above.

[0055] The various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In the present disclosure, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” each may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0056] The term “module” as used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0057] Various embodiments of the present disclosure may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0058] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0059] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0060] FIG. 2a is a perspective view of an electronic device (101) showing a flat state (or unfolding state) according to various embodiments of the present disclosure. FIG. 2b is a plan view showing the front of the electronic device (101) in the unfolded state according to various embodiments of the present disclosure. FIG. 2c is a plan view showing the rear of the electronic device (101) in the unfolded state according to various embodiments of the present disclosure. FIG. 3a is a perspective view of an electronic device (101) showing a folding state according to various embodiments of the present disclosure. FIG. 3b is a perspective view of an electronic device (101) showing an intermediate state according to various embodiments of the present disclosure.

[0061] The electronic device (101) of FIGS. 2a to 3b may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0062] Referring to FIGS. 2a through 3b, an electronic device (101) (e.g., the electronic device (101) of FIG. 1) may include a pair of housings (310, 320) (e.g., foldable housings) that are rotatably coupled to face each other and fold with respect to a hinge structure (e.g., the hinge structure (340) of FIG. 4) (e.g., a hinge device or a hinge module). In some embodiments, the hinge structure (340) may be arranged in the x-axis direction or in the y-axis direction. In some embodiments, two or more hinge structures (340) may be arranged to fold in the same direction or in different directions. In one embodiment, the electronic device (101) may include a first display (330) (e.g., a flexible display) that is placed in an area formed by the pair of housings (310, 320). In one embodiment, the first housing (310) and the second housing (320) are positioned on both sides with respect to the folding axis (F) and may have a shape that is substantially symmetric with respect to the folding axis (F). In one embodiment, the angle or distance between the first housing (310) and the second housing (320) may vary depending on whether the state of the electronic device (101) is in a flat state (or unfolding state), a folding state, or an intermediate state.

[0063] According to one embodiment, a pair of housings (310, 320) may include a first housing (310) (e.g., first housing structure) coupled to a hinge structure (340) and a second housing (320) (e.g., second housing structure) coupled to a hinge structure (340). In one embodiment, the first housing (310) may include, in an unfolded state, a first surface (311) (e.g., front) facing in a front direction (e.g., z-axis direction) and a second surface (312) (e.g., rear) facing in a rear direction (e.g., -z-axis direction) opposite to the first surface (311). In one embodiment, the second housing (320) may include a third surface (321) (e.g., front) facing the front direction (e.g., z-axis direction) and a fourth surface (322) (e.g., rear) facing the rear direction (e.g., -z-axis direction) when unfolded. In one embodiment, the electronic device (101) may be operated such that, when unfolded, the first surface (311) of the first housing (310) and the third surface (321) of the second housing (320) face substantially the same first direction (e.g., z-axis direction), and when folded, the first surface (311) and the third surface (321) face each other. In one embodiment, the electronic device (101) can be operated such that, in the unfolded state, the second surface (312) of the first housing (310) and the fourth surface (322) of the second housing (320) face substantially the same second direction (e.g., -z axis direction), and in the folded state, the second surface (312) and the fourth surface (322) face opposite directions. For example, in the folded state, the second surface (312) may face the first direction (e.g., z axis direction) and the fourth surface (322) may face the second direction (e.g., -z axis direction).

[0064] According to one embodiment, the first housing (310) may include a first side member (313) that forms at least partially the exterior of the electronic device (101) and a first rear cover (314) that is coupled to the first side member (313) and forms at least a part of the second side (312) of the electronic device (101). In one embodiment, the first side member (313) may include a first side (313a), a second side (313b) extending from one end of the first side (313a), and a third side (313c) extending from the other end of the first side (313a). In one embodiment, the first side member (313) may be formed into a rectangular shape (e.g., square or rectangle) through the first side (313a), the second side (313b), and the third side (313c).

[0065] According to one embodiment, the second housing (320) may include a second side member (323) that forms at least partially the exterior of the electronic device (101) and a second rear cover (324) that is coupled to the second side member (323) and forms at least a portion of the fourth side (322) of the electronic device (101). In one embodiment, the second side member (323) may include a fourth side (323a), a fifth side (323b) extending from one end of the fourth side (323a), and a sixth side (323c) extending from the other end of the fourth side (323a). In one embodiment, the second side member (323) may be formed into a rectangular shape through the fourth side (323a), the fifth side (323b), and the sixth side (323c). In one embodiment, the first housing (310) and the second housing (320) may be composed of a foldable housing (e.g., a foldable housing structure or a housing structure).

[0066] According to one embodiment, a pair of housings (310, 320) are not limited to the illustrated form and combination and may be implemented by other shapes or combinations of parts and / or combinations. For example, in some embodiments, the first side member (313) may be formed integrally with the first rear cover (314), and the second side member (323) may be formed integrally with the second rear cover (324).

[0067] According to one embodiment, in the unfolded state, the electronic device (101) may have the second side (313b) of the first side member (313) and the fifth side (323b) of the second side member (323) connected. In one embodiment, in the unfolded state, the electronic device (101) may have the third side (313c) of the first side member (313) and the sixth side (323c) of the second side member (323) connected. In one embodiment, in the unfolded state, the electronic device (101) may be configured such that the combined length of the second side (313b) and the fifth side (323b) is longer than the length of the first side (313a) and / or the fourth side (323a). Additionally, the combined length of the third side (313c) and the sixth side (323c) may be configured to be longer than the length of the first side (313a) and / or the fourth side (323a).

[0068] According to one embodiment, the first side member (313) and / or the second side member (323) may be formed of a metal (e.g., a conductive member or a conductive region) or may further comprise a polymer (e.g., a non-conductive member or a non-conductive region) injected into the metal. In one embodiment, the first side member (313) and / or the second side member (323) may comprise at least one conductive portion (316 and / or 326) electrically segmented through at least one segment (3161, 3162, and / or 3261, 3262) (e.g., a non-conductive portion or a gap) formed of a polymer. In this case, at least one conductive part (316 and / or 326) can be used as an antenna operating in at least one specified band (e.g., about 400 MHz to about 6000 MHz) by being electrically connected to a wireless communication circuit (e.g., cellular communication circuit) (e.g., wireless communication module (192) of FIG. 1) included in the electronic device (101).

[0069] According to one embodiment, the first rear cover (314) and / or the second rear cover (324) may be formed by at least one or a combination of at least two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0070] According to one embodiment, the first display (330) may be positioned to extend from the first surface (311) of the first housing (310) across the hinge structure (340) (e.g., hinge module or hinge assembly) to at least a portion of the third surface (321) of the second housing (320). For example, the first display (330) may include a first portion (330a) substantially corresponding to the first surface (311), a second portion (330b) corresponding to the third surface (321), and a third portion (330c) (e.g., a bendable area) connecting the first portion (330a) and the second portion (330b) and corresponding to the hinge structure (340).

[0071] According to one embodiment, the electronic device (101) may include a first protective member (315) (e.g., a first cover, a first protective frame, a first protective cover, or a first decorative member) that is coupled along the edge of the first housing (310). In one embodiment, the electronic device (101) may include a second protective member (325) (e.g., a second cover, a second protective frame, a second protective cover, or a second decorative member) that is coupled along the edge of the second housing (320). In one embodiment, the first protective member (315) and / or the second protective member (325) may be formed of a metal or polymer material. In one embodiment, the first protective member (315) and / or the second protective member (325) may be used as a decoration member. In one embodiment, the first display (330) may be positioned such that the edge of the first portion (330a) is interposed between the first housing (310) and the first protective member (315). In one embodiment, the first display (330) may be positioned such that the edge of the second portion (330b) is interposed between the second housing (320) and the second protective member (325). In one embodiment, the first display (330) may be positioned such that the edge of the first display (330) is protected through a protective cap (335) placed in an area corresponding to the hinge structure (340). Thus, the edge of the first display (330) can be substantially protected from the outside. In one embodiment, the electronic device (101) may include a hinge housing (341) (e.g., a hinge cover) that supports a hinge structure (340) and is exposed to the outside when the electronic device (101) is in a folded state, and is retracted into the first space (3101) of the first housing (310) and the second space (3201) of the second housing (320) so as not to be seen from the outside when the electronic device (101) is in a folded state. In some embodiments, the first display (330) may be extended from at least a portion of the second surface (312) to at least a portion of the fourth surface (322).In this case, the electronic device (101) can be folded so that the first display (330) is exposed to the outside (out-folding method).

[0072] According to one embodiment, the electronic device (101) may include a second display (400) (e.g., a sub-display) that is disposed separately from the first display (330). In one embodiment, the second display (400) is disposed so as to be at least partially exposed on the second surface (312) of the first housing (310) so that, when folded, it can replace the display function of the first display (330) and display status information of the electronic device (101). In one embodiment, the second display (400) may be disposed so as to be visible from the outside through at least a portion of the first rear cover (314). In some embodiments, the second display (400) may be disposed on the fourth surface (322) of the second housing (320). In this case, the second display (400) may be disposed so as to be visible from the outside through at least a portion of the second rear cover (324).

