Electronic device comprising fpcb

Abstract

According to an embodiment of the present disclosure, an electronic device including a flexible printed circuit board may be provided. The flexible printed circuit board comprises: a first ground layer including a first ground extending long in a first direction (Y direction); a second ground layer including a second ground and a signal line that are spaced apart from the first ground and extending long in the first direction to be parallel to the first ground; a third ground layer including a third ground spaced apart from the second ground and extending long in the first direction to be parallel to the second ground; a first insulating layer disposed between the first ground layer and the second ground layer; and a second insulating layer disposed between the second ground layer and the third ground layer, wherein the first ground layer and / or the third ground layer may include a plurality of holes formed along positions corresponding to the signal line. The first insulating layer and / or the second insulating layer may include an air pocket formed between the plurality of holes and the signal line to reduce or prevent insertion loss. Various other embodiments are also applicable.

Description

Electronic device including FPCB

[0001] Various embodiments of the present disclosure relate to electronic devices, for example, electronic devices including an FPCB.

[0002] The term "electronic device" may refer to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, and vehicle navigation systems. For example, these electronic devices can output stored information as sound or video.

[0003] With the increasing integration density of electronic devices and the widespread adoption of high-speed, high-capacity wireless communication, various functions can now be integrated into a single electronic device, such as a mobile communication terminal. For example, not only communication functions but also entertainment functions like games, multimedia functions like music and video playback, communication and security functions like mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized so that users can carry them conveniently.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include: a housing forming the exterior of the electronic device; a first circuit board accommodated in the housing and having a first component disposed thereon; a second circuit board accommodated in the housing and spaced apart from the first circuit board; and a flexible printed circuit board (FPCB) for electrically connecting the first circuit board and the second circuit board. The flexible printed circuit board may include: a first ground layer comprising a first ground extending longitudinally in a first direction; a third ground layer spaced apart from the first ground and having a second ground extending longitudinally in the first direction parallel to the first ground; a second ground layer disposed between the first ground layer and the third ground layer and having an RF signal line extending longitudinally in the first direction; and a first insulating layer disposed between the first ground layer and the second ground layer. and a second insulating layer disposed between the third ground layer and the second ground layer; may be included. The first ground layer and / or the third ground layer may include a plurality of holes formed along positions corresponding to the RF signal line. The first insulating layer and / or the second insulating layer may include an air pocket formed between the plurality of holes and the second ground layer to reduce or prevent insertion loss.

[0006] According to one embodiment of the present disclosure, an electronic device may comprise: a housing forming the exterior of the electronic device; a first circuit board accommodated in the housing and having a first component disposed thereon; a second circuit board accommodated in the housing and spaced apart from the first circuit board; and a flexible printed circuit board (FPCB) for electrically connecting the first circuit board and the second circuit board. The flexible printed circuit board may comprise: a first ground layer including a first ground extending longitudinally in a first direction; a second ground layer spaced apart from the first ground and including a second ground and a signal line extending longitudinally in the first direction parallel to the first ground; a third ground layer spaced apart from the second ground and including a third ground extending longitudinally in the first direction parallel to the second ground; and a first insulating layer disposed between the first ground layer and the second ground layer. and a second insulating layer disposed between the second grounding layer and the third grounding layer; may be included. The third grounding layer may include a plurality of holes formed along positions corresponding to each of the signal lines. The second insulating layer may include an air pocket formed between the plurality of holes and the signal lines to reduce or prevent insertion loss.

[0007] According to one embodiment of the present disclosure, an electronic device may comprise: a housing forming the exterior of the electronic device; a first circuit board accommodated in the housing and having a first component disposed thereon; a second circuit board accommodated in the housing and spaced apart from the first circuit board; and a flexible printed circuit board (FPCB) for electrically connecting the first circuit board and the second circuit board. The flexible printed circuit board may comprise: a first ground layer including a first ground extending longitudinally in a first direction; a second ground layer spaced apart from the first ground and including a second ground and a signal line extending longitudinally in the first direction parallel to the first ground; a third ground layer spaced apart from the second ground and including a third ground extending longitudinally in the first direction parallel to the second ground; and a first insulating layer disposed between the first ground layer and the second ground layer. and a second insulating layer disposed between the second grounding layer and the third grounding layer; may be included. The first grounding layer and the third grounding layer each include a first plurality of holes and a second plurality of holes (350b) formed along a position corresponding to the signal line, and the first insulating layer and the second insulating layer each include a first air pocket and a second air pocket formed between the plurality of holes and the signal line to reduce or prevent insertion loss.

[0008] The aspects, configurations, and / or advantages described above regarding one embodiment of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0010] FIG. 2 is a front view, a side view, and a rear view of an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a front view, a side view, and a rear view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0013] FIG. 5 is a drawing showing an FPCB according to one embodiment.

[0014] FIG. 6 is a drawing showing a portion of a cross-section of the FPCB shown in FIG. 5 cut in the A-A' direction according to one embodiment.

[0015] FIG. 7 is a drawing showing a portion of a cross-section of the FPCB shown in FIG. 5 cut in the A-A' direction according to one embodiment.

[0016] FIG. 8 is a diagram showing a manufacturing process of an FPCB according to one embodiment.

[0017] FIG. 9 is a drawing illustrating a microstrip line without mesh holes and a microstrip line with mesh holes formed, according to one embodiment.

[0018] FIG. 10 is a graph showing insertion loss according to frequency of a microstrip line without mesh holes formed and a microstrip line with mesh holes formed, according to one embodiment.

[0019] FIG. 11 is a graph showing the loss tangent for dielectric loss according to the material according to one embodiment.

[0020] FIG. 12 is a perspective view showing a cross- section of an FPCB having a hole formed in the ground layer according to one embodiment.

[0021] FIG. 13 is a perspective view showing a cross- section of an FPCB having a hole formed in the ground layer and an air pocket further formed, according to one embodiment.

[0022] FIG. 14 is a perspective view showing a cross-section of an FPCB in which an air pocket is formed extending to a coverlay portion according to one embodiment.

[0023] FIG. 15 is a drawing illustrating the shapes of various types of air pockets.

[0024] FIG. 16 is a graph showing insertion loss in an embodiment in which an air pocket is formed and an embodiment in which an air pocket is not formed, according to one embodiment of the present disclosure.

[0025] FIG. 17 is a perspective view showing a cross- section of an FPCB having a hole formed in the ground layer according to one embodiment.

[0026] FIG. 18 is a perspective view showing a cross- section of an FPCB having a hole formed in the ground layer according to one embodiment.

[0027] FIG. 19 is a drawing illustrating a method for forming an air pocket in an FPCB according to one embodiment.

[0028] Throughout the attached drawings, similar parts, configurations, and / or structures may be assigned similar reference numbers.

[0029] An FRC (FPCB type RF cable) is an RF cable implemented in the form of a flexible printed circuit board (FPCB) that can transmit and receive signals between an antenna and a wireless communication module. For example, an electronic device (e.g., a smartphone) may include a main printed circuit board (PCB) and a sub-PCB, and RF signals between the main PCB and the sub-PCB can be transmitted via the FRC.

[0030] In efficiently transmitting and receiving RF signals via FRC, improving insertion loss (IL) can be important. Insertion loss can be broadly classified into conductor loss and dielectric loss, and it can be reduced by lowering the loss rates for each. For example, conductor loss can be reduced by forming holes along the RF signal line, while dielectric loss can be lowered by applying materials with low loss tangent. Minimizing insertion loss in the FRC can increase the transmission efficiency of RF signals.

[0031] Meanwhile, while insertion loss can be significantly improved by developing and using a material with very low loss tangent, developing such a material is costly and can take a long time. In other words, there are limitations in terms of cost and time. Hereinafter, as a method to reduce insertion loss, the present disclosure provides an FPCB with a reduced loss rate for conductor loss and an electronic device including the same.

