1.-4. Adhesive tape for manufacturing semiconductor device

Abstract

Designs 1, 2, 3 and 4: each article is an adhesive tape used for dicing a semiconductor wafer, die-bonding a resulting semiconductor chip, and so on in the manufacturing process of semiconductor devices; when using the article, the PET separator is peeled off, and the semiconductor wafer is attached to the bonding layer; the article is equipped with a marked part near the bonding layer that cannot be used due to the presence of foreign objects, and the marked part is applied to the surface of the base material; as a result, when using the article, purchasers can utilize sensors on the laminating equipment to detect the bonding layers with foreign objects and remove them; the solid lines depict the portions for which a design registration as a partial design is sought, and the broken lines depict portions of the article that form no part of the claimed designs; the alternating long and short lines define bounds of the claimed designs and form no part thereof; novelty resides in the shape and configuration as shown in the representations; design 1: reproduction 1.8 is a sectional view cut along A-A line shown in the reproduction 1.1; reproduction 1.9 is an enlarged sectional view cut along B-B line and C-C line shown in the reproduction 1.1; reproduction 1.10 is an enlarged view of D-D portion in the reproduction 1.8; reproduction 1.11 is a reference exploded view of design 1; design 2: reproduction 2.8 is a sectional view cut along A-A line shown in the reproduction 2.1; reproduction 2.9 is an enlarged sectional view cut along B-B line and C-C line shown in the reproduction 2.1; reproduction 2.10 is an enlarged view of D-D portion in the reproduction 2.8; reproduction 2.11 is a reference exploded view of design 2; design 3: reproduction 3.8 is a sectional view cut along A-A line shown in the reproduction 3.1; reproduction 3.9 is an enlarged sectional view cut along B-B line and C-C line shown in the reproduction 3.1; reproduction 3.10 is an enlarged view of D-D portion in the reproduction 3.8; reproduction 3.11 is a reference exploded view of design 3; design 4: reproduction 4.8 is a sectional view cut along A-A line shown in the reproduction 4.1; reproduction 4.9 is an enlarged sectional view cut along B-B line and C-C line shown in the reproduction 4.1; reproduction 4.10 is an enlarged view of D-D portion in the reproduction 4.8; reproduction 4.11 is a reference exploded view of design 4.

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