[0073] According to one embodiment, the electronic device (101) may include at least one of an input device (303) (e.g., a microphone), an acoustic output device (301, 302), a sensor module (304), a camera device (305, 308), a key input device (306), or a connector port (307). In the illustrated embodiment, the input device (303) (e.g., a microphone), an acoustic output device (301, 302), a sensor module (304), a camera device (305, 308), a key input device (306), or a connector port (307) refers to a hole or shape formed in the first housing (310) or the second housing (320), but may include a substantial electronic component (e.g., an input device, an acoustic output device, a sensor module, or a camera device) disposed inside the electronic device (101) and operating through the hole or shape.

[0074] According to one embodiment, the input device (303) may include at least one microphone (303) disposed in the second housing (320). In some embodiments, the input device (303) may include a plurality of microphones (303) disposed to detect the direction of sound. In some embodiments, the plurality of microphones (303) may be disposed at appropriate locations in the first housing (310) and / or the second housing (320). In one embodiment, the acoustic output device (301, 302) may include speakers (301, 302). In one embodiment, the speakers (301, 302) may include a call receiver (301) disposed in the first housing (310) and a speaker (302) disposed in the second housing (320). In some embodiments, the input device (303), the audio output device (301, 302), and the connector port (307) are disposed in a space provided in the first housing (310) and / or the second housing (320) of the electronic device (101) and may be exposed to the external environment through at least one hole formed in the first housing (310) and / or the second housing (320). In one embodiment, at least one connector port (307) may be used to transmit and receive power and / or data with an external electronic device. In some embodiments, at least one connector port (e.g., an ear jack hole) may accommodate a connector (e.g., an ear jack) for transmitting and receiving audio signals with an external electronic device. In some embodiments, the hole formed in the first housing (310) and / or the second housing (320) may be used in common for the input device (303) and the audio output device (301, 302). In some embodiments, the acoustic output device (301, 302) may include a speaker (e.g., a piezo speaker) that is operated with the holes formed in the first housing (310) and / or the second housing (320) excluded.

[0075] According to one embodiment, the sensor module (304) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (304) may detect the external environment, for example, through a first surface (311) of the first housing (310). In some embodiments, the electronic device (101) may further include at least one sensor module positioned to detect the external environment through a second surface (312) of the first housing (310). In one embodiment, the sensor module (304) (e.g., an illuminance sensor) may be positioned below the first display (330) to detect the external environment through the first display (330). In one embodiment, the sensor module (304) may include at least one of a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, an illuminance sensor, a proximity sensor, a biosensor, an ultrasonic sensor, or an illuminance sensor.

[0076] According to one embodiment, camera devices (305, 308) may include a first camera device (305) (e.g., a front camera device) disposed on a first surface (311) of a first housing (310) and a second camera device (308) disposed on a second surface (312) of the first housing (310). The electronic device (101) may further include a flash (309) disposed near the second camera device (308). In one embodiment, the camera devices (305, 308) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (309) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, camera devices (305, 308) may be arranged such that two or more lenses (e.g., wide-angle lens, ultra-wide-angle lens, or telephoto lens) and image sensors are located on one side of the electronic device (101) (e.g., first side (311), second side (312), third side (321), or fourth side (322)). In some embodiments, camera devices (305, 308) may include lenses for time of flight (TOF) and / or image sensors.

[0077] According to one embodiment, a key input device (306) (e.g., a key button) may be placed on a third side (313c) of a first side member (313) of a first housing (310). In some embodiments, the key input device (306) may be placed on at least one of the other sides (313a, 313b) of the first housing (310) and / or the sides (323a, 323b, 323c) of the second housing (320). In some embodiments, the electronic device (101) may not include some or all of the key input devices (306), and the key input device (306) that is not included may be implemented in other forms, such as a soft key, on the first display (330). In some embodiments, the key input device (306) may be implemented using a pressure sensor included in the first display (330).

[0078] According to one embodiment, some of the camera devices (305, 308), such as a first camera device (305) or a sensor module (304), may be positioned to be exposed through the first display (330). For example, the first camera device (305) or the sensor module (304) may be positioned in the internal space of the electronic device (101) to come into contact with the external environment through an opening (e.g., a through hole) formed at least partially in the first display (330). In another embodiment, some of the sensor module (304) may be positioned to perform its function without being visually exposed through the first display (330) in the internal space of the electronic device (101). For example, in this case, the opening may be omitted in the area of ​​the first display (330) facing the sensor module (304).

[0079] Referring to FIG. 3b, the electronic device (101) may be operated to maintain an intermediate state through a hinge structure (340). In this case, the electronic device (101) may control the first display (330) so that different content is displayed in the display area corresponding to the first surface (311) and the display area corresponding to the third surface (321). In one embodiment, the electronic device (101) may be operated through the hinge structure (340) to a substantially unfolded state (e.g., the unfolded state of FIG. 2a) and / or a substantially folded state (e.g., the folded state of FIG. 3a) based on a certain inflection angle (e.g., the angle between the first housing (310) and the second housing (320) when in the intermediate state). For example, the electronic device (101) can be operated to transition to an unfolded state (e.g., the unfolded state of FIG. 2a) when pressure is applied in the unfolding direction (R1 direction) from an intermediate state unfolded at a certain inflection angle through the hinge structure (340). For example, the electronic device (101) can be operated to transition to a closed state (e.g., the folded state of FIG. 3a) when pressure is applied in the folding direction (R2 direction) from an intermediate state unfolded at a certain inflection angle through the hinge structure (340). In one embodiment, the electronic device (101) may be operated to maintain an unfolded state (not shown) at various angles through the hinge structure (340).

[0080] According to one embodiment, the electronic device (101) may include a conductive layer (3151) (e.g., a first conductive pattern or a first conductive material) disposed between the first housing (310) and the first protective member (315). In one embodiment, the conductive layer (3151) may be disposed on the inner surface of the first protective member (315) so as not to be visible from the outside. In one embodiment, the conductive layer (3151) may be electrically connected to a near-field wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed in the internal space of the electronic device (101). In one embodiment, the near-field wireless communication circuit may be configured to transmit and / or receive a wireless signal in a frequency band of about 13.56 MHz through the conductive layer (3151). In one embodiment, the conductive layer (3151) may operate as a near-field communication antenna (NA1) (e.g., a first near-field communication antenna). In one embodiment, a short-range communication antenna (NA1) is positioned along the length direction (e.g., ±x axis direction) of the first side (313a) near the first side (313a) of the electronic device (101) so as to form a wireless signal in the direction in which the front (311) of the electronic device (101) faces (e.g., z axis direction), the direction in which the side (313a) faces (e.g., y axis direction), or the direction between the front (311) and the side (313a) (e.g., the direction between the z axis and the y axis).

[0081] According to one embodiment, the electronic device (101) may include a conductive coil (390) (e.g., antenna member) (e.g., second conductive pattern or second conductor) positioned to form a wireless signal in the rear direction (e.g., -z axis direction) of the electronic device (101) when unfolded. In one embodiment, the conductive coil (390) may be electrically connected to a near-field wireless communication circuit positioned in the internal space of the electronic device (101) (e.g., second space (3201) of the second housing (320)). In one embodiment, the near-field wireless communication circuit may be configured to transmit and / or receive a wireless signal in a frequency band of about 13.56 MHz through the conductive coil (390). In one embodiment, the conductive coil (390) may operate as another near-field communication antenna (NA2) (e.g., second near-field communication antenna).

[0082] An electronic device (101) according to an exemplary embodiment of the present disclosure is configured to form a wireless signal for short-range communication in the front and / or side directions as well as in the rear of the electronic device (101), thereby helping to improve the usability of the electronic device (101).

[0083] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0084] Referring to FIG. 4, the electronic device (101) may include a first side member (313) (e.g., a first side frame), a second side member (323) (e.g., a second side frame), and a hinge structure (340) (e.g., a hinge module or a hinge assembly) that rotatably connects the first side member (213) and the second side member (223). In one embodiment, the electronic device (101) may include a first extension member (3131) that extends at least partially from the first side member (313), or a second extension member (3231) that extends at least partially from the second side member (323). In one embodiment, the first extension member (3131) may include a first surface (3131a) facing the front direction (e.g., z-axis direction) of the electronic device (101) and a second surface (3131b) facing in the opposite direction (e.g., -z-axis direction) to the first surface (3131a). In one embodiment, the second extension member (3231) may include a third surface (3231a) facing the front direction (e.g., z-axis direction) and a fourth surface (3231b) facing in the opposite direction (e.g., -z-axis direction) to the third surface (3231a). In one embodiment, the first extension member (3131) may be formed integrally with the first side member (313) or structurally coupled with the first side member (313). In one embodiment, the second extension member (3231) may be formed integrally with the second side member (323) or structurally coupled with the second side member (323). In one embodiment, the electronic device (101) may include a first display (330) positioned to receive support from the first surface (3131a) of the first extension member (3131) and the third surface (3231a) of the second extension member (3231).In one embodiment, the electronic device (101) may include a first rear cover (314) coupled to a first side member (313) and providing a first space (e.g., the first space (3101) of FIG. 2b) between the second side member (313) and the second rear cover (324) coupled to a second side member (323) and providing a second space (e.g., the second space (3201) of FIG. 2b) between the fourth side (3231b) of the second extension member (3231). In one embodiment, the first side member (313) and the first rear cover (314) may be formed integrally. In one embodiment, the second side member (323) and the second rear cover (324) may be formed integrally. In one embodiment, the electronic device (101) may include a first housing (e.g., the first housing (310) of FIG. 2a) provided through a first side member (313), a first extension member (3131), and a first rear cover (314) (e.g., a first housing structure). In one embodiment, the electronic device (101) may include a second housing (e.g., the second housing (320) of FIG. 2a) provided through a second side member (323), a second extension member (3231), and a second rear cover (324) (e.g., a second housing structure). In one embodiment, the electronic device (101) may include a second display (400) positioned between the first rear cover (314) and the second surface (3131b) of the first extension member (3131), so as to be visible from the outside through at least a portion of the first rear cover (314).