[0032] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which this disclosure pertains from the description below.

[0033] Hereinafter, embodiments of the present disclosure are described with reference to the accompanying drawings.

[0034] An electronic device according to various embodiments of the present disclosure may be a device of various forms. An electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. An electronic device according to embodiments of the present disclosure is not limited to the devices described above.

[0035] Various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In the present disclosure, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” each may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0036] As used in various embodiments of the present disclosure, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0037] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0038] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0039] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0040] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0041] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0042] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0043] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0044] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0045] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0046] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0047] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0048] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0050] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0052] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0053] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0054] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0055] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0056] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0057] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0058] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board (PCB), an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0059] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0060] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0061] FIG. 2 is a drawing illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0062] Referring to FIGS. 2 and FIGS. 3, the electronic device (101) may include a housing (201) for receiving a part of the electronic device (101) (e.g., a hinge assembly (HA) in FIG. 4), and a display (230) disposed within the space formed by the housing (201).

[0063] According to one embodiment, the housing (201) may be referred to as a foldable housing (201). According to one embodiment, the display (230) may be referred to as a flexible display (230).

[0064] According to one embodiment, the housing (201) may include a first housing (210) and a second housing (220). According to one embodiment, the first housing (210) and / or the second housing (220) may form at least a part of the exterior of the electronic device (101).

[0065] The housing (201) may be deformable. For example, the housing (201) may be folded or unfolded. This may be understood as the second housing (220) being folded or unfolded relative to the first housing (210). Or, it may be understood as the first housing (210) being folded or unfolded relative to the second housing (220). In the following description and claims, only the movement of the second housing (220) relative to the first housing (210) may be referred to, which may be applied to the movement of the first housing (210) relative to the second housing (220). The first housing (210) may provide relative movement relative to the second housing (220), and the second housing (220) may provide relative movement relative to the first housing (210).

[0066] According to one embodiment, the second housing (220) can rotate relative to the first housing (210) using a hinge assembly (e.g., the hinge assembly (HA) of FIG. 4). Accordingly, the electronic device (101) can be changed from an unfolded state (e.g., FIG. 2) to a folded state (e.g., FIG. 3) or vice versa. Here, the unfolded state may be referred to as an opened state, and the folded state may be referred to as a closed state. In the present disclosure, the term "unfolded state" of the electronic device (101) (e.g., FIG. 2) may mean that the electronic device (101) is in a fully unfolded state unless otherwise noted, and the term "folded state" of the electronic device (101) (e.g., FIG. 3) may mean that the electronic device (101) is in a fully folded state unless otherwise noted. In the fully folded state, the first front surface (210a) of the electronic device (101) may face the second front surface (220a) (or may be tilted by approximately a predetermined negative angle (e.g., -5 degrees), and in the fully unfolded state, the direction in which the first front surface (210a) faces may be the same as the direction in which the second front surface (220a) faces. For example, in a fully unfolded state, the first front surface (210a) may be located on substantially the same plane as the second front surface (220a).

[0067] According to one embodiment, the side of the display (230) that is visually exposed can be defined as the front of the electronic device (101) and / or housing (201) (e.g., a first front (210a) and a second front (220a)). And, the side opposite to the front can be defined as the rear of the electronic device (101) (e.g., a first rear (210b) and a second rear (220b)). Additionally, the side of the electronic device (101) that surrounds at least a portion of the space between the front and the rear can be defined as the side of the electronic device (101) (e.g., a first side (210c) and a second side (220c)).

[0068] According to one embodiment, the first housing (210) and the second housing (220) are positioned on both sides of the folding axis (A) and may have a shape that is symmetrical overall with respect to the folding axis (A). According to one embodiment, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the state of the electronic device (101) is an unfolded state, a folded state, or an intermediate state between the unfolded state and the folded state. For example, the first housing (210) and the second housing (220) may each be rotatably coupled to the hinge assembly (HA) and, by rotating about the folding axis (A) or about different folding axes, may rotate from a position folded from each other to a position inclined from each other or to an unfolded position parallel to each other.

[0069] In the present disclosure, the terms “positioned side by side” or “extended side by side” may mean that two structures (e.g., the first housing (210) and the second housing (220) of the housing (201)) are positioned at least partially next to each other, or that at least the parts positioned next to each other are arranged in parallel. In some embodiments, the term “arranged side by side” may mean that two structures are positioned next to each other and are arranged to face in parallel directions or the same direction. Expressions such as “side by side” and “parallel” may be used in the following detailed description, but they can be easily understood based on the shape or arrangement relationship of the structures by referring to the attached drawings, etc.

[0070] According to one embodiment, the electronic device (101) may include a hinge housing (240). The hinge housing (240) may be positioned between a first housing (210) and a second housing (220). According to one embodiment, the hinge housing (240) may be obscured by a part of the first housing (210) and the second housing (220) or visually exposed to the outside of the electronic device (101), depending on the state of the electronic device (101). For example, when the electronic device (101) is in an unfolded state (e.g., FIG. 2), at least a portion of the hinge housing (240) may be covered by the first housing (210) and the second housing (220) of the electronic device (101), and when the electronic device (101) is in a folded state (e.g., FIG. 3), at least a portion of the hinge housing (240) may be visually exposed to the outside of the electronic device (101). According to one embodiment, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded with a certain angle, the hinge housing (240) may be partially visually exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be smaller than in the folded state. In one embodiment, the hinge housing (240) may include a curved surface.

[0071] According to one embodiment, the hinge housing (240) can protect a hinge module (e.g., the hinge module (250) of FIG. 4 described below) and / or a component (e.g., FPCB (270)) placed inside the electronic device (101) from external impacts of the electronic device (101). According to one embodiment, the hinge housing (240) may be interpreted and / or referred to as a 'hinge cover (240)' for protecting the hinge module and / or component.

[0072] According to one embodiment, the display (230) may mean a display in which at least some area can be deformed into a flat or curved surface. For example, the display (230) may be formed to be variable in response to the relative movement of the second housing (220) with respect to the first housing (210). According to one embodiment, the display (230) may include a folding area (233), a first display area (231) positioned on one side with respect to the folding area (233), and a second display area (232) positioned on the other side. According to one embodiment, the folding area (233) may be positioned corresponding to a hinge assembly (e.g., the hinge assembly (HA) of FIG. 4). According to one embodiment, the first display area (231) may be positioned on the first housing (210), and the second display area (232) may be positioned on the second housing (220). According to one embodiment, the display (230) may be accommodated in the first housing (210) and the second housing (220).

[0073] According to one embodiment, the display (230) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer configured to detect a magnetic field type stylus pen.

[0074] According to one embodiment, the electronic device (101) may include a rear display (234). The rear display (234) may be positioned to face in a different direction from the display (230). For example, the display (230) may be visually exposed through the front of the electronic device (101) (e.g., a first front (210a) and / or a second front (220a)), and the rear display (234) may be visually exposed through the rear of the electronic device (101) (e.g., a first rear (210b)). In the embodiments of FIGS. 2 and 3, the position or size of the rear display (234) is exemplary and may vary depending on the embodiment.

[0075] According to one embodiment, the electronic device (101) may include at least one camera (204, 206) and a flash (208). According to one embodiment, the electronic device (101) may include a front camera (204) exposed through the front (e.g., a first front (210a)) and / or a rear camera (206) exposed through the rear (e.g., a first rear (210b)). The cameras (204, 206) may include one or more lenses, an image sensor, a flash, and / or an image signal processor. The flash (208) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (101).

