Method and device for simulating virtual fashion item

Abstract

Disclosed are a method and device for simulating a virtual fashion item. According to one embodiment of the present invention, the virtual fashion item simulation method comprises the steps of: identifying one or more segments in which reefing attributes corresponding to at least a portion of one or more sewing lines included in a virtual fashion item are set; generating one or more constraint elements connecting mesh elements related to the identified one or more segments; and simulating reefing of at least the portion of the one or more segments on the basis of a constraint element in which a damaged state satisfies a predefined reefing condition among the one or more constraint elements.

Description

Method and device for simulating virtual fashion items

[0001] The following embodiments relate to a method and apparatus for simulating virtual fashion items.

[0002] Computer-based simulation technology is widely used in the fashion industry for designing fashion items. There is a demand for the development of technology to simulate fashion items in virtual environments that closely resemble their actual appearance, whether for designing fashion items or for simulating the look of virtual characters wearing them in the gaming industry.

[0003] When representing the tearing of fashion items in a simulation, the material topology changes over time because the connection structure of the constituent materials changes depending on the tearing. While a remeshing process to reconstruct the mesh may be necessary to reflect these topological changes, remeshing can increase the computational burden in a real-time simulation environment. Consequently, a method to simulate the tearing of fashion items without remeshing may be required.

[0004] A virtual fashion item simulation method performed by at least one processor according to one embodiment includes: identifying one or more segments having a ripping attribute set corresponding to at least a portion of one or more seams included in a virtual fashion item; generating one or more constraint elements connecting mesh elements associated with the identified one or more segments; and simulating the ripping of at least a portion of the one or more segments based on a constraint element among the one or more constraint elements whose damage state satisfies a predefined ripping condition.

[0005] The above-mentioned restraint element may include a spring connecting mesh elements in a sewing relationship.

[0006] The step of simulating the ripping of at least a portion of the above one or more segments may include the step of switching one or more constraint elements that satisfy the ripping condition to an inactive state.

[0007] The above-mentioned ripping attribute may include at least one of parameters indicating whether ripping is enabled, a fracture threshold, a ripping speed, or a method for calculating a fracture indicator.

[0008] The step of simulating the ripping of at least a portion of the one or more segments may include: updating the damage state of the corresponding restraint element based on a fracture indicator calculated for each of the one or more restraint elements; and identifying a restraint element among the one or more restraint elements whose damage state satisfies the ripping condition.

[0009] The step of updating the damage state of the corresponding restraint element may include: a step of determining whether the fracture index of the corresponding restraint element is greater than or equal to a preset threshold; and a step of cumulatively updating the damage state of the corresponding restraint element according to the result of the determination.

[0010] The above preset threshold may be based on the ripping attribute set for the segment associated with the corresponding constraint element.

[0011] The step of updating the damage state of the corresponding constraint element may include determining the damage accumulation rate of the corresponding constraint element based on the ripping attribute set for the segment associated with the corresponding constraint element.

[0012] The step of calculating the fracture index may include the step of calculating the fracture index for the corresponding restraint element based on the change in length of the corresponding restraint element.

[0013] The step of calculating the fracture index may include: identifying a plurality of first mesh elements and a plurality of second mesh elements located on both sides of the corresponding restraint element based on a seam line including the corresponding restraint element; obtaining stress for each of the plurality of first mesh elements and the plurality of second mesh elements; and calculating a fracture index for the corresponding restraint element based on the obtained stresses.

[0014] The step of calculating a fracture index for the corresponding constraint element may include the step of calculating a first stress contribution based on the plurality of first mesh elements and a second stress contribution based on the plurality of second mesh elements based on the acquired stresses.

[0015] The above one or more seam lines include a segment with a ripping attribute set and a segment without a ripping attribute set, the segment with the ripping attribute set is configured such that corresponding vertices in a sewing relationship are connected by one or more constraint elements, and the segment without a ripping attribute set may be configured such that corresponding vertices in a sewing relationship are welded.

[0016] The above one or more segments include a ripping-capable segment and a ripping-completed segment, and the ripping-capable segment and the ripping-completed segment may be defined as parametric positions for the one or more seams.

[0017] The above parametric position may not be changed by the creation or removal of constraint elements.

[0018] The step of simulating the ripping of at least a portion of the above one or more segments may include the step of updating the ripped segment based on the parametric position of the constraint element satisfying the ripping condition.

[0019] The above damage state can be stored as a damage value corresponding to a parametric position for one or more of the above seams.

[0020] The damage value corresponding to the above parametric position can be obtained by interpolating the damage values ​​corresponding to different parametric positions.

[0021] An electronic device according to one embodiment comprises at least one processor including processing circuitry; and a memory for storing instructions, wherein the instructions, when executed alone or jointly by the at least one processor, cause the electronic device to perform the operation of identifying one or more segments having a ripping attribute set corresponding to at least a portion of one or more seams included in a virtual fashion item; the operation of generating one or more constraint elements connecting mesh elements associated with the identified one or more segments; and the operation of simulating the ripping of at least a portion of the one or more segments based on a constraint element among the one or more constraint elements whose damage state satisfies a predefined ripping condition.

[0022] FIG. 1 is a flowchart illustrating a virtual fashion item simulation method according to one embodiment.

[0023] FIG. 2 is a diagram illustrating a parametric location-based ripping target segment management method according to one embodiment.

[0024] FIG. 3 is a diagram illustrating a method for calculating a fracture index using a stress-based second method according to one embodiment.

[0025] FIGS. 4a and 4b are drawings for explaining a method of calculating a breakage index when a virtual fashion item according to one embodiment includes a spring cycle.

[0026] FIG. 5 is a drawing showing a user interface for setting a ripping target segment through a three-dimensional model according to one embodiment.

[0027] FIG. 6 is a drawing showing a user interface for setting a ripping target segment through a two-dimensional pattern according to one embodiment.

[0028] FIG. 7 is a drawing showing a user interface for setting a ripping target segment through at least one of a three-dimensional model or a two-dimensional pattern according to one embodiment.

[0029] FIG. 8 is a diagram illustrating the process of snapping to vertices when setting a ripping target segment in a user interface according to one embodiment.

[0030] FIG. 9 is a flowchart illustrating a virtual fashion item simulation method according to one embodiment.

[0031] FIG. 10 is a block diagram of the configuration of a device according to one embodiment.

[0032] Specific structural or functional descriptions of the embodiments are disclosed for illustrative purposes only and may be modified and implemented in various forms. Accordingly, actual implementations are not limited to the specific embodiments disclosed, and the scope of this specification includes modifications, equivalents, or substitutions included in the technical concept described by the embodiments.

[0033] In relation to the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise.

[0034] In this document, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0035] In this specification, the phrase “at least one of A, B, or C” may be interpreted broadly. Unless expressly otherwise stated, this phrase may mean A, B, and C individually, or a combination of two or more of them together. For example, “at least one of A, B, or C” may include A alone, B alone, C alone, a combination of A and B, a combination of B and C, a combination of A and C, and a combination of A, B, and C. This interpretation applies regardless of whether the listed items are connected by “and,” “or,” or “and / or,” and is intended to exclude a restrictive interpretation requiring that all listed elements be present.

[0036] Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in other aspects (e.g., importance or order). For example, a first component may be named a second component, and similarly, a second component may be named a first component.

[0037] Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0038] The singular expression includes the plural expression unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to specify the existence of the described features, numbers, steps, actions, components, parts, or combinations thereof, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0039] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this specification.

[0040] As used in this specification, the term "avatar" may refer to any type of three-dimensional object that serves as a target for wearing or placing clothing within a virtual space. This is not limited to typical human forms and can be defined as a broad concept that includes body forms of various sizes, mannequins, torsos, as well as biological forms or abstract geometric structures. Accordingly, avatar should be broadly interpreted to mean any three-dimensional mesh or geometric shape having a surface capable of physically interacting with virtual clothing.

[0041] As used in this specification, the term "virtual fashion item" refers to an object corresponding to a digital form of clothing or fashion accessory related to fashion. For example, a virtual fashion item may include at least one of clothing (e.g., T-shirts, blouses, pants, skirts, dresses, knitwear, etc.), hats, scarves, belts, gloves, socks, shoes, bags, and accessories (e.g., necklaces, bracelets, earrings, rings, etc.). A virtual fashion item encompasses all types of products manufactured using flexible materials such as fabric, leather, or film. For example, a virtual fashion item may include fabric furniture used in homes or offices (e.g., sofas, chair covers, bedding, curtains, cushions, etc.), and furthermore, may include various industrial textile products formed by sewing or joining multiple patterns, such as interior materials for means of transportation like automobiles or aircraft (e.g., car seats, headrests, door trims, etc.).

[0042] In the real world, a garment pattern corresponds to a paper template used to cut material into a specific shape when producing a garment. Therefore, in the real world, fabric is cut using a garment pattern, and the cut fabric is sewn to create a garment. However, in this specification, a garment pattern may refer to a composition as a material for a virtual fashion item. Specifically, a garment pattern may be provided as a graphic object having the form of a real-world paper template. Accordingly, a virtual fashion item can be created by combining two or more garment patterns according to this specification.

[0043] Virtual fashion items may include clothing and fashion accessories (hats, scarves, bags, etc.) modeled in three dimensions, and the surface of a virtual fashion item may be defined by one or more meshes. A mesh may be in the form of polygons (e.g., triangles, quadrilaterals) and may include multiple vertices and edges. A vertex corresponds to a point in the space of the surface, and an edge is a line segment connecting two different vertices.

[0044] Three or more vertices forming a polygon of a mesh are point masses, and each edge of the mesh can be represented as an elastic spring connecting that mass. A virtual fashion item can be modeled, for example, by a mass-spring model. Here, the springs may have resistance values ​​for, for example, stretch, shear, and bending, depending on the physical properties of the fabric used. Each vertex can move under the action of external forces, such as gravity, and internal forces of stretch, shear, and bending. By calculating the external and internal forces to determine the force applied to each vertex, the displacement and velocity of movement of each vertex can be calculated. Then, the movement of the virtual fashion item can be simulated through the movement of the mesh vertices at each time step. For example, if a virtual garment made of mesh is draped onto a 3D avatar, a 3D virtual garment with a natural shape based on the laws of physics can be realized.

[0045] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are given the same reference numeral regardless of the drawing number, and redundant descriptions thereof will be omitted.

[0046] FIG. 1 is a flowchart illustrating a virtual fashion item simulation method according to one embodiment.

[0047] The virtual fashion item simulation method described in FIG. 1 can be performed by an electronic device (or one or more processors included in the electronic device). For convenience, one or more processors are referred to as “processors” in this disclosure. The specific hardware structure of the electronic device is described in detail below.

[0048] Referring to FIG. 1, a process is illustrated in which an electronic device (e.g., the electronic device (1000) of FIG. 10) that performs a virtual fashion item simulation according to one embodiment simulates the ripping of at least a portion of a virtual fashion item through steps (110) to (130).

[0049] The operations of steps (110) to (130) included in the virtual fashion item simulation method described in FIG. 1 may be performed sequentially, but are not necessarily performed sequentially. For example, the order of steps (110) to (130) may be changed, and at least two of the operations of steps (110) to (130) may be performed in parallel.

[0050] In step (110), the electronic device can identify one or more segments with ripping properties set corresponding to at least a portion of one or more seams included in the virtual fashion item.

[0051] "Ripping" may refer to the relative separation of mesh areas that occurs as constraints formed on specific segments in a virtual fashion item are weakened or released. "Segment" refers to a continuous subset representing part or all of a specific line (e.g., a seam) and may refer to a line segment or a set of line segments that define an area on the surface of the virtual fashion item where separation may occur. A segment has a start point and an end point and may include continuous or discrete locations (e.g., vertices) between them. The segment subject to ripping may be defined by a seam, but is not limited thereto, and may include any line specified by the user, any line separating mesh areas, or any line determined during the simulation process. Separation within a segment may proceed sequentially, or it may occur simultaneously or independently at multiple locations within the segment.

[0052] According to one embodiment, ripping may occur partially or wholly with respect to the segment and may appear in various forms depending on the speed of separation, separation intensity, separation range, or separation pattern. For example, ripping may include various forms of separation phenomena such as tearing, fracture, or rupture of the virtual fashion item.

[0053] "Constraint" may refer to a constraint that defines the connection relationships between mesh regions or mesh elements of a virtual fashion item. Specifically, a constraint may refer to a computational rule or physical parameter applied to restrict the relative positional relationship or movement between adjacent mesh regions in a specific segment during the simulation. For example, a constraint may include the connection relationship between patterns connected by seams, the connection relationship formed along the internal lines of a pattern, or the connection relationship between mesh elements within a pattern. As an example, a constraint may be set using constraint elements such as springs, fixed constraints, or dampers, and may include, but is not limited to, methods that ensure two mesh elements remain adjacent or the distance between two elements is maintained at a specific value during the simulation (i.e., geometric constraints). In one embodiment, the electronic device weakening or releasing a constraint may include adjusting or deactivating the attributes of the constraint element implementing the corresponding constraint. For example, if the restraining element is a spring, weakening the restraint may correspond to reducing the stiffness (or rigidity) of the spring, and releasing the restraint may correspond to setting the stiffness of the spring to 0 or removing the spring. For convenience of explanation, the restraint and the restraining element may be used interchangeably below.

