Glass encapsulated OLED panel

Abstract

Embodiments described herein generally relate to a display. More specifically, embodiments described herein relate to sub-pixel circuits and methods of forming subpixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one or more embodiments, a sub-pixel circuit includes a substrate and a plurality of anodes disposed over the substrate. Overhang structures are disposed over the substrate in between adjacent anodes. Each overhang structure including a lower structure and an upper structure disposed over the lower structure. The upper structure has a bottom surface that laterally extends beyond a top surface of the lower structure to form an overhang. An organic light emitting (OLE) material is disposed over the anodes. A cathode is disposed over the OLE material. An encapsulation material disposed is over the cathode. A filler material disposed over the encapsulation material. A cover disposed over the filler material.

Description

PATENTAttorney Docket No.: 44025771 WO01GLASS ENCAPSULATED OLED PANELBACKGROUNDField

[0001] Embodiments described herein generally relate to a display. More specifically, embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic lightemitting diode (OLED) display.Description of the Related Art

[0002] Input devices including display devices may be used in a variety of electronic systems. An organic light-emitting diode (OLED) is a light-emitting diode (LED) in which the emissive electroluminescent layer is a film of an organic compound that emits light in response to an electric current. OLED devices are classified as bottom emission devices if light emitted passes through the transparent or semitransparent bottom electrode and substrate on which the panel was manufactured. Top emission devices are classified based on whether or not the light emitted from the OLED device exits through the lid that is added following the fabrication of the device. OLEDs are used to create display devices in many electronics today. Today’s electronics manufacturers are pushing these display devices to shrink in size while providing higher resolution than just a few years ago.

[0003] Therefore, a need exists for sub-pixel circuits and methods of forming subpixel circuits.SUMMARY

[0004] Embodiments described herein generally relate to a display. More specifically, embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic lightemitting diode (OLED) display.

[0005] In one or more embodiments, a sub-pixel circuit includes a substrate and a plurality of anodes disposed over the substrate. Overhang structures are disposedPATENTAttorney Docket No.: 44025771 WO01over the substrate in between adjacent anodes. Each overhang structure including a lower structure and an upper structure disposed over the lower structure. The upper structure has a bottom surface that laterally extends beyond a top surface of the lower structure to form an overhang. An organic light emitting (OLE) material is disposed over the anodes. A cathode is disposed over the OLE material. An encapsulation material disposed is over the cathode. A filler material disposed over the encapsulation material. A cover disposed over the filler material.

[0006] In one or more embodiments, a sub-pixel circuit includes a substrate, a plurality of anodes disposed over the substrate. The plurality of anodes including a first anode, a second anode, and a third anode. Pixel-defining layer (PDL) structures are disposed between adjacent anodes and defining a first sub-pixel, a second subpixel, and a third sub-pixel. Overhang structures are disposed over the substrate between selected PDL structures. Each overhang structure including a lower structure and an upper structure disposed over the lower structure. The upper structure has a bottom surface that laterally extends beyond a top surface of the lower structure to form an overhang. An organic light emitting (OLE) material disposed over the anodes. The OLE material comprises a common OLE material extending continuously across the first anode and the second anode such that the first sub-pixel and the second subpixel share the common OLE material. The OLE material disposed over the third anode is discontinuous from the common OLE material. A cathode is disposed over the OLE material. An encapsulation material is disposed over the cathode. A filler material is disposed over the encapsulation material. A cover is disposed over the filler material.

[0007] In one or more embodiments, a sub-pixel circuit includes a substrate and a plurality of anodes disposed over the substrate. Overhang structures are disposed over the substrate between adjacent anodes. Each overhang structure includes a lower structure and an upper structure disposed over the lower structure. The upper structure has a bottom surface that laterally extends beyond a top surface of the lower structure to form an overhang. An organic light emitting (OLE) material is disposed over each anode. A cathode is disposed over the OLE material. An encapsulation material is disposed over the cathode. A filler material is disposed over thePATENTAttorney Docket No.: 44025771 WO01encapsulation material. A black matrix is disposed over the filler material between adjacent sub-pixel. Color filters are disposed over the filler material within openings defined by the black matrix. A cover is disposed over the color filters and the black matrix.BRIEF DESCRIPTION OF THE DRAWINGS

[0008] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments of the disclosure and are therefore not to be considered limiting of its scope, as the disclosure may admit to other equally effective embodiments.

