The
dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of
inorganic particles with
permittivity of 30 or greater are coated with a conductive
metal or a compound thereof, or a conductive
organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a
polymer. In addition, another
dielectric-forming composition according to the invention is characterized by containing:
ultrafine particle-
resin composite particles composed of (J) inorganic
ultra fine particles with the average particle size of 0.1 mum or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a
polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the
ultrafine particle-
resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and
inorganic particles with the average particle size of 0.1 to 2 mum and
permittivity of 30 or greater, or inorganic composite particles in which a conductive
metal or a compound thereof, or a conductive
organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the
inorganic particles.