[0054] 'Ripping attributes' may refer to parameters that define the conditions for weakening or releasing constraints on a specific segment and the characteristics of the separation process resulting therefrom. For example, ripping attributes may include at least one of parameters indicating whether ripping is enabled, a fracture threshold, a ripping rate, or a method for calculating a fracture indicator.

[0055] The 'break threshold' may refer to a value that serves as a criterion for when the weakening or release of a constraint(s) formed for a specific segment begins. The break threshold may correspond to a threshold for determining whether to weaken or release a constraint. For example, an electronic device may weaken or release a corresponding constraint if the break indicator for that constraint exceeds the break threshold.

[0056] 'Ripping rate' may refer to a parameter that determines the speed at which segment separation proceeds. The ripping rate may correspond to the degree to which the constraint(s) formed on the corresponding segment weaken per unit time. For example, an electronic device may determine the amount of accumulated damage per unit time for the corresponding constraint based on the ripping rate, and the higher the ripping rate, the faster the corresponding constraint can weaken or be released.

[0057] The 'fracture index calculation method' may refer to a method for calculating a fracture index to determine the ripping of a segment. The fracture index calculation method may correspond to a calculation method for determining whether the constraint(s) formed for the corresponding segment are weakened or released. For example, the fracture index calculation method may be set as one of a strain (or degree of deformation)-based method (hereinafter, the first method) or a stress-based method (hereinafter, the second method), but is not limited thereto. As an example, an electronic device may calculate the fracture index for the corresponding constraint in different ways depending on the fracture index calculation method.

[0058] 'Ripping Activation Status' may refer to a parameter indicating whether the ripping function is applied to a specific segment. Ripping Activation Status may correspond to whether the constraint(s) formed for the corresponding segment can be weakened or released during the simulation process. For example, an electronic device may calculate the fracture index and perform the weakening or release of constraints only for segments where Ripping Activation Status is set to enabled.

[0059] According to one embodiment, each parameter included in the ripping attribute can be set on a segment basis. For example, the electronic device may set a first breakage threshold, a first ripping speed, and a first method for a first segment of the seam, and set a second breakage threshold, a second ripping speed, and a second method for a second segment of the seam. As an example, the electronic device can implement a differentiated ripping effect depending on the segment by applying different ripping attributes to each segment even within the same seam.

[0060] According to one embodiment, the electronic device can identify one or more segments to which a ripping attribute is set. One or more segments may correspond to at least a portion of one or more seams included in a virtual fashion item.

[0061] According to one embodiment, a segment subject to ripping (hereinafter referred to as the ripping target segment) may be defined by a sewing line. A "sewing line" may refer to a line defined to connect two or more patterns included in a virtual fashion item to each other, or to connect another element to a single pattern. A sewing line may be formed along the outline of a pattern or may be formed inside a pattern. For example, a sewing line may include not only lines connecting to other patterns from the outer edge of a pattern, but also lines formed inside a pattern to attach pockets, decorative details, etc. In this specification, a sewing line may be understood as a concept encompassing internal lines or characteristic lines that connect or divide patterns, such as dart lines, quilting lines, slash lines, zipper lines, reinforcement lines, and fold lines, and the virtual fashion item simulation method described in this specification may be applied in the same way to such internal lines or characteristic lines.

[0062] According to one embodiment, the ripping target segment may be set for all or part of a seam. For example, the ripping target segment may correspond to an entire seam, a part of a seam, or at least part of each of a plurality of seams. For convenience of explanation, the following description focuses on the case where a part of a seam connecting two or more patterns is set as the ripping target segment, but is not limited thereto, and the ripping target segment may be defined in various forms, such as feature lines within the pattern.

[0063] According to one embodiment, an electronic device may determine one or more identified segments as rip target segments. A 'rip target segment' may refer to a segment in which separation may occur due to the weakening or release of a constraint during the simulation process. A rip target segment may correspond to a segment scheduled for ripping when a simulation is performed with a rip attribute set. The electronic device may determine one or more segments with a rip attribute set as rip target segments. Hereinafter, a segment in which a rip attribute is set and ripping may occur during the simulation process may be referred to as a 'rip target segment'.

[0064] According to one embodiment, the electronic device can determine the ripping target segment based on whether ripping is enabled. The electronic device can identify only the seam or the seam segment for which the ripping activation status is set to enabled among the segments for which ripping attributes are set as the ripping target segment. For example, if the ripping activation status is set to enabled for a first seam for which ripping attributes are set, and the ripping activation status is set to disabled for a second seam, the electronic device can determine the first seam as the ripping target segment and exclude the second seam from the ripping target.

[0065] According to one embodiment, the electronic device may receive user input for setting ripping attributes. The electronic device may set ripping attributes for a specific segment based on the user input. For example, the electronic device may receive at least one of an input from a user specifying a segment to be ripped, an input setting whether to enable ripping for the segment, an input setting a fracture threshold, an input setting a ripping speed, or an input selecting a method for calculating a fracture index.

[0066] According to one embodiment, an electronic device may display at least one of a three-dimensional model of a virtual fashion item or one or more two-dimensional patterns corresponding to the virtual fashion item. Through at least one of the three-dimensional model or one or more two-dimensional patterns, the electronic device may receive a selection input for a segment corresponding to at least a portion of one or more seams included in the virtual fashion item. The electronic device may set a ripping attribute for the segment for which the selection input was received.

[0067] According to one embodiment, an electronic device may display a three-dimensional model of a virtual fashion item. The three-dimensional model may include, for example, a model created by placing or modifying two-dimensional patterns in a three-dimensional space, a model created through sewing simulations of two-dimensional patterns, or a model created through wearing simulations of an avatar. A user may set a segment as a ripping target segment by selecting a segment corresponding to at least a portion of a seam line on the displayed three-dimensional model.

[0068] According to one embodiment, an electronic device may display one or more two-dimensional patterns corresponding to a virtual fashion item. A two-dimensional pattern may refer to each garment pattern constituting the virtual fashion item displayed in a flat state. A user may set a segment as a ripping target segment by selecting a segment corresponding to at least a portion of a seam line on the displayed two-dimensional pattern. At this time, the electronic device may identify a corresponding segment of one or more other patterns that is in a sewing relationship with the selected segment. The electronic device may set the identified corresponding segment as a ripping target segment and indicate to the user that a ripping attribute has been set for the segment.

[0069] According to one embodiment, when a segment is selected through a two-dimensional pattern, the electronic device can reflect a segment corresponding to the selected segment in a three-dimensional model. Similarly, when a segment is selected through a three-dimensional model, the electronic device can reflect a segment corresponding to the selected segment on one or more two-dimensional patterns. Through this, even if a user sets a segment to be ripped through either the two-dimensional pattern or the three-dimensional model, the same segment is displayed as selected in the other, thereby providing a consistent user experience.

[0070] According to one embodiment, the selection input may include an input specifying a first position and a second position on a seam included in a virtual fashion item. The electronic device may set a segment between the first position and the second position as a segment to be ripped according to the selection input. For example, the user may select the entire seam by clicking the start and end points of the seam, or select only a portion of the seam by clicking two midpoints of the seam. In one embodiment, the user may select two points on the seam through touch input using a finger, touch pen input, or mouse click, but is not necessarily limited thereto.

[0071] For example, the user may designate vertices on the seam line as first and second positions. The electronic device may provide visual effects at the vertex positions when the user moves the cursor along the seam line. For example, when the user clicks the first vertex, that vertex is set as the first position, and while the cursor is moved thereafter, the line segment from the first position to the current cursor position may be displayed in a color different from the seam line. When the user clicks the second vertex, that vertex is set as the second position, and the segment between the first position and the second position may be determined as the segment to be ripped. In one embodiment, the first and second positions may be limited to correspond only to vertices, and the intermediate edge area between the vertices may be excluded from selection.

[0072] According to an embodiment, the user may select any position on the seam line. In this case, the electronic device may adjust the first and second positions specified by the user to one of the vertices already generated along the seam line. This may be so that the electronic device may set a constraint based on the vertices corresponding to the first and second positions. As previously explained, since the constraint corresponds to the connection relationship between mesh elements included in a specific segment, the electronic device may set a constraint on the segment between the vertices by adjusting the first and second positions to one of the vertices on the seam line.

[0073] According to one embodiment, the electronic device may perform snapping to adjust the first position and the second position to vertices on the seam line. Snapping is merely an example of a method for setting the segments to be ripped without performing remeshing that changes the topology of the mesh, and the electronic device may also adjust the first position and the second position to become vertices through other methods.

[0074] For example, an electronic device can make a first position and a second position correspond to a vertex through snapping. Snapping may refer to a technique that adjusts a selected input position to the vertex closest to that position. As an example, the electronic device can determine the first position and the second position as the vertex closest to the selected input position among the vertices existing on the corresponding seam line. When a user clicks any location on the seam line, the electronic device can identify the vertex on the seam line closest to the clicked location and determine that vertex as the first position or the second position.

[0075] The electronic device can define segments to be ripped without changing the mesh topology by utilizing snapping. This allows the electronic device to reduce computational costs associated with remeshing and improve simulation efficiency. However, depending on the embodiment, the electronic device may additionally provide a function to perform local or global remeshing so that vertices are located at first and second positions. For example, when the electronic device receives a remeshing command from a user (e.g., clicking a remeshing button), it may perform remeshing in batches so that vertices are located at the boundary positions of each segment for which ripping attributes are set. Depending on user settings, the electronic device may also perform remeshing so that vertices are located at the boundary positions of a segment whenever ripping attributes are set on that segment. This remeshing function may be optionally utilized when the user wishes to control segment boundaries more precisely.

[0076] According to one embodiment, the electronic device may provide a function for setting ripping attributes for a ripping target segment. The electronic device may set parameters such as whether ripping is enabled, a fracture threshold, a ripping speed, and a method for calculating a fracture indicator based on user input. For example, the electronic device may provide interface elements such as a toggle button for setting whether ripping is enabled, a numeric input field or slider for setting a fracture threshold or a ripping speed, and a drop-down menu for selecting a method for calculating a fracture indicator.

[0077] According to one embodiment, for each segment, the user may directly set all parameters included in the ripping attribute or set only some parameters. If only some parameters are set, the electronic device may set the remaining parameters to default values. The default values ​​may be predefined by the system. The default values ​​may be defined differently, for example, depending on the physical properties of the material constituting the segment. For example, a material with high elasticity may be defined with a higher breaking threshold than a material with low elasticity, and a material with high weave density may be defined with a lower ripping speed than a material with low weave density.

[0078] According to one embodiment, the electronic device may provide a function for editing a set ripping target segment. The electronic device may perform editing operations such as modifying the range of the ripping target segment, changing parameter values ​​of ripping attributes, or duplicating or deleting the ripping target segment. For example, in the case of a ripping target segment set for a seam, the electronic device may adjust the length of the ripping target segment by moving the start and end points of the segment.

[0079] According to one embodiment, the electronic device can restore a segment to a normal seam state by deleting the segment to be ripped. For example, upon receiving user input to delete the segment to be ripped, the electronic device can convert the segment into a sewn segment by removing the ripping attribute for the segment. At this time, the electronic device can change the visual display of the segment to a normal seam state. For example, a visual display indicating the segment to be ripped (e.g., dotted line, specific color) can be changed to a display indicating a normal seam (e.g., solid line, basic color). Subsequently, when a simulation is performed, the electronic device can convert the segment to a sewn state by performing a sewing process on the segment restored to a sewn segment to weld the vertices associated with the segment. For example, if the segment is separated after ripping is completed through the simulation, deleting the segment to be ripped and performing the simulation again allows the sewing process to be executed again on the segment, and the separated patterns can be visually confirmed to be sewn and joined.

[0080] The specific method for a user to select a segment to be ripped and set ripping attributes through a user interface, and to modify a segment with set ripping attributes, is explained in detail with reference to the drawings described below.

[0081] In step (120), the electronic device can generate one or more constraint elements that connect mesh elements associated with one or more identified segments.

[0082] According to one embodiment, an electronic device can perform a simulation of a virtual fashion item. During the simulation process, the electronic device can generate one or more constraint elements that connect mesh elements associated with one or more identified segments.

[0083] 'Simulation' may refer to the process of simulating the physical behavior of a virtual fashion item on a computer. The surface of the virtual fashion item may be defined by one or more meshes, and the mesh may include multiple vertices and edges in the form of polygons. A vertex corresponds to a point in surface space, and an edge may correspond to a line segment connecting two different vertices. As previously described, the virtual fashion item may be modeled by a mass-spring model, and the edges connecting each vertex may be represented as elastic springs. The electronic device can realize the shape change and movement of the virtual fashion item by simulating the movement of the vertices by calculating external and internal forces acting on each vertex. External forces may include, for example, gravity, wind, collisions with an avatar, or user-defined forces, and internal forces may include resistance forces to stretching, shearing, bending, etc., based on the physical properties of the material.

[0084] According to one embodiment, the simulation may include a series of draping phases. A draping phase may refer to a step for aligning patterns constituting a virtual fashion item into a stable wearing state in an avatar or three-dimensional space. A draping phase may be included in the initial phase of the simulation. For example, an electronic device may perform a draping phase for a predetermined frame segment after the simulation starts.