[0085] According to one embodiment, the electronic device (101) may include a first substrate (361) (e.g., a first printed circuit board or main printed circuit board) disposed in a first space between a first side member (313) and a first rear cover (314), a camera assembly (363), a first battery (371), or a first bracket (351). In one embodiment, the camera assembly (363) may include a plurality of camera devices (e.g., camera devices (305, 308) of FIG. 2a and FIG. 3a) and may be electrically connected to the first substrate assembly (361). In one embodiment, the first bracket (351) may provide a support structure and enhanced rigidity for supporting the first substrate (361) and / or the camera assembly (363).

[0086] According to one embodiment, the electronic device (101) may include a second substrate (362) (e.g., a second PCB or sub-printed circuit board) disposed in a second space between a second side member (323) and a second rear cover (324), a conductive coil (390) (e.g., an antenna member), a second battery (372), or a second bracket (352). In one embodiment, the electronic device (101) is arranged to extend from the first substrate (361) across the hinge structure (340) to a plurality of electronic components (e.g., second substrate (362), second battery (372), or conductive coil (390)) disposed between the second side member (323) and the second rear cover (324), and may include a wiring member (380) providing an electrical connection (e.g., a flexible printed circuit board, FPCB). In one embodiment, the conductive coil (390) may operate as at least one of a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The conductive coil (390) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging.

[0087] According to one embodiment, the electronic device (101) may include a hinge housing (341) (e.g., hinge cover) that supports a hinge structure (340) and is exposed to the outside when the electronic device (101) is in a folded state (e.g., the folded state of FIG. 3a) and is positioned so as not to be seen from the outside by being retracted into a first space and / or a second space when the electronic device (101) is in an unfolded state (e.g., the unfolded state of FIG. 2a).

[0088] According to one embodiment, the electronic device (101) may include a first protective member (315) coupled along the edge of a first side member (313). In one embodiment, the electronic device (101) may include a second protective member (325) coupled along the edge of a second side member (323). In one embodiment, the first display (330) may have the edge of a first planar portion (e.g., the first portion (330a) in FIG. 3b) protected by the first protective member (315). In one embodiment, the first display (330) may have the edge of a second planar portion (e.g., the second portion (330b) in FIG. 3b) protected by the second protective member (325). In one embodiment, the electronic device (101) may include a protective cap (335) disposed to protect the edge of a flexible portion (e.g., the third portion (330c) in FIG. 3b) corresponding to the hinge structure (340) of the first display (330). In some embodiments, the protective cap (335) and / or protective members (315, 325) may be omitted.

[0089] FIG. 5 is an exploded perspective view illustrating a stacked structure of a flexible display (500) according to various embodiments of the present invention.

[0090] The flexible display (500) of FIG. 5 may include at least some similarities to the first display (330) of FIG. 2a or other embodiments of the display.

[0091] Referring to FIG. 5, a flexible display (500) (e.g., the first display (330) of FIG. 2a) may include a window (510) (e.g., a polyimide (PI) film), a polarizer (520) (e.g., a polarizing film) sequentially disposed on the back surface of the window (510), a display panel (530), a polymer member (540), and / or a support plate (550). According to one embodiment, the flexible display (500) may be disposed to extend from at least a portion of the internal space of a first housing (e.g., the first housing (310) of FIG. 2a) to at least a portion of the internal space of a second housing (e.g., the second housing (320) of FIG. 2a). For example, the flexible display (500) may extend from at least a portion of the internal space of a first housing (e.g., the first housing (310) of FIG. 2a) to at least a portion of the internal space of a second housing (e.g., the second housing (320) of FIG. 2a) across the folding axis (e.g., the folding axis (F) of FIG. 2a) of the electronic device (e.g., the electronic device (101) of FIG. 2a).

[0092] According to one embodiment, the POL (520), display panel (530), polymer member (540), and support plate (550) may be attached to each other through adhesive members (P1, P2, P3). For example, the adhesive members (P1, P2, P3) may include at least one of OCA (optical clear adhesive), PSA (pressure sensitive adhesive), heat-reactive adhesive, general adhesive, or double-sided tape. According to one embodiment, the flexible display (500) may include another adhesive member (P4) (e.g., double-sided tape or waterproof member) positioned along the edge on the back of the support plate (550).

[0093] According to one embodiment, the polymer member (540) may be applied with a dark color (e.g., black) to help with background display when the display is off. According to one embodiment, the polymer member (540) may act as a cushion to absorb shock from the outside of the electronic device to prevent damage to the flexible display (500).

[0094] According to one embodiment, the support plate (550) serves to support the display panel (530) and may include SUS, Ti, Glass, GFRP (glass fiber reinforced plastic) or CFRP (carbon fiber reinforced plastic).

[0095] According to one embodiment, the support plate (550) may further include a metal sheet to help reinforce the rigidity of the electronic device (101), shield ambient noise, and dissipate heat emitted from an ambient heat dissipation component (e.g., the processor (120) of FIG. 1). According to one embodiment, the support plate (550) may include at least one metal sheet among Cu, Al, SUS, or CLAD (e.g., a laminated member in which SUS and Al are alternately arranged).

[0096] FIG. 6 is an enlarged plan view of a portion of the support plate shown in FIG. 5.

[0097] The support plate (550) of FIG. 6 may include at least some similarities to the support plate (550) of FIG. 5 or other embodiments of the support plate (550).

[0098] Referring to FIG. 6, a support plate (550) according to one embodiment may include a first planar portion (551) facing a first housing (e.g., the first housing (310) of FIG. 2a), a second planar portion (552) facing a second housing (e.g., the second housing (320) of FIG. 2a), and a bendable portion (553) formed to be bendable through a plurality of openings (5531) spaced apart and positioned to face a hinge structure (e.g., the hinge structure (340) of FIG. 4) between the first planar portion (551) and the second planar portion (552).

[0099] According to one embodiment, the bendable portion (553) may include a plurality of openings (5531) spaced apart from each other. According to one embodiment, the openings (5531) may refer to areas from which metal material has been removed.

[0100] In the present disclosure, the openings (5531) of the support plate (550) may refer to areas where a metal member is not placed in the bendable portion (553).

[0101] According to one embodiment, a plurality of openings (5531) may be formed along a first direction (e.g., length direction) (e.g., y-axis direction) and a second direction perpendicular to the first direction (e.g., width direction) (e.g., x-axis direction) of the bendable portion (553). According to one embodiment, the plurality of openings (5531) may be formed in an elliptical shape of an elongated hole along the first direction (e.g., y-axis direction) of the bendable portion (553). According to one embodiment, the plurality of openings (5531) may be arranged in an alternating manner along the second direction (e.g., x-axis direction) of the bendable portion (553). According to one embodiment, the plurality of openings (5531) may be arranged at regular or irregular intervals along the first direction (e.g., y-axis direction) and / or the second direction (e.g., x-axis direction). According to one embodiment, a plurality of openings (5531) may be formed with the same shape or different shapes. According to one embodiment, the bendable portion (553) may exhibit an elastic force that attempts to restore it to its original state after deformation through a perforated lattice structure formed by a plurality of openings (5531), and this elastic force may contribute to providing flexibility to the bendable portion.

[0102] According to one embodiment, the flexibility of the bendable portion (553) may be determined by the spacing, shape, or arrangement density between a plurality of openings (5531). For example, the flexibility of the bendable portion (553) may be determined by the length (l) of one opening (e.g., unit opening). According to one embodiment, the flexibility of the bendable portion (553) may be determined by the width (w) of one opening. According to one embodiment, the flexibility of the bendable portion (553) may be determined by a first spacing (d1) between openings (5531) formed in a second direction (e.g., x-axis direction). According to one embodiment, the flexibility of the bendable portion (553) may be determined by a second spacing (d2) between openings (5531) formed in a first direction (e.g., y-axis direction).

[0103] FIG. 7 is a schematic cross-sectional view of a flexible display (500) and a support plate (750) according to one embodiment.

[0104] Referring to FIG. 7, a flexible display (500) according to one embodiment may include a display panel disposed on a foldable housing.