[0009] FIG. 1 A is a schematic cross-sectional view of a sub-pixel circuit, according to one or more embodiments.

[0010] FIG. 1 B is a schematic top view of the sub-pixel circuit, according to one or more embodiments.

[0011] FIG. 2 is a schematic cross-sectional view of a sub-pixel circuit according to one or more embodiments.

[0012] FIG. 3 is a schematic cross-sectional view of a sub-pixel circuit, according to one or more embodiments.

[0013] FIG. 4 is a schematic cross-sectional view of a display device 400, according to one or more embodiments.

[0014] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.PATENTAttorney Docket No.: 44025771 WO01DETAILED DESCRIPTION

[0015] Embodiments described herein generally relate to a display. More specifically, embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic lightemitting diode (OLED) display. In various embodiments, the sub-pixels employ advanced overhang structures to improve functionality of the display.

[0016] The following detailed description describes exemplary embodiments of sub-pixel circuits and display devices incorporating the same. The embodiments described herein illustrate structures and fabrication approaches for forming organic light emitting (OLE) devices in which sub-pixel regions are defined by pixel-defining layer (PDL) structures and include permanent overhang structures that enable evaporative deposition, localized encapsulation, and integration with glass cover structures. As described in detail below with reference to the accompanying figures, the sub-pixel circuits may include isolated or shared organic light emitting stacks, per-sub-pixel encapsulation regions, filler materials, and upper optical stacks, and may be incorporated into display devices suitable for large-area applications. The described embodiments are provided for purposes of illustration and are not intended to limit the scope of the invention.

[0017] As used herein, a “sub-pixel” or “sub-pixel region” is defined by a respective pixel-defining layer (PDL) structure that partitions adjacent anode regions and delineates the optical aperture of the sub-pixel. In certain embodiments, permanent overhang structures are disposed on or above the PDL structures to provide deposition shadowing for forming discontinuous organic stacks and per-region encapsulation; however, the presence of an overhang is not required for sub-pixel definition. Sub-pixels may be electrically distinct by virtue of separate anodes and may be optically distinct by color filters and black matrix apertures, even when two or more sub-pixel regions share a common organic light-emitting stack or cathode.

[0018] FIG. 1A is a schematic cross-sectional view of a sub-pixel circuit 100, according to one or more embodiments. The sub-pixel circuit 100 includes a plurality of anodes 104 disposed over a substrate 102. In one embodiment, each anode 104 is a layer stack of a first transparent conductive oxide (TCO) layer, a second metal-PATENTAttorney Docket No.: 44025771 WO01containing layer disposed on the first TCO layer, and a third TCO layer disposed on the second metal-containing layer. In one or more embodiments, the anodes 104 are formed of a conductive material including chromium, titanium, gold, silver, copper, aluminum, indium tin oxide (ITO), a combination thereof, or other suitably conductive materials.

[0019] In one or more embodiments, pixel-defining layer (PDL) structures 126 are disposed on or over the substrate 102 in between the anodes 104. The PDL structures 126 include one of an organic material, an organic material with an inorganic coating disposed thereover, or an inorganic material. Non-limiting examples of the organic material include polyimides. Non-limiting examples of the inorganic material include silicon oxide (SiC>2), silicon nitride (SisN4), silicon oxynitride, magnesium fluoride (MgF2), or combinations thereof. Adjacent PDL structures 126 define sub-pixels 108 of the sub-pixel circuit 100.

[0020] Overhang structures 110 are disposed over the substrate 102. In one or more embodiments, the overhang structures 110 are disposed on or over upper surfaces of the PDL structures 126. Each overhang structure 110 includes a lower structure 110A and an upper structure 110B. In one or more embodiments, the lower structure 110A is disposed on or over an upper surface of a corresponding PDL structure 126. The upper structure 110B is disposed on or over the lower structure 110A. The upper structure 110B has a bottom surface 109 that extends past a top surface 107 of the lower structure 110A such that an overhang 113 is formed. In one or more embodiments, the upper structure 110B extends laterally beyond the lower structure 110A on both sides of the sub-pixel 108 to provide shadowing during evaporative deposition processes. In one or more embodiments, the overhang structures 110 are permanent to the sub-pixel circuit 100.