[0085] In the draping stage, the electronic device can adjust specific physical parameters so that the virtual fashion item aligns quickly and stably. For example, the electronic device can set the air damping relatively high to suppress excessive movement of the virtual fashion item and improve the convergence speed.

[0086] In the draping step, the electronic device may set (e.g., create) a spring (hereinafter, seam spring) connecting corresponding segments of patterns based on one or more seams. The seam spring may correspond to a constraint connecting corresponding vertices of patterns in a sewing relationship, and the electronic device may induce the patterns to be adjacent to each other at the seam segments based on the stiffness applied to the seam spring.

[0087] Generally, once the draping step is completed, the electronic device can remove the seam springs and perform welding to merge the vertices of the patterns along the seam line. Welding can refer to the process of merging corresponding vertices of adjacent patterns into a single vertex to form a continuous mesh structure. Through welding, the electronic device can maintain the connectivity between patterns without seam springs and represent a virtual fashion item as a single mesh.

[0088] Assuming that ripping occurs in welded seam segments, merged vertices need to be separated again. In this case, remeshing or equivalent mesh reconstruction operations may be required to reconstruct the topology of the separated mesh regions. For example, electronic devices may need to perform mesh reconstruction operations for separated segments, such as duplicating vertices or redefining edge connectivity. In particular, when ripping is performed in parallel on multiple target segments, remeshing is required for each segment, which can significantly increase the computational burden in a real-time simulation environment.

[0089] According to one embodiment, the electronic device can maintain a connection state via seam springs without performing welding on the segments targeted for ripping even after the draping step. Specifically, the electronic device can ensure that the vertices of the segments remain independent vertices without merging with each other by not removing the seam springs for segments where ripping attributes are set. Through this, the electronic device can implement ripping by adjusting the stiffness of the seam springs without the need to perform remeshing for vertex separation when ripping occurs. This may be intended to reduce the computational burden in a real-time simulation environment and improve the stability of the simulation.

[0090] For example, the electronic device can convert only the segments without the ripping attribute set to a welding state by retaining the seam springs included in the segments with the ripping attribute set and removing the seam springs included in the segments without the ripping attribute set. In other words, the electronic device can selectively perform welding only on segments that are not scheduled for ripping after the draping stage. Through this, the electronic device can apply an appropriate connection method according to the characteristics of each segment by converting segments that do not require ripping into a continuous mesh structure and maintaining the seam spring-based connection state for segments that require ripping (e.g., segments targeted for ripping). This selective welding method can improve simulation efficiency by reducing unnecessary topology changes.

[0091] According to one embodiment, each seam spring included in a segment with a ripping attribute set may correspond to a constraint element formed for that segment. In other words, the electronic device may set (e.g., create) a spring as a constraint element connecting mesh elements associated with one or more identified segments. The spring may refer to an elastic element that connects mesh elements in a sewing relationship, specifically connecting corresponding vertices of different patterns or connecting corresponding vertices along a feature line within a single pattern. For example, the electronic device may identify one or more pairs of vertices corresponding to a segment to be ripped based on a sewing relationship and create a spring connecting each pair of vertices. For convenience of explanation, the following description focuses on the case where a seam spring created in the draping step is used as a constraint element; however, depending on the embodiment, the constraint element may be a spring created separately for the segment to be ripped, or it may be another type of element capable of retaining and tracking a damaged state.

[0092] According to one embodiment, the weakening or release of the restraint described in step (110) may correspond to the weakening or release of a restraint element (e.g., a spring) included in the segment. The restraint elements created along the seam line each function independently and may be weakened or released individually depending on the damage state of each restraint element. For example, if the damage state of a specific restraint element satisfies a ripping condition, the electronic device may switch the restraint element to an inactive state. As an example, the electronic device may switch the spring corresponding to the restraint element to an inactive state by setting the stiffness of the spring corresponding to the restraint element to 0. Through this, the electronic device can control ripping on a restraint element basis and implement gradual separation.

[0093] According to one embodiment, the simulation may proceed in discrete time units. For example, an electronic device may perform the simulation by dividing it into multiple time steps, and may update the state of a virtual fashion item by calculating the positions, velocities, and accelerations of vertices at each time step. For example, the electronic device may update the shape of a mesh by calculating the external and internal forces acting on each vertex at each time step and determining the displacement of the vertices based on this.

[0094] According to one embodiment, the electronic device may initialize the damage state of each restraint element included in the ripping target segment when starting the simulation. For example, the electronic device may set a damage value representing the damage state of each restraint element to 0. As the simulation progresses, the electronic device may track the damage accumulated on each restraint element. As will be described later, damage to the restraint elements may occur due to external forces acting on the restraint elements during the simulation process. For example, damage may accumulate on the restraint elements (or mesh element(s) corresponding to the restraint elements) as external forces, such as gravity, wind, collision with an avatar, or user-defined forces, act on the virtual fashion item at every time step of the simulation.

[0095] In step (130), the electronic device can simulate the ripping of at least a portion of one or more segments based on one or more restraining elements whose damaged state satisfies a predefined ripping condition.

[0096] According to one embodiment, the electronic device can switch a restraining element satisfying a ripping condition to an inactive state. Switching to an inactive state may correspond to weakening or releasing the restraint, and may mean that the restraining element provides or does not provide a restraining force between mesh elements below a certain size. For example, if the restraining element is a spring, the electronic device can switch the spring to an inactive state by setting the stiffness of the spring to 0. When the stiffness of the spring is 0, the spring becomes in a state where it can be extended infinitely, so the spring may not provide a restraining force between mesh elements. Accordingly, the mesh regions of the segment may behave in a state where they are not restrained from each other, thereby enabling ripping.

[0097] According to one embodiment, an electronic device may switch a restraining element to an inactive state when the damaged state satisfies a predefined ripping condition. The 'predefined ripping condition' may include one or more criteria for determining whether the restraining element is a target for ripping. For example, the electronic device may switch the restraining element to an inactive state when the damaged state of the restraining element reaches a specific criterion (e.g., a maximum value or a threshold value). For example, the electronic device may switch the restraining element to an inactive state when a physical quantity associated with the restraining element (e.g., a fracture indicator described below) satisfies a specific criterion.

[0098] 'Damage state' may refer to a value representing the accumulated degree of damage to a specific restraint element. In one embodiment, damage to the restraint element may correspond to weakening of the restraint, and it may be understood that as the damage state increases, the degree of weakening of the restraint increases. The damage state may be modeled as a value that increases monotonically over time and may accumulate starting from an initial value (e.g., 0) until it reaches a maximum value (e.g., 1). When the damage state reaches a predefined ripping condition (e.g., maximum value), the electronic device may switch the corresponding restraint element to an inactive state.

[0099] According to one embodiment, the damage state may be updated based on a fracture indicator for the corresponding constraint element during the simulation (e.g., at each time step). The electronic device may update the damage state of the corresponding constraint element based on the fracture indicator calculated for each of one or more constraint elements.

[0100] The 'fracture index' may refer to a value indicating the probability of a specific constraint breaking or the degree to which it is likely to break. 'Fracture' may refer to the separation of the mesh regions connected by the constraint. Therefore, the fracture index can be understood as a value that quantitatively represents the extent to which the mesh regions connected by the constraint are inclined to separate from one another.

[0101] In one embodiment, the fracture index may be calculated as a value reflecting the physical state acting on the corresponding restraint element. For example, the fracture index may be calculated based on at least one of stress or strain acting on the corresponding restraint element. 'Stress' may refer to a force acting on the restraint element or a corresponding physical quantity, and may represent the intensity of an external force applied to the restraint element. 'Strain' may refer to the ratio of the changed length to the original length of the restraint element or the corresponding degree of deformation, and may indicate how much the restraint element has been stretched or compressed. For example, if the restraint element is a spring, the stress may correspond to the tension applied to the spring, and the strain may correspond to the degree of elongation of the spring.

[0102] According to one embodiment, the electronic device can determine whether the fracture index of a corresponding restraint element is greater than or equal to a preset threshold. Based on the determination result, the electronic device can cumulatively update the damage state of the corresponding restraint element. For example, the electronic device can determine whether the threshold of each restraint element is satisfied during the simulation (e.g., at each time step) and cumulatively update the damage state of the corresponding restraint element only if the fracture index is greater than or equal to the threshold.

[0103] According to one embodiment, a preset threshold may be based on a ripping attribute set for a segment associated with a corresponding constraint element. For example, the preset threshold may be based on a fracture threshold set for a segment associated with a corresponding constraint element. A segment associated with a corresponding constraint element may refer to a segment targeted for ripping that contains the corresponding constraint element. Since each parameter included in the ripping attribute is set on a per-segment target for ripping, constraint elements contained in the same segment may have the same fracture threshold. For example, if a user sets a high fracture threshold for a specific segment, the constraint elements contained in that segment must have a larger fracture index for damage to begin accumulating.

[0104] According to one embodiment, an electronic device can determine the damage accumulation rate of a corresponding restraint element based on a ripping attribute set for a segment associated with the corresponding restraint element. For example, the electronic device can determine the damage accumulation rate based on a ripping rate set for a segment associated with the corresponding restraint element. The 'damage accumulation rate' may refer to the degree to which the damage state increases per unit time when the fracture index is above a threshold. The higher the ripping rate, the greater the damage accumulation rate, allowing the restraint element to reach the maximum damage state more quickly. For example, if a user sets a high ripping rate for a specific segment, the restraint elements included in that segment may rapidly accumulate damage while the fracture index exceeds the threshold, allowing ripping to proceed quickly.

[0105] According to one embodiment, the electronic device can determine an increase in the damage state accumulated based on the ripping rate and the time step size of the simulation. For example, the electronic device can determine an increase in the damage state accumulated at each time step by multiplying the ripping rate by the time step size. During the simulation (e.g., at each time step), the electronic device determines whether each constraint element satisfies a threshold value, and only if the fracture index is greater than or equal to the threshold value can the corresponding constraint element's damage state be accumulated and updated by the determined increase.

[0106] According to one embodiment, the cumulative updating of the damage state can be performed in a manner that increases monotonically over time. The electronic device may increase the damage state of the restraint element, but may not decrease it. That is, once accumulated, the damage is not removed or recovered and may be continuously maintained throughout the simulation. For example, even if the fracture index of the restraint element exceeds a threshold and damage accumulates at a specific time step, and then decreases below the threshold at the next time step, the already accumulated damage state may be maintained. Through this, the electronic device can track the accumulated damage applied to the restraint element and implement gradual ripping even under repetitive or intermittent external forces.

[0107] According to one embodiment, an electronic device can identify one or more restraining elements whose damaged state satisfies a ripping condition. For example, the electronic device can identify a restraining element whose damaged state has reached a predefined maximum damaged state (e.g., 1) as a restraining element satisfying the ripping condition. The electronic device can ripping a segment corresponding to the restraining element by switching the identified restraining element to an inactive state. If the restraining element is a spring, the electronic device can switch it to an inactive state by setting the stiffness of the spring to 0, thereby allowing mesh regions at that location to be separated without being further restrained. Through this, the electronic device can implement gradual ripping on a restraining element basis.

[0108] According to one embodiment, the electronic device may calculate a fracture index using a plurality of methods. For example, the electronic device may calculate a fracture index using at least one of a strain-based first method or a stress-based second method, but the method for calculating the fracture index is not limited to the examples below, and other calculation methods may be applied.

[0109] According to one embodiment, the electronic device may determine the method for calculating the fracture index of a corresponding restraint element based on the ripping attribute set for the segment associated with the corresponding restraint element. For example, the electronic device may calculate the fracture index of the restraint element in different ways depending on the method for calculating the fracture index set for the segment associated with the corresponding restraint element. As previously described, the method for calculating the fracture index is one of the parameters included in the ripping attribute and may be set at the level of the segment to be ripped. Accordingly, different methods for calculating the fracture index may be applied depending on the segment even within the same virtual fashion item, and the user may select an appropriate method based on the desired ripping behavior, visual representation, or application requirements. According to an embodiment, the method for calculating the fracture index may also be set at the level of a simulation. In this case, the electronic device may apply the same method for calculating the fracture index to all segments to be ripped included in the virtual fashion item while the simulation is being performed. For example, if the user selects the first method or the second method in the simulation settings, the electronic device may calculate the fracture index for all restraint elements in the selected method while the simulation is being performed.

[0110] 'The first method' may refer to a method of calculating a fracture index based on the degree of deformation of each restraining element. For example, for each restraining element to which the first method is applied, the electronic device may calculate a fracture index based on the change in length of the corresponding restraining element. The change in length of the restraining element is a value indicating how much the restraining element has been stretched or compressed, and may correspond to the degree of deformation of the restraining element. For example, if the restraining element is a spring, the electronic device may calculate a fracture index based on the difference between the current length of the spring and a reference length (e.g., initial length or natural length). As an example, for each restraining element to which the first method is applied, the electronic device may calculate the value obtained by subtracting the reference length from the current length at each time step in which the simulation is performed. Generally, strain is defined as the ratio of the degree of deformation to the reference length; however, in the case of restraining elements connecting patterns in a sewing relationship, the reference length may be set to zero, so the electronic device may use the difference between the current length and the reference length itself as the fracture index. The first method is a method of directly measuring the amount of geometric change of the restraining element, and the calculation can be performed relatively simply and quickly. Accordingly, the first method may be advantageous in real-time simulation environments or low-spec hardware environments.