[0076] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0077] In the following detailed description, the length direction of the electronic device (101) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the following detailed description, the mention of length direction, width direction, and / or height direction (or thickness direction) may refer to the length direction, width direction, and / or height direction (or thickness direction) of the electronic device. In some embodiments, regarding the direction in which a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, referring to FIG. 4, the front of the electronic device (101) or housing (201) may be defined as the 'face facing the +Z-axis direction', and the rear as the 'face facing the -Z-axis direction'. According to one embodiment, the arrangement relationship in the height direction of any component or another component, for example, the up / down reference, may follow the +Z-axis direction / -Z-axis direction. For example, the statement that a component is placed on top of another component may mean that the component is placed in the +Z-axis direction relative to the other component, and the statement that a component is placed under the other component may mean that the component is placed in the -Z-axis direction relative to the other component. Meanwhile, it should be noted that even if a component is placed on top of or under another component, this does not mean that the entire component is located above or below the entire component of the other component. For example, it should be noted that a part of a component may be placed above a part of another component, but another part of a component may be placed below another part of another component. According to one embodiment, when a component is described as "viewed from above," this may mean viewing the component from the +Z-axis direction toward the -Z-axis direction from a position spaced a predetermined distance from the component.According to one embodiment, the statement that a component faces 'a certain direction' can be understood to include not only the component facing 'the same direction as the certain direction' but also the component facing 'a direction parallel to the certain direction'. It should be noted that in the following description, when a component is said to overlap (or stacked) with another component, the description of the arrangement relationship in the height direction described above may apply.

[0078] Referring to FIG. 4, the electronic device (101) may include a housing (201) comprising a first housing (210) and a second housing (220), a display (230), a hinge housing (240), a hinge module (250), a first circuit board (262), and a battery (280). The configuration of the first housing (210), the second housing (220), the display (230), and the hinge housing (240) in FIG. 4 may be all or partly the same as the configuration of the first housing (210), the second housing (220), the display (230), and the hinge housing (240) in FIG. 2 and FIG. 3. The configuration included in the electronic device (101) is not limited to the embodiments illustrated in the drawings. Other components may be added to the electronic device (101), or conversely, some components may be omitted. For example, the electronic device (101) may further include a second circuit board (264) spaced apart from the first circuit board (262).

[0079] According to one embodiment, the housing (201) may include a first bracket (212) and a second bracket (222). For example, the first housing (210) may include the first bracket (212), and the second housing (220) may include the second bracket (222). According to one embodiment, the first bracket (212) and / or the second bracket (222) may support components of the electronic device (101) (e.g., a display (230), a first circuit board (262), and a battery (280)). According to one embodiment, the first bracket (212) may be referred to as a 'first support bracket' or a 'first front plate (first front plate)'. According to one embodiment, the second bracket (222) may be referred to as the 'second support bracket' or the 'second front plate (second front plate)'.

[0080] According to one embodiment, the first bracket (212) and / or the second bracket (222) may be formed of a metal material and / or a non-metal (e.g., polymer) material. According to one embodiment, the first bracket (212) may be positioned between the display (230) and the battery (280). For example, the display (230) may be attached to one side of the first bracket (212), and the battery (280) and the first circuit board (262) (and / or the second circuit board (264)) may be positioned on the other side.

[0081] According to one embodiment, the housing (201) may include a first deco member (214) and a second deco member (224). For example, the first housing (210) may include the first deco member (214), and the second housing (220) may include the second deco member (224). According to one embodiment, the deco members (214, 224) may protect the display (230) from external impact. For example, the first deco member (214) may surround at least a portion of the display (230) (e.g., the first display area (231) of FIG. 2), and the second deco member (224) may surround at least a portion of the other portion of the display (230) (e.g., the second display area (232) of FIG. 2).

[0082] According to one embodiment, the housing (201) may include a first rear plate (216) and a second rear plate (226). For example, the first housing (210) may include a first rear plate (216) connected to a first support member (212), and the second housing (220) may include a second rear plate (226) connected to a second support member (222). According to one embodiment, the rear plates (216, 226) may form part of the exterior of the electronic device (101). For example, the first rear plate (216) may form a first rear (e.g., the first rear (210b) of FIG. 2 and FIG. 3), and the second rear plate (226) may form a second rear (e.g., the second rear (220b) of FIG. 2 and FIG. 3). According to one embodiment, a first battery (282) and a first circuit board (262) may be disposed between a first bracket (212) and a first rear plate (216), and a second battery (284) and a second circuit board (264) may be disposed between a second bracket (222) and a second rear plate (226). A processor (e.g., the processor (120) of FIG. 1) (e.g., an application processor (AP)) may be disposed on the first circuit board (262), and may include various other components. Various components not disposed on the first circuit board (262) may be disposed on the second circuit board (264). An example of a component disposed on the second circuit board (264) may include an antenna array (e.g., a patch antenna array, a dipole antenna array). For example, the first circuit board (262) may be referred to as the main circuit board (main PCB), and the second circuit board (264) may be referred to as the sub circuit board (sub PCB).

[0083] According to one embodiment, the hinge housing (240) may accommodate at least a portion of the hinge module (250). According to one embodiment, when the electronic device (101) is in an unfolded state, at least a portion of the hinge housing (240) may be located between the hinge module (250) and the housing (201). The hinge housing (240) may include an internal space (242) for accommodating the hinge module (250). In the present disclosure, the combination of the hinge housing (240) and the hinge module (250) may be referred to as a hinge assembly (HA).

[0084] Electronic components (e.g., a first circuit board (262), and / or a second circuit board (264)) for implementing various functions of the electronic device (101) may be disposed inside the housing (201). According to one embodiment, the first circuit board (262) may be disposed in the first housing (210), and the second circuit board (264) may be disposed in the second housing (220). Each of the first circuit board (262) and the second circuit board (264) may include a chip set (or integrated circuit, IC), and / or a processor (e.g., the processor (120) of FIG. 1) implemented to provide a specific function, but may be implemented with various types of electronic components not limited to those described.

[0085] According to one embodiment, the third circuit board (270) can electrically connect a component located in the first housing (210) (e.g., the first circuit board (262)) and a component located in the second housing (220) (e.g., the second circuit board (264)). The third circuit board (270) can serve as a connector that electrically connects electronic components placed at different locations. The third circuit board (270) may include at least a portion of a flexible material (e.g., polyimide (PI)). The third circuit board (270) may include a flexible printed circuit board (FPCB). According to one embodiment, the third circuit board (270) may be an FRC (FPCB type RF cable). According to one embodiment, the third circuit board (270) may cross the hinge housing (240). For example, a portion of the third circuit board (270) may be placed within the first housing (210), and another portion may be placed within the second housing (220). According to one embodiment, at least a portion of the third circuit board (270) may be placed in the internal space (242) of the hinge housing (240).

[0086] According to one embodiment, the hinge module (250) may be connected to the first housing (210) and the second housing (220), respectively. According to one embodiment, the second housing (220) may rotate relative to the first housing (210) using the hinge module (250). For example, the first housing (210) may rotate around an axis parallel to the width direction of the electronic device (e.g., the folding axis (A) in FIG. 2), and the second housing (220) may also rotate around the folding axis (e.g., the folding axis (A) in FIG. 2). According to one embodiment, when the first housing (210) rotates, the second housing (220) may also rotate symmetrically relative to the first housing (210).

[0087] FIG. 5 is a drawing showing an FPCB according to one embodiment.

[0088] A first circuit board (e.g., the first circuit board (262) of FIG. 4) disposed inside a first housing (e.g., the first housing (210) of FIG. 4) and a second circuit board (e.g., the second circuit board (264) of FIG. 4) disposed inside a second housing (e.g., the second housing (220) of FIG. 4) can be electrically connected through an FPCB (300) (e.g., the third circuit board (270) of FIG. 4) that crosses a hinge assembly (e.g., the hinge assembly (HA) of FIG. 4).