[0021] Within each sub-pixel 108, organic light emitting (OLE) materials 112 are deposited over the upper surface of the anode 104. In one or more embodiments the OLE materials 112 extend past an upper surface of the anode 104 over adjacent PDL structures 126 surrounding the anode 104. In one or more embodiments, the OLE materials 112 contact a sidewall 111 of the lower structures 110A of the adjacent overhang structures 110 of each sub-pixel 108. In one embodiment, each OLEPATENTAttorney Docket No.: 44025771 WO01material 112 is discontinuous from the adjacent OLE materials, such that each subpixel contains an isolated organic stack configured to emit a different color (e.g., red, green, or blue).

[0022] In one or more embodiments, each sub-pixel 108 includes a different OLE material 112 configured to emit a different colored light. For example, in one or more embodiments, the sub-pixel circuit 100 includes a first sub-pixel 108A, a second subpixel 108B, and a third sub-pixel 108C. The first sub-pixel 108A includes a first OLE 112A material configured to emit a first color light. In one or more embodiments, the first color light is a green light. The second sub-pixel 108B includes a second OLE material 112B configured to emit a second color light. In one or more embodiments, the second color light is a red light. The third sub-pixel 108C includes a third OLE material 112C configured to emit a third color light. In one or more embodiments, the third color light is a blue light.

[0023] Each sub-pixel 108 further includes a cathode 114. The cathode 114 is disposed over the OLE material 112 within each sub-pixel 108. The cathode 114 includes a conductive material, such as a metal. For example, the cathode 114 includes, but is not limited to, silver, magnesium, chromium, titanium, aluminum, ITO, ora combination thereof. An encapsulation material 116 is deposited over the cathode 114 within each sub-pixel 108. The encapsulation material 116 extends under at least a portion of each of the overhang extensions 113 and along the sidewall 111 of the lower structure 110A. In one or more embodiments, the encapsulation material 116 extends to contact the bottom surface 109 of the upper structure 110B. In one or more embodiments, the encapsulation material 116 defines a cavity 115 below the overhang extensions 113 within each sub-pixel 108. The encapsulation material 116 includes a non-conductive inorganic material, such as the silicon-containing material. The silicon-containing material may include SisN4 containing materials.

[0024] In one or more embodiments, a filler material 128 is disposed over the encapsulation material 116 of each sub-pixel 108. The filler material 128 extends over an upper surface of encapsulation material 116 and fills the cavity 115 defined by the encapsulation material 116. In one or more embodiments, the filler material 128 extends over a portion of the upper surface of the upper structure 110B. A columnPATENTAttorney Docket No.: 44025771 WO01spacer 122 is disposed over the upper surface of the upper structure 11 OB between the filler materials 128 of adjacent sub-pixels 108. In one or more embodiments, the filler material 128 is an organic material. An upper surface of the filler materials 128 and the column spacer 122 are coplanar to one another.

[0025] In one or more embodiments, a black matrix 124 is deposited over the column spacers 122 in between each sub-pixel 108. Color filters 130 are disposed over the filler materials 128 between adjacent black matrices 124. In one or more embodiments, each sub-pixel includes a color filter 130 configured to selectively transmit the corresponding color light emitted by the OLE material 112 of each subpixel. For example, in one or more embodiments, the first sub-pixel 108A includes a first OLE 112A material configured to emit a first color light. A first color filter 130A disposed over the first sub-pixel 108A is configured to selectively transmit the first color light. In one or more embodiments, the first color light is a green light. The second subpixel 108B includes a second OLE material 112B configured to emit a second color light. A second color filter 130B disposed over the second sub-pixel 108B is configured to selectively transmit the second color light. In one or more embodiments, the second color light is a red light. The third sub-pixel 108C includes a third OLE material 112C configured to emit a third color light. A third color filter 130C disposed over the third sub-pixel 108C is configured to selectively transmit the third color light. In one or more embodiments, the third color light is a blue light. In one or more embodiments, the upper surface of the color filters 130 and the black matrices 124 are coplanar to one another. A cover 157 is disposed over the color filters 130 and the black matrices 124. The cover 157 is formed of a transparent material, such as a glass material. In one or more embodiments, the color filters 130 mitigate surface reflections from the cover 157 by absorbing or scattering unwanted wavelengths in combination with the black matrices 124, thereby improving contrast. In one or more embodiments, the color filters 130 and the black matrices 124 define apertures and enhance optical uniformity across the sub-pixel circuit 100.