[0111] 'Second method' may refer to a method for calculating a fracture index based on the stress distribution around each restraining element. For example, for each restraining element to which the second method is applied, an electronic device may calculate a fracture index based on the stresses of mesh elements located on both sides of a seam containing the corresponding restraining element.

[0112] Specifically, the electronic device can identify a plurality of first mesh elements and a plurality of second mesh elements located on both sides of a corresponding constraint element based on a seam line containing the corresponding constraint element. The 'multiple first mesh elements' may refer to mesh elements that constitute a mesh area located on one side based on the corresponding constraint element, and the 'multiple second mesh elements' may refer to mesh elements that constitute a mesh area located on the other side based on the constraint element. In one embodiment, the first mesh elements and the second mesh elements may include mesh elements that share a vertex or an edge with the corresponding constraint element. For example, if the constraint element is a spring connecting two vertices, the first mesh elements may include mesh elements connected to one vertex of the spring, and the second mesh elements may include mesh elements connected to the other vertex of the spring.

[0113] Mesh elements may include, for example, triangle elements constituting a triangle mesh, quadrilateral elements constituting a quadrilateral mesh, polygonal elements constituting a polygon mesh, but are not limited thereto. For example, if a virtual fashion item is composed of a triangle mesh and a constraint element is a spring created along a seam line, the first mesh elements may include triangle elements that share a vertex or edge with the spring in a pattern on one side of the seam line, and the second mesh elements may include triangle elements that share a vertex or edge with the spring in a pattern on the other side of the seam line. In one embodiment, a set of mesh elements located on both sides of the constraint element may be referred to as a 'fan'. For example, a plurality of first mesh elements may form a first fan arranged radially around a vertex on one side of the constraint element, and a plurality of second mesh elements may form a second fan arranged radially around a vertex on the other side of the constraint element. The electronic device can identify the first fan and the second fan for each restraint element and calculate a fracture index based on the stress values ​​of the mesh elements included in each fan.

[0114] The electronic device can acquire stress for each of a plurality of first mesh elements and a plurality of second mesh elements. For example, the electronic device can calculate stress for each mesh element based on the deformation state of the mesh elements during the simulation (e.g., at each time step). According to an embodiment, the electronic device can provide a stress map representing the stress distribution of a virtual fashion item, and the stress values ​​for each mesh element calculated for generating the stress map can be used to calculate a fracture index. Since the first mesh elements and second mesh elements identified for each constraint element are different, the stress values ​​required for calculating the fracture index of each constraint element may also be different. Accordingly, the electronic device can acquire stress values ​​corresponding to each of the first mesh elements and second mesh elements identified for each constraint element at each time step.

[0115] The electronic device can calculate a first stress contribution based on a plurality of first mesh elements and a second stress contribution based on a plurality of second mesh elements based on acquired stress values. The first stress contribution may refer to a value indicating the degree of stress causing a mesh area located on one side of a restraining element to be separated from a mesh area on the other side connected along the restraining element, and the second stress contribution may refer to a value indicating the degree of stress causing a mesh area located on the other side of a restraining element to be separated from a mesh area on the one side connected along the restraining element. For example, the electronic device can calculate the first stress contribution by accumulating stress components corresponding to the direction in which the mesh area on the one side is to be separated from the mesh area on the other side connected along the seam line, based on the stress values ​​for each of the first mesh elements and the geometric arrangement of the mesh elements. Similarly, the electronic device can calculate the second stress contribution by accumulating stress components corresponding to the direction in which the mesh area on the other side is to be separated from the mesh area on the one side connected along the seam line.

[0116] The electronic device can calculate a fracture index for a corresponding constraint element based on a first stress contribution and a second stress contribution. For example, the electronic device can calculate a fracture index indicating the degree to which mesh regions on both sides tend to separate from each other based on the corresponding constraint element, based on the first stress contribution and the second stress contribution. As an example, the electronic device can calculate the fracture index of the corresponding constraint element by accumulating (e.g., summation, cumulative sum, weighted sum) the first stress contribution and the second stress contribution.

[0117] According to one embodiment, a preprocessing step for simulation initialization may be required to apply the second method. The preprocessing step may include identifying mesh elements constituting the first and second fans for each constraint element, and identifying and storing geometric structural information of these mesh elements in advance. For example, the electronic device may iterate through the mesh elements included in the fan formed around the vertices on both sides of each constraint element, and identify and store connection relationship information regarding which constraint element and vertex each mesh element is adjacent to. Through this preprocessing, the electronic device can quickly reference the geometric information of the mesh elements constituting the fan at each time step of the simulation to calculate the fracture index, thereby improving computational efficiency.

[0118] The second method comprehensively considers the stress distribution around the restraining element and can reflect the physical state of the material. Accordingly, although the computational complexity of the second method may increase compared to the first method, it can implement a more continuous and natural ripping process by reflecting the stress state of the region surrounding the restraining element. A method for an electronic device according to one embodiment to calculate a fracture index using the second method will be explained in more detail with reference to FIG. 3, which will be described later.

[0119] According to an embodiment, the electronic device may determine a method for calculating a fracture index to be applied to a segment to be ripped based on the simulation environment, available computational resources, application requirements, or structural characteristics of the segment to be ripped. For example, the electronic device may determine to calculate a fracture index using a first method in cases corresponding to at least one of the following: when the restraining element is an offset spring, when a complete fan structure is not formed around the restraining element, or when the restraining element connects a frozen pattern with a non-frozen pattern. Through this, the electronic device can calculate a fracture index using the first method even in situations where it is difficult to properly define or reliably apply the second method, and accordingly, can provide a stable ripping simulation for various types of garment structures.

[0120] According to one embodiment, a rip target segment may include a rippable segment and a ripped segment. A rippable segment may refer to a segment where ripping is permitted, and a ripped segment may refer to a segment where mesh regions are separated as the constraint element has already been switched to an inactive state. As the simulation progresses, the ripped segment may gradually expand within the rippable segment, and the electronic device can track and manage changes in the state of such segments.

[0121] According to one embodiment, if the damage status and ripping status of each constraint element are stored within the constraint element itself, a problem may arise where such information is lost when the constraint element is deleted or regenerated. As previously described, constraint elements exist transiently during the simulation process and can be regenerated under various circumstances. For example, if the simulation is re-initialized, the resolution of the mesh is changed, or the user adjusts the particle distance of the pattern, the number and arrangement of constraint elements generated along the seam may change. Additionally, the configuration of constraint elements may change when the draping step is completed, some constraint elements are removed, and welding is performed. Similarly, if the user newly selects an already welded segment as a segment to be ripped, constraint elements need to be regenerated for that segment. In such situations, if state information is stored on a constraint element basis, the regenerated constraint element loses the previously accumulated damage status information, which may impede the continuity of the ripping simulation. Therefore, the electronic device needs to manage the state information of the constraint elements in the continuous space of the seam line rather than within the constraint elements.

[0122] For example, ripping-capable segments and ripping-completed segments can be defined as parametric positions on seams associated with the corresponding ripping target segments. 'Parametric positions' may refer to a coordinate system in which each seam is represented as a continuous interval from 0 to 1. For example, the starting point of each seam may correspond to parametric position 0, the end point of each seam may correspond to parametric position 1, and any intermediate position on the seam may be represented by a value between 0 and 1. Through this parametric representation, the electronic device can consistently identify specific positions on each seam regardless of the number or arrangement of constraint elements.

[0123] According to one embodiment, an electronic device may manage segments that are ripped and segments that have been ripped on a parametric domain (e.g., from 0 to 1) of a seam as one or more interval information. Each interval information may represent a continuous interval defined by a start point and an end point as a subset of the parametric domain. For example, a segment that has been ripped for a specific seam may include two interval informations defined by a start point and an end point, such as [(0, 0.3), (0.7, 1.0)], which may indicate that a subset from 0 to 0.3 and a subset from 0.7 to 1.0 of the parametric domain of the seam have been ripped.

[0124] According to one embodiment, a ripping-capable segment may correspond to a segment designated by the user as a ripping target (i.e., a ripping target segment). For example, a ripping-capable segment may correspond to a portion of a seam selected as a ripping target segment based on user input, and may represent an area along the seam where ripping may occur. In one embodiment, a ripping-capable segment may be fixed during the simulation and may remain a ripping-capable segment even after ripping is completed. This may be because, in order for a ripped-capable constraint to remain in an inactive state (e.g., a state where stiffness is zero), the constraint must still be identified as ripping-capable. For example, if the constraint is a spring, the electronic device may be configured to set the stiffness of the spring to zero only when the spring is identified as ripping-capable. In other words, the electronic device may be configured to switch the constraint to an inactive state only when the constraint is included in a ripping-capable segment. Accordingly, the ripping-capable spring may still be included in a ripping-capable segment even after being switched to an inactive state.

[0125] According to one embodiment, when a plurality of ripping target segments are set for a single seam, each ripping target segment may be defined as a subset distinct from one another on the parametric domain of the seam. For example, if a user sets a first ripping target segment and a second ripping target segment at different locations on a single seam, the first ripping target segment may be defined as a subset of parametric locations 0 to 0.4, and the second ripping target segment may be defined as a subset of parametric locations 0.6 to 1.0. In this case, the electronic device may independently manage segments capable of ripping and segments that have been ripped for each of the first ripping target segment and the second ripping target segment, and each ripping target segment may have different ripping attributes.

[0126] According to one embodiment, the electronic device can update the ripped segment based on the parametric position of a restraining element satisfying the ripping condition. As previously described, when the damaged state of a restraining element satisfies the ripping condition, the restraining element is switched to an inactive state, which may mean that ripping is completed at that location. The electronic device can update the ripped segment by identifying the position occupied by the restraining element switched to an inactive state on the parametric domain of the seam and adding that position to the ripped segment.

[0127] In one embodiment, the electronic device may determine a parametric position corresponding to a constraint element based on the positions of vertices connected on a seam line. For example, the electronic device may identify a parametric segment corresponding to a constraint element by referencing the parametric positions of vertices on a seam line connected by the constraint element. When a constraint element is switched to an inactive state, the electronic device may update a ripped segment by adding a parametric segment corresponding to the constraint element to the ripped segment.

[0128] According to one embodiment, the parametric position may not be changed by the creation or removal of constraint elements. For example, even if the number of constraint elements created along a seam increases or decreases, the parametric position value corresponding to a specific point on the seam may remain the same. Through this, the electronic device can consistently maintain ripping-related state information even when constraint elements are regenerated.

[0129] For example, when a constraint element is created, the electronic device may set the properties of that constraint element based on whether its parametric position is included in a ripping-capable segment. For instance, the electronic device may set constraint elements included in a ripping-capable segment to be ripping-capable, and initialize constraint elements included in a ripping-completed segment to an inactive state (e.g., stiffness 0 for a spring). This allows the state of the previously ripping-completed segment to be maintained even if the simulation is re-initialized or the constraint element is recreated.

[0130] For example, an electronic device may store the damage state as a damage value corresponding to a parametric position for one or more seams. Since the damage state is a value that changes gradually during the simulation, it can be expressed in the form of a piecewise function in the parametric domain. For example, for each segment to be ripped, the electronic device may represent the damage state as a set of points {(x, y)} where the parametric position of the seam associated with the segment is the x-coordinate and the damage value at that position is the y-coordinate. In this case, each point included in the set of points may represent the accumulated degree of damage at a specific parametric position of the seam.

[0131] According to one embodiment, the electronic device can obtain a damage value for any parametric location by interpolating damage values ​​corresponding to different parametric locations. Through this, the electronic device can consistently represent the damage state accumulated along the seam line even if the number of constraint elements changes or their arrangement changes due to resampling or remeshing. For example, if the number of constraint elements increases as the mesh resolution increases, the electronic device can assign a damage state to the newly created constraint elements by interpolating the previously stored damage values, thereby ensuring the continuity of the ripping simulation. The electronic device can obtain a damage value for any parametric location using interpolation techniques such as linear interpolation, spline interpolation, polynomial interpolation, and nearest-to-nearness interpolation, but is not limited thereto.

[0132] According to one embodiment, an electronic device can generate an animation in which at least a portion of a virtual fashion item is ripped based on simulation results for one or more time points. The ripping animation may refer to an animation that visually represents the progression of damage in the ripped target segment, the deactivation of restraint elements, and changes in the separation state of the mesh area over time.

[0133] In one embodiment, the animation may be generated based on key frames. A 'key frame' may refer to a frame in which at least one attribute of a virtual fashion item is specified. The attribute value specified in the key frame may be referred to as a 'key' or 'key value'. According to one embodiment, an electronic device may set two or more points in time as key frames in which the value of a parameter included in the ripping attribute of a ripping target segment is specified. For example, the electronic device may set at least one of whether ripping is enabled, a breakage threshold, or a ripping speed as a key.