[0105] According to one embodiment, a cover glass (720, 730) comprising a transparent plate (720) and a film layer (730) may be disposed on a display panel (710). In the illustrated example, the upper direction of the display panel (710) may be the Z direction. According to one embodiment, the transparent plate (720) may include ultra-thin glass (UTG). The film layer (730) may include a polyimide (PI) film and / or a polarization film. The transparent plate (720) and the film layer (730) may be bonded by an adhesive (e.g., pressure sensitive adhesive (PSA)) (762). In addition to PSA, the adhesive (762) may include optically clear adhesive (OCA), heat-reactive adhesive, or double-sided tape.

[0106] According to one embodiment, a cover glass (720, 730) including a transparent plate (720) and a film layer (730) and a display panel (710) may be joined by an adhesive (e.g., PSA) (761). In addition to PSA, the adhesive (761) may include OCA, a thermally reactive adhesive, or double-sided tape.

[0107] According to one embodiment, a plastic film (740) and a support plate (750) may be disposed on the back surface of the display panel (710). In the illustrated example, the back surface direction of the display panel (710) may be the -Z direction.

[0108] According to one embodiment, the plastic film (740) may be applied with a dark color (e.g., black) to help with background visibility when the display is off. According to one embodiment, the plastic film (740) may be at least partially similar or substantially identical to the polymer member (540) described with reference to FIG. 5. For example, the plastic film (740) may serve as a cushion.

[0109] According to one embodiment, a support plate (750) may be disposed on the back surface of a plastic film (740). The plastic film (740) and the support plate (750) may be joined by an adhesive (e.g., PSA) (763). In addition to PSA, the adhesive (763) may include OCA, a heat-reactive adhesive, or double-sided tape.

[0110] According to one embodiment, the support plate (750) may be at least partially similar or substantially identical to the support plate (550) described with reference to FIG. 6. For example, the support plate (750) may include a first planar portion (e.g., the first planar portion (551) of FIG. 6) facing a first housing (e.g., the first housing (310) of FIG. 2a), a second planar portion (e.g., the second planar portion (552) of FIG. 6) facing a second housing (e.g., the second housing (320) of FIG. 2a), and a bendable portion (553) (e.g., the bendable portion (553) of FIG. 6) formed to be bendable through a plurality of openings (751) (e.g., the plurality of openings (5531) of FIG. 6) arranged spaced apart between the first planar portion (551) and the second planar portion (552), and positioned to face a hinge structure (e.g., the hinge structure (340) of FIG. 4).

[0111] According to one embodiment, a first polymer (771) may be disposed inside a plurality of openings (751) of a support plate (750). The first polymer (771) may prevent assembly defects in which air bubbles are trapped inside the plurality of openings (751) and reduce deformation of the openings (751) to increase durability. According to one embodiment, the first polymer (771) may include various types of polymers.

[0112] According to one embodiment, a thermoplastic member (760) covering a plurality of openings (751) may be disposed on the back surface of the support plate (750). For example, the thermoplastic member (760) may include TPU (thermoplastic polyurethane).

[0113] According to one embodiment, a first polymer (771) disposed inside a plurality of openings (751) can serve to reduce defects in which bubbles are trapped inside the plurality of openings (751) when an adhesive (e.g., PSA) is disposed on the upper surface of the plurality of openings (751) and a thermoplastic member (760) is disposed on the back surface of the plurality of openings (751). For example, the first polymer (771) can serve to reduce defects in which bubbles are trapped inside the plurality of openings (751) and visible from the outside. For example, the first polymer (771) can serve to strengthen the durability of the flexible display (500) by preventing twisting deformation during folding or bending of the plurality of openings (751).

[0114] In this document, "first polymer (771)" may be used interchangeably with terms such as "resin".

[0115] According to one embodiment, the material of the support plate (750) may include SUS, Ti, CFRP, GFRP, or Glass. According to one embodiment, the thickness of the support plate (750) may be varied in design, and the pattern shape and dimension forming the openings (751) may be varied. According to one embodiment, the material of the first polymer (771) may be varied in design considering the thickness of the support plate (750), the pattern shape and dimension forming the openings (751). For example, the modulus of the first polymer (771) may be designed considering the thickness of the support plate (750). By designing the modulus of the first polymer (771) to a relatively larger value as the thickness of the support plate (750) decreases, the durability of the flexible display (500) can be enhanced.

[0116] According to one embodiment, the first polymer (771) may include a plurality of first conductive particles (7711). For example, if an air gap is placed without anything inside the plurality of openings (751), heat generated from components surrounding the plurality of openings (751) may not be easily discharged. In one embodiment of the present invention, the first polymer (771) is placed inside the plurality of openings (751), and in order to increase the thermal conductivity of the first polymer (771), the first polymer (771) may include a plurality of first conductive particles (7711). The first polymer (771) including a plurality of first conductive particles (7711) can serve to easily transfer heat generated from components surrounding the plurality of openings (751) in a vertical or horizontal direction. For example, a first polymer (771) comprising a plurality of first conductive particles (7711) can serve to transfer heat generated from the flexible display (500) to a structure (e.g., a hinge structure (340) of FIG. 4) placed at the bottom of the support plate (750).

[0117] FIG. 8 is a cross-sectional view illustrating an embodiment in which a second polymer (772) covering an opening is disposed on a support plate (750).

[0118] The embodiment of FIG. 8 may be similar to the embodiment of FIG. 7 in at least some parts. Hereinafter, the embodiment of FIG. 8 that differs from the embodiment of FIG. 7 will be described. Features of components not described in FIG. 8 will be replaced by the description of the embodiment of FIG. 7.

[0119] In the embodiment of FIG. 8, unlike the embodiment of FIG. 7, a second polymer (772) covering an opening may be disposed on the support plate (750).

[0120] According to one embodiment, a second polymer (772) may be further disposed on the support plate (750). For example, the second polymer (772) may be disposed between the support plate (750) and the plastic film. According to one embodiment, the second polymer (772) may be disposed to cover a plurality of openings (751) between the plastic film and the support plate (750).

[0121] According to one embodiment, the second polymer (772) is positioned to correspond to the bendable portion (553) of the support plate (750) and may not be positioned to correspond to the first planar portion (e.g., the first planar portion (551) of FIG. 6) and the second planar portion (e.g., the second planar portion (552) of FIG. 6) of the support plate (750). For example, the second polymer (772) may be positioned in the opening (7631) of an adhesive (e.g., adhesive member) (763) that bonds the plastic film and the support plate (750).

[0122] According to one embodiment, the material and thickness of the second polymer (772) may be varied in design. For example, the material and thickness of the second polymer (772) may be varied according to the laminated structure placed between the support plate (750) and the display panel. For example, if a protective layer (e.g., barrier-PI layer) is removed between the plastic film and the support plate (750), the modulus and thickness of the second polymer (772) may be designed to be relatively high and may be designed to have properties for maintaining slip with an adhesive (e.g., adhesive member) (763) during repeated folding of the flexible display (500).

[0123] According to one embodiment, the first polymer (771) and the second polymer (772) disposed inside a plurality of openings may include the same material.

[0124] According to one embodiment, the first polymer (771) and the second polymer (772) disposed inside a plurality of openings may include different materials.

[0125] According to one embodiment, the first polymer (771) may include a plurality of first conductive particles (7711). For example, if an air gap is placed without anything inside the plurality of openings (751), heat generated from components surrounding the plurality of openings (751) may not be easily discharged. In one embodiment of the present invention, the first polymer (771) is placed inside the plurality of openings (751), and in order to increase the thermal conductivity of the first polymer (771), the first polymer (771) may include a plurality of first conductive particles (7711). The first polymer (771) including a plurality of first conductive particles (7711) can serve to easily transfer heat generated from components surrounding the plurality of openings (751) in a vertical or horizontal direction. For example, a first polymer (771) comprising a plurality of first conductive particles (7711) can serve to transfer heat generated from the flexible display (500) to a structure (e.g., a hinge structure (340) of FIG. 4) placed at the bottom of the support plate (750).

[0126] According to one embodiment, the second polymer (772) may include a plurality of second conductive particles (7721). In one embodiment of the present invention, the first polymer (771) is placed inside a plurality of openings (751), and in order to increase the thermal conductivity of the first polymer (771), the first polymer (771) may include a plurality of first conductive particles (7711). In one embodiment of the present invention, the second polymer (772) is placed on the first polymer (771), and in order to increase the thermal conductivity of the second polymer (772), the second polymer (772) may include a plurality of second conductive particles (7721).

[0127] According to one embodiment, the material of the plurality of first conductive particles (7711) and the material of the plurality of second conductive particles (7721) may be the same.

[0128] According to one embodiment, the material of the plurality of first conductive particles (7711) and the material of the plurality of second conductive particles (7721) may be different from each other.

[0129] According to one embodiment, the particle size of a plurality of first conductive particles (7711) and the particle size of a plurality of second conductive particles (7721) may be substantially the same.

[0130] According to one embodiment, the particle sizes of a plurality of first conductive particles (7711) and a plurality of second conductive particles (7721) may be substantially different from each other.