[0089] The FPCB (300) may include a plurality of layers. The FPCB (300) may include a first end (301) connected to a first circuit board (e.g., the first circuit board (262) of FIG. 4) and a second end (302) connected to a second circuit board (e.g., the second circuit board (264) of FIG. 4), and may include a connection portion (310) between the first end (301) and the second end (302). The connection portion (310) may include a plurality of layers between one surface (310a) (e.g., top surface) and another surface (310b) (e.g., bottom surface). For example, the plurality of layers of the FPCB (300) may include, as an example, a wiring layer on which signal wiring is formed, a ground layer on which ground is formed, and an insulating layer filling the space between the wiring layer and the ground layer. The first circuit board (262) can transmit a signal to the second circuit board (264) or receive a signal from the second circuit board (264) through an FPCB (300) that includes signal wiring. For example, the first circuit board (262) of the first housing (210) and the antenna module of the second housing (220) can be electrically connected through the FPCB (300).

[0090] The FPCB (300) may be positioned across the hinge assembly (HA). The FPCB (300) may be flexibly bent or curved when the electronic device (e.g., the electronic device (101) of FIGS. 1 to 4) is switched from a folded state to an unfolded state or from an unfolded state to a folded state. According to one embodiment, the portion of the FPCB (300) corresponding to the hinge assembly (HA) may be configured to be flexible, while the portion adjacent to the first end (301) connected to the first circuit board (e.g., the first circuit board (262) of FIG. 4) and the second end (302) connected to the second circuit board (e.g., the second circuit board (264) of FIG. 4) may be configured to be rigid. The FPCB (300) may have at least partially flexible characteristics and at least partially rigid characteristics.

[0091] FIG. 6 is a drawing showing a portion of a cross-section of the FPCB shown in FIG. 5 cut in the A-A' direction according to one embodiment. FIG. 7 is a drawing showing a portion of a cross-section of the FPCB shown in FIG. 5 cut in the A-A' direction according to one embodiment. FIG. 8 is a drawing showing a manufacturing process of an FPCB according to one embodiment.

[0092] Referring to FIGS. 6 and 7, the FPCB (300) may include a first ground layer (311), a second ground layer (313), and a third ground layer (315). The first ground layer (311) may include grounds extending in a first direction (Y direction). The third ground layer (315) may also include grounds extending in a first direction (Y direction). The third ground layer (315) may be spaced apart from the first ground layer (311) in a second direction (Z direction) perpendicular to the first direction. The second ground layer (313) may include a signal line (340) extending in a first direction (Y direction). Here, the signal line (340) may be, for example, an "RF signal line". The second ground layer (313) may include another signal line (e.g., power line) that extends in the first direction (Y direction). According to one embodiment, the second ground layer (313) may be referred to as a “signal transmission layer.” The second ground layer (313) may include grounds that extend in the first direction (Y direction). The second ground layer (313) may be disposed between the first ground layer (311) and the third ground layer (315). The plurality of ground layers (311, 315) and the second ground layer (313) may be implemented with an electrically conductive material (e.g., a conductor). For example, the conductor may include copper, but may include various electrically conductive materials, not limited to the examples described. The plurality of ground layers (311, 313, 315) may provide a ground potential.

[0093] Referring to FIG. 8, the FPCB (300) may include a first ground layer (311), a second ground layer (313), a third ground layer (315), and an insulating layer (321, 323). In the second direction (Z direction), the first ground layer (311), the second ground layer (313), and the third ground layer (315) are disposed between one side (310a) (e.g., top surface) and the other side (310b) (e.g., bottom surface) of the FPCB (300), and the insulating layer (321, 323) may be disposed in the portion excluding the first ground layer (311), the second ground layer (313), and the third ground layer (315). According to one embodiment, the first ground layer (311) and the third ground layer (315) can each form one side (310a) (e.g., top surface) and the other side (310b) (e.g., bottom surface) of the FPCB (300). The insulating layer may be composed of a plurality of insulating layers. For example, the plurality of insulating layers may include a first insulating layer (321) disposed between the first ground layer (311) and the second ground layer (313), and a second insulating layer (323) disposed between the second ground layer (313) and the third ground layer (315). According to one embodiment, the insulating layers (321, 323) may be made of an insulating material (e.g., a dielectric). For example, the insulating material of the insulating layer (321, 323) may be a material in which the dielectric constant (εr) is within a specified range for insulation, and may include a polyimide (PI) resin. For example, the polyimide resin may be a high heat-resistant resin produced by solution polymerizing an aromatic dianhydride and an aromatic diamine or an aromatic diisocyanate to produce a polyamic acid derivative, and then circulating dehydrating it at a high temperature to produce an imid. Accordingly, such a polyimide resin may have excellent properties such as heat oxidation resistance, heat resistance, radiation resistance, low temperature resistance, or chemical resistance as an insoluble and infusible ultra-high heat-resistant resin.

[0094] According to one embodiment, the FPCB (300) may be manufactured using a flexible copper clad laminate (FCCL). The flexible copper clad laminate (FCCL) may be in the form of a thin metal foil (e.g., copper foil (Cu film)) coated using an adhesive layer on a polyimide (PI) film having high heat resistance and flexibility as a substrate. The flexible copper clad laminate (FCCL) may be provided as a single-sided flexible copper clad laminate (FCCL) in which a layer of metal foil is placed on one side of a polyimide substrate, or as a double-sided flexible copper clad laminate (FCCL) in which metal foil is placed on both sides of a polyimide substrate. For example, as illustrated in FIG. 8, a double-sided flexible copper clad laminate (FCCL) can be realized by placing a first ground layer (311) and a second ground layer (313) on both sides of an insulating layer using polyimide (e.g., a first insulating layer (321)), and a single-sided flexible copper clad laminate (FCCL) can be realized by placing a third ground layer (315) on one side of an insulating layer made of polyimide material (e.g., a second insulating layer (323)). And an FPCB (300) can be realized by placing an insulating layer (e.g., a second insulating layer (323)) between the double-sided flexible copper clad laminate (FCCL) and the single-sided flexible copper clad laminate (FCCL). An FPCB (300) can be manufactured by bonding a polyimide substrate (323a) (e.g., a second insulating layer (323)) of a single-sided flexible copper clad laminate film (FCCL) with a double-sided flexible copper clad laminate film (FCCL) using an adhesive layer (323b). Here, the adhesive layer (323b) may include a bonding sheet and / or prepreg (preimpregnated materials). FIG. 8 shows that the second insulating layer (323) includes a polyimide substrate (323a) (e.g., a second insulating layer (323)) and an adhesive layer (323b), but is not necessarily limited thereto.In the embodiment of FIG. 19 described below, the first insulating layer (321) may include a polyimide substrate (321a) and an adhesive layer (321b).

[0095] The material of the insulating layer (321, 323) included in the above FPCB (300) is not limited to the above-described embodiment. For example, the material of the insulating layer (321, 323) included in the above FPCB (300) may include Teflon, epoxy, FR-4, high-resistance silicon, glass, alumina, and LTCC (low temperature co-fired ceramic). The manufacturing method of the above-described FPCB (300) is also merely an example to aid understanding and is not limited to the above-described embodiment.