[0134] According to one embodiment, an electronic device can generate intermediate frames among a plurality of key frames arranged in chronological order. For each segment between two adjacent key frames, the electronic device can obtain a parameter value corresponding to an intermediate frame by interpolating the key values ​​of the two key frames based on a weight corresponding to the relative time position in that segment. For example, the parameter value of the frame corresponding to the temporal midpoint between the two key frames can be determined as the midpoint of the parameter values ​​set in the two key frames.

[0135] According to one embodiment, the electronic device can perform a simulation based on a corresponding parameter value in each frame. For example, the electronic device can set the ripping properties of the corresponding ripping target segment based on a parameter value corresponding to a key frame or an interpolated parameter value corresponding to an intermediate frame, and perform a simulation according to the set ripping properties. Since the ripping behavior may vary depending on the parameter value applied in each frame, the electronic device can generate an animation in which ripping proceeds continuously and naturally over time.

[0136] According to one embodiment, the electronic device can implement a ripping animation that progresses gradually over time by determining the rate of damage accumulation of a restraining element included in a ripping target segment based on a ripping rate parameter. Specifically, the electronic device can perform a simulation in which the degree of damage (or state of damage) for the restraining element monotonically increases from 0 to 1 when the physical force (e.g., stress or strain) applied to the restraining element is greater than or equal to a threshold value set by a yield strength parameter. In this case, the rate at which the degree of damage increases may be proportional to the ripping rate parameter set by the user. For example, if the ripping rate parameter is set to 0.1, the electronic device can control the ripping target segment to reach complete ripping (i.e., degree of damage = 1) after 10 seconds by determining that the restraining element accumulates 0.1 damage per second, provided that the ripping condition (i.e., exceeding the yield strength) persists. Furthermore, the electronic device can generate an animation effect in which the ripping target segment is gradually torn at a speed set by the user by deactivating the constraint by setting the constraint attribute (e.g., stiffness) of the corresponding constraint element to 0 when the degree of damage reaches a maximum.

[0137] According to one embodiment, the electronic device can provide an animation in which ripping is controlled over time by sequentially rendering simulation results in chronological order and outputting them in frame units. For example, a user can control ripping to start at a desired time by setting the ripping activation status to an inactive state until a specific point in time and switching it to an active state from that specific point in time.

[0138] FIG. 2 is a diagram illustrating a parametric location-based ripping target segment management method according to one embodiment.

[0139] Referring to FIG. 2, a ripping target segment (200) with a ripping attribute set is schematically illustrated. According to one embodiment, an electronic device can identify one or more segments with a ripping attribute set corresponding to at least a portion of one or more seams included in a virtual fashion item. The electronic device can generate one or more constraint elements connecting mesh elements associated with the identified one or more segments. The method by which the electronic device identifies the ripping target segment and generates constraint elements may correspond to the method described in steps (110) and (120) of FIG. 1.

[0140] According to one embodiment, a virtual fashion item may include one or more patterns, and an electronic device may generate a restraining element that connects corresponding vertices of different patterns along a seam. Referring to FIG. 2, a one-sided pattern of a seam including a plurality of vertices from vertex (201) to vertex (207) and a other-sided pattern of a seam including a plurality of vertices from vertex (205) to vertex (209) are illustrated. The electronic device may generate one or more restraining elements that connect corresponding segments of patterns based on the seam. The restraining element is an element that connects corresponding vertices of patterns in a seam relationship and may include, for example, a spring. In the example illustrated in FIG. 2, the restraining element (203) connects a vertex (201) of one-sided pattern and a corresponding vertex (205) of the other-sided pattern.

[0141] The ripping target segment (200) may include a ripping-capable segment and a ripping-completed segment. A ripping-capable segment may refer to a segment that is allowed to be ripped, and a ripping-completed segment may refer to a segment in which the mesh regions are separated as the constraint element has already been switched to an inactive state. FIG. 2 illustrates an example in which a ripping-completed segment is defined as a parametric position relative to a seam.

[0142] Referring to FIG. 2, a parametric domain (210) of a seam is illustrated. A parametric position may refer to a coordinate system in which each seam is represented as a continuous interval from 0 to 1. In the parametric domain (210), the starting point (211) of the seam may correspond to parametric position 0, and the ending point (213) of the seam may correspond to parametric position 1. Any intermediate position on the seam may be represented by a value between 0 and 1. Through this parametric representation, the electronic device can consistently identify a specific position on each seam regardless of the number or arrangement of constraint elements.

[0143] According to one embodiment, the electronic device may manage segments that can be ripped and / or segments that have been ripped on the parametric domain (210) of the seam as one or more interval information. Each interval information (220, 230) may represent a continuous interval defined by a start point and an end point as a subset of the parametric domain (210).

[0144] In the example illustrated in FIG. 2, a first segment information (220) defined by a starting point (221) and an ending point (223) is shown. For example, if the starting point (221) corresponds to a parametric position 0 and the ending point (223) corresponds to a parametric position 0.44, the first segment information (220) can be defined as [(0, 0.44)].

[0145] In the example illustrated in FIG. 2, second segment information (230) defined by a starting point (231) and an ending point (233) is illustrated. For example, if the starting point (231) corresponds to a parametric position 0.69 and the ending point (233) corresponds to a parametric position 1, the second segment information (230) can be defined as [(0.69, 1)].

[0146] In the example illustrated in FIG. 2, the ripped segment may include first segment information (220) and second segment information (230). For example, the ripped segment may correspond to [(0, 0.44), (0.69, 1)]. This may indicate that ripping has been completed in a subset from 0 to 0.44 and a subset from 0.69 to 1 of the parametric domain (210) of the corresponding seam.

[0147] According to one embodiment, the electronic device can update the ripped segment based on the parametric position of a restraining element satisfying the ripping condition. When the damaged state of the restraining element satisfies the ripping condition and the restraining element is switched to an inactive state, the electronic device can update the segment information by identifying the position occupied by the restraining element switched to an inactive state on the parametric domain of the seam and adding the position to the ripped segment. In one embodiment, the ripped segment may be fixed during the simulation and may maintain an initial setting state without being updated upon the inactivation of the restraining element.

[0148] According to one embodiment, the parametric position may not be changed by the creation or removal of constraint elements. For example, even if the number of constraint elements created along a seam increases or decreases, the parametric position value corresponding to a specific point on the seam may remain the same. Through this, the electronic device can consistently maintain ripping-related state information even when constraint elements are regenerated. For example, even if the mesh resolution changes or the placement of constraint elements changes during the draping phase, the electronic device can consistently manage ripping-completed segment information based on the parametric position.

[0149] FIG. 3 is a diagram illustrating a method for calculating a fracture index using a stress-based second method according to one embodiment.

[0150] Referring to FIG. 3, an example of calculating a fracture index for a specific restraining element (311) is illustrated. The second method may mean a method of calculating a fracture index based on the stress distribution around each restraining element.

[0151] According to one embodiment, the second method may refer to a method for evaluating the degree to which mesh elements tend to separate along a specific boundary surface based on stress distribution. Generally, in such a method, an optimization process may be required to set a virtual splitting plane centered on a vertex, calculate the separation stress for splitting planes in multiple directions, and select the maximum value among them. If the segment to be ripped is defined along a seam line, the seam line itself may correspond to a potential separation boundary surface (i.e., a splitting plane). Accordingly, the electronic device can calculate a fracture index by evaluating the stress of mesh elements on both sides relative to the seam line without an optimization process of searching for the direction of the splitting plane.

[0152] For example, for each restraining element to which the second method is applied, the electronic device can calculate a fracture index based on the stresses of mesh elements located on both sides relative to a seam containing the corresponding restraining element. In the example illustrated in FIG. 3, along the seam (310), the restraining element (311) connects a vertex (321) on one side and a vertex (331) on the other side.

[0153] The electronic device can identify a plurality of first mesh elements and a plurality of second mesh elements located on both sides of a restraining element (311) based on a seam (310) containing a corresponding restraining element (311). The plurality of first mesh elements may refer to mesh elements constituting a mesh area located on one side based on the restraining element (311), and the plurality of second mesh elements may refer to mesh elements constituting a mesh area located on the other side based on the restraining element (311).

[0154] In the example illustrated in FIG. 3, the first fan (320) represents a set of mesh elements located on one side of the constraint element (311). The first fan (320) may include a plurality of mesh elements arranged radially around a vertex (321). Specifically, the first fan (320) may include vertices (323, 325, 327, 329) that share a vertex or edge with the vertex (321). The edges connecting these vertices (323, 325, 327, 329) and the vertex (321), and the triangle elements enclosed by these edges may constitute the first fan (320).

[0155] Likewise, the second fan (330) represents a set of mesh elements located on the other side of the constraint element (311). The second fan (330) may include a plurality of mesh elements arranged radially around a vertex (331). Specifically, the second fan (330) may include vertices (333, 335, 337, 339) that share a vertex or edge with the vertex (331). The edges connecting these vertices (333, 335, 337, 339) and the vertex (331), and the triangle elements surrounded by these edges may constitute the second fan (330).

[0156] According to one embodiment, the electronic device can obtain stress for each of a plurality of first mesh elements and a plurality of second mesh elements. For example, the electronic device can calculate stress for each mesh element based on the deformation state of the mesh elements during the simulation (e.g., at each time step).

[0157] The electronic device can calculate a first stress contribution based on a plurality of first mesh elements and a second stress contribution based on a plurality of second mesh elements based on the acquired stress values. The first stress contribution may represent a value indicating the degree of stress causing a mesh area located on one side of the restraining element (311) to be separated from a mesh area on the other side connected along the restraining element. The second stress contribution may represent a value indicating the degree of stress causing a mesh area located on the other side of the restraining element (311) to be separated from a mesh area on the one side connected along the restraining element.

[0158] In FIG. 3, the stress direction of each mesh element is indicated by an arrow. According to one embodiment, the electronic device can analyze the stress for each mesh element included in the first fan (320) to extract stress components in the direction of separation from the other mesh area along the seam line (310). For example, the electronic device can decompose the stress tensor of each mesh element to identify stress components in the direction perpendicular to the seam line (310) or in the direction away from the seam line (310). The electronic device can calculate a first stress contribution by accumulating these stress components (e.g., summation, cumulative sum, weighted sum).

[0159] Likewise, the electronic device can calculate a second stress contribution by analyzing the stress for each of the mesh elements included in the second fan (330), extracting stress components in the direction of separation from one side mesh area along the seam line (310), and accumulating them.

[0160] According to one embodiment, the process of extracting stress components can be performed by considering the normal vector of each mesh element and the direction vector of the seam line (310). For example, the electronic device can calculate a traction force in a direction perpendicular to the seam line (310) by multiplying the stress tensor of each mesh element by the normal direction of the seam line (310). The 'traction force' may represent the magnitude and direction of the force causing the mesh element to separate at the seam line (310). The electronic device may select and accumulate only the component corresponding to the separation direction (i.e., the direction away from the seam line) among the traction forces calculated for each mesh element.

[0161] According to one embodiment, the area or size of each mesh element may be considered as a weight during the process of accumulating stress components. For example, an electronic device may calculate a weighted stress contribution by multiplying the stress component of each mesh element by the area of ​​the corresponding mesh element, and calculate a first stress contribution and a second stress contribution by accumulating these. Through this, the stress of a mesh element with a larger size can be made to have a greater influence on the fracture indicator.

[0162] The electronic device can calculate a fracture index for the corresponding restraint element (311) based on the first stress contribution and the second stress contribution. For example, the electronic device can calculate the fracture index of the corresponding restraint element by accumulating (e.g., summation, cumulative sum, weighted sum) the first stress contribution and the second stress contribution.

[0163] FIGS. 4a and 4b are drawings for explaining a method of calculating a breakage index when a virtual fashion item according to one embodiment includes a spring cycle.

[0164] Referring to FIG. 4a, a diagram illustrating the connection structure of constraint elements created along multiple seams is shown. Each circle represents a vertex, and the line segments connecting the vertices represent edges. In the example illustrated in FIG. 4a, the constraint elements (e.g., seam springs) created along the seams (401 to 406) are indicated by thick solid lines, while the other edges (e.g., springs forming the edges inside the mesh) are indicated by light solid lines. FIG. 4a illustrates an example where constraint elements connecting centrally located vertices form a spring cycle. A 'spring cycle' may refer to a structure in which constraint elements (e.g., springs) created along seams are connected in a closed-loop form. For example, a spring cycle may be included when three or more patterns are cyclically connected by seams, so that the constraint elements form a closed loop.

[0165] According to one embodiment, the electronic device can identify one or more spring cycles based on the connection relationships between a plurality of constraint elements (e.g., edges indicated by thick solid lines) created along the seam lines (401 to 406). A spring cycle can be defined as a case where a plurality of constraint elements are connected in the form of a closed curve, forming a loop structure where the starting vertex and the ending vertex are the same. For example, the electronic device can analyze the connection relationships of the constraint elements to identify a set of constraint elements forming a closed path as a spring cycle.

[0166] According to one embodiment, an electronic device can generate an undirected graph based on constraint elements included in a seam and use the graph to search for spring cycles. For example, the electronic device can identify one or more independent spring cycles included in the seam structure by calculating a Minimal Cycle Basis (MCB). A Minimal Cycle Basis refers to a minimum set of independent cycles capable of generating cycles present in the graph, and the electronic device can use this set of cycles to isolate and process individual spring cycles.