[0131] FIG. 9 is a cross-sectional view illustrating an embodiment in which a second polymer (772) according to an embodiment is arranged to correspond to the entire surface area of ​​a support plate (750).

[0132] The embodiment of FIG. 9 may be similar to the embodiment of FIG. 8 in at least some parts. Hereinafter, the embodiment of FIG. 9 that differs from the embodiment of FIG. 8 will be described. Features of components not described in FIG. 9 will be replaced by the description of the embodiment of FIG. 8.

[0133] In the embodiment of FIG. 9, unlike the embodiment of FIG. 8, the second polymer (772) on the support plate (750) may be positioned to correspond to the entire surface area of ​​the support plate (750). For example, the second polymer (772) may be positioned to correspond not only to the bendable portion (553) of the support plate (750), but also to the first planar portion (e.g., the first planar portion (551) of FIG. 6) and the second planar portion (e.g., the second planar portion (552) of FIG. 6) of the support plate (750).

[0134] FIG. 10 is a conceptual diagram illustrating a manufacturing method for filling the opening of a support plate (750) with a first polymer (771) according to one embodiment.

[0135] Referring to FIG. 10, a manufacturing method for filling the openings of a support plate (750) with a first polymer (771) may include the following process. For example, when filling the first polymer (771) into the openings (751), a jetting method (1001) may be used to fill the polymer into the openings (751) without bubbles while minimizing the step difference with the surface of the support plate (750). The jetting method (1001) may be performed after the support plate (750) is placed on a process protective film (1010).

[0136] According to one embodiment, the material of the first polymer (771) suitable for the jetting method (1001) may preferably be a material of relatively low viscosity to eject small droplets to fill the interior of the openings (751). For example, after rapidly shooting fine droplets to fill the openings (751), a photocuring process or a thermal curing process may be performed. Accordingly, the material of the first polymer (771) filled in the openings (751) can maintain adhesion to the inner surface of the openings (751) while solidifying, and the step difference with the surface of the support plate (750) (e.g., the upper surface or lower surface of the support plate (750)) can be maintained within a tolerance level.

[0137] According to one embodiment, when the first polymer (771) filled inside the openings (751) and the second polymer (772) covering the top of the openings (751) are of the same material, the polymer material can be first jetted and cured inside the openings (751), and then the polymer material can be coated and cured on the front surface of the support plate (750) or on a part of the upper surface corresponding to the openings.

[0138] According to one embodiment, when the first polymer (771) filled inside the openings (751) and the second polymer (772) covering the top of the openings (751) are of the same material, the resin, which is the material of the polymer, can be applied first to the entire area of ​​the openings (751), and then a vacuum degassing process can be performed to allow the bubbles inside the openings (751) to escape to the surface. Subsequently, after applying the resin, which is the material of the polymer, in a specified shape (e.g., T-map shape or Y-map shape), a lamination process can be performed.

[0139] According to one embodiment, in the process of coating a second polymer (772) on the upper part of the openings (751), the flat part of the support plate (750) may be masked with a dam that is lower than the thickness of the adhesive (e.g., PSA layer), and after depositing the material of the second polymer (772), a curing process may be performed.

[0140] FIGS. 11 and FIGS. 12 are cross-sectional views illustrating an embodiment in which a second polymer (772) and a third polymer (773) are disposed on a support plate (750).

[0141] The embodiments of FIGS. 11 and 12 may be similar to the embodiment of FIG. 9 in at least some respects. Hereinafter, the embodiments of FIGS. 11 and 12 that differ from the embodiment of FIG. 9 will be described. Features of components not described in FIGS. 11 and 12 will be replaced by the description of the embodiment of FIG. 9.

[0142] In the embodiments of FIG. 11 and FIG. 12, unlike the embodiment of FIG. 9, the second polymer (772) and the third polymer (773) may be disposed on the support plate (750).

[0143] According to one embodiment, the second polymer (772) and the third polymer (773) may be arranged to correspond to the entire surface area of ​​the support plate (750). For example, the second polymer (772) may be arranged to correspond to the first planar portion (e.g., the first planar portion (551) of FIG. 6) and the second planar portion (e.g., the second planar portion (552) of FIG. 6) of the support plate (750), as well as the bendable portion (553) of the support plate (750). For example, the third polymer (773) may be arranged to correspond to the first planar portion (e.g., the first planar portion (551) of FIG. 6) and the second planar portion (e.g., the second planar portion (552) of FIG. 6) of the support plate (750), as well as the bendable portion (553) of the support plate (750).

[0144] Referring to FIG. 11, the first polymer (771), the second polymer (772), and the third polymer (773) may include polymers of different materials. For example, the first polymer (771) may have a first modulus, the second polymer (772) may have a second modulus different from the first modulus, and the third polymer (773) may have a third modulus different from the first and second modulus.

[0145] Referring to FIG. 12, the first polymer (771) and the second polymer (772) may have the same material, and the third polymer (773) may have a different material from the first polymer (771) and the second polymer (772). For example, the first polymer (771) and the second polymer (772) may have a first modulus, and the third polymer (773) may have a second modulus different from the first modulus.

[0146] According to one embodiment, the first polymer (771) filling the openings (751) for the purpose of strength reinforcement may include various polymer materials to increase the strength of a specific area.

[0147] According to one embodiment, the third polymer (773) may include a plurality of third conductive particles (not shown). In one embodiment of the present invention, to increase the thermal conductivity of the third polymer (773), the third polymer (773) may include a plurality of third conductive particles. The plurality of third conductive particles may be similar in at least some parts (e.g., material of the particles and / or particle size) to the plurality of first conductive particles (7711) and the plurality of second conductive particles (7721) described with reference to FIG. 7 or FIG. 8.

[0148] FIG. 13 is a plan view and a cross-sectional view illustrating a portion of a bendable portion (553) of a support plate (750) according to one embodiment. For example, FIG. 13 includes a cross-sectional view in which a portion of the bendable portion (553) is cut along line AA', which is a portion of the bendable portion (553).

[0149] Referring to FIG. 13, a support plate (750) according to one embodiment may have the widths of the openings (751) designed to vary in size to increase the rigidity of the bendable portion (553) while maintaining flexible bendability. According to one embodiment, the material of the first polymer (771) filling the openings (751) may be changed based on the width of the openings.

[0150] According to one embodiment, the plurality of openings (751) may include at least one first opening (751a) having a first width and at least one second opening (751b) having a second width smaller than the first width. According to one embodiment, at least one first opening (751a) having a first width may be positioned in a relatively central portion of the bendable portion (553). According to one embodiment, at least one second opening (751b) having a second width may be positioned on both sides of the bendable portion (553). For example, at least one second opening (751b) may be positioned on one side of the bendable portion (553) adjacent to the first planar portion (e.g., the first planar portion (551) of FIG. 6). For example, at least one second opening (751b) may be placed on the other side of the bendable portion (553) adjacent to the second planar portion (e.g., the second planar portion (552) of FIG. 6).

[0151] According to one embodiment, the first polymer (771) disposed in the at least one first opening (751a) has a first modulus (771a), and the first polymer (771) disposed in the at least one second opening (751b) may have a second modulus (771b) greater than the first modulus.

[0152] A support plate (750) according to one embodiment can increase strength by designing the width of openings (751) (e.g., at least one first opening (751a)) placed in the central part of a bendable portion (553) that has relatively weak strength, and filling the interior with a first polymer (771) of a material with a low modulus.

[0153] A support plate (750) according to one embodiment may have the width of the openings (751) (e.g., at least one second opening (751b)) designed to be relatively small to maintain flexibility in the outer portion of the relatively high-strength bendable portion (553), and may have its strength increased by filling the interior with a first polymer (771) of a material with a high modulus.

[0154] According to one embodiment, as shown in 1301 of FIG. 13, the second polymer (772) may not be placed on the support plate (750).

[0155] According to one embodiment, as shown in 1302 of FIG. 13, a second polymer (772) may be disposed on a support plate (750), and the second polymer (772) may be disposed to correspond to the entire surface area of ​​the support plate (750). For example, the second polymer (772) may be disposed to correspond to the first planar portion (e.g., the first planar portion (551) of FIG. 6) and the second planar portion (e.g., the second planar portion (552) of FIG. 6), as well as the bendable portion (553) of the support plate (750).

[0156] FIG. 14 is a plan view and a cross-sectional view illustrating a portion of a bendable portion (553) of a support plate (750) according to one embodiment. For example, FIG. 14 includes a cross-sectional view in which a portion of the bendable portion (553) is cut along lines AA' and BB', which are portions of the bendable portion (553).

[0157] Referring to FIG. 14, according to one embodiment, the material of the first polymer (771) filling the openings (751) may be changed based on the arrangement structure of the parts facing (or overlapping) the support plate (750).

[0158] According to one embodiment, the plurality of openings (751) may include at least one first opening (751a) that overlaps with a designated part of the hinge structure, and at least one second opening (751b) that does not overlap with the designated part of the hinge structure.

[0159] According to one embodiment, the first polymer (771) disposed in the at least one first opening (751a) has a third modulus (771a), and the first polymer (771) disposed in the at least one second opening (751b) may have a fourth modulus (771b) smaller than the third modulus (771a).