[0096] The FPCB (300) may include a via that penetrates a plurality of grounding layers (e.g., a first grounding layer (311), a second grounding layer (313), a third grounding layer (315)). The via may have a shape that is elongated in a second direction (Z direction) and may be connected to a plurality of grounding layers (e.g., a first grounding layer (311), a second grounding layer (313), a third grounding layer (315)) included in the FPCB (300). For example, the via may be placed between the first grounding layer (311) and the second grounding layer (313) to connect the first grounding layer (311) and the second grounding layer (313). Additionally, the via may be placed between the second grounding layer (313) and the third grounding layer (315) to connect the second grounding layer (313) and the third grounding layer (315). The vias include multiple vias, and the multiple vias may be spaced apart from each other along a first direction (Y direction), which is the direction in which the FPCB (300) extends. The multiple vias may also be spaced apart from each other along a third direction (X direction), which is the width direction of the FPCB (300). The vias may be implemented with an electrically conductive material (e.g., a conductor). According to one embodiment, the grounding of the multiple ground layers (311, 313, 315) has the same or similar potential through the vias, thereby allowing a ground (or reference) potential to be stably formed in the FPCB (300).

[0097] The FPCB (300) may include an FRC (FPCB type RF cable). According to one embodiment, the FPCB (300) of the present disclosure may be referred to as "FRC (300)". The purpose of using an FPCB (300) including an FRC may be to minimize the loss (e.g., insertion loss) when transmitting an RF signal from a first circuit board (e.g., the first circuit board (262) of FIG. 4) to a second circuit board (e.g., the second circuit board (264) of FIG. 4) or from a second circuit board to a first circuit board. As described above, regarding conductor loss, the loss rate can be reduced by forming a hole along the signal line (340) in the FPCB (300), and regarding dielectric loss, the loss rate can be reduced by applying a material with a low loss tangent. The transmission efficiency of RF signals can be increased by minimizing insertion loss for FRC. The present disclosure may provide various embodiments for further reducing conductor loss.

[0098] FIG. 6 is a drawing showing an embodiment in which the FPCB (300) includes stripline type wiring, and FIG. 7 is a drawing showing an embodiment in which the FPCB (300) includes microstrip type wiring.

[0099] Referring again to FIG. 6, holes (350) may be formed in the grounding layers (e.g., first grounding layer (311) and third grounding layer (315)) forming one side (310a) and the other side (310b) of the FPCB (300). According to one embodiment, the holes (350) may include a plurality of holes (350a, 350b) formed in the grounding layers (e.g., first grounding layer (311) and third grounding layer (315)) forming one side (310a) and the other side (310b) of the FPCB (300). The plurality of holes (350a, 350b) may be arranged along a first direction (Y-axis direction) which is the direction in which the signal line (340) extends, at a position corresponding to the signal line (340) included in the second grounding layer (313). According to one embodiment, a plurality of holes (350a, 350b) may be spaced apart at specified intervals along a first direction (Y-axis direction) in which the signal line (340) extends. Here, "a plurality of holes (350a, 350b) are spaced apart at specified intervals" means that the plurality of holes (350a, 350b) may be spaced apart at a constant interval from each other within a specified section along the length direction of the FPCB (300). However, it is not necessarily limited thereto. "A plurality of holes (350a, 350b) are spaced apart at specified intervals" means that at least some of the plurality of holes (350a, 350b) may be spaced apart at non-constant intervals within a specified section along the length direction of the FPCB (300).

[0100] Referring again to FIG. 7, a plurality of holes (350b) may be formed in a ground layer (e.g., a third ground layer (315)) forming the other side (310b) of the FPCB (300). According to one embodiment, a plurality of holes (350b) may be formed in a ground layer (e.g., a third ground layer (315)) forming the other side (310b) of the FPCB (300). The plurality of holes (350b) may be arranged along a first direction (Y-axis direction), which is the direction in which the signal line (340) extends, at a position corresponding to the signal line (340) included in the second ground layer (313). According to one embodiment, the plurality of holes (350b) may be spaced apart at a specified interval along the first direction (Y-axis direction), which is the direction in which the signal line (340) extends. Here, "multiple holes (350b) are spaced apart at specified intervals" means that multiple holes (350b) may be spaced apart at regular intervals from each other within a specified section along the length direction of the FPCB (300). However, it is not necessarily limited to this. "Multiple holes (350b) are spaced apart at specified intervals" means that at least some of the multiple holes (350b) may be spaced apart at irregular intervals within a specified section along the length direction of the FPCB (300).

[0101] According to one embodiment, when including stripline type wiring as shown in FIG. 6, a plurality of holes (350a, 350b) may be formed in the grounding layers (e.g., first grounding layer (311) and third grounding layer (315)) forming one side (310a) and the other side (310b) of the FPCB (300), respectively. Referring to FIG. 7, when including microstrip type wiring, an opening (350c) that is not made of an electrically conductive material (e.g., a conductor) may be formed at a position corresponding to the signal line (340). According to one embodiment, when including microstrip type wiring as shown in FIG. 7, a plurality of holes (350b) may be formed only in the grounding layer (315) forming the other side (310b) of the FPCB (300). As shown in FIGS. 6 and 7, the FPCB (300) can reduce loss (e.g., insertion loss) in transmitting RF signals by including a plurality of holes formed along the signal line (340) in the FPCB (300).

[0102] [Mathematical Formula 1]

[0103]

[0104] In the above [Equation 1], Z represents the impedance of the signal line (340), R represents the resistance value of the signal line (340) itself, L represents the inductance value of the signal line (340), G represents the resistance value of the insulating layer (321, 323) placed between the signal line (340) and the ground layer (311, 315) forming one side and the other side of the FPCB (300), and C represents the capacitance value formed between the signal line (340) and the ground layer (311, 315) and / or the insulating layer (321, 323) forming one side and the other side of the FPCB (300). To reduce the loss of the transmitted signal, the line width of the signal line (340) may be formed wide. At this time, referring to [Equation 1], if the line width of the signal line (340) is widened, R and / or L may be reduced. At this time, if the overlapping area between the signal line (340) and the ground layer (311, 315) is reduced by a plurality of holes formed on the signal line (340), the value of C is reduced, and the impedance (Z) can be maintained. In other words, if the value of C is reduced by a plurality of holes while the impedance (Z) is maintained, the line width of the signal line (340) can be widened, and the signal transmission performance of the signal line (340) can be improved.

[0105] FIG. 9 is a diagram illustrating a microstrip line without mesh holes and a microstrip line with mesh holes formed, according to one embodiment. FIG. 10 is a graph showing insertion loss according to frequency of a microstrip line without mesh holes formed and a microstrip line with mesh holes formed, according to one embodiment. FIG. 11 is a graph showing loss tangent for dielectric loss according to material, according to one embodiment.

[0106] FIG. 9 illustrates a plurality of signal lines formed in a second ground layer (313). The second ground layer (313) may include a plurality of signal lines (340a, 340b) and a plurality of grounds (3131, 3132). Some of the plurality of signal lines (340a, 340b) included in the second ground layer (313) may include a microstrip line (340a) without a mesh hole formed and a microstrip line (340b) with a mesh hole formed. For example, the microstrip line (340a) without a mesh hole formed indicates that no separate hole is formed in the third ground layer (315) at the position corresponding to the microstrip line (340a), and the microstrip line (340b) with a mesh hole formed indicates that a separate hole (350b) is formed in the third ground layer (315) at the position corresponding to the microstrip line (340a). According to one embodiment, a microstrip line (340a) without mesh holes formed may be referred to as a "solid microstrip line," and a microstrip line (340b) with mesh holes formed may be referred to as a "meshed microstrip line." When changing a microstrip line (340a) without mesh holes with a first line width (W1) to a microstrip line (340b) with mesh holes formed with a second line width (W2) while maintaining the same impedance (Z), the second line width (W2) may be larger than the first line width (W1). For example, the first line width (W1) may be approximately 85 μm, and the second line width (W2) may be approximately 150 μm.