[0026] FIG. 1 B is a schematic top view of the sub-pixel circuit 100 taken along line A-A' of FIG. 1A, according to one or more embodiments. Line A-A' corresponds to a plane extending through the color filters 130 and the black matrix 124 of the sub-pixelPATENTAttorney Docket No.: 44025771 WO01circuit 100. As shown in FIG. 1B, the sub-pixel circuit 100 includes a plurality of subpixels 108A, 108B, and 108C arranged in an array, with each sub-pixel being associated with a corresponding color filter 130A, 130B, and 130C disposed within openings defined by the black matrix 124.

[0027] The color filters 130 are configured to selectively transmit light emitted by underlying organic light emitting (OLE) materials, as described with respect to FIG.1A. The black matrix 124 surrounds the color filters 130 and defines optical apertures corresponding to the respective sub-pixels 108.

[0028] FIG. 2 is a schematic cross-sectional view of another sub-pixel circuit 100 according to one or more embodiments. In one or more embodiments, a substrate 102 supports a plurality of anodes 104 separated by pixel-defining layer (PDL) structures 126 that define respective sub-pixels 108. Overhang structures 110 are disposed on or over selected PDL structures 126 such that an overhang structure 110 is present between some adjacent sub-pixels, while other adjacent sub-pixels are not separated by an overhang structure 110.

[0029] In one or more embodiments, a first sub-pixel 108A and a second sub-pixel 108B are not separated by an overhang structure 110 and share a common OLE material 212 that extends continuously over the corresponding anodes 104 and the intervening PDL structure 126. In one or more embodiments, the common OLE material 212 is configured to emit white light or mixed-color light. A third sub-pixel 108C is separated from the second sub-pixel 108B by an overhang structure 110 and includes a third OLE material 112C that is discontinuous from the common OLE material 212. In one or more embodiments, the third OLE material 112C emits a different color light than the common OLE material 212.

[0030] Cathodes 114 are disposed over the OLE materials 112 within the respective sub-pixels 108. In one or more embodiments, a common cathode 114 extends over the common OLE material 212 of the first and second sub-pixels 108A, 108B, while a separate cathode 114 is disposed over the OLE material 112C of the third sub-pixel 108C. An encapsulation material 116 is deposited over the cathode 114 within each sub-pixel 108. Where an overhang structure 110 is present, thePATENTAttorney Docket No.: 44025771 WO01encapsulation material 116 extends under at least a portion of the overhang extensions 113 and along the sidewall 111 of the lower structure 110A to define a cavity 115 beneath the overhang extension 113.

[0031] A filler material 128 is disposed over the encapsulation material 116 and fills the cavity 115 beneath the overhang extension 113. Column spacers 122 are disposed over upper surfaces of the upper structures 110B and support an upper optical stack. In regions where no overhang structure 110 is present between adjacent sub-pixels, the encapsulation material 116 and filler material 128 form a substantially continuous layer across the adjacent sub-pixels 108.

[0032] A black matrix 124 is disposed between adjacent sub-pixels 108, and color filters 130A, 130B, and 130C are disposed over the respective sub-pixels. In one or more embodiments, the first color filter 130A and the second color filter 130B are aligned over the first and second sub-pixels 108A, 108B, respectively, such that distinct optical apertures are defined over the common OLE material 212. The third color filter 130C is aligned over the third sub-pixel 108C and selectively transmits light emitted by the OLE material 112C. A cover 157 is disposed over the color filters 130 and the black matrix 124.