[0160] For example, if the widths of the openings (751) are designed to be the same, increasing the modulus of the first polymer (771) filled in the openings increases durability, but the repulsion force may also increase accordingly. If the repulsion force of the first polymer (771) increases, defects such as the first polymer (771) peeling off inside the openings and the openings (751) breaking may occur, which may lower the durability of the support plate (750). In one embodiment of the present invention, the design may be different for at least one first opening (751a) that overlaps with a designated part of the hinge structure and at least one second opening (751b) that does not overlap, as these parts may be relatively weak mechanically or during the assembly process. For example, a first polymer (771) with a relatively large third modulus can be filled into at least one first opening (751a) that is relatively weak in strength, and a first polymer (771) with a relatively small fourth modulus can be filled into at least one second opening (751b) that is relatively weak in strength.

[0161] In one embodiment of the present invention, the first polymer (771) can be filled only inside the openings (751) to prevent an increase in the thickness of the entire display module due to the polymer.

[0162] In one embodiment of the present invention, when a second polymer (772) (or a second polymer (772) and a third polymer (773)) is coated on a support plate (750), the materials of the polymers can be selected in a modulus range that provides a slip effect between the support plate (750) and the adhesive (e.g., the adhesive (763) of FIG. 7) while also ensuring strength.

[0163] According to one embodiment, as shown in 1401 and 1402 of FIG. 14, the second polymer (772) may not be placed on the support plate (750).

[0164] According to one embodiment, as shown in 1403 and 1404 of FIG. 14, a second polymer (772) may be disposed on the support plate (750), and the second polymer (772) may be disposed to correspond to the entire surface area of ​​the support plate (750). For example, the second polymer (772) may be disposed to correspond to the first planar portion (e.g., the first planar portion (551) of FIG. 6) and the second planar portion (e.g., the second planar portion (552) of FIG. 6), as well as the bendable portion (553) of the support plate (750).

[0165] FIG. 15 is a schematic plan view of a support plate (750) included in a rollable electronic device according to one embodiment.

[0166] Referring to FIG. 15, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1 may be a rollable electronic device (hereinafter referred to as a “rollable electronic device”).

[0167] According to one embodiment, the electronic device may include a rollable housing comprising a first housing and a second housing movably coupled to the first housing.

[0168] According to one embodiment, the electronic device includes a flexible display (710) (e.g., the display module (160) of FIG. 1), and the flexible display (710) may be divided into a first display area (710A) and a second display area (710B).

[0169] According to one embodiment, the first display area (710A) of the flexible display (710) may be an area that is visually visible from the outside when the rollable housing is in a contracted state. The first display area (710A) of the flexible display (710) may also be an area that is visually visible from the outside even when the rollable housing is in an expanded state.

[0170] According to one embodiment, the second display area (710B) of the flexible display (710) is an area extended from the first display area (710A) and may be an area that is not visually visible from the outside when the rollable housing is in a contracted state and is positioned in a sliding state inside the rollable housing. The second display area (710B) of the flexible display (710) may be an area that is visually visible from the outside when it is in an expanded state and is positioned in a sliding state out from inside the rollable housing.

[0171] According to one embodiment, the stacked structure of the flexible display (710) may be at least partially similar or substantially identical to the stacked structure of the flexible display (500, 710) described with reference to FIGS. 5 to 14. For example, the flexible display (710) may include a display panel, a plastic film disposed on the back surface of the display panel, and a support plate (750) disposed on the back surface of the plastic film.

[0172] According to one embodiment, the support plate (750) may include a flat portion (750A) corresponding to a first display area (710A), and a bendable portion (750B) corresponding to a second display area (710B) and formed to be bendable through a plurality of spaced openings (751).

[0173] According to one embodiment, a first polymer (e.g., the first polymer (771) of FIG. 16) may be disposed inside a plurality of openings (751) disposed in a bendable portion (750B). According to one embodiment, the first polymer (771) disposed inside the plurality of openings (751) may serve to reduce the defect of air bubbles being trapped inside the plurality of openings (751) when an adhesive (e.g., PSA) is disposed on the upper surface of the plurality of openings (751) and a thermoplastic member is disposed on the back surface of the plurality of openings (751).

[0174] According to one embodiment, the shape of the support plate (750) of the rollable electronic device may vary depending on the use and purpose, and an opening (751) may not be formed in part of the bendable portion (750B) to reinforce the strength of the rolling drive part.

[0175] According to one embodiment, the rollable electronic device can increase durability by filling the first polymer (771) only inside the opening (751).

[0176] According to one embodiment, the rollable electronic device can increase durability and improve surface quality by placing a first polymer (771) inside the opening (751) and also placing a second polymer (772) on the front surface of a support plate (750) covering the opening (751).

[0177] FIG. 16 is a schematic cross-sectional view of the support plate (750) shown in FIG. 15.

[0178] Referring to FIG. 16, according to one embodiment, the support plate (750) may include a flat portion (750A) corresponding to a first display area (710A), and a bendable portion (750B) corresponding to a second display area (710B) and formed to be bendable through a plurality of openings (751) spaced apart.

[0179] According to one embodiment, a first polymer (771) may be disposed inside a plurality of openings (751) disposed in a bendable portion (750B). According to one embodiment, the first polymer (771) disposed inside the plurality of openings (751) may serve to reduce the defect of air bubbles being trapped inside the plurality of openings (751) when an adhesive (e.g., PSA) is disposed on the upper surface of the plurality of openings (751) and a thermoplastic member is disposed on the back surface of the plurality of openings (751).

[0180] According to one embodiment, the material of the first polymer (771) may be designed to take into account the thickness of the support plate (750), the pattern shape and dimension forming the openings (751). For example, the modulus of the first polymer (771) may be designed to take into account the thickness of the support plate (750). By designing the modulus of the first polymer (771) to have a relatively larger value as the thickness of the support plate (750) decreases, the durability of the flexible display (710) can be enhanced.

[0181] FIG. 17 is a schematic cross-sectional view of the support plate (750) shown in FIG. 15.

[0182] The embodiment of FIG. 17 may be similar to the embodiment of FIG. 16 in at least some parts. Hereinafter, the embodiment of FIG. 17 that differs from the embodiment of FIG. 16 will be described. Features of components not described in FIG. 17 will be replaced by the description of the embodiment of FIG. 16.

[0183] In the embodiment of FIG. 17, unlike the embodiment of FIG. 16, a second polymer (772) covering an opening may be disposed on the support plate (750).

[0184] According to one embodiment, a second polymer (772) may be further disposed on the support plate (750). For example, the second polymer (772) may be disposed between the support plate (750) and the plastic film. According to one embodiment, the second polymer (772) may be disposed to cover a plurality of openings (751) between the plastic film and the support plate (750). For example, the second polymer (772) on the support plate (750) may be disposed to correspond to the entire surface area of ​​the support plate (750).

[0185] According to one embodiment, the first polymer (771) and the second polymer (772) disposed inside a plurality of openings may include the same material.

[0186] According to one embodiment, the first polymer (771) and the second polymer (772) disposed inside a plurality of openings may include different materials.

[0187] FIG. 18 is a schematic plan view of a multi-foldable electronic device and a support plate (750) included therein according to one embodiment.

[0188] Referring to FIG. 18, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1 may be a multi-foldable electronic device (hereinafter referred to as "multi-foldable electronic device").

[0189] According to one embodiment, the electronic device may include a foldable housing (1800) comprising a first housing (1801), a second housing (1802), and a third housing (1803). The first housing (1801) and the second housing (1802) may be foldably coupled to each other. The second housing (1802) and the third housing (1803) may be foldably coupled to each other.

[0190] According to one embodiment, a flexible display (1850) may be disposed on a foldable housing (1800). For example, the flexible display (1850) may include a first display area (1851) disposed in a first housing (1801), a second display area (1852) disposed in a second housing (1802), and a third display area (1853) disposed in a third housing (1803). The first display area (1851), the second display area (1852), and the third display area (1853) of the flexible display (1850) may form a single display area that is continuously connected.

[0191] According to one embodiment, a first bending display area (1854) may be disposed between a first display area (1851) and a second display area (1852). According to one embodiment, the first bending display area (1854) is disposed to correspond to a first hinge structure between a first housing (1801) and a second housing (1802) and may be bent in an in-folding manner when the first housing (1801) and the second housing (1802) are folded toward each other. A first bendable portion (1841) of a support plate (750) may be disposed on the back surface of this first bending display area (1854).

[0192] According to one embodiment, a second bending display area (1855) may be disposed between the second display area (1852) and the third display area (1853). According to one embodiment, the second bending display area (1855) is disposed to correspond to a second hinge structure between the second housing (1802) and the third housing (1803) and may be bent in an in-folding manner when the second housing (1802) and the third housing (1803) are folded toward each other. A second bendable portion (1842) of a support plate (750) may be disposed on the back of this second bending display area (1855).