[0167] According to one embodiment, when a spring cycle exists, the distinction between the two mesh regions for applying the stress-based second method may not be clear. When a spring cycle exists, the two mesh regions based on a single constraint element may be reconnected through different paths, so the two regions may not be separated into independent regions. In such cases, the electronic device can clearly define the two mesh regions for each constraint element by cutting the spring cycle and converting the closed-curve cycle into an open path.

[0168] Referring to Fig. 4b, a diagram of a cut spring cycle is shown.

[0169] According to one embodiment, when a spring cycle is identified, the electronic device may determine the cutting plane at the spring cycle level rather than at the individual constraint element level. This may be because if only some of the constraint elements constituting the cycle are selectively deactivated, the mesh may remain constrained by adjacent constraint elements, resulting in no actual separation or non-physical behavior. The cutting plane may refer to a set of one or more constraint elements that must be deactivated to separate the spring cycle and form different mesh regions.

[0170] According to one embodiment, the electronic device may determine a cutting plane by selecting a plurality of restraining elements to separate a spring cycle. Referring to FIG. 4b, an example is illustrated in which a cutting plane is determined by considering combinations of restraining elements included in a spring cycle. In the example illustrated in FIG. 4b, for a spring cycle (410) formed by restraining elements (411 to 416), the electronic device may determine a cutting plane (420) by selecting restraining element (412) and restraining element (414). The two restraining elements selected as the cutting plane (420) may be deactivated so that the spring cycle can be converted into an open path.

[0171] According to one embodiment, the electronic device may calculate a fracture index for each of the restraining elements (411 to 416) constituting the spring cycle (410) and determine a cutting surface (420) based on the calculated fracture indices. Specifically, the electronic device may evaluate the fracture probability for a plurality of candidate restraining element combinations and select a combination with a relatively high fracture probability (e.g., restraining element (412) and restraining element (414)) as the cutting surface (420). At this time, the evaluation for each candidate combination may be performed by calculating a fracture index for the remaining restraining elements while assuming that the selected restraining elements are deactivated.

[0172] According to one embodiment, when determining a cutting plane, the electronic device may consider that selected constraint elements are positioned sufficiently spaced apart from each other on a spring cycle. For example, by selecting constraint elements that are spaced apart from each other based on a path length defined along the cycle, the electronic device may mitigate excessive imbalance in the sizes of mesh regions separated by the cutting plane.

[0173] According to one embodiment, the electronic device may additionally consider the damage state of each constraint element when determining the cutting plane. For example, constraint elements with a relatively high damage state may be given priority consideration to be included in the cutting plane, thereby inducing ripping to occur at locations where damage has already progressed.

[0174] According to one embodiment, the electronic device can calculate a fracture index by applying a second method to the remaining restraint elements (411, 413, 415, 416) after deactivating the restraint elements (412 and 414) selected as the cutting plane (420). At this time, the fan structure can be identified for the regions separated by the cutting plane (420), and the stress contribution can be calculated based on the stress of the mesh elements included in each fan.

[0175] For example, the electronic device may identify a first fan and a second fan located on both sides of each restraining element in a manner similar to the second method described in FIG. 3 for each of the remaining restraining elements (411, 413, 415, 416). The electronic device may obtain stress values ​​of mesh elements included in each fan and calculate a first stress contribution and a second stress contribution by accumulating stress components in the direction of separation from the seam. Then, the electronic device may calculate a fracture index for the corresponding restraining element based on the calculated first stress contribution and second stress contribution.

[0176] According to one embodiment, spring cycle identification and the selection of cutting surfaces may be performed during the simulation initialization phase or the preprocessing phase. For example, an electronic device may identify spring cycles by analyzing the seam structure of a virtual fashion item and predetermine and store one or more cutting surface candidates for each spring cycle. During the simulation, the electronic device may calculate a fracture index for each constraint element by referring to the stored cutting surface information. Through this, the electronic device can perform the calculation of the fracture index while alleviating the computational burden of repeatedly searching for spring cycles at every time step.

[0177] FIG. 5 is a drawing showing a user interface for setting a ripping target segment through a three-dimensional model according to one embodiment.

[0178] Referring to FIG. 5, a user interface (500) for setting a ripping target segment is illustrated. A three-dimensional model (510) of a virtual fashion item is displayed in the user interface (500). The electronic device can receive a selection input for a segment corresponding to at least a portion of one or more seams included in the virtual fashion item through the three-dimensional model.

[0179] According to one embodiment, the selection input may include an input specifying a first position and a second position on a seam included in a virtual fashion item. The electronic device may set a segment between the first position and the second position as a ripping target segment according to the selection input. In the example illustrated in FIG. 5, the user may specify a first position (511) and a second position (513) on a seam, and a segment (515) between the first position (511) and the second position (513) may be selected as a ripping target segment. The selected segment (515) may be displayed, for example, in a color different from the seam so that the user can visually identify it.

[0180] According to one embodiment, a user may select an interface element (501) to set a segment to be ripped. The interface element (501) is a button that activates the Seamline Rip function, and when the user clicks this button, the system may switch to a mode in which a segment to be ripped can be specified on the seamline. With the interface element (501) activated, the user may specify a first position (511) and a second position (513) by clicking any location on the seamline on the three-dimensional model (510). For example, the user may sequentially select two points (511, 513) on the seamline via a mouse click, touch input, or touch pen input. The electronic device may identify a seamline segment (515) between the two selected points (511, 513) as a segment to be ripped and visually highlight and display the segment (515).

[0181] According to one embodiment, the electronic device may provide a function for setting ripping attributes for a set ripping target segment. For example, the electronic device may provide a user interface (520) for setting ripping attributes for a ripping target segment.

[0182] According to one embodiment, the user interface (520) may include an interface element (521) that can input information about a ripping target segment. For example, the user can set a name to identify the ripping target segment through the interface element (521).

[0183] According to one embodiment, the user interface (520) may include an interface element (523) for setting ripping attributes for a ripping target segment. The ripping attributes may include at least one of whether ripping is enabled, a yield strength, a rip speed, or a method for calculating a rip indicator (not shown). In the example illustrated in FIG. 5, whether ripping is enabled can be controlled by a toggle button, and the yield strength and rip speed can be adjusted in the form of sliders.

[0184] According to one embodiment, the user can adjust the value of each parameter through the interface element (523). For example, the user can click a toggle button to switch whether ripping is enabled or disabled. For example, the user can adjust the fracture threshold or ripping speed by dragging a slider or by directly entering a value in a numeric input field. The electronic device stores the values ​​set by the user as ripping attributes for the corresponding ripping target segment and can refer to them when performing a simulation.

[0185] According to one embodiment, the electronic device may provide an interface element for selecting a fracture index calculation method. For example, the electronic device may allow selection of either a strain-based first method or a stress-based second method via a drop-down menu or a radio button. Depending on the method selected by the user, the electronic device may calculate the fracture index for the corresponding ripping target segment in different ways.

[0186] According to one embodiment, the electronic device can automatically set the remaining parameters to default values ​​when the user sets only some parameters of the ripping attributes. The default values ​​may be predefined by the system or determined based on the physical properties of the material constituting the segment. This allows the user to quickly set the segment to be ripped without having to set all parameters individually.

[0187] FIG. 6 is a drawing showing a user interface for setting a ripping target segment through a two-dimensional pattern according to one embodiment.

[0188] Referring to FIG. 6, a user interface (600) for setting a ripping target segment is illustrated. The user interface (600) displays one or more two-dimensional patterns corresponding to a virtual fashion item. The electronic device can receive a selection input for a segment corresponding to at least a portion of one or more seams included in the virtual fashion item through the two-dimensional patterns.

[0189] According to one embodiment, the selection input may include an input specifying a first position and a second position included in a seam on a two-dimensional pattern. The electronic device may set a segment between the first position and the second position as a ripping target segment according to the selection input. In the example illustrated in FIG. 6, the user may specify a first position (611) and a second position (613) on a seam marked on the pattern (610), and a segment (615) between the first position (611) and the second position (613) may be selected as a ripping target segment. The selected segment (615) may be displayed, for example, in a color different from the seam so that the user can visually identify it.

[0190] Although not illustrated, the user may select an interface element to set the segment to be ripped. The interface element is a button that activates the Seamline Rip function, and when the user clicks this button, the system may switch to a mode in which the segment to be ripped on the seamline can be specified. The interface element for setting the segment to be ripped may correspond to the interface element (501) described in FIG. 5. With the interface element activated, the user may specify a first position (611) and a second position (613) by clicking any location on the seamline on the two-dimensional pattern (610). For example, the user may sequentially select two points on the seamline via a mouse click, touch input, or touch pen input. The electronic device may identify the seamline segment between the two selected points as the segment to be ripped and visually highlight the segment (615).

[0191] Although not illustrated, the electronic device may provide a user interface for setting ripping attributes for a ripping target segment set through a two-dimensional pattern. The user interface for setting ripping attributes may correspond to the user interface (520) described in FIG. 5. The user may set at least one of whether ripping is enabled, a fracture threshold, a ripping speed, or a fracture index calculation method, and the electronic device may store the values ​​set by the user as ripping attributes for the corresponding ripping target segment and refer to them when performing a simulation.

[0192] FIG. 7 is a drawing showing a user interface for setting a ripping target segment through at least one of a three-dimensional model or a two-dimensional pattern according to one embodiment.

[0193] Referring to FIG. 7, a user interface (700) is shown displaying a three-dimensional model (710) of a virtual fashion item and one or more two-dimensional patterns (720, 730) corresponding to the virtual fashion item. The electronic device can select a segment to be ripped through either the three-dimensional model or the two-dimensional pattern, and reflect the selected segment in a different representation method.

[0194] According to one embodiment, the electronic device can identify a segment to be ripped based on a selection input through a three-dimensional model (710) and reflect the identified segment on a two-dimensional pattern. In the example illustrated in FIG. 7, the user can specify a first position (711) and a second position (713) of a seam line on the three-dimensional model (710), and a segment (715) between the first position (711) and the second position (713) can be selected as a segment to be ripped. The electronic device can reflect a segment (725, 735) corresponding to the segment (715) selected through the three-dimensional model (710) on a two-dimensional pattern (720, 730). For example, the electronic device can identify which patterns the seam line segment selected in the three-dimensional model (710) is formed by, and visually display the corresponding segment (725, 735) of the corresponding patterns (720, 730). The displayed segments (725, 735) may be displayed in a different color than the seam, for example.

[0195] According to one embodiment, the electronic device can identify a corresponding segment of another pattern in a sewing relationship based on a selection input through a two-dimensional pattern. In the example illustrated in FIG. 7, the user can specify a first position (721) and a second position (723) of a sewing line on a first pattern (720), and a segment (725) between the first position (721) and the second position (723) can be selected as a segment to be ripped. The electronic device can identify a corresponding segment (735) of a second pattern (730) in a sewing relationship with the selected segment (725). The corresponding segment (735) may correspond to a segment between a first position (731) corresponding to the first position (721) and a second position (733) corresponding to the second position (723). For example, the electronic device may display the identified segment (735) on the second pattern (730) in the same color so that the user can simultaneously check the segments of both patterns that are in a sewing relationship.

[0196] According to one embodiment, the electronic device can identify a segment to be ripped based on a selection input through a two-dimensional pattern and reflect the identified segment on a three-dimensional model. For example, when a user selects a segment (725) on a two-dimensional pattern (720), the electronic device can identify and visually display a segment on a three-dimensional model (710) corresponding to that segment. Through this, the user can immediately see how the segment selected in the two-dimensional pattern is represented in the three-dimensional model.

[0197] According to one embodiment, the electronic device can synchronize the selection between a three-dimensional model and a two-dimensional pattern so that when a user sets a segment to be ripped through one representation method, it is reflected in another representation method as well.

[0198] FIG. 8 is a diagram illustrating the process of snapping to vertices when setting a ripping target segment according to one embodiment.

[0199] Referring to FIG. 8, a user interface (800) is shown displaying a three-dimensional model (810) of a virtual fashion item. The three-dimensional model (810) is represented as a mesh structure, and multiple vertices and edges are shown.

[0200] According to one embodiment, a user can specify vertices on a sewing line as a first position and a second position. In one embodiment, the first position and the second position may be limited to correspond only to vertices, and intermediate edge regions between vertices may be excluded from selection.

[0201] According to an embodiment, the user may select any position on the seam line. In this case, the electronic device may adjust the first position and the second position specified by the user to one of the vertices already generated along the seam line.

[0202] According to one embodiment, the electronic device can adjust a first position and a second position to vertices on a seam line through snapping. Snapping may refer to a technique of adjusting a position selected and entered by a user to the vertex closest to that position. In the example illustrated in FIG. 8, when a user clicks any position on a seam line through a three-dimensional model (810), the electronic device can determine the vertex (811) closest to the clicked position as the first position. Similarly, when a user specifies a second position, the electronic device can determine the vertex (813) closest to that position as the second position. The electronic device can set the segment (815) between the first position (811) and the second position (813) as the segment to be ripped.