[0107] Referring to FIG. 10, a graph (L1) showing the frequency-dependent insertion loss for a microstrip line without mesh holes and a graph (L2) showing the frequency-dependent insertion loss for a microstrip line with mesh holes are shown. In the graphs shown in FIG. 10, the horizontal axis represents the operating frequency and the vertical axis represents the magnitude of the insertion loss. When a microstrip line (340a) without mesh holes is changed to a microstrip line (340b) with mesh holes, it can be seen that the performance improves to 0.3 dB at approximately 5 GHz. Dielectric loss can have characteristics such as the graph shown in FIG. 11 depending on the loss tangent of the dielectric material. It has the characteristic that the lower the dielectric loss, the better the insertion loss. In the graph shown in FIG. 11, the horizontal axis represents the operating frequency and the vertical axis represents the magnitude of the insertion loss. In FIG. 11, the magnitude of the frequency-dependent insertion loss according to various dielectric materials can be observed. For example, FIG. 11 can show frequency-dependent insertion loss according to various dissipation factors (Df) of the dielectric in the case of a microstrip with a line width of approximately 150 μm and a line length of approximately 100 mm. Referring to FIG. 11, for example, at 3.5 GHz, the material with the smallest dielectric loss is measured at -1.3 dB, and the material with the highest dielectric loss is measured at -2.35 dB. For example, at 20 GHz, the material with the smallest dielectric loss is measured at -4.24 dB, and the material with the highest dielectric loss is measured at -10.41 dB.

[0108] FIG. 12 is a perspective view showing a cross-section of an FPCB having a hole formed in the ground layer according to one embodiment. FIG. 13 is a perspective view showing a cross-section of an FPCB having a hole formed in the ground layer and an air pocket further formed according to one embodiment. FIG. 14 is a perspective view showing a cross-section of an FPCB having an air pocket extended to the coverlay portion according to one embodiment. FIG. 15 is a drawing illustrating the shape of various types of air pockets.

[0109] Referring again to FIG. 11, for example, in the case of an FRC transmitting a high-frequency signal, the characteristics of the diffusion element (Df) at high frequencies may be important. The material with the lowest dielectric loss is air, and the loss tangent may be close to zero. Accordingly, the FPCB (300) of the present disclosure may be configured to reduce insertion loss by further including an air pocket.

[0110] According to one embodiment, the FPCB (300) may include a first ground layer (311), a second ground layer (313), and a third ground layer (315). The first ground layer (311) may include a first ground (3111, 3112) that is extended in a first direction (e.g., Y direction). The second ground layer (313) may include a second ground (3131, 3132) that is spaced apart from the first ground (3111, 3112) and is extended in the first direction (e.g., Y direction) so as to be parallel to the first ground (3111, 3112), and a signal line (340). The third ground layer (315) may include a third ground (3151) that is spaced apart from the second ground (3131, 3132) and extends in a first direction (e.g., Y direction) parallel to the second ground (3131, 3132).

[0111] According to one embodiment, the FPCB (300) may include an insulating layer (320). The insulating layer (320) may include a plurality of insulating layers. For example, the insulating layer (320) may include a first insulating layer (321) and a second insulating layer (323). The first insulating layer (321) may be disposed between the first ground layer (311) and the second ground layer (313). The second insulating layer (323) may be disposed between the second ground layer (313) and the second ground layer (315).

[0112] According to one embodiment, the first ground layer (311) and / or the third ground layer (315) may include a plurality of holes (350b) formed along a position corresponding to an RF signal line (340). Here, the plurality of holes (350b) may be referred to as "a plurality of mesh holes".

[0113] According to one embodiment of the present disclosure, the FPCB (300) may include a first insulating layer (321) and / or the second insulating layer (323) and an air pocket (360) formed between a plurality of holes (350b) and the second ground layer (313) to reduce or prevent insertion loss. Referring to FIG. 12 and FIG. 13 together, the air pocket (360) may be a recess that extends continuously from the plurality of holes (350b) toward a signal line (340). For example, the air pocket (360) may be formed in a column shape. FIG. 13 illustrates the air pocket (360) as a circular column shape, but this is merely an example and the shape of the column is not limited to any specific embodiment. For example, FIG. 14 illustrates the air pocket (360) as an elliptical column shape, but various other shapes of columns may also be applied.

[0114] FIG. 15 discloses an FPCB (300a, 300b, 300c, 300d, 300e, 300f) each comprising a plurality of air pockets (360a, 360b, 360c, 360da, 360db, 360e, 360f) having various shapes of bottom surfaces. The FPCB (300) of the present disclosure may include an FPCB (300a) comprising a plurality of air pockets (360a) having a circular bottom surface, an FPCB (300b) comprising a plurality of air pockets (360b) having a square bottom surface, and an FPCB (300c) comprising a plurality of air pockets (360c) having a rectangular bottom surface. According to one embodiment, the FPCB (300) may include a plurality of FPCBs (300d) having at least two air pockets (360da, 360db) with different bottom surface patterns. According to one embodiment, the FPCB (300) may include an FPCB (300e) having one long ditch-shaped air pocket (360e). For example, according to one embodiment, the air pockets of the present disclosure may be referred to as "air layers." According to one embodiment, the plurality of air pockets (360) formed in the FPCB (300) may include a plurality of air pockets (360a, 360b, 360c, 360da, 360db, 360e) arranged at uniform intervals from each other, but are not necessarily limited thereto. According to one embodiment, the FPCB (300f) may include a plurality of air pockets (360) formed in the FPCB (300), wherein the plurality of air pockets (360f) are arranged at non-uniform intervals from each other.

[0115] FIGS. 12 to 14 disclose a microstrip type wiring in which an opening (350c) is formed at a position corresponding to a signal line (340). In this case, a plurality of holes (350b) and an air pocket (360) may be positioned opposite to the position where the opening (350c) is formed relative to the signal line (340). According to one embodiment, the air pocket (360) may be composed of a plurality of air pockets corresponding to a plurality of holes (350b).

[0116] Referring to FIGS. 12 to 14, a coverlay (317, 319) may be formed on a first ground layer (311) and a third ground layer (315) that form one side (e.g., one side (310a) of FIG. 5) and the other side (e.g., the other side (310b) of FIG. 5) of the FPCB (300). The coverlay may include a coverlay film and cover resin layers laminated on both sides of the coverlay film. For example, the coverlay film may include a polyimide (PI) resin formed as an electrical insulating layer. According to one embodiment, by including the coverlay (317, 319), the FPCB (300) can be protected from external impact.

[0117] Referring to FIG. 14, the air pocket (360) of the FPCB (300) of the present disclosure is formed corresponding to a plurality of holes (350b), and the air pocket (360) may be formed penetrating to the coverlay (319). The air pocket (360) formed in the FPCB (300) may be formed using a CO2 laser. A method for forming the air pocket (360) in the FPCB (300) will be described in detail later through the embodiment of FIG. 19.

[0118] FIG. 16 is a graph showing insertion loss in an embodiment in which an air pocket is formed and an embodiment in which an air pocket is not formed, according to one embodiment of the present disclosure.

[0119] The horizontal axis of the graph shown in FIG. 16 represents the operating frequency, and the vertical axis represents the magnitude of the insertion loss. FIG. 16 shows the magnitude of the insertion loss at different frequencies according to various dielectric materials. Referring to FIG. 16, in the graph (S1) of an embodiment without an air pocket, the insertion loss at a frequency of approximately 20 GHz is measured to be approximately -11.29 dB. In contrast, in the graph (S2) of an embodiment with an air pocket, the insertion loss at a frequency of approximately 20 GHz is measured to be approximately -8.22 dB. As shown in FIG. 16, it can be seen that the insertion loss of the FPCB (300) with an air pocket is reduced (approximately -3 dB reduced) compared to the FPCB (300) without an air pocket.