[0193] According to one embodiment, when the foldable housing (1800) is in a folded state, the first housing (1801) and the second housing (1802) may be configured to be folded in an in-folding manner so that the first display area (1851) and the second display area (1852) face each other. Accordingly, when the foldable housing (1800) is in a folded state, the first bending display area (1854) may be subjected to relatively greater stress compared to the second bending display area (1855), and relatively greater stress may also be applied to the first bendable portion (1841) of the support plate (750) disposed on the back surface of the first bending display area (1854).

[0194] According to one embodiment, when the foldable housing (1800) is in a folded state, the second housing (1802) and the third housing (1803) may be configured to be folded in an in-folding manner so that the third display area (1853) faces the back surface of the first housing (1801). Accordingly, when the foldable housing (1800) is in a folded state, the second bending display area (1855) may receive relatively less stress compared to the first bending display area (1854), and relatively less stress may also be applied to the second bendable portion (1842) of the support plate (750) placed on the back surface of the second bending display area (1855).

[0195] According to one embodiment, the stacked structure of the flexible display (1850) may be at least partially similar or substantially identical to the stacked structure of the flexible display (500, 710) described with reference to FIGS. 5 to 14. For example, the flexible display (1850) may include a display panel, a plastic film disposed on the back surface of the display panel, and a support plate (750) disposed on the back surface of the plastic film.

[0196] According to one embodiment, the support plate (750) may include a first planar portion (1810) facing a first housing (1801), a second planar portion (1820) facing a second housing (1802), a third planar portion (1830) facing a third housing (1803), a first bendable portion (1841) disposed between the first planar portion (1810) and the second planar portion (1820) and formed to be bendable through a plurality of first openings (e.g., the first opening (751a) of FIG. 20), and a second bendable portion (1842) disposed between the second planar portion (1820) and the third planar portion (1830) and including a plurality of second openings (e.g., the second opening (751b) of FIG. 20).

[0197] According to one embodiment, a polymer may be disposed inside a plurality of first openings (e.g., the first opening (751a) of FIG. 20) and inside a plurality of second openings (e.g., the second opening (751b) of FIG. 20) of a support plate (750). For example, a first polymer (e.g., the first polymer (2011) of FIG. 20) may be disposed inside a plurality of first openings (e.g., the first opening (751a) of FIG. 20), and a second polymer (e.g., the second polymer (2012) of FIG. 20) may be disposed inside a plurality of second openings (e.g., the second opening (751b) of FIG. 20).

[0198] According to one embodiment, the first polymer may have a first modulus and a first elongation. When the foldable housing (1800) is in a folded state, the first bending indicator area (1854) may be subjected to relatively large stress compared to the second bending indicator area (1855), and relatively large stress may also be applied to the first bendable portion (1841) of the support plate (750) disposed on the back surface of the first bending indicator area (1854). Accordingly, the first polymer may have a relatively large first modulus and a first elongation.

[0199] According to one embodiment, the second polymer may have a second modulus smaller than the first modulus and a second elongation smaller than the first elongation. When the foldable housing (1800) is in a folded state, the second bending indicator area (1855) may receive relatively less stress compared to the first bending indicator area (1854), and relatively less stress may also be applied to the second bendable portion (1842) of the support plate (750) disposed on the back surface of the second bending indicator area (1855). Accordingly, the second polymer may have a relatively small second modulus and a second elongation.

[0200] According to one embodiment, the polymer (2011, 2012) can serve to reduce the defect of air bubbles being trapped inside the openings (751a, 751b) when an adhesive (e.g., PSA) is placed on the upper surface of the openings (751a, 751b) and a thermoplastic member is placed on the back surface of the openings (751a, 751b).

[0201] FIG. 19 is a schematic plan view of a multi-foldable electronic device and a support plate (750) included therein according to one embodiment.

[0202] The embodiment of FIG. 19 may be similar to the embodiment of FIG. 18 in at least some respects. Hereinafter, the embodiment of FIG. 19 that differs from the embodiment of FIG. 18 will be described. Features of components not described in FIG. 19 will be replaced by the description of the embodiment of FIG. 18.

[0203] Referring to FIG. 19, when the foldable housing (1800) is in a folded state, the first housing (1801) and the second housing (1802) may be configured to be folded in an in-folding manner so that the first display area (1851) and the second display area (1852) face each other. According to one embodiment, when the foldable housing (1800) is in a folded state, the second housing (1802) and the third housing (1803) may be configured to be folded in an out-folding manner so that the back surface of the second housing (1802) and the back surface of the third housing (1803) face each other.

[0204] According to one embodiment, when the foldable housing (1800) is in a folded state, the first bending indicator area (1854) may receive relatively less stress compared to the second bending indicator area (1855), and relatively less stress may also be applied to the first bendable portion (1841) of the support plate (750) disposed on the back surface of the first bending indicator area (1854). Accordingly, the first polymer may have a relatively small first modulus and a first elongation rate.

[0205] According to one embodiment, when the foldable housing (1800) is in a folded state, the second bending indicator area (1855) may be subjected to relatively greater stress compared to the first bending indicator area (1854), and relatively greater stress may also be applied to the second bendable portion (1842) of the support plate (750) disposed on the back surface of the second bending indicator area (1855). Accordingly, the second polymer may have a relatively large second modulus and a second elongation rate. For example, the second polymer may have a second modulus greater than the first modulus and a second elongation rate greater than the first elongation rate.

[0206] FIG. 20 is a schematic cross-sectional view of the support plate (750) shown in FIG. 18.

[0207] Referring to FIG. 20, a first polymer (2011) may be disposed inside a plurality of first openings (751a), and a second polymer (2012) may be disposed inside a plurality of second openings (751b).

[0208] According to one embodiment, the first polymer (2011) and the second polymer (2012) may include the same material. For example, the first polymer (2011) and the second polymer (2012) may be designed to have the same modularity.

[0209] FIG. 21 is a schematic cross-sectional view of the support plate (750) shown in FIG. 18.

[0210] The embodiment of FIG. 21 may be similar to the embodiment of FIG. 20 in at least some respects. Hereinafter, the embodiment of FIG. 21 that differs from the embodiment of FIG. 20 will be described. Features of components not described in FIG. 21 will be replaced by the description of the embodiment of FIG. 20.

[0211] In the embodiment of FIG. 21, unlike the embodiment of FIG. 20, a third polymer (2013) covering the openings (751a, 751b) on the support plate (750) may be disposed. According to one embodiment, the third polymer (2013) may be disposed to correspond to the entire surface area of ​​the support plate (750).

[0212] According to one embodiment, the first polymer (2011) and the second polymer (2012) contain materials of the same type, and the materials of the third polymer (2013) and the materials of the first polymer (2011) and the second polymer (2012) may be different from each other. For example, the first polymer (2011) and the second polymer (2012) contain materials of the same modulus, and the modulus of the third polymer (2013) and the modulus of the first polymer (2011) and the second polymer (2012) may be different from each other.

[0213] FIG. 22 is a schematic cross-sectional view of the support plate (750) shown in FIG. 18.

[0214] The embodiment of FIG. 22 may be similar to the embodiment of FIG. 20 in at least some respects. Hereinafter, the embodiment of FIG. 22 that differs from the embodiment of FIG. 20 will be described. Features of components not described in FIG. 22 will be replaced by the description of the embodiment of FIG. 20.

[0215] Unlike the embodiment of FIG. 20, the first polymer (2011) and the second polymer (2012) may be made of different materials. For example, the first polymer (2011) may have a first modulus and a first elongation, and the second polymer (2012) may have a second modulus smaller than the first modulus and a second elongation smaller than the first elongation.

[0216] FIG. 23 is a schematic cross-sectional view of the support plate (750) shown in FIG. 18.

[0217] The embodiment of FIG. 23 may be similar to the embodiment of FIG. 22 in at least some respects. Hereinafter, the embodiment of FIG. 23 that differs from the embodiment of FIG. 22 will be described. Features of components not described in FIG. 23 will be replaced by the description of the embodiment of FIG. 22.

[0218] In the embodiment of FIG. 23, unlike the embodiment of FIG. 22, a third polymer (2013) covering the openings (751a, 751b) on the support plate (750) may be disposed. According to one embodiment, the third polymer (2013) may be disposed to correspond to the entire surface area of ​​the support plate (750).

[0219] According to one embodiment, the first polymer (2011), the second polymer (2012), and the first polymer (2011) may all include different materials. For example, the material of the first polymer (2011) and the material of the second polymer (2012) may be different from each other, the material of the second polymer (2012) and the material of the third polymer (2013) may be different from each other, and the material of the first polymer (2011) and the material of the third polymer (2013) may be different from each other.

[0220] An electronic device according to one embodiment of the present disclosure comprises: a foldable housing including a first housing, a second housing, and a hinge structure connecting the first housing and the second housing; and a flexible display disposed on the foldable housing, the flexible display including a display panel, a plastic film disposed on the back surface of the display panel, and a support plate disposed on the back surface of the plastic film, wherein the support plate comprises a first planar portion facing the first housing, a second planar portion facing the second housing, and a bendable portion formed to be bendable through a plurality of openings disposed spaced apart and facing the hinge structure between the first planar portion and the second planar portion, and a first polymer may be disposed inside the plurality of openings.