[0203] According to one embodiment, the electronic device can set a segment to be ripped without changing the topology of the mesh through snapping. This may be so that the electronic device creates constraint elements based on vertices corresponding to a first position and a second position. As previously described, since constraints correspond to the connection relationships between mesh elements included in a specific segment, the electronic device can set constraint elements for the segment between the vertices by adjusting the first position and the second position as vertices. The electronic device can set the vertex closest to a user-specified position as the boundary of the segment to be ripped while maintaining the existing mesh structure, thereby allowing the segment to be ripped without a complex mesh reconstruction process such as remeshing.

[0204] According to one embodiment, snapping can be applied in the same way when setting the ripping target segment through a 2D pattern as well as a 3D model. Since the 2D pattern is also represented as a mesh structure, the electronic device can set the ripping target segment by snapping a user-specified location on the 2D pattern to the nearest vertex.

[0205] FIG. 9 is a flowchart illustrating a virtual fashion item simulation method according to one embodiment.

[0206] The virtual fashion item simulation method described in FIG. 9 can be performed by an electronic device (or one or more processors included in the electronic device). The specific hardware structure of the electronic device is described in detail below.

[0207] Referring to FIG. 9, an electronic device (e.g., the electronic device (1000) of FIG. 10) that performs a virtual fashion item simulation according to one embodiment is shown to set a portion of the seam line of the virtual fashion item as a ripping target segment and simulate it through steps (910) to (920). The electronic device that performs the virtual fashion item simulation method described in FIG. 9 may be the same electronic device as the electronic device that performs the virtual fashion item simulation method described in FIG. 1, or it may be a different electronic device including one or more processors.

[0208] The operations of steps (910) to (920) included in the virtual fashion item simulation method described in FIG. 9 may be performed sequentially, but are not necessarily performed sequentially. For example, the order of steps (910) to (920) may be changed, and at least two of the operations of steps (910) to (920) may be performed in parallel.

[0209] In step (910), the electronic device can obtain user input selecting a portion of the seam connecting the first pattern and the second pattern included in the virtual fashion item as the ripping target segment.

[0210] The 'ripping target segment' may correspond to 'one or more segments with ripping attributes set' or 'ripping target segment' described in FIG. 1. As described in FIG. 1, a 'segment' is a continuous subset representing part or all of a specific line (e.g., a seam line), and may mean a line segment or a set of line segments that define an area where separation may occur on the surface of a virtual fashion item. For example, the ripping target segment may have a start point and an end point and may include continuous or discrete locations (e.g., vertices) between them.

[0211] A ripping target segment may refer to a part of a seam where a ripping attribute is set and separation may occur due to the weakening or release of the constraint during the simulation process. In one embodiment, a ripping target segment may refer to an area where a ripping attribute is set and which may be torn by an external force during the simulation.

[0212] The segment to be ripped may be the entire seam or a part of the seam. For example, the segment to be ripped may correspond to the entire seam, a part of the seam, or at least a part of each of multiple seams. The seam in FIG. 9 may correspond to the seam described in FIG. 1. For example, a seam may refer to a line defined to connect two or more patterns included in a virtual fashion item to each other, or to connect another element to a single pattern. As an example, a seam may include not only a line connecting to another pattern from the outer edge of the pattern, but also a line formed inside the pattern to attach pockets, decorative details, etc.

[0213] According to one embodiment, the electronic device can identify a segment to be ripped based on user input. The electronic device can set ripping attributes for the identified segment to be ripped. 'Ripping attributes' may refer to parameters that define conditions for weakening or releasing a constraint on a specific segment and characteristics of the separation process accordingly, and may include at least one of parameters indicating whether ripping is enabled, a fracture threshold, a ripping speed, or a method for calculating a fracture index.

[0214] According to one embodiment, the electronic device may display at least one of a three-dimensional model of a virtual fashion item or one or more two-dimensional patterns corresponding to the virtual fashion item. The electronic device may receive user input selecting a portion of a seam as a ripping target segment through at least one of the displayed three-dimensional model or one or more two-dimensional patterns.

[0215] According to one embodiment, an electronic device may display a three-dimensional model of a virtual fashion item. The three-dimensional model may include, for example, at least one of a model created by placing or transforming two-dimensional patterns in a three-dimensional space, a model created through sewing simulation of two-dimensional patterns, or a model created through wearing simulation of an avatar. A user may select a portion of a seam line on the displayed three-dimensional model as a segment to be ripped.

[0216] According to one embodiment, an electronic device may display one or more two-dimensional patterns corresponding to a virtual fashion item. The two-dimensional pattern may mean each pattern constituting the virtual fashion item displayed in a flat state. A user may select a portion of a seam line on the displayed two-dimensional pattern as a segment to be ripped.

[0217] According to one embodiment, when a ripping target segment is selected through either a three-dimensional model or one or more two-dimensional patterns, the electronic device may enable a segment corresponding to the selected ripping target segment to be visually displayed on the three-dimensional model and one or more two-dimensional patterns associated with the ripping target segment. For example, when a ripping target segment is selected through a two-dimensional pattern, the electronic device may reflect a segment corresponding to the selected ripping target segment on the three-dimensional model and another two-dimensional pattern associated with the ripping target segment. Similarly, when a ripping target segment is selected through a three-dimensional model, the electronic device may reflect a segment corresponding to the selected ripping target segment on an associated two-dimensional pattern. Through this, even if a user sets a ripping target segment through either a two-dimensional pattern or a three-dimensional model, the same segment may be displayed as selected in the other.

[0218] According to one embodiment, user input may include an input for selecting a first vertex and a second vertex on a seam connecting a first pattern and a second pattern. The electronic device may determine the seam segment between the first vertex and the second vertex as the segment to be ripped based on the user input. For example, the user may select the entire seam by clicking the start and end points of the seam, or select only a portion of the seam by clicking two midpoints of the seam. In one embodiment, the user may select two points on the seam through touch input using a finger, touch pen input, or mouse click, but is not necessarily limited thereto.

[0219] According to one embodiment, sections that are not vertices on the seam line may be excluded from the selection target of user input. For example, when a user moves a cursor on the seam line, the electronic device may provide visual effects (e.g., highlight, snap display) only at vertex locations. For example, when a user clicks a first vertex, that vertex is selected, and while moving the cursor thereafter, the line segment from the first vertex to the current cursor position may be displayed in a color different from the seam line. When a user clicks a second vertex, that vertex is selected, and the segment between the first vertex and the second vertex may be determined as the segment to be ripped. In one embodiment, the electronic device may restrict the user to select only vertices on the seam line, thereby excluding sections that are not vertices on the seam line from the selection target of user input.

[0220] According to one embodiment, when a user selects an arbitrary location on a seam line, the electronic device may determine a first vertex and a second vertex as the vertices on the seam line closest to the location specified by user input. The electronic device may make the first vertex and the second vertex correspond to vertices on the seam line through snapping. Snapping may refer to a technique of adjusting the selected input location to the vertex closest to that location. For example, the electronic device may determine the first vertex and the second vertex as the vertices closest to the selected input location among the vertices existing on the seam line. When a user clicks an arbitrary location on the seam line, the electronic device may identify the vertex on the seam line closest to the clicked location and determine that vertex as the first vertex or the second vertex.

[0221] According to one embodiment, the electronic device may display the ripping target segment and the sewing segment with distinct visual attributes based on user input. The 'sewing segment' may refer to the remaining portion of the sewing line that is not selected as the ripping target segment. The electronic device may enable the user to visually distinguish between the two segments by displaying the ripping target segment and the sewing segment with different colors, thicknesses, patterns, transparency, etc. For example, the electronic device may display the ripping target segment in red and the sewing segment in blue.

[0222] In step (920), the electronic device can set constraints on a plurality of mesh elements associated with the ripping target segment, thereby simulating a constrained state for each of the first pattern and the second pattern along a portion of the sewing line.

[0223] 'Constraint' can refer to a constraint that defines the connection relationships between mesh elements of a virtual fashion item. For example, an electronic device can generate a spring that connects corresponding vertices of patterns in a sewing relationship. The spring may correspond to a constraint that induces a first pattern and a second pattern to be adjacent to each other along a sewing line.

[0224] The 'constrained state' may refer to a state in which parts of the first pattern and the second pattern, respectively, are constrained to each other but are not merged, allowing them to be separated during the simulation. In the constrained state, the first pattern and the second pattern are maintained adjacent to each other by a constraint (e.g., a spring), but since they are not welded and maintain independent vertices, they can be separated if the constraint is weakened or released. For example, in a segment targeted for ripping in a constrained state, the first pattern and the second pattern can be separated from each other if the constraint is deactivated by an external force during the simulation.

[0225] According to one embodiment, the electronic device may set constraints on a plurality of mesh elements associated with a ripping target segment, which may include setting springs connecting corresponding vertices of a first pattern and a second pattern along a portion of a seam line. For example, the electronic device may set one or more springs connecting corresponding vertices of a first pattern and a second pattern along a ripping target segment. The electronic device may use one or more springs to simulate that a portion of each of the first pattern and the second pattern remains adjacent to each other.

[0226] According to one embodiment, an electronic device can perform a simulation of a virtual fashion item. As described in FIG. 1, the simulation may include a series of draping phases. A draping phase may refer to a step for aligning patterns constituting the virtual fashion item into a stable wearing state in an avatar or three-dimensional space. A draping phase may be included in the initial phase of the simulation. For example, the electronic device may perform a draping phase for a predetermined frame interval after the simulation begins.

[0227] According to one embodiment, in the draping step, the electronic device can adjust specific physical parameters so that the virtual fashion item is aligned quickly and stably. For example, the electronic device can set the air damping to a relatively high level to suppress excessive movement of the virtual fashion item and improve the convergence speed.

[0228] According to one embodiment, in the draping step, the electronic device may establish a constraint connecting corresponding segments of patterns based on one or more sewing lines. For example, in the draping step, the electronic device may generate one or more springs connecting corresponding vertices of a first pattern and a second pattern along a sewing segment and use this to simulate maintaining the two patterns in an adjacent state.

[0229] According to one embodiment, the electronic device can maintain a connection state by springs without performing welding on the segments to be ripped even after the draping step is completed. Specifically, by not removing the springs corresponding to the segments to be ripped, the electronic device can ensure that the vertices of the segments remain independent vertices without being merged with each other. Through this, the electronic device can implement ripping by adjusting the properties of the constraint (e.g., stiffness of the springs) without the need to perform remeshing for vertex separation when ripping occurs.

[0230] According to one embodiment, the electronic device can simulate different parts of the first pattern and the second pattern along the remaining part of the sewing line as a sewing state distinct from the constrained state.

[0231] According to one embodiment, the electronic device performs welding on a plurality of mesh elements associated with a sewing segment corresponding to the remainder of the sewing line, thereby simulating a sewing state for each other part of the first pattern and the second pattern along the remainder of the sewing line.

[0232] 'Sewing segment' may refer to the remaining portion of the sewing line that was not selected as a ripping target segment. The sewing segment may represent a segment that must remain combined without being separated during the simulation process.

[0233] 'Welding' can refer to the process of forming a continuous mesh structure by merging corresponding vertices of adjacent patterns into a single vertex along a seam line. Through welding, an electronic device can integrate different parts of the first pattern and the second pattern along a seam segment into a single mesh, and accordingly, the two patterns can be simulated in a fully combined state within the welded segment.

[0234] The 'sewing state' may refer to a state in which different parts of the first pattern and the second pattern are merged along the remainder of the seam line (e.g., a sewing segment) and remain unseparated during the simulation. In the sewing state, the mesh area of ​​the first pattern and the mesh area of ​​the second pattern facing each other along the remainder of the seam line may form a continuous topology. For example, in a welded segment, the vertex of the first pattern and the corresponding vertex of the second pattern are merged into a single vertex, so that the two patterns form a single continuous surface. Accordingly, the segment in the sewing state does not separate even if an external force is applied during the simulation, and can behave as if actual clothing were joined by stitching.

[0235] According to one embodiment, the electronic device can set constraints on a plurality of mesh elements associated with a sewing segment to simulate a portion of each of the first pattern and the second pattern along the sewing segment in a constrained state. For example, the electronic device can generate one or more springs connecting corresponding vertices of the first pattern and the second pattern along the sewing segment during the draping step, and use this to simulate the two patterns maintaining a state of being adjacent to each other.

[0236] According to one embodiment, when the draping step is completed, the electronic device may perform welding on the respective corresponding vertices of the first pattern and the second pattern, which are simulated in a constrained state. Specifically, the electronic device may remove the constraints (e.g., springs) connecting the mesh elements associated with the sewing segment and merge the corresponding vertices of the first pattern and the second pattern into one or more single vertices. For example, the electronic device may remove the springs created along the sewing segment and merge the vertices of the first pattern and the corresponding vertices of the second pattern that each spring connected into a single vertex. Through this, the sewing segment can be transitioned to a welded sewing state, and the first pattern and the second pattern form a continuous topology in the segment.

[0237] According to one embodiment, a sewing segment that has been switched to a sewing state can maintain a fixed connection state that is not separated during the simulation. Since the vertices of the first pattern and the second pattern are merged along the sewing segment, the two patterns can operate as a single continuous surface without separating even if an external force is applied to the segment. This can exhibit behavior similar to how a sewn part in actual clothing remains intact without tearing.

[0238] By performing welding on sewing segments to simulate a sewn state, and applying constraints to ripping target segments to simulate a constrained state, inseparable and separable segments can coexist within a single seam. This selective welding method can improve simulation efficiency by reducing unnecessary topology changes.