[0120] FIG. 17 is a perspective view showing a cross-section of an FPCB having a hole formed in the ground layer according to one embodiment. FIG. 17 discloses an FPCB having stripline type wiring, unlike FIG. 12 to FIG. 14, which discloses an FPCB having microstrip type wiring.

[0121] According to one embodiment, the FPCB (300) may include a first ground layer (311), a second ground layer (313), and a third ground layer (315). The first ground layer (311) may include a first ground (3111) that is extended in a first direction (e.g., Y direction). The second ground layer (313) may include a second ground (3131, 3132) and a signal line (340) that are spaced apart from the first ground (3111) and are extended in the first direction (e.g., Y direction) so as to be parallel to the first ground (3111). The third ground layer (315) may include a third ground (3151) that is spaced apart from the second ground (3131, 3132) and extends in a first direction (e.g., Y direction) parallel to the second ground (3131, 3132). A first insulating layer (e.g., the first insulating layer (321) of FIG. 12) may be disposed between the first ground layer (311) and the second ground layer (313). A second insulating layer (e.g., the second insulating layer (323) of FIG. 12) may be disposed between the second ground layer (313) and the second ground layer (315).

[0122] According to one embodiment, the first ground layer (311) and the third ground layer (315) may each include a plurality of holes (350a, 350b) formed along positions corresponding to the RF signal line (340).

[0123] According to one embodiment of the present disclosure, the FPCB (300) may include a first insulating layer (321) and a second insulating layer (323), and may include an air pocket (3601) formed between a plurality of holes (350a) and a second ground layer (313) to reduce or prevent insertion loss. Additionally, the FPCB (300) may include an air pocket (3602) formed between a plurality of holes (350b) and the second ground layer (313). The air pockets (3601, 3602) may include a plurality of air pockets.

[0124] FIG. 18 is a perspective view showing a cross-section of an FPCB having a hole formed in the ground layer according to one embodiment. FIG. 18 may disclose an FPCB (300) including another air pocket (360) in an FPCB (300) including microstrip type wiring.

[0125] According to one embodiment, the first ground layer (311) and / or the third ground layer (315) may each include a plurality of holes (350b) formed along a position corresponding to the RF signal line (340). In the FPCB (300) according to the embodiment shown in FIG. 18, an opening (350c) may be formed at a position opposite to the position where the plurality of holes (350b) are arranged relative to the signal line (340). If the air pocket (3601) of FIG. 18 corresponds to a single long ditch-shaped air pocket (360e) shown in FIG. 15, the FPCB (300) shown in FIG. 18 may represent an application example of the FPCB (300e) of FIG. 15.

[0126] According to one embodiment of the present disclosure, the FPCB (300) may include an air pocket (3601) formed in the first insulating layer (321) to reduce or prevent insertion loss. In the embodiment of FIG. 18, the air pocket may be shown not as being formed in the second insulating layer (323), that is, between the signal line (340) and the plurality of holes (350b), but as being formed in the first insulating layer (321) at a position opposite to the position where the plurality of holes (350b) are formed relative to the signal line (340).

[0127] FIG. 19 is a drawing for illustrating a method of forming an air pocket (360) in an FPCB (300) according to one embodiment.

[0128] According to one embodiment, the FPCB (300) of the present disclosure may be implemented through a laser drilling process. For example, the FPCB (300) may be implemented through a process using a CO2 laser during the laser drilling process. For example, as shown in FIG. 19, the FPCB (300) may include a first ground layer (311), a second ground layer (313), and a third ground layer (315). A first insulating layer (321) may be disposed between the first ground layer (311) and the second ground layer (313). A second insulating layer (323) may be disposed between the second ground layer (313) and the second ground layer (315). For example, the first insulating layer (321) may include a substrate (321a) made of polyimide material and an adhesive layer (321b). According to one embodiment, the FPCB (300) may include a first ground layer (311) and / or a third ground layer (315) with holes (350a, 350b). The holes (350a, 350b) may be formed along positions corresponding to RF signal lines (340). According to one embodiment, the present disclosure may form air pockets (360) using a CO2 laser. The CO2 laser process may use a gas such as CO2 or a CO2 mixed gas, and may process holes by spraying the gas onto the insulating layer of the FPCB (300). The CO2 laser process may not form holes in the ground layers (311, 313, 315), but may form holes in the insulating layers (321, 323). As described above through the illustration in FIG. 8, for the FPCB (300) manufactured through the process of FIG. 8, a CO2 laser can be sprayed through at least one hole (350a, 350b) formed in the first ground layer (311) and / or the third ground layer (315) to realize an FPCB (300) having an air pocket (360).A process using a CO2 laser like this has the advantage of being faster than other processes (e.g., UV laser processes) and can provide a good FPCB (300).

[0129] According to one embodiment, when a coverlay (319) is laminated after forming holes (350a, 350b) and air pockets (360), a phenomenon in which the coverlay collapses may occur as shown in FIG. 19. Accordingly, according to one embodiment of the present disclosure, as shown in FIG. 14, the occurrence of a phenomenon in which the coverlay collapses can be prevented by performing a CO2 laser process after the coverlay (317 and / or 319) is laminated on the FPCB (300).

[0130] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The device may include: a housing (201) forming the exterior of the electronic device; a first circuit board (262) accommodated in the housing and having a first component disposed thereon; a second circuit board (264) accommodated in the housing and spaced apart from the first circuit board; and a flexible printed circuit board (FPCB) (300) for electrically connecting the first circuit board and the second circuit board. The flexible printed circuit board may include: a first ground layer (311) comprising a first ground (3111, 3112) extending longitudinally in a first direction (Y direction); and a second ground layer (313) spaced apart from the first ground and extending longitudinally in the first direction parallel to the first ground, comprising a second ground and a signal line. It may include a third ground layer (315) including a third ground that is spaced apart from the second ground and extends in the first direction parallel to the second ground; a first insulation layer (321) disposed between the first ground layer and the second ground layer; and a second insulation layer (323) disposed between the second ground layer and the third ground layer. The first ground layer and / or the third ground layer may include a plurality of holes (350) formed along a position corresponding to the signal line. The first insulation layer and / or the second insulation layer may include an air pocket (360) formed between the plurality of holes (350) and the signal line to reduce or prevent insertion loss.

[0131] According to one embodiment, the second ground of the second ground layer is positioned between the first ground and the second ground, and the second ground layer may include the RF signal line between two second grounds spaced apart from each other.

[0132] According to one embodiment, the second ground layer may further include another signal line spaced apart from the RF signal line.

[0133] According to one embodiment, the first ground layer and the third ground layer include a plurality of holes formed along the signal line, and the first insulation layer and the third ground layer may include an air pocket formed between the plurality of holes and the signal line of the second ground layer.

[0134] According to one embodiment, the FPCB (300) may have a first ground layer that includes an opening formed along the signal line, and a third ground layer that includes a plurality of holes formed along the signal line. The first insulating layer may be a microstrip type FPCB that includes an air pocket formed between the plurality of holes and the signal line of the second ground layer.

[0135] According to one embodiment, the FPCB (300) may include a plurality of holes formed along the signal line in the first ground layer and the third ground layer. The first insulating layer and the second insulating layer may be a stripline type FPCB including an air pocket formed between the plurality of holes and the signal line of the second ground layer.

[0136] According to one embodiment, the air pocket may be a recess that is continuously connected from a plurality of holes (350b) toward a signal line.

[0137] According to one embodiment, the air pocket may be in the shape of a cylindrical column, a square column, or a polygonal column.

[0138] According to one embodiment, the air pocket may include at least two air pockets having a regular or irregular arrangement along the signal line.