[0221] Covering the plurality of openings between the plastic film and the support plate, a second polymer may be further included.

[0222] The second polymer is positioned to correspond to the bendable portion and may not be positioned on the first planar portion and the second planar portion.

[0223] The apparatus further includes an adhesive member disposed between the plastic film and the support plate, and the second polymer may be disposed in an opening of the adhesive member corresponding to the bendable portion.

[0224] The second polymer can be positioned to correspond to the entire surface area of ​​the support plate.

[0225] It may further include a third polymer disposed between the second polymer and the plastic film.

[0226] It may further include a thermoplastic member covering the plurality of openings on the back surface of the support plate.

[0227] The plurality of openings includes at least one first opening having a first width and at least one second opening having a second width smaller than the first width, and the first polymer disposed in the at least one first opening has a first modulus, and the first polymer disposed in the at least one second opening may have a second modulus larger than the first modulus.

[0228] The plurality of openings includes at least one first opening that overlaps with a designated part of the hinge structure and at least one second opening that does not overlap with the designated part of the hinge structure, and the first polymer disposed in the at least one first opening has a third modulus, and the first polymer disposed in the at least one second opening may have a fourth modulus smaller than the third modulus.

[0229] An electronic device according to one embodiment of the present disclosure comprises: a foldable housing comprising a first housing, a second housing, and a third housing; and a flexible display disposed on the foldable housing, the flexible display comprising a display panel, a plastic film disposed on the back surface of the display panel, and a support plate disposed on the back surface of the plastic film, wherein the support plate comprises a first planar portion facing the first housing, a second planar portion facing the second housing, a third planar portion facing the third housing, a first bendable portion disposed between the first planar portion and the second planar portion and formed to be bendable through a plurality of first openings, and a second bendable portion disposed between the second planar portion and the third planar portion and formed to be bendable through a plurality of second openings, wherein a first polymer is disposed inside the plurality of first openings and a second polymer is disposed inside the plurality of second openings.

[0230] The flexible display comprises a first display area disposed in the first housing, a second display area disposed in the second housing, and a third display area disposed in the third housing, and when the foldable housing is in a folded state, the first housing and the second housing are configured to be folded in an in-folding manner so that the first display area and the second display area face each other, and the second housing and the third housing are configured to be folded in an in-folding manner so that the third display area faces the back surface of the first housing, and the first polymer has a first modulus and a first elongation rate, and the second polymer may have a second modulus smaller than the first modulus and a second elongation rate smaller than the first elongation rate.

[0231] It may further include a third polymer covering the plurality of first openings and the plurality of second openings between the plastic film and the support plate.

[0232] The third polymer can be positioned to correspond to the entire surface area of ​​the support plate.

[0233] The flexible display comprises a first display area disposed in the first housing, a second display area disposed in the second housing, and a third display area disposed in the third housing, and when the foldable housing is in a folded state, the first housing and the second housing are configured to be folded in an in-folding manner so that the first display area and the second display area face each other, and the second housing and the third housing are configured to be folded in an out-folding manner so that the back surface of the second housing and the back surface of the third housing face each other, and the first polymer has a first modulus and a first elongation rate, and the second polymer may have a second modulus greater than the first modulus and a second elongation rate greater than the first elongation rate.

[0234] It may further include a third polymer covering the plurality of first openings and the plurality of second openings between the plastic film and the support plate.

[0235] The third polymer can be positioned to correspond to the entire surface area of ​​the support plate.

[0236] An electronic device according to one embodiment of the present disclosure comprises: a rollable housing including a first housing and a second housing movably coupled to the first housing; a flexible display including a first display area that is visually visible from the outside when the rollable housing is in a contracted state and a second display area that extends from the first display area and slides out from the inside of the rollable housing when the rollable housing transitions from the contracted state to an expanded state, the flexible display including a display panel, a plastic film disposed on the back surface of the display panel, and a support plate disposed on the back surface of the plastic film, wherein the support plate includes a flat portion corresponding to the first display area and a bendable portion formed to be bendable through a plurality of openings spaced apart corresponding to the second display area, and a first polymer may be disposed inside the plurality of openings.

[0237] Covering the plurality of openings between the plastic film and the support plate, a second polymer may be further included.

[0238] The apparatus further includes an adhesive member disposed between the plastic film and the support plate, and the second polymer may be disposed in an opening of the adhesive member corresponding to the bendable portion.

[0239] The second polymer can be positioned to correspond to the entire surface area of ​​the support plate.

[0240] According to one embodiment of the present disclosure, assembly defects in which air bubbles are trapped inside a plurality of openings can be prevented, and durability can be increased by reducing deformation of the openings. In addition, by placing a polymer containing resin or PSA in the empty space above the openings, the strength of the folding part (or curved part) can be increased, and crease marks (e.g., crease visibility) caused by sagging of the display panel can be reduced.

Claims

1. In an electronic device, A foldable housing comprising a first housing, a second housing, and a hinge structure connecting the first housing and the second housing; and A flexible display disposed on the above-mentioned foldable housing, display panel, A plastic film disposed on the back surface of the above-mentioned display panel, and The flexible display comprises a support plate disposed on the back surface of the plastic film, and The above support plate is, A first planar portion facing the first housing, A second planar portion facing the second housing, and It includes a bendable portion formed to be bendable through a plurality of spaced openings, which are arranged to face the hinge structure between the first planar portion and the second planar portion. A first polymer is disposed inside the plurality of openings mentioned above. Electronic device.

2. In Paragraph 1, Covering the plurality of openings between the plastic film and the support plate, and further comprising a second polymer, Electronic device.

3. In Paragraph 2, The second polymer is positioned to correspond to the bendable portion and is not positioned on the first planar portion and the second planar portion, Electronic device.

4. In Paragraph 3, It further includes an adhesive member disposed between the plastic film and the support plate, The second polymer is disposed in the opening of the adhesive member corresponding to the bendable portion, Electronic device.

5. In Paragraph 2, The second polymer is positioned to correspond to the entire surface area of ​​the support plate, Electronic device.

6. In Paragraph 2, A third polymer further comprising a third polymer disposed between the second polymer and the plastic film, Electronic device.

7. In Paragraph 1, A thermoplastic member further comprising covering the plurality of openings on the back surface of the support plate, Electronic device.

8. In Paragraph 1, The plurality of openings includes at least one first opening having a first width, and at least one second opening having a second width smaller than the first width. The first polymer disposed in the at least one first opening has a first modulus, and The first polymer disposed in the at least one second opening has a second modulus greater than the first modulus, Electronic device.

9. In Paragraph 1, The plurality of openings includes at least one first opening that overlaps with a designated part of the hinge structure, and at least one second opening that does not overlap with the designated part of the hinge structure. The first polymer disposed in the at least one first opening has a third modulus, The first polymer disposed in the at least one second opening has a fourth modulus smaller than the third modulus, Electronic device.

10. In an electronic device, A foldable housing comprising a first housing, a second housing, and a third housing; and A flexible display disposed on the above-mentioned foldable housing, display panel, A plastic film disposed on the back surface of the above-mentioned display panel, and The flexible display comprises a support plate disposed on the back surface of the plastic film, and The above support plate is, A first planar portion facing the first housing, A second planar portion facing the second housing above, A third planar portion facing the above-mentioned third housing, A first bendable portion disposed between the first planar portion and the second planar portion and formed to be bendable through a plurality of first openings, and It includes a second bendable portion disposed between the second planar portion and the third planar portion and formed to be bendable through a plurality of second openings, and A first polymer is disposed inside the plurality of first openings, and A second polymer is disposed inside the plurality of second openings. Electronic device.

11. In Paragraph 10, The flexible display includes a first display area disposed in the first housing, a second display area disposed in the second housing, and a third display area disposed in the third housing. When the above-mentioned foldable housing is in a folded state, the first housing and the second housing are configured to be folded in an in-folding manner so that the first display area and the second display area face each other, and the second housing and the third housing are configured to be folded in an in-folding manner so that the third display area faces the back surface of the first housing. The first polymer has a first modulus and a first elongation, and The second polymer has a second modulus smaller than the first modulus and a second elongation smaller than the first elongation, Electronic device.

12. In Paragraph 11, A third polymer further comprising covering the plurality of first openings and the plurality of second openings between the plastic film and the support plate, Electronic device.

13. In Paragraph 12, The above third polymer is Arranged to correspond to the entire area of ​​the above-mentioned support plate, Electronic device.

14. In Paragraph 10, The flexible display includes a first display area disposed in the first housing, a second display area disposed in the second housing, and a third display area disposed in the third housing. When the above-mentioned foldable housing is in a folded state, the first housing and the second housing are configured to be folded in an in-folding manner so that the first display area and the second display area face each other, and the second housing and the third housing are configured to be folded in an out-folding manner so that the back surface of the second housing and the back surface of the third housing face each other. The first polymer has a first modulus and a first elongation, and The second polymer has a second modulus greater than the first modulus and a second elongation greater than the first elongation, Electronic device.

15. In Paragraph 14, A third polymer further comprising covering the plurality of first openings and the plurality of second openings between the plastic film and the support plate, Electronic device.

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