[0239] According to one embodiment, the electronic device can disable a constraint set on at least some of the mesh elements among a plurality of mesh elements to simulate at least a portion of each of the first pattern and the second pattern, which are simulated in a constrained state, in an unconstrained state distinct from the constrained state. The 'unconstrained state' may mean a state in which at least a portion of each of the first pattern and the second pattern are not constrained to each other and are separated during the simulation.

[0240] According to one embodiment, the electronic device can simulate at least a portion of the first pattern and the second pattern, which are simulated in a constrained state, in an unconstrained state by deactivating a constraint (e.g., a spring). Deactivating a constraint may correspond to weakening or releasing the constraint, and may mean that the constraint provides or does not provide a constraining force between mesh elements below a certain magnitude. For example, if the constraint is a spring, the electronic device can deactivate the spring by setting the stiffness of the spring to 0. When the stiffness of the spring is 0, the spring becomes in a state where it can be extended infinitely, so the spring may not provide a constraining force between mesh elements. Accordingly, the meshes on both sides of the segment may behave in an unconstrained state and be separated.

[0241] According to one embodiment, the electronic device can progressively deactivate constraints set on the ripping target segment during the simulation. For example, the electronic device can update the damage state of the corresponding constraint based on a fracture indicator for each constraint during the simulation. The electronic device can identify a constraint among the constraints whose damage state satisfies a predefined ripping condition, and by deactivating the identified constraint, allow the unconstrained state to progressively expand along the ripping target segment. The specific method for the deactivation process of the constraint and the accumulation of damage can be applied in the same way as described in FIG. 1.

[0242] According to one embodiment, an electronic device may generate an animation in which an unconstrained state gradually expands along a segment to be ripped as constraints are deactivated, based on simulation results for one or more time points. The ripping animation may refer to an animation that visually represents the progress of constraint deactivation and changes in the separation state of a mesh area at the segment to be ripped over time. For example, the electronic device may provide an animation in which ripping progresses gradually by visually displaying the segment that has transitioned to an unconstrained state at each frame of the simulation and rendering it in chronological order. Through this animation, the user can visually confirm the process of a virtual fashion item being torn at a specific segment.

[0243] FIG. 10 is a block diagram of the configuration of a device according to one embodiment.

[0244] Referring to FIG. 10, an electronic device (1000) according to one embodiment includes one or more processors (1010) and memory (1030). The electronic device (1000) may further include an output device (1050). One or more processors (1010), memory (1030), and output device (1050) may be connected to each other via a communication bus (1005).

[0245] The electronic device (1000) may be a PC (Personal Computer), a user device (User Equipment) such as a smartphone, a server, and / or a cloud server or cloud computing model providing SaaS (Software as a Service) services. The output device (1050), indicated by a dotted line in FIG. 10, may be optionally included depending on the type of electronic device (1000).

[0246] One or more processors (1010) include processing circuitry.

[0247] The memory (1030) stores instructions executed by one or more processors (1010). When the instructions are executed individually or collectively by one or more processors (1010), the electronic device (1000) enables the aforementioned virtual fashion item simulation method to be performed.

[0248] According to one embodiment, an electronic device (1000) can identify one or more segments with a ripping attribute set corresponding to at least a portion of one or more seams included in a virtual fashion item. The electronic device (1000) can generate one or more constraint elements that connect mesh elements associated with the identified one or more segments. The electronic device (1000) can simulate ripping of at least a portion of one or more segments based on a constraint element among the one or more constraint elements whose damage state satisfies a predefined ripping condition.

[0249] According to one embodiment, the electronic device (1000) may receive user input selecting a portion of a seam connecting a first pattern and a second pattern included in a virtual fashion item as a ripping target segment. The electronic device (1000) may set constraints on a plurality of mesh elements associated with the ripping target segment to simulate a constrained state for each of the first pattern and the second pattern along the seam.

[0250] At this time, the data required for performing the virtual fashion item simulation method and the intermediate data generated during the simulation process may be stored inside the electronic device (1000), such as in memory (1030), or may be stored outside the electronic device (1000), such as in a cloud server, cloud storage, or external hard drive.

[0251] The output device (1050) can output (display) simulation results generated by one or more processors (1010). For example, the output device (1050) can output (display) animations generated by one or more processors (1010).

[0252] In addition, the memory (1030) can store various information generated during the processing of one or more processors (1010) described above. According to one embodiment, the memory (1030) can store a program in which the virtual fashion item simulation method described above is implemented through FIGS. 1 to 9. In addition, the memory (1030) can store various data and programs. The memory (1030) may include volatile memory or non-volatile memory. The memory (1030) may store various data by having a large-capacity storage medium such as a hard disk.

[0253] Additionally, one or more processors (1010) may perform at least one method or an algorithm corresponding to at least one method described above through FIGS. 1 to 9. One or more processors (1010) may be a data processing device implemented in hardware having a circuit having a physical structure for executing desired operations. For example, the desired operations may include code or instructions included in a program. One or more processors (1010) may be composed of, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), or a NPU (Neural Network Processing Unit). For example, the electronic device (1000) implemented in hardware may include a microprocessor, a central processing unit, a processor core, a multi-core processor, a multiprocessor, an Application-Specific Integrated Circuit (ASIC), and a Field Programmable Gate Array (FPGA).

[0254] One or more processors (1010) can execute a program and control an electronic device (1000). The program code executed by one or more processors (1010) can be stored in memory (1030).

[0255] Additionally, an electronic device (1000) according to one embodiment may receive data from a user through an input / output device (I / O) and output generated data. For example, the electronic device (1000) may receive input from a user through an input / output device to set a ripping target segment or define ripping attributes. The electronic device (1000) may be connected to an external device (e.g., a personal computer or a network) through an input / output device and exchange data.

[0256] An electronic device (1000) according to one embodiment may further include other components not illustrated. For example, the electronic device (1000) may further include a communication module that provides a function for the electronic device (1000) to communicate with another electronic device or another server via a network. Also, for example, the electronic device (1000) may further include other components such as a transceiver, various sensors, a database, etc.

[0257] The embodiments described above may be implemented as hardware components, software components, and / or combinations of hardware and software components. For example, the devices, methods, and components described in the embodiments may be implemented using a general-purpose computer or a special-purpose computer, such as, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing unit may execute an operating system (OS) and software applications executed on said operating system. Additionally, the processing unit may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing unit may be described as being used as a single unit, but those skilled in the art will understand that the processing unit may include multiple processing elements and / or multiple types of processing elements. For example, the processing unit may include multiple processors or one processor and one controller. In addition, other processing configurations, such as parallel processors, are also possible.

[0258] Software may include computer programs, code, instructions, or a combination of one or more of these, and may configure a processing unit to operate as desired or instruct the processing unit independently or collectively. Software and / or data may be stored on any type of machine, component, physical device, virtual equipment, computer storage medium, or device so as to be interpreted by the processing unit or to provide instructions or data to the processing unit. Software may be distributed over networked computer systems and may be stored or executed in a distributed manner. Software and data may be stored on computer-readable recording media.

[0259] The method according to the embodiment may be implemented in the form of program instructions that can be executed through various computer means and recorded on a computer-readable medium. The computer-readable medium may store program instructions, data files, data structures, etc., either individually or in combination, and the program instructions recorded on the medium may be those specifically designed and configured for the embodiment or those known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes; optical recording media such as CD-ROMs and DVDs; magneto-optical media such as floptical disks; and hardware devices specifically configured to store and execute program instructions, such as ROM, RAM, and flash memory. Examples of program instructions include machine code, such as that generated by a compiler, as well as high-level language code that can be executed by a computer using an interpreter, etc.

[0260] The hardware device described above may be configured to operate as one or more software modules to perform the operation of the embodiment, and vice versa.

[0261] Although the embodiments have been described above with reference to the limited drawings, those skilled in the art can apply various technical modifications and variations based thereon. For example, suitable results may be achieved even if the described techniques are performed in a different order than described, and / or if the components of the described system, structure, device, circuit, etc. are combined or assembled in a form different from described, or replaced or substituted by other components or equivalents.

[0262] Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims set forth below.

Claims

1. A step of identifying one or more segments having a ripping attribute set corresponding to at least a portion of one or more seams included in a virtual fashion item; A step of generating one or more constraint elements that connect mesh elements associated with one or more of the identified segments; and A step of simulating the ripping of at least a portion of the one or more segments based on a constraint element among the one or more constraint elements whose damaged state satisfies a predefined ripping condition. A virtual fashion item simulation method performed by at least one processor, including 2. In Paragraph 1, The above-mentioned restraint element includes a spring connecting mesh elements in a sewing relationship, A virtual fashion item simulation method performed by at least one processor.

3. In Paragraph 1, The step of simulating the ripping of at least a portion of the above one or more segments Step of switching one or more of the above constraint elements that satisfy the ripping condition to an inactive state including, A virtual fashion item simulation method performed by at least one processor.

4. In Paragraph 1, The above ripping attribute is including at least one of parameters indicating whether ripping is enabled, a fracture threshold, a ripping rate, or a method for calculating a fracture indicator, A virtual fashion item simulation method performed by at least one processor.

5. In Paragraph 1, The step of simulating the ripping of at least a portion of the above one or more segments A step of updating the damage state of a corresponding restraint element based on a fracture indicator calculated for each of the above one or more restraint elements; and A step of identifying a restraining element among the above one or more restraining elements whose damaged state satisfies the above ripping condition including, A virtual fashion item simulation method performed by at least one processor.

6. In Paragraph 5, The step of updating the damage state of the corresponding constraint element above A step of determining whether the fracture index of the corresponding constraint element is greater than or equal to a preset threshold; and Step of accumulating and updating the damage state of the corresponding constraint element according to the above judgment result including, A virtual fashion item simulation method performed by at least one processor.

7. In Paragraph 6, The above preset threshold is based on the ripping attribute set for the segment associated with the corresponding constraint element, A virtual fashion item simulation method performed by at least one processor.

8. In Paragraph 5, The step of updating the damage state of the corresponding constraint element above A step of determining the damage accumulation rate of a corresponding constraint element based on the ripping attribute set for the segment related to the above-mentioned corresponding constraint element. including, A virtual fashion item simulation method performed by at least one processor.

9. In Paragraph 5, The step of calculating the above fracture index A step of calculating a fracture index for the corresponding constraint element based on the change in length of the corresponding constraint element. including, A virtual fashion item simulation method performed by at least one processor.

10. In Paragraph 5, The step of calculating the above fracture index A step of identifying a plurality of first mesh elements and a plurality of second mesh elements located on both sides of a corresponding restraint element based on a sewing line including the corresponding restraint element; A step of obtaining stress for each of the plurality of first mesh elements and the plurality of second mesh elements; and A step of calculating a fracture index for the corresponding restraint element based on the stresses obtained above. including, A virtual fashion item simulation method performed by at least one processor.

11. In Paragraph 10, The step of calculating the fracture index for the corresponding constraint element above A step of calculating a first stress contribution based on a plurality of first mesh elements and a second stress contribution based on a plurality of second mesh elements based on the stresses obtained above. including, A virtual fashion item simulation method performed by at least one processor.

12. In Paragraph 1, The above one or more seams include at least one of a segment with a ripping attribute set and a segment without a ripping attribute set, and The segment with the above-mentioned ripping attribute set is configured such that corresponding vertices in a sewing relationship are connected by one or more constraint elements, and The segment for which the above ripping attribute is not set is configured such that corresponding vertices in a sewing relationship are welded together. A virtual fashion item simulation method performed by at least one processor.

13. In Paragraph 1, The above one or more segments include a ripping-capable segment and a ripping-completed segment, and The above-mentioned ripping-capable segment and the above-mentioned ripping-completed segment are Defined as a parametric position for one or more of the above-mentioned seams, A virtual fashion item simulation method performed by at least one processor.

14. In Paragraph 13, The above parametric position is not changed by the creation or removal of constraint elements, A virtual fashion item simulation method performed by at least one processor.

15. In Paragraph 1, The step of simulating the ripping of at least a portion of the above one or more segments A step of updating the ripped segment based on the parametric position of the constraint element satisfying the ripping condition. including, A virtual fashion item simulation method performed by at least one processor.

16. In Paragraph 1, The above damage condition is Stored as a damage value corresponding to a parametric position for one or more of the above sewing lines, A virtual fashion item simulation method performed by at least one processor.

17. In Paragraph 16, The damage value corresponding to the above parametric position is obtained by interpolating the damage values ​​corresponding to different parametric positions, A virtual fashion item simulation method performed by at least one processor.

18. A computer program stored on a computer-readable recording medium in combination with hardware to execute the method of any one of claims 1 through 17.

19. In electronic devices, At least one processor including processing circuitry; and Memory that stores instructions Includes, When the above commands are executed by the at least one processor alone or jointly, the electronic device, An action of identifying one or more segments with a ripping attribute set corresponding to at least a portion of one or more seams included in a virtual fashion item; The operation of generating one or more constraint elements that connect mesh elements associated with one or more of the identified segments; and Operation of simulating the ripping of at least a portion of the one or more segments based on a constraint element among the one or more above whose damaged state satisfies a predefined ripping condition. causing to perform, Electronic device.

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