[0033] In one or more embodiments, sub-pixel boundaries are defined by the PDL structures 126 and the optical apertures formed by the black matrix 124 and the color filters 130, while the overhang structures 110, where present, provide deposition shadowing and localized encapsulation geometry for selectively isolating OLE materials and encapsulation regions within the sub-pixel circuit 100.

[0034] FIG. 3 is a schematic cross-sectional view of another sub-pixel circuit 100, according to one or more embodiments. In one or more embodiments, the sub-pixel circuit 100 includes a plurality of sub-pixels 108A, 108B, and 108C defined by pixeldefining layer (PDL) structures 126 and including respective anodes 104, organic light emitting (OLE) materials 112, cathodes 114, overhang structures 110, encapsulation materials 116, filler materials 128, and column spacers 122, as previously described. The encapsulation materials 116 define cavities 115 beneath overhang extensionsPATENTAttorney Docket No.: 44025771 WO01113, and the filler materials 128 fill the cavities 115 and extend over upper surfaces of the encapsulation materials 116.

[0035] In one or more embodiments, the filler materials 128 and the column spacers 122 provide a substantially planar upper surface. A cover 157 is disposed directly over the filler materials 128 and the column spacers 122. The cover 157 is formed of a transparent material, such as a glass material, and provides mechanical protection and environmental sealing for the sub-pixel circuit 100.

[0036] A polarizer 302 is disposed over the cover 157. In one or more embodiments, the polarizer 302 is configured to reduce surface reflections and improve contrast of the sub-pixel circuit 100. The polarizer 302 may be laminated, bonded, or otherwise attached to the cover 157 using an optically transparent adhesive layer. Light emitted by the OLE materials 112 exits the sub-pixel circuit 100 through the cover 157 and the polarizer 302.

[0037] FIG. 4 is a schematic cross-sectional view of a display device 400, according to one or more embodiments. The display device 400 includes a plurality of sub-pixel circuits 100, as described herein, disposed between a substrate 102 and a cover 157. Each of the sub-pixel circuits 100 may correspond to any of the embodiments described with respect to FIGS. 1A-3. The plurality of sub-pixel circuits 100 are arranged across an active area of the substrate 102. The cover 157 is disposed over the sub-pixel circuits 100 and extends across the active area to protect the sub-pixel circuits 100 from the external environment.

[0038] A sealant 402 is disposed around a perimeter of the display device 400 between the substrate 102 and the cover 157. The sealant 402 seals the cover 157 to the substrate 102 and encloses the sub-pixel circuits 100 within a sealed internal volume. In one or more embodiments, the sealant 402 includes an epoxy, adhesive, or other sealing material suitable for bonding the cover 157 to the substrate 102 and preventing ingress of moisture and oxygen.

[0039] In one or more embodiments, the cover 157 is formed of a transparent material, such as glass, and provides mechanical support and environmental protection for the display device 400. The sealed configuration of the display devicePATENTAttorney Docket No.: 44025771 WO01400 enables use of localized encapsulation within the sub-pixel circuits 100 while providing overall device-level protection via the cover 157 and the sealant 402.

[0040] Benefits of the embodiments described herein further include a display device having localized encapsulation at the sub-pixel level, which reduces sensitivity to particles and environmental exposure as compared to devices employing a continuous global thin-film encapsulation. Additional benefits include improved compatibility between evaporative deposition of organic light emitting materials and glass encapsulation structures, enabling formation of red green blue (RGB) OLED displays without fine metal masks. The described sub-pixel circuits further provide improved manufacturability, reduced process complexity, increased yield, and reduced manufacturing cost. Further benefits include improved device reliability, enhanced optical performance, increased design flexibility, and suitability for large-area display applications, such as television and information technology displays.

[0041] While the foregoing is directed to examples of the present disclosure, other and further examples of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

PATENTAttorney Docket No.: 44025771 WO01What is claimed is:

1. A sub-pixel circuit comprising:a substrate;a plurality of anodes disposed over the substrate;overhang structures disposed over the substrate in between adjacent anodes, each overhang structure including a lower structure and an upper structure disposed over the lower structure, the upper structure having a bottom surface that laterally extends beyond a top surface of the lower structure to form an overhang;an organic light emitting (OLE) material disposed over the anodes;a cathode disposed over the OLE material;an encapsulation material disposed over the cathode;a filler material disposed over the encapsulation material; anda cover disposed over the filler material.