[0139] According to one embodiment, the air pocket may include a plurality of air pockets formed corresponding to the plurality of holes.

[0140] According to one embodiment, it may include a first coverlay for covering the first ground layer; and a second coverlay for covering the third ground layer.

[0141] According to one embodiment, the first coverlay and / or the second coverlay may include the plurality of holes and a hole communicating with the air pocket.

[0142] According to one embodiment, the air pocket (360) formed in the FPCB (300) can be formed through a CO2 laser process.

[0143] According to one embodiment, the CO2 laser process may include penetrating the plurality of holes to form an air pocket in the first insulating layer and / or the second insulating layer.

[0144] According to one embodiment, a coverlay for covering the first ground layer and / or the third ground layer may be included. An air pocket (360) formed in the FPCB (300) may be realized by performing a drilling process by a CO2 laser process through the coverlay and the plurality of holes.

[0145] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device (101) may include: a housing (201) forming the exterior of the electronic device; a first circuit board (262) accommodated in the housing and having a first component disposed thereon; a second circuit board (264) accommodated in the housing and spaced apart from the first circuit board; and a flexible printed circuit board (FPCB) (300) for electrically connecting the first circuit board and the second circuit board. The flexible printed circuit board may include: a first ground layer (311) comprising a first ground (3111, 3112) extending longitudinally in a first direction (Y direction); and a second ground layer (313) spaced apart from the first ground and extending longitudinally in the first direction parallel to the first ground, comprising a second ground and a signal line. It may include a third ground layer (315) including a third ground that is spaced apart from the second ground and extends in the first direction parallel to the second ground; a first insulation layer (321) disposed between the first ground layer and the second ground layer; and a second insulation layer (323) disposed between the second ground layer and the third ground layer. The third ground layer may include a plurality of holes (350b) formed along positions corresponding to the signal line. The second insulation layer may include an air pocket (360) formed between the plurality of holes (350) and the signal line to reduce or prevent insertion loss.

[0146] According to one embodiment, the second ground of the second ground layer is positioned between the first ground and the second ground, and the second ground layer may include the RF signal line between two second grounds spaced apart from each other.

[0147] According to one embodiment, the second ground layer may further include another signal line spaced apart from the RF signal line.

[0148] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include: a housing (201) forming the exterior of the electronic device; a first circuit board (262) accommodated in the housing and having a first component disposed thereon; a second circuit board (264) accommodated in the housing and spaced apart from the first circuit board; and a flexible printed circuit board (FPCB) (300) for electrically connecting the first circuit board and the second circuit board. The flexible printed circuit board may include: a first ground layer (311) comprising a first ground (3111, 3112) extending longitudinally in a first direction (Y direction); and a second ground layer (313) spaced apart from the first ground and extending longitudinally in the first direction parallel to the first ground, comprising a second ground and a signal line. It may include a third ground layer (315) including a third ground that is spaced apart from the second ground and extends in the first direction parallel to the second ground; a first insulation layer (321) disposed between the first ground layer and the second ground layer; and a second insulation layer (323) disposed between the second ground layer and the third ground layer. The first ground layer and the third ground layer may each include a first plurality of holes (350a) and a second plurality of holes (350b) formed along a position corresponding to the signal line. The first insulation layer and the second insulation layer may each include a first air pocket (3601) and a second air pocket (3602) formed between the plurality of holes (350) and the signal line to reduce or prevent insertion loss.

[0149] According to one embodiment, the second ground of the second ground layer is positioned between the first ground and the second ground, and the second ground layer may include the RF signal line between two second grounds spaced apart from each other.

[0150] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0151] Although the present disclosure has been described by way of example with respect to one embodiment, it should be understood that the embodiment is for illustrative purposes only and is not intended to limit the present disclosure. It will be obvious to those skilled in the art that various changes in form and detailed configuration may be made without departing from the whole context of the present disclosure, including the appended claims and their equivalents.

Claims

1. In an electronic device (101), A housing (201) forming the exterior of the electronic device; A first circuit board (262) accommodated in the above housing and having a first component placed thereon; A second circuit board (264) accommodated in the housing and spaced apart from the first circuit board; It includes a flexible printed circuit board (FPCB) (300) for electrically connecting the first circuit board and the second circuit board, and The above flexible printed circuit board is, A first grounding layer (311) including a first ground (3111, 3112) that is extended in a first direction (Y direction); A second ground layer (313) including a second ground and signal line that is spaced apart from the first ground and extends in the first direction parallel to the first ground; A third grounding layer (315) including a third grounding layer that is spaced apart from the second grounding layer and extends in the first direction parallel to the second grounding layer; A first insulating layer (321) disposed between the first ground layer and the second ground layer; and It includes a second insulating layer (323) disposed between the second grounding layer and the third grounding layer, and The first ground layer and / or the third ground layer includes a plurality of holes (350) formed along positions corresponding to the signal line, and An electronic device comprising an air pocket (360) formed between the plurality of holes (350) and the signal line to reduce or prevent insertion loss, wherein the first insulating layer and / or the second insulating layer comprises the above-mentioned first insulating layer and / or the above-mentioned second insulating layer.

2. In Paragraph 1, The second ground of the second ground layer is positioned between the first ground and the second ground, and The electronic device comprising the RF signal line between two second ground layers spaced apart from each other.

3. In Paragraph 1 or 2, The electronic device wherein the second ground layer further includes another signal line spaced apart from the RF signal line.

4. In any one of paragraphs 1 to 3, The first ground layer and the third ground layer include a plurality of holes formed along the signal line, and An electronic device comprising the first insulating layer and the third ground layer, wherein the first insulating layer and the third ground layer include an air pocket formed between the plurality of holes and the signal line of the second ground layer.

5. In any one of paragraphs 1 to 4, The above FPCB (300) has a first ground layer that includes an opening formed along the signal line, and a third ground layer that includes a plurality of holes formed along the signal line. An electronic device in which the first insulating layer comprises an air pocket formed between the plurality of holes and the signal line of the second ground layer, which is a microstrip type FPCB.

6. In any one of paragraphs 1 to 5, The above FPCB (300) includes a plurality of holes formed along the signal line in the first ground layer and the third ground layer, and An electronic device that is a stripline type FPCB, wherein the first insulating layer and the second insulating layer include an air pocket formed between the plurality of holes and the signal line of the second ground layer.

7. In any one of paragraphs 1 through 6, The above air pocket is an electronic device that is a recess formed by a plurality of holes (350b) connected in succession toward a signal line.

8. In Paragraph 7, The above air pocket is an electronic device in the form of a cylindrical column, a square column, or a polygonal column.

9. In Paragraph 7, The above air pocket is an electronic device comprising at least two air pockets having a regular or irregular arrangement along the signal line.

10. In Paragraph 7, The above air pocket is an electronic device comprising a plurality of air pockets formed corresponding to the plurality of holes.

11. In any one of paragraphs 1 through 10, A first coverlay for covering the first ground layer; and An electronic device comprising a second coverlay for covering the third ground layer.

12. In Paragraph 11, The electronic device comprising the first coverlay and / or second coverlay including the plurality of holes and a hole communicating with the air pocket.

13. In any one of paragraphs 1 to 14, The air pocket (360) formed in the above FPCB (300) is an electronic device formed through a CO2 laser process.

14. In Paragraph 13, An electronic device comprising the above CO2 laser process penetrating the plurality of holes to form an air pocket in the first insulating layer and / or the second insulating layer.

15. In Paragraph 13 or 14, It includes a coverlay for covering the first ground layer and / or the third ground layer, and An electronic device in which an air pocket (360) formed in the above FPCB (300) is implemented by performing a drilling process by a CO2 laser process through the coverlay and the plurality of holes.

Images