1.-2. Retainer ring for semiconductor wafer polishing

Abstract

1. The broken lines shown in Reproductions 1.1 to 1.10 are for illustrative purposes only and form no part of the claimed design; the dash-dot-dash lines in reproductions 1.2, 1.9 and 1.10 are included to show a partially enlarged view only and form no part of the claimed design; Reproduction 1.6 is a cross-sectional view taken along the line 1.6-1.6 in Reproduction 1.3; Reproduction 1.7 is an enlarged view of a portion defined by arrows 1.7 in Reproduction 1.6.; Reproduction 1.8 is an enlarged view of a portion defined by arrows 1.8 in Reproduction 1.6.; Reproduction.1.9 is a partially enlarged view of the portion 1.9 in Reproduction 1.2.; Reproduction.1.10 is a partially enlarged view of the portion 1.9 in Reproduction 1.2.; 2. The broken lines shown in Reproductions 2.1 to 2.10 are for illustrative purposes only and form no part of the claimed design; the dash-dot-dash lines in reproductions 2.2, 2.9 and 2.10 are included to show a partially enlarged view only and form no part of the claimed design; Reproduction 2.6 is a cross-sectional view taken along the line 2.6-2.6 in Reproduction 2.3; Reproduction 2.7 is an enlarged view of a portion defined by arrows 2.7 in Reproduction 2.6.; Reproduction 2.8 is an enlarged view of a portion defined by arrows 2.8 in Reproduction 2.6.; Reproduction.2.9 is a partially enlarged view of the portion 2.9 in Reproduction 2.2.; Reproduction 2.10 is a partially enlarged view of the portion 2.9 in Reproduction 2.2.

Images