2. The sub-pixel circuit of claim 1 , further comprising pixel-defining layer (PDL) structures disposed between adjacent anodes, wherein the overhang structures are disposed over the PDL structures.

3. The sub-pixel circuit of claim 1 , wherein the encapsulation material extends beneath at least a portion of the overhang and along a sidewall of the lower structure.

4. The sub-pixel circuit of claim 3, wherein the encapsulation material defines a cavity beneath the overhang.

5. The sub-pixel circuit of claim 4, wherein the filler material fills the cavity beneath the overhang.

6. The sub-pixel circuit of claim 1 , wherein the filler material includes an organic material.PATENTAttorney Docket No.: 44025771 WO017. The sub-pixel circuit of claim 1 , further comprising column spacers disposed over upper surfaces of the overhang structures between filler materials of adjacent sub-pixels.

8. The sub-pixel circuit of claim 1 , wherein the cover is formed of a glass material.

9. The sub-pixel circuit of claim 1 , further comprising a polarizer disposed over the cover.

10. The sub-pixel circuit of claim 1 , further comprising color filters disposed over the filler material.

11. The sub-pixel circuit of claim 10, further comprising a black matrix disposed between adjacent color filters.

12. A sub-pixel circuit, comprising:a substrate;a plurality of anodes disposed over the substrate, the plurality of anodes including a first anode, a second anode, and a third anode;pixel-defining layer (PDL) structures disposed between adjacent anodes and defining a first sub-pixel, a second sub-pixel, and a third sub-pixel;overhang structures disposed over the substrate between selected PDL structures, each overhang structure including a lower structure and an upper structure disposed over the lower structure, the upper structure having a bottom surface that laterally extends beyond a top surface of the lower structure to form an overhang; an organic light emitting (OLE) material disposed over the anodes, wherein the OLE material comprises a common OLE material extending continuously across the first anode and the second anode such that the first sub-pixel and the second subpixel share the common OLE material, and wherein the OLE material disposed over the third anode is discontinuous from the common OLE material;a cathode disposed over the OLE material;PATENTAttorney Docket No.: 44025771 WO01an encapsulation material disposed over the cathode;a filler material disposed over the encapsulation material; anda cover disposed over the filler material.

13. The sub-pixel circuit of claim 12, wherein the common OLE material is configured to emit white light.

14. The sub-pixel circuit of claim 12, wherein the OLE material disposed over the third anode is configured to emit a color different from light emitted by the common OLE material.

15. The sub-pixel circuit of claim 12, wherein a common cathode extends continuously over the first sub-pixel and the second sub-pixel.

16. The sub-pixel circuit of claim 12, wherein the encapsulation material extends beneath at least a portion of the overhang and along a sidewall of the lower structure of the overhang structure.

17. The sub-pixel circuit of claim 16, wherein the encapsulation material defines a cavity beneath the overhang structure.

18. The sub-pixel circuit of claim 17, wherein the filler material fills the cavity beneath the overhang structure.

19. The sub-pixel circuit of claim 12, wherein a first color filter is aligned with the first sub-pixel and a second color filter is aligned with the second sub-pixel, such that different optical apertures are defined over the common OLE material.

20. A sub-pixel circuit, comprising:a substrate;a plurality of anodes disposed over the substrate;PATENTAttorney Docket No.: 44025771 WO01overhang structures disposed over the substrate between adjacent anodes, each overhang structure including a lower structure and an upper structure disposed over the lower structure, the upper structure having a bottom surface that laterally extends beyond a top surface of the lower structure to form an overhang;an organic light emitting (OLE) material disposed over each anode;a cathode disposed over the OLE material;an encapsulation material disposed over the cathode;a filler material disposed over the encapsulation material;a black matrix disposed over the filler material between adjacent sub-pixels; color filters disposed over the filler material within openings defined by the black matrix; anda cover disposed over the color filters and the black matrix.

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